Work-piece processing method, and measuring system

Abstract

To provide a technique that can calculate a processing amount without peeling a resist film.SOLUTION: A work-piece processing method includes: a preparation process in which a work-piece having an exposed processing part and a protection part provided with a resist film is prepared; a processing process in which the processing part of the work-piece is removed while protecting the protection part of the work-piece by using the resist film; a measuring process in which a whole height from the processing part of the work-piece to a top face of the resist film is measured after the processing process; and a calculation process in which a processing amount of the work-piece is calculated on the basis of the measured whole height and a thickness of the resist film after the processing process.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a workpiece machining method and a measurement system. [Background technology]

[0002] Patent Document 1 discloses a method for processing a workpiece, in which a resist film is attached to the workpiece, a pattern is formed on the resist film, the entire workpiece is sandblasted, and finally the resist film is removed with an alkaline stripper. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-065000 Summary of the Invention [Problem to be solved by the invention]

[0004] From the perspective of quality control, it is necessary to check whether the workpiece has been processed into the designed shape before removing the resist film. For example, after sandblasting, it is possible to temporarily peel off the resist film manually and measure the amount of processing. If the amount of processing is insufficient, the resist film is reapplied and sandblasting is performed. This ensures the quality of the workpiece. However, the work of peeling and applying the resist film requires skilled techniques, is time-consuming, and hinders automation. The present disclosure provides a technology that can calculate the amount of processing without peeling off the resist film. [Means for solving the problem]

[0005] A method for processing a workpiece according to one aspect of the present disclosure includes a preparation step, a processing step, a measurement step, and a calculation step. The preparation step involves providing a resist film having an opening on a processing surface of the workpiece. The processing step involves removing the processing portion of the workpiece exposed by the opening while protecting the protective portion of the workpiece covered with the resist film provided on the workpiece. The measurement step involves measuring the overall height from the processing portion of the workpiece to the upper surface of the resist film after the processing step. The calculation step involves calculating the processing amount of the workpiece based on the measured overall height and the thickness of the resist film after the processing step.

[0006] A measurement system according to another aspect of the present disclosure includes a measurement device and a control unit. The measurement device measures the overall height from a processing surface of a workpiece having an exposed processing portion and a protective portion covered with a resist film to the upper surface of the resist film. The control unit is connected to the measurement device and calculates the amount of processing of the workpiece. The control unit then causes the measurement device to measure the overall height from the processing portion of the workpiece to the upper surface of the resist film after processing to remove the processing portion of the workpiece while protecting the protective portion of the workpiece, and calculates the amount of processing of the workpiece based on the measured overall height and the thickness of the resist film after processing to remove the processing portion of the workpiece. [Effects of the Invention]

[0007] According to the present disclosure, the processing amount can be calculated without removing the resist film. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram illustrating an example of a machining system to which a workpiece machining method according to an embodiment is applied. [Figure 2] FIG. 2 is a flowchart showing a method for machining a workpiece according to one embodiment. [Figure 3] 3A to 3E are diagrams showing examples of workpieces in each process. [Figure 4] FIG. 4 is a diagram for explaining the dimensions of the workpiece. DETAILED DESCRIPTION OF THE INVENTION

[0009] Embodiments of the present disclosure will be described in detail with reference to the drawings. In the description of the drawings, the same elements are designated by the same reference numerals, and duplicate descriptions will be omitted. The dimensional ratios of the drawings do not necessarily match those in the description. The terms "upper," "lower," "left," and "right" are used for convenience and are based on the state shown in the drawings.

[0010] [Example of a processing system] FIG. 1 is a diagram illustrating an example of a processing system to which a workpiece processing method according to an embodiment of the present invention is applied. The processing system 1 illustrated in FIG. 1 is composed of a group of devices for processing a workpiece. The workpiece is, for example, a plate-shaped member. Specific examples of the workpiece include an electrostatic chuck for holding a substrate, a glass substrate, a ceramic substrate, and a silicon substrate. The processing system 1 performs processing to remove the surface of the workpiece. Specific examples of processing include forming protrusions on the workpiece, forming holes, and forming grooves. The processing method is not particularly limited as long as it can remove the surface of the workpiece. Specific examples of processing methods include sandblasting and etching. The following describes an example in which the processing system 1 manufactures an electrostatic chuck by forming protrusions on a plate-shaped workpiece using sandblasting.

[0011] The processing system 1 includes a laminating device 11 , an exposure device 12 , a developing device 13 , a blasting device 14 , a measuring system 15 , and a peeling and cleaning device 16 .

[0012] The laminating device 11 is a device that applies a resist film to the top surface of a workpiece. The resist film is made of a material that is resistant to the abrasive grains of sandblasting. For example, the resist film is made of resin. The laminating device 11 includes a supply unit that supplies the resist film and a roller that presses the supplied resist film onto the workpiece. The workpiece processed by the laminating device 11 is transported to the exposure device 12.

