Tiling substrate for LED display device

Abstract

To provide a Tiling substrate for an LED display device, which facilitates laying-out of wiring connected to each LED while securing an LED mounting region.SOLUTION: The Tiling substrate for the LED display device comprises: scan signal wiring and scan signal wiring installed on a display side; a video pad group and a scan pad group installed on a back side; a video signal through-hole installation part that forms a video signal through-hole for connecting wiring from the video pad group and the video signal wiring; and a scan signal through-hole installation part that forms a scan signal through-hole for connecting wiring from the scan pad group and the scan signal wiring. The video pad group is disposed in a part where the scan signal through-hole installation part is not disposed, or disposed in a part where the scan signal through-hole installation part is disposed such that a dummy pad is installed. The scan pad group is disposed in a part where the video signal through-hole installation part is not disposed, or disposed in a part where the video signal through-hole installation part is disposed such that a dummy pad is installed.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a tiling substrate for an LED display device. [Background technology]

[0002] In recent years, it has become possible to increase the screen size of display devices by using a tiling module formed by arranging a plurality of tiling substrates, each having LEDs (Light Emitting Diodes) mounted thereon, in a tiled pattern.

[0003] The following patent document describes the following prior art: A module substrate having a plurality of light-emitting elements mounted on its upper surface is provided with through-holes penetrating the module substrate and vias provided within the through-holes in a non-pixel region outside the pixel region of the module substrate. Each light-emitting element is connected to a drive circuit provided on the lower surface via upper pads, wiring, and vias on the upper surface of the module substrate, and lower pads and wiring on the lower surface of the module substrate. The plurality of display modules are then placed on a support substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2023-504666 Summary of the Invention [Problem to be solved by the invention]

[0005] However, due to the increasing mounting density of LEDs, it is becoming increasingly difficult to layout the wiring connecting to each LED while ensuring a sufficient area for mounting the LEDs. The above prior art cannot address this problem.

[0006] The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a tiling substrate for an LED display device that makes it easy to layout the wiring connected to each LED while ensuring a sufficient area for mounting the LEDs. [Means for solving the problem]

[0007] The above problems can be solved by the following means.

[0008] A plurality of video signal wirings are provided on the front surface side of the tiling substrate for the LED display device, for supplying power to the plurality of LEDs provided on the front surface side; a scan signal wiring arranged on the front surface side for controlling the conduction and non-conduction of power to the plurality of LEDs; At least one group of video pads to be connected to an output terminal of at least one video driver IC that outputs a video signal and is installed on a rear side of the tiling substrate for the LED display device; At least one scan pad group is disposed on the rear surface side and is connected to an output terminal of at least one scan driver IC that outputs a scan signal; at least one video signal through hole providing portion for forming a video signal through hole for connecting a wiring extending from each pad of the group of video pads to the video signal wiring; at least one scan signal through hole providing portion for forming a scan signal through hole for connecting a wiring extending from each scan pad of the scan pad group to the scan signal wiring, the wiring extending from each video pad of the video pad group and the at least one video signal through hole installation portion are electrically insulated from the wiring extending from each scan pad of the scan pad group and the scan signal through hole installation portion; the video pad group is arranged in a portion where the scan signal through hole installation portion is not arranged when viewed from above, or is arranged so that an electrically floating dummy pad is installed in a portion where the scan signal through hole installation portion is arranged, A tiling substrate for an LED display device, in which the scan pad group is arranged in a portion where the through hole installation portion for video signals is not arranged when viewed in a plane, or in a portion where the through hole installation portion for video signals is arranged so that an electrically floating dummy pad is arranged. [Effects of the Invention]

