Cover tape for electronic component packaging and packaging body

Abstract

To provide an electronic component packaging cover tape that is easy to recycle after use and exhibits excellent heat resistance.SOLUTION: This disclosure provides an electronic component packaging cover tape 1 comprising, in the order listed, a heat-resistant layer 2, a base material layer 3, an intermediate layer 4, and a heat-seal layer 5, wherein the base material layer contains a polyolefin resin and the ethylene content in the electronic component packaging cover tape is 60 mass% or more.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a cover tape for packaging electronic components and a package using the same. [Background technology]

[0002] In recent years, electronic components such as ICs, resistors, transistors, diodes, capacitors, and piezoelectric resistors have been packaged in tape for surface mounting. In tape packaging, electronic components are housed in a carrier tape with multiple compartments for housing the components, and then the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting the electronic components. When mounting the electronic components, the cover tape is peeled off the carrier tape, and the electronic components are automatically removed and surface-mounted on a board. The cover tape is also called top tape.

[0003] After the electronic components are removed from the packaging, packaging materials such as cover tape, carrier tape, and bottom tape are discharged from the mounting machine. In recent years, with the increasing demand for electronic components, the amount of packaging material discharged has been large. Therefore, in consideration of environmental issues, there is a demand for packaging materials that are easily recyclable.

[0004] However, conventional cover tapes are not easily recycled because they use different materials, such as a polyester resin with high mechanical strength as the base layer and a polyolefin resin as the intermediate layer. Therefore, there is a demand for an environmentally friendly cover tape for packaging electronic components that can be easily recycled after use.

[0005] Furthermore, packaging materials such as the cover tape, carrier tape, and bottom tape may be cut in the same machine after use and disposed of together, so there is a demand for the packaging to be easily recycled.

[0006] For example, Patent Document 1 proposes a cover tape for packaging electronic components that is easy to recycle after use and environmentally friendly, and that includes a base layer, an intermediate layer, and a heat seal layer in this order, with the base layer and intermediate layer containing a polyolefin resin. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2023-70266 Summary of the Invention [Problem to be solved by the invention]

[0008] However, polyolefin resins have low heat resistance and soften at relatively low temperatures. Therefore, when used as the base layer of a cover tape, the base layer may soften or even melt when the cover tape is heat-sealed. In the above case, the base layer side of the cover tape may stick to the sealing iron used for heat sealing, causing problems such as contamination of the sealing iron and making the cover tape more susceptible to tearing. In addition, in the above case, the base layer may stretch during heat sealing, causing the cover tape to deform convexly or wrinkle. If the cover tape deforms convexly, the volume of the storage compartment in the package increases, making electronic components more likely to move and changing their position and orientation. Furthermore, if the cover tape deforms convexly or wrinkles, it becomes difficult to inspect the appearance of the package.

[0009] The present disclosure has been made in view of the above circumstances, and aims to provide a cover tape for packaging electronic components that is easy to recycle after use and has excellent heat resistance. [Means for solving the problem]

[0010] One embodiment of the present disclosure provides a cover tape for packaging electronic components, which has a heat-resistant layer, a base layer, an intermediate layer, and a heat-seal layer in this order, wherein the base layer contains a polyolefin resin, and the ethylene content in the cover tape for packaging electronic components is 60 mass% or more.

[0011] Another embodiment of the present disclosure provides a package comprising a carrier tape having a plurality of storage sections for storing electronic components, the electronic components stored in the storage sections, and the above-mentioned cover tape for packaging electronic components arranged to cover the storage sections. [Effects of the Invention]

[0012] The cover tape for packaging electronic components according to the present disclosure has the advantages of being easily recyclable after use and having excellent heat resistance. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a schematic cross-sectional view illustrating a cover tape for packaging electronic components according to the present disclosure. [Figure 2] 1A and 1B are schematic plan and cross-sectional views illustrating a packaging body according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0014] Embodiments of the present disclosure will be described below with reference to the drawings and the like. However, the present disclosure can be implemented in many different forms and should not be construed as being limited to the description of the embodiments exemplified below. Furthermore, to clarify the explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual form, but these are merely examples and do not limit the interpretation of the present disclosure. Furthermore, in this specification and each drawing, elements similar to those described above with reference to the previous drawings may be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0015] In this specification, when describing an aspect in which another component is placed on a certain component, the term "above" or "below" refers to both a case in which another component is placed directly above or below the component so as to be in contact with the component, and a case in which another component is placed above or below the component with another component interposed therebetween, unless otherwise specified. Also, in this specification, when describing an aspect in which another component is placed on the surface of a certain component, the term "on the surface side" or "on the surface" refers to both a case in which another component is placed directly above or below the component so as to be in contact with the component, and a case in which another component is placed above or below the component with another component interposed therebetween, unless otherwise specified.

[0016] The cover tape for packaging electronic components and the package according to the present disclosure will be described in detail below. Note that in this specification, the "cover tape for packaging electronic components" may be simply referred to as the "cover tape."

[0017] A. Cover tape for packaging electronic components The cover tape of the present disclosure is a cover tape for packaging electronic components having a heat-resistant layer, a base layer, an intermediate layer, and a heat-seal layer in this order, wherein the base layer contains a polyolefin resin, and the ethylene content in the cover tape for packaging electronic components is 60% by mass or more.

[0018] The cover tape according to the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of the cover tape according to the present disclosure. As shown in FIG. 1, the cover tape 1 has a heat-resistant layer 2, a base layer 3, an intermediate layer 4, and a heat-sealable layer 5, in this order. The base layer 3 contains a polyolefin resin. The ethylene content in the cover tape 1 is within a predetermined range.

[0019] 2(a) and 2(b) are a schematic plan view and a cross-sectional view showing an example of a package using the cover tape of the present disclosure, and FIG. 2(b) is a cross-sectional view taken along line AA in FIG. 2(a). As shown in FIGS. 2(a) and 2(b), the package 10 includes a carrier tape 11 having multiple storage compartments 12 for storing electronic components 13, the electronic components 13 stored in the storage compartments 12, and a cover tape 1 arranged to cover the storage compartments 12. The cover tape 1 is heat-sealed to the carrier tape 11, and heat-sealed portions 5H are provided in lines of a predetermined width on both ends of the heat-sealed layer 5 of the cover tape 1. In addition, in the package 10, the carrier tape 11 may have feed holes 14.

[0020] In conventional cover tapes, polyester resins such as polyethylene terephthalate are used as the base layer to ensure mechanical strength. However, because such base layers are made of a different material from the polyolefin resins commonly used as intermediate layers, recycling of the cover tapes has been difficult.

[0021] In contrast, in the present disclosure, the base layer, which is relatively thick among the layers constituting the cover tape, contains a polyolefin resin, and the ethylene content in the cover tape is above a predetermined value, making it easy to recycle.

[0022] On the other hand, polyolefin resins have low heat resistance and soften at relatively low temperatures, so when used as the base layer of a cover tape, the base layer may soften or even melt when the cover tape is heat-sealed. In this case, the surface of the cover tape facing the base layer may stick to the sealing iron used for heat sealing, contaminating the sealing iron or making the cover tape more susceptible to tearing.

[0023] In contrast, in the present disclosure, a heat-resistant layer is disposed on the surface of the base material layer opposite the intermediate layer, thereby preventing the base material layer containing a polyolefin resin from sticking to the sealing iron during heat sealing, thereby preventing contamination of the sealing iron by the base material layer during heat sealing, and also preventing breakage of the cover tape during heat sealing.

