Electronic card with electronic interface

Abstract

To provide an electronic ID card or electronic card with various characteristic parts.SOLUTION: The electronic card includes: an integrated circuit; and a contact plate for electrically interfacing with the integrated circuit. The contact plate may include a terminal electrode array displaced from the edges of the contact plate. The electronic card can be coated with a coating layer that at least partially covers a ferromagnetic element or ferromagnetic film. Additionally, the electronic card further includes a metal substrate having a beveled exposed surface that provides visual contrast with the coating layer and enhances the handling and use of the electronic card.SELECTED DRAWING: None

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application is a non-provisional application and claims priority to U.S. Provisional Patent Application No. 62 / 737,528 (entitled "Electronic Card Having an Electronic Interface," filed September 27, 2018), U.S. Provisional Patent Application No. 62 / 814,779 (entitled "Electronic Card Having an Electronic Interface," filed March 6, 2019), and U.S. Provisional Patent Application No. 62 / 814,788 (entitled "Electronic Card Having an Electronic Interface," filed March 6, 2019), the disclosures of which are incorporated herein by reference in their entireties.

[0002] [Technical field] The described embodiments relate generally to electronic devices, and more particularly to electronic cards having an electronic interface and various features as described herein. [Background technology]

[0003] Traditionally, ID cards have been used to identify a particular user or entity associated with the card. For example, an ID card may include a printed serial number, a photograph, or other information that can be used to identify the user. However, recent developments in user identification allow electronic readers to identify users by electronically reading the ID card or other form of identification. The cards, systems, and techniques described herein relate to electronic cards with improved features and processes for manufacturing the electronic cards. Summary of the Invention

[0004] Embodiments described herein relate to electronic ID cards or electronic cards having various features. The electronic card may include an integrated circuit and a contact plate for electrically interfacing with the integrated circuit. The contact plate may include a terminal electrode array displaced from an edge of the contact plate. The electronic card may be coated with a coating layer that at least partially covers the ferromagnetic element or ferromagnetic film. The electronic card may further include a metal substrate with an exposed chamfer that provides visual contrast with the coating layer and improves handling and use of the electronic card.

[0005] In some exemplary embodiments, the electronic ID card includes a substrate including a metal material. The substrate may define a first recess or stepped region formed on a first surface of the substrate and extending along an outer substrate edge of the substrate. The substrate may further define a second recess on a second surface of the substrate opposite the first surface. The ferromagnetic film may be at least partially disposed within the first recess or stepped region, and the integrated circuit may be at least partially disposed within the second recess. The ID card also includes a coating layer including a polymer and a pigment dispersed within the polymer. The coating layer may be disposed on the ferromagnetic film and at least a portion of the substrate.

[0006] In some embodiments, the substrate is formed from a titanium sheet having a thickness of less than 1 mm. The substrate may include a titanium sheet bonded or laminated to a plastic (polymer) sheet, the titanium sheet and the plastic sheet having a combined thickness of less than 1 mm. In some cases, the first recess is a first laser-ablated recess formed in a first surface of the substrate. The second recess can be a second laser-ablated recess formed in a second surface of the substrate. In some examples, the electronic ID card is rectangular with four corners, each corner having a rounded shape. The rounded shape is a spline shape having a non-uniform radius of curvature.

[0007] In some embodiments, the coating layer includes a first layer and a second layer. The first layer includes a polymer and a pigment, and the second layer includes a transparent polymer disposed on the first layer and defining at least a portion of the exterior surface of the electronic ID card. In some cases, the coating layer is disposed on the first side and at least a portion of the second side of the substrate.

[0008] In some embodiments, the electronic ID card further includes a contact plate disposed on the integrated circuit, and the portion of the exterior surface defined by the transparent polymer may be a first portion, and the contact plate may define a terminal electrode array that defines a second portion of the exterior surface of the electronic ID card.

[0009] In some embodiments, the electronic ID card defines a first set of chamfered edges extending around the periphery of the first side and a second set of chamfered edges extending around the periphery of the second side. In some cases, a first chamfered edge of the first set of chamfered edges extends along an outer substrate edge of the substrate. The ferromagnetic film may be attached to a backing layer, and the first chamfered edge may be defined at least in part by a beveled edge formed in the ferromagnetic film and the backing layer. In some examples, the first chamfered edge does not extend beyond the beveled edges of the ferromagnetic film and the backing layer.

[0010] In some embodiments, the second set of chamfered edges is at least partially defined by a chamfered portion of the substrate. The electronic ID card may further include an oxide coating formed on the chamfered portion of the substrate. The coating layer may have a first color and the oxide coating may have a second color that is visually different from the first color.

[0011] In some embodiments, the electronic ID card further includes a laser-formed relief feature. The laser-formed relief feature may include at least one concave wall defining a recess extending through the coating layer. The laser-formed relief feature may further include a recessed marking feature defining a bottom of the recess and visually distinct from adjacent portions of the coating layer.

[0012] Some exemplary embodiments relate to an electronic ID card including a substrate defining a recess formed in a front surface thereof and an integrated circuit disposed in the recess. The electronic card may further include a ferromagnetic film disposed along a back surface of the substrate opposite the front surface. The electronic card may further include a contact plate disposed on the integrated circuit, the contact plate including a plate substrate defining a set of outer edges and a terminal electrode array disposed on the plate substrate. Each terminal electrode of the terminal electrode array may be displaced from the set of outer edges of the plate substrate.

[0013] In some embodiments, the contact plate further comprises a set of ablated regions, each ablated region disposed between a corresponding terminal electrode of the terminal electrode array and a corresponding outer edge of the outer edge set. In some cases, the contact plate further comprises a conductive periphery including a conductive material surrounding the terminal electrode array. The periphery may be separated from the terminal electrode array by one or more ablated regions.

[0014] In some embodiments, the terminal electrode array may be disposed on a front surface of the plate substrate. The contact plate may further include a backside conductive layer disposed on a backside of the plate substrate. The terminal electrode array may be electrically connected to the backside conductive layer by one or more vias that pass through the plate substrate.

[0015] In some embodiments, the plate substrate is formed from a non-conductive material. The terminal electrode array can include a first conductive layer including an electrolessly plated metal disposed on the non-conductive material of the plate substrate. The terminal electrode array can also include a second conductive layer including an electroplated metal disposed on the first conductive layer.

[0016] Some exemplary embodiments relate to a method for forming a contact plate for an electronic card. A photoresist layer may be applied to a front surface of a plate substrate. The photoresist layer may be exposed using a light source to form a plating mask defining a plating area array. A catalyst solution may be applied to the plating area array to form a first conductive layer along the plating areas of the plating area array. A plating solution may be applied to the first conductive layer. While the plating solution is being applied to the first conductive layer, a current may be applied to the first conductive layer to define a terminal electrode displaced between the terminal electrode and an edge of the plate substrate, forming a second conductive layer on the first conductive layer using an electroplating process.

[0017] In some embodiments, the plate substrate is formed from a non-conductive material. The first conductive layer may include a bridge portion electrically connecting the first conductive layer to an edge of the plate substrate. Optionally, the method further includes laser-ablating portions of the first and second conductive layers located at least partially within the bridge portion to expose a portion of the non-conductive material of the plate substrate. In some embodiments, a conductive periphery is disposed on the front surface of the plate substrate and at least partially surrounds the terminal electrode. The bridge portion may extend between the terminal electrode and the conductive periphery.

[0018] In some embodiments, a back conductive layer is formed along the back surface of the plate substrate opposite the front surface, and the first conductive layer can be electrically connected to the back conductive layer using one or more vias that pass through the plate substrate. [Brief explanation of the drawings]

[0019] The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, in which like reference numerals indicate like structural elements, and in which:

[0020] [Figure 1A] FIG. 1 is a front view of an exemplary electronic card.

[0021] [Figure 1B] FIG. 2 is a rear view of an exemplary electronic card.

[0022] [Figure 1C] FIG. 1 is an exploded view of an exemplary electronic card.

[0023] [Figure 2] FIG. 1 is an exploded view of an exemplary electronic card.

[0024] [Figure 3A] FIG. 1 is a cross-sectional view of an electronic card. [Figure 3B] FIG. 1 is a cross-sectional view of an electronic card. [Figure 3C] FIG. 1 is a cross-sectional view of an electronic card.

[0025] [Figure 4] FIG. 1 is a cross-sectional view of an electronic card.

[0026] [Figure 5A] FIG. 1 is a cross-sectional view of an electronic card. [Figure 5B] FIG. 1 is a cross-sectional view of an electronic card. [Figure 5C] FIG. 1 is a cross-sectional view of an electronic card.

[0027] [Figure 6A] FIG. 2 is a top view of an exemplary contact plate. [Figure 6B] FIG. 2 is a top view of an exemplary contact plate. [Figure 6C] FIG. 2 is a top view of an exemplary contact plate. [Figure 6D] FIG. 2 is a top view of an exemplary contact plate.

[0028] [Figure 7A] 1A-1C illustrate various exemplary terminal electrode arrays. [Figure 7B] 1A-1C illustrate various exemplary terminal electrode arrays. [Figure 7C] 1A-1C illustrate various exemplary terminal electrode arrays. [Figure 7D] 1A-1C illustrate various exemplary terminal electrode arrays.

[0029] [Figure 8A] 7 is an exemplary cross-sectional view of the exemplary contact plate of FIG. 6. [Figure 8B] 7 is an exemplary cross-sectional view of the exemplary contact plate of FIG. 6.

[0030] [Figure 9A] 10A and 10B illustrate exemplary connection structures of contact plates. [Figure 9B] 10A and 10B illustrate exemplary connection structures of contact plates.

[0031] [Figure 10] 1A and 1B illustrate exemplary markings on an electronic card.

[0032] [Figure 11A] 1 is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11B] 1 is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11C] 1 is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11D] 1 is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11E] 1 is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11F] 1 is a cross-sectional view of an exemplary marking on an electronic card.

[0033] [Figure 12] 1A-1C illustrate exemplary laser-formed relief features. [Figure 13] 1A-1C illustrate exemplary laser-formed relief features. [Figure 14] 1A-1C illustrate exemplary laser-formed relief features.

[0034] [Figure 15A] 1A-1C illustrate exemplary laser-formed relief features. [Figure 15B] 1A-1C illustrate exemplary laser-formed relief features.

[0035] [Figure 16A] 1A and 1B illustrate exemplary bevels on an electronic card. [Figure 16B] 1A and 1B illustrate exemplary bevels on an electronic card. [Figure 16C] 1A and 1B illustrate exemplary bevels on an electronic card.

[0036] [Figure 17] FIG. 1 illustrates exemplary components of an electronic card. DETAILED DESCRIPTION OF THE INVENTION

[0037] Reference will now be made in detail to exemplary embodiments as illustrated in the accompanying drawings. It should be understood that the following description is not intended to limit these embodiments to a single preferred embodiment. On the contrary, the following description is intended to cover alternatives, modifications, and equivalents, as may be included within the spirit and scope of the described embodiments as defined by the appended claims.

[0038] Embodiments described herein relate to electronic cards having various features. As described herein, electronic cards include an integrated circuit and an electronic interface that can be used to communicate with an external card reader. Electronic cards may be ID cards used to authenticate or identify users. In some examples, electronic cards are used as security badges, employee ID cards, student ID cards, customer loyalty cards, electronic passports, or other forms of electronic ID. In some cases, electronic cards may be state-issued ID cards that function as driver's licenses, social security cards, or other government-issued IDs. Electronic cards are also used to facilitate transactions or purchases and may in some cases be used as credit cards, debit cards, prepaid debit cards, prepaid phone cards, vending cards, parking cards, toll cards, and other similar types of cards used to facilitate transactions. In some cases, electronic cards are configured to securely store information and / or keys or codes that can be used to access securely stored information from another source. For example, electronic cards may be used to store or access medical records or financial information. In some cases, electronic cards are configured to operate as a subscriber identity module (SIM) for use with a mobile or cellular phone. Electronic cards may also be configured as gift cards configured to store a card value or debit an account having a card value. Electronic cards may also be used to provide access to facilities, restricted areas, or restriction systems. For example, electronic cards may include one or more components configured to communicate with an external reader or device to unlock access to a restricted area, region, or restriction system.

[0039] Electronic cards, also referred to herein as electronic ID cards, smart cards, chip cards, or integrated circuit cards (ICCs), typically include an integrated circuit, an electrical interface, and may further include one or more magnetizable elements, such as a ferromagnetic strip or magnetic region. Electronic cards may also conform to one or more standards, including, for example, ISO 14443, ISO 15693, ISO 7810, and / or ISO 7816 international standards. In some cases, electronic cards may conform to standards and industry practices associated with what are referred to as "contact cards." Contact cards typically include terminals or electrode arrays that physically contact an external card reader or other electronic device to facilitate electronic communication. Electronic cards may also conform to standards and practices associated with what are referred to as "contactless cards." Contactless cards generally include a radio transceiver or other wireless electronics configured to interface with an external device using a wireless communication protocol. Contactless cards may include one or more electrical contacts or terminals in addition to the wireless electronics, or may not include electrical contacts or terminals. Whether the electronic card is a contact card or a contactless card, the electronic card may include a magnetic or ferromagnetic strip for use with an external card reader having magnetic swipe or similar magnetic strip reading capability.

[0040] Some embodiments described herein relate to electronic cards having a metal substrate coated with a two-part or multi-layer coating. The coating layer (composed of one or more individual layers or components) can be specially formulated to give the electronic card the appearance and / or feel of a ceramic material. For example, the coating layer can have a specific blend of additives and a surface roughness that gives the tactile sensation of a ceramic material. The coating layer can also be used to give the electronic card a uniform appearance and hide various functional elements of the card. For example, the coating layer can be used to hide a ferromagnetic film, ferromagnetic strip, or ferromagnetic stack located underneath the coating. In some cases, the ferromagnetic film, ferromagnetic strip, or ferromagnetic stack is located in a stepped area, recess, or pocket formed in the electronic card and is covered or coated with the coating layer.

[0041] Some embodiments described herein relate to electronic cards having contact plates with unique electrode arrangements. Specifically, the electronic cards may have contact plates with an array of terminal electrodes that are displaced from the edges of the contact plate. As described herein, the contact plates may have an array of terminal electrodes, with each terminal electrode displaced from a corresponding edge of the contact plate. This configuration provides certain functional advantages by enabling unique terminal layouts not possible with conventional technology. However, this configuration also presents various manufacturing challenges. Various techniques for addressing these manufacturing challenges are described herein. For example, in some instances, the terminal electrodes may temporarily extend to one or more edges of the contact plate to facilitate the electroplating process, and then portions of the terminal electrodes may be polished using a laser-based process. In other instances, the terminal electrodes are electrically connected to a copper layer disposed on a hidden or inner surface of the contact plate to facilitate the electroplating process.

[0042] Some embodiments described herein relate to electronic cards having markings at least partially formed in a coating layer. In some embodiments, the markings include subsurface markings formed below a first layer of the coating layer and within a second layer of the coating layer. In some embodiments, the markings include laser relief features that extend through the coating layer and expose a portion of the underlying substrate. In examples where the substrate is formed from a metallic material, the laser relief features may include one or more oxide layers that can provide a different color or visual appearance from surrounding or adjacent portions of the coating layer.

[0043] In some examples, the electronic card includes one or more chamfers or beveled edges formed around the front or back of the electronic card. In some embodiments, the chamfers or beveled edges are disposed entirely within the ferromagnetic film and support layer and do not extend into the underlying metal substrate. In some cases, the chamfers or beveled edges extend into the metal substrate, exposing a portion of the metal material. In such cases, the exposed portion of the metal material may be coated with an oxide layer that provides a different, distinct color, or a particular visual appearance. In some cases, the chamfers include a coating or oxide layer that provides a colored appearance, and the edges of the card are exposed edges of the metal substrate that are not coated or covered with a coating or colored oxide layer. The use of these techniques enables unique visual appearances that are less susceptible to wear and degradation over time compared to traditional ink or printed markings.

