Light emitting element mounting board and illuminating device

Abstract

To provide a light emitting element mounting board and an illuminating device that can enhance positioning accuracy on a heat dissipation member even if a multi-layer circuit board is used.SOLUTION: A light emitting element mounting board (10) comprises: an element mounting layer (11a) in which a light emitting element (20) is mounted on a mounting region of a mounting surface; and a board upper layer (11b) laminated on the element mounting layer (11a), and comprising an opening part (13) formed at a position corresponding to the mounting region. The element mounting layer (11a) is provided with a reference hole (14a) penetrating from an upper surface to a back surface. The board upper layer (11b) is provided with a fastening hole (14b) having a larger diameter than that of the reference hole (14a).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light-emitting element mounting substrate and a lighting device. [Background technology]

[0002] In recent years, vehicle lamps using light-emitting diodes (LEDs) as light sources have become widespread. Also, as a lighting device used in a vehicle lamp, a lighting device in which a plurality of LEDs are arranged on a circuit board to irradiate light with a desired brightness and light distribution pattern has been proposed (see Patent Document 1, etc.).

[0003] It is generally known that LEDs generate heat as they emit light, which causes their temperature to rise, resulting in changes in the wavelength of light emitted and a decrease in light-emitting efficiency. Therefore, in headlights and other devices that emit a large amount of light, it is important to effectively dissipate the heat generated by the LED to the outside and suppress temperature increases. Another proposal is to form through-hole wiring and heat-dissipation wiring on a circuit board made of insulating material, effectively transferring the heat from the LED to the heat-dissipation wiring on the back side, and dissipating the heat from a heat-dissipating member in contact with the heat-dissipation wiring. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-073762 Summary of the Invention [Problem to be solved by the invention]

[0005] In conventional lighting devices, it has been proposed to use a circuit board with multiple layers stacked together and to mount an LED in an opening provided in the upper layer. In such conventional lighting devices, it is possible to form a wiring layer using multiple layers, and to reduce the thickness of the opening in which the LED is mounted, thereby ensuring heat dissipation from the heat dissipation member placed on the back side of the circuit board.

[0006] It has also been proposed to secure thermal contact between the circuit board and the heat dissipation member by inserting fastening members into fastening holes provided in the circuit board. However, when the circuit board is formed of multiple layers, it is difficult to ensure the accuracy of aligning the fastening holes formed in each layer.

[0007] Therefore, the present invention has been made in consideration of the above-mentioned conventional problems, and aims to provide a substrate for mounting light-emitting elements and a lighting device that can improve the positioning accuracy on a heat dissipation member even when a multi-layer circuit board is used. [Means for solving the problem]

[0008] In order to solve the above problem, the substrate for mounting a light-emitting element of the present invention comprises an element mounting layer for mounting a light-emitting element in a mounting area of ​​a mounting surface, and an upper substrate layer stacked on the element mounting layer and having an opening formed at a position corresponding to the mounting area, wherein the element mounting layer is provided with a reference hole penetrating from the top surface to the back surface, and the upper substrate layer is provided with a fastening hole having a diameter larger than that of the reference hole.

[0009] In such a substrate for mounting an light-emitting element of the present invention, a reference hole penetrating from the top surface to the back surface is provided in the element mounting layer, and the fastening hole provided in the upper layer of the substrate has a diameter larger than that of the reference hole, so that even if the substrate for mounting an light-emitting element is constructed of multiple layers, it is possible to improve the positioning accuracy to the heat dissipation member.

[0010] In one aspect of the present invention, the reference hole is positioned within the diameter of the fastening hole in a plan view.

[0011] In one aspect of the present invention, the diameter of the fastening hole is larger than the diameter of the reference hole by 0.3 mm or more.

[0012] In one aspect of the present invention, the element mounting layer is provided with through-hole wiring that penetrates from the mounting surface to the back surface in the mounting region.

[0013] In one aspect of the present invention, the through-hole wiring is filled with a heat dissipation material.

[0014] In addition, in one aspect of the present invention, the element mounting layer has a substrate lower layer having the mounting surface and the back surface, and a substrate intermediate layer laminated on the mounting surface of the substrate lower layer, and the opening is formed in the substrate intermediate layer at a position corresponding to the mounting area, and the reference hole is provided in the substrate intermediate layer.

[0015] In addition, in order to solve the above problem, the lighting device of the present invention has a substrate for mounting an light-emitting element described in any one of the above and a heat dissipation portion arranged on the back surface side, and is characterized in that the substrate for mounting an light-emitting element and the heat dissipation portion are fastened with a fastening member inserted into the fastening hole.

[0016] In one aspect of the present invention, the fastening member is a screw member that is screwed into a screw hole provided in the heat dissipation portion.

[0017] In one aspect of the present invention, the fastening member is a crimping member that is inserted into a fastening portion provided in the heat dissipation portion.

[0018] In one aspect of the present invention, a positioning pin is provided on the heat dissipation portion, and the positioning pin is inserted into the reference hole to position the heat dissipation portion on the light-emitting element mounting substrate. [Effects of the Invention]

[0019] The present invention can provide a light-emitting element mounting substrate and a lighting device that can improve the positioning accuracy on a heat dissipation member even when a multi-layer circuit board is used. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating an overview of an illumination device 100 according to a first embodiment. [Figure 2]2A to 2C are process diagrams illustrating an example of a method for manufacturing the lighting device 100. [Figure 3] 10A to 10C are process diagrams illustrating another example of a method for manufacturing the lighting device 100. [Figure 4] FIG. 10 is a schematic cross-sectional view illustrating an overview of an illumination device 110 according to a second embodiment. [Figure 5] FIG. 10 is a schematic cross-sectional view illustrating an overview of an illumination device 120 according to a third embodiment. [Figure 6] FIG. 10 is a schematic cross-sectional view illustrating an overview of an illumination device 130 according to a fourth embodiment. [Figure 7] FIG. 10 is a schematic cross-sectional view illustrating an overview of an illumination device 140 according to a fifth embodiment. [Figure 8] FIG. 10 is a schematic cross-sectional view illustrating an overview of an illumination device 150 according to a sixth embodiment. [Figure 9] FIG. 11 is a schematic cross-sectional view illustrating an overview of an illumination device 160 according to a seventh embodiment. [Figure 10] FIG. 13 is a schematic cross-sectional view illustrating an overview of an illumination device 170 according to an eighth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0021] (First embodiment) Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The same or equivalent components, members, and processes shown in each drawing will be given the same reference numerals, and duplicated explanations will be omitted as appropriate. In the following explanation, an illumination device 100 according to the present invention will be described by way of example in which it is applied to a vehicle lamp. FIG. 1 is a schematic cross-sectional view illustrating an overview of the illumination device 100 according to this embodiment.

