Electronic module

Abstract

To provide an electronic module capable of managing as appropriate the distance between a heat release surface disposed on both surfaces of a substrate and an external connection terminal.SOLUTION: An electronic module 1 includes a first substrate 10, a first electronic element 13 disposed on the first substrate 10, a second substrate 20, a second electronic element 23 disposed on the second substrate 20, external connection terminals 32 and 34, and an internal connection terminal 36 inserted through the external connection terminals 32 and 34 and fixing the external connection terminals 32 and 34 at a predetermined position between the first substrate 10 and the second substrate 20. An internal connection terminal 36 is disposed between the first substrate 10 and the second substrate 20 or the second electronic element 23 or between the first electronic element 13 and the second substrate 20 or the second electronic element 23.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an electronic module. [Background technology]

[0002] Conventionally, there have been electronic modules in which heat dissipation surfaces are arranged on both sides of the electronic module, and heat is dissipated from both sides of the electronic module. Patent Document 1 describes an electronic module (semiconductor device) 900 including an electronic element (semiconductor element) 910, a pair of substrates 920 and 930 arranged to sandwich the electronic element 910, and a conductive spacer 940 interposed between the substrates 930 and the electronic element 910 (see FIG. 7 ). The substrates 920 and 930 have insulating base materials 921 and 931, front surface metal bodies 922 and 932 connected to corresponding electrodes, and heat dissipation members (rear surface metal bodies) 923 and 933. Heat generated in the electronic element 910 is dissipated from both sides of the electronic module 900 through the conductive spacer 940, the front surface metal bodies 922 and 932, and the heat dissipation members 923 and 933. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-181822

[0004] Incidentally, when the electronic module 900 is an electronic module that handles high voltage, in order to ensure an insulating distance between the heat dissipation members 923, 933 arranged on both sides of the electronic module 900 and the external connection terminals (power supply terminals, output terminals) 941, 942, it is desirable to arrange the external connection terminals 941, 942 at a midpoint in the thickness direction of the heat dissipation members 923, 933 arranged on both sides.

[0005] When the external connection terminals 941, 942 are arranged at a midpoint in the thickness direction of the heat dissipation members 923, 933 arranged on both sides of the electronic module 900, methods for electrically connecting the external connection terminals 941, 942 to the wiring (not shown) formed on the electronic element 910 or the substrates 920, 930 include bending the external connection terminal 941 in the direction in which the substrate 930 is arranged and connecting it to the wiring formed on the substrate 930, as shown in Figure 7, or increasing the thickness of the substrate 920 to ensure an insulating distance between the external connection terminals 941, 942 and the heat dissipation surface.

[0006] However, with the method of bending the external connection terminals 941, it is not easy to control the distance between the external connection terminals 941 and the substrate 930, and there are cases where it is not possible to ensure an insulating distance between the external connection terminals 941 and the wiring arranged on the substrate 930. Furthermore, there are cases where the external connection terminals 941 come into contact with other electronic elements arranged on the substrate 930 at the portions where the external connection terminals 941 are bent. On the other hand, with the method of thickening the substrate 920, it is possible to ensure an insulating distance between the heat dissipation member 923 and the external connection terminals 942, but there is a problem in that it may be difficult to maintain an insulating distance between the wiring (not shown) and the external connection terminals 941. Summary of the Invention [Problem to be solved by the invention]

[0007] Therefore, the present invention has been made in consideration of the above-mentioned problems, and aims to provide an electronic module that has heat dissipation surfaces on both sides of the electronic module and external connection terminals arranged between a first substrate and a second substrate, and that is capable of appropriately managing the distance between the heat dissipation surfaces arranged on both sides of the substrate and the external connection terminals. [Means for solving the problem]

[0008] The electronic module of the present invention comprises a first substrate, a first electronic element arranged on the first substrate, a second substrate, a second electronic element arranged on the second substrate, an external connection terminal, and an internal connection terminal inserted into the external connection terminal and supporting the external connection terminal at a predetermined position between the first substrate and the second substrate, wherein the internal connection terminal is arranged between the first substrate and the second substrate or the second electronic element, or between the first electronic element and the second substrate or the second electronic element. [Effects of the Invention]

