Electronic-component mounting substrate and electronic module

Abstract

To provide an electronic-component mounting substrate that is able to improve the strength of bonding to an electronic component via a bonding material, and to provide an electronic module including the electronic-component mounting substrate.SOLUTION: An embodiment of an electronic-component mounting substrate includes a first insulating layer having a first surface. The first surface has a first mounting region for mounting an electronic component. The first mounting region has one or more first protrusions. The first protrusion is located on the first surface in the first mounting region. On an arbitrary first imaginary straight line extending in an in-plane direction of the first surface, a plurality of sections in which the first protrusions are located are present at least at a first interval. A dimension of a first section, which is a section in which the first protrusion adjacent to any side of the first interval is located, is larger than a dimension of the first interval.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an electronic component mounting substrate and an electronic module. [Background technology]

[0002] BACKGROUND ART For example, a substrate described in Patent Document 1 is known as an electronic component mounting substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2023 / 074342 Summary of the Invention [Problem to be solved by the invention]

[0004] When an electronic component is bonded to an electronic component mounting substrate via a bonding material, there has been a demand for improved bonding strength.

[0005] Therefore, the present disclosure provides an electronic component mounting substrate that enables improved bonding strength with an electronic component via a bonding material, and an electronic module that includes the electronic component mounting substrate. [Means for solving the problem]

[0006] (1) One aspect of the electronic component mounting substrate according to the present disclosure is a first insulating layer having a first surface; the first surface has a first mounting area for mounting an electronic component; the first mounting area has one or more first protrusions; the first protrusion is located on the first surface in the first mounting area, a plurality of sections in which the first protrusions are located are present at least at a first interval on any first virtual straight line extending in an in-plane direction of the first surface, The dimension of a first section, which is a section in which the first protrusion adjacent to any side of the first interval is located, is larger than the dimension of the first interval.

[0007] (2) One aspect of the electronic component mounting substrate according to the present disclosure is a first insulating layer having a first surface; the first surface has a first mounting area for mounting an electronic component; the first mounting area has one or more first protrusions; an upper surface of the first protrusion constitutes a part of the first surface in the first mounting region; a plurality of sections in which the first protrusions are located are present at least at a first interval on any first virtual straight line extending in an in-plane direction of the first surface, The dimension of a first section, which is a section in which the first protrusion adjacent to any side of the first interval is located, is larger than the dimension of the first interval.

[0008] (3) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to (1), The area of ​​the first protrusion in a plan view decreases with increasing distance from the first surface in the height direction of the first protrusion.

[0009] (4) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to (1) or (2), The first protrusion includes the same insulating material as the first insulating layer.

[0010] (5) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to (4), The insulating material is mainly composed of ceramic.

[0011] (6) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (5), The porosity of the first protrusion is greater than the porosity of the first insulating layer.

[0012] (7) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (6), The surface roughness of the first protrusions is greater than the surface roughness of the first insulating layer.

[0013] (8) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (7), The height of the first protrusion located in the first section is smaller than the dimension of the first interval.

[0014] (9) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (8), The height of the first protrusion located in the first section is smaller than the dimension of the first section.

[0015] (10) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (9), The first mounting region has a plurality of the first protrusions.

[0016] (11) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (10), In a plan view, the first protrusion is rod-shaped.

[0017] (12) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (11), In a plan view, the first protrusion has a circular shape.

[0018] (13) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (11), In a plan view, the first protrusion has a mesh shape.

[0019] (14) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (11), a plurality of sections in which the first convex portions are located are present at a plurality of intervals on the first virtual straight line, The dimensions of the plurality of intervals are constant.

[0020] (15) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (14), A second insulating layer is provided on any area of ​​the first surface other than the first mounting area.

[0021] (16) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to (15), the second insulating layer has a through hole penetrating the second insulating layer in a thickness direction, In a plan view, the first mounting region is located within the through hole.

[0022] (17) One aspect of the electronic component mounting substrate according to the present disclosure is The electronic component mounting substrate according to any one of (1) to (14), a second insulating layer on any area of ​​the first surface other than the first mounting area; the second insulating layer has a through hole penetrating the second insulating layer in a thickness direction and a second surface facing the same side as the first surface, In a plan view, the first mounting region is located within the through hole, the second surface has a second mounting area for mounting an electronic component; the second mounting area has one or more second protrusions; the second protrusion is located on the second surface in the second mounting area, On any second virtual line extending in an in-plane direction of the second surface, sections in which the second protrusions are located are spaced apart by at least a second interval, a dimension of a second section, which is a section in which the second convex portion adjacent to any side of the second interval is located, is larger than a dimension of the second interval; The height of the second convex portion located in the second section is greater than the height of the first convex portion located in the first section.

[0023] (18) One aspect of the electronic module according to the present disclosure is any one of the electronic component mounting substrates (1) to (17) above; and a first electronic component mounted on the first mounting area via a bonding material.

[0024] (19) One aspect of the electronic module according to the present disclosure is The electronic component mounting substrate according to (16) or (17), a first electronic component mounted on the first mounting area via a bonding material, The electronic component is located within the through hole.

