Oscillator and electronic device

Abstract

To provide an oscillator and an electronic device capable of suppressing generation of stray capacitance between a drive electrode formed on a tuning-fork-type piezoelectric vibrating piece and a conductive member.SOLUTION: The oscillator includes a piezoelectric vibrating piece having a base, a vibrating arm part configured by an arm part extending from the base and a head part continuously connected to a tip end of the arm part, and a drive electrode drawn from the base to a tip end of the head part; and a package accommodating the piezoelectric vibrating piece, the drive electrode being formed on at least a side surface of the vibrating arm part, the package including a mounting electrode for mounting the piezoelectric vibrating piece, a notch part provided at a corner of the package, and a conductive member extending from the lower end of the notch part to a side surface of the package and having a potential different from that of the drive electrode, a proximity part of the drive electrode disposed at the position closest to the conductive member in a side-surface direction of the package being arranged so as not to overlap the conductive member in a facing direction in which the piezoelectric vibrating piece and an integrated circuit face each other.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to oscillators and electronic devices. [Background technology]

[0002] Conventionally, there are oscillators used in electronic devices such as smartphones (for example, Patent Document 1). The oscillator includes, for example, a piezoelectric vibrator that uses a quartz crystal. The piezoelectric vibrator includes a piezoelectric vibrating piece and a package that hermetically seals the piezoelectric vibrating piece. An integrated circuit chip that performs arithmetic processing on signals from the piezoelectric vibrator is mounted on the underside of the package.

[0003] The oscillator is mounted on a substrate inside the electronic device via external electrodes provided at the bottom of the package. To electrically connect the oscillator to the substrate by soldering, a conductive member extending from the external electrodes may be provided on the side of the package. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5101201 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, the miniaturization of electronic devices has led to a demand for smaller oscillators. As oscillators become smaller, the distance between the excitation electrode of a piezoelectric vibrating reed and the conductive material on the side of the package becomes smaller, potentially resulting in stray capacitance between the excitation electrode of the piezoelectric vibrating reed and the conductive material. The generation of stray capacitance can degrade the oscillator's frequency deviation voltage characteristics and vibration characteristics. In particular, in tuning-fork-type piezoelectric vibrating reeds with two or more vibrating arms, the differing amounts of stray capacitance generated in each vibrating arm can lead to poor vibration balance among the vibrating arms, potentially resulting in poor vibration characteristics. Furthermore, tuning-fork-type piezoelectric vibrating reeds are more prone to stray capacitance between the excitation electrode and the conductive material than AT vibrating reeds due to their larger thickness and the excitation electrode being formed on the side. This tends to degrade vibration characteristics when oscillators are miniaturized, resulting in poor vibration characteristics due to the generation of stray capacitance.

[0006] In view of the above circumstances, an object of the present invention is to provide an oscillator and an electronic device that can suppress the occurrence of stray capacitance between an excitation electrode formed on a tuning-fork-type piezoelectric vibrating piece and a conductive member. [Means for solving the problem]

[0007] An oscillator according to a first aspect of the present invention comprises a piezoelectric vibrating piece having a base, a vibrating arm portion composed of an arm portion extending from the base and a head portion connected to the tip of the arm portion, and an excitation electrode routed from the base to the tip of the head portion, an integrated circuit having a plurality of integrated circuit terminals, and a package accommodating the piezoelectric vibrating piece and the integrated circuit, wherein the excitation electrode is formed on at least the side of the vibrating arm portion, and the package comprises a mounting electrode for mounting the piezoelectric vibrating piece, an integrated circuit electrode for mounting the integrated circuit, a notch portion provided at a square corner of the package, and a conductive member extending from the lower end of the notch portion to the side of the package and having a different potential from the excitation electrode, and wherein the proximity portion of the excitation electrode, which is positioned at a position closest to the conductive member in the side direction of the package, is positioned so as not to overlap with the conductive member in the opposing direction in which the piezoelectric vibrating piece and the integrated circuit face each other.

[0008] According to the oscillator of the first aspect, in the excitation electrode of the piezoelectric vibrating reed, the proximity portion that is arranged at a position closest to the conductive member in the side direction of the package is arranged so as not to overlap with the conductive member in the opposing direction in which the piezoelectric vibrating reed and the integrated circuit face each other. Therefore, even if the excitation electrode is formed on the side of a tuning-fork-shaped piezoelectric vibrating reed having an arm portion and a head portion, a sufficient distance can be ensured between the excitation electrode and the conductive member, and the occurrence of stray capacitance between the excitation electrode and the conductive member can be suppressed.

[0009] An oscillator according to a second aspect of the present invention is the oscillator according to the first aspect, wherein the shortest distance from the vibrating arm to the conductive member may be 350 μm or less.

[0010] According to the oscillator of the second aspect, since the excitation electrode and the conductive member do not overlap in the opposing direction, even if the shortest distance between the vibrating arm portion and the conductive member is 350 μm or less, at which vibration inhibition due to Coulomb force is likely to occur, it is possible to suppress the generation of stray capacitance between the excitation electrode of the vibrating arm portion and the conductive member. Furthermore, since the shortest distance between the vibrating arm portion and the conductive member can be set to 350 μm or less while suppressing the generation of stray capacitance, the oscillator can be made smaller.

[0011] An oscillator according to a third aspect of the present invention may be the oscillator according to the first or second aspect, wherein the distance in the opposing direction from the piezoelectric vibrating piece to the conductive member is greater than 0 μm and less than or equal to 100 μm.

[0012] According to the oscillator of the third aspect, by making the distance between the piezoelectric vibrating reed and the conductive member greater than 0 μm in the facing direction, the Coulomb force generated by stray capacitance can be reduced, and vibration inhibition due to the Coulomb force can be prevented. Furthermore, by making the distance between the piezoelectric vibrating reed and the conductive member 100 μm or less in the facing direction, the height dimension of the oscillator in the facing direction can be reduced, and the oscillator can be made smaller.

[0013] An oscillator according to a fourth aspect of the present invention is the oscillator according to the second aspect, wherein the distance from the tip of the head portion to the outer wall of the package may be 200 μm or less.

[0014] According to the oscillator of the fourth aspect, the distance between the excitation electrode and the conductive member can be sufficiently secured, and the occurrence of stray capacitance between the excitation electrode and the conductive member can be suppressed. Therefore, the distance from the tip of the head portion to the outer wall of the package can be reduced to 200 μm or less, and the oscillator can be made smaller.

[0015] An oscillator according to a fifth aspect of the present invention is the oscillator according to the first or second aspect, wherein the conductive member has a potential different from that of the excitation electrode routed around the head portion.

[0016] According to the oscillator of the fifth aspect, it is possible to suppress the occurrence of stray capacitance between the excitation electrode routed around the head portion and the conductive member having a different potential from the excitation electrode routed around the head portion.