[0009] In a tiling substrate for an LED display device, it is possible to easily layout the wiring connected to each LED while ensuring a sufficient area for mounting the LEDs. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is an explanatory diagram showing a simplified example of the configuration of a tiling substrate. [Figure 2] 10 is an explanatory diagram showing a simplified connection relationship between each LED, a TGV for a video signal, and a TGV for a scan signal on the surface of a tiling substrate. FIG. [Figure 3] FIG. 10 is a cross-sectional view of a portion of the tiling substrate where LEDs are mounted. [Figure 4] 10 is an explanatory diagram showing a simplified layout configuration of a portion of the TGV for video signals and the TGV for scan signals of the tiling substrate. FIG. [Figure 5] FIG. 1 is a cross-sectional view of a tiling substrate. [Figure 6] FIG. 1 is an explanatory diagram showing a simplified example of a layout configuration on the surface of a tiling substrate. [Figure 7] FIG. 10 is an explanatory diagram showing a simplified example of the layout configuration of the rear surface of the tiling substrate. [Figure 8] 10 is an explanatory diagram showing a state in which film substrates are connected to a group of FOG pads for video signals and a group of FOG pads for scan signals on the back surface of the tiling substrate. FIG. [Figure 9] FIG. 10 is an explanatory diagram showing the layout of a group of scan signal FOG pads, a group of video signal TGVs, and wiring extending from the group of scan signal FOG pads. [Figure 10]FIG. 10 is an explanatory diagram showing an example of the layout of a group of FOG pads for scan signals and a group of TGVs for video signals. [Figure 11] FIG. 10 is an explanatory diagram showing an example of the layout of wiring extending from a group of TGVs for video signals and a group of FOG pads for scan signals. [Figure 12] FIG. 10 is an explanatory diagram showing another example of the layout of the wiring extending from the group of TGVs for video signals and the group of FOG pads for scan signals. [Figure 13] FIG. 10 is a diagram showing a modified example of a dummy pad. [Figure 14] FIG. 10 is an explanatory diagram simply showing another example of the layout configuration on the back surface of the tiling substrate. [Figure 15] FIG. 10 is an explanatory diagram simply showing another example of the configuration of the tiling substrate. [Figure 16] FIG. 10 is a diagram showing a pixel circuit that performs constant current control and PWM control for each LED. [Figure 17] FIG. 2 is a cross-sectional view showing a TFT layer in which a TFT of a pixel circuit is formed. [Figure 18] FIG. 10 is a diagram showing a first example of a layout of a scan signal TGV region and a scan signal FOG pad group. [Figure 19] FIG. 10 is a diagram showing a second example of the layout of the scan signal TGV region and the scan signal FOG pad group. [Figure 20] FIG. 10 is a diagram showing a third example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 21] FIG. 10 is a diagram showing a fourth example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 22] FIG. 10 is a diagram showing a fifth example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 23] FIG. 10 is a diagram showing a sixth example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 24] FIG. 10 is a diagram showing a seventh example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 25] FIG. 10 is a diagram showing an eighth example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 26] FIG. 13 is a diagram showing a ninth example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 27] FIG. 19 is a diagram showing a tenth example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 28] FIG. 11 is a diagram showing an eleventh example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 29] FIG. 12 is a diagram showing a twelfth example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 30] FIG. 13 is a diagram showing a thirteenth example of the layout of the scan signal TGV area and the scan signal FOG pad group. [Figure 31] This is a diagram of the surface of a Tiling module in which multiple Tiling substrates are arranged in a tiled pattern. [Figure 32] This is a diagram of the back side of a Tiling module in which multiple Tiling substrates are arranged in a tiled pattern. [Figure 33] FIG. 10 is a diagram showing each LED, video signal wiring, and scan signal wiring on the surface of a tiling substrate of a comparative example. [Figure 34] FIG. 10 is an explanatory diagram for explaining side wiring. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, a tiling substrate for an LED display device will be described in detail with reference to the drawings. The described embodiments are merely exemplary, and various modifications are possible from such embodiments. Hereinafter, the same reference numerals in the drawings refer to the same components, and the size of each component in the drawings is exaggerated for clarity and convenience of description.

[0012] Hereinafter, the expressions "upper" or "above" include not only what is directly above / below / left / right in contact, but also what is above / below / left / right without contact.

[0013] Terms such as "first" and "second" are used to describe various components, but are used only to distinguish one component from another, and are not intended to limit the materials or structures of the components.

[0014] The singular expressions include the plural expressions unless the context clearly indicates otherwise. Furthermore, when a part "comprises" a certain element, this does not mean that other elements are excluded, but that other elements may also be included, unless otherwise specified to the contrary.

[0015] In addition, terms such as "unit" and "module" used in the specification refer to a unit that processes one or more functions or operations, and may be realized by hardware or software, or a combination of hardware and software.

[0016] For ease of explanation, the surface of the tiling substrate 100 on which the LEDs 101 to 103 (see FIG. 2) are mounted will be referred to as the "front surface," and the surface opposite to the "front surface" will be referred to as the "back surface."

[0017] FIG. 1 is an explanatory diagram simply showing an example of the configuration of the Tiling substrate 100. FIG. 2 is an explanatory diagram simply showing the connection relationship between each LED, a TGV (Through Glass Via) 110 for video signals, and a TGV 120 for scan signals on the front surface of the Tiling substrate 100. FIG. 3 is a cross-sectional view of a part of the Tiling substrate 100 on which LEDs 101 to 103 are mounted. FIG. 4 is an explanatory diagram simply showing the layout configuration of a part of the TGV 110 for video signals and the TGV 120 for scan signals on the Tiling substrate 100. FIG. 5 is a diagram showing a cross-sectional view of the Tiling substrate 100. FIG. 6 is an explanatory diagram simply showing an example of the layout configuration of the front surface of the Tiling substrate 100. FIG. 7 is an explanatory diagram simply showing an example of the layout configuration of the back surface of the Tiling substrate 100.

[0018] 1 and 2 show examples of the configuration and connections of a passive matrix driving system.

