Thermal circuit system

Abstract

To provide a heat regeneration system for regenerating a heat source required for a process with waste heat.SOLUTION: A heat regeneration system converts into required high-temperature heat and low-temperature heat by using hot waste heat and cold waste heat generated from a process. The heat regeneration system includes: a) a thermal amplifier 4 housing an absorbent material which uses hot waste heat as absorbent heat; b) a thermal battery 5 housing a latent heat storage material which stores its output heat; c) a thermal transistor 2 which takes out heat that has been increased by absorption of evaporation water in a high-pressure absorber into absorbent liquid via a heat exchanger and outputs the heat as high-temperature heat, and cools cold waste heat generated from a low-temperature process 7 with water evaporation latent heat by evaporating water in a low-pressure evaporator and outputs low-temperature heat, and regenerates the absorbent liquid using latent heat of the latent heat storage material; and d) a thermal booster 3 which increases a temperature of high-temperature heat through hydration reaction of a chemical heat storage material, stores heat through dehydration reaction of the chemical heat storage material by using high-temperature heat, promotes regeneration of the chemical heat storage material by condensing steam generated by the dehydration reaction using the low-temperature heat, and obtains a heat source required for a process.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a heat regeneration system (hereinafter referred to as a "thermal circuit system") that uses waste heat from processes such as heating and cooling and converts it into a heat source required for the process. [Background technology]

[0002] Currently, industrial sectors, particularly the materials industry, use fossil fuels and electricity as heat sources for material production. However, as carbon neutrality is required, heat sources that do not use fossil fuels are also needed. Industries that require a heat source of around 1000°C, such as the steel industry, must rely on ammonia or hydrogen combustion, while the food processing and chemical industries mainly use heat sources of around 200°C, and storage issues and the use of toxic fuels are not optimal solutions. Furthermore, the materials industry requires not only high-temperature processes such as heating using fossil fuels, but also low-temperature processes for cooling below room temperature, but the cold energy is currently provided by electricity. Therefore, it is urgent to achieve carbon neutrality for both high-temperature and low-temperature processes.

[0003] Heat pumps collect heat using a small amount of energy and use it as a large amount of thermal energy, and are used to save power in high-temperature and low-temperature processes, with examples of chemical heat pumps being disclosed in Patent Documents 1 and 2, absorption heat pumps being disclosed in Patent Documents 3 and 4, and adsorption heat pumps being disclosed in Patent Document 5. Furthermore, latent heat storage materials that can utilize phase-change substances with a phase transition point of 80°C or higher are known (Patent Document 6). However, there is no system that can regenerate the heat source needed for high-temperature and low-temperature processes using waste heat from those processes and achieve carbon neutrality. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2019-158299 [Patent Document 2] Japanese Patent Application Laid-Open No. 2016-118379 [Patent Document 3] Japanese Patent Application Laid-Open No. 2004-270994 [Patent Document 4] Japanese Patent Application Laid-Open No. 2006-112686 [Patent Document 5] Japanese Patent Application Publication No. 9-318193 [Patent Document 6] Patent No. 6332812 Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the above circumstances, an object of the present invention is to provide a heat regeneration system (thermal circuit system) that regenerates a heat source required for a process using waste heat from the process. [Means for solving the problem]

[0006] In order to solve the above problems, the thermal circuit system of the present invention is a heat regeneration system that uses waste heat from a high-temperature process and converts it into a high-temperature heat source required for the process, and is composed of a first heat pump, a second heat pump, and a third heat pump, where the first heat pump heats the waste heat, the second heat pump further heats the heat output from the first heat pump to output it as high-temperature heat and also outputs low-temperature heat using the waste heat as a heat source, and the third heat pump further heats the high-temperature heat, and the heat source required for the process is regenerated using the waste heat from the process, thereby achieving carbon neutrality.