[0044] These and other embodiments are described below with reference to Figures 1A-17. However, those skilled in the art will readily appreciate that the detailed description provided herein with respect to these figures is for illustrative purposes only and should not be construed as limiting.

[0045] 1A and 1B illustrate an exemplary electronic card according to embodiments described herein. FIG. 1A is a front view of electronic card 100. Generally, electronic card 100 can be an electronic ID card associated with a particular individual. Electronic card 100 can be used to authenticate or identify an individual or user. As previously described, electronic card 100 can be used as a security badge, employee ID card, student ID card, customer or retail loyalty card, electronic passport, or some other form of electronic identification. Electronic cards are also used to facilitate transactions or purchases and, in some cases, can be used as credit cards, debit cards, prepaid debit cards, prepaid phone cards, vending cards, parking cards, toll cards, and other similar types of cards used to facilitate transactions. Electronic card 100 can comply with one or more standards, including, for example, ISO 14443, ISO 15693, ISO 7810, and / or ISO 7816 international standards.

[0046] In some cases, electronic card 100 includes computer memory configured to securely store information and / or keys or codes that can be used to access information stored on an external device or system. For example, electronic card 100 may be used to store or access medical records or financial information. In some cases, electronic card 100 is configured to operate as a subscriber identity module (SIM) for use with a mobile phone or cell phone over a wireless or cellular network. The computer memory or computer-readable memory functionality of electronic card 100 may be provided by one or more memory components, such as, for example, an electronically readable magnetic strip or strap, a programmable random access memory, a solid-state memory component, and other forms of electronic information storage components. Other exemplary computer-readable memory components are described below with reference to FIG. 17.

[0047] Electronic card 100 may also be referred to as an electronic ID card, smart card, chip card, or integrated circuit card (ICC). Electronic card 100 shown in FIG. 1A is configured to operate as a contact card. In some embodiments, electronic card 100 may include wireless circuitry and be configured to operate as a contactless card. When configured as a contactless card, electronic card 100 may include contact plate 102 or may omit contact plate 102.

[0048] As shown in FIG. 1A, electronic card 100 includes several features along a front surface 110. Specifically, electronic card 100 includes a contact plate 102 including a terminal electrode array 104 that defines at least a portion of the exterior surface of electronic card 100. Terminal electrodes 104 may be formed from a conductive material and configured to provide a contact-based electrical interface with an external device, including, for example, an external card reader, a terminal device, a point-of-service (POS) system, or other similar types of devices. As shown in FIG. 1A, terminal electrode array 104 is offset from an edge of contact plate 102 and may have any one of a variety of shapes or configurations. Exemplary contact plates and terminal electrodes are described below with reference to FIGS. 6A-9B.

[0049] Generally, the terminal electrodes 104 of the contact plate 102 remain exposed to facilitate electrical contact with an external card reader or device. However, the terminal electrodes 104 may include a conductive coating or be otherwise colored to generally match the color of the surrounding portions of the electronic card 100. In one example, the terminal electrodes 104 are coated with a conductive ink or marking that generally matches the color of the coating of the electronic card 100 to camouflage or hide the exposed terminal electrodes 104. While the contact plate 102 is shown as having a square or rectangular form factor, in other embodiments, the contact plate 102 may have a circular or round profile or form factor. In some examples, the contact plate 102 and terminal electrodes 104 formed using one of the described manufacturing techniques may be thinner than conventional contact plate assemblies or circuits.

[0050] As shown in FIG. 1A , electronic card 100 may further include one or more markings 114. Markings 114 may identify a company, institution, or entity associated with electronic card 100. Markings 114 may optionally identify a user or individual associated with the card. In some cases, markings 114 may include an account number, a serial number, or some other identifier associated with an individual and / or electronic card 100. In embodiments where electronic card 100 is a credit card or other similar card issued by a financial institution, electronic card 100 may omit a traditional signature block, expiration date, primary account number (PAN), or other traditional markings. Markings 114 may include the issuing institution's name and / or logo, and the cardholder's name or other unique personal information associated with the cardholder. Also, unlike some traditional credit cards, markings 114 may be flush, unembossed, or otherwise smooth with the exterior surface of electronic card 100.

[0051] In some cases, marking 114 includes a microscale security mark. The microscale security mark may include microscale features etched, laser formed, machined, or otherwise formed in a coating on electronic card 100. The microscale features are used to create an authentication mark that is difficult to counterfeit or copy and to verify the authenticity of electronic card 100. In some cases, the microscale security mark may be integrated with one or more non-microscale markings to camouflage or otherwise obscure the appearance of the microscale marking.

[0052] In some embodiments, marking 114 is printed or painted on front surface 110 of electronic card 100. Additionally or alternatively, marking 114 may be formed using laser marking techniques. In one example, marking 114 is a subsurface marking formed in one of the coating layers of electronic card 100. In another example, marking 114 may include a laser-formed relief feature formed in a coating or coating layer of electronic card 100 and may extend into the underlying card substrate. (See, e.g., substrates 1202, 1302, and 1402 in FIGS. 12, 13, and 14.) Using a laser-formed relief feature as marking 114 or as part of marking 114 may provide a striking visual signature that is more durable than traditional ink or printed markings. Various exemplary markings are described below with reference to FIGS. 10-15B.

[0053] 1A , electronic card 100 may include a set of edges 116 surrounding front surface 110. According to some embodiments described herein, one or more edges of edge set 116 may include a chamfer or beveled region. In some embodiments, edge set 116 is a set of chamfered edges that extend around or surround front surface 110, as described herein. The chamfer or bevel may improve the appearance and feel of electronic card 100. The chamfer or bevel may also facilitate use of electronic card 100 with certain external card readers or card reading devices.

[0054] FIG. 1B is a back view of electronic card 100. As shown in FIG. 1B, electronic card 100 includes several features along back surface 120. Specifically, electronic card 100 includes edge set 122 that extends around or surrounds back surface 120. According to some embodiments described herein, one or more edges of edge set 122 may include a chamfer or beveled region. This chamfer or bevel may correspond to the chamfer or beveled region of edge set 116 that surrounds front surface 110. Specifically, a second set of chamfered edges may extend around or surround back surface 120. As described herein, the chamfered edges may be coated or covered with an oxide or other coating that provides color along the chamfered edges. In some cases, the chamfered edges include exposed portions of the metal substrate. In some cases, the chamfered edge is colored, and the edge or sidewall of the substrate extending between the front and back chamfered edges is exposed and uncoated or uncolored.

[0055] As shown in FIG. 1B , electronic card 100 also includes magnetic region 124. Magnetic region 124 may extend all the way to edge 122 a of electronic card 100. In some embodiments, magnetic region 124 is larger than a conventional magnetic strip used on a conventional credit card. Magnetic region 124 may allow for the encoded information to be read using an external card reader or card reading device. While the entire magnetic region 124 may be encodable, in some embodiments, only a portion of magnetic region 124 is actually encoded with information. For example, a subregion within magnetic region 124 may define a coding strip or band corresponding to the location of a conventional magnetic strip on a conventional credit card, ID card, or other card adapted to be read using an external magnetic reader. In one example, the encoded region of magnetic region 124 is approximately 5-10 mm wide and displaced approximately 5 mm from edge 122 a.

[0056] 1B is shown as extending all the way to edge 122 of electronic card 100, in other embodiments, magnetic region 124 may be displaced from one or more of the edges of electronic card 100. Additionally, the orientation of magnetic region 124 may vary from embodiment to embodiment. For example, magnetic region 124 may be located along or displaced from a short edge of electronic card 100. In another embodiment, magnetic region 124 is located in a central region of electronic card 100. In another embodiment, magnetic region 124 is omitted entirely.

[0057] As described below with reference to Figures 3A-3C, the magnetic region 124 may be defined by a ferromagnetic film disposed beneath a coating layer. The coating layer may be thin enough to allow passage of magnetization signals or encoded data, while being thick enough to conceal the ferromagnetic film. While the ferromagnetic film or other ferromagnetic element may be concealed or obscured by the coating layer, the electronic card 100 may include visual markings 126 or other indicia indicating the approximate location of the ferromagnetic element or film and / or indicating the boundaries or boundaries of the magnetic region 124. The visual markings 126 may be formed using ink or printing techniques and / or may include recessed marking features, similar to those described below with reference to Figures 10-15B.

[0058] As shown in FIGS. 1A and 1B , electronic card 100 may include four corner regions 112. In this example, corner regions 112 have rounded shapes. In some embodiments, corner regions 112 have non-uniform radii of curvature. Specifically, corner regions 112 may have shapes corresponding to splines or variable radius curves. Corner regions with variable or non-uniform radii of curvature can generally be said to have spline shapes. In some embodiments, corner regions 112 have constant or uniform radii of curvature. Generally, corner regions 112 may include corresponding edges (of edge sets 116, 122) and may abut adjacent edges along corresponding surfaces. In some embodiments, each edge of each corner region 112 has a bevel or chamfer that matches the bevel or chamfer of the remaining edges surrounding the corresponding surface (110, 120).

[0059] FIG. 1C is an exploded view of an exemplary electronic card 100. The electronic card 100 may be formed from a metal substrate or other substrate material. In one exemplary embodiment, the substrate is formed from a titanium or stainless steel material, and the electronic card 100 has a thickness less than that of a conventional credit card. Specifically, the thickness of the electronic card 100 may be less than 0.75 mm. Additionally, the flatness of the electronic card 100 is extremely high. For example, the electronic card 100 may have a flatness that varies by less than 50 μm across the area of the electronic card 100. In another example, the electronic card 100 may have a flatness that varies by less than 20 μm across the area of the electronic card 100. In another example, the electronic card 100 may have a flatness that varies by less than 10 μm across the area of the electronic card 100.

[0060] 1C, electronic card 100 includes a recess 108 formed in a front surface 110 of electronic card 100. Integrated circuit 106 is disposed at least partially within recess 108, and contact plate 102 is disposed over integrated circuit 106. Although recess 108 is depicted as being generally square or rectangular in shape, in alternative embodiments, recess 108 may be circular or may have a rounded shape or contour configured to accommodate a circular or rounded contact plate 102.

[0061] In some embodiments, the integrated circuit 108 and the contact plate 102 are connected (e.g., bonded) together to define a chip module 105. The chip module 105 may be approximately 1 cm square. In alternative embodiments, the chip module 105 may have a different shape, including a circular, oval, or round shape or profile. The area of the chip module 105 may be determined primarily by the area of the contact plate 102, which in this case are the same. The integrated circuit 106 may include one or more processors, microprocessors, computer processing units (CPUs), numerical processing units (NPUs), or other processing circuits. The integrated circuit 106 may also include one or more types of computer memory, including, for example, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), or other types of non-transitory computer storage. In some embodiments, the integrated circuit 106 also includes wireless circuitry configured to transmit and / or receive wireless communications or signals.

[0062] As shown in FIG. 1C , electronic card 100 may also include a stepped region 128 formed in back surface 120 of electronic card 100. In this example, stepped region 128 extends all the way to edge 122 a of electronic card 100. However, in other embodiments, stepped region 128 may be displaced inward from edge 122 a or another edge of electronic card 100. In some cases, stepped region 128 is defined by two parallel walls extending along the length (or width) of electronic card 100. As shown in FIG. 1C , stepped region 128 is defined by a single wall extending along the length of electronic card 100.

[0063] As shown in FIG. 1C , the ferromagnetic stack, including the ferromagnetic element 130 (e.g., a ferromagnetic film) and the backing layer 132, is at least partially disposed within a stepped region 128. The stepped region 128, which may also be referred to as a recess or pocket, may be a laser-ablated region formed using a laser-ablation or laser-machining process. The stepped region 128 may also be formed using a machining or grinding process that removes a portion of the substrate using a mechanical cutter or grinder. As shown in FIG. 1C , the stepped region 128 includes a stepped surface that is recessed, removed, or otherwise displaced from an adjacent surface of the substrate or card.

[0064] As shown in FIG. 1C , the ferromagnetic stack, including the ferromagnetic element 130 and the backing layer 132, extends all the way to the edge 122 a of the electronic card 100. The stepped region 128 may have a depth corresponding to or approximately equal to the thickness of the ferromagnetic stack. Specifically, the stepped region 128 may have a depth corresponding to or approximately equal to the combined thickness of the ferromagnetic element 130 and the backing layer 132. This allows for a substantially smooth surface flush with or along the back surface 120 of the electronic card 100. For purposes of this description, substantially smooth may be used to refer to a surface in which no transition, edge, or joint between the two elements is tactilely perceptible. According to some embodiments, some or all of the ferromagnetic element 130 may be covered or coated with a coating layer to conceal or obscure the ferromagnetic element 130.

[0065] In some cases, the outer surface of the ferromagnetic stack is textured to provide a tactile or visual effect. For example, the ferromagnetic elements 130 and backing layer 132 may be pressed or formed to create a texture along the outer surface of the card. The texture has a surface roughness in the range of 0.3 to 1.0 μm Ra. In some cases, the thickness of the ferromagnetic stack is thinner than a conventional magnetic strip. In some cases, the thickness of the ferromagnetic stack is approximately 200 μm to 270 μm. In some cases, the thickness of the ferromagnetic stack is approximately 225 μm to 250 μm.

[0066] 1C, the ferromagnetic element 130 and backing layer 132 are disposed within the recessed or stepped region 128. However, in other embodiments, the ferromagnetic element 130 may be disposed along the outer surface of the electronic card, and a coating layer or another layer may be disposed adjacent to the ferromagnetic element 130 to define a substantially smooth transition, edge, or joint between the layer and the ferromagnetic element 130.

[0067] 2 is an exploded view of another exemplary electronic card 200. Similar to the previous example, as shown in FIGS. 1A-1C, electronic card 200 includes a recess 208 formed in a front surface 210 of electronic card 200. A chip module 205 including an integrated circuit 206 and a contact plate 202 may be at least partially disposed within recess 208. In this example, integrated circuit 206 is at least partially disposed within recess 208, and contact plate 202 is disposed over integrated circuit 206.

[0068] As shown in FIG. 2 , electronic card 200 includes a laminate substrate including first layer 201 and second layer 203. In one exemplary embodiment, first layer 201 includes a metal or metal sheet formed from aluminum, carbon steel, stainless steel, titanium, or another type of metal or alloy. Second layer 203 may be formed from a polymer sheet (e.g., a plastic sheet) and adhered to first layer 201 using an adhesive or other bonding agent. In some cases, first layer 201 is laminated to second layer 203 by pressing the two sheets of material together and applying heat or an elevated temperature to form a bond between the two layers. While only two layers are shown in this example, more than two layers may be used in other embodiments. For example, a plastic layer similar to second layer 203 shown in FIG. 2 may be attached or glued to the opposite side (e.g., front side) of first layer 201. Thus, the first metal layer may be sandwiched or disposed between two or more polymer layers (plastic sheets) to form electronic card 200.

[0069] As shown in FIG. 2 , a ferromagnetic stack including a backing layer 232 and a ferromagnetic element 230 (e.g., a ferromagnetic film) can be attached to a substrate that does not include a stepped region (completely different from the example shown in FIG. 1C ). In some cases, one or more coatings or coating layers are deposited adjacent to the ferromagnetic element 230 and the backing layer 232. If the one or more coatings or coating layers have a combined thickness approximately equal to the combined thickness of the ferromagnetic element 230 and the backing layer 232, the interface, transition, or junction between the ferromagnetic element 230 and the exterior surface of the electronic card 200 (formed by one of the coatings or coating layers) can be substantially smooth. In some embodiments, the ferromagnetic element 230 is coated with an additional coating or coating layer that extends across the entire back surface of the electronic card 200 to mask or obscure the ferromagnetic element 230.

