Power conversion device

Abstract

To provide a power conversion device which is capable of improving vibration resistance of a control board and can be downsized.SOLUTION: In a power conversion device 100, a board support part 31 of a support plate 3 which supports a control board 2 is disposed so as to overlap at least a portion of a specific electronic component 21 in a view in a normal direction of a component mounting surface 2a of the control board 2. Thus, vibration of the specific electronic component 21 can be effectively reduced, and the specific electronic component 21 can be prevented from being broken. Further, since the support plate 3 is an insulator, an insulation distance of the control board 2, electronic components, a connection terminal 12 of a semiconductor module 1, etc., is not needed, a degree of freedom in arrangement is high, and an area is easily secured. Thus, rigidity and vibration resistance of the control board 2 can be improved, and downsizing of the power conversion device 100 can be attained.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a power conversion device. [Background technology]

[0002] Electric motors are used as a power source in environmentally friendly vehicles such as battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), and plug-in hybrid electric vehicles (PHEVs). These vehicles are equipped with a power conversion device including an inverter that converts direct current (DC) supplied from the battery into alternating current (AC) to drive the electric motor (three-phase AC motor).

[0003] An inverter includes a semiconductor module equipped with a semiconductor switching element for power conversion that converts direct current to alternating current, a drive circuit for the semiconductor module, a control circuit that controls them, a smoothing capacitor for current smoothing, etc. In recent years, as the output of electric motors has increased, there has been a demand for higher output from power conversion devices, and the size of semiconductor modules has tended to increase. Therefore, miniaturization of power conversion devices has become an important issue from the viewpoint of mountability in vehicles.

[0004] Furthermore, power conversion devices tend to be mounted on or integrated with electric motors or transmissions, and are therefore subject to vibrations not only from the road surface when the vehicle is in operation, but also from the operation of the engine, electric motor, and transmission, so high vibration resistance is required. In particular, relatively large electronic components mounted on control boards, such as transformers and electrolytic capacitors, are prone to damage due to vibrations amplified by the housing and control board, making it necessary to improve the vibration resistance of control boards.

[0005] As a prior example of miniaturization or improved vibration resistance of a power converter, Patent Document 1 discloses a power converter in which a circuit board on which a drive circuit and a control circuit are arranged is fixed to a highly rigid cover via a support structure such as a busbar assembly. Patent Document 2 discloses a power converter in which an electronic board on which electronic components are mounted and a terminal block supporting the electronic board are fastened together so that the vibration mode of the electronic board during resonance is a vibration mode that can prevent breakage of the electronic components. Patent Document 3 discloses an inverter device in which a vibration-absorbing elastic resin adhesive layer is provided between the underside of a CPU board provided on the top surface of an inverter module and a power system metal board. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 5506749 [Patent Document 2] Patent No. 6657457 [Patent Document 3] Patent No. 5412098 Summary of the Invention [Problem to be solved by the invention]

[0007] In Patent Document 1, a busbar assembly is disposed below the circuit board as a support structure. However, if the support structure is made of a conductor, the need for an insulating distance from the surroundings limits the degree of freedom in placement, making it difficult to achieve both improved vibration resistance and compactness. In other words, if the area of ​​the support structure is increased to ensure rigidity, the power conversion device will become larger in size to ensure an insulating distance from the surroundings. On the other hand, if the area of ​​the support structure is reduced to ensure an insulating distance from the surroundings, the rigidity will decrease and high vibration resistance will not be achieved. Furthermore, providing multiple support points to ensure mechanical strength sufficient to withstand the vibration load of a vehicle increases the size of the circuit board and power conversion device, which is a problem.

[0008] In Patent Document 2, it is necessary to identify in advance the vibration mode that will cause a break in the electronic component, which requires a lot of effort. Furthermore, since the vibration mode changes depending on the dimensional variations of the contact points, the vibration mode that can prevent the occurrence of a break needs to be sufficiently separated in frequency from the problematic vibration mode. This requires narrowing the fastening pitch between the electronic board and the terminal block to increase the number of fastening points, which poses a problem of increasing the size of the electronic board and power conversion device.

[0009] Furthermore, in Patent Document 3, when the distance between the CPU board and the power metal board increases, the amount of adhesive increases, which requires time for curing, resulting in reduced workability. Furthermore, the adhesive complicates disassembly and reduces rebuildability. Furthermore, if the adhesive comes into contact with electronic components on the backside of the CPU board, the difference in the linear expansion coefficients of the CPU board and the adhesive during temperature changes can cause thermal stress on the electronic components, potentially damaging them.

