Liquid discharge head, liquid discharge device and article manufacturing method

Abstract

To provide a technique advantageous for improving liquid impact accuracy.SOLUTION: A liquid discharge head includes: a discharge nozzle opened on a first surface; a first unit having a first part including a second surface opposite to the first surface; and a second unit which is bonded to the second surface in an adhesive part, and is configured to supply liquid to the first unit. The second unit is thicker than the first unit in a first direction perpendicular to the first surface. The second unit has a frame part overlapping the first unit in the first direction, and a wall part arranged inside the frame part. The frame part has a second part. The frame part and the wall part are bonded to the second surface in the adhesive part. The wall part has a third part having Young's modulus lower than each of the Young's moduli of the first part and the second part.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head, a liquid ejection device, and a method for manufacturing an article. [Background technology]

[0002] A liquid ejection head has multiple ejection nozzles. The liquid ejection head moves relative to a target object and ejects liquid from the ejection nozzles, causing the liquid to land on the target object and drawing a structure on the target. This type of liquid ejection head is equipped with a liquid supply unit having a flow path for circulating and continuously supplying the liquid to prevent the liquid from drying out or settling inside the head.

[0003] Patent Document 1 discloses an inkjet head that includes an ink supply unit that is arranged on the opposite side of the ink ejection surface from the ink ejection unit. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-134880 Summary of the Invention [Problem to be solved by the invention]

[0005] High precision is now required for the landing position of liquid. The time it takes for liquid ejected from a discharge nozzle to land on a target (hang time) depends on the distance from the discharge nozzle to the target. If the flight time of liquid ejected from multiple discharge nozzles differs, deviations will occur in the landing position of the liquid on the target.

[0006] The present disclosure provides an advantageous technique for improving the landing accuracy of liquid. [Means for solving the problem]

[0007] One aspect of the present disclosure is a liquid ejection head comprising: a first unit having a first portion including an ejection nozzle opening in a first surface and a second surface opposite the first surface; and a second unit adhered to the second surface by an adhesive portion and configured to supply liquid to the first unit, wherein the second unit is thicker than the first unit in a first direction perpendicular to the first surface, the second unit has a frame portion overlapping the first unit in the first direction and a wall portion arranged inside the frame portion, the frame portion has a second portion, the frame portion and the wall portion are adhered to the second surface by the adhesive portion, and the wall portion has a third portion having a Young's modulus lower than that of each of the first portion and the second portion. [Effects of the Invention]

[0008] According to the present disclosure, a technique that is advantageous for improving the landing accuracy of liquid is provided. [Brief explanation of the drawings]

[0009] [Figure 1] 1A and 1B are explanatory diagrams of a liquid ejection device according to a first embodiment. [Figure 2] FIG. 1 is an explanatory diagram of a liquid ejection head according to a first embodiment. [Figure 3] 1A and 1B are explanatory views of a chip unit according to a first embodiment. [Figure 4] FIG. 1 is an explanatory diagram of a liquid ejection head according to a first embodiment. [Figure 5] FIG. 2 is an explanatory diagram of a liquid supply unit according to the first embodiment. [Figure 6] 1(a) and 1(b) are explanatory diagrams of the manufacturing process of the liquid ejection head of Comparative Example 1. FIG. 1(c) is an explanatory diagram of the manufacturing process of the liquid ejection head of Comparative Example 2. [Figure 7] FIG. 1 is an explanatory diagram of a liquid ejection head according to a first embodiment. [Figure 8] 7A is a view taken along the line VIIIA-VIIIA in FIG. 7, and FIG. 7B is a view taken along the line VIIIB-VIIIB in FIG. [Figure 9] FIG. 10 is an explanatory diagram of a liquid supply unit of a liquid ejection head according to a second embodiment. [Figure 10] 10A is an explanatory diagram of a liquid supply unit of a liquid ejection head according to a third embodiment, and FIG. 10B is an explanatory diagram of a liquid supply unit of a liquid ejection head according to a fourth embodiment. [Figure 11] FIG. 11 is an explanatory diagram of a liquid supply unit according to the fifth embodiment. [Figure 12] FIG. 13 is an explanatory diagram of a liquid supply unit according to the sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments described below are merely examples, and those skilled in the art can appropriately modify and implement the detailed configurations without departing from the spirit and scope of the present invention.

[0011] In the drawings referred to in the following description of the embodiments, elements denoted by the same reference numerals have the same functions unless otherwise specified. When a plurality of identical elements are arranged in a drawing, the assignment of the reference numerals and their explanation may be omitted. Furthermore, since the drawings may be represented schematically for the convenience of illustration and explanation, the shape, size, arrangement, etc. of elements depicted in the drawings may not strictly correspond to the actual objects.

[0012] In this specification, the liquid handled by the liquid ejection device may be referred to as "ink." However, the ink in this embodiment is not limited to a liquid for forming characters or images. For example, the ink may be a liquid containing a functional material for forming a functional thin film such as an electrode or an optical filter, or a functional element such as an organic electroluminescence (EL) element. Furthermore, the ejection and application of a liquid to an object may be referred to as "recording." However, the term "recording" used here does not necessarily mean recording information such as characters or images. For example, it also includes applying a liquid to an object to manufacture an article such as a functional thin film, a functional element, or a three-dimensional object. Furthermore, the object to which the liquid is applied may be referred to as a "recording medium." However, the recording medium is not limited to a medium for recording information such as characters or images, but may also include components that serve as the base material for manufacturing an article such as a functional thin film, a functional element, or a three-dimensional object.

[0013] In the following embodiments, directions are indicated by an XYZ coordinate system, which is a Cartesian coordinate system. The X, Y, and Z axes are perpendicular to one another. The direction of the X axis is also called the X direction, the direction of the Y axis is also called the Y direction, and the direction of the Z axis is also called the Z direction. A plane including the X and Y axes is also called an XY plane. The negative direction of the Z axis is also the direction of gravity. The X and Y directions are also horizontal directions.

[0014] [First embodiment] 1(a) and 1(b) are explanatory diagrams of a liquid ejection device 100 according to a first embodiment. Fig. 1(a) is a plan view of the liquid ejection device 100 as viewed in the direction of gravity, which is the negative direction of the Z axis. Fig. 1(b) is a side view of the liquid ejection device 100 as viewed in the positive direction of the Y axis.

[0015] The liquid ejection device 100 is used in part of a process for manufacturing an organic EL panel having an OLED (Organic Light Emitting Diode), which is an organic EL element. That is, the liquid ejection device 100 performs a coating process to apply a solution to a substrate S, which is an example of a target object (recording medium), thereby forming a solution film on the substrate S. Thereafter, a drying process to dry the solution film and a sintering process to sinter the dried film are performed, thereby forming a functional film (organic film) on the substrate S.

[0016] The solution is composed of, for example, a solution (ink) containing a solute and a solvent for forming an organic film. The solvent can exist in a liquid state under an environment of room temperature (25°C) and atmospheric pressure (1 atm). The solvent preferably has a property that promotes evaporation in a reduced pressure environment lower than atmospheric pressure (1 atm). The evaporation of the solvent is preferably promoted, for example, at a temperature higher than room temperature (25°C).