[0022] As shown in Fig. 1, the lighting device 100 includes a light-emitting element mounting substrate 10, a light-emitting element 20, a heat dissipation member 30, and a fastening member 40. The light-emitting element mounting substrate 10 includes an element mounting layer 11a, a substrate upper layer 11b, a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, an opening 13, a reference hole 14a, and a fastening hole 14b. The heat dissipation member 30 includes a fastening portion 31. The fastening member 40 includes a head portion 41 and an insertion portion 42. Electronic components (not shown) that are combined with the light-emitting element 20 to form an electronic circuit, and connection terminal portions (not shown) that make electrical connection to the outside, are mounted on the light-emitting element mounting substrate 10.

[0023] The electronic components are mounted on the front surface (first surface) or back surface (second surface) of the light-emitting element mounting substrate 10, and are components that constitute an electronic circuit by realizing various functions when supplied with power and control signals. Although the electronic components are not shown in FIG. 1, they can be electrically connected to the first wiring layer 12a by surface mounting using solder or wire bonding using wire. The type and number of electronic components are not limited, and known components such as resistors, capacitors, and integrated circuits can be used.

[0024] The connection terminal portion is a component mounted on the front surface (first surface) or back surface (second surface) of the light-emitting element mounting substrate 10, and is electrically connected to a connector (not shown) of a cable (not shown) that transmits power or signals from the outside. The shape and structure of the connection terminal portion are not limited. The shape and structure of the cable are also not limited, and a conventionally known flexible cable or the like can be used. The connector has a shape corresponding to the connection terminal portion, and can be mechanically and electrically connected to the connection terminal portion.

[0025] 1, in the lighting device 100, a plurality of light-emitting elements 20 are mounted on the first wiring layer 12a in the opening 13 of the light-emitting element mounting substrate 10, and a heat dissipation member 30 is disposed on the back surface side of the light-emitting element mounting substrate 10. Furthermore, fastening members 40 are inserted into the fastening holes 14b and the reference holes 14a of the light-emitting element mounting substrate 10, and the insertion portions 42 are inserted into the fastening portions 31, thereby positioning and fixing the light-emitting element mounting substrate 10 to the heat dissipation member 30.

[0026] The light-emitting element mounting substrate 10 is a plate-like member having a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, hole-filling resin, openings 13, reference holes 14a, and fastening holes 14b formed on a substantially plate-like base material. A heat dissipation member 30 is disposed on the back surface side of the light-emitting element mounting substrate 10, and a heat conduction member (not shown) is preferably disposed between the two. The material constituting the base material of the light-emitting element mounting substrate 10 is not particularly limited, but a resin material with excellent electrical insulation properties is preferably used, and a glass epoxy resin or the like used in ordinary printed wiring boards can be used, such as FR4 (Flame Retardant Type 4).

[0027] The heat conductive member is a member with high thermal conductivity that is disposed between the light-emitting element mounting substrate 10 and the heat dissipation member 30. In order to improve the voltage resistance of the lighting device 100, it is preferable that the heat conductive member be insulating. The material that constitutes the heat conductive member is not limited, but one example is heat dissipation grease mixed with a filler of metal particles or metal oxide particles. Alternatively, a heat conductive sheet molded into a sheet shape may be used as the heat conductive member.

[0028] 1 shows a two-layer structure of the element mounting layer 11a and the substrate upper layer 11b as the light-emitting element mounting substrate 10, but a multilayer substrate having more layers stacked thereon may also be used. Also, while Fig. 1 shows an example in which the first wiring layer 12a and the through-hole wiring 12c are formed only on the element mounting layer 11a, the light-emitting element mounting substrate 10 may also be configured as a multilayer wiring substrate by forming the through-hole wiring 12c and a wiring layer on the substrate upper layer 11b.

[0029] The element mounting layer 11a has a mounting surface on which a light emitting element 20 is mounted in a mounting region, and is provided with a reference hole 14a penetrating from the top surface to the back surface. In the example shown in Fig. 1, a heat dissipation member 30 is disposed on the back surface side of the element mounting layer 11a. Furthermore, although the example shown in Fig. 1 shows an example in which the element mounting layer 11a is configured as a single layer, the element mounting layer 11a may have a multi-layer structure with each layer having a different structure.

[0030] The substrate upper layer 11b is stacked on the element mounting layer 11a, and has an opening 13 formed in a position corresponding to the mounting area. Furthermore, the substrate upper layer 11b has a fastening hole 14b, which has a larger diameter than the reference hole 14a, at a position corresponding to the reference hole 14a. While FIG. 1 shows an example in which the upper surface of the substrate upper layer 11b is lower than the upper surface of the light-emitting element 20, the substrate upper layer 11b may be formed with a thickness such that the upper surface of the substrate upper layer 11b is higher than the upper surface of the light-emitting element 20.

[0031] The first wiring layer (element wiring) 12a is a wiring pattern formed on the surface (first surface) of the element mounting layer 11a. Part of the first wiring layer 12a functions as a land portion on which the light emitting element 20 or electronic components are mounted, and as a terminal portion to which wires are electrically connected. The light emitting element 20 and electronic components are electrically connected to the first wiring layer 12a, and an electronic circuit is configured on the light emitting element mounting substrate 10. In the first wiring layer 12a, a through-hole wiring 12c is formed in the region of the land portion on which the light emitting element 20 is mounted.

[0032] The second wiring layer (heat dissipation wiring) 12b is a wiring pattern formed on the back surface (second surface) of the light-emitting element mounting substrate 10. As shown in FIG. 1, the second wiring layer 12b may have a region electrically connected to the first wiring layer 12a by the through-hole wiring 12c and a region electrically isolated from the through-hole wiring 12c, which are provided in different regions. The region of the second wiring layer 12b connected to the through-hole wiring 12c functions as a heat dissipation path, as will be described later. Furthermore, the region of the second wiring layer 12b electrically isolated from the through-hole wiring 12c may be connected to a ground potential.

