Substrate

Abstract

To provide a technique capable of preventing a wiring substrate disposed in a notch part from being damaged and broken.SOLUTION: A substrate 100 includes: a substrate body 10; a notch part 20 formed in the substrate body 10 and in which a wiring member is disposed; a chamfered part 30 formed at a corner part of the notch part 20; and a plated part 40 formed at an end surface of the notch part 20 including the chamfered part 30. By forming the chamfered part 30 (R surface) in the notch part 20 of the substrate body 10 and then forming the plating part 40 to protect the wiring member, damage to the wiring member can be prevented.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate. [Background technology]

[0002] Patent Document 1 discloses a technique in which a holder is provided to prevent wire breakage, and the holder is chamfered to protect the wire. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 57-151874 Summary of the Invention [Problem to be solved by the invention]

[0004] When a cutout is formed in a substrate and a wiring member is to be placed in the cutout, the wiring member may come into contact with the corner of the cutout, scratching the wiring substrate and possibly causing a break.

[0005] Therefore, an object of the present invention is to provide a technique that can prevent a wiring board placed in a cutout portion from being scratched and broken. [Means for solving the problem]

[0006] The present invention employs the following solutions. Note that the solutions below are merely examples, and the present invention is not limited to these. The present invention can be an invention that includes at least one of the invention-specifying matters shown in the solutions below. Furthermore, each invention-specifying matter shown in the solutions below can be made into a subordinate concept by adding an element that limits the invention-specifying matter, or can be made into a superordinate concept by removing an element that limits the invention-specifying matter.

[0007] The substrate of the solution is a substrate that includes, for example, a substrate body, a cutout portion formed in the substrate body in which a wiring member is arranged, a chamfered portion formed at the corner of the cutout portion, and a plated portion formed on the end face of the cutout portion including the chamfered portion. [Effects of the Invention]

[0008] According to the present invention, it is possible to prevent the wiring board arranged in the notch from being scratched and broken. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a diagram showing a substrate 100 of a first embodiment. [Figure 2] 1A and 1B are diagrams showing a state in which the substrate 100 of the first embodiment is used. [Figure 3] FIG. 10 is a diagram showing a substrate 100-2 according to a second embodiment. [Figure 4] FIG. 10 is a diagram showing a state in which a substrate 100-2 of a second embodiment is used. [Figure 5] FIG. 1 is a diagram showing a substrate 100A of a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that each of the following embodiments is shown as a preferred example of a substrate, and the embodiments are not limited to these examples.

[0011] [First embodiment] FIG. 1 is a diagram showing a substrate 100 of the first embodiment. The substrate 100 includes a substrate body 10, a notched portion 20, a chamfered portion 30, and a plated portion 40. The substrate 100 is a substrate used in, for example, a power supply product.

[0012] The substrate body 10 is a plate-like member on which electrical components and the like are mounted. The cutout portion 20 is formed at the end of the board main body 10, and is a portion where the wiring member 200 (see FIG. 2) is placed. The cutout portion 20 has a rectangular shape in a plan view. The cutout portion 20 serves to prevent the wiring member 200 from hitting the housing of a power supply product or the like when wiring the wiring member 200 that connects boards. The wiring member 200 can connect electronic components to each other, or connect the substrate 100 to another substrate. The wiring member 200 is, for example, a harness.

[0013] The chamfered portions 30 are portions formed at the corners of the cutout portion 20. The chamfered portions 30 are formed at the four corners of the rectangular shape of the cutout portion 20. The chamfered portions 30 are curved chamfers (R-chamfers, fillets). The two upper chamfered portions 30a, 30b have a curved shape (external R) that protrudes toward the outside of the substrate body 10, and the two lower chamfered portions 30c, 30d have a curved shape (internal R) that recesses toward the inside of the substrate body 10.

[0014] Specifically, it is preferable that the radius (R1) of the curve of the outer chamfered portion 30 (30a, 30b) of the substrate body 10 is approximately 1.0 to 3.0 mm, and it is preferable that the radius (R2) of the curve of the inner chamfered portion 30 (30c, 30d) of the substrate body 10 is approximately 0.5 to 1.0 mm.

[0015] The plated portion 40 is a portion formed on the end face of the cutout portion 20 including the chamfered portion 30. The plated portion 40 is formed across the front, side, and back surfaces of the substrate body 10. The plated portion 40 is preferably metal plated, and more preferably gold plated or copper plated.

[0016] The width of the plated portion 40 is approximately 2.0 to 5.0 mm. The thickness of the substrate body 10 is approximately 1.6 mm. Therefore, the width of the plated portion 40 is greater than the thickness of the substrate body 10. Because the plated portion 40 is different from the through-holes in the substrate body 10, it can be formed after the contours of the cutout portion 20, etc. are processed. The plated portion 40 is formed over the entire cutout portion 20, including the chamfered portion 30, but it is sufficient that the plated portion 40 covers at least the chamfered portion 30. The plated portion 40 may be disposed up to the end of the curved surface of the chamfered portion 30, or may be disposed beyond the end of the curved surface of the chamfered portion 30 with some leeway.

