Measurement device and measurement method

Abstract

To provide a measurement device for accurately measuring the physical properties of a measurement object.SOLUTION: A wiring board comprises: a board having a first surface and a second surface on the opposite side of the first surface and including a first electrode and a second electrode on the first surface side; and a metal plate arranged via a spacer on the second surface side of the board. The metal plate has a region overlapping with the first electrode and the second electrode in a plan view.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a measurement device and a measurement method. [Background technology]

[0002] There is a method for measuring the physical properties of a measurement object by placing the measurement object on the first and second electrodes in a measurement device having a first electrode and a second electrode and measuring the dielectric constant between the first and second electrodes. For example, if the measurement object includes a glass container and water sealed in the glass container, the concentration of carbonate contained in the water can be measured. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-113339 Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned measuring devices are required to measure the physical properties of the object to be measured with high accuracy without being affected by the surrounding environment.

[0005] An object of the present invention is to provide a measuring device capable of measuring the physical properties of an object to be measured with high accuracy. [Means for solving the problem]

[0006] This wiring board has a first surface and a second surface opposite to the first surface, and includes a substrate on which a first electrode and a second electrode are provided on the first surface side, and a metal plate arranged on the second surface side of the substrate via a spacer, and the metal plate has an area that overlaps with the first electrode and the second electrode in a planar view. [Effects of the Invention]

[0007] According to the disclosed technology, it is possible to provide a measuring device that can measure the physical properties of a measurement object with high accuracy. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram illustrating a measurement device according to a first embodiment. [Figure 2] 3 is a circuit diagram showing an example of a detection circuit connected to the measurement device according to the first embodiment. FIG. [Figure 3] FIG. 4 is a diagram illustrating an initial value of the capacitance of a variable capacitor. [Figure 4] FIG. 4 is a diagram showing an example of a flow of an advance preparation process of the measurement device according to the first embodiment. [Figure 5] FIG. 3 is a diagram showing an example of a measurement flow of the measurement device according to the first embodiment. [Figure 6] FIG. 10 is a cross-sectional view illustrating a measurement device according to a first modified example of the first embodiment. [Figure 7] FIG. 10 is a cross-sectional view illustrating a measurement device according to a second modification of the first embodiment. [Figure 8] FIG. 10 is a diagram illustrating a measurement device according to a second embodiment. [Figure 9] FIG. 10 is a diagram illustrating the addition of a spacer. [Figure 10] FIG. 10 is a plan view illustrating an example of a holding member. [Figure 11] 10A and 10B are diagrams illustrating a cutout portion of a holding member. [Figure 12] FIG. 10 is a diagram illustrating a simulation result. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0010] First Embodiment 1A and 1B are diagrams illustrating a measurement device according to a first embodiment, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A.

[0011] Referring to FIG. 1, the measuring device 1 includes a substrate 10, a spacer 30, and a metal plate 40.

[0012] The substrate 10 has a first surface 11 and a second surface 12 opposite to the first surface 11. In the example of FIG. 1, the first surface 11 is the upper surface and the second surface 12 is the lower surface. The substrate 10 has, for example, a circular planar shape. The substrate 10 is an insulating substrate. For example, the material of the substrate 10 is glass epoxy or the like. The thickness of the substrate 10 is, for example, approximately 600 μm to 1500 μm.

[0013] A first electrode 21 and a second electrode 22 are provided on the first surface 11 side of the substrate 10. The first electrode 21 and the second electrode 22 are electrically insulated from each other. The first electrode 21 and the second electrode 22 have, for example, a substantially arc-shaped band-like planar shape. The first electrode 21 and the second electrode 22 are curved so as to move away from each other. One end of the first electrode 21 faces one end of the second electrode 22, and the other end of the first electrode 21 faces the other end of the second electrode 22. The first electrode 21 and the second electrode 22 are made of, for example, copper. The first electrode 21 and the second electrode 22 have a thickness of, for example, about 12 μm to 30 μm.