[0033] The through-hole wiring 12c is an electrically conductive wiring formed on the inner wall of a through-hole (penetrating hole) that penetrates from the front side to the back side of the element mounting layer 11a. A conventionally known plating method or the like can be used to form the through-hole wiring 12c. Here, the through-hole wiring 12c includes a via and a through-hole via. The through-hole wiring 12c is electrically connected to a portion of the first wiring layer 12a and a portion of the second wiring layer 12b. The region where the through-hole wiring 12c is provided is not limited, but by providing the through-hole wiring 12c at a position of the first wiring layer 12a corresponding to the land portion on which the light-emitting element 20 is mounted, heat generated by light emission can be efficiently transmitted to the back side.

[0034] Furthermore, the through-hole wiring 12c is preferably filled with a hole-filling resin, which is a heat dissipation material. The material constituting the hole-filling resin is not limited, and a thermosetting epoxy resin can be used as an example. Furthermore, in order to improve the thermal conductivity of the hole-filling resin, a filler with high thermal conductivity or a metallic conductive filler may be mixed into the resin material. The thermal conductivity of the hole-filling resin, which is a heat dissipation material, is preferably 0.3 W / °C or higher.

[0035] The opening 13 is an opening formed in the substrate upper layer 11b at a position corresponding to the mounting region. The first wiring layer 12a of the element mounting layer 11a is exposed in the opening 13, and a light emitting element 20 is mounted thereon. While FIG. 1 shows an example in which the opening 13 has a wall surface perpendicular to the element mounting layer 11a, the shape of the wall surface is not limited thereto, and the wall surface may be inclined or curved relative to the element mounting layer 11a. A reflective layer that reflects light from the light emitting element 20 may also be provided in the opening 13.

[0036] The reference hole 14a is a hole that penetrates from the top surface to the back surface of the element mounting layer 11a. The reference hole 14a is provided at a position corresponding to the fastening portion 31 within the diameter of the fastening hole 14b in a plan view. The diameter of the reference hole 14a is large enough to allow the insertion portion 42 of the fastening member 40 to be inserted therein, and is preferably approximately the same as the outer diameter of the insertion portion 42. By making the diameter of the reference hole 14a the same as the outer diameter of the insertion portion 42, positioning can be performed simultaneously when the light-emitting element mounting substrate 10 and the heat dissipation member 30 are fastened together with the fastening member 40.

[0037] The fastening holes 14b are holes that penetrate from the top surface to the back surface of the substrate upper layer 11b. The diameter of the fastening holes 14b is set larger than the diameter of the reference holes 14a, and the reference holes 14a are positioned inside the fastening holes 14b. Furthermore, the diameter of the fastening holes 14b is preferably larger than the diameter of the reference holes 14a by 0.3 mm or more. By making the diameter of the fastening holes 14b larger than the diameter of the reference holes 14a, it is possible to easily align the reference holes 14a and the fastening holes 14b in the process of bonding the element mounting layer 11a and the substrate upper layer 11b together and in the process of forming the fastening holes 14b.

[0038] The light-emitting element 20 is a component mounted on the element mounting layer 11a within the opening 13 of the light-emitting element mounting substrate 10 and emits light of a predetermined wavelength when a voltage is applied. The region of the element mounting layer 11a exposed within the opening 13 is the mounting region where the light-emitting element 20 is mounted. While FIG. 1 illustrates a surface-mounted case in which the light-emitting element 20 is electrically connected to the first wiring layer 12a using solder, it may also be electrically connected to the first wiring layer 12a by wire bonding. For example, when the lighting device 100 is used as a headlamp for a vehicle lamp, a white LED may be used as the light-emitting element 20. When used as a tail lamp or stop lamp, a red LED may be used. When used as a turn signal lamp, an amber LED may be used. The structure of the light-emitting element 20 is not limited, and it may be a packaged LED chip or a bare LED chip directly mounted. Examples of white LEDs include a combination of a GaN-based LED emitting primary light in the blue to ultraviolet wavelength range and a phosphor, or a combination of RGB LED chips.

[0039] The heat dissipation member 30 is made of a material having a higher thermal conductivity than the base material of the light-emitting element mounting substrate 10, and is disposed on the back side of the light-emitting element mounting substrate 10 to dissipate heat from the light-emitting element mounting substrate 10. The material constituting the heat dissipation member 30 is not limited, but metals such as anodized aluminum or copper can be used. In FIG. 1, a plate-shaped member is shown as the heat dissipation member 30, but the shape and structure are not limited, and a shape with a plurality of upright heat dissipation fins can be used.

[0040] The fastening portion 31 is a portion that is provided on the heat dissipation member 30 and fastened with the fastening member 40. In Fig. 1, an example is shown in which the fastening portion 31 is a screw hole that screws into the insertion portion 42, but the structure is not limited as long as it is possible to fasten the fastening member 40 to the heat dissipation member 30. Another example is to use a through-hole that penetrates from the upper surface side (the light-emitting element mounting substrate 10 side) of the heat dissipation member 30 to the back surface side as the fastening portion 31, and to use a crimping member as the fastening member 40.

[0041] The fastening member 40 is a member that is inserted into the reference holes 14a and the fastening holes 14b provided in the light-emitting element mounting substrate 10 and fastened to the fastening portions 31 of the heat dissipation member 30, thereby fastening the light-emitting element mounting substrate 10 to the heat dissipation member 30. The specific configuration of the fastening member 40 is not limited, and it may be a threaded member such as a screw or bolt that is threaded into a screw hole formed in the heat dissipation member 30, or a caulking member formed to protrude from the heat dissipation member 30 or the light-emitting element mounting substrate 10. By fastening with the fastening member 40, the light-emitting element mounting substrate 10 is fixed in a state where it is pressed toward the heat dissipation member 30 at the position of the fastening holes 14b.

