Transfer device and component mounting machine

Abstract

To provide a transfer device capable of accurately determining the film thickness of a transfer material within a reservoir, and a component mounting machine including the same.SOLUTION: A transfer device 24 includes a reservoir 241 including a bottom portion 2411 and a peripheral wall portion 2412, a blade member 242 including a blade 2421 that spreads the transfer material in a film-like state relative to a bottom surface 2411S of the bottom portion 2411, a measurement unit 244, and a processing unit 245. The measurement unit 244 measures a wall top height HW, which indicates the height of the top surface of the peripheral wall portion 2412, and measures a blade top height HB, which indicates the height of the top surface of the blade 2421. The processing unit 245 calculates a clearance CL, which indicates the gap between the bottom surface 2411S and the blade 2421, on the basis of the wall top height HW and the blade top height HB.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a transfer device that transfers a transfer material to an electronic component, and a component mounter that includes the same. [Background technology]

[0002] A component mounter for mounting electronic components on a substrate such as a printed circuit board to produce a mounted board includes a transfer device that transfers a transfer material such as flux to electrodes of the electronic component. The transfer device includes a storage tank that stores the transfer material and a blade that spreads the transfer material in the storage tank into a film. In the transfer device, the electronic component is immersed in the film-like transfer material in the storage tank while abutting the bottom surface of the storage tank. As a result, a layer of the transfer material is formed on the surface of the electronic component up to a height corresponding to the film thickness of the transfer material in the storage tank.

[0003] In order to properly adjust the amount of transfer material layer formed on the surface of an electronic component, it is necessary to accurately determine the film thickness of the transfer material in the storage tank. For example, Patent Document 1 discloses a technology in which a height measurement sensor attached to the mounting head of a component mounter measures the height of the bottom surface of the storage tank and the height of the liquid surface of the transfer material, and calculates the film thickness of the transfer material in the storage tank based on the difference between these heights. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-78581 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when a transparent transfer material is used, it is difficult to accurately measure the height of the bottom surface of the storage tank and the height of the liquid surface of the transfer material, which makes it difficult to accurately determine the film thickness of the transfer material in the storage tank.

[0006] An object of the present invention is to provide a transfer device that can accurately determine the film thickness of a transfer material in a storage tank, and a component mounter equipped with the same. [Means for solving the problem]

[0007] A transfer device according to one aspect of the present invention comprises a storage tank formed in a bottomed cylindrical shape capable of storing a transfer material to be transferred to an electronic component, the storage tank including a bottom surface portion having a bottom surface against which the electronic component abuts, and a peripheral wall portion protruding upward from the peripheral edge of the bottom surface portion; a blade that spreads the transfer material in the storage tank into a film-like shape against the bottom surface; and a blade attachment portion to which the blade is attached, the storage tank including a blade member arranged above the storage tank; a measurement unit arranged above the storage tank and the blade member that measures a peripheral wall top surface height indicating the height of the top surface of the peripheral wall portion and a blade top surface height indicating the height of the top surface of the blade or the blade attachment portion; and a processing unit that performs processing to calculate a clearance indicating the gap between the bottom surface and the blade based on the peripheral wall top surface height and the blade top surface height.

[0008] According to this transfer device, the processing unit can determine the height position of the bottom surface of the bottom portion based on the peripheral wall upper surface height measured by the measurement unit, regardless of whether or not a transfer material is present in the storage tank, and can determine the height position of the lower edge of the blade based on the blade upper surface height measured by the measurement unit. This allows the processing unit to accurately calculate the clearance, which indicates the gap between the bottom surface of the bottom portion and the lower edge of the blade, regardless of whether or not a transfer material is present in the storage tank. Therefore, the processing unit can accurately determine the film thickness of the transfer material spread by the blade onto the bottom surface of the bottom portion based on the clearance.

[0009] In the transfer device, the blade has a shape extending in a predetermined longitudinal direction relative to the bottom surface, and the processing unit calculates the clearance corresponding to each of a plurality of points in the longitudinal direction of the blade, and outputs clearance information indicating the calculation results, including information on the maximum value, minimum value, and median or average value of the clearance.

[0010] In this aspect, the inclination of the blade relative to the bottom surface of the bottom portion and the height position of the blade relative to the bottom surface can be recognized based on the maximum, minimum, and median or average clearance values ​​contained in the clearance information output by the processing unit.

[0011] In the above-described transfer device, the blade mounting portion has a plurality of elongated holes extending in the vertical direction, and the blade is mounted by screw members inserted into the plurality of elongated holes so that the inclination of the blade relative to the bottom surface can be adjusted based on the clearance information.

[0012] In this aspect, the inclination of the blade relative to the bottom surface can be adjusted based on the clearance information by adjusting the attachment posture of the blade using screws inserted through multiple elongated holes formed in the blade attachment portion. In this case, by adjusting the attachment posture of the blade relative to the blade attachment portion so that the difference between the maximum and minimum clearance values ​​included in the clearance information falls within a predetermined tolerance range, the inclination of the blade can be adjusted so that the lower edge of the blade is approximately parallel to the bottom surface. This makes it possible to make the clearance between the bottom surface of the bottom portion and the lower edge of the blade as constant as possible over the entire length of the blade. Therefore, the film thickness of the transfer material spread by the blade in a film form on the bottom surface of the bottom portion can be made as uniform as possible over the entire length of the blade.