[0019] As shown in FIG. 1, in the tiling substrate 100, the LEDs 101 to 103 mounted on the front surface of a glass substrate 190 (see FIG. 3) are connected to a video driver IC 150 and a scan driver IC 170 mounted on the rear surface of the glass substrate 190. The LEDs 101, 102, and 103 may be red, green, and blue light-emitting diodes, respectively. The LEDs 101 to 103 may be micro LEDs (uLEDs). Three LEDs emitting different colors (red, green, and blue) form one pixel. The LEDs 101 to 103 are arranged in a matrix. Hereinafter, the LEDs 101 to 103 arranged in the same column in the column direction are referred to as the LEDs 101 to 103 of the same column. The LEDs 101 to 103 arranged in the same row in the row direction are referred to as the LEDs 101 to 103 of the same row. The column direction may correspond to the vertical direction when the tiling substrate 100 is viewed in a plan view. The row direction may correspond to the horizontal direction when the tiling substrate 100 is viewed in a plan view. However, the vertical direction and the horizontal direction only need to be relatively orthogonal to each other, and the relationship is such that when one direction is set, the other direction is determined.

[0020] The video driver IC 150 supplies video signals to the LEDs 101 to 103 in the same column via the video signal wiring 111 connected to each of the LEDs 101 to 103. That is, the video driver IC 150 supplies different video signals to each column via the multiple video signal wirings 111 corresponding to the multiple columns. This allows power to be supplied to each of the LEDs 101 to 103 in the row selected by the scan signal supplied from the scan driver IC 170.

[0021] The scan driver IC 170 supplies scan signals to the LEDs 101 to 103 in the same row via scan signal wiring 121 connected to each of the LEDs 101 to 103. That is, the scan driver IC 170 supplies different scan signals to each row via a plurality of scan signal wirings 121 corresponding to the plurality of rows. This allows the scan signal supplied from the scan driver IC 170 to select any one of the rows as a row to which power can be supplied to the LEDs 101 to 103.

[0022] As shown in FIG. 2, a plurality of blocks, each including a plurality of pixels, are set in the tiling substrate 100. For ease of explanation, three blocks (block (1), block (2), and block (3)) are shown in FIG. 2. A video signal TGV 110 and a scan signal TGV 120 may be provided in each block. Furthermore, on the surface of the tiling substrate 100, a common video signal wiring 111 may be connected to the LEDs 101 to 103 in the same column in each block. Furthermore, on the surface of the tiling substrate 100, a common scan signal wiring 121 may be connected to the LEDs 101 to 103 in the same row in each block. The video signal TGV 110 and the scan signal TGV 120 are vias corresponding to the video signal through holes and the scan signal through holes, respectively. Note that, although the example in FIG. 2 illustrates simultaneous control by six video signal wirings 111, the number of video signal wirings 111 for simultaneous control is not limited to six.

[0023] In the passive matrix driving method, the current to all of the LEDs 101 to 103 is controlled by a video driver IC 150 and a scan driver IC 170 mounted on the back surface of the tiling substrate 100. Therefore, in the passive matrix driving method, variations in the current applied to the LEDs 101 to 103 are less likely to occur compared to the active matrix driving method described below.

[0024] As shown in FIG. 3, a wiring layer 180 is provided on a glass substrate 190 of the tiling substrate 100, and each LED can be connected to an LED pad formed as the uppermost layer M3 of the wiring layer 180 (see FIG. 5).

[0025] In Fig. 4, the video signal TGV 110 is indicated by a thin circle, and the scan signal TGV 120 is indicated by a thick circle. Furthermore, the video signal wiring 111 is indicated by a thick dashed line, and the scan signal wiring 121 is indicated by a thick solid line. In Fig. 4, only a portion of the video signal wiring 111 and the scan signal wiring 121 is shown.

[0026] As shown in Fig. 5, three metal wiring layers, M1 to M3, may be stacked via an interlayer insulating film as the wiring layer 180 on the front surface side of the tiling substrate 100. For example, the M1 layer is used to form the scan signal wiring 121, and the M2 layer is used to form the video signal wiring 111. The M1 layer and the M2 layer may be connected via a first via Via1. The M3 layer may be used to form pads for connecting the terminals of the LEDs 101 to 103 to the video signal wiring 111 and the scan signal wiring 121. The M2 layer and the M3 layer may be connected via a second via Via2.

[0027] As the wiring layer 185 on the back side of the tiling substrate 100, three metal wiring layers, M4 layer to M6 layer, may be stacked via an interlayer insulating film. For example, the M4 layer is used to form the scan signal wiring 121, and the M5 layer is used to form the video signal wiring 111. The M4 layer and the M5 layer may be connected via a third via Via3. The M6 ​​layer may be used to form FOG pads for connecting the film substrate 160 (see FIG. 8 ), on which the video driver IC 150 and the scan driver IC 170 are respectively mounted, to the video signal wiring 111 and the scan signal wiring 121, respectively. The film substrate 160 may be formed, for example, by an FPC (Flexible Printed Circuits). The M5 layer and the M6 ​​layer may be connected via a fourth via Via4.

