Heat dissipation module and antenna array device including the same

Abstract

To provide a heat dissipation module that can dissipate heat efficiently from an antenna array device, and an antenna array device including this heat dissipation module.SOLUTION: A heat dissipation module and an antenna array device including this heat dissipation module are provided. The heat dissipation module is applied to the antenna array device. The antenna array device includes a circuit board and an upper cover. The heat dissipation module includes a main body, a plurality of thermally conductive structures disposed on one side of the main body so as to form an array, a plurality of support structures for supporting the circuit board, and a plurality of connection structures provided at an edge of the main body and for connecting the upper cover. The thermal conductive structures and the support structures are disposed on the same side of the main body. The heat dissipation module provided in the present disclosure can efficiently dissipate heat from the antenna array device.SELECTED DRAWING: Figure 12

Description

[Technical Field]

[0001] The present invention relates to the field of antenna technology, and more particularly to a heat dissipation module and an antenna array device having the same. [Background technology]

[0002] An antenna system consisting of multiple identical antennas arranged according to a set rule is also called an antenna array. Among these, phase-controlled array antennas formed from antenna arrays can efficiently communicate with low-earth orbit satellites due to their high flexibility and wide-angle scanning. With the development of low-earth orbit satellite communication technology, antenna arrays have been installed, and wireless communication devices capable of communicating with low-earth orbit satellites have also been developed. However, antenna arrays have poor heat dissipation performance, especially in the confined space of wireless communication devices. If the heat generated during operation of the antenna array cannot be quickly dissipated, it will affect the signal transmission quality. Summary of the Invention [Problem to be solved by the invention]

[0003] In view of the above, the present invention provides a heat dissipation module capable of efficiently dissipating heat from an antenna array device, and an antenna array device having this heat dissipation module. [Means for solving the problem]

[0004] A first aspect of the present application provides a heat dissipation module applicable to an antenna array device, the antenna array device including a circuit board and an upper cover. The heat dissipation module includes a main body, a plurality of heat conduction structures arranged on one side of the main body to form an array, a plurality of support structures for supporting the circuit board, and a plurality of connection structures provided on an edge of the main body for connecting the upper cover, the plurality of heat conduction structures and the plurality of support structures being arranged on the same side of the main body.

[0005] In one embodiment, the heat conducting structure is made from a heat conducting material.

[0006] In one embodiment, each of the heat conducting structures is a strip structure, and a plurality of the heat conducting structures form the array in a row arrangement.

[0007] In one embodiment, the heat dissipation module further includes a heat conductive sheet, and at least one end of the heat conductive structure is provided with a positioning portion for limiting the position of the heat conductive sheet.

[0008] In one embodiment, the thermal conductivity of the thermally conductive sheet is 0.8 W / Mk or more, the hardness of the thermally conductive sheet is 10 Shore or more, and the hardness of the thermally conductive sheet is 70 Shore or less.

[0009] In one embodiment, the antenna array device includes a plurality of radiating units, the plurality of radiating units being installed on one side of the circuit board; the plurality of heat conduction structures are disposed on another side of the circuit board away from the plurality of radiation units, and are provided corresponding to the plurality of radiation units; The ratio of the area of ​​the plurality of heat conduction structures to the area of ​​the plurality of radiating units is 20% or more.

[0010] In one embodiment, the heat dissipation module further includes a plurality of heat dissipation fins; The plurality of heat dissipation fins are arranged on the other side of the main body at intervals from one another and extend radially outward.

[0011] A second aspect of the present application provides an antenna array device including a circuit board, an upper cover, a plurality of radiating units, and the heat dissipation module according to any one of the above aspects.

[0012] In one embodiment, the antenna array device further includes a lower cover connected to the upper cover to form a storage space, and the storage space is used to store a plurality of radiating units, a circuit board, and a heat dissipation module.

[0013] In one embodiment, the antenna array apparatus further includes a sub-circuit board, which is disposed on a side of the heat dissipation module away from the circuit board, the sub-circuit board is electrically connected to the circuit board, and the sub-circuit board is used to supply power to the circuit board. [Effects of the Invention]

[0014] The heat dissipation module provided by the present application has a plurality of heat conduction structures arranged in an array to improve the heat conduction efficiency of the heat conduction structures, thereby effectively dissipating heat from the antenna array device. At the same time, the circuit board is supported by a plurality of support structures, and is connected to the upper cover through a plurality of connection structures, thereby reducing the probability of displacement of the radiating module in the antenna array device and improving the phase control accuracy of the antenna array device. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a schematic diagram of an antenna array device provided by an embodiment of the present application; [Figure 2] FIG. 2 is a partial exploded view of the antenna array device shown in FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 2 is an exploded schematic view of the heat dissipation module in FIG. [Figure 5] FIG. 10 is a diagram schematically illustrating the ratio of the area of ​​a plurality of heat conduction structures to the area of ​​a plurality of radiating units. [Figure 6] 2 is a schematic diagram of the heat dissipation module in FIG. 1 as seen from another angle. [Figure 7] FIG. 2 is a cross-sectional view taken along line VI-VI in FIG. [Figure 8]FIG. 2 is a schematic diagram of an antenna array device provided by another embodiment of the present application. [Figure 9] FIG. 9 is a schematic diagram of a heat dissipation module in the antenna array device shown in FIG. [Figure 10] FIG. 9 is a partial exploded view of the antenna array device shown in FIG. [Figure 11] FIG. 9 is a schematic diagram of the antenna array device shown in FIG. 8 from another perspective. [Figure 12] FIG. 9 is a schematic diagram showing a connection state between the antenna array device and a stand shown in FIG. 8. DETAILED DESCRIPTION OF THE INVENTION

[0016] Specific embodiments of the present invention will be further described below with reference to these drawings.