[0013] The transfer device further includes a blade moving mechanism that moves the blade member in the up and down direction so as to adjust the height position of the blade relative to the bottom surface based on the clearance information.

[0014] In this aspect, the height position of the blade relative to the bottom surface can be adjusted based on the clearance information in response to the vertical movement of the blade member by the blade movement mechanism. In this case, the height position of the blade relative to the bottom surface can be adjusted in response to the vertical movement of the blade member by the blade movement mechanism so that the median or average clearance matches the target film thickness of the transfer material, while the difference between the maximum and minimum clearance values ​​included in the clearance information is within a predetermined tolerance range. This allows the clearance between the bottom surface of the bottom portion and the lower edge of the blade to match the target film thickness of the transfer material.

[0015] In the transfer device, the measurement unit repeatedly measures the height of the upper surface of the blade each time the blade member is moved by the blade moving mechanism during a predetermined period, and the processing unit calculates the clearance each time the measurement unit repeatedly measures the height of the upper surface of the blade during the predetermined period, and outputs the clearance information indicating the calculation result.

[0016] In this aspect, the measurement unit repeatedly measures the height of the blade upper surface each time the blade member is moved by the blade movement mechanism, and the processing unit calculates the clearance accordingly and outputs clearance information. For example, under circumstances in which the amount of transfer material in the storage tank changes as the transfer material is transferred to the electronic component, the storage tank is repeatedly replenished with transfer material and the blade member is moved up and down by the blade movement mechanism in order to maintain the film thickness of the transfer material at a predetermined target value. Even under such circumstances in which the amount of transfer material in the storage tank changes dynamically, the clearance can be accurately calculated each time the blade member is moved by the blade movement mechanism, and the film thickness of the transfer material can be accurately determined based on the clearance.

[0017] In the above-described transfer device, when the number of times the measurement of the blade upper surface height by the measurement unit is repeated exceeds a predetermined reference number, the processing unit outputs notification information to notify that fact.

[0018] In this aspect, the operator can confirm, based on the notification information output from the processing unit, that the number of times the measurement of the blade upper surface height by the measurement unit has been repeated has exceeded a predetermined reference number.

[0019] In the transfer device, the measurement unit periodically measures the peripheral wall upper surface height and the blade upper surface height, and the processing unit calculates the clearance each time the measurement unit periodically performs measurement, and outputs the clearance information indicating the calculation result.

[0020] In this embodiment, the measurement unit periodically measures the height of the upper surface of the peripheral wall and the height of the upper surface of the blade, and the processing unit accordingly calculates the clearance and outputs the clearance information. This allows the clearance to be periodically calculated with high accuracy, and the film thickness of the transfer material to be determined with high accuracy based on the clearance.

[0021] In the above-described transfer device, the processing unit performs processing to control the movement of the blade member by the blade movement mechanism so that the median or average value of the clearance included in the clearance information falls within a predetermined target range.

[0022] In this aspect, the processing unit can automatically adjust the clearance by controlling the movement of the blade member by the blade movement mechanism, thereby automatically adjusting the film thickness of the transfer material based on the clearance.

[0023] According to another aspect of the present invention, a component mounter includes a head unit that is movable in the vertical direction and includes a mounting head that holds an electronic component and mounts the electronic component on a substrate, a control unit that controls the vertical movement of the mounting head, and the transfer device described above that transfers a transfer material to the electronic component held by the mounting head. When the control unit transfers the transfer material to the electronic component held by the mounting head in the transfer device, the control unit moves the mounting head so that the electronic component abuts against the bottom surface of the bottom part. The measurement unit is attached to the head unit and is capable of measuring a substrate top surface height that indicates the height of the top surface of the substrate.

[0024] According to this component mounting machine, the peripheral wall top surface height and blade top surface height in the transfer device can be measured using a measurement unit that is attached to a head unit including a mounting head and is used to measure the substrate top surface height.

[0025] In the above-mentioned component mounting machine, the transfer device is installed so that, in the vertical direction, the upper surface of the peripheral wall portion and the upper surface of the blade or the blade mounting portion are positioned within the measurement range of the measurement unit when measuring the height of the upper surface of the substrate.

[0026] In this aspect, the measurement unit can accurately measure the height of the upper surface of the substrate, the height of the upper surface of the peripheral wall, and the height of the upper surface of the blade.

[0027] In the component mounter, the control unit moves the mounting head so that the electronic component abuts against the bottom surface of the bottom portion, based on the peripheral wall upper surface height measured by the measurement unit.

