Electronic module

Abstract

To provide an electronic module that can increase the heat release property compared to the conventional electronic module.SOLUTION: An electronic module 1 includes a first substrate 10, a first heat generation component 12, and mold resin. The electronic module 1 further includes a second substrate 20 that is disposed apart from the first substrate 10 and the first heat generation component 12, and a first heat transmission member 14 that transmits the heat generated in the first heat generation component 12 to the second substrate 20. A surface of the first substrate 10 on a side opposite to the side where the first heat generation component 12 is disposed, and a surface of the second substrate 20 on a side opposite to the first substrate 10 side are exposed outside the electronic module 1. In the electronic module 1, the heat generated from the first heat generation component 12 cannot be only released through the first substrate 10 but also released through the second substrate 20 via the first heat transmission member 14.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an electronic module. [Background technology]

[0002] Conventionally, there has been known an electronic module that includes a substrate, a heat-generating component (e.g., a semiconductor chip such as a MOSFET) arranged on the substrate, a surface of the substrate on which the heat-generating component is arranged, and a molded resin that seals the heat-generating component, and in which the surface of the substrate opposite to the side on which the heat-generating component is arranged is exposed to the outside of the electronic module (see, for example, Patent Document 1).

[0003] In conventional electronic modules, the side of the substrate opposite to the side on which the heat-generating components are located is exposed to the outside of the electronic module, making it easier to dissipate heat generated by the heat-generating components to the outside of the electronic module via the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2020 / 208741 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, electronic elements are the typical heat-generating components in electronic modules, and research into electronic elements has progressed rapidly in recent years. For example, next-generation electronic elements using semiconductor materials such as SiC and GaN are beginning to be put into practical use. While such electronic elements can be made smaller (and thus more dense), greater attention must be paid to their heat dissipation. For this reason, in the technical field of electronic modules, there is a demand for improved heat dissipation in electronic modules.

[0006] The present invention has been made in view of the above-mentioned problems, and has an object to provide an electronic module that can improve heat dissipation performance compared to conventional electronic modules. [Means for solving the problem]

[0007] The electronic module of the present invention comprises a first substrate, a first heat-generating component arranged on the first substrate, a surface of the first substrate on which the first heat-generating component is arranged, and a molded resin that seals the first heat-generating component, wherein the electronic module further comprises a second substrate arranged on the side of the first substrate on which the first heat-generating component is arranged, spaced apart from the first substrate and the first heat-generating component, and a first heat transfer member that transfers heat generated by the first heat-generating component to the second substrate, and wherein the surface of the first substrate opposite the side on which the first heat-generating component is arranged and the surface of the second substrate opposite the first substrate side are exposed to the outside of the electronic module. [Effects of the Invention]

[0008] The electronic module of the present invention includes a second substrate disposed on the side of the first substrate where the first heat-generating component is disposed, while being spaced apart from the first substrate and the first heat-generating component, and a first heat transfer member that transfers heat generated by the first heat-generating component to the second substrate. Furthermore, the surface of the first substrate opposite the side where the first heat-generating component is disposed and the surface of the second substrate opposite the first substrate are exposed to the outside of the electronic module. Therefore, the electronic module of the present invention can dissipate heat generated by the first heat-generating component not only through the first substrate, but also through the second substrate via the first heat transfer member. Therefore, the electronic module of the present invention has improved heat dissipation performance compared to conventional electronic modules. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view of an electronic module 1 according to an embodiment. [Figure 2]2A and 2B are external views of an electronic module 1 according to an embodiment. Fig. 2A is a plan view of the electronic module 1. Fig. 2B is a left side view of the electronic module 1. Fig. 2C is a bottom view of the electronic module 1. [Figure 3] 3 is a perspective view of the internal structure of the electronic module 1 according to the embodiment, and in FIG. 3, the molding resin 40, which is one of the components of the electronic module 1, is not shown. [Figure 4] 4(a) and 4(b) are plan views illustrating the internal structure of the electronic module 1 according to the embodiment. FIG. 4(a) and FIG. 4(b) are plan views of the internal structure of the electronic module 1. In FIG. 4(a), the second substrate 20, the second heat-generating component 22, the second spacer 25, and the molded resin 40, which are components of the electronic module 1, are not shown. In FIG. 4(b), in addition to the components not shown in FIG. 4(a), the first heat transfer member 14, the first spacer 15, the first internal connection terminal 16, the first external connection terminal 30, and the other external connection terminals 35 are also not shown. [Figure 5] 5(a) to 5(d) are side views illustrating the internal structure of an electronic module 1 according to an embodiment. FIG. 5(a) is a left side view of the internal structure of the electronic module 1. FIG. 5(b) is an enlarged view of the first heat transfer member 14 and its vicinity in FIG. 5(a). FIG. 5(c) is a right side view of the internal structure of the electronic module 1. FIG. 5(d) is an enlarged view of the second heat transfer member 24 and its vicinity in FIG. 5(c). In FIGS. 5(a) to 5(d), the first internal connection terminal 18, the second internal connection terminal 28, the other external connection terminals 34 and 37, and the molded resin 40, which are components of the electronic module 1, are not shown. Arrows H1 to H4, which are indicated by dashed lines in FIGS. 5(b) and 5(d), indicate the state of heat transfer (heat dissipation) during operation. [Figure 6]6(a) and 6(b) are bottom views illustrating the internal structure of the electronic module 1 according to the embodiment. FIG. 6(a) and FIG. 6(b) are bottom views of the internal structure of the electronic module 1. FIG. 6(a) does not show the first substrate 10, the first heat-generating component 12, the first spacer 15, and the molded resin 40, which are components of the electronic module 1. FIG. 6(b) does not show the components not shown in FIG. 6(a), as well as the second heat transfer member 24, the second spacer 25, the second internal connection terminal 26, the second external connection terminals 32a and 32b, and the other external connection terminals 36. DETAILED DESCRIPTION OF THE INVENTION

