Method for transferring substrate and substrate transfer apparatus

Abstract

To shorten the time required for replacing a substrate.SOLUTION: The method for transferring a substrate is a method for transferring a substrate for a transfer apparatus including a transfer chamber and a buffer chamber. The transfer chamber is provided with a transfer mechanism having two forks arranged vertically and capable of supporting a substrate. The buffer chamber is connected to the transfer chamber and is provided with a placing part capable of placing a substrate by contacting a part of the substrate, and with a plurality of pins disposed below the placing part and capable of vertically moving to support the substrate. In the method for transferring a substrate, the transfer mechanism supporting a second substrate with a lower fork is inserted into the buffer chamber in which a first substrate is placed on the placing part, and the first substrate placed on the placing part is lifted by an upper fork. In the method for transferring a substrate, while the first substrate is lifted by the upper fork, the plurality of pins are raised to lift the second substrate supported by the lower fork by means of the plurality of pins. In the method for transferring a substrate, the transfer mechanism is withdrawn from the buffer chamber while the second substrate is lifted by the plurality of pins.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transport method and a substrate transport apparatus. [Background technology]

[0002] Patent document 1 discloses a technology in which a first transport arm and a second transport arm that can operate independently are provided in a transport chamber, and the first transport arm receives a processed substrate from a processing chamber, and the second transport arm transports an unprocessed substrate to the processing chamber. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-174716 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a substrate transfer method and a substrate transfer device that can reduce the time required for substrate replacement. [Means for solving the problem]

[0005] A substrate transfer method according to one aspect of the present disclosure is a substrate transfer method for a transfer apparatus having a transfer chamber and a buffer chamber or a load lock module. The transfer chamber is provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate. The buffer chamber or load lock module is provided with a mounting portion on which the substrate can be placed by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate, and is connected to the transfer chamber. The substrate transfer method includes a first step, a second step, and a third step. In the first step, the transfer mechanism, with the second fork supporting the second substrate, enters the buffer chamber or the load lock module, where a first substrate is placed on either the mounting portion or the pins, and supports the first substrate placed on either the mounting portion or the pins with the first fork. In the first step, while the first substrate is supported by the first fork, the second substrate supported by the second fork is placed on the other of the mounting portion or the pins. In the third step, the transport mechanism is withdrawn from the buffer chamber or the load lock module with the second substrate placed on the other of the mounting portion or the pins. In the first step, if the arrangement position of the second substrate on the second fork is misaligned, the transport mechanism is moved to a position where there is no misalignment with respect to the first substrate placed on either the mounting portion or the pins, and then the first substrate is supported by the first fork. In the second step, with the first substrate supported by the first fork, the transport mechanism is moved in accordance with the misalignment to correct the position of the second substrate with respect to the other of the mounting portion or the pins, and then the second substrate is placed on the other of the mounting portion or the pins. [Effects of the Invention]

[0006] According to the present disclosure, the time required to replace a substrate can be reduced. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view schematically illustrating an example of a substrate processing system according to an embodiment. [Figure 2] FIG. 2 is a perspective view illustrating an example of the configuration of a robot arm according to the embodiment. [Figure 3]FIG. 3 is a plan view showing an example of the configuration of a third arm according to the embodiment. [Figure 4] FIG. 4 is a cross-sectional view showing an example of the configuration of an LLM according to an embodiment. [Figure 5] FIG. 5 is a plan view schematically illustrating an example of the configuration of an LLM according to an embodiment. [Figure 6] FIG. 6 is a cross-sectional view schematically showing an example of the configuration of a buffer chamber according to an embodiment. [Figure 7] FIG. 7 is a plan view schematically showing an example of the configuration of a buffer chamber according to an embodiment. [Figure 8A] FIG. 8A is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 8B] FIG. 8B is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 8C] FIG. 8C is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 8D] FIG. 8D is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 8E] FIG. 8E is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 8F] FIG. 8F is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 8G] FIG. 8G is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 9A] FIG. 9A is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 9B] FIG. 9B is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 9C] FIG. 9C is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 9D] FIG. 9D is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 9E] FIG. 9E is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 9F] FIG. 9F is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 9G] FIG. 9G is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 9H] FIG. 9H is a diagram illustrating the flow of transfer in the LLM in the substrate processing system according to the embodiment. [Figure 10A] FIG. 10A is a view illustrating a transfer flow in a buffer chamber in a substrate processing system according to an embodiment. [Figure 10B] FIG. 10B is a view illustrating the flow of transfer in the buffer chamber in the substrate processing system according to the embodiment. [Figure 10C] FIG. 10C is a view illustrating the flow of transfer in the buffer chamber in the substrate processing system according to the embodiment. [Figure 10D] FIG. 10D is a view illustrating the transfer flow in the buffer chamber in the substrate processing system according to the embodiment. [Figure 10E] FIG. 10E is a view for explaining the flow of transfer in the buffer chamber in the substrate processing system according to the embodiment. [Figure 11A] FIG. 11A is a view illustrating a transfer flow in a buffer chamber in a substrate processing system according to an embodiment. [Figure 11B] FIG. 11B is a view illustrating the flow of transfer in the buffer chamber in the substrate processing system according to the embodiment. [Figure 11C] FIG. 11C is a view illustrating the transfer flow in the buffer chamber in the substrate processing system according to the embodiment. [Figure 11D]FIG. 11D is a view for explaining the transfer flow in the buffer chamber in the substrate processing system according to the embodiment. [Figure 11E] FIG. 11E is a view for explaining the transfer flow in the buffer chamber in the substrate processing system according to the embodiment. [Figure 12] FIG. 12 is a flowchart showing an example of the process flow of the substrate transfer method according to the embodiment. [Figure 13] FIG. 13 is a flowchart showing an example of the process flow of the substrate transfer method according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the disclosed substrate transport method and substrate transport apparatus will be described in detail with reference to the accompanying drawings. Note that the disclosed technology is not limited to the following embodiments.

[0009] The substrate processing system has a vacuum transfer chamber for transferring a substrate to a process module where substrate processing is performed. The substrate processing system connects the vacuum transfer chamber to a load lock whose interior can be switched between a reduced pressure state and an atmospheric state, and exchanges a processed substrate with an unprocessed substrate via the load lock. For example, the vacuum transfer chamber is provided with a transfer mechanism such as a transfer arm inside. The transfer mechanism removes a substrate from the load lock and transfers the removed substrate to a selected process module. The transfer mechanism also transfers the processed substrate to the next process module or load lock.

[0010] In some substrate processing systems, multiple vacuum transfer chambers are connected by buffer chambers, and in such cases, the transfer mechanisms of the respective vacuum transfer chambers exchange substrates via the buffer chambers.

[0011] In this way, when exchanging an unprocessed substrate for a processed substrate in a load lock or buffer chamber, one substrate must be removed and then the other substrate placed, which increases the time required to exchange the substrates.

[0012] Therefore, it is expected that the time required for replacing the substrate will be reduced.

[0013] [Embodiment] [Configuration of substrate processing system 1] An embodiment will be described. First, a substrate processing system 1 according to the embodiment will be described. Fig. 1 is a plan view schematically showing an example of the substrate processing system 1 according to the embodiment. The substrate processing system 1 shown in Fig. 1 is a substrate processing system capable of performing various processes, such as plasma processing, on a substrate W, such as a semiconductor wafer.

[0014] The substrate processing system 1 includes a processing system main body 10 and a control device 100 that controls the processing system main body 10. As shown in Fig. 1, the processing system main body 10 includes vacuum transfer chambers 11a and 11b, a plurality of process modules 13, a plurality of load lock modules 14, and an Equipment Front End Module (EFEM) 15. In the following description, the vacuum transfer chambers 11a and 11b are also referred to as VTMs (Vacuum Transfer Modules) 11a and 11b, the process modules 13 are also referred to as PMs (Process Modules) 13, and the load lock modules 14 are also referred to as LLMs (Load Lock Modules) 14.

[0015] Each of the VTMs 11a and 11b has a substantially rectangular shape in a plan view. A plurality of PMs 13 are connected to each of two opposing side surfaces of the VTMs 11a and 11b. An LLM 14 is connected to one of the other two opposing side surfaces of the VTM 11a, and a buffer chamber 19 is connected to the other side surface for connection to the VTM 11b. The VTM 11b is connected to the VTM 11a via the buffer chamber 19. The VTMs 11a and 11b each have a vacuum chamber that is maintained at a predetermined reduced pressure. A robot arm 12 (12a, 12b) is disposed inside the VTMs 11a and 11b, respectively. In this embodiment, the VTMs 11a and 11b, the LLM 14, the EFEM 15, and the buffer chamber 19 correspond to the substrate transport apparatus of the present disclosure.