[0028] In this aspect, when the transfer material is transferred to the electronic component held by the mounting head in the transfer device, the control unit moves the mounting head up and down based on the peripheral wall upper surface height measured by the measurement unit. In this case, the height position of the bottom surface of the bottom portion can be determined from the peripheral wall upper surface height measured by the measurement unit, and by moving the mounting head up and down based on this, the electronic component can be abutted against the bottom surface without applying excessive load to the electronic component. [Effects of the Invention]

[0029] As described above, according to the present invention, it is possible to provide a transfer device that can accurately determine the film thickness of a transfer material in a storage tank, and a component mounter equipped with the same. [Brief explanation of the drawings]

[0030] [Figure 1] 1 is a block diagram of a component mounter to which a transfer device according to an embodiment of the present invention is applied; [Figure 2] FIG. 2 is a plan view showing the configuration of a mounter main body in the component mounter. [Figure 3] FIG. 2 is a plan view showing the configuration of a transfer device. [Figure 4] FIG. 2 is a partial cross-sectional view showing a main part of a transfer device. [Figure 5] 4 is a flowchart showing a flow of processing by each part of the transfer device. DETAILED DESCRIPTION OF THE INVENTION

[0031] A transfer device and a component mounter including the same according to an embodiment of the present invention will be described below with reference to the drawings. Note that directional relationships will be described below using XY Cartesian coordinates that are orthogonal to each other on a horizontal plane.

[0032] [Overall configuration of component mounter] The component mounter 1 shown in FIGS. 1 and 2 is a device that mounts electronic components on a substrate PP such as a printed circuit board to produce a mounted substrate. Examples of electronic components include chip components with electrodes provided at both ends of the component body, as well as various types of components such as SOPs (Small Outline Packages), QFPs (Quad Flat Packages), PLCCs (Plastic Leaded Chip Carriers), and BGAs (Ball Grid Arrays). An SOP is a component with multiple electrodes arranged at both ends of the component body in the X-axis direction. A QFP and a PLCC are components with multiple electrodes arranged at both ends of the component body in the X-axis direction and multiple electrodes arranged at both ends of the component body in the Y-axis direction. A BGA is a component with multiple ball-shaped electrodes provided on the underside of the component body.

[0033] The component mounter 1 includes a mounter main body 2 including a transfer device 24, and a control unit 3.

[0034] The mounting machine main body 2 constitutes a structural portion that performs component mounting operations such as mounting electronic components onto the substrate PP during the production of mounted substrates. A solder paste pattern is printed on the substrate PP before the mounting machine main body 2 mounts the electronic components. In other words, the mounting machine main body 2 mounts the electronic components onto the substrate PP on which the solder paste pattern has been printed. The mounting machine main body 2 includes a main body frame 21, a substrate transport unit 22, a component supply unit 23, a transfer device 24, a head unit 25, and a substrate support unit 28.

[0035] The main body frame 21 is a structure in which the various components of the mounting machine main body 2 are arranged, and is formed in a substantially rectangular shape in a plan view seen from above and below in a direction perpendicular to both the X-axis direction and the Y-axis direction. The board transport unit 22 is formed by a conveyor, and is arranged on the main body frame 21 so as to extend in the X-axis direction. The board transport unit 22 transports the board PP in the X-axis direction. The board PP transported by the board transport unit 22 is positioned by the board support unit 28 at a predetermined work position (a component mounting position where components are mounted on the board PP). The board support unit 28 positions the board PP at the component mounting position by supporting the board PP from below.

[0036] The component supply units 23 are disposed in respective regions at both ends of the main frame 21 in the Y-axis direction. The component supply unit 23 is not particularly limited in its component supply method as long as it is configured to be able to supply electronic components. For example, the component supply unit 23 may be a tape feeder that supplies electronic components using tape as a carrier, a tray feeder that supplies electronic components by moving a pallet including trays on which electronic components are placed, or a stick feeder that supplies electronic components stored in cylindrical sticks by pushing them out of the sticks.

[0037] The head unit 25 is held by a moving frame 27. A fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotated by a Y-axis servo motor 263 are arranged on the main body frame 21. The moving frame 27 is placed on the fixed rail 261, and a nut portion 271 provided on the moving frame 27 is threadedly engaged with the ball screw shaft 262. The moving frame 27 also has a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servo motor 274. The head unit 25 is movably held by the guide member 272, and a nut portion provided on the head unit 25 is threadedly engaged with the ball screw shaft 273. The moving frame 27 moves in the Y-axis direction due to operation of the Y-axis servo motor 263, and the head unit 25 moves in the X-axis direction relative to the moving frame 27 due to operation of the X-axis servo motor 274. That is, head unit 25 is movable in the Y-axis direction in conjunction with the movement of movable frame 27, and is also movable in the X-axis direction along movable frame 27. Head unit 25 is movable between component supply unit 23 and substrate PP supported by substrate support unit 28 via transfer device 24.

[0038] The head unit 25 is equipped with a plurality of mounting heads 251. Each mounting head 251 is provided so as to be movable in the vertical direction. Each mounting head 251 has a suction nozzle attached to its tip (lower end). Each mounting head 251 sucks and holds an electronic component supplied by the component supply unit 23 with the suction nozzle. The head unit 25 moves to the transfer device 24 while holding an electronic component P (FIG. 4) supplied by the component supply unit 23 with each mounting head 251, and then performs a component mounting process to mount the electronic component P on the board PP at a predetermined component mounting position.