[0017] An electronic device according to a sixth aspect of the present invention comprises a piezoelectric vibrating piece having a base, a vibrating arm portion composed of an arm portion extending from the base and a head portion connected to the tip of the arm portion, and an excitation electrode routed from the base to the tip of the head portion, an integrated circuit having a plurality of integrated circuit terminals, and a package accommodating the piezoelectric vibrating piece and the integrated circuit, wherein the excitation electrode is formed on at least the side of the vibrating arm portion, and the package comprises a mounting electrode for mounting the piezoelectric vibrating piece, an integrated circuit electrode for mounting the integrated circuit, a notch portion provided at the four corners of the package, an external electrode provided at the lower end of the package and having a different potential than the excitation electrode, and a conductive member extending from the lower end of the notch portion to the side of the package and conducting to the external electrode, and wherein the proximity portion of the excitation electrode, which is positioned at a position closest to the conductive member in the side direction of the package, is positioned so as not to overlap with the conductive member in the opposing direction in which the piezoelectric vibrating piece and the integrated circuit face each other.

[0018] According to the electronic device of the sixth aspect, in the excitation electrode of the piezoelectric vibrating reed, the proximity portion that is arranged at a position closest to the conductive member in the side direction of the package is arranged so as not to overlap with the conductive member in the opposing direction in which the piezoelectric vibrating reed and the integrated circuit face each other. Therefore, even if the excitation electrode is formed on the side of a tuning-fork-shaped piezoelectric vibrating reed having an arm portion and a head portion, a sufficient distance can be ensured between the excitation electrode and the conductive member, and the occurrence of stray capacitance between the excitation electrode and the conductive member can be suppressed.

[0019] An electronic device according to a seventh aspect of the present invention is the electronic device according to the sixth aspect, wherein the shortest distance from the vibrating arm portion to the conductive member may be 350 μm or less.

[0020] According to the electronic device of the seventh aspect, since the excitation electrode and the conductive member do not overlap in the opposing direction, even if the shortest distance between the vibrating arm and the conductive member is 350 μm or less, at which point vibration inhibition due to Coulomb force is likely to occur, the generation of stray capacitance between the excitation electrode of the vibrating arm and the conductive member can be suppressed. Furthermore, since the shortest distance between the vibrating arm and the conductive member can be set to 350 μm or less while suppressing the generation of stray capacitance, the oscillator can be made smaller. This allows the electronic device equipped with the oscillator to be made smaller.

[0021] An electronic device according to an eighth aspect of the present invention may be the electronic device according to the sixth or seventh aspect, wherein the distance in the opposing direction from the piezoelectric vibrating piece to the conductive member is greater than 0 μm and less than or equal to 100 μm.

[0022] According to the electronic device of the eighth aspect, by making the distance between the piezoelectric vibrating reed and the conductive member greater than 0 μm in the facing direction, the Coulomb force generated by stray capacitance can be reduced, and vibration inhibition due to the Coulomb force can be prevented. Furthermore, by making the distance between the piezoelectric vibrating reed and the conductive member 100 μm or less in the facing direction, the height dimension of the oscillator in the facing direction can be reduced, and the oscillator can be made smaller. This allows the electronic device equipped with the oscillator to be made smaller.

[0023] An electronic device according to a ninth aspect of the present invention is the electronic device according to the seventh aspect, wherein the distance from the tip of the head portion to the outer wall of the package may be 200 μm or less.

[0024] According to the electronic device of the ninth aspect, a sufficient distance can be secured between the excitation electrode and the conductive member, and the occurrence of stray capacitance between the excitation electrode and the conductive member can be suppressed, so that the distance from the tip of the head part to the outer wall of the package can be set to 200 μm or less, thereby enabling the oscillator to be miniaturized, and thus the electronic device incorporating the oscillator can be miniaturized.

[0025] An electronic device according to a tenth aspect of the present invention is the electronic device according to the sixth or seventh aspect, wherein the conductive member has a different potential from the excitation electrode routed around the head portion.

[0026] According to the electronic device of the tenth aspect, it is possible to suppress the occurrence of stray capacitance between the excitation electrode routed around the head portion and a conductive member having a different potential from the excitation electrode routed around the head portion. [Effects of the Invention]

[0027] According to the oscillator and electronic device of the present invention, it is possible to provide an oscillator and electronic device that can suppress the occurrence of stray capacitance between an excitation electrode formed on a tuning-fork-shaped piezoelectric vibrating piece and a conductive member. [Brief explanation of the drawings]

[0028] [Figure 1] 1 is a perspective view showing an appearance of an oscillator according to a first embodiment. [Figure 2] FIG. 1 is a plan view showing an oscillator according to a first embodiment. [Figure 3] 1 is a perspective view showing the appearance of a piezoelectric vibrating reed included in an oscillator according to a first embodiment. [Figure 4] FIG. 1 is an exploded perspective view showing an oscillator according to a first embodiment. [Figure 5] FIG. 3 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 1 is a perspective view showing an example of a conventional oscillator. [Figure 7] 1 is a diagram illustrating an example of an electronic device in which an oscillator according to a first embodiment is mounted. [Figure 8] 1 is a diagram illustrating an example of an electronic device in which an oscillator according to a first embodiment is implemented. [Figure 9] 1 is a diagram illustrating an example of an electronic device in which an oscillator according to a first embodiment is mounted. [Figure 10] FIG. 2 is a plan view showing a substrate of an electronic device on which the oscillator according to the first embodiment is mounted. [Figure 11] FIG. 11 is a cross-sectional view taken along line IX-IX in FIG. [Figure 12] FIG. 10 is a cross-sectional view showing an example of a substrate on which a conventional oscillator is mounted. [Figure 13] FIG. 10 is a plan view showing an oscillator according to a second embodiment. [Figure 14] FIG. 10 is an exploded perspective view showing an oscillator according to a second embodiment. [Figure 15] FIG. 14 is a cross-sectional view taken along line XV-XV in FIG. [Figure 16] FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. [Figure 17] 10 is a graph showing the relationship between the distance from an excitation electrode to a conductive member in an oscillator and Coulomb force. DETAILED DESCRIPTION OF THE INVENTION

[0029] (First embodiment) A first embodiment of the present invention will be described with reference to the drawings.

[0030] Fig. 1 is an external perspective view showing an oscillator 100 according to this embodiment. Fig. 2 is a plan view showing the oscillator 100. Fig. 3 is an external perspective view showing a piezoelectric vibrating piece 20 included in the oscillator 100. Fig. 4 is an exploded perspective view showing the oscillator 100. Fig. 5 is a cross-sectional view taken along line VV in Fig. 2.

[0031] The oscillator 100 includes a piezoelectric vibrator 101 and an integrated circuit 102. The oscillator 100 is an oscillator used in electronic devices, and can be used, for example, as a single-function oscillator for a clock. The oscillator 100 can be used in a timing control device that controls operation timing. The oscillator 100 can be used in a device that provides time, a calendar, etc.

[0032] The piezoelectric vibrator 101 is a so-called ceramic package type surface-mount vibrator. The piezoelectric vibrator 101 includes a package 10, a piezoelectric vibrating piece 20, and external electrodes 30.