[0016] The robot arms 12a and 12b are configured to be rotatable, extendable, and movable up and down. The robot arms 12a and 12b can transport the substrate W between the PM 13, the LLM 14, and the buffer chamber 19 by placing the substrate W on the fork 230 disposed at the tip of the robot arms 12a and 12b. The robot arms 12a and 12b and a robot arm 150 described later are an example of a transport mechanism of the present disclosure.

[0017] The substrate processing system 1 is provided with a plurality of sensors for detecting the position of the substrate W. For example, in the substrate processing system 1, two sensors 121 are arranged for each LLM 14, above a position through which the substrate W passes, near a connection between the LLM 14 and the EFEM 15. The two sensors 121 arranged for each LLM 14 acquire sensing information about the substrate W when the robot arm 150 in the EFEM 15 loads or unloads the substrate W into or out of the LLM 14. In addition, in the substrate processing system 1, two sensors 122 are arranged for each LLM 14, above a position through which the substrate W passes, near a connection between the VTM 11a and the LLM 14. The two sensors 122 arranged for each LLM 14 acquire sensing information about the substrate W when the robot arm 12a loads or unloads the substrate W into or out of the LLM 14. In addition, in the substrate processing system 1, two sensors 123 are arranged for each LLM 14, above a position through which the substrate W passes, near a connection between the VTM 11a and the buffer chamber 19. The two sensors 123 acquire sensing information about the substrate W when the robot arm 12a loads or unloads the substrate W into or from the buffer chamber 19. Furthermore, the substrate processing system 1 has two sensors 124 disposed above a position through which the substrate W passes, near the connection between the VTM 11b and the buffer chamber 19. The two sensors 124 acquire sensing information about the substrate W when the robot arm 12b loads or unloads the substrate W into or unloads the buffer chamber 19. Note that although two sensors 121 to 124 are provided on each side, three or more sensors may be provided on each side. The sensors 121 to 124 may be disposed in any position and configured as long as they can detect the position of the substrate W. For example, the sensors 121 to 124 may be configured to detect the position of the substrate W from the side.

[0018] The PM 13 has a processing chamber and a cylindrical stage 130 (mounting table) disposed therein. The stage 130 has three thin, rod-shaped lift pins 131 that can freely protrude from the top surface. The lift pins 131 are arranged on the same circumference in a plan view of the stage 130. Each lift pin 131 supports and lifts the substrate W placed on the stage 130 by protruding from the top surface of the stage 130. Each lift pin 131 also supports and places the supported substrate W on the stage 130 by retracting into the stage 130. After the substrate W is placed on the stage 130, the PM 13 reduces the pressure inside the PM 13 to introduce a processing gas, and further applies high-frequency power inside to generate plasma, which then performs plasma processing on the substrate W. The VTMs 11a and 11b and the PM 13 are separated by a gate valve 132 that can be opened and closed.

[0019] The LLM 14 is disposed between the VTM 11a and the EFEM 15. The LLM 14 has an internal pressure variable chamber whose interior can be switched between a predetermined reduced pressure state and atmospheric pressure state, and has a cylindrical stage 140 disposed inside.

[0020] When transferring a substrate W from the EFEM 15 to the VTM 11a, the LLM 14 maintains its interior at atmospheric pressure, receives the substrate W from the EFEM 15, and then depressurizes its interior to transfer the substrate W into the VTM 11a. When transferring a substrate W from the VTM 11a to the EFEM 15, the LLM 14 maintains its interior at reduced pressure, receives the substrate W from the VTM 11a, and then increases its interior pressure to atmospheric pressure to transfer the substrate W into the EFEM 15. The stage 140 has three thin, rod-shaped lift pins 141 that can protrude from the top surface. The lift pins 141 are arranged on the same circumference in a plan view. Each lift pin 141 supports and lifts the substrate W by protruding from the top surface of the stage 140. Each lift pin 141 retracts into the stage 140 to place the supported substrate W on the stage 140. The LLM 14 and the VTM 11a are separated by a gate valve 142 that can be opened and closed. The LLM 14 and the EFEM 15 are separated by a gate valve 143 that can be opened and closed freely.

[0021] The EFEM 15 is disposed opposite the VTM 11a. The EFEM 15 is a rectangular parallelepiped atmospheric transfer chamber equipped with an FFU (Fan Filter Unit) and maintained at atmospheric pressure. Two LLMs 14 are connected to one longitudinal side of the EFEM 15. Four load ports (LPs) 16 are connected to the other longitudinal side of the EFEM 15. A FOUP (Front-Opening Unified Pod) (not shown), which is a container for accommodating multiple substrates W, is placed on the LPs 16. An aligner 17 and an MTP (Mapping Temporary Port) 18 are connected to one transverse side of the EFEM 15. A robot arm 150 is also disposed within the EFEM 15.

[0022] The robot arm 150 is configured to be movable along a guide rail. The robot arm 150 is configured similarly to the robot arm 12, and is configured to be rotatable, extendable, and movable up and down. The robot arm 150 can transport the substrate W between the FOUP of the LP 16, the aligner 17, the MTP 18, and the LLM 14 by placing the substrate W on a fork 230 arranged at the tip of the robot arm 150. Note that the robot arm 150 is not limited to the configuration shown in FIG. 1 as long as it is capable of transporting the substrate W between the FOUP, the aligner 17, the MTP 18, and the LLM 14.

[0023] The aligner 17 aligns the substrate W. The aligner 17 has a rotary stage (not shown) rotated by a drive motor (not shown). The rotary stage has, for example, a diameter smaller than that of the substrate W and is configured to be rotatable with the substrate W placed on its upper surface. An optical sensor for detecting the outer periphery of the substrate W is provided near the rotary stage. In the aligner 17, the optical sensor detects the center position of the substrate W and the direction of the notch relative to the center of the substrate W, and the substrate W is transferred to the fork 230 so that the center position and notch direction of the substrate W are at a predetermined position and in a predetermined direction. This adjusts the transfer position of the substrate W within the LLM 14 so that the center position and notch direction of the substrate W are at a predetermined position and in a predetermined direction. In addition, an MTP 18 is provided directly below the aligner 17, and can temporarily retract the substrate W.

[0024] The buffer chamber 19 is disposed between the VTM 11a and the VTM 11b. The buffer chamber 19 has a cylindrical stage 190 therein for transferring the substrate W between the VTM 11a and the VTM 11b. The stage 190 has three thin rod-shaped lift pins 191 that can freely protrude from the top surface. The lift pins 191 are arranged on the same circumference in a plan view. The lift pins 191 support and lift the substrate W by protruding from the top surface of the stage 190. Furthermore, the lift pins 191 retract into the stage 190 to place the substrate W that they support onto the stage 190.

[0025] The substrate processing system 1 includes a control device 100. The control device 100 controls the operation of the substrate processing system 1. For example, the control device 100 controls the operation of the robot arms 12 and 150, the opening and closing of the gate valves 142 and 143, the raising and lowering of the lift pins 141 of the LLM 14, and the raising and lowering of the lift pins 191 of the buffer chamber 19. The control device 100 is, for example, a computer, and includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), an auxiliary storage device, and the like. The CPU operates based on a program stored in the ROM or the auxiliary storage device, and controls the operation of each component of the substrate processing system 1. In this embodiment, the control device 100 corresponds to the control unit of the present disclosure.

[0026] [Configuration of robot arms 12 and 150] Next, an example of the configuration of the robot arms 12, 150 according to the embodiment will be described. In this embodiment, the robot arms 12 (12a, 12b), 150 are multi-joint robots with similar configurations. The following description will be made using the configuration of the robot arm 12 as an example. FIG. 2 is a perspective view showing an example of the configuration of the robot arm 12 according to the embodiment. In FIG. 2, the reference numerals of the components constituting the robot arm 12 are indicated by numbers in the 200s. Also, in FIG. 2, the reference numerals of the components constituting the robot arm 12 when they are used as the robot arm 150 are indicated by numbers in the 300s in parentheses.

[0027] The robot arm 12 has an arm portion 200 and a base portion 201. The base portion 201 supports the arm portion 200. The arm portion 200 is rotatably attached to the base portion 201.

[0028] The arm unit 200 is configured as a multi-joint arm in which a plurality of arms are connected at joints. The arm unit 200 according to the embodiment has a first arm 211, a second arm 212, and third arms 213 and 214.