[0039] 2, a board recognition camera 252 and a measurement unit 244 are attached to the head unit 25. The board recognition camera 252 is a camera equipped with an imaging element such as a CMOS (Complementary Metal-Oxide-Semiconductor) or a CCD (Charged-Coupled Device). The board recognition camera 252 captures images of the marks from above in order to recognize the various marks affixed to the top surface of the board PP transported to the component mounting position by the board transport unit 22. The amount of positional deviation of the board PP from the origin coordinates is detected by the recognition of the marks on the board PP by the board recognition camera 252.

[0040] The measurement unit 244 is a diffuse reflection type laser displacement sensor that irradiates a measurement object with laser light and measures the height of the measurement object by receiving diffusely reflected light from the measurement object. The measurement unit 244 measures the substrate upper surface height HP (FIG. 4) indicating the height of the upper surface of the substrate PP when the head unit 25 is positioned above the substrate PP that has been transported to the component mounting position by the substrate transport unit 22. The measurement unit 244 also measures the height of key parts of the transfer device 24 when the head unit 25 is positioned above the transfer device 24, as will be described in detail later.

[0041] 2, a component recognition camera 29 is disposed on the main body frame 21. The component recognition camera 29 is a camera that captures images of the electronic components P held by the mounting head 251 of the head unit 25 from below. Based on the captured image by the component recognition camera 29, the position and orientation of the electronic components P relative to the mounting head 251 are recognized.

[0042] The control unit 3 is realized by a processor that operates by loading a predetermined program. As shown in Fig. 1, the control unit 3 controls the operation of each unit of the mounter main body 2, as well as the display operation of the display unit 2D that displays various information in the component mounter 1. The control unit 3 functionally includes a board transport control unit 31, a component supply control unit 32, and a head control unit 33.

[0043] The board transport control unit 31 controls the transport operation of the board PP by the board transport unit 22. The component supply control unit 32 controls the supply operation of the electronic components P by the component supply unit 23. The head control unit 33 controls the movement of the head unit 25, and also controls the vertical movement of the mounting head 251. In this way, the head control unit 33 causes the mounting head 251 to perform a component mounting operation to mount the electronic components P held by the mounting head 251 onto the board PP, corresponding to each of a plurality of target mounting positions set on the board PP.

[0044] [About the transfer device] The transfer device 24 included in the mounting machine main body 2 will be described in detail with reference to FIGS. 3 and 4. The transfer device 24 is a device that transfers a transfer material TM onto the surface of an electrode P1 of an electronic component P held by the mounting head 251 of the head unit 25, thereby forming a transfer material layer on the surface of the electrode P1. The transfer material TM is a transparent liquid such as a flux having flowability. The transfer material TM is broadly classified into two types: rosin-based flux and water-soluble flux. The transfer material TM has the function of removing oxide films and dirt from the surface of the electrode P1 and the function of improving the wettability of solder to the surface of the electrode P1.

[0045] If the amount of transfer material layer formed on the electrode P1 of the electronic component P is too small, the effect of improving the solder wettability on the surface of the electrode P1 may be insufficient, resulting in problems such as an insufficient solder bond. On the other hand, if the amount of transfer material layer formed on the electrode P1 is too large, the solder may spread excessively, causing problems such as the gap between the component body and the substrate PP becoming too narrow. For this reason, an appropriate range of the amount of transfer material layer formed on the electrode P1 is set for each type of electronic component P. For example, for an electronic component P configured as a BGA, the appropriate amount of transfer material layer is considered to be formed up to a height position approximately 50 to 70% of the electrode height from the underside of the component body to the lower end of the ball-shaped electrode P1.

[0046] The transfer device 24 includes a reservoir 241 , a blade member 242 , a blade moving mechanism 243 , a measurement unit 244 attached to the head unit 25 , and a processing unit 245 .

[0047] The storage tank 241 is formed in a cylindrical shape with a bottom capable of storing the transfer material TM to be transferred to the electrodes P1 of the electronic component P, and includes a bottom surface portion 2411 having a bottom surface 2411S against which the electrodes P1 of the electronic component P abut, and a peripheral wall portion 2412 protruding upward from the peripheral edge of the bottom surface portion 2411. The bottom surface 2411S of the bottom surface portion 2411 has, for example, a circular shape. When the bottom surface 2411S is circular, the upper surface 2412U of the peripheral wall portion 2412 has an annular shape surrounding the bottom surface 2411S when viewed in the vertical direction. The transfer device 24 is installed on the main body frame 21 so that the bottom surface 2411S is a horizontal plane and the bottom surface 2411S and the upper surface 2412U of the peripheral wall portion 2412 are parallel to each other.