[0028] The M1 layer and the M4 layer are connected by a TGV 110 for video signals or a TGV 120 for scan signals.

[0029] As shown in FIG. 6, a video signal TGV region 112 and a scan signal TGV region 122 are set on the tiling substrate 100. The video signal TGV region 112 is a region for forming video signal TGVs 110, and constitutes a video signal through-hole installation portion. Hereinafter, the plurality of video signal TGVs 110 formed in the video signal TGV region 112 will also be referred to as a "video signal TGV group 114." The scan signal TGV region 122 is a region for forming scan signal TGVs 120, and constitutes a scan signal through-hole installation portion. Hereinafter, the plurality of scan signal TGVs 120 formed in the scan signal TGV region 122 will also be referred to as a "scan signal TGV group 124."

[0030] In the tiling substrate 100, the LEDs 101 to 103 in the same column in the same block are connected to each other by the video signal wiring 111 in the M2 layer, which is connected to one video signal TGV 110. The LEDs 101 to 103 in the same row in the same block are connected to each other by the scan signal wiring 121 in the M1 layer, which is connected to one scan signal TGV 120.

[0031] In FIG. 6, only some of the video signal TGVs 110, video signal wiring 111, scan signal TGVs 120, and scan signal wiring 121 of the M1 layer are shown.

[0032] As shown in FIG. 7, a group of FOG (Film On Glass) pads 113a for video signals (hereinafter also referred to as "video signal FOG pad group 113") and a group of FOG pads 123a for scan signals (hereinafter also referred to as "scan signal FOG pad group 123") are formed on the back surface side of the tiling substrate 100. The video signal FOG pads 113a are FOG pads connected to output terminals of the video driver IC 150. The scan signal FOG pads 123a are FOG pads connected to output terminals of the scan driver IC 170. One or more video signal FOG pad groups 113 are formed. One or more scan signal FOG pad groups 123 are formed. The video signal FOG pad group 113 constitutes a video pad group. The scan signal FOG pad group 123 constitutes a scan pad group.

[0033] 7, the video signal FOG pad group 113 is arranged in a portion where the scan signal TGV region 122 is not arranged when the rear surface of the Tiling substrate 100 is viewed in plan. The scan signal FOG pad group 123 is also arranged in a portion where the video signal TGV region 112 is arranged when the rear surface of the Tiling substrate 100 is viewed in plan. In this case, as will be described later, the scan signal FOG pad group 123 can be arranged so that an electrically floating dummy pad (see FIG. 10) is arranged in the portion where the video signal TGV region 112 is arranged.

[0034] The scan signal FOG pad group 123 may be arranged in a portion where the video signal TGV region 112 is not arranged when the rear surface of the tiling substrate 100 is viewed in plan.

[0035] The video signal FOG pad group 113 may also be arranged in the portion where the scan signal TGV region 122 is arranged when the rear surface of the tiling substrate 100 is viewed in plan. In this case, the video signal FOG pad group 113 may be arranged such that dummy pads that are not electrically conductive are arranged in the portion where the scan signal TGV region 122 is arranged.

[0036] The wiring in the M5 layer extending from each video signal FOG pad 113a in the video signal FOG pad group 113 is connected to the video signal TGV 110. The video signal TGV 110 connects the wiring in the M5 layer extending from each video signal FOG pad 113a to the video signal wiring 111 in the M2 layer connected to the LEDs 101 to 103 via the first via Via1, the third via Via3, etc. For convenience, the wiring extending from each video signal FOG pad 113a in the video signal FOG pad group 113 is distinguished from the video signal wiring 111, but when the two are connected, they can both be said to form the video signal wiring 111.

[0037] The wiring on the M4 layer extending from each scan signal FOG pad 123a in the scan signal FOG pad group 123 is connected to the scan signal TGV 120. The scan signal TGV 120 connects the wiring on the M4 layer extending from each scan signal FOG pad 123a to the scan signal wiring 121 on the M1 layer connected to the LEDs 101 to 103. For convenience, the wiring extending from each scan signal FOG pad 123a in the scan signal FOG pad group 123 is distinguished from the scan signal wiring 121, but when the two are connected, they can both be said to form the scan signal wiring 121.

[0038] The wiring and video signal TGVs 110 extending from each video signal FOG pad 113a in the video signal FOG pad group 113, and the wiring and scan signal TGVs 120 extending from each scan signal FOG pad in the scan signal FOG pad group 123 are laid out so as to be electrically insulated from each other.

[0039] FIG. 8 is an explanatory diagram showing a state in which the film substrate 160 is connected to the video signal FOG pad group 113 and the scan signal FOG pad group 123 on the back surface of the tiling substrate 100, respectively.