[0007] Here, a high-temperature process is one that requires a heat source of 200°C or higher, and includes many material creation processes such as plastic molding. The hot waste heat generated from a high-temperature process is 70-100°C. The first heat pump raises the temperature of the hot waste heat to 70-100°C, and the second heat pump further raises the temperature of the heat output from the first heat pump, outputting it as high-temperature heat of 100-150°C, while cooling the cold waste heat and outputting it as low-temperature heat of 5-10°C. Finally, the third heat pump raises the temperature to 200-300°C, the temperature required as a heat source for many material creation processes such as plastic molding. Generally, it is difficult for an absorption heat pump to heat up to above 130°C. However, in this system, the first heat pump heats up the hot waste heat, the second heat pump further heats up the heat from the first heat pump and outputs it as high-temperature heat, and the cold waste heat is cooled and output as low-temperature heat, and the third heat pump further heats up the high-temperature heat, thereby raising the temperature of waste heat from 70 to 100°C to 200 to 300°C.

[0008] In the thermal circuit system of the present invention, it is preferable to provide a heat storage tank containing a latent heat storage material that stores the output heat of the first heat pump and stabilizes the temperature of the heat supplied to the second heat pump. Not only does this stabilize the temperature of the heat supplied to the second heat pump, but it also has the effect of enabling the system to quickly start up when operation begins the next day if the temperature can be maintained for half a day (about 12 hours) after the system has stopped.

[0009] In the thermal circuit system of the present invention, the first heat pump may be an adsorption heat pump containing an adsorbent that uses hot waste heat as adsorption heat. The second heat pump may be an absorption heat pump that uses water evaporated in a high-pressure absorber to be absorbed by an absorbing liquid, and outputs the resulting heat as high-temperature heat via a heat exchanger, while evaporating water in a low-pressure evaporator to cool the cold waste heat from the low-temperature process using the latent heat of water evaporation and outputting it as low-temperature heat, and regenerates the absorbing liquid using the latent heat of the latent heat storage material. The third heat pump may be a chemical heat pump that uses the reaction heat of the hydration reaction of a chemical heat storage material to heat high-temperature heat, stores the high-temperature heat through a dehydration reaction of the chemical heat storage material using the high-temperature heat, and condenses the steam generated by the dehydration reaction using the low-temperature heat to promote regeneration of the chemical heat storage material.

[0010] According to this configuration, waste heat and waste cold heat from high-temperature and low-temperature processes can be used to regenerate heat by converting it into high-temperature and low-temperature heat required for the processes. From the viewpoint of expandability, it is preferable to use an adsorption heat pump for the first heat pump, an absorption heat pump for the second heat pump, and a chemical heat pump for the third heat pump, but it is also possible to replace the absorption heat pump with a chemical heat pump, and furthermore, it is also possible to replace the third heat pump with an adsorption heat pump. However, since adsorption heat pumps take time to regenerate, it is necessary to prepare several regenerators.

[0011] The first and second heat pumps generate steam at 100-150°C and cold energy at 5-10°C from hot waste heat at 70-100°C and cold waste heat at 10-15°C. The third heat pump then generates steam at 200-300°C and cold energy at 6-11°C from steam at 100-150°C and cold energy at 5-10°C. The combination of the first, second, and third heat pumps makes it possible to generate steam at 200-300°C. Furthermore, the hot waste heat (70-100°C) and cold waste heat (12-20°C) discharged after use in the high-temperature and low-temperature processes are converted into a hot heat source of 80-100°C in the first heat pump, which uses heat of adsorption, and after stabilization in a heat storage tank using latent heat storage material, the heat is regenerated again in the thermal circuit system. The thermal circuit system is a closed circuit, requiring no energy other than the power of the pump for liquid transport, and is a system that does not discharge waste heat. With this system configuration, the hot and cold waste heat discharged in the high-temperature process and the low-temperature process can be regenerated using the heat of absorption, heat of reaction, heat of adsorption, and latent heat, making it possible to simultaneously regenerate the high-temperature and low-temperature heat required for the high-temperature and low-temperature processes from the hot and cold waste heat.

