Electronic module and manufacturing method for electronic module

Abstract

To provide an electronic module having a heat release surface on upper and lower surfaces, in which the heat release surface is mounted with high mounting accuracy in a height direction and therefore the heat release property is excellent.SOLUTION: An electronic module 1 includes a first substrate 10, a first electronic element 13 disposed on the first substrate 10, a second substrate 20, a second electronic element 23 disposed on the second substrate 20, and an internal connection terminal 36 connecting the first substrate 10 and the second substrate 20. The second substrate 20 includes an extension part 25 that extends outward relative to an outer periphery of the first substrate 10 in a plan view.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an electronic module and a method for manufacturing an electronic module. [Background technology]

[0002] Conventionally, there has been an electronic module (semiconductor device) 900 in which heat dissipation members (rear surface metal bodies) 923, 933 are arranged on both sides of the electronic module 900, and heat is dissipated from both sides. Patent Document 1 describes an electronic module 900 including a semiconductor element 910 having electrodes on both sides, a pair of substrates 920, 930 arranged to sandwich the semiconductor element 910, and a conductive spacer 940 interposed between the substrate 930 and the semiconductor element 910. The substrates 920, 930 have insulating base materials 921, 931, front surface metal bodies 922, 932 connected to corresponding electrodes of the semiconductor element 910, and heat dissipation members 923, 933. Heat generated in the semiconductor element 910 is dissipated from both sides of the electronic module 900 through the conductive spacer 940, the front surface metal bodies 922, 932, and the heat dissipation members 923, 933. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-181822 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the case of an electronic module that dissipates heat from both sides, the heat dissipation surfaces on both sides of the electronic module must be in contact with a heat sink (see Figure 7). For this reason, it is necessary to control the distance between the heat dissipation surfaces to be within a specified tolerance range.

[0005] On the other hand, electronic modules with multiple stacked substrates are manufactured by stacking components such as substrates, internal connection terminals, and external connection terminals in the height direction of the electronic module. In conventional single-sided heat dissipation electronic modules, the heat dissipation surface is located on only one side of the electronic module, so strict tolerance control is not essential when stacking the internal components. On the other hand, when heat dissipation surfaces are located on both sides of the electronic module, the position of the heat dissipation surface located in the height direction has a significant impact on the heat dissipation characteristics, so it is necessary to control the position of the heat dissipation surface with high precision.

[0006] The present invention has been made in consideration of the above-mentioned problems, and aims to provide an electronic module having heat dissipation surfaces on both sides, in which the heat dissipation surfaces are mounted with high mounting accuracy in the vertical direction, thereby achieving excellent heat dissipation characteristics, and to provide a method for manufacturing an electronic module that is capable of manufacturing such an electronic module. [Means for solving the problem]

[0007] The electronic module of the present invention is an electronic module comprising a first substrate, a first electronic element arranged on the first substrate, a second substrate, a second electronic element arranged on the second substrate, and an internal connection terminal arranged between the first substrate and the second substrate, characterized in that the second substrate has a protrusion that, in a planar view, protrudes outward from the outer periphery of the first substrate.

[0008] The method for manufacturing an electronic module of the present invention includes a first substrate mounting step of mounting a first substrate on the first mounting portion of an assembly jig having a first mounting portion for mounting a first substrate on which a first electronic element is arranged and a second mounting portion for mounting a second substrate on which a second electronic element is arranged; an internal connection terminal mounting step of arranging one end of an internal connection terminal on the first substrate; and a second substrate mounting step of mounting the second substrate on the other end of the internal connection terminal and the second mounting portion, wherein the second substrate, when assembled into the electronic module, has a protruding portion that protrudes outward from the outer periphery of the first substrate in a planar view, and the second substrate is placed on the second mounting portion by engaging the protruding portion with the second mounting portion, and the second mounting portion is positioned at a predetermined height from the first mounting portion and at a position where it can engage the engaging portion in a planar view. [Effects of the Invention]

[0009] The electronic module of the present invention includes a first substrate, a second substrate, and an internal connection terminal disposed between the first substrate and the second substrate. The second substrate has a protruding portion that protrudes outward from the outer periphery of the first substrate in a plan view. The electronic module of the present invention can mount the first substrate and the second substrate with high accuracy in the height direction using the first heat dissipation surface of the first substrate and the protruding portion of the second substrate. According to the present invention, in an electronic module having heat dissipation surfaces on both sides, the heat dissipation surfaces are mounted with high accuracy in the height direction, thereby providing an electronic module with excellent heat dissipation characteristics.