[0040] A film substrate 160 on which a video driver IC 150 is mounted is mounted on the video signal FOG pad group 113. Specifically, the film substrate 160 is mounted on the video signal FOG pad group 113 so that each video signal FOG pad 113a is connected to each wiring of the film substrate 160 that is connected to the output terminal of the video driver IC 150. The film substrate 160 is mounted on the video signal FOG pad group 113 using, for example, an anisotropic conductive film (ACF).

[0041] A film substrate 160 on which a scan driver IC 170 is mounted is mounted on the scan signal FOG pad group 123. Specifically, the film substrate 160 is mounted on the scan signal FOG pad group 123 so that each scan signal FOG pad 123a is connected to each wiring of the film substrate 160, which is connected to the output terminal of the scan driver IC 170. The film substrate 160 is mounted on the scan signal FOG pad group 123 using, for example, ACF.

[0042] The number of video driver ICs 150 and scan driver ICs 170 mounted on the tiling substrate 100 is not limited.

[0043] FIG. 9 is an explanatory diagram showing the layout of the scan signal FOG pad group 123, the video signal TGV group 114, and the wiring extending from the scan signal FOG pad group 123. In FIG. 9, only some of the wiring extending from the scan signal FOG pad group 123 is shown. FIG. 10 is an explanatory diagram showing an example of the layout of the scan signal FOG pad group 123 and the video signal TGV group 114. FIG. 10 corresponds to the part circled in thin lines in FIG. 9. FIG. 11 is an explanatory diagram showing an example of the layout of the wiring (scan signal wiring 121) extending from the video signal TGV group 114 and the scan signal FOG pad group 123. FIG. 11 corresponds to the part circled in thick lines in FIG. 9.

[0044] In the example of FIG. 9, the scan signal FOG pad group 123 is also arranged in the area where the video signal TGV region 112 is arranged. As shown in FIG. 10, the scan signal FOG pad group 123 can be arranged so that dummy pads that are not electrically conductive are arranged in the area where the video signal TGV region 112 is arranged. The dummy pads can be electrically floating. Therefore, no problems will occur even if the video signal TGV 110 and the dummy pads come into contact with each other.

[0045] As shown in FIG. 11 , the wires extending from the scan signal FOG pad group 123 (which may also be referred to as scan signal wires 121) are arranged parallel to each other at the portions where they intersect with the video signal TGV region 112. In the example of FIG. 11 , the multiple wires extending from the scan signal FOG pad group 123 are adjacent to each other with one video signal TGV 110 sandwiched between them. The width of the wires extending from the scan signal FOG pad group 123 may be 185 μm, and the diameter of the video signal TGV 110 may be 170 μm. The minimum distance between the wires extending from the scan signal FOG pad group 123 and the video signal TGV 110 may be 30 μm. However, these numerical values ​​are merely examples, and the wires are not limited to the above numerical values ​​as long as they are arranged parallel to each other. The direction in which the wiring extending from the scan signal FOG pad group 123 extends can be set to match the regular arrangement direction of the video signal TGV group 114.

[0046] FIG. 12 is an explanatory diagram showing another example of the layout of the video signal TGV group 114 and the scan signal wiring 121.

[0047] 12, the wires extending from the scan signal FOG pad group 123 are also arranged parallel to each other at the portions where they intersect with the video signal TGV region 112. In the example of FIG. 12, every two wires extending from the scan signal FOG pad group 123 are adjacent to each other without a video signal TGV 110 in between. One pair of two wires adjacent to each other without a video signal TGV 110 in between is adjacent to another pair of two wires adjacent to each other without a video signal TGV 110 in between, via one video signal TGV 110 in between. The minimum spacing between the two wires in the pair may be 30 μm. However, this numerical value is merely an example, and the spacing is not limited to the above numerical value as long as the wires extending from the scan signal FOG pad group 123 are arranged parallel to each other.

[0048] The angles of the multiple wirings extending in parallel from the scan signal FOG pad group 123 may be different at both ends of the tiling substrate 100 in the parallel direction.

[0049] FIG. 13 is a diagram showing a modified example of the dummy pad.

[0050] 13, some of the dummy pads 123d can be divided so that one dummy pad 123d corresponds to one video signal TGV 110. That is, the dummy pad 123d can be laid out so that only one video signal TGV 110 overlaps it. This prevents, for example, two video signal TGVs 110 from being short-circuited when two video signal TGVs 110 are placed on one dummy pad 123d. Note that all of the dummy pads 123d may be divided.

[0051] FIG. 14 is an explanatory diagram simply showing another example of the layout configuration of the rear surface of the tiling substrate 100. In FIG.

[0052] In the example of FIG. 14, the scan signal FOG pad group 123 is arranged in a portion where the video signal TGV region 112 is not arranged when the rear surface of the tiling substrate 100 is viewed in plan.

[0053] Fig. 15 is an explanatory diagram simply showing another example of the configuration of the tiling substrate 100. Fig. 16 is a diagram showing a pixel circuit that performs constant current control and PWM control on each of the LEDs 101 to 103. Fig. 17 is a cross-sectional view showing a TFT layer 181 in which a TFT (Thin Film Transistor) of the pixel circuit is formed.

