Photosensitive element and method for forming resist pattern

Abstract

To provide a photosensitive element exhibiting superior adhesion, resolution, and preservation stability, and a method of forming a resist pattern.SOLUTION: A photosensitive element comprising a supporting film and a photosensitive layer containing a photosensitive resin composition, wherein the photosensitive resin composition contains the following components: (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, and (C) a biimidazole photopolymerization initiator, the component (C) being contained in an amount of 5.0 mass% or more relative to the total mass of solids of the photosensitive resin composition, the absorbance (Y) of the photosensitive layer with a film thickness of 25 μm at the wavelength of 365 nm being 0.35 or less, and the contribution (X) of the absorbance of the component (C) in the absorbance (Y) being 40% or more, the contribution (X) being calculated by formula (1).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a photosensitive element and a method for forming a resist pattern. [Background technology]

[0002] Printed wiring boards are generally manufactured using a photolithography process. Photolithography is a method of forming a desired wiring pattern on a substrate by the following steps: First, a coating film made of a photosensitive resin composition is formed on the substrate, and the coating film is then pattern-exposed and developed to form a resist pattern. Next, a conductor pattern is formed by etching or plating. Thereafter, the resist pattern on the substrate is removed to form the desired wiring pattern on the substrate.

[0003] In recent years, with the miniaturization and increasing density of electronic devices, there has been a demand for the formation of finer wiring than ever before on wiring boards. In this regard, MSAP (Modified Semi-Additive Process) and SAP (Semi-Additive Process) have attracted attention as methods for manufacturing wiring boards. In these methods, to form finer wiring, it is desirable to form a resist pattern with both adhesion and resolution of 7 μm or less. In response to this demand, Patent Document 1 discloses a photosensitive resin composition containing an anthracene-based sensitizer and in which the binder polymer has hydroxyalkyl (meth)acrylate units and a specific amount of styrene or styrene derivative units. In the examples of Patent Document 1, a biimidazole photopolymerization initiator is used as the photopolymerization initiator. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2021 / 193232 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when this type of photosensitive resin composition is exposed using an exposure device with a wavelength of 365 nm and the resist pattern formed is observed, the following problems are found: insufficient resolution; it is difficult to form patterns of 7 μm or less; and there is room for improvement in adhesion. Conventional photosensitive resin compositions such as those described in Patent Document 1 may contain a relatively large amount of biimidazole photopolymerization initiator. Such photosensitive resin compositions undergo sensitivity fluctuations when stored under yellow light, which can result in deterioration of the storage stability of the photosensitive layer. In particular, when the biimidazole photopolymerization initiator is contained in an amount of 5% by mass or more, based on the total amount of all solid components of the photosensitive resin composition, significant deterioration of storage stability is often observed. In other words, it has been difficult to achieve adhesion, resolution, and storage stability in conventional photosensitive elements.

[0006] The present invention has been proposed in view of the above-mentioned circumstances, and an object of the present invention is to provide a photosensitive element that is excellent in adhesion, resolution, and storage stability, and a method for forming a resist pattern. [Means for solving the problem]

[0007] One aspect of the present invention is as follows. [1] A photosensitive element comprising a support film and a photosensitive layer containing a photosensitive resin composition, The photosensitive resin composition comprises the following components: (A) alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) Biimidazole photopolymerization initiator Including, The component (C) is contained in an amount of 5.0 mass% or more based on the total solid content mass of the photosensitive resin composition, the absorbance (Y) of the photosensitive layer at a wavelength of 365 nm when the layer is 25 μm thick is 0.35 or less; the contribution (X) of the absorbance of the component (C) to the absorbance (Y) is 40% or more; The contribution (X) is expressed by the following formula (1): X (%) = 100 × εc / absorbance of photosensitive layer (Y) (1) ε: Change in absorbance per 1% by mass of component (C) c: Content (% by mass) of component (C) in the total solid components of the photosensitive resin composition The photosensitive element is calculated by the following formula: [2] 2. The photosensitive element according to item 1, wherein the component (C) is contained in an amount of 5.5% by mass or more based on the total solid content by mass of the photosensitive resin composition. [3] 3. The photosensitive element according to item 1 or 2, wherein the component (C) is contained in an amount of 6.0% by mass or more based on the total solid content by mass of the photosensitive resin composition. [4] 4. The photosensitive element of any one of items 1 to 3, wherein the contribution (X) is 55% or greater. [5] 5. The photosensitive element of any one of items 1 to 4, wherein the contribution (X) is 65% or greater. [6] 6. The photosensitive element of any one of items 1 to 5, wherein the contribution (X) is 85% or greater. [7] 7. The photosensitive element according to any one of items 1 to 6, wherein the absorbance (Y) is 0.30 or less. [8] 8. The photosensitive element according to any one of items 1 to 7, wherein the absorbance (Y) is 0.25 or less. [9] Furthermore, the photosensitive resin composition (D) Other photopolymerization initiators and / or sensitizers 9. The photosensitive element according to any one of items 1 to 8, comprising at least one selected from the group consisting of benzophenone compounds, pyrazoline compounds, anthracene compounds, and coumarin compounds as the photosensitive element.

[10] Furthermore, the photosensitive resin composition (D) Other photopolymerization initiators and / or sensitizers 10. The photosensitive element according to any one of items 1 to 9, comprising at least one selected from the group consisting of a benzophenone compound and a pyrazoline compound as the photosensitive element.

[11] The component (A) contains styrene as a monomer component, 11. The photosensitive element according to any one of items 1 to 10, wherein the proportion of the structural units derived from styrene is 35% by mass or more based on the total mass of all monomer components in the component (A).

[12] The component (A) contains styrene as a monomer component, 12. The photosensitive element according to any one of items 1 to 11, wherein the proportion of the structural units derived from styrene is 50% by mass or more based on the total mass of all monomer components in the component (A).

[13] The component (A) contains styrene as a monomer component, 13. The photosensitive element according to any one of items 1 to 12, wherein the proportion of the structural units derived from styrene is 60% by mass or more based on the total mass of all monomer components in the component (A).

[14] The component (B) is represented by the following general formula (II): [ka] (In the formula, R 2 are each independently a hydrogen atom or a methyl group, and X 2 O and Y 2 Each O is independently an oxyethylene group or an oxypropylene group, m3, m4, n2, and n3 are independently an integer of 0 to 40, m3+m4 is 1 to 40, and n2+n3 is 0 to 20. The compound contains a compound represented by 14. The photosensitive element according to any one of items 1 to 13, wherein the content of the compound represented by formula (II) is 50% by mass or more based on the total amount of component (B).

[15] Furthermore, the photosensitive resin composition (E) Polymerization inhibitor 15. The photosensitive element of any one of items 1 to 14, comprising:

[16] 16. The photosensitive element according to any one of items 1 to 15, wherein the support film has an absorbance at 365 nm of 0.1 or less.

[17] 17. The photosensitive element of any one of items 1 to 16, further comprising a protective film.

[18] A method for forming a resist pattern using the photosensitive element according to any one of items 1 to 17, The following steps: laminating the photosensitive element to a substrate; exposing the photosensitive layer of the laminated photosensitive element to light; and developing the photosensitive layer after exposure; A method for forming a resist pattern, comprising: [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a photosensitive element that is excellent in adhesion, resolution, and storage stability, and a method for forming a resist pattern using the same. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view for explaining an example of a "foreign object" assumed in this embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention (hereinafter abbreviated as "the present embodiment") will be described. The present invention is not limited to the present embodiment, and various modifications can be made within the scope of the gist of the present invention. In this specification, the upper and lower limits of each numerical range may be arbitrarily combined, and may be replaced with values ​​described in the examples. In this specification, numerical ranges indicated using "to" include the upper and lower limit values.

[0011] [Embodiment 1] The photosensitive element of the present embodiment includes a support film and a photosensitive layer containing a photosensitive resin composition, A photosensitive resin composition comprising the following components: (A) alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) Biimidazole photopolymerization initiator Including, The photosensitive resin composition contains the component (C) in an amount of 5.0% by mass or more based on the total solid content by mass. Hereinafter, in this specification, (A) to (C) may be simply referred to as "component (A)" to "component (C)." The same applies to "(D)" and "(E)" described below.

[0012] In this embodiment, the absorbance (Y) at 365 nm when the photosensitive layer has a film thickness of 25 μm is 0.35 or less, and the contribution (X) of the absorbance of component (C) to the absorbance (Y) is 40% or more, which results in excellent adhesion, resolution, and storage stability. Here, the contribution (X) is expressed by the following formula (1): X (%) = 100 × εc / absorbance of photosensitive layer (Y) (1) ε: Change in absorbance per 1% by mass of component (C) c: Content (% by mass) of component (C) in the total solid components of the photosensitive resin composition It is calculated as follows. The absorbance (Y) can be greater than 0.

[0013] The photosensitive resin composition of this embodiment contains 1 to n types of component (C), where n is a positive integer, preferably 5, and more preferably 3.

[0014] <Support film> The support film is a layer or film for supporting the photosensitive layer, and is preferably a transparent substrate film that transmits actinic rays.

