Protective sheet and sheet arrangement method

Abstract

To prevent a low molecular weight component from adhering to a resin sheet to be protected when a protective sheet is peeled from the resin sheet.SOLUTION: A protective sheet to protect an arrangement face of a resin sheet that is arranged on one face of a substrate comprises a metallocene-catalyzed polyolefin sheet. A sheet arrangement method for arranging and integrating a resin sheet on a ring frame having an opening in the center and a plate-like substrate disposed in the opening of the ring frame includes: a mounting step for mounting the ring frame and the substrate on a support unit while disposing the substrate in the opening of the ring frame; a peeling step for peeling a metallocene-catalyzed polyolefin sheet from the resin sheet that has an arrangement face protected by the metallocene-catalyzed polyolefin sheet; and an integration step for, after the mounting step and the peeling step, arranging the resin sheet on the ring frame and the substrate supported by the support unit and integrating the ring frame and the substrate via the resin sheet.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a protective sheet that protects the surface on which a resin sheet is to be placed, and a sheet placement method for peeling the protective sheet from a resin sheet whose surface is protected by the protective sheet and placing the resin sheet on a substrate such as a semiconductor wafer. [Background technology]

[0002] Device chips used in electronic devices such as mobile phones and computers are formed by dividing a substrate, such as a semiconductor wafer, which has multiple devices arranged on its surface, into individual devices. Known devices for dividing a substrate include cutting devices that cut the substrate with an annular cutting blade and laser processing devices that irradiate a workpiece with a laser beam to perform laser processing.

[0003] A circular adhesive tape called dicing tape or expanding tape is attached in advance to a substrate to be processed by a processing device such as a cutting device or a laser processing device. The outer periphery of the adhesive tape is then attached to the inner periphery of a ring frame with an opening formed in the center. In other words, the substrate, adhesive tape, and ring frame are integrated to form a frame unit. The substrate is then loaded into the processing device in the frame unit state and processed (see Patent Document 1).

[0004] The substrate incorporated in the frame unit is easy to handle. Furthermore, if the adhesive tape is spread in the circumferential direction after dividing the substrate, the gap between the chips formed from the substrate increases, making it easier to pick up the chips. A tape application device is known that forms a frame unit by applying adhesive tape to the substrate and ring frame (see Patent Documents 2 and 3).

[0005] The adhesive tape includes a base layer and an adhesive layer disposed on the base layer. In the cutting device, to ensure that the wafer is divided, the cutting unit is positioned at a predetermined height so that the lower end of the cutting blade reaches a position lower than the underside of the wafer. Therefore, the cutting blade that cuts the wafer also cuts the adhesive layer of the adhesive tape. Therefore, when the wafer is cut, cutting debris from the adhesive layer is generated along with cutting debris from the wafer. These cutting debris may adhere to the chips formed by cutting, causing a decrease in the quality of the chips.

[0006] In addition, in laser processing equipment, to ensure that wafers are divided by ablation, the laser beam is irradiated onto the wafer under conditions that ensure the formation of dividing grooves extending from the front to the back of the wafer. As a result, the thermal effects of the laser beam irradiation melt the adhesive layer of the adhesive tape below and around the formed dividing grooves, causing part of the adhesive layer to adhere to the back side of the chips formed from the wafer. This causes a problem of reduced chip quality.

[0007] Therefore, a technique is known in which a resin sheet without an adhesive layer is applied to the wafer instead of using adhesive tape, and then the wafer is processed (see Patent Documents 4 and 5). When a resin sheet without an adhesive layer is applied to the wafer and ring frame by a method such as thermocompression bonding, problems caused by the adhesive layer do not occur. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 10-242083 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-116928 [Patent Document 3] Japanese Patent Application Laid-Open No. 2018-133446 [Patent Document 4] Japanese Patent Application Publication No. 2019-201016 [Patent Document 5] Japanese Patent Application Publication No. 2020-64956 Summary of the Invention [Problem to be solved by the invention]

[0009] A protective sheet (peel sheet, release sheet) may be placed on the surface of a resin sheet that does not have an adhesive layer to prevent dirt, dust, etc. from adhering to the surface that comes into contact with a substrate such as a workpiece. Then, the protective sheet is peeled off from the resin sheet immediately before it is attached to the substrate, and the resin sheet is placed on the substrate.

