Electronic equipment

Abstract

To provide electronic equipment capable of suppressing noises and securing footprint.SOLUTION: Electronic equipment 1 comprises a first substrate 10, a second substrate 20, and a noise shield part 30. The first and second substrates 10 and 20 are electrically connected together. The noise shield part 30 shields propagation of electromagnetic noises generated from the first substrate 10 and / or the second substrate 20, and is capacitively coupled to the first substrate 10 and / or the second substrate 20. Capacitive coupling is set to correspond to a prescribed frequency band of the noise.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] 2. Description of the Related Art Conventionally, a known method for blocking electromagnetic noise generated from electronic devices is to connect a noise shield plate directly to the frame ground of the electronic device, thereby suppressing noise and ensuring a sufficient mounting area.

[0003] Patent Document 1 provides a mounting structure for a normal mode choke coil used in an input / output filter, which prevents the conduction of coupling capacitance and switching noise from metal plates such as a chassis or heat sinks.

[0004] In Patent Document 2, the shielding layer and the shielding plate shield radiation noise generated from electronic components. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 06-120057 [Patent Document 2] Japanese Patent Application Laid-Open No. 2016-039697 Summary of the Invention [Problem to be solved by the invention]

[0006] However, it may be difficult to directly install the noise shielding portion on the mounting board from the viewpoints of ensuring the insulation distance of the shielding portion, suppressing noise, and ensuring the mounting area.

[0007] SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic device that solves the above-mentioned problems. [Means for solving the problem]

[0008] The electronic device of the present invention comprises a first substrate, a second substrate, and a noise shielding section, wherein the first substrate and the second substrate are electrically connected, and the noise shielding section shields the propagation of electromagnetic noise generated from the first substrate and / or the second substrate, and is capacitively coupled to the first substrate and / or the second substrate.

[0009] The capacitive coupling is set in accordance with a predetermined frequency band of the noise.

[0010] The noise shielding portion has a predetermined shape corresponding to a predetermined frequency band of the noise.

[0011] The noise shielding portion includes a movable portion, and the movable portion is capable of being deformed into a predetermined shape corresponding to a predetermined frequency band of the noise.

[0012] The predetermined shape is characterized in that one side of the noise shielding portion is set to a length that is an integral fraction of a wavelength corresponding to the predetermined frequency band of the noise.

[0013] The length divided by an integer is characterized by being half the length.

[0014] The first substrate and / or the second substrate has a frame ground portion, and the capacitive coupling is performed with respect to the frame ground portion.

[0015] The capacitive coupling is set using a capacitor corresponding to a predetermined frequency band of the noise.

[0016] The noise shielding portion is characterized in that a slit portion is formed as a slot antenna, and a resistive member for absorbing electromagnetic noise is inserted into the slit portion.

[0017] The slit portion is characterized in that one side of the slit portion is set to a length that is an integral fraction of a wavelength corresponding to a predetermined frequency band of the noise.

[0018] The length divided by an integer is characterized by being half the length.

[0019] The noise shielding portion has a cavity.

[0020] The predetermined frequency is 2.4 GHz or 5 GHz, which is a frequency band for Wi-Fi (Wireless Fidelity).

[0021] The movable portion is characterized by using metal plates connected by hinges.

[0022] The noise shielding portion is characterized by using an aluminum alloy material.

[0023] The noise shielding portion is characterized by using a copper material.

[0024] The second substrate and the noise shielding portion are characterized by having a silicone sheet therebetween, the silicone sheet having insulating and heat dissipating properties.

[0025] The noise shielding portion is characterized by using a bent metal plate material.