[0017] The solvent is preferably an organic solvent, such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, diethylene glycol monomethyl ether, cyclohexanone, N,N-dimethylisobutyramide, N-methylformamide, N-methylacetamide, N-diethylformamide, cyclohexanol, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, 1,3-butanediol, 1,4-butanediol, propylene glycol ... Examples of the alkyl ether include ethylene glycol, hexylene glycol, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, N-hexyl acetate, ethyl cellosolve acetate, and cyclohexylbenzene.

[0018] The organic film is an organic layer, such as a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, or an electron injection layer of an OLED. The production of an organic EL device includes the steps of forming each of the organic films, i.e., the hole injection layer, the hole transport layer, the light-emitting layer, the electron transport layer, and the electron injection layer, on a substrate S. The solution film is applied to a required location on the substrate S by the liquid ejection apparatus 100 before a drying process.

[0019] The liquid ejection device 100 includes a liquid ejection head 103, a base 109, and a stage 110 that is disposed on the base 109 and holds a substrate S. The stage 110 is an example of a holding unit. A sub-scanning guide rail 107 extending in the Y direction is fixed to the base 109 via a support member 108. A main scanning guide rail 105 is placed on the sub-scanning guide rail 107, and a main scanner 104 is placed on the main scanning guide rail 105. The main scanning guide rail 105 is a carriage that is movable on the sub-scanning guide rail 107 in the Y direction. The main scanner 104 is movable on the main scanning guide rail 105 in the X direction.

[0020] A liquid discharge unit 102 is attached to the main scanner 104. By moving the main scanning guide rail 105 in the Y direction and the main scanner 104 in the X direction, the liquid discharge unit 102 can be freely scanned in the X and Y directions above the substrate S set on the stage 110.

[0021] The liquid ejection unit 102 is equipped with a liquid ejection head 103 capable of ejecting ink toward the substrate S. The liquid ejection unit 102 is equipped with a flow path including a sub-tank for supplying ink to the liquid ejection head 103. An ink tank 101, which serves as a main tank, is installed on a base 109. The ink tank 101 stores ink to replenish the ink when the ink level in the sub-tank of the liquid ejection unit 102 becomes low, and the ink is supplied to the liquid ejection unit 102 through a connecting flow path 111. Furthermore, a flow path for waste liquid and a tank for waste liquid may be provided as necessary.

[0022] Fig. 2 is an explanatory diagram of the liquid ejection head 103 according to the first embodiment. Fig. 2 shows a schematic cross-sectional view of the liquid ejection head 103 taken along an imaginary plane parallel to the YZ plane, viewed in the positive direction of the X axis.

[0023] The liquid ejection head 103 includes a chip unit 1 which is an example of a first unit, a liquid supply unit 2 which is an example of a second unit, and an adhesive part 3 which bonds the chip unit 1 and the liquid supply unit 2. The adhesive part 3 is a cured product formed by curing an adhesive.

[0024] 3(a) and 3(b) are explanatory diagrams of a chip unit 1 according to the first embodiment. The chip unit 1 has a discharge surface 15 and a bonding surface 16 on the opposite side of the discharge surface 15. The discharge surface 15 is an example of a first surface. The bonding surface 16 is an example of a second surface. FIG. 3(a) is a plan view of the discharge surface 15 of the chip unit 1 as viewed in the positive direction of the Z axis. FIG. 3(b) is a plan view of the bonding surface 16 of the chip unit 1 as viewed in the negative direction of the Z axis.

[0025] The chip unit 1 has a plurality of ejection nozzles N opening on the ejection surface 15. Ink is ejected from each ejection nozzle N. The ejection surface 15 and the bonding surface 16 are substantially parallel to each other. In the first embodiment, the ejection surface 15 and the bonding surface 16 are parallel to the XY plane. The direction perpendicular to the ejection surface 15 and the direction perpendicular to the bonding surface 16 are the Z direction. The Z direction is an example of a first direction, the Y direction is an example of a second direction, and the X direction is an example of a third direction. In the first embodiment, the Y direction is the longitudinal direction of the chip unit 1, the X direction is the lateral direction of the chip unit 1, and the Z direction is the thickness direction (height direction) of the chip unit 1.

[0026] Two or more of the multiple discharge nozzles N are arranged at intervals in the Y direction. Two or more discharge nozzles N arranged at intervals in the Y direction constitute one nozzle group. In the first embodiment, the chip unit 1 has multiple nozzle groups arranged at intervals from each other in the X direction. That is, the multiple nozzle groups are constituted by multiple discharge nozzles N. Note that in the first embodiment, the chip unit 1 has multiple nozzle groups, but this is not limited thereto, and the chip unit 1 may have one nozzle group. That is, the chip unit 1 has one or multiple nozzle groups. Note that the number and arrangement of the discharge nozzles N may be arbitrary as long as they are within the discharge surface 15.

[0027] A plurality of connection ports 12 are arranged on the joining surface 16. Each connection port 12 is in communication with a corresponding one of the plurality of discharge nozzles N via a liquid flow path.

[0028] Fig. 4 is an explanatory diagram of the liquid ejection head 103 according to the first embodiment. Fig. 4 shows a schematic cross-sectional view of a part of the liquid ejection head 103 along an imaginary plane parallel to the XZ plane, viewed in the positive direction of the Y axis. Fig. 4 also shows a schematic view of the liquid flow path from the flow path 22 in the liquid ejection head 103 to the ejection nozzle N.

[0029] 4, the chip unit 1 has a plate 131 that includes an ejection surface 15 and defines a plurality of ejection nozzles N and a plurality of pressure chambers 19. Note that FIG. 4 illustrates one ejection nozzle N and a pressure chamber 19 corresponding to the one ejection nozzle N.

[0030] The chip unit 1 also has a plate 132 connected to the plate 131. The chip unit 1 also has a plate 133 connected to the plate 132 and defining a common liquid chamber 17. The common liquid chamber 17 is in communication with a plurality of pressure chambers 19 through communication ports in the plate 132.

[0031] The chip unit 1 also has a plate 134 that includes a bonding surface 16 and is connected to the plate 133. A connection port 12 that communicates with the common liquid chamber 17 is defined in the plate 134.

[0032] A piezoelectric element 18, which is an example of an energy generating element, is disposed in each pressure chamber 19. The energy generated by the piezoelectric element 18 causes the liquid in the pressure chamber 19 to be ejected from the ejection nozzle N. The ejection direction of the liquid from the ejection nozzle N is approximately in the negative direction of the Z axis.

[0033] For convenience, the illustration does not include the electrical circuitry and electrical wiring for driving the piezoelectric element 18. The energy generating element is not limited to the piezoelectric element 18. The energy generating element may be any other element that can impart ejection energy to the liquid, such as an electrothermal conversion element (heater).

[0034] In the first embodiment, the plate 134 is an example of a first portion. The plates 131 to 134 are mainly made of silicon, for example. That is, each of the plates 131 to 134 is a silicon substrate. The main body of the chip unit 1 is configured by stacking the multiple plates 131 to 134. The main body of the chip unit 1 defines a liquid flow path from the connection port 12 to the discharge nozzle N.

[0035] In the first embodiment, the chip unit 1 has four plates 131 to 134, but the present invention is not limited to this. Furthermore, the liquid flow path defined inside the chip unit 1 is not limited to the above example.

[0036] Known techniques are used for the structure and manufacturing method of the chip unit 1. For example, the chip unit 1 is manufactured by processing channels in multiple plates using photolithography, and then directly joining or laminating the multiple plates by adhesive.