[0010] The method for manufacturing an electronic module of the present invention includes a first substrate mounting step of mounting a first substrate on the first mounting portion of an assembly jig having a first mounting portion for mounting the first substrate and a second mounting portion for mounting the second substrate, and a second substrate mounting step of mounting the second substrate on the second mounting portion. When assembled into an electronic module, the second substrate has a protruding portion that protrudes outward from the outer periphery of the first substrate in a planar view. The second mounting portion is disposed at a predetermined height from the first mounting portion and is disposed in a position that allows the protruding portion to be engaged in a planar view. This allows the first substrate and the second substrate to be mounted with high accuracy in the vertical direction. According to the present invention, it is possible to provide a method for manufacturing an electronic module having heat dissipation surfaces on both sides, in which the heat dissipation surfaces are mounted with high mounting accuracy in the vertical direction, resulting in excellent heat dissipation characteristics. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view of an electronic module 1 according to an embodiment, and in FIG. 1, among the components of the electronic module 1, a mold resin 40 is not shown. [Figure 2] 1 is an external view of an electronic module 1 according to an embodiment. [Figure 3] 3 is a side view illustrating the internal structure of the electronic module 1 according to the embodiment. Note that, among the components of the electronic module 1, the mold resin 40 and some of the internal connection terminals 36 are not shown in FIG. [Figure 4]4A and 4B are plan views illustrating variations of the protrusion 25 in the electronic module 1 according to the embodiment. In FIG. 4, the molded resin 40, the first external connection terminal 32, and the second external connection terminal 34, which are components of the electronic module 1, are omitted. In FIG. 4, the second substrate 20 is indicated by a solid line, and the first substrate 10 is indicated by a dotted line. The dotted lines are omitted where the solid and dotted lines overlap. FIG. 4A is a diagram illustrating the shape of the protrusion 25 in the electronic module 1 according to the embodiment shown in FIGS. 1 to 3. FIG. 4B is a diagram illustrating the shape of the protrusion 25 in an electronic module according to a first modification. FIG. 4C is a diagram illustrating the shape of the protrusion 25 in an electronic module according to a second modification. [Figure 5] 10A and 10B are diagrams illustrating an example of an assembly jig 50 that can be used to manufacture the electronic module 1 according to the embodiment. [Figure 6] 2A to 2C are diagrams shown to explain a method for manufacturing the electronic module 1 according to the embodiment. [Figure 7] 9A and 9B are diagrams illustrating an electronic module 900 according to the prior art. DETAILED DESCRIPTION OF THE INVENTION

[0012] The electronic module and the manufacturing method of the electronic module of the present invention will be described below based on the embodiments shown in the drawings. Note that not all of the elements and combinations thereof described in the embodiments are necessarily essential to the solution of the present invention.

[0013] [Embodiment] 1. Electronic Module 1 to 3, the electronic module 1 according to the embodiment includes a first substrate 10, a first heat dissipation member 12, a first electronic element 13, a second substrate 20, a second heat dissipation member 22, a second electronic element 23, a first external connection terminal 32, a second external connection terminal 34, and an internal connection terminal 36. The electronic module 1 may include components other than those described above. Each component will be described below.

[0014] The first substrate 10 is a substrate having a first heat dissipation member 12 disposed on one surface and a first electronic element 13 disposed on the other surface (see FIG. 3). A ceramic substrate can be used as the first substrate 10, and preferably a substrate (e.g., a DCB substrate) having a structure in which copper plates are disposed on both surfaces of a ceramic plate can be used. When a DCB substrate is used as the first substrate 10, the copper plate disposed on one surface can be used as the first heat dissipation member 12. The first heat dissipation member 12 is exposed to the outside of the mold resin 40. The first substrate 10 has wiring 11 (see FIG. 3), which is electrically connected to the electrodes of the first electronic element 13.

[0015] In this specification, "electrically connected" refers not only to cases where the conductive parts of the components are in direct contact with each other, but also to cases where the components are in contact with each other via another conductive component (for example, solder or a spacer).