[0026] The noise shielding portion is characterized by using a welded metal plate material. [Effects of the Invention]

[0027] According to the electronic device of the present invention, the electronic device includes a first substrate, a second substrate, and a noise shielding portion. The first substrate and the second substrate are electrically connected, and the noise shielding portion shields the propagation of electromagnetic noise generated from the first substrate and / or the second substrate, and capacitively couples the first substrate and / or the second substrate. This makes it possible to suppress noise and ensure a sufficient mounting area even when it is difficult to directly install the noise shielding portion on the first substrate and / or the second substrate due to the need to ensure an insulation distance for the noise shielding portion. Furthermore, the heat dissipation function of the first substrate or the second substrate can be improved. [Brief explanation of the drawings]

[0028] [Figure 1] 1 is a side view showing a configuration of an electronic device 1 according to an embodiment of the present invention. [Figure 2] FIG. 1 is a diagram showing an equivalent circuit of an electronic device 1 before the present invention is used. [Figure 3] 1 is a perspective view showing the configuration of the electronic device 1, in which the noise shielding section 30 includes a movable section 32. FIG. [Figure 4] 1 is a side view showing the electronic device 1, in which the first substrate 10 and the second substrate 20 each include a frame ground portion 101. FIG. [Figure 5] 1 is a side view showing the electronic device 1, in which the first substrate 10 and the second substrate 20 each include a frame ground portion 101. FIG. [Figure 6] 1 is a side view showing the electronic device 1, in which the first substrate 10 and the second substrate 20 each include a frame ground portion 101. FIG. [Figure 7] 1 is a side view of the electronic device 1, showing a capacitor 40. The capacitor 40 may be mounted on the circuit board side, or may be disposed on the circuit board 30. [Figure 8] FIG. 10 is a front view showing a configuration in which a slit 303 and a resistance member 304 are provided in the noise shielding portion 30. [Figure 9] 10 is a side view showing a case where a silicone sheet 50 is mounted between a second substrate 20 and a noise shielding portion 30. FIG. [Figure 10] FIG. 10 is a perspective view of a case where a bent metal plate is used for the noise shielding portion 30. [Figure 11] 10 is a side view showing a case where the noise shielding portion 30 has a cavity portion 305. FIG. [Figure 12] FIG. 10 is a side view showing a case where the noise shielding portion 30 is made in a mesh shape. [Figure 13] FIG. 13 is a front view of the noise shielding portion 30 of FIG. 12. [Figure 14]FIG. 10 is a diagram showing an equivalent circuit for simulating noise propagation due to an electric field when measures to shield noise by a noise shielding section 30 are not taken. [Figure 15] FIG. 15 is a side view of the electronic device 1 corresponding to FIG. [Figure 16] 10 is a diagram showing the results of a simulation of noise propagation due to an electric field when noise shielding by the noise shielding section 30 is not taken as a measure to shield noise. FIG. [Figure 17] FIG. 10 is a diagram showing an equivalent circuit for simulating noise propagation due to an electric field when noise shielding section 30 is used as a noise shielding measure. [Figure 18] FIG. 18 is a side view of the electronic device 1 corresponding to FIG. [Figure 19] 10A and 10B are diagrams showing the results of a simulation of noise propagation due to an electric field when noise shielding section 30 is used as a noise shielding measure. DETAILED DESCRIPTION OF THE INVENTION

[0029] An example of an embodiment will be described below. Note that the present invention is not limited to the embodiment described below, and various modifications can be made without departing from the spirit and scope of the invention.

[0030] An embodiment of the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, an electronic device 1 according to this embodiment includes a first substrate 10, a second substrate 20, and a noise shielding unit 30. For example, the first substrate 10 is equipped with an AC-DC conversion unit 12 including a PFC (power factor correction) unit 11, and the second substrate 20 is equipped with a relatively low-voltage DC-DC converter 13. In this case, the first substrate 10 performs relatively high-voltage switching at low to medium frequencies (e.g., several hundred kHz), which may generate electromagnetic noise. This noise may propagate to the relatively low-voltage DC-DC converter 13 on the second substrate 20 and affect its behavior. In particular, when the AC-DC conversion unit 12 and / or the DC-DC converter 13 perform switching operations under high-frequency, high-speed switching, and large-current conditions, electromagnetic noise may be generated over a wide frequency range (kHz to GHz). Therefore, various noise standards must be met. FIG. 2 is a diagram showing an equivalent circuit of the electronic device 1 before the present invention is used.