[0070] 1A-1B and 2 illustrate exemplary configurations, and the locations of various elements may vary depending on the particular implementation. For example, in the examples of FIGS. 1A-1B and 2, the ferromagnetic stack or ferromagnetic element and the integrated circuit are located on opposite sides of the electronic card. However, in alternative embodiments, the recessed and stepped regions may be formed on the same surface (e.g., the front surface), and the integrated circuit and ferromagnetic element may be located along the same side of the electronic card. Furthermore, while in FIGS. 1A-1B and 2, the magnetic region extends along the long sides of the rectangular electronic card, in other implementations, the magnetic region may extend along one or both short sides of the rectangular card. In some cases, the magnetic region may extend along more than one side of the electronic card. Additionally, the locations of the contact plate and its corresponding integrated circuit may vary from implementation to implementation. In some embodiments, the electronic card may not include a contact plate, as shown in the examples of FIGS. 1A, 1B, and 2.

[0071] The examples of Figures 1A-1B and 2 show electronic cards having particular shapes or form factors. However, depending on the embodiment, the length, width, and / or aspect ratio of length to width may differ from the general shapes shown in Figures 1A, 1B, and 2. Specifically, the width of the electronic card may be greater than that of a conventional credit card. In another example, the length of the electronic card may be shorter than that of a conventional credit card. Similarly, the shapes and sizes of various elements, including magnetic regions or elements, may be wider or otherwise dimensionally different than the magnetic strip of a conventional credit card.

[0072] 3A-3C are cross-sectional views of electronic cards 300a, 300b, and 300c, which may correspond to cross-section BB of electronic card 100 shown in FIG. 1B. As shown in FIG. 3A, electronic card 300a includes substrate 302a coated with coatings or coating layers 333a and 334a. As described with reference to FIG. 3A and other figures described herein, the coating layers may be referred to as coatings, masking layers, or maskings. The descriptions of coating layers 333a and 334a, substrate 302a, ferromagnetic element 330a, and backing layer 333a may also apply to other embodiments described with reference to other figures, and redundant descriptions of these and other elements may be omitted or abbreviated for clarity.

[0073] 3A is a cross-sectional view of a portion of electronic card 300a having magnetic region 324a, which may correspond to magnetic region 124 of FIG. 1B. As shown in FIG. 3A, a ferromagnetic stack including ferromagnetic element 330a (e.g., a ferromagnetic film) at least partially defines the size and location of magnetic region 324a. The ferromagnetic stack including ferromagnetic element 330a and backing layer 332a is disposed within stepped region 328a, has a total thickness approximately equal to the depth of stepped region 328a, and forms a substantially flush or smooth interface along back surface 320a of electronic card 300a.

[0074] In this example, stepped region 328a is formed in substrate 302a. In some embodiments, ferromagnetic element 330a has a thickness of about 1-20 μm. In some embodiments, ferromagnetic element 330a has a thickness of about 3-10 μm. In some embodiments, liner layer 332a has a thickness of about 50-150 μm. In some embodiments, liner layer 332a has a thickness of about 80-100 μm. In some embodiments, liner layer 332a has a thickness of about 90 μm. The thickness of the ferromagnetic stack, including the combined thickness of ferromagnetic element 330a and liner layer 332a, can range from 200 μm to 270 μm.

[0075] The substrate 302a, for this example and other examples described herein, may be formed from a single material or from multiple materials bonded or laminated together. For example, the substrate 302a may be formed from a metallic material (e.g., a metal sheet) including aluminum, carbon steel, stainless steel, titanium, or other types of metals or alloys. The substrate 302a may also be formed from one or more polymers (e.g., a polymer sheet or film) including, for example, polyvinyl chloride, polyethylene-based polymers, PVC, polyester, acrylic, styrene, or polycarbonate. In some examples, the substrate 302a is formed from a composite material, which may include filled polymers, carbon fiber, carbon laminates, or other structures formed from two or more materials. In some cases, the substrate 302a may be formed from ceramic, glass, or other similar types of materials. The substrate 302a may be formed as a single or homogenous element, or may be formed from a stack of multiple materials or layers (e.g., multiple sheets and / or films) bonded or adhered to each other. For example, the substrate 302a may be formed from a metal sheet (e.g., a titanium sheet) and bonded or laminated to one or more polymer sheets (e.g., a plastic sheet) to form a laminated multi-layer substrate. In one example, the substrate 302a includes a metal sheet bonded to two plastic sheets, each bonded to an opposing surface of the metal sheet. In another example, the substrate 302a includes a single plastic sheet bonded to a surface of the metal sheet. Adhesives or other bonding agents may be used to bond the multiple layers together.

[0076] Substrate 302a may be formed from a sheet, plate, or multiple layers having a total thickness of less than 1 mm. In some cases, substrate 302a has a total or overall thickness of approximately 0.6-0.85 mm. In some cases, electronic card 300a has an overall thickness of less than 1 mm. In some cases, electronic card 300a has an overall thickness of approximately 0.6-0.85 mm. In some cases, electronic card 300a has an overall thickness of approximately 0.5-0.75 mm.

[0077] As shown in FIG. 3A , coating or coating layer 333a may define at least a portion of front surface 310a, and coating layer 334a may define at least a portion of back surface 320a. Although coating layers 333a, 334a are designated by different reference numerals, coating layers 333a, 334a may comprise a single continuous coating layer that defines at least a portion of both front surface 310a and back surface 320a. In some cases, coating layers 333a, 334a may be referred to as a single layer even if the edges of the card are uncoated and the single layer is not continuous. In some cases, coating layers 333a, 334a each have a thickness of less than 100 μm. In some embodiments, coating layers 333a, 334a each have a thickness of between 50 μm and 10 μm. In some embodiments, coating layers 333a, 334a each have a thickness of approximately 60 μm.

[0078] In this example and other examples described herein, the coating layers (333a, 334a) may be scratch and / or chip resistant to provide a durable coating for the electronic card. In some cases, the coating layers may be substantially stain resistant and substantially impervious to staining or discoloration with normal use. As described herein, one or more coating layers may include a hard coating or coating layer that provides structural durability and inhibits discoloration of the electronic card due to expected use of the electronic card.

[0079] 3A and other figures throughout this disclosure are depicted as being a single homogenous or monolayer, the coating layers may be formed from multiple layers or regions. For example, as shown in the detailed view, the coating layers 333a, 334a may include a primer layer 352 disposed on the surface of the substrate 302a, a first layer 354 formed on the primer layer 352, and a second layer 356, including a hard coating or transparent layer formed on the surface of the first layer 354.

[0080] The first layer 354 may include one or more polymeric materials. While depicted as a separate, discrete layer, in some cases, the first layer 354 includes a primer layer 352 adhered to the surface of the substrate 302a. The first layer 354 may include one or more additional urethane materials bonded or adhered to the substrate 302a via the first urethane or primer layer 352. The primer layer 352 may be specially formulated to adhere to both the metal substrate (e.g., titanium, stainless steel) and the color layer or first layer 354, which may include a significant concentration of a particular pigment, such as titanium oxide. The one or more additional urethane materials may include a dual urethane or polyurethane formulation applied to the first urethane or primer layer 352.

[0081] In some examples, the first layer 354 of the coating layers 333a, 334a can be formed from a polymeric material having a pigment dispersed therein. The first layer 354 may also be referred to herein as a polymeric layer, a color layer, and / or a pigment layer. The pigment particles dispersed within the polymeric layer can be inorganic pigment particles, including, but not limited to, metal oxides such as titanium oxide (TiO2, Ti2O3), zinc oxide (ZnO), manganese dioxide (MnO2), and iron oxide (Fe3O4). In some cases, the pigment includes one or more of aluminum oxide, cobalt, copper, or other pigments suitable for use in consumer products. The particles can have a size ranging from 0.1 μm to 10 μm or from 0.1 μm to 1 μm. The polymeric layer can further include other additives.

[0082] In some cases, the coating layers 333a, 334a include a second layer 356 formed on the first layer 354, such as a polymer layer, a color layer, or a pigment layer, which may include a polymer and a pigment, as described above. In some cases, the second layer 356 may be a transparent layer formed from a transparent, translucent, and / or transparent polymer. The transparent polymer may have higher hardness and / or abrasion resistance than the underlying first layer. For example, the second layer 356 may include an acrylate polymer or an epoxy polymer. The second layer 356 may include a UV-curable material that hardens upon exposure to a UV light source to form a hardened outer surface. The second layer 356 may include a filler material, such as a nanoscale inorganic material or diamond material. The diameter of the nanoscale filler material may be less than 100 nm or less than 50 nm. In some embodiments, the second layer 356 includes a diamond-like carbon (DLC) coating or other similar coating material. For example, the second layer 356 of the coating layers 333a, 334a may include a tetrahedral amorphous carbon material having a thickness in the range of 1 μm to 50 μm.

[0083] The coating layers 333a, 334a, including their constituent components or sublayers, may be deposited on the substrate 302a using a deposition process or layer application process. Examples of deposition or layer application processes include physical vapor deposition (PVD), atomic deposition coating (ALD), spray coating, dip coating, and other similar material deposition processes. Each layer or sublayer of the coating layers 333a, 334a may be applied using a separate deposition process depending on the type of layer or sublayer being applied.

[0084] The ferromagnetic element 330a may be formed from a film of a material capable of magnetically storing or maintaining encoded data or other information. The encoded data or other information may be read using an external card reader or card reading device. The ferromagnetic element 330a may include a film or thin layer of a metal or metallized material configured to hold or maintain a magnetic field. In some cases, the ferromagnetic element 330a is formed from nickel, iron, ferrite, steel, cobalt, or other ferromagnetic material. The ferromagnetic element 330a may be deposited, laminated, or glued or attached to the backing layer 332a. In some embodiments, the ferromagnetic element 330a is deposited (e.g., sputtered, printed, coated) on the backing layer 332a.

[0085] The backing layer 332a may be formed from one or more of a polymer, a metal, or other suitable material and may include an adhesive or binder. In one example, the backing layer 332a includes two or more polycarbonate sheets bonded or otherwise adhered to one another. In one embodiment, the backing layer 332a includes a first polycarbonate sheet that is colored white and a second polycarbonate sheet that is transparent or clear. The two or more polycarbonate sheets may be bonded to the substrate 302a with a thermosetting adhesive. In another example, the backing layer 332a may include or comprise a pressure-sensitive adhesive (PSA) on one or both sides of the backing layer 332a to facilitate attachment of the ferromagnetic element 330a to the substrate 302a. In another example, the backing layer 332a is formed from one or more polymeric materials (e.g., polycarbonate sheets) and includes an adhesive on one or more sides. The polymeric material of the backing layer 332a may be bonded to the substrate 302a using a thermal bonding or thermal lamination process that does not use a separate adhesive layer.

[0086] The ferromagnetic stack can be treated to provide a particular texture. The texture can provide a desired appearance and / or feel that corresponds to the texture of other portions of the electronic card 300a. For example, the ferromagnetic stack can be formed from two or more polycarbonate sheets bonded to a ferromagnetic film. The ferromagnetic stack can be pressed with a heated texture plate that imprints the texture onto the outer surface of the ferromagnetic stack. In some cases, the surface roughness of the imprinted texture ranges from 0.3 to 1.0 μm Ra. In one example, the imprinted texture has a surface roughness of about 0.5 μm Ra or greater.

[0087] Using the examples described herein, ferromagnetic stacks thinner than some conventional magnetic strips can be formed. In some embodiments, ferromagnetic elements 330a have a thickness ranging from 0.005 mm to 0.05 mm, and backing layer 332a has a thickness ranging from 0.05 mm to 1.5 mm. The thickness of the ferromagnetic stack, including the combined thickness of ferromagnetic elements 330a and backing layer 332a, can range from 200 μm to 270 μm.

[0088] FIG. 3B illustrates an exemplary electronic card 300b having a chamfered feature or chamfered edge. Electronic card 300b may include elements and features described herein with respect to other electronic card embodiments, the description of which is omitted for clarity. As shown in FIG. 3B, electronic card 300b includes chamfered edges 310b and 312b (exemplary chamfered features) formed along the edges of electronic card 300b. While FIG. 3B illustrates examples of chamfered edges 310b and 312b, electronic card 300b may include chamfered edges extending along all of the outer edges of the card (e.g., along edge set 116 in FIG. 1A and edge set 122 in FIG. 1B).

[0089] In this example, the chamfered edge 310b is at least partially defined by a sloped region formed in the ferromagnetic element 330b and the backing layer 332b. As shown in FIG. 3B, the chamfered edge 310b does not extend beyond the sloped edges of the ferromagnetic element 330b and the backing layer 332b. Thus, the chamfered edge 310b is at least partially defined by the sloped edges formed in the ferromagnetic element 330b and the backing layer 332b. Stated differently, the sloped edges of the ferromagnetic element 330b and the backing layer 332b terminate at the (vertical) sidewalls 314 or edges of the substrate 302b. Generally, as shown in FIG. 3B, the sidewalls 314 are approximately perpendicular to the surfaces 320a and 310b.

[0090] As shown in FIG. 3B , electronic card 300b includes coating layers 333b, 334b extending over at least a portion of front surface 310b and back surface 320b of electronic card 300b. As described above with respect to FIG. 3A and other embodiments herein, coating layers 333b, 334b may be formed from multiple layers. Specifically, coating layers 333b, 334b may include a first layer including a polymer and a pigment dispersed therein and a second outer layer formed on the first layer. The second or outer layer may include a transparent polymer and / or a diamond-like carbon (DLC) coating. As previously described, although coating layers 333b, 334b are indicated by two reference numerals in FIG. 3B , coating layers 333b, 334b may be formed from a single continuous layer or coating layer.

[0091] FIG. 3C illustrates another exemplary electronic card 300c. The electronic card 300c may include elements and features described herein with respect to other electronic card embodiments, and for clarity, the description thereof is omitted. FIG. 3C illustrates an electronic card 300c having coating layers 333c, 334c extending across substantially all or nearly all of the front and back surfaces of the electronic card 300c. As shown in FIG. 3C, the coating layer 334c extends across the back surface, which includes a ferromagnetic stack including a ferromagnetic element 330c and a backing layer 332c. As previously described, the ferromagnetic stack may define a magnetic region of the electronic card 300c (see, for example, region 124 in FIG. 1B). Extending the coating layer 334c over the ferromagnetic element 330c may conceal the ferromagnetic element 330c from view. In some cases, the coating layer 334c may provide a continuous and / or uniform visual appearance across the transition between the magnetic region and adjacent or surrounding regions of the electronic card 300c. The coating layer 334c may conceal the transition between the ferromagnetic element 330c and the adjacent portion of the electronic card 300c, but additional markings or indicia may be formed on or in the coating layer 334c to indicate the approximate location of the magnetic region or edge of the ferromagnetic element 330c and / or the boundary of the encoding region within the magnetic region defined by the ferromagnetic element 330c.

[0092] Generally, the coating layer 334c is configured to pass magnetic signals and / or magnetically encoded information stored or encoded in the ferromagnetic element 330c. Specifically, the coating layer 334c may be formed from a dielectric or non-conductive material and is thin enough to enable reliable communication between the ferromagnetic element 330c and an external card reader or card reading device. In some cases, the thickness of the coating layer 334c is about 60 μm or less. In some cases, the thickness of the coating layer 334c is about 30 μm or less. In some cases, the thickness of the coating layer 334c is about 20 μm or less.

[0093] The coating layer 334c typically includes at least one layer or region containing a pigment dispersed within the coating layer 334c to help hide or mask the underlying substrate 302c and / or ferromagnetic element 330c. The thickness of the coating layer 333c, 334c may depend, at least in part, on the color of the pigment. For example, a dark pigment may hide underlying elements or components with a thinner coating than a light or white pigment.

[0094] As described above with reference to FIG. 3A, the coating layer 334c may also include an outer layer or coating that may have a hardness that resists abrasion and / or scratching. In some cases, the outer layer is a transparent polymer such as an acrylic (e.g., an acrylate polymer) or an epoxy (e.g., an epoxy polymer). In some cases, the coating layer 334c includes a UV-curable polymer. In some cases, the outer layer or coating includes a diamond-like carbon (DLC) coating. The DLC coating may have a thickness in the range of approximately 1 μm to 50 μm.