[0029] One end of a first arm 211 is attached to the base portion 201. A first joint portion 221 that rotatably supports the first arm 211 is provided on the base portion 201. One end of a second arm 212 is attached to the other end of the first arm 211. A second joint portion 222 that rotatably supports the second arm 212 is provided to the other end of the first arm 211. One end of a third arm 213 is attached to the other end of the second arm 212. A third joint portion 223 that rotatably supports the third arm 213 is provided to the other end of the second arm 212.

[0030] The robot arm 12 according to this embodiment has two arms, third arms 213 and 214, at its distal end, and one end of the third arms 213 and 214 is supported so as to overlap at a third joint 223. Hereinafter, of the two third arms 213 and 214, the upper third arm 213 will be referred to as the upper arm 213, and the lower third arm 214 will be referred to as the lower arm 214. The robot arm 12 is capable of driving the upper arm 213 and the lower arm 214 to rotate independently via the third joint 223.

[0031] Next, an example of the configuration of the third arms 213, 214 according to the embodiment will be described. The third arms 213, 214 have the same configuration. FIG. 3 is a plan view showing an example of the configuration of the third arms 213, 214 according to the embodiment. In FIG. 3, the reference numerals of the components constituting the third arms 213, 214 of the robot arm 12 are indicated by numbers in the 200s. Also in FIG. 3, the reference numerals of the components constituting the third arms 213, 214 when they are the third arms 313, 314 of the robot arm 150 are indicated by numbers in the 300s in parentheses.

[0032] The third arms 213, 214 (upper arm 213, lower arm 214) are provided with a fork 230. The fork 230 has a Y-shape with its tip branching into two support portions 231, and supports the substrate W. The robot arm 12 supports and transports the substrate W by the fork 230.

[0033] As described above, the robot arm 150 has the same configuration as the robot arm 12. When describing the robot arm 150 below, the operation will be described using the reference numerals in the 300s shown in parentheses in Figures 2 and 3.

[0034] The configurations of the robot arms 12 and 150 are merely examples and are not limited to these. The robot arms 12a and 12b are not limited to the configurations shown in Figures 1 to 3 as long as they are able to transport the substrate W between the PM 13, the LLM 14, and the buffer chamber 19. Similarly, the robot arm 150 is not limited to the configurations shown in Figures 1 to 3 as long as it is able to transport the substrate W between the LLM 14, the EFEM 15, and the LP 16.

[0035] [LLM14 Configuration] Next, an example of the configuration of the LLM 14 according to the embodiment will be described. FIG. 4 is a cross-sectional view that schematically shows an example of the configuration of the LLM 14 according to the embodiment. FIG. 5 is a plan view that schematically shows an example of the configuration of the LLM 14 according to the embodiment. The LLM 14 is connected to the VTM 11a and the EFEM 15. A gate valve 142 is provided at the LLM 14's connection to the VTM 11a, and a gate valve 143 is provided at the LLM 14's connection to the EFEM 15. The LLM 14 can switch its interior between a reduced pressure state and an atmospheric state by closing the gate valves 142 and 143 to reduce the pressure inside.

[0036] The LLM 14 has a stage 140 provided therein. The stage 140 has a cooling mechanism, such as a flow path through which a coolant flows, that allows the substrate W placed on the stage 140 to be cooled. The stage 140 has three lift pins 141 that can move up and down to support the substrate W. The LLM 14 also has a mounting unit 145 on top of the stage 140 that can mount the substrate W. Figure 5 illustrates the fork 230 of the robot arm 12, showing an example of the relative positions of the three lift pins 141 and the mounting unit 145.

[0037] The three lift pins 141 are provided so as to be able to pass between the two support portions 231 of the fork 230 of the robot arm 12. The three lift pins 141 are also provided so as to be able to pass between the two support portions 331 of the fork 330 of the robot arm 150. For example, the three lift pins 141 are provided on the same circumference near the center of the stage 140. The three lift pins 141 are provided inside the two support portions 231 of the fork 230 and in an area narrower than the inside of the two support portions 331 of the fork 330. The LLM 14 supports the substrate W by raising the three lift pins 141.

[0038] The mounting portion 145 supports the substrate W by contacting a portion of the substrate W. The LLM 14 according to this embodiment is provided with two mounting portions 145a, 145b spaced apart in a direction intersecting the direction of the gate valves 142, 143 through which the substrate W passes. The distance between the mounting portions 145a, 145b is narrower than the width of the substrate W and wider than the width of the fork 230 of the robot arm 12 and the width of the fork 330 of the robot arm 150. The mounting portions 145a, 145b each contact an edge of the substrate W placed thereon to support the substrate W.

[0039] [Configuration of Buffer Chamber 19] Next, an example of the configuration of the buffer chamber 19 according to the embodiment will be described. Fig. 6 is a cross-sectional view that schematically shows an example of the configuration of the buffer chamber 19 according to the embodiment. Fig. 7 is a plan view that schematically shows an example of the configuration of the buffer chamber 19 according to the embodiment. The buffer chamber 19 is connected to VTM 11a and VTM 11b.

[0040] A stage 190 is provided inside the buffer chamber 19. The stage 190 is provided with three lift pins 191 that can move up and down to support the substrate W. The buffer chamber 19 also has a mounting portion 195 on top of the stage 140 that can mount the substrate W. In Figure 7, the fork 230 of the robot arm 12 is illustrated to show an example of the relative positions of the three lift pins 191 and the mounting portion 195.

[0041] The three lift pins 191 are provided so as to be able to pass between two support portions 231 of a fork 230 of the robot arm 12. For example, the three lift pins 191 are provided on the same circumference near the center of the stage 190. The three lift pins 191 are provided in an area narrower than the inside of the two support portions 231 of the fork 230. The buffer chamber 19 supports the substrate W by raising the three lift pins 191.

[0042] The buffer chamber 19 is also provided with a mounting portion 195 on top of the stage 140, on which a substrate W can be placed. The mounting portion 195 contacts a portion of the substrate W to support the substrate W. The buffer chamber 19 according to this embodiment is provided with two mounting portions 195a, 195b spaced apart in a direction intersecting the direction in which the substrate W passes. The distance between the mounting portions 195a, 195b is narrower than the width of the substrate W and wider than the width of the fork 230 of the robot arm 12. The mounting portions 195a, 195b contact the respective ends of the placed substrate W to support the substrate W.

[0043] Based on the control of the control device 100, the substrate processing system 1 uses the robot arms 12 and 150 to remove an unprocessed substrate W1 from a FOUP and transport it to one of the PMs 13 via the EFEM 15, the LLM 14, the VTMs 11a and 11b, and the buffer chamber 19. Also, based on the control of the control device 100, the substrate processing system 1 uses the robot arms 12 and 150 to transport a substrate W that has been processed in the PM 13 to the FOUP via the VTMs 11a and 11b, the buffer chamber 19, the LLM 14, and the EFEM 15.

[0044] The substrate processing system 1 according to the embodiment transfers the unprocessed substrate W1 and the processed substrate W2 in the LLM 14 and the buffer chamber 19 under the control of the control device 100 as follows.

[0045] First, the flow of transporting an unprocessed substrate W1 and a processed substrate W2 in the LLM 14 will be described. FIGS. 8A to 8G are diagrams illustrating the flow of transport in the LLM 14 in the substrate processing system 1 according to an embodiment. FIGS. 8A to 8G show the flow of transporting an unprocessed substrate W1 and a processed substrate W2 between the LLM 14 and the EFEM 15. Note that in FIGS. 8A to 8G, the lift pins 141 are simply shown with only the tip portions. Also, in FIGS. 8A to 8G, when the insides of the VTM 11a and the LLM 14 are in a reduced pressure state, a diagonal line pattern is shown inside the VTM 11a and the LLM 14.

[0046] In FIG. 8A , the LLM 14 raises the lift pins 141 to support the processed substrate W2. The lift pins 141 are raised to a height where the distance between the lower surface of the processed substrate W2 they support and the upper surface of the mounting section 145 is smaller than the gap between the upper arm 313 and the lower arm 314 of the robot arm 150. The LLM 14 closes the gate valves 142 and 143 to switch the interior to atmospheric pressure. The VTM 11a is depressurized to a predetermined depressurized state. The EFEM 15 is at atmospheric pressure. In the EFEM 15, the unprocessed substrate W1 is removed from the FOUP placed on the LP 16, and the unprocessed substrate W1 is supported by the upper arm 313 of the robot arm 150.