[0015] Examples of transparent substrate films include films made of synthetic resins such as polyethylene, polypropylene, polycarbonate, polyethylene terephthalate, etc. Among these, polyethylene terephthalate (PET) is preferably used because it has suitable flexibility and strength.

[0016] From the viewpoint of improving the adhesion of the resist pattern, the absorbance of the support film at a wavelength of 365 nm is preferably 0.3 or less, more preferably 0.2 or less, even more preferably 0.1 or less, and most preferably 0.08 (e.g., 0.080) or less. The absorbance may be 0 or more.

[0017] Among these, it is preferable to use a film with few internal foreign matters, i.e., a high-quality film. Specifically, as the high-quality film, it is more preferable to use a PET film synthesized using a Ti-based catalyst, a PET film with a small diameter and low content of lubricant, a PET film containing lubricant on only one side of the film, a thin PET film, a PET film smoothed on at least one side, a PET film roughened on at least one side by plasma treatment, etc. This allows the exposure light to be irradiated onto the photosensitive layer without being blocked by internal foreign matter, thereby improving the resolution of the photosensitive element.

[0018] The thickness of the support film is preferably 5 to 25 μm, and more preferably 6 to 20 μm. The thinner the support film, the fewer internal foreign matter there tends to be, making it easier to prevent a decrease in resolution. On the other hand, if the film thickness is less than 5 μm, the film is likely to stretch and deform in the winding direction due to tension during the coating and winding manufacturing process, and it is also likely to tear due to minute scratches. As a result, the film's strength is likely to be insufficient, and therefore wrinkles are likely to occur during lamination.

[0019] At least one surface of the support film may be subjected to a smoothing treatment using a calender or the like, which can reduce the surface roughness of one surface of the support film, particularly the surface that comes into contact with the photosensitive layer, and in this case, the effects of the present invention can be more easily achieved.

[0020] The haze of the support film is preferably 0.01 to 1.5%, more preferably 0.01 to 1.2%, and even more preferably 0.01 to 0.95%, from the viewpoint of improving the parallelism of the light beam irradiated onto the photosensitive layer and obtaining high resolution.

[0021] <Photosensitive layer> The photosensitive layer contains a photosensitive resin composition. The photosensitive resin composition contains (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, and (C) a biimidazole photopolymerization initiator. The photosensitive resin composition may contain (D) another photopolymerization initiator and / or (E) a polymerization inhibitor.

[0022] Component (A): Alkali-soluble polymer The (A) component preferably has a repeating unit consisting of at least one first monomer described below, and more preferably has a repeating unit consisting of at least one first monomer and at least one second monomer described below.

[0023] The first monomer is a monomer having a carboxyl group in the molecule and at least one polymerizable unsaturated group in the molecule. The first monomer may be a monomer having one polymerizable unsaturated group in the molecule, and examples thereof include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, maleic anhydride, and maleic acid half ester. Among these, (meth)acrylic acid is preferred, and methacrylic acid is more preferred, from the viewpoint of excellent adhesion and resolution. In this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, "(meth)acryloyl group" means acryloyl group or methacryloyl group, and "(meth)acrylate" means "acrylate" or "methacrylate".

[0024] The copolymerization ratio of the first monomer is preferably 10 to 50% by mass, based on the total mass of all monomer components. A copolymerization ratio of 10% by mass or more is preferred from the viewpoint of excellent adhesion and resolution, and is more preferably 15% by mass or more, even more preferably 18% by mass or more, even more preferably 21% by mass or more, particularly preferably 23% by mass or more, and most preferably 25% by mass or more. A copolymerization ratio of 50% by mass or less is preferred from the viewpoint of excellent adhesion and resolution, and is more preferably 35% by mass or less, even more preferably 30% by mass or less, particularly preferably 29% by mass or less, and most preferably 27% by mass or less. When two or more types of first monomers are used, the total copolymerization ratio of each of them is preferably within the above range.

[0025] The second monomer is a non-acidic monomer having at least one polymerizable unsaturated group in the molecule. The second monomer may be a monomer having one polymerizable unsaturated group in the molecule, and preferably contains a compound having an aromatic structure from the viewpoints of resolution and adhesion. The inclusion of a structural unit derived from such a compound facilitates suppression of swelling of the photosensitive layer during development, thereby making it possible to obtain a cured film with excellent adhesion, resolution, and other properties. The copolymerization ratio of the monomer derived from the compound having an aromatic structure is preferably 10 to 90% by mass, based on the total mass of all monomer components. A copolymerization ratio of 10% by mass or more is preferred from the viewpoint of excellent adhesion and resolution, more preferably 30% by mass or more, even more preferably 40% by mass or more, even more preferably 50% by mass or more, and particularly preferably 60% by mass or more. A copolymerization ratio of 90% by mass or less is preferred from the viewpoint of excellent developability, and more preferably 80% by mass or less. When two or more compounds having an aromatic structure are used as the second monomer, the total copolymerization ratio of each of them is preferably within the above range.

[0026] Examples of compounds having an aromatic structure include benzyl (meth)acrylate, styrene, methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, styrene dimer, styrene trimer and other styrene derivatives, 2-[3-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]ethyl (meth)acrylate, and the like.

[0027] The compound having an aromatic structure is preferably benzyl (meth)acrylate or styrene, more preferably styrene. For example, the copolymerization ratio of styrene is preferably 10 to 90 mass%, more preferably 40 to 80 mass%, and even more preferably 50 to 70 mass%, based on the total mass of all monomer components, from the viewpoint of excellent adhesion and resolution.

[0028] Furthermore, the use of an alkali-soluble polymer with a high copolymerization ratio of a compound having an aromatic structure (e.g., styrene) can easily reduce the number of foreign matters in the photosensitive element. Examples of foreign matters include precipitates measuring several to several tens of micrometers in size (precipitate 11 shown in FIG. 1), or precipitates measuring several micrometers in size as a core with bubbles measuring several tens of micrometers in size (bubble 12 shown in FIG. 1) formed around them. Foreign matters can be observed visually or with an optical microscope.

[0029] An example of foreign matter in a photosensitive resin composition is shown in Figure 1. In the figure, the photosensitive layer is indicated by the number "1," and the foreign matter is indicated by the number "10." Of the foreign matter 10, precipitates having a size of about several to several tens of micrometers are indicated by the number "11," and bubbles having a size of about several tens of micrometers are indicated by the number "12." The trend in development is toward incorporating a relatively large amount of component (C) into a photosensitive resin composition. On the other hand, if the content of component (C) is high, compatibility with other components in the photosensitive resin composition tends to deteriorate, which is thought to result in the generation of such foreign matter 10 in the photosensitive layer 1 during film formation. Using an alkali-soluble polymer with a high copolymerization ratio of a compound having an aromatic structure (e.g., styrene) and a high aromatic ring ratio tends to improve compatibility between the biimidazole photopolymerization initiator (C) and the photosensitive resin composition. This makes it easier to prevent the generation of component (C) in the photosensitive resin composition, even when a photosensitive resin composition is designed to contain a relatively large amount of component (C), and therefore, it is thought to facilitate reducing the number of foreign matters.

[0030] It is also preferable that the compound having an aromatic structure contains both styrene and benzyl (meth)acrylate. The copolymerization ratio of benzyl (meth)acrylate is preferably 1 to 60 mass%, more preferably 1 to 30 mass%, and even more preferably 1 to 20 mass%, based on the total mass of all monomer components.

[0031] The second monomer preferably contains a compound having a hydroxy group. By containing a structural unit derived from such a compound, it becomes easier to control the developability of the photosensitive layer, and therefore it becomes easier to obtain a cured film having excellent adhesion, resolution, etc. The second monomer may contain both a compound having an aromatic structure and a compound having a hydroxy group.

[0032] The compound having a hydroxy group is preferably a hydroxyalkyl (meth)acrylate or a dihydroxyalkyl (meth)acrylate. Examples of the hydroxyalkyl (meth)acrylate include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Examples of the dihydroxyalkyl (meth)acrylate include glycerin mono(meth)acrylate. The compound having a hydroxy group is more preferably 2-hydroxyethyl methacrylate or glycerin mono(meth)acrylate. These compounds are relatively easy to obtain, and yet their developability is easily controlled, making it easy to realize a resist pattern with excellent adhesion and resolution.

[0033] The content of the hydroxyl group-containing compound in component (A) is preferably 1.0 to 20 mass%, more preferably 1 to 10 mass%, and even more preferably 1 to 6 mass%, based on the total mass of all monomer components, from the viewpoints of developability and adhesion. When two or more types of compounds having a hydroxyl group are used, it is preferable that the total copolymerization proportion of each is within the above range.

[0034] The second monomer may further include a polymerizable compound different from either a compound having an aromatic structure or a compound having a hydroxy group. Examples of polymerizable compounds different from either compounds having an aromatic structure or compounds having a hydroxy group include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, and nonylphenoxy polyethylene glycol. (meth)acrylates such as methyl methyl ether (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, phenoxyethyl (meth)acrylate, ethyl carbitol (meth)acrylate, methoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, (2-methyl-2-ethyl-1,3-dioxolan-4-yl)methyl (meth)acrylate, cyclic trimethylolpropane formal (meth)acrylate, and 3,3,5-trimethylcyclohexyl (meth)acrylate; vinyl alcohol esters such as vinyl acetate; and (meth)acrylonitrile.

