Electric connection device

Abstract

To provide an electric connection device that can reduce the load applied to a probe.SOLUTION: An electric connection device 1 includes a probe 10, a probe head 60 that keeps the probe 10, a wiring sheet 30 including a first connection part 31 disposed on a first sheet surface 311 facing the probe head 60 and a second connection part 32 disposed on a second sheet surface 312, the wiring sheet having flexibility, and a wiring board 20 disposed facing the probe head 60 with the wiring sheet 30 therebetween and including a first electrode 21 facing the second connection part 32. The wiring sheet 30 includes a first layer 350 that the first connection part 31 penetrates, a wiring layer 360 including an electrode pad 363 disposed facing the first connection part 31 and including an internal circuit electrically connected to the electrode pad 363, and a second layer 370 that the second connection part 32 penetrates. The first layer 350 is elastically deformed so that the first connection part 31 having received the pressing force from the probe 10 comes into contact with the electrode pad 363.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrical connecting device used for testing electrical characteristics of an object to be tested. [Background technology]

[0002] An electrical connection device including a probe is used to test the electrical characteristics of a test object such as a semiconductor integrated circuit in a wafer state. In a test using the probe, one end of the probe contacts an electrode of the test object, and the other end of the probe contacts a terminal arranged on a wiring board included in the electrical connection device. The terminal arranged on the wiring board is electrically connected to a test device such as a tester. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-178901 Summary of the Invention [Problem to be solved by the invention]

[0004] In order to accurately test the electrical characteristics of an object under test, it is necessary to stably connect the probe to the object under test. For this purpose, the probe must be pressed against the wiring board, which applies a load to the probe. However, probes have a limit to how much load they can withstand. The present invention aims to provide an electrical connection device that can reduce the load applied to the probe. [Means for solving the problem]

[0005] An electrical connection device according to one aspect of the present invention includes a probe, a probe head that holds the probe, a flexible wiring sheet including a first connection portion arranged on a first sheet surface facing the probe head and a second connection portion arranged on a second sheet surface, and a wiring substrate that is arranged facing the probe head across the wiring sheet and has a first electrode arranged opposite the second connection portion. The wiring sheet has a first layer through which the first connection portion penetrates, an electrode pad arranged on the first connection surface spaced from the first layer so as to face the first connection portion, a wiring layer including an internal circuit electrically connected to the electrode pad, and a second layer through which the second connection portion penetrates. When the first layer receives a pressing force from the probe, the first connection portion elastically deforms so that it contacts the electrode pad. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide an electrical connecting device that can reduce the load applied to the probe. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an electrical connecting device according to an embodiment. [Figure 2A] FIG. 2A is a schematic plan view showing the configuration of the electrical connecting device according to the embodiment. [Figure 2B] FIG. 2B is a schematic cross-sectional view showing the configuration of the electrical connecting device according to the embodiment. [Figure 3] FIG. 3 is a schematic diagram showing elastic deformation of the first layer of the wiring sheet of the electrical connection device according to the embodiment. [Figure 4] FIG. 4 is a schematic diagram showing the original shape of the first layer of the wiring sheet of the electrical connection device according to the embodiment. [Figure 5] FIG. 5 is a schematic diagram showing elastic deformation of the second layer of the wiring sheet of the electrical connection device according to the embodiment. [Figure 6] FIG. 6 is a schematic diagram showing the original shape of the second layer of the wiring sheet of the electrical connection device according to the embodiment. [Figure 7]FIG. 7 is a schematic diagram showing the shape of a first space formed in a first layer of a wiring sheet of an electrical connection device according to an embodiment. [Figure 8] FIG. 8 is a schematic diagram showing the shape of a second space formed in the second layer of the wiring sheet of the electrical connection device according to the embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view showing an example of the structure of a wiring layer of a wiring sheet of an electrical connecting device according to an embodiment. [Figure 10] FIG. 10 is a schematic diagram showing an example of an internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 11] FIG. 11 is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 12] FIG. 12 is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 13] FIG. 13 is a schematic diagram showing an example of a loopback circuit using the wiring sheet shown in FIG. [Figure 14] FIG. 14 is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 15] FIG. 15 is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connecting device according to the embodiment. [Figure 16] FIG. 16 is a schematic diagram showing an example of the layout of electronic circuits on the wiring sheet of the electrical connecting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, arrangements, etc. of the components of the embodiments of the present invention are not limited to those described below.