[0010] The present disclosure discloses a technique for solving the above-mentioned problems, and aims to provide a power conversion device that can improve the vibration resistance of a control board and can be made smaller. [Means for solving the problem]

[0011] The power conversion device of the present disclosure comprises a semiconductor module having a semiconductor switching element, a control board on which an electronic circuit that controls the operation of the semiconductor module is arranged, electronic components mounted on one side of the control board, and an insulating support plate arranged opposite the other side of the control board, the support plate having a board support portion that protrudes toward the other side of the control board and supports the other side, and the board support portion is arranged so as to overlap at least a portion of the electronic components when viewed in the normal direction of the one side of the control board. [Effects of the Invention]

[0012] According to the power conversion device of the present disclosure, by arranging the board support portion of the support plate that supports the control board so that it overlaps at least a part of the electronic components when viewed in the normal direction of one surface of the control board, the vibration resistance of the control board can be improved and the vibration of the electronic components can be effectively reduced. In addition, because the support plate is an insulator, an insulating distance from the control board is not required, which increases the degree of freedom in arrangement and enables miniaturization. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view showing the appearance of a power conversion device according to a first embodiment. [Figure 2] 1 is a cross-sectional view showing a power conversion device according to a first embodiment. [Figure 3] 1 is an exploded perspective view showing the configuration of a power conversion device according to a first embodiment. [Figure 4] 3 is a diagram illustrating the arrangement of a substrate support part in the power converter according to the first embodiment. FIG. [Figure 5] 5A and 5B are diagrams illustrating another example of arrangement of the substrate support parts in the power converter according to the first embodiment. [Figure 6] 10 is a diagram illustrating yet another example of arrangement of the substrate support parts in the power converter according to the first embodiment. FIG. [Figure 7] FIG. 10 is an exploded perspective view showing the configuration of a power conversion device according to a second embodiment. [Figure 8] FIG. 10 is an exploded perspective view showing another configuration of the power conversion device according to the second embodiment. [Figure 9] FIG. 10 is an exploded perspective view showing still another configuration of the power conversion device according to the second embodiment. [Figure 10] FIG. 11 is an exploded perspective view showing the configuration of a power conversion device according to a third embodiment. [Figure 11] FIG. 10 is a perspective view showing the appearance of a power conversion device according to a fourth embodiment. [Figure 12] FIG. 10 is a cross-sectional view showing a power conversion device according to a fourth embodiment. [Figure 13] FIG. 10 is an exploded perspective view showing the configuration of a power conversion device according to a fourth embodiment. [Figure 14] FIG. 10 is a perspective view showing the appearance of a power conversion device according to a fifth embodiment. [Figure 15] FIG. 10 is a cross-sectional view showing a power conversion device according to a fifth embodiment. [Figure 16] FIG. 10 is a cross-sectional view showing a power conversion device according to a fifth embodiment. [Figure 17] FIG. 10 is an exploded perspective view showing the configuration of a power conversion device according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Embodiment 1 A power conversion device according to a first embodiment will be described below with reference to the drawings. Fig. 1 is a perspective view showing the appearance of the power conversion device according to the first embodiment, Fig. 2 is a cross-sectional view taken at the position indicated by AA in Fig. 1 and seen from the direction indicated by arrow X (hereinafter referred to as X direction), and Fig. 3 is an exploded perspective view showing the configuration of the power conversion device according to the first embodiment. In each drawing, the same or corresponding parts are denoted by the same reference numerals.

[0015] The power conversion device 100 according to the first embodiment is an inverter or converter mounted on, for example, a BEV, an HEV, or the like. The inverter converts a direct current (DC) of a battery into an alternating current (AC) to drive a three-phase AC motor. The converter converts an AC current generated by a generator into a direct current to charge the battery. The power conversion device 100 also converts voltage using a step-up converter and a step-down converter to exchange energy between a low-voltage battery and a high-voltage battery. However, the use of the power conversion device 100 is not particularly limited, and the power conversion device 100 can be used for various purposes other than in-vehicle use.

[0016] Each component of the power conversion device 100 will be briefly described with reference to Figures 1 to 3. In the following description, the side viewed from the direction indicated by arrow Z in Figure 1 (hereinafter referred to as the Z direction) will be referred to as the top side of the power conversion device, and the side viewed from the opposite direction to the Z direction will be referred to as the bottom side of the power conversion device. The Z direction is the normal direction to the board surface of the control board 2, and the Z direction and the X direction are perpendicular to each other.

[0017] As shown in Figures 1 and 2, the power conversion device 100 includes a semiconductor module 1 having a semiconductor switching element (not shown), a control board 2 on which an electronic circuit (not shown) that controls the operation of the semiconductor module 1 is arranged, specific electronic components 21a and 21b which are electronic components mounted on one side of the control board 2, an insulating support plate 3 arranged opposite the other side of the control board 2, a spacer 4, a housing 5, and fastening screws 6.