[0017] The following clearly and completely describes the technical aspects of the embodiments of the present invention in accordance with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, and are not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0018] It should be noted that when one element is said to be "electrically connected" to another element, this may be directly connected to the other element, or there may be an intermediate element. Also, when one element is said to be "electrically connected" to another element, this may be by way of a contact connection (e.g., by way of wire connection) or by way of a non-contact connection (non-contact coupling).

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention pertains. The terminology used in the present specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the present invention.

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, several embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following examples and features of the examples may be combined with each other if not inconsistent.

[0021] An antenna system consisting of multiple identical antennas arranged according to a set rule is also called an antenna array. Among these, phase-controlled array antennas formed from antenna arrays can efficiently communicate with low-earth orbit satellites due to their high flexibility and wide-angle scanning. With the development of low-earth orbit satellite communication technology, antenna arrays have been installed, and wireless communication devices capable of communicating with low-earth orbit satellites have also been developed. However, antenna arrays have poor heat dissipation performance, especially in the confined space of wireless communication devices. If the heat generated during operation of the antenna array cannot be quickly dissipated, it will affect the signal transmission quality.

[0022] Based on this, the present application provides a heat dissipation module that can increase the heat dissipation speed of an antenna array, and an antenna array device having the heat dissipation module.

[0023] As shown in FIG. 1, an antenna array apparatus 10 according to one embodiment of the present application is used to realize communication with one or more of a low-earth orbit satellite, a communication base station, and a wireless communication device.

[0024] Continuing to refer to FIG. 2 , the antenna array device 10 includes an upper cover 110, a radiating module 120, a circuit board 130, a heat dissipation module 140, and a lower cover 150. The radiating module 120 is used to receive or transmit signals to realize communication between the antenna array device 10 and other communication devices, such as low-earth orbit satellites, communication base stations, or wireless communication devices. The radiating module 120 further includes at least one radiating layer and at least one dielectric layer. A plurality of radiating units are disposed on the radiating layer. The plurality of radiating units jointly form an antenna array to efficiently realize communication between the antenna array device 10 and low-earth orbit satellites. The antenna array includes a receiving antenna array and / or a transmitting antenna array. When the antenna array includes a receiving antenna array and a transmitting antenna array, some of the plurality of radiating units may form the receiving antenna array, and other of the plurality of radiating units may form the transmitting antenna array. The circuit board 130 is provided with a radio frequency circuit and a control circuit for realizing communication control for the antenna array device 10. The heat dissipation module 140 is in contact with the circuit board 130 and is used to dissipate heat from the circuit board 130 and / or devices on the circuit board 130, thereby reducing the temperature of the antenna array apparatus 10 and ensuring normal operation of the antenna array apparatus 10. Referring also to Figure 3, the upper cover 110 is connected to the lower cover 150 to form an accommodating space 160. The radiating module 120, the circuit board 130, and the heat dissipation module 140 are stacked and accommodated together in the accommodating space 160.

[0025] As shown in FIG. 4, the heat dissipation module 140 includes a plurality of heat conduction structures 141, a plurality of support structures 142, a plurality of connection structures 143, and a main body 146. The main body 146 includes a first side and a second side that are spaced apart from each other. See also FIGS. 2 and 4. The side of the main body 146 closer to the circuit board 130 is referred to as the first side, and the side of the main body 146 farther from the circuit board 130 is referred to as the second side. The plurality of heat conduction structures 141 and the plurality of support structures 142 are provided on the first side of the main body 146. The plurality of connection structures 143 are provided on the edge of the main body 146.

[0026] Here, a plurality of heat-conducting structures 141 are arranged in an array on one side of the body 146. Each heat-conducting structure 141 is made of a heat-conducting material, including, but not limited to, any two or more combinations of heat-conducting plastics, ceramics, and metals. In some embodiments, the heat-conducting structure 141 may be made of one or more alloys of gold, silver, copper, iron, aluminum, and tin. In other embodiments, the heat-conducting structure 141 may be made of one or any combination of ceramic materials, such as silicon oxide, aluminum oxide, and zinc oxide.

