Element substrate, recording head, cartridge, and recording device

Abstract

To provide an element substrate that can inhibit increase in size.SOLUTION: An element substrate includes: a plurality of energy generation elements to generate energy for ejecting a liquid; a plurality of heating elements to regulate a temperature of the liquid; first drivers to respectively drive the plurality of energy generation elements; and second drivers to respectively drive the plurality of heating elements. The plurality of energy generation elements, the plurality of heating elements, the first drivers, and the second drivers are arranged along a first direction. A single driver array in which the first drivers and the second drivers are arranged along the first direction is formed.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to an element substrate, a printhead, a cartridge, and a printing apparatus. [Background technology]

[0002] Patent Document 1 discloses a recording element substrate (element substrate) that includes a supply port provided between a heat source (sub-heater) and a heat source (driver) different from the heat source. The recording element substrate of Patent Document 1 increases the distance between the sub-heater, which is the heat source, and the driver, thereby suppressing the effect of heating on the driver and achieving highly reliable driving. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-213874 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, the recording element substrate disclosed in Patent Document 1 is equipped with a heater for generating ejection energy in addition to the sub-heater, and therefore requires a driver for driving this heater. Patent Document 1 does not disclose the position for arranging the driver for driving the heater for generating ejection energy, but depending on the position for arranging the driver, there is a risk that the recording element substrate will become larger.

[0005] Therefore, an object of the present disclosure is to provide an element substrate that can prevent an increase in size. [Means for solving the problem]

[0006] The element substrate of the present disclosure comprises a plurality of energy generating elements that generate energy for ejecting liquid, a plurality of heat generating elements that adjust the temperature of the liquid, a first driver that drives each of the plurality of energy generating elements, and a second driver that drives each of the plurality of heat generating elements, wherein the plurality of energy generating elements, the plurality of heat generating elements, the first driver, and the second driver are arranged along a first direction, and a single driver row is formed in which the first driver and the second driver are arranged along the first direction. [Effects of the Invention]

[0007] According to the element substrate of the present disclosure, it is possible to prevent the element substrate from becoming large. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is an explanatory diagram of a printing apparatus that can be applied to an embodiment. [Figure 2] FIG. 1 is a plan view showing an example of a substrate that can be applied to an embodiment. [Figure 3] FIG. 10 is a diagram showing an example of a circuit board that can be applied to an embodiment. [Figure 4] Cross-sectional view of line IV-IV in Figure 2. [Figure 5] Enlarged view of region V in Figure 2. [Figure 6] 6 is a schematic cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] FIG. 4 is a schematic plan view perspective view showing an example of a second substrate. [Figure 8] Cross-sectional view of line VIII-VIII in Figure 7. [Figure 9] FIG. 4 is a schematic plan view showing an example of a third substrate. [Figure 10] FIG. 10 is a schematic plan view showing an example of a fourth substrate. DETAILED DESCRIPTION OF THE INVENTION

[0009] [First embodiment] Hereinafter, the present embodiment will be described with reference to the drawings. Note that the embodiment described below is merely an example to which the technology of the present disclosure can be applied, and does not limit the technical scope of the present disclosure.

[0010] In this disclosure, "recording" does not only mean forming meaningful information (for example, characters and figures that are visible to humans). "Recording" also means forming insignificant information. Furthermore, in this disclosure, "recording" broadly means forming an image, a design, a pattern, a structure, or a combination thereof on a recording medium, or processing the medium.

[0011] "Recording medium" refers not only to paper used in general recording devices, but also to other materials that can accept ink, such as cloth, plastic film, metal plate, glass, ceramics, resin, wood, and leather. Recording media can be anything on which an image can be formed by impacting ink droplets. For example, various materials and shapes can be used, such as paper, cloth, optical disc label surfaces, plastic sheets, overhead projector sheets, and envelopes.

[0012] In this embodiment, the description will be made assuming that ink is used as the liquid. However, the liquid that can be used in the technology of the present disclosure is not limited to ink. In addition to ink, various recording liquids can be used, including treatment liquids used for the purposes of improving the fixation of ink on a recording medium, reducing uneven gloss, and improving abrasion resistance.

[0013] In this embodiment, a recording apparatus using an inkjet recording method will be described as an example. The recording apparatus may be, for example, a single-function printer having only a recording function, or a multi-function printer having multiple functions such as a recording function, a fax function, and a scanner function. The recording apparatus may also be an apparatus for manufacturing color filters, electronic devices, optical devices, microstructures, etc. using a predetermined recording method.

[0014] <Recording device 100> FIG. 1A is a perspective view showing an example of a recording apparatus 100 that can be applied to this embodiment.

[0015] As shown in FIG. 1(a), the recording device 100 includes a lead screw 102 having a spiral groove 101 formed therein, a carriage 103 having a pin (not shown) that engages with the spiral groove 101, and a guide rail 104 that slidably supports the carriage 103.

[0016] The recording device 100 includes a carriage motor 105 for moving the carriage 103, and a first gear 106, a second gear 107, and a third gear 108 for transmitting a driving force from the carriage motor 105 to the lead screw 102.

[0017] The recording device 100 includes a platen 109 that supports the recording medium P and a paper pressure plate 110 that presses down the recording medium P. The recording device 100 also includes a first photocoupler 112 and a second photocoupler 113 for detecting a lever 111 attached to the carriage 103.