[0025] (20) One aspect of the electronic module according to the present disclosure is The electronic module according to (19), the second insulating layer has a second surface facing the same side as the first surface; The electronic component mounting board includes, on the second surface, a first electrode that is electrically connected to the first electronic component. [Effects of the Invention]

[0026] According to the present disclosure, it is possible to obtain an electronic component mounting substrate that enables improved bonding strength with an electronic component via a bonding material, and an electronic module that includes the electronic component mounting substrate. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a perspective view of an embodiment of an electronic component mounting substrate; [Figure 2] FIG. 2 is a plan view of the electronic component mounting board shown in FIG. [Figure 3] 3 is a cross-sectional view of the electronic component mounting board taken along line AA in FIG. 2. FIG. [Figure 4] FIG. 10 is a perspective view of another embodiment of an electronic component mounting board. [Figure 5] FIG. 5 is a plan view of the electronic component mounting board shown in FIG. [Figure 6] 6 is a cross-sectional view of the electronic component mounting board taken along the line BB in FIG. 5. [Figure 7] FIG. 10 is a perspective view of another embodiment of an electronic component mounting board. [Figure 8] FIG. 8 is a plan view of the electronic component mounting board shown in FIG. [Figure 9] 9 is a cross-sectional view of the electronic component mounting board taken along line CC in FIG. 8. FIG. [Figure 10] FIG. 10 is a perspective view of another embodiment of an electronic component mounting board. [Figure 11] FIG. 11 is a plan view of the electronic component mounting board shown in FIG. [Figure 12] 12 is a cross-sectional view of the electronic component mounting board taken along the line DD in FIG. 11. FIG. [Figure 13] FIG. 10 is a perspective view of another embodiment of an electronic component mounting board. [Figure 14] FIG. 14 is a plan view of the electronic component mounting board shown in FIG. [Figure 15] 15 is a cross-sectional view of the electronic component mounting board taken along the line EE in FIG. 14. [Figure 16] 10 is a plan view of the first mounting region, showing another embodiment of the shape of the first protrusion. FIG. [Figure 17] 10 is a plan view of the first mounting region, showing another embodiment of the shape of the first protrusion. FIG. [Figure 18] 3 is an enlarged view of a part (inside a frame F) of the first mounting area in FIG. 2. FIG. [Figure 19]17 is an enlarged view of a part of the first mounting region (inside a frame G) in FIG. 16. FIG. [Figure 20] 18 is an enlarged view of a part of the first mounting region (inside a frame H) in FIG. 17. FIG. [Figure 21] FIG. 3 is an enlarged view of a part (inside a frame I) of the second mounting area in FIG. [Figure 22] 4 is a cross-sectional SEM image of a first protrusion located on a first surface of a first insulating layer in the electronic component mounting substrate of the embodiment shown in FIGS. [Figure 23] 4 is a cross-sectional SEM image of a second convex portion located on the second surface of the second insulating layer in the electronic component mounting substrate according to the embodiment shown in FIGS. [Figure 24] 10 is a cross-sectional curve of a first mounting region in which a plurality of circular first protrusions are arranged side by side. [Figure 25] 10 is a cross-sectional curve of a second mounting region in which a plurality of circular second protrusions are arranged side by side. [Figure 26] 1 is a cross-sectional view illustrating one embodiment of an electronic module. DETAILED DESCRIPTION OF THE INVENTION

[0028] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, for the sake of convenience, each of the drawings below shows a simplified view of only the main components necessary for explaining the embodiments. Therefore, the embodiments of the present disclosure may include any components not shown in the drawings. Furthermore, the dimensions of the components in the drawings do not faithfully represent the actual dimensions, dimensional ratios, etc. of the components. For convenience, the directions of the electronic component mounting board and the electronic module are defined using the Cartesian coordinate system XYZ. The positive side of the X direction is the right side, the positive side of the Y direction is the front side, and the positive side of the Z direction is the top side.

[0029] In this disclosure, "planar view" refers to a view in the thickness direction (Z direction) of the electronic component mounting substrate, and includes a planar perspective view. "Planar direction" or "in-plane direction" refers to a direction (XY direction) perpendicular to the thickness direction (Z direction) of the electronic component mounting substrate. "Cross-sectional view" refers to a view in a direction (XY direction) perpendicular to the thickness direction (Z direction) of the electronic component mounting substrate.

[0030] In the following description, expressions such as "constant," "orthogonal," "vertical," or "parallel" may be used. These expressions do not necessarily mean "constant," "orthogonal," "vertical," or "parallel" in the strict sense. In other words, these expressions allow for deviations due to, for example, manufacturing accuracy, installation accuracy, etc.

[0031] [Electronic component mounting board] 1 to 15, an electronic component mounting substrate 100 of the present disclosure includes a first insulating layer 1 having a first surface S1. The first insulating layer 1 may be composed of one layer or multiple layers. The first surface S1 does not have to be flat, and may have a curved surface.

[0032] The first surface S1 has a first mounting area A1 for mounting electronic components. The shape of the first mounting area A1 in a plan view is not particularly limited, and may be, for example, a circular shape, a rectangular shape, or the like.

[0033] The first mounting area A1 has one or more first protrusions 10. In the present disclosure, a first protrusion 10 refers to a portion that has a protruding shape compared to the surrounding area and has a maximum height of 5 μm or more.

[0034] 1 to 12, the first protrusion 10 may be located on the first surface S1 in the first mounting area A1, or, as shown in FIGS. 13 to 15, the upper surface of the first protrusion 10 may form part of the first surface S1 in the first mounting area.

[0035] The number of first protrusions 10 that the first mounting area A1 has may be one or more as shown in Figures 1 to 15. Details of the first protrusions 10 will be described later.