[0009] 1 is used to inspect an inspection target object 2. The electrical connection device 1 includes a probe 10, a probe head 60 that holds the probe 10, a wiring sheet 30 laminated on the probe head 60, and a wiring board 20 laminated on the wiring sheet 30.

[0010] The electrical connection device 1 further includes a printed circuit board 40 laminated on the wiring board 20, and a stiffener 50 laminated on the printed circuit board 40. In the following description, the direction in which the electrical connection device 1 is located as viewed from the object under test 2 is referred to as the upward direction, and the direction in which the object under test 2 is located as viewed from the electrical connection device 1 is referred to as the downward direction. As shown in FIG. 1, the direction from bottom to top is referred to as the Z direction, and the plane perpendicular to the Z direction is referred to as the XY plane. In FIG. 1, the left-right direction of the drawing is the X direction, and the depth direction is the Y direction. Furthermore, for each of the components of the electrical connection device 1, the surface facing upward is also referred to as the upper surface, and the surface facing downward is also referred to as the lower surface.

[0011] The probe 10 has a tip portion 11, which is one end arranged so as to be able to come into contact with the test object 2, and a base portion 12, which is the other end connected to the tip portion 11. For example, the probe 10 is held in a state in which it passes through a through-hole formed in the probe head 60. The tip portion 11 and the base portion 12 are exposed from the probe head 60.

[0012] The object under test 2 is mounted on a stage 3. The electrical connecting device 1 and the stage 3 are relatively movable in the vertical direction. When inspecting the object under test 2, the distance between the electrical connecting device 1 and the stage 3 is narrowed so that the tip 11 of the probe 10 comes into contact with a signal terminal (not shown) of the object under test 2. FIG. 1 shows a state in which the probe 10 and the object under test 2 are spaced apart.

[0013] The wiring sheet 30 includes a first connection portion 31 arranged on a first sheet surface 311 facing the probe head 60, and a second connection portion 32 arranged on a second sheet surface 312 facing the opposite direction of the first sheet surface 311. Although not shown in FIG. 1 , the wiring sheet 30 has an internal circuit that is electrically connected to at least one of the first connection portion 31 and the second connection portion 32. The first connection portion 31 faces the first sheet surface 311 and connects to the base end portion 12 of the probe 10 exposed from the probe head 60. The wiring sheet 30 is flexible and elastically deforms in the film thickness direction. The configuration of the wiring sheet 30 will be described in detail later.

[0014] The wiring board 20 is disposed opposite the probe head 60 with the wiring sheet 30 sandwiched therebetween. A first electrode 21 electrically connected to the second connection portion 32 of the wiring sheet 30 is disposed on a first main surface 201 of the wiring board 20 facing the second sheet surface 312 of the wiring sheet 30. A second electrode 22 is disposed on a second main surface 202 of the wiring board 20 facing the printed circuit board 40 and facing in the opposite direction to the first main surface 201. The first electrode 21 and the second electrode 22 are electrically connected via internal wiring 200. The wiring board 20 may be a multilayer wiring board such as a multi-layer organic (MLO) or multi-layer ceramic (MLC) wiring board.

[0015] The printed circuit board 40 is disposed opposite the second main surface 202 of the wiring board 20. The printed circuit board 40 includes a first end 41 disposed on the lower surface facing the wiring board 20, a second end 42 disposed on the upper surface, and a wiring pattern 400 that electrically connects the first end 41 and the second end 42. The second end 42 is electrically connected to, for example, an inspection device (not shown). As a result, an electrical signal is transmitted between the inspection object 2 and the inspection device via the electrical connection device 1.

[0016] The wiring board 20 may be, for example, a space transformer that converts the spacing between the base ends 12 of the probes 10 as viewed from the normal direction of the second main surface 202 of the wiring board 20 into the spacing between the first ends 41 of the printed circuit board 40. When the wiring board 20 is a space transformer, the signal terminals can be electrically connected to the second ends 42 of the printed circuit board 40 that are arranged at a wider interval than the interval between the signal terminals arranged on the test object 2. This facilitates electrical connection between the wiring pattern 400 of the printed circuit board 40 and the test device.

