Centerfinding for process kit or process kit carrier at manufacturing system

Abstract

To provide a method, manufacturing system, and non-temporary computer-readable storage medium for finding a center of a process kit and / or a process kit ring.SOLUTION: A method includes: moving an object placed on an end effector past a sensor of a manufacturing system; receiving a first signal indicating a current shape of the object from the sensor of the manufacturing system; determining whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and / or a process kit carrier; and, in response to a determination that the first signal corresponds to the second signal, determining a coordinate correspondence between coordinates of the center of the object and coordinates of the center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE

[0001] Embodiments of the present disclosure relate generally to manufacturing systems, and more particularly to locating the center of a process kit or process kit carrier in a manufacturing system. [Background technology]

[0002]

[0002] Accurate positioning of substrates and other substrate processing components (e.g., process kits, process kit carriers, etc.) at stations of a manufacturing system is useful for maintaining the quality and consistency of substrates processed in the manufacturing system. For example, a robot of the manufacturing system may move the process kit and process kit carrier to a station of the manufacturing system so that it engages with a substrate at that station. If the robot does not accurately position the process kit and process kit carrier at the station (e.g., corresponding to the positioning of the substrate at the station), the process kit and process kit carrier may not engage the substrate, and instead the substrate may be damaged. Summary of the Invention

[0003] Some described embodiments are directed to a method that includes moving an object placed on an end effector past a set of sensors of a manufacturing system. The method also includes receiving a first set of signals from the set of sensors of the manufacturing system, each signal indicating a current shape of the object placed on the end effector. The method also includes determining whether each of the first set of signals corresponds to one of a second set of signals, where each of the second set of signals indicates a predefined shape for at least one of a process kit or a process kit carrier. The method also includes determining a correspondence between a center of the object and a center of the end effector in response to determining that each of the first set of signals corresponds to a respective signal of the second set of signals. The determined correspondence indicates whether the current placement of the object on the end effector satisfies a target placement criterion.

[0004] In some embodiments, a manufacturing system includes a robot arm including an end effector and a controller operably coupled to the robot arm. The controller is configured to perform an operation including moving an object placed on the end effector of the robot arm past a set of sensors of the manufacturing system. The controller is also configured to perform an operation including receiving, from the set of sensors of the manufacturing system, a first set of signals, each of which indicates a current shape of the object placed on the end effector. The controller is also configured to perform an operation including determining whether each of the first set of signals corresponds to one of a second set of signals, where each of the second set of signals indicates a predefined shape for at least one of the process kit or the process kit carrier. The controller is also configured to perform an operation including determining a correspondence between a center of the object and a center of the end effector in response to determining that each of the first set of signals corresponds to a respective signal of the second set of signals. The determined correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

[0005] In some embodiments, a non-transitory computer-readable medium includes instructions that, when executed by a processing device, cause the processing device to perform an operation including moving an object placed on an end effector of a robot arm past a set of sensors of a manufacturing system. The processing device is also configured to perform an operation including receiving, from the set of sensors of the manufacturing system, a first set of signals, each of which indicates a current shape of the object placed on the end effector. The processing device is also configured to perform an operation including determining whether each of the first set of signals corresponds to one of a second set of signals, where each of the second set of signals indicates a predefined shape for at least one of the process kit or the process kit carrier. The processing device is also configured to perform an operation including determining, in response to determining that each of the first set of signals corresponds to a respective signal of the second set of signals, a correspondence between a center of the object and a center of the end effector. The determined correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

[0006]

[0006] The present disclosure is presented by way of example, and not by way of limitation, in the accompanying drawings, in which like reference numerals indicate similar elements. It should be noted that different references to "an" or "one" embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one. [Brief explanation of the drawings]

[0007] [Figure 1]

[0007] FIG. 1 is a top view schematic diagram of an exemplary manufacturing system according to several aspects of the present disclosure. [Figure 2A]

[0008] 1 illustrates a side view of a station of a manufacturing system including one or more sensors, according to aspects of the present disclosure. [Figure 2B]1 illustrates a side view of a station of a manufacturing system including one or more sensors, according to aspects of the present disclosure. [Figure 3A]

[0009] 1 illustrates an end effector of a robotic arm according to aspects of the present disclosure. [Figure 3B]

[0010] 1 illustrates an end effector moving a substrate process kit and a substrate process kit carrier to a station of a manufacturing system, according to aspects of the present disclosure. [Figure 4]

[0011] 1 is a flowchart of a method for obtaining a signal indicative of a shape of a process kit and / or a process kit carrier according to aspects of the present disclosure. [Figure 5]

[0012] 1 is a flowchart of a method for determining a correspondence between a center of a process kit and / or process kit carrier and a center of an end effector, according to aspects of the present disclosure. [Figure 6A]

[0013] 1 illustrates a sensor of a manufacturing system detecting a substrate process kit at a target location on an end effector, according to aspects of the present disclosure. [Figure 6B]

[0014] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 6C] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 6D] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 7A]

[0015] 1 illustrates a manufacturing system sensor detecting a process kit and a carrier at a target location on an end effector, according to aspects of the present disclosure. [Figure 7B]

[0016] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 7C] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 7D] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 8A]

[0017] 1 illustrates a sensor of a manufacturing system detecting a process kit on an end effector of a robotic arm, according to aspects of the present disclosure. [Figure 8B]

[0018] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 8C] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 8D] 1 illustrates a signal generated by a sensor at the entrance of a station of a manufacturing system, according to aspects of the present disclosure. [Figure 9]

[0019] 1 shows a diagrammatic representation of a machine, taking the example form of a computing device, within which a set of instructions for causing the machine to perform any one or more of the methods described herein may be executed. DETAILED DESCRIPTION OF THE INVENTION

[0008]

[0020] Embodiments described herein relate to methods and systems for locating the center of a process kit or process kit carrier in a manufacturing system. A process kit (also called a process ring or edge ring) may be placed in a processing chamber of a manufacturing system to maintain a substrate at a specific location and / or position during processing. The process kit may begin to degrade over time and may be replaced with a new process kit. In some embodiments, an end effector of a robot arm may engage one or more portions of the process kit (i.e., remove it from or move it into a processing chamber). The robot arm may move the process kit ring to various stations in the manufacturing system. In other or similar embodiments, a process kit ring carrier (also called a carrier) may engage the process kit ring. The end effector of the robot arm may engage the carrier to move the process kit into and out of a processing chamber.

[0009]

[0021] The process kit is placed at a specific location (called a target location) within the processing chamber. If the process kit is not placed at the target location before a process is performed in the processing chamber, the process kit may not successfully maintain the substrate at the specific location and / or position during processing. The substrate may contain a significant number of defects. The process kit and / or carrier may be placed at a specific location (called a target location) on the end effector to enable the end effector to position the process kit at the target location. The process kit and / or carrier may be placed at the target location relative to the center of the end effector. For example, the process kit and / or carrier is placed at the target location of the end effector when the center of the process kit and / or carrier corresponds to (is approximately aligned with) the center of the end effector.

[0010]

[0022] Traditionally, manufacturing systems attempt to place a process kit and / or carrier at a target location on the end effector when the end effector engages the process kit and / or carrier. However, as the end effector moves the process kit and / or carrier to or from a processing chamber, the location of the process kit and / or carrier may shift. If the process kit and / or carrier is at the target location on the end effector when the end effector begins to position the process kit, the end effector may not place the process kit at the target location on the processing chamber. Furthermore, if the process kit and / or carrier is at the target location when the robot arm moves the process kit and / or carrier to a processing chamber, the process kit and / or carrier may become dislodged from the end effector or cause damage to other equipment in the manufacturing system. Such damage can be difficult and expensive to repair, meaning that at least a portion of the manufacturing system may be unavailable for a significant period of time. If a portion of the manufacturing system is unavailable for an extended period of time, the efficiency and yield of the entire manufacturing system may be reduced.

[0011]

[0023] The methods and systems herein use multiple sensors positioned at various stations of a manufacturing system to detect the placement of a process kit and / or carrier on an end effector before the end effector places the process kit and / or carrier in a particular station (e.g., a processing chamber) of the manufacturing system. In some embodiments, a set of sensors may be positioned at the entrance of a station of the manufacturing system, and each sensor may include a first element and a second element. The end effector may move the process kit and / or carrier between the first element and the second element as it moves the process kit and / or carrier toward or away from the entrance of the station. Each sensor may detect whether the end effector or the process kit and / or carrier interrupts a signal transmitted between the first element and the second element as the end effector moves the process kit and / or carrier, and may send data to a system controller indicating whether the signal for the respective sensor is interrupted or not. The system controller receives data from each sensor and determines whether the shape of the signal for each sensor corresponds to a respective signal indicative of a predefined shape for the process kit and / or carrier. In response to determining that the respective signals correspond to the respective signals, the system controller determines a correspondence between the center of the process kit and / or carrier and the center of the end effector. The determined correspondence indicates whether the placement of the process kit and / or carrier on the end effector meets the target placement criteria. Based on the determined correspondence, the system controller can determine whether an adjustment to the process recipe for the robot arm can be made to cause the end effector to place the process kit and / or carrier at the target location of the station. In response to determining that an adjustment can be made, the system controller can make the adjustment to cause the end effector to place the process kit and / or carrier at the target location.If the system controller determines that no adjustments can be made, the system controller may send a message to an operator of the manufacturing system indicating that the process kit and / or carrier cannot be placed at the target position of the station.