[0095] As shown in FIG. 3C , coating layer 334c and the ferromagnetic stack, including ferromagnetic element 330c and backing layer 332c, at least partially define chamfered edge 310c. Similarly, coating layer 333c and substrate 302c at least partially define chamfered edge 312c. As previously mentioned, although coating layers 333c, 334c are indicated by two reference numerals in FIG. 3C , coating layers 333c, 334c may be formed from a single continuous layer or layers. Coating layers 333c, 334c may be referred to as a single layer even if the coating layer does not extend around the edge of the card but is a discontinuous layer from the front to the back of electronic card 300c.

[0096] FIG. 4 illustrates another exemplary electronic card 400. The electronic card 400 may include elements and features described herein with respect to other electronic card embodiments, and for clarity, the description thereof is omitted. FIG. 4 illustrates the electronic card 400 with coating layers 433, 434 extending over substantially all or nearly all of the front and back surfaces of the electronic card 400. The cross-sectional view of FIG. 4 corresponds to the configuration of FIG. 2, in which the ferromagnetic element 230 and backing layer 232 are not disposed within recesses or grooves. As shown in FIG. 4, the coating layer 434 extends over the back surface, including the ferromagnetic element 430 in the magnetic region (see, for example, region 124 in FIG. 1B). Extending the coating layer 434 over the ferromagnetic element 430 can hide the ferromagnetic element 430 from view. As shown in FIG. 4, the coating layer 434 does not have a uniform thickness to accommodate the thickness of the ferromagnetic element 430 and backing layer 432.

[0097] As with the previous example, coating layer 434 may provide a continuous and / or uniform visual appearance across the transition between the magnetic region and the adjacent or surrounding region of electronic card 400. Coating layer 434 may conceal the transition between ferromagnetic element 430 and the adjacent portion of electronic card 400, but additional markings or indicia may be formed on or in coating layer 434 to indicate the approximate location of the magnetic region or edge of ferromagnetic element 430 and / or the boundary of the encoded region within the magnetic region defined by ferromagnetic element 430.

[0098] Generally, at least a portion of coating layer 434 is configured to transmit magnetic signals and / or magnetically encoded information stored or encoded on ferromagnetic element 430. Specifically, coating layer 434 may be formed from a dielectric or non-conductive material and is thin enough to allow reliable communication between ferromagnetic element 430 and an external card reader or card reading device. In some cases, coating layer 434 has a thickness of about 60 μm or less in the area extending over ferromagnetic element 430. In some cases, coating layer 434 has a thickness of about 30 μm or less in the corresponding area. In some cases, coating layer 434 has a thickness of about 20 μm or less in the corresponding area.

[0099] As with the previous example, the coating layer 434 typically includes at least one layer or region containing a pigment dispersed within the coating layer 434 to help hide or mask the underlying substrate 402 and / or ferromagnetic element 430. The thickness of the coating layers 433, 434 may depend, at least in part, on the color of the pigment. For example, a dark pigment may hide an underlying element or component with a thinner coating than a light or white pigment.

[0100] As discussed above with reference to Figures 3A and 3C, coating layer 434 may also include an outer layer or coating that may have a hardness that resists abrasion and / or scratching. In some cases, the outer layer is a transparent polymer such as an acrylic (e.g., an acrylate polymer) or an epoxy (e.g., an epoxy polymer). In some cases, coating layer 434 includes a UV-curable polymer. In some cases, the outer layer or coating includes a diamond-like carbon (DLC) coating. The DLC coating may have a thickness in the range of approximately 1 µm to 50 µm.

[0101] 4, coating layer 434, ferromagnetic element 430, and backing layer 432 at least partially define chamfered edge 410. Similarly, coating layer 433 and substrate 402 at least partially define chamfered edge 412. As previously mentioned, although coating layers 433, 434 are indicated by two reference numerals in FIG. 4, coating layers 433, 434 may be formed from a single continuous layer or coating layers.

[0102] FIG. 5A is a cross-sectional view of an electronic card 500a. The cross-sectional view may correspond to section AA shown in FIG. 1A. As shown in FIG. 5A, the electronic card 500a includes an integrated circuit 506a disposed at least partially within a recess 508a formed in a substrate 502a of the electronic card 500a. A contact plate 503a is disposed on the integrated circuit 506a and is at least partially disposed within the recess 508a. The integrated circuit 506a and / or the contact plate 503a may be connected or integrated to define a chip module approximately 1 cm square. The dimensions of the integrated circuit 506a and / or the contact plate 503a may vary depending on the embodiment, and they may have a linear shape with widths and lengths ranging between 0.5 cm and 2 cm. The length and width need not be equal or approximately equal. In some cases, the integrated circuit 506a and / or the contact plate 503a may be circular or round in shape or outline.

[0103] As shown in FIG. 5A , contact plate 503a includes terminal electrode array 504a that is exposed and defines at least a portion of the exterior surface of electronic card 500a. The depth of recess 508a and / or the thickness of integrated circuit 506a and contact plate 503a may be configured to provide a substantially smooth or flush surface along the front surface of electronic card 500a. In some embodiments, terminal electrode array 504a protrudes slightly from the front surface of electronic card 500a to facilitate physical and electrical connection with an external card reader or card reading device. As shown in FIG. 5A , the front and back surfaces of electronic card 500a may be at least partially defined by coating layers 532a and 534a.

[0104] 5A , the contact plate 503a may be attached to the substrate 502a by an adhesive 548a. The adhesive 548a may include a pressure-sensitive adhesive, an epoxy adhesive, a hot-melt bonding agent, or some other type of adhesive material or composition. In this example, the contact plate 503a is attached to a ledge area formed within the recess 508a. By attaching the contact plate 503a to the ledge area, the combined thickness of the adhesive 548a and the contact plate 503a may be more easily controlled or predicted, providing a more consistent or uniform position of the terminal electrode array 504a relative to the exterior surface of the electronic card 500a.

[0105] In some examples, the shelf region and / or the surface of contact plate 503a are textured or otherwise prepared to promote adhesion to adhesive 548a. For example, the shelf region of recess 508a may be laser textured to form small surface features that improve bonding between the shelf region of recess 508b and adhesive 548a. In some cases, the surface may be laser polished to form micro-sized features that increase the bonding surface area and improve the bond strength between recess 508b and adhesive 548a. In some embodiments, a laser-based process may be used to polish the surface of the shelf region to create a surface roughness of approximately 1.0 μm Ra, thereby improving the bond strength between substrate 502a and adhesive 548a. In some cases, a laser-based process may be used to create a surface roughness in the range of 0.5-2 μm Ra. In some cases, the shelf region of recess 508a is textured using a mechanical and / or chemical texturing process to create the desired surface roughness.

[0106] The surface of the ledge area of recess 508a may also be coated with a coloring layer or colorant to create a black or dark color along the ledge area. This may be useful for a decorative appearance of the transition between contact plate 503a and the surrounding portion of electronic card 500a. While these features and bonding techniques are described with respect to electronic card 500a in FIG. 5A, the same techniques may be applied to other embodiments, including the electronic cards shown in FIGS. 5B and 5C.

[0107] The recess 508a and / or adhesive 548a may also include one or more venting features that allow gases or vapors to escape from the recess 508a during manufacturing or other circumstances. For example, small grooves may be formed in the shelf region and / or adhesive 548a to allow hot gases or vapors to escape from the recess 508a. In one example, the shelf region defines grooves ranging from 0.5 mm to 1 mm square that allow gases or vapors to pass through. Additionally or alternatively, the adhesive 548a may include gaps ranging from 0.5 mm to 1 mm that allow gases or vapors to pass through. The venting features may aid in the escape of gases or vapors during a thermal bonding or lamination process in which one or more surfaces of the electronic card 500a are heated. In some cases, venting features defined in the adhesive and / or recesses may facilitate higher temperature bonding or manufacturing processes. While the venting features are described with respect to the electronic card 500a of FIG. 5A , the same techniques may be applied to other embodiments, including the electronic cards shown in FIGS. 5B and 5C .

[0108] In the example of FIG. 5A , the integrated circuit 506a includes a semiconductor 542a embedded in an encapsulation 544a. The semiconductor 542a may be electrically connected to one or more of the terminal electrode arrays 504a. In this example, the semiconductor 542a of the integrated circuit 506a is connected to the terminal electrode arrays 504a by one or more respective vias or conductive elements 546a. In some cases, the vias or conductive elements 546a are integrally formed in the contact plate 503a and define terminals that are soldered to the integrated circuit 506a. The encapsulation 544a may be formed from a dielectric material and provide structural support and electrical insulation for the integrated circuit 506a.

[0109] Although a simplified example is shown in FIG. 5A , integrated circuit 506a and / or contact plate 503a may include additional components or elements not explicitly shown in FIG. 5A . For example, electronic card 500a may also include an antenna and / or wireless communication circuitry configured to facilitate wireless communication with an external device, such as a card reader with wireless functionality or capabilities. In some cases, integrated circuit 506a includes an antenna and / or wireless communication circuitry configured to communicate wirelessly with an external device. If integrated circuit 506a and / or electronic card 500a are configured for wireless communication with an external device, contact plate 503a may be omitted or optionally provided.

[0110] Generally, the integrated circuit 506a is configured to provide electronic functionality for the electronic card 500a. Specifically, the integrated circuit 506a may include a microcontroller or other type of processing unit configured to perform a particular set of functions. For example, if the electronic card 500a is configured to facilitate financial transactions, the integrated circuit 506a may be configured to store and / or generate a security code used to authenticate a user or a transaction. In some cases, the integrated circuit 506a may be configured to provide a unique identification number or serial number that may be associated with a user, a user's account, an advertisement, a merchant, or other entity or institution. As described in more detail below with reference to FIG. 17 , the integrated circuit 506a may include, for example, non-volatile computer memory, a computer processing unit (CPU), a numerical processing unit (NPU), wireless communication circuitry, or other elements or components including other electronic elements, components, or systems.

[0111] Figure 5A may be a cross-sectional view of a chip module having a contact plate similar to contact plate 602a of Figure 6A taken along section CC. Specifically, contact plate 503a and contact plate 602a both include center electrodes (504a, 620a) electrically connected to integrated circuit 506a by via 546a. However, in alternative configurations, one or more of the electrodes may not be electrically connected to integrated circuit 506a and may be decorative in nature.

[0112] FIG. 5B shows an alternative configuration in which the center electrode 504b or center portion is not connected to the semiconductor 542b of the integrated circuit 506b. The configuration shown in FIG. 5B may correspond to the contact plate 602b of FIG. 6B along cross section DD. As shown in FIG. 5B, the center portion 504b and the periphery are not connected to the semiconductor 542b of the integrated circuit 506b. The left and right electrodes 504b are electrically connected to the semiconductor 542b by respective conductors 543b, which may include wires or other conductive tubes. The semiconductor 542b, the conductors 543b, and at least a portion of the vias 546b may be encapsulated in an encapsulation 544b.

[0113] As shown in FIG. 5B, electronic card 500b includes coating layers 532b, 534b formed on corresponding surfaces of substrate 502b. As in the previous example, contact plate 503b is connected to recess 508b by adhesive 548b, which may be disposed along a ledge or protrusion of recess 508b. Various elements described above with reference to the previous figures also apply to the configuration of FIG. 5B. Specifically, recess 508b may include venting features to facilitate the release of gases or vapors, and the ledge of recess 508b may be textured to promote bonding with adhesive 548b.

[0114] FIG. 5C illustrates another alternative configuration in which the center electrode 504c or core is not connected to the semiconductor 542c of the integrated circuit 506c. Additionally, the configuration illustrated in FIG. 5C includes a terminal electrode 507c extending around the edge of the contact plate 503c. In this example, the terminal electrode 507c is electrically connected to the semiconductor 542c by a conductive tube 543c. The semiconductor 542c, the conductive tube 543c, and at least a portion of the terminal electrode extending along the bottom surface of the contact plate 503c may be encapsulated in an encapsulation portion 544c. The configuration illustrated in FIG. 5C may correspond to the contact plate 602c of FIG. 6C. Specifically, the portion of the terminal electrode 507c wrapping around the contact plate 503c of FIG. 5C may correspond to the connector portion 656c of the terminal electrode 652c of FIG. 6C.

[0115] As shown in FIG. 5C, electronic card 500c includes coating layers 532c, 534c formed on corresponding surfaces of substrate 502c. As in the previous example, contact plate 503c is connected to recess 508c by adhesive 548c, which may be disposed along a ledge or protrusion of recess 508c. Various elements described above with reference to previous figures also apply to the configuration of FIG. 5C. Specifically, recess 508c may include venting features to facilitate the release of gases or vapors, and the ledge of recess 508c may be textured to promote bonding with adhesive 548c.

[0116] 6A is a top view of an exemplary contact plate 602a. The contact plate 602a may correspond to the contact plates described above with reference to FIGS. 1A, 1C, 1D, and 5A. The contact plate 602a includes a plate substrate 610a and an array of terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a disposed along a front or outer surface of the plate substrate 610a. The terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a are formed from a conductive material and each define a portion of the outer surface of the electronic card, which may be exposed to facilitate physical contact and electrical connection with an external device, such as an external card reader or card reading device. In some cases, the terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, 628a may be formed from copper, nickel, platinum, carbon, silver, gold, alloys, or other conductive materials.

[0117] Generally, the plate substrate 610a defines a set of outer edges that form the outline or perimeter of the plate substrate 610a. As shown in Figure 6A, each of the terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, 628a is separated or displaced from an edge (of the outer edge set) of the plate substrate 610a. Specifically, as shown in FIG. 6A , the contact plate 602a includes a perimeter 630a surrounding the terminal electrode arrays 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a, where each of the terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a is displaced from its nearest edge by the width of the corresponding portion of the perimeter 630a. While the perimeter 630a depicted in FIG. 6A appears to have a generally uniform width, in other embodiments, the width may vary or be non-uniform. For example, the top or bottom of the perimeter 630a may be larger or smaller than the sides of the perimeter 630a. Similarly, the top of the perimeter 630a may have a different width than the bottom, etc.

[0118] 6A , terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a may each be configured to provide an electrical connection for a specific function of the electronic card. By way of example, first terminal electrode 612a may provide a dedicated power terminal (e.g., a VCC terminal), second terminal electrode 614a may provide a dedicated reset signal terminal (e.g., a RST terminal), third terminal electrode 616a may provide a dedicated clock signal terminal (e.g., a CLK terminal), fourth terminal electrode 618a may provide an auxiliary or programmable terminal, fifth terminal electrode 620a may provide an auxiliary or programmable terminal, sixth terminal electrode 622a may provide a dedicated ground terminal (e.g., a GND terminal), seventh terminal electrode 624a may provide a dedicated programming terminal (e.g., a VPP terminal), and eighth and ninth terminal electrodes 626a and 628a may provide auxiliary or programmable terminals.

[0119] 6B, 6C, and 6D show alternative electrode configurations for the contact plates. Specifically, contact plates 602b, 602c, and 602d all include peripheral portions 630b, 630c, and 630d that are at least partially coated with a conductive material. The conductive material of peripheral portions 630b, 630c, and 630d can be the same or similar to the material used to form terminal electrodes 642b, 652c, and 662d. In some cases, peripheral portions 630b, 630c, and 630d and terminal electrodes 642b, 652c, and 662d are formed from the same one or more layers and then separated by forming voids or grooves 644b, 654c, and 664d in one or more layers to electrically insulate terminal electrodes 642b, 652c, and 662d from other portions of the one or more layers forming peripheral portions 630b, 630c, and 630d.

[0120] In FIG. 6B, the terminal electrode 642b is separated from the periphery 630b by a gap or groove 644b. The gap or groove 644b electrically insulates the corresponding terminal electrode 642b from other conductive elements along the top surface of the contact plate 602b. In some cases, the groove 644b exposes a portion of the plate substrate 610b. As in the previous example, the terminal electrode 642b is displaced from the corresponding edge of the plate substrate 610b. The contact plate 602b in FIG. 6B may correspond to the cross-sectional view depicted in FIG. 5B.