[0033] 1, 2, 4, and 5, the direction in which the piezoelectric vibrating reed 20 and the integrated circuit 102 face each other is defined as the "thickness direction (vertical direction, facing direction) T," the orientation in which the piezoelectric vibrating reed 20 is provided is defined as the "upper side T1" in the thickness direction T, and the opposite orientation is defined as the "lower side T2" ​​in the thickness direction T. The longitudinal direction of the piezoelectric vibrating reed 20 is defined as the "longitudinal direction L," one side in the longitudinal direction L is defined as the "base end side L1," and the other side is defined as the "tip side L2" in the longitudinal direction L. The shorter side of the piezoelectric vibrating reed 20 is defined as the "width direction (left-right direction) W," one side in the width direction W is defined as the "right side W1," and the other side is defined as the "left side W2" in the width direction W.

[0034] In addition, a plane perpendicular to the thickness direction T is defined as a "horizontal plane HP." The horizontal plane HP is a plane that includes the longitudinal direction L and the width direction W.

[0035] The package 10 includes a package body 11, a seal ring 12, a sealing plate 13, and a conductive member 40. The package 10 has a vibrating piece mounting region (cavity) R1 in which the piezoelectric vibrating piece 20 is mounted, and a chip mounting region R2 in which the integrated circuit 102 is mounted.

[0036] The package body 11 includes a first base substrate 1, a second base substrate 2, and a third base substrate 3.

[0037] The first base substrate 1 is a substrate having a rectangular shape in a plan view seen from the thickness direction T. The first base substrate 1 includes a first frame 1a and a second frame 1b provided below the first frame 1a at a position T2.

[0038] The outer shape of the first frame 1a and the outer shape of the second frame 1b are the same when viewed in a plan view from the thickness direction T. The first frame 1a and the second frame 1b are provided with through holes that penetrate in the thickness direction T.

[0039] In the first base substrate 1, the through hole of the first frame 1a and the through hole of the second frame 1b have the same shape and are connected to each other in a plan view seen in the thickness direction T. The through hole of the first base substrate 1 has a rounded rectangular shape in a plan view seen in the thickness direction T.

[0040] A vibrating element mounting region R1 is formed in a space surrounded by the inner surface of the through-hole of the first base substrate 1. That is, the vibrating element mounting region R1 is surrounded by the first base substrate 1 in the direction along the horizontal plane HP.

[0041] In the following description, the direction along the horizontal plane HP is also referred to as the side direction of the package 10. For example, a plan view seen from the side direction of the package 10 refers to a plan view seen from any direction along the horizontal plane HP.

[0042] A pair of mounting portions 4 that protrude into the resonator element mounting region R1 are formed on the inner surfaces of the right side W1 and left side W2 of the through hole of the first base substrate 1. The pair of mounting portions 4 are arranged near the center in the longitudinal direction L. In this embodiment, the pair of mounting portions 4 protrude from the second frame 1b.

[0043] On the upper T1 surfaces of the pair of mounting portions 4, a pair of electrode pads (mounting electrodes) 4a, which are connection electrodes with the piezoelectric vibrating reed 20, are formed.

[0044] The pair of mounting electrodes 4a are configured, for example, by a single layer film made of a single metal formed by vapor deposition, sputtering, or the like, or by a laminated film in which different metals are laminated.

[0045] The second base substrate 2 is a substrate having a rectangular shape in a plan view seen from the thickness direction T. The outer shape of the first base substrate 1 and the outer shape of the second base substrate 2 are the same in a plan view seen from the thickness direction T.

[0046] The second base substrate 2 is integrally joined by sintering or the like to the lower surface (lower surface T2) of the first base substrate 1. The upper surface (upper surface T1) of the second base substrate 2 forms the bottom surface of the resonator element mounting region R1.

[0047] The third base substrate 3 is a substrate having a rectangular shape in a plan view seen from the thickness direction T. The outer shape of the third base substrate 3 and the outer shape of the second base substrate 2 are the same shape in a plan view seen from the thickness direction T.

[0048] The third base substrate 3 is integrally joined to the lower surface of the second base substrate 2 by sintering or the like. The third base substrate 3 has a through hole penetrating in the thickness direction T. The through hole of the third base substrate 3 has a rounded rectangular shape in a plan view seen from the thickness direction T.

[0049] A chip mounting area R2 is formed in the space surrounded by the inner surface of the through hole of the third base substrate 3. That is, the chip mounting area R2 is surrounded by the third base substrate 3 in the lateral direction of the package 10.

[0050] The first base substrate 1, the second base substrate 2, and the third base substrate 3 are, for example, substrates made of ceramics. Examples of ceramic materials that can be used for the first base substrate 1, the second base substrate 2, and the third base substrate 3 include alumina-made HTCC (High Temperature Co-Fired Ceramic) and glass-ceramic-made LTCC (Low Temperature Co-Fired Ceramic).

[0051] At the four corners of the first base substrate 1, the second base substrate 2 and the third base substrate 3, quadrant-arc cutout portions 11a are formed across the entire thickness direction T of the first base substrate 1, the second base substrate 2 and the third base substrate 3 when viewed in a plane from the thickness direction T.

[0052] The first base substrate 1, the second base substrate 2, and the third base substrate 3 are fabricated by, for example, stacking and bonding three wafer-like ceramic substrates, forming a matrix of through-holes that penetrate the three bonded ceramic substrates, and cutting the three ceramic substrates into a grid pattern based on each through-hole. At this time, the through-holes are divided into four, forming the notches 11a.

[0053] The seal ring 12 is a conductive frame-shaped member that is smaller than the outer shapes of the first base substrate 1, the second base substrate 2, and the third base substrate 3. The seal ring 12 is bonded to the upper surface of the first base substrate 1.

[0054] The inner surface of the seal ring 12, together with the inner surface of the through hole of the first base substrate 1, surrounds the resonator element mounting region R1 from the side surface of the package 10. The seal ring 12 may be made of a material such as a nickel-based alloy.

[0055] The sealing plate 13 is a conductive substrate. The sealing plate 13 is bonded to the upper surface of the seal ring 12. The sealing plate 13 airtightly seals the opening of the seal ring 12. The vibrating element mounting region R1 is a space defined by the first base substrate 1, the second base substrate 2, the seal ring 12, and the sealing plate 13. The vibrating element mounting region R1 is a hermetically sealed space.

[0056] The conductive member 40 will be described later.

[0057] The piezoelectric vibrating piece 20 is housed in a vibrating piece mounting region R1 of the hermetically sealed package 10. The piezoelectric vibrating piece 20 is a vibrating piece including a piezoelectric plate made of, for example, quartz crystal.

[0058] The piezoelectric vibrating piece 20 is a tuning-fork type vibrating piece that includes a base 21 and a pair of vibrating arms 22 . The base 21 includes a base main body 21a and a pair of support arms 21b.

[0059] The pair of support arms 21b are connected to the right side W1 and left side W2 of the base body 21a and extend in the longitudinal direction L. As shown in FIG. 2, most of the pair of support arms 21b are disposed on the tip side L2 of the base body 21a.

[0060] The pair of supporting arms 21b are supported by the mounting portion 4 from below T2 via the mounting electrode 4a. The pair of supporting arms 21b are adhered to the mounting electrode 4a with a conductive adhesive.

[0061] The pair of vibrating arms 22 extend from the base body 21a to the tip side L2. The pair of vibrating arms 22 are disposed apart from the second base substrate 2 in the thickness direction T.

