Electronic module

Abstract

To provide an electronic module capable of sufficiently securing reliability.SOLUTION: An electronic module 1 comprises: a first substrate 10; a chip 20 which is arranged on the first substrate 10 and which has a main electrode 21 and a control electrode 22 on the opposite side of a surface on the side of the first substrate 10; a power chip connection terminal 30 which is provided on the main electrode 21 and which is electrically connected to the main electrode 21; and a columnar signal chip connection terminal 40 which is provided on the control electrode 22 and which is electrically connected to the control electrode 22.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an electronic module. [Background technology]

[0002] BACKGROUND ART Conventionally, an electronic module is known that includes a chip arranged on a substrate and a power chip connection terminal provided on a main electrode of the chip (see, for example, Patent Document 1).

[0003] 7, a conventional electronic module 900 includes a first substrate 910, a chip 920 disposed on the first substrate 910 and having a main electrode 921 and a control electrode 922 on the surface opposite to the surface facing the first substrate 910, and a pillar-shaped power chip connection terminal 930 provided on the main electrode 921 and electrically connected to the main electrode 921. In the conventional electronic module 900, the control electrode 922 is connected to wiring 913 on the first substrate 910 via a wire W.

[0004] In the conventional electronic module 900, a second substrate 970 is provided at a position opposite to the first substrate 910, and the chip 920 and the second substrate 970 are connected via power chip connection terminals 930. The first substrate 910 and the second substrate 970 are also connected via internal connection terminals 950. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2020-503697 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the case of a conventional electronic module 900 in which a second substrate 970 is provided opposite a first substrate 910, during the manufacturing process, it is necessary to perform reflow while pressing the first substrate 910, chip 920, second substrate 970, etc. from both the first substrate 910 side and the second substrate 970 side.

[0007] However, when reflow is performed while holding down the first substrate 910 and the second substrate 970, as shown in Fig. 8, the power chip connection terminal 930 physically presses the main electrode 921, causing the chip 920 to tilt, which may make it difficult to maintain the chip 920 horizontally relative to the first substrate 910, which may make it difficult to ensure sufficient reliability. Note that in Fig. 8, a connection member 940 made from a processed metal plate is used instead of the wire W, but in this case too, the same problem is expected.

[0008] This problem occurs not only when reflow is performed while holding down the first substrate 910 and the second substrate 970, but also when there are substrates on only one side, as the main electrode 921 may be physically pressed by the weight of the power chip connection terminal 930, causing the chip 920 to tilt, and in this case too, it may become impossible to keep the chip 920 horizontal relative to the first substrate 910.

[0009] SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide an electronic module that can ensure sufficient reliability. [Means for solving the problem]

[0010] The electronic module of the present invention is characterized by comprising a first substrate, a chip arranged on the first substrate and having a main electrode and a control electrode on the side opposite to the side facing the first substrate, a power chip connection terminal provided on the main electrode and electrically connected to the main electrode, and a columnar signal chip connection terminal provided on the control electrode and electrically connected to the control electrode. [Effects of the Invention]

[0011] According to the electronic module of the present invention, since the electronic module includes a columnar signal chip connection terminal provided on and electrically connected to the control electrode, even if the main electrode is physically pressed by the power chip connection terminal, the signal chip connection terminal presses the control electrode, preventing the chip from tilting and keeping the chip horizontal with respect to the first substrate, thereby ensuring sufficient reliability.