[0009] The electronic module of the present invention includes a first substrate, a second substrate, external connection terminals, and internal connection terminals inserted into the external connection terminals. The internal connection terminals are inserted into the external connection terminals and fix the external connection terminals at predetermined positions between the first substrate and the second substrate. In the electronic module of the present invention, the distance between the first substrate and the second substrate is regulated by the length of the internal connection terminals. Therefore, by controlling the length of the internal connection terminals, the distance between the first substrate and the second substrate can be appropriately controlled without bending the external connection terminals or using a thick substrate. Furthermore, because the external connection terminals are fixed at predetermined positions between the first substrate and the second substrate by the internal connection terminals, the distance between the first substrate and the external connection terminals and the distance between the second substrate and the external connection terminals can also be appropriately controlled. According to the present invention, an electronic module can be provided that has heat dissipation surfaces on both sides of the substrate and has external connection terminals arranged between the first substrate and the second substrate, allowing the distance between the heat dissipation surfaces arranged on both sides of the substrates and the external connection terminals to be appropriately controlled. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view of an electronic module 1 according to an embodiment, and in FIG. 1, among the components of the electronic module 1, the mold resin 40 is not shown. [Figure 2] 1 is an external view of an electronic module 1 according to an embodiment. [Figure 3]3 is a side view illustrating the internal structure of the electronic module 1 according to the embodiment. Note that, among the components of the electronic module 1, the mold resin 40 and the internal connection terminals 36a are not shown in FIG. [Figure 4] 4(a) and 4(b) are plan views illustrating the internal structure of the electronic module 1 according to the embodiment. In FIG. 4(a), the second substrate 20, the second electronic element 23, and the molded resin 40, which are components of the electronic module 1, are omitted. In FIG. 4(b), in addition to the components omitted in FIG. 4(a), some of the internal connection terminals 36c, 36d and the external connection terminals 34a, 34b are omitted. [Figure 5] 5(a) and 5(b) are bottom views illustrating the internal structure of the electronic module 1 according to the embodiment. In FIG. 5(a), the first substrate 10, the first electronic element 13, and the molded resin 40, which are components of the electronic module 1, are omitted. In FIG. 5(b), in addition to the components omitted in FIG. 5(a), some of the internal connection terminals 36b, 36d and the external connection terminals 34a, 34b are also omitted. [Figure 6] 10 is a left side view illustrating creepage distances L3 and L4 of the electronic module 1 according to the embodiment. FIG. [Figure 7] 9A and 9B are diagrams illustrating an electronic module 900 according to the prior art. DETAILED DESCRIPTION OF THE INVENTION

[0011] The electronic module of the present invention will be described below based on the embodiments shown in the drawings. Note that not all of the elements and combinations thereof described in the embodiments are necessarily essential to the solution of the present invention.

[0012] [Embodiment] 1. Electronic Module 1 to 5, the electronic module 1 according to the embodiment includes a first substrate 10, a first heat dissipation member 12, a first electronic element 13, a second substrate 20, a second heat dissipation member 22, a second electronic element 23, external connection terminals 32a and 32b, external connection terminals 34a and 34b, and internal connection terminals 36a, 36b, 36c, and 36d. Note that the electronic module 1 may include other components in addition to those described above. Each component will be described below.

[0013] The first substrate 10 is a substrate having a first heat dissipation member 12, which functions as a heat dissipation surface, arranged on one side, and a first electronic element 13 arranged on the other side (see FIGS. 3 and 4). A ceramic substrate can be used as the first substrate 10, and preferably a substrate (e.g., a DCB substrate) having a structure in which copper plates are arranged on both sides of a ceramic plate can be used. When a DCB substrate is used as the first substrate 10, the copper plate arranged on one side can be used as the first heat dissipation member 12. The first heat dissipation member 12 is exposed to the outside of the mold resin 40. The first substrate 10 has wiring 11 (see FIGS. 3 and 4), and the wiring 11 is electrically connected to an electrode (not shown) arranged on the surface of the first electronic element 13 facing the first substrate 10.

[0014] In this specification, "electrically connected" refers not only to cases where the conductive parts of the components are in direct contact with each other, but also to cases where the components are in contact with each other via another conductive component (for example, solder or a spacer).

[0015] The first electronic element 13 is an electronic element disposed on the first substrate 10. The first electronic element 13 is disposed on the surface of the first substrate 10 facing the second substrate 20, and is sealed with mold resin 40. The first electronic element 13 has an electrode (not shown) disposed on the surface facing the first substrate 10, and electrodes 13a and 13b disposed on the surface facing the second substrate 20. The electrode disposed on the surface facing the first substrate 10 is electrically connected to wiring 11 provided on the first substrate 10. The electrodes 13a and 13b are electrically connected to internal connection terminals 36c and 36d. An example of the first electronic element 13 is a vertical MOSFET.