[0016] The first electronic element 13 is an electronic element disposed on the first substrate 10. The first electronic element 13 is disposed on the second substrate 20 side of the first substrate 10, and is sealed with a mold resin 40. The first electronic element 13 has electrodes (not shown), and is electrically connected to the wiring 11 provided on the first substrate 10 and the internal connection terminals 36. An example of the first electronic element 13 is a vertical MOSFET.

[0017] The second substrate 20 is a substrate that is disposed on the side of the first substrate 10 where the first electronic element 13 is disposed, while being spaced apart from the first substrate 10 and the first electronic element 13. With regard to the second substrate 20, "being spaced apart from the first substrate 10 and the first electronic element 13" means that the second substrate 20 is not in direct contact with the first substrate 10 or the first electronic element 13.

[0018] The second substrate 20 is a substrate on which a second heat dissipation member 22 is disposed on one surface and a second electronic element 23 is disposed on the other surface. A ceramic substrate can be used as the second substrate 20, and preferably a substrate (e.g., a DCB substrate) having a structure in which copper plates are disposed on both surfaces of a ceramic plate can be used. When a DCB substrate is used as the second substrate 20, the copper plate disposed on one surface can be used as the second heat dissipation member 22. The second heat dissipation member 22 is exposed to the outside of the mold resin 40 (see FIG. 2). The second substrate 20 includes wiring 21 (see FIG. 3), and the wiring 21 is electrically connected to the electrodes of the second electronic element 23.

[0019] In a plan view, the second substrate 20 has a protruding portion 25 that protrudes outward from the outer periphery of the first substrate 10. Here, the protruding portion 25 refers to the portion of the second substrate 20 that protrudes from the outer periphery of the first substrate 10 when the electronic module 1 is viewed in a plan view. The protruding portion 25 is preferably formed from a ceramic substrate.

[0020] The shape of the protruding portions 25 and the number of protruding portions 25 provided on the second substrate 20 can be determined as appropriate as long as the second substrate 20 can be stably supported during the assembly of the electronic module 1. Here, stably supporting the second substrate 20 includes not only the case where the second substrate 20 is supported by the protruding portions 25, but also the case where the second substrate 20 is supported by the protruding portions 25 and the internal connection terminals 35.

[0021] Hereinafter, variations of the protruding portion 25 in the electronic module 1 will be described with reference to FIG.

[0022] In the electronic module 1 according to the embodiment, the second substrate 20 is larger than the first substrate 10 in the longitudinal direction (the up-down direction in the figure) and the lateral direction (the left-right direction in the figure) (see FIG. 4(a)). Therefore, when the first substrate 10 and the second substrate 20 are stacked so that their centers of gravity are aligned, the entire periphery of the second substrate 20 is positioned outside the periphery of the first substrate 10, forming a protruding portion 25.

[0023] In the first modified example, the second substrate 20 is formed to be longer than the first substrate 10 in the short-side direction (left-right direction in the figure) and to be the same length as the first substrate 10 in the long-side direction (up-down direction in the figure) (see FIG. 4(b)). Therefore, when the first substrate 10 and the second substrate 20 are stacked in the height direction so that the positions of their centers of gravity are aligned, the second substrate 20 has protruding portions 25 that protrude outward beyond the outer periphery of the first substrate 10, which are formed on the left and right sides of the second substrate 20 in the figure.

[0024] The outer shapes of the first substrate 10 and the second substrate 20 are not limited to rectangular. One or both of the first substrate 10 and the second substrate 20 may have a shape other than rectangular. For example, in a second modified example shown in FIG. 4(c), the outer periphery of the second substrate 20 partially protrudes beyond the outer periphery of the first substrate 10 in a plan view, forming protruding portions 25. In the second modified example, the protruding portions 25 are formed in five locations in FIG. 4(c): two on the left, one from top to right, one on the right, and one from right to bottom of the second substrate 20.

[0025] The above-described shape of the protruding portion 25 and the position where the protruding portion 25 is provided are merely examples and are not limited to the above-described shape, etc. By having the protruding portion 25 formed on the second substrate 20 protruding outward from the outer periphery of the first substrate 10, it is possible to obtain the effect that the first substrate 10 and the second substrate 20 can be mounted with high precision in the height direction.