[0047] When the inside of the LLM 14 becomes atmospheric, the gate valve 143 opens, as shown in FIG. 8B. The robot arm 150 causes the upper arm 313 and the lower arm 314 to enter the LLM 14, as shown in FIG. 8C. The robot arm 150 causes the upper arm 313 and the lower arm 314 to enter at a height such that the upper surface of the upper arm 313 is higher than the upper surface of the mounting unit 145 and the upper surface of the lower arm 314 is lower than the lower surface of the processed substrate W2 supported by the lift pins 141. Note that in FIGS. 8B to 8F, the heights of the upper surfaces of the upper arm 313 and the lower arm 314 of the robot arm 150 when they enter the LLM 14 are indicated by lines H1 and H2.

[0048] When the upper arm 313 and the lower arm 314 enter the LLM 14, the unprocessed substrate W1 passes through the detection area of ​​the sensor 121. The sensor 121 outputs sensing information to the control device 100. The control device 100 identifies the placement position of the unprocessed substrate W1 on the upper arm 313 based on the sensing information obtained from the sensor 121 and position information of the upper arm 313 of the robot arm 150. The position information of the upper arm 313 of the robot arm 150 is identified based on, for example, the length of each arm of the robot arm 150 and the angle of each joint. The robot arm 150 transports the unprocessed substrate W1 on the upper arm 313 to a position above a predetermined placement position with respect to the platform 145.

[0049] 8D, the LLM 14 lowers the lift pins 141 and places the processed substrate W2 that was supported by the lift pins 141 on the lower arm 314. The robot arm 150 lowers the upper arm 313 and the lower arm 314 and places the unprocessed substrate W1 that was supported by the upper arm 313 on the placement part 145, as shown in FIG.

[0050] In this way, the substrate processing system 1 according to the embodiment can exchange the unprocessed substrate W1 for the processed substrate W2 by having the upper arm 313 and the lower arm 314 of the robot arm 150 enter the LLM 14 once. Furthermore, the robot arm 150 transports the unprocessed substrate W1 to a predetermined placement position relative to the receiver 145 based on sensing information etc. obtained from the sensor 121 when the upper arm 313 and the lower arm 314 enter the LLM 14. This makes it possible to reduce the amount of deviation of the unprocessed substrate W1 from its predetermined placement position relative to the receiver 145.

[0051] After placing the unprocessed substrate W1 on the placement part 145, the robot arm 150 retracts the upper arm 313 and the lower arm 314 from the LLM 14, as shown in FIG. 8F. After the upper arm 313 and the lower arm 314 have retracted, the gate valve 143 closes. The pressure inside the LLM 14 is reduced. As shown in FIG. 8G, the robot arm 150 transports the processed substrate W2 supported by the lower arm 314 to a FOUP placed on the LP 16.

[0052] 9A to 9H are diagrams illustrating the flow of transfer in the LLM 14 in the substrate processing system 1 according to the embodiment. FIGS. 9A to 9H show the flow of transfer of an unprocessed substrate W1 and a processed substrate W2 between the LLM 14 and the VTM 11a. Note that in FIGS. 9A to 9H, the lift pins 141 are simply shown with only their tip portions. Also, in FIGS. 9A to 9H, when the insides of the VTM 11a and the LLM 14 are in a reduced-pressure state, diagonal lines are drawn inside the VTM 11a and the LLM 14.

[0053] 9A, the LLM 14 is depressurized to a predetermined depressurized state inside. The VTM 11a is depressurized to a predetermined depressurized state inside. The robot arm 12a has a processed substrate W2 placed on the lower arm 214.

[0054] When the interior of the LLM 14 reaches a predetermined reduced pressure state, the gate valve 142 opens, as shown in Fig. 9B. As shown in Fig. 9C, the robot arm 12a causes the upper arm 213 and the lower arm 214 to enter the LLM 14. The robot arm 12a causes the upper arm 213 and the lower arm 214 to enter the LLM 14 at a height such that the top surface of the upper arm 213 is lower than the top surface of the mounting unit 145. In Figs. 9B to 9F, the heights of the top surfaces of the upper arm 213 and the lower arm 214 of the robot arm 12a when they enter the LLM 14 are indicated by lines H3 and H4.

[0055] When the upper arm 213 and the lower arm 214 enter the LLM 14, the processed substrate W2 passes through the detection area of ​​the sensor 122. The sensor 122 outputs sensing information to the control device 100. The control device 100 identifies the placement position of the processed substrate W2 on the lower arm 214 based on the sensing information obtained from the sensor 122 and position information of the lower arm 214 of the robot arm 12a. The position information of the lower arm 214 of the robot arm 12a is identified based on, for example, the length of each arm of the robot arm 12a and the angle of each joint. The robot arm 12a transports the processed substrate W2 on the lower arm 214 to a position above a predetermined placement position with respect to the lift pins 141.

[0056] 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and the unprocessed substrate W1 placed on the mounting part 145 is lifted and supported by the upper arm 213. As shown in FIG. 9E, the LLM 14 raises the lift pins 141, and the processed substrate W2 that was supported by the lower arm 214 is lifted and supported by the lift pins 141.

[0057] In this way, the substrate processing system 1 according to the embodiment can exchange the unprocessed substrate W1 for the processed substrate W2 by having the upper arm 213 and the lower arm 214 of the robot arm 12a enter the LLM 14 once. Furthermore, the robot arm 12a transports the processed substrate W2 to a predetermined position relative to the lift pins 141 based on sensing information and the like obtained from the sensor 122 when the upper arm 213 and the lower arm 214 enter the LLM 14. This makes it possible to reduce the amount of deviation of the processed substrate W2 from its predetermined position relative to the lift pins 141.

[0058] After supporting the unprocessed substrate W1 on the upper arm 213, the robot arm 12a causes the upper arm 213 and the lower arm 214 to retract from the LLM 14, as shown in FIG. 9F. After the upper arm 213 and the lower arm 214 have retracted, the gate valve 142 closes. As shown in FIG. 9G, the robot arm 12a transports the unprocessed substrate W1 supported on the upper arm 213 to the PM 13 or buffer chamber 19 where substrate processing is performed. As shown in FIG. 9H, the LLM 14 switches the interior to atmospheric condition, lowers the lift pins 141, and places the processed substrate W2 on the stage 140, which then cools the processed substrate W2.

[0059] Thereafter, the LLM 14 and the EFEM 15 perform the transport in the flow of FIGS. 8A to 8G described above, and exchange the processed substrate W2 for the next unprocessed substrate W1.

[0060] The processed substrate W2 may be displaced during substrate processing by the PM 13 or during transport by the robot arm 12, and the placement position on the lower arm 214 may be displaced.

[0061] In the substrate processing system 1, the control device 100 identifies the position of the processed substrate W2 on the lower arm 214 based on sensing information obtained from the sensor 122, etc. The robot arm 12a transports the processed substrate W2 to a position above a predetermined position relative to the lift pins 141. Therefore, for example, if the position of the processed substrate W2 on the lower arm 214 is misaligned, the positions of the upper arm 213 and the lower arm 214 when the robot arm 12a transports the substrate W2 above the lift pins 141 will be misaligned by the amount of the misalignment. In this state, if the robot arm 12a raises the upper arm 213 and the lower arm 214 as shown in FIG. 9D , a misalignment will occur in the position of the unprocessed substrate W1 on the upper arm 213. If the placement position of the unprocessed substrate W1 on the upper arm 213 is shifted, there is a risk that the unprocessed substrate W1 may collide with components around the transport path (e.g., gate valves 142, 143) during transport, or that the placement position may be shifted at the destination.

[0062] Therefore, the substrate processing system 1 corrects the positional misalignment when exchanging the unprocessed substrate W1 with the processed substrate W2 between the LLM 14 and the VTM 11a. For example, as shown in Fig. 9C, the robot arm 12a moves the upper arm 213 to a position where there is no positional misalignment with respect to the unprocessed substrate W1 placed on the receiver 145. Then, as shown in Fig. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and lifts and supports the unprocessed substrate W1 placed on the receiver 145 with the upper arm 213.

[0063] With the unprocessed substrate W1 held up, the robot arm 12a moves the lower arm 214 in accordance with the positional deviation to correct the position of the processed substrate W2 relative to the lift pins 141. For example, the robot arm 12a moves the lower arm 214 by the amount of the positional deviation to correct the position of the processed substrate W2 relative to the lift pins 141. For example, the robot arm 12a transports the processed substrate W2 on the lower arm 214 to a position above a predetermined placement position relative to the lift pins 141. Thereafter, the LLM 14 raises the lift pins 141, as shown in FIG. 9E, and the processed substrate W2 is lifted and supported by the lift pins 141.