[0018] The housing 5, semiconductor module 1, support plate 3, and control board 2 are arranged in this order from the underside of the power conversion device 100, stacked in the Z direction. The power conversion device 100 further includes a smoothing capacitor, a boost reactor, a terminal block that connects the boost reactor and the semiconductor module 1, a cover that covers the entire power conversion device (none of which are shown), and the like.

[0019] 3, the semiconductor module 1 has a main body 11 incorporating a semiconductor switching element, a connection terminal 12 serving as a first connection terminal, and a second connection terminal (not shown). The semiconductor switching element constitutes an inverter, a converter, an electronic relay, etc. of the power conversion device 100.

[0020] The connection terminals 12 extend in the normal direction (i.e., Z direction) of the board surface of the control board 2, and are inserted into the through holes 22 of the control board 2 to electrically connect the semiconductor switching elements to the control board 2. The connection terminals 12 transmit signals indicating the temperature, operating state, abnormal state, etc. of the semiconductor module 1 from the semiconductor module 1 to the control board 2, and also transmit control signals for controlling the semiconductor module 1 from the control board 2 to the semiconductor module 1.

[0021] The second connection terminal electrically connects the semiconductor switching element and the smoothing capacitor. The direct current of the battery passes through the smoothing capacitor and is transmitted to the semiconductor module 1 by the second connection terminal. Note that, although the present embodiment shows a configuration including four connection terminals 12, the number of connection terminals 12 is not limited to this.

[0022] The control board 2 has an electronic circuit that controls the operation of the semiconductor module 1, and monitors and controls the drive, temperature, operating state, abnormal state, etc. of the semiconductor module 1. The control board 2 also has through holes 22 into which the connection terminals 12 of the semiconductor module 1 are inserted. A plurality of specific electronic components 21a, 21b (collectively referred to as specific electronic components 21) are mounted on one surface of the control board 2 (hereinafter referred to as the component mounting surface 2a). In this embodiment, the component mounting surface 2a of the control board 2 is arranged on the upper surface side of the power conversion device 100.

[0023] The specific electronic component 21 is a relatively large component whose size or weight is equal to or greater than a predetermined value. That is, the specific electronic component 21 is a component that is particularly susceptible to damage due to vibration, and specifically, is a transformer, an electrolytic capacitor, or the like. In this embodiment, a configuration including two specific electronic components 21a and 21b is shown, but the number of specific electronic components 21 is not limited to this. Furthermore, electronic components (not shown) other than the specific electronic component 21 are also mounted on the component mounting surface 2a of the control board 2.

[0024] The insulating support plate 3 is disposed opposite the other surface (hereinafter referred to as the supported surface 2b) of the control board 2. As shown in Fig. 3, the support plate 3 includes a main body 30, board support portions 31a and 31b (collectively referred to as board support portions 31), and screw holes 32 into which fastening screws 6 are inserted.

[0025] The spacer 4 is a structure for mounting the control board 2 and the support plate 3 on the housing 5. The spacer 4 is fixed to the housing 5, and the control board 2 and the support plate 3 are fixed to the spacer 4 with fastening screws 6. In this embodiment, a configuration including six spacers 4 has been shown, but the number of spacers 4 is not limited to this.

[0026] The semiconductor module 1 is mounted on the upper surface of the housing 5, and the main body 11 of the semiconductor module 1 is thermally connected to the housing 5. The housing 5 is cooled by a refrigerant such as water or ethylene glycol liquid, and discharges heat generated from the semiconductor switching elements and electronic circuits when the semiconductor module 1 is operated to the outside. This makes it possible to suppress a temperature rise in the semiconductor module 1, and to operate the power conversion device 100 efficiently.

[0027] The following describes the configuration and function of the support plate 3 in the power conversion device 100. As described above, a plurality of specific electronic components 21a, 21b are arranged at intervals on the component mounting surface 2a of the control board 2. The specific electronic components 21 are mounted on the control board 2 by being soldered to solder pads (not shown) formed on the component mounting surface 2a of the control board 2.

[0028] 3, the support plate 3 has a flat main body 30 and board support portions 31a and 31b that protrude further toward the supported surface 2b of the control board 2 than the main body 30 and support the supported surface 2b. The board support portion 31 is arranged so as to overlap at least a portion of the specific electronic component 21 when viewed in the normal direction of the component mounting surface 2a of the control board 2 (i.e., the Z direction).

[0029] In other words, at least a portion of the board support portion 31 is arranged so as to overlap with a projected area of ​​the specific electronic component 21 mounted on the component mounting surface 2a of the control board 2, when viewed in the normal direction of the component mounting surface 2a of the control board 2. With this configuration, the amplitude of the portion of the control board 2 where the specific electronic component 21 is mounted is suppressed.