[0012] In the thermal circuit system of the present invention, the latent heat storage material in the heat storage tank is preferably microcapsules containing non-porous hollow silica particles encapsulating a phase change substance that absorbs and releases latent heat in response to temperature changes. By using these microcapsules as the latent heat storage material, the supercooling phenomenon disappears, so the temperature inside the heat storage tank is kept constant and the temperature of the waste heat is stabilized. Furthermore, by aggregating the microcapsules and cross-linking the microcapsules with graphite, the heat transfer characteristics are improved, and a heat storage tank with higher temperature stability can be formed.

[0013] In the thermal circuit system of the present invention, the only externally supplied energy is the power for the liquid pump and the electricity for control, and there is no externally supplied heat, and the hot and cold waste heat generated from the process is consumed within the system itself, so there is no need for waste heat treatment. [Effects of the Invention]

[0014] The thermal circuit system of the present invention has the advantage of regenerating the heat source required for the process using waste heat from the process, securing an industrial heat source without using fossil fuels or electricity other than that for pump power, and achieving carbon neutrality.Furthermore, the thermal circuit system of the present invention has the advantage of eliminating the need for waste heat treatment because it does not emit waste heat. [Brief explanation of the drawings]

[0015] [Figure 1] Schematic diagram of the thermal circuit system of the present invention [Figure 2] Thermal transistor diagram [Figure 3] Thermal booster diagram [Figure 4] Thermal booster operation diagram [Figure 5] Thermal amplifier diagram [Figure 6] Thermal battery diagram [Figure 7] Thermal circuit system configuration diagram [Figure 8] Another embodiment of the thermal circuit system configuration 1 [Figure 9] Another embodiment 2 of the thermal circuit system configuration DETAILED DESCRIPTION OF THE INVENTION

[0016] (Thermal Circuit System) This paper provides a detailed explanation of a thermal circuit system that uses absorption heat, reaction heat, adsorption heat, and latent heat to regenerate the hot and cold waste heat emitted in high-temperature and low-temperature processes, and simultaneously regenerates the high-temperature and low-temperature heat sources required for the high-temperature and low-temperature processes from the hot and cold waste heat. Hereinafter, the first heat pump containing an adsorbent that uses warm waste heat as adsorption heat will be referred to as a "thermal amplifier" in this specification. The thermal amplifier is an adsorption heat pump that includes an adsorber containing a porous adsorbent such as zeolite and a regenerator that regenerates the adsorbent. The adsorber takes in warm waste heat as adsorption heat, and is used to raise the temperature of the cooled waste heat. Furthermore, the heat storage tank containing the latent heat storage material that stores the output heat of the first heat pump (thermal amplifier) ​​will be referred to as the "thermal battery" in the rest of this specification. The thermal battery stabilizes the temperature of the waste heat by selecting a latent heat storage material that keeps the temperature inside the heat storage tank constant.

[0017] The second heat pump, which uses the latent heat of the latent heat storage material to regenerate the absorbing liquid by evaporating water in a high-pressure absorber and extracting the resulting heat in a heat exchanger and outputting it as high-temperature heat, and which also evaporates water in a low-pressure evaporator and cools the cold waste heat from the low-temperature process using the latent heat of water evaporation and outputs it as low-temperature heat, is hereinafter referred to as a "thermal transistor" in this specification.

[0018] In addition, the third heat pump, which raises the temperature of high-temperature heat using the heat of reaction from the hydration reaction of the chemical heat storage material, uses the high-temperature heat to store heat through the dehydration reaction of the chemical heat storage material, and uses low-temperature heat to condense the steam generated by the dehydration reaction to promote the regeneration of the chemical heat storage material, thereby obtaining the high-temperature and low-temperature heat sources required for the process, is referred to in this specification as a "thermal booster." The thermal booster utilizes the hydration reaction of the chemical heat storage material, but when the hydration reaction becomes saturated, a dehydration reaction must occur to regenerate the chemical heat storage material. This requires regeneration heat, which is achieved by using some of the high-temperature steam generated by the thermal transistor. The dehydrated steam also needs to be condensed into water, and cold water obtained from the low-temperature heat generated by the thermal transistor is used for this condensation.

