Switch device

Abstract

To provide a switch device which prevents cracking of a glass layer.SOLUTION: A switch device includes a glass layer, a resin layer arranged on the lower surface side of the glass layer, a support part which is arranged on the lower surface side of the resin layer, and has a circular through hole in plan view, and a switch arranged in the through hole, wherein the thickness of the glass layer is 20 μm or more and 150 μm or less, the support part includes an upper surface positioned on the resin layer side, an inside surface positioned in the through hole, and a connection surface connecting the upper surface and the inside surface, an opening diameter in a boundary between the upper surface and the connection surface of the through hole is larger than an opening diameter in a boundary between the connection surface and the inside surface, and when the glass layer is pressed, the glass layer and the resin layer are elastically deformed, conduction and non-conduction of the switch are switched.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a switch device. [Background technology]

[0002] A known switch device includes a glass layer and a switch disposed on the underside of the glass layer, the glass layer having a thickness of 20 μm to 150 μm, the switch having multiple contacts including a contact that moves up and down, and when the glass layer is pressed, the glass layer elastically deforms, switching the multiple contacts between conductive and non-conductive. In such a switch device, the glass layer is thin, and therefore it is required to make the glass layer less likely to break. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-166480 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a switch device in which the glass layer is less likely to break. [Means for solving the problem]

[0005] A switch device according to one embodiment of the present disclosure includes a glass layer, a resin layer disposed on a lower surface of the glass layer, a support portion disposed on the lower surface of the resin layer and having a through hole that is circular in a planar view, and a switch disposed in the through hole, wherein the thickness of the glass layer is 20 μm or more and 150 μm or less, the support portion includes an upper surface located on the resin layer side, an inner surface located within the through hole, and a connection surface connecting the upper surface and the inner surface, wherein the opening diameter at the boundary between the upper surface and the connection surface of the through hole is larger than the opening diameter at the boundary between the connection surface and the inner surface, and when the glass layer is pressed, the glass layer and the resin layer elastically deform, switching the switch between conductive and non-conductive states. [Effects of the Invention]

[0006] According to the disclosed technology, a switch device can be provided in which the glass layer is less likely to break. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a cross-sectional view illustrating a switch device according to a first embodiment. [Figure 2] FIG. 2 is a plan view of the support portion shown in FIG. [Figure 3] 3A to 3C are diagrams illustrating the operation of the switch device according to the first embodiment. [Figure 4] FIG. 2 is a partially enlarged cross-sectional view of a support portion in FIG. [Figure 5] 10A and 10B are partially enlarged cross-sectional views showing other examples of the shape of the connecting surface. [Figure 6] FIG. 1 is a diagram (part 1) for explaining a suitable relationship between the distance D, the opening diameter R, and the thickness G of the glass layer. [Figure 7] FIG. 2 is a diagram (part 2) for explaining a suitable relationship between the distance D, the opening diameter R, and the thickness G of the glass layer. [Figure 8] FIG. 10 is a diagram (part 3) for explaining a suitable relationship between the distance D, the opening diameter R, and the thickness G of the glass layer. DETAILED DESCRIPTION OF THE INVENTION

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following describes the preferred embodiments of the present invention with reference to the accompanying drawings. In the drawings, the same components are designated by the same reference numerals, and redundant explanations may be omitted.

[0009] First Embodiment 1 is a cross-sectional view illustrating a switch device according to a first embodiment. As shown in FIG. 1, the switch device 1 includes a glass layer 10, a resin layer 20, a bonding layer 30, a support portion 40, and a switch 50. The bonding layer 30 is not an essential component of the switch device 1. For example, the resin layer 20 can also serve as the bonding layer 30.

[0010] The components of the switch device 1 will be described below.

[0011] [Glass layer] The glass layer 10 has an upper surface 10a and a lower surface 10b opposite to the upper surface 10a. The upper surface 10a is a single continuous surface. The lower surface 10b is also a single continuous surface. The upper surface 10a side of the glass layer 10 forms the outermost surface of the switch device 1. The glass layer 10 preferably has high surface durability as determined by a pencil hardness test of 9H or higher and excellent dimensional stability.

