Electronic module, and method and device for manufacturing the same

Abstract

To provide an electronic module in which resin leakage hardly occurs in a sealing process even though a plate-like power terminal is used.SOLUTION: An electronic module 100 includes a substrate 110, electronic elements 120A, 120B disposed on the substrate 110, and a plate-shaped power terminal 160 erected from the substrate 110. The substrate 110, the electronic elements 120A, 120B, and the power terminal 160 are sealed with a sealing member 190. The power terminal 160 is electrically connected to the substrate 110, at least whose distal end portion protruding from the sealing member 190, and having a crushed portion 163 recessed from other portions at a position in contact with a surface of the sealing member 190.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic module, a method for manufacturing an electronic module, and an apparatus for manufacturing an electronic module. [Background technology]

[0002] BACKGROUND ART Conventionally, electronic modules have been known that include pin terminals standing upright on a substrate and are sealed with a sealing member (see, for example, Patent Document 1).

[0003] 11 , in a conventional electronic module 900, pin terminals 972, 974 protrude from sealing resin 990, and therefore resin sealing is performed using a mold having a pair of slide portions 922. Specifically, in the manufacturing process of the electronic module, after placing the pin terminals 972, 974 in the mold, the pair of slide portions 922 are slid to sandwich the pin terminals 972, 974, thereby preventing the sealing resin 990 from flowing out beyond the pair of slide portions 922 and performing resin sealing. Recesses 963 corresponding to the tip ends of the pair of slide portions 922 are formed in the pin terminals 972, 974 of the conventional electronic module 900. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2020 / 129195 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, there has been a demand for electronic modules that can be used in electrical devices that pass large currents. To meet this demand, it has been considered to use plate-shaped power terminals, which have a relatively large cross-sectional area for the current path, instead of pin terminals. However, when using plate-shaped power terminals, there are issues such as the risk of gaps forming between the mold (slide portion) and the power terminal due to the large contact surface between the slide portion and the power terminal, and the risk of resin leakage due to the formation of sagging or fractured surfaces when shearing the plate material to manufacture the power terminal.

[0006] Therefore, the present invention has been made in consideration of the above circumstances, and aims to provide an electronic module that is less likely to cause resin leakage during the sealing process, despite using plate-shaped power terminals. [Means for solving the problem]

[0007] The electronic module of the present invention comprises a substrate, an electronic element disposed on the substrate, and a flat power terminal erected from the substrate, wherein the substrate, the electronic element, and the power terminal are sealed with a sealing member, and the power terminal has at least a tip portion protruding from the sealing member and a crushed portion at a position where it contacts the surface of the sealing member that is recessed more than other portions.

[0008] The method for manufacturing an electronic module of the present invention includes an assembly forming step of erecting a power terminal formed in a flat plate shape on a substrate on which an electronic element is to be arranged, to form an assembly having the substrate, the electronic element, and the power terminal; an accommodating step of accommodating the substrate, the electronic element, and the first portion of the power terminal on the substrate side in a first cavity of a mold, and accommodating a second portion on the tip side of the power terminal in a power terminal accommodating hole extending from an inner surface of the first cavity; and a sealing member is poured into the first cavity after the accommodating step to encapsulate the substrate, the electronic element, and the power terminal in a power terminal accommodating hole extending from an inner surface of the first cavity. and a sealing process of sealing the first portion of the power terminal, wherein in the accommodating process, after the second portion of the power terminal is inserted into the power terminal accommodating hole, tip portions of a pair of slide portions provided on the mold are caused to protrude from the inner periphery of the power terminal accommodating hole to sandwich the power terminal between the pair of slide portions, thereby separating the tip portion of the second portion of the power terminal from the first cavity and forming a crushed portion by the tip portions of the pair of slide portions biting into the outer periphery of the second portion of the power terminal.

[0009] The electronic module manufacturing apparatus of the present invention is an electronic module manufacturing apparatus for carrying out the electronic module manufacturing method of the present invention, and is characterized in that it comprises a first mold having the power terminal insertion hole and the pair of slide portions, and a second mold opposite the first mold, one side of the power terminal is a sagging surface where a sagging is formed at the end, and the other side of the power terminal is a burr surface connected to the fracture surface of the side, and when viewed in a plan view, a recess corresponding to the cross section of the power terminal is formed at the tip portion of each of the pair of slide portions, the shape of the bottom of the recess in the slide portion of the pair of slide portions that abuts against the sagging surface has a shape that corresponds to the shape of the sagging surface, and the shape of the bottom of the recess in the slide portion of the pair of slide portions that abuts against the burr surface has a shape in which convex portions are formed on both side wall sides of the recess. [Effects of the Invention]

[0010] According to the electronic module of the present invention, the power terminals have a crushed portion that is recessed more than other portions at the position where it contacts the surface of the sealing member, so that when resin sealing is performed using a mold, a gap is unlikely to occur between the mold (sliding portion) and the power terminals, and resin leakage can be prevented. As a result, the electronic module of the present invention is an electronic module that is unlikely to experience resin leakage during the sealing process, even though it uses plate-shaped power terminals.