[0014] The spacers 30 are provided on the second surface 12 side of the substrate 10. The spacers 30 can be arranged, for example, on the outer periphery of the second surface 12 of the substrate 10. In the example of FIG. 1, four spacers 30 are provided, but the number of spacers 30 can be set as desired. In the example of FIG. 1, the spacers 30 are in contact with the second surface 12 of the substrate 10 and the upper surface 41, which is the surface of the metal plate 40 facing the substrate 10. The spacers 30 are made of a material such as rubber or resin.

[0015] The metal plate 40 is disposed on the second surface 12 side of the substrate 10 via a spacer 30. The metal plate 40 is not in contact with the substrate 10, and a space exists between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40. The distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40 can be set appropriately as needed, but can be, for example, 1 mm or more and 20 mm or less.

[0016] The metal plate 40 may be circular in plan view, for example. When the metal plate 40 is circular in plan view, the diameter may be, for example, 50 mm or more and 150 mm or less. Examples of materials that can be used for the metal plate 40 include aluminum, copper, and stainless steel. The thickness of the metal plate 40 may be, for example, 5 mm or more and 20 mm or less. The metal plate 40 has an area that overlaps with the first electrode 21 and the second electrode 22 in plan view. The metal plate 40 is not electrically connected to the substrate 10. That is, the potential of the metal plate 40 is floating.

[0017] The measurement object 200 is placed on the first surface 11 of the substrate 10 so that a desired physical property can be measured using the first electrode 21 and the second electrode 22. The measurement object 200 includes, for example, a glass container and a substance such as water sealed in the glass container. For example, when the measurement object 200 includes a glass container and water sealed in the glass container, the concentration of carbonates (calcium carbonate, magnesium carbonate, etc.) contained in the water can be measured.

[0018] That is, since the dielectric constant between the first electrode 21 and the second electrode 22 differs depending on the concentration of carbonate, the concentration of carbonate can be measured contactlessly by measuring the dielectric constant between the first electrode 21 and the second electrode 22. Therefore, it is possible to suppress a decrease in accuracy due to corrosion of the first electrode 21 and the second electrode 22, etc.

[0019] The measurement device 1 may also include a temperature sensor. For example, if the concentration of carbonate in water is temperature dependent, the carbonate concentration and the water temperature can be measured simultaneously using the first electrode 21 and the second electrode 22. Therefore, even if the physical property is temperature dependent, it can be measured with high accuracy according to the temperature.

[0020] 2 is a circuit diagram showing an example of a detection circuit connected to the measurement device according to the first embodiment. The first electrode 21 and the second electrode 22 of the measurement device 1 can be connected to a detection circuit 70 shown in FIG. 2. The detection circuit 70 is used to detect the dielectric constant between the first electrode 21 and the second electrode 22.

[0021] The detection circuit 70 includes a variable capacitor 71, a quartz crystal (Xtal) 72, a resistive element 73, a resistive element 74, a capacitor 75, a capacitor 76, and an inverter 77. The detection circuit 70 further includes nodes N1, N2, N3, and N4. The variable capacitor 71 includes a first electrode 21 and a second electrode 22, and the capacitance of the variable capacitor 71 changes depending on the dielectric constant between the first electrode 21 and the second electrode 22.

[0022] A variable capacitor 71 and a crystal oscillator 72 are connected in series between nodes N1 and N2. One end of a capacitor 75 is connected to node N1, and the other end of the capacitor 75 is grounded. One end of a capacitor 76 is connected to node N2, and the other end of the capacitor 76 is grounded. A resistive element 73 is connected between nodes N1 and N3. Nodes N2 and N4 are short-circuited, and a resistive element 74 and an inverter 77 are connected in parallel between nodes N3 and N4. The input of the inverter 77 is connected to node N4, and the output is connected to node N3.

[0023] In the detection circuit 70, the capacitance of the variable capacitor 71 changes depending on the dielectric constant between the first electrode 21 and the second electrode 22, and the frequency of the AC signal output from the node N3 changes depending on the capacitance of the variable capacitor 71. Therefore, the dielectric constant between the first electrode 21 and the second electrode 22 can be determined by analyzing the frequency of the AC signal. As described above, if the measurement object 200 includes a glass container and water sealed in the glass container, the concentration of carbonate in the water can be determined from the dielectric constant between the first electrode 21 and the second electrode 22. The AC signal output from the node N3 is sometimes called a clock signal.