[0031] The first substrate 10 and the second substrate 20 are electrically connected, and the noise shielding section 30 shields the propagation of electromagnetic noise generated from the first substrate 10 and / or the second substrate 20, and is capacitively coupled to the first substrate 10 and the second substrate 20, more specifically to the PFC section 11 and AC-DC conversion section 12 of the first substrate 10 and the DC-DC converter 12 of the second substrate 20. The second substrate section 20 and the noise shielding section 30 are provided so as to stand upright on the first substrate 10. The noise shielding section 30 is provided so as to face the second substrate section 20. The first substrate section 10, the second substrate section 20, and the noise shielding section 30 are rectangular in shape.

[0032] The above-mentioned capacitive coupling is set in accordance with a predetermined frequency band of noise, and the noise shielding portion 30 has a predetermined shape corresponding to the predetermined frequency band of noise.

[0033] As shown in FIG. 3, the noise shielding section 30 includes a movable section 31, which can be deformed into a predetermined shape corresponding to a predetermined frequency band of noise.

[0034] The predetermined shape is desirably set so that one side of the noise shielding portion 30 has a length that is an integral fraction of the wavelength corresponding to the predetermined frequency band of noise. For example, if the noise frequency band is 2.45 GHz, the length is set to 120 mm, which is one-half of the wavelength corresponding to that frequency, approximately 120 mm.

[0035] Furthermore, it is desirable that the length of an integer fraction be half the length. For example, if the noise frequency band is 2.45 GHz, the length is set to 60 mm, which is half the wavelength of approximately 120 mm corresponding to that frequency.

[0036] More specifically, the noise shielding unit 30 of the present invention has a base 31 and a movable unit 32, and the base 31 and the movable unit 32 are rectangular and formed using metal plates. That is, the movable unit 32 is made of a metal plate connected to the base 31 by a hinge 33, and therefore, even in a space-limited environment, it is possible to selectively shield electromagnetic noise of a predetermined frequency f while avoiding interference with other objects. The movable unit 32 is rectangular and forms part of the noise shielding unit 30, and can be moved left and right via the hinge 33, thereby changing its lateral dimension. Although not shown, the movable unit 32 may be positioned above the base 31 and can be moved up and down via the hinge 33, thereby changing its height dimension.

[0037] The noise shielding portion 30 of the present invention uses, for example, an aluminum alloy material. As the aluminum alloy material, an aluminum 5000 series (e.g., A5052) or the like is used. The aluminum 5000 series is advantageous in that it has characteristics such as corrosion resistance and workability (easy cutting and weldability).

[0038] The noise shielding portion 30 of the present invention is made of, for example, a copper material. As the copper material, tough pitch copper C1100 or the like is used. Tough pitch copper C1100 is advantageous in that it has high electrical conductivity, thermal conductivity, and workability (ductility and drawability), as well as characteristics such as corrosion resistance and weather resistance.

[0039] As shown in Fig. 4, the first substrate 10 and the second substrate 20 may have frame ground sections 101 (101A, 101B), and capacitive coupling may be performed with respect to the frame ground sections 101 (101A, 101B). Furthermore, as shown in Fig. 5, capacitive coupling may also be performed between the noise shielding section 30 and the PFC section 11 and AC-DC conversion section 12 of the first substrate 10, and the DC-DC converter 12 of the second substrate 20. Furthermore, as shown in Fig. 6, the frame ground section 101 may be provided separately or independently from the first substrate 10 and the second substrate 20, and capacitive coupling may be performed between the separated or independent frame ground section 101 and the noise shielding section 30, the PFC section 11 and AC-DC conversion section 12 of the first substrate 10, and the DC-DC converter 12 of the second substrate 20.

[0040] As shown in FIG. 7, the capacitive coupling may be set using a capacitor 40 that corresponds to a predetermined frequency band of noise.