[0030] The tops of the board support parts 31 are flat and abut against the supported surface 2b of the control board 2. In this embodiment, the shape of the tops of the board support parts 31 is rectangular, but the shape of the board support parts 31 is not particularly limited and may be a complex shape that can accommodate multiple electronic components. In addition, an adhesive (not shown) may be placed between the control board 2 and the board support parts 31.

[0031] The board support portion 31 is arranged corresponding to at least the specific electronic component 21, and does not need to be arranged corresponding to all electronic components mounted on the control board 2. However, the board support portion 31 may be arranged corresponding to electronic components other than the specific electronic component 21.

[0032] Furthermore, the board support portion 31 is disposed in correspondence with an area including the main body of the specific electronic component 21 and the solder pads on which the specific electronic component 21 is mounted. That is, the board support portion 31 is disposed so as to overlap with part or all of the area including the specific electronic component 21 and the solder pads when viewed in the normal direction of the component mounting surface 2a of the control board 2. The area over which the board support portion 31 overlaps with the specific electronic component 21 and the solder pads may be equal to or greater than the minimum range determined by factors such as the type and position of the specific electronic component 21, the allowable vibration, and the acceleration and amplitude of the control board 2 when vibrating.

[0033] In this embodiment, the main body 30 of the support plate 3 is a long, narrow, rectangular flat plate whose area is about one-third that of the control board 2, but the area and shape of the main body 30 are not particularly limited. Increasing the area and thickness of the main body 30 increases the rigidity of the support plate 3 and improves vibration resistance, but this also increases weight, so larger is not necessarily better. The area and thickness of the main body 30 need only be at least the minimum area and thickness necessary to obtain rigidity and vibration resistance sufficient to withstand the vibration load of the vehicle.

[0034] Furthermore, the main body 30 may have a complex shape with holes, notches, curved portions, etc., as needed, for example, to avoid the connection terminals 12. Furthermore, the main body 30 does not have to be flat, and may be inclined or curved. For example, the board support portion 31 may be formed by protruding the central portion of the main body 30 toward the control board 2 more than the peripheral edge portion.

[0035] Furthermore, the substrate support portion 31 is formed on the main body portion 30, and the thickness of the support plate 3 is greater in the portion with the substrate support portion 31 than in the portion without the substrate support portion 31. The substrate support portion 31 may be a separate component joined to the main body portion 30, or may be formed integrally with the main body portion. Furthermore, the main body portion 30 and the substrate support portion 31 may be formed integrally so that the thickness of the support plate 3 is the same in the portion with and without the substrate support portion 31.

[0036] The frequency of the first mode of the eigenvalue of the vibration of the support plate 3 is set to be higher than the frequency of the first mode of the eigenvalue of the vibration of the control board 2. When the support plate 3, which has a high frequency of the first mode of the eigenvalue of the vibration, abuts against the control board 2, which has a low frequency of the first mode of the eigenvalue of the vibration, the frequency of the first mode of the eigenvalue of the control board 2 and the support plate 3 when viewed as a single body becomes higher, thereby reducing the vibration received by the specific electronic component 21. The material, cross-sectional shape, etc. of the support plate 3 are determined so that the desired frequency can be achieved.

[0037] The material of the support plate 3 is not particularly limited, but is required to be insulating and highly rigid, and is preferably a resin with excellent moldability. Examples of insulating resins include thermoplastic resins such as general-purpose plastics such as polyethylene and polypropylene, engineering plastics such as polyamide (nylon) and polyacetal (POM), super engineering plastics such as polyether ether ketone (PEEK), polyphenylene sulfide (PPS), and polytetrafluoroethylene (PTFE), and thermosetting resins such as phenol and epoxy.

[0038] 4 to 6 are top views showing examples of the arrangement of the board support portion 31, and in the figures, the support plate 3 and board support portion 31 below the control board 2 are indicated by dotted lines. Fig. 4 shows the arrangement of the board support portion 31 in the power conversion device 100, and the support plate 3 has a plurality of board support portions 31a, 31b arranged thereon, which overlap with the plurality of specific electronic components 21a, 21b, respectively, when viewed in the normal direction of the component mounting surface 2a of the control board 2. A portion of the board support portion 31a overlaps with a portion of the specific electronic component 21a, and the entire board support portion 31b overlaps with a portion of the specific electronic component 21b.

[0039] 5, board support portions 31c and 31d having a larger top area than the support plate 3 shown in Fig. 4 are arranged on the support plate 3. When viewed in the normal direction of the component mounting surface 2a of the control board 2, the board support portions 31c and 31d overlap entirely with the specific electronic components 21a and 21b, respectively.