[0012]

[0024] Embodiments of the present disclosure address the shortcomings of conventional systems described above because they enable a system controller of a manufacturing system to make on-the-fly adjustments to a process recipe for a robot arm before the end effector places a process kit and / or carrier at a station. Sensors positioned at the entrance to the station can detect the current shape of the process kit and / or carrier. The system controller can identify the center of the process kit and / or carrier based on the detected current shape and determine whether the process kit and / or carrier is located at a target location on the end effector based on the identified center. Based on the location of the process kit and / or carrier on the end effector, the system controller can determine whether adjustments to the process recipe for the robot arm can be made to enable the end effector to place the process kit and / or carrier at the target location of the station. Adjusting the process recipe for the robot arm based on the determined location of the process kit and / or carrier on the end effector increases the likelihood that the end effector will be able to place the process kit and / or carrier at the target location of the station. Each process kit placed at a target location in a processing chamber reduces the number of defects on substrates processed in the processing chamber. As a result, the efficiency of the entire manufacturing system and the overall yield are improved. Furthermore, in some cases, the system controller may determine that adjustments to the process recipe for the robot arm cannot be made to allow the end effector to place the process kit at the target location of the station and may send an error message to an operator of the manufacturing system. When the system controller sends an error message to the operator and does not attempt to place the process kit at the target location, the likelihood of the process kit and / or carrier becoming dislodged from the end effector and / or damaging equipment in the manufacturing system is reduced.As a result, the total number of expensive repairs to the manufacturing system is reduced and the total uptime of each part of the manufacturing system is increased.

[0013]

[0025] 1 is a schematic top view of an exemplary manufacturing system according to aspects of the present disclosure. The manufacturing system 100 can perform one or more processes on a substrate 102. The substrate 102 can be any suitably rigid, dimensionally consistent, planar article (e.g., a silicon-containing disk or wafer, a patterned wafer, a glass plate, etc.) suitable for fabricating electronic devices or circuit components thereon.

[0014]

[0026] The manufacturing system 100 may include a process tool 104 and a factory interface 106 coupled to the process tool 104. The process tool 104 may include a housing 108 having a transfer chamber 110 therein. The transfer chamber 110 may include one or more process chambers (also called processing chambers) 114, 116, 118 arranged around and coupled to the transfer chamber 110. The process chambers 114, 116, 118 may be coupled to the transfer chamber 110 through respective ports, such as slit valves.

[0015]

[0027] The process chambers 114, 116, and 118 may be adapted to perform any number of processes on the substrate 102. The same or different substrate processes may be performed in each process chamber 114, 116, and 118. The substrate processes may include atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, hardening, pre-cleaning, metal or metal oxide removal, and the like. In one example, a PVD process may be performed in one or both process chambers 114, an etching process may be performed in one or both process chambers 116, and an annealing process may be performed in one or both process chambers 118. Other processes may also be performed on the substrate 102 in the process chambers. The process chambers 114, 116, and 118 may each include a substrate support assembly. The substrate support assembly may be configured to hold the substrate 102 in place while the substrate process is being performed.

[0016]

[0028] As described above, an etching process may be performed in one or more processing chambers 114, 116, 118. Accordingly, some process chambers 114, 116, 118 (e.g., etch chambers) may include a process kit (also referred to as an edge ring or process kit ring) positioned on a surface of a substrate support assembly. An exemplary process kit may include process kit 310 of FIG. 3B. In some embodiments, process kits may be replaced from time to time. While replacing a process kit in conventional systems involves an operator disassembling the process chambers 114, 116, 118 to replace the process kit, the manufacturing system 100 may be configured to facilitate replacing a process kit without an operator disassembling the process chambers 114, 116, 118.

[0017]

[0029] In some embodiments, the process chambers 114, 116, 118 may include a carousel (also referred to as a susceptor). The carousel may be disposed within the interior space of the process chambers 114, 116, 118 and configured to rotate about an axial center of the process chambers 114, 116, 118 during a process (e.g., a deposition process) to ensure uniform distribution of process gases. In some embodiments, the carousel may include one or more end effectors configured to handle one or more objects. For example, the end effectors may be configured to hold substrates, process kits, and / or process kit carriers. According to embodiments described herein, one or more sensors may be disposed in the process chambers 114, 116, 118 and configured to detect the placement of an object on the carousel end effector.

[0018]

[0030] The transfer chamber 110 may also include a transfer chamber robot 112. The transfer chamber robot 112 may include one or more arms, where each arm includes one or more end effectors at the end of each arm. The end effectors may be configured to handle a particular object, such as a substrate. Alternatively, or in addition, the end effectors may be configured to handle a process kit (i.e., using a process kit carrier). In some embodiments, the transfer chamber robot 112 may be a selective compliance assembly robot arm (SCARA) robot, such as a two-link SCARA robot, a three-link SCARA robot, or a four-link SCARA robot.

[0019]

[0031] A load lock 120 may also be coupled to the housing 108 and the transfer chamber 110. The load lock 120 may be configured to interact with and be coupled to the transfer chamber 110 on one side and the factory interface 106 on the other side. In some embodiments, the load lock 120 may have an environmentally controlled atmosphere that can change from a reduced pressure environment (where substrates are transferred to and from the transfer chamber 110) to an inert gas environment at or near atmospheric pressure (where substrates are transferred to and from the factory interface 106). In some embodiments, the load lock 120 may be a stacked load lock having a pair of upper and lower internal chambers positioned at different vertical heights (e.g., one above the other). In some embodiments, the pair of upper internal chambers may be configured to receive processed substrates from the transfer chamber 110 for removal from the process tool 104. Meanwhile, the pair of lower internal chambers may be configured to receive substrates from the factory interface 106 for processing within the process tool 104. In some embodiments, the load lock 120 may be configured to perform a substrate process (e.g., etch or pre-clean) on one or more substrates 102 received therein.

[0020]

[0032] The factory interface 106 may be any suitable enclosure (e.g., a front-end equipment module (EFEM), etc.). The factory interface 106 may be configured to receive substrates 102 from substrate carriers 122 (e.g., front-opening unified pods (FOPS)) docked to various load ports 124 of the factory interface 106. A factory interface robot 126 (shown in dotted lines) may be configured to transfer substrates 102 between the substrate carriers (also called containers) 122 and the load locks 120. In other and / or similar embodiments, the factory interface 106 may be configured to receive replacement parts (e.g., process kits) from a replacement parts storage container 123. The factory interface robot 126 may include one or more robot arms and may be or include a SCARA robot. In some embodiments, the factory interface robot 126 may have more links and / or degrees of freedom than the transfer chamber robot 112. The factory interface robot 126 may include an end effector on the end of each robot arm. The end effector may be configured to pick up and handle a particular object, such as a substrate or a process kit. Alternatively or additionally, the end effector may be configured to handle an object, such as a process kit (e.g., using a process kit carrier).

[0021]

[0033] Any conventional robot type may be used for the factory interface robot 126. Transfers may be performed in any order or in any direction. In some embodiments, the factory interface 106 may be maintained in a non-reactive gas environment, for example, at a slight positive pressure (e.g., using nitrogen as the non-reactive gas).

[0022]

[0034] In some embodiments, the transfer chamber 110, the process chambers 114, 116, and 118, and the load lock 120 may be maintained at a reduced pressure level. The manufacturing system 100 may include one or more reduced pressure ports coupled to one or more stations of the manufacturing system 100. For example, a first reduced pressure port 130a may couple the factory interface 106 to the load lock 120. A second reduced pressure port 130b may be coupled to the load lock 120 and may be disposed between the load lock 120 and the transfer chamber 110.

[0023]

[0035] In some embodiments, one or more sensors may be included in one or more stations of the manufacturing system 100. For example, one or more sensors may be included in the transfer chamber 110, at or near the ports (i.e., entrances) of the processing chambers 114, 116, 118. An end effector of a robot arm (e.g., of the transfer chamber robot 112) may move the substrate 102 or process kit (i.e., using a process kit carrier) past one or more sensors as the substrate 102 and / or process kit is moved into or out of the process chambers 114, 116, 118. Each sensor may be configured to detect the substrate 102 or process kit and / or carrier as the end effector moves the substrate 102 or process kit and / or carrier into or out of the process chambers 114, 116, 118. Each sensor may be further configured to detect a shape of the substrate 102 and / or process kit on the end effector as the end effector moves the substrate 102 or process kit and / or carrier into or out of the process chambers 114, 116, 118. Further details regarding the one or more sensors are provided herein.