[0041] 8, noise shielding section 30 has elongated slit section 303 formed as a slot antenna, and resistive member 304 for absorbing electromagnetic noise is inserted into slit section 303. This allows the electric field of electromagnetic noise to be concentrated in the slit section, allowing resistive member 304 to effectively absorb the electromagnetic noise. It is preferable to set one side of slit portion 303 to a length equal to an integral fraction of the wavelength corresponding to the predetermined frequency band of noise. For example, if the predetermined frequency band is 2.4 GHz, the wavelength is approximately 120 mm, so it is more preferable to set one side of noise shielding portion 30 to a length equal to one-half the wavelength, that is, approximately 120 mm, and one side of slit portion 303 to a length equal to half the wavelength, that is, approximately 60 mm. This further concentrates the electric field of the electromagnetic noise in slit portion 303, allowing resistance member 304 to effectively absorb the electromagnetic noise.

[0042] When the predetermined frequency f is a microwave between 300 MHz and 300 GHz, this also applies to the Wi-Fi (Wireless Fidelity) frequency band of 2.4 GHz or 5 GHz. For example, the wavelength λ of a microwave with a frequency f of 2.4 GHz can be calculated using Equation 1, where c is the speed of light. For example, when the frequency f is 2.4 GHz, c is approximately 3×10 8 Since the wavelength is m / s, the wavelength is approximately 120 mm. In this case, the length of one side of the noise shielding portion 30 can be set to an integer fraction of the wavelength corresponding to the predetermined frequency band of the noise, for example, 60 mm (1 / 2 the wavelength), 40 mm (1 / 3 the wavelength), 30 mm (1 / 4 the wavelength), etc.

[0043] [Formula 1] λ(m)=c(m / s) / f(Hz) 0.12(m)=3×10 8 (m / s) / 2.4×10 9 (Hz)

[0044] As shown in FIG. 9, the second substrate 20 and noise shielding portion 30 of the present invention preferably have, for example, a silicone sheet 50 between the second substrate 20 and the noise shielding portion 30. As the silicone sheet 50, a silicone sheet 50 containing ceramic filler or the like can be used. A silicone sheet 50 containing ceramic filler is advantageous in that it has characteristics such as high insulation and heat dissipation. The silicone sheet 50 has a predetermined dielectric constant and has a capacitor effect. As shown in Equation 2, the electrostatic capacitance (capacitor effect) increases in proportion to the dielectric constant.

[0045] [Formula 2] C (capacitance) = ε (dielectric constant) × S (area) / d (distance between second substrate 10 and noise shielding section 30)

[0046] 10, the noise shielding section 30 of the present invention may be made of a bent metal plate material. The noise shielding section 30 may be made of a bent metal plate material welded at the bent portion.

[0047] As shown in FIG. 11, the second substrate 20 of the present invention is configured to be surrounded by the noise shielding portion 30, and the noise shielding portion 30 has a cavity 305 between itself and the second substrate 20.

[0048] As shown in FIG. 12, the second substrate 20 and the noise shielding portion 30 may have a silicone sheet 50 between them, which has insulating and heat-dissipating properties.

[0049] 13, the noise shielding portion 30 may be in a mesh shape. As shown in Equation 3, the shorter the length of one side of the mesh (the finer the mesh), the greater the amount of noise attenuation. Furthermore, by making the noise shielding portion 30 in a mesh shape, heat dissipation can also be improved.

[0050] [Formula 3] D = 20log(λ / 2g) D: Noise attenuation (dB) λ: Wavelength (m) g: length of one side of the mesh (m)

[0051] Here, we will show a simulation example of noise generation in the electronic device 1. The electronic device 1 shown in Fig. 14 and Fig. 15 is configured without a noise shielding portion 30. In this electronic device 1, as shown in Fig. 16, it has been confirmed that noise occurs in the second substrate 20 via capacitive coupling (parasitic capacitance) between the first substrate 10 and the second substrate 20 at the timing when the voltage of the first substrate 10 changes sharply. Note that noise may also propagate due to magnetic coupling.