[0016] The second substrate 20 is a substrate that is disposed on the side of the first substrate 10 where the first electronic element 13 is disposed, while being spaced apart from the first substrate 10 and the first electronic element 13. With regard to the second substrate 20, "being spaced apart from the first substrate 10 and the first electronic element 13" refers to a state in which the second substrate 20 is not in direct contact with the first substrate 10 or the first electronic element 13.

[0017] The second substrate 20 is a substrate having a second heat dissipation member 22, which functions as a heat dissipation surface, arranged on one side thereof, and a second electronic element 23 arranged on the other side thereof. A ceramic substrate can be used as the second substrate 20, and preferably a substrate (e.g., a DCB substrate) having a structure in which copper plates are arranged on both sides of a ceramic plate can be used. When a DCB substrate is used as the second substrate 20, the copper plate arranged on one side thereof can be used as the second heat dissipation member 22. The second heat dissipation member 22 is exposed to the outside of the mold resin 40 (see FIG. 2). The second substrate 20 has wiring 21 (see FIGS. 3 and 5), and the wiring 21 is electrically connected to an electrode (not shown) arranged on the surface of the second electronic element 23 facing the second substrate 20.

[0018] The second electronic element 23 is an electronic element disposed on the second substrate 20. The second electronic element 23 is disposed on the surface of the second substrate 20 facing the first substrate 10, and is sealed with mold resin 40. The second electronic element 23 has an electrode (not shown) disposed on the surface facing the second substrate 20, and electrodes 23a and 23b disposed on the surface facing the first substrate 10. The electrode disposed on the surface facing the second substrate 20 is electrically connected to wiring 21 provided on the second substrate 20. The electrodes 23a and 23b are electrically connected to internal connection terminals 36b and 36d. An example of the second electronic element 23 is a vertical MOSFET.

[0019] The internal connection terminals 36a, 36b, 36c, and 36d (hereinafter, the "internal connection terminals 36a, 36b, 36c, and 36d" may be collectively referred to as "internal connection terminals 36") are columnar connection terminals arranged between the first substrate 10 and the second substrate 20 or the second electronic element 23, or between the first electronic element 13 and the second substrate 20 or the second electronic element 23.

[0020] The internal connection terminals 36 are inserted into holes formed in the external connection terminals 32a, 32b and / or the external connection terminals 34a, 34b, and fix the external connection terminals 32a, 32b and / or the external connection terminals 34a, 34b at predetermined positions between the first substrate 10 and the second substrate 20.

[0021] Specifically, one end of the internal connection terminal 36 is disposed on the first substrate 10 or the first electronic element 13 disposed on the first substrate 10 via a bonding material (for example, solder). The other end of the internal connection terminal 36 is disposed on the second substrate 20 or the second electronic element 23 disposed on the second substrate 20 via a bonding material (for example, solder).

[0022] Here, the internal connection terminals 36 used should have an appropriate length depending on the location where they are to be placed. Specifically, when the internal connection terminal 36 is placed between the first electronic element 13 and the second substrate 20, an internal connection terminal 36 that is shorter in length by the thickness of the first electronic element 13 is used compared to when the internal connection terminal 36 is placed in a location where the first electronic element 13 is not placed.

[0023] Furthermore, when the internal connection terminal 36 is placed between the first substrate 10 and the second electronic element 23, an internal connection terminal 36 that is shorter in length by the thickness of the second electronic element 23 is used compared to when the internal connection terminal 36 is placed in a location where the second electronic element 23 is not placed.

[0024] Furthermore, when the internal connection terminal 36 is placed between the first electronic element 13 and the second electronic element 23, an internal connection terminal 36 that is shorter in length by the thickness of the first electronic element 13 and the second electronic element 23 is used compared to when the internal connection terminal 36 is placed in a location where neither the first electronic element 13 nor the second electronic element 23 is placed.