[0012] The glass layer 10 is not particularly limited, and an appropriate glass layer can be adopted depending on the purpose. The glass layer 10 can be classified by composition, for example, soda-lime glass, borate glass, aluminosilicate glass, or quartz glass. Furthermore, the glass layer 10 can be classified by alkali component, for example, alkali-free glass or low-alkali glass. The content of alkali metal components (e.g., Na2O, KO, or Li2O) in the glass is preferably 15 wt% or less, and more preferably 10 wt% or less.

[0013] Considering the surface hardness, airtightness, and corrosion resistance of glass, the thickness of the glass layer 10 is preferably 20 μm or more. Furthermore, because the glass layer 10 needs to have film-like flexibility and durability against repeated use, the thickness of the glass layer 10 is preferably 150 μm or less. The thickness of the glass layer 10 is more preferably 30 μm to 120 μm, and particularly preferably 50 μm to 100 μm.

[0014] The glass layer 10 preferably has a light transmittance of 85% or more at a wavelength of 550 nm. The glass layer 10 preferably has a refractive index of 1.4 to 1.65 at a wavelength of 550 nm. The glass layer 10 preferably has a density of 2.3 g / cm 3 ~3.0g / cm 3 and more preferably 2.3 g / cm 3 ~2.7g / cm 3 is.

[0015] The method for forming the glass layer 10 is not particularly limited, and an appropriate method can be adopted depending on the purpose. Typically, the glass layer 10 can be produced by melting a mixture containing a main raw material such as silica or alumina, an antifoaming agent such as mirabilite or antimony oxide, and a reducing agent such as carbon at a temperature of about 1400°C to 1600°C, forming it into a thin plate, and then cooling it. Examples of methods for forming the glass layer 10 include the slot downdraw method, the fusion method, and the float method. The glass layer formed into a plate by these methods may be chemically polished with a solvent such as hydrofluoric acid, as necessary, to make it thinner or to improve smoothness.

[0016] The glass layer 10 may be made of tempered glass. The tempered glass may be chemically tempered glass or thermally tempered glass, but chemically tempered glass having a compressive stress layer is easier to manufacture than thermally tempered glass. When the glass layer 10 is made of tempered glass, the compressive stress is preferably 600 MPa or more.

[0017] Chemical strengthening refers to the process of replacing ions near the surface of a glass sheet with ions with a larger ionic radius. This ion exchange creates a compressive stress layer on the surface of the glass sheet, resulting in chemically strengthened glass. The glass composition in the compressive stress layer is different from the glass composition inside the glass.

[0018] In chemically strengthened glass, the glass plate before strengthening can be, for example, soda-lime glass, aluminosilicate glass, borosilicate glass, aluminoborosilicate glass, etc. Soda-lime glass or soda-silicate glass is preferred, and soda-lime glass is more preferred, in that the depth of the compressive stress layer does not become too large more than necessary.

[0019] Ion exchange can be performed, for example, by substituting Li ions on the surface of the glass plate with Na ions and / or K ions. Alternatively, Na ions on the surface of the glass plate may be substituting K ions. This ion exchange forms a compressive stress layer on the surface of the glass plate.

[0020] To replace Na ions with K ions, for example, a glass plate containing sodium may be brought into contact with an inorganic molten salt containing potassium nitrate. The inorganic molten salt containing potassium nitrate preferably contains at least one salt selected from the group consisting of K2CO3, Na2CO3, KHCO3, NaHCO3, KOH, and NaOH.

[0021] A functional layer such as an antifouling layer, an anti-reflection layer, a conductive layer, a reflective layer, or a decorative layer may be provided on the upper surface 10a and / or the lower surface 10b of the glass layer 10. Braille may also be provided on the upper surface 10a of the glass layer 10. In the switch device according to this embodiment, the glass layer 10 is located on the outermost surface. Here, "the glass layer 10 is located on the outermost surface" means that the glass layer 10 is substantially located on the outermost surface, and even if an additional layer such as that described above is provided, this embodiment will still refer to the glass layer 10 as being located on the outermost surface.