[0010] The electronic module of the present invention will be described below based on the embodiments shown in the drawings. The embodiments described below do not limit the invention according to the claims. Furthermore, not all of the elements and combinations thereof described in the embodiments are necessarily essential to the solution of the present invention.

[0011] [Embodiment] 1 to 6, the electronic module 1 according to the embodiment includes a first substrate 10, a first heat-generating component 12, a first heat transfer member 14, a first spacer 15, first internal connection terminals 16 and 18, a second substrate 20, a second heat-generating component 22, a second heat transfer member 24, a second spacer 25, second internal connection terminals 26 and 28, a first external connection terminal 30, second external connection terminals 32a and 32b, other external connection terminals 34, 35, 36, and 37, and a molded resin 40. The electronic module 1 may include other components in addition to those described above. Each component will be described below.

[0012] The first substrate 10 is a substrate on which the first heat-generating component 12 is disposed. The first substrate 10 has a structure in which copper plates are disposed on both sides of a ceramic plate (for example, a DCB substrate). The surface of the first substrate 10 opposite the side on which the first heat-generating component 12 is disposed is exposed to the outside of the electronic module 1 (outside the molded resin 40) (see FIG. 2(c)). The first substrate 10 is electrically connected to the first drain electrode (first second electrode, described later) of the first heat-generating component 12.

[0013] In this specification, "electrically connected" refers not only to cases where the conductive parts of the components are in direct contact with each other, but also to cases where the components are in contact with each other via another conductive component (for example, solder or a spacer).

[0014] The first heat-generating component 12 is disposed on the first substrate 10. In this specification, the term "heat-generating component" refers to an electronic component that generates heat when in use (when power is applied). Examples of heat-generating components include, but are not limited to, electronic elements (typically semiconductor chips), resistors, coils, and capacitors.

[0015] The first heat-generating component 12 is a vertical electronic component having a first electrode and a first second electrode. In this specification, a "vertical electronic component" refers to an electronic component having at least two types of electrodes (first electrode and second electrode) on its surface, with the surface on which the first electrode is located being the opposite surface to the surface on which the second electrode is located. A "vertical electronic component" can also be said to be an "electronic component having electrodes on both sides."

[0016] Specifically, the first heat-generating component 12 is a vertical MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) having a first source electrode (first first electrode) 12a arranged on the second substrate 20 side, a first drain electrode (first second electrode, not shown) arranged on the first substrate 10 side, and a first gate electrode 12b arranged on the same side as the first source electrode 12a (see FIG. 4(b)). The first heat-generating component 12 has three first source electrodes 12a.