[0027] Referring again to FIG. 2 , in the present embodiment, the radiating module 120 is provided on the side of the circuit board 130 away from the heat dissipation module 140. That is, the multiple radiating units are arranged on the side of the circuit board 130 away from the heat dissipation module 140. The radio frequency circuit on the circuit board 130 includes multiple radio frequency modules (not shown). The multiple radio frequency modules on the circuit board 130 are arranged in one-to-one correspondence with the multiple radiating units in the radiating module 120. The radio frequency modules include, but are not limited to, at least one of a waveform generator, a signal generator, an analog-to-digital converter (ADC), a phase shifter, and a power divider. For example, if the radiating module 120 includes 1024 radiating units, the radio frequency circuit on the circuit board 130 may include 1024 corresponding radio frequency modules. The plurality of radiating units form a first array, and the plurality of radio frequency modules form a second array, and the first array and the second array correspond to each other. In this way, it is necessary to dissipate heat from the radio frequency modules on the circuit board 130 to maintain the normal operation of the radio frequency modules and the corresponding radiating units. In the present invention, the plurality of heat conducting structures 141 are arranged on the other side of the circuit board 130, away from the plurality of radiating units. The plurality of heat conducting structures 141 are arranged to form an array, for example, a third array. The third array and the second array correspond to each other. Furthermore, since the second array corresponds to the first array, the third array corresponds to the first array. That is, the plurality of heat conducting structures 141 are arranged corresponding to the plurality of radiating units. In this way, each heat conducting structure 141 can respectively contact the circuit board 130 and / or the corresponding radio frequency module on the circuit board 130. Each thermal conduction structure 141 is used to conduct heat from the circuit board 130 and / or the corresponding radio frequency module to itself, thereby reducing the temperature of the circuit board 130 and / or the radio frequency module and ensuring the normal operation of the antenna array device 10.In this application, the radio frequency module is disposed on the side of the circuit board 130 that is closer to the heat dissipation module 140. In this way, the heat conduction structure 141 can be in direct contact with the radio frequency module to conduct the heat generated by the radio frequency module to the outside.

[0028] In some embodiments, each thermally conductive structure 141 has a strip structure, and the multiple thermally conductive structures 141 form an array in a row arrangement. In this way, when multiple radio frequency modules are arranged in a row on the circuit board 130, each thermally conductive structure 141 can simultaneously conduct heat to each of the multiple radio frequency modules arranged in the row. The present application does not limit the number of thermally conductive structures 141. For example, in other embodiments, multiple thermally conductive structures 141 may be arranged in one-to-one correspondence with multiple radio frequency modules. In this way, the number of thermally conductive structures 141 can be equal to the number of radio frequency modules. In other embodiments, each thermally conductive structure 141 may have a circular structure, a polygonal structure, or the like. The present application does not limit the shape of the thermally conductive structure 141.

[0029] As shown in FIG. 5, FIG. 5 is a schematic diagram of the areas of the plurality of heat conduction structures 141 and the areas of the plurality of radiating units. Here, S1 is the area of ​​one heat conduction structure among the plurality of heat conduction structures 141, and S2 is the area occupied by the plurality of radiating units. In some embodiments, the ratio of the area of ​​the plurality of heat conduction structures 141 (i.e., all S1) to the area of ​​the plurality of radiating units (i.e., S2) is 20% or more. This can ensure that the plurality of heat conduction structures 141 can efficiently dissipate heat for the antenna array apparatus 10 and that the antenna array apparatus 10 operates normally.

[0030] Referring again to FIG. 4 , in some embodiments, the heat dissipation module 140 further includes a thermally conductive sheet 144. The thermally conductive sheet 144 is disposed between the radio frequency module and the thermally conductive structure 141, or between the circuit board 130 and the thermally conductive structure 141. The thermal conductivity of the thermally conductive sheet 144 is 0.8 (W / Mk) or more. The Shore hardness of the thermally conductive sheet 144 is 10 degrees or more and 70 degrees or less. That is, the thermally conductive sheet 144 has thermal conductivity and a certain degree of elasticity. For example, the thermally conductive sheet 144 may include, but is not limited to, a thermally conductive silica gel sheet, a thermally conductive tape, a thermally conductive paste, a thermally conductive cement, a thermally conductive seal, a thermally conductive glass cloth, a ceramic heat dissipation sheet, a graphite sheet, graphene, a phase change material, and a composite material. If the heat conduction structure 141 is made of a heat conduction material with high hardness and comes into direct contact with the circuit board 130 or the radio frequency module on the circuit board 130, the heat conduction structure 141 may damage the circuit board 130 or the radio frequency module. Therefore, in this embodiment, a heat conduction sheet 144 is provided between the heat conduction structure 141 and the radio frequency module (or the circuit board 130), so that the heat of the circuit board 130 or the radio frequency module on the circuit board 130 is conducted to the heat conduction structure 141 via the heat conduction sheet 144, and the probability of damaging the radio frequency module (or the circuit board 130) can be reduced.