[0062] The pair of vibrating arms 22 includes an arm portion 22a extending from the base body 21a to the tip side L2, and a head portion 22b connected to the tip of the arm portion 22a.

[0063] The dimension of the head portion 22b is larger than the dimension of the arm portion 22a in the width direction W. That is, the pair of vibrating arms 22 are hammerhead type vibrating arms.

[0064] By using a hammerhead type vibrating arm 22, it is possible to increase the weight of the tip of the vibrating arm 22 and the moment of inertia during vibration, making it easier for the vibrating arm 22 to vibrate. In other words, it is possible to adjust the frequency of the piezoelectric vibrating piece 20. As a result, it is possible to shorten the length of the vibrating arm 22, thereby achieving miniaturization.

[0065] The piezoelectric plate forming the piezoelectric vibrating piece 20 is not limited to quartz crystal, but may be made of, for example, aluminum nitride (AlN), lead zirconate titanate (PZT), or the like.

[0066] An electrode film is disposed on the outer surface including the front and back surfaces of the piezoelectric vibrating piece 20. The electrode film includes excitation electrodes 20a and 20b, mount electrodes that serve as mount portions when the base 21 is mounted on the package 10, and connection wiring that connects the excitation electrodes 20a and 20b and the mount electrodes.

[0067] The excitation electrodes 20a, 20b provided on the electrode film are arranged on the outer surfaces of the pair of vibrating arms 22. Two systems of excitation electrodes 20a, 20b are arranged on the outer surfaces of the pair of vibrating arms 22, which vibrate the pair of vibrating arms 22 when a predetermined voltage is applied. The excitation electrodes 20a, 20b are routed from the base 21 to the tip of the head portion 22b. The excitation electrodes 20a, 20b may be arranged on the base 21.

[0068] 3, the piezoelectric vibrating piece 20 has a predetermined thickness, and the excitation electrodes 20a and 20b are formed on at least the side surfaces of the vibrating arm portions 22. The side surfaces of the vibrating arm portions 22 refer to surfaces that are perpendicular to the horizontal plane HP in the piezoelectric vibrating piece 20 mounted on the oscillator 100. The side surfaces of the vibrating arm portions 22 do not need to be strictly perpendicular to the horizontal plane HP.

[0069] The electrode film is, for example, a laminated film of chromium (Cr) and gold (Au), which is formed by depositing a chromium film that has good adhesion to quartz crystal as a base, and then laminating a thin gold film on the chromium film. The film configuration of the electrode film is not limited to this, and for example, a thin gold film may be further laminated on a laminated film of chromium and nichrome (NiCr), or it may be a single layer film of chromium, nickel, aluminum (Al), titanium (Ti), etc.

[0070] The external electrode 30 is provided on the lower end of the third base substrate 3. The external electrode 30 is configured, for example, as a single-layer film made of a single metal formed by vapor deposition, sputtering, or the like, or as a laminated film in which different metals are laminated.

[0071] In this embodiment, the external electrode 30 includes a first external electrode 31, a second external electrode 32, a third external electrode 33, and a fourth external electrode .

[0072] The first external electrode 31, the second external electrode 32, the third external electrode 33 and the fourth external electrode 34 are provided at the lower ends of the square corners of the third base substrate 3, respectively.

[0073] The external electrode 30 and the mounting electrode 4a are electrically connected to each other via through-wiring (not shown) that penetrates the second frame 1b of the first base substrate 1, the second base substrate 2, and the third base substrate 3 in the thickness direction T.

[0074] When a predetermined voltage is applied to the external electrode 30, a current flows through the excitation electrodes 20a, 20b of the vibrating arm 22, generating an electric field. The pair of vibrating arms 22 vibrate at a predetermined resonance frequency in directions approaching and separating from each other (width direction W) due to, for example, an inverse piezoelectric effect caused by the generated electric field.

[0075] The pair of vibrating arms 22 are arranged parallel to each other in the width direction W, and each is connected to the base body 21a. The pair of vibrating arms 22 vibrate in a direction in which they approach and move away from each other (the width direction W), with their ends on the base end side L1 connected to the base body 21a as fixed ends and their ends on the tip side L2 as free ends.

[0076] The conductive member 40 is an electrically conductive member that extends from the lower end of the notch 11a to the side surface of the package 10 and is electrically connected to the external electrode 30. The conductive member 40 is provided by, for example, wet plating.

[0077] In the following description, the portion of the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 that is closest to the conductive member 40 in the side direction of the package 10 is referred to as the "close portion." The close portion is, for example, the excitation electrodes 20a, 20b routed to the end of the tip side L2 of the head portion 22b, or the excitation electrodes 20a, 20b routed to the end of the base side L1 of the base portion 21.

[0078] The close portions of the excitation electrodes 20a and 20b are arranged at positions that do not overlap with the conductive member 40 in the thickness direction (opposing direction) T.

[0079] 5, in this embodiment, the conductive member 40 extends from the lower end of the third base substrate 3 to the upper end of the second base substrate 2. The conductive member 40 is not provided on the first base substrate 1.

[0080] The piezoelectric vibrating piece 20 is spaced apart from the second base substrate 2 in the thickness direction T, and is located above the second base substrate 2 at a height T1.

[0081] That is, the excitation electrodes 20a and 20b of the piezoelectric vibrating reed 20 are spaced apart from the conductive member 40 in the thickness direction T, and therefore do not overlap with the conductive member 40 in the thickness direction T.

[0082] When a predetermined voltage is applied to the external electrode 30, the conductive member 40 has a different potential from the excitation electrodes 20a, 20b of the piezoelectric vibrating piece 20. The conductive member 40 has a different potential from the excitation electrodes 20a, 20b routed to the head portion 22b.

[0083] At this time, by arranging the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 so as not to overlap with the conductive member 40 in the thickness direction T, it is possible to suppress the occurrence of stray capacitance between the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 and the conductive member 40. By suppressing the occurrence of stray capacitance between the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 and the conductive member 40, it is possible to suppress the deterioration of the voltage characteristics of the frequency deviation of the oscillator 100.

[0084] The excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 only need to be arranged so that at least the closest portion to the conductive member 40 in the side direction of the package 10 does not overlap with the conductive member 40 in the thickness direction T. By arranging the close portion so as not to overlap with the conductive member 40 in the thickness direction T, it is possible to suppress the occurrence of stray capacitance between the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 and the conductive member 40.

[0085] Furthermore, the excitation electrodes 20a and 20b of the piezoelectric vibrating reed 20 are arranged so as not to overlap with the conductive member 40 when viewed in a plan view from the diagonal directions D1 and D2.

[0086] As illustrated in FIG. 2, the diagonal directions D1 and D2 refer to the direction of the side surface of the package 10 that connects the notched portion 11a and the excitation electrodes 20a and 20b over the shortest distance.

[0087] The diagonal direction (first diagonal direction) D1 is a direction that connects the excitation electrodes 20a, 20b and the notch portion 11a at the end of the tip side L2 of the piezoelectric vibrating reed 20 over the shortest distance. That is, when viewed in the thickness direction T from the direction that connects the excitation electrodes 20a, 20b and the notch portion 11a at the end of the tip side L2 of the piezoelectric vibrating reed 20 over the shortest distance, the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 are arranged so as not to overlap with the conductive member 40.