[0048] In the storage tank 241, the length along the vertical direction between the bottom surface 2411S of the bottom surface portion 2411 and the upper surface 2412U of the peripheral wall portion 2412 is set to a predetermined known value. Therefore, it is possible to determine the height of the bottom surface 2411S based on the height of the upper surface 2412U of the peripheral wall portion 2412. The storage tank 241 is rotatable around a shaft portion 2413 that passes through the center of the bottom surface 2411S and extends in the vertical direction.

[0049] The blade member 242 is disposed above the storage tank 241. The blade member 242 includes a blade 2421 that spreads the transfer material TM in the storage tank 241 into a film-like shape on the bottom surface 2411S, and a blade attachment portion 2422 to which the blade 2421 is attached. The blade 2421 spreads the transfer material TM in the storage tank 241 into a film-like shape on the bottom surface 2411S while the storage tank 241 is rotated around the shaft portion 2413. The blade 2421 is a plate having a shape that extends in a predetermined longitudinal direction relative to the bottom surface 2411S. The blade 2421 is attached to the blade attachment portion 2422 so that a lower edge 2421D that extends linearly along the longitudinal direction of the blade 2421 is approximately parallel to the bottom surface 2411S. The blade attachment portion 2422 is a rod-shaped member extending parallel to the bottom surface 2411S, and has a plurality of elongated holes 242H extending in the vertical direction in the attachment region of the blade 2421. The blade 2421 is attached to the blade attachment portion 2422 with screws SC inserted through the plurality of elongated holes 242H so that an upper surface 2421U of the blade 2421 is substantially aligned with an upper surface of the blade attachment portion 2422. The blade 2421 is attached to the blade attachment portion 2422 with screws SC inserted through the plurality of elongated holes 242H so that the inclination of the blade 2421 with respect to the bottom surface 2411S can be adjusted.

[0050] In the blade member 242, the upper surface of the blade attachment portion 2422 and the upper surface 2421U of the blade 2421 are located higher than the upper surface 2412U of the peripheral wall portion 2412, and the lower edge 2421D of the blade 2421 is located between the bottom surface 2411S of the bottom portion 2411 and the upper surface 2412U of the peripheral wall portion 2412. In the blade member 242, the length in the vertical direction between the upper surface of the blade attachment portion 2422 or the upper surface 2421U of the blade 2421 and the lower edge 2421D of the blade 2421 is set to a predetermined known value. Therefore, it is possible to determine the height of the lower edge 2421D of the blade 2421 based on the height of the upper surface of the blade attachment portion 2422 or the upper surface 2421U of the blade 2421.

[0051] In the transfer device 24, a clearance CL indicating the gap between the bottom surface 2411S of the bottom surface portion 2411 and the lower edge 2421D of the blade 2421 in the vertical direction corresponds to the film thickness of the transfer material TM spread by the blade 2421 onto the bottom surface 2411S. When transferring the transfer material TM to an electronic component P held by the mounting head 251 in the transfer device 24, the head control unit 33 of the control unit 3 moves the mounting head 251 in the vertical direction so that the electronic component P abuts against the bottom surface 2411S. As a result, the electronic component P held by the mounting head 251 is immersed in the transfer material TM spread in the film form in the storage tank 241 with the surface on which the electrodes P1 are provided facing downward and the lower end of the electrodes P1 abutting against the bottom surface 2411S. As a result, a transfer material layer is formed on the surface of the electrodes P1 of the electronic component P up to a height position corresponding to the film thickness of the transfer material TM in the storage tank 241.

[0052] The blade movement mechanism 243 is a mechanism that moves the blade member 242 in the vertical direction so as to adjust the height position of the blade 2421 relative to the bottom surface 2411S. The clearance CL can be adjusted in accordance with the adjustment of the height position of the blade 2421 relative to the bottom surface 2411S based on the vertical movement of the blade member 242 by the blade movement mechanism 243. The film thickness of the transfer material TM in the storage tank 241 can be adjusted based on such adjustment of the clearance CL, and therefore the amount of the transfer material layer formed on the surface of the electrode P1 of the electronic component P can be adjusted.

[0053] The structure of the blade moving mechanism 243 is not particularly limited as long as it can move the blade member 242 in the up-down direction. The blade moving mechanism 243 includes, for example, a ball screw shaft 2431 extending in the up-down direction, a nut portion 2432 provided on the blade attachment portion 2422 and threadedly engaged with the ball screw shaft 2431, and a drive motor 2433 that rotates the ball screw shaft 2431. In such a blade moving mechanism 243, when the ball screw shaft 2431 is rotated by the drive motor 2433, the blade attachment portion 2422, which is provided with the nut portion 2432 that threadably engages with the ball screw shaft 2431, moves in the up-down direction along the ball screw shaft 2431. This allows the blade member 242 to move in the up-down direction relative to the bottom surface 2411S.

[0054] The measurement unit 244 is disposed above the storage tank 241 and the blade member 242. As described above, in this embodiment, the measurement unit 244 is attached to the head unit 25. With the head unit 25 disposed above the transfer device 24, the measurement unit 244 measures a peripheral wall upper surface height HW indicating the height of the upper surface 2412U of the peripheral wall portion 2412, and also measures a blade upper surface height HB indicating the height of the upper surface 2421U of the blade attachment portion 2422 or the blade 2421. Note that in this embodiment, the measurement unit 244 measures the height of the upper surface 2421U of the blade 2421 as the blade upper surface height HB.