[0054] FIG. 15 illustrates the configuration and connections of an active matrix driving system.

[0055] A video signal supplied from the video driver IC 150 via the video signal wiring 111 is supplied to each of the LEDs 101 to 103 in a row selected by a scan signal supplied from the scan driver IC 170 via the scan signal wiring 121 via a PWM (Pulse Width Modulation) control circuit. The PWM control circuit generates a PWM control signal for supplying power corresponding to the video signal and outputs it to the LEDs 101 to 103. The constant current source transistor generates a constant current based on a constant current control voltage and applies it to the LEDs 101 to 103. Each of the LEDs 101 to 103 emits light in accordance with the power based on the supplied video signal. The use of constant voltage driving and PWM driving can prevent chromaticity shifts from occurring.

[0056] FIG. 18 is a diagram showing a first example of the layout of the scan signal TGV region 122 and the scan signal FOG pad group 123. In FIG.

[0057] 18, the scan signal TGV region 122 extends vertically in the center of the tiling substrate 100 when the back surface of the tiling substrate 100 is viewed in plan, and is installed as one continuous body from the top end to the bottom end. The scan signal FOG pad groups 123 are installed at both ends of the tiling substrate 100 in the horizontal direction, as two continuous bodies each consisting of scan signal FOG pads 123a lined up in the vertical direction.

[0058] FIG. 19 is a diagram showing a second example of the layout of the scan signal TGV region 122 and the scan signal FOG pad group 123. In FIG.

[0059] 19, the scan signal TGV region 122 extends vertically in the center of the tiling substrate 100 when the back surface of the tiling substrate 100 is viewed in plan, and is installed as one continuous body from the top end to the bottom end. The scan signal FOG pad group 123 is installed as two continuous bodies in which the scan signal FOG pads 123a are arranged vertically on different vertical axes.

[0060] FIG. 20 is a diagram showing a third example of the layout of the scan signal TGV region 122 and the scan signal FOG pad group 123. In FIG.

[0061] 20, the scan signal TGV region 122 extends vertically when the rear surface of the tiling substrate 100 is viewed in plan, and is arranged as two continuums on different vertical axes from the top to the bottom. The scan signal FOG pad groups 123 are arranged at both ends of the tiling substrate 100 in the horizontal direction, as two continuums in which the scan signal FOG pads 123a are arranged vertically.

[0062] By placing the TGV region 122 for the scan signal as two continuums on different vertical axes from the top to the bottom, the difference in wiring resistance from each TGV to each LED 101 to 103 on the surface of the tiling substrate 100 can be reduced compared to arranging it as a single continuum.

[0063] FIG. 21 is a diagram showing a fourth example of the layout of the scan signal TGV region 122 and the scan signal FOG pad group 123. In FIG.

[0064] 21 , the scan signal TGV region 122 extends in the vertical direction when the rear surface of the tiling substrate 100 is viewed in plan, and is arranged as three continuums on different vertical axes from the top to the bottom. The scan signal FOG pad group 123 is arranged as two continuums in which the scan signal FOG pads 123a are arranged side by side on the vertical axis that passes through the center between the three continuums of the scan signal TGV region 122.

[0065] By arranging the TGV region 122 for the scan signal as three continuous bodies on different vertical axes from the top to the bottom, the difference in wiring resistance from each TGV to each LED 101 to 103 on the surface of the tiling substrate 100 can be further reduced compared to arranging it as two continuous bodies.

[0066] 22 to 24 are diagrams showing fifth to seventh examples of the layout of the scan signal TGV region 122 and the scan signal FOG pad group 123, respectively.

[0067] In the fifth to seventh examples, when the rear surface of the tiling substrate 100 is viewed in a plane, the scan signal TGV regions 122 extend in the vertical direction and are arranged as four continuums on different vertical axes from the top to the bottom. The scan signal FOG pad groups 123 are arranged as two continuums, each of which has the scan signal FOG pads 123a arranged side by side on a vertical axis passing through the centers of two sets of continuums when the four continuums of the scan signal TGV regions 122 are divided into two sets of continuums. The fifth to seventh examples are different from one another in at least one of the spacing between the continuums of the scan signal TGV regions 122, the spacing between the continuums of the scan signal TGV regions 122 and the continuums of the scan signal FOG pad groups 123, and the spacing between the continuums of the scan signal FOG pad groups 123.

[0068] By arranging the TGV region 122 for the scan signal as four continuous bodies on different vertical axes from the top to the bottom, the difference in wiring resistance from each TGV to each LED 101 to 103 on the surface of the tiling substrate 100 can be further reduced compared to arranging it as three continuous bodies.

[0069] 25 to 30 are diagrams showing eighth to thirteenth examples of the layout of the scan signal TGV region 122 and the scan signal FOG pad group 123. FIG.