[0037] The liquid supply unit 2 is configured to supply liquid to the chip unit 1. The liquid supply unit 2 is fixed to the bonding surface 16 of the chip unit 1 by adhesive at the adhesive part 3. That is, the liquid supply unit 2 is adhered to the bonding surface 16 of the chip unit 1 via the adhesive part 3.

[0038] The liquid supply unit 2 is connected to the chip unit 1 by a flow path via a connection port 12 of the chip unit 1. In FIG. 3(b), an area 11 corresponding to the flow path of the liquid supply unit 2 is shown by a dashed line. One or more connection ports 12 for passing ink are provided in the area 11. The number, shape, size, and arrangement of the connection ports 12 are not limited as long as the desired ink supply form can be realized.

[0039] Fig. 5 is an explanatory diagram of the liquid supply unit 2 according to the first embodiment. Fig. 5 shows a schematic perspective view of the liquid supply unit 2. Fig. 5 also shows the liquid supply unit 2 with a see-through view of the configuration of a portion of the liquid supply unit 2.

[0040] The liquid supply unit 2 includes a base 21 and a plurality of walls 23 as at least one wall. The base 21 has a frame 21w shown in Fig. 2. The frame 21w is a portion of the base 21 that overlaps with the chip unit 1 in the Z direction. In other words, the frame 21w is the portion of the base 21 that overlaps with the chip unit 1 when viewed in the Z direction.

[0041] Frame portion 21w has an end surface 25 on the chip unit 1 side and a recessed portion 26 recessed in the positive direction of the Z axis relative to end surface 25. Recessed portion 26 is a bottomed hole. Multiple wall portions 23 are arranged inside frame portion 21w, i.e., in recessed portion 26, at intervals in the Y direction. End surface 25 of frame portion 21w and end surfaces 27 of the multiple wall portions 23 are adhesively fixed to joining surface 16 of chip unit 1 by adhesive portion 3. That is, each of end surfaces 25, 27 is an end surface facing the joining surface 16 and is an end surface in contact with adhesive portion 3.

[0042] End surface 27 is the leading end surface of wall portion 23 in the Z direction (downstream side in the negative direction of the Z axis), and is flush with end surface 25 of frame portion 21w. The base end surface of wall portion 23 in the Z direction (upstream side in the negative direction of the Z axis) is fixed to the bottom surface of recess 26 by adhesive or the like. Note that both end surfaces of wall portion 23 in the X direction are also fixed to both end surfaces of recess 26 by adhesive or the like. In addition, end surface 25 of frame portion 21w is part of the end surface of base portion 21.

[0043] The base 21 and the wall 23 may be fixed together using the same type of adhesive as that used to form the adhesive portion 3, or a different type of adhesive. Alternatively, the wall 23 may be fitted into the recess 26 of the base 21 by press-fitting, for example, without using an adhesive. Alternatively, the liquid supply unit 2 may be produced by insert molding, in which the base 21 and the wall 23 are integrally molded. However, the method for producing the liquid supply unit 2 is not limited to these methods.

[0044] In this way, a plurality of flow paths (spaces) 22 are defined by the frame 21w and the plurality of wall portions 23 of the liquid supply unit 2 and the plurality of areas 11 of the chip unit 1. Each flow path 22 is a space in which liquid (ink) supplied to the chip unit 1 is disposed.

[0045] Each of the multiple flow channels 22 is connected to a corresponding one of the multiple connection ports 12 of the chip unit 1. A connection port 24 that is connected to the connection flow channel 111 in FIG. 1(a) is arranged on the bottom surface of each flow channel 22.

[0046] With the above configuration, liquid is supplied from the ink tank 101 to each flow path 22 of the liquid supply unit 2 via the connection flow path 111. The liquid supplied to each flow path 22 is supplied to the chip unit 1 via the corresponding connection port 12 of the plurality of connection ports 12 of the chip unit 1, and the liquid is ejected from the corresponding ejection nozzle N of the plurality of ejection nozzles N of the chip unit 1.

[0047] Each wall portion 23 has a role of separating two flow paths 22, but is not limited to this. For example, the two flow paths 22 may be communicated with each other via a communication port disposed in the wall portion 23.

[0048] Furthermore, there are no restrictions on the number, length in the X direction, width in the Y direction, depth in the Z direction, and arrangement of the flow paths 22 of the liquid supply unit 2, and these may be set arbitrarily in consideration of the flow path structure to the discharge nozzle N. There are also no restrictions on the number, shape, size, and arrangement of the connection ports 24, and these may be set arbitrarily.

[0049] The adhesive portion 3 is a cured product obtained by curing an adhesive, and is preferably a cured product obtained by curing a thermosetting resin or a UV delayed curing resin. The uncured adhesive is, for example, in a liquid state, and can be applied to a desired position.

[0050] Here, a liquid ejection head of a comparative example will be described. Figures 6(a) and 6(b) are explanatory diagrams of the manufacturing process of the liquid ejection head of comparative example 1.

[0051] In Comparative Example 1, a chip unit 1 and a liquid supply unit 2X are prepared. The liquid supply unit 2X has a different configuration from the liquid supply unit 2, and is entirely made of a material with a high Young's modulus, such as metal.

[0052] As shown in FIG. 6(a), an adhesive 3A before hardening is placed between the chip unit 1 and the liquid supply unit 2X, and by hardening the adhesive 3A, an adhesive part 3 shown in FIG. 6(b) is formed.

[0053] The adhesive 3A shrinks as it hardens. The shrinkage that occurs when the adhesive 3A hardens causes the chip unit 1 to warp, causing the ejection surface 15 to curve into a convex shape that is convex in the negative direction of the Z axis. As a result, as shown in Figure 6(b), a difference ΔH' occurs in the height direction along the liquid ejection direction between the ejection nozzle located near the center of the ejection surface 15 and the ejection nozzle located near the end of the ejection surface 15. The difference ΔH' is the maximum difference in height direction between any two ejection nozzles among the multiple ejection nozzles.

[0054] 6(b), the Y direction is the longitudinal direction of the chip unit 1. Therefore, there is a large difference in height between the ejection nozzles located near the center of the ejection surface 15 in the Y direction and the ejection nozzles located near the ends of the ejection surface 15 in the Y direction. That is, although the ejection surface 15 is curved in a convex shape when viewed in either the X direction or the Y direction, the difference in height between the ejection nozzles located near the center of the ejection surface 15 in the Y direction and the ejection nozzles located near the ends of the ejection surface 15 in the Y direction is larger than the difference in height between the ejection nozzles located near the center of the ejection surface 15 in the X direction and the ejection nozzles located near the ends of the ejection surface 15 in the X direction.

[0055] For ease of explanation, the thickness of the adhesive 3A shown in FIG. 6(a) and the thickness of the adhesive portion 3 shown in FIG. 6(b) are exaggerated for ease of understanding. Also, the height difference ΔH' between the discharge nozzles shown in FIG. 6(b) is exaggerated for ease of understanding. Also, the chip unit 1 is shown schematically in FIGS. 6(a) and 6(b), and the liquid supply unit 2X is also shown schematically in FIGS. 6(a) and 6(b). For example, slight irregularities may exist on the adhesive surface of the liquid supply unit 2X.