[0031] Accordingly, in some embodiments, a positioning portion 1411 is further provided on at least one end of the heat conduction structure 141. The positioning portion 1411 is for regulating the position of the heat conduction sheet 144. In one embodiment of the present application, a groove is formed on the upper surface of the heat conduction structure 141 that is close to the circuit board 130, forming the aforementioned positioning portion 1411. The heat conduction sheet 144 is provided within the positioning portion 1411. When the heat conduction sheet 144 is provided within the positioning portion 1411, the height of the surface of the heat conduction sheet 144 is greater than the height at which the upper surface of the heat conduction structure 141 is located, and the thickness of the heat conduction sheet 144 is greater than the gap between the positioning portion 1411 and the radio frequency module (or the circuit board 130). That is, both sides of the heat conduction sheet 144 are in close contact with the inner surface of the positioning portion 1411 and the radio frequency module (or the circuit board 130), respectively. In this way, the thermally conductive sheet 144 conducts heat from the radio frequency module (or circuit board 130) to the thermally conductive structure 141, while avoiding direct contact between the thermally conductive structure 141 and the radio frequency module (or circuit board 130), thereby reducing the probability of damage to the radio frequency module (or circuit board 130). In this embodiment, the length of the positioning portion 1411 is approximately the same as the length of the thermally conductive structure 141. In this way, it is only necessary to form one groove on each surface of the thermally conductive structure 141 to form the corresponding positioning portion 1411. In other embodiments, grooves for forming the positioning portions 1411 may be formed on both ends of the thermally conductive structure 141, or three or more grooves for forming the positioning portions 1411 may be formed on the thermally conductive structure 141. That is, the present application does not limit the number and arrangement positions of the positioning portions 1411 on the thermally conductive structure 141. Accordingly, the number of thermally conductive sheets 144 in this application is adjusted according to the number of positioning portions 1411. The present application does not limit the number of heat conductive sheets 144.

[0032] Continuing to refer to FIG. 4 , each support structure 142 in the heat dissipation module 140 is used to support the circuit board 130. To ensure the accuracy of phase control of the antenna array formed by the radiating module 120, the radiating layer and dielectric layer in the radiating module 120 should be prevented from shifting as much as possible. In the present application, the circuit board 130 is supported by the support structure 142, and the radiating module 120 is fixed between the circuit board 130 and the upper cover 110 (see FIG. 2 ). This improves the stability of the radiating module 120 and prevents the radiating layer or dielectric layer in the radiating module 120 from shifting, which could affect the accuracy of phase control and the radiation effect of the antenna array device 10. Specifically, the support structure 142 contacts a position on the circuit board 130 where no radio frequency module or circuit is provided. This reduces the probability that the support structure 142 will damage the circuit or electronic components on the circuit board 130. In some embodiments, the support structure 142 is made of a metal material. This allows the support structure 142 to contact a position on the circuit board 130 where no radio frequency module or circuit is installed, thereby allowing heat from the circuit board 130 to be dissipated while reducing interference from the support structure 142 to the radiation module 120 and the circuit on the circuit board 130.

[0033] 4 , in some embodiments, the support structure 142 includes a first support portion 1421 and a second support portion 1422. The diameter of the first support portion 1421 is larger than the diameter of the second support portion 1422. One end of the first support portion 1421 is connected to the body 146, and the other end of the first support portion 1421 is connected to one end of the second support portion 1422, the other end of which abuts the circuit board 130. Because the support structure 142 is used to support the circuit board 130, the support structure 142 needs to reach a certain length to contact the circuit board 130 and perform its supporting role. Furthermore, to prevent the length of the support structure 142 from being too long and affecting the strength of the support structure 142, the strength of the support structure 142 can be increased by increasing the diameter of the support structure 142. Furthermore, to prevent the contact area between the support structure 142 and the circuit board 130 from being too large and affecting the circuit layout design of the circuit board 130, a structural design with a small top and a large bottom is adopted to form the first support part 1421 and the second support part 1422. In this way, the support strength of the support structure 142 can be increased and the impact of the support structure 142 on the circuit board 130 can be reduced.

[0034] It is understood that the first support portion 1421 and the second support portion 1422 may be integrally formed or may be separately connected and installed, and the present application does not specifically limit the same.

[0035] In other embodiments, the support structure 142 may be a cylinder or other polygonal prism, etc. This application does not limit the specific shape of the support structure 142.

[0036] In some embodiments, the antenna array device 10 further includes a plurality of buffer members 145. The buffer members 145 are disposed between the support structure 142 and the circuit board 130. The buffer members 145 are made of an elastic material and provide a buffering effect when the support structure 142 and the circuit board 130 (see FIG. 2 ) collide with each other, thereby reducing the probability of damage to the circuit board 130 due to the collision between the support structure 142 and the circuit board 130. That is, one end of the second support portion 1422 remote from the first support portion 1421 can abut against the circuit board 130 via the buffer members 145. In some embodiments, the buffer members 145 may be any of sponge, rubber, and foam cotton.