[0036] 1 to 3 and 7 to 15, the electronic component mounting board 100 may have a second insulating layer 2 on any region of the first surface S1 other than the first mounting region A1. The second insulating layer 2 may be composed of one layer or multiple layers. Note that, as shown in FIGS. 4 to 6, the electronic component mounting board 100 does not necessarily have to have the second insulating layer 2.

[0037] 1 to 3, 7 to 9, and 13 to 15, the second insulating layer 2 may have through holes 24 that penetrate the second insulating layer 2 in the thickness direction. The shape of the through holes 24 in a plan view is not particularly limited and may be, for example, circular or rectangular. Note that the second insulating layer 2 does not necessarily have to have through holes 24, as shown in FIGS. 10 to 12.

[0038] As shown in Figures 1 to 3, 7 to 9, and 13 to 15, the first mounting region A1 may be located within the through hole 24 in plan view. By having the first mounting region A1 located within the through hole 24 in plan view, electronic components can be mounted within the through hole 24, thereby protecting the electronic components from external impact. Furthermore, the bonding of the electronic components can be made stronger. When mounting electronic components within the through hole 24, the electronic components may be embedded within the through hole 24 with, for example, a resin. Note that even if the second insulating layer 2 has a through hole 24, the first mounting region A1 does not have to be located within the through hole 24.

[0039] 1 to 3, 7 to 9, and 13 to 15, the second insulating layer 2 may have a second surface S2 facing the same side (upper side) as the first surface S1. The second surface S2 does not have to be flat, and may have a curved surface.

[0040] 1 to 3 and 13 to 15, the second surface S2 may have a second mounting area A2 for mounting electronic components. The shape of the second mounting area A2 in a plan view is not particularly limited and may be, for example, circular, rectangular, or the like.

[0041] As shown in FIGS. 1 to 3 and 13 to 15, the second mounting region A2 may have one or more second protrusions 20. In the present disclosure, the second protrusions 20 refer to portions that are convex compared to the surrounding region and have a maximum height of 5 μm or more. The second surface S2 may not have the second mounting region A2. Even if the second surface S2 has the second mounting region A2, the second mounting region A2 may not have the second protrusions 20.

[0042] 1 to 3, the second protrusion 20 may be located on the second surface S2 in the second mounting area A2. Alternatively, as shown in FIGS. 13 to 15, the upper surface of the second protrusion 20 may form part of the second surface S2 in the second mounting area A2.

[0043] The number of second protrusions 20 is not particularly limited, and may be one depending on the shape of the second protrusions 20. Details of the first protrusions 10 and the second protrusions 20 will be described later.

[0044] As shown in FIGS. 1 to 15, the electronic component mounting board 100 may include a first electrode 11. The first electrode 11 is an electrode to which an electronic component mounted on the first mounting area A1 is electrically connected via a wire or the like. As shown in FIGS. 6 and 12, the first electrode 11 may be located on the upper surface (first surface S1) of the first insulating layer 1. As shown in FIGS. 3, 9, and 15, the first electrode 11 may be located on the upper surface (second surface S2) of the second insulating layer 2. The electronic component mounting board 100 may include a plurality of first electrodes 11.

[0045] As shown in Figures 3, 9, and 15, the electronic component mounting board 100 may include a first internal wiring 12. The first internal wiring 12 may be electrically connected to the first electrode 11 through a via conductor 3. As shown in Figures 3, 9, and 15, the first internal wiring 12 may be located between the first insulating layer 1 and the second insulating layer 2. The electronic component mounting board 100 may include a plurality of first internal wirings 12.

[0046] As shown in FIGS. 3, 6, 9, 12, and 15, the electronic component mounting board 100 may include a first external wiring 13. The first external wiring 13 may be electrically connected to the first electrode 11 through a via conductor 3. When the electronic component mounting board 100 includes a first internal wiring 12, the first external wiring 13 may be electrically connected to the first electrode 11 through the via conductor 3 and the first internal wiring 12. As shown in FIGS. 3, 6, 9, 12, and 15, the first external wiring 13 may be located on the lower surface of the first insulating layer 1. The electronic component mounting board 100 may include a plurality of first external wirings 13.

[0047] As shown in Figures 3, 12, and 15, the electronic component mounting board 100 may include a second electrode 21. The second electrode 21 is an electrode to which an electronic component mounted in the second mounting area A2 is electrically connected via a wire or the like. As shown in Figures 3, 12, and 15, the second electrode 21 may be located on the upper surface (second surface S2) of the second insulating layer 2. Alternatively, the second electrode 21 may be located on the upper surface (first surface S1) of the first insulating layer 1. The electronic component mounting board 100 may include a plurality of second electrodes 21.

[0048] 3, 12, and 15, the electronic component mounting board 100 may include second internal wiring 22. The second internal wiring 22 may be electrically connected to the second electrode 21 through a via conductor 3. As shown in FIGS. 3, 12, and 15, the second internal wiring 22 may be located between the first insulating layer 1 and the second insulating layer 2. The electronic component mounting board 100 may include a plurality of second internal wirings 22.

[0049] 3, 12, and 15, the electronic component mounting board 100 may include a second external wiring 23. The second external wiring 23 may be electrically connected to the second electrode 21 through the via conductor 3 and the second internal wiring 22. As shown in FIGS. 3, 12, and 15, the second external wiring 23 may be located on the lower surface of the first insulating layer 1. The electronic component mounting board 100 may include a plurality of second external wirings 23.