[0070] In the eighth to thirteenth examples, the scan signal TGV regions 122 are arranged as four continuums extending in the vertical direction when the back surface of the tiling substrate 100 is viewed in plan, and the total length of the multiple continuums is an integer multiple of the vertical length of the tiling substrate 100. When the four continuums of the scan signal TGV regions 122 are divided into two sets of continuums, the scan signal FOG pad groups 123 are arranged as two continuums, each of which has the scan signal FOG pads 123a arranged in the vertical direction on a vertical axis passing through the centers of the two continuums. The eighth to thirteenth examples are different from one another in at least one of the spacing between the continuums of the scan signal TGV regions 122, the length and vertical position of the continuums of the scan signal TGV regions 122, the spacing between the continuums of the scan signal TGV regions 122 and the continuums of the scan signal FOG pad groups 123, and the spacing between the continuums of the scan signal FOG pad groups 123.

[0071] The first to thirteenth examples of the layout of the scan signal TGV area 122 and the scan signal FOG pad group 123 shown in Figures 18 to 30 can be applied to the layout of the video signal TGV area 112 and the video signal FOG pad group 113 based on the same concept.

[0072] Fig. 31 is a diagram of the front surface of a Tiling module 10 in which a plurality of Tiling substrates 100 are arranged in a tiled pattern. Fig. 32 is a diagram of the back surface of a Tiling module 10 in which a plurality of Tiling substrates 100 are arranged in a tiled pattern. The Tiling module 10 constitutes an LED display device. The Tiling module 10 can easily be made larger in screen size depending on the number of Tiling substrates 100 arranged.

[0073] (Comparative Example) Fig. 33 is a diagram showing each LED, video signal wiring, and scan signal wiring on the surface of a tiling substrate of a comparative example, Fig. 34 is an explanatory diagram for explaining side wiring.

[0074] As shown in Figures 33 and 34, a method is known in which side wiring is used to connect the video signal wiring and scan signal wiring formed on the surface of the tiling substrate to the video driver IC and scan driver IC mounted on the back side of the tiling substrate.

[0075] However, when using side wiring, the video signal wiring of each block needs to be extended to one side surface to connect to the side wiring, which makes it difficult to secure space for the wiring layout. Also, the area required for the layout of the video signal wiring on the side surface where the side wiring is provided becomes large, which may reduce the aperture ratio of the Tiling substrate 100.

[0076] The embodiment has the following advantages.

[0077] a plurality of video signal wirings that are arranged on the front side of a tiling substrate for an LED display device and that supply power to a plurality of LEDs that are arranged on the front side; a scan signal wiring that is arranged on the front side and that controls the conduction and non-conduction of power to the plurality of LEDs; at least one video pad group that is arranged on the back side of the tiling substrate for an LED display device and that is connected to an output terminal of at least one video driver IC that outputs a video signal; at least one scan pad group that is arranged on the back side and that is connected to an output terminal of at least one scan driver IC that outputs a scan signal; and at least one video pad group for forming a video signal through hole that connects wirings extending from each pad of the video pad group to the video signal wirings. In a tiling substrate for an LED display device, the tiling substrate includes a signal through-hole installation portion and at least one scan signal through-hole installation portion for forming a scan signal through-hole for connecting wiring extending from each scan pad of the scan pad group to the scan signal wiring, the video pad group is arranged in a portion where the scan signal through-hole installation portion is not arranged in a plan view, or arranged so that an electrically floating dummy pad is arranged in the portion where the scan signal through-hole installation portion is arranged, and the scan pad group is arranged in a portion where the video signal through-hole installation portion is not arranged in a plan view, or arranged so that an electrically floating dummy pad is arranged in the portion where the video signal through-hole installation portion is arranged. This makes it possible to easily layout the wiring connected to each LED while ensuring a sufficient area for mounting the LEDs on the tiling substrate for an LED display device.

[0078] Furthermore, the scan signal through-hole installation portion extends vertically in the center of the tiling substrate for the LED display device in a plan view, and is installed as a single continuous body from the top to the bottom, which effectively simplifies the layout of the wiring connected to each LED while ensuring a sufficient area for mounting the LEDs.

[0079] Furthermore, the scan signal through-hole installation portions are arranged to extend vertically in a plan view, forming multiple continuums on different vertical axes from the top to the bottom, which effectively reduces the difference in wiring resistance from the scan signal through-holes to each LED.

[0080] Furthermore, the scan signal through-hole installation portions are arranged as multiple contiguous bodies extending vertically in plan view, and the total length of the multiple contiguous bodies is an integer multiple of the vertical length of the LED display device tiling substrate, thereby effectively reducing the difference in wiring resistance from the scan signal through-holes to each LED.

[0081] Furthermore, the image signal through-hole installation areas extend horizontally in a plan view, which effectively simplifies the layout of the video signal wiring and scan signal wiring connected to each LED.