[0013] The exposure device 12 is a device that transfers a pattern onto a resist film. The exposure device is equipped with a light source that emits light of a specific wavelength, such as ultraviolet light, and a mask that has a pattern to be transferred onto the resist film. The workpiece processed by the exposure device 12 is transported to the developing device 13.

[0014] The developing device 13 is a device that chemically processes the exposed resist film to form a pattern. The developing device 13 has a nozzle that sprays the developer and a spin coater that rotates the workpiece. The workpiece processed by the developing device 13 is transported to the blasting device 14.

[0015] The blasting device 14 processes the surface of a workpiece by spraying abrasive grains at high pressure onto the surface. The blasting device 14 is equipped with a compressor that supplies compressed air, a hopper that stores abrasive grains, a nozzle that is connected to the compressor and hopper and sprays the abrasive grains, a stage that supports the workpiece, a chamber that houses the nozzle and stage, and an abrasive grain recovery mechanism. The blasting device 14 performs processing according to set processing conditions. The processing conditions include the spray amount, processing time (spraying time), spraying speed, etc. The workpiece processed by the blasting device 14 is then transported to the measurement system 15.

[0016] The measurement system 15 is a system for calculating the amount of machining of a workpiece. The measurement system 15 includes a measurement device 150 and a control unit 151.

[0017] The measuring device 150 is a device that measures the overall height from the processed portion of the workpiece to the top surface of the resist film. The measuring device 150 is a 3D sensor that can measure film thickness. Specific examples of the measuring device 150 include a white light interferometer and a laser microscope. A white light interferometer measures the overall height from the processed portion of the workpiece to the top surface of the resist film by irradiating the workpiece with white light and analyzing the interference pattern of the reflected light. A laser microscope measures the overall height from the processed portion of the workpiece to the top surface of the resist film by irradiating the workpiece with laser light and analyzing changes in the intensity or phase of the reflected light.

[0018] The control unit 151 is connected to the measuring device 150 and calculates the amount of workpiece machining. The control unit 151 is configured as a computer system including, for example, a processor such as a CPU (Central Processing Unit), memories such as RAM (Random Access Memory) and ROM (Read Only Memory), input / output devices such as a touch panel, mouse, keyboard, and display, and a communication device such as a network card. The control unit 151 realizes the functions described below by having the processor operate each piece of hardware based on a program stored in the memory or the like.

[0019] The control unit 151 is configured to be able to operate the measuring device 150. The control unit 151 calculates the amount of workpiece processing based on the measurement results of the measuring device 150. A method for calculating the amount of workpiece processing will be described later. The control unit 151 may feed back the measurement results to the blasting device 14. For example, the control unit 151 transmits a signal to the blasting device 14 to change the processing conditions of the blasting device 14 based on the measurement results.

[0020] The measurement system 15 may include a spectroscopic film thickness meter in addition to the measurement device 150. The 3D sensor that is the measurement device 150 cannot measure the film thickness of the resist film depending on the transmittance of the resist film. The spectroscopic film thickness meter has a light source that emits light of a predetermined wavelength, and can measure the thickness of the resist film based on the intensity of the light reflected from the front and back surfaces of the resist film and the refractive index of the resist film. The workpiece measured by the measurement system 15 is transported to the blasting device 14. The workpiece measured by the measurement system 15 may also be transported to the peeling and cleaning device 16.

[0021] The peeling and cleaning device 16 is a device that peels off the resist film from the workpiece and cleans it. The peeling and cleaning device 16 is equipped with a tank that stores a stripping liquid and a nozzle that sprays the stripping liquid. The workpiece is finished as a product by the peeling and cleaning device 16.

[0022] As described above, the processing system 1 shown in Fig. 1 processes the workpieces in sequence. The workpieces may be transported between the various devices by a robot or by an operator. By using a robot for transport, the entire process is automated.

[0023] [Example of workpiece processing method] Fig. 2 is a flowchart showing a method for machining a workpiece according to one embodiment. The machining method M1 shown in Fig. 2 is executed by the machining system 1. In explaining the machining method, Figs. 3(A) to 3(E) and 4 are referenced. Figs. 3(A) to 3(E) are diagrams showing an example of a workpiece in each process. Fig. 4 is a diagram explaining the dimensions of the workpiece.

[0024] As shown in Fig. 2, first, in step S10 (an example of a preparation step), a workpiece masked with a resist film is prepared. The workpiece masked with the resist film is the workpiece immediately before blast processing. Fig. 3 (A) to (C) show the workpiece prepared in step S10.