[0025] In the electronic module 1 shown as the embodiment, the internal connection terminal 36a is arranged between an area of ​​the first substrate 10 where the first electronic element 13 is not arranged and an area of ​​the second substrate 20 where the second electronic element 23 is not arranged. On the other hand, the internal connection terminals 36c and 36d are arranged between the first electronic element 13 and the second substrate 20 (see FIG. 4), and the internal connection terminals 36b and 36d are arranged between the first substrate 10 and the second electronic element 23. The internal connection terminals 36b, 36c, and 36d are formed shorter than the internal connection terminal 36a by the thickness of the first electronic element 13 or the second electronic element 23.

[0026] By using an internal connection terminal 36 of an appropriate length depending on the location where it is to be placed, the distance between the first substrate 10 and the second substrate 20 can be appropriately managed, and the first substrate 10 and the second substrate 20 can be kept parallel to each other.

[0027] The internal connection terminals 36 are components that manage the distance between the first substrate 10 and the second substrate 20 and are also used for electrical communication in the electronic module 1. One end of the internal connection terminals 36 is electrically connected to the wiring 11 of the first substrate 10 or the electrodes 13a, 13b of the first electronic element 13. The other end of the internal connection terminals 36 is electrically connected to the wiring 21 of the second substrate 20 or the electrodes 23a, 23b of the second electronic element 23. Furthermore, the internal connection terminals 36 are electrically connected to the external connection terminals 32 or the external connection terminals 34.

[0028] The internal connection terminal 36 electrically connects the first electronic element 13 to the external connection terminals 34a and 34b. Specifically, the internal connection terminal 36c, one end of which is disposed on the first electronic element 13, electrically connects the electrode 13a of the first electronic element 13 to the external connection terminal 34b, as shown in Figures 4(a) and 4(b). Furthermore, the internal connection terminal 36d electrically connects the electrode 13b of the first electronic element 13 to the external connection terminal 34a.

[0029] The internal connection terminal 36 electrically connects the second electronic element 23 to the external connection terminals 32b, 34a, and 34b. Specifically, the internal connection terminal 36b, one end of which is disposed on the second electronic element 23, electrically connects the electrode 23a of the second electronic element 23 to the external connection terminals 32b and 34b, as shown in Figures 5(a) and 5(b). Furthermore, the internal connection terminal 36d electrically connects the electrode 23b of the second electronic element 23 to the external connection terminal 34a.

[0030] The internal connection terminal 36 may be connected to the wiring 11 of the first substrate 10 and / or the wiring 21 of the second substrate 20. The internal connection terminal 36 may also be connected to the external connection terminals 32, 34. The internal connection terminal 36a of the electronic module 1 is electrically connected to the wiring 11 of the first substrate 10, the wiring 21 of the second substrate 20, and the external connection terminal 32a.

[0031] It is preferable to select the cross-sectional area and material of the internal connection terminals 36, and the number of the internal connection terminals 36 to be used, taking into consideration the amount of current that will flow. For example, in the electronic module 1, the internal connection terminal 36b that electrically connects the electrode 23a of the second electronic element 23 and the external connection terminal 32a has three thick internal connection terminals 36c to accommodate a large current.

[0032] The external connection terminals 32a, 32b (in the following description, the "external connection terminals 32a, 32b" may be collectively referred to as the "external connection terminals 32") are terminals that connect the wiring 11 of the first substrate 10, the electrodes 13a, 13b of the first electronic element 13, the wiring 21 of the second substrate 20, or the electrodes 23a, 23b of the second electronic element 23 to the outside of the electronic module 1 via the internal connection terminals 36.

[0033] The external connection terminal 32 is a power terminal capable of handling a large current. As shown in Fig. 3, a portion of the external connection terminal 32 is disposed in the region between the first substrate 10 and the second substrate 20, extending parallel to the first substrate 10 and the second substrate 20. At least one end of the external connection terminal 32 is exposed to the outside of the molded resin 40, and is configured to be connectable to an external terminal (not shown).

[0034] The external connection terminals 34a, 34b (in the following description, the "external connection terminals 34a, 34b" may be collectively referred to as the "external connection terminals 34". Furthermore, the "external connection terminals 32aa, 32b" and the "external connection terminals 34a, 32b" may be collectively referred to as the "external connection terminals 32, 34") are terminals that connect the wiring 11 of the first substrate 10, the electrodes 13a, 13b of the first electronic element 13, the wiring 21 of the second substrate 20 and / or the electrodes 23a, 23b of the second electronic element 23 to the outside of the electronic module 1 via the internal connection terminals 36.