[0026] The second electronic element 23 is an electronic element disposed on the second substrate 20. The second electronic element 23 is disposed on the first substrate 10 side of the second substrate 20, and is sealed with a mold resin 40. The second electronic element 23 has electrodes, and is electrically connected to the wiring 21 provided on the second substrate 20 and the internal connection terminals 36. An example of the second electronic element 23 is a vertical MOSFET.

[0027] The internal connection terminals 36 are disposed between the first substrate 10 and the second substrate 20. The internal connection terminals 36 are configured as columnar members and function as members for adjusting the height of the second substrate 20 relative to the first substrate 10. One end of the internal connection terminals 36 is disposed on the first substrate 10 or the first electronic element 13 disposed on the first substrate 10 via a bonding material (e.g., solder). The other end of the internal connection terminals 36 is disposed on the second substrate 20 or the second electronic element 23 disposed on the second substrate 20 via a bonding material (e.g., solder).

[0028] The internal connection terminals 36 are also components used for electrical communication in the electronic module 1. One end of the internal connection terminals 36 is electrically connected to the wiring 11 of the first substrate 10 or the electrode of the first electronic element 13. The other end of the internal connection terminals 36 is electrically connected to the wiring 21 of the second substrate 20 or the electrode of the second electronic element 23. Furthermore, the internal connection terminals 36 are electrically connected to the first external connection terminals 32 or the second external connection terminals 34. It is preferable to select the cross-sectional area and material of the internal connection terminals 36, as well as the number of internal connection terminals 36 to be used, taking into consideration the amount of current flowing through them.

[0029] The first external connection terminal 32 is a terminal that connects the wiring 11 of the first substrate 10, the electrodes of the first electronic element 13, the wiring 21 of the second substrate 20, or the electrodes of the second electronic element 23 to the outside of the electronic module 1 via the internal connection terminal 36. The first external connection terminal 32 is a power terminal that can handle large currents. At least one end of the first external connection terminal 32 is exposed to the outside of the mold resin 40, and is configured to be connectable to an external terminal (not shown).

[0030] The second external connection terminals 34 are terminals that connect the wiring 11 of the first substrate 10, the electrodes of the first electronic elements 13, the wiring 21 of the second substrate 20, or the electrodes of the second electronic elements 23 to the outside of the electronic module 1 via the internal connection terminals 36. The second external connection terminals 34 are electrically connected to the internal connection terminals 36 between the first substrate 10 and the second substrate 20. At least one end of the second external connection terminals 34 is exposed to the outside of the molded resin 40, and is configured to be connectable to an external terminal (not shown).

[0031] The mold resin 40 seals the surface of the first substrate 10 on which the first electronic element 13 is arranged and the first electronic element 13 (see FIG. 2). The mold resin 40 also seals the surface of the second substrate 20 on which the second electronic element 23 is arranged and the second electronic element 23.

[0032] 2. Manufacturing method of electronic module A method for manufacturing the electronic module 1 of the embodiment will be described.

[0033] 2.1. Assembly jig The electronic module 1 according to the embodiment is manufactured by using an assembly jig 50 to arrange the first substrate 10, the internal connection terminals 36, the first external connection terminals 32, the second external connection terminals 34, and the second substrate 20 in the vertical direction.

[0034] An assembly jig 50 that can be used when manufacturing the electronic module 1 has a first mounting portion 52, an upright portion 53, a second mounting portion 54, and a wall 55, as shown in FIG. The first mounting portion 52 is a flat surface formed on the assembly jig 50, and is a mounting portion on which the first substrate 10 is placed. In Fig. 5, the first mounting portion 52 is shown as an area surrounded by solid and dotted lines. By placing the first substrate 10 on the first mounting portion 52, the height of the first substrate 10 can be adjusted using the surface on which the first mounting portion 52 is formed as a reference plane.

[0035] Standing portions 53 are arranged around the first mounting portion 52. Five standing portions 53 are arranged in the assembly jig 50 shown in Fig. 5. Furthermore, each standing portion 53 is arranged so as to contact the boundary between the first mounting portion 52 and the area outside the first mounting portion 52 in a plan view. This makes it possible to restrict free movement of the first substrate 10 in the in-plane direction when the first substrate 10 is placed on the first mounting portion 52, and to align the first substrate 10 in the in-plane direction.