[0025] First, as shown in FIG. 3A, a resist film 20 is supplied from the film supply unit of the laminating device 11, and the resist film 20 is pressed onto the processing surface 100 of the workpiece 10 by a roller. Next, as shown in FIG. 3B, light of a specific wavelength, such as ultraviolet light, is projected onto the resist film 20 from a light source of the exposure device 12 through a mask. The exposed resist film 20 is chemically changed to become a resist film 20A in which a dissolved region 200 and a non-dissolved region 201 are formed. Next, as shown in FIG. 3C, a developer is supplied from the nozzle of the developing device 13 onto the exposed resist film 20A. As a result, the dissolved region 200 of the resist film 20A is dissolved to form an opening 202, and the non-dissolved region 201 remains, becoming a resist film 20B. The processing surface 100 of the workpiece 10 has a processing portion 10a where the workpiece 10 is exposed by the opening 202, and a protective portion 10b covered with the resist film 20B. The workpiece shown in FIG. 3(C) is masked with a resist film and is the workpiece immediately before the processing step.

[0026] Next, in step S12, the workpiece is set on the stage of the blasting device 14. Next, in step S14 (processing step), the processed portion 10a of the workpiece 10 is removed while the protective portion 10b of the workpiece 10 is protected by the resist film 20B. As a more specific example, abrasive grains are sprayed toward the workpiece 10 from the nozzle of the blasting device 14. As a result, as shown in FIG. 3(D), the workpiece 10 becomes workpiece 10A from which the processed portion 10a of the workpiece 10 has been removed (cut), and the resist film 20B becomes resist film 20C with a worn upper surface.

[0027] 4, before the processing step, the thickness F1 of the resist film 20B provided on the workpiece is the same as the overall height H1 from the processing portion 10a of the workpiece to the upper surface 20a of the resist film 20B. In the processing step, the processing portion 10a of the workpiece 10 is removed, and at the same time, the upper surface of the resist film 20B is also worn away to a considerable extent. After the processing step, the sum of the thickness F2 of the resist film 20C and the amount of wear DF ​​of the resist film is the same as the thickness F1 (or overall height H1) of the resist film 20B, and the sum of the thickness F2 of the resist film 20C and the amount of processing DP is the same as the overall height H2 from the processing portion 10a of the workpiece to the upper surface 20a of the resist film 20C.

[0028] Subsequently, in step S16, the workpiece 10A provided with the resist film 20C is transported from the blasting device 14 to the measuring device 150. In step S18, the measuring device 150 measures the overall height H2 from the processed portion 10a of the workpiece to the upper surface 20a of the resist film 20C.

[0029] Subsequently, in step S20, the control unit 151 calculates the thickness F2 of the resist film 20C. Then, in step S22 (calculation step), the control unit 151 calculates the processing amount DP based on the thickness F2 of the resist film 20C. There are two methods below.

[0030] The first method is a method of calculating the processing amount DP by subtracting the thickness F2 of the resist film 20C from the overall height H2 from the processing portion 10a of the workpiece to the upper surface 20a of the resist film 20C. The thickness F2 of the resist film 20C is measured, for example, by a spectroscopic film thickness meter separately included in the measuring device 150. As a specific example, the thickness of the resist film 20C is measured based on the intensity of reflected light from the front and back surfaces of the resist film 20C and the refractive index of the resist film 20C. Because the thickness F2 of the resist film 20C is measured directly, the processing amount DP can be calculated more accurately than when the thickness F2 of the resist film 20C is calculated or estimated.

[0031] The second method is to calculate the amount of wear DF, calculate the thickness F2 of the resist film 20C from the amount of wear DF, and subtract the thickness F2 of the resist film 20C from the overall height H2 from the processed portion 10a of the workpiece to the upper surface 20a of the resist film 20C to calculate the processing amount DP.

[0032] First, before the processing step, the measuring device 150 measures the overall height H1 (thickness F1 of the resist film 20B) from the processing portion 10a of the workpiece 10 to the upper surface of the resist film 20B (pre-measurement step). That is, the pre-measurement step is performed in step S10 (preparation step).

[0033] Next, the control unit 151 calculates the amount of wear DF. The memory unit of the control unit 151 pre-stores the amount of wear of the resist film 20 per unit injection amount. The control unit 151 calculates the amount of wear DF ​​by multiplying the amount of abrasive grains injected in step S14 (processing step) by the amount of wear of the resist film 20 per unit injection amount. The control unit 151 then subtracts the amount of wear DF ​​from the overall height H1 (thickness F1 of the resist film 20B) from the processing portion 10a of the workpiece 10 to the upper surface of the resist film 20B to calculate the thickness F2 of the resist film 20C. The control unit 151 then subtracts the thickness F2 of the resist film 20C from the overall height H2 from the processing portion 10a of the workpiece to the upper surface 20a of the resist film 20C to calculate the amount of processing DP. According to the second method, the amount of processing DP can be calculated even if the thickness F2 of the resist film 20C cannot be directly measured due to the relationship between the refractive index and transmittance.