[0056] 6(c) is an explanatory diagram of the manufacturing process of the liquid ejection head of Comparative Example 2. In Comparative Example 2, a chip unit 1 and a liquid supply unit 2Y are prepared. The liquid supply unit 2Y has a different configuration from the liquid supply units 2 and 2X, and is entirely made of a material with a low Young's modulus, such as resin.

[0057] An adhesive 3A before hardening is placed between the chip unit 1 and the liquid supply unit 2Y as shown in FIG. 6(a), and by hardening the adhesive 3A, an adhesive part 3 shown in FIG. 6(c) is formed.

[0058] Contraction that occurs when adhesive 3A hardens deforms liquid supply unit 2Y, causing warping of chip unit 1 and curving of discharge surface 15 into a concave shape concave in the positive direction of the Z axis. As a result, as shown in Figure 6(c), a difference ΔH' occurs in the height along the liquid discharge direction between a discharge nozzle near the center of discharge surface 15 and a discharge nozzle near the end of discharge surface 15. Difference ΔH' is the maximum difference in height between any two discharge nozzles among the multiple discharge nozzles.

[0059] 6(c), the Y direction is the longitudinal direction of the chip unit 1. Therefore, there is a large difference in height between the ejection nozzles located near the center of the ejection surface 15 in the Y direction and the ejection nozzles located near the ends of the ejection surface 15 in the Y direction. That is, when viewed in either the X direction or the Y direction, the ejection surface 15 is curved in a concave shape, but the difference in height between the ejection nozzles located near the center of the ejection surface 15 in the Y direction and the ejection nozzles located near the ends of the ejection surface 15 in the Y direction is larger than the difference in height between the ejection nozzles located near the center of the ejection surface 15 in the X direction and the ejection nozzles located near the ends of the ejection surface 15 in the X direction.

[0060] For ease of explanation, the thickness of the adhesive portion 3 shown in FIG. 6(c) is exaggerated for ease of understanding. Also, the height difference ΔH' between the discharge nozzles shown in FIG. 6(c) is exaggerated for ease of understanding. Also, the chip unit 1 is schematically illustrated in FIG. 6(c), and the liquid supply unit 2Y is also schematically illustrated in FIG. 6(c). For example, slight irregularities may exist on the adhesive surface of the liquid supply unit 2Y.

[0061] As shown in Figure 6(b) or 6(c), the greater the difference in height ΔH' between the ejection nozzles, the greater the difference in the ink flight time between the ejection nozzles before the ink lands on the main surface of the target substrate S. As a result, the accuracy of the ink landing on the substrate S decreases. When a high-resolution liquid ejection head is envisioned, the variation in the height of the ejection nozzles required for the accuracy of the ink landing needs to be kept to, for example, the order of a single micron.

[0062] FIG. 7 is an explanatory diagram of a liquid ejection head 103 according to the first embodiment. The following description will be made with reference to FIGS. 2 and 7. At least the frame portion 21w of the base portion 21 has a high Young's modulus layer 2h. The high Young's modulus layer 2h is an example of the second portion. In the first embodiment, the entire base portion 21, i.e., the entire frame portion 21w, is the high Young's modulus layer 2h. In addition, the wall portion 23 has a low Young's modulus layer 2s. The low Young's modulus layer 2s is an example of the third portion. In the first embodiment, the entire wall portion 23 is the low Young's modulus layer 2s.

[0063] The layers 2h and 2s have different Young's moduli. The Young's modulus of the low Young's modulus layer 2s is lower than the Young's modulus of the high Young's modulus layer 2h and the Young's modulus of the plate 134 of the chip unit 1.

[0064] Deformation due to shrinkage when the adhesive hardens affects not only the chip unit 1 but also the low Young's modulus layer 2s. The adhesive portion 3 shown in FIG. 7 is a cured product of the adhesive 3A shown in FIG. 6(a). In Comparative Example 1, the chip unit 1 deforms as shown by the dashed line in FIG. 7, whereas in the first embodiment, the chip unit 1 deforms as shown by the broken line in FIG. 7 by combining the two layers 2h and 2s. That is, in the first embodiment, the low Young's modulus layer 2s partially induces deformation of the chip unit 1 in the opposite direction to that in Comparative Example 1. That is, the wall portion 23 has the low Young's modulus layer 2s, which induces deformation of the chip unit 1 in the opposite direction to that in the high Young's modulus layer 2h.

[0065] This reduces the difference in height (maximum value) ΔH between the discharge nozzles N of the chip unit 1, providing a liquid discharge head 103 with good landing accuracy. In particular, the difference in height between two discharge nozzles spaced apart in the Y direction of the discharge surface 15 is effectively reduced. In this case, it is preferable to appropriately select the material, area, thickness, and arrangement of the layers 2h and 2s relative to the plate 134 of the chip unit 1.

[0066] For ease of explanation, the thickness of the adhesive portion 3 shown in FIG. 7 is exaggerated for ease of understanding. The height difference ΔH between the discharge nozzles shown in FIG. 7 is also exaggerated for ease of understanding. The chip unit 1 and the liquid supply unit 2 are also shown schematically in FIG. 7. For example, slight irregularities may exist on the adhesive surface of the liquid supply unit 2.

[0067] Here, the thickness (height) in the Z direction of the chip unit 1 is T1, the thickness (height) in the Z direction of the liquid supply unit 2 (frame portion 21w) is T2, and the thickness (height) in the Z direction of the adhesive portion 3 is T3. Also, the thickness (height) in the Z direction of the low Young's modulus layer 2s of each wall portion 23 is D2. In the first embodiment, the entire wall portion 23 is the low Young's modulus layer 2s, so the thickness D2 in the Z direction of the low Young's modulus layer 2s is also the height of the wall portion 23 in the Z direction.

[0068] In order to offset deformation of the chip unit 1 caused by the adhesive 3 with deformation of the wall 23 caused by the adhesive 3, it is preferable that at least the frame 21w of the base 21 has high rigidity. Also, it is necessary to ensure the volume of the flow path 22 in the liquid supply unit 2. For the above reasons, in the first embodiment, the thickness T2 of the liquid supply unit 2 in the Z direction is greater than the thickness T1 of the chip unit 1 in the Z direction. In other words, the liquid supply unit 2 is thicker than the chip unit 1 in the Z direction.

[0069] The above configuration reduces deformation of the discharge surface 15 of the chip unit 1 and reduces the difference in height between the plurality of discharge nozzles N. As a result, the variation in the time that the liquid discharged from the plurality of discharge nozzles N toward the substrate S dwells until it lands on the substrate S is reduced, and it is possible to reduce deviation in the landing position of the liquid.

[0070] As described above, according to the first embodiment, the landing accuracy of the liquid ejected from each ejection nozzle N is improved. That is, according to the first embodiment, a technique is provided that is advantageous for improving the landing accuracy of the liquid. The landing accuracy of the liquid refers to the accuracy of the landing position of the liquid.

[0071] Furthermore, the thickness T1 of the chip unit 1 in the Z direction is greater than the thickness T3 of the adhesive portion 3 in the Z direction. That is, the chip unit 1 is thicker in the Z direction than the adhesive portion 3. The height D2 of the wall portion 23 in the Z direction is greater than the thickness T3 of the adhesive portion 3 in the Z direction and is smaller than the thickness T2 of the liquid supply unit 2 in the Z direction.