[0042] The head 41 is a portion formed on the upper portion of the fastening member 40 and abuts against the light-emitting element mounting substrate 10 to restrict upward movement of the light-emitting element mounting substrate 10. In Fig. 1, the diameter of the head 41 is larger than the diameter of the fastening hole 14b, and an example is shown in which the head 41 abuts against the substrate upper layer 11b. Also, in Fig. 1, the head 41 is shown as having a plate shape with flat upper and lower surfaces, but the shape and structure are not limited thereto.

[0043] The insertion portion 42 is a portion formed by extending from the back surface of the head portion 41 toward the heat dissipation member 30. The insertion portion 42 is inserted into the fastening hole 14b, the reference hole 14a, and the fastening portion 31 to position and fix the light-emitting element mounting substrate 10 to the heat dissipation member 30. In FIG. 1, a screw groove (not shown) is formed on the outer periphery of the tip of the insertion portion 42, and this screw groove (not shown) is screwed into a screw groove (not shown) provided on the inner periphery of the fastening portion 31, thereby fastening the fastening member 40 to the heat dissipation member 30.

[0044] 1, power and control signals are transmitted from the outside to an electronic circuit formed by the first wiring layer 12a, the light emitting elements 20, and electronic components via cables, connectors, and connection terminals, causing the light emitting elements 20 to emit light. Heat generated by the light emission of the light emitting elements 20 is transmitted to the heat dissipation member 30 via the first wiring layer 12a, the through-hole wiring 12c, the second wiring layer 12b, and the heat conduction member. The heat dissipation member 30 dissipates the heat to the outside of the lighting device 100, thereby cooling the lighting device 100.

[0045] 2A and 2B are process diagrams illustrating an example of a manufacturing method for the lighting device 100. First, in a preparation step, as shown in Fig. 2A, a device mounting layer 11a is prepared in which a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, and a reference hole 14a are formed. The first wiring layer 12a, the second wiring layer 12b, the through-hole wiring 12c, and the reference hole 14a can be formed using a conventionally known method for manufacturing a multilayer substrate.

[0046] Next, in the bonding step shown in FIG. 2(b), a separately prepared substrate upper layer 11b is bonded to the element mounting layer 11a. Prior to bonding, fastening holes 14b and openings 13 are formed in the substrate upper layer 11b. The element mounting layer 11a and the substrate upper layer 11b can be bonded to each other by a conventionally known method, and one example is bonding using an adhesive. In bonding, alignment is performed so that the mounting area for mounting the light emitting element 20 is located within the opening 13, and the reference hole 14a is located within the fastening hole 14b. By bonding the element mounting layer 11a and the substrate upper layer 11b together in the bonding step, the light emitting element mounting substrate 10 is formed.

[0047] 2(c), the light emitting element 20 is mounted in the mounting area within the opening 13, and the first wiring layer 12a and the light emitting element 20 are electrically connected. At the same time, other electronic components may be mounted on the first wiring layer 12a. The method for electrically connecting the light emitting element 20 to the first wiring layer 12a is not limited, and solder reflow can be used as an example.

[0048] 2(d), the heat dissipation member 30 is placed on the back surface side of the light-emitting element mounting substrate 10, and is positioned so that the reference holes 14a and the fastening portions 31 overlap. During the positioning step, a heat conductive member such as thermally conductive grease may be placed between the back surface of the light-emitting element mounting substrate 10 and the heat dissipation member 30.

[0049] 2(e), the insertion portion 42 of the fastening member 40 is inserted into the fastening hole 14b, the reference hole 14a, and the fastening portion 31 and fastened, thereby positioning and fixing the light-emitting element mounting substrate 10 to the heat dissipation member 30, thereby obtaining the lighting device 100. In the fastening step, the thread groove of the insertion portion 42 is screwed into the thread groove of the fastening portion 31, causing the head 41 of the fastening member 40 to abut against the surface of the substrate upper layer 11b, and the light-emitting element mounting substrate 10 is urged toward the heat dissipation member 30. Furthermore, the insertion portion 42 is inserted into the reference hole 14a, thereby restricting in-plane movement of the light-emitting element mounting substrate 10.

[0050] 2(a) to 2(e), the diameter of the fastening holes 14b is larger than that of the reference holes 14a, and the reference holes 14a are positioned inside the fastening holes 14b. This makes it easy to align the reference holes 14a and the fastening holes 14b in the bonding process.

[0051] FIG. 3 is a process diagram illustrating another example of a manufacturing method for the lighting device 100. Although not shown in the drawings, in the preparation step, a first wiring layer 12a, a second wiring layer 12b, and an element mounting layer 11a having through-hole wiring 12c and reference holes 14a formed therein are prepared. Next, in the bonding step shown in FIG. 3(a), a separately prepared substrate upper layer 11b is bonded to the element mounting layer 11a. In this modification, the fastening holes 14b and openings 13 are not formed in the substrate upper layer 11b before bonding. FIG. 3(b) shows the state of this modification after the bonding step.

[0052] 3(c), fastening holes 14b are formed in the substrate upper layer 11b at positions corresponding to the reference holes 14a, and openings 13 are formed in positions corresponding to the mounting areas. There are no limitations on the method for forming the fastening holes 14b and openings 13, and known laser processing techniques or mechanical processing techniques using drills or the like can be used. By forming the fastening holes 14b and openings 13 in the substrate upper layer 11b in the processing step, the light-emitting element mounting substrate 10 is constructed.

[0053] Next, in the element mounting step shown in Fig. 3(d), the light-emitting element 20 is mounted in the mounting region within the opening 13, and the first wiring layer 12a and the light-emitting element 20 are electrically connected. Next, in the positioning step shown in Fig. 3(e), the heat dissipation member 30 is placed on the back side of the light-emitting element mounting substrate 10, and positioned so that the reference hole 14a and the fastening portion 31 overlap. Next, in the fastening step shown in Fig. 3(f), the insertion portion 42 of the fastening member 40 is inserted into the fastening hole 14b, the reference hole 14a, and the fastening portion 31 and fastened, thereby positioning and fixing the light-emitting element mounting substrate 10 to the heat dissipation member 30, and obtaining the lighting device 100.

[0054] 3(a) to 3(f), the diameter of the fastening hole 14b is larger than that of the reference hole 14a, and the reference hole 14a is positioned inside the fastening hole 14b. This facilitates alignment and processing when forming the fastening hole 14b and the opening 13 in the processing step.