[0010] Here, the protective sheet is also a sheet made of resin. Generally, the molecular weight of the constituent molecules of a resin is not constant, and the molecular weight distribution of the constituent molecules tends to have a broad, bell-shaped shape with a peak near the average molecular weight. Furthermore, among the resins constituting the protective sheet, low-molecular-weight components located in the low-molecular-weight tail region of the molecular weight distribution tend to stick to the resin sheet to be protected.

[0011] That is, when the protective sheet is peeled off from the resin sheet, the low molecular weight components of the protective sheet stick to the resin sheet, which causes a further problem that when the resin sheet is separated from the substrate after the resin sheet is disposed on the substrate and processed, the low molecular weight components are transferred to the substrate and become a source of contamination.

[0012] The present invention has been made in consideration of such problems, and its object is to provide a protective sheet that is less likely to leave low molecular weight components on the resin sheet when peeled from the resin sheet it is protecting, and an arrangement method for peeling the protective sheet from the resin sheet protected by the protective sheet and placing it on a substrate. [Means for solving the problem]

[0013] According to one aspect of the present invention, there is provided a protective sheet for protecting a surface of a resin sheet disposed on one side of a substrate, the protective sheet being made of a metallocene catalyst-based polyolefin sheet.

[0014] Preferably, the resin sheet is a polyolefin sheet or a polyethylene sheet.

[0015] According to another aspect of the present invention, there is provided a sheet disposing method for disposing and integrating a resin sheet on a ring frame having an opening in the center and a plate-shaped substrate placed in the opening of the ring frame, the sheet disposing method comprising: a loading step for placing the ring frame and the substrate on a support unit while placing the substrate in the opening of the ring frame; a peeling step for peeling the metallocene catalyst-based polyolefin sheet from the resin sheet whose mounting surface is protected by a metallocene catalyst-based polyolefin sheet; and an integration step for disposing the resin sheet on the ring frame and the substrate supported by the support unit after the loading step and the peeling step, and integrating the ring frame and the substrate via the resin sheet.

[0016] Preferably, the resin sheet is a polyolefin sheet or a polyethylene sheet. [Effects of the Invention]

[0017] In the protective sheet and sheet disposition method according to one embodiment of the present invention, the surface of the resin sheet disposed on the substrate is protected by the metallocene catalyst-based polyolefin sheet, i.e., the metallocene catalyst-based polyolefin sheet serves as the protective sheet.

[0018] Metallocene-catalyzed polyolefins have a narrower molecular weight distribution range and less low-molecular-weight components than general polyolefins. Therefore, when a metallocene-catalyzed polyolefin sheet is peeled off from a resin sheet in which the metallocene-catalyzed polyolefin sheet is used as a protective sheet, low-molecular-weight components are less likely to stick to the resin sheet. In this case, when the resin sheet is disposed on a substrate, processed, and then separated from the substrate, low-molecular-weight components are less likely to be transferred to the substrate, and the substrate is less likely to be contaminated.

[0019] Therefore, according to one aspect of the present invention, there are provided a protective sheet that is less likely to leave low molecular weight components on the resin sheet when peeled from the resin sheet it is protecting, and an arrangement method for peeling the protective sheet from the resin sheet protected by the protective sheet and placing it on a substrate. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 2 is a side view schematically showing the tape application device. [Figure 2] FIG. 10 is a perspective view schematically showing a state in which a ring frame and a substrate are placed on a support unit. [Figure 3] 1 is a flowchart showing the flow of each step of a resin sheet disposing method. DETAILED DESCRIPTION OF THE INVENTION

[0021] An embodiment of the present invention will be described with reference to the accompanying drawings. The protective sheet (metallocene polyolefin sheet) according to this embodiment protects the surface of a resin sheet that does not have an adhesive layer and is disposed on a substrate such as a semiconductor wafer. A frame unit is formed when the resin sheet is disposed on the substrate, which is the workpiece to be processed by a processing device such as a cutting device or laser processing device, and a ring frame having an opening large enough to accommodate the substrate.