[0012] However, when creating a connection member (see symbol 940 in Figure 8) by bending a small component, it is difficult to achieve high bending precision, and it is also difficult to position it with high precision for a small connection area such as a gate electrode. However, the electronic module of the present invention is equipped with a columnar signal chip connection terminal, so there is no need to bend small components, and it can be positioned with high precision even for a small connection area such as a gate electrode. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view showing an electronic module 1 according to a first embodiment. [Figure 2] 2 is a diagram showing the internal structure of the electronic module 1 according to embodiment 1. Note that Fig. 2 is a diagram in which the mold resin 80 is omitted from the perspective view of Fig. 1. [Figure 3] 3A and 3B are diagrams showing the internal structure of the electronic module 1 according to embodiment 1. Fig. 3A is a plan view from Fig. 1 in which the configuration on the second substrate 70 side and the molded resin 80 are omitted, and Fig. 3B is a plan view from Fig. 3A in which the first support member 60 and the second support member 62 are omitted. [Figure 4]4A and 4B are diagrams illustrating the power chip connection terminals 30 and the signal chip connection terminals 40 in the first embodiment. FIG. 4A is a perspective view illustrating the power chip connection terminals 30 and the signal chip connection terminals 40, and FIG. 4B is a schematic side view illustrating the power chip connection terminals 30 and the signal chip connection terminals 40. The arrows in FIG. 4B indicate the force (pressure) applied to the chip 20 (the same applies to FIGS. 5B and 6B). For simplicity of explanation, conductive bonding materials other than the conductive bonding material S1 between the first substrate 10 and the chip 20 are not shown (the same applies to FIGS. 5B and 6B). [Figure 5] 5A and 5B are diagrams illustrating the power chip connection terminal 30a and the signal chip connection terminal 40 in embodiment 2. Fig. 5A is a plan view illustrating the power chip connection terminal 30a and the gate electrode 22, and Fig. 5B is a schematic side view illustrating the power chip connection terminal 30a and the signal chip connection terminal 40. [Figure 6] 6A and 6B are diagrams illustrating the power chip connection terminal 30b and the signal chip connection terminal 40 in embodiment 3. Fig. 6A is a plan view illustrating the power chip connection terminal 30b and the gate electrode 22, and Fig. 6B is a schematic side view illustrating the power chip connection terminal 30b and the signal chip connection terminal 40. [Figure 7] 7 is a side view for explaining a conventional electronic module 900. In Fig. 7, reference numerals 912 and 914 indicate wiring, and reference numeral S1 indicates a solder. [Figure 8] 8 is a schematic enlarged side view of a main part shown to explain the problems of a conventional electronic module 900. Note that reference numeral S3 denotes solder, and reference numeral 935 denotes a spacer. Also, the arrow near the power chip connection terminal 930 in FIG. 8 indicates the force (pressure) applied to the chip 920, and the arrow near the connection member 940 indicates the direction of the force that lifts up the control electrode 922 side of the chip 920. DETAILED DESCRIPTION OF THE INVENTION

[0014] The electronic module of the present invention will be described below based on the embodiments shown in the drawings. Note that the embodiments described below do not limit the invention according to the claims. Furthermore, not all of the elements and combinations thereof described in the embodiments are necessarily essential to the solution of the present invention.

[0015] [Embodiment 1] 1. Configuration of the electronic module 1 according to the first embodiment 1, the electronic module 1 according to the first embodiment is an electronic module molded with mold resin 80. The electronic module 1 has heat dissipation metal plates (the upper surface is designated 73, and the lower surface is not shown) arranged on the upper and lower surfaces, and power terminals 69a, 66, and 69b extending from one side as external terminals through which a main current flows, and signal terminals 63 and 68 and sense terminals 61 and 65 extending from the other side as external terminals.

[0016] As shown in Figures 1 to 4, the electronic module 1 comprises a first substrate 10, a chip 20, power chip connection terminals 30, 31, a spacer 35, signal chip connection terminals 40, 41, internal connection terminals 50, 51, first support members 60, 64, second support members 62, 67, external terminals (power terminals 69a, 66, 69b, signal terminals 63, 68, and sense terminals 61, 65), a second substrate 70 (see Figure 2), and a molded resin 80 (see Figure 1).

[0017] The first substrate 10 is a DCB substrate (Direct Copper Bonding substrate) having an insulating substrate (ceramic substrate) 12, circuit wiring 11 formed on one surface (top surface) of the insulating substrate 12, and a metal plate for heat dissipation (not shown) formed on the other surface (bottom surface) of the insulating substrate 12.