[0055] As described above, in the substrate 10 for mounting light-emitting elements and the lighting device 100 of this embodiment, the element mounting layer 11a is provided with a reference hole 14a that penetrates from the top surface to the back surface, and the fastening hole 14b provided in the substrate upper layer 11b has a diameter larger than the reference hole 14a, so even if the substrate 10 for mounting light-emitting elements is constructed of multiple layers, it is possible to improve the positioning accuracy to the heat dissipation member 30.

[0056] (Second embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. 4. Description of content that overlaps with the first embodiment will be omitted. FIG. 4 is a schematic cross-sectional view illustrating an overview of a lighting device 110 according to this embodiment. This embodiment differs from the first embodiment in that the diameter of the fastening hole 14b is larger than the diameter of the head 41 of the fastening member 40.

[0057] 4, the lighting device 110 also includes a light-emitting element mounting substrate 10, a light-emitting element 20, a heat dissipation member 30, and a fastening member 40. The light-emitting element mounting substrate 10 includes an element mounting layer 11a, a substrate upper layer 11b, a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, an opening 13, a reference hole 14a, and a fastening hole 14b. The heat dissipation member 30 includes a fastening portion 31. The fastening member 40 includes a head portion 41 and an insertion portion 42.

[0058] 4, in this embodiment, the diameter of the head 41 is smaller than the diameter of the fastening hole 14b, and the head 41 abuts against the element mounting layer 11a. The diameter of the fastening hole 14b is set larger than the diameter of the reference hole 14a, and the reference hole 14a is positioned inside the fastening hole 14b. The light-emitting element mounting substrate 10 and the lighting device 110 of this embodiment can be manufactured using the manufacturing method described with reference to FIG. 2 or FIG. 3 by making the diameter of the fastening hole 14b larger than the head 41.

[0059] In this embodiment, the screw groove of the insertion portion 42 is screwed into the screw groove of the fastening portion 31, whereby the head 41 of the fastening member 40 comes into contact with the surface of the element mounting layer 11a, and the light-emitting element mounting substrate 10 is urged toward the heat dissipation member 30. Furthermore, the insertion portion 42 is inserted into the reference hole 14a, whereby movement of the light-emitting element mounting substrate 10 in the in-plane direction is restricted.

[0060] In the substrate 10 for mounting light-emitting elements and the lighting device 110 of this embodiment, the element mounting layer 11a is provided with a reference hole 14a that penetrates from the top surface to the back surface, and the fastening hole 14b provided in the substrate upper layer 11b has a diameter larger than the reference hole 14a, so even if the substrate 10 for mounting light-emitting elements is constructed of multiple layers, it is possible to improve the positioning accuracy to the heat dissipation member 30.

[0061] (Third embodiment) Next, a third embodiment of the present invention will be described with reference to Fig. 5. Descriptions of content that overlap with the first embodiment will be omitted. Fig. 5 is a schematic cross-sectional view illustrating an overview of a lighting device 120 according to this embodiment. This embodiment differs from the first embodiment in that the element mounting layer 11a has a two-layer structure consisting of a substrate lower layer 11c and a substrate intermediate layer 11d.

[0062] 5, the lighting device 120 includes a light-emitting element mounting substrate 10, a light-emitting element 20, a heat dissipation member 30, and a fastening member 40. The light-emitting element mounting substrate 10 includes an element mounting layer 11a, which is formed by stacking a substrate lower layer 11c and a substrate intermediate layer 11d, a substrate upper layer 11b, a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, an opening 13, a reference hole 14a, and fastening holes 14b and 14c. The heat dissipation member 30 includes a fastening portion 31. The fastening member 40 includes a head portion 41 and an insertion portion 42.

[0063] As shown in FIG. 5, the device mounting layer 11a of this embodiment has a laminated structure of a substrate lower layer 11c and a substrate intermediate layer 11d. The substrate lower layer 11c has a mounting surface and a back surface, and is formed with a fastening hole 14c, a first wiring layer 12a, a second wiring layer 12b, and through-hole wiring 12c. The fastening hole 14c penetrates from the top surface of the substrate lower layer 11c to the back surface and is provided at a position corresponding to the fastening portion 31 of the heat dissipation member 30. The diameter of the fastening hole 14c is set larger than the diameter of the reference hole 14a, and the reference hole 14a is located inside the fastening hole 14c. The diameter of the fastening hole 14c is preferably 0.3 mm or more larger than the diameter of the reference hole 14a. The substrate intermediate layer 11d is laminated on the mounting surface of the substrate lower layer 11c, and is formed with the reference hole 14a and an opening 13. Furthermore, fastening holes 14b and openings 13 are formed in the substrate upper layer 11b.

[0064] 5 shows an example in which the openings 13 formed in the substrate intermediate layer 11d and the substrate upper layer 11b are the same size, but they may be different in size as long as the light emitting element 20 can be mounted in the mounting area of ​​the substrate lower layer 11c. Also, although an example is shown in which the fastening holes 14c formed in the substrate lower layer 11c and the fastening holes 14b formed in the substrate upper layer 11b have the same diameter, they may be different in diameter as long as the reference holes 14a can be positioned inside each other.

[0065] The light-emitting element mounting substrate 10 and the lighting device 120 of this embodiment can be manufactured using a method similar to the manufacturing method described with reference to FIG. 2. In this case, the reference hole 14a, the fastening holes 14b and 14c, and the opening 13 are formed in advance in each layer, and the substrate lower layer 11c and the substrate upper layer 11b are bonded to the substrate intermediate layer 11d. In this method, the diameters of the fastening holes 14b and 14c are also larger than that of the reference hole 14a, and the reference hole 14a is positioned inside the fastening holes 14b and 14c. This makes it easy to align the reference hole 14a with the fastening holes 14b and 14c in the bonding process.

[0066] The light-emitting element mounting substrate 10 and the lighting device 120 of this embodiment can also be manufactured using a method similar to the manufacturing method described with reference to FIG. 3. In this case, the reference hole 14a is formed in the substrate intermediate layer 11d, and the substrate upper layer 11b and the substrate lower layer 11c are bonded to the substrate intermediate layer 11d, and then the fastening holes 14b, 14c and the opening 13 are formed. In this method, the diameters of the fastening holes 14b, 14c are larger than that of the reference hole 14a, and the reference hole 14a is positioned inside the fastening holes 14b, 14c. This facilitates alignment and processing when forming the fastening holes 14b, 14c and the opening 13 in the processing step.