[0088] The diagonal direction (second diagonal direction) D2 is a direction that connects the excitation electrodes 20a, 20b and the cutout portion 11a at the end of the base end side L1 of the piezoelectric vibrating reed 20 over the shortest distance. That is, when viewed in the thickness direction T from the direction that connects the excitation electrodes 20a, 20b and the cutout portion 11a at the end of the base end side L1 of the piezoelectric vibrating reed 20 over the shortest distance, the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 are arranged so as not to overlap with the conductive member 40.

[0089] When the excitation electrode and a conductive member having a different potential from that of the excitation electrode are close to each other, stray capacitance may occur between the excitation electrode and the conductive member.

[0090] In this embodiment, the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 are arranged so as not to overlap with the conductive member 40 in the thickness direction T, thereby suppressing the generation of stray capacitance between the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 and the conductive member 40. Specifically, the excitation electrodes 20a, 20b are arranged so that the planes of the excitation electrodes 20a, 20b and the plane of the conductive member 40 do not overlap with each other in the thickness direction T. Therefore, the distance between the piezoelectric vibrating reed 20 and the conductive member 40 in the side direction of the package 10 can be reduced, and the oscillator 100 can be made smaller.

[0091] Here, the problems with conventional oscillators will be described. FIG. 6 is a perspective view showing an example of a conventional oscillator 100B.

[0092] In the conventional oscillator 100B, when the conductive member 40B is plated in the cutout portion of the package, as shown in FIG. 6, the conductive member 40B may unintentionally be plated almost up to the top edge of the cutout portion.

[0093] In particular, in the conventional oscillator 100B, when the external dimensions of the package or the like are reduced and the conductive member 40B is plated using a conventional manufacturing process, there is a possibility that the conductive member 40B will be plated almost up to the upper end of the notch.

[0094] 6, the conductive member 40B is plated on the second frame of the first base substrate at the notch, and reaches a part of the first frame of the first base substrate at the notch.

[0095] In the conventional oscillator 100B, the piezoelectric vibrating reed is mounted on a mounting electrode of the second frame. Therefore, in the conventional oscillator 100B illustrated in Fig. 6, the excitation electrode of the piezoelectric vibrating reed and the conductive member 40B are arranged to overlap in the thickness direction T.

[0096] In this case, it is not possible to ensure a sufficient distance between the excitation electrode of the piezoelectric vibrating reed and the conductive member 40B, and there is a risk that stray capacitance will occur between the excitation electrode and the conductive member 40B.

[0097] In the conventional oscillator 100B, in order to ensure a sufficient distance between the excitation electrode and the conductive member 40B, it is necessary to arrange the excitation electrode and the conductive member 40B at a distance from each other in the side direction of the package. In other words, it is necessary to increase the outer dimensions of the package, making it difficult to reduce the size of the package.

[0098] In conventional oscillators, it was possible to ensure a sufficient distance between the excitation electrode and the conductive member, but as oscillators become smaller, it has become more difficult to ensure a sufficient distance between the excitation electrode and the conductive member, and the influence of stray capacitance occurring between the excitation electrode and the conductive member has become greater.

[0099] Compared to oscillators equipped with AT vibrating pieces, oscillators equipped with tuning-fork-shaped piezoelectric vibrating pieces are more likely to have stray capacitance between the excitation electrode and the conductive material due to the larger thickness of the piezoelectric vibrating piece and the excitation electrode being formed on the side, and when the oscillator is made smaller, the generation of stray capacitance tends to cause a deterioration in vibration characteristics.

[0100] Furthermore, in an oscillator using a tuning-fork type piezoelectric vibrating piece, when the package is made smaller, as the arm portion becomes shorter, it is necessary to increase the area of ​​the head portion in order to adjust the frequency of the piezoelectric vibrating piece.

[0101] Therefore, the proportion of the area occupied by the head portion in the piezoelectric vibrating piece increases, and the area occupied by the excitation electrodes formed on the head portion also increases relatively. This may increase the stray capacitance generated between the excitation electrodes and the conductive member. The excitation electrodes formed on the head portion include excitation electrodes formed on the side surfaces of the head portion.

[0102] As described above, oscillators equipped with tuning-fork type piezoelectric vibrating pieces tend to be more susceptible to the stray capacitance that accompanies miniaturization of the package than oscillators using AT vibrating pieces.

[0103] The proximity portions of the excitation electrodes 20a, 20b in the oscillator 100 are arranged at positions that do not overlap with the conductive member 40 in the thickness direction T. Therefore, even when the oscillator 100 is equipped with a tuning-fork-shaped piezoelectric vibrating piece 20, the occurrence of stray capacitance between the excitation electrodes 20a, 20b and the conductive member 40 can be suppressed, and deterioration of the voltage characteristics of the frequency deviation of the oscillator 100 can be suppressed. As a result, the oscillator 100 can be miniaturized while suppressing the influence of stray capacitance occurring between the excitation electrodes 20a, 20b and the conductive member 40.

[0104] By preventing the excitation electrodes 20a, 20b at the tip end (head portion 22b) of the vibrating arm portion 22 from overlapping with the conductive member 40, the voltage characteristics of the frequency deviation of the oscillator 100 can be more suitably prevented from deteriorating.

[0105] Here, in the oscillator 100 of this embodiment, for example, by making the dimensions (height) of the second frame 1b and the mounting portion 4 in the thickness direction T 50 μm or more, the stray capacitance occurring between the excitation electrodes 20a, 20b of the piezoelectric vibrating piece 20 and the conductive member 40 can be reduced.

[0106] In the oscillator 100 of this embodiment, for example, the height of the second frame 1b and the mounting portion 4 is made larger than the height of the second frame and the mounting portion in the conventional oscillator 100B, so that the excitation electrodes 20a, 20b of the piezoelectric vibrating piece 20 and the conductive member 40 do not overlap in the thickness direction T.

[0107] Therefore, the oscillator 100 in this embodiment can ensure a sufficient distance between the excitation electrodes 20a, 20b and the conductive member 40, and can suppress the occurrence of stray capacitance between the excitation electrodes 20a, 20b and the conductive member 40.

[0108] Therefore, compared to the conventional oscillator 100B, the oscillator 100 of this embodiment can reduce the distance between the excitation electrodes 20a, 20b and the conductive member 40 in the side direction of the package 10. In other words, the oscillator 100 of this embodiment can be made smaller than the conventional oscillator 100B.

[0109] It should be noted that the oscillator 100 only needs to be arranged so that the excitation electrodes 20a, 20b and the conductive member 40 do not overlap in the thickness direction T, and the method for achieving this is not limited to the method of increasing the height of the second frame 1b and the mounting portion 4. The oscillator 100 may be arranged so that the excitation electrodes 20a, 20b and the conductive member 40 do not overlap in the thickness direction T, for example, by reducing the height of the conductive member 40 in the thickness direction T.

[0110] In the side direction of the package 10, the distance between the close portions of the excitation electrodes 20a, 20b and the conductive member 40 is preferably 200 μm or less. By setting the distance between the close portions of the excitation electrodes 20a, 20b and the conductive member 40 to 200 μm or less, the oscillator 100 can be made smaller.