[0035] The external connection terminal 34 is a terminal that handles a smaller current than the external connection terminal 32. As shown in FIG. 3, a portion of the external connection terminal 34 is disposed in the region between the first substrate 10 and the second substrate 20, extending parallel to the first substrate 10 and the second substrate 20. At least one end of the external connection terminal 34 is exposed to the outside of the molded resin 40, and is configured to be connectable to an external terminal (not shown). Furthermore, the external connection terminal 32 and the external connection terminal 34 may be connected to each other, as shown as the external connection terminal 32b and the external connection terminal 32b in FIG. 5(a).

[0036] Holes are formed in the external connection terminals 32, 34. Internal connection terminals 36 are inserted into the holes. The external connection terminals 32, 34 are fixed at predetermined positions between one end and the other end of the internal connection terminal 36 inserted into the hole. This makes it possible to manage the distances between the first substrate 10, the first electronic element 13, the second substrate 20, and the second electronic element 23 and the external connection terminals 32, 34.

[0037] The length of the internal connection terminal 36 and the position at which the external connection terminals 32, 34 are connected to the internal connection terminal 36 are configured so that the distance between the external connection terminals 32, 34 and the elements of the first substrate 10 and the first electronic element 13 that are located near the external connection terminals 32, 34 is longer than a predetermined insulation distance. Furthermore, the length of the internal connection terminal 36 and the position at which the external connection terminals 32, 34 are connected to the internal connection terminal 36 are configured so that the distance between the external connection terminals 32, 34 and the elements of the second substrate 20 and the second electronic element 23 that are located near the external connection terminals is longer than a predetermined insulation distance.

[0038] Specifically, the length of the internal connection terminals 36 and the positions at which the external connection terminals 32, 34 are connected to the internal connection terminals 36 are configured so that the distance between the external connection terminals 32, 34 and elements of the first substrate 10 and the first electronic element 13 that are located near the external connection terminals 32, 34 is longer than the insulation distance. Also, the length of the internal connection terminals 36 and the positions at which the external connection terminals 32, 34 are connected to the internal connection terminals 36 are configured so that the distance between the external connection terminals 32, 34 and elements of the second substrate 20 and the second electronic element 23 that are located near the external connection terminals 32, 34 is longer than the insulation distance.

[0039] The distance between the first substrate 10 and the external connection terminals 32, 34, and the distance between the first electronic element 13 and the external connection terminals 32, 34 can be adjusted by adjusting the length of the internal connection terminals 36 arranged between the first substrate 10 or the first electronic element 13 and the external connection terminals 32, 34, and the position at which the external connection terminals 32, 34 are connected to the internal connection terminals 36.

[0040] In addition, the distance between the second substrate 20 and the external connection terminals 32, 34, and the distance between the second electronic element 23 and the external connection terminals 32, 34 can be adjusted by adjusting the length of the internal connection terminals 36 arranged between the second substrate 20 or the second electronic element 23 and the external connection terminals 32, 34, and the position at which the external connection terminals 32, 34 are connected to the internal connection terminals 36.

[0041] In the electronic module 1 according to the embodiment, the first electronic element 13 is disposed at a position closer to the external connection terminals 32, 34 than the first substrate 10. The distance between the first electronic element 13 and the external connection terminals 32, 34 is L1. Furthermore, the second electronic element 23 is disposed at a position closer to the external connection terminals 32, 34 than the second substrate 20. The distance between the second electronic element 23 and the external connection terminals 32, 34 is L2 (see FIG. 3).

[0042] The distance L1 between the first electronic element 13 and the external connection terminals 32, 34 is configured to be longer than the insulation distance. The distance L2 between the second electronic element 23 and the external connection terminals 32, 34 is configured to be longer than the insulation distance. Here, the insulation distance is a distance that does not cause a short circuit between the external connection terminals 32, 34 and the first substrate 10 or the second substrate 20.

[0043] By configuring the distance L1 between the first electronic element 13 and the external connection terminals 32, 34 and the distance L2 between the second electronic element 23 and the external connection terminals 32, 34 to be longer than the insulation distance, it is possible to prevent short circuits from occurring between the external connection terminals 32, 34 and the first electronic element 13, and between the external connection terminals 32, 34 and the second electronic element 23.