[0018] The carriage 103 is detachably mounted with a cartridge 116, which is an integrated unit of an inkjet recording head 114 (see FIG. 1(b)) and an ink tank 115 (see FIG. 1(b)).

[0019] The driving force of the carriage motor 105 is transmitted via a first gear 106, a second gear 107, and a third gear 108, causing the lead screw 102 to rotate. A carriage 103, which has a pin (not shown) that engages with a spiral groove 101 formed in the lead screw 102, moves in the ±X directions in the figure as the lead screw 102 rotates. That is, the carriage 103 moves back and forth in the ±X directions in the figure, which are the main scanning directions, in conjunction with the forward or reverse rotation drive of the carriage motor 105. A guide rail 104 supports the carriage 103 from below as it moves back and forth in the ±X directions.

[0020] While the carriage 103 moves back and forth in the ±X directions, the print head 114 (see FIG. 1(b)) ejects ink in accordance with print data, thereby printing one band of image on the print medium P.

[0021] The portion of the recording medium P being recorded by the recording head 114 is kept parallel to the ejection port surface of the recording head 114 by the platen 109 and the paper pressure plate 110. When the recording head 114 performs a recording scan of one band, the recording medium P is transported in a direction intersecting the X direction (in this embodiment, the -Y direction) by a distance equivalent to one band. By alternately repeating this recording scan by the recording head 114 and the transport operation of the recording medium P, an image is formed on the recording medium P in stages.

[0022] The home position is the end of the scanning area of ​​the carriage 103 in the +X direction. When the carriage 103 is at the home position, a first photocoupler 112 and a second photocoupler 113 detect a lever 111 attached to the carriage 103. The detection results of the first photocoupler 112 and the second photocoupler 113 are used to switch the rotation direction of the carriage motor 105, etc.

[0023] FIG. 1(b) is an external perspective view showing an example of a cartridge 116 that can be applied to this embodiment.

[0024] 1(b), the cartridge 116 is an integral structure of the print head 114 and the ink tank 115. The ink tank 115 contains ink to be supplied to the print head 114.

[0025] When the cartridge 116 is mounted on the carriage 103 (see FIG. 1(a)), electrodes (not shown) provided on the cartridge 116 are electrically connected to the main body substrate (not shown) of the device. Then, ink is ejected from the element substrate 117 of the recording head 114 in accordance with the ejection signal received by the electrodes from the main body substrate.

[0026] FIG. 1C is a diagram illustrating the configuration of an element substrate 117, which is the part of the print head 114 that ejects ink.

[0027] As shown in FIG. 1(c), the element substrate 117 is mainly constructed by laminating an ejection port forming member 120 on a substrate 119. On the substrate 119, a plurality of ejection heaters 202 (not shown in FIG. 1(c)), which are energy generating elements for ejecting ink, are arranged at predetermined intervals in the Y direction in the figure. Ink is supplied to the element substrate 117 from an ink tank 115 (see FIG. 1(b)). A temperature sensor (not shown) for detecting the temperature of the print head 114 (see FIG. 1(b)) is provided at an end of the substrate 119. The detected temperature of the temperature sensor essentially detects the temperature of the ink in contact with the temperature sensor.

[0028] In the ejection port forming member 120, ejection ports 118 are formed at positions facing the respective ejection heaters 202. These ejection ports 118 form a single ejection port array along the Y direction. This ejection port array is configured so that dots can be printed at a predetermined printing resolution.

[0029] In addition, the ejection port forming member 120 is formed with flow paths (not shown) that communicate with each of the multiple ejection ports 118, and a common liquid chamber (not shown) that is connected to an ink supply port (not shown) and is commonly connected to the multiple flow paths (not shown).

[0030] With the above configuration, ink supplied from an ink supply port (not shown) to a common liquid chamber (not shown) is guided to the ejection port 118 via individual flow paths, where it forms a meniscus. When a predetermined pulse voltage is applied to the ejection heater 202 (not shown in FIG. 1(c)) in accordance with an ejection signal, film boiling occurs in the ink in contact with the ejection heater 202, and the growth energy of the generated bubbles causes the ink to be ejected in the -Z direction from the ejection port 118 as droplets.

[0031] Hereinafter, the longitudinal direction (Y direction) of the element substrate 117 will be referred to as the first direction, the lateral direction (X direction) of the element substrate 117 will be referred to as the second direction, and the height direction (Z direction) of the element substrate 117 will be referred to as the third direction, where appropriate. The X direction, Y direction, and Z direction are perpendicular to each other.

[0032] <Board 119> FIG. 2 is a plan view showing an example of a substrate 119 that can be applied to this embodiment.

[0033] 2, the substrate 119 has a pad section 200 including a power supply pad 200a for electrical connection to the outside and a GND (ground) pad 200b. The substrate 119 has a VH wiring 201 that functions as a power supply wiring. The substrate 119 also has a discharge heater 202 that generates bubbles in the liquid when heated and can discharge the liquid from the discharge port 118 using the growth energy of the bubbles, and a sub-heater 203 that is a heating element that generates heat to adjust the temperature of the liquid. The substrate 119 also has a supply port 204 that is an opening for supplying the liquid to the discharge port forming member 120 (see FIG. 1(c)).