[0011] According to the electronic module manufacturing method and manufacturing device of the present invention, by clamping the power terminal between a pair of slide parts, the tip portion of the power terminal is separated from the first cavity and the tip portions of the pair of slide parts bite into the outer periphery of the second part of the power terminal to form a crushed portion, making it less likely for a gap to form between the mold (slide parts) and the power terminal and preventing resin leakage. [Brief explanation of the drawings]

[0012] [Figure 1] 1A and 1B are perspective views showing an electronic module 100 according to an embodiment, in which FIG. [Figure 2] 2A and 2B are diagrams showing the internal structure of an electronic module 100 according to an embodiment. Fig. 2A is a front view of the electronic module 100 from which the sealing member 190 is omitted, Fig. 2B is a plan view of the electronic module 100 from which the sealing member 190 is omitted, and Fig. 2C is a plan view of the electronic module 100 from which the sealing member 190, first connecting frame 132, second connecting frame 142, and internal connecting frame 152 are omitted. [Figure 3] 3A and 3B are diagrams illustrating a power terminal 160 according to an embodiment. Fig. 3A is a front view of the power terminal 160, Fig. 3B is a plan view of the power terminal 160, Fig. 3C is an enlarged cross-sectional plan view showing the A1-A1 cross section of Fig. 3A, and Fig. 3D is an enlarged cross-sectional plan view showing the A2-A2 cross section of Fig. 3A. [Figure 4]4(a) to 4(d) are diagrams showing steps for manufacturing the power terminal 160 according to the embodiment. [Figure 5] 1 is a flowchart illustrating a method for manufacturing an electronic module according to an embodiment. [Figure 6] 6A and 6B are diagrams showing a process of placing an assembly in a mold 1 in an embodiment. Fig. 6A is a front cross-sectional view showing the process of placing an assembly in the mold 1, and Fig. 6B is a side cross-sectional view showing the assembly when being placed in the mold 1. [Figure 7] 7A and 7B are diagrams illustrating a process of sandwiching a power terminal 160 between a pair of slide parts 24 in an embodiment. Fig. 7A is a front cross-sectional view illustrating the process of sandwiching a power terminal 160 between a pair of slide parts 24, and Fig. 7B is a side cross-sectional view illustrating the process of sandwiching a power terminal 160 between a pair of slide parts 24. [Figure 8] 10 is a plan view showing how the sliding portion 24 sandwiches the power terminal 160 in the accommodating step. FIG. [Figure 9] 10 is an enlarged plan view of a main part showing how the sliding portion 24 sandwiches the power terminal 160 in the accommodating step. FIG. [Figure 10] 10(a) is a front cross-sectional view showing the sealing step, and FIG. 10(b) is a side cross-sectional view showing the sealing step. [Figure 11] 1 is a cross-sectional view illustrating a resin sealing process for a conventional electronic module, in which reference numeral 910 denotes a substrate, reference numeral 920 denotes an electronic element, reference numerals 932 and 942 denote connection frames, and reference numeral 952 denotes an internal connection frame. DETAILED DESCRIPTION OF THE INVENTION

[0013] The electronic module, the manufacturing method of the electronic module, and the manufacturing apparatus of the electronic module of the present invention will be described below based on the embodiments shown in the drawings. Note that the embodiments described below do not limit the invention according to the claims. Furthermore, not all of the elements and combinations thereof described in the embodiments are necessarily essential to the solution of the present invention.

[0014] [Embodiment] 1. Electronic module 100 according to an embodiment First, an electronic module 100 according to an embodiment will be described. As shown in Figures 1 and 2, the electronic module 100 according to the embodiment includes a substrate 110, electronic elements 120A and 120B, a first terminal 130, a second terminal 140, a power terminal 160, a first connection frame 132, a second connection frame 142, an internal connection frame 152, and pin terminals 172, 174, 182, and 184.

[0015] In the following description, the longitudinal direction of the electronic module 100 will be referred to as the front-rear direction, and the lateral direction will be referred to as the left-right direction. The height direction of the electronic module 100 will be referred to as the up-down direction. In the following description, the terms front, rear, left, right, top, and bottom are used for convenience of explanation and do not specify the orientation in which the electronic module 100 is attached when it is used.

[0016] As shown in FIG. 1, the electronic module 100 according to the embodiment is resin-sealed with a sealing member 190, and the first terminal 130, the second terminal 140, the power terminal 160, the tip portions of the pin terminals 172, 174, 182, 184, and the substrate 110 (metal plate 113 for heat dissipation) are exposed from the sealing member 190.

[0017] 1 and 2, the electronic module 100 according to the embodiment configures a half-bridge circuit in which electronic elements (semiconductor elements) 120A and 120B are connected in series. The second terminal 140 is connected to an external high voltage, and the first terminal 130 is connected to a reference potential. The power terminal 160 is a midpoint terminal connected to the midpoint between the source electrode of the electronic element 120A and the drain electrode of the electronic element 120B. The circuit configuring the electronic module 100 may be a full-bridge circuit or any other suitable circuit.

[0018] 2(a), the substrate 110 is a DCB (Direct Copper Bonding) substrate having an insulating substrate (ceramic substrate) 112, circuit wiring 111 formed on the upper surface of the insulating substrate (ceramic substrate) 112, and a heat dissipation metal plate 113 formed on the lower surface (rear surface) of the insulating substrate (ceramic substrate) 112. The substrate 110 may be an appropriate substrate such as a printed circuit board.

[0019] The electronic elements 120A and 120B are disposed on the die pad of the circuit wiring 111. Each of the electronic elements 120A and 120B is a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) having a drain electrode formed on the substrate 110 side and a source electrode and a gate electrode formed on the opposite side from the substrate side. The electronic elements 120A and 120B may be other semiconductor elements such as IGBTs, triacs, and diodes, or may be electronic elements other than semiconductor elements such as capacitors and inductors. The number of electronic elements is not limited to two, and may be one, or three or more.