[0024] Furthermore, because polyolefin resins have low heat resistance, the base layer stretches during heat sealing, causing the cover tape to deform convexly or wrinkle. Convex deformation of the cover tape increases the volume of the storage compartment in the package, making the electronic components more likely to move and changing their position and orientation. Convex deformation or wrinkles in the cover tape also make it difficult to inspect the appearance of the package.

[0025] In contrast, in the present disclosure, as described above, a heat-resistant layer is disposed on the surface of the base layer opposite the intermediate layer, thereby suppressing elongation of the base layer during heat sealing. Therefore, convex deformation of the cover tape during heat sealing can be suppressed. As a result, a package using the cover tape of the present disclosure can maintain the position and orientation of electronic components, improving the mounting efficiency of electronic components. Furthermore, convex deformation of the cover tape can be suppressed during heat sealing, and the occurrence of wrinkles in the cover tape can be suppressed. Therefore, visual inspection of the package can be performed accurately.

[0026] Hereinafter, each configuration of the cover tape according to the present disclosure will be described.

[0027] 1. Ethylene content in the cover tape In the present disclosure, the ethylene content of the cover tape is 60% by mass or more, preferably 70% by mass or more, and more preferably 90% by mass or more. In the field of cover tapes, if the ethylene content of the cover tape is within the above range, recycling is facilitated.

[0028] In this specification, the "ethylene" in "ethylene content" is considered to be derived from the polyolefin resin contained in the cover tape. Specifically, when the polyolefin resin contained in the cover tape is (1) polyethylene (a homopolymer of ethylene), (2) polypropylene (a homopolymer of propylene), (3) an ethylene-propylene copolymer (a copolymer of ethylene and propylene), (4) a modified polyolefin resin obtained by modifying polyethylene, polypropylene, or an ethylene-propylene copolymer, which has a modification rate of 10% or less and does not contain an aromatic ring, or (5) a composition in which 100 parts by mass of polyethylene, polypropylene, or an ethylene-propylene copolymer is mixed with less than 10 parts by mass of a compound not containing an aromatic ring, the "ethylene" is considered to be derived from the ethylene constituting the polyolefin resin.

[0029] The method for producing the modified polyolefin resin is not particularly limited, and examples include a method in which a polyolefin resin is polymerized and then modified. The modified polyolefin resin may contain functional groups such as a carbonyl group, a hydroxyl group, a nitro group, an imide group, an acetoxyl group, an alkyl methacrylate group or an alkyl acrylate group having up to three alkyl carbon atoms.

[0030] The polyolefin resin contained in the cover tape can be analyzed by Fourier transform infrared spectroscopy (FT-IR) to determine whether it is at least one of the above (1) to (5). Specifically, the analysis is performed by the following method. First, a 3000 cm -1 ~2800cm -1 , 1500cm -1 ~1400cm -1 , 1400cm -1 ~1350cm -1 , 1330cm -1 ~1270cm -1 The absorption peaks at 3000 cm are derived from the above (1) to (5). Therefore, if there are absorption peaks other than the above absorption peaks in the IR spectrum, it is judged to be a mixture containing the above (1) to (5), or a compound other than the above (1) to (5). -1 ~2800cm -1The area of ​​the absorption peak at 1500 cm -1 ~1400cm -1 and the area of ​​the absorption peak at 1400 cm -1 ~1350cm -1 The area of ​​the absorption peak at 1330 cm -1 ~1270cm -1 When the ratio of the area of ​​the absorption peak other than these to the sum of the areas of the absorption peaks of (1) and (2) is less than 10%, the polyolefin resin is determined to be at least one of the above (1) to (5).

[0031] In the IR spectrum, for example, the ethylene in polyethylene, the ethylene in polyethylene terephthalate (PET), and the ethylene in polystyrene cannot be distinguished. -1 ~3000cm -1 The absorption peak at 1715 cm comes from the aromatic ring. -1 , 1240cm -1 , 1095cm -1 Therefore, in the IR spectrum, it has a characteristic absorption peak at 3100 cm -1 ~3000cm -1 If there is an absorption peak at 1715 cm, it is judged to contain, for example, PET or polystyrene. Also, for example, in the case of a copolymer of ethylene and a monomer other than an olefin, it is judged to contain a structural unit derived from dimethyl terephthalate or a structural unit derived from styrene. In addition, if there is an absorption peak at 1715 cm in the IR spectrum, it is judged to contain a structural unit derived from dimethyl terephthalate or a structural unit derived from styrene. -1 , 1240cm -1 , 1095cm -1 If there is an absorption peak, it is determined that PET is included. Therefore, if there is an absorption peak as described above, it is determined that an aromatic ring is included and therefore it does not fall under the above (1) to (5).

[0032] The ethylene content is measured by FT-IR using the microscopic ATR method. First, a cross section of the cover tape is prepared using an ultramicrotome. Then, the ethylene content of each layer constituting the cover tape is measured by FT-IR using the microscopic ATR method. Specifically, the 2915 cm spectrum attributed to ethylene is measured from the IR spectrum of a certain layer. -1 The area value of the absorption peak X is 2850 cm -1 , 1465cm -1 , 720cm -1 The ethylene content of a certain layer is calculated by the following formula using the value of Y obtained by adding up the area values ​​of the other absorption peaks excluding the absorption peak of (1) and the layer thickness A (μm). a=X / (Y+X)×A Similarly, calculate the ethylene content of each layer a, b, c, .... The total of the ethylene contents a, b, c, ... of each layer is added together, divided by the total of the thicknesses A, B, C, ... of each layer, and multiplied by 100 to obtain the ethylene content in the cover tape.

[0033] 2.Heat-resistant layer The heat-resistant layer in the present disclosure is disposed on the surface of the substrate layer opposite to the intermediate layer.

[0034] (1) Physical properties of the heat-resistant layer The heat-resistant layer preferably has a tack of 100 gf or less, more preferably 90 gf or less, at 150°C as measured by a probe tack test. If the tack is within the above range, the heat-resistant layer side of the cover tape can be prevented from sticking to the sealing iron during heat sealing. This can prevent contamination of the sealing iron and prevent the cover tape from breaking during heat sealing. Furthermore, if the tack is within the above range, the cover tape can be prevented from deforming into a convex shape or from wrinkling during heat sealing. Meanwhile, the lower limit of the tack is not particularly limited.

[0035] The heat sealing temperature when heat sealing the cover tape is generally in the range of 120° C. or higher and 200° C. or lower, and more generally 150° C. Therefore, in the present disclosure, tack at 150° C. is adopted as the tack of the heat-resistant layer.

[0036] The tackiness of the heat-resistant layer at 150°C is measured by a probe tack test. Specifically, the tackiness of the heat-resistant layer at 150°C is measured under the following conditions and procedures. For example, a tackiness tester such as "TAC-2" manufactured by RHESCA is used.