[0064] This allows the substrate processing system 1 to transport the unprocessed substrate W1 and the processed substrate W2 without causing misalignment. This allows the robot arms 12, 150 to transport the unprocessed substrate W1 and the processed substrate W2 stably and accurately. Furthermore, when the robot arms 12, 150 transport the unprocessed substrate W1 and the processed substrate W2, they can be prevented from coming into contact with the gate valves 142, 143, etc.

[0065] The substrate processing system 1 may correct the positional deviation when the position of the processed substrate W2 on the lower arm 214 is deviated by more than a tolerance. The tolerance is determined according to the amount of deviation in the position of the substrate W that is tolerated by the substrate processing system 1. For example, the tolerance is set to the amount of deviation in the position of the substrate W that is tolerated by the transport path and the transport destination.

[0066] For example, in the substrate processing system 1, the control device 100 identifies the position of the processed substrate W2 on the lower arm 214 based on sensing information obtained from the sensor 122, etc. The control device 100 determines whether the identified position of the substrate W2 is misaligned by more than a tolerance. If the position of the substrate W2 is misaligned by more than the tolerance, the substrate processing system 1 corrects the misalignment when exchanging the unprocessed substrate W1 for the processed substrate W2. For example, as shown in FIG. 9C, the robot arm 12a moves the upper arm 213 to a position where there is no misalignment with respect to the unprocessed substrate W1 placed on the receiver 145. Then, as shown in FIG. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and lifts and supports the unprocessed substrate W1 placed on the receiver 145 with the upper arm 213. The robot arm 12a, while lifting up the unprocessed substrate W1, moves the lower arm 214 in accordance with the positional deviation to correct the position of the processed substrate W2 relative to the lift pins 141. As shown in FIG. 9E, the LLM 14 raises the lift pins 141, and the processed substrate W2 is lifted and supported by the lift pins 141. This substrate transport method of transporting the substrate while correcting the positional deviation in this manner is hereinafter referred to as the first transport method. By using the first transport method, the substrate processing system 1 can transport the unprocessed substrate W1 and the processed substrate W2 without causing any positional deviation, although the time required for replacement increases slightly by correcting the position of the substrate W2.

[0067] On the other hand, if the positional deviation of the processed substrate W2 on the lower arm 214 is smaller than the allowable value, the robot arm 12a moves the lower arm 214 to a position where the processed substrate W2 on the lower arm 214 is not misaligned with respect to the lift pins 141, as shown in FIG. 9C. Then, as shown in FIG. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and the unprocessed substrate W1 placed on the mounting section 145 is lifted and supported by the upper arm 213. The robot arm 12a maintains the posture of the unprocessed substrate W1 in the lifted state, and keeps the position of the lower fork unchanged. As shown in FIG. 9E, the LLM 14 raises the lift pins 141, and lifts and supports the processed substrate W2 with the lift pins 141. As a result, the substrate processing system 1 can quickly transport the unprocessed substrate W1 and the processed substrate W2, even though the position of the unprocessed substrate W1 on the upper arm 213 is misaligned.

[0068] Furthermore, when the position of the processed substrate W2 on the lower arm 214 is misaligned, the substrate processing system 1 may correct the misalignment as follows. When the position of the processed substrate W2 on the lower arm 214 is misaligned, the robot arm 12a moves the upper arm 213 and the lower arm 214 in accordance with the misalignment to correct the position of the processed substrate W2 relative to the lift pins 141. For example, when the position of the processed substrate W2 on the lower arm 214 is misaligned by more than a tolerance, the robot arm 12a moves the upper arm 213 and the lower arm 214 to positions where the misalignment of the processed substrate W2 relative to the lift pins 141 becomes smaller than the tolerance. For example, the robot arm 12a moves the upper arm 213 and the lower arm 214 so that the midpoint of the misalignment of the processed substrate W on the lower arm 214 coincides with a reference position for placing the substrate W2 relative to the lift pins 141. Specifically, the control device 100 determines a line segment connecting the center position of the misaligned substrate W2 on the lower arm 214 with the center position of the substrate W2 when there is no misalignment. The robot arm 12a moves the upper arm 213 and the lower arm 214 so that one of the positions on the line segment coincides with a reference position for placing the substrate W2 relative to the lift pins 141. Then, as shown in FIG. 9D, the robot arm 12a raises the upper arm 213 and the lower arm 214, and the upper arm 213 lifts and supports the unprocessed substrate W1 placed on the mounting part 145. As shown in FIG. 9E, the LLM 14 raises the lift pins 141, and the lift pins 141 lift and support the processed substrate W2 that was supported by the lower arm 214. This substrate transport method for transporting substrates while correcting misalignment in this manner is hereinafter referred to as the second transport method. In the second transfer method, although a positional deviation of less than a tolerance occurs between the unprocessed substrate W1 and the processed substrate W2, the substrate W1 and the substrate W2 can be quickly exchanged.

[0069] Next, a description will be given of the flow of transport of an unprocessed substrate W1 and a processed substrate W2 in the buffer chamber 19. Figures 10A to 10E are views illustrating the flow of transport in the buffer chamber 19 in the substrate processing system 1 according to an embodiment. Figures 10A to 10E show the flow of transport of an unprocessed substrate W1 and a processed substrate W2 between the buffer chamber 19 and the VTM 11a. Note that in Figures 10A to 10E, only the tip portions of the lift pins 191 are shown in a simplified manner.

[0070] 10A, the buffer chamber 19 supports the processed substrate W2 by raising the lift pins 191. The lift pins 191 are raised to a height at which the distance between the lower surface of the processed substrate W2 they support and the upper surface of the mounting section 195 is smaller than the gap between the upper arm 213 and the lower arm 214 of the robot arm 12a. In the VTM 11a, the upper arm 213 of the robot arm 12a supports the unprocessed substrate W1.

[0071] 10B, the robot arm 12a causes the upper arm 213 and the lower arm 214 to enter the buffer chamber 19. The robot arm 12a causes the upper arm 213 and the lower arm 214 to enter at a height such that the upper surface of the upper arm 213 is higher than the upper surface of the mounting unit 195 and the upper surface of the lower arm 214 is lower than the lower surface of the processed substrate W2 supported by the lift pins 191. Note that in FIGS. 10A to 10E, the heights of the upper surfaces of the upper arm 213 and the lower arm 214 of the robot arm 12a when they enter the buffer chamber 19 are indicated by lines H5 and H6.

[0072] When the upper arm 213 and the lower arm 214 enter the buffer chamber 19, the unprocessed substrate W1 passes through the detection area of ​​the sensor 123. The sensor 123 outputs sensing information to the control device 100. The control device 100 identifies the placement position of the unprocessed substrate W1 on the upper arm 213 based on the sensing information obtained from the sensor 123 and position information of the upper arm 213 of the robot arm 12a. The position information of the upper arm 213 of the robot arm 12a is identified based on, for example, the length of each arm of the robot arm 12a and the angle of each joint. The robot arm 12a transports the unprocessed substrate W1 on the upper arm 213 to a position above a predetermined placement position with respect to the platform 195.

[0073] 10C, the buffer chamber 19 lowers the lift pins 191 and places the processed substrate W2 that was supported by the lift pins 191 on the lower arm 214. As shown in FIG. 10D, the robot arm 12a lowers the upper arm 213 and the lower arm 214 and places the unprocessed substrate W1 that was supported by the upper arm 213 on the placement part 195.

[0074] In this way, the substrate processing system 1 according to the embodiment can exchange the unprocessed substrate W1 for the processed substrate W2 by causing the upper arm 213 and the lower arm 214 of the robot arm 12a to enter the buffer chamber 19 once.

[0075] After the unprocessed substrate W1 is placed on the placement part 195, the robot arm 12a causes the upper arm 213 and the lower arm 214 to retreat from the buffer chamber 19, as shown in FIG. 10E.

[0076] 11A to 11E are diagrams illustrating the flow of transfer in the buffer chamber 19 in the substrate processing system 1 according to this embodiment. Figures 11A to 11E show the flow of transfer of an unprocessed substrate W1 and a processed substrate W2 between the buffer chamber 19 and the VTM 11b. Note that in Figures 11A to 11E, only the tip portions of the lift pins 191 are shown in a simplified manner.

[0077] 11A, in the buffer chamber 19, an unprocessed substrate W1 is placed on a placement part 195. A processed substrate W2 is placed on the lower arm 214 of the robot arm 12b.