[0035] The weight average molecular weight Mw of component (A) is preferably 10,000 to 60,000. A weight average molecular weight Mw of 60,000 or less is preferred from the viewpoint of achieving flexibility, resolution, and developability of the resist pattern, and from the same viewpoint, a weight average molecular weight Mw of 55,000 or less is more preferred, and less than 50,000 is even more preferred. From the same viewpoint, the weight average molecular weight Mw is preferably 10,000 or more, more preferably 14,000 or more, and even more preferably 25,000 or more.

[0036] The polydispersity of the component (A) is preferably from 1.0 to 6.0, more preferably from 1.0 to 5.0, even more preferably from 1.0 to 4.0, and particularly preferably from 1.0 to 3.0.

[0037] From the viewpoint of developability and resolution, the component (A) may be a copolymer consisting of only a monomer containing one polymerizable unsaturated group, i.e., the component (A) does not need to contain a polymerizable unsaturated group.

[0038] Component (A) may contain a copolymer containing a polymerizable unsaturated group. The copolymer containing a polymerizable unsaturated group can be obtained, for example, by adding glycidyl (meth)acrylate to a copolymer having a carboxyl group. When the photosensitive resin composition contains a copolymer containing a polymerizable unsaturated group, whether it is component (A) or component (B) may be determined, for example, by the following method. A copolymer containing a monomer having a carboxyl group in the molecule and at least one polymerizable unsaturated group in the molecule as a copolymerization component may be classified as component (A). A compound that is not a copolymer and a copolymer that does not contain a monomer having a carboxyl group in the molecule and at least one polymerizable unsaturated group in the molecule as a copolymerization component may be classified as component (B).

[0039] In this embodiment, the component (A) may be used alone or in a mixture of two or more types. When a mixture of two or more types is used, the content, molecular weight, and polydispersity of the monomers in the multiple components (A) are preferably selected so that the weighted average value, when the content ratio is treated as the weight, falls within the above range.

[0040] The synthesis of component (A) is preferably carried out by adding an appropriate amount of a radical polymerization initiator such as benzoyl peroxide or azoisobutyronitrile to a solution prepared by diluting one or more of the monomers described above with a solvent such as acetone, methyl ethyl ketone, or isopropanol, and then heating and stirring the mixture. The synthesis may be carried out by adding a portion of the mixture dropwise to the reaction solution. After the reaction is complete, additional solvent may be added to adjust the concentration to the desired level. In addition to solution polymerization, bulk polymerization, suspension polymerization, or emulsion polymerization may also be used as a synthesis method. The synthesis may also be carried out by living radical polymerization.

[0041] The content of component (A) relative to the total solid mass of the photosensitive resin composition may be 10% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, 40% by mass or more, 45% by mass or more, 50% by mass or more, 55% by mass or more, or 60% by mass or more, or 90% by mass or less, 80% by mass or less, 70% by mass or less, 60% by mass or less, or 50% by mass or less.

[0042] It is preferable to set the content of component (A) relative to the total solid content by mass of the photosensitive resin composition to 90 mass% or less from the viewpoint of controlling the development time, and it is preferable to set it to 10 mass% or more from the viewpoint of suppressing bleeding of the photosensitive layer from the edge surfaces of the film.

[0043] Component (B): a compound having an ethylenically unsaturated double bond Component (B) preferably contains a (meth)acryloyl group, and more preferably contains a bifunctional or higher functional compound (a bifunctional or higher functional compound having an ethylenically unsaturated double bond). The term "bifunctional or higher functional compound having an ethylenically unsaturated double bond" refers to a compound having two or more ethylenically unsaturated double bonds in one molecule.

[0044] The compound having an ethylenically unsaturated double bond is preferably a (meth)acrylate compound. The compound having an ethylenically unsaturated double bond may contain only a bifunctional compound having an ethylenically unsaturated double bond, or may contain a bifunctional compound having an ethylenically unsaturated double bond and a trifunctional or higher functional compound having an ethylenically unsaturated double bond. The compound having an ethylenically unsaturated double bond may contain, for example, a tetrafunctional, pentafunctional, or hexafunctional compound having an ethylenically unsaturated double bond.

[0045] Examples of the difunctional compound having an ethylenically unsaturated double bond include alkyl di(meth)acrylate, 1,3-bis(meth)acryloyloxy-2-propanol, and compounds represented by the following general formula (I): [ka] (In the formula, R 1 are each independently a hydrogen atom or a methyl group, and X 1 O and Y 1 O each independently represents an oxyethylene group, an oxypropylene group, or an oxybutylene group, and (X 1 O)m1, (X 1 O)m2, (Y 1 O) n1 is a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxybutylene chain, m1, m2, and n1 are each independently an integer of 0 to 40, m1+m2 is 1 to 40, and n1 is 0 to 20. Polyalkylene glycol di(meth)acrylate represented by the following general formula (II):

[0046] General formula (II) [ka] (In the formula, R 2 are each independently a hydrogen atom or a methyl group, and X 2 O and Y 2 Each O is independently an oxyethylene group or an oxypropylene group, m3, m4, n2, and n3 are independently an integer of 0 to 40, m3+m4 is 1 to 40, and n2+n3 is 0 to 20. Examples of the bisphenol A di(meth)acrylate include bisphenol A di(meth)acrylates represented by the following formula:

[0047] The polyalkylene glycol di(meth)acrylate represented by the formula (I) includes R 1 = methyl group, m1 + m2 = 6 (average value), n1 = 12 (average value), X 1 O is an oxyethylene group, Y 1 Examples include a vinyl compound in which O is an oxypropylene group (manufactured by Hitachi Chemical Co., Ltd., product name "FA-024M").

[0048] The bisphenol A type di(meth)acrylate compound represented by the general formula (II) is, for example, BPE-200(R 2 = methyl group, X 2 O = oxyethylene group, m3 + m4 = 4, n2 = n3 = 0), BPE-500(R 2 = methyl group, X 2 O = oxyethylene group, m3 + m4 = 10, n2 = n3 = 0), BPE-900(R 2 = methyl group, X 2 O = oxyethylene group, m3 + m4 = 17, n2 = n3 = 0) (all manufactured by Shin-Nakamura Chemical Co., Ltd., product names), FA-321M(R 2 = methyl group, X 2 O = oxyethylene group, m3 + m4 = 10, n2 = n3 = 0), FA-P321M(R 2 = methyl group, X 2 O=oxypropylene group, m3+m4=10, n2=n3=0) (all of these are product names manufactured by Hitachi Chemical Co., Ltd.) These may be used alone or in any combination of two or more.

[0049] From the viewpoints of adhesion, resolution, and reducing the number of foreign particles, component (B) preferably contains a bisphenol A di(meth)acrylate compound represented by general formula (II). The content of the bisphenol A di(meth)acrylate compound represented by general formula (II) is preferably 1% by mass or more, more preferably 20% by mass or more, even more preferably 50% by mass or more, and particularly preferably 80% by mass or more, based on the total amount of component (B). Use of a bisphenol A di(meth)acrylate compound represented by general formula (II) with a high aromatic ring ratio tends to improve the compatibility between the photosensitive resin composition and component (C). This is thought to facilitate preventing the generation of component (C) in the photosensitive resin composition, thereby facilitating the reduction of the number of foreign particles.

[0050] In terms of resolution and adhesion, the average value of n2+n3+m3+m4 in the bisphenol A di(meth)acrylate compound represented by the general formula (II) is preferably 20 or less, and more preferably 10 or less. It is more preferable to include a bisphenol A di(meth)acrylate in which the average value of n2+n3+m3+m4 is more than 5 and 10 or less, and a bisphenol A di(meth)acrylate in which the average value of n2+n3+m3+m4 is 5 or less. The average value of n2+n3+m3+m4 may be 2 or more. The number of oxyethylene or oxypropylene structural units is an integer value in a single molecule, and is a rational number that is the average value in an aggregate of multiple molecules.