[0037] <Measurement conditions> Compression speed: 30mm / min Pressure: 300gf Pressurization time: 0.1 seconds Measurement (removal) speed: 30 mm / min Measurement contact part (probe): Cylinder diameter 5mm, SUS304 Temperature conditions: Probe temperature 150℃, sample stage temperature 50℃ Measurement environment: 25±2°C, 50±10% RH

[0038] <Measurement procedure> The cover tape was cut to a size of 50 mm x 20 mm to obtain a sample. Using a glass slide (76 mm x 26 mm, 0.8 mm to 1.0 mm thick) and 3M heat-resistant polyimide tape "7414," the sample was attached flat on the glass slide with the heat-resistant layer facing up, ensuring that the polyimide tape did not extend beyond the glass slide. The sample was placed on the stage of the measurement device using the included clamps, and the probe was brought into contact with the sample from above under the above measurement conditions. The probe was then released from the sample under the above measurement conditions, and the load value applied to the probe at this time was recorded.

[0039] The glass transition temperature (Tg) of the heat-resistant layer may be, for example, 50°C or higher, 70°C or higher, or 120°C or higher. If the Tg of the heat-resistant layer is within the above range, sufficient heat resistance can be obtained. On the other hand, the upper limit of the Tg of the heat-resistant layer is not particularly limited, but may be, for example, 250°C or lower, 200°C or lower, or 150°C or lower. Specifically, the Tg of the heat-resistant layer may be 50°C or higher and 250°C or lower, 70°C or higher and 200°C or lower, or 120°C or higher and 150°C or lower.

[0040] The Tg of the heat-resistant layer is measured by differential scanning calorimetry (DSC) in accordance with JIS K7121:2012. The measurement conditions are as follows: the temperature is increased to 200°C at 10°C / min, held for 10 minutes, then cooled to 0°C at 10°C / min, held for 10 minutes, and then increased again to 300°C at 10°C / min. The inflection point of the stepwise change in the DSC curve is taken as the Tg.

[0041] (2) Heat-resistant layer material Various materials can be used for the heat-resistant layer as long as they have heat resistance sufficient to withstand the manufacturing process of the cover tape and the tape packaging process. Examples of materials for the heat-resistant layer include cured resin compositions containing a resin and a curing agent. Examples of resins used in the resin composition include acrylic resins, phenolic resins, alkyd resins, melamine resins, urea resins, polyester resins, and epoxy resins. These resins may be used alone or in combination. The curing agent is appropriately selected depending on the type of resin. Examples of materials for the heat-resistant layer include cured resins cured by heat, ultraviolet light, electron beams, etc. Examples of cured resins include thermosetting resins, ultraviolet-cured resins, and electron-beam-cured resins. Polyamides and polyimides can also be used as materials for the heat-resistant layer.

[0042] The heat-resistant layer may also contain an antistatic agent. In this case, the heat-resistant layer can also serve as an antistatic layer. The antistatic layer is a layer for preventing the cover tape from becoming charged. By containing an antistatic agent in the heat-resistant layer, it is possible to suppress the generation of static electricity due to contact between the cover tape and other surfaces, and to suppress the adhesion of dirt, dust, etc. to the surface of the cover tape due to static electricity.

[0043] Examples of antistatic agents include metal oxides, conductive polymers, polymeric surfactants, and low molecular weight surfactants, with conductive polymers being preferred.

[0044] Examples of conductive polymers include polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylene vinylene, and polyvinylcarbazole. Among these, the conductive polymer is preferably one or more selected from the group consisting of polythiophene, polyaniline, and polypyrrole. This is because sufficient antistatic properties and transparency independent of humidity can be obtained. For example, PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / polystyrene sulfonic acid) is preferably used as the polythiophene. For example, sulfonated polyaniline is preferably used as the polyaniline. When the conductive polymer is contained, low surface resistivity can be obtained even with a thin thickness, which is preferable. A thin heat-resistant layer can improve the light transmittance of the cover tape. Furthermore, a thin heat-resistant layer can reduce the light absorption rate of the cover tape. Therefore, the transparency of the cover tape can be improved.

[0045] The content of the conductive polymer in the heat-resistant layer is, for example, 5% by mass to 15% by mass, and may be 7% by mass to 12% by mass. If the content of the conductive polymer is too low, the antistatic effect tends to be difficult to achieve. On the other hand, if the content of the conductive polymer is too high, dispersibility tends to be poor, and adhesion, optical properties, and mechanical properties tend to be poor.

[0046] The polymer surfactants and low molecular weight surfactants are each classified into nonionic, cationic, and anionic types. Among them, cationic polymer surfactants are preferred from the viewpoints of antistatic properties and coatability. Nonionic low molecular weight surfactants are preferred from the viewpoints of cost, optical properties, and ink production.

[0047] As the cationic polymer surfactant, a polymer quaternary ammonium salt is preferred. The counter anion of the quaternary ammonium salt is not particularly limited, and for example, a halogen ion or a sulfide ion is used. The 1st to 3rd positions of the ammonium are occupied by an aryl group or an alkyl group, and although not particularly limited, from the viewpoint of solubility, a group having 6 or less carbon atoms is preferred. As the main chain of the polymer quaternary ammonium salt, an acrylic main chain is preferred from the viewpoints of transparency and substrate adhesion. As the nonionic low-molecular surfactant, although not particularly limited, fatty acid ester type having 10 to 20 lipophilic groups, ether type such as polyoxyethylene alkyl ether, ester ether type, alkanolamide type, alkyl glycoside type, and alkylamine type are preferred.

[0048] The content of the polymeric quaternary ammonium salt in the heat-resistant layer is, for example, 10% by mass to 30% by mass, and may be 15% by mass to 20% by mass. If the content of the polymeric quaternary ammonium salt is too low, the antistatic effect tends to be difficult to achieve. On the other hand, if the content of the polymeric quaternary ammonium salt is too high, the adhesion, optical properties, and mechanical properties tend to be poor.

[0049] Examples of metal oxides include antimony-doped tin oxide (ATO), fluorine-doped tin oxide, phosphorus-doped tin oxide (PTO), aluminum-doped tin oxide, niobium-doped tin oxide, tantalum-doped tin oxide, tungsten-doped tin oxide, indium-doped tin oxide, tin oxide, tin-doped indium oxide (ITO), fluorine-doped indium oxide, cadmium-doped indium oxide, indium-doped zinc oxide, fluorine-doped zinc oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, magnesium-doped zinc oxide, silicon-doped zinc oxide, tin-doped zinc oxide, boron-doped zinc oxide, zinc oxide, zinc antimonate (AZO), and niobium-doped titanium oxide. Metal oxides may be used alone or in combination of two or more. From the viewpoint of stabilizing the surface resistivity, antimony-doped tin oxide, tin-doped indium oxide, phosphorus-doped tin oxide, tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, and zinc antimonate are preferred.

[0050] The average particle size of the metal oxide is, for example, 0.01 μm to 1 μm, and from the viewpoint of transparency, it is preferably 0.01 μm to 0.5 μm. The shape of the metal oxide may be any of spherical, acicular, and lamellar, but from the viewpoints of transparency, surface resistivity, and dispersibility, spherical and acicular shapes are preferred.

[0051] The content of metal oxide in the heat-resistant layer is such that the surface resistivity is 1×10 10 The amount is preferably Ω / □ or less, for example, 10% by mass or more and 70% by mass or less.