[0078] 11B, the robot arm 12b causes the upper arm 213 and the lower arm 214 to enter the buffer chamber 19. The robot arm 12b causes the upper arm 213 and the lower arm 214 to enter the buffer chamber 19 at a height such that the upper surface of the upper arm 213 is lower than the upper surface of the mounting portion 195. Note that in FIGS. 11A to 11E, the heights of the upper surfaces of the upper arm 213 and the lower arm 214 of the robot arm 12b when they enter the buffer chamber 19 are indicated by lines H7 and H8.

[0079] When the upper arm 213 and the lower arm 214 enter the buffer chamber 19, the processed substrate W2 passes through the detection area of ​​the sensor 124. The sensor 124 outputs sensing information to the control device 100. The control device 100 identifies the placement position of the processed substrate W2 on the lower arm 214 based on the sensing information obtained from the sensor 124 and position information of the lower arm 214 of the robot arm 12b. The position information of the lower arm 214 of the robot arm 12b is identified based on, for example, the length of each arm of the robot arm 12b and the angle of each joint. The robot arm 12b transports the processed substrate W2 on the lower arm 214 to a position above a predetermined placement position with respect to the lift pins 191.

[0080] 11C, the robot arm 12b raises the upper arm 213 and the lower arm 214, and the unprocessed substrate W1 placed on the placement part 195 is lifted and supported by the upper arm 213. As shown in FIG. 11D, the buffer chamber 19 raises the lift pins 191, and the processed substrate W2 that was supported by the lower arm 214 is lifted and supported by the lift pins 191.

[0081] In this way, the substrate processing system 1 according to the embodiment can exchange the unprocessed substrate W1 for the processed substrate W2 by causing the upper arm 213 and the lower arm 214 of the robot arm 12b to enter the buffer chamber 19 once.

[0082] After the unprocessed substrate W1 is supported by the upper arm 213, the robot arm 12b causes the upper arm 213 and the lower arm 214 to retreat from the buffer chamber 19, as shown in Fig. 11E. The robot arm 12b transports the unprocessed substrate W1 supported by the upper arm 213 to the PM 13, which performs substrate processing, and performs the substrate processing. The buffer chamber 19 and the TM 11a perform transport in the flow shown in Figs. 10A to 10E, and the processed substrate W2 is replaced with the next unprocessed substrate W1.

[0083] As described above, the processed substrate W2 may be displaced during substrate processing in the PM 13 or during transport by the robot arm 12, resulting in a displacement of its placement position on the lower arm 214. When exchanging the unprocessed substrate W1 for the processed substrate W2 between the buffer chamber 19 and VTM 11b, the substrate processing system 1 may correct the displacement in the same way as when exchanging the substrate W1 and the substrate W2 between the LLM 14 and VTM 11a described above.

[0084] [Board transport method] Next, the process flow of the substrate transfer method according to this embodiment will be described. Fig. 12 is a flowchart showing an example of the process flow of the substrate transfer method according to this embodiment. Fig. 12 takes as an example the case where an unprocessed substrate W1 and a processed substrate W2 are transferred between the LLM 14 and the EFEM 15, as shown in Figs. 8A to 8G.

[0085] In the LLM 14, the lift pins 141 are raised to support the processed substrate W2. The upper arm 313 of the robot arm 150 supports the unprocessed substrate W1.

[0086] The control device 100 controls the LLM 14 and the gate valve 143 to switch the inside of the LLM 14 to atmospheric conditions and open the gate valve 143 (step S10).

[0087] The control device 100 controls the robot arm 150 to cause the upper arm 313 and the lower arm 314 to enter the LLM 14 (step S11). When the upper arm 313 and the lower arm 314 enter the LLM 14, the sensor 121 outputs sensing information to the control device 100. The control device 100 identifies the placement position of the unprocessed substrate W1 on the upper arm 313 based on the sensing information obtained from the sensor 121 and the position information of the upper arm 313 of the robot arm 150. The control device 100 controls the robot arm 150 to transport the unprocessed substrate W1 on the upper arm 313 to a position above a predetermined placement position with respect to the receiver 145.

[0088] The controller 100 controls the LLM 14 to lower the lift pins 141 and place the processed substrate W2 that was supported by the lift pins 141 on the lower arm 314 (step S12). The controller 100 controls the robot arm 150 to lower the upper arm 313 and the lower arm 314 and place the unprocessed substrate W1 that was supported by the upper arm 313 on the placement part 145 (step S13).

[0089] The control device 100 controls the robot arm 150 to cause the upper arm 313 and the lower arm 314 to retract from the LLM 14 (step S14), and then ends the process.

[0090] Fig. 13 is a flowchart showing an example of the process flow of the substrate transfer method according to the embodiment. Fig. 13 illustrates an example in which an unprocessed substrate W1 and a processed substrate W2 are transferred between the LLM 14 and the VTM 11a as shown in Figs. 9A to 9H.

[0091] In the LLM 14, the unprocessed substrate W1 is placed on the mounting part 145. The lower arm 214 of the robot arm 12a supports the processed substrate W2.

[0092] The control device 100 controls the LLM 14 and gate valves 142, 143 to close the gate valves 142, 143 and reduce the pressure inside the LLM 14 to switch to a reduced pressure state, and opens the gate valve 142 when a predetermined reduced pressure state is reached (step S20).

[0093] The control device 100 controls the robot arm 12a to cause the upper arm 213 and the lower arm 214 to enter the LLM 14 (step S21). When the upper arm 213 and the lower arm 214 enter the LLM 14, the sensor 122 outputs sensing information to the control device 100. The control device 100 identifies the placement position of the processed substrate W2 on the lower arm 214 based on the sensing information obtained from the sensor 122 and the position information of the lower arm 214 of the robot arm 12a.

[0094] The control device 100 determines whether the position of the processed substrate W2 on the lower arm 214 is displaced by an amount equal to or greater than the allowable value (step S22).

[0095] If the positional deviation is smaller than the allowable value (step S22: No), the control device 100 controls the robot arm 12a to transport the processed substrate W2 on the lower arm 214 to a position above a predetermined placement position with respect to the lift pins 141 (step S23). The control device 100 controls the robot arm 12a to raise the upper arm 213 and the lower arm 214, and the unprocessed substrate W1 placed on the placement part 145 is lifted and supported by the upper arm 213 (step S24).

[0096] On the other hand, if the positional deviation is equal to or greater than the allowable value (step S23: Yes), the control device 100 controls the robot arm 12a to move the upper arm 213 to a position where there is no positional deviation relative to the unprocessed substrate W1 placed on the receiver 145 (step S25). The control device 100 controls the robot arm 12a to raise the upper arm 213 and the lower arm 214, and the upper arm 213 lifts and supports the unprocessed substrate W1 placed on the receiver 145 (step S26). Then, the control device 100 controls the robot arm 12a to move the lower arm 214 in accordance with the positional deviation while the unprocessed substrate W1 is lifted, thereby correcting the position of the processed substrate W2 relative to the lift pins 141 (step S27). For example, the control device 100 controls the robot arm 12a to transport the processed substrate W2 on the lower arm 214 to a position above a predetermined placement position relative to the lift pins 141.

[0097] The controller 100 controls the LLM 14 to raise the lift pins 141, and the processed substrate W2 supported by the lower arm 214 is lifted and supported by the lift pins 141 (step S28). The controller 100 controls the robot arm 12a to retract the upper arm 213 and the lower arm 214 from the LLM 14 (step S29), thereby completing the process.

[0098] As described above, in the substrate transfer method according to the embodiment, the robot arm 12 (transfer mechanism) supporting the substrate W2 (second substrate) on the lower arm 214 (lower fork) enters the LLM 14 and buffer chamber 19 (buffer chamber) on which the substrate W1 (first substrate) is placed on the placement units 145 and 195, and the upper arm 213 (upper fork) lifts the substrate W1 placed on the placement units 145 and 195 (steps S21, S23, and S24). With the substrate W1 lifted by the upper arm 213, the multiple lift pins 141 and 191 are raised, and the substrate W2 supported by the lower arm 214 is lifted by the multiple lift pins 141 and 191 (step S28). With the substrate W2 lifted by the multiple lift pins 141 and 191, the robot arm 12 retreats from the LLM 14 and buffer chamber 19 (step S29). As a result, the substrate transfer method according to the embodiment can reduce the time required to exchange the substrate W1 with the substrate W2.