[0040] 6, the support plate 3 is provided with a board support portion 31e that overlaps with the plurality of specific electronic components 21a, 21b when viewed in the normal direction of the component mounting surface 2a of the control board 2. In this manner, one board support portion 31e may correspond to the plurality of specific electronic components 21a, 21b. Note that, although one board support portion 31e overlaps with all of the plurality of specific electronic components 21a, 21b in the example shown in FIG. 6, one board support portion 31e may overlap with only a portion of each of the specific electronic components 21a, 21b.

[0041] As described above, according to the power conversion device 100 of the first embodiment, by providing the support plate 3 that supports the control board 2, it is possible to improve the rigidity and vibration resistance of the control board 2. Furthermore, by arranging the board support portion 31 of the support plate 3 so as to overlap at least a part of the specific electronic component 21 when viewed in the normal direction of the component mounting surface 2a of the control board 2, it is possible to suppress the amplitude of the portion of the control board 2 where the specific electronic component 21 is mounted, and to effectively reduce the vibration of the specific electronic component 21. This makes it possible to prevent damage to the specific electronic component 21 due to vibrations amplified by the housing 5 and the control board 2.

[0042] Furthermore, since the support plate 3 is an insulator, no insulation distance is required between the control board 2, electronic components, and the connection terminals 12 of the semiconductor module 1, etc., allowing for a high degree of freedom in placement, and making it possible to achieve both improved vibration resistance of the control board 2 and miniaturization of the power conversion device 100.

[0043] That is, since the degree of freedom in the arrangement of the main body portion 30 of the support plate 3 is high and it is easy to ensure the area, it is possible to ensure high rigidity while suppressing an increase in the thickness in the Z direction of the power conversion device 100. This makes it possible to increase the natural frequency of the support plate 3 and improve the vibration resistance of the control board 2. Furthermore, since the degree of freedom in the arrangement of the board support portion 31 of the support plate 3 is high, it is easy to arrange it in correspondence with the mounting location of the specific electronic component 21 with low vibration resistance.

[0044] Furthermore, because the support plate 3 is fixed to the housing 5 together with the control board 2 by the spacers 4 and fastening screws 6, there is no need to add new parts or processes to fix the support plate 3, and workability is less impaired compared to when the support plate 3 is not provided. Also, because there is no need to add new screw holes to the control board 2 for fastening the support plate 3, it is possible to avoid an increase in the size of the control board 2. Furthermore, disassembly is easy and the rebuildability is high.

[0045] On the other hand, as a comparative example, when new screw holes for fastening the support plate 3 are provided in the control board 2, it is necessary to ensure an insulating distance between the fastening screws and the connection terminals 12, electronic components, circuits, etc., which places restrictions on the arrangement of the electronic components, circuits, etc. As a result, the control board 2 becomes larger.

[0046] Furthermore, by making the frequency of the first mode of the eigenvalue in the vibration of the support plate 3 higher than the frequency of the first mode of the eigenvalue in the vibration of the control board 2, the vibration of the control board 2 is suppressed, thereby reducing the vibration of the specific electronic component 21. Furthermore, by increasing the pitch of the spacers 4 and reducing the number of fastening screws 6, the area required to ensure the insulation distance between the fastening screws 6 and the electronic circuit can be reduced, and the control board 2 can be made more compact.

[0047] Furthermore, by placing an adhesive between the control board 2 and the board support part 31, it is possible to prevent gaps from occurring between the control board 2 and the board support part 31, thereby reliably reducing vibrations of the specific electronic component 21. Furthermore, since the adhesive is placed on the supported surface 2b side of the control board 2 and does not adhere to electronic components such as the specific electronic component 21, it does not cause damage to the electronic components and reduces workability.

[0048] Embodiment 2 7 to 9 are exploded perspective views showing the configuration of a power conversion device according to embodiment 2. In this embodiment, power conversion devices 101, 102, and 103 having a different spacer structure will be described as modifications of the power conversion device 100 according to embodiment 1. Note that other configurations of the power conversion devices 101, 102, and 103 according to embodiment 2 are similar to those of the power conversion device 100 according to embodiment 1, and therefore will not be described here.

[0049] In the power conversion device 101 shown in FIG. 7, six spacers 4 are integrated into a single structure by a frame-shaped member 4a. The spacers 4 and the frame-shaped member 4a may be formed separately or integrally. This structure improves the rigidity of the spacers 4, and improves the vibration resistance of the spacers 4 and the control board 2. Furthermore, because the spacers 4 are integrated into a single structure, they can be easily attached to the housing 5, improving workability.

[0050] In the power conversion device 102 shown in Fig. 8, some (two in this case) of the spacers 4 are integrated with the support plate 3. If the outer shapes (areas) of the support plate 3 and the control board 2 are the same, all of the spacers 4 may be integrated with the support plate 3. This structure simplifies the work of attaching the support plate 3 to the housing 5, improving workability.