[0022] First, the substrate on which the resin sheet is disposed will be described. Fig. 1 includes cross-sectional views each showing a schematic representation of the substrate 11 and the ring frame 13. Fig. 2 also includes perspective views each showing a schematic representation of the substrate 11 and the ring frame 13.

[0023] The substrate 11 is, for example, a wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor. Alternatively, the substrate 11 is a substantially disk-shaped substrate made of a material such as sapphire, glass, or quartz. The glass may be, for example, alkali glass, non-alkali glass, soda-lime glass, lead glass, borosilicate glass, or quartz glass.

[0024] A plurality of devices (not shown), such as ICs (Integrated Circuits) and LSIs (Large Scale Integration), are formed on the surface 11a of the substrate 11. When the substrate 11 is divided into individual devices using a processing device such as a cutting device or a laser processing device, individual device chips can be formed.

[0025] The ring frame 13 is made of a metal material such as aluminum or stainless steel. The ring frame 13 has an opening 13c with a diameter larger than that of the substrate 11, and has a flat front surface 13a and a flat back surface 13b. With the substrate 11 positioned approximately in the center of the opening 13c of the ring frame 13, a resin sheet is attached to the back surface 11b of the substrate 11 and the back surface 13b of the ring frame 13, thereby forming a frame unit.

[0026] The resin sheet 3 disposed on the substrate 11 is used in place of a conventional dicing tape having an adhesive layer. Figure 1 includes a cross-sectional view that schematically shows the resin sheet 3 on which a metallocene polyolefin sheet is disposed as a protective sheet 5. The resin sheet 3 has a diameter larger than the outer diameter of the substrate 11 and does not have an adhesive layer.

[0027] The resin sheet 3 is a thermoplastic sheet. The outer periphery of the resin sheet 3 is disposed on the ring frame 13. The resin sheet 3 is a flexible sheet such as a polyolefin sheet or a polyester sheet, but the material of the resin sheet 3 is not limited to these.

[0028] Here, the polyolefin sheet is a sheet of a polymer synthesized using an alkene as a monomer. The polyolefin sheet used for the resin sheet 3 is, for example, a polyethylene sheet, a polypropylene sheet, or a polystyrene sheet that is transparent or translucent to visible light.

[0029] The polyester sheet is a polymer resin sheet 3 synthesized using dicarboxylic acid (a compound having two carboxyl groups) and diol (a compound having two hydroxyl groups) as monomers. The polyester sheet used for the resin sheet 3 is a resin sheet 3 that is transparent or translucent to visible light, such as a polyethylene terephthalate sheet or a polyethylene naphthalate sheet.

[0030] The resin sheet 3 does not have a glue layer (adhesive layer) and does not have sufficient adhesiveness, so it cannot be attached to the substrate 11. The resin sheet 3 has thermoplastic properties, so when it is heated to a temperature near its melting point while being joined to the substrate 11 while a predetermined pressure is applied, it partially melts and can be fixed to the substrate 11. In other words, the resin sheet 3 cannot be disposed on the substrate 11 and the ring frame 13 unless it is heated, so it is thermocompression bonded to the substrate 11 and the ring frame 13.

[0031] The protective sheet 5 according to this embodiment will now be described. The protective sheet 5 is made of a metallocene-catalyzed polyolefin sheet. A metallocene-catalyzed polyolefin sheet is a polyolefin polymerized using a metallocene catalyst and shaped into a sheet. A metallocene catalyst is characterized by having uniform active sites, which results in a narrow molecular weight distribution of the polymer and facilitates copolymerization. For example, the molecular weight of a metallocene-catalyzed polyolefin is approximately 10,000 to 200,000. However, the protective sheet 5 may also contain a polyolefin whose molecular weight does not fall within this range.

[0032] For example, known polyethylenes that are metallocene-catalyzed polyolefins include linear low-density polyethylene (LLDPE), high-density polyethylene (HDPE), and medium-density polyethylene (MDPE). However, the metallocene-catalyzed polyolefins used in metallocene-catalyzed polyolefin sheets are not limited to these. Metallocene-catalyzed polyolefins are known as materials with narrow molecular weight distributions and relatively few low-molecular-weight components.