[0050] [Shape of the first convex part, etc.] As shown in FIG. 2 and other figures, the first protrusions 10 may be circular in plan view. In this case, the first mounting area A1 has a plurality of first protrusions 10. Circular shapes include perfect circles, ellipses, and irregular circles. When there are a plurality of circular first protrusions 10, the plurality of circular first protrusions 10 may be arranged at equal intervals or randomly within the first mounting area A1. When the first mounting area A1 has a structure including a plurality of circular first protrusions 10, the surface area of ​​the first mounting area A1 can be significantly increased with a relatively small amount of material. Furthermore, when the first protrusions 10 are circular, the bonding material flows easily in the first mounting area A1, thereby reducing unevenness in the bonding material between the electronic component and the first mounting area A1.

[0051] As shown in FIG. 16 , the first protrusion 10 may be rod-shaped in a plan view. In this case, the first mounting area A1 has a plurality of first protrusions 10. The rod-shaped shape refers to a shape extending from one end to the other. The direction in which the rod-shaped first protrusions 10 extend (first direction D1) is, for example, a direction intersecting with a first virtual line described below. The end of the rod-shaped first protrusion 10 may have a cornered shape or may have rounded corners. When there are a plurality of rod-shaped first protrusions 10, the rod-shaped first protrusions 10 may be aligned in one direction or may not be aligned in one direction. Furthermore, the intervals between the rod-shaped first protrusions 10 may be equal or may not be equal. In a structure in which the first mounting area A1 has a plurality of rod-shaped first protrusions 10, the first protrusions 10 can be easily formed by laser processing.

[0052] As shown in FIG. 17, the first protrusion 10 may have a mesh-like shape in plan view. The number of first protrusions 10 having a mesh-like shape in plan view may be one as shown in FIG. 17, or may be multiple. The mesh-like shape refers to a shape in which multiple bars intersect with each other to form multiple openings. As shown in FIG. 17, the mesh-like shape may be a shape formed by the intersection of multiple bars extending in a certain direction (second direction D2) with multiple bars extending in a direction different from the second direction D2 (third direction D3). In this case, either the second direction D2 or the third direction D3 may be the same direction as the direction in which a first virtual straight line described below extends. The angle formed by the second direction D2 and the third direction D3 may be a right angle or may not be a right angle. The end of each bar constituting the mesh-like shape may have a corner, or the corner may be rounded. Each bar constituting the mesh-like shape may be bent. The shapes of the multiple openings in the mesh-like first protrusion 10 may be the same or different. The shape of the openings in a plan view is not particularly limited and may be various shapes such as a polygonal shape or a circular shape. Polygonal shapes include a square shape, a rectangular shape, a diamond shape, a trapezoid shape, etc. When the first protrusion 10 has a mesh shape in a plan view, the bonding material can be collected in the openings, preventing the bonding material from flowing out more than necessary.

[0053] The shape of the first protrusions 10 in plan view may be various shapes other than those described above, such as a rectangular shape, etc. When there are multiple first protrusions 10, the shapes of the first protrusions 10 in plan view may be the same as or different from each other.

[0054] In an embodiment in which the first protrusion 10 is located on the first surface S1 in the first mounting area A1, the area of ​​the first protrusion 10 in a plan view may decrease with increasing distance from the first surface S1 in the height direction (Z direction) of the first protrusion 10. This makes the first protrusion 10 less likely to be damaged compared to, for example, a case in which the top of the first protrusion 10 has corners in a cross-sectional view. This reduces the possibility that the first protrusion 10 itself will come off the electronic component mounting board 100 or that the corners of the first protrusion 10 will chip when applied to an electronic module, causing an electronic component to come off.

[0055] 18 to 20, on any first imaginary line 15 extending in the in-plane direction (XY direction) of the first surface S1, there are a plurality of sections in which the first protrusions 10 are located, separated by at least a first interval 15b. Furthermore, when a section on the first imaginary line 15 in which the first protrusions 10 are located adjacent to any side of the first interval 15b is defined as a "first section 15a," the dimension of the first section 15a is greater than the dimension of the first interval 15b. The "section on the first imaginary line 15 in which the first protrusions 10 are located" refers to a section of the first imaginary line 15 in which the first protrusions 10 overlap in a planar view, and is defined regardless of the positional relationship between the first imaginary line 15 and the first protrusions 10 in the thickness direction (Z direction) of the electronic component mounting board 100. In other words, the first protrusions 10 do not necessarily have to be located above the first imaginary line 15 (on the positive side of the Z direction).

[0056] As described above, the electronic component mounting board 100 of the present disclosure has the first protrusion 10, and further, the dimension of the first section 15a is larger than the dimension of the first interval 15b, thereby greatly increasing the surface area of ​​the first mounting region A1. This facilitates the anchoring effect, improving the bonding strength between the electronic component and the electronic component mounting board 100 via the bonding material. As a result, the electronic component mounting board of the present disclosure can reduce the likelihood of electronic components falling off even in an environment prone to large vibrations, for example, when mounted on heavy machinery such as a car or excavator.

[0057] 18 to 20, the sections in which the first protrusions 10 are located may be spaced apart from one another on the first virtual line 15. In this case, the dimensions of the multiple spaces may or may not be constant. If the dimensions of the multiple spaces are constant, the possibility of the electronic component rattling or tilting when mounted can be reduced.