[0052] 17 and 18 is configured to include a noise shielding section 30. This electronic device 1 shows a configuration example in which the noise shielding section 30 is capacitively coupled to a frame ground section 101 that is separate and independent from the first substrate 10 and the second substrate 20.

[0053] As shown in FIG. 19, it has been confirmed that by increasing the coupling capacitance of the capacitive coupling between the noise shielding portion 30 and the frame ground portion 101, noise generation can be reduced even without directly electrically connecting the frame ground portion 101 to the frame ground (e.g., the potential of the housing).

[0054] As described above, according to the electronic device 1, the first substrate 10 and the second substrate 20 are electrically connected, the noise shielding section 30 shields the propagation of electromagnetic noise generated from the first substrate 10 and / or the second substrate 20, and the first substrate and / or the second substrate are capacitively coupled, so that even if it is difficult to directly install the noise shielding section 30 on the first substrate 10 and the second substrate 20 from the perspective of ensuring the insulation distance of the noise shielding section 30, it is possible to suppress noise and ensure a mounting area. Furthermore, the electronic device 1 can have a heat dissipation function related to the first substrate 10 or the second substrate 20.

[0055] According to the electronic device 1, the noise shielding section 30 is capacitively coupled to the first substrate 10 and the second substrate 20, and the capacitive coupling is set to correspond to a predetermined frequency band of noise, so that the propagation of electromagnetic noise generated from the first substrate 10 or the second substrate 20 can be selectively shielded.

[0056] According to the electronic device 1, the noise shielding portion 30 has a predetermined shape corresponding to a predetermined frequency band of noise, and is therefore able to selectively shield the propagation of electromagnetic noise generated from the first substrate 10 or the second substrate 20. The predetermined shape is preferably adjusted in accordance with the noise level of a predetermined frequency band required by the noise standard.

[0057] According to the electronic device 1, the noise shielding section 30 includes the movable section 301, and can selectively shield noise of a corresponding predetermined frequency by deforming the movable section 301. The deformation of the movable section 301 is preferably adjusted in accordance with the noise level of a predetermined frequency band required by the noise standard.

[0058] More specifically, according to the electronic device 1, the noise shielding section 30 has a movable section 301, which can be deformed into a predetermined shape corresponding to a predetermined frequency band of noise, and therefore can selectively shield the propagation of electromagnetic noise generated from the first substrate 10 or the second substrate 20.

[0059] According to the electronic device 1, the predetermined shape of the noise shielding section 30 is set so that one side of the noise shielding section 30 has a length that is an integer fraction of the wavelength corresponding to the predetermined frequency band of noise, making it possible to selectively shield noise of the corresponding predetermined frequency; more specifically, it is possible to selectively shield the propagation of electromagnetic noise generated from the first substrate 10 or the second substrate 20.

[0060] According to the electronic device 1, the predetermined shape of the noise shielding section 30 is such that one side of the noise shielding section 30 has a length that is half the wavelength corresponding to a predetermined frequency band of noise, making it possible to selectively shield noise of the corresponding predetermined frequency; more specifically, it is possible to selectively shield the propagation of electromagnetic noise generated from the first substrate 10 or the second substrate 20.

[0061] According to the electronic device 1, the first substrate 10 and the second substrate 20 have a frame ground portion 101, and capacitive coupling is made to the frame ground portion 101, so that the noise shielding portion 30 can block the propagation of electromagnetic noise generated from the first substrate 10 and / or the second substrate 20. Furthermore, even if it is difficult to directly install the noise shielding portion 30 on the first substrate 10 and the second substrate 20 in terms of ensuring the insulation distance, it is possible to suppress noise and ensure the mounting area. Furthermore, it is possible to have a heat dissipation function related to the first substrate 10 or the second substrate 20.