[0018] The second substrate 70 is also a DCB substrate having an insulating substrate (ceramic substrate) 72, circuit wiring (not shown) formed on one surface (the lower surface in FIG. 2) of the insulating substrate 72, and a heat dissipation metal plate 73 formed on the other surface (the upper surface in FIG. 2) of the insulating substrate 72. The first substrate 10 and the second substrate 70 may be appropriate substrates such as printed circuit boards.

[0019] The chip 20 is a vertical MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) disposed on the circuit wiring 11 of the first substrate 10, and has a source electrode 21 (main electrode) and a gate electrode 22 (control electrode) on the surface opposite to the surface facing the first substrate 10, and a drain electrode 23 (see FIG. 4(b)) formed on the surface facing the first substrate 10. The source electrode 21 is divided into three parts, occupying three of the four quadrants of the rectangular chip 20 in plan view. The gate electrode 22 is formed at a corner that is the outer edge of the quadrant of the chip 20 in plan view where the source electrode 21 is not formed. The drain electrode 23 is formed over the entire surface of the chip 20 facing the first substrate 10.

[0020] When attempting to secure a large area for the main electrode, the source electrode 21 occupies a large portion of the surface of the chip 20, but a certain distance must be maintained between the source electrode 21 and the control electrode (gate electrode 22) to prevent a short circuit with the control electrode, which increases the possibility that the power chip connection terminal 30 will be connected at a position away from the center of gravity of the chip 20, making the chip 20 more likely to tilt. The signal chip connection terminal 40, which will be described later, is particularly effective in such cases.

[0021] The spacer 35 is a plate-like member formed across the three divided source electrodes 21. The spacer 35 has a recess formed therein for receiving the power chip connection terminal 30, which will be described later, and is joined to the power chip connection terminal 30 in the recess via a conductive bonding material (e.g., solder).

[0022] The power chip connection terminal 30 is a columnar member made of a conductive material (e.g., a metal material). The power chip connection terminal 30 is provided on the source electrode 21 (main electrode), with one end (lower end) electrically connected to the source electrode 21 (main electrode) and the other end (upper end) electrically connected to wiring (not shown) on the second substrate 70. The lower end of the power chip connection terminal 30 is joined to a recess in the spacer 35 via a conductive bonding material (e.g., solder), and the upper end is joined to the wiring on the second substrate 70 via a conductive bonding material (e.g., solder).

[0023] As shown in Fig. 3(a), the power chip connection terminal 30 is supported by the first support member 60 in a state in which it penetrates a first through-hole H1 (see Fig. 4(b)) of the first support member 60, which will be described later. The power chip connection terminal 30 is press-fitted into the first through-hole H1.

[0024] 4(a), the power chip connection terminal 30 has a cylindrical main body 32 and a ring-shaped flange 33 provided midway along the height of the main body 32. The lower surface of the flange 33 is joined to the first support member 60. The shape of the main body 32 is not limited to a cylindrical shape, and may be a rectangular pillar or any other appropriate pillar shape.

[0025] The signal chip connection terminal 40 is a columnar member made of a conductive material (e.g., a metal material). The signal chip connection terminal 40 is provided on the gate electrode 22 (control electrode), with one end (lower end) electrically connected to the gate electrode 22 (control electrode) and the other end (upper end) electrically connected to wiring (not shown) on the second substrate 70. The lower end of the signal chip connection terminal 40 is joined to the gate electrode 22 (control electrode) via a conductive bonding material (e.g., solder), and the upper end is joined to the wiring on the second substrate 70 via a conductive bonding material (e.g., solder). The signal chip connection terminal 40 does not have to be in contact with the second substrate 70.

[0026] 3(a), the signal chip connection terminal 40 is supported by the second support member 62 in a state in which it passes through a second through-hole H2 (see FIG. 4(b)) of the second support member 62, which will be described later. The signal chip connection terminal 40 is inserted into the second through-hole H2.