[0034] The substrate 119 includes a first driver 205 for driving the ejection heater 202 and a second driver 206 for driving the sub-heater 203. The substrate 119 includes a GNDH wiring 207 that functions as a GND (ground) wiring. Hereinafter, when there is no need to particularly distinguish between the first driver 205 and the second driver 206, they will be simply referred to as drivers.

[0035] In this embodiment, a plurality of ejection heaters 202 for generating energy for ejecting liquid and a plurality of sub-heaters 203 for adjusting the temperature of the liquid are arranged along a first direction (Y direction). A first driver 205 for driving each of the plurality of ejection heaters 202 and a second driver 206 for driving each of the plurality of sub-heaters 203 are arranged along the first direction (Y direction). In a part of a driver row 205a formed in a row along the first direction (Y direction), the first driver 205 and the second driver 206 are arranged adjacent to each other along the first direction (Y direction).

[0036] In the driver row 205a, the plurality of second drivers 206 are periodically arranged. In the example of Fig. 2, one second driver 206 is arranged following two consecutive first drivers 205. In this manner, a plurality of sets each consisting of two first drivers 205 and one second driver 206 are arranged along the first direction (Y direction).

[0037] Furthermore, the distance between the drivers in the driver array 205a is smaller than the distance between the ejection heaters in the ejection heater array 202a. In other words, the distance between two consecutive first drivers 205 in the driver array 205a, and the distance between consecutive first drivers 205 and second drivers 206, are smaller than the distance between two consecutive ejection heaters 202 in the ejection heater array 202a.

[0038] According to this configuration, the size of the driver array 205a in the longitudinal direction (Y direction) can be made smaller than when the intervals between the drivers in the driver array 205a are the same as the intervals between the ejection heaters in the ejection heater array 202a.

[0039] The distance between the drivers in the driver array 205a is smaller than the distance between the sub-heaters in the sub-heater array 203a. That is, the distance between two consecutive first drivers 205 in the driver array 205a and the distance between consecutive first drivers 205 and second drivers 206 are smaller than the distance between two consecutive sub-heaters 203 in the sub-heater array 203a.

[0040] According to this configuration, the size of the driver array 205a in the longitudinal direction (Y direction) can be reduced compared to when the intervals between the drivers in the driver array 205a are the same as the intervals between the sub-heaters in the sub-heater array 203a.

[0041] Furthermore, a plurality of supply ports 204 for supplying liquid to a plurality of discharge ports 118 (not shown in FIG. 2) are arranged along the first direction (Y direction) at positions corresponding to the plurality of discharge heaters 202. The discharge heater array 202a of the discharge heaters 202, the sub-heater array 203a of the sub-heaters 203, the supply port array 204a consisting of a plurality of supply ports 204, and the driver array 205a are arranged on the substrate 119 along the X direction which intersects with the Y direction in which each array extends.

[0042] The pad section 200 is arranged at both ends in the first direction (Y direction) of the substrate 119. The pad section 200 includes power supply pads 200a for the ejection heaters 202 and sub-heaters 203, and GND pads 200b for the ejection heaters 202 and sub-heaters 203. The pad section 200 includes signal pads for transmitting logic data to a control data supply circuit (not shown in FIG. 1), etc.

[0043] A plurality of supply ports 204 are arranged in the first direction (Y direction) in the center of the substrate 119. That is, a single supply port array 204a consisting of a plurality of supply ports 204 is formed in the center of the substrate 119. The supply port array 204a is formed at a position shifted in the second direction (+X direction in the example of FIG. 2) with respect to the ejection heater array 202a.

[0044] By laminating the ejection port forming member 120 on the substrate 119, the liquid supplied from the supply port 204 is supplied to the upper layer of the ejection heater 202 through a flow path formed in the ejection port forming member 120. The plurality of ejection heaters 202 are arranged along the first direction (Y direction). That is, a single ejection heater array 202a consisting of the plurality of ejection heaters 202 is formed along the supply port array 204a.

[0045] The sub-heater 203 is an element for heating and keeping the substrate 119 and the liquid warm. The sub-heater 203 is arranged between the discharge heater 202 and the supply port 204 in the X direction. A plurality of sub-heaters 203 are arranged along a first direction (Y direction). That is, one sub-heater array 203a is formed between the supply port array 204a and the discharge heater array 202a. In this way, by forming the discharge heater array 202a near the sub-heater array 203a, it is possible to efficiently heat and keep the liquid on the discharge heater 202 warm.

[0046] By forming a sub-heater array 203a between the supply port array 204a and the discharge heater array 202a, it is possible to efficiently heat and keep warm the liquid on the discharge heater 202 and inside the supply port 204. In this embodiment, the supply port array 204a is formed from a plurality of openings, but one or several supply ports each consisting of a single opening and long in the Y direction may be formed.

[0047] Furthermore, on the substrate 119, a first driver 205 for driving the ejection heater 202 and a second driver 206 for driving the sub-heater 203 are arranged.

[0048] In this embodiment, each of the plurality of first drivers 205 is connected to a corresponding one of the plurality of ejection heaters 202. The plurality of first drivers 205 form one driver row 205a along the first direction (Y direction).

[0049] By switching the first driver 205 ON and OFF at any timing, it is possible to pass a current to the discharge heater 202 at any timing. Then, when a current is passed through the discharge heater 202, the discharge heater 202 is heated, and the liquid is heated. When the discharge heater 202 is suddenly heated, film boiling occurs in the liquid in contact with the discharge heater 202, and bubbles are generated.