[0055] In the component mounting machine 1, the peripheral wall top surface height HW and blade top surface height HB in the transfer device 24 can be measured using a measurement unit 244 attached to a head unit 25 including a mounting head 251 and used to measure the substrate top surface height HP.

[0056] Furthermore, in the component mounter 1, the head control unit 33 of the control unit 3 moves the mounting head 251 in the vertical direction based on the peripheral wall upper surface height HW measured by the measuring unit 244 so that the electronic component P abuts against the bottom surface 2411S of the bottom surface portion 2411. That is, when the transfer material TM is transferred in the transfer device 24 to the electronic component P held by the mounting head 251, the head control unit 33 moves the mounting head 251 in the vertical direction based on the peripheral wall upper surface height HW measured by the measuring unit 244. In this case, it is possible to obtain the height position of the bottom surface 2411S of the bottom surface portion 2411 from the peripheral wall upper surface height HW measured by the measuring unit 244, and by moving the mounting head 251 in the vertical direction based on this, the electronic component P can be abutted against the bottom surface 2411S without applying an excessive load to the electronic component P.

[0057] 4, the transfer device 24 is installed so that the upper surface 2412U of the peripheral wall portion 2412 and the upper surface 2421U of the blade 2421 are positioned within the measurement range MR of the measurement unit 244 when measuring the substrate upper surface height HP. Specifically, when the measurement unit 244 measures the substrate upper surface height HP, the head control unit 33 moves the head unit 25 so that the center of the measurement range MR of the measurement unit 244 in the vertical direction is at the height position of the upper surface of the substrate PP. The transfer device 24 is installed so that the intermediate height position between the upper surface 2412U of the peripheral wall portion 2412 and the upper surface 2421U of the blade 2421 is at the height position of the upper surface of the substrate PP. This allows the measurement unit 244 to measure the substrate top surface height HP when the head unit 25 is positioned above the substrate PP transported by the substrate transport unit 22, and to accurately measure the peripheral wall top surface height HW and the blade top surface height HB when the head unit 25 is positioned above the transfer device 24.

[0058] The processing unit 245 is realized by a processor that operates by loading a predetermined program. The processing unit 245 calculates a clearance CL that indicates the gap between the bottom surface 2411S and the lower edge 2421D of the blade 2421 based on the peripheral wall upper surface height HW and the blade upper surface height HB measured by the measurement unit 244. The processing unit 245 can determine the height position of the bottom surface 2411S of the bottom surface portion 2411 based on the peripheral wall upper surface height HW measured by the measurement unit 244, regardless of whether or not a transfer material TM is present in the storage tank 241, and can determine the height position of the lower edge 2421D of the blade 2421 based on the blade upper surface height HB measured by the measurement unit 244. This allows the processing unit 245 to accurately calculate the clearance CL that indicates the gap between the bottom surface 2411S of the bottom surface portion 2411 and the lower edge 2421D of the blade 2421, regardless of whether or not a transfer material TM is present in the storage tank 241. Therefore, the processing unit 245 can accurately determine the film thickness of the transfer material TM spread in a film shape on the bottom surface 2411S of the bottom surface portion 2411 by the blade 2421 based on the clearance CL.

[0059] In this embodiment, the measurement unit 244 measures three or more peripheral wall upper surface heights HW by measuring three or more circumferentially separated points on the upper surface 2412U of the peripheral wall portion 2412. The measurement unit 244 also measures two or more blade upper surface heights HB by measuring two or more longitudinally separated points on the upper surface 2421U of the blade 2421. In this case, the processing unit 245 calculates a virtual bottom surface plane, which is a least-squares plane including the bottom surface 2411S of the bottom surface portion 2411, by the least squares method based on the three or more peripheral wall upper surface heights HW. The processing unit 245 also calculates a virtual blade lower end imaginary line extending along the lower edge 2421D of the blade 2421 based on the two or more blade upper surface heights HB. The processing unit 245 then calculates the vertical distance between the virtual bottom surface plane and the virtual blade lower end imaginary line as the clearance CL.

[0060] In this case, the processing unit 245 calculates the clearance CL corresponding to each of multiple points in the longitudinal direction of the blade 2421, and outputs clearance information J1 including information on the maximum value CL1, minimum value CL2, and median or average value CL3 of the clearance CL indicating the calculation result. The clearance information J1 output by the processing unit 245 may be displayed, for example, on the display unit 2D of the component mounter 1. An operator operating the component mounter 1 can recognize the inclination of the blade 2421 with respect to the bottom surface 2411S of the bottom surface portion 2411 and the height position of the blade 2421 with respect to the bottom surface 2411S, based on the maximum value CL1, minimum value CL2, and median or average value CL3 of the clearance CL included in the clearance information J1 output by the processing unit 245.