[0044] If the first substrate 10 is positioned closer to the external connection terminals 32, 34 than the first electronic element 13, by replacing the first electronic element 13 in the above description with the first substrate 10, an electronic module 1 can be obtained that can prevent short circuits from occurring between the external connection terminals 32, 34 and the first substrate 10.

[0045] If the second substrate 20 is positioned closer to the external connection terminals 32, 34 than the second electronic element 23, by replacing the second electronic element 23 in the above description with the second substrate 20, an electronic module 1 can be obtained that can prevent short circuits from occurring between the external connection terminals 32, 34 and the second substrate 20.

[0046] The mold resin 40 seals the surface of the first substrate 10 on which the first electronic element 13 is arranged and the first electronic element 13 (see FIG. 2). The mold resin 40 also seals the surface of the second substrate 20 on which the second electronic element 23 is arranged and the second electronic element 23.

[0047] The heat dissipation surface of the first substrate 10, ie, the surface on which the first heat dissipation member 12 is arranged, and the heat dissipation surface of the second substrate 20, ie, the surface on which the second heat dissipation member 22 is arranged, are exposed from the mold resin 40.

[0048] The molding resin 40 has a first recessed portion 41 and a second recessed portion 42.

[0049] In the electronic module 1, the first recess 41 is provided on the surface 43 (see Figure 6) of the molded resin 40 where the first heat dissipation member 12 is exposed, between the boundary between the part where the first heat dissipation member 12 is exposed and the part where the first heat dissipation member 12 is covered by the molded resin 40, and the outer edge that forms the outer shape of the resin mold 40 in the direction in which the external connection terminal 32 or the external connection terminal 34 extends.

[0050] In the electronic module 1, the second recessed portion 42 is provided on the surface 44 (see Figures 2 and 6) of the molded resin 40 where the second heat dissipation member 22 is exposed, between the boundary between the part where the second heat dissipation member 22 is exposed and the part where the second heat dissipation member 22 is covered by the molded resin 40, and the outer edge that forms the outer shape of the resin mold 40 in the direction in which the external connection terminal 32 or the external connection terminal 34 extends.

[0051] 2 and 6, the first recess 41 is formed by hollowing out (digging down) a surface 43 of the electronic module 1 where the first heat dissipation member 12 is exposed from the molded resin 40. The second recess 42 is formed by hollowing out a surface 44 of the electronic module 1 where the second heat dissipation member 22 is exposed from the molded resin 40.

[0052] As shown in FIG. 2, the first recessed portion 41 and / or the second recessed portion 42 may be formed by recessing the entire circumference of the molded resin 50, so that the first recessed portion 41 and the second recessed portion 42 are joined together, and the molded resin 40 is formed into a narrowed shape.

[0053] The first recess 41 is configured so that the distance L3 along the outer surface of the molded resin 50 between the external connection terminals 32, 34 and the first heat dissipation member 12 (hereinafter, the "distance L3 along the outer surface of the molded resin 50 between the external connection terminals 32, 34 and the first heat dissipation member 12" will be referred to as the "creeping distance L3") is longer than the specified insulation distance.

[0054] The second recess 42 is configured so that the distance L4 along the outer surface of the molded resin 50 between the external connection terminals 32, 34 and the first heat dissipation member 12 (hereinafter, the "distance L4 along the outer surface of the molded resin 50 between the external connection terminals 32, 34 and the second heat dissipation member 22" will be referred to as the "creeping distance L4") is longer than the specified insulation distance.

[0055] This makes it possible to prevent short circuits on the surface (along the outer surface) of the molded resin 40 between the first heat dissipation member 12 and the external connection terminals 32, 34. Also, it is possible to prevent short circuits on the surface of the molded resin 40 between the second heat dissipation member 22 and the external connection terminals 32, 34.

[0056] Furthermore, the external connection terminals 32, 34 are disposed at the midpoint in the thickness direction between the first heat dissipation member 12 disposed on the first substrate 10 and the second heat dissipation member 22 disposed on the second substrate 20. That is, as shown in Fig. 6, the external connection terminals 32, 34 are disposed at positions where the creepage distance L3 between the external connection terminals 32, 34 and the first heat dissipation member 12 is the same as the creepage distance L4 between the external connection terminals 32, 34 and the second heat dissipation member 22.

[0057] This makes it possible to reduce the thickness of the electronic module 1 while preventing short circuits, provided that the condition that the creepage distance L3 between the external connection terminals 32, 34 and the first heat dissipation member 12, and the creepage distance L4 between the external connection terminals 32, 34 and the second heat dissipation member 22 is longer than the insulation distance is met.