[0019] The thermal circuit system of the present invention is a heat regeneration system that converts waste heat of about 80 to 100°C into steam of 200 to 300°C and cold heat of 5 to 10°C. The thermal circuit is an electrical circuit that uses heat as if it were an electrical circuit, and is composed of a thermal transistor that continuously generates high-temperature heat of 100 to 150°C and low-temperature heat of 5 to 10°C from hot waste heat of 70 to 100°C and cold waste heat of 12 to 20°C, a thermal booster that further raises the high-temperature heat of 100 to 150°C to 200 to 300°C, and a thermal amplifier and thermal battery for steadily supplying hot waste heat of 70 to 100°C. The configurations of the thermal transistor, thermal booster, thermal amplifier, and thermal battery will be described below.

[0020] (thermal transistor) A thermal transistor uses waste heat at 70 to 100°C to continuously generate high-temperature heat at 100 to 150°C and low-temperature heat at 5 to 10°C. For example, an absorption heat pump can be used as a thermal transistor. There are two types of absorption heat pumps, and of these, the second-class absorption heat pump uses the input heat source temperature (T W ), output high temperature heat source temperature (T H ), output low temperature heat source temperature (T L ), then T H >T W >T L In other words, the output high-temperature heat source temperature T H is the input heat source temperature T W It uses waste heat at 80-100°C to generate high-temperature heat at 100-150°C, while also generating low-temperature heat at 5-10°C.

[0021] (thermal booster) In a thermal booster, the high-temperature heat output from a thermal transistor of 100-150°C is further heated to 200-300°C and used as a high-temperature heat source for high-temperature processes. A thermal booster uses a chemical heat storage material to raise the temperature through a hydration reaction, and is a known chemical heat pump specialized for heating.

[0022] First, steam at 100 to 150°C generated by the thermal transistor is introduced into a high-pressure (e.g., 0.1 MPa) reactor, and the heat of the hydration reaction is used to raise the temperature to 200 to 300°C. The reaction of the chemical thermal storage material stops when it reaches saturation, so it is dehydrated and regenerated in a regenerator. The regenerator regenerates the chemical thermal storage material at low pressure (e.g., 1.5 kPa) using steam at 100 to 150°C obtained by the thermal transistor.

[0023] In addition, steam at 100-150°C obtained from the thermal transistor is used to supply water vapor to the reactor. Because both methods use condensation heat, the consumption of the 100-150°C steam obtained from the thermal transistor is about 10%, and the remaining 90% or so can be supplied to the high-temperature process as steam at 200-300°C.

[0024] Meanwhile, the regenerator condenses the water vapor produced by the dehydration reaction, which requires low-temperature heat. This low-temperature heat is approximately 7°C obtained from the thermal transistor, but heat balance calculations show that the temperature of the low-temperature heat only rises by about 1°C, so low-temperature heat of around 6 to 11°C can be supplied directly to the low-temperature process.

[0025] The thermal transistor generates 70-80°C of waste heat, the thermal booster generates 80-100°C of waste heat, and the high-temperature process generates 80-100°C of waste heat. This system reuses this waste heat. A thermal amplifier and a thermal battery are used to keep the temperature of the waste heat constant and stabilize it.

[0026] (thermal amplifier) A thermal amplifier is a heat pump that uses the heat of adsorption of porous materials such as zeolite to stabilize the supply of waste heat. In principle, a thermal amplifier can raise the temperature up to about 300°C, but it is difficult to directly obtain high-temperature steam because it takes time for water molecules to desorb. Here, it is used to raise the temperature of low-temperature waste heat (below 70-80°C) up to 80°C. In this case, desorption of water molecules can be easily achieved by reducing the pressure, even with low-temperature waste heat.