[0033] The protective sheet 5 made of the metallocene catalyst-based polyolefin sheet according to this embodiment protects the surface of the resin sheet 3 that is disposed on a substrate 11 such as a semiconductor wafer. Here, the surface refers to the surface that contacts the substrate 11 on which the resin sheet 3 is disposed. FIG. 1 schematically shows a tape body 1 made of the protective sheet 5 and the resin sheet 3.

[0034] When protective sheet 5 made of a metallocene catalyst-based polyolefin sheet is disposed on resin sheet 3, low molecular weight components are less likely to stick to resin sheet 3 when protective sheet 5 is peeled off from resin sheet 3. In this case, when resin sheet 3 is disposed on substrate 11, substrate 11 is processed, and then resin sheet 3 is separated from substrate 11, low molecular weight components are less likely to be transferred to substrate 11, and substrate 11 is less likely to be contaminated.

[0035] The resin sheet 3 protected by the protective sheet 5 is peeled off from the protective sheet 5 in a sheet disposing device 2 described next, and disposed on a substrate 11. The tape body 1 formed by the protective sheet 5 and the resin sheet 3 is transported into the sheet disposing device 2 in a rolled state, and is pulled out from the roll for use.

[0036] Next, we will explain the sheet distribution device 2. Fig. 1 is a partial cross-sectional side view that schematically shows an example of the configuration of the sheet distribution device 2. As shown in Fig. 1, the sheet distribution device 2 includes a cylindrical payout roller (payout means) 4 that supports a tape body 1 that is wound into a cylindrical shape.

[0037] The delivery roller 4 is connected to a rotary drive source (not shown), such as a motor, and rotates around a rotation axis that is roughly parallel to the first direction (Y-axis direction) by the force generated by the rotary drive source. The length of the delivery roller 4 in the first direction is greater than the width of the tape body 1.

[0038] Therefore, tape 1 in a cylindrically wound state is supported across its entire width by pay-out roller 4. Tape 1 is constructed by placing protective sheet 5 on the surface on which resin sheet 3 is disposed, and is wound, for example, around a cylindrical core (not shown) with protective sheet 5 facing inward. Pay-out roller 4 is inserted into the space inside this core, so that tape 1 is supported by pay-out roller 4.

[0039] The protective sheet 5 according to this embodiment is formed in a strip shape and is attached to the surface on which the resin sheet 3 is disposed to protect the surface on which the resin sheet 3 is disposed. A portion of the resin sheet 3 that has been peeled off from the protective sheet 5 is attached to the substrate 11 and the ring frame 13.

[0040] A transport roller 6 is disposed on the side of the feed roller 4 for feeding downward the tape body 1 fed from the feed roller 4. Below the transport roller 6, an incision forming unit 8 is provided for forming a generally circular incision in the resin sheet 3 that is smaller than the outer diameter of the ring frame 13 and larger than the inner diameter (diameter of the inner periphery) that defines the opening 13c.

[0041] The incision forming unit 8 includes a cutting blade roller 10 disposed on the resin sheet 3 side of the tape body 1, and a support roller 12 adjacent to the cutting blade roller 10 with the tape body 1 sandwiched between them. For example, by feeding the tape body 1 downward while pressing the cutting blade roller 10 against the support roller 12, a circular resin sheet 3a to be attached to one surface of the substrate 11 and the ring frame 13 can be cut out from the resin sheet 3.

[0042] A pressure unit 14 is disposed near the cutting blade roller 10 to apply a force to the cutting blade roller 10 in a direction toward the support roller 12. Note that this pressure unit 14 may also apply a force to the support roller 12 in a direction toward the cutting blade roller 10.

[0043] A transport roller 16 for feeding the tape 1 diagonally downward is disposed below the incision forming unit 8. A peeling unit 18 for peeling the circular resin sheet 3a from the tape 1 (more specifically, the protective sheet 5) is disposed diagonally below the transport roller 16.

[0044] The peeling unit 18 can peel the circular resin sheet 3a from the tape body 1 (protective sheet 5) by folding back the tape body 1 (protective sheet 5) at its tip and sending it downstream. A pressure roller 20 is disposed adjacent to one end of the peeling unit 18 to apply a downward force to the peeled circular resin sheet 3a. Furthermore, a support unit (support table) 22 is disposed at a position lower than the peeling unit 18 and the pressure roller 20 to support the substrate 11 and ring frame 13.