[0022] [Resin layer] The resin layer 20 is disposed on the lower surface 10b side of the glass layer 10. The resin layer 20 has an upper surface 20a and a lower surface 20b opposite to the upper surface 20a. The resin layer 20 is flexible. From the viewpoint of flexibility, the thickness of the resin layer 20 is preferably 50 μm or more and 150 μm or less.

[0023] Examples of materials for the resin layer 20 include polyester resins such as polyethylene terephthalate resins and polyethylene naphthalate resins, cycloolefin resins such as norbornene resins, polyethersulfone resins, polycarbonate resins, acrylic resins, polyolefin resins, polyimide resins, polyamide resins, polyimideamide resins, polyarylate resins, polysulfone resins, polyetherimide resins, urethane resins, and cellulose resins.

[0024] In this way, when the glass layer 10 and the resin layer 20 are laminated, the resin layer 20 suppresses excessive deformation of the glass layer 10, preventing cracking of the glass layer 10, and also realizes an appropriate amount of deformation, thereby improving the durability of the glass layer 10 against repeated elastic deformation. Note that the amount of deformation of the glass layer 10 can be controlled by changing the thickness of the resin layer 20.

[0025] A bonding layer may be provided between the lower surface 10b of the glass layer 10 and the upper surface 20a of the resin layer 20. Any pressure-sensitive adhesive or adhesive described below can be used as the bonding layer. However, from the viewpoint of strength, it is preferable to use an adhesive as the bonding layer. From the viewpoint of appearance, the thickness of the bonding layer is preferably 0.5 μm or more and 25 μm or less, more preferably 0.5 μm or more and 5 μm or less, and even more preferably 0.5 μm or more and 3 μm or less.

[0026] A plurality of resin layers may be laminated on the lower surface 10b side of the glass layer 10. Such a laminated structure can further suppress cracking of the glass layer 10 and further improve the durability of the glass layer 10 against repeated elastic deformation.

[0027] [Joining layer] The bonding layer 30 bonds the resin layer 20 and the support portion 40. Any adhesive or adhesive can be used as the bonding layer 30. The thickness of the bonding layer 30 can be, for example, 5 μm or more and 20 mm or less.

[0028] In this specification, a pressure-sensitive adhesive refers to a layer that has adhesive properties at room temperature and adheres to an adherend with light pressure. Therefore, even when an adherend that has been stuck to the pressure-sensitive adhesive is peeled off, the pressure-sensitive adhesive retains practical adhesive strength. On the other hand, an adhesive refers to a layer that can bond substances by being interposed between them. Therefore, when an adherend that has been stuck to the adhesive is peeled off, the adhesive loses practical adhesive strength.

[0029] Examples of the adhesive include adhesives having a base polymer such as an acrylic polymer, a silicone polymer, a polyester, a polyurethane, a polyamide, a polyether, a fluorine-based polymer, or a rubber-based polymer.

[0030] Examples of adhesives include polyester adhesives, polyurethane adhesives, polyvinyl alcohol adhesives, epoxy adhesives, acrylic adhesives, and silicone adhesives. If the adhesive is a thermosetting adhesive, it can exhibit peel resistance by being heated and cured (solidified). If the adhesive is a light-curing adhesive such as an ultraviolet-curing adhesive, it can exhibit peel resistance by being cured by irradiating it with light such as ultraviolet light. If the adhesive is a moisture-curing adhesive, it can be cured by reacting with moisture in the air, and can therefore exhibit peel resistance by being left to stand.

[0031] [Support part] 2 is a plan view of the support part 40 shown in Fig. 1, as viewed from the normal direction of the upper surface 40a of the support part 40. As shown in Figs. 1 and 2, the support part 40 is disposed on the lower surface 20b side of the resin layer 20 via the bonding layer 30, and supports the glass layer 10 and the resin layer 20.