[0027] As shown in FIG. 4(a), the signal chip connection terminal 40 has a cylindrical main body 42 and a ring-shaped flange 43 provided midway along the height of the main body 42. The lower surface of the flange 43 is joined to the second support member 62. The shape of the main body 42 is not limited to a cylindrical shape, and may be a rectangular pillar or any other appropriate pillar shape. The flange 43 may be omitted.

[0028] A chip (not shown) is also arranged on the circuit wiring (not shown) of the second substrate 70, and a spacer (not shown) and a power chip connection terminal 31 are arranged on the source electrode of the chip (not shown) (the side on which the chip is arranged relative to the second substrate 70 is considered to be the upper side), and a signal chip connection terminal 41 is arranged on the gate electrode. These configurations are the same as those of the chip 20, spacer 35, power chip connection terminal 30, and signal chip connection terminal 40 on the first substrate 10, but turned upside down, so a description thereof will be omitted.

[0029] 3, a first support member 64 is provided at a midpoint in the height direction of the power chip connection terminal 31, and the power chip connection terminal 31 is supported by the first support member 64. A second support member 67 is provided at a midpoint in the height direction of the signal chip connection terminal 41, and the signal chip connection terminal 41 is supported by the first support member 64.

[0030] The internal connection terminals 50, 51 are columnar members that connect the first substrate 10 and the second substrate 70. In the first embodiment, three are arranged at each end of the first substrate 10. A power terminal 69a serving as an external terminal is connected to the internal connection terminal 50 at a midpoint in the height direction, and a power terminal 69b serving as an external terminal is connected to the internal connection terminal 51 at a midpoint in the height direction.

[0031] The first support member 60 is a conductive plate-like member having three first through-holes H1. A power chip connection terminal 30 is inserted (press-fitted) into each of the first through-holes H1. The first support member 60 extends horizontally to the outside of the molded resin 80 (see FIG. 1), and the portion outside the molded resin 80 forms a sense terminal 61 as an external terminal.

[0032] The first support member 64 is a conductive plate-like member having three first through-holes. The first support member 64 extends horizontally to the outside of the molded resin 80 (see FIG. 1) in the direction opposite to the direction in which the sense terminal 61 extends, and the portion outside the molded resin 80 forms the external terminal. The external terminal extending in the same direction as the sense terminal 61 is the sense terminal 65 which is connected to the source electrode of the chip (not shown) arranged on the second substrate 70, and the external terminal extending in the opposite direction to the sense terminal 61 is the power terminal 66.

[0033] The second support member 62 is a conductive plate-like member having one second through-hole H2. The second support member 62 extends horizontally to the outside of the molded resin 80 (see FIG. 1), and the portion outside the molded resin 80 forms an external terminal (signal terminal 63).

[0034] The second support member 67 is a plate-like member having one second through-hole (not shown). The second support member 67 extends horizontally to the outside of the molded resin 80 (see FIG. 1), and the portion outside the molded resin 80 forms an external terminal (signal terminal 68).

[0035] The first support members 60 and 64, the second support members 62 and 67, and the external terminals (signal terminals 63 and 68, sense terminals 61 and 65, and power terminals 66, 69a, and 69b) may be formed from a single lead frame.

[0036] Mold resin 80 (see FIG. 1) seals first substrate 10, chip 20, first support member 60, second support member 62, power chip connection terminals 30, and signal chip connection terminals 40. Mold resin 80 is made of a thermosetting molding material that is primarily composed of epoxy resin with silica filler and the like added, and protects chip 20 and the like from environmental factors such as heat, light, and humidity.

[0037] 2. Effects of the Electronic Module 1 According to the First Embodiment The electronic module 1 according to the first embodiment includes the signal chip connection terminal 40 that is provided on and electrically connected to the control electrode (gate electrode 22), so that even if the main electrode (source electrode 21) is physically pressed by the power chip connection terminal 30, the signal chip connection terminal 40 presses the control electrode (gate electrode 22), preventing the chip 20 from tilting and keeping the chip 20 horizontal with respect to the first substrate 10. As a result, it is possible to ensure sufficient reliability.