[0024] The detection circuit 70 is connected to, for example, a calculation device 80. The calculation device 80 is, for example, a computer, and has a central processing unit (CPU) 81, a recording medium 82 such as a memory, an input interface (I / F) 83, and an output interface (I / F) 84. The recording medium 82 stores programs that control various processes executed in a measurement system using the measurement device 1. The calculation device 80 receives signals from the outside through the input interface 83 and transmits signals to the outside through the output interface 84. The calculation device 80 receives the output signal (AC signal) of the detection circuit 70, and the CPU 81 executes the program stored in the recording medium 82. In this way, the concentration of carbonate in water contained in the measurement object 200 can be measured.

[0025] The above program is stored in, for example, a computer-readable recording medium and installed from the recording medium into the recording medium 82 of the arithmetic device 80. Examples of computer-readable recording media include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnet optical disks (MOs), and memory cards. The program may be downloaded from a server via the Internet and installed into the recording medium 82 of the arithmetic device 80. In addition to the above program, the recording medium 82 may also store reference data created using previously acquired calibration curve data.

[0026] As described above, in a measurement system using the measurement device 1, the dielectric constant between the first electrode 21 and the second electrode 22 changes depending on the dielectric constant of the measurement object 200, and the frequency of the AC signal changes accordingly. Therefore, by analyzing the frequency of the AC signal, it is possible to measure physical properties that depend on the dielectric constant of the measurement object 200.

[0027] The dielectric constant is easily affected by the surrounding environment. If the dielectric constant between first electrode 21 and second electrode 22 changes due to the surrounding environment, the frequency of the AC signal also changes, which causes noise when measuring the physical properties of object 200 to prevent accurate measurement. Therefore, in measuring device 1, the influence of the surrounding environment is reduced by arranging metal plate 40.

[0028] For example, if the measurement device 1 does not have the metal plate 40, placing the measurement device 1 on a metal desk will change the dielectric constant between the first electrode 21 and the second electrode 22 due to the influence of the desk. Similarly, if a person approaches the measurement device 1, the dielectric constant between the first electrode 21 and the second electrode 22 will change. However, by providing the metal plate 40, the measurement device 1 is less susceptible to the influence of the surrounding environment, and this problem can be avoided. As a result, the measurement device 1 can monitor the physical properties of the measurement object 200 with high accuracy.

[0029] The area of ​​the surface of the metal plate 40 facing the substrate 10 is preferably larger than the area of ​​the surfaces of the first electrode 21 and the second electrode 22 facing the substrate 10. This makes it possible to sufficiently reduce the influence of the surrounding environment. It is more preferable that the area of ​​the surface of the metal plate 40 facing the substrate 10 is larger than the area of ​​the second surface 12 of the substrate 10. This makes it possible to further increase the effect of reducing the influence of the surrounding environment.

[0030] Furthermore, by providing the metal plate 40, the measurement device 1 can vary the initial value of the capacitance of the variable capacitor 71. This will be described with reference to Fig. 3. The initial value of the capacitance of the variable capacitor 71 is the capacitance of the variable capacitor 71 when the measurement object 200 is not placed on the first surface 11 of the substrate 10.

[0031] In FIG. 3, C1 is the capacitance between the first electrode 21 and the second electrode 22. C2 is the capacitance between the first electrode 21 and the metal plate 40. C3 is the capacitance between the second electrode 22 and the metal plate 40. In FIG. 3, C2 and C3 are connected in series, which is then connected in parallel to C1. Therefore, the combined capacitance of C1, C2, and C3 is C1+(C2×C3) / (C2+C3). This is the initial value of the capacitance of the variable capacitor 71.

[0032] Here, C2 and C3 change depending on the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40. For example, by changing the height of the spacer 30, the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40 changes, and therefore the capacitances of C2 and C3 can be changed. As a result, the initial value of the capacitance of the variable capacitor 71 can be changed.