[0072] If the total amount of adhesive forming the adhesive portion 3 increases, deformation of the chip unit 1 increases when the adhesive hardens. For this reason, the thickness T3 of the adhesive portion 3 in the Z direction is preferably 100 μm or less, and more preferably 50 μm or less. The thickness (height) D2 of the low Young's modulus layer 2s in the Z direction is preferably greater than the thickness T3 of the adhesive portion 3 in the Z direction, and more preferably greater than 50 μm.

[0073] The Young's modulus of the plate 134 of the chip unit 1 is preferably 100 GPa or more. The main component of the material of the plate 134 may be silicon.

[0074] To reliably induce deformation in the chip unit 1 that is opposite to the deformation caused by the adhesive portion 3, the Young's modulus of the high Young's modulus layer 2h is preferably 100 GPa or more. The main component material of the high Young's modulus layer 2h may be, for example, a metal. In the first embodiment, the entire frame portion 21w is made of metal, and the entire base portion 21 is made of metal. Among metals, invar or kovar is suitable as the material for the high Young's modulus layer 2h from the viewpoints of high rigidity, low thermal expansion coefficient, and ease of processing.

[0075] The Young's modulus of the low Young's modulus layer 2s is preferably 0.001 GPa or more and 20 GPa or less. If the Young's modulus of the low Young's modulus layer 2s is lower than 0.001 GPa, the function of the wall portion 23 as a partition may be reduced, and the components of the low Young's modulus layer 2s may be eluted into the ink. Furthermore, if the Young's modulus of the low Young's modulus layer 2s is higher than 20 GPa, deformation of the chip unit 1 in the reverse direction is less likely to be induced.

[0076] The main component of the low Young's modulus layer 2s may be, for example, a resin. The resin is preferably a resin with high chemical resistance suited to the ink material, such as polyether ether ketone resin, polyphenylene sulfide resin, or paraxylene-based polymer. Note that fluorine-based resins may be excluded from the resins used for the low Young's modulus layer 2s because they may have reduced adhesiveness in some cases.

[0077] Fig. 8(a) is a view taken along arrows VIIIA-VIIIA in Fig. 7, and Fig. 8(b) is a view taken along arrows VIIIB-VIIIB in Fig. 7. Fig. 8(a) shows a plan view of the liquid supply unit 2 as viewed in the negative direction of the Z axis. Fig. 8(b) shows a plan view of the liquid supply unit 2 and adhesive portion 3 as viewed in the negative direction of the Z axis.

[0078] In Fig. 8(a), frame portion 21w is the inner portion surrounded by the dashed line in base portion 21. Adhesive portion 3 shown in Fig. 8(b) is provided on at least end surface 27 of frame portion 21w and end surface 25 of wall portion 23 of liquid supply unit 2 shown in Fig. 8(a).

[0079] It is preferable that the adhesive portion 3 is continuous so as to surround the flow path 22 when viewed in the Z direction so that the liquid in the flow path 22 does not leak from the flow path 22 to the outside of the liquid ejection head 103. In other words, when viewed in the Z direction, the adhesive portion 3 needs only to surround the periphery of the flow path 22 without interruption. Note that when viewed in the Z direction, the adhesive portion 3 may protrude from a position corresponding to the frame portion 21w as long as it does not block the connection port 12 or the connection port 24. Furthermore, when viewed in the Z direction, a portion of the frame portion 21w does not need to overlap the adhesive portion 3.

[0080] The material of the adhesive portion 3 is not limited as long as it has sufficient chemical resistance to ink and sufficient adhesive strength. For example, the adhesive used to form the adhesive portion 3 is preferably a thermosetting resin or a UV delayed curing resin. Furthermore, the adhesive portion 3 may contain a filler as long as it does not cause any problems with the properties of the adhesive portion 3 after curing.

[0081] The liquid ejection head 103 may have components other than those described above. Examples of components other than those described above include a flow path for adjusting the temperature of ink, an exterior member, a wiring member, and a sealing material.

[0082] 8(a), a virtual plane (imaginary plane) V1 is defined. The imaginary plane V1 is a virtual plane parallel to the XZ plane, i.e., a virtual plane perpendicular to the Y direction. The imaginary plane V1 is a virtual plane that passes through the center positions of the multiple wall portions 23 in the Y direction. The multiple wall portions 23 are arranged symmetrically with respect to the virtual plane V1. This reduces the difference in height in the Z direction among the multiple discharge nozzles N of the chip unit 1. This improves the landing accuracy of the liquid discharged from each discharge nozzle N.

[0083] [Second embodiment] The second embodiment will now be described. Elements with the same reference symbols as those in the first embodiment will have substantially the same configurations and functions as those described in the first embodiment unless otherwise specified, and differences from the first embodiment will be mainly described. The liquid ejection head of the second embodiment is the liquid ejection head 103 of the first embodiment, with the liquid supply unit 2 replaced by a liquid supply unit 2A.

[0084] Fig. 9 is an explanatory diagram of a liquid supply unit 2A of a liquid ejection head according to the second embodiment. Fig. 9 shows a schematic cross-sectional view of the liquid supply unit 2A taken along an imaginary plane parallel to the YZ plane, viewed in the positive direction of the X axis.

[0085] The liquid supply unit 2A includes a base 21A having a frame 21Aw that overlaps the chip unit 1 (FIG. 2) in the Z direction, and a plurality of wall portions 23 arranged inside the frame 21Aw, i.e., in the recess 26. The shape of the base 21A is the same as the shape of the base 21 described in the first embodiment. The shape of the frame 21Aw is the same as the shape of the frame 21w described in the first embodiment. In the second embodiment, the configuration of the base 21A is different from the configuration of the base 21. That is, the configuration of the frame 21Aw is different from the configuration of the frame 21w.

[0086] In the first embodiment, the entire frame portion 21w was the high Young's modulus layer 2h, but in the second embodiment, the frame portion 21Aw has a high Young's modulus layer 2h that is the base of the frame portion 21Aw, and a coating member 201 disposed on the surface of the high Young's modulus layer 2h. The high Young's modulus layer 2h is an example of a second portion. The coating member 201 is an example of a third coating member.

[0087] The material of the high Young's modulus layer 2h may be, for example, a metal, as described in the first embodiment. That is, a portion of the frame portion 21Aw is made of a metal, and a portion of the base portion 21A is made of a metal. Among metals, invar or kovar is suitable as the material of the high Young's modulus layer 2h from the viewpoints of high rigidity, low thermal expansion coefficient, and ease of processing.

[0088] Depending on the application of the liquid ejection head, there is a risk that the metal components of the high Young's modulus layer 2h may dissolve into the ink in the flow path 22. In the second embodiment, in order to prevent the metal components of the high Young's modulus layer 2h from dissolving into the ink in the flow path 22, at least the inner surface of the high Young's modulus layer 2h, which is the base of the frame portion 21Aw, is coated with a coating member 201.

[0089] The material of the coating member 201 is preferably an organic material with high chemical resistance that matches the ink material, such as a paraxylene-based polymer.

[0090] It is preferable that thickness T4 of coating member 201 be smaller than thickness T3 (FIG. 2) of adhesive portion 3. This is because if thickness T4 of coating member 201 is equal to or larger than thickness T3 of adhesive portion 3, the effect of correcting warpage of chip unit 1 will be reduced.