[0050] Furthermore, each of the second drivers 206 is connected to a corresponding one of the sub-heaters 203. In a driver row 205a in which a plurality of first drivers 205 are arranged in a row along the first direction (Y direction), the second drivers 206 are arranged periodically.

[0051] In this embodiment, two first drivers 205 are arranged in succession, one second driver 206 is arranged following the first drivers 205, and two first drivers 205 are arranged in succession following the second driver 206. In this way, in the driver row 205a, the second drivers 206 are periodically sandwiched between two first drivers 205. The second driver 206 can switch on and off the current flowing to the sub-heater 203. In this way, by arranging the first driver 205 and the second driver 206 in one driver row 205a, it is possible to save space without adding extra rows in the X direction.

[0052] The VH wiring 201 is arranged in an area to the left of the ejection heater array 202a. Power is supplied to the VH wiring 201 via a power supply pad 200a. The GNDH wiring 207 is arranged in an area to the right of the driver array 205a.

[0053] The GNDH wiring 207 is connected to the GND pad 200b. The VH wiring 201 is connected to each of the multiple ejection heaters 202 and each of the multiple sub-heaters 203 individually via wiring (not shown in FIG. 2), and is configured to be usable as a common power supply solid wiring. The GNDH wiring 207 is connected to the first driver 205 and the second driver 206, and is configured to be usable as a common GND solid wiring.

[0054] For energy conservation, it is preferable to minimize the power consumed by components other than the ejection heater 202 and the sub-heater 203. For example, it is preferable that the VH wiring 201 and the GNDH wiring 207 are made of a low-resistance material such as aluminum.

[0055] FIG. 3 is a diagram showing an example of a circuit of the substrate 119 that can be applied to this embodiment.

[0056] As shown in FIG. 3, the first driver 205 and the second driver 206 are N-channel insulated gate field effect transistors.

[0057] The power supply pad 200a is configured so as to be able to share the same power supply to supply power to the discharge heater 202 and the sub-heater 203. The power supply pad 200a is connected to the drain sides of a first driver 205 and a second driver 206 via a VH wiring 201 and the resistors of the discharge heater 202 and the sub-heater 203.

[0058] The GND pad 200b is configured so as to be able to be shared as the same GND pad for the ejection heater 202 and the sub-heater 203. The GND pad 200b is connected to the source sides of the first driver 205 and the second driver 206 via a GNDH wiring 207.

[0059] In this embodiment, a common VH wiring 201 and a common GNDH wiring 207 are used for the ejection heater 202 and the sub-heater 203. However, separate VH wiring, GNDH wiring, power supply pads, and GND pads may be provided for the ejection heater 202 and the sub-heater 203, respectively, to supply power.

[0060] In the circuit of this embodiment, a plurality of first logic circuits (AND circuits) 301 for selecting the ejection heaters 202 are arranged to correspond to each of the plurality of ejection heaters 202. In this embodiment, AND circuits are used as the logic circuits. The plurality of first logic circuits 301 are arranged along a first direction (Y direction) to form a logic circuit row 300.

[0061] In the circuit of this embodiment, a plurality of second logic circuits (AND circuits) 302 for selecting the sub-heaters 203 are arranged to correspond to each of the plurality of sub-heaters 203. In a logic circuit array 300 in which a plurality of first logic circuits 301 are arranged in a row along the first direction (Y direction), the second logic circuits 302 are arranged periodically.

[0062] In the example of FIG. 3, two first logic circuits 301 are arranged in succession, one second logic circuit 302 is arranged following the first logic circuits 301, and two first logic circuits 301 are arranged in succession following the second logic circuit 302.

[0063] In this way, by arranging the first logic circuit 301 and the second logic circuit 302 along the Y direction to form one logic circuit row 300, it is possible to save space without adding extra rows, as with the driver row 205a.

[0064] The first logic circuit 301 and the second logic circuit 302 are connected via signal lines to a control data supply circuit 303. Based on the logic data signals sent from the control data supply circuit 303, the two types of AND circuits and the gate G of the driver are controlled, and the ejection heater 202 and the sub-heater 203 can be driven.

[0065] A logical data signal can be input from the pad section 200 (not shown in FIG. 3) to the control data supply circuit 303 via the printing apparatus main body and a host PC (not shown), etc. Examples of logical data signals include a clock signal CLK, an image data signal DATA, a latch signal LT, and a printing element control signal HE, all of which are not shown.

[0066] In this embodiment, the first logic circuit 301, the second logic circuit 302, and the control data supply circuit 303 are arranged inside the substrate 119. However, the first logic circuit 301, the second logic circuit 302, and the control data supply circuit 303 may be arranged outside the substrate 119.

[0067] Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 2. In Fig. 4, the discharge heater 202 and the sub-heater 203 are shown by dashed lines because they are arranged at the back of Fig. 4 in the cross-sectional view.

[0068] 4, the substrate 119 includes a silicon substrate 401 containing silicon, and an upper layer 402 disposed above the silicon substrate 401. Between the silicon substrate 401 and the upper layer 402, an intermediate layer 403 in which the second driver 206 is disposed is sandwiched.

[0069] A second driver 206 is disposed on a silicon substrate 401. The second driver 206 is covered by an interlayer film that functions as an insulating layer. A portion of the second driver 206 is electrically connected to a GNDH wiring 207 on an upper layer 402 through a through-hole 404. A VH wiring 201 is also disposed on the upper layer 402. An ejection heater 202 is also disposed on the upper layer 402.