[0033] In the measurement device 1, the measurement sensitivity of the measurement object varies depending on the distance between the metal plate 40 and the substrate 10. The distance between the metal plate 40 and the substrate 10 at which sufficient measurement sensitivity is obtained varies for each measurement object. Therefore, it is preferable to perform a pre-preparation step in which the distance between the metal plate 40 and the substrate 10 at which sufficient measurement sensitivity is obtained for each measurement object is determined and recorded in advance. Then, during actual measurement, it is preferable to adjust the distance between the metal plate 40 and the substrate 10 to the distance recorded in the pre-preparation step before performing the measurement. This makes it possible to measure with sufficient sensitivity even if the type of measurement object changes. Furthermore, if the type of measurement object is the same, it is possible to measure multiple samples with sufficient sensitivity by simply adjusting the distance between the metal plate 40 and the substrate 10 once.

[0034] In order to adjust the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40, for example, the substrate 10 may be screwed to the spacer 30. This allows the substrate 10 to be detachable. Therefore, for example, by removing the substrate 10 and adding an additional spacer between the substrate 10 and the spacer 30 and then screwing the substrate 10, the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40 can be increased.

[0035] 4 is a diagram showing an example of the flow of a preparatory process for the measurement device according to the first embodiment. As described above, the measurement sensitivity of the object to be measured varies depending on the distance between the metal plate 40 and the substrate 10. Therefore, it is preferable to carry out a preparatory process for adjusting the distance between the metal plate 40 and the substrate 10 and determining the distance at which the measurement sensitivity of the object to be measured is equal to or greater than a predetermined value.

[0036] First, in step S301, the measurement device 1 is prepared. Next, in step S302, the measurement object is placed on the first electrode 21 and the second electrode 22 of the measurement device 1. Then, in step S303, it is determined whether the measurement sensitivity of the measurement object is sufficient. Here, measurement sensitivity refers to the frequency difference between the clock signal in the initial state of the measurement object and the clock signal after it has changed over time. For example, if the clock signal in the initial state is 32.0001 MHz and the clock signal after it has changed over time is 32.0002 MHz, there is a difference of 100 Hz, and in this case, the measurement sensitivity is 100. In this embodiment, if the measurement sensitivity is 50 or higher, it is determined that the measurement sensitivity is sufficient.

[0037] If it is determined in step S303 that the measurement sensitivity is sufficient (YES), the process proceeds to step S304, where the current distance between the metal plate 40 and the substrate 10 in step S303 is determined as the distance to be used during measurement. If it is determined in step S303 that the measurement sensitivity is not sufficient (NO), the process proceeds to step S305, where the object to be measured is removed. Then, in step S306, the distance between the metal plate 40 and the substrate 10 is adjusted, and the process returns to step S302. Thereafter, steps S302 to S306 are repeated until it is determined that the measurement sensitivity is sufficient. Then, in step S303, the distance between the metal plate 40 and the substrate 10 when it is determined that the measurement sensitivity is sufficient is determined as the distance to be used during measurement.

[0038] FIG. 5 is a diagram showing an example of a measurement flow of the measurement device according to the first embodiment. First, in step S401, the measurement device 1 is prepared. Next, in step S402, the distance between the metal plate 40 and the substrate 10 in the measurement device 1 is adjusted to a distance corresponding to the object to be measured. Here, the distance corresponding to the object to be measured is the distance determined in step S304 of the advance preparation process shown in FIG. 4. Next, in step S403, the object to be measured is placed on the first electrode 21 and the second electrode 22 of the measurement device 1. Then, in step S404, the physical properties of the object to be measured are measured based on the change in the dielectric constant between the first electrode 21 and the second electrode 22. Because the distance between the metal plate 40 and the substrate 10 is adjusted to ensure sufficient measurement sensitivity, the physical properties of the object to be measured can be measured with high accuracy.

[0039] 6 is a cross-sectional view illustrating a measuring device according to Modification 1 of the first embodiment. In FIG. 1 described above, even when the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40 is shortest, the initial capacitance of the variable capacitor 71 may be insufficient. In this case, as in the measuring device 1A shown in FIG. 6, a capacitor 78 may be provided that is mounted on the second surface 12 of the substrate 10 and electrically connected between the first electrode 21 and the second electrode 22. This allows the initial capacitance of the variable capacitor 71 to be relatively large, and the capacitance can be reduced by increasing the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40.