[0045] The center of the upper surface of the support unit 22 serves as a first support surface 22a for supporting the substrate 11. In addition, a second support surface 22b for supporting an annular ring frame 13 that surrounds the substrate 11 is formed around the first support surface 22a.

[0046] The heights of the first support surface 22a and the second support surface 22b are determined so that the upper surface (e.g., rear surface 11b) of the substrate 11 supported by the first support surface 22a and the upper surface (e.g., rear surface 13b) of the ring frame 13 supported by the second support surface 22b are at approximately the same height. A ball screw type moving mechanism 24 is provided below the support unit 22. The support unit 22 is moved by this moving mechanism 24 in a second direction (X-axis direction) perpendicular to the first direction (Y-axis direction).

[0047] A pair of transport rollers 26, 28 are arranged on the sides of the peeling unit 18 to feed the tape 1 (protective sheet 5) folded back by the peeling unit 18 downstream. Further to the side of the transport rollers 26, 28, a take-up roller 30 is arranged to take up the tape 1 (protective sheet 5) transported by the transport rollers 26, 28.

[0048] The take-up roller 30 is connected to a rotary drive source (not shown), such as a motor, and rotates around a rotation axis that is generally parallel to the first direction by the force generated by the rotary drive source. The length of the take-up roller 30 in the first direction is greater than the width of the tape body 1 (protective sheet 5).

[0049] For example, the circular resin sheet 3a cut out by the incision forming unit 8 is peeled off from the tape body 1 (protective sheet 5) by the peeling unit 18, and then pressed (pressed) downward by the pressure roller 20 to come into contact with a part of the ring frame 13 on the support unit 22. Thereafter, the support unit 22 is moved in the second direction while the payout roller 4 and the take-up roller 30 are rotated.

[0050] That is, the substrate 11 and the ring frame 13 are moved relative to the pressure roller 20 in the second direction. As a result, the pressure-receiving area pressed by the pressure roller 20 moves in the second direction relative to the substrate 11 and the ring frame 13, and the circular resin sheet 3a comes into contact with the entire upper surfaces of the substrate 11 and the ring frame 13 due to the downward force acting from the pressure roller 20.

[0051] The circular resin sheet 3a (resin sheet 3) cannot be integrated with the substrate 11 and the ring frame 13 as it is. The sheet disposing device 2 includes a heating unit (not shown) that heats the circular resin sheet 3a (resin sheet 3) and one or both of the substrate 11 and the ring frame 13.

[0052] For example, a heating unit composed of an electric heating wire or the like is disposed inside the support unit 22, and the substrate 11 or the like is heated to a predetermined temperature by the heating unit before the circular resin sheet 3a comes into contact with the substrate 11 or the like. Alternatively, for example, the heating unit provided in the sheet disposing device 2 may be a heat gun that supplies hot air to the circular resin sheet 3a that comes into contact with the substrate 11 or the like, or an infrared lamp that irradiates infrared rays onto the circular resin sheet 3a.

[0053] Furthermore, the sheet disposing device 2 may include a pressing member that presses from above the circular resin sheet 3a (resin sheet 3) that contacts the substrate 11 or the like, and the above-mentioned pressing roller 20 functions as the pressing member. When the heated circular resin sheet 3a is pressed from above, the circular resin sheet 3a can be thermocompression-bonded to the substrate 11 or the like.

[0054] The circular resin sheet 3a (resin sheet 3) may be heated and pressed by other methods, for example, by pressing the circular resin sheet 3a from above with a member heated to a predetermined temperature. For example, a heat roller equipped with an internal heat source may be used. The pressure roller 20 may be equipped with an internal heat source, in which case the pressure roller 20 functions as a heat roller.

[0055] The heat roller is heated to a predetermined temperature and placed on one end of the ring frame 13 with the circular resin sheet 3a interposed between them. The heat roller is then rotated and rolled on the ring frame 13 from one end to the other. This causes the circular resin sheet 3a to be thermocompressed to the substrate 11 and the ring frame 13. In other words, the heat roller functions as both a heating unit and a pressing member.