[0020] In the electronic element 120A, the source electrode is connected to the first terminal 130 via the internal connection terminal 134 and the first connection frame 132. It is also connected to a pin terminal 174 serving as a sense terminal via a wire or circuit wiring (not shown). The gate electrode is connected to the pin terminal 172 via a connector 176 and circuit wiring. The drain electrode (not shown) is connected to the power terminal 160 via the circuit wiring 111, and the power terminal 160 is electrically connected to the internal connection frame 152. In the example of FIG. 1, the internal connection terminal 134 has a circular cross section.

[0021] In the electronic element 120B, the source electrode is connected to the internal connection frame 152 via an internal connection terminal 154, and the internal connection frame 152 is connected to the power terminal 160. The source electrode is also connected to a pin terminal 184 serving as a sense terminal via a wire or circuit wiring (not shown). The gate electrode is connected to the pin terminal 182 via a connector 186 and circuit wiring. The drain electrode (not shown) is electrically connected to the second terminal 140 via the circuit wiring 111, the connection member 178, and the second connection frame 142. In the example of FIG. 1, the internal connection terminal 154 has a circular cross section, and the connection member 178 has a rectangular cross section.

[0022] 1 and 2, the first terminal 130 is disposed at the front of the electronic module 100 in the front-to-rear direction. The first terminal 130 is made of a plate-shaped member made of a conductive flat plate material, for example, a copper plate. The first terminal 130 has a through-hole 131 that passes through the first terminal 130 in the up-down direction. The through-hole 131 has, for example, a circular shape when viewed in the up-down direction.

[0023] The first connection frame 132 is electrically connected to the first terminals 130. The first connection frame 132 is embedded inside the sealing member 190. In the electronic module 100, the first connection frame 132 and the first terminals 130 are formed integrally from the same plate material.

[0024] The first connection frame 132 has through-holes (reference numerals omitted) that pass through the first connection frame 132 in the vertical direction. The through-holes have a circular shape when viewed in the vertical direction. The upper ends of the internal connection terminals 134 fit into the through-holes. The internal connection terminals 134 are fixed to the first connection frame 132 by, for example, press-fitting, and connect the first connection frame 132 to the source electrodes of the electronic elements 120A.

[0025] The second terminal 140 is disposed at the rear of the electronic module 100 in the front-to-rear direction. The second terminal 140 is a plate-shaped member made of a conductive flat plate material, for example, a copper plate. The second terminal 140 has a through-hole 141 that passes through the second terminal 140 in the up-down direction. The through-hole 141 has, for example, a circular shape when viewed in the up-down direction.

[0026] The second connection frame 142 (internal connection frame) is electrically connected to the second terminals 140. The second connection frame 142 is embedded inside the sealing member 190. In the electronic module 100, the second connection frame 142 and the second terminals 140 are formed integrally from the same plate material.

[0027] The internal connection frame 152 is a plate-like member having through holes (reference numerals omitted) that pass through the internal connection frame 152 in the vertical direction and elongated holes 156 (see FIG. 2(b)), and supports the power terminals 160 and electrically connects the electronic elements 120A, 120B to the power terminals 160. The internal connection frame 152 is disposed on the same plane as the first connection frame 132 and the second connection frame 142.

[0028] The through-hole has a circular shape when viewed in the vertical direction, and the upper end of the internal connection terminal 154 is fitted therein, and the internal connection frame 152 and the source electrode of the electronic element 120A are connected by the internal connection terminal 154. The long hole 156 extends in the front-rear direction, and a first portion of the power terminal 160 (see reference numeral 166 in FIG. 3 described later) is press-fitted into it.

[0029] 1 to 3, the power terminal 160 is a flat plate-like member erected on the substrate 110, and is disposed so that the thickness direction is the left-right direction, and has an elongated shape with the longitudinal direction being the up-down direction. As shown in Fig. 3, the power terminal 160 has a first portion 166 that is located closer to the substrate than the internal connection frame 152 and is press-fitted into the elongated hole 156, and a second portion 164 that is located on the opposite side of the internal connection frame 152 from the substrate 110 side and is formed wider than the first portion 166.

[0030] The first part 166 has an end on the substrate side electrically connected to the substrate 110, and constitutes part of the circuit wiring that connects the electronic element 120A and the electronic element 120B. The first part 166 is sealed with a sealing member 190. Note that the power terminal 160 and the substrate 110 do not necessarily have to be directly electrically joined.

[0031] The second part 164 has a connection part 164a that is connected to the first part 166 and whose width (front-to-back width) gradually increases as it moves away from the first part 166 when viewed from the left-right direction, and an exposed part 164b (tip) that is connected to the connection part 164a and has a roughly rectangular shape and extends upward.

[0032] The connecting portion 164a has a support portion 167 that supports the power terminal 160 by contacting the internal connection frame 152, and protruding portions 162 that protrude from one side and the other side of the power terminal 160 and have their lower surfaces in contact with the internal connection frame 152. The connecting portion 164a is sealed with a sealing member 190.

[0033] The exposed portion 164b has an opening 161 formed in the center and a crushed portion 163 that is recessed more than other portions at a position where it contacts the surface of the sealing member 190 (the connection portion with the connection portion 164a). The exposed portion 164b is exposed from the sealing member 190. The crushed portion 163 is formed to surround the entire periphery of the power terminal 160.