[0121] As in the previous example, in FIG. 6C , the terminal electrodes 652c are separated from the periphery 630c by gaps or grooves 654c. The gaps or grooves 654c electrically insulate each terminal electrode 652c from other conductive elements along the top surface of the contact plate 602c. In some cases, the grooves 654c expose a portion of the plate substrate 610c. As shown in FIG. 6C , the terminal electrodes 652c each include a connector portion 656c that can extend around the edge of the plate substrate 610c for electrical connection to an integrated circuit or other electrical component. The contact plate 602c in FIG. 6C may correspond to the cross-sectional view depicted in FIG. 5B or 5C.

[0122] In FIG. 6D , the terminal electrodes 662d are separated from the periphery 630d by a gap or groove 664d. The gap or groove 664d electrically insulates each respective terminal electrode 662d from other conductive elements along the top surface of the contact plate 602d. In some cases, the groove 664d exposes a portion of the plate substrate 610d. As shown in FIG. 6D , the contact plate 602d also includes a periphery 666d that surrounds the periphery 630d. The periphery 666d may not be coated with a conductive coating. In some cases, the periphery 666d includes an exposed surface of the plate substrate 610d. The contact plate 602d in FIG. 6D may correspond to the cross-sectional view depicted in FIG. 5A .

[0123] 7A-7D illustrate various exemplary terminal electrode arrays. Specifically, FIG. 7A illustrates an exemplary contact plate 702a having a rectangular terminal electrode array 704a. As shown in FIG. 7A, the terminal electrode 704a is disposed on an outer or upper surface of a plate substrate 710a and is displaced from the edge of the plate substrate 710a by a gap or space. Specifically, the terminal electrode array 704a is at least partially surrounded by a peripheral region 730a. In this example, none of the electrodes of the terminal electrode array 704a extend to the edge of the contact plate 702a. However, in alternative embodiments, one or more electrodes of the terminal electrode array 704a may extend to a corresponding edge of the contact plate 702a.

[0124] 7B shows an exemplary contact plate 702b having a square or rectangular terminal electrode array 704b. As in the previous example, the terminal electrode array 704b is disposed on a plate substrate 710b and is offset or spaced from the edge of the plate substrate 710b. As shown in FIG. 7B, the terminal electrode array 704b is at least partially surrounded by a peripheral region 730b of the plate substrate 710b.

[0125] 7C shows an exemplary contact plate 702c having a terminal electrode array 704c that is elongated and has rounded corners. As in the previous example, the terminal electrode array 704c is disposed along or on a plate substrate 710c and is offset or spaced from the edge of the plate substrate 710c. As shown in FIG. 7C, the terminal electrode array 704c is at least partially surrounded by a peripheral region 730c of the plate substrate 710c.

[0126] 7D shows an exemplary contact plate 702d having a diamond-shaped terminal electrode array 704d. As in the previous example, the terminal electrode array 704d is disposed on a plate substrate 710d and is offset or spaced from the edge of the plate substrate 710d. As shown in FIG. 7D, the terminal electrode array 704d is at least partially surrounded by a peripheral region 730d of the plate substrate 710d.

[0127] The terminal electrode configurations shown in FIGS. 7A-7D are provided as examples and are not intended to be an exhaustive description of all possible configurations. For example, the electrodes of a terminal electrode array need not have similar or identical shapes or be arranged in a uniform pattern. The terminal electrodes may vary in shape and location within the array depending on the particular implementation. Furthermore, not all terminal electrodes need to be displaced or spaced apart from the edge of the contact plate or plate substrate. In some instances, one or more of the electrodes may extend to a corresponding edge of the contact plate or plate substrate. Furthermore, not each of the terminal electrodes need be electrically connected to an integrated circuit or other electrical component. For example, one or more of the terminal electrodes may be decorative in nature or may be a "dummy" terminal electrode that does not perform an electrical function.

[0128] 8A and 8B are exemplary cross-sectional views of the exemplary contact plate of FIG. 6. Specifically, FIG. 8A illustrates an exemplary contact plate 802a corresponding to contact plates 602a, 602b, 602c, and 602d of FIGS. 6A-6D. As shown in FIG. 8A, contact plate 802a includes terminal electrodes 818a, 820a, and 828a disposed or positioned on the upper or front surface of plate substrate 810a. In this example, plate substrate 810a may be formed from a non-metallic material, including, for example, a polymer or composite material. Examples of suitable polymer materials for plate substrate 810a include, but are not limited to, polycarbonate, phenolic, polysulfone, polyethersulfone, polycetal, polyester resins (e.g., polyethylene, polyester, PVC), and other suitable polymers. Examples of suitable composite materials for plate substrate 810a include, but are not limited to, fiber-reinforced plastics, glass fiber composites, carbon fiber composites, laminated composites, and other suitable composite materials. In some examples, the plate substrate 810a may be formed at least in part from a metallic material such as, for example, steel, stainless steel, aluminum, copper, titanium, an alloy, or other metallic material. The plate substrate 810a may be formed from ceramic, glass, or other similar types of materials. In some cases, the plate substrate 810a is formed from a metal sheet that is stamped or machined from a larger plate or sheet.

[0129] If the plate substrate 810a is formed from a metal or conductive material, the terminal electrodes 818a, 820a, 828a may be formed along the top or outer surface of the plate substrate 810a using an electroplating process. If the plate substrate 810a is formed from a non-conductive material, the terminal electrodes 818a, 820a, 828a may be formed using a combination of electroless and electroplating processes, as described below.

[0130] Whether the plate substrate 810a is formed from a conductive or non-conductive material, the pattern of exposed areas corresponding to the pattern of the terminal electrode array can be formed using a photoresist masking process. In an exemplary process, a photoresist layer is applied to the top or outer surface of the plate substrate 810a. A photoresist mask is then placed on the photoresist layer. The photoresist mask can include either a positive or negative pattern corresponding to the pattern of the terminal electrode array to be formed (see, for example, the pattern of nine terminal electrodes shown in FIG. 6). Whether the photoresist mask is a positive or negative pattern depends on the type of photoresist material used (positive or negative resist), as described below.

[0131] The photoresist layer can then be exposed using a light source (e.g., a UV light source or a broad spectrum light source). Exposure using a light source can affect the photoresist layer differently depending on the type of photoresist material used. In one example, if the photoresist is a negative resist photoresist material, exposure causes crosslinking within the photoresist material, making the exposed portions insoluble in a photoresist developer. In another example, if the photoresist is a positive resist photoresist material, exposure causes decrosslinking within the photoresist material, making the exposed portions soluble in a photoresist developer.

[0132] Selected areas of the top surface of the plate substrate 810a can be exposed by rinsing or immersing the photoresist material to be exposed in a solvent, such as a photoresist developer. Portions of the photoresist material that are soluble in the solvent or photoresist developer are removed, leaving behind the remaining (insoluble) portions to define a plating mask. The pattern of the plating mask can define an array of plating areas corresponding to the locations of the terminal electrodes 818a, 820a, and 828a.

[0133] If the plate substrate 810a is formed from a conductive material, the terminal electrodes 818a, 820a, and 828a can be formed using an electroplating process. In one example, the first layer of the terminal electrodes 819a, 821a, and 829a can be formed by dipping or immersing the plate substrate 810a in a plating solution containing metal cations. An electric current is then passed through the conductive material of the plate substrate 810a, resulting in the formation of a thin metal film along the exposed plating areas formed within the plating mask. In this example, a first solution is used to form the first conductive layer of the terminal electrodes 819a, 821a, and 829a through a first electroplating process. A second solution having a different metal cation can then be used to form the second or outer conductive layer of the terminal electrodes 818a, 820a, and 828a. Examples of the first or second conductive layer include, but are not limited to, copper, silver, nickel, gold, tin, solder, brass, or cadmium. The materials used for the first and second layers may be different or the same, and in some cases, only a single layer is formed using a single electroplating process to form the terminal electrodes 818a, 820a, 828a.

[0134] If the plate substrate 810a is formed from a non-conductive material, the terminal electrodes 818a, 820a, and 828a may be formed using a combination of electroless and electroplating processes. In one example, a strike or flash is applied to the plate substrate 810a to form a thin coating. For example, after a plating mask is formed on the plate substrate 810a, the exposed portions of the plate substrate 810a may be immersed in a cleaning solution or etching solution that increases the micro-roughness of the exposed portions to form micropores. An exemplary etching solution may include sulfuric acid or other types of acidic solutions. After etching, a palladium solution or other catalytic solution may be applied to the exposed portions of the plate substrate 810a. The palladium solution or other catalytic solution may result in a thin layer of conductive material (e.g., approximately 1 μm thick) being formed on the exposed portions of the plate substrate 810a. In some cases, a 1-5 μm thick palladium layer is formed along the surface of the plate substrate 810a to form the first conductive layer of the terminal electrodes 819a, 821a, and 829a.

[0135] After the first conductive layer of the terminal electrodes 819a, 821a, and 829a is formed on the surface of the plate substrate 810a, one or more additional layers can be formed on the first layer using an electroplating process similar to the process described above. Specifically, the plate substrate 810a and the terminal electrodes 819a, 821a, and 829a are immersed in a plating solution containing metal cations. A current is then passed through the terminal electrodes 819a, 821a, and 829a, resulting in the formation of a thin metal film on the terminal electrodes 819a, 821a, and 829a. The resulting layer can define the second conductive layer of the terminal electrodes 818a, 820a, and 828a. As in the previous example, the second conductive layer can include, but is not limited to, copper, silver, nickel, gold, tin, solder, brass, or cadmium. Although the example of FIG. 8A shows only two layers (an electroless first layer and an electroplated second layer), two or more electroplated layers can be formed by subjecting the plate substrate 810a to multiple electroplating processes.

[0136] As shown in FIG. 8A, the contact plate 802a includes a perimeter 830a that at least partially surrounds the terminal electrodes 818a, 820a, and 828a. This provides a desired offset or positioning from the corresponding edge of the plate substrate 810a. However, the presence of the perimeter 830a can make it difficult to pass current through the first layer of terminal electrodes 819a, 821a, and 829a to perform one or more electroplating processes. This is particularly true when the contact plate 802a is formed from a large sheet with an array of contact plates that are processed simultaneously and then cut or separated to improve manufacturing throughput and efficiency. FIGS. 8B, 9A, and 9B illustrate solutions that can be used to electrically connect the first layer of terminal electrodes 819a, 821a, and 829a to perform electroplating processes.

[0137] FIG. 8B is a cross-sectional view of another exemplary contact plate 802b. Contact plate 802b may correspond to contact plate 802a of FIG. 8A. As shown in FIG. 8B, contact plate 802b includes terminal electrodes 818b, 820b, and 828b disposed or positioned on the upper or front surface of plate substrate 810b. In this example, plate substrate 810b is formed from a non-metallic material, including, for example, a polymer or composite material. Examples of suitable polymer materials for plate substrate 810a include, but are not limited to, polycarbonate, phenolic, polysulfone, polyethersulfone, polycetal, polyester resins (e.g., polyethylene, polyester, PVC), and other suitable polymers. Examples of suitable composite materials for plate substrate 810b include, but are not limited to, fiber-reinforced plastics, glass fiber composites, carbon fiber composites, laminated composites, and other suitable composite materials.

[0138] As described above with reference to FIG. 8A, the terminal electrodes 818b, 820b, and 828b can be formed along the non-conductive plate substrate 810b using a combination of electroless and electroplating processes. First, a plating mask can be formed on the top or outer surface of the plate substrate 810b. Similar to the example provided above with reference to FIG. 8A, a photoresist material can be selectively exposed and then washed to create a plating mask having an array of areas corresponding to the pattern of the terminal electrode arrays 818b, 820b, and 828b.

[0139] 8A, the first conductive layer of the terminal electrodes 819b, 821b, and 829b may be formed by applying a strike or flash to form a thin layer of conductive material. Specifically, the exposed portion of the plate substrate 810b may be cleaned and etched before being immersed in a palladium liquid or other catalytic solution. The resulting electroless process may result in a 1-5 μm thick palladium layer formed along the surface of the plate substrate 810b, forming the first conductive layer of the terminal electrodes 819b, 821b, and 829b.

[0140] After performing the electroless plating process, one or more subsequent electroplating processes may be used to form the terminal electrodes 818b, 820b, and 828b. As discussed above, the presence of the periphery 830b may make it difficult to couple current to each of the first conductive layers of the terminal electrodes 819b, 821b, and 829b to perform the electroplating process. As discussed above, the desired periphery 830b displaces or recesses the terminal electrodes 818b, 820b, and 828b from the corresponding edges of the plate substrate 810b.

[0141] To help solve the problem of conducting current through the first conductive layers of the terminal electrodes 819b, 821b, and 829b, the configuration shown in FIG. 8B includes a back conductive layer 831b formed along the back, bottom, or inner surface of the plate substrate 810b. The back conductive layer 831b can be formed from a conductive material, including, but not limited to, copper, silver, nickel, gold, tin, solder, brass, conductive carbon, or cadmium. As shown in FIG. 8B, the first conductive layers of the terminal electrodes 819b, 821b, and 829b are electrically connected to the back conductive layer 831b by corresponding vias 822b, 824b, and 826b that extend through the plate substrate 810b, respectively. The vias 822b, 824b, and 826b can be formed by drilling holes in the plate substrate 810b and then filling the holes with a conductive material. In some cases, the vias 822b, 824b, and 826b are formed when forming the back conductive layer 831b. The vias 822b, 824b, 826b and the backside conductive layer 831b may be formed from the same conductive material.

[0142] Using the configuration shown in FIG. 8B , current can be applied to the back conductive layer 831b and passed through corresponding vias 822b, 824b, and 826b to each of the terminal electrodes 818b, 820b, and 828b. Thus, one or more subsequent electroplating processes can be used to form the terminal electrodes 818b, 820b, and 828b by applying current to the single-element back conductive layer 831b. In some cases, the back conductive layer 831b is part of a larger conductive layer formed along the lower or inner surface of a larger sheet. The large sheet can result in an array of contact plates that are processed simultaneously and then cut or separated to improve manufacturing throughput and efficiency.

[0143] 9A-9B illustrate exemplary connection structures of the contact plate. FIGS. 9A and 9B illustrate additional options for applying current to the first conductive layer of the terminal electrode 918a to perform the electroplating process. As shown in FIG. 9A, the lower or first conductive layer of the terminal electrode 918a can be formed on the surface of the plate substrate. The terminal electrode 918a can correspond to the lower or first layer of a terminal electrode similar to the terminal electrode 618 in FIG. 6. In the example of FIG. 9A, the terminal electrode 918a is connected to a conductive periphery 930a by a bridge portion 950a. In this example, the periphery 930a can be formed from a conductive material or layer that extends to the edge of the plate substrate to facilitate electrical connection to a current source during electroplating. Applying current to the conductive periphery 930a can cause the current to flow through the bridge portion 950a to the terminal electrode 918a during the electroplating process.

[0144] After one or more electroplating processes are performed to form the outer or upper layer of the terminal electrode 918a, the bridge portion 950a may be removed to electrically isolate the terminal electrode 918a from other conductive portions of the card, including the conductive periphery 930a. The bridge portion 950a may be removed, for example, by laser abrading the bridge portion 950a using an abrasive laser with a spot size smaller than the width of the bridge portion 950a. In some cases, after the bridge portion 950a is removed, a laser ablated or polished region 952a is formed that is generally in the same area as the bridge portion 950a and may expose the (non-conductive) material of the plate substrate. The polished region 952a may be substantially free of conductive material and may electrically isolate the terminal electrode 918a from the conductive periphery 930a. In some cases, the polished region 952a may extend partially into the plate substrate. The bridge portion 950a may also be removed using a mechanical cutter, an etchant, or other material removal technique to define a machined region corresponding to the polished region 952a shown in FIG. 9A . In some cases, after the outer or top layer of the terminal electrode 918a is formed using an electroplating process, the conductive surrounding portion 930a is also removed.