[0091] As described above, according to the second embodiment, similarly to the first embodiment, it is possible to reduce deformation of the discharge surface 15 of the chip unit 1 and improve the landing accuracy of the liquid discharged from each discharge nozzle N. That is, according to the second embodiment, a technique advantageous for improving the landing accuracy of the liquid is provided.

[0092] [Third embodiment] The third embodiment will be described below. Elements with the same reference symbols as those in the first or second embodiment will have substantially the same configurations and functions as those described in the first or second embodiment unless otherwise specified, and differences from the first and second embodiments will be mainly described.

[0093] Figure 10(a) is an explanatory diagram of a liquid supply unit 2B of a liquid ejection head according to Embodiment 3. Figure 10(a) shows a plan view of the liquid supply unit 2B as viewed in the negative direction of the Z axis.

[0094] The liquid supply unit 2B has a base 21 and a plurality of wall portions arranged in a recess 26 of the base 21 at intervals from one another in the Y direction. The plurality of wall portions includes a group G1 consisting of two or more wall portions 23, at least one wall portion 23X1 arranged at an interval from the group G1 in the positive direction of the Y axis, and at least one wall portion 23X2 arranged at an interval from the group G1 in the negative direction of the Y axis. The number of the at least one wall portion 23X1 is the same as the number of the at least one wall portion 23X2. The wall portion 23 is an example of a first wall portion. The wall portion 23X1 is an example of a second wall portion. The wall portion 23X2 is an example of a third wall portion.

[0095] The material of the wall 23X1 is preferably, for example, metal. The material of the wall 23X1 is preferably the same as the material of the high Young's modulus layer 2h of the frame 21w. The wall 23X2 has the same configuration as the wall 23X1.

[0096] 10(a), a virtual plane (virtual plane) V1 is defined. The virtual plane V1 is a virtual plane parallel to the XZ plane, i.e., a virtual plane perpendicular to the Y direction. The virtual plane V1 is a virtual plane passing through the center positions of the multiple wall portions 23, 23X1, and 23X2 in the Y direction. The two or more wall portions 23 are arranged symmetrically with respect to the virtual plane V1. The multiple wall portions 23, 23X1, and 23X2 are arranged symmetrically with respect to the virtual plane V1. With the above configuration, the difference in height in the Z direction among the multiple discharge nozzles N of the chip unit 1 is reduced. This improves the landing accuracy of the liquid discharged from each discharge nozzle N.

[0097] [Fourth embodiment] The fourth embodiment will be described. Below, elements with the same reference symbols as those in the first, second, or third embodiment will have substantially the same configurations and functions as those described in the first, second, or third embodiment unless otherwise specified, and differences from the first, second, and third embodiments will be mainly described.

[0098] Figure 10(b) is an explanatory diagram of a liquid supply unit 2C of a liquid ejection head according to Embodiment 4. Figure 10(b) shows a plan view of the liquid supply unit 2C as viewed in the negative direction of the Z axis.

[0099] The liquid supply unit 2C has a base 21 and a plurality of wall portions 23C arranged in a recess 26 of the base 21 at intervals in the Y direction. The wall portions 23C have the same configuration, and therefore, one wall portion 23C will be described below.

[0100] In the first embodiment, the case where the entire wall portion 23 is the low Young's modulus layer 2s has been described, but this is not limitative. A part of the wall portion 23C may be the low Young's modulus layer 2s.

[0101] The wall portion 23C includes a low Young's modulus layer 2s having a lower Young's modulus than the plate 134 (FIG. 4) and the high Young's modulus layer 2h (FIG. 2), and a block 21c made of a material different from that of the low Young's modulus layer 2s. The plate 134 is an example of a first portion. The high Young's modulus layer 2h is an example of a second portion. The low Young's modulus layer 2s is an example of a third portion. The block 21c is an example of a fourth portion.

[0102] The low Young's modulus layer 2s is preferably a resin block including a part or all of the end surface 27C of the wall portion 23C, and in the fourth embodiment, is a resin block including a part of the end surface 27C. The end surface 27C is the end surface of the wall portion 23C facing the joining surface 16 in FIG. 2 and is the end surface in contact with the adhesive portion 3. The thickness (height) of the low Young's modulus layer 2s in the Z direction is preferably greater than the thickness T3 (FIG. 2) of the adhesive portion 3 in the Z direction. The thickness (height) of the low Young's modulus layer 2s in the Z direction is preferably greater than 50 μm. Furthermore, the thickness (height) of the low Young's modulus layer 2s in the Z direction may be equal to or less than the thickness (height) of the wall portion 23C in the Z direction. In other words, the low Young's modulus layer 2s may extend in the Z direction over the entire Z direction of the wall portion 23C, or may extend in the Z direction over a part of the Z direction of the wall portion 23C. The material of the block 21c is, for example, metal. That is, the block 21c is a metal block.

[0103] The material of the block 21c is preferably the same as the material of the high Young's modulus layer 2h, so that the block 21c is formed integrally with the high Young's modulus layer 2h.

[0104] Even with the above-described configuration, according to the fourth embodiment, the landing accuracy of the liquid ejected from each ejection nozzle N is improved. Furthermore, the multiple wall portions 23C are arranged symmetrically with respect to the imaginary plane V1. This improves the landing accuracy of the liquid ejected from each ejection nozzle N.

[0105] [Fifth embodiment] The fifth embodiment will be described. Below, elements with the same reference symbols as those in the first, second, third, or fourth embodiment will have substantially the same configurations and functions as those described in the first, second, third, or fourth embodiment unless otherwise specified, and differences from the first, second, third, and fourth embodiments will be mainly described.

[0106] Fig. 11 is an explanatory diagram of a liquid supply unit 2D according to the fifth embodiment. Fig. 11 shows a schematic perspective view of the liquid supply unit 2D. Fig. 11 also shows the liquid supply unit 2D in a see-through manner, showing the configuration of a portion of the liquid supply unit 2D.

[0107] The liquid supply unit 2D has a base 21 and a plurality of wall portions 23D arranged in a recess 26 of the base 21 at intervals in the Y direction. The plurality of wall portions 23D have the same configuration, and therefore, one wall portion 23D will be described below.

[0108] In the first embodiment, the case where the entire wall portion 23 is the low Young's modulus layer 2s has been described, but this is not limitative. A part of the wall portion 23D may be the low Young's modulus layer 2s.

[0109] The wall portion 23D has a coating member 21d made of a low Young's modulus layer 2s having a Young's modulus lower than that of each of the plate 134 (FIG. 4) and the high Young's modulus layer 2h, and a base 20d made of a material different from that of the low Young's modulus layer 2s. The plate 134 is an example of a first portion. The high Young's modulus layer 2h is an example of a second portion. The coating member 21d (low Young's modulus layer 2s) is an example of a third portion and an example of a first coating member. The base 20d is an example of a fourth portion.

[0110] The coating member 21d is disposed on the surface of the base body 20d. The coating member 21d includes a part or all of the end surface 27D of the wall portion 23D, and in the fifth embodiment, the entire end surface 27D. The end surface 27D is the end surface of the wall portion 23D facing the joining surface 16 in FIG. 2 and is the end surface that contacts the adhesive portion 3.

[0111] The material of the base body 20d is, for example, a metal. The material of the base body 20d is the same as the material of the high Young's modulus layer 2h. The base body 20d is formed integrally with the high Young's modulus layer 2h.