[0052] (3) Thickness of the heat-resistant layer The thickness of the heat-resistant layer may be any thickness that does not affect recyclability. The thickness of the heat-resistant layer is, for example, 5 μm or less, or may be 4 μm or less, or may be 3 μm or less. If the thickness of the heat-resistant layer is within the above range, the impact on recyclability can be reduced. On the other hand, the thickness of the heat-resistant layer is, for example, 0.1 μm or more, or may be 0.3 μm or more, or may be 0.5 μm or more. If the thickness of the heat-resistant layer is within the above range, sufficient heat resistance can be obtained. Specifically, the thickness of the heat-resistant layer is 0.1 μm or more and 5 μm or less, or may be 0.3 μm or more and 4 μm or less, or 0.5 μm or more and 3 μm or less.

[0053] In this specification, the thickness of each layer is a value measured by observing the cross section of the cover tape with an optical microscope.

[0054] (4) Method for forming heat-resistant layer The heat-resistant layer can be formed, for example, by applying a composition containing the above materials to one surface of the substrate layer and then curing the composition.

[0055] 3.Base material layer The substrate layer in the present disclosure contains a polyolefin resin and is a layer that supports the intermediate layer and the heat seal layer.

[0056] (1) Material of the base layer In the present disclosure, the substrate layer includes a polyolefin-based resin.

[0057] In this specification, a polyolefin resin is a resin obtained by polymerizing or copolymerizing an olefin monomer having a polymerizable unsaturated double bond. In the case of a copolymer, a polyolefin resin is a resin in which olefin units account for more than 50 mol% and 100 mol% or less of all structural units constituting the resin. Note that polyesters, such as polyethylene terephthalate, are polymers polymerized by ester bonds and are therefore distinguished from "polyolefin resins."

[0058] The polyolefin resin used in the base layer may be a homopolymer of an olefin monomer or a copolymer of two or more olefin monomers. The polyolefin resin may be used alone or in combination of two or more.

[0059] Examples of olefin monomers include α-olefins such as ethylene, propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, 1-octene, etc. Examples of olefin monomers also include diolefins such as dienes, isoprene, butylene, and butadiene.

[0060] Among these, the polyolefin resin is preferably a homopolymer of an olefin monomer. Examples of the homopolymer of an olefin monomer include polyethylene, polypropylene, and polybutylene. Among these, polyethylene and polypropylene are preferred, and polyethylene is more preferred.

[0061] Examples of polyethylene include low-density polyethylene (LDPE), medium-density polyethylene (MDPE), high-density polyethylene (HDPE), linear low-density polyethylene (LLDPE), and metallocene-based linear low-density polyethylene (M-LLDPE). Among these, high-density polyethylene is preferred. In this specification, the classifications of various polyethylenes refer to those defined in the former JIS K6748:1995 and JIS K6899-1:2000.

[0062] The density of polyethylene is, for example, 0.91 g / cm 3 More than 0.97g / cm 3 Preferably less than 0.94 g / cm 3 More than 0.97g / cm 3 The density of the polyethylene is measured by Method B (pycnometer method) in accordance with JIS K7112:1999.

[0063] Furthermore, the polyolefin resin is preferably a polyethylene resin. This allows for an increased ethylene content in the cover tape, making recycling easier. Examples of polyethylene resins include ethylene homopolymers and copolymers of ethylene and olefin monomers other than ethylene. Among these, as mentioned above, ethylene homopolymers, i.e., polyethylene, are preferred.

[0064] The polyolefin resin may be a biomass-derived polyolefin resin. The biomass-derived polyolefin resin may be a biomass-derived polyolefin resin that can be used for radiocarbon dating. 14 It is preferable that the polyethylene resin has a biomass degree calculated from the measured value of C. This makes it possible to reduce the total amount of carbon dioxide emissions.

[0065] There is no difference in physical properties such as molecular weight, mechanical properties, and thermal properties between plant (biomass)-derived resin compositions and petroleum-derived resin compositions. Therefore, the biomass content is generally used to distinguish between them. The carbon content of petroleum-derived resin compositions is as follows: 14 It does not contain radioactive carbon-14 (half-life 5730 years). Therefore, the biomass ratio is 14 The concentration of C is measured by accelerator mass spectrometry and used as an index of the content of the plant-derived resin composition in the resin composition. Therefore, if the resin composition is plant-derived, measuring the biomass degree of the resin composition will result in a biomass degree that corresponds to the content of the plant-derived resin composition.

[0066] Biomass polyethylene is produced by the following method. First, sugar solution extracted from harvested sugarcane is heated and concentrated to crystallize the raw sugar and blackstrap molasses, which are then separated using a centrifuge. The blackstrap molasses is then diluted with water to an appropriate concentration and fermented with yeast to produce ethanol. This bioethanol is then heated to produce ethylene through an intramolecular dehydration reaction in the presence of a catalyst. This plant-derived ethylene is then polymerized using a polymerization catalyst to produce polyethylene. Furthermore, biomass ethylene-α-olefin copolymerization can be obtained by copolymerizing the above-mentioned plant-derived ethylene with an α-olefin using a gas-phase polymerization method in the presence of a metallocene catalyst.

[0067] Specifically, radiocarbon dating of biomass-derived polyethylene resins 14 The biomass degree according to C is preferably 80% or more and 100% or less.

[0068] The method for measuring the biomass degree is the method described in Japanese Patent No. 5799520.

[0069] The base layer may contain additives as needed, such as fillers, plasticizers, colorants, and antistatic agents.

[0070] (b) Layer structure of the base layer The substrate layer may be a single layer containing a polyolefin resin, or may be a multilayer structure of two or more layers. In the case of a multilayer structure, at least one layer constituting the substrate layer must contain a polyolefin resin. The compositions of the layers may be the same or different. The substrate layer may also have a layer that does not contain a polyolefin resin.

[0071] In particular, the substrate layer is preferably a single layer containing a polyolefin resin, since this facilitates recycling.

[0072] The layer containing a polyolefin resin is preferably a uniaxially oriented polyolefin film or a biaxially oriented polyolefin film. That is, the base layer preferably contains a uniaxially oriented polyolefin film or a biaxially oriented polyolefin film. Compared to unstretched polyolefin films, uniaxially oriented polyolefin films and biaxially oriented polyolefin films can obtain high tensile strength and excellent impact strength that can withstand external forces during storage and transportation. Furthermore, compared to unstretched polyolefin films, uniaxially oriented polyolefin films and biaxially oriented polyolefin films have high transparency, gloss, and can be made thinner. The stretching direction of a uniaxially oriented polyolefin film is the machine direction (MD) of the unstretched film, and the stretching direction of a biaxially oriented polyolefin film is the machine direction (MD) of the unstretched film and the direction perpendicular thereto (TD).

[0073] Specific examples include uniaxially oriented polyethylene films, biaxially oriented polyethylene films, uniaxially oriented polypropylene films, and biaxially oriented polypropylene films.

[0074] (c) Thickness of the substrate layer The thickness of the substrate layer is, for example, 10 μm or more, and may be 12 μm or more. On the other hand, the thickness of the substrate layer is, for example, 50 μm or less, and may be 30 μm or less. That is, the thickness of the substrate layer may be, for example, 10 μm or more and 50 μm or less, and 12 μm or more and 30 μm or less. If the substrate layer is too thick, the rigidity during tape packaging will be strong, which is disadvantageous in terms of handling and cost. If the substrate layer is too thin, the mechanical strength may be insufficient.

[0075] 4. Middle class The intermediate layer in the present disclosure is disposed between the substrate layer and the heat-sealing layer. By disposing the intermediate layer between the substrate layer and the heat-sealing layer, the adhesion between the substrate layer and the heat-sealing layer can be improved. Furthermore, when the cover tape in the present disclosure is heat-sealed to the carrier tape, the intermediate layer improves cushioning. Therefore, heat can be applied more uniformly to the heat-sealing layer.