[0017] 1, a stiffener 50 may be laminated on the printed circuit board 40. The stiffener 50 has a higher rigidity than the printed circuit board 40, and prevents the printed circuit board 40 from bending, thereby ensuring the mechanical strength of the electrical connection device 1. Furthermore, the stiffener 50 may be used as a support for fixing each of the components of the electrical connection device 1. The stiffener 50 may be fixed to the printed circuit board 40 by, for example, a screw.

[0018] 2A is a plan view (hereinafter also referred to as "plan view") of a laminated structure of wiring board 20, printed board 40, and stiffener 50, as viewed from the Z direction. FIG. 2B is a cross-sectional view of a side surface as viewed from the Y direction of an XY plane perpendicular to the Z direction. FIG. 2B does not illustrate first electrode 21 and second electrode 22 of wiring board 20, first connection portion 31 and second connection portion 32 of wiring sheet 30, wiring pattern 400 of printed board 40, etc.

[0019] A stiffener 50 is disposed on the upper surface of a printed circuit board 40, which is circular in plan view. As shown in FIG. 2A, for example, the stiffener 50 has a shape in which an outer circular ring and an inner rectangular ring are connected by spokes. A wiring board 20 and a wiring sheet 30 are disposed near the center of the lower surface of the printed circuit board 40. The wiring board 20, the printed circuit board 40, and the stiffener 50 are fixed together with screws, for example. FIG. 2B shows an example in which the wiring board 20 and the printed circuit board 40 are joined with screws 70. The wiring sheet 30 is not fastened with screws, but is held between the probe head 60 and the wiring board 20. Holes are formed in the wiring sheet 30 for inserting the screws 70.

[0020] The following describes in detail the structure of wiring sheet 30. As shown in Fig. 1, wiring sheet 30 includes a first layer 350, a wiring layer 360, and a second layer 370. First layer 350, wiring layer 360, and second layer 370 are arranged in this order along the thickness direction (Z direction) of wiring sheet 30.

[0021] The first layer 350 has two surfaces defined by a first sheet surface 311 and a first opposing surface 352. A first connecting portion 31 penetrates the first layer 350 from the first sheet surface 311 to the first opposing surface 352.

[0022] The wiring layer 360 has two surfaces defined by a first connection surface 361 facing the first opposing surface 352 and a second connection surface 362 facing the opposite direction of the first connection surface 361. The wiring layer 360 includes an electrode pad 363 disposed on the first connection surface 361 separated from the first layer 350 so as to face the first connection portion 31, and an internal circuit (not shown) electrically connected to the electrode pad 363.

[0023] The second layer 370 has two surfaces defined by a second opposing surface 371 that faces the second connecting surface 362 and a second seat surface 312. The second connecting portion 32 penetrates the second layer 370 from the second opposing surface 371 to the second seat surface 312.

[0024] The first layer 350 is elastically deformed around the first connection portion 31 so that the first connection portion 31 contacts the electrode pad 363 when it receives a pressing force from the base end portion 12 of the probe 10 .

[0025] The second layer 370 is spaced apart from the second connection surface 362 around the second connection portion 32. The second layer 370 around the second connection portion 32 is elastically deformed so as to bias the second connection portion 32 towards the first electrode 21.

[0026] When assembling the electrical connecting device 1, a pressing force is applied to press the first connection portion 31 against the base end 12 of the probe 10. Pressing the first connection portion 31 against the base end 12 is hereinafter referred to as "preload." When the probe head 60 holding the probe 10 is attached to the wiring sheet 30, the first layer 350 elastically deforms so that the first connection portion 31 contacts the electrode pad 363, as shown in FIG. 3 . In other words, the first layer 350 elastically deforms in the preload. The elastic force of the first layer 350 presses the first connection portion 31 of the wiring sheet 30 against the probe 10. This ensures stable contact between the probe 10 and the first connection portion 31.