[0036] The standing portion 53 is disposed in the electronic module 1 so as to avoid the positions where the first external connection terminal 32 and the second external connection terminal 34 are disposed.

[0037] The standing portion 53 has a second mounting portion 54. The second mounting portion 54 is a mounting portion that engages the protruding portion 25 of the second substrate 20 when determining the height of the second substrate 20. The second mounting portion 54 is formed on the surface of the standing portion 53 that faces the first mounting portion 52. The second mounting portion 54 is disposed at a position corresponding to the protruding portion 25 of the second substrate 20 when the second substrate 20 is placed on the assembly jig 50. The second mounting portion 54 is disposed at a position having a predetermined height with respect to the first mounting portion 52. When the second substrate 20 is placed on the second mounting portion 54, the protruding portion 25 is engaged with the second mounting portion 54, thereby enabling the second substrate 20 to be mounted with high precision in the height direction relative to the reference surface of the first mounting portion 52.

[0038] The erected portion 53 has a wall 55. The wall 55 is disposed at a position that restricts free movement of the second substrate 20 in the in-plane direction when the protruding portion 25 is engaged with the second mounting portion 54. This allows the second substrate 20 to be aligned in the in-plane direction when the second substrate 20 is mounted on the second mounting portion 54.

[0039] 2.2. Manufacturing method of electronic modules Next, a method for manufacturing the electronic module will be described with reference to FIG.

[0040] The manufacturing method of the electronic module 1 includes a first substrate placing step of placing the first substrate 10 on the first placing portion 52 of an assembly jig 50, which has a first placing portion 52 for placing the first substrate 10 on which the first electronic element 13 is arranged and a second placing portion 54 for placing the second substrate 20 on which the second electronic element 23 is arranged; an internal connection terminal placing step of placing one end of the internal connection terminal 36 on the first substrate 10; and a second substrate placing step of placing the second substrate 20 on the other end of the internal connection terminal 36 and on the second placing portion 54.

[0041] Furthermore, in the manufacturing method of the electronic module 1, the second substrate 20 has, in a plan view, a protruding portion 25 that protrudes outward from the outer periphery of the first substrate 10 when assembled into the electronic module 1. The second substrate 20 is placed on the second placing portion 54 by engaging the protruding portion 25 with the second placing portion 54.

[0042] Furthermore, in the manufacturing method of the electronic module 1, the second mounting portion 54 is disposed at a predetermined height from the first mounting portion 52. In addition, the second mounting portion 54 is disposed at a position where the protruding portion 25 can be engaged in a plan view.

[0043] The method for manufacturing the electronic module 1 will now be described in detail. An assembly jig 50 is prepared. As shown in FIGS. 5 and 6, the assembly jig 50 that can be used in the manufacturing method of the electronic module 1 includes a first mounting portion 52 on which the first substrate 10 is placed, an upright portion 53, and a second mounting portion 54 on which the second substrate 20 is placed.

[0044] The standing portion 53 is disposed at a position that allows the first substrate 10 to pass over it from above when the first substrate 10 is placed on the first mounting portion 52. The second mounting portion 54 is disposed on the standing portion 53, and is disposed at a predetermined height with respect to the first mounting portion 52. Furthermore, the second mounting portion 54 is disposed at a position that allows the protruding portion 25 of the second substrate 20 to be engaged therewith in a plan view.

[0045] 6(a), in the first substrate placing step, the first substrate 10 is placed on the first placing portion 52 of the assembly jig 50. When the first substrate 10 is placed on the first placing portion 52, the standing portions 53 including the second placing portion 54 are arranged in a position where the first substrate 10 can pass through in a plan view. Therefore, the first substrate 10 can be placed on the first placing portion 52 by passing between the standing portions 53.

[0046] The first substrate 10 is placed so that the surface on which the first heat dissipation member 12 is arranged abuts against the first mounting portion 52. This allows the height of the surface of the first substrate 10 on which the first heat dissipation member 12 is arranged to be aligned with the height of the reference surface of the first mounting portion 52. In addition, the outer periphery of the first substrate 10 abuts against the inner periphery of the erect portion 53 of the assembly jig 50. This makes it possible to restrict free movement of the first substrate 10 in the in-plane direction. As a result, the first substrate 10 can be aligned in the in-plane direction.