[0051] 9, all (six in this example) spacers 4 are integrated with the housing 5. Such a structure eliminates the need for a process for fixing the spacers 4 to the housing 5, improving workability. According to the power conversion devices 101, 102, and 103 of the second embodiment, in addition to the same effects as those of the power conversion device 100 of the first embodiment, workability is further improved.

[0052] Embodiment 3 10 is an exploded perspective view showing the configuration of a power conversion device according to embodiment 3. In this embodiment, as a modified example of the power conversion device 100 according to embodiment 1, a power conversion device 104 including a viscoelastic body 33 between a control board 2 and a support plate 3 will be described. Note that other configurations of the power conversion device 104 according to embodiment 3 are similar to those of the power conversion device 100 according to embodiment 1, and therefore will not be described here.

[0053] In the power conversion device 104, a viscoelastic body 33 is disposed between the support plate 3 and the control board 2, and the support plate 3 abuts against the supported surface of the control board 2 via the viscoelastic body 33. That is, in this embodiment, the board support portion is the viscoelastic body 33 disposed between the control board 2 and the support plate 3, and is disposed so as to overlap at least a portion of the specific electronic component 21 when viewed in the normal direction of the component mounting surface 2a of the control board 2. The viscoelastic body 33 is a member having a high damping rate, such as rubber, gel, adhesive, UV-curable liquid gasket (CIPG), or self-adhesive material.

[0054] 10, a viscoelastic body 33 is arranged as a board support portion on the main body portion 30 of the support plate 3, but similar to the first embodiment (see FIG. 3), the support plate 3 may have a board support portion 31 on the main body portion 30, and the viscoelastic body 33 may be arranged between the control board 2 and the board support portion 31. Also, an adhesive may be arranged between the control board 2 and the viscoelastic body 33 and / or between the viscoelastic body 33 and the support plate 3. Also, a spacer structure similar to that of the second embodiment may be employed in the power conversion device 104.

[0055] According to the power conversion device 104 of the third embodiment, in addition to the same effects as those of the power conversion device 100 of the first embodiment, by disposing the viscoelastic body 33 between the control board 2 and the support plate 3, the response acceleration of the control board 2 is reduced and the vibration resistance of the control board 2 is further improved. Furthermore, since the viscoelastic body 33 is disposed only at the contact points with the control board 2, the amount of viscoelastic body 33 used can be reduced, improving workability.

[0056] Embodiment 4 Fig. 11 is a perspective view showing the appearance of a power conversion device according to embodiment 4, Fig. 12 is a cross-sectional view taken at the position indicated by BB in Fig. 11 and seen from the X direction, and Fig. 13 is an exploded perspective view showing the configuration of the power conversion device according to embodiment 4. In this embodiment, as a modification of the power conversion device 100 according to embodiment 1, a power conversion device 105 will be described in which the component mounting surface 2a of the control board 2 is arranged on the lower surface side. Note that other configurations of the power conversion device 105 according to embodiment 4 are similar to those of the power conversion device 100 according to embodiment 1, and therefore description thereof will be omitted here.

[0057] 13, in the power converter 105, the component mounting surface 2a of the control board 2 is disposed opposite the semiconductor module mounting surface of the housing 5. Furthermore, an insulating support plate 3 is disposed on the upper surface of the control board 2, facing the supported surface 2b of the control board 2. That is, from the lower surface of the power converter 105, the housing 5, the semiconductor module 1, the control board 2, and the support plate 3 are disposed overlapping in the Z direction.

[0058] 12, the specific electronic component 21 is disposed in the space between the control board 2 and the housing 5. The board support portion 31 of the support plate 3 protrudes downward from the main body portion 30 to abut against the supported surface 2b of the control board 2, and is disposed so as to overlap at least a portion of the specific electronic component 21 when viewed in the normal direction of the component mounting surface 2a of the control board 2. The frequency of the first mode of the eigenvalue in the vibration of the support plate 3 is set to be higher than the frequency of the first mode of the eigenvalue in the vibration of the control board 2.

[0059] In addition, the power conversion device 105 according to this embodiment can also employ a spacer structure similar to that of the above-described embodiment 2, and can arrange the viscoelastic body 33 between the control board 2 and the support plate 3 as in the above-described embodiment 3. In addition, an adhesive may be arranged between the control board 2 and the board support portion 31.

[0060] According to the power conversion device 105 of embodiment 4, in addition to the same effects as the power conversion device 100 of embodiment 1 described above, by arranging the component mounting surface 2a of the control board 2 and the semiconductor module mounting surface of the housing 5 opposite each other, the specific electronic component 21 is arranged in the space between the control board 2 and the housing 5, thereby suppressing an increase in the thickness of the power conversion device 105 in the Z direction, and achieving miniaturization as in the other embodiments.