[0034] Once the machining amount DP is calculated, in step S24, the control unit 151 determines whether the machining amount DP is within a target range. The target range is set, for example, to a range that includes the target machining amount. If it is determined that the machining amount DP is not within the target range (step S24: NO), the control unit 151 changes the machining conditions for the next machining process in step S26 (feedback process). By feeding back the measurement results to the machining conditions, the workpiece is machined into a shape as designed. If it is determined that the machining amount DP is within the target range (step S24: YES), the flowchart shown in FIG. 2 ends.

[0035] When the flowchart shown in Fig. 2 is completed, a peeling and cleaning process (not shown) is executed. Fig. 3(E) is a diagram showing an example of a workpiece in the peeling and cleaning process. In the peeling and cleaning process, a stripping solution is sprayed onto the entire workpiece 10A from the nozzle of the peeling and cleaning device 16. This peels off the resist film 20C, and the workpiece 10A is obtained as a product.

[0036] [Summary of the embodiment] In the processing method M1 and the measurement system 15, the workpiece 10 is prepared, and the processing portion 10a of the workpiece 10 is removed using the resist film 20B. Then, the overall height H2 from the processing portion 10a of the workpiece 10A to the upper surface 20a of the resist film 20C is measured. Next, the processing amount of the workpiece 10A is calculated based on the measured overall height H2 and the thickness F2 of the resist film 20C after the processing process. In the processing method M1 and the measurement system 15, the processing amount is calculated without peeling off the resist film 20C. Therefore, skilled techniques such as peeling off and attaching the resist film 20C are not required to measure the processing amount, which reduces manpower and time.

[0037] Although various exemplary embodiments have been described above, various omissions, substitutions, and modifications may be made without being limited to the above exemplary embodiments. For example, the measurement system 15 may be integrated with the blasting device 14. As an example, the measurement device 150 may be disposed within the chamber of the blasting device 14. Even with such a configuration, the same effects as those of the processing method M1 and the measurement system 15 are achieved. Furthermore, the refractive index of the resist film 20 may be unknown. In this case, the thickness F1 of the resist film 20B may be measured with a 3D sensor or a spectroscopic film thickness meter, the overall height H1 may be measured with the 3D sensor, and the refractive index of the resist film 20 may be derived by dividing the thickness F1 of the resist film 20B by the overall height H1. The processing method M1 and the measurement system 15 may calculate the processing amount of the workpiece 10A using the derived refractive index of the resist film 20. [Explanation of symbols]

[0038] 10, 10A...workpiece, 10a...processing portion, 10b...protection portion, 20, 20A, 20B, 20C...resist film, 15...measurement system, 100...processing surface, 202...opening, 150...measuring device, 151...control portion.

Claims

1. a preparation step of providing a resist film having openings on a processing surface of a workpiece; a processing step of removing the processed portion of the workpiece exposed by the opening while protecting the protective portion of the workpiece covered with a resist film provided on the workpiece; a measuring step of measuring an overall height from a processed portion of the workpiece to an upper surface of the resist film after the processing step; a calculation step of calculating a processing amount of the workpiece based on the measured overall height and the thickness of the resist film after the processing step; A method for machining a workpiece, including:

2. 2. The workpiece processing method of claim 1, wherein in the calculation step, the thickness of the resist film after the processing step is measured based on the intensity of reflected light from the front and back surfaces of the resist film and the refractive index of the resist film.

3. The preparation step includes a pre-measurement step of measuring an overall height from a processed portion of the workpiece to an upper surface of the resist film as a thickness of the resist film before the processing step, The machining step includes blasting abrasive grains onto the workpiece, 2. The method for processing a workpiece according to claim 1, wherein in the calculation step, the amount of wear of the resist film in the processing step is calculated based on the amount of abrasive grains sprayed in the processing step and the amount of wear of the resist film per unit amount sprayed, and the thickness of the resist film after the processing step is calculated based on the thickness of the resist film before the processing step and the amount of wear of the resist film.

4. The method for machining a workpiece according to any one of claims 1 to 3, further comprising a feedback process for changing machining conditions for the next machining process based on the machining amount of the workpiece calculated by the calculation process and a target machining amount.

5. a measuring device for measuring the overall height from a processed portion of a workpiece exposed on a surface by an opening and a protective portion covered with a resist film to an upper surface of the resist film; a control unit connected to the measuring device and configured to calculate the machining amount of the workpiece; Equipped with The control unit After the processing in which the processed portion of the workpiece is removed while protecting the protective portion of the workpiece, the measuring device measures the overall height from the processed portion of the workpiece to the upper surface of the resist film; Calculating the amount of processing of the workpiece based on the measured overall height and the thickness of the resist film after processing in which the processed portion of the workpiece is removed. Measurement system.

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