[0111] 2 indicates the shortest distance between the tip of the head portion 22b and the outer wall 11s of the package 10 in the longitudinal direction L when viewed from the thickness direction T. The dimension M1 is, for example, 200 μm or less. Note that, from the viewpoint of miniaturizing the oscillator 100, the shortest distance between the head portion 22b and the outer wall of the package 10 in a direction other than the longitudinal direction L when viewed from the thickness direction T (for example, the width direction W) is also preferably 200 μm or less.

[0112] 2 indicates the shortest distance between the base 21 and the outer wall 11s of the package 10 in the longitudinal direction L. The dimension M2 is, for example, 200 μm.

[0113] The distance between the head portion 22b and the notch portion 11a is preferably 150 μm or less in the longitudinal direction L. By making the distance between the head portion 22b and the notch portion 11a 150 μm or less, the oscillator 100 can be made smaller.

[0114] 2 indicates the shortest distance between the head portion 22b and the notch portion 11a in the longitudinal direction L. The dimension M3 is, for example, 100 μm or less.

[0115] 2 indicates the shortest distance between the base 21 and the notch 11a in the longitudinal direction L. The dimension M4 is, for example, 100 μm or less.

[0116] Furthermore, in the side direction of the package 10, by making the distance between the approaching portions of the excitation electrodes 20a, 20b and the outer wall 11s of the package 10 equal to the distance between the approaching portions and the conductive member 40, the external dimensions of the package 10 when viewed in a plane from the thickness direction T can be reduced, and the oscillator 100 can be made smaller.

[0117] The integrated circuit 102 is an integrated circuit chip having a plurality of integrated circuit terminals and an oscillator circuit, and is provided in the chip mounting region R2, as shown in FIG.

[0118] The integrated circuit 102 performs various arithmetic operations on the electrical signal input from the piezoelectric vibrator 101, thereby generating and outputting an output signal including frequency components.

[0119] The integrated circuit 102 has a plurality of integrated circuit terminals that are electrically connected to integrated circuit electrodes 5 formed on the lower surface of the second base substrate 2. The integrated circuit electrodes 5 are configured, for example, as a single-layer film made of a single metal formed by vapor deposition, sputtering, or the like, or as a laminated film made of different metals laminated together.

[0120] The integrated circuit electrode 5 and the mounting electrode 4a are electrically connected to each other via through-wiring (not shown) that penetrates the second frame 1b of the first base substrate 1 and the second base substrate 2 in the thickness direction T.

[0121] 7, 8 and 9 are diagrams showing an example of an electronic device ED in which the oscillator 100 is implemented.

[0122] The electronic device ED illustrated in Fig. 7 is a watch. The electronic device ED illustrated in Fig. 8 is a computer. The electronic device ED illustrated in Fig. 9 is a smartphone. The electronic device ED in which the oscillator 100 is implemented is not limited to a watch, a computer, or a smartphone, and may be another electronic device.

[0123] Fig. 10 is a plan view showing a substrate CB of an electronic device ED on which an oscillator 100 is mounted. Fig. 11 is a cross-sectional view taken along line IX-IX in Fig. 10.

[0124] The oscillator 100 is bonded to a substrate CB by a bonding material S, and is mounted on an electronic device ED that includes the substrate CB. The bonding material S is, for example, an alloy such as solder used in soldering.

[0125] As shown in Fig. 10, the joining member S is provided in the notch 11a. Furthermore, as shown in Fig. 11, the joining member S is connected to the conductive member 40 of the oscillator 100 on the substrate CB.

[0126] In the oscillator 100, the proximity portions of the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 are arranged so as not to overlap with the conductive member 40 in the thickness direction T. In addition, the bonding member S that bonds the oscillator 100 to the substrate CB is connected to the conductive member 40.

[0127] Therefore, even when the oscillator 100 is mounted on the substrate CB by the bonding member S, the occurrence of stray capacitance between the bonding member S and the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 can be suppressed.

[0128] Here, a problem with an electronic device having a substrate on which a conventional oscillator is mounted will be described.

[0129] FIG. 12 is an example of a cross-sectional view of a conventional oscillator 100B mounted on a substrate CB.

[0130] As shown in Figures 6 and 12, in the conventional oscillator 100B, the conductive member 40B is plated almost up to the upper end of the cutout portion, so that the excitation electrode of the piezoelectric vibrating piece and the conductive member 40B are arranged overlapping in the thickness direction T.

[0131] A conventional oscillator 100B is mounted on a substrate CB by a bonding member SB such as solder, as shown in Fig. 12. The bonding member SB is provided mainly to be connected to the conductive member 40B, and therefore, as shown in Fig. 12, is provided to approximately the same height as the conductive member 40B in the thickness direction T.

[0132] Therefore, in an electronic device equipped with the conventional oscillator 100B, the excitation electrode of the piezoelectric vibrating piece and the bonding member SB may be arranged overlapping in the thickness direction T, and there is a risk of stray capacitance occurring between the excitation electrode of the piezoelectric vibrating piece and the bonding member SB.

[0133] The occurrence of stray capacitance may deteriorate the voltage characteristics of the frequency deviation and the vibration characteristics of the oscillator. In particular, in the case of a tuning fork-type vibrating piece having two or more vibrating arms, the difference in the amount of stray capacitance generated in each vibrating arm may cause the vibration balance in each vibrating arm to deteriorate, resulting in deterioration of the vibration characteristics. Furthermore, compared to AT vibrating pieces, tuning fork-type vibrating pieces are thicker and have excitation electrodes formed on the side surfaces, which makes them more susceptible to stray capacitance between the excitation electrodes and the conductive material, and when the oscillator is miniaturized, the occurrence of stray capacitance tends to deteriorate the vibration characteristics.

[0134] In the oscillator 100 of this embodiment, for example, the height of the second frame 1b and the mounting portion 4 is made larger than the height of the second frame and the mounting portion of the conventional oscillator 100B, so that the excitation electrodes 20a, 20b of the piezoelectric vibrating piece 20 do not overlap with the bonding member S in the thickness direction T.

[0135] Therefore, in the oscillator 100 of this embodiment, even if the piezoelectric vibrating piece 20 has a vibrating arm portion 22 and the excitation electrodes 20a, 20b are formed on the side surfaces of the vibrating arm portion 22, the occurrence of stray capacitance between the excitation electrodes 20a, 20b of the piezoelectric vibrating piece 20 and the bonding member S can be suppressed.

[0136] The oscillator 100 and electronic device ED of this embodiment include a piezoelectric vibrating reed 20 having a base 21, vibrating arms 22, and excitation electrodes 20a, 20b routed from the base 21 to the tip of a head 22b, and a package 10 that houses the piezoelectric vibrating reed 20. The excitation electrodes 20a, 20b are formed on at least the side surfaces of the vibrating arms 22. The package 10 includes cutouts 11a provided at the four corners of the package 10, and a conductive member 40 that extends from the lower end of the cutout 11a to the side surface of the package 10 and has a different potential from the excitation electrodes.

[0137] In the excitation electrodes 20a and 20b, the proximity portions arranged at positions closest to the conductive member 40 in the side direction of the package 10 are arranged so as not to overlap with the conductive member 40 in the thickness direction T.