[0037] A plurality of connection structures 143 are used to connect the main body 146 and the upper cover 110. The connection between the connection structures 143 and the upper cover 110 can further fix the radiating module 120 and the circuit board 130 between the upper cover 110 and the heat dissipation module 140 (see FIG. 2 ). In this way, on the one hand, the heat dissipation module 140 can be closely attached to the circuit board 130, which can effectively conduct heat from the circuit board 130 and the radio frequency modules thereon. On the other hand, the radiating module 120 and the circuit board 130 can be confined between the upper cover 110 and the heat dissipation module 140, which can reduce the probability of shifting the radiating layer and the dielectric layer in the radiating module 120 and improve the operation accuracy of the antenna array device 10. In some embodiments, the connection structures 143 may be connection holes formed on the edge of the main body 146. Correspondingly, a corresponding mating connection structure (not shown) is provided on the inner edge of the upper cover 110 (i.e., the side closer to the radiating module 120). For example, in some embodiments, the edge of the main body 146 is provided with a connection hole as the connection structure 143. The inner edge of the top cover 110 is provided with a fitting hole as the mating connection structure. A connecting member passes through the connection structure 143 and the mating connection structure to achieve connection between the main body 146 and the top cover 110. The connection structure 143 can be made of a metal material or a non-metal material, and the present application is not limited thereto.

[0038] Referring again to FIG. 2 , in some embodiments, a plurality of positioning posts 147 are further provided on the first side of the main body 146. The positioning posts 147 are used to achieve pre-positioning between the heat dissipation module 140, the circuit board 130, and the upper cover 110. Specifically, a plurality of first positioning holes 131 are formed in the circuit board 130 corresponding to the positioning posts 147. Mounting posts (not shown) are provided on the inner side of the upper cover 110. The positioning posts 147 have through-holes, and the mounting posts have receiving holes. The through-holes in the positioning posts 147 are aligned with the corresponding first positioning holes 131 and receiving holes in the mounting posts. The positioning members pass through the through-holes and the first positioning holes 131 and are partially received in the receiving holes in the mounting posts, thereby achieving preliminary positioning between the upper cover 110, the circuit board 130, and the heat dissipation module 140. The positioning posts 147 may be made of a metal or non-metal material, but the present application is not limited thereto.

[0039] As shown in FIG. 6 , in some embodiments, the heat dissipation module 140 further includes a plurality of heat dissipation fins 148. The plurality of heat dissipation fins 148 are spaced apart from one another at one end of the second side of the main body 146. The heat dissipation fins 148 are also made of a thermally conductive material and are generally sheet-shaped. The plane on which the heat dissipation fins 148 are located is generally perpendicular to the plane on which the main body 146 is located. Correspondingly, the lower cover 150 further includes a heat dissipation portion 151 corresponding to the plurality of heat dissipation fins 148 (see FIG. 2 ). The plurality of heat dissipation fins 148 are exposed from the lower cover 150 through the heat dissipation portion 151. In this way, the plurality of heat conduction structures 141 and the plurality of support structures 142 conduct heat to the plurality of heat dissipation fins 148 via the main body 146, and then transfer the heat to the air outside the lower cover 150 via the plurality of heat dissipation fins 148, thereby achieving efficient heat dissipation. In some embodiments, the heat dissipation fins 148 extend radially outward. As can be understood, the present application provides the heat dissipation fins 148 to increase the surface area, thereby improving the efficiency of heat transfer to the air and the heat dissipation effect.

[0040] 2 and 6 . The heat dissipation module 140 further includes a plurality of protruding posts 149. The protruding posts 149 are disposed around the plurality of heat dissipation fins 148 on the second side of the main body 146. The protruding posts 149 are used to connect with the lower cover 150. In one embodiment, each protruding post 149 has a locking hole. Correspondingly, the lower cover 150 has a through-hole around the heat dissipation portion 151. A locking member passes through the through-hole and is partially received in the locking hole, thereby realizing the connection between the main body 146 of the heat dissipation module 140 and the lower cover 150.

[0041] See also FIGS. 4 and 6. In some embodiments, the heat-conducting structures 141, the support structures 142, the connecting structures 143, the main body 146, the positioning posts 147, the heat-dissipating fins 148, and the protruding posts 149 are all made of a heat-conducting material and integrally molded by a CNC (Computer Numerical Control Machine Tools) process. In other embodiments, the main body 146 is also made of a heat-conducting material, and the heat-conducting structures 141, the support structures 142, the connecting structures 143, the main body 146, and the heat-dissipating fins 148 can be joined together to form the heat-dissipating module 140. Furthermore, in some embodiments, the surface of the main body 146 can be folded to form stripe-shaped protrusions, which serve as the heat-conducting structures 141. Correspondingly, slots 1461 are formed on the second side of the main body 146 corresponding to the positions of the heat-conducting structures 141. This is advantageous for reducing the weight of the antenna array device 10.

[0042] Referring again to Fig. 2, in some embodiments, the edge of the circuit board 130 is further provided with a plurality of second positioning holes 132. Correspondingly, each dielectric layer and each radiation layer of the radiation module 120 is provided with a third positioning hole 121. The positioning and connection between the circuit board 130 and the radiation module 120 is achieved by passing a plurality of fasteners through the corresponding second positioning holes 132 and third positioning holes 121.