[0067] In the substrate 10 for mounting light-emitting elements and the lighting device 120 of this embodiment, a reference hole 14a that penetrates from the top surface to the back surface is provided in the substrate intermediate layer 11d, and the fastening holes 14b, 14c provided in the substrate upper layer 11b and the substrate lower layer 11c have diameters larger than the reference hole 14a, so even if the substrate 10 for mounting light-emitting elements is constructed of multiple layers, it is possible to improve the positioning accuracy to the heat dissipation member 30.

[0068] (Fourth embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG. 6. Description of content that overlaps with the first embodiment will be omitted. FIG. 6 is a schematic cross-sectional view illustrating an overview of an illumination device 130 according to this embodiment. This embodiment differs from the first embodiment in that a lens member 50 is provided in the illumination device 130, and a fastening member 40 is inserted into a through-hole 53 formed in the lens member 50.

[0069] As shown in Fig. 6, the lighting device 130 includes a light-emitting element mounting substrate 10, a light-emitting element 20, a heat dissipation member 30, a fastening member 40, and a lens member 50. The light-emitting element mounting substrate 10 includes an element mounting layer 11a, a substrate upper layer 11b, a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, an opening 13, a reference hole 14a, and a fastening hole 14b. The heat dissipation member 30 includes a fastening portion 31. The fastening member 40 includes a head portion 41 and an insertion portion 42. The lens member 50 includes a lens portion 51, a substrate contact portion 52, and a through-hole 53.

[0070] The lens member 50 is an optical member disposed on the light emission surface side of the light-emitting element 20, and adjusts the light distribution pattern of light emitted from the light-emitting element 20 and emits the light. The lens portion 51 is a portion through which light from the light-emitting element 20 passes and refracts the light. The substrate abutting portion 52 is provided on the outer periphery of the lens portion 51 at a position corresponding to the fastening hole 14b, and is a portion that abuts against the light-emitting element mounting substrate 10. The through hole 53 is a hole that penetrates from the upper surface to the back surface of the substrate abutting portion 52 at a position corresponding to the reference hole 14a. It is preferable that the diameter of the through hole 53 is approximately the same as the diameter of the insertion portion 42.

[0071] The material constituting the lens member 50 is not limited, and conventionally known resin materials or glass materials can be used. Furthermore, the shape and size of the lens portion 51 are not limited, and conventionally known convex lenses, concave lenses, Fresnel lenses, TIR (Total Internal Reflection) lenses, etc. can be used. Furthermore, while Fig. 6 shows an example in which the lens portion 51 and the substrate abutting portion 52 are integrally formed, the substrate abutting portion 52 may be formed separately from the lens portion 51, and the lens portion 51 may be positioned and held by the substrate abutting portion 52.

[0072] 6, fastening hole 14b in this embodiment is formed to have a diameter larger than substrate contact portion 52 of lens member 50, and reference hole 14a is located inside. Furthermore, substrate contact portion 52 is inserted into fastening hole 14b, and insertion portion 42 of fastening member 40 is inserted into through-hole 53, reference hole 14a, and fastening portion 31.

[0073] In this embodiment, the thread groove of the insertion portion 42 is screwed into the thread groove of the fastening portion 31, causing the head 41 of the fastening member 40 to abut against the upper surface of the substrate abutting portion 52, and the lens member 50 and the light-emitting element mounting substrate 10 are urged toward the heat dissipation member 30. Furthermore, the insertion portion 42 is inserted into the through-hole 53 and the reference hole 14a, thereby restricting the movement of the lens member 50 and the light-emitting element mounting substrate 10 in the in-plane direction.

[0074] In the light-emitting element mounting substrate 10 and the lighting device 130 of this embodiment, the element mounting layer 11a is also provided with the reference hole 14a penetrating from the top surface to the back surface, and the fastening hole 14b provided in the substrate upper layer 11b has a diameter larger than the reference hole 14a, so that even if the light-emitting element mounting substrate 10 is configured with multiple layers, it is possible to improve the positioning accuracy with respect to the heat dissipation member 30. Furthermore, since the lens member 50 is provided with the through hole 53, the lens member 50 and the light-emitting element mounting substrate 10 can be positioned and fixed to the heat dissipation member 30 all at once.

[0075] (Fifth embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIG. 7. Description of content that overlaps with the first embodiment will be omitted. FIG. 7 is a schematic cross-sectional view illustrating an overview of an illumination device 140 according to this embodiment. This embodiment differs from the fourth embodiment in that a lens member 50 is provided in the illumination device 140, and an insertion portion 54 formed on the lens member 50 is inserted into the reference hole 14a.

[0076] 7, the lighting device 140 includes a light-emitting element mounting substrate 10, a light-emitting element 20, a heat dissipation member 30, a fastening member 40, and a lens member 50. The light-emitting element mounting substrate 10 includes an element mounting layer 11a, a substrate upper layer 11b, a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, an opening 13, a reference hole 14a, and a fastening hole 14b. The heat dissipation member 30 includes a fastening portion 31. The fastening member 40 includes a head portion 41 and an insertion portion 42. The lens member 50 includes a lens portion 51, a substrate contact portion 52, an insertion portion 54, and a crimping portion 55.

[0077] The insertion portion 54 is a portion that extends from the back surface side of the board contact portion 52 toward the heat dissipation member 30. The outer shape of the insertion portion 54 is approximately the same as the inner diameters of the reference hole 14a and the fastening portion 31, and the insertion portion 54 is inserted into the reference hole 14a and the fastening portion 31. The crimped portion 55 is a portion that protrudes from the back surface of the heat dissipation member 30 at the tip of the insertion portion 54, and is made larger in diameter than the insertion portion 54 by crimping the tip of the protruding insertion portion 54.

[0078] 7, fastening hole 14b in this embodiment is formed to have a diameter larger than substrate contact portion 52 of lens member 50, and reference hole 14a is located inside fastening hole 14b. Furthermore, substrate contact portion 52 is inserted into fastening hole 14b, and insertion portion 42 is inserted into reference hole 14a and fastening portion 31.