[0061] Embodiment 5 FIG. 14 is a perspective view showing the appearance of a power conversion device according to embodiment 5, FIG. 15 is a cross-sectional view taken at a position indicated by CC in FIG. 14 and seen from the X direction, FIG. 16 is a cross-sectional view taken at a position indicated by DD in FIG. 14 and seen from the X direction, and FIG. 17 is an exploded perspective view showing the configuration of a power conversion device according to embodiment 5.

[0062] In this embodiment, as a modification of the power conversion device 100 according to the first embodiment, a power conversion device 106 including a support plate 3a having substantially the same outer shape as the control board 2 will be described. Note that other configurations of the power conversion device 106 according to the fifth embodiment are similar to those of the power conversion device 100 according to the first embodiment, and therefore description thereof will be omitted here.

[0063] 14 and 15, the support plate 3a has substantially the same outer shape as the control board 2. Furthermore, as shown in Figures 16 and 17, the semiconductor module 1 has connection terminals 12 extending in the normal direction of the component mounting surface 2a of the control board 2, and the control board 2 has through holes 22 into which the connection terminals 12 are inserted. The support plate 3a has guide holes 34 through which the connection terminals 12 pass, at positions overlapping with the through holes 22 when viewed in the normal direction of the component mounting surface 2a of the control board 2.

[0064] In the manufacturing process of the power conversion device 106, after the support plate 3a is attached to the control board 2, the control board 2 and the support plate 3a are assembled to the housing 5 in which the semiconductor module 1 is mounted. At this time, the connection terminals 12 of the semiconductor module 1 are guided to the positions of the through holes 22 of the control board 2 by the guide holes 34 of the support plate 3a.

[0065] The support plate 3a of the power conversion device 106 according to this embodiment has a larger area than the support plate 3 (see FIG. 3) of the power conversion device 100 according to the first embodiment, and furthermore, by providing the guide holes 34, the reduction in area due to the shape for avoiding the connection terminals 12 is minimized. Therefore, if other conditions (material, plate thickness, etc.) are the same, the frequency of the first mode of the eigenvalue in the vibration of the support plate 3a will be higher than the frequency of the first mode of the eigenvalue in the vibration of the support plate 3 according to the first embodiment.

[0066] As a comparative example, if the support plate 3a, which has substantially the same outer shape as the control board 2, does not have the guide holes 34, it is necessary to form notches or the like in the support plate 3a to avoid the connection terminals 12. In this case, the area of ​​the support plate 3a is smaller than when the guide holes 34 are formed, and the rigidity and vibration resistance of the support plate 3a are reduced.

[0067] Furthermore, in the case of the support plate 3 having an outer shape smaller than that of the control board 2 as in the above-described first embodiment, the specific electronic component 21 needs to be mounted in an area overlapping with the support plate 3 when viewed in the normal direction of the component mounting surface 2a of the control board 2. In contrast, in the present embodiment, no matter where the specific electronic component 21 is mounted on the control board 2, the board support part 31 can be arranged to correspond to it, which increases the degree of freedom in arranging the specific electronic component 21.

[0068] In addition, the power conversion device 106 according to this embodiment can also employ a spacer structure similar to that of the above-described embodiment 2, and can arrange the viscoelastic body 33 between the control board 2 and the support plate 3a in the same manner as in the above-described embodiment 3. In addition, an adhesive may be arranged between the control board 2 and the board support portion 31.

[0069] According to the power conversion device 106 of embodiment 5, in addition to the same effects as the power conversion device 100 of embodiment 1 above, since the support plate 3a has approximately the same external shape as the control board 2, it has even higher rigidity than the support plate 3 of embodiment 1 above, improves vibration resistance, and increases the degree of freedom in arranging the specific electronic component 21.

[0070] Furthermore, since the support plate 3a has the guide holes 34, reduction in area due to the shape to avoid the connection terminals 12 is minimized, and it is possible to prevent a decrease in the rigidity and vibration resistance of the support plate 3a. Furthermore, since the support plate 3a has the guide holes 34, the connection terminals 12 of the semiconductor module 1 can be easily inserted into the through holes 22 of the control board 2, thereby improving productivity.

[0071] Although various exemplary embodiments and examples are described in this disclosure, the various features, aspects, and functions described in one or more embodiments are not limited to the application of a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless variations not illustrated are contemplated within the scope of the technology disclosed in this specification. For example, this includes cases where at least one component is modified, added, or omitted, and even cases where at least one component is extracted and combined with components of another embodiment.

[0072] Various aspects of the present disclosure are summarized below as appendices.