[0027] When the probe 10 is separated from the wiring sheet 30, the shape of the first layer 350 returns to its original state so that the first connection portion 31 is separated from the electrode pad 363, as shown in Fig. 4. In other words, Fig. 4 shows the state of the wiring sheet 30 before the probe head 60 is attached to the wiring sheet 30.

[0028] The periphery of second connection portion 32 of second layer 370 is formed to be elastically deformable. Therefore, when wiring board 20 is attached to wiring sheet 30, second connection portion 32 of wiring sheet 30, which is biased against first electrode 21 of wiring board 20, is pressed against wiring layer 360, as shown in FIG. 5 . The elastic force of elastically deformed second layer 370 ensures that second connection portion 32 and first electrode 21 are in secure contact. A gold ball, for example, may be used for second connection portion 32.

[0029] When wiring board 20 is separated from wiring sheet 30, the periphery of second connection portion 32 of second layer 370 returns to its original shape, as shown in Fig. 6. In other words, Fig. 6 shows the state of wiring sheet 30 before wiring sheet 30 is attached to wiring board 20.

[0030] 3 and 4, a first spacer 381 is disposed between the first layer 350 and the wiring layer 360 of the wiring sheet 30 in a region surrounding the region where the first connection portion 31 is disposed. The first spacer 381 forms a space between the first layer 350 and the wiring layer 360. Because the first spacer 381 is disposed around the first connection portion 31, the first layer 350 curves within the range of the space between the first layer 350 and the wiring layer 360. In other words, the thickness of the first spacer 381 in the Z direction limits the degree of curvature of the first layer 350.

[0031] 5 and 6, a second spacer 382 is disposed between the second layer 370 of the wiring sheet 30 and the wiring board 20 in a region surrounding the region where the second connection portion 32 is disposed. The second spacer 382 forms a space between the second layer 370 and the wiring board 20. Because the second spacer 382 is disposed around the second connection portion 32, the second layer 370 curves within the range of the space between the second layer 370 and the wiring board 20. In other words, the thickness of the second spacer 382 in the Z direction limits the degree of curvature of the second layer 370.

[0032] In order to elastically deform the periphery of the first connection portion 31 of the first layer 350, a first space 310 for flexure may be provided in the first layer 350 around the first connection portion 31, as shown in Fig. 7, for example. By providing the first space 310 around the periphery and disposing the first connection portion 31 in a flexible region, the periphery of the first connection portion 31 can be elastically deformed. The magnitude of the elastic force can be adjusted by setting the area of ​​the first space 310.

[0033] To elastically deform the periphery of the second connection portion 32 of the second layer 370, a second space 320 for flexure may be provided in the second layer 370 around the second connection portion 32, as shown in FIG. 8 . By providing the second space 320 around the periphery and disposing the second connection portion 32 in a flexible region, the periphery of the second connection portion 32 can be elastically deformed. The magnitude of the elastic force can be adjusted by setting the area of ​​the second space 320. The area of ​​the first space 310 and the area of ​​the second space 320 may be different. For example, if the elastic force of the second layer 370 can be smaller than that of the first layer 350, the area of ​​the second space 320 may be larger than the area of ​​the first space 310.

[0034] The first layer 350 and the second layer 370 of the wiring sheet 30 may be made of, for example, an insulating film. The wiring layer 360 may have a structure in which a conductive film and an insulating film are laminated together. For example, an internal circuit may be formed by a conductive pattern formed on the conductive film. FIG. 9 shows an example of the configuration of the wiring layer 360 of the wiring sheet 30. Electrode pads 363 and the like are not shown in FIG. 9.

[0035] The wiring layer 360 of the wiring sheet 30 shown in FIG. 9 has a structure in which a laminate of a conductive film 302 and an insulating film 303 is sandwiched between a pair of cover films 301 made of an insulating material. The number of laminates of conductive films 302 and insulating films 303 can be set arbitrarily. The conductive film 302 may be made of a metal material such as copper foil. The insulating film 303 may be made of an insulating material such as a polyimide sheet. The cover film 301 may be made of an insulating material such as solder resist. An adhesive may be used to bond the conductive film 302, the insulating film 303, and the cover film 301 to each other. Note that the wiring layer 360 may have a structure in which an insulating film (also referred to as a "base film") is further sandwiched between the laminates including the conductive film 302 and the insulating film 303. The cover film 301 may be used for the first layer 350 and the second layer 370.