[0112] The coating member 21d is made of, for example, a resin, and the resin is preferably a polyether ether ketone resin, a polyphenylene sulfide resin, or a paraxylene-based polymer.

[0113] In order to offset deformation caused by the adhesive portion 3 with deformation caused by the coating member 21d, the Z-direction thickness T5 of the coating member 21d is preferably greater than the Z-direction thickness T3 (FIG. 2) of the adhesive portion 3. The Z-direction thickness T5 of the coating member 21d is preferably greater than 50 μm.

[0114] Even with the above-described configuration, according to the fifth embodiment, the landing accuracy of the liquid ejected from each ejection nozzle N is improved.

[0115] [Sixth embodiment] The sixth embodiment will be described below. Elements with the same reference symbols as those in the first, second, third, fourth, or fifth embodiment will have substantially the same configurations and functions as those described in the first, second, third, fourth, or fifth embodiment unless otherwise specified, and differences from the first, second, third, fourth, and fifth embodiments will be mainly described.

[0116] Fig. 12 is an explanatory diagram of a liquid supply unit 2E according to the sixth embodiment. Fig. 12 shows a schematic perspective view of the liquid supply unit 2E. Fig. 12 also shows the liquid supply unit 2E with a see-through view of the configuration of a portion of the liquid supply unit 2E.

[0117] The liquid supply unit 2E has a base 21 and a plurality of wall portions 23E arranged in a recess 26 of the base 21 at intervals in the Y direction. The plurality of wall portions 23E have the same configuration, and therefore, one wall portion 23E will be described below.

[0118] In the first embodiment, the case where the entire wall portion 23 is the low Young's modulus layer 2s has been described, but this is not limitative. A part of the wall portion 23E may be the low Young's modulus layer 2s.

[0119] The wall portion 23E has a base 20e made of a low Young's modulus layer 2s having a Young's modulus lower than that of each of the plate 134 (FIG. 4) and the high Young's modulus layer 2h, and a coating member 21e made of a material different from that of the low Young's modulus layer 2s. The plate 134 is an example of a first portion. The high Young's modulus layer 2h is an example of a second portion. The base 20e (low Young's modulus layer 2s) is an example of a third portion. The coating member 21e is an example of a fourth portion and an example of a second coating member.

[0120] The coating member 21e is disposed on the surface of the base body 20e. The coating member 21e includes a part or all of the end face 27E of the wall portion 23E, and in the sixth embodiment, the entire end face 27E. The end face 27E is the end face of the wall portion 23E facing the joining surface 16 in FIG. 2 and is the end face that contacts the adhesive portion 3.

[0121] The base 20e is made of, for example, a resin, and the resin is preferably a polyether ether ketone resin, a polyphenylene sulfide resin, or a paraxylene-based polymer.

[0122] The coating member 21e is made of, for example, an inorganic material. The thickness T6 of the coating member 21e in the Z direction is preferably 100 nm or more and less than 1 μm, from the viewpoint of offsetting deformation due to the adhesive portion 3 with deformation due to the base body 20e.

[0123] Even with the above-described configuration, according to the sixth embodiment, the landing accuracy of the liquid ejected from each ejection nozzle N is improved.

[0124] <Embodiments of manufacturing methods of articles> In this embodiment, an article is manufactured using the liquid ejection device described above. The article may be an intermediate product or a final product. The article manufacturing method according to this embodiment is suitable for manufacturing an article such as an organic light-emitting diode (OLED) panel using an inkjet printing device. The article manufacturing method according to this embodiment includes a step (coating step) of depositing or applying a solution film (a solution containing a solute and a solvent for forming an organic film) on a substrate by a printing method using an inkjet printing device or the like to obtain a coated substrate. The method also includes a step (drying step) of drying the solution film on the coated substrate to obtain a dry substrate on which a dry film has been formed. Furthermore, this manufacturing method includes other well-known steps (such as baking, cooling, dehumidification, dry cleaning, electrode formation, and sealing film formation). The article manufacturing method according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0125] [Other variations] The present disclosure is not limited to the above-described embodiments, and many modifications of the embodiments are possible within the technical concept of the present disclosure. For example, at least two of the above-described embodiments and modifications may be combined. Furthermore, the effects described in the present embodiments are merely a list of the most preferable effects resulting from the embodiments of the present disclosure, and the effects of the embodiments of the present disclosure are not limited to those described in the present embodiments.

[0126] For example, the liquid supply unit may have at least two of the wall 23 of the first embodiment, the wall 23C of the fourth embodiment, the wall 23D of the fifth embodiment, and the wall 23E of the sixth embodiment.

[0127] The above-described embodiments have been described as being applied to the production of displays including organic EL panels, but are not limited to this, and the above-described embodiments can also be applied to the production of displays including liquid crystal panels, for example.

[0128] The disclosure of the above embodiments includes the following sections.

[0129] (Section 1) a first unit having a first portion including a discharge nozzle opening in a first surface and a second surface opposite to the first surface; a second unit attached to the second surface by an adhesive portion and configured to supply a liquid to the first unit; the second unit is thicker than the first unit in a first direction perpendicular to the first surface, the second unit has a frame portion overlapping the first unit in the first direction and a wall portion disposed inside the frame portion, the frame has a second portion; the frame portion and the wall portion are bonded to the second surface by the adhesive portion; the wall portion has a third portion having a Young's modulus lower than the Young's modulus of each of the first portion and the second portion; A liquid ejection head characterized by:

[0130] (Section 2) a space in which the liquid supplied to the first unit is disposed is defined by being sandwiched between the frame portion, the wall portion, and the first unit; Item 1. A liquid ejection head according to item 1.

[0131] (Section 3) The Young's modulus of the first portion is 100 GPa or more. 3. The liquid ejection head according to item 1 or 2, characterized in that:

[0132] (Section 4) The first portion contains silicon as a major component. 4. The liquid ejection head according to any one of items 1 to 3, characterized in that:

[0133] (Section 5) The Young's modulus of the second portion is 100 GPa or more. 5. The liquid ejection head according to any one of items 1 to 4, characterized in that:

[0134] (Section 6) The second part contains a metal as a main component. 6. The liquid ejection head according to any one of items 1 to 5, characterized in that:

[0135] (Section 7) The metal is Invar or Kovar; Item 7. A liquid ejection head according to item 6, characterized in that:

[0136] (Section 8) The Young's modulus of the third portion is 0.001 GPa or more and 20 GPa or less. 8. The liquid ejection head according to any one of items 1 to 7, characterized in that:

[0137] (Section 9) The third part contains a resin as a main component. 9. The liquid ejection head according to any one of items 1 to 8, characterized in that:

[0138] (Section 10) The resin includes a polyether ether ketone resin, a polyphenylene sulfide resin, or a paraxylene-based polymer. Item 10. A liquid ejection head according to item 9, characterized in that:

[0139] (Section 11) The thickness of the third portion in the first direction is greater than the thickness of the adhesive portion in the first direction. 11. The liquid ejection head according to any one of items 1 to 10, characterized in that:

[0140] (Section 12) The thickness of the third portion in the first direction is greater than 50 μm. 12. The liquid ejection head according to any one of items 1 to 11, characterized in that:

[0141] (Section 13) The entire wall portion is the third portion. 13. The liquid ejection head according to any one of items 1 to 12, characterized in that:

[0142] (Section 14) the wall portion includes a fourth portion made of a material different from that of the third portion; 13. The liquid ejection head according to any one of items 1 to 12, characterized in that:

[0143] (Section 15) the fourth portion is a base of the wall portion, and the third portion is a first coating member disposed on a surface of the base. Item 15. A liquid ejection head according to item 14, characterized in that:

[0144] (Section 16) The third portion includes a part or the whole of the end surface of the wall portion facing the second surface. Item 16. A liquid ejection head according to item 14 or 15.