[0024]

[0036] The manufacturing system 100 may also include a system controller 128. The system controller 128 may be and / or include a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. The system controller 128 may include one or more processing devices, which may be general-purpose processing devices such as a microprocessor or a central processing unit. More specifically, the processing device may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or combinations of instruction sets. The processing device may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The system controller 128 may include a data storage device (e.g., one or more disk drives and / or solid-state drives), a main memory, a static memory, a network interface, and / or other components. System controller 128 may execute instructions to perform any one or more of the methods and / or embodiments described herein, which may be stored (during execution of the instructions) in a computer-readable storage medium, which may include main memory, static memory, a secondary storage device, and / or a processing device.

[0025]

[0037] In one embodiment, the system controller 128 may execute instructions to cause an end effector of a robot arm (e.g., of the transfer chamber robot 112) to move an object (i.e., a substrate 102 and / or a process kit) from a first station (e.g., the load lock 120) of the manufacturing system 100 to a second station (e.g., the process chambers 114, 116, 118) of the manufacturing system 100. In response to executing the instructions to move the object from the first station to the second station, the system controller 128 may receive a set of signals from one or more sensors included at an entrance to the first station or the second station. Each signal may indicate the current shape of the object placed on the end effector of the robot arm. In some embodiments, the system controller 128 may determine the position of the object placed on the end effector of the robot arm based on each signal received from the one or more sensors. For example, the system controller 128 may compare the current shape of the process kit and / or carrier with a predefined shape for the process kit and / or carrier to determine whether the current shape corresponds to the predefined shape for the process kit and / or carrier. In response to determining that the current shape corresponds to the predefined shape for the process kit and / or carrier, the system controller 128 may identify a first set of coordinates corresponding to the center of the process kit and / or carrier based on the received signals. The system controller 128 may compare the first set of coordinates corresponding to the center of the process kit and / or carrier with a second set of coordinates corresponding to the center of the end effector to determine a correspondence between the first set of coordinates and the second set of coordinates. According to several embodiments described herein, the system controller 128 may determine whether the center of the process kit and / or carrier is located at a target position relative to the center of the end effector based on the determined coordinate correspondence.

[0026]

[0038] While embodiments of the present disclosure are directed to determining the center of a process kit and / or carrier placed on an end effector of a robot arm (e.g., of a transfer chamber robot or a factory interface robot), it should be noted that embodiments of the present disclosure may also be applied to determining the center of a process kit and / or carrier placed on other components of a manufacturing system. For example, according to embodiments described herein, a process kit and / or carrier may be placed on an end effector of a rotating carousel or a rotating susceptor in the process chambers 114, 116, and 118. According to embodiments described above, one or more sensors may be positioned within the process chamber to detect the position of the process kit and / or carrier on the rotating carousel. According to embodiments described herein, the one or more sensors may send a signal to the system controller 128, as described above, and the system controller 128 may detect the center of the process kit and / or carrier on the rotating susceptor based on the received signal.

[0027]

[0039] 2A-2B illustrate side views of a station of the transfer chamber 110 including one or more sensors 218, in accordance with aspects of the present disclosure. While some embodiments of the present disclosure include one or more sensors 218 included within the transfer chamber 110, it should be noted that the one or more sensors 218 may be included within any station of the manufacturing system 100. For example, the one or more sensors 218 may be included within the factory interface 106, at the entrance to the load lock 120 and / or at the entrance to the substrate carrier 122 or replacement parts storage container 123. In another example, the one or more sensors 218 may be located within the process chambers 114, 116, 118 of the manufacturing system 100.

[0028]

[0040] The exemplary transfer chamber 110 generally includes a bottom 202, sidewalls 204, and a lid 206 that enclose a process space 208. In some embodiments, a process chamber, such as process chambers 114, 116, 118 of FIG. 1 , may be coupled (e.g., bolted) to the exterior of the transfer chamber 110. A port 210 to the process chamber may be provided between the transfer chamber 110 and the process chamber. In some embodiments, a door may be provided within the port 210 to the process chamber. The door may seal the environment of the process chamber from the environment of the transfer chamber during a manufacturing process (e.g., an etching process).

[0029]

[0041] 1, the transfer chamber 110 may include a transfer chamber robot 112. As previously described, the transfer chamber robot 112 may include a robot arm 212 and an end effector 214 at the end of the robot arm 212. In further or alternative embodiments, as previously described, the end effector 214 may be part of a rotating carousel of the process chambers 114, 116, 118. The transfer chamber robot 112 may be configured to transfer substrates 102, process kits, carriers, etc. between the transfer chamber 110 and the process chambers 114, 116, 118. For example, the end effector 214 of the robot arm 212 may pick up a process kit and / or carrier (e.g., process kit 310 and / or carrier 312 in FIG. 3B) from a load lock 120 of the manufacturing system 100 and move the process kit 310 and / or carrier 312 into the transfer chamber 110. It should be noted that although some embodiments of the present disclosure are directed to the transfer chamber robot 112, embodiments of the present disclosure may be applied to any robot included in a manufacturing system, such as the factory interface robot 126. It should also be noted that embodiments of the present disclosure may be applied to any robot operating in a reduced pressure or non-reduced pressure environment.

[0030]

[0042] In some embodiments, the transfer chamber robot 112 may transfer the process kits 310 and / or carriers 312 between the transfer chamber 110 and the process chambers 114, 116, 118 via the port 210. The port 210 may be selectively sealed by a valve (e.g., a slit valve) to separate the environment of the transfer chamber 110 from the environment of the process chambers 114, 116, 118. While some embodiments of the present disclosure are directed to the transfer chamber robot 112 moving the process kits 310 and / or carriers 312 between the transfer chamber 110 and the process chambers, it should be noted that embodiments of the present disclosure may apply to the transfer of any object (e.g., substrate 102, etc.) between the transfer chamber 110 and the process chambers.

[0031]

[0043] As previously described, the end effector 214 of the robot arm 212 may pick up the process kit 310 and / or carrier 312 from a first station of the manufacturing system 100 and move the process kit 310 and / or carrier 312 to a second station of the manufacturing system 100. Additionally or alternatively, the end effector 214 of the rotating carousel may pick up the process kit 310 and / or carrier 312 within the process chambers 114, 116, 118. The rotating carousel may rotate the process kit 310 and / or carrier 312 placed on the end effector 214 within the process chambers 114, 116, 118.

[0032]

[0044] 3A and 3B illustrate an end effector 214 of a robot arm 212 in accordance with aspects of the present disclosure. In some embodiments, the end effector 214 may include two or more blades 314. Each blade 314 may be configured to interact with a portion of an object (e.g., a substrate, a process kit 310, a process kit carrier 312, etc.). In one illustrative example, the robot arm 212 may move the end effector 214 below the process kit 310 such that each blade 314 is positioned below the process kit 310 in a first station of the manufacturing system 100, and may move the end effector 214 toward the process kit 310 to engage the blade(s) 314 with the process kit 310. In other or similar embodiments, the process kit 310 may be positioned on a carrier 312, as shown in FIG. 3B. The robot arm 212 may move the end effector 214 beneath the process kit 310 and carrier 312 so that each blade 314 is positioned below the process kit 310 and carrier 312, and may move the end effector 214 toward the process kit 310 and carrier 312 to engage the blade(s) 314 with the process kit 310 and / or carrier 312. In some embodiments, the carrier 312 may include one or more components (e.g., pins) configured to engage with one or more sockets of each blade 314 of the end effector 214. In other or similar embodiments, the carrier 312 may include one or more sockets configured to engage with one or more components (e.g., pins) of each blade 314 of the end effector 214.

[0033]

[0045] In some embodiments, the robot arm 212 may engage each blade 314 of the end effector 214 with the process kit 310 and / or carrier 312, thereby positioning the process kit 310 and / or carrier 312 at a target location on the end effector 214. The process kit 310 and / or carrier 312 may be positioned at a target location on the end effector 214 when a particular portion of the process kit 310 and / or carrier 312 corresponds with (e.g., is positioned approximately above or below) a particular portion of the end effector 214. For example, the process kit 310 may be positioned at a target location on the end effector 214 when a center 322 of the process kit 310 and / or carrier 312 corresponds with a center 316 of the end effector 214. In some embodiments, the center 316 of the end effector 214 may be identified by a particular reference feature, such as a reference feature 318, included on a portion of the end effector 214. In other or similar embodiments, the center 316 of the end effector 214 may be identified as a particular location relative to a particular reference feature, such as reference feature(s) 320, or as a particular reference location identified on the end effector 214. For example, the center 316 of the end effector 214 may be located between the blades 314 of the end effector 214. In some embodiments, the system controller 128 may identify the center 316 of the end effector 214 based on the length of each blade 314 of the end effector 214 and the width between each blade 314. In other or similar embodiments, the system controller 128 may identify the center 316 of the end effector 214 based on the distance between the reference features 320.

[0034]

[0046] It should be noted that while embodiments of the present disclosure are directed to target placement of the process kit 310 and / or carrier 312 with respect to the center 316 of the end effector 214, the target placement of the process kit 310 and / or carrier 312 may be determined with respect to any portion of the end effector 214 (e.g., the end of one or more blades 314, the wrist of the end effector 214, etc.). For example, in some embodiments, the end effector 214 may not include a blade 314 but may include other or additional components for supporting the process kit 310 and / or carrier 312. The target placement of the process kit 310 and / or carrier 312 may be determined with respect to other or additional components of the end effector 214.