[0058] The height of the first protrusions 10 located in the first sections 15a may be smaller than the dimension of the first intervals 15b, thereby reducing the weight of the electronic component mounting board 100. In addition, the bonding material can be made to flow more easily in the first mounting area A1, thereby reducing unevenness in the spreading of the bonding material between the electronic component and the first mounting area A1.

[0059] The height of the first protrusion 10 located in the first section 15a may be smaller than the dimension of the first section 15a. This reduces the weight of the electronic component mounting board 100 and allows the bonding material to flow more easily. If the bonding material flows more easily, unevenness in the bonding material between the electronic component and the first mounting area A1 can be reduced.

[0060] [Shape of the second convex part, etc.] As shown in FIG. 21 , on any second imaginary line 25 extending in the in-plane direction (XY direction) of the second surface S2, there may be a plurality of sections in which the second protrusions 20 are located, separated by at least a second interval 25b. Furthermore, when a section on the second imaginary line 25 in which the second protrusions 20 are located is defined as a "second section 25a" adjacent to any side of the second interval 25b, the dimension of the second section 25a may be larger than the dimension of the second interval 25b. The "section on the second imaginary line 25 in which the second protrusions 20 are located" refers to a section of the second imaginary line 25 in which the second protrusions 20 overlap in a planar view, and is defined regardless of the positional relationship between the second imaginary line 25 and the second protrusions 20 in the thickness direction (Z direction) of the electronic component mounting board 100. In other words, the second protrusions 20 do not necessarily have to be located above the second imaginary line 25 (on the positive side of the Z direction).

[0061] If the dimension of the second section 25a is larger than the dimension of the second gap 25b, the surface area of ​​the second mounting area A2 can be significantly increased, which facilitates the anchor effect and improves the bonding strength with the electronic component via the bonding material.

[0062] The shape of the second protrusions 20 in plan view may be various shapes such as a circle, a rod, a mesh, a rectangle, etc., similar to the shape of the first protrusions 10 in plan view described above. When there are multiple second protrusions 20, the shapes of the second protrusions 20 in plan view may be the same as or different from each other.

[0063] In an embodiment in which the second protrusion 20 is located on the second surface S2 in the second mounting area A2, the area of ​​the second protrusion 20 in a plan view may decrease with increasing distance from the second surface S2 in the height direction (Z direction) of the second protrusion 20, similar to the area of ​​the first protrusion 10 in a plan view described above. This makes the second protrusion 20 less likely to be damaged, for example, compared to a case in which the upper part of the second protrusion 20 has corners in a cross-sectional view. This reduces the possibility that the second protrusion 20 itself will come off the electronic component mounting board 100, or that the corners of the second protrusion 20 will chip when applied to an electronic module, causing an electronic component to come off.

[0064] The second protrusions 20 may be located in a plurality of sections spaced apart from one another on the second virtual straight line 25. In this case, the dimensions of the plurality of spaces may or may not be constant. If the dimensions of the plurality of spaces are constant, the possibility of the electronic component rattling or tilting when mounted can be reduced.

[0065] The height of the second protrusions 20 located in the second sections 25a may be smaller than the dimension of the second intervals 25b, thereby reducing the weight of the electronic component mounting board 100. In addition, the bonding material can be made to flow more easily in the second mounting area A2, thereby reducing unevenness of the bonding material between the electronic component and the second mounting area A2.

[0066] The height of the second protrusion 20 located in the second section 25a may be smaller than the dimension of the second section 25a. This reduces the weight of the electronic component mounting board 100 and allows the bonding material to flow more easily. If the bonding material flows more easily, unevenness in the bonding material between the electronic component and the second mounting area A2 can be reduced.

[0067] In an embodiment in which the first mounting area A1 is located within the through hole 24 of the second insulating layer 2, the bonding material may accumulate less easily in the second mounting area A2 than in the first mounting area A1. Therefore, an electronic component bonded to the second mounting area A2 may be more likely to become detached than an electronic component bonded to the first mounting area A1. In such an embodiment, the bonding material can be more easily accumulated in the second mounting area A2 by making the height of the second protrusion 20 located in the second section 25a higher than the height of the first protrusion 10 located in the first section 15a.

[0068] [Embodiment in which the area other than the protrusion in the mounting area is considered to be the recess] In an embodiment in which the upper surface of the first protrusion 10 constitutes a part of the first surface S1 in the first mounting area A1, the area in the first mounting area A1 other than the first protrusion 10 can be considered a "first recess." The number of first recesses can be one or more depending on the shape and number of the first protrusions 10. Similarly, in an embodiment in which the upper surface of the second protrusion 20 constitutes a part of the second surface S2 in the second mounting area A2, the area in the second mounting area A2 other than the second protrusion 20 can be considered a "second recess." The number of second recesses can be one or more depending on the shape and number of the second protrusions 20.

[0069] For example, the electronic component mounting board 100 shown in FIGS. 13 to 15 can be described as follows. The electronic component mounting board 100 shown in FIGS. 13 to 15 includes a first insulating layer 1 and a second insulating layer 2. The first insulating layer 1 has a first surface S1 on its upper side. The first surface S1 has a first mounting area A1 for mounting an electronic component. The first mounting area A1 has one first recess. The lower surface of the first recess is located below the first surface S1 within the first mounting area A1. The second insulating layer 2 is located on an area of ​​the first surface S1 other than the first mounting area A1, and has a through-hole 24 penetrating the second insulating layer 2 in the thickness direction. In a plan view, the first mounting area A1 is located within the through-hole 24. The second insulating layer 2 has a second surface S2 facing the same side (upper side) as the first surface S1. The second surface S2 has the second mounting area A2 for mounting an electronic component. The second mounting area A2 has one second recess, the lower surface of which is located below the second surface S2 within the second mounting area A2.