[0017] The first heat-generating component 12 generates heat at a different timing than the second heat-generating component 22. In this specification, the condition "heat generation at different timings" is satisfied if the timings at which the heat generation of the first heat-generating component and the second heat-generating component increase or decrease during actual use do not match. Note that the above "heat generation timing" is preferably "the timing at which heat generation reaches its maximum." In this case, the above feature can also be expressed as "when the electronic module 1 is in use, the first heat-generating component 12 and the second heat-generating component 22 are controlled so that the timings at which they each generate their maximum heat are different." The electronic module 1 according to the embodiment is intended to configure a half-bridge circuit, with the first heat-generating component 12 used as the high side and the second heat-generating component 22 used as the low side.

[0018] The first heat transfer member 14 is a member that transfers heat generated by the first heat-generating component 12 to the second substrate 20 (see FIGS. 5(a) and 5(b)). The first heat transfer member 14 is a generally columnar member that is connected to the first heat-generating component 12 and the second substrate 20 so as to be able to exchange heat therewith, and whose main portion is formed as an integral unit. With respect to the first heat transfer member, "connected so as to be able to exchange heat" not only refers to the case where the first heat transfer member is in direct contact with the target component, but also includes the case where the first heat transfer member is connected to the target component via another component (e.g., solder or a spacer). The above-mentioned "another component" is preferably made of a material with good thermal conductivity (e.g., a metal material). The above points also apply to the second heat transfer member.

[0019] 5(b), the state of heat transfer (heat dissipation) regarding the first heat-generating component 12 in the electronic module 1 will be described. The first heat-generating component 12 is disposed on the first substrate 10. Therefore, the heat generated by the first heat-generating component 12 is dissipated to the outside of the electronic module 1 via the first substrate 10 (see arrow H1).

[0020] The electronic module 1 also includes a first heat transfer member 14 that transfers heat generated in the first heat-generating component 12 to the second substrate 20. Therefore, the heat generated in the first heat-generating component 12 is dissipated to the outside of the electronic module 1 via a path that passes through the first heat transfer member 14 and the second substrate 20, in addition to the path that passes through the first substrate 10 described above (see arrow H2).

[0021] The first heat transfer member 14 is made of a conductive material and is electrically connected to the electrodes of the first heat-generating component 12. In other words, the first heat transfer member 14 can also function as an internal connection terminal, which is a member present inside the electronic module 1 and used for electrical communication. The first heat transfer member 14 is electrically connected to the first source electrode (first first electrode) 12a. The electronic module 1 includes three first heat transfer members 14 corresponding to the three first source electrodes 12a of the first heat-generating component 12. The end of each first heat transfer member 14 opposite to the first heat-generating component 12 side is electrically connected to the wiring pattern of the second substrate 20.

[0022] The first spacer 15 is made of a conductive material and is a saucer-shaped member interposed between the first source electrode 12a of the first heat-generating component 12 and the first heat transfer member 14. Although not shown, the first source electrode 12a and the first spacer 15 are joined by a conductive bonding material (e.g., solder). The first spacer 15 and the first heat transfer member 14 are also joined by a conductive bonding material.

[0023] The first internal connection terminals 16, 18 are components present inside the electronic module 1 and used for electrical communication. The first internal connection terminal 16 is electrically connected to the first gate electrode 12b of the first heat-generating component 12 and other external connection terminals 35. The first internal connection terminal 18 is electrically connected to the first substrate 10 and other external connection terminals 34.

[0024] Second substrate 20 is a substrate that is disposed on the side of first substrate 10 where first heat-generating component 12 is disposed, in a state separated from first substrate 10 and first heat-generating component 12. Regarding the second substrate, "separated from the first substrate and the first heat-generating component" refers to a state in which the second substrate is not in direct contact with the first substrate and the first heat-generating component. Therefore, if the second substrate is not in direct contact with the first substrate and the first heat-generating component, it can be said that the second substrate is "separated from the first substrate and the first heat-generating component" even if a component in contact with the second substrate is also in contact with the first substrate or the first heat-generating component.

[0025] The second substrate 20 has a structure in which copper plates are arranged on both sides of a ceramic plate (for example, a DCB substrate). The surface of the second substrate 20 opposite to the first substrate 10 side is exposed to the outside of the electronic module 1 (outside the molded resin 40) (see FIG. 2(a)). The second substrate 20 is electrically connected to the second drain electrode (second second electrode, described later) of the second heat-generating component 22.

[0026] The second heat-generating component 22 is disposed on the surface of the second substrate 20 facing the first substrate 10. The second heat-generating component 22 is a vertical electronic component having a second first electrode and a second second electrode. Specifically, the second heat-generating component 22 is a vertical MOSFET having a second source electrode (second first electrode) 22a disposed on the first substrate 10 side, a second drain electrode (second second electrode, not shown) disposed on the second substrate 20 side, and a second gate electrode 22b disposed on the same side as the second source electrode 22a (see FIG. 6(b)). The second heat-generating component 22 has three second source electrodes 22a.