[0076] The material for the intermediate layer is appropriately selected depending on the materials for the base layer and the heat seal layer. In particular, it is preferable that the intermediate layer contains a polyolefin resin, because this facilitates recycling. The polyolefin resin used for the intermediate layer is the same as the polyolefin resin used for the base layer.

[0077] The polyolefin resin is preferably polyethylene, and more preferably low-density polyethylene. This improves cushioning. The density of polyethylene is, for example, 0.89 g / cm. 3 More than 0.93g / cm 3 The following is preferred:

[0078] The intermediate layer may be a single layer or may be a multi-layer consisting of two or more layers.

[0079] The thickness of the intermediate layer may be, for example, 5 μm or more and 50 μm or more, or 15 μm or more and 35 μm or less.

[0080] A film can be used as the intermediate layer. In this case, the lamination method of the substrate layer and the intermediate layer is not particularly limited, and known methods can be used. For example, there is a method (extrusion lamination method) in which a heat-molten film raw material is extruded onto the substrate layer using a T-die or the like, rapidly cooled and solidified with a cooling roll, and then pressure-bonded to the substrate layer. This forms an intermediate layer on one side of the substrate layer. It is preferable that an anchor coat layer is formed in advance on the surface of the substrate layer on which the intermediate layer will be disposed. Another method is to bond a pre-manufactured film to the substrate layer with an adhesive. Among these, the former method is preferred.

[0081] 5. Heat seal layer When a package is produced using the cover tape of the present disclosure, the heat seal layer of the present disclosure is heat sealed to the carrier tape, thereby adhering the cover tape to the carrier tape.

[0082] (1) Heat-sealing layer material The heat seal layer contains a thermoplastic resin. Examples of thermoplastic resins include polyolefin resins, acrylic resins, polyester resins, polyurethane resins, and vinyl chloride-vinyl acetate copolymers. Among these, polyolefin resins and acrylic resins are preferred, and polyolefin resins are more preferred. The use of these resins facilitates recycling. Furthermore, when the carrier tape contains a polyolefin resin, the heat seal strength is stable and low-temperature sealing is possible. On the other hand, acrylic resins are preferred because of their high transparency.

[0083] Examples of the polyolefin resin used in the heat seal layer include homopolymers of olefin monomers, copolymers of two or more kinds of olefin monomers, and copolymers of olefin monomers and monomers other than olefins.

[0084] The homopolymer of an olefin monomer and the copolymer of two or more kinds of olefin monomers are the same as the polyolefin resin used in the base layer.

[0085] Examples of copolymers of an olefin monomer and a monomer other than an olefin include ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene-styrene copolymer, and ethylene-styrene-acrylic acid copolymer.

[0086] Among these, polyethylene, polypropylene, and ethylene-vinyl acetate copolymer are preferred, polyethylene and ethylene-vinyl acetate copolymer are more preferred, and polyethylene is even more preferred.

[0087] Furthermore, it is also preferable that the polyolefin-based resin is a polyethylene-based resin. This can increase the ethylene content in the cover tape, making it easier to recycle. Examples of polyethylene-based resins include ethylene homopolymers, copolymers of ethylene and olefin monomers other than ethylene, and copolymers of ethylene and monomers other than olefins. As mentioned above, examples of copolymers of ethylene and monomers other than olefins include ethylene-vinyl acetate copolymers, ethylene-acrylic acid copolymers, ethylene-methacrylic acid copolymers, ethylene-styrene copolymers, and ethylene-styrene-acrylic acid copolymers. Of these, as mentioned above, polyethylene and ethylene-vinyl acetate copolymers are preferred, and polyethylene is more preferred.

[0088] Examples of the acrylic resin used in the heat seal layer include acrylic esters such as methyl acrylate, ethyl acrylate, propyl acrylate, and butyl acrylate. The acrylic resin may also be a resin obtained by polymerizing one or more methacrylic esters such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, and cyclohexyl methacrylate.

[0089] The heat seal layer may contain additives such as modifiers, wax-type low-molecular-weight polyolefins, and antistatic agents, as needed. Examples of modifiers include synthetic petroleum resin-based tackifiers such as petroleum resins, coumarone-based, and styrene-based, and natural resin-based tackifiers such as rosin-based, methyl ester-based, glycerin ester-based, pentaerythritol ester-based, and terpene-based tackifiers, as well as modified versions thereof. Examples of synthetic petroleum resin-based tackifiers include aliphatic petroleum resins, aromatic petroleum resins, alicyclic hydrogenated petroleum resins, and copolymerized petroleum resins. Modifiers may be used alone or in combination. Examples of antistatic agents include metal oxides, conductive polymers, carbon, carbon nanotubes, and surfactants. Antistatic agents may be used alone or in combination.

[0090] (2) Method for forming heat seal layer The method for forming the heat seal layer is not particularly limited, and known methods can be used. For example, a method (extrusion lamination method) can be used in which the raw material of the heat-melted film is extruded onto the substrate layer or intermediate layer using a T-die or the like, and then pressure-bonded to the substrate layer or intermediate layer using a laminator (cooling roll). Another example is a method in which a pre-manufactured film is bonded to the substrate layer or intermediate layer using an adhesive. Examples of adhesives that can be used include polyester adhesives, polyurethane adhesives, and acrylic adhesives.

[0091] Another method for forming the heat seal layer includes, for example, using a composition for a heat seal layer in which a thermoplastic resin, additives, etc. are dispersed or dissolved in a solvent, applying the composition for a heat seal layer to a base layer, and drying the composition. Examples of the method for applying the composition for a heat seal layer include known application methods such as roll coating, reverse roll coating, gravure coating, gravure reverse coating, comma coating, bar coating, wire bar coating, rod coating, kiss coating, knife coating, die coating, flow coating, dip coating, and spray coating.

[0092] (3) Specific Embodiments of the Heat-Sealing Layer Hereinafter, the heat seal layer will be described in three separate embodiments: a first embodiment containing polyethylene, a second embodiment containing ethylene-vinyl acetate copolymer, and a third embodiment containing acrylic resin.

[0093] (a) Heat seal layer of the first embodiment The heat seal layer of the first embodiment contains polyethylene. The polyethylene contained in the heat seal layer is preferably low-density polyethylene (LDPE) or linear low-density polyethylene (LLDPE) because of its high heat sealability. The density of the low-density polyethylene is, for example, 0.890 g / cm. 3 More than 0.930g / cm 3 The density of linear low density polyethylene is, for example, 0.910 g / cm 3 More than 0.925g / cm 3 The following is preferred:

[0094] The content of polyethylene in the heat seal layer is, for example, 50% by mass or more and 100% by mass or less, and may be 60% by mass or more and 80% by mass or less.

[0095] The thickness of the heat seal layer is not particularly limited, and may be, for example, 5 μm to 40 μm, or 10 μm to 20 μm. If the thickness of the heat seal layer is too thin, the sealing property may be poor and a uniform film may not be obtained. If the thickness of the heat seal layer is too thick, the transparency of the cover tape may be reduced, and the tack may be increased due to the increased stress in the single heat seal layer.