[0051] Commercially available bifunctional compounds having an ethylenically unsaturated double bond include, for example, NK Ester (registered trademark) A-HD-N, A-NOD-N, A-DOD-N, A-NPG, 701A, A-200, A-400, A-600, A-1000, APG-200, APG-400, APG-700, A-PTMG65, A-DCP, ABE-300, A-BPE-4, A-BPE-10, A-BPE-20, HD-N, NOD-N, DOD-N, NPG, 701, 2G, 3G, 4G, and 9G. 14G, 23G, 9PG, DCP, BPE-80N, BPE-100, BPE-200, BPE-500, BPE-900, BPE-1300N, NK Oligo (registered trademark) UA-4200, UA-160™, UA-290™, UA-W2A, UA-4400, UA-122P, U-200PA (all manufactured by Shin-Nakamura Chemical Co., Ltd.), Light Acrylate (registered trademark) 3EG-A, 4EG-A, 9EG-A, 14EG-A, PTMGA-250, NP-A, MPD-A, 1.6HX-A, and 1.9ND-A, DCP-A, BP-4EAL, BP-4PA, HPP-A, Light Ester G-201P (all manufactured by Kyoeisha Chemical Co., Ltd.), Fancryl (registered trademark) FA-124AS, FA-023M, FA-121M, FA-124M, FA-125M, FA-129AS, FA-137M, FA-220M, FA-222A, FA-240A, FA-240M, FA-320M, FA-3218M, FA-321A, FA-321M, FA-324A, FA-731A, FA-P240A, FA-P270A, FA-PTG9A, FA-PTG9M, FA-PTG28A, FA-PTG49A (all manufactured by Showa Denko Materials Co., Ltd.), DPGDA, HDDA, TPGDA, EBECRYL 145, EBECRYL 150, PEG400DA, EBECRYL 11, IRR 214-K, EBECRYL 130, EBECRYL PEG200DMA (all manufactured by Daicel-Allnex Co., Ltd.), SR212, SR213, SR230, SR238F, SR259, SR268, SR272, SR306H, SR344, SR349, SR508, CD560, CD561, CD564, SR601, SR602, SR610, SR833S, SR9003, SR9045, SR9209, SR205, SR206, SR209, SR210, SR214, SR231, SR239, SR248, SR252, SR297, SR348, SR480, CD540, CD541, CD542, SR603, SR644, and SR9036 (all manufactured by Arkema Co., Ltd.), and KAYARAD (registered trademark). Examples include NPGDA, PEG400DA, FM-400, R-167, HX-220, HX-620, R-551, R-712, R-604, and R-684 (all manufactured by Nippon Kayaku Co., Ltd.).

[0052] The proportion of the bifunctional compound having an ethylenically unsaturated double bond is preferably 20% by mass or more, more preferably 50% by mass or more, and even more preferably 75% by mass or more, based on the total amount of component (B), from the viewpoints of releasability, resolution, and adhesion.

[0053] Examples of trifunctional or higher functional compounds having an ethylenically unsaturated double bond include trimethylolpropane tri(meth)acrylate, glycerin tri(meth)acrylate, isocyanuric acid tri(meth)acrylate, pentaerythritol (tri / tetra)(meth)acrylate, ditrimethylolpropane (tetra / penta / hexa)(meth)acrylate, and dipentaerythritol (tetra / penta / hexa)(meth)acrylate.

[0054] The compound having a trifunctional or higher functional ethylenically unsaturated double bond may be a compound obtained by forming a (meth)acrylate from an alcohol having a central skeleton containing three or more groups to which an alkylene oxide group can be added in the molecule, the alcohol having an alkylene oxide group such as an ethylene oxide group, a propylene oxide group, or a butylene oxide group added thereto, and (meth)acrylic acid. Examples include alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, alkylene oxide-modified tri(meth)acrylate of glycerin, alkylene oxide-modified pentaerythritol (tri / tetra)(meth)acrylate, alkylene oxide-modified ditrimethylolpropane (tetra / penta / hexa)(meth)acrylate, alkylene oxide-modified dipentaerythritol (tetra / penta / hexa)(meth)acrylate, and alkylene oxide-modified isocyanuric acid tri(meth)acrylate.

[0055] The compound having a tri- or higher functional ethylenically unsaturated double bond may include alkylene oxide-modified pentaerythritol (tri / tetra)(meth)acrylate from the viewpoint of developability.

[0056] Commercially available compounds having a tri- or higher functional ethylenically unsaturated double bond include, for example, NK Ester (registered trademark) A-TMPT, A-TMPT-9EO, AT-20E, A-GLY-3E, A-GLY-9E, A-GLY-20E, A-9300, A-9200YN, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMMT, ATM-35E, AD-TMP, A-DPH, and A-9550. , A-DPH-12E, TPOA-50, NK Oligo (registered trademark) UA-7100, UA-1100H, U-6LPA, UA-33H, U-10HA, U-10PA, U-15HA (all manufactured by Shin-Nakamura Chemical Co., Ltd.), Light Acrylate (registered trademark) TMP-A, cPE-3A, PE-4A, DPE-6A (all manufactured by Kyoeisha Chemical Co., Ltd.), FA-731A (manufactured by Showa Denko Materials Co., Ltd.), TMPTA, EBECRYL 160S, OTA 480, PETIA, PETRA, EBECRYL 40, PETA, EBECRYL 140, EBECRYL 1140, EBECRYL 1142, DPHA, EBECRYL 895, EBECRYL 896, EBECRYL TMPTMA (all manufactured by Daicel-Allnex Co., Ltd.), SR351S, SR368, SR415, SR444, SR454, SR492, SR499, CD501, SR502, SR9020, D9021, SR9035, SR295, SR355, SR399, SR494, SR9041 (all manufactured by Arkema Co., Ltd.), KAYARAD (registered trademark) Examples include GPO-303, TMPTA, THE-330, TPA-330, PET-30, T-1420(T), RP-1040, DPHA, DPEA-12, D-310, and DPCA-20 (all manufactured by Nippon Kayaku Co., Ltd.).

[0057] From the viewpoint of adhesion and developability, the proportion of the compound having a trifunctional ethylenically unsaturated double bond may be 1 to 50 mass %, 1 to 25 mass %, or 1 to 15 mass %, based on the total amount of component (B).

[0058] The content of component (B) relative to the total solid mass of the photosensitive resin composition is preferably 30% by mass or more, more preferably 35% by mass or more, from the viewpoints of sensitivity, tackiness, and followability, and is preferably 50% by mass or less, more preferably 45% by mass or less, and even more preferably 42% by mass or less, from the viewpoints of edge fusion property, tackiness, and resolution.

[0059] From the viewpoints of edge fusion property, tackiness, and resolution, the ratio of the solid content of component (B) to the solid content of component (A) (i.e., the value of solid content of component (B) / solid content of component (A)) is preferably 1.4 or less, more preferably 1.3 or less, even more preferably 1.2 or less, and particularly preferably 1.1 or less. The lower limit is preferably 0.7 or more, more preferably 0.8 or more, even more preferably 0.9 or more, and particularly preferably 1.0 or more.

[0060] In this specification, edge fusion property refers to the tendency of resist to protrude from the edge surface of a photosensitive element roll, particularly the tendency of resist to protrude from the edge surface during storage of the photosensitive element roll, and the smaller the amount of protruding resist, the better. Tackiness refers to the adhesiveness of the photosensitive resin composition, and from the viewpoint of suppressing defects in lamination to a substrate and in peeling of the protective film and the support film, it is preferable that the adhesiveness of the photosensitive resin composition is appropriate. Conversely, by suitably controlling the adhesiveness of the photosensitive resin composition, it is easy to suppress defects in lamination to a substrate and to suppress defects in peeling of the protective film and the support film.

[0061] The number of ethylenically unsaturated double bonds per 100 g of solid content of the photosensitive resin composition is preferably 0.1 to 0.3 mol. When the amount is 0.1 mol or more, it is easy to prevent the photosensitive resin component from leaching out of the cured resist pattern in the water washing step after development, which in turn makes it easy to prevent contamination of the water washing step. When the amount is 0.3 mol or less, it is easy to prevent chipping and even falling off of the cured resist pattern in the water washing step after development, which in turn makes it easy to prevent contamination of the water washing step.

[0062] The number of ethylenically unsaturated double bonds per 100 g of solid content of the photosensitive resin composition is preferably 0.1 mol or more, more preferably 0.11 mol or more, even more preferably 0.12 mol or more, particularly preferably 0.13 mol or more, and is preferably 0.3 mol or less, more preferably 0.28 mol or less, even more preferably 0.25 mol or less, particularly preferably 0.22 mol or less, 0.20 mol or less, or 0.18 mol or less, and most preferably 0.15 mol or less. The number of ethylenically unsaturated double bonds per 100 g of solid content in the photosensitive resin composition is preferably 0.1 to 0.25 mol, more preferably 0.1 to 0.2 mol, still more preferably 0.11 to 0.2 mol, and particularly preferably 0.11 to 0.15 mol.

[0063] Component (C): Biimidazole photopolymerization initiator The component (C) is a photopolymerization initiator having a biimidazole structure. The content of component (C) is preferably 5.0% by mass or more, and from the viewpoints of sensitivity and adhesion, it is preferably 5.25% by mass or more, more preferably 5.5% by mass or more, even more preferably 6.0% by mass or more, and most preferably 7.0% by mass or more, based on the total solid mass of the photosensitive resin composition. Also, from the viewpoint of reducing the number of foreign matters, it is preferably 10% by mass or less, more preferably 9.0% by mass or less, and even more preferably 8.0% by mass or less.