[0036] The wiring sheet 30 may be selected from a plurality of wiring sheet candidates. Each of the wiring sheet candidates has a first connection portion 31 arranged on a first sheet surface 311, a second connection portion 32 arranged on a second sheet surface 312, and a wiring layer 360 in which an internal circuit is formed. Each of the wiring sheet candidates may include an internal circuit having a different configuration from the other wiring sheet candidates. One wiring sheet 30 selected from the plurality of wiring sheet candidates may be configured to be detachable between the probe head 60 and the wiring board 20.

[0037] An example of the configuration of the wiring sheet candidates included in the wiring sheet group will be described below. In the following, when each of the wiring sheet candidates is not limited, it will be referred to as the wiring sheet 30.

[0038] An internal circuit of any of the wiring sheets 30 included in the wiring sheet group may include a circuit (hereinafter also referred to as an "interposer circuit") that electrically connects the first connection portion 31 and the second connection portion 32. For example, when an interposer circuit is formed on the wiring layer 360 having the structure shown in Fig. 9, wiring is formed that penetrates the cover film 301, the conductive film 302, and the insulating film 303 from the first connection surface 361 to the second connection surface 362 of the wiring layer 360.

[0039] When the internal circuit of wiring sheet 30 includes an interposer circuit, as shown in Fig. 10, the internal circuit of wiring sheet 30 may include a circuit that short-circuits first connection portion 31 and second connection portion 32. In the internal circuit of wiring sheet 30 shown in Fig. 10, first connection portion 31 and second connection portion 32 are electrically short-circuited by short-circuiting wiring 331.

[0040] By attaching the wiring sheet 30 shown in FIG. 10 to the electrical connecting device 1, the probes 10 and the wiring pattern 400 of the printed circuit board 40 are short-circuited via the internal circuit of the wiring sheet 30. As a result, the DUT 2 and the testing device are electrically connected. This allows an electrical signal to be transmitted between the testing device, such as an IC tester, and the DUT 2, thereby measuring the characteristics of the DUT 2. For example, the internal circuit of the wiring sheet 30 connects the first connecting portions 31 and the second connecting portions 32 one-to-one. Alternatively, the internal circuit may connect one first connecting portion 31 to multiple second connecting portions 32, or multiple first connecting portions 31 to one second connecting portion 32.

[0041] When the internal circuit of wiring sheet 30 includes an interposer circuit, the internal circuit may include a matching circuit 332 having a first terminal connected to first connection portion 31 and a second terminal connected to second connection portion 32, as shown in Fig. 11. Matching circuit 332 may be a circuit that matches impedance between first connection portion 31 and second connection portion 32. For example, matching circuit 332 may include a π-type filter.

[0042] The internal circuit of wiring sheet 30 may include a circuit that electrically connects one of first connection portions 31 to another of first connection portions 31. In other words, the internal circuit of wiring sheet 30 may include a circuit (hereinafter also referred to as a "loopback circuit") that electrically connects the output terminal and input terminal of device under test 2. The loopback circuit electrically connects two signal terminals of device under test 2.

[0043] For example, as shown in Fig. 12, the internal circuit of the wiring sheet 30 may include a circuit that short-circuits one of the first connection portions 31 and another one of the first connection portions 31. In the internal circuit of the wiring sheet 30 shown in Fig. 12, one first connection portion 31 and another one of the first connection portions 31 are electrically short-circuited by a loopback wiring 333. By attaching the wiring sheet 30 shown in Fig. 12 to the electrical connection device 1, one of the probes 10 and another one of the probes 10 are short-circuited via the internal circuit of the wiring sheet 30. As a result, one signal terminal of the test object 2 and another one of the signal terminals are electrically connected.