[0043] The lower cover 150 is further provided with a plurality of first mounting holes 152 on a side closer to the heat dissipation module 140. The upper cover 110 is provided with second mounting holes (not shown) corresponding to the plurality of first mounting holes 152. A plurality of mounting members pass through the corresponding first mounting holes 152 and are partially received in the second mounting holes to realize a connection between the upper cover 110 and the lower cover 150.

[0044] In some embodiments, the antenna array device 10 further includes a sub-circuit board 170. The sub-circuit board 170 is provided on the side of the heat dissipation module 140 away from the circuit board 130. That is, the sub-circuit board 170 is provided between the heat dissipation module 140 and the lower cover 150. The sub-circuit board 170 is provided with a processor, a power conversion circuit, a modulation / demodulation module, a GPS (Global Positioning System), a connection port, etc. The sub-circuit board 170 is electrically connected to the circuit board 130 and supplies power to the circuit board 130. In other embodiments, the power conversion circuit may be provided on the circuit board 130. In the present application, providing the sub-circuit board 170 can reduce the area of ​​the circuit board 130.

[0045] The installation process of the antenna array device 10 is roughly as follows.

[0046] First, referring back to FIG. 2 , a plurality of fasteners are used to connect the plurality of second positioning holes 132 with the corresponding plurality of third positioning holes 121, thereby positioning and connecting the circuit board 130 and the radiation module 120. Then, the through-holes in the positioning posts 147 are aligned with the corresponding first positioning holes 131 and receiving holes in the mounting posts, and the positioning members are passed through the through-holes and the first positioning holes 131 and partially received in the receiving holes in the mounting posts, thereby initially achieving the preliminary positioning of the upper cover 110, the circuit board 130, and the heat dissipation module 140. Furthermore, as shown in FIG. 7 , the connecting members are passed through the connecting structure 143 and the mating connecting structure inside the upper cover 110 to achieve a locking connection between the main body 146 and the upper cover 110. Next, the locking members are passed through the through-holes in the lower cover 150 and partially received in the locking holes in the protruding posts 149, thereby achieving a preliminary connection between the main body 146 of the heat dissipation module 140 and the lower cover 150. Finally, the upper cover 110 and the lower cover 150 are connected together by passing a plurality of mounting members through the corresponding first mounting holes 152 and partially receiving them in the second mounting holes.

[0047] As can be understood, the first positioning hole 131, the second positioning hole 132, the third positioning hole 121, the through-hole, the receiving hole, the mounting hole, the locking hole, the first mounting hole 152, and the second mounting hole referred to herein may be screw holes. Correspondingly, the fasteners, the positioning members, the connecting members, the locking members, and the mounting members may be bolts, hot-melt bolts, etc. The present application does not limit the connection and positioning method between the modules in the antenna array device 10. In other embodiments, connection and positioning may be performed using methods such as adhesives and / or engagement.

[0048] 7 , in some embodiments, when the connecting structure 143 (or the positioning post 147) is made of a metal material, the height of the connecting structure 143 (or the positioning post 147) is less than or equal to the height of the circuit board 130, thereby reducing interference from the connecting structure 143 to the radiating module 120. Accordingly, in the present application, the upper cover 110 and the lower cover 150 are also made of an insulating material to reduce interference with the radiating module 120.

[0049] As can be appreciated, the present application does not limit the specific shape of the body 146. In other embodiments, the body 146 can be a circular sheet, a polygonal sheet, or the like.

[0050] In addition, in the present application, waterproof washers may be further provided in correspondence with the heat dissipation part 151 and the connection part between the upper cover 110 and the lower cover 150 in order to fulfill the roles of waterproofing, dustproofing, and vibration reduction.

[0051] As described above, the heat dissipation module 140 provided in the present application has a plurality of heat conduction structures 141 arranged to form an array, thereby increasing the heat conduction efficiency of the heat conduction structures 141 and enabling efficient heat dissipation to the antenna array device 10. At the same time, the plurality of support structures 142 support the circuit board 130 and the plurality of connection structures 143 connect to the upper cover 110, thereby reducing the probability of displacement of the radiating module 120 in the antenna array device 10 and improving the phase control accuracy of the antenna array device 10.

[0052] 8 and 9. Another embodiment of the present application further provides an antenna array device 10a. The antenna array device 10a includes an upper cover 110, a radiating module 120, a circuit board 130, a heat dissipation module 140a, and a lower cover 150a. The structure of the antenna array device 10a is substantially the same as that of the antenna array device 10, except that the heat dissipation module 140a and the lower cover 150a in the antenna array device 10a are different from the heat dissipation module 140 and the lower cover 150 in the antenna array device 10, and the position of the sub-circuit board 170 is different.

[0053] Here, the structure of the heat dissipation module 140a is almost the same as that of the heat dissipation module 140 in the antenna array device 10. The heat dissipation module 140a also includes a plurality of heat conductive structures 141, a plurality of support structures 142, a plurality of connection structures 143, a plurality of heat conductive sheets 144, a plurality of buffer members 145, a main body 146, and a plurality of positioning posts 147 (see FIG. 4). The difference between the heat dissipation module 140a and the heat dissipation module 140 is the structural arrangement of the second side of the main body 146. In the heat dissipation module 140a, the second side of the main body 146, together with the lower cover 150a, functions as the bottom case of the antenna array device 10a (see FIG. 8).