[0099] Furthermore, in the substrate transfer method according to the embodiment, when the placement position of substrate W2 on the lower arm 214 is misaligned, the robot arm 12 is moved to a position where there is no misalignment with respect to the substrate W1 placed on the placement units 145, 195, and then the substrate W1 is lifted by the upper arm 213 (steps S25, S26). In the substrate transfer method, with the substrate W1 lifted by the upper arm 213, the robot arm 12 is moved in accordance with the misalignment to correct the position of the substrate W2 with respect to the plurality of lift pins 141, 191, and then the plurality of lift pins 141, 191 are raised (steps S27, S28). In this way, the substrate transfer method according to the embodiment can exchange substrates W1 and W2 without misalignment of substrate W1 and by correcting the misalignment of substrate W2.

[0100] Furthermore, in the substrate transport method according to the embodiment, if the position of the substrate W2 on the lower arm 214 is misaligned by more than the allowable value, the robot arm 12 is moved to a position where there is no misalignment with respect to the substrate W1 placed on the mounting units 145, 195, and then the substrate W1 is lifted by the upper arm 213 (steps S25, S26). Then, in the substrate transport method, with the substrate W1 lifted by the upper arm 213, the robot arm 12 is moved in accordance with the misalignment to correct the position of the substrate W2 with respect to the plurality of lift pins 141, 191, and then the plurality of lift pins 141, 191 are raised (steps S27, S28). On the other hand, in the substrate transport method, if the positional misalignment of the substrate W2 on the lower arm 214 is less than the allowable value, the robot arm 12 is moved to a position where there is no misalignment with respect to the plurality of lift pins 141, 191 on the lower arm 214, and then the substrate W1 is lifted by the upper arm 213 (steps S23, S24). Then, in the substrate transfer method, while substrate W1 is lifted by upper arm 213, multiple lift pins 141, 191 are raised without changing the position of lower arm 214 (step S28). As a result, in the substrate transfer method according to the embodiment, if the position of substrate W2 on lower arm 214 is misaligned by more than a tolerance, substrate W1 can be exchanged with substrate W2 without misalignment and by correcting the misalignment of substrate W2. Furthermore, if the position of substrate W2 on lower arm 214 is less than the tolerance, substrate W1 can be quickly exchanged with substrate W2.

[0101] Furthermore, in the substrate transfer method according to the embodiment, if the placement position of the substrate W2 on the lower arm 214 is misaligned by an amount equal to or greater than the tolerance, the robot arm 12 is moved by the amount of the misalignment to correct the position of the substrate W2 relative to the plurality of lift pins 141, 191 (step S27). In this way, the substrate transfer method according to the embodiment corrects the misalignment of the substrate W2, enabling the substrate W1 and substrate W2 to be quickly exchanged.

[0102] Furthermore, in the substrate transfer method according to the embodiment, when the placement position of the substrate W2 on the lower arm 214 is misaligned, the robot arm 12 is moved in accordance with the misalignment to correct the position of the substrate W2 relative to the plurality of lift pins 141, 191, and then the substrate W1 placed on the placement units 145, 195 is lifted by the upper arm 213. As a result, in the substrate transfer method according to the embodiment, although a positional misalignment that is smaller than the initial positional misalignment of the substrate W2 occurs in the substrates W1 and W2, the substrates W1 and W2 can be quickly replaced.

[0103] Furthermore, in the substrate transfer method according to the embodiment, when the placement position of the substrate W2 on the lower arm 214 is misaligned by more than the tolerance, the robot arm 12 is moved to a position where the misalignment of the substrate W2 with respect to the plurality of lift pins 141, 191 is smaller than the tolerance, and then the substrate W1 placed on the placement units 145, 195 is lifted by the upper arm 213. As a result, in the substrate transfer method according to the embodiment, although a smaller misalignment occurs in the substrates W1 and W2 than the initial misalignment of the substrate W2, the substrates W1 and W2 can be quickly replaced while reducing the misalignment.

[0104] Furthermore, in the substrate transfer method according to the embodiment, the robot arm 12, 150, with the substrate W1 supported by the upper arm 213, 313, enters the LLM 14 and buffer chamber 19, where the substrate W2 is supported by the raised plurality of lift pins 141, 191, and then lowers the plurality of lift pins 141, 191 to place the substrate W2 on the lower arm 214, 314 (steps S11, S12). In the substrate transfer method, with the substrate W2 placed on the lower arm 214, 314, the substrate W1 supported by the upper arm 213, 313 is placed on the placement part 145, 195 (step S13). In the substrate transfer method, with the substrate W2 placed on the lower arm 214, 314, the robot arm 12, 150 retreats from the LLM 14 and buffer chamber 19 (step S14). As a result, the substrate transfer method according to the embodiment can shorten the time required to exchange the substrate W1 and substrate W2.

[0105] In the substrate transport method according to the embodiment, substrate W1 is a substrate W before a predetermined process (e.g., substrate processing) is performed, and substrate W2 is a substrate W after the predetermined process is performed. Since the unprocessed substrate W1 is transported above the processed substrate W2, it is possible to prevent particles that have fallen from the processed substrate W2 from adhering to the unprocessed substrate W1.

[0106] Although the embodiments have been described above, the disclosed embodiments should be considered to be illustrative in all respects and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the claims.

[0107] For example, in the above embodiment, the substrate W is a semiconductor wafer, but is not limited to this. The substrate may be any substrate, such as a glass substrate.

[0108] Furthermore, in the above embodiment, an example was described in which, when the placement position of the processed substrate W2 on the lower arm 214 is misaligned, the misalignment is corrected when exchanging the unprocessed substrate W1 for the processed substrate W2 between the LLM 14 and the VTM 11a. However, this is not limited to this. When the placement position of the substrate W is misaligned, the substrate processing system 1 may transport the misaligned substrate W to a temporary holder provided in an empty PM 13 or the VTMs 11a and 11b, temporarily place the substrate W thereon, align it, and transport the aligned substrate W. For example, when the placement position of the processed substrate W2 on the lower arm 214 is misaligned by more than a tolerance, the substrate processing system 1 may align the substrate W2 and transport the aligned substrate W2. This substrate transport method in which the substrate is temporarily placed, aligned, and then transported is referred to as the third transport method. Furthermore, if the position of the processed substrate W2 on the lower arm 214 is misaligned by more than a tolerance, the substrate processing system 1 may transport the processed substrate W2 and the unprocessed substrate W1 separately from the LLM 14 and buffer chamber 19 without exchanging them using the substrate transport method described above. For example, the substrate processing system 1 may remove one of the substrates W1 and W2 from the LLM 14 and buffer chamber 19 and then place the other. For example, the substrate processing system 1 may exchange the unprocessed substrate W1 and the processed substrate W2 by having the robot arm 12a or the robot arm 150 enter the LLM 14 twice, removing one of the substrates W1 and W2 during the first entry and then placing the other during the second entry. This substrate transport method in which the robot arm 150 enters the LLM 14 twice is hereinafter referred to as a fourth transport method. The substrate processing system 1 may switch the substrate transport method depending on the throughput required for transporting the substrates W1 and W2 and the allowable amount of misalignment. For example, the substrate processing system 1 determines whether the position of the processed substrate W2 on the lower arm 214 is misaligned by an amount equal to or greater than a tolerance. If the misalignment is smaller than the tolerance, the substrate processing system 1 may exchange the unprocessed substrate W1 for the processed substrate W2 by performing steps S23 and S24 of the substrate transport method in FIG. 12 described above.Furthermore, when the positional deviation is equal to or greater than the allowable value, the substrate processing system 1 may select and execute an appropriate substrate transfer method from the first to fourth transfer methods described above based on the amount of positional deviation and the allowable transfer time. [Explanation of symbols]

[0109] 1. Substrate Processing System 10 Processing system main body 11, 11a, 11b Vacuum transfer chamber (VTM) 12, 12a, 12b, 150 Robot Arm 13 Process Module (PM) 14 Load Lock Module (LLM) 15 EFEM 16 Loading Port (LP) 19 Buffer Chamber 100 control device 140, 190 stages 141, 191 Lift pins 145, 145a, 145b, 195, 195a, 195b placing portion 200, 300 arm section 211, 311 First Arm 212, 312 Second Arm 213, 313 Third arm, upper arm 214, 314 3rd arm, lower arm 230, 330 fork 231, 331 Support part W, W1, W2 board

Claims

1. a transfer chamber provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate; a buffer chamber or a load lock module connected to the transfer chamber, the buffer chamber or the load lock module having a mounting portion on which the substrate can be mounted by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate; A substrate transport method for a transport device having a first step of inserting the transport mechanism, with the second fork supporting the second substrate, into the buffer chamber or the load lock module in which a first substrate has been placed on either the placement section or the pins, and supporting the first substrate placed on either the placement section or the pins with the first fork; a second step of placing the second substrate supported by the second fork on the other of the placement portion and the pins while the first substrate is supported by the first fork; a third step of causing the transport mechanism to withdraw from the buffer chamber or the load lock module in a state in which the second substrate is placed on the other of the placement portion and the pins; and In the first step, if the arrangement position of the second substrate on the second fork is misaligned, the transport mechanism is moved to a position where there is no misalignment with respect to the first substrate placed on either the placement section or the pins, and then the first substrate is supported by the first fork; In the second step, while the first fork is supporting the first substrate, the transport mechanism is moved in accordance with the positional deviation to correct the position of the second substrate relative to the other of the placement unit and the pins, and then the second substrate is placed on the other of the placement unit and the pins. Substrate transport method.