[0044] FIG. 13 shows a configuration in which a first signal terminal 2A of the DUT 2, which one of the probes 10 contacts, and a second signal terminal 2B of the DUT 2, which another of the probes 10 contacts, are electrically connected via a loopback wiring 333 on the wiring sheet 30. For example, if the DUT 2 is a receiving circuit, the first signal terminal 2A is the output terminal of the DUT 2, and the second signal terminal 2B is the input terminal of the DUT 2, a transmission test can be performed by returning the output from the DUT 2 to the input. In other words, it is possible to test whether the output and input sections of the DUT 2 are functioning normally, even without the presence of a device to transmit to. For example, as a test similar to a jitter tolerance test performed on a receiving circuit, an output signal output from the first signal terminal 2A (output terminal) can be input as an input signal to the second signal terminal 2B (input terminal) to check whether a specified error rate is maintained.

[0045] When the internal circuit of wiring sheet 30 includes a loopback circuit, the internal circuit may include a circuit including capacitor 34 connected in series between one of first connection portions 31 and another of first connection portions 31, as shown in Fig. 14. One terminal of capacitor 34 is connected to one of first connection portions 31, and the other terminal of capacitor 34 is connected to the other of first connection portions 31. Capacitor 34 may be a capacitor formed using a semiconductor manufacturing process (hereinafter also referred to as a "process capacitor"), or the like.

[0046] Furthermore, the internal circuit of the wiring sheet 30 may include a relay circuit that switches one of the first connection portions 31 to be electrically connected to either one of the second connection portions 32 or another of the first connection portions 31. For example, the internal circuit shown in Fig. 15 includes a relay circuit 334 that constitutes either an interposer circuit that connects the first connection portions 31 and the second connection portions 32, or a loopback circuit that connects the first connection portions 31 to each other.

[0047] 15 constitutes an interposer circuit, the first contact terminal 334a and the second contact terminal 334b ​​are connected, and the third contact terminal 334c and the fourth contact terminal 334d are connected. This electrically connects the first connecting portion 31 and the second connecting portion 32. When the relay circuit 334 constitutes a loopback circuit, the first contact terminal 334a and the common contact terminal 334e of the relay circuit 334 are connected, and the third contact terminal 334c and the common contact terminal 334e are connected. This electrically connects one of the first connecting portions 31 and another of the first connecting portions 31.

[0048] Although examples of the internal circuit of wiring sheet 30 have been described with reference to Figures 10 to 15, the configuration of the internal circuit is not limited to the above. For example, the internal circuit may include an inductor instead of capacitor 34 shown in Figure 14, or the internal circuit may include both a capacitor and an inductor. In other words, the internal circuit of wiring sheet 30 may include a passive circuit including any element. Furthermore, the internal circuit may include a switching circuit using a diode or the like instead of relay circuit 334 shown in Figure 15.

[0049] The elements included in the internal circuit of wiring sheet 30 may be formed using, for example, a MEMS (Micro Electro Mechanical Systems) process. By using the MEMS process, miniaturized elements can be formed integrally with wiring sheet 30.

[0050] As described above, with the electrical connection device 1, various circuit configurations such as those shown in FIGS. 10 to 15 can be realized in the electrical connection device 1 simply by replacing the wiring sheet 30. Therefore, multiple types of measurements can be performed on the inspection target 2 using the electrical connection device 1. For example, a DC test can be performed on the inspection target 2 by mounting the wiring sheet 30 including an internal circuit that shorts the first connection portion 31 and the second connection portion 32 on the electrical connection device 1. Furthermore, a high-frequency test can be performed on the inspection target 2 by mounting the wiring sheet 30 including an internal circuit that includes a matching circuit or a loopback circuit on the electrical connection device 1.

[0051] 15, the electrical connecting device 1 can shorten the wiring length of the interposer circuit and the loopback circuit compared to when a relay element is arranged on the printed circuit board 40. As a result, the electrical connecting device 1 can shorten the propagation path of the electrical signal, thereby suppressing loss and noise of the electrical signal.

[0052] 11, the electrical connecting device 1 can shorten the wiring connected to the matching circuit 332 by arranging the matching circuit 332 on the wiring sheet 30. For example, since the matching circuit 332 can be arranged in close proximity to the wiring for which impedance matching is desired, impedance matching can be performed effectively.