[0064] An example of the component (C) is lophine dimer, that is, a dimer of 2,4,5-triarylimidazole. Lophine dimers, i.e., dimers of 2,4,5-triarylimidazole, include the dimer of 2-(o-chlorophenyl)-4,5-diphenylbiimidazole (also known as 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole), 2,2',5-tris-(o-chlorophenyl)-4-(3,4-dimethoxyphenyl)-4',5'-diphenylbiimidazole, 2,4-bis-(o-chlorophenyl)-5-(3,4-dimethoxyphenyl)-diphenylbiimidazole, 2,4,5- Tris-(o-chlorophenyl)-diphenylbiimidazole, 2-(o-chlorophenyl)-bis-4,5-(3,4-dimethoxyphenyl)-biimidazole, 2,2'-bis-(2-fluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3-difluoromethylphenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,4-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole 2,2'-bis-(2,5-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,6-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,4-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,5-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methylphenyl)-biimidazole 2,2'-bis-(2,3,6-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,4,5-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,4,6-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,4,5-tetrafluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,4,5-tetrafluorophenyl)-4,4',5,Examples include 5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,4,6-tetrafluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, and 2,2'-bis-(2,3,4,5,6-pentafluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole.

[0065] From the viewpoints of high sensitivity, resolution, and adhesion, the biimidazole photopolymerization initiator (C) preferably contains a lophine dimer, and particularly, it is more preferable that it contains a 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer.

[0066] Component (D): Other photopolymerization initiators and / or sensitizers Component (D) is a photopolymerization initiator or sensitizer other than component (C). In this specification, a photopolymerization initiator is a compound that initiates polymerization of component (B) upon irradiation with light of a specific wavelength. The photopolymerization initiator may be, for example, a radical polymerization initiator. In this specification, a sensitizer is a compound that promotes polymerization of component (B) upon irradiation with light of a specific wavelength. A compound that functions as both a photopolymerization initiator and a sensitizer may also be included as component (D).

[0067] Here, a compound that can be used as the component (C) may also function as the component (D), and a compound that can be used as the component (D) may also function as the component (C). On the other hand, when a specific photopolymerization initiator is adopted for component (C), the other photopolymerization initiator may be regarded as component (D). For example, when component (C) contains 5.0 mass% or more of a lophine dimer based on the total mass of the solid content of the photosensitive resin composition, the photopolymerization initiator other than the lophine dimer may be treated as component (D).

[0068] Examples of component (D) include N-aryl-α-amino acid compounds, quinone compounds, aromatic ketone compounds, anthracene derivatives, acetophenone compounds, acylphosphine oxide compounds, benzoin compounds, benzoin ether compounds, dialkyl ketal compounds, thioxanthone compounds, dialkylaminobenzoic acid ester compounds, oxime ester compounds, acridine compounds, pyrazoline derivatives, N-arylamino acid ester compounds, coumarin derivatives, and halogen compounds.

[0069] Examples of aromatic ketone compounds include benzophenone compounds. Examples of benzophenone compounds include benzophenone, Michler's ketone [4,4'-bis(dimethylamino)benzophenone], 4-methoxy-4'-dimethylaminobenzophenone, and 4-(dimethylamino)benzophenone. From the viewpoints of sensitization effect and adhesion, 4,4'-bis(diethylamino)benzophenone or 4-(dimethylamino)benzophenone is preferred as the aromatic ketone compound.

[0070] In this specification, the term "anthracene derivative" refers to both anthracene and compounds derived therefrom. Examples of anthracene derivatives include anthracene, 9,10-dialkoxyanthracene, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dibutoxyanthracene, 9,10-diphenylanthracene, 2-ethylanthraquinone, octaethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, and 10-phenyl-9-anthraceneboronic acid. From the viewpoint of sensitization effect and adhesion, 9,10-dibutoxyanthracene, 9,10-diphenylanthracene, and 10-phenyl-9-anthraceneboronic acid are preferred, and 9,10-diphenylanthracene and 10-phenyl-9-anthraceneboronic acid are particularly preferred.

[0071] From the viewpoints of adhesion and rectangularity of the resist pattern, the pyrazoline derivatives are preferably 1-phenyl-3-(4-tert-butyl-styryl)-5-(4-tert-butyl-phenyl)-pyrazoline, 1-phenyl-3-(4-biphenyl)-5-(4-tert-butyl-phenyl)-pyrazoline, 1-phenyl-3-(4-biphenyl)-5-(4-tert-octyl-phenyl)-pyrazoline, or 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline.

[0072] When the photosensitive layer contains the component (D), from the viewpoint of storage stability, it preferably contains at least one of a benzophenone compound, a pyrazoline compound, an anthracene compound, and a coumarin compound, more preferably contains at least one of a benzophenone compound and a pyrazoline compound, and even more preferably contains a benzophenone compound.

[0073] The content of component (D) is preferably 0 to 0.5% by mass, more preferably 0 to 0.1% by mass, even more preferably 0 to 0.05% by mass, and particularly preferably 0 to 0.025% by mass. By adjusting the content of component (D) within the above range, it is easy to reduce absorbance in regions other than the exposure wavelength and to improve storage stability.

[0074] Component (E): Polymerization inhibitor Examples of component (E) include phenothiazine, p-methoxyphenol, hydroquinone, pyrogallol, naphthylamine, tert-butylcatechol, cuprous chloride, 2,6-di-tert-butyl-p-cresol, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], nitrosophenylhydroxyamine aluminum salt (e.g., aluminum salt with 3 moles of nitrosophenylhydroxylamine added), and diphenylnitrosamine. Among these, triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate] or aluminum salt with 3 moles of nitrosophenylhydroxylamine added is preferred. These can be used alone or in combination of two or more.

[0075] From the viewpoint of storage stability, the component (E) preferably contains any one of phenothiazine, p-methoxyphenol, tert-butylcatechol, and 2,6-di-tert-butyl-p-cresol.

[0076] From the viewpoint of resolution, the content of the component (E) is preferably from 10 to 5000 ppm, more preferably from 50 to 1000 ppm, and even more preferably from 50 to 500 ppm, based on the total solid mass of the photosensitive resin composition.

[0077] Other ingredients The photosensitive resin composition may contain other components (antioxidants, stabilizers, base dyes, plasticizers, etc.) as desired.

[0078] Examples of base dyes include Basic Green 1 [CAS number (hereinafter the same): 633-03-4] (e.g., Aizen Diamond Green GH, product name, manufactured by Hodogaya Chemical Co., Ltd.), Fuchsin [632-99-5], Methyl Violet [603-47-4], Methyl Green [82-94-0], Victoria Blue B [2580-56-5], Basic Blue 7 [2390-60-5] (e.g., Aizen Victoria Pure Blue BOH, product name, manufactured by Hodogaya Chemical Co., Ltd.), Rhodamine B [81-88-9], Rhodamine 6G [989-38-8], and Basic Yellow 2 [2465-27-2]. Among these, Basic Green 1 is preferred from the viewpoint of improving colorability, hue stability, and exposure contrast. These dyes can be used alone or in combination of two or more.

[0079] The content of the base dye is preferably 0.001 to 3 mass %, more preferably 0.01 to 2 mass %, and even more preferably 0.04 to 1 mass %. From the viewpoint of obtaining good coloring properties, the content of the base dye is preferably equal to or greater than the above lower limit, while from the viewpoint of maintaining the sensitivity of the photosensitive layer, the content is preferably equal to or less than the above upper limit.

[0080] Examples of antioxidants include triphenyl phosphite (e.g., manufactured by ADEKA Corporation under the trade name: TPP), tris(2,4-di-tert-butylphenyl) phosphite (e.g., manufactured by ADEKA Corporation under the trade name: 2112), tris(mononylphenyl) phosphite (e.g., manufactured by ADEKA Corporation under the trade name: 1178), and bis(mononylphenyl)-dinonylphenyl phosphite (e.g., manufactured by ADEKA Corporation under the trade name: 329K). These can be used alone or in combination of two or more.

[0081] The content of the antioxidant is preferably 0.01 to 0.8% by mass, more preferably 0.01 to 0.3% by mass, based on the total solids mass of the photosensitive resin composition. From the viewpoint of achieving good hue stability of the resist pattern and improving the sensitivity of the photosensitive layer, the content of the antioxidant is preferably equal to or greater than the above-mentioned lower limit. On the other hand, from the viewpoint of achieving good hue stability while suppressing the color development of the resist pattern and improving adhesion, the content of the antioxidant is preferably equal to or less than the above-mentioned upper limit.

[0082] The stabilizer can be used to improve the thermal stability of the photosensitive resin composition. Examples of the stabilizer include at least one of an alkylene oxide compound having a glycidyl group and a benzotriazole compound. These can be used alone or in combination of two or more.

[0083] Examples of alkylene oxide compounds having a glycidyl group include neopentyl glycol diglycidyl ether (e.g., Epolite 1500NP manufactured by Kyoeisha Chemical Co., Ltd.), nonaethylene glycol diglycidyl ether (e.g., Epolite 400E manufactured by Kyoeisha Chemical Co., Ltd.), bisphenol A-propylene oxide 2-mol adduct diglycidyl ether (e.g., Epolite 3002 manufactured by Kyoeisha Chemical Co., Ltd.), and 1,6-hexanediol diglycidyl ether (e.g., Epolite 1600 manufactured by Kyoeisha Chemical Co., Ltd.). These can be used alone or in combination of two or more.