[0034] The power terminal 160 is formed by shearing a conductive flat plate material, for example, a metal plate. As shown in FIG. 3(c), one surface 165a of the power terminal 160 is a sagging surface where sagging 168a is formed at the end, and the other surface 165b of the power terminal 160 is a burr surface that connects to the fractured surface 168b of the side surface. In the crushed portion 163, the end of the other surface 165b of the power terminal 160 is recessed more than other parts of the other surface 165b of the power terminal 160 (see FIG. 3(d)).

[0035] The sealing member 190 seals the electronic elements 120A and 120B, the lower surface of the first terminal 130, the lower surface of the second terminal 140, the first connection frame 132, the second connection frame 142, and the power terminal 160 (the first portion 166 and the connection portion 164a of the second portion). The sealing member 190 is made of a thermosetting molding material that is mainly composed of epoxy resin with silica filler or the like added, and protects the electronic element 120 from environmental factors such as heat, light, and humidity.

[0036] The sealing member 190 has a base covering portion 192 that covers the base of the power terminal 160 protruding from the sealing member 190 (the base of the power terminal 190 protruding from the height position of the surface of the sealing member 190 other than the base covering portion 192) (see FIG. 1). The sealing member 190 also has a pin terminal base covering portion 193 that covers the base of the pin terminals 172, 174 or the pin terminals 182, 184 protruding from the sealing member 190 (the base of the pin terminals 172, 174 or the pin terminals 182, 184 protruding from the height position of the surface of the sealing member 190 other than the pin terminal base covering portion 193). The base covering portion 192 and the pin terminal base covering portion 193 have a shape that protrudes more than other portions of the sealing member 190. Although pin terminal base covering portion 193 covers the bases of two pin terminals together, it may cover each pin terminal individually or all four pin terminals together.

[0037] Next, the horizontal cross-sectional structure of the power terminal 160 and the cross-sectional structure of the crushed portion 163 will be described with reference to FIGS.

[0038] The power terminal 160 is manufactured by shearing a conductive flat plate (e.g., a flat metal plate) using a press. Specifically, as shown in FIG. 4(a), a flat metal plate 160' is placed on a die 210 with an opening, and a punch 200 presses it from above. At this time, tensile stress is generated in the metal plate 160' near the blades of the punch 200 and die 210, resulting in a sagging 168a on the surface (see FIG. 4(c)). If the load of the punch 200 is further increased, cracks occur in the metal plate 160', forming a fracture surface 168b. If the load is further increased, the metal plate 160' and the power terminal 160 are separated (see FIG. 4(c)), and the power terminal 160 can be manufactured (see FIG. 4(d)). At this time, burrs may be formed above the sheared surface, but these burrs are removed by polishing. In this manner, the power terminal 160 is formed.

[0039] As described above, power terminal 160 is manufactured by shearing a metal plate, and therefore has a burred surface and a sagging surface. One surface 165a of power terminal 160 is the sagging surface, and the other surface 165b of power terminal 160 is the burred surface.

[0040] As shown in FIG. 3(c), one surface 165a of the power terminal 160 is a sag surface with a smoothly rounded or inclined sag 168a formed at the end. The other surface 165b of the power terminal 160 is a burr surface connected to a fractured surface 168b on the side surface. The end of the other surface 165b is relatively flat. The fractured surface 168b is formed on the side of the power terminal 160, and is a slope that recesses from the side surface on the sag 168a side to the burr surface side.

[0041] The crushed portion 163 is formed to surround the entire periphery of the power terminal 160. In the crushed portion 163, one surface 165a of the power terminal 160 has a shape such that the drooping surface of the other portion is simply crushed. The other surface 165b of the power terminal 160 has a recessed portion 168c formed at an end portion that is recessed more than other portions of the other surface of the power terminal 160. In addition, the side portion of the power terminal 160 has a relief portion 169 formed when the crushed portion 163 of the power terminal 160 is formed (when the power terminal 160 is sandwiched between the pair of slide portions 24 in the sealing process described below) and the crushed material is pushed out to the side surface.

[0042] 2. Electronic module manufacturing method and electronic module manufacturing apparatus 1 (mold) according to the embodiment Next, a method for manufacturing an electronic module according to an embodiment will be described. As shown in Fig. 5, the method for manufacturing an electronic module according to an embodiment includes an assembly forming step, an accommodating step, and a sealing step in this order.

[0043] (Assembly forming process) First, the power terminal 160 formed in a flat plate shape is erected on the substrate 110 on which the electronic elements 120A and 120B are arranged, to form an assembly having the substrate 110, the electronic elements 120A and 120B, the first terminal 130, the second terminal 140, the first connection frame 132, the second connection frame 142, the internal connection frame 152, and the power terminal 160.

[0044] Specifically, the electronic elements 120A and 120B are placed on the circuit wiring 111 of the substrate 110 via a conductive bonding material (e.g., solder). Next, a lead frame is prepared, in which the first terminal 130, the second terminal 140, the first connection frame 132, the second connection frame 142, and the internal connection frame 152 are surrounded by a frame portion (not shown), and placed above the circuit wiring 111. At this time, the through holes of the first connection frame 132 and the through holes of the internal connection frame 152 are positioned above the electrodes (source electrodes) of the electronic elements 120A and 120B, respectively.

[0045] Next, the first portion 166 of the power terminal 160 is inserted into the elongated hole 156 of the lead frame (internal connection frame), the internal connection terminals 134 and 154 are inserted into the through-hole, and the pin terminals 172, 174, 182, and 184 are inserted into predetermined positions of the lead frame, so that the power terminal 160 and each pin terminal abut against the substrate 110, and the internal connection terminals 134 and 154 abut against the source electrodes of the electronic elements 120A and 120B. Note that the power terminal 160, internal connection terminals 134 and 154, and each pin terminal may be inserted into the lead frame in advance, and then the lead frame may be placed on the substrate 110 and electronic elements 120A and 120B.