[0145] (Section 17) The material of the fourth portion is metal. 17. The liquid ejection head according to any one of items 14 to 16,

[0146] (Section 18) The material of the fourth portion is the same as the material of the second portion. 18. The liquid ejection head according to any one of items 14 to 17,

[0147] (Section 19) the third portion is a substrate of the wall portion, and the fourth portion is a second coating member disposed on a surface of the substrate. Item 15. A liquid ejection head according to item 14, characterized in that:

[0148] (Section 20) The thickness of the second coating member is 100 nm or more and less than 1 μm. 20. A liquid ejection head according to item 19, characterized in that:

[0149] (Section 21) The material of the second coating member is an inorganic material. 21. A liquid ejection head according to item 19 or 20, characterized in that

[0150] (Section 22) The entire frame portion is the second portion. 22. The liquid ejection head according to any one of items 1 to 21, characterized in that:

[0151] (Section 23) the frame includes a third coating member disposed on the second portion; 23. The liquid ejection head according to any one of items 1 to 22, characterized in that

[0152] (Section 24) the thickness of the third coating member is smaller than the thickness of the adhesive portion; 24. A liquid ejection head according to item 23, characterized in that:

[0153] (Section 25) the material of the third coating member is a paraxylene-based polymer; 25. A liquid ejection head according to item 23 or 24, characterized in that

[0154] (Section 26) the second unit has two or more wall portions disposed inside the frame portion and spaced apart from each other in a second direction perpendicular to the first direction; 26. The liquid ejection head according to any one of items 1 to 25,

[0155] (Section 27) The two or more wall portions are arranged symmetrically with respect to a virtual plane perpendicular to the second direction. 27. A liquid ejection head according to item 26, characterized in that:

[0156] (Section 28) the wall portion is a first wall portion, the second unit has at least one second wall portion disposed inside the frame portion and spaced apart from the group including the two or more first wall portions in the second direction; 28. A liquid ejection head according to item 26 or 27, characterized in that

[0157] (Section 29) a holder for holding an object; and the liquid ejection head according to any one of items 1 to 28, which ejects liquid onto the object held by the holding unit. A liquid ejection device characterized by:

[0158] (Section 30) Item 30. A method for manufacturing an article, comprising discharging a liquid onto a substrate using the liquid discharge device according to Item 29. [Explanation of symbols]

[0159] N...discharge nozzle, 1...chip unit (first unit), 2...liquid supply unit (second unit), 2h...high Young's modulus layer (second portion), 2s...low Young's modulus layer (third portion), 3...adhesive portion, 15...discharge surface (first surface), 16...bonding surface (second surface), 21w...frame portion, 23...wall portion, 100...liquid discharge device, 103...liquid discharge head, 134...plate (first portion)

Claims

1. a first unit having a first portion including a discharge nozzle opening in a first surface and a second surface opposite to the first surface; a second unit attached to the second surface by an adhesive portion and configured to supply a liquid to the first unit; the second unit is thicker than the first unit in a first direction perpendicular to the first surface, the second unit has a frame portion overlapping the first unit in the first direction and a wall portion disposed inside the frame portion, the frame has a second portion; the frame portion and the wall portion are adhered to the second surface by the adhesive portion; the wall portion has a third portion having a Young's modulus lower than the Young's modulus of each of the first portion and the second portion; A liquid ejection head characterized by:

2. a space in which the liquid supplied to the first unit is disposed is defined by being sandwiched between the frame portion, the wall portion, and the first unit; 2. The liquid ejection head according to claim 1.

3. The Young's modulus of the first portion is 100 GPa or more.

2. The liquid ejection head according to claim 1.

4. The first portion contains silicon as a major component.

2. The liquid ejection head according to claim 1.

5. The Young's modulus of the second portion is 100 GPa or more.

2. The liquid ejection head according to claim 1.

6. the second portion contains metal as a major component; 2. The liquid ejection head according to claim 1.

7. The metal is Invar or Kovar; 7. A liquid ejection head according to claim 6.

8. The Young's modulus of the third portion is 0.001 GPa or more and 20 GPa or less.

2. The liquid ejection head according to claim 1.

9. The third part contains a resin as a main component.

2. The liquid ejection head according to claim 1.

10. The resin includes a polyether ether ketone resin, a polyphenylene sulfide resin, or a paraxylene-based polymer.

10. The liquid ejection head according to claim 9.

11. a thickness of the third portion in the first direction being greater than a thickness of the adhesive portion in the first direction; 2. The liquid ejection head according to claim 1.

12. The thickness of the third portion in the first direction is greater than 50 μm.

2. The liquid ejection head according to claim 1.

13. The entire wall portion is the third portion.

2. The liquid ejection head according to claim 1.

14. the wall portion includes a fourth portion made of a material different from that of the third portion; 2. The liquid ejection head according to claim 1.

15. the fourth portion is a base of the wall portion, and the third portion is a first coating member disposed on a surface of the base.

15. The liquid ejection head according to claim 14.

16. The third portion includes a part or the whole of an end surface of the wall portion facing the second surface.

15. The liquid ejection head according to claim 14.

17. The material of the fourth portion is metal.

15. The liquid ejection head according to claim 14.

18. The material of the fourth portion is the same as the material of the second portion.

15. The liquid ejection head according to claim 14.

19. the third portion is a substrate of the wall portion, and the fourth portion is a second coating member disposed on a surface of the substrate.

15. The liquid ejection head according to claim 14.

20. The thickness of the second coating member is 100 nm or more and less than 1 μm.

20. The liquid ejection head according to claim 19.

21. the second coating member is made of an inorganic material; 20. The liquid ejection head according to claim 19.

22. The entire frame portion is the second portion.

2. The liquid ejection head according to claim 1.

23. the frame includes a third coating member disposed on the second portion.

2. The liquid ejection head according to claim 1.

24. the thickness of the third coating member is smaller than the thickness of the adhesive portion; 24. The liquid ejection head according to claim 23.

25. the third coating member is made of a paraxylene-based polymer; 24. The liquid ejection head according to claim 23.

26. the second unit has two or more wall portions disposed inside the frame portion and spaced apart from each other in a second direction perpendicular to the first direction; 2. The liquid ejection head according to claim 1.

27. the two or more wall portions are arranged symmetrically with respect to a virtual plane perpendicular to the second direction, 27. A liquid ejection head according to claim 26.

28. the wall portion is a first wall portion, the second unit has at least one second wall portion disposed inside the frame portion and spaced apart from the group including the two or more first wall portions in the second direction; 27. A liquid ejection head according to claim 26.

29. a holder for holding an object; and the liquid ejection head according to any one of claims 1 to 28, which ejects liquid onto the object held by the holding section. A liquid ejection device characterized by:

30. A method for manufacturing an article, comprising discharging a liquid onto a substrate using the liquid discharge device according to claim 29.

Images