[0017] FIG. 2 is a diagram showing a state in which the substrate 100 of the first embodiment is used. 2, a wiring member 200 is placed in the cutout portion 20. At this time, even if the wiring member 200 hits the corner of the cutout portion 20, the wiring member 200 (wire coating) will not be damaged because the chamfered portion 30 and the plated portion 40 are formed at the corner.

[0018] As described above, the first embodiment has the following advantages. (1) According to the first embodiment, the chamfered portion 30 is formed in the cutout portion 20 of the substrate main body 10, and then the plated portion 40 is formed. Therefore, the wiring member 200 can be protected by the two elements, the chamfered portion 30 and the plated portion 40, and the wiring member 200 placed in the cutout portion 20 can be prevented from being scratched and broken.

[0019] (2) According to the first embodiment, the plated portion 40 is formed on the chamfered portion 30, which makes it easier to form the plated portion 40 (the plating adheres more easily) compared to plating an unchamfered portion. Also, burrs (protrusions) tend to form on the corners of the cutout portion 20 when the cutout portion 20 is formed, but the plated portion 40 can also cover the burrs.

[0020] (3) According to the first embodiment, the chamfered portions 30 are formed at the four corners of the rectangular shape of the notch 20, so that the portions that the wiring member 200 is likely to come into contact with can be protected.

[0021] (4) According to the first embodiment, the plated portion 40 is formed across the front, side, and back surfaces of the substrate body 10, and by enveloping the cutout portion 20, the possibility of the wiring member 200 being damaged can be further reduced.

[0022] Second Embodiment Next, a second embodiment will be described with reference to the drawings. In the following description, parts that perform the same functions as those in the first embodiment will be given the same reference numerals, and duplicated descriptions will be omitted as appropriate.

[0023] FIG. 3 is a diagram showing a substrate 100-2 according to the second embodiment. The main difference between the substrate 100 of the first embodiment and the substrate 100-2 of the second embodiment is that the shape of the notch 20-2 is changed. The cutout portion 20-2 has a shape combining a square shape and a circle shape in a plan view. The square-shaped portion is a first region 21 for inserting and removing the wiring member 300 (see FIG. 4), and the circular portion is a second region 22 for placing the wiring member 300. The width L1 of the first region 21 (width in the horizontal direction in the figure, opening width) is narrower than the width L2 of the second region 22 (width in the horizontal direction in the figure, maximum width of the space for storing the wiring member).

[0024] The chamfered portions 30-2 are formed at the four corners of the quadrangle. Of the four chamfered portions 30-2, the chamfered portions 30-2 (30-2a, 30-2b) on the outer side of the substrate body 10-2 have a larger radius of curvature (bending radius) than the chamfered portions 30-2 (30-2c, 30-2d) on the inner side of the substrate body 10-2.

[0025] Specifically, it is preferable that the radius (R3) of the curve of the outer chamfered portion 30-2 (30-2a, 30-2b) of the substrate main body 10-2 is approximately 1.0 to 3.0 mm, and it is preferable that the radius (R4) of the curve of the inner chamfered portion 30-2 (30-2c, 30-2d) of the substrate main body 10-2 is approximately 0.5 to 1.0 mm.

[0026] FIG. 4 is a diagram showing a state in which the substrate 100-2 of the second embodiment is used. 4, the wiring member 300 is placed in the cutout portion 20-2. At this time, even if the wiring member 300 hits the corner of the cutout portion 20-2, the wiring member 300 will not be damaged because the chamfered portion 30-2 and the plated portion 40 are formed at the corner.

[0027] As described above, according to the second embodiment, in addition to the effects of the first embodiment, the following effects are obtained. (1) According to the second embodiment, the chamfered portions 30-2 are formed at the four corners of the rectangular shape of the notch 20-2, so that the portions that the wiring member 300 is likely to come into contact with can be protected.

[0028] (2) According to the second embodiment, the outer chamfered portion 30-2 (30-2a, 30-2b) of the substrate body 10-2 has a larger radius of curve than the inner chamfered portion 30-2 (30-2c, 30-2d) of the substrate body 10, so that the entrance and exit have a larger curve, making it easier to insert the wiring member 300, while the interior has a smaller curve, improving the effect of preventing the wiring member 300 from jumping out.

[0029] (3) According to the second embodiment, the width L1 of the first region 21 is narrower than the width L2 of the second region 22, and therefore the opening can be narrowed to prevent the wiring member 300 from protruding. This makes it possible to prevent the wiring member 300 from coming into contact with the housing of a power supply product or the like, while eliminating the need for banding with cable ties or the like (reducing the number of steps required for banding).

[0030] (4) As shown in Fig. 4, the wiring member 300 may be formed by bundling multiple electric wires by twisting them together as a noise countermeasure. In such a case, the wiring member 300 has a circular cross section, and therefore can be fitted snugly into the circular cutout portion 20-2.