[0035]

[0047] The system controller 128 may associate the identified center 316 of the end effector 214 with particular coordinates (e.g., Cartesian coordinates, etc.). For purposes of this disclosure, the system controller 128 may associate the identified center 316 of the end effector 214 with coordinates (0,0). However, it should be noted that the system controller 128 may associate the identified center 316 or other portion of the end effector 214 with any coordinates. According to embodiments described herein, the system controller 128 may identify a center 322 of the process kit 310 and / or carrier 312 disposed on the end effector 214 and determine a correspondence between the center 316 of the end effector 214 and the center of the process kit 310 and / or carrier 312.

[0036]

[0048] As described above, the robot arm 212 can engage the end effector 214 with the process kit 310 and / or carrier 312 and move the end effector 214 and the process kit 310 and / or carrier 312 from a first station to a second station of the manufacturing system 100. The robot arm 212 can position the process kit 310 at or near a target position in the second station. In some embodiments, in accordance with embodiments described herein, the robot arm 212 can position the process kit and / or carrier 312 at the target position taking into account a correspondence between the center 316 of the end effector 214 and the center of the process kit 310 and / or carrier 312. In some embodiments, the second station can be a process chamber 114, 116, 118, and the robot arm 212 can position the process kit 310 and / or carrier 312 at or near a substrate support assembly of the process chamber 114, 116, 118. The substrate support assembly may include one or more components (e.g., lift pins) configured to receive the process kit 310 on a surface of the substrate support assembly. The robot arm 212 may cause the end effector 214 to position the process kit 310 and / or the carrier 312 on one or more components of the substrate support assembly. In response to the robot arm 212 positioning the process kit 310 and / or the carrier 312 on one or more components of the substrate support assembly, the robot arm 212 may cause the end effector 214 to disengage the process kit 310 and move the end effector 214 out of the process chamber 114, 116, 118. The one or more components of the substrate support assembly may position the process kit 310 at a target location directly above the surface of the substrate support assembly. A process may then be performed in the process chamber 114, 116, 118.

[0037]

[0049] In some embodiments, the robotic arm 212 and / or the end effector 214 may include a directional encoder (referred to as an encoder) to determine the specific position of the end effector 214 within the manufacturing system 100 .

[0038]

[0050] 2A-2B , the lid 206 of the transfer chamber 110 may include a window 216 positioned proximate to the port 210 (e.g., the entrance to the process chambers 114, 116, 118). The sensor 218 may be positioned on or near the window 216, thereby allowing the sensor 218 to view the end effector 214 and a portion of the process kit 310 and / or carrier 312 as they pass through the port 210. The window 216 may be fabricated from quartz or other materials that do not substantially interfere with the detection mechanism of the sensor 218. In some embodiments, one or more elements of the sensor 218 may be positioned on the exterior of the window 216 to isolate the sensor 218 from the environment of the transfer chamber 110.

[0039]

[0051] In some embodiments, the sensor 218 may be a through beam sensor. For example, the sensor 218 may include a first element 219A and a second element 219B. In some embodiments, the first element 219A may be an emitting element configured to emit a signal 220 (e.g., a light beam) through the window 216 toward a second element 219B disposed on the bottom 202 of the transfer chamber 110. In such embodiments, the second element 219B may be a receiving element configured to receive the signal 220 emitted by the first element 219A. The sensor 218 may determine that an object (e.g., the end effector 214, the substrate 102, the process kit 310, the carrier 312, etc.) is not located at or near the port 210 as long as the signal 220 is received at the second element 219B. As shown in FIG. 2A , neither the end effector 214 nor the process kit 310 and / or the carrier 312 are located at or near the port 210. Thus, the signal 220 emitted by the first element 219A is received at the second element 219B. 2B, the robot arm 212 has moved the end effector 214 supporting the process kit 310 and / or carrier 312 near the port 210. As a result, the process kit 310 and / or carrier 312 block the signal 220 emitted by the first element 219A from being received by the second element 219B. Thus, the sensor 218 can detect that an object (e.g., the end effector 214, the process kit 310, and / or the carrier 312) is positioned at or near the port 210.

[0040]

[0052] In other or similar embodiments, the sensor 218 may be a reflective sensor. For example, the first element 219A may be configured to emit the signal 220, as described above, and the second element 219B may be configured to reflect the signal 220 back to the first element 219A. In such embodiments, the first element 219A may be further configured to determine whether an object is located at or near the port 210 by determining whether the signal 220 emitted from the first element 219A is reflected by the second element 219B back to the first element 219A. As shown in FIG. 2A , neither the end effector 214 nor the process kit 310 and / or carrier 312 is located at or near the port 210. Therefore, the signal 220 emitted by the first element 219A is reflected by the second element 219B back to the first element 219B. 2B, the robot arm 212 has moved the end effector 214, which supports the process kit 310 and / or carrier 312, near the port 210. The process kit 310 and / or carrier 312 prevent the signal 220 from being reflected by the second element 219B and returning to the first element 219A. Thus, the sensor 218 can detect when an object (e.g., the end effector 214, the process kit 310, and / or the carrier 312) is positioned at or near the port 210.

[0041]

[0053] In other or similar embodiments, sensor 218 may be any sensor configured to detect whether an object is placed at or near port 210. For example, sensor 218 may be an optical sensor, a proximity sensor, a mechanical light switch, a Hall effect sensor, a reed switch, or another type of detection mechanism suitable for detecting an object placed at or near port 210.

[0042]

[0054] As previously described, FIG. 3B illustrates an end effector moving a process kit 310 and / or carrier 312 to a station 330 of a manufacturing system in accordance with aspects of the present disclosure. In some embodiments, station 330 may be a processing chamber, such as processing chambers 114, 116, 118 of FIG. 1 . In other or similar embodiments, station 330 may be any station described with respect to FIG. 1 or any other station included in a manufacturing system. One or more sensors, such as sensor 218 of FIGS. 2A-2B , may be positioned at or near an entrance 332 to the station (e.g., port 210) in accordance with previously described embodiments. Each of the one or more sensors 218 may be configured to generate a signal corresponding to a different portion of an object entering or exiting station 330. For example, the first sensor 218A may generate a first signal for a first portion of the process kit 310 and / or carrier 312, the second sensor 218B may generate a second signal for a second portion of the process kit 310 and / or carrier 312, and the third sensor 218C may generate a third signal for a third portion of the process kit 310 and / or carrier 312. As the end effector 214 moves the process kit 310 and / or carrier 312 toward or away from the inlet 332, one or more portions of the process kit 310 and / or carrier 312 may trigger a sensor (i.e., cause a sensor 218 signal to be interrupted). As the end effector 214 continues to move the process kit 310 and / or carrier 312 toward or away from the inlet, one or more portions of the process kit 310 and / or carrier 312 that blocked the signal 220 generated by the sensor 218 may now no longer block the signal (i.e., the signal is received by the emitting element 219A and / or receiving element 219B). Each sensor 218 may generate data associated with its respective signal.The data indicates the instants in time when a portion of the process kit 310 and / or carrier 312 does or does not block the signal 220 as the end effector 214 moves the process kit 310 and / or carrier 312 toward or away from the entrance 332. Further details regarding the signals generated by the sensor 218 are provided herein.

[0043]

[0055] FIG. 4 is a flowchart of a method 400 for acquiring a signal indicative of the shape of a process kit and / or carrier according to aspects of the present disclosure. FIG. 5 is a flowchart of a method 500 for determining a correspondence between a center of a process kit and / or carrier and a center of an end effector according to aspects of the present disclosure. Methods 400 and 500 may be performed by processing logic, which may include hardware (circuitry, dedicated logic, etc.), software (such as those running on a general-purpose computer system or a dedicated machine), firmware, or some combination thereof. Some operations of methods 400 and 500 may be performed by a processing device, such as system controller 128 of FIG. 1.

[0044]

[0056] For simplicity of explanation, methods 400 and 500 are depicted and described as a series of operations. However, operations according to the present disclosure may occur in various orders and / or simultaneously, and may occur with other operations not shown or described herein. Moreover, not all illustrated operations may be performed to implement a method in accordance with the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that these methods may alternatively be represented as a series of interrelated states via a state diagram or events.

[0045]

[0057] 4, at block 410, a process kit and / or carrier is placed at a target position on the end effector of the robot arm. In some embodiments, the process kit can be a calibration process kit and / or the carrier can be a calibration carrier. The calibration process kit and / or carrier can be specifically designed to collect data associated with the signal of the sensor 218, where the data is indicative of the shape of the process kit and / or carrier placed on the end effector 214. For example, the calibration process kit and / or carrier can include specific features (e.g., alignment features, pins, or other components for engaging the end effector) that allow the calibration process kit and / or carrier to be displaced to the target position on the end effector.