[0070] The sub-heater 203 is disposed on an intermediate layer 403. The sub-heater 203 is formed of polysilicon, aluminum wiring, etc. The intermediate layer 403 includes an AND circuit region 405 where an AND circuit is disposed, and a data signal line region 406 where wiring for transmitting and receiving various data is disposed.

[0071] In this way, the substrate 119 includes a silicon substrate 401, an intermediate layer 403, and an upper layer 402 that are stacked along a direction perpendicular to the surface of the substrate 119. In the substrate 119, the second driver 206 is arranged in the intermediate layer 403, which is different from the upper layer 402 on which the VH wiring 201 and the GNDH wiring 207 are arranged. The second driver 206 is arranged so as to overlap with the GNDH wiring 207 along a direction perpendicular to the surface of the substrate 119.

[0072] That is, in the first direction (Y direction) and in the third direction (Z direction) orthogonal to the second direction (X direction) orthogonal to the first direction (Y direction) plane, the GNDH wiring 207 is arranged above the second driver 206. Note that, although the GNDH wiring 207 is arranged above the second driver 206 in the example of Fig. 4, the VH wiring 201 may be arranged instead of the GNDH wiring 207.

[0073] According to this arrangement, the VH wiring 201 or the GNDH wiring 207 is arranged so as to be shifted in the height direction relative to the second driver 206. Therefore, compared to a configuration in which the VH wiring 201, the GNDH wiring 207, and the second driver 206 are all arranged on the same layer, the substrate 119 can be made smaller in size in the short side direction.

[0074] The wiring from the VH wiring 201 to the ejection heater 202 and the sub-heater 203, and the wiring from the VH wiring 201 to the driver are routed two-dimensionally or three-dimensionally via through holes and individual wiring.

[0075] <Details of the First Driver 205 and the Second Driver 206> Fig. 5 is an enlarged view of region V in Fig. 2. In this embodiment, the first driver 205 and the second driver 206 are NMOS (n-channel metal oxide semiconductor) transistors including insulated gate field effect transistors.

[0076] 5, a first drain wiring D1 for a first driver 205 extends from the discharge heater 202 toward the short-side direction (X direction) of the substrate 119 so as to avoid the sub-heater 203 and the supply port 204. The first drain wiring D1 branches into two so as to be separated from each other between the supply port 204 and the first driver 205. The two branched first drain wirings D1 extend parallel to each other along the second direction (X direction).

[0077] In the region V of this embodiment, two discharge heaters 202 are arranged, and therefore two first drain wirings D1 are arranged so as not to overlap each other and to have similar shapes. A second drain wiring D2 for a second driver 206 extends from the sub-heater 203 in the short direction of the substrate 119 so as to face the first drain wiring D1 across the supply port 204.

[0078] The second drain wiring D2 branches into two lines spaced apart from each other between the supply port 204 and the second driver 206. The two branches of the second drain wiring D2 extend parallel to each other in the second direction (X direction). In this way, when the substrate 119 is viewed in a plan view, the first drain wiring D1 and the second drain wiring D2 are each arranged in a finger shape.

[0079] Hereinafter, for convenience, one of the two branched first drain wirings D1 and one of the two branched second drain wirings D2 will be referred to as a first finger DF1, and the other of the two branched first drain wirings D1 and the other of the two branched second drain wirings D2 will be referred to as a second finger DF2.

[0080] As described above, in the region V of this embodiment, there are two discharge heaters 202 and one sub-heater 203. A first drain wiring D1 extends from each of the two discharge heaters 202, and a second drain wiring D2 extends from the one sub-heater 203. That is, in the region V of this embodiment, there are two first drain wirings D1 and one second drain wiring D2.

[0081] Furthermore, two first drain wirings D1 and one second drain wiring D2 are branched into finger shapes, so that in the driver row 205a of this embodiment, three first fingers DF1 and three second fingers DF2 are alternately arranged along the first direction (Y direction).

[0082] Of the three first fingers DF1, two first fingers DF1 connected to the ejection heater 202 function as electrodes of the first drain wiring D1 in the first driver 205. Of the three first fingers DF1, one first finger DF1 connected to the sub-heater 203 functions as an electrode of the second drain wiring D2 in the second driver 206. That is, a total of six fingers arranged along the first direction (Y direction) function as electrodes on the drain side.

[0083] In this embodiment, one source electrode S is provided that is common to the first driver 205 and the second driver 206. The source electrode S branches into seven fingers, and each of these seven fingers intertwines in a comb-like manner with each of the six fingers that function as drain-side electrodes.

[0084] As a result, fingers that function as source-side electrodes and fingers that function as drain-side electrodes are alternately arranged along the first direction (Y direction). By efficiently arranging the source-side electrodes and the drain-side electrodes in this manner, the size (width) of the driver row 205a in the second direction can be slimmed down.

[0085] In this embodiment, the gates G are separated into elements for each of the two types of drivers. The gates G are arranged in a hook shape so as to fill the gap between the drain electrode and the source electrode of each driver. When the substrate 119 is viewed from above, there are regions where the gates G and the source electrode S, and the gates G and the first finger DF1 or the second finger DF2 overlap, but these are electrically insulated by an interlayer insulating film. As described above, in this embodiment, the tip of each of the multiple gates G is connected to each of the multiple AND circuits.