[0145] FIG. 9B illustrates another exemplary configuration for applying current to the first conductive layer of the terminal electrode 918b to perform the electroplating process. As shown in FIG. 9B, the lower or first layer of the terminal electrode 918b may be formed on the surface of the plate substrate. The terminal electrode 918b may correspond to the lower or first layer of a terminal electrode similar to the terminal electrode 618 in FIG. 6. In the example of FIG. 9B, the terminal electrode 918b is connected to a bridge portion 950b formed from a conductive material or layer that extends to the edge of the plate substrate. As with the other examples above, the bridge portion 950b may facilitate electrical connection to a current source during electroplating. Applying a current to the bridge portion 950b may cause the current to flow through the terminal electrode 918b during the electroplating process.

[0146] After one or more electroplating processes are performed to form the outer or upper layer of the terminal electrode 918b, the bridge portion 950b may be removed to create a displacement or gap between the terminal electrode 918b and the corresponding edge of the plate substrate. As shown in FIG. 9B , the contact plate includes a non-conductive periphery 930b that separates the terminal electrode 918b from the edge of the plate substrate. As in the previous example, the bridge portion 950b may be removed, for example, by laser abrading the bridge portion 950b using an abrading laser with a spot size smaller than the width of the bridge portion 950b. In some cases, after the bridge portion 950b is removed, a laser ablated or polished region 952b is formed that is generally in the same area as the bridge portion 950b and can expose the (non-conductive) material of the plate substrate. The polished region 952b may be substantially free of conductive material and electrically isolate the terminal electrode 918b from the conductive portion of the contact plate along its top surface (if present). In some cases, the polished region 952b may extend partially into the plate substrate. Bridge portion 950b may also be removed using a mechanical cutter, etching solution, or other material removal technique to define a machined area corresponding to polished area 952b shown in Figure 9B.

[0147] Figure 10 illustrates an exemplary marking on an electronic card. Specifically, Figure 10 illustrates a marking 1020 including a first laser-formed relief feature 1022 and a second laser-formed relief feature 1024 formed on a front surface 1010 of an electronic card 1000. As described in more detail below with reference to Figures 11A-15B, the laser-formed relief features 1022, 1024 ("relief features") may extend through a coating layer of the electronic card 1000 and, in some cases, may extend at least partially into the card substrate.

[0148] The markings 1020 may include one or more printed portions in addition to the relief features 1022, 1024. The printed portions may be formed by applying ink, dye, or pigment to the front surface 1010 of the electronic card 1000. The markings 1020 may include symbols such as the logo shown in FIG. 10. The markings 1020 may also include textual or numerical information including, for example, a serial number, an account number, a user name, an institution name, a telephone number, an address, and other textual, numerical, or symbolic information.

[0149] 11A-11E are cross-sectional views of exemplary markings. The exemplary markings shown in Figures 11A-11E may correspond to one or more of the markings described above, including, for example, marking 1020 of Figure 10 and marking 114 of Figure 1A.

[0150] FIG. 11A shows an exemplary marking 1140a formed along the outer surface of coating layer 1134a. In this example, substrate 1102a is coated on both sides or at least partially covered by coating layers 1132a and 1134a. Coating layers 1132a and 1134a may be formed in accordance with other coating layers described herein, and redundant description will be omitted for clarity. In the example of FIG. 11A, marking 1140a includes a marking material deposited or otherwise disposed along the top or outer surface of coating layer 1134a. Marking 1140a may include printed ink, paint, or other material that is visually distinct from the surrounding portions of coating layer 1134a. Although marking 1140a is shown exposed in FIG. 11A, marking 1140a may be coated or at least partially covered by a protective film or coating, which may be translucent or transparent to allow visibility of marking 1140a.

[0151] FIG. 11B illustrates an exemplary marking 1140b formed below the outer surface of the coating layer 1134b. As shown in FIG. 11B, the marking 1140b may be a subsurface marking formed below the outer surface of the coating layer 1134b but above the surface of the substrate 1102b. The marking 1140b may be formed using a laser beam focused on a subsurface region of the coating layer 1134b. The marking 1140b may be visible or perceptible from the outer surface, but may be substantially indestructible or protected from abrasion or wear. The marking 1140b may also be affixed after the electronic card is formed and may include personal information, including, for example, an account number, account holder name, account type, card issuer information, expiration date, CVC code, or other card-specific information.

[0152] In some cases, the coating layer 1134b may be formed from multiple layers, as in other embodiments described herein. Specifically, the coating layer 1134b may include a first layer 1136b disposed on the surface of the substrate 1102b, which may include a primer layer and a color layer. The color layer and / or primer layer may include a pigment dispersed throughout a polymer or other type of binder, as in other embodiments described herein. The coating layer 1134b may further include a second layer 1138b disposed on the first layer 1136b. The second layer 1138b may include a transparent or translucent material having a higher hardness than the first layer 1136b. As in other examples described herein, the second layer 1138b may include an acrylate material, a UV-curable polymer, DLC, or other similar types of coatings. The coating layer 1132b may be formed from a similar or identical multilayer structure as the coating layer 1134b. As in the previous example, the coating layers 1132b, 1134b may be a single continuous layer or may be discontinuous layers with breaks along one or more edges of the electronic card.

[0153] As shown in FIG. 11B, the marking 1140b can be formed beneath the second layer 1138b and at least partially within the first layer 1136b. In one example, the marking 1140b is formed by focusing a laser through the second layer 1138b onto the first layer 1136b to chemically and / or physically modify an area of the first layer 1136b. In some cases, the second layer 1138b is substantially unchanged or intact after forming the marking in the first layer 1136b. In some cases, the second layer 1138b is affected, with only the interior region and outer surface of the second layer 1138b remaining substantially intact. In one example, a UV laser with a wavelength of 10-400 nm and a power output of less than 1 Watt is used to form the marking 1140b. In some cases, a UV laser with a wavelength of 300-377 nm and a power output of less than 0.5 Watts is used to form the marking 1140b. UV lasers can have pulse widths ranging from 0.5 nanoseconds to 40 nanoseconds, and can also have frequencies ranging from about 225 kHz to 400 kHz.

[0154] Referring to FIG. 11B, in some embodiments, a laser may be used to create a series of laser-treated spots to form dark or black regions along the first layer 1136b. Each spot may be created using a UV laser to modify the reflective optical properties of the first layer 1136b by dispersing, removing, or otherwise altering a pigment (e.g., titanium dioxide pigment). In some cases, the laser at least partially oxidizes the treated portions of the first layer 1136b. The laser-treated spots may have diameters ranging from 5 μm to 60 μm and be arranged in a pattern of about 5,000 dots per inch to about 8,000 dots per inch. In some cases, the spot density is about 6,500 dots per inch to about 7,500 dots per inch. In some cases, the pitch or spacing of the spots varies in different directions. For example, the spot pitch may be about 0.5 to 1.5 μm in a first direction and about 5 μm to 10 μm in a second direction perpendicular to the first direction. The spots can be formed using back and forth multidirectional passes to define a "serpentine" or bidirectional raster lasering pattern, or using a series of unidirectional passes to define a "typewriter" or unidirectional raster lasering pattern. In some cases, multiple passes of the laser are made in a given area to form the laser marking 1140b. In some cases, the laser marking 1140b has a feature size (e.g., linewidth) determined by the spot side of the laser (e.g., 5 μm to 60 μm). In some cases, the laser marking 1140b appears generally uniform to the naked eye when viewed from a few inches away, while larger area features are formed using an array of lasered spots.

[0155] FIG. 11C shows an exemplary marking 1140c etched into the cover layer 1134c. In this example, the marking 1140c is formed by removing a portion of the cover layer 1134c to expose a portion of the substrate 1102c. The substrate 1102c may have a different color or visual appearance that is visually distinct from the surrounding portions of the cover layer 1134c to provide the visual quality of the marking 1140c. In some cases, the surface of the substrate 1102c is treated to provide a color that enhances the visual distinction or appearance of the marking 1140c. As described in more detail with reference to FIGS. 12-14, the exposed portion of the substrate may be polished and / or strengthened with an oxide coating to provide a visually distinct marking.

[0156] 11C, marking 1140c may be formed by removing a portion of cover layer 1134c. In some cases, cover layer 1134c may be exposed to a laser to abrade or otherwise remove portions of cover layer 1134c to expose underlying substrate 1102c. In other cases, portions of cover layer 1134c may be removed using a chemical etching process, a mechanical etching process, or other material removal technique.

[0157] 11D shows an exemplary marking 1140d partially etched into the cover layer 1134d. As shown in FIG. 11D, the marking 1140d defines or is defined by a recess or groove that is formed in the cover layer 1134d but does not expose a portion of the underlying substrate 1102d. In some embodiments, the cover layer 1134d is formed from multiple layers, two or more of which have different colors or visual appearances. Markings 1140d with distinct visual appearances can be formed by removing one or more upper or outer layers to expose lower or inner layers that have a different color or visual appearance from the upper or outer layers.

[0158] 11D, marking 1140d may be formed by removing a portion of cover layer 1134d. In some cases, cover layer 1134d is exposed to a laser to abrade or otherwise remove a portion of cover layer 1134d, exposing an underlying or inner sublayer of cover layer 1134d having a different color or visual appearance. In other cases, portions of cover layer 1134d may be removed using a chemical etching process, a mechanical etching process, or other material removal technique.

[0159] FIG. 11E illustrates an exemplary marking 1140e etched into a portion of the cover layer 1134e and the underlying substrate 1102e. As shown in FIG. 11E, the marking 1140e defines or is defined by a recess or groove formed in the exterior or upper portion of the cover layer 1134e and the substrate 1102e. In the example of FIG. 11E, the recess or groove has a sloped or angled cross-section. In particular, the recess of the marking 1140e includes two opposing angled sidewalls, which can provide a desired visual effect. The substrate 1102e can have a visually different color or visual appearance from the surrounding portions of the cover layer 1134e to provide the visual quality of the marking 1140e. In some cases, the exposed portion of the substrate 1102e is treated to provide a color that enhances the visual distinction or appearance of the marking 1140e. As described in more detail with reference to FIGS. 12-14, the exposed portion of the substrate can be polished and / or reinforced with an oxide coating to provide a visually distinct marking.

[0160] 11E, marking 1140e may be formed by removing portions of cover layer 1134e and substrate 1102e. In some cases, cover layer 1134e and substrate 1102e may be exposed to a laser to abrade or otherwise remove portions of cover layer 1134e and substrate 1102e to form grooves or recesses. In other cases, portions of cover layer 1134e and substrate 1102e may be removed using a chemical etching process, a mechanical etching process, or other material removal technique.

[0161] FIG. 11F illustrates an exemplary marking 1140f etched into a portion of the cover layer 1134f and the underlying substrate 1102f. As shown in FIG. 11F, the marking 1140f defines or is defined by a recess or groove formed in the outer portion of the cover layer 1134f and the substrate 1102f. In the example of FIG. 11F, the recess or groove has a rectangular cross-section. The recess of the marking 1140f has a generally flat bottom, which may provide a desired visual effect. As with the previous example, the substrate 1102f may have a different color or visual appearance that is visually distinct or visually different from the surrounding portions of the cover layer 1134f to provide the visual quality of the marking 1140f. As with the other examples, one or more exposed surfaces of the substrate 1102f may be treated to provide a color that enhances the visual distinction or appearance of the marking 1140f. As will be described in more detail with reference to Figures 12-14, the exposed portions of the substrate may be polished and / or reinforced with an oxide coating to provide visually distinguishable markings.

[0162] 11F, the markings 1140f may be formed by removing portions of the cover layer 1134f and the substrate 1102f. In some cases, the cover layer 1134f and the substrate 1102f may be exposed to a laser to abrade or otherwise remove portions of the cover layer 1134f and the substrate 1102f to form grooves or recesses. In other cases, portions of the cover layer 1134f and the substrate 1102f may be removed using a chemical etching process, a mechanical etching process, or other material removal technique.

[0163] 12-14 are cross-sectional views of exemplary markings formed on the surface of an electronic card. Specifically, FIG. 12 is a cross-sectional view of a relief feature 1222. The relief feature 1222 in FIG. 12 may correspond to the first laser-formed relief feature 1022 in FIG. 10. FIG. 12 illustrates an example of a fine or precise marking that may be produced using a laser-based technique. In the example of FIG. 12, a laser may be used to remove a portion of a coating layer 1230 to expose a portion of a substrate 1202, which may be formed from a metallic material. As shown, removing the portion of the coating layer 1230 does not significantly distort the adjacent portions of the coating layer 1230 or the underlying substrate 1202. While the exposed substrate 1202 is shown as having angled, non-planar features, in some embodiments, the exposed substrate 1202 may be substantially flat or planar. Additionally, as described below with reference to FIG. 14, a metal oxide layer may be formed on the exposed metal substrate 1202.

[0164] As shown in FIG. 12 , the relief feature 1222 includes a pair of recessed walls 1264 that define a recess extending through the coating layer 1230. The relief feature 1222 further includes a recessed marking feature 1266 that defines a bottom of the recess. The recessed marking feature 1266 may have a coating, texture, coloring, or appearance that visually distinguishes the recessed marking feature 1266 from adjacent portions of the coating layer 1230. The recess defined by the pair of recessed walls 1264 and the marking feature 1266 has a width W that may be determined in part by the spot size diameter of the laser used to form the relief feature 1222. Note that although the pair of recessed walls 1264 are shown as forming an approximately 90-degree angle with respect to the front surface 1210, embodiments are not limited to this particular shape. In other embodiments, one or both of the pair of recessed walls 1264 may be formed at an angle (non-perpendicular) with respect to the front surface 1210.

[0165] 12, coating layer 1230 is formed along surface 1212 of substrate 1202, and recessed marking features 1266 are formed in surface 1212 of substrate 1202 to define marking surface 1214. Marking surface 1214 may be flush with surface 1212 or may be at a different height than surface 1212, as shown in FIG. 12. In some embodiments, marking surface 1214 is recessed relative to surface 1212 by 5 μm or less, 3 μm or less, 2 μm or less, or 1 μm or less.

[0166] In general, the marking surface 1214 may have a texture that gives the recessed marking features 1266 a visual appearance that is different or visually distinct from adjacent portions of the coating layer 1230. For example, the marking surface 1214 may have a surface finish with a roughness that corresponds to the roughness of a polished surface. The roughness of the marking surface 1214 may be from about 1 μm to about 5 μm. In additional examples, the roughness of the marking surface 1214 may be greater than 5 μm or greater than 10 μm. One measure of surface roughness is the parameter R, which is a measure of the amplitude of the roughness profile. a (the arithmetic mean value of the roughness determined from the deviation from the center line). Another parameter is the average spacing S between peaks in the roughness profile. m Reflectance can also be used as a measure of surface roughness.

[0167] In some examples, marking surface 1214 can include a dye, ink, or other marking element that can be used to provide marking color to recessed marking feature 1266. In some cases, marking surface 1214 includes an oxide layer that can provide marking color to recessed marking feature 1266. The metal oxide can be a thermally grown metal oxide or can be thermally grown on a metal material by heating the substrate using a laser. Examples of oxide layers formed in relief features are described with reference to FIG. 14.

[0168] As shown in FIG. 12 , coating layer 1230 can be a multi-layer coating. In this example, coating layer 1230 includes a first layer 1234 having a thickness T1 and a second layer 1236 having a thickness T2. The thickness of first layer 1234 can be greater than the thickness of second layer 1236. In some embodiments, the total thickness of the coating layer is between 50 μm and 500 μm or between 100 μm and 300 μm. First layer 1234 can be disposed on outer surface 1212 of substrate 1202 and can contact surface 1212 along the interface between coating layer 1230 and substrate 1202, as shown in FIG. 12 . Second layer 1236 is disposed on first layer 1234.