[0046]

[0058] In other or similar embodiments, the process kit may be the process kit 310 shown in FIG. 3B and the carrier may be the carrier 312. In such embodiments, one or more measurements may be performed to identify the center 322 of the process kit 310 and / or carrier 312. In response to identifying the center 322 of the process kit 310 and / or carrier 312, the process kit 310 and / or carrier 312 may be positioned at a target location on the end effector 214. As described above, the process kit 310 and / or carrier 312 may be positioned at a target location on the end effector 214 when the center 322 of the process kit 310 and / or carrier 312 corresponds with the center 316 of the end effector 214. In some embodiments, the center 322 corresponds with the center 316 if the process kit and / or carrier 312 is approximately aligned with (i.e., directly above or directly below) the center 316 when positioned on the end effector 214. In other or similar embodiments 322, when the process kit 310 and / or carrier 312 is placed on the end effector 214, the center 322 corresponds to the center 316 if the center 322 is positioned within a certain distance from the center 316.

[0047]

[0059] In some embodiments, an operator of the manufacturing system may place the process kit 310 and / or carrier 312 at the target location of the end effector 214. In other or similar embodiments, one or more automated components of the manufacturing system (e.g., the transfer chamber robot 110) may engage the process kit 310 and / or carrier 312, thereby placing the process kit 310 and / or carrier 312 at the target location of the end effector 214, according to previously described embodiments. While embodiments of the present disclosure are directed to the process kit 310 and / or carrier 312 being placed at the target location of the end effector 214, it should be noted that a calibration process kit and / or calibration carrier may be placed at the target location of the end effector 214, according to previously described embodiments.

[0048]

[0060] Figure 6A shows a process kit 310 positioned at the target location of the end effector 214. As shown in Figure 6A, the center 322 of the process kit 310 corresponds to (i.e., is generally aligned with) the center 316 of the end effector 214. Figure 7A shows a process kit carrier 312 positioned at the target location of the end effector 214. As shown in Figure 7A, the center 322 of the carrier 312 corresponds to the center 316 of the end effector 214.

[0049]

[0061] 4, at block 420, the processing device moves the process kit 310 and / or the process kit carrier 312 proximate to a set of sensors of the manufacturing system. In some embodiments, the set of sensors can include sensors 218A, B, and / or C, as described with respect to FIG. 3B. As shown in FIG. 6A, the robot arm 212 moves the end effector 214 and the process kit 310 toward a station 330 of the manufacturing system. As previously described, a first element 219A of each sensor can send a signal 220 to a second element 219B. When no object is placed between the first element 219A and the second element 219B, the second element 219B may receive the signal 220 from the first element 219A and / or reflect the signal 220 back to the first element 219A (i.e., the signal transmitted between the first element 219A and the second element 219B is not blocked or "blocked"). In response to detecting that the signal 220 has been received or reflected by the second element 219A, the respective sensor may detect that no object is placed between the first element 219A and the second element 219B. The respective sensor's detection of no object being placed between the first element 219A and the second element 219B is referred to as a first state of the signal 220. In response to detecting that the signal 220 is not received or reflected by the second element 219B, each sensor may detect that an object is placed between the first element 219A and the second element 219B (i.e., the signal 220 is blocked between the first element 219A and the second element 219B). The detection of an object being placed between the first element 219A and the second element 219B of each sensor is referred to as a second state of the signal 220. Each sensor 218 may detect a change in the state of the signal 220 when an object passes between the first element 219A and the second element 219B. In response to detecting the change in the state of the signal 220, each sensor 218 may send an instruction to a computing system (e.g., the system controller 128) for the manufacturing system. The system controller 128 may track the change in the state of the signal for each sensor 218 over time.

[0050]

[0062] 6B-6D depict graphs 610-630 showing the change in state of each signal 220 transmitted by the first element 219A of each sensor 218A, B, and C as the robot arm 212 moves the end effector 214 and process kit 310 toward the station 330. In some embodiments, the state of each signal 220 may be the state received by the system controller 128 from each sensor 218A, B, C according to the embodiments described above.

[0051]

[0063] FIG. 6B depicts a graph 610 showing the change in state of a signal 612 transmitted by the first element 219A of the sensor 218A as the end effector 214 and the process kit 310 move toward the station 330. During a first time interval (i.e., T0-T3), neither the end effector 214 nor the process kit 310 is positioned between the first element 219A and the second element 219B of the sensor 218A (i.e., the signal transmitted by the first element 219A of the sensor 218A is “unblocked”). The sensor 218A may send a notification to the system controller indicating that the sensor 218A is unblocked. As seen in FIG. 6B, the signal 612 is associated with a first state (e.g., a value of 1) during the first time interval. At time T3, the edge 614 of the process kit 310 is moved between the first element 219A and the second element 219B of the sensor 218A. As a result, the signal transmitted by the first element 219A of the sensor 218A is blocked. The sensor 218A may detect this change in the state of the signal 612 and may send a notification to the system controller 128 indicating that the sensor 218A is blocked at time T3. As seen in FIG. 6B , the signal 612 is associated with a second state (e.g., a value of 0) at time T3. The signal of the sensor 218A may remain blocked until time T5. Note that although multiple embodiments of the present disclosure associate the first state of the signal with a value of 1 and the second state of the signal with a value of 0, various states of the signal may be associated with any value. At time T5, another edge of the process kit 310 passes the sensor 218A, causing the signal of the sensor 218A to become unblocked. The sensor 218A may detect this change in the state of the signal 612 and may send a notification to the system controller 128 indicating that the sensor 218A is no longer blocked at time T5. As can be seen in FIG. 6B, signal 612 is associated with a first state at time T5.

[0052]

[0064] The sensor 218A can detect a change in the state of the signal 612 when the end effector 214 and process kit 310 are moved into the station 330. Graph 610 shows the resulting shape of the signal 612 after the process kit 310 is moved into the station 330. In some embodiments, the resulting shape of the signal 612 can correspond to the shape of the process kit 310 placed on the end effector 214. For example, the change in the signal state at time T3 can correspond to the outer diameter of the process kit, and the change in the signal state at time T5 can correspond to the inner diameter of the process kit. As shown in FIG. 6B , another change in the signal state is detected at time T11 and time T13. The change in the signal state at time T11 can correspond to the inner diameter of the process kit, and the change in the signal state at time T13 can correspond to the outer diameter of the process kit.

[0053]

[0065] 6C and 6D depict graphs 620 and 630 showing the change in state of signals 622 and 632, respectively, transmitted by first elements 219A of sensors 218B and 218C as end effector 214 and process kit 310 move toward station 330, according to various embodiments described above. Each graph 620 and 630 shows the resulting shape of signals 622 and 632 after process kit 310 is moved into station 330. In this case, each resulting shape of signals 622 and 632 corresponds to the shape of process kit 310 positioned on end effector 214, as described above.

[0054]

[0066] In some embodiments, the end effector 214, or other components of the robot arm 212, may be positioned between the first element 219A and the second element 219B of each sensor 218. For example, as shown in FIGS. 6A and 6C, between times T3 and T10, no portion of the process kit 310 or end effector 214 blocks the signal 622 of the sensor 218B. At time T10, the edge 624 of the end effector 214 blocks the signal 622 of the sensor 218B. In some embodiments, the end effector 214 may completely block the signal 622. In such an embodiment, the sensor 218B may detect that the state of the signal 622 has changed from unblocked to blocked and may send a notification to the system controller 128, in accordance with the embodiments described above. In other or similar embodiments, the end effector 214 may partially block the signal 622. An object may partially block a signal when the strength or intensity of the signal transmitted from the first element 219A is greater than the strength or intensity of the signal when received by the second element 219B. In some embodiments, this may occur when the object is composed of a material that blocks a portion of the signal from being transmitted to the second element 219B but allows another portion of the signal to be transmitted to the second element 219B. The sensor 218B may determine that the signal 622 is partially blocked. As seen in FIG. 6C , the signal 622 is associated with a third state (e.g., a value between 1 and 0) at time T10. The end effector 214 may partially block the signal 622 until time T15. At time T15, the edge 626 of the process kit 310 is moved between the first element 219A and the second element 219B of the sensor 218B. 6C, the signal 622 is associated with a second state at time T15. At time T16, the edge 628 of the process kit 310 is moved between the first element 219A and the second element 219B of the sensor 218B.6A, at time T16, signal 622 is no longer blocked by process kit 310, but is blocked by end effector 214. Thus, sensor 218B may detect the change in state of signal 622 and may send a notification to system controller 128 indicating that sensor 218B is partially blocked at time T16.

[0055]

[0067] The sensors 218A-C can detect a change in the state of their signals in response to the process kit carrier 312 (with or without a process kit) according to embodiments described above. 7B-7D depict graphs 710-730 showing the change in state of each signal 712, 722, 732 transmitted by the first element 219A of each sensor 218A-C as the robot arm 212 moves the end effector 214, the process kit 310, and the carrier 312 toward the station 330. The resulting shape of each signal 712, 722, and 732 can correspond to the shape of the process kit 310 and the process kit carrier 312 positioned on the end effector 214 according to embodiments described above.