[0054] 10 , in this embodiment, the heat dissipation module 140a includes a plurality of first heat dissipation fins 1481a and a plurality of second heat dissipation fins 1482a. The second side of the main body 146 includes a first region 1462 and a second region 1463. The first region 1462 is located approximately at the center of the second side. A receiving recess 1464 for receiving the sub-circuit board 170 is further formed on one side of the first region 1462 in the main body 146. The second region 1463 surrounds the first region 1462 and the receiving recess 1464.

[0055] The multiple first heat dissipation fins 1481a are arranged in a matrix with gaps between them in the first region 1462. A first channel 1465 is formed between every two adjacent rows. In each row, a second channel 1466 is formed between every two adjacent first heat dissipation fins 1481a. The first channels 1465 extend in a first direction (e.g., the Y direction in FIG. 10), and the second channels 1466 extend in a second direction (e.g., the X direction in FIG. 10). In this embodiment, the second direction and the first direction are approximately perpendicular to each other.

[0056] The second heat dissipation fins 1482a are spaced apart within the second region 1463. Each of the second heat dissipation fins 1482a extends radially outward from the first region 1462. Each second heat dissipation fin 1482a is generally arc-shaped, and the curvature of the edge increases toward the periphery of the main body 146. That is, each of the second heat dissipation fins 1482a is generally fin-shaped and provided on the second side of the main body 1466. The second heat dissipation fins 1482a located on the side farther from the accommodating recess 1464 in the first region 1462 correspond one-to-one to the adjacent first heat dissipation fins 1481a, so that the second channel 1466 continues to extend radially outward within the second region 1463. At least two of the second heat dissipation fins 1482a are provided corresponding to the first channel 1465. This allows the first channel 1465 to continue extending within the second region 1463 .

[0057] In other embodiments, the plurality of second heat dissipation fins 1482a may extend in a wave shape or other shape in the second region 1463, and the present application is not limited thereto.

[0058] In other embodiments, only the plurality of first heat dissipation fins 1481a may be provided spaced apart from one another on the second side of the body 146. The plurality of first heat dissipation fins 1481a may extend outward in a radial, wavy, or other shape.

[0059] In the heat dissipation module 140a, the heat conduction structure 141, the support structures 142, the connecting structures 143, the main body 146, the positioning posts 147, the first heat dissipation fins 1481a, and the second heat dissipation fins 1482a are integrally formed from metal materials using a CNC (Computer Numerical Control Machine Tools) process, thereby improving the heat dissipation effect of the heat dissipation module 140a.

[0060] The lower cover 150a is used to cover the accommodating recess 1464 to protect the sub-circuit board 170 within the accommodating recess 1464. In this embodiment, a plurality of heat conductive structures, a plurality of support structures, and a plurality of heat conductive sheets (not shown in FIG. 10 ) may be provided on the side of the lower cover 150a closer to the sub-circuit board 170 to increase the heat dissipation rate of the sub-circuit board 170. In addition, a plurality of third heat dissipation fins 1501a are further provided on the side of the lower cover 150a farther from the sub-circuit board 170, corresponding to the plurality of second heat dissipation fins 1482a in the second region 1463. In this way, when the lower cover 150a is fitted to the accommodating recess 1464, the plurality of second heat dissipation fins 1482a located on the side of the first region 1462 closer to the accommodating recess 1464 are butted against the plurality of third heat dissipation fins 1501a, and the second channel 1466 continues to extend outward in a generally radial manner within the second region 1463 (see Figure 11).

[0061] As such, the heat dissipation module 140a provided in this embodiment has a plurality of first heat dissipation fins 1481a and a plurality of second heat dissipation fins 1482a, and forms a first channel 1465 and a second channel 1466 on the second side of the main body 146 through the plurality of first heat dissipation fins 1481a and the plurality of second heat dissipation fins 1482a, thereby further increasing the contact area between the heat dissipation module 140a and the air, thereby improving the heat dissipation efficiency of the heat dissipation module 140a.

[0062] 12 , in one embodiment, the antenna array apparatus 10a further includes a stent 180. The stent 180 is used to adjust the height and angle of the antenna array apparatus 10a. Here, the stent 180 includes a base 181, a support 182, an angle adjustment connector 183, and a coupling member 184. The support 182 has one end connected to the base 181 and the other end connected to the angle adjustment connector 183. The angle adjustment connector 183 is connected to the second side of the main body 146 via the coupling member 184.

[0063] Specifically, the coupling member 184 includes a first coupling portion 1841, a second coupling portion 1842, and a third coupling portion 1843. The first coupling portion 1841 is generally sheet-shaped. Both ends of the first coupling portion 1841 extend upward and are then bent inward to form the second coupling portion 1842 and the third coupling portion 1843, respectively. As such, the ends of the first coupling portion 1841 and the second coupling portion 1842 are both at a different height from the plane on which the first coupling portion 1841 is located. In this embodiment, the second coupling portion 1842 and the third coupling portion 1843 are used to connect to the main body 146. The first coupling portion 1841 is used to connect to the angle adjustment connector 183. As a result, a gap is formed between the first coupling portion 1841 and the main body 146, reducing the influence of the coupling member 184 on the heat dissipation effect of the heat dissipation module 140a.