[0047] 6(b), in the internal connection terminal installation step, the internal connection terminal 36 is erected on the first substrate 10. Subsequently, the first external connection terminal 32 and the second external connection terminal 34 are arranged. Alternatively, instead of the above step, the internal connection terminal 36 is inserted into a hole formed in the first external connection terminal 32 or the second external connection terminal 34 to create an assembly of the internal connection terminal 36 and the first external connection terminal 32 and / or the second external connection terminal 34. Furthermore, the assembly of the internal connection terminal 36 and the first external connection terminal 32 and / or the second external connection terminal 34 may be arranged on the first substrate 10.

[0048] In the second substrate placement step, as shown in FIG. 6(c), the second substrate 20 is placed on the other end of the internal connection terminal 36 and the second mounting portion 54, with the second electronic element 23 (see FIG. 3) disposed thereon. The second substrate 20 has a protruding portion 25. The second substrate 20 can be placed on the second mounting portion 54 by engaging the protruding portion 25 with the second mounting portion 54. This allows the height of the second substrate 20 to be adjusted based on the height of the first mounting portion 52.

[0049] In addition, the outer periphery of the second substrate 20 is abutted against the wall 55. This restricts free movement of the second substrate 20 in the in-plane direction when the second substrate 20 is placed on the second placement portion 54. As a result, the second substrate 20 can be aligned in the in-plane direction.

[0050] After the second substrate 20 is placed, it is sealed with mold resin 40 to complete the electronic module 1. The sealing is performed by sealing the surface of the first substrate 10 on which the first electronic element 13 is arranged and the first electronic element 13 with the mold resin 40. The mold resin 40 also seals the surface of the second substrate 20 on which the second electronic element 23 is arranged and the second electronic element 23.

[0051] The effects of the electronic module 1 according to the embodiment will be described below.

[0052] The electronic module 1 according to the embodiment has a first substrate 10, a second substrate 20, and internal connection terminals 36 that connect the first substrate 10 and the second substrate 20. The second substrate 20 has a protruding portion 25 that protrudes outward from the outer periphery of the first substrate 10 in a plan view. According to the electronic module 1, the first substrate 10 and the second substrate 20 can be mounted with high precision in the height direction using the heat dissipation surface of the first substrate 10 and the protruding portion 25 of the second substrate 20. This makes it possible to provide an electronic module 1 with excellent heat dissipation characteristics.

[0053] In the electronic module 1 according to the embodiment, the second substrate 20 includes a ceramic substrate and a second heat dissipation member 22 formed on one surface of the ceramic substrate, and the protruding portion 25 is formed from the ceramic substrate. By using a ceramic substrate as the second substrate 20, the first substrate 10 and the second substrate 20 can be mounted with high accuracy in the height direction, and the heat dissipation characteristics from the second substrate 20 side can be improved. Furthermore, by forming the second heat dissipation member 22 on the surface of the second substrate 20, the heat dissipation characteristics can be further improved. This makes it possible to provide an electronic module 1 with excellent heat dissipation characteristics.

[0054] In the electronic module 1 according to the embodiment, the first substrate 10 includes a ceramic substrate and a first heat dissipation member 12 formed on one surface of the ceramic substrate. By using a ceramic substrate as the first substrate 10, the first substrate 10 and the second substrate 20 can be mounted with high accuracy in the height direction, and the heat dissipation characteristics from the first substrate 10 side can be improved. Furthermore, by forming the first heat dissipation member 12 on one surface of the first substrate 10, the heat dissipation characteristics can be further improved. This makes it possible to provide an electronic module 1 with excellent heat dissipation characteristics.

[0055] The electronic module 1 according to the embodiment further includes a first external connection terminal 32 and / or a second external connection terminal 34, and the internal connection terminal 36 is inserted into the first external connection terminal 32 and / or the second external connection terminal 34. By accurately controlling the length of the internal connection terminal 36, the first substrate 10 and the second substrate 20 can be mounted with high precision in the height direction. Furthermore, the first electronic element 13 or the second electronic element 23 can be electrically connected to the first external connection terminal 32 or the second external connection terminal 34.