[0079] In this embodiment, the tip of the insertion portion 54 protrudes from the back surface side of the heat dissipation member 30 to form the crimping portion 55, and the back surface of the substrate abutting portion 52 abuts against the element mounting layer 11a, thereby urging the light-emitting element mounting substrate 10 toward the heat dissipation member 30. Furthermore, by inserting the insertion portion 54 into the reference hole 14a and the fastening portion 31, the lens member 50 and the light-emitting element mounting substrate 10 are positioned and in-plane movement relative to the heat dissipation member 30 is restricted. Therefore, the combination of the insertion portion 54 and the crimping portion 55 corresponds to the crimping member in the present invention and, like the fastening member 40, has the function of positioning and fastening the light-emitting element mounting substrate 10 and the heat dissipation member 30 together.

[0080] In the light-emitting element mounting substrate 10 and the lighting device 140 of this embodiment, the element mounting layer 11a is also provided with the reference hole 14a penetrating from the top surface to the back surface, and the fastening hole 14b provided in the substrate upper layer 11b has a diameter larger than the reference hole 14a, so that even if the light-emitting element mounting substrate 10 is configured with multiple layers, it is possible to improve the positioning accuracy with respect to the heat dissipation member 30. Furthermore, the lens member 50 is provided with the insertion portion 54 and has the crimping portion 55 formed at its tip, so that the lens member 50 and the light-emitting element mounting substrate 10 can be positioned and fixed to the heat dissipation member 30 all at once.

[0081] (Sixth embodiment) Next, a sixth embodiment of the present invention will be described with reference to FIG. 8. Description of content that overlaps with the first embodiment will be omitted. FIG. 8 is a schematic cross-sectional view illustrating an overview of an illumination device 150 according to this embodiment. This embodiment differs from the first embodiment in that a positioning pin 32 is provided on the heat dissipation member 30, and a reference hole 14f and a fastening hole 14d are provided on the element mounting layer 11a.

[0082] 8, the lighting device 150 includes a light-emitting element mounting substrate 10, a light-emitting element 20, a heat dissipation member 30, and a fastening member 40. The light-emitting element mounting substrate 10 includes an element mounting layer 11a, a substrate upper layer 11b, a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, an opening 13, fastening holes 14d and 14e, and a reference hole 14f. The heat dissipation member 30 includes a fastening portion 31 and a positioning pin 32. The fastening member 40 includes a head portion 41 and an insertion portion 42.

[0083] The fastening hole 14d is a hole that penetrates from the upper surface of the element mounting layer 11a to the rear surface. The fastening hole 14e is a hole that penetrates from the upper surface of the substrate upper layer 11b to the rear surface. The diameter of the fastening hole 14e is set to be larger than the diameter of the reference hole 14f. The fastening holes 14d, 14e are provided at positions corresponding to the fastening portions 31. While FIG. 8 shows an example in which the fastening holes 14d, 14e have the same diameter, the diameter of the fastening hole 14e may be smaller than that of the fastening hole 14d, or the reference hole 14a may be used instead of the fastening hole 14d as shown in FIG. 1.

[0084] The reference hole 14f is a hole that penetrates from the top surface of the element mounting layer 11a to the back surface. The reference hole 14f is formed at a position corresponding to the positioning pin 32, and its diameter is approximately the same as the outer diameter of the positioning pin 32. The positioning pin 32 is a protrusion formed on the surface of the heat dissipation member 30, and is the part that is inserted into the reference hole 14f.

[0085] 8, in this embodiment, the diameter of the head 41 is larger than the diameter of the fastening hole 14e, and the head 41 abuts against the substrate upper layer 11b. Therefore, when the thread groove of the insertion portion 42 is screwed into the thread groove of the fastening portion 31, the head 41 of the fastening member 40 abuts against the surface of the substrate upper layer 11b, and the light-emitting element mounting substrate 10 is urged toward the heat dissipation member 30. Furthermore, when the positioning pin 32 is inserted into the reference hole 14f, movement of the light-emitting element mounting substrate 10 in the in-plane direction relative to the heat dissipation member 30 is restricted.

[0086] In the substrate 10 for mounting light-emitting elements and the lighting device 150 of this embodiment, the element mounting layer 11a is provided with a reference hole 14f that penetrates from the top surface to the back surface, and the fastening hole 14e provided in the substrate upper layer 11b has a diameter larger than the reference hole 14a, so even if the substrate 10 for mounting light-emitting elements is constructed of multiple layers, it is possible to improve the positioning accuracy to the heat dissipation member 30.

[0087] Seventh embodiment Next, a seventh embodiment of the present invention will be described with reference to Fig. 9. Description of content that overlaps with the first embodiment will be omitted. Fig. 9 is a schematic cross-sectional view illustrating an overview of an illumination device 160 according to this embodiment. This embodiment differs from the sixth embodiment in that a lens member 50 is provided in the illumination device 160, and a fastening member 40 is inserted into a through-hole 53 formed in the lens member 50.

[0088] As shown in Fig. 9, the lighting device 160 includes a light-emitting element mounting substrate 10, a light-emitting element 20, a heat dissipation member 30, a fastening member 40, and a lens member 50. The light-emitting element mounting substrate 10 includes an element mounting layer 11a, a substrate upper layer 11b, a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, an opening 13, fastening holes 14d and 14e, and a reference hole 14f. The heat dissipation member 30 includes a fastening portion 31 and a positioning pin 32. The fastening member 40 includes a head portion 41 and an insertion portion 42. The lens member 50 includes a lens portion 51, a substrate contact portion 52, and a through-hole 53.

[0089] The substrate contact portion 52 is provided on the outer periphery of the lens portion 51 at a position corresponding to the fastening hole 14e, and is a portion that comes into contact with the light-emitting element mounting substrate 10. As shown in Fig. 9, the fastening hole 14e in this embodiment is formed to have a smaller diameter than the substrate contact portion 52 of the lens member 50. In addition, the insertion portion 42 of the fastening member 40 is inserted into the through-hole 53, the fastening holes 14d and 14e, and the fastening portion 31.