[0169] The first layer 1234 can include one or more polymeric materials. In one example, the first layer 1234 includes a first urethane layer (e.g., a primer layer) that is adhered to the surface of the substrate 1202. The first layer 1234 can include one or more additional urethane materials that are bonded or adhered to the substrate 1202 via the first urethane layer or the primer layer. The one or more additional urethane materials can include a dual urethane or polyurethane formulation that is applied to the first urethane layer or the primer layer.

[0170] In some embodiments, the first layer 1234 includes pigment particles dispersed within a polymer binder. By way of example, the pigment particles may be inorganic pigment particles including metal oxides, including, but not limited to, titanium oxide (TiO2, Ti2O3), zinc oxide (ZnO), manganese dioxide (MnO2), and iron oxide (Fe3O4). The particles may have a size ranging from 0.1 μm to 10 μm or from 0.1 μm to 1 μm. The first layer 1234 may further include other additives or components.

[0171] In some embodiments, the second layer 1236 is transparent and may be formed from a transparent polymer. The transparent polymer of the second layer 1236 may have greater hardness and / or abrasion resistance than the first layer 1234. For example, the second layer 1236 may include an acrylate polymer (e.g., acrylic) or an epoxy polymer. In some cases, the coating layer 1236 includes a UV-curable polymer. In some cases, the second layer 1236 includes a diamond-like carbon (DLC) coating or other hard material that may be formed into a thin layer. The second layer 1236 may include a filler material, including, for example, a nanoscale inorganic material or a diamond material. The diameter of the nanoscale filler material may be less than 100 nm or less than 50 nm.

[0172] The first layer 1234 and / or the second layer 1236 may be deposited on the substrate 1202 using a deposition or layer application process including, for example, physical vapor deposition (PVD), atomic deposition coating (ALD), spray coating, dip coating, and other similar material deposition processes. In some cases, the first layer 1234 is applied to a primer layer formed on the surface of the substrate 1202. The foregoing description of the first and second layers 1234, 1236 is not limited to the example of FIG. 12 , but applies more generally to multilayer coatings described with respect to other aspects of the present disclosure.

[0173] As shown in FIG. 12 , relief feature 1222 includes a recessed marking feature 1266 having a geometric feature 1272 extending into substrate 1202. As shown in FIG. 12 , geometric feature 1272 is a channel formed in substrate 1202 and has an angular or V-shaped cross-sectional shape, commonly referred to as "channel" 1272. Channel 1272 may have a width approximately equal to the width W of recessed marking feature 1266. In some cases, the width of channel 1272 may be between about 80% and 100% of the width of recessed marking feature 1266. Channel 1272 may have an angle θ greater than about 45 degrees and less than 180 degrees, or between about 60 degrees and about 120 degrees.

[0174] FIG. 13 is a cross-sectional view of another exemplary laser-formed relief feature 1322. The relief feature 1322 in FIG. 13 may correspond to the relief feature 1022 in FIG. 10. As shown in FIG. 13, the relief feature 1322 includes a pair of recessed walls 1364 that extend into the coating layer 1330 and at least partially define a recess. In this example, the pair of recessed walls 1364 extend at a non-perpendicular angle relative to the front surface 1310 of the electronic card. As shown in FIG. 13, the relief feature 1322 further includes a recessed marking feature 1366 that defines a bottom of the recess. In this example, the recessed marking feature 1366 includes a curved or rounded feature 1372 that extends into the substrate 1302 and has a depth D and a width W. The feature 1372 may be described as a channel with angled walls extending from a rounded bottom or valley. The shaped feature 1372 can have an angle θ greater than about 45 degrees and less than 180 degrees, or between about 60 degrees and about 120 degrees. In some cases, the angled walls of the shaped feature 1372 correspond to the angle of the concave wall 1364.

[0175] FIG. 14 shows another exemplary laser-formed relief feature. The laser-formed relief feature 1422 may correspond to the relief feature 1022 described above with reference to FIG. 10. As with the previous example, the relief feature 1422 may be formed along the exterior surface 1410, extend at least partially into the coating layer 1430 and into the underlying metal substrate 1402, and be formed from a metallic material. In this example, the relief feature 1422 includes a marking surface 1414 having one or more oxide layers that provide a distinct color, a different color, or a particular visual appearance to the relief feature. Specifically, the relief feature 1422 includes a first oxide layer 1452 having a first thickness T1 and a second oxide layer 1454 having a second thickness T2 that is greater than the first thickness T1.

[0176] The metal oxide layers 1452, 1454 may comprise thermally grown metal oxides. For example, the metal oxide layers 1452, 1454 may be thermally grown on the marking surface 1414 of the metal substrate 1402 by heating the substrate 1402 using a laser or other focused heat or energy source. Suitable metal materials include, but are not limited to, titanium alloys, steel, or zirconium-, titanium-, or iron-based bulk solidification alloy substrates. In some embodiments, the thermally grown metal oxide may have a lower porosity than the porosity of anodically grown porous metal oxides. In embodiments, the metal oxide may comprise titanium oxide, iron oxide, chromium oxide, zirconium oxide, or a combination thereof.

[0177] The thickness of the metal oxide layer can affect the color of the relief feature 1422 in several ways. For example, the metal oxide layers 1452, 1454 can display color as a result of interference of light reflected from the metal oxide and the underlying metal substrate 1402. Typically, the displayed interference color depends on the thickness of the metal oxide. The interference color displayed with a metal oxide that is too thick may appear dark. When the metal oxide is very thin (or absent), the recessed marking feature may appear bright or metallic. Various colors can be obtained, including, but not limited to, blue, purple, pink, orange, yellow, gold, brown, and green. The appropriate thickness of the metal oxide layer for achieving color from light interference may depend on the composition and crystallinity of the metal oxide layer as well as the desired color to be achieved. As an example, the thickness of the metal oxide layer for achieving color from light interference may be 50 nm to 500 nm.

[0178] As shown in FIG. 14 , first oxide layer 1452 may have a first thickness T1 to provide a first color or appearance, and second oxide layer 1454 may have a second thickness T2 greater than the first thickness T1 to provide a second color or appearance different from the first color or appearance. The configuration of FIG. 14 may produce a variety of visual effects. In some examples, relief feature 1422 of FIG. 14 appears to have a first color or visual appearance when viewed from one angle and a second color or visual appearance when viewed from another, different angle. In some examples, the first color of first oxide layer 1452 and the second color of second oxide layer 1454 combine to provide a third color that is distinguishable when viewed with the naked eye (unaided) at a normal or typical viewing distance.

[0179] Figures 15A and 15B show other exemplary laser-formed relief features. Specifically, Figure 15A is an enlarged view of relief feature 1524, which may correspond to relief feature 1024 of Figure 10. Figure 15B is a cross-sectional view of relief feature 1524 along section FF of Figure 15A. Relief feature 1524 is provided as an example of how relief feature 1524 may be formed in an area or region of the exterior surface of an electronic card. Generally, relief feature 1524 may be visually and tactilely distinct from surrounding or adjacent portions of the surface of the electronic card.

[0180] 15B , the relief feature 1524 extends into the coating layer 1530 and at least partially into the substrate 1502 and may be formed from a metallic material. The relief feature 1524 includes a recessed wall 1564 that defines at least a portion of a recess. The relief feature 1524 further includes a first recessed marking feature 1566 formed around the periphery of the relief feature 1524. The first recessed marking feature 1566 may include a shaped feature, which in this example is a channel 1550 having a round or rounded shape and extending into the substrate 1502. The relief feature 1524 further includes a second recessed marking feature 1568 that is at least partially surrounded by the first recessed marking feature 1566.

[0181] The second recessed marking feature 1568 may cover a majority of the area of the relief feature 1524 and provide the primary appearance or visual characteristic of the relief feature. In this example, the second recessed marking feature 1568 includes a surface texture 1552, which may provide a visual appearance that is distinct from surrounding or adjacent portions of the electronic card. In some examples, the second recessed marking feature 1568 may include one or more oxide layers that provide one or more colors to the relief feature 1524.

[0182] 16A-16C illustrate exemplary chamfered portions of electronic cards. Electronic cards 1600a, 1600b, and 1600c in FIGS. 16A, 16B, and 16C may correspond to or be similar to electronic cards 100 described with reference to other figures. As previously discussed, chamfered portions may provide various functional and / or visual benefits to electronic cards. For example, chamfered edges or chamfered portions may facilitate insertion of the card into a card reader or card reading device. Chamfered edges or chamfered portions may also provide a desired tactile feel or make the electronic card easier to handle. Additionally, chamfered edges or chamfered portions may provide a distinct visual appearance.

[0183] FIG. 16A is a cross-sectional view of chamfered edges 1610a, 1612a of an electronic card 1600a having an exposed portion (chamfer) of the card substrate 1602. Similar to other embodiments described herein, the electronic card 1600a includes a substrate 1602, which may be formed from a metal or metallic material. The electronic card 1600a also includes a coating layer 1630, which may include multiple layers. As shown in FIG. 16A , the coating layer 1630 includes a first layer 1632, which may be used to provide color or appearance to the electronic card 1600a. As previously described, the first layer 1632 may include a pigment or dye dispersed within a polymer or polymer binder. The coating layer 1630 may also include a second layer 1634, which may be formed from a hard and / or transparent material and is disposed over the first layer 1632. As previously mentioned, the second layer 1634 can include a transparent polymer, including, for example, an acrylic (e.g., an acrylate polymer) or an epoxy (e.g., an epoxy polymer). In some cases, the coating layer 1632 includes a UV-curable polymer. In some cases, the second layer 1634 includes a hard coating, such as a diamond-like carbon (DLC) coating.

[0184] As shown in FIG. 16A , electronic card 1600a includes a front chamfered edge 1610a and a back chamfered edge 1612a. Front chamfered edge 1610a can extend or surround the front of electronic card 1600a, and back chamfered edge 1612a can extend or surround the back of electronic card 1600a. In this example, chamfered edges 1610a, 1612a include exposed portions of substrate 1602, also referred to herein as chamfers of substrate 1602. In some cases, exposed portions or chamfers of substrate 1602 are polished or otherwise treated to provide a smooth surface finish. In some cases, exposed portions or chamfers are brushed or etched to provide a textured surface finish.

[0185] The chamfered portions of the substrate 1602 that partially define the chamfered edges 1610 a, 1612 a may have a different visual appearance than the non-chamfered portions of the electronic card 1600 a. In some embodiments, the exposed or chamfered portions of the substrate 1602 along the chamfered edges 1610 a, 1612 a may have the natural color of the metallic material forming the substrate 1602. In other embodiments, the exposed or chamfered portions of the substrate 1602 along the chamfered edges 1610 a, 1612 a may be anodized or oxidized to form an anodized or oxide layer. The anodized or oxide layer may have a natural color or may include a dye or pigment to provide a desired appearance or color.

[0186] 16A, the electronic card 1600a also defines a sidewall or substrate edge extending between a chamfered edge 1610a on the front side and a chamfered edge 1612a on the back side. In the embodiment shown in FIG. 16A, the sidewall or substrate edge is coated with the same or similar coating layer 1630 as the front and back sides of the electronic card 1600a.

[0187] 16B shows another exemplary electronic card 1600b with chamfered edges 1610b, 1612b having exposed or chamfered portions of substrate 1602 coated with oxide layers 1640, 1642. Similar to that described above with reference to FIG. 14, oxide layers 1640, 1642 can be thermally grown oxides formed to specific thicknesses to provide a desired color or appearance.

[0188] For example, the oxide layers 1640, 1642 may display color as a result of interference of light reflected from the metal oxide and the underlying metal substrate 1602. As previously mentioned, interference colors displayed with metal oxide that is too thick may appear dark. When the metal oxide is very thin (or absent), the recessed marking features may appear bright or metallic. Various colors can be obtained, including, but not limited to, blue, purple, pink, orange, yellow, gold, brown, and green. The appropriate thickness of the oxide layers 1640, 1642 for achieving color from light interference may depend on the composition and crystallinity of the layers as well as the desired color to be achieved. As an example, the thickness of the oxide layers 1640, 1642 for achieving color from light interference may be 50 nm to 500 nm. In some embodiments, the substrate 1602 is anodized and coated with the oxide layers 1640, 1642 to provide a specific color or visual effect.

[0189] As with the other examples above, the electronic card 1600b of FIG. 16B can include a coating layer 1630 that provides a visual appearance or color to the electronic card 1600b. As with the previous example, the coating layer 1630 can include multiple layers, including sublayers 1632 and 1634. The appearance of the coating layer 1630 can be different and / or contrast with the color or appearance of the chamfered portions 1610b, 1612b, which have oxide layers 1640, 1642. As shown in FIG. 16B, the electronic card 1600a also defines a sidewall or substrate edge extending between the chamfered edge 1610a on the front side and the chamfered edge 1612a on the back side. In the embodiment shown in FIG. 16A, the sidewall or substrate edge is coated with the same or similar coating layer 1630 as on the front and back sides of the electronic card 1600a.

[0190] FIG. 16C illustrates another exemplary electronic card 1600c having chamfered edges 1610c, 1612c with exposed or chamfered portions of the substrate 1602. In the example of FIG. 16C, the substrate 1602 also defines exposed sidewalls or substrate edges 1650. In some cases, the exposed sidewalls or substrate edges 1650 are coated with a thin and / or transparent coating that protects the substrate 1602 but allows the natural color of the substrate 1602 to be visible along the edges of the electronic card 1600c. As with the other examples above, the electronic card 1600c can include a coating layer 1630 that provides a visual appearance or color to the electronic card 1600c. As with the previous example, the coating layer 1630 can include multiple layers, including sublayers 1632 and 1634. The appearance of the coating layer 1630 may be different and / or contrast with the color or appearance of the chamfers 1610c, 1612c and / or exposed sidewall 1650.

[0191] FIG. 17 illustrates exemplary components of an electronic card 1700. Electronic card 1700 may correspond to any one of the electronic card embodiments described herein. Specifically, the electronic cards described herein may include one or more of the components described below with respect to electronic card 1700. However, the schematic diagram of FIG. 17 is not intended to be an exhaustive or comprehensive description of the components or elements of an electronic card. Additionally, one or more of the components or elements described below may be optional or may be omitted from a particular embodiment.

[0192] According to some embodiments, electronic card 1700 may be foldable or bendable. For example, electronic card 1700 may define one or more foldable or bendable regions configured to be repeatedly folded or bent during use. Various components described herein may be configured to facilitate the creation of foldable cards, including, for example, flexible electronic components, flexible battery elements, flexible display elements, etc.

[0193] 17, electronic card 1700 includes one or more processing units 1702. Processing unit 1702 may include one or more computer processors or microcontrollers configured to perform various operations or functions. In some cases, processing unit 1702 performs various operations in accordance with computer-readable instructions or firmware. Processing unit 1702 may include a central processing unit (CPU), a numerical processing unit (NPU), and other processing circuitry. Processing unit 1702 may include other processors within electronic card 1700, such as application-specific integrated chips (ASICs) and other microcontroller devices.

[0194] Additionally, the processing unit 1702 may be operatively connected to memory 1704. The processing unit 1702 may be operatively connected to memory 1704 by an electronic bus or bridge. In some cases, the processing unit 1702 may be directly connected to memory 1704. The memory 1704 may include various types of non-transitory computer-readable storage media, including, for example, read-access memory (RAM), read-only memory (ROM), erasable programmable memory (e.g., EPROM and EEPROM), or flash memory. The memory 1704 is configured to store computer-readable instructions, encoded security keys, security codes, serial numbers, identification information, financial information, medical information, or other types of data or records.

[0195] 17, electronic card 1700 may further include radio circuitry 1706. As previously described, electronic card 1700 may include a wireless transceiver or other wireless electronics configured to interface with external devices using a wireless communication protocol. In some embodiments, if electronic card 1700 interfaces with external devices primarily using radio circuitry 1706, electronic card 1700 may be referred to as a contactless card. Contactless cards may not necessarily include physical contacts or terminals. Additionally, if electronic card 1700 is a contact card, electronic card 1700 may not include radio circuitry.

