Composition, additive for resin, and resin foam

A compound with a specific structure is added to resin foams to address the increase in thermal conductivity over time, ensuring sustained insulation performance without additional manufacturing complexity.

JP2025129054APending Publication Date: 2025-09-03TOSOH CORP +1
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Patent Information

Application Number
JP2025025958
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-02-22
Filing Date
2025-02-20
Publication Date
2025-09-03

AI Technical Summary

Technical Problem

Resin foams, such as polyurethane foams, experience an increase in thermal conductivity over time, leading to a decrease in thermal insulation performance, and existing methods to mitigate this issue are complex and costly.

Method used

A composition containing a compound with a specific structure, represented by formula (1), is added to the resin to suppress the increase in thermal conductivity, which can be incorporated into resin foams to maintain low thermal conductivity over time.

Benefits of technology

The compound effectively reduces the increase in thermal conductivity of resin foams, maintaining their insulation performance without complicating the manufacturing process.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide an additive capable of suppressing an increase in thermal conductivity of a resin foam over time.SOLUTION: The additive for resin contains a compound having a group represented by the following formula (1) [where R1 and R2 each independently represent a hydrogen atom or an organic group and * represents a bond, provided that at least one of R1 and R2 contains an alkyl group or an alkylene group in which at least one hydrogen atom is substituted with a halogen atom].SELECTED DRAWING: None
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Citation Information

Patent Citations

  • Method for producing polyurethane foam with closed cell

    JP2002302528A