[0056]

[0068] In block 430, the processing device (i.e., the system controller 128) receives signals indicative of the shape of the process kit 310 and / or the carrier 312. As described above, each sensor 218A-C may send a message to the system controller 128 for each change in state of a signal (e.g., signals 612, 622, 632, 712, 722, 732, etc.). The system controller 128 may receive each message and identify the time of each change in state of each signal. The system controller 128 may track changes in the state of each signal over time, as shown in FIGS. 6B-6D and 7B-7D. As described above, changes in the state of each signal over time may correspond to the current state of the process kit and / or carrier 312 positioned on the end effector 214. Thus, the system controller 128 may associate the particular shape of each signal with the current shape of the process kit and / or carrier 312, as shown in FIGS. 6B-6D and 7B-7D. As previously described, the process kit 310 and / or carrier 312 are positioned at the target locations of the end effector 214. Thus, the shape of each signal corresponds to the target shape of the process kit 310 and / or carrier 312.

[0057]

[0069] In block 440, a processing device (e.g., the system controller 128) stores the signals indicative of the shape of the process kit 310 and / or carrier 312 in a data store 130, such as the data store of FIG. 1. In some embodiments, the system controller 128 may store data received from each sensor 218A-C used to identify the shape of each signal. For example, the system controller 128 may store data indicative of a change in state of a particular signal (e.g., from a value of 1 to a value of 0) and a timestamp indicating the instant in time the change occurred. In some embodiments, the system controller 128 may store additional data associated with the signals. For example, the system controller 128 may store data associated with the strength of the signal. The system controller 128 may also store data associated with the process kit 310 and / or carrier 312 associated with each particular signal. For example, the system controller 128 may store data indicative of the type of material used to construct one or more portions of the process kit and / or carrier 312.

[0058]

[0070] As previously described, FIG. 5 is a flowchart of a method 500 for determining a correspondence between the center 322 of the process kit 310 and / or carrier 312 and the center 316 of the end effector 214. In block 510, the process kit 310 and / or carrier 312 is moved past two or more sensors of a manufacturing system. The process kit 310 and / or carrier 312 may be placed on an end effector (e.g., of a robot arm or a rotating carousel). For example, the transfer chamber robot 112 or the factory interface robot 126 may move the process kit 310 and / or carrier 312 past two or more sensors according to the previously described embodiments. In another example, an end effector of a rotating carousel within a process chamber may move the process kit 310 and / or carrier 312 past two or more sensors. FIG. 8A illustrates a process kit 310 placed on the end effector 214 of a robot arm according to the previously described embodiments. Although the following embodiments are described with respect to determining the correspondence between the center 322 of the process kit 310 and the center 316 of the end effector 214, the same or similar embodiments may be applied to determining the correspondence between the center of the carrier 312 (with or without the process kit 310) and the center 316 of the end effector 214.

[0059]

[0071] In some embodiments, the two or more sensors may be any of the sensors 218A-C depicted in Figures 2A-2B and 3. As previously described, one or more of the sensors 218A-C may include a first element 219A (i.e., a signal-emitting element) and a second element 219B (i.e., a signal-receiving element). The sensor may detect the process kit 310 and / or carrier 312 by detecting a change in state of a signal transmitted by the sensor's first element 219A in response to the robot arm 212 moving the process kit 310 and / or carrier 312 between the first element 219A and the second element 219B, according to several previously described embodiments. 8B-8D depict graphs 810-830, respectively, illustrating the change in state of signals 812, 822, and 832 transmitted by first elements 219A of sensors 218A-C as end effector 214 and process kit 310 move toward station 330, according to various embodiments described above. Each graph 810, 820, and 830 illustrates the resulting shape of signals 812, 822, and 832 after process kit 310 is moved into station 330. In this case, each resulting shape of signals 812, 822, and 832 corresponds to the shape of process kit 310 positioned on end effector 214.

[0060]

[0072] In block 520, the processing device receives a first signal indicative of the current shape of the process kit 310 and / or carrier 312. As previously described, each sensor 218A-C may send a message to the system controller 128 for each change in state of the signal (e.g., signals 812, 822, 832, etc.). The system controller 128 may receive each message and determine the time of each change in state of each signal. The system controller may track the change in state of each signal over time, as shown in graphs 810, 820, and 830 in FIGS. 8B-8D.

[0061]

[0073] In block 530, the processing device determines whether the first signal corresponds to a second signal indicative of a predefined shape of the process kit and / or process kit carrier. As described above, the system controller 128 may receive a signal indicative of a shape of the process kit and / or carrier positioned at a target position of the end effector 214. The system controller 128 may store data corresponding to the shape of the process kit and / or carrier at the target position of the end effector 214 in the data store 130. The system controller 128 may identify data for the second signal indicative of the predefined shape of the process kit from the data store 130. In response to receiving the first signal indicative of the current shape of the process kit 310 and / or carrier 312, the system controller 128 may compare the data for the first signal with the data for the second signal to determine whether the current shape of the process kit 310 corresponds to the predefined shape of the process kit.

[0062]

[0074] In one exemplary embodiment, the system controller 128 may reference the data store 130 to identify data associated with signal 612. The system controller 128 compares the data obtained for signal 612 to the data associated with signal 612 to determine whether the difference between signals 612 and 812 meets a difference criterion. As previously described, the resulting shape of signal 612 after the process kit is placed at the target location of the end effector 214 may correspond to the shape of the process kit placed on the end effector 214. The change in signal at times T3 and T13 may correspond to the outer diameter of the process kit, and the change in signal state at times T5 and T11 may correspond to the inner diameter. Based on signal 812, the system controller 128 may determine each instant the state of the signal of sensor 218A changes between State 1 and State 0. For example, system controller 128 may determine that the state of the signal of sensor 218A changed from state 1 to state 0 at time T2, changed from state 0 to state 1 at time T4, changed from state 1 to state 0 at time T10, and changed from state 0 to state 1 at time T12. The system controller may determine that the changes in signal state at times T2 and T12 correspond to the outer diameter of the object, and that the changes in signal state at times T4 and T10 correspond to the inner diameter of the object.

[0063]

[0075] The system controller may compare the shape of signal 812 to the shape of signal 612 to determine whether the current shape of process kit 310 (shown by signal 812) corresponds to the target shape of the process kit. In some embodiments, system controller 128 may determine that the current shape of process kit 310 corresponds to the target shape of the process kit by determining whether the number of signal state changes in signal 812 corresponds to the number of signal states in signal 612 (i.e., whether the number of edges detected for process kit 310 corresponds to the number of edges for the target process kit). The number of signal state changes in signal 812 may correspond to the number of signal state changes in signal 612 if the difference between the number of signal state changes in each signal meets a difference threshold. For example, the difference threshold may be 1. Because signals 612 and 812 each include four signal state changes, the difference between the number of signal state changes in each signal meets the difference threshold. In another embodiment, the system controller 128 may determine that the current shape of the process kit 310 corresponds to the target shape of the process kit by determining whether a state change of the signal 812 occurred within a threshold time interval compared to a state change of the signal 612. For example, the system controller 128 may determine that one set of state changes of the signal 812 includes state changes at times T2 and T4, and another set of state changes of the signal 612 includes state changes at times T3 and T5. The threshold time interval may be a value of 2 (e.g., 2 seconds). The system controller may determine that the difference between a first state change of the set of state changes of the signal 812 (e.g., the state change at time T2) and a second state change of the other set of state changes of the signal 612 (e.g., the state change at time T3) satisfies the threshold time interval. In some embodiments, the system controller 128 may compare each set of state changes of the signal 812 with the corresponding state changes of each other set of the signal 612 and determine whether the difference between each state change satisfies the threshold time interval.In response to determining that the difference between each state change of signals 812 and 612 satisfies the threshold time interval, the system controller 128 may determine that the current state of the process kit 310 corresponds to the target shape of the process kit.

[0064]

[0076] In another illustrative example, the system controller 128 may reference the data store 130 to identify data associated with signal 712. The system controller may compare the data associated with signal 812 to the data associated with signal 712 to determine whether the shape of signal 812 corresponds to the shape of signal 712, according to embodiments described above. For example, the system controller 128 may determine that the number of signal state changes included in signal 812 (i.e., four state changes) does not correspond to the number of signal state changes included in signal 712 (i.e., six state changes). The system controller 128 may also determine that the state changes of 812 did not occur within a time threshold interval compared to the state changes of signal 712, according to embodiments described above. Thus, the system controller 128 may determine that the current shape of the signal for the object (e.g., process kit 310) does not correspond to the shape of the signal for the process kit.

[0065]

[0077] In some embodiments, the system controller 128 may determine that an object placed on the end effector is expected to be a process kit 310 (i.e., based on a process recipe). In such embodiments, the system controller 128 may identify particular data stored in the data store 130 that corresponds to a predefined shape for the process kit. The system controller 128 may determine whether the current shape of the object corresponds to the predefined shape of the process kit according to the embodiments described above.