[0027] (thermal battery) A thermal battery is a heat storage tank that uses a latent heat storage material. Conventional latent heat storage materials have the problem of supercooling, and have not been used for temperature stabilization. In particular, inorganic hydrates, which are highly safe and stable and ideal for waste heat recovery, have the problem of supercooling by several tens of degrees Celsius. It is already known that the supercooling phenomenon in inorganic hydrate-based heat storage materials can be eliminated. By using such materials as latent heat storage materials, the temperature inside the heat storage tank can be maintained constant, thereby stabilizing the temperature of the waste heat. Furthermore, by introducing a thermal battery, it is possible to prevent the heat source from cooling down once the thermal circuit system is shut down. This allows for rapid heat supply when restarting. A thermal amplifier and thermal battery can stabilize heat supply over the long term.

[0028] In a thermal circuit system, waste heat is supplied within a closed circuit, so there is no external heat input, except for the room-temperature cooling water used for cooling. The only external energy inputs are the pump power for the liquid supply and control power. This power-based COP is over 20, making it a revolutionary system compared to current electric heat pumps (COP of about 3), heaters (COP of about 1), and gas-fired boilers (COP of about 0.8). Furthermore, if roughly half of the resulting high-temperature heat is converted into electricity by combining it with a binary system with a thermoelectric conversion efficiency of about 10%, the electricity consumed by the pump can be supplied as waste heat. This makes it possible to build a thermal management system in a completely closed system that does not require electricity or fossil fuels.

[0029] In addition, the thermal circuit can change the ratio of high-temperature and low-temperature heat by changing the operating conditions. By switching the flow of the absorption liquid, it is possible to meet demand for high-temperature or low-temperature heat only, and by installing thermal batteries for each temperature range, it is possible to respond to fluctuations in process load without shutting down the system.

[0030] An example of an embodiment of the present invention will be described in detail below with reference to the drawings. Note that the scope of the present invention is not limited to the following examples and illustrated examples, and many modifications and variations are possible. [Example]

[0031] Figure 1 shows one embodiment of the configuration of a thermal circuit system. Thermal circuit system 1 is a heat regeneration system that uses waste heat (70-100°C) from a high-temperature process 6 and waste heat (12°C) from a low-temperature process 7 to convert them into the high-temperature and low-temperature heat required for high-temperature process 6 and low-temperature process 7. As shown in Figure 1, thermal circuit system 1 is composed of a thermal transistor 2 that generates high-temperature heat (120°C) and low-temperature heat (7°C) from waste heat (70-100°C), a thermal booster 3 that further raises the temperature of the 120°C high-temperature heat to 250°C, a thermal amplifier 4 that provides a stable supply of waste heat to the system, and a thermal battery 5. The thermal amplifier 4 contains an adsorbent and uses the 70-100°C waste heat as adsorption heat to raise the temperature of the waste heat. The thermal transistor 2 absorbs the water evaporated in the high-pressure absorber into an absorbing liquid, extracts the resulting heat using a heat exchanger, and outputs it as high-temperature heat. At the same time, the thermal transistor 2 evaporates water in a low-pressure evaporator, cools the cold waste heat from the low-temperature process using the latent heat of water evaporation, and outputs it as low-temperature heat. The latent heat of the latent heat storage material is used to regenerate the absorbing liquid. The thermal booster 3 raises the temperature of the high-temperature heat using the reaction heat of the hydration reaction of the chemical heat storage material, uses the high-temperature heat to store heat through the dehydration reaction of the chemical heat storage material, and uses the low-temperature heat to condense the steam generated by the dehydration reaction, promoting the regeneration of the chemical heat storage material.