[0061] As described above, the blade 2421 is attached to the blade attachment portion 2422 by the screw members SC inserted into the plurality of elongated holes 242H formed in the blade attachment portion 2422. In other words, the blade 2421 is attached to the blade attachment portion 2422 by the screw members SC inserted into the plurality of elongated holes 242H so that the inclination of the blade 2421 with respect to the bottom surface 2411S can be adjusted based on the clearance information J1.

[0062] The operator can adjust the inclination of the blade 2421 with respect to the bottom surface 2411S based on the clearance information J1 by adjusting the attachment attitude of the blade 2421 using the screws SC inserted into the multiple elongated holes 242H formed in the blade attachment portion 2422. In this case, by adjusting the attachment attitude of the blade 2421 with respect to the blade attachment portion 2422 so that the difference between the maximum value CL1 and the minimum value CL2 of the clearance CL included in the clearance information J1 falls within a predetermined tolerance range, the inclination of the blade 2421 can be adjusted so that the lower edge 2421D of the blade 2421 is approximately parallel to the bottom surface 2411S. This makes it possible to keep the clearance CL between the bottom surface 2411S of the bottom surface portion 2411 and the lower edge 2421D of the blade 2421 as constant as possible throughout the entire longitudinal direction of the blade 2421. Therefore, the thickness of the transfer material TM spread in a film shape by the blade 2421 on the bottom surface 2411S of the bottom surface portion 2411 can be made as uniform as possible over the entire length of the blade 2421.

[0063] The blade movement mechanism 243 also moves the blade member 242 in the vertical direction so as to adjust the height position of the blade 2421 relative to the bottom surface 2411S based on the clearance information J1. The height position of the blade 2421 relative to the bottom surface 2411S can be adjusted based on the clearance information J1 in response to the vertical movement of the blade member 242 by the blade movement mechanism 243. In this case, the height position of the blade 2421 relative to the bottom surface 2411S can be adjusted in response to the vertical movement of the blade member 242 by the blade movement mechanism 243 so that the median or average value CL3 of the clearance CL matches the target film thickness of the transfer material TM, while the difference between the maximum value CL1 and the minimum value CL2 of the clearance CL included in the clearance information J1 is within a predetermined tolerance range. This allows the clearance CL between the bottom surface 2411S of the bottom surface portion 2411 and the lower edge 2421D of the blade 2421 to match the target film thickness of the transfer material TM.

[0064] Furthermore, the processing unit 245 may perform processing to control the movement of the blade member 242 by the blade movement mechanism 243 so that the median or average value CL3 of the clearance CL included in the clearance information J1 falls within a predetermined target range. In this case, the processing unit 245 can automatically adjust the clearance CL by controlling the movement of the blade member 242 by the blade movement mechanism 243. This makes it possible to automatically adjust the film thickness of the transfer material TM based on the clearance CL.

[0065] Next, the operation of the transfer device 24 will be described with reference to the flowchart of FIG.

[0066] With the head unit 25 disposed above the transfer device 24, the measurement unit 244 measures the peripheral wall top surface height HW (step S1) and the blade top surface height HB (step S2). The processing unit 245 calculates the clearance CL based on the peripheral wall top surface height HW and the blade top surface height HB (step S3), and outputs clearance information J1 indicating the calculation result (step S4).

[0067] During the production of mounting boards in accordance with the component mounting operation by the mounting head 251, the measurement unit 244 may periodically measure the peripheral wall upper surface height HW and the blade upper surface height HB. In this case, the processing unit 245 calculates the clearance CL each time the measurement is periodically performed by the measurement unit 244, and outputs clearance information J1 indicating the calculation result. This makes it possible to periodically and accurately calculate the clearance CL during the production of mounting boards, and to accurately determine the film thickness of the transfer material TM based on the clearance CL.

[0068] If the difference between the maximum value CL1 and the minimum value CL2 of the clearance CL included in the clearance information J1 exceeds the upper limit of a predetermined tolerance range, an operator performs work to adjust the inclination of the blade 2421 with respect to the bottom surface 2411S. The processing unit 245 determines whether or not work to adjust the inclination of the blade 2421 has been performed (step S5). If information indicating that work has been performed is input, the processing unit 245 determines that work to adjust the inclination of the blade 2421 has been performed, and if the information is not input, the processing unit 245 determines that work to adjust the inclination of the blade 2421 has not been performed.

[0069] If the median or average value CL3 of the clearance CL included in the clearance information J1 does not match the target value of the film thickness of the transfer material TM, the blade member 242 is moved in the vertical direction by the blade moving mechanism 243. The processing unit 245 determines whether the blade member 242 has been moved in the vertical direction (step S6).