[0070] In this case, on any first virtual line 15 extending in the in-plane direction of the first surface S1, there are a plurality of sections in which the first recesses are located, separated by at least a third interval. The dimension of the third section, which is the section in which the first recesses adjacent to any side of the third interval are located, is smaller than the dimension of the third interval. The third interval corresponds to the first interval 15a, and the third section corresponds to the first interval 15b.

[0071] Similarly, on any second virtual line 25 extending in the in-plane direction of the second surface S2, there are multiple sections in which the second recesses are located, separated by at least a fourth interval. The dimension of the fourth section, which is the section in which the second recesses adjacent to any side of the fourth interval are located, is smaller than the dimension of the fourth interval. The fourth interval corresponds to the second interval 25a, and the fourth section corresponds to the second interval 25b.

[0072] [Materials for each component of electronic component mounting boards] The first insulating layer 1 and the second insulating layer 2 contain an insulating material. The insulating material may be primarily composed of ceramic. A "primary component" refers to a component that accounts for 60% by mass or more. Examples of ceramic include aluminum oxide sintered bodies (alumina ceramics), aluminum nitride sintered bodies, silicon carbide sintered bodies, mullite sintered bodies, and glass ceramics. When the insulating material is primarily composed of ceramic, the heat dissipation and rigidity of the electronic component mounting substrate 100 are enhanced. However, since the surface of ceramic is typically smooth and has few irregularities, bonding strength to electronic components with a bonding material is low. However, with the electronic component mounting substrate 100 of the present disclosure, the anchor effect of the first protrusions 10 and the second protrusions 20 improves bonding strength, thereby achieving high bonding strength even when the first insulating layer 1 and the second insulating layer 2 contain ceramic as their primary component. The insulating material contained in the first insulating layer 1 and the insulating material contained in the second insulating layer 2 may be the same or different. The insulating material may be a dielectric material.

[0073] The insulating material may be mainly composed of a resin, such as an epoxy resin, polyimide, or liquid crystal polymer.

[0074] There is no particular limitation on the material contained in the first protrusion 10 and the second protrusion 20. If the material contained in the first protrusion 10 and the second protrusion 20 is an insulating material, the possibility of short-circuiting of electronic components can be reduced when the first protrusion 10 and the second protrusion 20 are applied to an electronic module.

[0075] The material contained in the first protrusion 10 may be the same insulating material as the first insulating layer 1. This improves the bonding strength between the first protrusion 10 and the first insulating layer 1. Similarly, the material contained in the second protrusion 20 may be the same insulating material as the second insulating layer 2. This improves the bonding strength between the second protrusion 20 and the second insulating layer 2.

[0076] The first electrode 11, the first internal wiring 12, the first external wiring 13, the second electrode 21, the second internal wiring 22, the second external wiring 23, and the via conductor 3 contain conductive components that transmit signals, power, etc. Examples of conductive components include tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, cobalt, and alloys thereof. The conductive components contained in each component may be the same or different from each other.

[0077] The porosity of the first protrusions 10 may be greater than the porosity of the first insulating layer 1. This results in a relatively large amount of irregularities on the surface of the first protrusions 10, and a relatively large surface area of ​​the first protrusions 10. Similarly, the porosity of the second protrusions 20 may be greater than the porosity of the second insulating layer 2. This results in a relatively large amount of irregularities on the surface of the second protrusions 20, and a relatively large surface area of ​​the second protrusions 20. The relatively large surface area of ​​the first protrusions 10 and / or the second protrusions 20 further improves the bonding strength with the electronic component via the bonding material.

[0078] The porosity of each component is the ratio of the void area to the unit area of ​​the cut surface of each component. Specifically, first, an SEM (scanning electron microscope) image of the cut surface of each component is taken. Next, the SEM image is analyzed using, for example, an image analysis and measurement system, WinROOF (manufactured by Mitani Shoji Co., Ltd.), to determine the ratio of the void area. This allows the porosity to be calculated.

[0079] The surface roughness of the first protrusions 10 may be greater than the surface roughness of the first insulating layer 1. This results in a relatively large surface area for the first protrusions 10. Similarly, the surface roughness of the second protrusions 20 may be greater than the surface roughness of the second insulating layer 2. This results in a relatively large surface area for the second protrusions 20. The relatively large surface area of ​​the first protrusions 10 and / or the second protrusions 20 further improves the bonding strength with the electronic component via the bonding material.

[0080] The surface roughness of each member can be measured, for example, using a surface roughness measuring instrument, SURFCOM 1400D (manufactured by Tokyo Seimitsu Co., Ltd.) If the surface roughness of the two members to be compared differs significantly, they can also be compared visually using, for example, SEM images.

[0081] 22 is approximately 10 μm. It can be seen from the cross-sectional SEM image of FIG.

[0082] 23 is approximately 16 μm. It can be seen from the cross-sectional SEM image of FIG.