[0086] Fig. 6 is a schematic cross-sectional view taken along line VI-VI in Fig. 5. Fig. 6 illustrates the cross section of second driver 206 to explain the flow of electricity, but the way electricity flows in first driver 205 (not shown in Fig. 6) is similar to the way electricity flows in second driver 206.

[0087] 6, the silicon substrate 401 includes p-type base regions 601 and n-type well layers 602, which are alternately arranged along a first direction (Y direction). The base regions 601 include n-type source regions 603. The well layers 602 include n-type drain regions 604. A gate oxide film 605 is stacked on the base regions 601 and the well layers 602. Contact portions 606 are arranged to penetrate the gate oxide film 605, connecting the source regions 603 and source electrodes S, the drain regions 604 and second fingers DF2, and the drain regions 604 and first fingers DF1.

[0088] The source electrode S and drain electrode D of the driver region are electrically connected to the source region 603 and drain region 604 in the underlying silicon substrate 401, respectively, via contact portions 606. With this configuration, when a predetermined voltage is applied to the gate G, the driver is turned on, and the p-type base region 601 below each gate G becomes a channel, allowing a drain current to flow between the source and drain.

[0089] As described above, in the element substrate of this embodiment, a second driver is incorporated into a driver row in which a plurality of first drivers are arranged, and one driver row consisting of the first driver and the second driver is formed. That is, in this embodiment, a driver row consisting only of a plurality of first drivers and a driver row consisting only of a plurality of second drivers are arranged on the same row. In this way, in this embodiment, two types of drivers are arranged in the space where one driver row would be arranged, making it possible to make the device smaller than conventional technology.

[0090] Therefore, the element substrate of this embodiment can prevent the size from increasing.

[0091] Furthermore, in the element substrate of this embodiment, a supply port is disposed between the area where the ejection heater and sub-heater are disposed and the area where the first driver and second driver are disposed, thereby mitigating the effect of heat generated by the ejection heater and sub-heater on the drivers and enabling stable ejection of liquid.

[0092] [Second embodiment] The present embodiment aims to provide an element substrate that can be further miniaturized in the short side direction. Note that the same reference numerals are used to designate the same or corresponding components as those in the first embodiment, and the description will be omitted, with the differences being mainly described.

[0093] FIG. 7 is a schematic plan view perspective view showing an example of a second substrate 700 that can be applied to this embodiment.

[0094] 7, in a plan view of the second substrate 700, the driver row 205a, the GNDH wiring 207, and the VH wiring 201 are arranged to overlap in the Z direction. In this embodiment, the GNDH wiring 207 and the VH wiring 201 are arranged to overlap on top of the driver row 205a in this manner. Therefore, in this embodiment, the substrate 119 takes up less space than in the first embodiment.

[0095] FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG.

[0096] 8, an intermediate layer 403 is laminated on a silicon substrate 401. The intermediate layer 403 is provided with a sub-heater 203, a second driver 206, a through-hole 404, an AND circuit region 405, and a data signal line region 406.

[0097] An intermediate layer 801 including a GNDH wiring 207 is laminated on the intermediate layer 403. The second driver 206 provided in the intermediate layer 403 and the GNDH wiring 207 provided in the intermediate layer 801 are connected via a through hole 404 provided in the intermediate layer 403. An upper layer 402 including a discharge heater 202 and a VH wiring 201 is laminated on the intermediate layer 801.

[0098] In this manner, in the present embodiment, the driver array, the GNDH wiring 207, and the VH wiring 201 are arranged so as to overlap along the third direction (Z direction) when viewing the cross section of the second substrate 700. This makes it possible to reduce the space required to arrange the GNDH wiring 207 and the VH wiring 201 side by side along a planar direction (for example, the X direction) compared to the first embodiment. That is, according to the arrangement of the driver array, the GNDH wiring 207, and the VH wiring 201 of the present embodiment, the space required to arrange them can be further reduced compared to the first embodiment.

[0099] Therefore, the second substrate 700 can be made smaller in size in the short side direction (X direction) than the first embodiment.

[0100] In this embodiment, the VH wiring 201 is arranged above the GNDH wiring 207, but the GNDH wiring 207 may be arranged above the VH wiring 201. Even with this configuration, the size in the short side direction (X direction) can be made smaller than that of the first embodiment.

[0101] [Third embodiment] The present embodiment aims to provide an element substrate capable of adjusting the temperature distribution with higher precision. Note that the same reference numerals are used to designate the same or corresponding components as those in the first and second embodiments, and the description will be omitted, with the differences being mainly described.

[0102] FIG. 9 is a schematic plan view showing an example of a third substrate 900 that can be applied to this embodiment.

[0103] 9, one ejection heater 202 is provided for one sub-heater 203 on the third substrate 900. In the driver array 205a on the third substrate 900, one first driver 205 and one second driver 206 are alternately arranged along the first direction (Y direction). In the logic circuit array of this embodiment, the first logic circuit 301 (see FIG. 3) and the second logic circuit 302 (see FIG. 3) are also alternately arranged along the first direction (Y direction).

[0104] Therefore, the element substrate of this embodiment can adjust the temperature distribution with higher precision than the first embodiment.

[0105] [Fourth embodiment] The present embodiment aims to adjust the temperature distribution at the end of the element substrate with higher precision. Note that the same reference numerals are used for the same or corresponding configurations as those in the first, second, and third embodiments, and the description will be omitted, with the differences being mainly described.