[0038] However, when creating a conventional connection member (for example, see reference numeral 940 in Figure 8) by bending a small component, it is difficult to achieve high bending accuracy, and it is also difficult to position with high accuracy for a small connection area such as a control electrode. However, according to the electronic module 1 of embodiment 1, since it is equipped with a columnar signal chip connection terminal 40, there is no need to bend small components, and it is possible to position with high accuracy even for a small connection area such as a gate electrode 22.

[0039] Furthermore, the electronic module 1 according to the first embodiment includes a plate-shaped first support member 60 having a first through-hole H1 and a second support member 62 having a second through-hole H2. The power chip connection terminals 30 are supported by the first support member 60 while passing through the first through-hole H1, and the signal chip connection terminals 40 are supported by the second support member 62 while passing through the second through-hole H2. This allows the power chip connection terminals 30 and the signal chip connection terminals 40 to be stably supported in an upright position. Furthermore, since the first support member 60, the second support member 62, and the power chip connection terminals 30 and the signal chip connection terminals 40 can be configured as circuit wiring, the installation area for wiring on the first substrate 10 and the second substrate 70 can be reduced, thereby enabling the electronic module to be miniaturized. Furthermore, since the circuit wiring can be configured in a three-dimensional space, the electronic module offers high design flexibility. Furthermore, the chip 20 can be evenly pressed, more reliably maintaining the chip 20 horizontally relative to the first substrate 10, resulting in an electronic module that can further ensure reliability.

[0040] Furthermore, according to the electronic module 1 of embodiment 1, the second support members 62, 67 extend horizontally to the outside of the molded resin 80, and the portions outside the molded resin 80 form the signal terminals 63, 68 of the gate electrode 22, so that the signal chip connection terminals 40, 41 and the second support members 62, 67 can form a circuit that connects the gate electrode 22 of the chip 20 to the signal terminals 63, 68. This makes it possible to reduce the installation area for the wiring on the first substrate 10 and the second substrate 70, allowing the electronic module to be further miniaturized and resulting in an electronic module with even greater design freedom.

[0041] Furthermore, according to the electronic module 1 of embodiment 1, the first support members 60, 64 extend horizontally to the outside of the molded resin 80, and the portions outside the molded resin 80 form the external terminals (sense terminals 61, 65 and power terminal 66), so that the power chip connection terminals 30, 31 and the first support members 60, 64 can form a circuit that connects the source electrode 21 of the chip 20 to the external terminals. Therefore, from this perspective as well, the installation area for wiring on the first substrate 10 and the second substrate 70 can be reduced, allowing the electronic module to be further miniaturized.

[0042] Furthermore, the electronic module 1 according to the first embodiment includes a second substrate 70 facing the first substrate 10, and the power chip connection terminals 30 and the signal chip connection terminals 40 are connected to the second substrate 70, so that heat can be dissipated from both sides of the first substrate 10 and the second substrate 70, resulting in an electronic module with high heat dissipation. Furthermore, the power chip connection terminals 30 and the signal chip connection terminals 40 can connect the first substrate 10 and the chip 20 to the second substrate 70 and the chip (arranged on the second substrate), improving shape stability.

[0043] Furthermore, according to the electronic module 1 of embodiment 1, the main electrode (source electrode 21) is divided into multiple (three) electrode portions, and the power chip connection terminals 30, 31 are arranged corresponding to each of the three divided electrode portions, which facilitates electrical continuity between the power chip connection terminals 30, 31 and the three divided electrode portions. Also, current imbalance is unlikely to occur, and heat generated from the chip 20 is easily dissipated to the second substrate 70 via the power chip connection terminals 30, 31.

[0044] In the electronic module 1 according to the first embodiment, the gate electrode 22 is disposed on the outer edge of the chip 20. This configuration facilitates connection of the gate electrode 22 to the outside, and also allows the area of ​​the source electrode 21 to be increased.

[0045] According to the electronic module 1 of embodiment 1, a spacer 35 is arranged between the main electrode (source electrode 21) and the power chip connection terminal 30, thereby making it possible to alleviate thermal stress associated with the conductive bonding material between the main electrode (source electrode 21) and the power chip connection terminal 30.