[0046] Next, the substrate 110, the electronic elements 120A and 120B, the first terminals 130, the second terminals 140, the first connection frame 132, the second connection frame 142, the internal connection frame 152, and the power terminals 160 are electrically connected by appropriately joining them together. As a method for electrically joining them, for example, a conductive joining material (solder) may be placed in advance at the connection points, and the respective components may be brought into contact with each other and joined by melting the conductive joining material by reflow or the like.

[0047] (Configuration of mold 1) Before describing the accommodation step, we will first describe a mold 1, which is an electronic module manufacturing apparatus according to an embodiment that accommodates an assembly. As shown in Fig. 6, the mold 1 has a first mold 10, a second mold 20 facing the first mold 10, and a drive member 30, each of which can be moved in the vertical direction.

[0048] The first mold 10 has a first recess 11 formed on the surface facing the second mold 20, and a mounting portion on which a frame portion of a lead frame (not shown) is mounted.

[0049] The second mold 20 has a second recess 21 formed on the surface facing the first mold 10, and a power terminal accommodating hole 22 and a pin terminal accommodating hole 23 extending upward from the second recess 21. Slide portions 24 (24A to 24D) are provided on the inner sides of the power terminal accommodating hole 22 and the pin terminal accommodating hole 23. The second mold 20 is moved toward the first mold 10 and the first mold 10 and second mold 20 are brought together, whereby the first recess 11 and the second recess 21 form a first cavity C1.

[0050] The pair of slide portions 24 are provided on the inner sides of the power terminal accommodating holes 22 and the pin terminal accommodating holes 23. By sliding the pair of slide portions 24 horizontally, their tip portions protrude from the inner periphery of the power terminal accommodating holes 22, and the power terminals 160 and each pin terminal accommodated in the power terminal accommodating holes 22 and the pin terminal accommodating holes 23 can be sandwiched between the pair of slide portions 24. This makes it possible to separate the tip portions 28 of the power terminal accommodating holes 22 and the pin terminal accommodating holes 23 from the first cavity C1 on the board side. The tip portions of the pair of slide portions 24 are formed in a tapered shape.

[0051] 9, in a plan view, recesses 25A, 25B corresponding to the cross section of power terminal 160 are formed in tip portions 28 of a pair of slide portions 24A, 24B, respectively, and the shape of the bottom of recess 25B in slide portion 24B that abuts against power terminal 165A (sagging surface) has a shape corresponding to the shape of the sagging surface, and the shape of the bottom of recess 25A in slide portion 24A that abuts against power terminal 165B (burr surface) has a shape in which protrusions 26 are formed on both side walls of recess 25B. In addition, a notch 29 for forming relief portion 169 (see FIG. 4) is provided in a shoulder portion of at least one of recesses 25A, 25B.

[0052] The drive member 30 has a main body 31 and a pressing portion 32. The main body 31 is disposed on the second mold 20 (the side opposite to the first mold 10) and is configured to be movable up and down. The pressing portion 32 abuts against a slope 27 on the base end side of the slide portion 24. When the main body 31 of the drive member 30 approaches the second mold 20, the pressing portion 32 presses against the slope 27 on the base end side of the slide portion 24 (the side opposite to the tip end side of the power terminal), thereby sliding the pair of slide portions 24 toward the power terminal 160. Furthermore, by pulling out a separate pin (not shown), the pressing portion 32 (drive member 30) moves above the slope 27 on the base end side, and slides the pair of slide portions 24 in directions away from each other.

[0053] (Storage process) 6, in the accommodating step, the substrate 110, the electronic elements 120A and 120B, and the first portion 166 of the power terminal 160 on the substrate side are accommodated in the first cavity C1 of the mold 1, and the second portion 164 (more precisely, the exposed portion 164b) on the tip side of the power terminal 160 is accommodated in the power terminal accommodating hole 22 of the mold 1 extending from the inner surface of the first cavity C1.

[0054] Specifically, first, a frame portion (not shown) of a lead frame is placed on the opposing surface of a first mold 10, and the assembly is placed in a first recess 11 of the first mold 10. At this time, the heat dissipation metal plate 113 of the substrate 110 is placed in contact with the first recess 11. Next, as shown in FIG. 6, a second mold 20 is placed on the first mold 10. In this state, a first cavity C1 is formed, consisting of the first recess 11 of the first mold 10 and the second recess 21 of the second mold 20. The first cavity C1 accommodates the substrate 110, electronic elements 120A and 120B, first terminals 130, second terminals 140, first connection frame 132, second connection frame 142, internal connection frame 152, and first portion 166 of the power terminal 160. In addition, the power terminal accommodating hole 22 of the second mold 20 extending from the inner surface of the first cavity C1 accommodates the upper part (exposed part 164b) of the second portion 164 of the power terminal 160, and the pin terminal accommodating hole 23 of the second mold 20 extending from the inner surface of the first cavity C1 accommodates the upper parts of the pin terminals 172, 174, 182, 184.

[0055] In the accommodating step, after accommodating the power terminal 160 and each pin terminal in the power terminal accommodating hole 22 and the pin terminal accommodating hole 23, the pair of slide portions 24 are slid (protruded) from the inner periphery of the power terminal accommodating hole 22 and each pin terminal accommodating hole 23 to sandwich the second portion 164 of the power terminal 160 and each pin terminal (see FIG. 7). The position where the slide portions 24 sandwich the power terminal 160 is a position in the second portion 164 that is a predetermined distance away from the internal connection frame 152.