[0064] Furthermore, the base 181 is used to stably support the antenna array apparatus 10. The support 182 is an elastic member, and the height of the antenna array apparatus 10a is adjusted by adjusting the height of the support 182. The angle adjustment connector 183 is used to adjust the angle of the orientation of the antenna array apparatus 10a. In this embodiment, the angle adjustment connector 183 achieves angle adjustment through cooperation between a fixed shaft and a rotating shaft (not shown). Note that the angle adjustment connector 183 is not limited to the specific configuration shown in FIG. 12 . The present application does not limit the specific configuration of the angle adjustment connector 183. In other embodiments, other connecting members, such as a movable hinge, may be used to achieve angle adjustment.

[0065] In this manner, in this embodiment, by providing the stent 180 to the antenna array device 10a, the antenna array device 10a can adjust its height and angle depending on the usage environment, improving flexibility during use.

[0066] It should be understood that the antenna array device 10 may also include a stent 180. This will not be further described here.

[0067] The above embodiments are used only to explain the technical aspects of the present invention and do not limit the present invention. Although the present invention has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that even if the technical aspects of the present invention are modified or replaced with equivalents, they cannot deviate from the spirit and scope of the technical aspects of the present invention. Those skilled in the art can also make other changes within the spirit of the present invention and apply them to the present invention as long as they do not deviate from the technical effects of the present invention. All such changes based on the spirit of the present invention should be included within the scope of protection claimed by the present invention. [Explanation of symbols]

[0068] 10, 10a Antenna array device 110 Upper cover 120 Radiation Module 121 Third positioning hole 130 Circuit Board 131 First positioning hole 132 Second positioning hole 140, 140a heat dissipation module 141 Heat Conduction Structure 1411 Positioning part 144 Thermal Conduction Sheet 142 Support structure 1421 1st support part 1422 Second support part 143 Connection structure 145 Cushioning material 146 Main Unit 1461 Slots 1462 First area 1463 Second area 1464 Containment Recess 1465 Channel 1 1466 Second Channel 147 Positioning Post 148 Heat dissipation fin 1481a First heat dissipation fin 1482a Second heat dissipation fin 149 Protruding pillar 150, 150a Lower cover 1501a Third heat dissipation fin 151 Heat radiation part 152 First mounting hole 160 Storage Space 170 Sub-circuit board 180 Stand 181 base 182 Support 183 Angle adjustment connection part 184 Coupling member 1841 First Coupling Part 1842 Second coupling part 1843 Third Coupling

Claims

1. A heat dissipation module applied to an antenna array device, The antenna array device includes a circuit board and an upper cover, and the heat dissipation module includes: The main body and a plurality of thermally conductive structures disposed on one side of the body to form an array; a plurality of support structures for supporting the circuit board; a plurality of connecting structures provided on the edge of the body for connecting the upper cover; A heat dissipation module, characterized in that the plurality of heat conduction structures and the plurality of support structures are disposed on the same side of the body.

2. The heat dissipation module according to claim 1 , wherein the heat conduction structure is made of a heat conductive material.

3. The heat dissipation module according to claim 1 , wherein each of the heat conduction structures is a strip structure, and a plurality of the heat conduction structures form the array in a row arrangement.

4. The heat dissipation module according to claim 1 , further comprising a heat conduction sheet, and a positioning portion is provided at at least one end of the heat conduction structure to limit the position of the heat conduction sheet.

5. 5. The heat dissipation module according to claim 4, wherein the thermal conductivity of the thermal conductive sheet is 0.8 W / Mk or more, the hardness of the thermal conductive sheet is 10 Shore or more, and the hardness of the thermal conductive sheet is 70 Shore or less.

6. the antenna array device includes a plurality of radiating units, the plurality of radiating units being installed on one side of the circuit board; the plurality of heat conduction structures are disposed on another side of the circuit board away from the plurality of radiation units, and are provided corresponding to the plurality of radiation units; The heat dissipation module according to claim 1 , wherein the ratio of the area of ​​the plurality of heat conduction structures to the area of ​​the plurality of radiation units is 20% or more.

7. the heat dissipation module further includes a plurality of heat dissipation fins; The heat dissipation module according to claim 1 , wherein the plurality of heat dissipation fins are arranged on the other side of the body at intervals and extend radially outward.

8. An antenna array device, An antenna array device comprising a circuit board, an upper cover, a plurality of radiating units, and the heat dissipation module according to any one of claims 1 to 7.

9. 10. The antenna array device of claim 8, further comprising a lower cover connected to an upper cover to form an accommodation space, the accommodation space being used to accommodate a plurality of the radiating units, the circuit board, and the heat dissipation module.

10. The antenna array device according to claim 8 , further comprising a sub-circuit board provided on a side of the heat dissipation module away from the circuit board and electrically connected to the circuit board.

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