[0032] As shown in Figure 2, the thermal transistor 2 uses a high-concentration absorbing solution to absorb water evaporated in a high-pressure absorber 21 (e.g., 42 kPa). The absorbing solution can be, for example, a lithium bromide (LiBr) solution. The absorbing solution heats up to approximately 130°C. This heat is then transferred to a waste heat of approximately 80°C (heated to 80.5°C by heat exchange with the absorbing solution) and extracted via a heat exchanger, resulting in high-temperature steam heat of approximately 120°C. Subsequently, low-temperature heat of 7°C is obtained in a low-pressure absorber 22 (e.g., 0.8 kPa). The low-concentration absorbing solution is regenerated into a high-concentration solution in a regenerator (e.g., 38 kPa). In this way, high-temperature heat of approximately 120°C and low-temperature heat of approximately 7°C can be continuously obtained using the waste heat of approximately 80°C, which is the output of the thermal battery 5, without using gas or external power.

[0033] The thermal booster 3 uses a chemical heat storage material to raise the temperature through a hydration reaction, and is a known chemical heat pump specialized for raising the temperature. As shown in FIG. 3, high-temperature water (steam) at approximately 120°C generated by the thermal transistor 2 is introduced into a reactor 31 (e.g., 0.1 MPa) and heated to approximately 250°C using the heat of the hydration reaction. The reaction of the chemical thermal storage material 31a stops when saturation is reached, so it must be dehydrated and regenerated. The regenerator 32 (e.g., 1.5 kPa) also uses the steam at approximately 120°C obtained by the thermal transistor 2 for regeneration. The evaporator 33, which supplies steam to the reactor 31, also uses the high-temperature water (steam) at approximately 120°C obtained from the thermal transistor 2. Because both systems use the heat of condensation, only about 10% of the high-temperature water (steam) at approximately 120°C obtained from the thermal transistor 2 is consumed, and the remaining 90% or so can be provided as steam at approximately 250°C as a high-temperature heat source for high-temperature processes. On the other hand, in the regenerator 32, low-temperature heat is required to condense the water vapor generated by the dehydration reaction in the condenser 34. This low-temperature heat is obtained from the thermal transistor 2 at a temperature of about 7°C. According to heat balance calculations, the temperature of the low-temperature heat rises by only about 1°C at most. This makes it possible to provide the low-temperature heat of about 8°C as a low-temperature heat source for the low-temperature process 7.

[0034] Here, a known chemical heat storage material can be used as the chemical heat storage material (31a, 32a) used in the thermal booster 3, and may be a chemical heat storage material alone, or a material in which particulate chemical heat storage material is bound with a water vapor permeable resin. Examples of chemical heat storage materials include calcium chloride and calcium sulfate, and one type may be used, or multiple types may be combined.

[0035] Next, the operation of the thermal booster 3 will be described with reference to FIG. 4. In order to continuously obtain steam at approximately 250°C, the thermal booster 3 controls the operation of the piping valves to alternately operate the reactor 31 and the regenerator 32. As shown in FIG. 4, high-temperature water (steam) at approximately 120°C output from the thermal transistor 2 (not shown) is sent to the regenerator 32 and used in the dehydration reaction of the chemical heat storage material, and then sent to the evaporator 33 and used to generate steam. In addition, low-temperature water at 7°C output from the thermal transistor 2 is sent to the condenser 34 and used to condense the steam generated by the dehydration reaction. The low-temperature water, heated to approximately 8°C by the heat of condensation, is provided as a low-temperature heat source. The high-temperature water at 120°C output from the thermal transistor 2 is sent to the reactor 31, where it is hydrated with steam from the evaporator 33 to obtain a high-temperature heat source of 250°C. Then, the valves in the piping are controlled so that the reactor 31 is replaced by the regenerator 32 and the evaporator 33 is replaced by the condenser 34. This makes it possible to continuously obtain steam at approximately 250°C (a high-temperature heat source for a high-temperature process) using high-temperature water (steam) at approximately 120°C without using gas or external electricity.