[0032] The support portion 40 has, for example, a rectangular shape in a plan view. The support portion 40 may have a shape other than a rectangular shape in a plan view. The support portion 40 can be formed from, for example, resin or metal. The support portion 40 has a through-hole 40x that penetrates from the upper surface 40a to the lower surface. The through-hole 40x has a circular shape in a plan view. Note that the cross-sectional view of FIG. 1 shows a cross-section cut along a plane that passes through the center of the through-hole 40x and is perpendicular to the upper surface 40a.

[0033] The support portion 40 has an upper surface 40a, an inner surface 40b, and a connecting surface 40c. The upper surface 40a is located on the resin layer 20 side. The connecting surface 40c connects the upper surface 40a and the inner surface 40b. The inner surface 40b and the connecting surface 40c are located inside the through-hole 40x. The upper surface 40a is, for example, parallel to the upper surface 10a of the glass layer 10. The inner surface 40b is, for example, perpendicular to the upper surface 40a. In a cross-sectional view, the connecting surface 40c may be curved, linear, or a mixture of curved and linear shapes.

[0034] The through-hole 40x has the largest opening diameter on the side closer to the glass layer 10. Specifically, the opening diameter S of the through-hole 40x at the boundary between the upper surface 30a and the connection surface 40c of the support part 40 is larger than the opening diameter R of the through-hole 40x at the boundary between the connection surface 40c and the inner side surface 40b of the support part 40. Furthermore, the opening diameter S of the through-hole 40x at the boundary between the upper surface 40a and the connection surface 40c is largest. The opening diameter R is preferably 25 mm or more. When the opening diameter R is 25 mm or more, the glass layer 10 and the resin layer 20 are more likely to deform toward the switch 50.

[0035] The support portion 40 may have a plurality of through holes 40x spaced apart from one another. The plurality of through holes 40x may be arranged, for example, in a matrix in plan view. A switch 50 may be disposed in each of the through holes 40x. Furthermore, one glass layer 10 and one resin layer 20 may be disposed so as to cover the plurality of through holes 40x.

[0036] [switch] The switch 50 is a switch that detects a physical change when pressed. Operating the switch 50 provides a clicking sensation. The switch 50 is, for example, a tactile switch. The switch 50 is not limited to a tactile switch, and may be any switch that provides a clicking sensation, such as a membrane switch.

[0037] The switch 50 is disposed in the through-hole 40x of the support part 40. In the example of FIG. 1, a gap is provided between the lower surface 20b of the resin layer 20 and the switch 50, but the gap does not have to be provided. It is preferable that the switch device 1 has a gap large enough that the switch 50 does not interfere with the flatness of the glass layer 10 and the resin layer 20.

[0038] Fig. 3 is a diagram illustrating the operation of the switch device according to the first embodiment. As shown in Fig. 3, in the switch device 1, when the glass layer 10 is pressed in the direction of the arrow, the glass layer 10 and the resin layer 20 elastically deform to press the movable part of the switch 50, switching the switch 50 between conductive and non-conductive states. When the pressing of the glass layer 10 is stopped, the glass layer 10, the resin layer 20, and the switch 50 return to the state shown in Fig. 1.

[0039] In Fig. 3, Y indicates the displacement of the glass layer 10. The arrow direction in Fig. 3 is the normal direction of the upper surface 10a of the glass layer 10 when the glass layer 10 is not pressed. The displacement Y is the distance that the upper surface 10a of the glass layer 10 is displaced in the direction of the arrow when the glass layer 10 is pressed in the direction of the arrow in Fig. 3.

[0040] In the switch device 1, the support portion 40 has a connection surface 40c that connects the upper surface 40a and the inner surface 40b. Therefore, in the switch device 1, the opening diameter S of the through-hole 40x at the boundary between the upper surface 40a and the connection surface 40c is larger than the opening diameter R at the boundary between the connection surface 40c and the inner surface 40b. With this structure, when the glass layer 10 and the resin layer 20 are pressed, the lower surface 20b of the resin layer 20 bends gently while contacting the connection surface 40c, thereby reducing the risk of the glass layer 10 breaking. In other words, a switch device 1 can be realized in which the glass layer 10 is less likely to break.