[0084] Examples of the benzotriazole compound include carboxylbenzotriazole, 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, 1-(N,N-bis(2-ethylhexyl)aminomethyl)-1,2,3-benzotriazole, 1-(N,N-bis(2-ethylhexyl)aminomethyl)-1,2,3-tolyltriazole, 1-(N,N-bis-2-hydroxyethyl)aminomethyl)-1,2,3-benzotriazole, and 1-(N,N-bis(2-ethylhexyl)aminomethyl)-5-carboxy-1,2,3-benzotriazole.

[0085] The total content of the antioxidant, the alkylene oxide compound having a glycidyl group, and the benzotriazole compound in the photosensitive resin composition is preferably 0.001 to 3 mass %, more preferably 0.05 to 1 mass %.

[0086] In this embodiment, the photosensitive layer may contain a color-forming dye that develops color upon exposure to light. Known examples of color-forming dyes include a combination of a leuco dye and a halogen compound. Examples of leuco dyes include tris(4-dimethylamino-2-methylphenyl)methane (leuco crystal violet) and tris(4-dimethylamino-2-methylphenyl)methane (leucomalachite green). Examples of halogen compounds include amyl bromide, isoamyl bromide, isobutylene bromide, ethylene bromide, diphenylmethyl bromide, benzal bromide, methylene bromide, tribromomethylphenyl sulfone, carbon tetrabromide, tris(2,3-dibromopropyl)phosphate, trichloroacetamide, amyl iodide, isobutyl iodide, 1,1,1-trichloro-2,2-bis(p-chlorophenyl)ethane, and hexachloroethane.

[0087] In this embodiment, the photosensitive layer may contain additives such as plasticizers as needed, such as phthalates such as diethyl phthalate, o-toluenesulfonic acid amide, p-toluenesulfonic acid amide, tributyl citrate, triethyl citrate, triethyl acetyl citrate, tri-n-propyl acetyl citrate, tri-n-butyl acetyl citrate, polypropylene glycol, polyethylene glycol, polyethylene glycol alkyl ether, and polypropylene glycol alkyl ether.

[0088] <Configuration of photosensitive layer> The thickness of the photosensitive layer is preferably 3 to 100 μm, and specifically preferred film thicknesses include 7 μm, 15 μm, 25 μm, 40 μm, and 60 μm. A more preferred upper limit is 50 μm. As the thickness approaches 3 μm, resolution is more likely to improve, and as the thickness approaches 100 μm, film strength is more likely to improve, so the thickness can be appropriately selected depending on the application. When the formed resist pattern is used in a plating formation process, the film thickness is preferably 10 to 30 μm, and more preferably 15 to 25 μm.

[0089] In this embodiment, the absorbance (Y) at a wavelength of 365 nm when the photosensitive layer has a film thickness of 25 μm is 0.35 or less. This results in excellent storage stability and rectangular resist pattern, and facilitates the realization of good adhesion. From the same viewpoint, the absorbance is preferably 0.3 or less, more preferably 0.2 or less, even more preferably 0.18 or less, and particularly preferably 0.16 or less. The absorbance may be 0 or more, and from the viewpoint of obtaining a photosensitive layer resin composition having good photoreactivity and excellent sensitivity, it is preferably 0.11 or more.

[0090] Generally, the absorbance of the photosensitive layer can be measured with a spectrophotometer by placing the substrate on which the photosensitive layer is formed on the reference side. Furthermore, generally, the absorbance can also be measured with reference to JIS K 0115 (2004). When using a spectrophotometer, the absorbance of the photosensitive layer can also be calculated by converting the measurement result using only the substrate as a reference. In the case of the photosensitive element described below, a support film can be used as the substrate. The absorbance measured by the above method is a value derived including the amount of light scattered by the photosensitive layer and the substrate. In this embodiment, the "absorbance" is a value derived using the method described in the <Absorbance> section of the Examples.

[0091] In this embodiment, the contribution (X) is expressed by the following formula (1): X (%) = 100 × εc / absorbance of photosensitive layer (Y) (1) ε: Change in absorbance per 1% by mass of component (C) c: Content (mass%) of component (C) in the total solid components of the photosensitive resin composition It is calculated as follows.

[0092] ε can be calculated by the following method. Photosensitive resin compositions were prepared by adding different amounts of component (C) to 100 parts by mass of the total of components (A) and (B). Each composition was applied to a substrate to a film thickness of 25 μm, and the absorbance of the resulting photosensitive layer was measured. The results were plotted with the content (mass%) of component (C) relative to the total solids mass of the photosensitive resin composition on the X axis and the absorbance (Y) of the photosensitive layer on the Y axis. The data obtained were linearly approximated to obtain a straight line with a specified slope. The slope of this line corresponds to the change in absorbance ε per 1 mass% of component (C) at that content. The component (A) used here preferably contains methacrylic acid, styrene, benzyl methacrylate, 2-hydroxyl methacrylate, and methyl methacrylate in any desired ratio. The component (B) preferably is a bisphenol A di(meth)acrylate such as FA-321M. These components have low absorbance at 365 nm, making them suitable for accurately measuring the absorbance change ε ​​per 1% by mass of the component (C).

[0093] From the viewpoint of storage stability, the contribution (X) is preferably 45% or more, more preferably 55% or more, even more preferably 65% ​​or more, and particularly preferably 85% or more. The larger the value (X), the more easily the sensitizing effect of additives other than component (C) is suppressed, and the reactivity to long-wavelength light such as yellow light is likely to decrease, which is thought to tend to improve storage stability.

[0094] Examples of means for increasing the contribution (X) include increasing the content of component (C), decreasing the content of component (D), and decreasing the content of other components that absorb at 365 nm.

[0095] When the photosensitive resin composition contains a plurality of components (C), the contribution (X) can be calculated as follows. That is, when the component (C) contains the components (C-1) to (Cn) (n is an integer of 2 or more), the change in absorbance per 1 mass% is ε1 to ε n , the content of each (C) component c1 to c n , and thus derive the contributions (X-1) to (Xn). The sum of the obtained contributions (X-1) to (Xn) is treated as the contribution (X) in this embodiment.

[0096] <Protective film> The photosensitive element of this embodiment may include a protective film. The support film, the photosensitive layer, and the protective film may be laminated in this order. The protective film can be laminated on the photosensitive layer side of the laminate of the support film and the photosensitive layer, and functions as a cover.

[0097] When the adhesive strength between the photosensitive layer and the protective film is sufficiently weaker than the adhesive strength between the photosensitive layer and the support film, the protective film can be easily peeled off from the photosensitive layer. For example, polyethylene film, polypropylene film, oriented polypropylene film, polyester film, etc. can be preferably used as the protective film. A release layer may also be provided on the surface of the protective film.

[0098] The thickness of the protective film is preferably 10 to 100 μm, more preferably 10 to 50 μm. Examples of the protective film include Alphan (registered trademark) EM-501, E-200, E-201F, FG-201, and MA-411 (all manufactured by Oji F-Tex Co., Ltd.), Torayfan (registered trademark) KW37, 2578, 2548, 2500, and YM17S, Therapeel (registered trademark) PJ271, PJ111, HP2, PJ101, WZ, MDA, MFA, TK07, BKE, BX8A, and SY (all manufactured by Toray Industries, Inc.), and GF-18, GF-818, and GF-858 (all manufactured by Tamapoly Co., Ltd.).

[0099] [Photosensitive element roll] The photosensitive element may be in a long shape, or may be in a roll shape in which a long photosensitive element is wound around a core.

[0100] [Method for forming resist pattern] The method for forming a resist pattern using a photosensitive element according to this embodiment includes the following steps: laminating the photosensitive element to a substrate; exposing the photosensitive layer of the laminated photosensitive element; and developing the exposed photosensitive layer; Preferably, in this order.

[0101] (Lamination process) Specifically, in the lamination step, if the photosensitive element includes a protective film, the protective film is peeled off from the photosensitive element, and then the photosensitive layer is heat-pressed onto the surface of a support (e.g., a substrate) using a laminator, and laminated once or multiple times. Examples of materials for the substrate include copper, stainless steel (SUS), glass, and indium tin oxide (ITO). The heating temperature during lamination is generally 40 to 160°C. Heat-pressing can be performed using a laminator equipped with rolls, or by repeatedly passing the laminate of the substrate and the photosensitive layer through the rolls several times. Heat-pressing can be performed under reduced pressure, if desired.

[0102] (Exposure process) In the exposure step, the photosensitive layer is exposed using an exposure machine. The exposure can be carried out after peeling off the support, if desired. When exposure is carried out through a photomask, the exposure dose is determined by the illuminance of the light source and the exposure time, and may be measured using an actinometer. In the exposure step, direct imaging exposure may be carried out. In direct imaging exposure, exposure is carried out directly on the substrate using a drawing device without using a photomask. A semiconductor laser or an ultra-high pressure mercury lamp with a wavelength of 350 to 410 nm is used as the light source. When the drawing pattern is controlled by a computer, the exposure dose is determined by the illuminance of the exposure light source and the moving speed of the substrate.