[0062] In the electronic device 1, the capacitive coupling is set using a capacitor 40 corresponding to a predetermined frequency band of noise, so the noise shielding unit 30 can shield the propagation of electromagnetic noise generated from the first substrate 10 and / or the second substrate 20. Even if it is difficult to directly install the noise shielding unit 30 on the first substrate 10 and the second substrate 20 from the perspective of ensuring the insulation distance of the noise shielding unit 30, noise suppression and securing of the mounting area can be achieved. Furthermore, the propagation of electromagnetic noise generated from the first substrate 10 or the second substrate 20 can be selectively shielded. The constant of the capacitor 40 is preferably adjusted according to the noise level in the predetermined frequency band required by the noise standard.

[0063] In the electronic device 1, the noise shielding section 30 has a slit section 303 formed as a slot antenna, and a resistive member 304 for absorbing electromagnetic noise is inserted into the slit section 303, so that the noise shielding section 30 can block the propagation of electromagnetic noise generated from the first substrate 10 and / or the second substrate 20.

[0064] In the electronic device 1, when the length of one side of the slit portion 303 is set to an integer fraction of the wavelength corresponding to a predetermined frequency band of noise, it becomes possible to selectively block noise of the corresponding predetermined frequency.

[0065] In the electronic device 1, when one side of the slit portion 303 is set to a length that is half the wavelength corresponding to a predetermined frequency band of noise, it becomes possible to selectively block noise of the corresponding predetermined frequency.

[0066] The noise shielding section 30 has the cavity 305, and therefore can block the propagation of electromagnetic noise generated from the first substrate 10 and / or the second substrate 20.

[0067] In the electronic device 1, particularly when the specified frequency is 2.4 GHz or 5 GHz, which is the frequency band of Wi-Fi (Wireless Fidelity), the noise shielding section 30 can selectively shield the propagation of electromagnetic noise that affects the frequency band of Wi-Fi (Wireless Fidelity) and is generated from the first substrate 10 and / or the second substrate 20.

[0068] In the electronic device 1, the movable part 32 is preferably made of a metal plate connected by a hinge 33. This makes it possible to selectively block electromagnetic noise of a predetermined frequency.

[0069] In the electronic device 1, it is preferable to use, for example, an aluminum alloy material (aluminum 5000 series (e.g., A5052)) for the noise shielding portion 30. This is advantageous in terms of corrosion resistance and workability (easy to cut, weldable), and is less susceptible to salt damage, contributing to improved reliability of the entire system and reduced manufacturing costs.

[0070] According to the electronic device 1, using copper as the material for the noise shielding portion 30 is advantageous in terms of corrosion resistance and weather resistance, is less susceptible to salt damage, improves the reliability of the entire system, and contributes to reducing manufacturing costs.

[0071] More specifically, in the electronic device 1, it is suitable to use, for example, tough pitch copper C1100 for the noise shielding portion 30. Tough pitch copper C1100 has high electrical conductivity, thermal conductivity, and workability (ductility and drawability), and is advantageous in terms of corrosion resistance and weather resistance, is less susceptible to salt damage, and contributes to improving the reliability of the entire system and reducing manufacturing costs.

[0072] In the electronic device 1, it is preferable that a silicone sheet, for example, is provided between the second substrate 20 and the noise shielding portion 30. As the silicone sheet, a silicone sheet containing a ceramic filler or the like is used. A silicone sheet containing a ceramic filler is advantageous in that it has characteristics such as high insulation and heat dissipation, and contributes to improving the reliability of the entire system and reducing manufacturing costs.

[0073] In the electronic device 1, it is preferable to use a folded metal plate for the noise shielding section 30. By using a folded metal plate, it is possible to suppress noise and ensure a sufficient mounting area even when it is difficult to ensure the insulation distance of the noise shielding section 30. Furthermore, it is possible to improve the heat dissipation function of the first substrate 10 or the second substrate 20.

[0074] In the electronic device 1, it is preferable to use a welded metal plate material for the noise shielding section 30. By using a welded metal plate material, it is possible to suppress noise and ensure a mounting area even when it is difficult to ensure the insulation distance of the noise shielding section 30. Furthermore, it is possible to provide a heat dissipation function related to the first substrate 10 or the second substrate 20.