[0036] As shown in Figure 5, the thermal amplifier 4 is a heat pump consisting of an adsorber 41 and a regenerator 42. It utilizes the heat of adsorption generated when water vapor is adsorbed onto a porous adsorbent to raise the temperature of waste heat lowered to less than 70-80°C to approximately 80°C. Examples of adsorbent materials include zeolite, lithium hydroxide, magnesium sulfate, strontium oxalate, activated carbon, and porous metal-oxide-free (MOF). One type may be used, or multiple types may be combined. A material in which particulate adsorbent is bound with a water vapor-permeable resin may also be used. Here, a zeolite adsorbent is used to raise the temperature of waste heat using the heat of hydration.

[0037] As shown in Figure 6(1), the thermal battery 5 is a heat storage tank in which a latent heat storage material is encapsulated in microcapsules 5a and housed in a thermostatic tank 5b. Known microencapsulated latent heat storage materials include those in which a shell made of rubber, plastic, metal, or the like is filled with a latent heat material such as magnesium chloride, sodium chloride, paraffin, or naphthalene. To prevent the latent heat material from being released from the capsule (preventing sustained release), most materials are encapsulated in polymer capsules. This makes it difficult to use phase-change materials with a phase transition temperature above 80°C, and issues with mechanical strength and heat resistance have been identified. Therefore, by using nonporous hollow silica particles encapsulating a phase-change material as the microcapsules 5a, it is possible to use phase-change materials with a phase transition temperature above 80°C, thereby eliminating the mechanical strength and heat resistance issues.

[0038] Phase-change materials that can be used include organic substances such as pentaerythritol, polyethylene, and propionamide, which have a phase transition point in the temperature range of 80 to 200°C, as well as inorganic hydrates such as magnesium chloride and magnesium nitrate. Latent heat storage materials have the problem of supercooling, and have not been used for temperature stabilization. However, the use of inorganic hydrate-based heat storage materials can eliminate this problem. Since the temperature inside the thermal battery 5 is maintained constant, the temperature of the waste heat can be stabilized. Using the thermal battery 5 prevents the heat source from cooling down after the system is shut down, allowing for rapid heat supply upon restart.

[0039] 6(2), the microcapsules 5a in the thermostatic chamber 5b may be aggregated to form a microcapsule aggregate 5c. The individual microcapsules 5a are fixed to each other by graphite bridges 5d, improving the heat transfer characteristics and forming a heat storage chamber with higher temperature stability.

[0040] The results of a performance analysis of the thermal circuit system of this embodiment shown in FIG. 7 are described below. The conditions for the performance analysis are shown in Table 1 and FIG. 7. For waste heat at 80°C output from the thermal battery 5, the thermal transistor 2 generates 165 kW of high-temperature heat at 120°C and 262 kW of low-temperature heat at 7°C. The thermal booster 3 then generates 196 kW of high-temperature heat at 250°C and 245 kW of low-temperature heat at 8°C. In other words, the thermal amplifier 4 heats the dry air 11b at room temperature (25°C) at 718 kW. The waste-heat-based COP for the thermal transistor 2 alone with the thermal amplifier 4 is 0.595 (the COP for the thermal transistor 2 alone without the thermal amplifier 4 is 0.528), and for the thermal transistor 2 and thermal booster 3 with the thermal amplifier 4, it is 0.614.

[0041] [Table 1]

[0042] (Other Examples) (1) Figure 8 shows another embodiment of the thermal circuit system configuration. The thermal circuit system 11 does not have a low-temperature process, and therefore cannot provide a low-temperature heat source to the low-temperature process or utilize the cold waste heat from the low-temperature process. However, the low-temperature heat output from the thermal transistor 2 is used in the thermal booster 3, and the cold / hot heat used in the thermal booster 3 becomes cold waste heat and returns to the thermal transistor 2. In other words, the low-temperature heat source output from the thermal booster 3 is returned to the thermal transistor 2.