[0056] When the slide portions 24 clamp the power terminals 160, the main body portion 31 of the drive member 30 is moved toward the second mold 20 (see FIGS. 7 and 8). As a result, the pressing portions 32 press the slopes 27 on the base end sides of the pair of slide portions 24, causing the slide portions 24 to slide simultaneously and simultaneously clamp the power terminals 160. Similarly, the pair of slide portions 24 can simultaneously clamp each pin terminal.

[0057] At this time, the tip ends of the pair of slide portions 24 (slide portions 24A, 24B) bite into the outer periphery of the power terminal 160, forming a crushed portion 163. Furthermore, when the pair of slide portions 24 sandwich the power terminal 160, the power terminal 160 is surrounded by the inner periphery of the power terminal accommodating hole 22 and the slide portions 24, forming a second cavity C2 in a space connected to the first cavity C1 (see FIG. 7). Furthermore, the slide portions 24 isolate the space covering the exposed portion 166a of the power terminal 160 from the second cavity C2.

[0058] Similarly, for the pin terminals, the tip ends of the pair of slide portions 24 (slide portions 24C, 24D) bite into the outer periphery of each pin terminal, forming a recess (see reference numeral 963 in FIG. 11 for the configuration of the recess). When the pair of slide portions 24 (slide portions 24C, 24D) sandwich the pin terminal, the pin terminal is surrounded by the inner periphery of the pin terminal accommodating hole 23 and the slide portions 24, forming a third cavity C3 in a space connected to the first cavity C1. Furthermore, the slide portions 24 isolate the space covering the tip ends of each pin terminal from the third cavity C3.

[0059] (Sealing process) Next, the sealing member 190 (resin) is poured into the first cavity C1 to seal the substrate 110, the electronic element 120, and the first portion 166 of the power terminal 160 with the sealing member 190 (see FIG. 10). The sealing member 190 (resin) also flows from the first cavity C1 into the second cavity C2 to form a base covering portion 192, and the sealing member 190 (resin) also flows into the third cavity C3 to form a pin terminal base covering portion 193.

[0060] After the resin that makes up the sealing member 190 (including the base covering portion 192 and the pin terminal base covering portion 193) has hardened, the electronic module 100 is removed from the mold 1. Thereafter, the frame portion (not shown) of the lead frame is cut off. In this manner, the electronic module 100 can be manufactured.

[0061] 3. Effects of the Electronic Module 100, Electronic Module Manufacturing Method, and Manufacturing Apparatus 1 According to the Embodiment According to the electronic module 100 of the embodiment, the power terminals 160 have crushed portions 163 that are recessed more than other portions at positions that contact the surface of the sealing member 190, so that when sealing is performed using the mold 1, gaps are less likely to occur between the mold 1 (slide portion 24) and the power terminals 160, and resin leakage can be prevented. As a result, the electronic module 100 of the embodiment is an electronic module that is less likely to experience resin leakage during the sealing process, despite using plate-shaped power terminals 160.

[0062] Furthermore, the electronic module 100 and the method for manufacturing the electronic module according to the embodiment include an internal connection frame 152, which is a flat plate-like member having elongated holes 156 (see FIG. 2(b)), and which supports the power terminals and electrically connects the electronic elements 120A, 120B to the power terminals 160, and therefore can stably support the plate-like power terminals 160. Furthermore, since the internal connection frame 152 and the power terminals 160 can form circuit wiring, the installation area for wiring on the substrate can be reduced, and the electronic module can be made smaller. Furthermore, since circuit wiring can be formed in a three-dimensional space, the electronic module has a high degree of design freedom.

[0063] Furthermore, in the electronic module 100 according to the embodiment, the first portion 166 of the power terminal 160 located on the substrate side of the internal connection frame 152 is press-fit into the elongated hole 156, which allows for stable support of the power terminal 160 and also improves adhesion between the internal connection frame 152 and the power terminal 160. Furthermore, the second portion 164 located on the opposite side of the internal connection frame 152 from the substrate side is formed wider than the first portion 166, which increases the cross-sectional area of ​​the current path and makes it easier to pass a large current.

[0064] Furthermore, in the electronic module 100 according to the embodiment, the end of the other surface 165b (burred surface) of the power terminal 160 is recessed in the crushed portion 163 relative to other portions of the other surface 165b of the power terminal 160, so that the slide portion 24 can be inserted into the other surface 165b of the power terminal 160 in the sealing process, thereby reliably preventing resin leakage from fractured surfaces, etc. Note that even if an attempt is made to remove gouges near the fractured surfaces (portions recessed inward from the end of the burred surface) by crushing the entire burred surface, the crushed flesh will not adhere to the gouges. However, because the end of the other surface 165b (burred surface) of the power terminal 160 is recessed relative to other portions of the other surface 165b of the power terminal 160, the gouges can be filled.

[0065] Furthermore, according to the electronic module 100 of the embodiment, the crushed portion 163 is formed to surround the entire power terminal 160, so that in the sealing process, the slide portion 24 is forced to bite into the entire plate-shaped power terminal 160, making it possible to more reliably prevent resin leakage.