[0096] (b) Heat seal layer of the second embodiment The heat seal layer of the twelfth type contains ethylene-vinyl acetate copolymer (EVA). The inclusion of EVA in the heat seal layer improves the heat sealability to the carrier tape. This prevents unintended peeling during transportation, storage, etc.

[0097] The ethylene-vinyl acetate copolymer is a copolymer containing at least ethylene monomer units and vinyl acetate monomer units. The ethylene content in the ethylene-vinyl acetate copolymer is not particularly limited and may be, for example, 60% by mass to 97% by mass, or 80% by mass to 95% by mass. The vinyl acetate content in the ethylene-vinyl acetate copolymer is not particularly limited and may be, for example, 3% by mass to 40% by mass, or 5% by mass to 20% by mass. The ethylene-vinyl acetate copolymer may contain a third monomer unit in addition to the ethylene monomer unit and the vinyl acetate monomer unit. The third monomer unit may contain a functional group having antistatic properties.

[0098] The content of the ethylene-vinyl acetate copolymer in the heat seal layer is not particularly limited and may be, for example, 50% by mass to 100% by mass, or 60% by mass to 80% by mass. Increasing the content of the ethylene-vinyl acetate copolymer improves the heat seal performance but tends to increase tackiness.

[0099] The melt mass flow rate (MFR) of the EVA-containing material contained in the heat seal layer may be, for example, 5 g / 10 min to 120 g / 10 min, or 20 g / 10 min to 80 g / 10 min. The MFR is the value measured at 120°C under a load of 2.16 kg in accordance with JIS K7210-1:2014.

[0100] The heat seal layer may further contain polyethylene. By incorporating polyethylene, it is possible to maintain good heat sealability while reducing tack and suppressing deterioration after being placed in a high-humidity and high-heat environment.

[0101] Examples of polyethylene include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene. Low-density polyethylene and linear low-density polyethylene are preferred because of their high heat-sealing properties. The density of low-density polyethylene is, for example, 0.910 g / cm. 3 More than 0.930g / cm 3 The density of linear low density polyethylene is, for example, 0.910 g / cm 3 More than 0.925g / cm 3 The following is preferred:

[0102] The content of polyethylene in the heat seal layer may be, for example, 0% by mass or more and 50% by mass or less, or 20% by mass or more and 40% by mass or less. Increasing the polyethylene content decreases the heat seal performance, but tends to decrease the tackiness.

[0103] Furthermore, the heat seal layer may contain a resin other than the ethylene-vinyl acetate copolymer and polyethylene, if necessary.

[0104] The thickness of the heat seal layer is not particularly limited, and may be, for example, 5 μm to 40 μm, or 10 μm to 20 μm. If the thickness of the heat seal layer is too thin, the sealing property may be poor and a uniform film may not be obtained. If the thickness of the heat seal layer is too thick, the transparency of the cover tape may be reduced, and the tack may be increased due to the increased stress in the single heat seal layer.

[0105] (c) Heat seal layer of the third embodiment The heat seal layer of the third embodiment contains a (meth)acrylic resin. Examples of the (meth)acrylic resin include an ethylene-(meth)acrylic acid copolymer, an ethylene-(meth)acrylic acid copolymer, an ethylene-styrene-(meth)acrylic acid copolymer, and a styrene-(meth)acrylic acid copolymer. The (meth)acrylic resin is a copolymer other than a polyolefin resin, having an ethylene content of less than 50 mol%.

[0106] The content of the (meth)acrylic resin in the heat seal layer is, for example, 50% by mass or more and 100% by mass or less, and may be 60% by mass or more and 80% by mass or less.

[0107] The heat seal layer may further contain a styrene resin or a polyolefin resin such as polyethylene or EVA.

[0108] The thickness of the heat seal layer is not particularly limited, and may be, for example, 1 μm to 5 μm, or 1 μm to 3 μm. If the heat seal layer is too thick, recyclability will be impaired. If the heat seal layer is too thin, the sealing properties may be poor and a uniform film may not be obtained.

[0109] 6. Other configurations (1) Antistatic layer In the present disclosure, an antistatic layer may be disposed on the side of the heat-resistant layer opposite the substrate layer or between the heat-resistant layer and the substrate layer. The antistatic layer is a layer for preventing the cover tape from becoming electrically charged. The presence of the antistatic layer can suppress the generation of static electricity due to contact with other surfaces and can suppress the adhesion of dirt, dust, etc. to the surface of the cover tape due to static electricity. Typically, the thickness of the antistatic layer is thin compared to the overall thickness of the cover tape, so it does not affect recyclability.

[0110] The antistatic agent used in the antistatic layer is the same as the antistatic agent used in the heat-resistant layer.

[0111] The method for forming the antistatic layer includes, for example, applying a composition for an antistatic layer, in which an antistatic agent or the like is dispersed or dissolved in a solvent, to one surface of the heat-resistant layer or the base layer, and then drying the composition. The method for applying the composition for an antistatic layer includes, for example, known coating methods such as air doctor coating, blade coating, knife coating, rod coating, bar coating, direct roll coating, reverse roll coating, gravure coating, and slide coating.

[0112] The thickness of the antistatic layer is, for example, 0.01 μm or more and 1 μm or less. By using an antistatic layer of this thickness, it is possible to impart antistatic properties to the cover tape. Furthermore, if the antistatic layer is disposed on the opposite side of the heat-resistant layer from the substrate layer, if the antistatic layer is too thick, the antistatic agent may be degraded and turn into particles due to the heat during tape packaging. Furthermore, if the antistatic layer is disposed between the heat-resistant layer and the substrate layer, if the antistatic layer is too thick, it may hinder heat sealing during tape packaging. On the other hand, if the antistatic layer is too thin, it may not exhibit antistatic properties.

[0113] (2) Adhesive layer The cover tape of the present disclosure may have an adhesive layer between the base layer and the intermediate layer, or between the intermediate layer and the heat-sealing layer. The adhesive layer can improve adhesion between the base layer and the intermediate layer, or between the intermediate layer and the heat-sealing layer. The thickness of the adhesive layer is usually small relative to the overall thickness of the cover tape, so it does not affect recyclability.

[0114] The adhesive layer may be appropriately selected depending on the materials used for the base layer, intermediate layer, and heat seal layer, and is not particularly limited. For example, an olefin-based adhesive, an acrylic-based adhesive, an isocyanate-based adhesive, a urethane-based adhesive, or an ester-based adhesive may be used for the adhesive layer.

[0115] The adhesive layer can be formed by coating an adhesive composition, which is not particularly limited and can be gravure coating, roll coating, or the like.

[0116] The thickness of the adhesive layer is not particularly limited as long as it can improve the adhesion between the base layer and the intermediate layer or between the intermediate layer and the heat seal layer, and may be adjusted as appropriate.

[0117] 6. Physical properties of cover tape (1) Haze The haze of the cover tape in the present disclosure is, for example, 60% or less, or may be 55% or less, or may be 50% or less. The haze is measured in accordance with JIS K7136:2000 using a haze meter "NDH 7000" manufactured by Nippon Denshoku Industries Co., Ltd.

[0118] (2) Total light transmittance The total light transmittance of the cover tape in the present disclosure is, for example, preferably 80% or more, and more preferably 85% or more. A cover tape having such optical properties will have good visibility. The total light transmittance is measured using a haze meter "NDH 7000" manufactured by Nippon Denshoku Industries Co., Ltd. in accordance with JIS K7361-1:1997.