[0070] The measurement unit 244 repeatedly measures the blade top surface height HB each time the blade member 242 is moved by the blade movement mechanism 243 over a predetermined period. The processing unit 245 calculates the clearance CL each time the measurement of the blade top surface height HB is repeated by the measurement unit 244 over a predetermined period, and outputs clearance information J1 indicating the calculation result. For example, under circumstances in which the amount of transfer material TM in the storage tank 241 changes depending on the transfer of the transfer material TM to the electronic component P, the storage tank 241 is repeatedly replenished with transfer material TM and the blade member 242 is moved up and down by the blade movement mechanism 243 in order to maintain the film thickness of the transfer material TM at a predetermined target value. Even under such circumstances in which the amount of transfer material TM in the storage tank 241 changes dynamically, the clearance CL can be accurately calculated each time the blade member 242 is moved by the blade movement mechanism 243, and the film thickness of the transfer material TM can be accurately determined based on the clearance CL.

[0071] The processing unit 245 determines whether the number of times the measurement of the blade top surface height HB by the measurement unit 244 has been repeated exceeds a predetermined reference number (step S7). If the number of times the measurement of the blade top surface height HB has been repeated exceeds the predetermined reference number (YES in step S7), the processing unit 245 outputs notification information J2 to notify that fact (step S8). Based on the notification information J2 output from the processing unit 245, the operator can confirm that the number of times the measurement of the blade top surface height HB by the measurement unit 244 has been repeated exceeds the predetermined reference number. [Explanation of symbols]

[0072] 1. Component Mounting Machine 2 Mounting machine body 24 Transcription device 241 Reservoir 2411 Bottom part 2412 Peripheral wall section 242 Blade member 2421 Blade 2422 Blade attachment part 243 Blade movement mechanism 244 Measurement Unit 245 processing units 25 Head Unit 251 Mounting Head

Claims

1. a storage tank formed in a bottomed cylindrical shape capable of storing a transfer material to be transferred to an electronic component, the storage tank including a bottom surface portion having a bottom surface against which the electronic component abuts, and a peripheral wall portion protruding upward from a peripheral edge of the bottom surface portion; a blade member disposed above the storage tank, the blade member including a blade that spreads the transfer material in the storage tank in a film shape against the bottom surface and a blade attachment portion to which the blade is attached; a measuring unit disposed above the storage tank and the blade member, for measuring a peripheral wall upper surface height indicating the height of an upper surface of the peripheral wall portion, and for measuring a blade upper surface height indicating the height of an upper surface of the blade or the blade attachment portion; a processing unit that performs processing to calculate a clearance indicating a gap between the bottom surface and the blade based on the peripheral wall top surface height and the blade top surface height.

2. The blade has a shape extending in a predetermined longitudinal direction relative to the bottom surface, The transfer device according to claim 1, wherein the processing unit calculates the clearance corresponding to each of a plurality of points in the longitudinal direction of the blade, and outputs clearance information including information on the maximum, minimum, and median or average values ​​of the clearance indicating the calculation results.

3. 3. The transfer device according to claim 2, wherein the blade attachment portion has a plurality of elongated holes extending in the vertical direction, and the blade is attached by screw members inserted into the plurality of elongated holes so that the inclination of the blade relative to the bottom surface can be adjusted based on the clearance information.

4. The transfer device according to claim 2 , further comprising a blade movement mechanism that moves the blade member in a vertical direction so as to adjust the height position of the blade relative to the bottom surface based on the clearance information.

5. the measurement unit repeatedly measures the height of the blade upper surface each time the blade member is moved by the blade moving mechanism during a predetermined period; 5. The transfer device according to claim 4, wherein the processing unit calculates the clearance each time the measurement unit repeats measurement of the blade upper surface height during the predetermined period, and outputs the clearance information indicating the calculation result.

6. 6. The transfer device according to claim 5, wherein the processing unit outputs notification information to notify a user that the number of times the measurement of the blade upper surface height by the measurement unit has been repeated exceeds a predetermined reference number.

7. the measuring unit periodically measures the peripheral wall upper surface height and the blade upper surface height; The transfer device according to claim 2 , wherein the processing unit calculates the clearance each time the measurement unit periodically performs measurement, and outputs the clearance information indicating the calculation result.

8. The transfer device according to claim 4 , wherein the processing unit performs processing to control movement of the blade member by the blade movement mechanism so that a median or average value of the clearance included in the clearance information falls within a predetermined target range.

9. a head unit that is provided to be movable in the vertical direction and includes a mounting head that holds electronic components and mounts the electronic components on a substrate; a control unit for controlling the vertical movement of the mounting head; a transfer device according to any one of claims 1 to 8, which transfers a transfer material onto the electronic component held by the mounting head; when transferring the transfer material to the electronic component held by the mounting head in the transfer device, the control unit moves the mounting head so that the electronic component abuts on the bottom surface of the bottom surface portion; The component mounter, wherein the measurement unit is attached to the head unit and is capable of measuring a board upper surface height indicating the height of the upper surface of the board.

10. 10. The component mounter according to claim 9, wherein the transfer device is installed such that, in the vertical direction, an upper surface of the peripheral wall portion and an upper surface of the blade or the blade attachment portion are positioned within a measurement range of the measurement unit when measuring the height of the substrate upper surface.

11. 10. The component mounter according to claim 9, wherein the control unit moves the mounting head so that the electronic component abuts on the bottom surface of the bottom portion based on the peripheral wall upper surface height measured by the measurement unit.

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