[0196] The electronic card 1700 may include an encoded magnetic component 1708. As described above with respect to some embodiments, the electronic card 1700 may include a magnetic element (e.g., a ferromagnetic film) that defines a magnetic area or region along a surface of the electronic card 1700. The encoded magnetic component 1708 may store encoded information or data, and the information or data may be read using an external card reader or card reading device. The encoded magnetic component 1708 may be configured to allow dynamic encoding that can change depending on the use of the electronic card 1700. For example, the information stored on the encoded magnetic component 1708 may be changed by the processing unit 1702 and / or an external encoder depending on the particular application or operation performed using the electronic card 1700. The stored information may include an account balance, a monetary amount, an authentication code, or other types of dynamic information.

[0197] As shown in FIG. 17 , electronic card 1700 may include a security component 1710 that can be used to authenticate electronic card 1700. Generally, security component 1710 includes an element or feature that is or makes difficult to copy or counterfeit. In some cases, security component 1710 may include a sticker or visual marking with at least one feature that is difficult to copy or duplicate. For example, security component 1710 may include a sticker or marking with a holographic image, which is typically difficult to copy or duplicate without sophisticated equipment. In some cases, security component 1710 includes an embedded electronic code, electronic signature, or other electrically detectable element used to authenticate or identify electronic card 1700. Generally, security component 1710 may be used to help determine whether electronic card 1700 is authentic or not a counterfeit. In some cases, an external reader is configured to read or detect security component 1710 and provide access to a restricted area, region, or system upon presentation of electronic card 1700.

[0198] Electronic card 1700 may include antenna 1712. Antenna 1712 may work in conjunction with radio circuitry 1706 to facilitate wireless communication with an external device or reader. In some cases, antenna 1712 is passive and is used to communicate a serial number or other unique identifier to an external device or reader. In some cases, antenna 1712 includes or is configured as a radio frequency identification (RFID) antenna, a Bluetooth antenna, a near field communication (NFC) antenna, an ultra-wideband antenna, or other similar component or device.

[0199] In some embodiments, antenna 1712 is configured to receive and / or transmit signals from multiple external devices to determine the location of electronic card 1700. For example, antenna 1712 may be used to transmit a beacon signal that is detected by one or more external devices. Variations in received signals from various devices may be used to triangulate or calculate an estimated location of electronic card 1700. In another example, antenna 1712 of electronic card 1700 is a wideband antenna (e.g., an ultra-wideband antenna) configured to detect the range of signals emitted from various devices. Electronic card 1700 may use the detected signals to estimate its current location.

[0200] Antenna 1712 may further include an NFC antenna that can be used to conduct transactions with a point-of-sale (POS) device or other external device. In some embodiments, antenna 1712 may be configured to communicate with an antenna from another electronic card to authenticate or initiate a transaction between the two parties. In one example, electronic card 1700 is configured to exchange cash or card value when touched or tapped with another similarly configured electronic card. The value exchange may be facilitated via a user interface displayed on electronic card 1700 (e.g., using display 1714) or on another user device, such as a mobile phone, tablet, computer, etc.

[0201] Antenna 1712 may also be used to send alerts or notifications to the user device. In one example, antenna 1712 is configured to send a signal to the user device that is received or relayed when the user device moves a certain proximity away from electronic card 1700. This feature may help prevent electronic card 1700 from being unintentionally left unattended at a business or other location. Antenna 1712 may also be configured to receive instructions from the user device. For example, antenna 1712 may be configured to receive or relay a signal from the user device that includes an instruction to disable electronic card 1700. The instruction to disable electronic card 1700 may be received from another system or device that may be operated by the card issuer or another party.

[0202] In some embodiments, electronic card 1700 is shipped to a user or customer in a container or package. The container or package may be configured for shipping via the mail or other delivery service. The container or package may be configured for display in a retail store or environment. In some cases, the container or package is not configured for shipping without a separate shipping container or package. For example, the exterior of the container or package may have a decorative appearance that would not withstand normal shipping conditions intact or without defects.

[0203] In some embodiments, the container or package may include an antenna or electronic components that are readable by a user's mobile phone or other portable electronic device (e.g., tablet, notebook computer, desktop computer, portable media player, etc.). For example, the container or package may include a pouch or pocket into which the electronic card 1700 may be at least partially placed. The pouch or pocket may include a sleeve that completely surrounds the electronic card 1700 or may include a recess that partially surrounds the electronic card 1700 and leaves the top (or bottom) surface substantially exposed. The package may also include one or more flaps or panels that are configured to fold over the pouch or pocket to conceal or cover the electronic card 1700 contained therein.

[0204] The container may also include one or more antennas extending along one or more sides of the pouch or pocket. The one or more antennas may include a near field communication (NFC) antenna, a radio frequency identification (RFID) antenna, or other types of antennas configured for wireless communication. In one example, the container includes two elongated antennas disposed along both sides of the pouch or pocket. The two elongated antennas may be displaced outward from the edges of the electronic card 1700 when the electronic card 1700 is placed in the pouch or pocket of the container. In some cases, the one or more antennas surround or at least partially surround the electronic card 1700 when the electronic card 1700 is held within the container. In some cases, the antennas overlap one or more portions of the electronic card 1700 when the electronic card 1700 is placed in the pouch or pocket of the container.

[0205] In some embodiments, the user's portable electronic device can identify the electronic card 1700 and obtain a serial number or another type of unique identifier. The user's portable electronic device may obtain the identity of the electronic card 1700 by electrically communicating with one or more antennas integrated with the packaging. The user's portable electronic device may also be configured to communicate with external devices and / or services to register the electronic card 1700 with a registry or user account. In some cases, the electronic card 1700 is activated in response to registration using the user's portable electronic device.

[0206] In some embodiments, electronic card 1700 includes one or more visual output devices configured to provide output to a user. For example, electronic card 1700 may include display 1714 that renders visual information generated by processing unit 1702 or other forms of graphical output. Display 1714 may include a liquid crystal display (LCD), a light emitting diode, an organic light emitting diode (OLED) display, an active layer organic light emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc. If display 1714 is a liquid crystal display or an electrophoretic ink display, the display may further include a backlight component that can be controlled to provide variable levels of display brightness. If display 1714 is an organic light emitting diode or an organic electroluminescent type display, the brightness of display 1714 may be controlled by modifying electrical signals provided to the display elements. Display 1714 may be a foldable or flexible display configured to be bent or folded during normal operation.

[0207] In some examples, display 1714 is used to provide dynamic or configurable markings on electronic card 1700. For example, display 1714 may be used to display the cardholder's name, account number, card issuer logo, or other similar types of markings. In some examples, display 1714 may dynamically change the markings depending on the state or mode of electronic card 1700. Display 1714 may display indicia or other markings indicating that value has been loaded onto electronic card 1700 and / or that electronic card 1700 is authorized to conduct monetary transactions or transfers. In some embodiments, display 1714 may change the orientation of the markings or graphical output depending on the orientation of electronic card 1700.

[0208] As shown in FIG. 17 , the electronic card 1700 may include a battery 1716 configured to power the components of the electronic card 1700. The battery 1716 may include one or more storage cells linked together to enable an internal supply of power. The battery 1716 may be operably connected to a power management circuit configured to provide appropriate voltage and power levels to individual or group of components within the electronic card 1700. The battery 1716 may be configured to receive power from an external source, such as an external wireless charger, via the power management circuit. In one example, the battery 1716 is operably connected to a receiver coil configured to receive wireless or inductively coupled power from a wireless charging device having a transmitter coil. The battery 1716 may store the received power so that the electronic card 1700 can operate for extended periods of time, which may range from several hours to several days, without connection to an external power source. The battery 1716 may be flexible to accommodate bending or flexing of the electronic card 1700. For example, the battery 1716 may be mounted on a flexible structure or a flexible printed circuit. In some cases, the battery 1716 is formed from flexible anode and cathode layers, and the battery cells themselves are flexible. In some cases, the individual battery cells are not flexible, but are attached to a flexible substrate or carrier so that the battery cell array can be bent or folded around a bendable region of the electronic card 1700.

[0209] In some embodiments, electronic card 1700 includes one or more input devices 1718. Input device 1718 is a device configured to receive input from a user or the environment. Input device 1718 may include, for example, a touch sensor, a force sensor, or another touch-actuation sensor. Touch-actuation sensors can be used to define touch-actuated buttons, gesture input areas, capacitive slide bars, or other touch-sensitive areas on electronic card 1700. Input device 1718 may be configured to receive gesture input, force input, or various other forms of touch input. In some embodiments, input device 1718 may provide a dedicated or primary function, including, for example, a power button, a home button, or other dedicated function or operation.

[0210] 17, electronic card 1700 may include one or more output devices 1720. For example, electronic card 1700 may include output device 1720 configured to function as a speaker and generate sound or audio output. In another example, output device 1720 may be configured to operate as a tactile or haptic output device and generate haptic output along a surface of electronic card 1700. Output device 1720 may be formed from a mesh or matrix of fibers or wires configured to move or deform in response to a signal from processing unit 1702. Movement of the mesh or matrix of fibers may generate tactile or haptic output along the exterior surface of electronic card 1700. Similarly, movement of the mesh or matrix of fibers may generate sound or audio output.

[0211] In some embodiments, electronic card 1700 includes one or more devices configured to authenticate a user. For example, electronic card 1700 may include a biosensor configured to identify or authenticate a user by detecting some unique bio-characteristic, including a fingerprint, facial pattern, eye detection, or other bio-data. The biosensor may include, for example, a capacitive array configured to detect a unique characteristic of a user's fingerprint or touch. Alternatively, the biosensor may include an optical sensor configured to detect other unique characteristics of a user. The biosensor may be used to authenticate financial transactions, provide access to restricted areas, and / or unlock devices or systems paired to electronic card 1700.

[0212] The following description applies to the electronic cards and electronic devices described herein to the extent that personally identifiable information data can be obtained using these cards or devices. It should be fully understood that use of personally identifiable information should be in accordance with generally recognized privacy policies and practices that meet or exceed industry or government requirements for maintaining user privacy. In particular, personally identifiable information data should be managed and handled in a manner that minimizes the risk of unintended or unauthorized access or use, and the nature of permitted use should be clearly indicated to the user.

[0213] In the foregoing description, for purposes of explanation, specific terminology was used to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments set forth herein have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teachings.

[0214] For example, mechanisms that implement functionality may be physically located in various locations, including being distributed so that some of the functionality is implemented in different physical locations. Also, as used in this specification, including the claims, "or" when used in a list of items preceded by "at least one" indicates a disjunctive list; for example, the list "at least one of A, B, or C" indicates A or B or C or AB or AC or BC or ABC (i.e., A and B and C). Furthermore, the term "exemplary" does not imply that the described example is preferred or better than other examples.

Claims

1. An electronic ID card, a metal substrate having a first surface and a second surface, the metal substrate defining a recess extending into the first surface; a ferromagnetic film disposed along the second surface of the metal substrate; an integrated circuit at least partially disposed within the recess; a first coating layer disposed on the metal substrate, a first layer extending over the first surface of the metal substrate and comprising a polymer and a pigment dispersed within the polymer; a second layer extending over the first layer and comprising a transparent polymer; and a first coating layer comprising: An electronic ID card comprising:

2. the second layer has a higher hardness than the first layer; the second layer defines an exterior surface of the electronic identification card; the second layer has a surface roughness of about 0.5 μm Ra; 10. The electronic ID card of claim 1.

3. the first layer comprises a urethane primer adhered to the first surface of the metal substrate; the polymer of the first layer comprises urethane adhered to the metal substrate by the urethane primer; The electronic ID card of claim 1 , wherein the second layer comprises a clear acrylate that defines a portion of the exterior surface of the electronic ID card.

4. the electronic ID card further comprises a contact plate disposed on the integrated circuit; the portion of the exterior surface defined by the clear acrylate is a first portion; 4. The electronic ID card of claim 3, wherein the contact plate defines a terminal electrode array that defines a second portion of the exterior surface of the electronic ID card.

5. 5. The electronic ID card of claim 4, wherein each terminal electrode of the terminal electrode array is offset from an edge of the contact plate.

6. The electronic ID card of claim 4 , wherein the contact plate further comprises a conductive layer surrounding the terminal electrode array.

7. the contact plate includes a plate substrate formed from a dielectric material; Each terminal electrode is a first layer formed from electrolessly plated metal and extending over the dielectric material of the contact plate; a second layer formed from an electroplated metal and extending over the first layer; 5. The electronic ID card of claim 4, comprising:

8. the electronic identification card defines a first set of chamfered edges surrounding the first surface; The electronic ID card of claim 1 , wherein the electronic ID card defines a second set of chamfered edges surrounding the second face.

9. the ferromagnetic film is attached to a backing layer; a first chamfered edge defined at least in part by a beveled edge formed in the ferromagnetic film and the liner layer; 9. The electronic ID card of claim 8, wherein the first chamfered edge coincides with the beveled edges of the ferromagnetic film and the backing layer.

10. the electronic ID card further comprising a laser-formed relief feature, the laser-formed relief feature comprising: at least one concave wall defining a marking recess extending through the first coating layer; a recessed marking feature defining a bottom of the marking recess; 10. The electronic ID card of claim 1, comprising:

11. The electronic ID card is rectangular with four rounded corners, The rounded shape is a spline shape having a non-uniform radius of curvature.

10. The electronic ID card of claim 1.

12. An electronic card, a metal substrate defining a recess formed in a front surface thereof; a ferromagnetic film disposed along a back surface of the metal substrate opposite the front surface; an integrated circuit disposed in the recess of the metal substrate; a contact plate disposed on the integrated circuit, A plate substrate; a terminal electrode array disposed on the plate substrate, each terminal electrode being displaced from an edge of the plate substrate; a contact plate including An electronic card comprising:

13. 13. The electronic card of claim 12, wherein the contact plate further includes a set of abrasive regions, each abrasive region being disposed between a respective terminal electrode of the terminal electrode array and a respective edge of the plate substrate.

14. the contact plate further includes a periphery including a conductive material surrounding the terminal electrode array; the periphery being separated from the terminal electrode array by one or more abrasive regions; 13. The electronic card of claim 12.

15. the terminal electrode array is disposed on the front surface of the plate substrate; the contact plate further includes a back surface conductive layer disposed on a back surface of the plate substrate; the terminal electrode array is electrically connected to the backside conductive layer by one or more vias that penetrate the plate substrate; 13. The electronic card of claim 12.

16. the plate substrate is made of a non-conductive material; The terminal electrode array a first conductive layer including an electrolessly plated metal disposed on the non-conductive material of the plate substrate; a second conductive layer comprising an electroplated metal disposed on the first conductive layer; Including, 13. The electronic card of claim 12.

17. 1. A method of forming a contact plate for an electronic card, comprising: applying a photoresist layer to the front surface of the plate substrate; exposing the photoresist layer using a light source to form a plating mask defining an array of plating areas; applying a catalyst solution to the plating area array to form a first conductive layer along the plating areas of the plating area array; applying a plating solution to the first conductive layer; applying a current to the first conductive layer while the plating solution is being applied to the first conductive layer to form a second conductive layer on the first conductive layer using an electroplating process that defines a terminal electrode displaced between the terminal electrode and an edge of the plate substrate; A method comprising:

18. the plate substrate is formed of a non-conductive material; the first conductive layer includes a bridge portion electrically connecting the first conductive layer to the edge portion of the plate substrate; The method further includes laser ablating a portion of the first and second conductive layers located at least partially within the bridge portion to expose a portion of the non-conductive material of the plate substrate.

18. The method of claim 17.

19. a conductive periphery disposed on the front surface of the plate substrate and at least partially surrounding the terminal electrode; The method of claim 18 , wherein the bridge portion extends between the terminal electrode and the conductive periphery.

20. forming a back conductive layer along a back surface of the plate substrate opposite the front surface; electrically coupling the first conductive layer to the backside conductive layer using one or more vias through the plate substrate; 20. The method of claim 17 further comprising:

Images