[0053] By detachably disposing wiring sheet 30, which includes an internal circuit capable of configuring any of the above-described circuits, between wiring board 20 and printed circuit board 40, it is possible to configure any measurement system for electrical connecting device 1. As a result, electrical connecting device 1 can measure the characteristics of object under test 2 with high accuracy.

[0054] Furthermore, according to the electrical connecting device 1, by disposing the flexible wiring sheet 30 between the probe head 60 and the wiring board 20, the warping and unevenness of the surfaces of the probe head 60 and the wiring board 20 can be absorbed by the wiring sheet 30. This makes it possible to suppress rattles and poor contact of the electrical connecting device 1 caused by gaps occurring between the probe head 60 and the wiring board 20.

[0055] Furthermore, the electrical connection device 1 allows electronic components electrically connected to the internal circuit to be arranged on the surface of the wiring sheet 30. For example, as shown in FIG. 16 , electronic components 100 connected to the internal circuit of the wiring sheet 30 may be arranged on each of the first sheet surface 311 and the second sheet surface 312. The electronic components 100 may be, for example, capacitors, inductors, or resistors. While FIG. 16 shows an example in which electronic components 100 are arranged on each of the first sheet surface 311 and the second sheet surface 312, the electronic components 100 may also be arranged on either the first sheet surface 311 or the second sheet surface 312. By arranging the electronic components 100 on the surface of the wiring sheet 30, it is possible to reduce or divide the electronic components arranged on, for example, the wiring board 20 or the printed circuit board 40. Furthermore, by arranging the electronic components on the surface of the wiring sheet 30, it is possible to shorten the wiring length between the test object 2 and the electronic components. Therefore, for example, by arranging electronic components such as capacitors that reduce power supply noise on the wiring sheet 30, measurements of the test object 2 can be performed stably.

[0056] As described above, during the preloading process in the assembly process of the electrical connecting device 1, the base ends 12 of the probes 10 come into contact with the first connection portions 31 of the first layer 350 of the wiring sheet 30, and then the probes 10 further press the first layer 350 toward the wiring layer 360. The first layer 350 bends to an extent limited by the thickness of the first spacers 381, and the first connection portions 31 come into contact with the electrode pads 363. The base ends 12 of the probes 10 are electrically connected to the internal wiring 200 of the wiring board 20 via the internal circuitry of the wiring sheet 30.

[0057] Therefore, according to the electrical connecting device 1, part of the load applied until the first connection portion 31 of the first layer 350 and the electrode pad 363 of the wiring layer 360 come into contact is absorbed by the curvature of the first layer 350. This makes it possible to reduce the load applied to the probe 10 by the preload, thereby preventing damage to the probe 10.

[0058] In contrast, in the electrical connecting device of the comparative example that does not include the wiring sheet 30, the entire load due to the preload is applied to the probe 10. For this reason, in the electrical connecting device of the comparative example, it is necessary to reduce the load applied to the probe 10 compared to the electrical connecting device 1.

[0059] As described above, the electrical connecting device 1 can reduce the load applied to the probe 10, thereby increasing the maximum load applied to the probe 10 during testing of the test object 2. This reduces damage to the probe 10 caused by bringing the electrical connecting device 1 closer to the test object 2 to ensure a reliable electrical connection between the probe 10 and the test object 2. For example, when there is variation in the position of the tip 11 of the probe 10, the electrical connecting device 1 can be brought closer to the test object 2 so that the probe 10 that is farther from the test object 2 can reliably contact the test object 2. At this time, the large maximum load on the probe 10 can prevent damage to the probe 10 that is closer to the test object 2.

[0060] The load limit of the probe 10 increases with the length of the probe 10. Therefore, the electrical connecting device 1, which reduces the load applied to the probe 10, allows the length of the probe 10 to be shorter than that of the electrical connecting device of the comparative example. By shortening the length of the probe 10, it is possible to shorten the signal wiring in the electrical connecting device 1. Therefore, the electrical connecting device 1 can improve the accuracy of the high-frequency current characteristics of the test object 2.

[0061] (Other embodiments) Although the present invention has been described above by way of the preferred embodiment, the descriptions and drawings that form part of this disclosure should not be understood as limiting the present invention. From this disclosure, various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art.