[0046] [Embodiment 2] The electronic module 2 according to the second embodiment has a configuration similar to that of the electronic module 1 according to the first embodiment, but the configurations of the source electrode and the power chip connection terminal are different from those of the electronic module 1 according to the first embodiment. That is, in the electronic module 2 according to the second embodiment, as shown in Fig. 5, the source electrode is not divided into three parts, but one source electrode 21a having a relatively large area is formed, and one power chip connection terminal 30a corresponding to the source electrode 21a is arranged.

[0047] As described above, the electronic module 2 according to the second embodiment has a different configuration of the source electrode and the power chip connection terminal from the electronic module 1 according to the first embodiment. However, like the electronic module 1 according to the first embodiment, the electronic module 2 has a signal chip connection terminal 40 that is provided on the gate electrode 22 and electrically connected to the gate electrode 22. This makes it possible to ensure sufficient reliability and to position with high precision even for a small connection area such as the gate electrode 22.

[0048] The electronic module 2 according to the second embodiment has the same configuration as the electronic module 1 according to the first embodiment except for the configuration of the source electrode and the power chip connection terminal, and therefore has the corresponding effects of the electronic module 1 according to the first embodiment.

[0049] [Embodiment 3] The electronic module 3 according to the third embodiment has a configuration similar to that of the electronic module 1 according to the first embodiment, but differs from the electronic module 2 according to the second embodiment in the configuration of the power chip connection terminal. That is, in the electronic module 3 according to the third embodiment, as shown in Fig. 6, the power chip connection terminal 30b is not a pillar-shaped terminal but has a shape bridging two electrode portions (a shape of a so-called clip or connector).

[0050] In embodiment 3, the power chip connection terminal 30b is not a pillar-shaped terminal, but when the power chip connection terminal 30b is placed on the source electrode 21a of the chip 20, the chip 20 may be pushed in or the chip 20 may be pushed by the weight of the power chip connection terminal 30b. In this case, the chip can be prevented from floating up by providing a signal chip connection terminal.

[0051] In the third embodiment, the power chip connection terminals 30b are not columnar terminals, and there is no member corresponding to the first support member.

[0052] As described above, the electronic module 3 according to the third embodiment has a different configuration of the power chip connection terminal from that of the electronic module 2 according to the second embodiment. However, like the electronic module 2 according to the second embodiment, the electronic module 3 has a signal chip connection terminal 40 that is provided on the gate electrode 22 and electrically connected to the gate electrode 22. This makes it possible to ensure sufficient reliability and to position with high precision even for a small connection area such as the gate electrode 22.

[0053] The electronic module 3 according to the third embodiment has the same configuration as the electronic module 2 according to the second embodiment except for the configuration of the power chip connection terminals, and therefore has the corresponding effects of the electronic module 2 according to the second embodiment.

[0054] Although the present invention has been described above based on the above embodiment, the present invention is not limited to the above embodiment and can be embodied in various forms without departing from the spirit of the present invention, and for example, the following modifications are also possible.

[0055] (1) The positions, connections, numbers, etc. described in the above embodiments (including each modified example; the same applies below) are examples and can be changed within the scope that does not impair the effects of the present invention.

[0056] (2) In the above embodiments, a vertical MOSFET is used as the chip, but the present invention is not limited to this. A horizontal MOSFET, i.e., a lateral MOSFET in which the drain electrode is formed on the side opposite the substrate, may also be used. In this case, both the source electrode and the drain electrode may be connected using a power chip connection terminal, or only one of them may be connected. Furthermore, the present invention may be used not only for MOSFETs but also for transistors other than MOSFETs, such as IGBTs, thyristors, and triacs, and any appropriate element may be used as long as it is a chip having a control electrode and a main electrode.

[0057] (3) In the above embodiments, the signal chip connection terminals are supported using the second support member, but the present invention is not limited to this. The second support member does not have to be used.

[0058] (4) In the above embodiment, the present invention is applied to an electronic module having two chips, but the present invention is not limited to this. The present invention may be applied to an electronic module having one chip, or to an electronic module having three or more chips.