[0040] The spacer 30 may be configured to be detachable from the substrate 10 and the metal plate 40 by screwing or the like. In this case, by preparing a plurality of types of spacers 30 with different heights and selecting a spacer 30 with an appropriate length from among them, the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40 can be adjusted in either a longer or shorter direction.

[0041] FIG. 7 is a cross-sectional view illustrating a measurement device according to Modification 2 of the first embodiment. As in the measurement device 1B shown in FIG. 7, a high-dielectric-constant plate 90 may be disposed on the upper surface 41 of the metal plate 40, which is the surface facing the substrate 10. Examples of materials for the high-dielectric-constant plate 90 include aluminum oxide and urethane. This structure allows the initial capacitance of the variable capacitor 71 to be larger than when the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40 is the same but the high-dielectric-constant plate 90 is not provided. In this application, a high dielectric constant refers to a relative dielectric constant of 5 or greater.

[0042] Second Embodiment In the second embodiment, an example of a measuring device in which the shape of the spacer is different will be described. Note that in the second embodiment, the description of the same components as those in the embodiments already described may be omitted.

[0043] 8A and 8B are diagrams illustrating a measurement device according to the second embodiment, where FIG. 8A is a plan view and FIG. 8B is a cross-sectional view taken along line BB in FIG. 8A.

[0044] 8, the measuring device 2 has a substrate 10, a metal plate 40, and a holding member 100. The holding member 100 holds the substrate 10 and the metal plate 40. The holding member 100 can be made of, for example, resin.

[0045] The holding member 100 includes a substrate holding portion 101, a metal plate holding portion 102, and a spacer 103. The substrate holding portion 101 is disposed on the outside of the outer peripheral side surface of the substrate 10. The metal plate holding portion 102 is disposed on the outside of the outer peripheral side surface of the metal plate 40. The spacer 103 is disposed between the substrate holding portion 101 and the metal plate holding portion 102, and determines the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40.

[0046] The substrate holding part 101 and the spacer 103 may be integrally formed or may be separate pieces joined together. The metal plate holding part 102 and the spacer 103 may be integrally formed or may be separate pieces joined together. The substrate holding part 101, the metal plate holding part 102, and the spacer 103 may all be integrally formed.

[0047] In this structure, the substrate 10 can be detached, for example, by screwing the substrate 10 to the spacer 103. Therefore, by removing the substrate 10 and adding a spacer 104 between the substrate 10 and the spacer 103 and screwing the substrate 10, for example, as shown in FIG. 9, the distance between the second surface 12 of the substrate 10 and the upper surface 41 of the metal plate 40 can be increased.

[0048] FIG. 10 is a plan view illustrating an example of a holding member. The holding member 100 can be formed in a ring shape in a plan view as shown in FIG. 10(a), or may have a notch 110 as shown in FIG. 10(b). The notch 110 can be provided in the board holding portion 101, the metal plate holding portion 102, and the spacer 103 so as to expose a portion of the outer peripheral side surface of the board 10 and the metal plate 40. For example, as shown in FIG. 11, a connector 120 provided on the board 10 can be positioned so as to overlap the notch 110 in a plan view. In other words, even if the connector 120 is positioned on the outer periphery of the board 10, the holding member 100 can hold the board 10. The connector 120 can be positioned on the first surface 11 and / or the second surface 12 of the board 10.

[0049] <simulation> Simulations were performed for two cases: one in which a stainless steel plate was placed below the metal plate 40 of the measuring device 1, and one in which a stainless steel plate was not placed. Specifically, for these two cases, the values ​​of C1, C2, and C3 shown in Fig. 3, as well as the value of "C1 + (C2 × C3) / (C2 + C3)" (here, Ctotal), which is the initial value of the capacitance of the variable capacitor 71, were calculated using the simulation software "ANSYS Electronics Desktop 2022R2."