[0031] FIG. 5 is a diagram showing a substrate 100A of a comparative example. The board 100A of the comparative example has four right-angled cutouts 20A at its four corners. In the board 100A of the comparative example, the cutouts 20A are provided on the top surface of the board body 10A, and wiring members are placed inside the cutouts 20A. However, the wiring members may protrude from the cutouts 20A and float, and may come into contact with the housing when the board is installed in the housing, or with the board edges (arrows X1, X2, X3, and X4), which may scratch the wiring members and cause breaks.

[0032] Furthermore, in the board 100A of the comparative example, after the wiring members are inserted into the cutout portions 20A, the wiring members may be banded and secured with a cable band (not shown) using the cable band insertion holes 50. However, even with such banding, the wiring members may come into contact with the board edges (arrows X1, X2, X3, and X4) of the board main body 10A, which may damage the wiring members and cause breakage.

[0033] As described above, in the substrate 100A of the comparative example, when wiring members are laid between the substrates, cutout portions 20A are formed in the substrate main body 10A and the wiring members are stored in the cutout portions 20A, but at this time, there is a problem that the wiring members may be damaged or protrude from the substrate edges (arrows X1, X2, X3, X4) of the cutout portions 20A. On the other hand, in each of the above-mentioned embodiments, such problems can be solved by forming chamfered portions (fillets) at the corners (edges) of the cutout portions of the substrate main body and then forming plated portions on the end faces of the cutout portions.

[0034] Further, a comparison with the above-mentioned patent documents is as follows. The technology of Patent Document 1 is a holder technology that prevents wire breakage and protects electric wires by chamfering the holder. On the other hand, the technology of each of the above-mentioned embodiments is different from the technology of Patent Document 1 because it forms a chamfered portion (R-surface) in the cutout portion of the board body and then forms a plated portion to protect the wiring member. The configuration of forming a chamfered portion and a plated portion in the cutout portion of the board body to ensure a route for the wiring member inside the power supply product and preventing damage to the wiring member is a technology that has not existed in the past.

[0035] [Modifications] The present invention is not limited to the above-described embodiment, and can be practiced in various modified forms. (1) The board has been described as an example of a board for a power supply product (power supply unit), but it may be a board for other products.

[0036] (2) The shape of the cutout is not limited to a square or a circle, but may be an oval or other polygonal shape, or a combination of these (for example, a combination of a small square and a large square, a combination of a small circle and a large circle, etc.).

[0037] (3) The chamfered portion has been described as an example of an R-chamfer (fillet), but may also be a C-chamfer (flat chamfer).

[0038] (4) Although the plated portion has been described as being metal plated, it may be plated with other materials (for example, resin plating).

[0039] (5) Although the chamfered portions are formed at the four corners of the quadrangle in the above example, they may be formed at at least one of the four corners of the quadrangle. For example, they may be formed at only the two outer corners, or at only one of the four corners.

[0040] (6) In the second embodiment, the chamfered portion on the outer side of the substrate body has a larger radius of curvature than the chamfered portion on the inner side of the substrate body. However, the chamfered portion on the outer side of the substrate body may have a smaller radius of curvature than the chamfered portion on the inner side of the substrate body. The chamfered portion on the outer side of the substrate body and the chamfered portion on the inner side of the substrate body may have the same radius of curvature.

[0041] (7) In the above description, the plated portion is formed across the front, side, and back surfaces of the substrate body, but it may be formed on at least one of the front, side, and back surfaces of the substrate body.

[0042] (8) In the above description, the chamfered portion is formed at the corner of the notch, but it may also be formed by rounding the edge of the substrate relative to the straight portion between the corners of the notch. [Explanation of symbols]

[0043] 10, 10-2 Board body 20, 20-2 Notch 21 First area L1 Width of the first area 22 Second area L2 Width of the second area 30, 30a~30d, 30-2, 30-2a~30-2d Chamfered part 40 Plated section 100, 100-2 board 200, 300 Wiring materials

Claims

1. A substrate body, a cutout portion formed in the substrate body and in which a wiring member is disposed; a chamfered portion formed at a corner of the cutout portion; a plated portion formed on an end surface of the cutout portion including the chamfered portion; A substrate comprising:

2. The substrate according to claim 1 , The cutout portion has a rectangular shape in a plan view, The substrate is characterized in that the chamfered portions are formed at the four corners of the quadrangular shape.

3. The substrate according to claim 1 , the cutout portion has a shape obtained by combining a square shape and a circle shape in a plan view, The substrate is characterized in that the chamfered portions are formed at the four corners of the quadrangular shape.

4. The substrate according to claim 3, A substrate, characterized in that the chamfered portion on the outer side of the substrate body has a larger radius of curve than the chamfered portion on the inner side of the substrate body.

5. The substrate according to claim 3, the rectangular portion is a first region for inserting and removing the wiring member, the circular portion is a second region for disposing the wiring member, A substrate, wherein the width of the first region is narrower than the width of the second region.

6. The substrate according to claim 1 , The substrate is characterized in that the plated portion is formed across the front, side, and back surfaces of the substrate body.

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