[0083] In the electronic component mounting substrate 100 of the present disclosure, the first protrusions 10 may be provided in an arrangement and cross-sectional shape as exemplified in Fig. 24. In Fig. 24, the height H1 of the first protrusions 10 refers to the height from the lowest point between adjacent first protrusions 10 to the apex of the first protrusion 10. The position of each first protrusion 10 in the height direction varies because the first surface S1 is not a completely flat surface but includes some protrusions.

[0084] In the electronic component mounting substrate 100 of the present disclosure, the second protrusions 20 may be provided in an arrangement and cross-sectional shape as exemplified in Fig. 25. In Fig. 25, the height H2 of the second protrusions 20 refers to the height from the lowest point between adjacent second protrusions 20 to the apex of the second protrusion 20. The reason why the positions of the second protrusions 20 in the height direction vary is because the second surface S2 is not a completely flat surface but includes some protrusions.

[0085] [Method for manufacturing electronic component mounting substrates] The method for manufacturing the electronic component mounting substrate 100 is not particularly limited.

[0086] 1 to 3 can be manufactured, for example, as follows. In the following example, the first insulating layer 1, the second insulating layer 2, the first protrusion 10, and the second protrusion 20 are made of an aluminum oxide sintered body. The first electrode 11, the first internal wiring 12, the first external wiring 13, the second electrode 21, the second internal wiring 22, and the second external wiring 23 are formed using a tungsten metallized layer.

[0087] First, the raw material powders for the first insulating layer 1 and the second insulating layer 2 are kneaded with an organic solvent and an organic binder to form a slurry. The raw material powder mainly consists of aluminum oxide powder and a powder of silicon oxide or other sintering aid components. Next, the slurry is formed into a sheet using a forming method such as a doctor blade method or a lip coater method to form a ceramic green sheet. Furthermore, tungsten powder is mixed with an organic solvent and an organic binder to form a metal paste. To form the via conductors 3, through holes are formed at predetermined positions on the ceramic green sheet, and the through holes are filled with the metal paste. The metal paste is then printed at predetermined positions on the ceramic green sheet using a method such as screen printing. If necessary, multiple ceramic green sheets are stacked to form a laminate.

[0088] In order to form the first convex portion 10 and the second convex portion 20 in the regions that will become the first mounting region A1 and the second mounting region A2 in the laminate, a convex portion-forming slurry is printed as appropriate by a screen printing method, an inkjet printing method, or the like. The convex portion-forming slurry contains, for example, the same powder, organic solvent, and organic binder as the above-mentioned slurry for forming the insulating layer.

[0089] The content ratio of each component may be different between the slurry for forming the convex portions and the slurry for forming the insulating layer. For example, by lowering the content of the organic solvent and organic binder in the slurry for forming the convex portions compared to the slurry for forming the insulating layer, the porosity and surface roughness of the first convex portions 10 and the second convex portions 20 can be increased compared to the first insulating layer 1 and the second insulating layer 2.

[0090] After printing the slurry for forming the convex portions, the laminate is fired, thereby obtaining the electronic component mounting substrate 100. When the first convex portions 10 and the second convex portions 20 are formed by sintering the slurry printed by screen printing, inkjet printing, or the like in this way, damage to the electronic component mounting substrate 100 and the generation of processing waste can be reduced compared to when using laser processing, which will be described later.

[0091] 13 to 15, the first protrusions 10 and the second protrusions 20 can be formed by, for example, performing laser processing, blasting, cutting, or the like after sintering the laminate to appropriately remove the first mounting area A1 and the second mounting area A2. Laser processing allows the first protrusions 10 and the second protrusions 20 to be formed with high precision.

[0092] A metal plating layer may be applied by plating to the exposed surfaces of the first electrode 11, the second electrode 21, the first external wiring 13, and the second external wiring 23. This effectively reduces corrosion of each component. The metal plating layer may be, for example, a nickel plating layer, a gold plating layer, a palladium plating layer, or a combination thereof. The plating method may be, for example, an electrolytic plating method or an electroless plating method.

[0093] [Electronic Module] As shown in FIG. 26, the electronic module 200 of the present disclosure includes a first electronic component 16 mounted on a first mounting area A1 via a bonding material 4.

[0094] As shown in FIG. 26, the first electronic component 16 may be located inside the through-hole 24 in plan view.

[0095] As shown in FIG. 26, the electronic component mounting board 100 included in the electronic module 200 may have a first electrode 11 electrically connected to the first electronic component 16 on the second surface S2.

[0096] As shown in FIG. 26, the electronic module 200 may include a second electronic component 26 mounted on the second mounting area A2 via a bonding material 4.

[0097] As shown in FIG. 26, the electronic component mounting board 100 included in the electronic module 200 may have a second electrode 21 electrically connected to a second electronic component 26 on the second surface S2.

[0098] 26, the first electronic component 16 may be electrically connected to the first electrode 11 by a wire W. The second electronic component 26 may be electrically connected to the second electrode 21 by a wire W. Note that the connection method between each electronic component and each electrode shown in FIG. 26 is a wire bonding method, but is not limited to this and may be another connection method such as flip-chip bonding.

[0099] The first electronic component 16 and the second electronic component 26 are not particularly limited and may be, for example, a transformer (transformer coil), a light-emitting element, a light-receiving element, etc. The first electronic component 16 and the second electronic component 26 may be the same as or different from each other.

[0100] The bonding material 4 is not particularly limited and may be, for example, a resin-based bonding material. Examples of resin-based bonding materials include epoxy resin-based bonding materials, silicone-based bonding materials, acrylic resin-based bonding materials, and urethane resin-based bonding materials. The bonding material 4 used to bond the first electronic component 16 and the bonding material 4 used to bond the second electronic component 26 may be the same as or different from each other.