[0106] FIG. 10 is a schematic plan view showing an example of a fourth substrate 1000 that can be applied to this embodiment.

[0107] 10, the sub-heaters 203 and second drivers 206 are arranged more sparsely than in the first embodiment in the central portion of the fourth substrate 1000. On the other hand, the sub-heaters 203 and second drivers 206 are arranged more densely at the edge of the fourth substrate 1000 than in the central portion of the fourth substrate 1000.

[0108] Generally, the edges of an element substrate are more susceptible to external temperature changes than the center. In contrast, by arranging the sub-heaters 203 and the first drivers 205 more densely from the center to the edges, as in the fourth substrate 1000, it becomes possible to more accurately correct temperature changes at the edges of the element substrate.

[0109] In the driver array 205a of this embodiment, the ratio of the number of ejection heaters 202 to one sub-heater 203 in the central portion differs from the ratio of the number of ejection heaters 202 to one sub-heater 203 at the end portions. Even when the ratio of the number of ejection heaters 202 to one sub-heater 203 varies in this manner within one driver array 205a, it is possible to connect the ejection heater 202 to the first driver 205, and the sub-heater 203 to the second driver 206. In this case, for example, by thinning and arranging the wiring on the drain side, it is possible to easily connect the ejection heater 202 to the first driver 205, and the sub-heater 203 to the second driver 206.

[0110] Therefore, the element substrate of this embodiment can adjust the temperature distribution at the end portion with higher precision than the first embodiment.

[0111] [Other embodiments] In the first, second, third and fourth embodiments, heaters are used as energy generating elements, but it is possible to use various elements such as piezoelectric elements.

[0112] The present disclosure includes the following configurations.

[0113] [Configuration 1] a plurality of energy generating elements that generate energy for ejecting liquid; a plurality of heating elements for adjusting the temperature of the liquid; a first driver for driving each of the plurality of energy generating elements; a second driver for driving each of the plurality of heat generating elements; Equipped with the plurality of energy generating elements, the plurality of heat generating elements, the first driver, and the second driver are arranged along a first direction; a driver row is formed in which the first driver and the second driver are arranged along the first direction; An element substrate comprising:

[0114] [Configuration 2] In the driver row, the second drivers are periodically arranged in the first direction. The element substrate according to configuration 1.

[0115] [Configuration 3] In the driver row, the second driver is arranged following a plurality of consecutive first drivers. 3. The element substrate according to claim 2.

[0116] [Configuration 4] In the driver row, the first drivers and the second drivers are arranged alternately. 3. The element substrate according to claim 2.

[0117] [Configuration 5] an interval between each of the drivers in the driver row is smaller than an interval between each of the energy generating elements in an energy generating element row consisting of a plurality of the energy generating elements; 5. The element substrate according to any one of the first to fourth aspects.

[0118] [Configuration 6] an energy generating element array consisting of a plurality of the energy generating elements and a heat generating element array consisting of a plurality of the heat generating elements are arranged along a second direction intersecting the first direction; 6. The element substrate according to any one of the first to fifth aspects.

[0119] [Configuration 7] a plurality of supply ports for supplying liquid, the supply ports being arranged along the first direction so as to correspond to the plurality of energy generating elements, respectively; 7. The element substrate according to configuration 6.

[0120] [Configuration 8] a supply port array consisting of a plurality of the supply ports is disposed at a position shifted in the second direction with respect to the energy generating element array; 8. The element substrate according to configuration 7.

[0121] [Configuration 9] the heat generating element array is provided between the energy generating element array and the supply port array in the second direction; The element substrate according to configuration 8.

[0122] [Configuration 10] the heating elements are arranged more densely at the ends of the heating element array consisting of the plurality of heating elements than at the center of the heating element array; 10. The element substrate according to any one of the first to ninth aspects.

[0123] [Configuration 11] each of the first driver and the second driver includes an insulated gate field effect transistor; a common source-side wiring is connected to drain-side wiring of the first driver and the second driver; 11. The element substrate according to any one of the first to tenth embodiments.

[0124] [Configuration 12] a plurality of first logic circuits arranged along the first direction for selecting the first drivers; a plurality of second logic circuits arranged along the first direction for selecting the second drivers; Equipped with the first logic circuit and the second logic circuit are arranged along the first direction to form a logic circuit row; 12. The element substrate according to any one of the first to eleventh aspects.

[0125] [Configuration 13] In the logic circuit array, the second logic circuits are periodically arranged in the first direction. 13. The element substrate according to claim 12.

[0126] [Configuration 14] In the logic circuit string, the second logic circuit is arranged following a plurality of consecutive first logic circuits. 14. The element substrate according to claim 13.

[0127] [Configuration 15] In the logic circuit array, the first logic circuits and the second logic circuits are arranged alternately. 14. The element substrate according to claim 13.

[0128] [Configuration 16] each of the first logic circuit and the second logic circuit is an AND circuit; 16. The element substrate according to any one of configurations 12 to 15.

[0129] [Configuration 17] The power supply wiring of the heat generating element is common to the power supply wiring of the energy generating element. 17. The element substrate according to any one of the first to sixth aspects.

[0130] [Configuration 18] The ground wiring of the heat generating element is common to the ground wiring of the energy generating element. 18. The element substrate according to any one of configurations 1 to 17.