[0058] Here, when the thickness of the external connection terminals 32, 34 is not uniform, "positioning the external connection terminals 32, 34 at the midpoint in the thickness direction between the first heat dissipation member 12 and the second heat dissipation member 22" means that the thickest external connection terminal 32, 34 that affects the determination of the insulation distance is positioned at the midpoint in the thickness direction between the first heat dissipation member 12 and the second heat dissipation member 22.

[0059] It is also preferable to select the cross-sectional area (width, thickness) of the external connection terminals 32, 34 in consideration of the amount of current that flows.

[0060] The effects achieved by the electronic module 1 according to the embodiment will be described below.

[0061] The electronic module 1 according to the embodiment includes a first substrate 10, a second substrate 20, external connection terminals 32, 34, and an internal connection terminal 36 inserted into the external connection terminals 32, 34. The internal connection terminal 36 is inserted into the external connection terminals 32, 34 and fixes the external connection terminals 32, 34 at predetermined positions between the first substrate 10 and the second substrate 20. In the electronic module 1 according to the embodiment, the distance between the first substrate 10 and the second substrate 20 is restricted by the length of the internal connection terminal 36. Therefore, by controlling the length of the internal connection terminal 36, the distance between the first substrate 10 and the second substrate 20 can be controlled without bending the external connection terminals 32, 34 or using a thick substrate. Furthermore, because the external connection terminals 32, 34 are fixed at predetermined positions between the first substrate 10 and the second substrate by the internal connection terminals 36, it is possible to appropriately control the distance between the first substrate 10 and the external connection terminals 32, 34 and the distance between the second substrate 20 and the external connection terminals 32, 34. According to the electronic module 1 according to the embodiment, in the electronic module 1 having heat dissipation surfaces on both sides thereof and in which the external connection terminals 32, 34 are arranged between the first substrate 10 and the second substrate 20, it is possible to provide an electronic module 1 that allows appropriate control of the distance between the first substrate 10 and the external connection terminals 32, 34 and the distance between the second substrate 20 and the external connection terminals 32, 34.

[0062] In the electronic module 1 according to the embodiment, the internal connection terminal 36 electrically connects the first electronic element 13 to the external connection terminals 32, 34. According to the electronic module 1 according to the embodiment, a current can be passed from the external connection terminals 32, 34 to the first electronic element 13 through the internal connection terminal 36.

[0063] In the electronic module 1 according to the embodiment, the internal connection terminal 36 electrically connects the second electronic element 23 to the external connection terminals 32, 34. According to the electronic module 1 according to the embodiment, a current can be passed from the external connection terminals 32, 34 to the second electronic element 23 through the internal connection terminal 36.

[0064] In the electronic module 1 according to the embodiment, the length of the internal connection terminal 36 and the position at which the external connection terminals 32, 34 are connected to the internal connection terminal 36 are configured so that the distance between the external connection terminals 32, 34 and the elements of the first substrate 10 and the first electronic element 13 that are located near the external connection terminals 32, 34 is longer than a predetermined insulation distance, and the distance between the external connection terminals 32, 34 and the elements of the second substrate 20 and the second electronic element 23 that are located near the external connection terminals 32, 34 is longer than the predetermined insulation distance. This makes it possible to prevent short circuits from occurring between the external connection terminals 32, 34 and the first substrate 10 and the second substrate 20, and results in a highly reliable electronic module 1.

[0065] The electronic module 1 according to the embodiment further includes a molded resin 40, and the first electronic element 13, the surface of the first substrate 10 on which the first electronic element 13 is arranged, the second electronic element 23, and the surface of the second substrate 20 on which the second electronic element 23 is arranged are sealed with the molded resin 40, and the heat dissipation surface of the first substrate 10 and the heat dissipation surface of the second substrate 20 are exposed from the molded resin 40. The electronic module 1 can increase the insulation voltage without impairing the heat dissipation characteristics, and can also improve the reliability of the electronic module 1.