[0041] That is, if there were no connecting surface 40c and the top surface 40a and the inner surface 40b intersected at a right angle, the glass layer 10 and the resin layer 20 would bend sharply at the right angle, increasing the risk of cracking the glass layer 10. Switch device 1 having connecting surface 40c between the top surface 40a and the inner surface 40b can reduce the risk of such a problem occurring.

[0042] In a cross-sectional view, the connecting surface 40c may be curved or straight, but a curved surface without corners is more advantageous in terms of preventing cracks in the glass layer 10. [Optimal relationship between distance D, opening diameter R, and glass layer thickness G] FIG. 4 is a partially enlarged cross-sectional view of the support portion in FIG. 1. As shown in FIG. 4, a distance D can be defined in the support portion 40. In FIG. 4, P1 is a line that passes through the boundary between the upper surface 40a and the connecting surface 40c and is perpendicular to the upper surface 40a. P2 is a line that passes through the boundary between the inner surface 40b and the connecting surface 40c and is perpendicular to the inner surface 40b. I is the intersection of the lines P1 and P2. Distance D is the shortest distance from intersection I to the connecting surface 40c in a cross-sectional view. For example, if the connecting surface 40c is 1 / 4 of a circle centered at intersection I in a cross-sectional view, distance D is the radius of that circle.

[0043] Fig. 5 is a partially enlarged cross-sectional view showing another example of the shape of the connection surface. In the example of Fig. 5, connection surface 40c is linear in cross-sectional view. In this case, distance D can be calculated in the same manner as described with reference to Fig. 4. In cases where connection surface 40c has a shape that is a mixture of curved and linear lines in cross-sectional view, distance D can also be calculated in the same manner as described with reference to Fig. 4.

[0044] 6, the inventors have investigated the optimum relationship between the distance D, the opening diameter R, and the thickness G of the glass layer to prevent the glass layer 10 from cracking when the glass layer 10 is pressed from the side indicated by the arrow to switch the switch 50 between conductive and non-conductive states. The switch device 1A has a bonding layer 15 provided between the glass layer 10 and the resin layer 20 of the switch device 1.

[0045] A glass film (OA-10 manufactured by Nippon Electric Glass Co., Ltd.) was used as the glass layer 10. A polyethylene terephthalate (PET) film (Cosmoshine A4160 manufactured by Toyobo Co., Ltd.) was used as the resin layer. An epoxy adhesive with a thickness of 5 μm was used as the bonding layer 15.

[0046] The inventors conducted repeated experiments to confirm whether the glass layer 10 would crack or not in the switch device 1A by changing the thickness G of the glass layer 10, the thickness of the resin layer 20, the distance D, the opening diameter R, and the amount of displacement of the glass layer 10 when a load was applied to the switch 50 in the direction of the arrow in Fig. 6. Here, the arrow direction in Fig. 6 is the normal direction of the upper surface 10a of the glass layer 10 when the glass layer 10 is not being pressed. The amount of displacement is the distance by which the upper surface 10a of the glass layer 10 is displaced in the direction of the arrow when the glass layer 10 is pressed in the direction of the arrow in Fig. 6.

[0047] Fig. 7 summarizes the experimental conditions and results. In the "Results" column for Examples 1 to 9 and Comparative Examples 1 to 18 shown in Fig. 7, "OK" indicates that the glass layer 10 was not broken, and "Broken" indicates that the glass layer 10 was broken. As shown in Fig. 7, whether the glass layer 10 breaks when the displacement amount is changed depends on the thickness G of the glass layer 10, the distance D, and the opening diameter R.

[0048] Figure 8 is a graph plotted based on the results of Figure 7. In Figure 8, the X axis is D (mm) x R (mm) / G (μm) and the Y axis is the displacement (mm), with black circles indicating "OK" cases and crosses indicating "damage" cases in Figure 7.