[0138] As a result, it is possible to provide the oscillator 100 and the electronic device ED that can suppress the occurrence of stray capacitance between the excitation electrodes 20a, 20b formed on the tuning-fork-type piezoelectric vibrating piece 20 and the conductive member 40.

[0139] Second Embodiment An oscillator 100C according to a second embodiment will be described. In the following description, the same components as those already described will be assigned the same reference numerals and redundant description will be omitted.

[0140] Fig. 13 is a plan view showing an oscillator 100C according to a second embodiment. Fig. 14 is an exploded perspective view showing the oscillator 100C. Fig. 15 is a cross-sectional view taken along line XV-XV in Fig. 13. Fig. 16 is a cross-sectional view taken along line XVI-XVI in Fig. 13.

[0141] The oscillator 100C includes a piezoelectric vibrator 101C and an integrated circuit 102. The piezoelectric vibrator 101C is a so-called ceramic package type surface-mount vibrator. The piezoelectric vibrator 101C includes a package 10C, a piezoelectric vibrating piece 20, and an external electrode 30.

[0142] The package 10C includes a package body 11C, a seal ring 12, a sealing plate 13, and a conductive member 40. The package 10C has a vibrating piece mounting region (cavity) R1 in which the piezoelectric vibrating piece 20 is mounted, and a chip mounting region R2 in which the integrated circuit 102 is mounted.

[0143] The package body 11C includes a first base substrate 1C, a second base substrate 2, and a third base substrate 3.

[0144] The first base substrate 1C is a substrate having a rectangular shape in a plan view seen from the thickness direction T. The outer shape of the first base substrate 1C and the outer shapes of the second base substrate 2 and the third base substrate 3 are the same in a plan view seen from the thickness direction T. The second base substrate 2 is integrally bonded to the lower surface of the first base substrate 1C by sintering or the like.

[0145] The first base substrate 1C is, for example, a substrate made of ceramics. Examples of ceramic materials that can be used for the first base substrate 1C include alumina-made HTCC (High Temperature Co-Fired Ceramic) and glass-ceramic-made LTCC (Low Temperature Co-Fired Ceramic).

[0146] At the four corners of the first base substrate 1C, cutout portions 11Ca having a quadrant arc shape when viewed in a plan view from the thickness direction T are formed over the entire thickness direction T of the first base substrate 1C, the second base substrate 2, and the third base substrate 3.

[0147] The first base substrate 1C, the second base substrate 2, and the third base substrate 3 are fabricated by, for example, stacking and bonding three wafer-like ceramic substrates, forming a matrix of through-holes that penetrate the three bonded ceramic substrates, and cutting the three ceramic substrates into a lattice pattern based on each through-hole. At this time, the through-holes are divided into four to form the notched portions 11Ca.

[0148] As described above, the first base substrate 1 of the first embodiment has a first frame 1a and a second frame 1b. The first base substrate 1 of the first embodiment is formed of a two-layer substrate consisting of the first frame 1a and the second frame 1b. That is, the package body 11 of the first embodiment is composed of four layers consisting of the first frame 1a, the second frame 1b, the second base substrate 2, and the third base substrate 3.

[0149] The first base substrate 1C of this embodiment is formed from a single substrate, similar to the second base substrate 2 and the third base substrate 3. That is, the package body 11C of this embodiment is configured from three layers consisting of the first base substrate 1C, the second base substrate 2, and the third base substrate 3.

[0150] In the package body 11C of this embodiment, a mounting portion 4C is provided at a position corresponding to the pair of support arms 21b on the upper surface of the second base substrate 2. The mounting portion 4C is configured, for example, by a single-layer film made of a single metal formed by vapor deposition, sputtering, or the like, or a laminated film in which different metals are laminated, and functions as a mounting electrode that is a connection electrode with the piezoelectric vibrating reed 20.

[0151] In the piezoelectric vibrating piece 20 mounted on the mounting portion 4C, the distance from the head portion 22b to the outer wall 11Cs of the package 10C is preferably 200 μm or less, which allows the package 10C to be miniaturized.

[0152] The piezoelectric vibrating piece 20 mounted on the three-layer package body 11C of this embodiment has one less substrate layer forming the package body 11C than the piezoelectric vibrating piece 20 mounted on the four-layer package body 11 of the first embodiment, so the distance between the piezoelectric vibrating piece 20 and the conductive member 40 is likely to be smaller.

[0153] The excitation electrodes 20a, 20b of the piezoelectric vibrating piece 20 provided in the oscillator 100C of this embodiment are arranged so that the proximity portion located at the position closest to the conductive member 40 in the side direction of the package 10C does not overlap with the conductive member 40 in the opposing direction T, similar to the oscillator 100 of the first embodiment.

[0154] Therefore, even with the three-layer structure, the oscillator 100C of this embodiment can suppress the occurrence of stray capacitance between the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 and the conductive member 40. By making the package body 11C a three-layer structure and suppressing the occurrence of stray capacitance between the excitation electrodes 20a, 20b and the conductive member 40, the oscillator 100C can be made even more compact.

[0155] 15 and 16 indicates the distance from the piezoelectric vibrating piece 20 to the conductive member 40 in the opposing direction T. The dimension H1 is preferably greater than 0 μm and equal to or less than 100 μm.

[0156] Furthermore, the shortest distance from the vibrating arm portion 22 to the conductive member 40 is preferably 350 μm or less. By setting the dimension H1 to 100 μm or less and by setting the shortest distance from the vibrating arm portion 22 to the conductive member 40 to 350 μm or less, the oscillator 100C can be further miniaturized. Note that the distance from the tip (head portion 22b) of the vibrating arm portion 22 to the outer wall 11Cs of the package is preferably shorter than the shortest distance from the vibrating arm portion 22 to the conductive member 40. This allows the oscillator 100C to be suitably miniaturized.

[0157] Even if the oscillator 100C is miniaturized, with the dimension H1 being 100 μm or less and the shortest distance from the vibrating arm portion 22 to the conductive member 40 being 350 μm or less, the occurrence of stray capacitance between the excitation electrodes 20a, 20b and the conductive member 40 can be suppressed by arranging the proximity portions of the excitation electrodes 20a, 20b and the conductive member 40 so that they do not overlap in the opposing direction T.

[0158] For example, in a conventional oscillator in which the excitation electrodes and the conductive member are arranged to overlap, vibration inhibition due to Coulomb force is likely to occur when the shortest distance between the vibrating arm portion and the conductive member is 350 μm or less. In the oscillator 100C, by arranging the proximity portions of the excitation electrodes 20 a, 20 b and the conductive member 40 so that they do not overlap in the opposing direction T, it is possible to suppress the occurrence of stray capacitance between the excitation electrodes 20 a, 20 b and the conductive member 40 even when the shortest distance from the vibrating arm portion 22 to the conductive member 40 is 350 μm or less.

[0159] Furthermore, by making the dimension H1 larger than 0 μm, a sufficient distance can be secured between the excitation electrodes 20a, 20b and the conductive member 40, and the occurrence of stray capacitance between the excitation electrodes 20a, 20b and the conductive member 40 can be suitably suppressed.