[0066] 6, the electronic module 1 according to the embodiment further includes a first recess 41 disposed on a surface 43 where the first heat dissipation member 12 is exposed from the molded resin 40, and a second recess 42 disposed on a surface 44 where the second heat dissipation member 22 is exposed from the molded resin 40. The first recess 41 is configured so that the creepage distance L3 along the outer surface of the molded resin 40 between the external connection terminals 32, 34 and the first heat dissipation member 12 is longer than a predetermined insulation distance. The second recess 42 is configured so that the creepage distance L4 along the outer surface of the molded resin 40 between the external connection terminals 32, 34 and the second heat dissipation member 22 is longer than the predetermined insulation distance. This allows the edge distances L3, L4 to be longer than when the recesses 41, 42 are not present. As a result, it is possible to prevent short circuits from occurring along the surface of the mold resin 40 between the first heat dissipation member 12 and the external connection terminals 32, 34, and between the second heat dissipation member 22 and the external connection terminals 32, 34.

[0067] Although the present invention has been described above based on the above embodiment, the present invention is not limited to the above embodiment and can be embodied in various forms without departing from the spirit of the present invention, and for example, the following modifications are also possible.

[0068] (1) The shape, number, size, position, etc. of the components of the present invention are not limited to those described above or shown in the drawings, and may be modified as appropriate as long as the characteristics of the present invention are not impaired.

[0069] For example, in the above embodiment, the number of first electronic elements 13 and second electronic elements 23 is one each, but the present invention is not limited to this. There may be a plurality of first electronic elements 13 and second electronic elements 23. Alternatively, the electronic elements may be disposed on only one of the first substrate 10 and the second substrate 20.

[0070] (2) The electronic module of the present invention may further include electronic elements, structures, etc. other than the first electronic element 13 on the first substrate 10. Also, the electronic module may further include electronic elements, structures, etc. other than the second electronic element 23 on the second substrate 20.

[0071] (3) In the electronic module of the present invention, electronic elements other than MOSFETs (for example, various diodes, transistors other than vertical MOSFETs, and thyristors) can also be used as the first electronic element 13. The same applies to the second electronic element 23. [Explanation of symbols]

[0072] 1...electronic module, 10...first substrate, 12...first heat dissipation member, 13...first electronic element, 20...second substrate, 22...second heat dissipation member, 23...first electronic element, 32, 32a, 32b, 34, 34a, 34b...external connection terminals, 36, 36a, 36b, 36c, 36d...internal connection terminals, 40...molded resin, 41...first recessed portion, 42...second recessed portion

Claims

1. a first substrate; a first electronic element disposed on the first substrate; A second substrate; a second electronic element disposed on the second substrate; An external connection terminal, an internal connection terminal that is inserted into the external connection terminal and fixes the external connection terminal at a predetermined position between the first substrate and the second substrate; An electronic module characterized in that the internal connection terminals are arranged between the first substrate and the second substrate or the second electronic element, or between the first electronic element and the second substrate or the second electronic element.

2. 2. The electronic module according to claim 1, wherein the internal connection terminal electrically connects the first electronic element and the external connection terminal.

3. 2. The electronic module according to claim 1, wherein the internal connection terminal electrically connects the second electronic element and the external connection terminal.

4. 2. The electronic module according to claim 1, wherein the length of the internal connection terminal and the position at which the external connection terminal is connected to the internal connection terminal are configured so that the distance between the external connection terminal and an element of the first substrate and the first electronic element that is located close to the external connection terminal is longer than a predetermined insulation distance, and the distance between the external connection terminal and an element of the second substrate and the second electronic element that is located close to the external connection terminal is longer than a predetermined insulation distance.

5. Further comprising a molding resin; 5. The electronic module according to claim 1, wherein the first electronic element, the surface of the first substrate on which the first electronic element is arranged, the second electronic element, and the surface of the second substrate on which the second electronic element is arranged are sealed with the mold resin, and the heat dissipation surface of the first substrate and the heat dissipation surface of the second substrate are exposed from the mold resin.

6. a first heat dissipation member disposed on the first substrate, a second heat dissipation member disposed on the second substrate, a first recessed portion disposed on a surface of the molding resin where the first heat dissipation member is exposed, and a second recessed portion disposed on a surface of the molding resin where the second heat dissipation member is exposed, the first recessed portion is configured so that a creepage distance along an outer surface of the molding resin between the external connection terminal and the first heat dissipation member is longer than a predetermined insulation distance; 6. The electronic module according to claim 5, wherein the second recessed portion is configured so that a creepage distance along the outer surface of the molded resin between the external connection terminal and the second heat dissipation member is longer than a predetermined insulation distance.

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