[0090] In this embodiment, the screw groove of the insertion portion 42 is screwed into the screw groove of the fastening portion 31, whereby the head 41 of the fastening member 40 abuts against the upper surface of the substrate abutting portion 52, and the lens member 50 and the light-emitting element mounting substrate 10 are urged toward the heat dissipation member 30. In addition, the positioning pin 32 is inserted into the reference hole 14f, whereby the movement of the light-emitting element mounting substrate 10 in the in-plane direction relative to the heat dissipation member 30 is restricted.

[0091] In the substrate 10 for mounting light-emitting elements and the lighting device 160 of this embodiment, the element mounting layer 11a is provided with a reference hole 14f that penetrates from the top surface to the back surface, and the fastening hole 14e provided in the substrate upper layer 11b has a diameter larger than the reference hole 14a, so even if the substrate 10 for mounting light-emitting elements is constructed of multiple layers, it is possible to improve the positioning accuracy to the heat dissipation member 30.

[0092] (Eighth embodiment) Next, an eighth embodiment of the present invention will be described with reference to FIG. 10. Description of content that overlaps with the first embodiment will be omitted. FIG. 10 is a schematic cross-sectional view illustrating an overview of an illumination device 170 according to this embodiment. This embodiment differs from the seventh embodiment in that a lens member 50 is provided in the illumination device 170, an insertion portion 54 formed on the lens member 50 is inserted into the fastening portion 31, and a crimped portion 55 is formed at the tip of the insertion portion 54.

[0093] 10 , the lighting device 170 includes a light-emitting element mounting substrate 10, a light-emitting element 20, a heat dissipation member 30, and a lens member 50. The light-emitting element mounting substrate 10 includes an element mounting layer 11a, a substrate upper layer 11b, a first wiring layer 12a, a second wiring layer 12b, through-hole wiring 12c, an opening 13, fastening holes 14d and 14e, and a reference hole 14f. The heat dissipation member 30 includes a fastening portion 31 and a positioning pin 32. The lens member 50 includes a lens portion 51, a substrate contact portion 52, an insertion portion 54, and a caulking portion 55.

[0094] The insertion portion 54 is a portion extending from the back surface side of the substrate contact portion 52 toward the heat dissipation member 30. The outer shape of the insertion portion 54 is approximately the same as the inner diameter of the fastening portion 31, and the insertion portion 54 is inserted into the fastening holes 14d, 14e and the fastening portion 31. As shown in FIG. 10 , the fastening hole 14e in this embodiment is formed to have a smaller diameter than the substrate contact portion 52 of the lens member 50. Therefore, the tip of the insertion portion 54 protrudes from the back surface side of the heat dissipation member 30 to form a crimped portion 55, and the back surface of the substrate contact portion 52 abuts against the substrate upper layer 11b, thereby urging the light-emitting element mounting substrate 10 toward the heat dissipation member 30. Furthermore, the insertion of the positioning pin 32 into the reference hole 14f restricts in-plane movement of the light-emitting element mounting substrate 10 relative to the heat dissipation member 30.

[0095] In the substrate 10 for mounting light-emitting elements and the lighting device 170 of this embodiment, the element mounting layer 11a is provided with a reference hole 14f that penetrates from the top surface to the back surface, and the fastening hole 14e provided in the substrate upper layer 11b has a diameter larger than the reference hole 14a, so even if the substrate 10 for mounting light-emitting elements is constructed of multiple layers, it is possible to improve the positioning accuracy to the heat dissipation member 30.

[0096] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention. [Explanation of symbols]

[0097] 100~170...Lighting equipment 10...Light emitting element mounting substrate 20...Light emitting element 30...Heat dissipation member 40...Fastening member 50...Lens component 11a...Element mounting layer 11b…Board upper layer 11c…Bottom board layer 11d...Substrate middle layer 12a...first wiring layer 12b…Second wiring layer 12c...Through-hole wiring 13...Opening 14a, 14f…Reference hole 14b~14e... Fastening holes 31... Fastening part 32...Locating pin 41...Head 42...insertion part 51...Lens section 52...Board contact portion 53...Through hole 54...insertion part 55...Crimped part

Claims

1. an element mounting layer for mounting a light emitting element in a mounting region of the mounting surface; a substrate upper layer laminated on the element mounting layer and having an opening formed at a position corresponding to the mounting area; a reference hole penetrating from the top surface to the back surface is provided in the element mounting layer; The light-emitting element mounting substrate is characterized in that a fastening hole having a diameter larger than that of the reference hole is provided in the upper layer of the substrate.

2. The light-emitting element mounting substrate according to claim 1, The light-emitting element mounting substrate, wherein the reference hole is located within a diameter of the fastening hole in a plan view.

3. The light-emitting element mounting substrate according to claim 1, The diameter of the fastening hole is larger than the diameter of the reference hole by 0.3 mm or more.

4. The light-emitting element mounting substrate according to claim 1, The light-emitting element mounting substrate is characterized in that the element mounting layer is provided with through-hole wiring that penetrates from the mounting surface to the back surface in the mounting region.

5. 5. The circuit board according to claim 4, The light-emitting element mounting substrate is characterized in that the through-hole wiring is filled with a heat dissipation material inside.

6. The light-emitting element mounting substrate according to claim 1, the element mounting layer includes a substrate lower layer having the mounting surface and the back surface, and a substrate intermediate layer laminated on the mounting surface of the substrate lower layer, the substrate intermediate layer has the opening formed at a position corresponding to the mounting area; The light-emitting element mounting substrate, wherein the reference hole is provided in the substrate intermediate layer.

7. The light-emitting element mounting substrate according to any one of claims 1 to 6, a heat dissipation portion disposed on the rear surface side, The lighting device is characterized in that the light-emitting element mounting substrate and the heat dissipation portion are fastened together by fastening members inserted into the fastening holes.

8. 8. The lighting device according to claim 7, The lighting device according to claim 1, wherein the fastening member is a screw member that is screwed into a screw hole provided in the heat dissipation portion.

9. 8. The lighting device according to claim 7, The lighting device is characterized in that the fastening member is a crimping member inserted into a fastening portion provided on the heat dissipation portion.

10. 8. The lighting device according to claim 7, The lighting device is characterized in that a positioning pin is provided on the heat dissipation portion, and the positioning pin is inserted into the reference hole to position the heat dissipation portion on the light-emitting element mounting substrate.

Images