[0101] In an embodiment in which the first mounting area A1 is located within the through hole 24, the first electronic component 16 may be placed within the through hole 24 and then bonded by filling the through hole 24 with bonding material 4.

[0102] In addition, the details shown in the above embodiments can be modified as appropriate without departing from the spirit of the present disclosure. The scope of the present invention includes the scope of the invention described in the claims and its equivalents. Various combinations of the embodiments are not limited to the examples of the above embodiments. Furthermore, combinations of the embodiments with each other are also possible. [Explanation of symbols]

[0103] 100 Electronic component mounting board 200 Electronic Module 1 First insulating layer 10 First protrusion 11 1st electrode 12 1st internal wiring 13 First external wiring 15 First imaginary line 15a Section 1 15b 1st interval 16 First Electronic Parts S1 1st page A1 1st loading area 2 Second insulating layer 20 Second convex part 21 2nd electrode 22 2nd internal wiring 23 Second external wiring 24 through holes 25 Second imaginary line 25a Section 2 25b 2nd interval 26 Secondary Electronic Components S2 side 2 A2 2nd loading area 3 Via conductor 4 Bonding material W Wire

Claims

1. a first insulating layer having a first surface; the first surface has a first mounting area for mounting an electronic component; the first mounting area has one or more first protrusions; the first protrusion is located on the first surface in the first mounting area, a plurality of sections in which the first convex portion is located are present at least at a first interval on any first virtual straight line extending in an in-plane direction of the first surface, a dimension of a first section, which is a section in which the first convex portion adjacent to any side of the first interval is located, is larger than a dimension of the first interval; A substrate for mounting electronic components.

2. a first insulating layer having a first surface; the first surface has a first mounting area for mounting an electronic component; the first mounting area has one or more first protrusions; an upper surface of the first protrusion constitutes a part of the first surface in the first mounting region; a plurality of sections in which the first convex portion is located are present at least at a first interval on any first virtual straight line extending in an in-plane direction of the first surface, a dimension of a first section, which is a section in which the first convex portion adjacent to any side of the first interval is located, is larger than a dimension of the first interval; A substrate for mounting electronic components.

3. an area of ​​the first convex portion in a plan view decreases with increasing distance from the first surface in a height direction of the first convex portion; The electronic component mounting substrate according to claim 1 .

4. the first protrusion contains the same insulating material as the first insulating layer; The electronic component mounting substrate according to claim 1 .

5. The insulating material is mainly composed of ceramic. The electronic component mounting substrate according to claim 4 .

6. the porosity of the first protrusion is greater than the porosity of the first insulating layer; The electronic component mounting substrate according to claim 5 .

7. the surface roughness of the first protrusions is greater than the surface roughness of the first insulating layer; The electronic component mounting substrate according to claim 5 .

8. a height of the first convex portion located in the first section is smaller than a dimension of the first interval; The electronic component mounting substrate according to claim 1 or 2.

9. a height of the first protrusion located in the first section is smaller than a dimension of the first section; The electronic component mounting substrate according to claim 1 or 2.

10. The first mounting region has a plurality of the first protrusions. The electronic component mounting substrate according to claim 1 or 2.

11. In a plan view, the first protrusion is rod-shaped. The electronic component mounting substrate according to claim 10.

12. In a plan view, the first convex portion has a circular shape. The electronic component mounting substrate according to claim 10.

13. In a plan view, the first convex portion has a mesh shape. The electronic component mounting substrate according to claim 1 or 2.

14. a plurality of sections in which the first convex portions are located are present at a plurality of intervals on the first virtual straight line, The dimensions of the plurality of intervals are constant. The electronic component mounting substrate according to claim 1 or 2.

15. a second insulating layer on any area of ​​the first surface other than the first mounting area; The electronic component mounting substrate according to claim 1 or 2.

16. the second insulating layer has a through hole penetrating the second insulating layer in a thickness direction, In a plan view, the first mounting region is located within the through hole. The electronic component mounting substrate according to claim 15.

17. a second insulating layer on any area of ​​the first surface other than the first mounting area; the second insulating layer has a through hole penetrating the second insulating layer in a thickness direction and a second surface facing the same side as the first surface, In a plan view, the first mounting region is located within the through hole, the second surface has a second mounting area for mounting an electronic component; the second mounting area has one or more second protrusions; the second protrusion is located on the second surface in the second mounting area, On any second virtual line extending in an in-plane direction of the second surface, sections in which the second convex portions are located are spaced apart by at least a second interval, a dimension of a second section, which is a section in which the second convex portion adjacent to any side of the second interval is located, is larger than a dimension of the second interval; The height of the second convex portion located in the second section is greater than the height of the first convex portion located in the first section. The electronic component mounting substrate according to claim 1 .

18. The electronic component mounting substrate according to claim 1 or 2, a first electronic component mounted on the first mounting area via a bonding material, Electronic module.

19. The electronic component mounting substrate according to claim 16 , a first electronic component mounted on the first mounting area via a bonding material, The electronic component is located in the through hole. Electronic module.

20. the second insulating layer has a second surface facing the same side as the first surface; the electronic component mounting substrate has, on the second surface, a first electrode electrically connected to the first electronic component; 20. The electronic module of claim 19.

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