[0119] B. Packaging The packaging body of the present disclosure comprises a carrier tape having a plurality of storage sections for storing electronic components, the electronic components stored in the storage sections, and the above-mentioned cover tape arranged to cover the storage sections.

[0120] 2(a) and 2(b) are a schematic plan view and a cross-sectional view showing an example of a package according to the present disclosure. Since Fig. 2(a) and 2(b) were described above in the section "A. Cover tape for packaging electronic components," their description will be omitted here.

[0121] Each configuration of the packaging body of the present disclosure will be described below.

[0122] 1. Cover tape The cover tape in this disclosure has been described above in the section "A. Cover tape for packaging electronic components," so a description thereof will be omitted here.

[0123] In the package of the present disclosure, the heat seal layer of the cover tape and the carrier tape are bonded together by a heat seal portion. The heat seal portion can be located, for example, in a portion where the heat seal layer of the cover tape contacts the carrier tape. That is, the heat seal layer may have a heat seal portion and a non-heat seal portion. This improves the peelability of the cover tape from the carrier tape.

[0124] 2. Carrier tape The carrier tape in the present disclosure is a member having a plurality of storage sections for storing electronic components.

[0125] The carrier tape may be any tape having a plurality of storage sections, and may be, for example, an embossed carrier tape (also called an embossed tape), a punched carrier tape (also called a punched tape), or a pressed carrier tape (also called a pressed tape). Of these, an embossed carrier tape is preferably used from the viewpoints of cost, formability, dimensional accuracy, etc.

[0126] The material of the carrier tape is not particularly limited, and examples thereof include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polyethylene, polycarbonate, polyacrylonitrile, and ABS resin, as well as paper. In this specification, paper refers to a material containing cellulose as the main component and may further contain a resin component. From the viewpoint of recycling, polypropylene and polyethylene are preferred.

[0127] The thickness of the carrier tape is appropriately selected depending on the material of the carrier tape, the thickness of the electronic components, etc. The thickness of the carrier tape is, for example, 30 μm or more and 1500 μm or less. If the thickness of the carrier tape is too thick, the formability may be poor. On the other hand, if the thickness of the carrier tape is too thin, the strength may be insufficient.

[0128] The carrier tape has a plurality of storage sections. The storage sections are usually arranged at predetermined intervals along the longitudinal direction of the carrier tape. The size, depth, pitch, etc. of the storage sections are appropriately adjusted depending on the size, thickness, etc. of the electronic components.

[0129] A general carrier tape molding method can be applied as a method for forming a carrier tape having a storage portion, and the method can be appropriately selected depending on the type and material of the carrier tape, etc. Examples include press molding, vacuum molding, pressure molding, punching, and compression processing.

[0130] 3. Electronic Components The electronic components used in the package of the present disclosure are not particularly limited, and examples thereof include ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light-emitting diodes), liquid crystals, piezoelectric element resistors, filters, quartz oscillators, quartz vibrators, connectors, switches, volumes, relays, etc. The type of IC is also not particularly limited.

[0131] 4.Other The package in the present disclosure is used for storing and transporting electronic components. The electronic components are stored and transported in the package and are then mounted. During mounting, the cover tape is peeled off, the electronic components stored in the carrier tape storage section are removed, and the electronic components are mounted on a substrate or the like.

[0132] The present disclosure is not limited to the above-described embodiments. The above-described embodiments are merely examples, and any configuration that is substantially identical to the technical idea described in the claims of the present disclosure and that provides similar effects is included within the technical scope of the present disclosure. [Example]

[0133] The present disclosure will be described in more detail below with reference to examples and comparative examples.

[0134] [Example 1] A 25-μm-thick biaxially oriented polyethylene film ("BOPE-TEN" manufactured by WEIFU Co., Ltd., hereinafter referred to as PE film) was prepared as a base layer, with one side subjected to corona treatment. Additionally, an acrylic resin ("LG6720 Weak Matte Varnish B" manufactured by Tokyo Ink & Chemicals, Inc.) and a polyisocyanate ("Coronate HX" manufactured by Tosoh Corporation) were mixed in a mass ratio of 100:3 and diluted two-fold with ethyl acetate to prepare resin composition 1 for heat-resistant layer. Next, resin composition 1 for heat-resistant layer was applied to the corona-treated surface of the PE film to a film thickness of 2 μm after drying to form a heat-resistant layer.

[0135] Additionally, a polyurethane-based adhesive was prepared by mixing an isocyanate component (Mitsui Chemicals, Inc.'s "Takenate A-3075") and a polyol component (Mitsui Chemicals, Inc.'s "Takelac A-3210") in a mass ratio of 3:1 and diluting with ethyl acetate to a solids content of 5% by mass. The adhesive composition was then applied to the surface of the PE film opposite the heat-resistant layer to form a 1 μm-thick adhesive layer. Polyethylene resin (Prime Polymer Co., Ltd.'s "Evolue SP1071C") was then melted and extruded onto the surface of the adhesive layer, and a 20 μm-thick intermediate layer was formed by extrusion lamination using a cooling roll. Next, a heat-seal layer resin composition 1 (Unitika Ltd.'s "SB-1230N", a polyethylene-based resin) was applied to the surface of the intermediate layer opposite the PE film to a film thickness of 3 μm after drying to form a heat-seal layer.

[0136] [Example 2] A PE film similar to that used in Example 1 was prepared as a base layer. An acrylic resin (DH-S004 manufactured by DIC Corporation) and a polyisocyanate (DH-HARDENER manufactured by DIC Corporation) were mixed at a mass ratio of 100:5 and diluted two-fold with ethyl acetate to prepare a resin composition 2 for a heat-resistant layer. The resin composition 2 for a heat-resistant layer was applied to the corona-treated surface of the PE film to a film thickness of 1 μm after drying to form a heat-resistant layer.

[0137] Next, in the same manner as in Example 1, the adhesive composition was applied to the surface of the PE film opposite the heat-resistant layer to form an adhesive layer. Next, a polyethylene resin (Novatec LC600A manufactured by Japan Polyethylene Corporation) was melted and extruded onto the surface of the adhesive layer, and a 20 μm-thick intermediate layer was formed by extrusion lamination using a cooling roll. A polyethylene resin (Zaixen ACHW10 manufactured by Sumitomo Seika Chemicals Co., Ltd.) and a nonionic surfactant (Nimeen T2 202 manufactured by NOF Corporation) were mixed in a mass ratio of 170:1 to prepare resin composition 2 for heat-sealing layers. Next, resin composition 2 for heat-sealing layers was applied to the surface of the intermediate layer opposite the PE film to a film thickness of 5 μm after drying to form a heat-sealing layer.

[0138] [Example 3] A PE film similar to that used in Example 1 was prepared as a base layer. A solution containing a polyester resin (GX-1157 manufactured by GOO Chemical Co., Ltd.) and a carbodiimide (Carbodilite SV-02 manufactured by Nisshinbo Chemical Inc.) in a mass ratio of 100:10 was prepared, and then a nonionic surfactant (Nimeen T2 202 manufactured by NOF Corporation) was mixed with the solution in a mass ratio of 170:1 to prepare a heat-resistant layer resin composition 3. Next, the heat-resistant layer resin composition 3 was applied to the corona-treated surface of the PE film to a film thickness of 2 μm after drying to form a heat-resistant layer.