[0066]

[0078] 5 , in response to determining that the first signal does not correspond to the second signal indicating the predefined shape for the process kit and / or carrier, the processing device may determine that the current shape of the process kit 310 does not correspond to the predefined shape for the process kit. In such cases, the method 500 may proceed to block 570. At block 570, the processing device may send an error message to an operator of the manufacturing system. In some embodiments, the error message may indicate that the current shape of the process kit 310 does not correspond to the predefined shape for the process kit and / or carrier.

[0067]

[0079] In response to determining that each of the first set of signals corresponds to a respective signal of the second set of signals, the processing device may determine that the current shape of the process kit corresponds to a predefined shape for the process kit and / or the process kit carrier. In such a case, the method 500 may proceed to block 540. In block 540, the processing device may determine a correspondence between the center 322 of the process kit 310 and the center 316 of the end effector 214. The correspondence may refer to a difference between the current placement of the process kit 310 on the end effector 214 and the target placement of the process kit on the end effector. As described above, the process kit (and / or carrier) is positioned at the target placement on the end effector 214 when the center of the process kit corresponds to (e.g., is substantially aligned with) the center 316 of the end effector 214. The center 316 of the end effector 214 may be identified according to several embodiments described above. As previously mentioned, the system controller 128 may associate the identified center 316 of the end effector 214 with a particular coordinate (e.g., Cartesian coordinate, etc.), such as coordinate (0,0).

[0068]

[0080] The system controller 128 may identify the center 322 of the process kit 310 based on the shape of the monitored signals 812, 822, and 832 as the process kit 310 is moved toward or away from the station 330. As described above, each change in signal state detected by the sensor 218 indicates an edge of the process kit 310. The system controller 128 may associate each signal state change in the signals 812, 822, and 832 with an edge of the process kit 310, and each edge with a particular portion of the process kit 310. For example, the system controller 128 may associate a first state change in each signal 812, 822, and 832 with the outer diameter of the process kit 310. In another embodiment, the system controller 128 may associate a second state change in each signal 812, 822, and 832 with the inner diameter of the process kit 310.

[0069]

[0081] In some embodiments, the system controller 128 may determine whether a particular state change corresponds to an edge of the process kit 310 or another object interposed between the first element 219A and the second element 219B of a particular sensor 218. For example, as shown in FIGS. 8A and 8D , the sensor 218C may detect that a portion of an object (e.g., a blade of the end effector 214) is interposed between the first element 219A and the second element 219B of the sensor 218C at time T3. The system controller 128 may determine whether the amount of time the object blocks the first element 219A and the second element 219B of the sensor 218C corresponds to the amount of time that a portion of the process kit is expected to block the sensor 218C. For example, the system controller 128 may determine (e.g., based on signals 612, 622, 632) that a portion of the process kit blocks the transmitting element for approximately 2 seconds. The system controller 128 may determine that the sensor 218C was blocked for approximately 0.5 seconds beginning at time T3. Thus, the system controller 128 may determine that the object (i.e., the blade of the end effector 214) blocking the sensor 218C at time T3 does not correspond to a process kit. In such embodiments, the system controller 128 may evaluate the signal 832 to identify a subsequent moment in time when the object blocks the sensor 218 for the expected interval. In response to identifying the subsequent moment, the system controller 128 may determine that a first moment in time in the identified time interval corresponds to detecting an edge of the process kit 310 and may associate the corresponding edge with a particular portion of the process kit 310. As shown in FIG. 8D , the system controller 128 may identify the time interval between times T4 and T6 that corresponds to an edge of the process kit. Thus, the system controller 128 may determine that time T4 is the first state change of the signal 832 and may associate the state change at time Tx with an edge at the outer diameter of the process kit 310.

[0070]

[0082] In response to associating each edge with a particular portion of the process kit 310, the system controller 128 may execute a center detection algorithm to identify the center of the process kit 310. The system controller 128 may assign each associated edge to a particular coordinate relative to the center 316 of the end effector 214. The system controller 128 may then identify a set of edges that are co-circular with other edges detected by the sensor 218. For example, the system controller 128 may determine that the edges associated with the state changes at time T2 in signal 812, time T1 in signal 822, and time T4 in signal 832 are the same circle because the geometric shapes of the respective edges are co-circular. The system controller 128 may group each edge of the set of edges into groups of three coordinates to define both triangles and circles.

[0071]

[0083] In response to defining the triangles and circles for each group of edges, the system controller 128 may calculate the center and radius of the defined circle based on the distance between each of the specific edges in the group. In some embodiments, the system controller 128 may determine the distance between each of the specific edges in the group based on the distance between each of the sensors at the entrance to the station 330. In other or similar embodiments, the system controller 128 may determine the distance between each of the specific edges in the group based on the speed at which the end effector 214 moves toward the station 330 and the amount of time between each signal state change detected by the sensor 218. The system controller 128 may calculate the center and radius of each defined circle for each group of edges and may identify the center and radius corresponding to the center of the process kit 310. For example, the system controller 128 may determine the center and radius of the process kit 310 based on the average center and radius for each of the groups of edges. In response to identifying the center and radius of the process kit 310, the system controller 128 may assign coordinates to the determined center relative to the center of the end effector 214. For example, the system controller may determine the location of the center 322 of the process kit 310 and assign coordinates (0, 1) to the center 322.

[0072]

[0084] 5 , in block 540, the processing device may determine a correspondence between the coordinates of the center of the process kit 310 and the coordinates of the center of the end effector 214. The system controller 128 may determine the correspondence between the center 322 of the process kit 310 and the center of the end effector 214 based on the distance between the coordinates corresponding to the center 316 and the center 322. For example, the system controller 128 may determine that the difference between the center 322 and the center 316 is (0, +1). Therefore, the correspondence between the center 316 and the center 322 is (0, +1).

[0073]

[0085] At block 550, the processing device may determine whether the determined correspondence satisfies the target placement criteria. System controller 128 may determine that the determined correspondence satisfies the target placement criteria based on a determination that the distance between center 322 and center 316 does not exceed the threshold difference value. In response to determining that the correspondence satisfies the target placement criteria, method 500 may proceed to block 560. In response to determining that the correspondence does not satisfy the target placement criteria, method 500 may proceed to block 570.

[0074]

[0086] In block 560, the processing device may adjust the process recipe associated with the robot arm to cause the end effector to place the process kit 310 at a target location in a station of the manufacturing system 100. The system controller 128 may modify the process recipe associated with the robot arm 212 to cause the end effector 214 to place the process kit 310 at the target location in the station 330. For example, the system controller 128 may determine that the process kit 310 is located slightly to the right of the target location on the end effector 214 based on the determined correspondence between the center 322 and the center 316. Thus, the system controller 128 may adjust the process recipe associated with the robot arm to take into account the location of the process kit 310 on the end effector 214 and place the process kit 310 slightly to the left of the target location in the station 330.

[0075]

[0087] 9 shows a diagrammatic representation of a machine, taking the exemplary form of a computing device, within which a set of instructions may be executed to cause the machine to perform any one or more of the methodologies described herein. In alternative embodiments, the machine may be connected (e.g., networked) to other machines in a local area network (LAN), an intranet, an extranet, or the Internet. The machine may function as a server or a client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a mobile phone, a web appliance, a server, a network router, switch, or bridge, or any machine capable of executing a set of instructions (sequential or otherwise) that define operations to be performed by the machine. Furthermore, although a single machine is illustrated, the term "machine" should also be construed to include any collection of machines (e.g., computers) that individually or jointly execute a set (or sets) of instructions to perform any one or more of the methodologies described herein. In some embodiments, computing device 900 may correspond to system controller 128 of FIG. 1.

[0076]

[0088] The exemplary computing device 900 includes a processing device 902, a main memory 904 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM), a static memory 906 (e.g., flash memory, static random access memory (SRAM), etc.), and a secondary memory (e.g., a data storage device 928), which communicate with each other via a bus 908.

[0077]

[0089] Processing device 902 may represent one or more general-purpose processors, such as a microprocessor or central processing unit. More specifically, processing device 902 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or a combination of instruction sets. Processing device 902 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), a network processor, or the like. Processing device 902 may also be a system-on-chip (SoC), a programmable logic controller (PLC), or other type of processing device. Processing device 902 is configured to execute processing logic (instructions 926) to perform the operations and steps described herein.

[0078]

[0090] Computing device 900 may further include a network interface device 922 for communicating with a network 964. Computing device 900 may also include a video display unit 910 (e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT)), an alphanumeric input device 912 (e.g., a keyboard), a cursor control device 914 (e.g., a mouse), and a signal generation device 920 (e.g., a speaker).

[0079]

[0091] The data storage device 928 may include a machine-readable storage medium (or more specifically, a non-transitory computer-readable storage medium) 924 on which is stored one or more sets of instructions 926 that embody one or more of the methods or functions described herein. Here, non-transitory storage medium refers to a storage medium other than a carrier wave. The instructions 926 may also reside, completely or at least partially, within the main memory 904 and / or the processing device 902 during execution by the computing device 900, with the main memory 904 and the processing device 902 also constituting computer-readable storage media.