[0160] Fig. 17 is a graph showing the relationship between the distance from the excitation electrode to the conductive member in an oscillator and the Coulomb force. The horizontal axis of the graph shown in Fig. 17 represents the distance from the excitation electrode to the conductive member (inter-electrode distance). The vertical axis of the graph shown in Fig. 17 represents the magnitude of the Coulomb force generated between the excitation electrode and the conductive member.

[0161] A curve G1 indicates the relationship between the distance between the electrodes and the Coulomb force when the excitation electrode and the conductive member overlap in the facing direction T.

[0162] Curves G2 to G6 show the relationship between the inter-electrode distance and Coulomb force when the excitation electrode and the conductive member do not overlap in the opposing direction T, and the distance (opposing distance) between the excitation electrode and the conductive member in the opposing direction T is different for each curve.

[0163] Curves G2, G3, G4, G5, and G6 show the relationship between the inter-electrode distance and the Coulomb force when the opposing distance is 0 μm, 30 μm, 50 μm, 100 μm, and 200 μm, respectively.

[0164] 17, when the inter-electrode distance is 350 μm or less, the Coulomb force when the excitation electrode and the conductive member are arranged to overlap increases as the inter-electrode distance decreases, compared to the Coulomb force when the excitation electrode and the conductive member do not overlap. In other words, when the distance from the excitation electrode to the conductive member is 350 μm or less, whether or not the excitation electrode and the conductive member overlap greatly affects the Coulomb force generated between the excitation electrode and the conductive member.

[0165] Therefore, by preventing the excitation electrode and the conductive member from overlapping in the opposing direction T, even if the shortest distance from the excitation electrode to the conductive member is 350 μm or less, the Coulomb force generated between the excitation electrode and the conductive member can be prevented from increasing compared to when the excitation electrode and the conductive member are arranged to overlap.

[0166] The oscillator 100C of this embodiment is bonded to a substrate CB by a bonding member S, similar to the oscillator 100 of the first embodiment, and is mounted on an electronic device ED that includes the substrate CB.

[0167] The joint member S is provided in the notch 11Ca. The joint member S is connected to the conductive member 40 of the oscillator 100C on the substrate CB.

[0168] In the oscillator 100C, the proximity portions of the excitation electrodes 20a and 20b of the piezoelectric vibrating reed 20 are arranged so as not to overlap with the conductive member 40 in the thickness direction T. In addition, the bonding member S that bonds the oscillator 100C to the substrate CB is connected to the conductive member 40.

[0169] Therefore, even when the oscillator 100C is mounted on the substrate CB by the bonding member S, the occurrence of stray capacitance between the bonding member S and the excitation electrodes 20a, 20b of the piezoelectric vibrating reed 20 can be suppressed.

[0170] Although the embodiments of the present invention have been described above in detail with reference to the drawings, the specific configuration is not limited to these embodiments and includes design modifications within the scope of the present invention. Furthermore, the components shown in the above-described embodiments and the modified examples shown below can be appropriately combined to form a configuration.

[0171] (Variation 1) In each of the above embodiments, the piezoelectric vibrating piece 20 has a pair of support arms 21b, but the form of the piezoelectric vibrating piece is not limited to this. The piezoelectric vibrating piece may be configured not to have support arms, and the base body may be mounted on the mounting electrode. [Explanation of symbols]

[0172] 100, 100C... oscillator, 10, 10C... package, 11, 11C... package body, 11a, 11Ca... notch portion, 11s, 11Cs... outer wall of package, 1, 1C... first base substrate, 1a... first frame, 1b... second frame, 20... piezoelectric vibrating piece, 20a, 20b... excitation electrode, 21... base portion, 22... vibrating arm portion, 22a... arm portion, 22b... head portion, 4, 4C... mounting portion, 4a... mounted electrode (electrode pad), 5... integrated circuit electrode, 40... conductive member, 102... integrated circuit, D1, D2... diagonal direction, T... facing direction (thickness direction), H1... distance in the facing direction from the piezoelectric vibrating piece to the conductive member, L... longitudinal direction, W... width direction, ED... electronic device, CB... substrate, S... bonding member, R1... vibrating piece mounting area

Claims

1. a piezoelectric vibrating piece having a base, a vibrating arm portion including an arm portion extending from the base and a head portion connected to the tip of the arm portion, and an excitation electrode routed from the base to the tip of the head portion; an integrated circuit having a plurality of integrated circuit terminals; a package that accommodates the piezoelectric vibrating piece and the integrated circuit; Equipped with The excitation electrodes are formed at least on the side surfaces of the vibrating arms, The package comprises: a mounting electrode on which the piezoelectric vibrating piece is mounted; an integrated circuit electrode for mounting the integrated circuit; a cutout portion provided at each of the four corners of the package; a conductive member extending from a lower end of the notch to a side surface of the package and having a potential different from that of the excitation electrode; Equipped with In the excitation electrode, a proximity portion arranged at a position closest to the conductive member in a side direction of the package is arranged so as not to overlap with the conductive member in an opposing direction in which the piezoelectric vibrating reed and the integrated circuit face each other. Oscillator.

2. The shortest distance from the vibrating arm portion to the conductive member is 350 μm or less.

2. The oscillator of claim 1.

3. a distance from the piezoelectric vibrating piece to the conductive member in the opposing direction is greater than 0 μm and less than or equal to 100 μm; 3. The oscillator according to claim 1 or 2.

4. The distance from the tip of the head portion to the outer wall of the package is 200 μm or less.

3. The oscillator according to claim 2.

5. the conductive member has a potential different from that of the excitation electrode routed around the head portion; 3. The oscillator according to claim 1 or 2.

6. a piezoelectric vibrating piece having a base, a vibrating arm portion including an arm portion extending from the base and a head portion connected to the tip of the arm portion, and an excitation electrode routed from the base to the tip of the head portion; an integrated circuit having a plurality of integrated circuit terminals; a package that accommodates the piezoelectric vibrating piece and the integrated circuit; Equipped with The excitation electrodes are formed at least on the side surfaces of the vibrating arms, The package comprises: a mounting electrode on which the piezoelectric vibrating piece is mounted; an integrated circuit electrode for mounting the integrated circuit; a cutout portion provided at each of the four corners of the package; an external electrode provided at a lower end of the package and having a potential different from that of the excitation electrode; a conductive member extending from a lower end of the notch to a side surface of the package and electrically connected to the external electrode; Equipped with In the excitation electrode, a proximity portion arranged at a position closest to the conductive member in a side direction of the package is arranged so as not to overlap with the conductive member in an opposing direction in which the piezoelectric vibrating reed and the integrated circuit face each other. Electronic devices.

7. The shortest distance from the vibrating arm portion to the conductive member is 350 μm or less. The electronic device according to claim 6 .

8. a distance from the piezoelectric vibrating piece to the conductive member in the opposing direction is greater than 0 μm and less than or equal to 100 μm; The electronic device according to claim 6 or 7.

9. The distance from the tip of the head portion to the outer wall of the package is 200 μm or less. The electronic device of claim 7.

10. the conductive member has a potential different from that of the excitation electrode routed around the head portion; The electronic device according to claim 6 or 7.

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