[0131] [Configuration 19] the element substrate includes a plurality of layers stacked along a direction perpendicular to a surface of the element substrate, the second driver is arranged on a layer different from a layer on which a power supply wiring or a ground wiring of the heat generating element is arranged, and is arranged so as to overlap with the power supply wiring or the ground wiring in a direction perpendicular to the surface of the element substrate. 19. The element substrate according to any one of configurations 1 to 18.

[0132] [Configuration 20] the second driver, the ground wiring, and the power supply wiring are arranged so as to overlap each other in a direction perpendicular to the surface of the element substrate; 20. The element substrate according to claim 19.

[0133] [Configuration 21] the energy generating element is a heater; 21. The element substrate according to any one of configurations 1 to 20.

[0134] [Configuration 22] The energy generating element is a piezoelectric element. 21. The element substrate according to any one of configurations 1 to 20.

[0135] [Configuration 23] An element substrate according to any one of configurations 1 to 22, A recording head characterized by:

[0136] [Configuration 24] a recording head according to configuration 23; a tank for storing a liquid to be ejected by the recording head; A cartridge comprising:

[0137] [Configuration 25] 25. The cartridge of claim 24, a means for scanning the cartridge in a scanning direction; a means for transporting paper in a direction intersecting the scanning direction, A recording apparatus for recording an image on the paper.

Claims

1. a plurality of energy generating elements that generate energy for ejecting liquid; a plurality of heating elements for adjusting the temperature of the liquid; a first driver for driving each of the plurality of energy generating elements; a second driver for driving each of the plurality of heat generating elements; Equipped with the plurality of energy generating elements, the plurality of heat generating elements, the first driver, and the second driver are arranged along a first direction; a driver row is formed in which the first driver and the second driver are arranged along the first direction; An element substrate comprising:

2. In the driver row, the second drivers are periodically arranged in the first direction. The element substrate according to claim 1 .

3. In the driver row, the second driver is arranged following a plurality of consecutive first drivers. The element substrate according to claim 2 .

4. In the driver row, the first drivers and the second drivers are arranged alternately. The element substrate according to claim 2 .

5. an interval between each of the drivers in the driver row is smaller than an interval between each of the energy generating elements in an energy generating element row consisting of a plurality of the energy generating elements; The element substrate according to claim 1 or 2.

6. an energy generating element array consisting of a plurality of the energy generating elements and a heat generating element array consisting of a plurality of the heat generating elements are arranged along a second direction intersecting the first direction; The element substrate according to claim 1 or 2.

7. a plurality of supply ports for supplying liquid, the supply ports being arranged along the first direction so as to correspond to the plurality of energy generating elements, respectively; The element substrate according to claim 6 .

8. a supply port array including a plurality of the supply ports is disposed at a position shifted in the second direction with respect to the energy generating element array; The element substrate according to claim 7 .

9. the heating element array is provided between the energy generating element array and the supply port array in the second direction; The element substrate according to claim 8 .

10. the heating elements are arranged more densely at the ends of the heating element array consisting of the plurality of heating elements than at the center of the heating element array; 3. The element substrate according to claim 1 or 2.

11. each of the first driver and the second driver includes an insulated gate field effect transistor; a common source-side wiring is connected to drain-side wirings of the first driver and the second driver; The element substrate according to claim 1 or 2.

12. a plurality of first logic circuits arranged along the first direction for selecting the first drivers; a plurality of second logic circuits arranged along the first direction for selecting the second drivers; Equipped with the first logic circuit and the second logic circuit are arranged along the first direction to form a logic circuit row; The element substrate according to claim 1 or 2.

13. In the logic circuit array, the second logic circuits are periodically arranged in the first direction. The element substrate according to claim 12 .

14. In the logic circuit string, the second logic circuit is arranged following a plurality of consecutive first logic circuits. The element substrate according to claim 13 .

15. In the logic circuit array, the first logic circuits and the second logic circuits are arranged alternately. The element substrate according to claim 13 .

16. each of the first logic circuit and the second logic circuit is an AND circuit; The element substrate according to claim 12 .

17. The power supply wiring of the heat generating element is common to the power supply wiring of the energy generating element. The element substrate according to claim 1 or 2.

18. The ground wiring of the heat generating element is common to the ground wiring of the energy generating element. The element substrate according to claim 1 or 2.

19. the element substrate includes a plurality of layers stacked along a direction perpendicular to a surface of the element substrate, the second driver is arranged on a layer different from a layer on which a power supply wiring or a ground wiring of the heat generating element is arranged, and is arranged so as to overlap with the power supply wiring or the ground wiring in a direction perpendicular to the surface of the element substrate. The element substrate according to claim 1 or 2.

20. the second driver, the ground wiring, and the power supply wiring are arranged so as to overlap each other in a direction perpendicular to the surface of the element substrate; 20. The device substrate according to claim 19.

21. the energy generating element is a heater; The element substrate according to claim 1 or 2.

22. The energy generating element is a piezoelectric element. The element substrate according to claim 1 or 2.

23. An element substrate according to claim 1, A recording head characterized by:

24. The recording head according to claim 23; a tank for storing a liquid to be ejected by the recording head; A cartridge comprising:

25. A cartridge according to claim 24; a means for scanning the cartridge in a scanning direction; a means for transporting paper in a direction intersecting the scanning direction, A recording apparatus for recording an image on the paper.

Images