[0082] Furthermore, the image signal through-hole installation portions are arranged so that they extend horizontally in a plan view and form multiple continuums on different horizontal axes from the left end to the right end, which effectively reduces the difference in wiring resistance from the image signal through-holes to each LED.

[0083] Furthermore, when viewed from above, the group of video pads extends horizontally and is arranged as a plurality of video pad continuums on the same horizontal axis from the left end to the right end, and the scan signal through hole installation section is arranged between adjacent video pad continuums in the horizontal direction, which makes it easy to avoid interference between the fan-out wiring to the group of video pads and the scan signal through holes.

[0084] Furthermore, the wiring extending from each scan pad in the scan pad group is arranged parallel to each other at the portions where it intersects with the video signal through hole installation portions, which makes it easy to avoid interference between the fan-out wiring to the scan pad group and the video signal through holes.

[0085] The above-described embodiments are merely examples, and those skilled in the art will recognize that various modifications and equivalent embodiments are possible. Therefore, the disclosed embodiments should be considered from an illustrative perspective, not a restrictive one. The scope of the invention is defined in the claims, and all structures within the scope of the claims should be construed as being within the scope of the invention. [Explanation of symbols]

[0086] 10 Tiling modules, 100 Tiling board, 101~103 LEDs, 110 TGV for video signals, 111 Video signal wiring, 112 TGV area for video signals, 113 FOG pads for video signals, 113a FOG pad for video signal, 114 TGV group for video signals, 120 TGV for scanning signals, 121 Scan signal wiring, 122 TGV area for scanning signals, 123 FOG pads for scan signals, 123a FOG pad for scan signal, 124 TGV group for scanning signals, 123d dummy pad, 150 video driver IC, 160 film substrate, 170 scan driver IC, 180 wiring layer, 181 TFT layers, 190 glass substrate.

Claims

1. a plurality of video signal wirings that are installed on the front surface side of the tiling substrate for the LED display device and that supply power to the plurality of LEDs that are installed on the front surface side; a scan signal wiring arranged on the front surface side for controlling the conduction and non-conduction of power to the plurality of LEDs; At least one group of video pads that are installed on the rear surface of the tiling substrate for the LED display device and are to be connected to an output terminal of at least one video driver IC that outputs a video signal; At least one scan pad group is provided on the rear surface side and is connected to an output terminal of at least one scan driver IC that outputs a scan signal; at least one video signal through hole providing portion for forming a video signal through hole for connecting a wiring extending from each pad of the group of video pads to the video signal wiring; at least one scan signal through hole providing portion for forming a scan signal through hole for connecting a wiring extending from each scan pad of the scan pad group to the scan signal wiring, the wiring extending from each video pad of the video pad group and the at least one video signal through hole installation portion are electrically insulated from the wiring extending from each scan pad of the scan pad group and the scan signal through hole installation portion; the video pad group is arranged in a portion where the scan signal through hole installation portion is not arranged when viewed from above, or is arranged so that an electrically floating dummy pad is installed in a portion where the scan signal through hole installation portion is arranged, A tiling substrate for an LED display device, in which the scan pad group is arranged in a portion where the through hole installation portion for video signals is not arranged when viewed in a plane, or in a portion where the through hole installation portion for video signals is arranged so that an electrically floating dummy pad is arranged.

2. A tiling substrate for an LED display device as described in claim 1, wherein the scan signal through hole installation portion extends vertically at the center of the tiling substrate for the LED display device when viewed in a plane, and is installed as a single continuous body from the top end to the bottom end.

3. 2. A tiling substrate for an LED display device as described in claim 1, wherein the scan signal through hole installation portion extends vertically when viewed in a plane and is installed as multiple continuous bodies on different vertical axes from the top end to the bottom end.

4. 2. A tiling substrate for an LED display device as described in claim 1, wherein the scan signal through hole installation portion is arranged as a plurality of continuous bodies extending vertically when viewed in a plane, and the total length of the plurality of continuous bodies is an integer multiple of the vertical length of the tiling substrate for an LED display device.

5. 5. The tiling substrate for an LED display device according to claim 2, wherein the video signal through hole providing portion extends in a horizontal direction when viewed in a plan view.

6. A tiling substrate for an LED display device as described in any one of claims 2 to 4, wherein the through hole installation portion for video signals extends horizontally when viewed in a plane and is installed as multiple continuums on different horizontal axes from the left end to the right end.

7. the group of video pads extends horizontally in a plan view and is arranged as a continuum of a plurality of video pads on the same horizontal axis from the left end to the right end; 6. The tiling substrate for an LED display device according to claim 5, wherein the scan signal through-hole installation portion is disposed between the video pad continua adjacent in the horizontal direction.

8. 2. The tiling substrate for an LED display device according to claim 1, wherein the wiring extending from each scan pad of the scan pad group is arranged parallel to each other at a portion where the wiring intersects with a portion where a through hole for a video signal is provided.

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