[0027] The second heat transfer member 24 is a member that transfers heat generated by the second heat-generating component 22 to the first substrate 10 (see FIGS. 5(c) and 5(d)). The second heat transfer member 24 is connected to the second heat-generating component 22 and the first substrate 10 so as to be able to exchange heat with them, and is a substantially columnar member whose main portion is formed as an integral unit.

[0028] 5(d), the state of heat transfer (heat dissipation) regarding the second heat-generating component 22 in the electronic module 1 will be described. The second heat-generating component 22 is disposed on the second substrate 20. Therefore, the heat generated by the second heat-generating component 22 is dissipated to the outside of the electronic module 1 via the second substrate 20 (see arrow H3).

[0029] The electronic module 1 also includes a second heat transfer member 24 that transfers heat generated by the second heat-generating component 22 to the first substrate 10. Therefore, the heat generated by the second heat-generating component 22 is dissipated to the outside of the electronic module 1 via a path that passes through the second heat transfer member 24 and the first substrate 10, in addition to the path that passes through the second substrate 20 described above (see arrow H4).

[0030] The second heat transfer member 24 is made of a conductive material and is electrically connected to the electrodes of the second heat-generating component 22. In other words, the second heat transfer member 24 also functions as an internal connection terminal, which is a member that exists inside the electronic module 1 and is used for electrical communication. but The second heat transfer member 24 is electrically connected to the second source electrode (second first electrode) 22a. The electronic module 1 includes three second heat transfer members 24 corresponding to the three second source electrodes 22a of the second heat-generating component 22. The end of each second heat transfer member 24 opposite to the second heat-generating component 22 side is connected to the wiring pattern of the first substrate 10.

[0031] The second spacer 25 is made of a conductive material and is a saucer-shaped member interposed between the second source electrode 22a of the second heat-generating component 22 and the second heat transfer member 24. Although not shown, the second source electrode 22a and the second spacer 25 are joined by a conductive bonding material (e.g., solder). The second spacer 25 and the second heat transfer member 24 are also joined by a conductive bonding material.

[0032] The second internal connection terminals 26, 28 are members that exist inside the electronic module 1 and are used for electrical communication. The second internal connection terminal 26 is electrically connected to the second gate electrode 22b of the second heat-generating component 22 and other external connection terminals 36. The second internal connection terminal 28 is electrically connected to the second substrate 20 and other external connection terminals 37.

[0033] The first external connection terminal 30 is electrically connected to the first heat transfer member 14 between the first substrate 10 and the second substrate 20, and has at least one end protruding from the molded resin 40. The first external connection terminal 30 in the electronic module 1 is a detection terminal for the first source electrode 12a of the first heat-generating component 12.

[0034] The second external connection terminals 32a, 32b are electrically connected to the second heat transfer member 24 between the first substrate 10 and the second substrate 20, and at least one end of the second external connection terminals 32a is a power terminal capable of handling large currents. The second external connection terminal 32b is a detection terminal for the second source electrode 22a of the second heat-generating component 22. The second external connection terminals 32a, 32b are integral members.

[0035] The other external connection terminals 34, 35, 36, and 37 are members that are electrically connected to components other than the first heat transfer member 14 and the second heat transfer member 24, and at least one end of which protrudes outside the molded resin 40. The other external connection terminal 34 is a power terminal that is electrically connected to the first internal connection terminal 18. The other external connection terminal 35 is a control terminal that is electrically connected to the first internal connection terminal 16. The other external connection terminal 36 is a control terminal that is electrically connected to the second internal connection terminal 26. The other external connection terminal 37 is a power terminal that is electrically connected to the second internal connection terminal 28.

[0036] The molded resin 40 seals the surface of the first substrate 10 on which the first heat-generating component 12 is arranged and the first heat-generating component 12 (see FIGS. 1 and 2). The molded resin 40 also seals the surface of the second substrate 20 on which the second heat-generating component 22 is arranged and the second heat-generating component 22.

[0037] The effects of the electronic module 1 according to the embodiment will be described below.