[0103] The light irradiation method used in the exposure step is preferably at least one method selected from the group consisting of projection exposure, proximity exposure, contact exposure, direct imaging exposure, and electron beam direct writing, and is more preferably performed by the projection exposure method or the direct imaging exposure method.

[0104] A heating step may be performed between the exposure step and the development step. The heating temperature is preferably about 30 to about 200°C, more preferably 30 to 150°C, and even more preferably 35 to 120°C. By performing this heating step, it is possible to improve resolution and adhesion. For heating, a hot air, infrared, or far-infrared heating furnace, a thermostatic oven, a hot plate, a hot air dryer, an infrared dryer, a hot roll, or the like can be used.

[0105] The time elapsed from the exposure step to the heating step, more precisely the time elapsed from the time exposure is stopped to the time heating is started, is preferably 10 to 600 seconds, more preferably 20 to 300 seconds.The time elapsed from the time heating is started to the time heating is stopped is preferably 1 to 120 seconds, more preferably 5 to 60 seconds.

[0106] (Development process) In the development process, the unexposed or exposed areas of the photosensitive layer after exposure are removed with a developer using a developing device. If a support film is present on the photosensitive layer after exposure, it is removed. Then, the unexposed or exposed areas are developed and removed using a developer consisting of an alkaline aqueous solution, thereby obtaining a resist image.

[0107] The alkaline aqueous solution is preferably an aqueous solution of Na2CO3, K2CO3, tetramethylammonium hydroxide, or the like. The alkaline aqueous solution is selected according to the characteristics of the photosensitive layer, but an aqueous Na2CO3 solution with a concentration of 0.2 to 2% by mass is generally used. The alkaline aqueous solution may contain a surfactant, an antifoaming agent, a small amount of an organic solvent to promote development, etc. The temperature of the developer in the development step is preferably kept constant within the range of 20 to 40°C.

[0108] The development step preferably includes a water washing step for removing the developer contained in the resist pattern after development. The washing water may be pure water, industrial water, or other water selected according to the characteristics of the photosensitive layer. To improve the resolution and shape of the resist pattern, a polyvalent metal salt such as MgSO4 may be added at a concentration of 0.001 to 1% by mass. The temperature of the washing water in the water washing step is preferably kept constant within the range of 20 to 40°C.

[0109] A resist pattern can be obtained by the above steps, and if desired, a heating step can be further carried out at 60 to 300°C. By carrying out this heating step, the chemical resistance of the resist pattern can be improved. For the heating step, a heating furnace using hot air, infrared rays, or far infrared rays can be used.

[0110] To obtain a conductive pattern, a conductive pattern forming step may be carried out after the developing step or heating step, in which the substrate on which the resist pattern has been formed is etched or plated.

[0111] The method for producing a conductor pattern is carried out, for example, by using a metal plate or a metal-coated insulating plate as a substrate, forming a resist pattern by the above-mentioned resist pattern formation method, and then carrying out a conductor pattern formation step, in which a conductor pattern is formed on the substrate surface (e.g., copper surface) exposed by development using a known etching method or plating method.

[0112] Furthermore, after producing a conductor pattern by the above-mentioned method for producing a conductor pattern, a peeling process can be carried out to peel the resist pattern from the substrate using an aqueous solution that is more alkaline than the developer, thereby obtaining a wiring board (e.g., a printed wiring board) having a desired wiring pattern.

[0113] The aqueous alkaline solution used for stripping (hereinafter also referred to as "stripping solution") is not particularly limited, but an aqueous solution of NaOH or KOH with a concentration of 2 to 5% by mass, or an organic amine-based stripping solution is generally used. A small amount of a water-soluble solvent may be added to the stripping solution. Examples of the water-soluble solvent include alcohol. The temperature of the stripping solution in the stripping step is preferably within the range of 40 to 70°C.

[0114] In this embodiment, the photosensitive element can be used in the manufacture of printed wiring boards; the manufacture of lead frames for mounting IC chips; precision processing of metal foils such as metal masks; the manufacture of packages such as ball grid arrays (BGAs) and chip-sized packages (CSPs); the manufacture of tape substrates such as chip-on-film (COFs) and tape automated bonding (TABs); the manufacture of semiconductor bumps; and the manufacture of partition walls for flat panel displays such as ITO electrodes, address electrodes, and electromagnetic wave shields. Unless otherwise specified, the values ​​of the above-mentioned parameters are measured in accordance with the measurement methods in the examples described below. [Example]

[0115] The present embodiment will be described below with reference to examples and comparative examples. However, the present embodiment is not limited to the following examples as long as it does not deviate from the gist of the present embodiment. The physical properties in the examples were measured by the following methods.

[0116] <Synthesis of component (A)> The monomers (copolymerization components) shown in the table were mixed with azobisisobutyronitrile in the amounts (unit: parts by mass) shown in the table to prepare solution (a). 200 g of methyl ethyl ketone and 100 g of ethanol were placed in a flask equipped with a stirrer, reflux condenser, thermometer, dropping funnel, and nitrogen gas inlet tube, and the mixture was stirred while blowing nitrogen gas into the flask and heated to 80°C. 300 g of solution (a) was added dropwise to the mixture in the flask at a constant rate over 4 hours, and the mixture was then stirred at 80°C for 2 hours.

[0117] Next, 0.5 parts by mass of azobisisobutyronitrile was dissolved in 50 parts by mass of a mixture of 30 parts by mass of methyl ethyl ketone and 20 parts by mass of ethanol to prepare solution (b). 50 g of solution (b) was added dropwise to the solution in the flask at a constant rate over 10 minutes, and the solution in the flask was stirred at 80°C for 3 hours. The solution in the flask was then heated to 90°C over 30 minutes and maintained at 90°C for 2 hours. After that, stirring was stopped and the solution was cooled to room temperature (25°C). This yielded solutions of alkali-soluble polymers A1 to A9. The weight-average molecular weights (Mw) of the alkali-soluble polymers A1 to A9 are shown in the table.

[0118] The weight average molecular weight was determined by measuring by gel permeation chromatography (GPC) and converting the result using a calibration curve of standard polystyrene. The GPC conditions are shown below. (GPC conditions) Pump: JASCO PU-980 Columns: 2 in total Shodex KF-80Y / KF-806M Eluent: tetrahydrofuran Measurement temperature: 40℃ Flow rate: 2.05mL / min Detector: JASCO RI-1530

[0119] [Preparation of evaluation samples] The evaluation samples were prepared as follows.

[0120] <Preparation of Photosensitive Element> The components shown in the table were mixed in the amounts shown in the table (the number for each component indicates the amount of solids (unit: parts by mass)), and methyl ethyl ketone measured to give a solids concentration of 60% was added. The mixture was then thoroughly stirred and mixed to obtain a photosensitive resin composition preparation. The amount (parts by mass) is the mass of nonvolatile matter (solid content). A 16 μm-thick polyethylene terephthalate film (Toray Industries, Inc., QS71) was used as a support film, and the preparation was uniformly applied to its surface using a bar coater. The film was then dried in a dryer at 95°C for 2 minutes and 30 seconds to form a photosensitive layer with a thickness of 25 μm.

[0121] Next, a 19 μm polyethylene film (protective film, manufactured by Tamapoly Co., Ltd., GF-818) was laminated as a protective film to the surface of the photosensitive layer on the side not laminated with the polyethylene terephthalate film, thereby obtaining a photosensitive resin element.

[0122] <Surface> As a substrate for evaluating image quality, a 0.4 mm thick copper clad laminate on which 18 μm rolled copper foil was laminated was surface washed with a 10 mass % H 2 SO 4 aqueous solution.

[0123] <Lamination> While peeling off the polyethylene film (protective film) from the photosensitive element, the photosensitive resin laminate was laminated onto a copper-clad laminate preheated to 50°C using a hot roll laminator (AL-700, manufactured by Asahi Kasei Corporation) at a roll temperature of 105°C. The air pressure was 0.35 MPa and the lamination speed was 1.5 m / min.

[0124] <Exposure> Two hours after lamination, the evaluation substrate was exposed to light at a wavelength of 365 nm using a projection exposure machine (UX-2003SM-AGG01 manufactured by Ushio Inc.) using a predetermined mask pattern for projection exposure.

[0125] <Heating> One minute after exposure, the evaluation substrate was heated for 30 seconds in a constant temperature incubator with a blower (manufactured by Yamato Scientific Co., Ltd., DKM600) set at 60°C.

[0126] <Developing> The polyethylene terephthalate film (support film) was peeled off from the photosensitive layer. Then, development was carried out for a predetermined time using an alkaline developer (Fuji Kiko Co., Ltd., dry film developer) with a spray pressure of 0.15 Pa and a 1% by mass Na2CO3 aqueous solution at 30°C. The development spray time was twice the shortest development time, and the post-development rinse spray time was twice the shortest development time. The shortest time required for the unexposed portions of the photosensitive layer to completely dissolve was considered the "shortest development time."