[0056] A manufacturing method for an electronic module 1 according to an embodiment includes a first substrate mounting step of mounting the first substrate 10 on the first mounting portion 52 of an assembly jig 50, the assembly jig 50 having a first mounting portion 52 for mounting the first substrate 10 and a second mounting portion 54 for mounting the second substrate 20, and a second substrate mounting step of mounting the second substrate 20 on the second mounting portion 54. When assembled into the electronic module 1, the second substrate 20 has a protruding portion 25 that protrudes outward from the outer periphery of the first substrate 10 in a planar view. The second mounting portion 54 is disposed at a predetermined height from the first mounting portion 52 and is disposed in a position where the protruding portion 25 can be engaged in a planar view. This allows the first substrate 10 and the second substrate 20 to be mounted with high accuracy in the height direction. According to the present invention, a manufacturing method for an electronic module 1 having heat dissipation surfaces on both sides can be provided, whereby the heat dissipation surfaces are mounted with high mounting accuracy in the height direction, resulting in excellent heat dissipation characteristics.

[0057] Although the present invention has been described above based on the above embodiment, the present invention is not limited to the above embodiment and can be embodied in various forms without departing from the spirit of the present invention, and for example, the following modifications are also possible.

[0058] (1) The shape, number, size, position, etc. of the components of the present invention are not limited to those described above or shown in the drawings, and may be modified as appropriate as long as the characteristics of the present invention are not impaired.

[0059] For example, in the above embodiment, the number of first electronic elements 13 and the number of second electronic elements 23 are one each, but the present invention is not limited to this. The number of first electronic elements 13 and the number of second electronic elements 23 may be plural.

[0060] (2) The electronic module of the present invention may further include electronic elements, structures, etc. other than the first electronic element 13 on the first substrate 10. Also, the electronic module may further include electronic elements, structures, etc. other than the second electronic element 23 on the second substrate 20.

[0061] (3) In the electronic module of the present invention, electronic elements other than MOSFETs (for example, various diodes, transistors other than vertical MOSFETs, and thyristors) can also be used as the first electronic element 13. The same applies to the second electronic element 23. [Explanation of symbols]

[0062] REFERENCE SIGNS LIST 1...electronic module, 10...first substrate, 12...first heat dissipation member, 13...first electronic element, 20...second substrate, 22...second heat dissipation member, 23...first electronic element, 25...extension portion, 32...first external connection terminal, 34...second external connection terminal, 36...internal connection terminal, 40...molded resin, 50...assembly jig, 52...first mounting portion, 53...standing portion, 54...second mounting portion, 55...wall

Claims

1. a first substrate; a first electronic element disposed on the first substrate; A second substrate; a second electronic element disposed on the second substrate; an internal connection terminal disposed between the first substrate and the second substrate, The electronic module is characterized in that the second substrate has a protruding portion that protrudes outward from the outer periphery of the first substrate in a plan view.

2. the second substrate has a ceramic substrate and a heat dissipation member formed on one surface of the ceramic substrate, 2. The electronic module of claim 1, wherein the protrusion is formed from the ceramic substrate.

3. 3. The electronic module according to claim 2, wherein the first substrate comprises a ceramic substrate and a heat dissipation member formed on one surface of the ceramic substrate.

4. Further provided with an external connection terminal, 4. The electronic module according to claim 1, wherein the internal connection terminals are inserted into the external connection terminals.

5. a first substrate placing step of placing the first substrate on the first placing portion of an assembly jig, the assembly jig including a first placing portion for placing a first substrate on which a first electronic element is arranged and a second placing portion for placing a second substrate on which a second electronic element is arranged; an internal connection terminal arranging step of arranging one end of an internal connection terminal on the first substrate; a second substrate mounting step of mounting the second substrate on the other end of the internal connection terminal and the second mounting portion, the second substrate has a protruding portion that protrudes outward from an outer periphery of the first substrate in a plan view when assembled into the electronic module; the second substrate is placed on the second placement section by the overhanging portion being locked to the second placement section, A method for manufacturing an electronic module, characterized in that the second mounting portion is positioned at a predetermined height from the first mounting portion and is positioned in a position where the engaging portion can be engaged in a planar view.

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