[0050] The metal plate 40 was assumed to be a circular plate with a diameter of 100 mm and a thickness of 10 mm. The metal plate 40 was larger than the substrate 10. The stainless steel plate was assumed to be a rectangular plate with dimensions of 300 mm x 300 mm x 30 mm, and when placing the stainless steel plate, the center of the stainless steel plate was aligned with the center of the metal plate 40. The capacitance was calculated for distances between the second surface 12 of the substrate 10 and the metal plate 40 of 2 mm, 4 mm, 6 mm, and 8 mm.

[0051] Fig. 12 shows the simulation results, with Fig. 12(a) showing the results when a stainless steel plate is placed under the metal plate 40 and Fig. 12(b) showing the results when no stainless steel plate is placed. In Fig. 12, in addition to C1, C2, C3, and Ctotal, Cadd = (C2 × C3) / (C2 + C3) is also shown. The capacitances are all in pF.

[0052] Focusing on the Ctotal values ​​in Figures 12(a) and (b), they are consistent. This indicates that the Ctotal value is hardly affected by the stainless steel plate. Furthermore, other studies by the inventors have shown that when the measurement device 1 does not have the metal plate 40, the Ctotal value is significantly affected by the stainless steel plate. Therefore, the results in Figure 12 confirm that the placement of the metal plate 40 can reduce the influence of the surrounding environment. Furthermore, Figure 12 also confirms that the Ctotal value can be varied by adjusting the distance between the second surface 12 of the substrate 10 and the metal plate 40.

[0053] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims. [Explanation of symbols]

[0054] 1,1A,1B,2 Measuring device 10 Substrate 11 Page 1 12 Side 2 21 1st electrode 22 2nd electrode 30,103,104 Spacer 40 metal plate 41 Top side 70 Detection circuit 71 Variable Capacitor 72 Crystal resonator (Xtal) 73,74 Resistive elements 75, 76, 78 Capacitors 77 Inverter 80 Arithmetic unit 81 Central Processing Unit 82 Recording Media 83 Input Interface (I / F) 84 Output Interface (I / F) 90 High dielectric constant plate 100 holding member 101 Board holding part 102 Metal plate holding part 110 Notch 120 Connector 200 Measurement Object

Claims

1. a substrate having a first surface and a second surface opposite to the first surface, with a first electrode and a second electrode provided on the first surface; a metal plate disposed on the second surface side of the substrate via a spacer, The metal plate has an area that overlaps with the first electrode and the second electrode in a plan view.

2. The measuring device according to claim 1 , wherein an area of ​​the surface of the metal plate facing the substrate is larger than areas of the surfaces of the first electrode and the second electrode facing the substrate.

3. The measuring device according to claim 1 , further comprising a capacitor mounted on the second surface side of the substrate and electrically connected between the first electrode and the second electrode.

4. The measuring device according to claim 1 , further comprising a high-dielectric-constant plate disposed on a surface of the metal plate facing the substrate.

5. a holding member for holding the substrate and the metal plate, 3. The measuring device of claim 1, wherein the holding member comprises a substrate holding portion arranged on the outside of the outer peripheral side of the substrate, a metal plate holding portion arranged on the outside of the outer peripheral side of the metal plate, and a spacer arranged between the substrate holding portion and the metal plate holding portion to determine the distance between the substrate and the metal plate.

6. the substrate holding portion, the metal plate holding portion, and the spacer are provided with cutout portions that expose portions of the outer peripheral side surfaces of the substrate and the metal plate; The measuring device according to claim 5 , wherein the connector provided on the substrate is disposed at a position overlapping the notch in a plan view.

7. a step of preparing a measurement object; preparing a measuring device having a first surface and a second surface opposite to the first surface, a substrate having a first electrode and a second electrode provided on the first surface side, and a metal plate disposed on the second surface side of the substrate via a spacer; adjusting the distance between the metal plate and the substrate to a distance corresponding to the object to be measured; a step of placing the object to be measured on the first electrode and the second electrode after the step of adjusting the distance; and measuring a physical property of the object to be measured based on a change in dielectric constant between the first electrode and the second electrode.

8. a preparation step of adjusting the distance between the metal plate and the substrate and determining the distance at which the measurement sensitivity of the object to be measured is equal to or greater than a predetermined value; The measurement method according to claim 7 , wherein the distance corresponding to the object to be measured is a distance determined in the advance preparation step.

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