[0075] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications and applications are possible.

[0076] That is, in the above-described embodiment, the noise shielding unit 30 is capacitively coupled to the first substrate 10 and the second substrate 20, but it may be capacitively coupled to either the first substrate 10 or the second substrate 20. That is, the noise shielding unit 30 can achieve the desired effect as long as it is capacitively coupled to the first substrate 10 and / or the second substrate 20.

[0077] Furthermore, in the above-described embodiment, both the first substrate 10 and the second substrate 20 have the frame ground portion 101, but only one of the first substrate 10 and the second substrate 20 may have the frame ground portion 101. In other words, as long as the first substrate 10 and / or the second substrate 20 has a frame ground portion and capacitive coupling is made to the frame ground portion 101, the desired effect is achieved. [Explanation of symbols]

[0078] 1:Electronic equipment 10: First board 11:PFC section (power factor improvement section) 12: AC-DC conversion section 13: DC-DC converter section 101, 101A, 101B: Frame ground 20: Second board 30: Noise shielding section 31: Base 32: Moving part 33: Hinge 303: Slit section 304: Resistance material 305: Cavity 40: Capacitor 50: Silicone sheet

Claims

1. An electronic device comprising a first substrate, a second substrate, and a noise shielding portion, the first substrate and the second substrate are electrically connected to each other; An electronic device characterized in that the noise shielding portion shields the propagation of electromagnetic noise generated from the first substrate and / or the second substrate, and is capacitively coupled to the first substrate and / or the second substrate.

2. 2. The electronic device according to claim 1, wherein the capacitive coupling is set in accordance with a predetermined frequency band of the noise.

3. 2. The electronic device according to claim 1, wherein the noise shielding portion has a predetermined shape corresponding to a predetermined frequency band of the noise.

4. 4. The electronic device according to claim 3, wherein the noise shielding portion includes a movable portion, and the movable portion is deformable into a predetermined shape corresponding to a predetermined frequency band of the noise.

5. 5. The electronic device according to claim 3, wherein the predetermined shape is set so that one side of the noise shielding portion has a length that is an integral fraction of a wavelength corresponding to the predetermined frequency band of the noise.

6. 6. The electronic device according to claim 5, wherein the integral fraction of the length is half the length.

7. 2. The electronic device according to claim 1, wherein the first substrate and / or the second substrate has a frame ground portion, and the capacitive coupling is performed with the frame ground portion.

8. 2. The electronic device according to claim 1, wherein the capacitive coupling is set using a capacitor corresponding to a predetermined frequency band of the noise.

9. 2. The electronic device according to claim 1, wherein the noise shielding portion has a slit portion formed therein as a slot antenna, and a resistive member for absorbing electromagnetic noise is inserted into the slit portion.

10. 5. The electronic device according to claim 3, wherein one side of the slit portion is set to a length that is an integral fraction of a wavelength corresponding to the predetermined frequency band of the noise.

11. 11. The electronic device according to claim 10, wherein the integral fraction of the length is half the length.

12. The electronic device according to claim 3 , wherein the noise shielding portion has a cavity.

13. 3. The electronic device according to claim 2, wherein the predetermined frequency is 2.4 GHz or 5 GHz, which is a frequency band of Wi-Fi (Wireless Fidelity).

14. 5. The electronic device according to claim 4, wherein the noise shielding portion has a movable portion, and the movable portion is made of a metal plate connected by a hinge.

15. 2. The electronic device according to claim 1, wherein the noise shielding portion is made of an aluminum alloy material.

16. 2. The electronic device according to claim 1, wherein the noise shielding portion is made of copper.

17. 2. The electronic device according to claim 1, wherein the second substrate and the noise shielding portion have a silicone sheet therebetween, the silicone sheet having insulating and heat-dissipating properties.

18. 2. The electronic device according to claim 1, wherein the noise shielding portion is made of a folded metal plate.

19. 2. The electronic device according to claim 1, wherein the noise shielding portion is made of a welded metal plate.

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