[0049] In Figure 8, a dashed line can be drawn based on the results of Figure 7. The dashed line shown in Figure 8 satisfies Y = 0.38In(R x D / G) + 1.55, where D > 0. The region below the dashed line shown in Figure 8 satisfies Y < 0.38In(R x D / G) + 1.55 (Equation 1). In other words, if Equation 1 is satisfied, no cracks will occur in the glass layer 10.

[0050] When designing a switch device, first select the switch to be used. Once the switch is selected, the required displacement of the glass layer 10 is determined based on the switch specifications. Once the displacement of the glass layer 10 is determined, D, R, and G can be determined to satisfy Equation 1. This makes it possible to realize a switch device that does not cause cracks in the glass layer even when used with the displacement determined based on the switch specifications.

[0051] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0052] In addition to the above-described embodiments, the following supplementary notes are also disclosed. (Appendix 1) A glass layer; a resin layer disposed on the lower surface side of the glass layer; a support portion disposed on a lower surface side of the resin layer and having a through hole that is circular in a plan view; a switch disposed in the through hole, The thickness of the glass layer is 20 μm or more and 150 μm or less, the support portion includes an upper surface located on the resin layer side, an inner surface located within the through hole, and a connection surface connecting the upper surface and the inner surface, an opening diameter of the through hole at the boundary between the upper surface and the connection surface is larger than an opening diameter of the through hole at the boundary between the connection surface and the inner surface; When the glass layer and the resin layer are pressed, the glass layer and the resin layer are elastically deformed, causing the switch to switch between conductive and non-conductive states. (Appendix 2) When the opening diameter at the boundary between the connecting surface and the inner side surface in a cross-sectional view is R [mm], the shortest distance from the intersection of a first line passing through the boundary between the upper surface and the connecting surface and perpendicular to the upper surface with a second line passing through the boundary between the inner side surface and the connecting surface and perpendicular to the inner side surface is D [mm] (where D>0), and the thickness of the glass layer is G [μm], 2. The switch device according to claim 1, wherein a displacement Y of the glass layer in a normal direction to an upper surface of the glass layer satisfies Y≦0.38In(R×D / G)+1.55. (Appendix 3) 3. The switch device according to claim 1, wherein the connecting surface is curved in cross section. (Appendix 4) 4. The switch device according to claim 1, wherein a bonding layer is provided between the glass layer and the resin layer. [Explanation of symbols]

[0053] 1.1A switch device 10 Glass Layers 10a,20a,40a top surface 10b,20b bottom surface 15 Bonding layer 20 Resin layer 30 Bonding layer 40 Support part 40b Inside surface 40c connection surface 40x through holes 50 Switch

Claims

1. A glass layer; a resin layer disposed on the lower surface side of the glass layer; a support portion disposed on a lower surface side of the resin layer and having a through hole that is circular in a plan view; a switch disposed in the through hole, The thickness of the glass layer is 20 μm or more and 150 μm or less, the support portion includes an upper surface located on the resin layer side, an inner surface located within the through hole, and a connection surface connecting the upper surface and the inner surface, an opening diameter of the through hole at the boundary between the upper surface and the connection surface is larger than an opening diameter of the through hole at the boundary between the connection surface and the inner surface; When the glass layer is pressed, the glass layer and the resin layer are elastically deformed, switching the switch between conductive and non-conductive states.

2. When the opening diameter at the boundary between the connecting surface and the inner side surface in a cross-sectional view is R [mm], the shortest distance from the intersection of a first line passing through the boundary between the upper surface and the connecting surface and perpendicular to the upper surface with a second line passing through the boundary between the inner side surface and the connecting surface and perpendicular to the inner side surface to the connecting surface is D [mm] (where D>0), and the thickness of the glass layer is G [μm], The switch device according to claim 1 , wherein a displacement Y of the glass layer in a normal direction to an upper surface of the glass layer satisfies Y≦0.38In(R×D / G)+1.

55.

3. The switch device according to claim 1 or 2, wherein the connecting surface is curved in cross section.

4. The switch device according to claim 1 or 2, further comprising a bonding layer provided between the glass layer and the resin layer.

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