[0059] (5) In the above embodiment, the thickness of the first support members 60, 64 is the same as the thickness of the second support members 62, 67, but the present invention is not limited to this. The thickness of the first support members 60, 64 may be thicker than the thickness of the second support members 62, 67. With this configuration, the first support members 60, 64 connected to the source electrodes can conduct a relatively large current and can have a width sufficient to support the power chip connection terminals 30, 31, which have a relatively large cross-sectional area. Furthermore, since the through holes can be enlarged, the power chip connection terminals 30, 31, which have a relatively large cross-sectional area, can be inserted through the through holes.

[0060] The signal chip connection terminals 40, 41 are pin terminals with a small current flow and a relatively small cross-sectional area. To insert such signal chip connection terminals 40, 41, the diameter of the second through hole H2 must be small. However, if the second support member is thick, it is not easy to form a through hole with such a small diameter. Therefore, by making the thickness of the second support members 62, 67 thinner than the thickness of the first support members 60, 64, the second through hole H2 with a small diameter can be formed.

[0061] (6) In the above embodiment, the gap between the signal chip connection terminals 40, 41 and the second through-hole H2 may be larger than the gap between the power chip connection terminals 30, 31 and the first through-hole H1. By adopting such a configuration, the signal chip connection terminals 40, 41 themselves can be adjusted to be positioned appropriately during the manufacturing process (self-alignment becomes effective). [Explanation of symbols]

[0062] 1, 2, 3...electronic module, 10...first substrate, 20...chip, 21, 21a...source electrode (main electrode), 22...gate electrode, 30, 30a, 30b, 31...power chip connection terminal, 35...spacer, 40, 41...signal chip connection terminal, 60, 64...first support member, 62, 67...second support member, 61, 63, 65, 66, 68, 69a, 69b...external terminal, 70...second substrate, H1...first through hole, H2...second through hole

Claims

1. a first substrate; a chip disposed on the first substrate, the chip having a main electrode and a control electrode on a surface opposite to the surface on the first substrate side; a power chip connection terminal disposed on the main electrode and electrically connected to the main electrode; an electronic module comprising: a columnar signal chip connection terminal disposed on the control electrode and electrically connected to the control electrode;

2. a plate-shaped first support member having a first through hole; a plate-shaped second support member having a second through hole, the power chip connection terminal is supported by the first support member while passing through the first through hole, The electronic module according to claim 1 , wherein the signal chip connection terminals are supported by the second support member while passing through the second through holes.

3. the first substrate, the chip, the first support member, the second support member, the power chip connection terminals, and the signal chip connection terminals are sealed with a molding resin; 3. The electronic module according to claim 2, wherein the second support member extends to the outside of the molding resin, and the portion outside the molding resin forms an external terminal of the control electrode.

4. the first substrate, the chip, the first support member, the second support member, the power chip connection terminals, and the signal chip connection terminals are sealed with a molding resin; 3. The electronic module according to claim 2, wherein the first support member extends to the outside of the molding resin, and the portion outside the molding resin forms an external terminal connected to the main electrode.

5. Further, a second substrate is provided at a position opposite to the first substrate, 5. The electronic module according to claim 1, wherein the power chip connection terminals and the signal chip connection terminals are connected to the second substrate.

6. 3. The electronic module of claim 2, wherein the thickness of the first support member is greater than the thickness of the second support member.

7. 3. The electronic module according to claim 2, wherein a gap between the signal chip connection terminal and the second through-hole is larger than a gap between the power chip connection terminal and the first through-hole.

8. An electronic module according to any one of claims 1 to 4, characterized in that the main electrode is divided into a plurality of electrode portions, and the power chip connection terminals are arranged corresponding to each of the divided electrode portions.

9. 5. The electronic module according to claim 1, wherein the control electrodes are arranged on the outer edge of the chip.

10. 5. The electronic module according to claim 1, wherein a spacer is disposed between the main electrode and the power chip connection terminal.

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