[0066] Furthermore, according to the electronic module 100 of the embodiment, in the crushed portion 163, an escape portion 169 that protrudes outward is formed on the side of the power terminal 160. Therefore, during the storage process, the material of the plate material crushed by the slide portion 24 is pushed out into the escape portion 169, which prevents the material from being pushed out to an unexpected location and deforming the power terminal 160, and also prevents a gap from forming between the slide portion 24 and the power terminal 160, which could cause resin leakage.

[0067] Furthermore, according to the electronic module 100 of this embodiment, the sealing member 190 has a base covering portion 192 that covers the base of the power terminal 160 protruding from the sealing member 190, so that the creepage distance from the power terminal 160 and the adjacent pin terminal 172 or other portions exposed from the sealing member 190 can be increased, resulting in an electronic module with fewer malfunctions. Furthermore, the exposed portions of the power terminal 160 that are vulnerable to shock and exposed from the sealing member 190 can be protected, resulting in an electronic module with high shock resistance.

[0068] Furthermore, the electronic module 100 according to the embodiment includes pin-shaped pin terminals 172 and the like standing upright from the substrate 110, and the sealing member 190 has a pin terminal base covering portion 193 that covers the base of the pin terminals 172 and the like protruding from the sealing member 190, so that the creepage distance from the power terminals 160 adjacent to the pin terminals 172 and the portions of other pin terminals and the like that are exposed from the sealing member 190 can be increased, resulting in an electronic module with fewer malfunctions. Furthermore, the portions of the pin terminals 172 and the like that are exposed from the sealing member 190 can be protected, resulting in an electronic module with high impact resistance in this respect as well.

[0069] According to the manufacturing method of the electronic module of the embodiment, the power terminal 160 is clamped by a pair of slide portions 24, thereby separating the tip portion of the power terminal 160 from the first cavity C1, and when the power terminal 160 is clamped by the pair of slide portions 24, the tip portions of the pair of slide portions 24A, 24B protruding from the inner circumference of the power terminal accommodating hole 22 bite into the outer circumference of the second portion 164 of the power terminal 160 to form a crushed portion 163, so that a gap is less likely to occur between the mold 1 (slide portions 24) and the power terminal 160, and resin leakage can be prevented.

[0070] Furthermore, according to the method for manufacturing an electronic module according to the embodiment, the leading ends of the pair of slide portions 24 are both formed in a tapered shape, so that in the sealing process, when the power terminals 160 are sandwiched, crushed portions 163 can be easily formed in the power terminals 160, and the slide portions 24 can be made to bite into the power terminals 160. As a result, gaps are less likely to occur between the power terminals 160 and the slide portions 24.

[0071] Furthermore, according to the manufacturing method and manufacturing apparatus for an electronic module of the embodiment, in the accommodation step, recesses 25A, 25B corresponding to the cross section of the power terminal 160 in a plan view are formed at the tip portions of the pair of slide portions 24 of the mold 1, respectively, and the shape of the bottom of the recess 25A of the slide portion 24A that abuts against one surface (sagging surface) 165a of the pair of slide portions 24 has a shape that corresponds to the shape of the one surface (sagging surface) 165a, and the shape of the bottom of the recess 25B of the slide portion 24B that abuts against the burr surface of the pair of slide portions 24 has a shape in which convex portions 26 are formed on both side wall sides of the recess 25B, so that a crushed portion 163 corresponding to the difference between the sagging surface and the burr surface can be formed, and resin leakage can be more reliably prevented.

[0072] Furthermore, according to the manufacturing method of the electronic module of the embodiment, a notch 29 is provided in the shoulder portion of the recesses 25A, 25B in at least one of the pair of slide portions 24 (slide portion 24B). Therefore, when the power terminal 160 is clamped by the slide portion 24 in the accommodation process to form a crushed portion, the material of the power terminal 160 moves to the portion of the notch 29, and an escape portion 169 can be formed.

[0073] Although the present invention has been described above based on the above embodiment, the present invention is not limited to the above embodiment and can be embodied in various forms without departing from the spirit of the present invention, and for example, the following modifications are also possible.

[0074] (1) The positions, connections, numbers, etc. described in the above embodiments (including each modified example; the same applies below) are examples and can be changed within the scope that does not impair the effects of the present invention.

[0075] (2) In the above embodiment, the present invention is applied to an electronic module that uses pin terminals, but the present invention is not limited to this. The present invention may also be applied to an electronic module that does not use pin terminals.

[0076] (3) In the above embodiment, the present invention is applied to a terminal used as a midpoint terminal as a power terminal, but the present invention is not limited to this. The present invention may also be applied to a terminal other than a midpoint terminal (for example, a first terminal or a second terminal).

[0077] (4) In the above embodiment, the present invention is applied to an electronic module having an internal connection frame, but the present invention is not limited to this. The present invention may also be applied to an electronic module that does not have an internal connection frame.

[0078] (5) In the above embodiment, the first mold is the upper mold and the second mold is the lower mold, but the present invention is not limited to this. The first mold may be the lower mold and the second mold may be the upper mold. In this case, the lead frame is placed on the opposing surface of the second mold with the power terminals and pin terminals of the assembly inserted into the power terminal accommodating holes 22 and pin terminal accommodating holes 23 of the second mold. Then, a driving member is also placed below the second mold, and the pair of sliding members is moved horizontally by moving the pressing member upward. [Explanation of symbols]

[0079] 1... manufacturing apparatus (mold), 22... power terminal accommodating hole, 24, 24A, 24B, 24C, 24D... slide portion, 25A, 25B... recess, 26... protrusion, 29... notch, 100... electronic module, 110... substrate, 120A, 120B... electronic element, 152... internal connection frame, 153... elongated hole, 160... power terminal, 163... crushed portion, 165A... one surface, 165b... other surface, 168a... sagging, 168b... fracture surface, 168c... recessed portion, 169... relief portion, 170... sealing member, 172, 174, 182, 184... pin terminal, 190... sealing member, 192... base covering portion, 193... pin terminal base covering portion, C1... first cavity

Claims

1. A substrate; an electronic element disposed on the substrate; a flat power terminal standing on the substrate, the substrate, the electronic element, and the power terminal are sealed with a sealing member, The power terminal has at least a tip portion protruding from the sealing member, and has a crushed portion at a position where it contacts the surface of the sealing member that is recessed more than other portions.