[0080]

[0092] The computer-readable storage medium 924 may also be used to store the instructions 926. The computer-readable storage medium 924 may also store a software library including methods for invoking the instructions 926. While the computer-readable storage medium 924 is shown as a single medium in one embodiment, the term "computer-readable storage medium" should be understood to include a single medium or multiple media (e.g., a centralized database or a distributed database, and / or associated caches and servers) that store one or more sets of instructions. The term "computer-readable storage medium" should also be interpreted to include any medium capable of storing or encoding a set of instructions that are executed by a machine and cause the machine to perform any one or more of the methods of the present disclosure. Accordingly, the term "computer-readable storage medium" should be interpreted to include, but is not limited to, solid-state memory, optical media, and magnetic media.

[0081]

[0093] The foregoing description sets forth numerous specific details, such as examples of specific systems, components, methods, etc., to provide a thorough understanding of some embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known components or methods are not described in detail or are presented in simple block diagram form to avoid unnecessarily obscuring the present disclosure. Thus, the specific details described are merely exemplary. Certain implementations may differ from these example details and still be considered within the scope of the present disclosure.

[0082]

[0094] Throughout this specification, a reference to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Thus, the appearances of the phrase "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. In addition, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." When the term "about" or "approximately" is used herein, it is intended to mean that the stated nominal value is accurate to within ±10%.

[0083]

[0095] Although the operations of the methods herein are illustrated and described in a particular order, the order of the operations of each method may be changed such that certain operations are performed in reverse order and certain operations are performed at least partially concurrently with other operations. In another embodiment, instructions or sub-operations of separate operations may be intermittent and / or interleaved.

[0084]

[0096] It should be understood that the foregoing description is intended to be illustrative, and not limiting. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. The scope of the disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. moving an object disposed on the end effector past a plurality of sensors of a manufacturing system; receiving a first plurality of signals from the plurality of sensors of the manufacturing system, each signal indicative of a current shape of the object placed on the end effector; determining whether each of the first plurality of signals corresponds to one of a second plurality of signals, wherein each of the second plurality of signals is indicative of a predefined shape for at least one of a process kit or a process kit carrier; and determining a correspondence between a center of the object and a center of the end effector in response to determining that each of the first plurality of signals corresponds to a respective signal of the second plurality of signals, the determined correspondence indicating whether a current placement of the object on the end effector satisfies a target placement criterion.

2. Determining a correspondence between the center of the object and the center of the end effector includes: identifying the center of the object based on each of the first plurality of signals; determining a distance between the center of the object and the center of the end effector; The method of claim 1 , wherein the correspondence between the center of the object and the center of the end effector is determined based on the determined distance.

3. Identifying the center of the object includes: determining a first set of coordinates based on each of the first plurality of signals, each of the first set of coordinates corresponding to an edge of the object; and 3. The method of claim 2, further comprising calculating at least a second coordinate corresponding to the center of the object based on each of the first set of coordinates.

4. determining, based on a process recipe, that the object placed on the end effector is expected to include at least one of a process kit or a process kit carrier; and 10. The method of claim 1, further comprising: determining that the object does not correspond to at least one of the process kit or the process kit carrier in response to determining that one or more of the first plurality of signals indicating the current shape of the object does not correspond to the respective signal of the second plurality of signals indicating a predetermined shape for the at least one of the process kit or the process kit carrier.

5. 2. The method of claim 1, wherein one or more sensors of the plurality of sensors include a transmitting element and a receiving element, each sensor configured to detect the current shape of the object in response to the end effector moving the object between the transmitting element and the receiving element.

6. Determining that a signal of the first plurality of signals corresponds to the respective signal of the second plurality of signals includes: determining a first time interval during which the end effector moves a portion of the object between the emitting element and the receiving element of a first sensor of the plurality of sensors based on the signal; and determining whether the first time interval corresponds to a second time interval associated with each signal of the second plurality of signals; The method of claim 5 , wherein the signal is determined to correspond to the respective signal in response to determining that the first time interval corresponds to the second time interval.

7. determining whether the current placement of the object on the end effector satisfies the target placement criteria based on the determined correspondence; and 10. The method of claim 1, further comprising, in response to determining that the current placement does not meet the target placement criteria, modifying a process recipe associated with the end effector to cause the end effector to place the object at a target location in a station of the manufacturing system.

8. determining whether the current placement of the object on the end effector satisfies placement correction criteria; and 8. The method of claim 7, further comprising: in response to determining that the current placement does not satisfy the placement correction criteria, determining that the current placement of the at least one of the process kit or the process kit carrier on the end effector cannot be corrected by modifying the process recipe associated with the end effector.

9. 10. The method of claim 1, wherein the object comprises the process kit, the process kit carrier, the process kit coupled to the process kit carrier, or the process kit coupled to the process kit carrier and further comprising a substrate.

10. The method of claim 1 , wherein one or more of the plurality of sensors is disposed within a processing chamber of the manufacturing system, and the end effector is coupled to a rotating carousel of the processing chamber.

11. a robotic arm including an end effector; a controller operably coupled to the robotic arm, the controller comprising: moving an object disposed on the end effector past a plurality of sensors of a manufacturing system; receiving a first plurality of signals from the plurality of sensors of the manufacturing system, each signal indicative of a current shape of the object placed on the end effector; determining whether each of the first plurality of signals corresponds to one of a second plurality of signals, wherein each of the second plurality of signals is indicative of a predefined shape for at least one of a process kit or a process kit carrier; and In response to determining that each of the first plurality of signals corresponds to a respective signal of the second plurality of signals, the manufacturing system is configured to perform an operation including determining a correspondence between a center of the object and a center of the end effector, the determined correspondence indicating whether a current placement of the object on the end effector satisfies a target placement criterion.

12. To determine the correspondence between the center of the object and the center of the end effector, the controller: identifying the center of the object based on each of the first plurality of signals; determining a distance between the center of the object and the center of the end effector; The manufacturing system of claim 11 , wherein the correspondence between the center of the object and the center of the end effector is determined based on the determined distance.

13. To identify the center of the object, the controller: determining a first set of coordinates based on each of the first plurality of signals, each of the first set of coordinates corresponding to an edge of the object; and 13. The manufacturing system of claim 12, adapted to perform an operation including calculating at least a second coordinate corresponding to the center of the object based on each of the first set of coordinates.

14. The controller determining, based on a process recipe, that the object placed on the end effector is expected to include at least one of a process kit or a process kit carrier; and 12. The manufacturing system of claim 11, further configured to perform an action including determining that the object does not correspond to at least one of the process kit or the process kit carrier in response to determining that one or more of the first plurality of signals indicating the current shape of the object does not correspond to the respective signal of the second plurality of signals indicating a predetermined shape for the at least one of the process kit or the process kit carrier.

15. 12. The manufacturing system of claim 11, wherein one or more of the plurality of sensors includes an emitting element and a receiving element, each sensor configured to detect the current shape of the object in response to the end effector moving the object between the emitting element and the receiving element.

16. To determine whether a signal of the first plurality of signals corresponds to the respective signal of the second plurality of signals, the controller: determining a first time interval during which the end effector moves a portion of the object between the emitting element and the receiving element of a first sensor of the plurality of sensors based on the signal; and determining whether the first time interval corresponds to a second time interval associated with each signal of the second plurality of signals; The manufacturing system of claim 15 , wherein the signal is determined to correspond to the respective signal in response to determining that the first time interval corresponds to the second time interval.

17. The controller determining whether the current placement of the object on the end effector satisfies the target placement criteria based on the determined correspondence; and 12. The manufacturing system of claim 11, further configured to perform an action, in response to determining that the current placement does not meet the target placement criteria, further comprising: modifying a process recipe associated with the end effector to cause the end effector to place the object at a target location in a station of the manufacturing system.

18. The manufacturing system of claim 11 , wherein the robotic arm is a component of at least one of a factory interface robot of a factory interface in the manufacturing system or a transfer chamber robot of a transfer chamber in the manufacturing system.

19. A non-transitory computer-readable storage medium containing instructions that, when executed by a processing device, cause the processing device to: moving an object disposed on the end effector past a plurality of sensors of a manufacturing system; receiving a first plurality of signals from the plurality of sensors of the manufacturing system, each signal indicative of a current shape of the object placed on the end effector; determining whether each of the first plurality of signals corresponds to one of a second plurality of signals, wherein each of the second plurality of signals is indicative of a predefined shape for at least one of a process kit or a process kit carrier; and a non-transitory computer-readable storage medium configured to cause operations to be performed, the non-transitory computer-readable storage medium comprising: in response to determining that each of the first plurality of signals corresponds to a respective signal of the second plurality of signals, determining a correspondence between a center of the object and a center of the end effector, the determined correspondence indicating whether a current placement of the object on the end effector satisfies a target placement criterion.

20. To determine a correspondence between the center of the object and the center of the end effector, the processing device: identifying the center of the object based on each of the first plurality of signals; determining a distance between the center of the object and the center of the end effector; The non-transitory computer-readable storage medium of claim 19 , wherein the correspondence between the center of the object and the center of the end effector is determined based on the determined distance.

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