[0062] For example, wiring sheet 30 may include an internal circuit that combines multiple types of circuit configurations. For example, wiring sheet 30 may include an internal circuit that combines short-circuit wiring 331 and matching circuit 332. Or, wiring sheet 30 may include an internal circuit that combines an interposer circuit and a loopback circuit. For example, the internal circuit may include short-circuit wiring 331, matching circuit 332, and loopback wiring 333, or may further include relay circuit 334. Or, the loopback circuit may include matching circuit 332. In this way, any circuit can be configured as the internal circuit of wiring sheet 30.

[0063] As described above, by mounting a wiring sheet 30 including an internal circuit with a mixture of arbitrary circuit configurations on the electrical connection device 1, multiple types of measurements can be performed on the object to be inspected 2 using a single wiring sheet 30.

[0064] As such, the present invention naturally includes various embodiments not described above. Therefore, the technical scope of the present invention is defined only by the invention-specifying matters according to the scope of the claims that are appropriate from the above description. [Explanation of symbols]

[0065] 1 Electrical connection device 2. Inspection object 10 probes 11 Tip 12 Proximal end 20 Wiring board 21 1st electrode 22 2nd electrode 30 Wiring sheet 31 First connection part 32 Second connection part 40 Printed Circuit Board 41 First end 42 Second end 50 Stiffna 60 probe head 100 Electronic Components 200 Internal wiring 201 First main surface 202 Second main surface 311 First seat surface 312 Second seat surface 350 1st layer 352 First opposing surface 360 wiring layer 361 First connection surface 362 Second connection surface 363 Electrode Pads 370 2nd layer 371 Second opposing surface 381 First Spacer 382 Second Spacer 400 Wiring Pattern

Claims

1. An electrical connection device used for inspecting an object to be inspected, a probe having a tip end arranged to be in contact with the test object and a base end connected to the tip end; a probe head for holding the probe; a flexible wiring sheet including a first connection portion disposed on a first sheet surface facing the probe head and a second connection portion disposed on a second sheet surface facing in an opposite direction to the first sheet surface; a wiring board disposed opposite the probe head with the wiring sheet interposed therebetween, the wiring board having a first main surface on which a first electrode facing the second connection portion is disposed; Equipped with The wiring sheet is a first layer having opposite surfaces defined by the first sheet surface and a first opposing surface, the first connection portion passing through from the first sheet surface to the first opposing surface; a wiring layer having both surfaces defined by a first connection surface facing the first opposing surface and a second connection surface facing in an opposite direction to the first connection surface, the wiring layer including an electrode pad disposed on the first connection surface spaced apart from the first layer so as to face the first connection portion, and an internal circuit electrically connected to the electrode pad; a second layer having two opposing surfaces defined by the second sheet surface and a second opposing surface opposing the second connection surface, the second layer having the second connection portion passing through from the second opposing surface to the second sheet surface; and the first layer elastically deforms when a pressing force is applied from the base end portion so that the first connection portion comes into contact with the electrode pad; Electrical connection device.

2. the second layer is spaced apart from the second connection surface around the second connection portion; a periphery of the second connection portion of the second layer elastically deforms to urge the second connection portion toward the first electrode; 2. The electrical connecting device according to claim 1.

3. 3. The electrical connection device according to claim 1, wherein a first spacer forming a space between the first layer and the wiring layer is arranged between the first layer and the wiring layer around the first connection portion.

4. 3. The electrical connection device according to claim 1, wherein a second spacer that forms a space between the second layer and the wiring board is disposed between the second layer and the wiring board around the second connection portion.

5. 3. The electrical connecting device according to claim 1, wherein the wiring sheet has a structure in which a laminate of a conductive film and an insulating film is sandwiched between cover films made of an insulating material.

6. 3. The electrical connection device according to claim 1, further comprising a printed circuit board including a wiring pattern arranged opposite the wiring board and connected to a second electrode arranged on a second main surface of the wiring board facing in the opposite direction to the first main surface.

7. 7. The electrical connecting device according to claim 6, wherein said wiring board is a space transformer that converts the spacing between said probes into the spacing between said wiring patterns of said printed circuit board when viewed in the normal direction of the main surface of said wiring board.

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