[0127] [evaluation] <Sensitivity (optimum exposure amount)> The evaluation was carried out using a mask pattern with a line width (L) / space width (S) (hereinafter referred to as "L / S") ratio of 8 / 8 (unit: μm). That is, the mask pattern was used on the substrate that had been subjected to the above surface preparation and lamination, and the exposure dose (unit: mJ / cm) was set to a value that would result in a line width of 8 μm in the pattern formed on the substrate. 2 The sensitivity (optimum exposure amount) was evaluated by the optimum exposure amount. The smaller the optimum exposure amount, the higher the sensitivity.

[0128] <Adhesion> Evaluation was carried out using a mask pattern with an L / S ratio of x / 3x (x = 1 to 20 (varying in 1 μm intervals)) (unit: μm). That is, the substrate that had been subjected to the above-mentioned surface preparation and lamination was exposed to light at an optimum exposure dose using this mask pattern. Thereafter, a resist pattern was formed by carrying out the above-mentioned heating and development treatment. This resist pattern was observed under an optical microscope at a magnification of 100 times to obtain an observed image. In the observed image, the adhesion was evaluated based on the minimum line width formed without meandering or chipping of the line portion (exposed portion). The smaller this value, the better the adhesion. An adhesion of 7 μm or less is considered acceptable. In one embodiment, an adhesion of 5 μm or less is particularly good.

[0129] <Resolution> Evaluation was carried out using a mask pattern with an L / S ratio of x / x (x = 1 to 20 (varied in 1 μm intervals)) (unit: μm). That is, the substrate that had been subjected to the above-mentioned surface preparation and lamination was exposed to light at an optimum exposure dose using this mask pattern. Thereafter, a resist pattern was formed by carrying out the above-mentioned heating and development treatment. This resist pattern was observed under an optical microscope at a magnification of 100 times to obtain an observed image. In the observed image, the resolution was evaluated based on the minimum line width at which the line portions (exposed portions) were free from meandering or chipping and the space portions (unexposed portions) were removed without residue. The smaller this value, the better the adhesion. A resolution of 7 μm or less was considered acceptable. In one embodiment, a resolution of 5 μm or less is considered particularly good.

[0130] <Storage stability> A photosensitive element was laminated onto the surface-prepared substrate, and the substrate was left standing at room temperature, 55% humidity, and under yellow light for 100 hours, after which the optimum exposure amount was evaluated. The difference in the optimum exposure amount before and after leaving the substrate was used as the storage stability. Regarding storage stability, a small change in the optimum exposure amount is preferred, and a value of 10 mJ / cm is preferred. 2 Anything less than or equal to 0 mJ / cm was considered a pass. 2 This indicates that it is particularly favorable.

[0131] <Number of foreign objects> A 2m x 2m photosensitive element (test piece) was prepared. The photosensitive layer was observed through the support film using an optical microscope, and the number of foreign particles with a peripheral diameter of 50µm or more was counted. A test with 10 or fewer foreign particles was deemed to have passed. A test with 3 or fewer foreign particles was deemed to have been particularly good.

[0132] <Absorbance> After peeling off the protective film from the photosensitive element, the absorbance of the photosensitive layer at a wavelength of 365 nm was measured using a spectrophotometer U-3010 (manufactured by Hitachi High-Technologies Corporation) with a 16 μm thick polyethylene terephthalate film (support film, manufactured by Toray Industries, Inc., QS71) as a reference. The measurement was performed with a slit set to 4 nm and a scan speed of 600 nm / min.

[0133] <Contribution of absorbance of component (C-1) (X)> Photosensitive resin compositions B1 to B5 were obtained by mixing the components in the amounts shown in Table 7. Photosensitive resin compositions B1 to B5 were used to obtain photosensitive elements each having a photosensitive layer thickness of 25 μm using the method described above. The absorbance of the photosensitive layer at 365 nm was then measured using the method described above. The results were plotted with the content of component (C-1) on the X axis and the absorbance of the photosensitive layer on the Y axis, resulting in a straight line with a slope of 2.146. Therefore, the ε (change in absorbance per 1% by mass of component (C)) was calculated to be 2.146. The absorbance contribution (X) of the component (C-1) for each photosensitive element was calculated using the following formula (1). X (%) = 100 × εc / absorbance of photosensitive layer (Y) (1) ε: Change in absorbance per 1% by mass of component (C) c: Content (mass%) of component (C) in the photosensitive resin composition It is calculated as follows.

[0134] [Table 1] [Table 2] [Table 3] [Table 4] [Table 5] [Table 6] [Table 7]

[0135] As can be seen from the table, the examples were good in all of <adhesion>, <resolution> and <storage stability>.

[0136] Although the present embodiment has been described above, the present invention is not limited to the above and can be modified as appropriate within the scope of the invention. [Industrial Applicability]

[0137] By using the photosensitive element of the present invention, a resist pattern having excellent adhesion, resolution, and storage stability can be obtained. Such a photosensitive element can be widely used as a photosensitive element for forming resist patterns on printed wiring boards and the like. [Explanation of symbols]

[0138] 1: Photosensitive layer 10: Foreign matter 11: Precipitate 12: Air bubbles

Claims

1. A photosensitive element comprising a support film and a photosensitive layer containing a photosensitive resin composition, The photosensitive resin composition comprises the following components: (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) Biimidazole photopolymerization initiator Including, The component (C) is contained in an amount of 5.0 mass% or more based on the total solid content mass of the photosensitive resin composition, the absorbance (Y) of the photosensitive layer at a wavelength of 365 nm when the layer is 25 μm thick is 0.35 or less; the contribution (X) of the absorbance of the component (C) to the absorbance (Y) is 40% or more; The contribution (X) is expressed by the following formula (1): X (%) = 100 × εc / absorbance of photosensitive layer (Y) (1) ε: absorbance change per 1 mass % of component (C) c: Content (% by mass) of component (C) in all solid components in the photosensitive resin composition The photosensitive element is calculated by the following formula:

2. The photosensitive element according to claim 1 , wherein the component (C) is contained in an amount of 5.5% by mass or more based on the total solid content by mass of the photosensitive resin composition.

3. The photosensitive element according to claim 1 or 2, wherein the component (C) is contained in an amount of 6.0% by mass or more based on the total solid content by mass of the photosensitive resin composition.

4. The photosensitive element of claim 1 or 2, wherein the contribution (X) is 55% or greater.

5. The photosensitive element of claim 1 or 2, wherein the contribution (X) is 65% or greater.

6. The photosensitive element of claim 1 or 2, wherein the contribution (X) is 85% or greater.

7. 3. The photosensitive element of claim 1, wherein the absorbance (Y) is 0.30 or less.

8. 3. The photosensitive element of claim 1 or 2, wherein the absorbance (Y) is 0.25 or less.

9. Furthermore, the photosensitive resin composition (D) Other photopolymerization initiators and / or sensitizers 3. The photosensitive element according to claim 1, wherein the photosensitive compound contains at least one selected from the group consisting of a benzophenone compound, a pyrazoline compound, an anthracene compound, and a coumarin compound.

10. Furthermore, the photosensitive resin composition (D) Other photopolymerization initiators and / or sensitizers The photosensitive element of claim 1 or 2, wherein the photosensitive compound contains at least one selected from the group consisting of a benzophenone compound and a pyrazoline compound.

11. The component (A) contains styrene as a monomer component, 3. The photosensitive element according to claim 1, wherein the proportion of the structural units derived from styrene is 35% by mass or more based on the total mass of all monomer components in the component (A).

12. The component (A) contains styrene as a monomer component, 3. The photosensitive element according to claim 1, wherein the proportion of the structural units derived from styrene is 50% by mass or more based on the total mass of all monomer components in the component (A).

13. The component (A) contains styrene as a monomer component, 3. The photosensitive element according to claim 1, wherein the proportion of the structural units derived from styrene is 60% by mass or more based on the total mass of all monomer components in the component (A).

14. The component (B) is represented by the following general formula (II): 【Chemical 1】 (In the formula, R ２ are each independently a hydrogen atom or a methyl group, and X ２ O and Y ２ Each O is independently an oxyethylene group or an oxypropylene group; m3, m4, n2, and n3 are independently an integer of 0 to 40; m3+m4 is 1 to 40; and n2+n3 is 0 to 20. The compound contains a compound represented by 3. The photosensitive element according to claim 1, wherein the content of the compound represented by formula (II) is 50% by mass or more based on the total amount of component (B).

15. Furthermore, the photosensitive resin composition (E) Polymerization inhibitor The photosensitive element of claim 1 or 2, comprising:

16. 3. The photosensitive element of claim 1, wherein the support film has an absorbance at 365 nm of 0.1 or less.

17. The photosensitive element of claim 1 or 2, further comprising a protective film.

18. A method for forming a resist pattern using the photosensitive element according to claim 1 or 2, comprising the steps of: The following steps: laminating the photosensitive element to a substrate; exposing the photosensitive layer of the laminated photosensitive element to light; and developing the photosensitive layer after exposure; A method for forming a resist pattern, comprising:

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