2. In the first step, if the position of the second substrate on the second fork is misaligned by an allowable value or more, the transport mechanism is moved to a position where there is no misalignment with the first substrate placed on either the placement section or the pins, and then the first substrate is lifted by the first fork; if the positional misalignment of the second substrate on the second fork is less than the allowable value, the transport mechanism is moved to a position where there is no misalignment with the other of the placement section or the pins, and then the first substrate is lifted by the first fork; In the second step, when the position of the second substrate on the second fork is misaligned by an allowable value or more, the first substrate is lifted by the first fork, the transport mechanism is moved in accordance with the misalignment to correct the position of the second substrate relative to the other of the placement section and the pins, and then the second substrate is placed on the other of the placement section and the pins; and when the positional misalignment of the second substrate on the second fork is less than the allowable value, the first substrate is lifted by the first fork, and the second substrate is placed on the other of the placement section and the pins without changing the position of the second fork. The substrate transfer method according to claim 1 .

3. In the second step, when the arrangement position of the second substrate on the second fork is deviated by an allowable value or more, the transport mechanism is moved by an amount corresponding to the positional deviation to correct the position of the second substrate relative to the other of the placement section and the pins. The substrate transfer method according to claim 1 .

4. a transfer chamber provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate; a buffer chamber or a load lock module connected to the transfer chamber, the buffer chamber or the load lock module having a mounting portion on which the substrate can be mounted by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate; A substrate transport method for a transport device having a first step of inserting the transport mechanism, with the second fork supporting the second substrate, into the buffer chamber or the load lock module in which a first substrate has been placed on either the placement section or the pins, and supporting the first substrate placed on either the placement section or the pins with the first fork; a second step of placing the second substrate supported by the second fork on the other of the placement portion and the pins while the first substrate is supported by the first fork; a third step of causing the transport mechanism to withdraw from the buffer chamber or the load lock module in a state in which the second substrate is placed on the other of the placement portion and the pins; and In the first step, when the arrangement position of the second substrate on the second fork is misaligned, the transport mechanism is moved in accordance with the misalignment to correct the position of the second substrate relative to the other of the placement section and the pins, and then the first substrate placed on either the placement section or the pins is supported by the first fork. Substrate transport method.

5. In the first step, when the position of the second substrate on the second fork is misaligned by an allowable value or more, the transport mechanism is moved to a position where the misalignment of the second substrate with respect to the pin is smaller than the allowable value, and then the first substrate placed on the placement section is lifted by the first fork. The substrate transport method according to claim 4 .

6. a transfer chamber provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate; a buffer chamber or a load lock module connected to the transfer chamber, the buffer chamber or the load lock module having a mounting portion on which the substrate can be mounted by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate; A substrate transport method for a transport device having a first step of inserting the transport mechanism, with the second fork supporting the second substrate, into the buffer chamber or the load lock module in which a first substrate has been placed on either the placement section or the pins, and supporting the first substrate placed on either the placement section or the pins with the first fork; a second step of placing the second substrate supported by the second fork on the other of the placement portion and the pins while the first substrate is supported by the first fork; a third step of causing the transport mechanism to withdraw from the buffer chamber or the load lock module in a state in which the second substrate is placed on the other of the placement portion and the pins; and the first substrate is a substrate before being subjected to a predetermined process, The second substrate is a substrate after a predetermined process has been performed. Substrate transport method.

7. a transfer chamber provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate; a buffer chamber or a load lock module connected to the transfer chamber, the buffer chamber or the load lock module having a mounting portion on which the substrate can be mounted by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate; A substrate transport method for a transport device having a step of moving the transport mechanism, with the first substrate supported by the first fork, into the buffer chamber or the load lock module in which a second substrate is supported by either the placement section or the pins, and placing the second substrate on the second fork; placing the first substrate supported by the first fork on the other of the placement portion and the pins while the second substrate is placed on the second fork; moving the transport mechanism out of the buffer chamber or the load lock module with the second substrate placed on the second fork; and the first substrate is a substrate before being subjected to a predetermined process, The second substrate is a substrate after a predetermined process has been performed. Substrate transport method.

8. a transfer chamber provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate; a buffer chamber or a load lock module connected to the transfer chamber, the buffer chamber or the load lock module having a mounting portion on which the substrate can be mounted by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate; a control unit that controls the transport mechanism, with the second substrate supported by the second fork, to enter the buffer chamber or the load lock module in which a first substrate has been placed on either the placement unit or the pins, support the first substrate placed on either the placement unit or the pins with the first fork, place the second substrate supported by the second fork on the other of the placement unit or the pins while the first substrate is supported by the first fork, and exit the transport mechanism from the buffer chamber or the load lock module in a state in which the second substrate has been placed on the other of the placement unit or the pins; and When the placement position of the second substrate on the second fork is misaligned, the control unit moves the transport mechanism to a position where there is no misalignment with respect to the first substrate placed on either the placement unit or the pins, then supports the first substrate with the first fork, and while the first substrate is supported by the first fork, moves the transport mechanism in accordance with the misalignment to correct the position of the second substrate with respect to the other of the placement unit and the pins, and then controls to place the second substrate on the other of the placement unit and the pins. Substrate transport device.

9. a transfer chamber provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate; a buffer chamber or a load lock module connected to the transfer chamber, the buffer chamber or the load lock module having a mounting portion on which the substrate can be mounted by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate; a control unit that controls the transport mechanism, with the second substrate supported by the second fork, to enter the buffer chamber or the load lock module in which a first substrate has been placed on either the placement unit or the pins, support the first substrate placed on either the placement unit or the pins with the first fork, place the second substrate supported by the second fork on the other of the placement unit or the pins while the first substrate is supported by the first fork, and exit the transport mechanism with the second substrate placed on the other of the placement unit or the pins; and When the placement position of the second substrate on the second fork is misaligned, the control unit moves the transport mechanism in accordance with the misalignment to correct the position of the second substrate with respect to the other of the placement unit and the pins, and then controls the first fork to support the first substrate placed on either the placement unit or the pins. Substrate transport device.

10. a transfer chamber provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate; a buffer chamber or a load lock module connected to the transfer chamber, the buffer chamber or the load lock module having a mounting portion on which the substrate can be mounted by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate; a control unit that controls the transport mechanism, with the second substrate supported by the second fork, to enter the buffer chamber or the load lock module in which a first substrate has been placed on either the placement unit or the pins, support the first substrate placed on either the placement unit or the pins with the first fork, place the second substrate supported by the second fork on the other of the placement unit or the pins while the first substrate is supported by the first fork, and exit the transport mechanism from the buffer chamber or the load lock module in a state in which the second substrate has been placed on the other of the placement unit or the pins; and the first substrate is a substrate before being subjected to a predetermined process, The second substrate is a substrate after a predetermined process has been performed. Substrate transport device.

11. a transfer chamber provided with a transfer mechanism having a first fork and a second fork capable of supporting a substrate; a buffer chamber or a load lock module connected to the transfer chamber, the buffer chamber or the load lock module having a mounting portion on which the substrate can be mounted by contacting a portion of the substrate and a plurality of pins that can be raised and lowered to support the substrate; a control unit that controls the transport mechanism, with the first substrate supported by the first fork, to enter the buffer chamber or the load lock module in which a second substrate is supported by either the placement unit or the pins, place the second substrate on the second fork, place the first substrate supported by the first fork on the other of the placement unit or the pins with the second substrate placed on the second fork, and exit the transport mechanism from the buffer chamber or the load lock module with the second substrate placed on the second fork; and the first substrate is a substrate before being subjected to a predetermined process, The second substrate is a substrate after a predetermined process has been performed. Substrate transport device.

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