[0139] Next, in the same manner as in Example 1, the adhesive composition was applied to the surface of the PE film opposite the heat-resistant layer to form an adhesive layer. Then, in the same manner as in Example 2, an intermediate layer having a thickness of 25 μm was formed on the surface of the adhesive layer. Furthermore, an acrylic resin (DIC Corporation's "DIC Seal A450LT") and an antistatic agent (Ishihara Sangyo Kaisha's "FSS-10M (Sb-doped Sn)") were mixed in a mass ratio of 2:1 to prepare a heat-seal layer resin composition 3. Next, the heat-seal layer resin composition 3 was applied to the surface of the intermediate layer opposite the PE film to a film thickness of 2 μm after drying to form a heat-seal layer.

[0140] [Example 4] A PE film similar to that used in Example 1 was prepared as a base layer. Acrylic resin (DH-SOO4 manufactured by DIC Corporation) and polyisocyanate (DH-HARDENER manufactured by DIC Corporation) were mixed in a mass ratio of 100:5, and the mixture was diluted two-fold with ethyl acetate. An antistatic agent (FSS-10M (Sb-doped Sn2) manufactured by Ishihara Sangyo Kaisha, Ltd.) was then mixed with the resulting solution in a mass ratio of 1:1 to prepare resin composition 4 for heat-resistant layer. Resin composition 4 for heat-resistant layer was then applied to the corona-treated surface of the PE film to a film thickness of 2 μm after drying, forming a heat-resistant layer.

[0141] Next, the adhesive composition was applied to the surface of the PE film opposite the heat-resistant layer to form an adhesive layer in the same manner as in Example 1. Then, a 15 μm-thick intermediate layer was formed on the surface of the adhesive layer in the same manner as in Example 2. Next, resin composition 4 for heat-sealing layers ("CMPS V207" manufactured by Dow Mitsui Polychemicals, a polyolefin resin composition) was melted and extruded onto the surface of the intermediate layer, and a 15 μm-thick heat-sealing layer was formed by extrusion lamination using a cooling roll.

[0142] [Comparative Example 1] A PE film similar to that used in Example 1 was prepared as a base layer. Next, an adhesive layer was formed on the PE film in the same manner as in Example 1. Next, an intermediate layer having a thickness of 15 μm was formed on the surface of the adhesive layer in the same manner as in Example 2. Next, a heat seal layer having a thickness of 15 μm was formed on the surface of the intermediate layer in the same manner as in Example 4.

[0143] [evaluation] (1) Ethylene content in the cover tape The polyolefin resin contained in the cover tape was analyzed by FT-IR as described in the above section "A. Cover tape for packaging electronic components 1. Ethylene content in the cover tape" to determine whether it was at least one of the above (1) to (5). The ethylene content in the cover tape was also measured using FT-IR by the microscopic ATR method as described in the above section "A. Cover tape for packaging electronic components 1. Ethylene content in the cover tape." The Fourier transform infrared spectrophotometer used was a "FTS7000" manufactured by VARIAN. The ATR device used was a "Silvergate ATR Evolution" manufactured by Specac, with a Zn-Se prism. The measurement conditions are shown below. <Measurement conditions> Measurement mode: Microscopic ATR method ·Incidence angle: 45° Detector: DTGS ·Resolution: 4cm -1 Number of times accumulated: 64

[0144] (2) Heat-resistant layer adhesion The tackiness of the heat-resistant layer of the cover tape was measured using the method described in the above section "A. Cover tape for packaging electronic components 2. Heat-resistant layer (1) Physical properties of the heat-resistant layer." The temperature conditions were probe temperatures of 60°C, 100°C, and 150°C. Note that the cover tape of Comparative Example 1 did not have a heat-resistant layer, so the tackiness of the base layer of the cover tape was measured.

[0145] (3) Adhesion to the seal iron Using a taping machine "NST-35" manufactured by Nitto Kogyo Co., Ltd., heat sealing was performed under the following conditions, and the adhesion of the cover tape to the sealing iron was evaluated. The evaluation criteria are shown below. <Heat sealing conditions> Taping temperature: 150℃ Taping speed: 3000 tacts Seal width: 0.6mm Taping iron size: 0.6mm x 2 wires Taping iron length (seal length per tact): 8±1mm Carrier tape: optional (8mm width)

[0146] <Evaluation criteria> A: The cover tape does not tear and does not stick to the sealing iron. B: The cover tape does not break, and although it sticks slightly to the sealing iron and lifts up, it can be sealed without any problems. C: The cover tape breaks or sticks to the sealing iron, causing the device to stop.

[0147] [Table 1]

[0148] In the present disclosure, for example, the following inventions are provided. [1] A cover tape for packaging electronic components, comprising a heat-resistant layer, a base layer, an intermediate layer, and a heat-sealing layer in this order, the base layer contains a polyolefin-based resin, The cover tape for packaging electronic components has an ethylene content of 60% by mass or more. [2] The cover tape for packaging electronic components according to [1], wherein the tack of the heat-resistant layer at 150°C measured by a probe tack test method is 100 gf or less. [3] The cover tape for packaging electronic components according to [1] or [2], wherein the polyolefin resin contained in the base material layer is a polyethylene resin. [4] The cover tape for packaging electronic components according to any one of [1] to [3], wherein the intermediate layer contains a polyolefin resin. [5] The cover tape for packaging electronic components according to [4], wherein the polyolefin resin contained in the intermediate layer is a polyethylene resin. [6] The cover tape for packaging electronic components according to any one of [1] to [5], wherein the heat seal layer contains a polyolefin resin. [7] The cover tape for packaging electronic components according to [6], wherein the polyolefin resin contained in the heat seal layer is a polyethylene resin. [8] A carrier tape having a plurality of storage compartments for storing electronic components; an electronic component stored in the storage section; The cover tape for packaging electronic components according to any one of [1] to [7], which is arranged to cover the storage section; A packaging body comprising: [Explanation of symbols]

[0149] 1... Cover tape 2 … Heat-resistant layer 3...Base material layer 4. Middle class 5... Heat seal layer 10 … Packaging 11... Carrier tape 12...Storage area 13...Electronic components

Claims

1. A cover tape for packaging electronic components, comprising a heat-resistant layer, a base layer, an intermediate layer, and a heat-sealing layer in this order, the base layer contains a polyolefin-based resin, The cover tape for packaging electronic components has an ethylene content of 60 mass% or more.

2. 2. The cover tape for packaging electronic components according to claim 1, wherein the heat-resistant layer has a tack of 100 gf or less at 150°C as measured by a probe tack test method.

3. 2. The cover tape for packaging electronic components according to claim 1, wherein the polyolefin resin contained in the base material layer is a polyethylene resin.

4. The cover tape for packaging electronic components according to claim 1 , wherein the intermediate layer comprises a polyolefin resin.

5. 5. The cover tape for packaging electronic components according to claim 4, wherein the polyolefin resin contained in the intermediate layer is a polyethylene resin.

6. The cover tape for packaging electronic components according to claim 1 , wherein the heat seal layer contains a polyolefin resin.

7. 7. The cover tape for packaging electronic components according to claim 6, wherein the polyolefin resin contained in the heat seal layer is a polyethylene resin.

8. a carrier tape having a plurality of storage sections for storing electronic components; an electronic component housed in the housing; The cover tape for packaging electronic components according to any one of claims 1 to 7, which is disposed so as to cover the storage section; A packaging body comprising:

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