[0038] The electronic module 1 according to the embodiment includes a second substrate 20 that is disposed on the side of the first substrate 10 where the first heat-generating component 12 is disposed, while being spaced apart from the first substrate 10 and the first heat-generating component 12, and a first heat transfer member 14 that transfers heat generated by the first heat-generating component 12 to the second substrate 20. Furthermore, a surface of the first substrate 10 opposite the side where the first heat-generating component 12 is disposed and a surface of the second substrate 20 opposite the first substrate 10 are exposed to the outside of the electronic module 1. Therefore, the electronic module 1 according to the embodiment can dissipate heat generated by the first heat-generating component 12 not only through the first substrate 10, but also through the second substrate 20 via the first heat transfer member 14. Therefore, the electronic module 1 according to the embodiment is an electronic module that can achieve higher heat dissipation performance than conventional electronic modules.

[0039] Furthermore, in the electronic module 1 according to the embodiment, the first heat-generating component 12 has an electrode, and the first heat transfer member 14 is made of a conductive material and is electrically connected to the electrode of the first heat-generating component 12. Therefore, according to the electronic module 1 according to the embodiment, the first heat transfer member 14 can be used for electrical communication between the first heat-generating component 12 and other components, and functions can be consolidated to reduce the size of the electronic module 1.

[0040] Furthermore, in the electronic module 1 according to the embodiment, the first heat-generating component 12 is a vertical electronic component having a first source electrode (first first electrode) 12a and a first drain electrode (first second electrode), the first heat transfer member 14 is electrically connected to the first source electrode 12a, and the first substrate 10 is electrically connected to the first drain electrode. Therefore, according to the electronic module 1 according to the embodiment, by using a vertical electronic component having electrodes on both sides as the first heat-generating component 12, it is possible to achieve both improved heat dissipation and miniaturization.

[0041] The electronic module 1 according to the embodiment also includes a first external connection terminal 30 electrically connected to the first heat transfer member 14 between the first substrate 10 and the second substrate 20. Therefore, according to the electronic module 1 according to the embodiment, it is possible to extract a current directly from the first heat transfer member 14 via the first external connection terminal 30.

[0042] Furthermore, the electronic module 1 according to the embodiment includes a second heat-generating component 22 arranged on the surface of the second substrate 20 facing the first substrate 10, and a second heat transfer member 24 that transfers heat generated by the second heat-generating component 22 to the first substrate 10. Therefore, according to the electronic module 1 according to the embodiment, it is possible to increase the mounting density by arranging the second heat-generating component 22 also on the second substrate 20, and it is also possible to increase the heat dissipation performance of the second heat-generating component 22.

[0043] Furthermore, in the electronic module 1 according to the embodiment, the second heat-generating component 22 has an electrode, and the second heat transfer member 24 is made of a conductive material and is electrically connected to the electrode of the second heat-generating component 22. Therefore, according to the electronic module 1 according to the embodiment, the second heat transfer member 24 can be used for electrical communication between the second heat-generating component 22 and other components, and functions can be consolidated to reduce the size of the electronic module 1.

[0044] Furthermore, in the electronic module 1 according to the embodiment, the second heat-generating component 22 is a vertical electronic component having a second source electrode (second first electrode) 22a and a second drain electrode (second second electrode), the second heat transfer member 24 is electrically connected to the second source electrode 22a, and the second substrate 20 is electrically connected to the second drain electrode. Therefore, according to the electronic module 1 according to the embodiment, by using a vertical electronic component having electrodes on both sides as the second heat-generating component 22, it is possible to achieve both improved heat dissipation and miniaturization.

[0045] The electronic module 1 according to the embodiment also includes second external connection terminals 32a, 32b electrically connected to the second heat transfer member 24 between the first substrate 10 and the second substrate 20. Therefore, according to the electronic module 1 according to the embodiment, it is possible to extract current directly from the second heat transfer member 24 via the second external connection terminals 32a, 32b.

[0046] Furthermore, in the electronic module 1 according to the embodiment, the first heat-generating component 12 generates heat at a different timing than the second heat-generating component 22. Therefore, with the electronic module 1 according to the embodiment, it is possible to stagger the timing at which heat is generated between the first heat-generating component 12 and the second heat-generating component 22, thereby reducing the amount of heat generated at one time within the electronic module 1.

[0047] Furthermore, in the electronic module 1 according to the embodiment, the first substrate 10 and the second substrate 20 have a structure in which copper plates are disposed on both sides of a ceramic plate. Therefore, according to the electronic module 1 according to the embodiment, it is possible to further improve heat dissipation by using substrates with high thermal conductivity.