[0043] (2) Figure 9 shows another embodiment of the thermal circuit system configuration. Compared to the thermal circuit system 1, the thermal circuit system 12 does not have a thermal battery 5, cannot maintain the thermal temperature, and cannot boot up the system immediately. However, the thermal amplifier 4, thermal transistor 2, and thermal booster 3 enable heat regeneration, converting waste heat from the high-temperature process 6 into the high-temperature heat source required for the process. [Industrial Applicability]

[0044] This invention can stably supply heat sources for high-temperature and low-temperature processes in the materials industry and is useful for achieving carbon neutrality. [Explanation of symbols]

[0045] 1,11,12 Thermal Circuit System 2 Thermal transistor (second heat pump) 3 Thermal booster (third heat pump) 4 Thermal amplifier (first heat pump) 5 Thermal battery (heat storage tank) 5a Microcapsules 5b Constant temperature bath 5c Microcapsule aggregates 5d Graphite Bridge 6 High-Temperature Processes 7 Low-temperature process 8. Pump 11a moist air 11b Dry Air 21 High-pressure absorber 22 Low pressure absorber 23 High-pressure evaporator 24 Low-pressure evaporator 25,32,42 Regenerator 26,34 Condenser 31 Reactor 31a,32a Chemical heat storage material 33 Evaporator 41 Adsorption device 42 Regenerator

Claims

1. 1. A heat recovery system that uses waste heat from a high temperature process to convert it into a high temperature heat source required for the process, comprising: The heat pump is composed of a first heat pump, a second heat pump, and a third heat pump. The first heat pump heats the waste heat, the second heat pump further heats the heat output from the first heat pump and outputs it as high-temperature heat, and also outputs low-temperature heat using the cold waste heat as a heat source; A thermal circuit system characterized in that a third heat pump further heats the high-temperature heat.

2. 2. The thermal circuit system according to claim 1, further comprising a heat storage tank containing a latent heat storage material for storing the output heat of the first heat pump, thereby stabilizing the temperature of the heat supplied to the second heat pump.

3. the first heat pump accommodates an adsorbent that uses the waste heat as adsorption heat; The second heat pump absorbs water evaporated in a high-pressure absorber into an absorbing liquid, extracts the heat generated by the heat exchanger, and outputs the high-temperature heat; it also evaporates water in a low-pressure evaporator, cools the cold waste heat from the low-temperature process using the latent heat of water evaporation, and outputs low-temperature heat; and regenerates the absorbing liquid using the latent heat of the latent heat storage material. The third heat pump heats the high-temperature heat by reaction heat of the hydration reaction of the chemical heat storage material, uses the high-temperature heat to store heat by a dehydration reaction of the chemical heat storage material, and uses the low-temperature heat to condense steam generated by the dehydration reaction, thereby promoting the regeneration of the chemical heat storage material. The thermal circuit system described in claim 2.

4. The waste heat is 70 to 100°C, The output heat from the first heat pump is 80 to 100°C, The high-temperature heat output by the second heat pump is 100 to 150°C, and the low-temperature heat is 5 to 10°C, 4. The thermal circuit system according to claim 1, wherein the temperature rise in the third heat pump is 200 to 300°C.

5. The thermal circuit system according to claim 2 or 3, characterized in that the latent heat storage material is a microcapsule containing non-porous hollow silica particles encapsulating a phase change substance that absorbs and releases latent heat in response to temperature changes.

6. The thermal circuit system according to claim 2 or 3, characterized in that the latent heat storage material is an aggregate of microcapsules containing non-porous hollow silica particles encapsulating a phase change substance that absorbs and releases latent heat in response to temperature changes, and the microcapsules are cross-linked with graphite.

7. In the thermal circuit system according to any one of claims 1 to 3, The externally supplied energy is the power for the pump for liquid delivery and the electricity for control. A thermal circuit system characterized by no external heat supply and waste heat being consumed within the system.

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