2. an internal connection frame that is a flat plate-like member having an elongated hole, and that supports the power terminal and electrically connects the electronic element and the power terminal; the sealing member seals the substrate, the electronic element, the internal connection frame, and the power terminal; In the power terminal, a first portion of the internal connection frame located on the substrate side is press-fitted into the elongated hole; 2. The electronic module according to claim 1, wherein a second portion of the internal connection frame located on the opposite side from the substrate is formed to be wider than the first portion.

3. one surface of the power terminal is a sagging surface on which a sagging is formed at an end portion; the other surface of the power terminal is a burr surface connected to the fractured surface of the side surface, 3. The electronic module according to claim 1, wherein the end of the other surface of the power terminal in the crushed portion is recessed more than other portions of the other surface of the power terminal.

4. 3. The electronic module according to claim 1, wherein the crushed portion is formed so as to surround the power terminal.

5. 3. The electronic module according to claim 1, wherein the crushed portion has a relief portion formed on a side surface of the power terminal that protrudes outward.

6. 3. The electronic module according to claim 1, wherein the sealing member has a base covering portion that covers the base of the power terminal at a portion that protrudes from the sealing member.

7. The substrate further includes a pin terminal having a pin shape and at least a tip portion thereof protruding from the sealing member.

3. The electronic module according to claim 1, wherein the sealing member has a pin terminal base covering portion that covers the base of the pin terminal at a portion that protrudes from the sealing member.

8. an assembly forming step of erecting a flat power terminal on a substrate on which an electronic element is to be disposed, to form an assembly including the substrate, the electronic element, and the power terminal; an accommodating step of accommodating the substrate, the electronic element, and the first portion of the power terminal on the substrate side in a first cavity of a mold, and accommodating a second portion of the power terminal on the tip side in a power terminal accommodating hole extending from an inner surface of the first cavity; a sealing step of sealing the substrate, the electronic element, and the first portion of the power terminal by pouring a sealing material into the first cavity, a first cavity provided on the mold for inserting the second portion of the power terminal into the power terminal accommodating hole, and a second cavity provided on the mold for inserting the second portion of the power terminal into the power terminal accommodating hole; a pair of slide portions provided on the mold for inserting the second portion of the power terminal into the power terminal accommodating hole, the pair of slide portions being caused to protrude from an inner periphery of the power terminal accommodating hole and sandwiching the power terminal between the pair of slide portions, thereby separating the tip portion of the second portion of the power terminal from the first cavity and forming a crushed portion by having the tip portions of the pair of slide portions bite into the outer periphery of the second portion of the power terminal.

9. 9. The method for manufacturing an electronic module according to claim 8, wherein the leading ends of the pair of slide portions are both formed in a tapered shape.

10. one surface of the power terminal is a sagging surface on which a sagging is formed at an end portion; the other surface of the power terminal is a burr surface connected to the fractured surface of the side surface, In the accommodating step, the pair of slide portions of the mold each have a recess formed at a tip end thereof, the recess corresponding to a cross section of the power terminal, as viewed from above; The shape of the bottom of the recess of the slide portion that contacts the sagging surface of the pair of slide portions corresponds to the shape of the sagging surface, 10. The method for manufacturing an electronic module according to claim 8, wherein the shape of the bottom of the recess of one of the pair of slide portions that abuts against the burr surface is such that a convex portion is formed on both side walls of the recess.

11. 10. The method for manufacturing an electronic module according to claim 8, wherein a notch is provided in a shoulder portion of the recess in at least one of the pair of slide portions.

12. In the assembly forming step, an internal connection frame is assembled, which is a flat plate-like member having an elongated hole, and which supports the power terminal and electrically connects the electronic element and the power terminal, and a first portion of the power terminal is press-fitted into the elongated hole to support the power terminal and electrically connect the electronic element and the power terminal, In the sealing step, the substrate, the electronic element, the internal connection frame, and the power terminal are sealed with a sealing member, 10. The method for manufacturing an electronic module according to claim 8, wherein the second portion of the power terminal is formed to be wider than the first portion.

13. An electronic module manufacturing apparatus for carrying out the electronic module manufacturing method according to claim 8, a first mold including the power terminal insertion hole and the pair of slide portions; a second mold opposed to the first mold, one surface of the power terminal is a sagging surface on which a sagging is formed at an end portion; the other surface of the power terminal is a burr surface connected to the fractured surface of the side surface, When viewed from above, a recess is formed at each of the tip ends of the pair of slide portions, the recess corresponding to a cross section of the power terminal, The shape of the bottom of the recess in the slide portion of the pair of slide portions that contacts the sagging surface has a shape corresponding to the shape of the sagging surface, An electronic module manufacturing apparatus, characterized in that the shape of the bottom of the recess in one of the pair of slide portions that abuts the burr surface has a shape in which a convex portion is formed on the side wall of the recess.

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