[0048] Although the present invention has been described above based on the above embodiment, the present invention is not limited to the above embodiment and can be embodied in various forms without departing from the spirit of the present invention, and for example, the following modifications are also possible.

[0049] (1) The shape, number, size, position, etc. of the components of the present invention are not limited to those described above or shown in the drawings, and may be modified as appropriate as long as the characteristics of the present invention are not impaired.

[0050] For example, in the above embodiment, the number of first heat-generating components 12 is one, but the present invention is not limited to this. The number of first heat-generating components may be multiple. The same applies to the second heat-generating components.

[0051] (2) The electronic module of the present invention may further include a heat-generating component other than the first heat-generating component (a heat-generating component for which no corresponding first heat-transfer member exists) or other structure, etc. on the first substrate. The electronic module of the present invention may further include a heat-generating component other than the second heat-generating component (a heat-generating component for which no corresponding second heat-transfer member exists) or other structure, etc. on the second substrate.

[0052] (3) The electronic module of the present invention may not include the second heat-generating component and the second heat-transfer member.

[0053] (4) The electronic module of the present invention may not include the first spacer and the second spacer.

[0054] (5) In the above embodiment, the first external connection terminal 30 is a detection terminal, the second external connection terminal 32a is a power terminal, and the second external connection terminal 32b is a detection terminal, but the present invention is not limited to this. The function of each external connection terminal can be set appropriately depending on the structure of the electronic module, etc.

[0055] (6) The first heat-generating component in the electronic module of the present invention may be a heat-generating component other than a vertical MOSFET. Examples of heat-generating components other than a vertical MOSFET include electronic elements other than a vertical MOSFET (diodes, transistors, thyristors, etc.), resistors, coils, and capacitors. The same applies to the second heat-generating component. [Explanation of symbols]

[0056] 1...electronic module, 10...first substrate, 12...first heat-generating component, 12a...first source electrode (first first electrode), 12b...first gate electrode, 14...first heat transfer member, 20...second substrate, 22...second heat-generating component, 22a...second source electrode (second first electrode), 22b...second gate electrode, 24...second heat transfer member, 30...first external connection terminal, 32a...second external connection terminal, 32b...second external connection terminal, 40...molding resin

Claims

1. a first substrate; a first heat generating component disposed on the first substrate; an electronic module including a surface of the first substrate on which the first heat generating component is disposed and a molding resin that seals the first heat generating component, the electronic module further includes a second substrate disposed on the side of the first substrate where the first heat-generating component is disposed, the second substrate being spaced apart from the first substrate and the first heat-generating component, and a first heat transfer member that transfers heat generated by the first heat-generating component to the second substrate, An electronic module characterized in that the surface of the first substrate opposite the side on which the first heat-generating component is arranged and the surface of the second substrate opposite the first substrate side are exposed to the outside of the electronic module.

2. the first heat generating component has an electrode; 2. The electronic module according to claim 1, wherein the first heat transfer member is made of an electrically conductive material and is electrically connected to the electrode of the first heat generating component.

3. the first heat-generating component is a vertical electronic component having a first electrode and a first second electrode, the first heat transfer member is electrically connected to the first electrode; The electronic module of claim 2 , wherein the first substrate is electrically connected to the first and second electrodes.

4. The electronic module according to claim 2 , further comprising a first external connection terminal electrically connected to the first heat transfer member between the first substrate and the second substrate.

5. a second heat generating component disposed on a surface of the second substrate facing the first substrate; The electronic module according to claim 1 , further comprising a second heat transfer member for transferring heat generated by the second heat generating component to the first substrate.

6. the second heat generating component has an electrode; 6. The electronic module according to claim 5, wherein the second heat transfer member is made of an electrically conductive material and is electrically connected to the electrode of the second heat generating component.

7. the second heat-generating component is a vertical electronic component having a second first electrode and a second second electrode, the second heat transfer member is electrically connected to the second first electrode; The electronic module according to claim 6 , wherein the second substrate is electrically connected to the second electrode.

8. The electronic module according to claim 6 , further comprising a second external connection terminal electrically connected to the second heat transfer member between the first substrate and the second substrate.

9. 6. The electronic module according to claim 5, wherein the first heat generating component generates heat at a timing different from that of the second heat generating component.

10. 2. The electronic module according to claim 1, wherein the first substrate and the second substrate each have a structure in which copper plates are disposed on both sides of a ceramic plate.

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