[0073] (Appendix 1) a semiconductor module having a semiconductor switching element; a control board on which an electronic circuit for controlling the operation of the semiconductor module is arranged; an electronic component mounted on one surface of the control board; a support plate made of an insulator and arranged opposite the other surface of the control board, the support plate has a board support portion that protrudes toward the other surface of the control board and supports the other surface, The power conversion device is characterized in that the board support portion is arranged so as to overlap at least a portion of the electronic component when viewed in a normal direction of the one surface of the control board. (Appendix 2) 2. The power conversion device according to claim 1, wherein an adhesive is disposed between the control board and the board support portion. (Appendix 3) The power conversion device according to claim 1 or 2, wherein a viscoelastic body is disposed between the control board and the board support portion. (Appendix 4) The power conversion device according to claim 1 or 2, wherein the board support portion is a viscoelastic body disposed between the control board and the support plate. (Appendix 5) the semiconductor module has a connection terminal extending in a normal direction to the one surface of the control board, the control board has through holes into which the connection terminals are inserted, The power conversion device according to any one of Supplementary Note 1 to Supplementary Note 4, characterized in that the support plate has a guide hole through which the connection terminal passes, at a position overlapping with the through hole when viewed in the normal direction of the one surface of the control board. (Appendix 6) A power conversion device described in any one of Supplementary Note 1 to Supplementary Note 5, characterized in that the frequency of the first mode of the eigenvalue in the vibration of the support plate is higher than the frequency of the first mode of the eigenvalue in the vibration of the control board. (Appendix 7) a plurality of specific electronic components are arranged at intervals on the one surface of the control board, and the plurality of specific electronic components have a size or weight equal to or greater than a predetermined value; The power conversion device according to any one of claims 1 to 6, characterized in that the support plate is provided with a plurality of board support portions that overlap with each of the plurality of specific electronic components when viewed in the normal direction of the one surface of the control board. (Appendix 8) a plurality of specific electronic components are arranged at intervals on the one surface of the control board, and the plurality of specific electronic components have a size or weight equal to or greater than a predetermined value; The power conversion device according to any one of claims 1 to 6, characterized in that the support plate has a board support portion arranged thereon that overlaps with the plurality of specific electronic components when viewed in the normal direction of the one surface of the control board. [Industrial Applicability]

[0074] The present disclosure can be used as a vibration-proof structure for a power conversion device, particularly for an on-vehicle power conversion device. [Explanation of symbols]

[0075] 1 semiconductor module, 2 control board, 2a component mounting surface, 2b supported surface, 3, 3a support plate, 4 spacer, 4a frame-shaped member, 5 housing, 6 fastening screw, 11 main body, 12 connection terminal, 21, 21a, 21b specific electronic component, 22 through hole, 30 main body, 31, 31a, 31b, 31c, 31d, 31e board support portion, 32 screw hole, 33 viscoelastic body, 34 guide hole, 100, 101, 102, 103, 104, 105, 106 power conversion device

Claims

1. a semiconductor module having a semiconductor switching element; a control board on which an electronic circuit for controlling the operation of the semiconductor module is arranged; an electronic component mounted on one surface of the control board; a support plate made of an insulator and arranged opposite the other surface of the control board, the support plate has a board support portion that protrudes toward the other surface of the control board and supports the other surface, The power conversion device is characterized in that the board support portion is arranged so as to overlap at least a portion of the electronic component when viewed in a normal direction of the one surface of the control board.

2. 2. The power conversion device according to claim 1, wherein an adhesive is disposed between the control board and the board support portion.

3. 2. The power conversion device according to claim 1, wherein a viscoelastic body is disposed between the control board and the board support portion.

4. 2. The power conversion device according to claim 1, wherein the board support portion is a viscoelastic body disposed between the control board and the support plate.

5. the semiconductor module has a connection terminal extending in a normal direction to the one surface of the control board, the control board has through holes into which the connection terminals are inserted, The power conversion device according to any one of claims 1 to 4, characterized in that the support plate has a guide hole through which the connection terminal passes, at a position that overlaps with the through hole when viewed in the normal direction of the one surface of the control board.

6. 5. The power conversion device according to claim 1, wherein a frequency of a first mode of eigenvalues ​​in vibration of the support plate is higher than a frequency of a first mode of eigenvalues ​​in vibration of the control board.

7. a plurality of specific electronic components are arranged at intervals on the one surface of the control board, and the plurality of specific electronic components have a size or weight equal to or greater than a predetermined value; A power conversion device as described in any one of claims 1 to 4, characterized in that the support plate has a plurality of board support portions arranged thereon that overlap each of the plurality of specific electronic components when viewed in the normal direction of the one surface of the control board.

8. a plurality of specific electronic components are arranged at intervals on the one surface of the control board, and the plurality of specific electronic components have a size or weight equal to or greater than a predetermined value; A power conversion device as described in any one of claims 1 to 4, characterized in that the support plate has a board support portion arranged thereon that overlaps with the plurality of specific electronic components when viewed in the normal direction of the one surface of the control board.

Images