[0056] Alternatively, an iron-like pressing member with an internal heat source and a flat bottom plate may be used instead of a heat roller to perform thermocompression bonding of the circular resin sheet 3a (resin sheet 3). In this case, the pressing member is heated to a predetermined temperature to function as a hot plate, and the circular resin sheet 3a placed on the substrate 11 or the like is pressed from above with the pressing member. When the circular resin sheet 3a is pressed while being heated using this method, the substrate 11 and the ring frame 13 are integrated via the circular resin sheet 3a by thermocompression bonding.

[0057] Next, a sheet disposing method will be described in which a frame unit is formed by integrating a ring frame 13 having an opening 13c in the center, a plate-shaped substrate 11 placed in the opening 13c of the ring frame 13, and a resin sheet 3. This sheet disposing method can utilize the sheet disposing device 2 described above. However, this sheet disposing method does not necessarily require the use of the sheet disposing device 2. Figure 3 is a flowchart showing the flow of each step of the sheet disposing method. Each step of the sheet disposing method will be described in detail below.

[0058] First, in the sheet arrangement method, a placing step S10 is performed in which the substrate 11 is placed in the opening 13c of the ring frame 13, and the ring frame 13 and the substrate 11 are placed on the support unit 22. Fig. 2 is a perspective view schematically showing the state in which the substrate 11 and the ring frame 13 are placed on the support unit 22 of the sheet arrangement device 2 in the placing step S10.

[0059] More specifically, in the placing step S10, the substrate 11 is placed on the first support surface 22a of the support unit 22, and the ring frame 13 is placed on the second support surface 22b of the support unit 22. At this time, the back surface 11b of the substrate 11, which will be the surface on which the resin sheet 3 is to be placed, faces upward, and the back surface 13b of the ring frame 13 faces upward. In other words, the front surface 11a of the substrate 11 faces the first support surface 22a, and the front surface 13a of the ring frame 13 faces the second support surface 22b.

[0060] 1 includes a cross-sectional view that schematically shows the substrate 11 and ring frame 13 placed on the support unit 22. In this case, it is preferable that the height of the back surface 11b of the substrate 11 and the back surface 13b of the ring frame 13 are approximately the same.

[0061] In addition, in the sheet disposition method shown in Figure 3, a peeling step S20 is carried out in which the metallocene catalyst-based polyolefin sheet (protective sheet 5) is peeled off from the resin sheet 3 whose disposition surface is protected by the metallocene catalyst-based polyolefin sheet (protective sheet 5).

[0062] In the peeling step S20, the tape body 1 is fed from the feed roller 4. Then, the tape body 1 is sent downward by the transport roller 6 until it faces the incision forming unit 8. Thereafter, the tape body 1 is sent downward while pressing the cutting blade roller 10 against the support roller 12, thereby forming an incision in the resin sheet 3 and cutting out a circular resin sheet 3a from the resin sheet 3.

[0063] However, the resin sheet 3 may have incisions formed in advance before being carried into the sheet disposing device 2. In this case, it is not necessary to form incisions in the resin sheet 3 in the peeling step S20, and it is not necessary to cut out the circular resin sheet 3a from the resin sheet 3. In this case, the sheet disposing device 2 does not need to include the incision forming unit 8.

[0064] In the peeling step S20, the circular resin sheet 3a (resin sheet 3) is sent by the transport roller 16 to the downstream peeling unit 18. In the peeling unit 18, the tape body 1 (protective sheet 5) is folded back at the leading end and sent downstream, thereby peeling the circular resin sheet 3a from the tape body 1 (protective sheet 5).

[0065] 3, after the placing step S10 and the peeling step S20, the integrating step S30 is performed. In the integrating step S30, the ring frame 13 and the substrate 11 supported by the support unit 22 are arranged, and the ring frame 13 and the substrate 11 are integrated via the circular resin sheet 3a (resin sheet 3).

[0066] In the integration step S30, first, the support unit 22 is moved by the movement mechanism 24, and one end of the ring frame 13 is positioned below one end of the circular resin sheet 3a. Then, the pressure roller 20 (pressing member) presses the circular resin sheet 3a toward the ring frame 13 from above, and the circular resin sheet 3a comes into contact with the ring frame 13.

[0067] In this state, the circular resin sheet 3a is peeled off from the protective sheet 5, and the movement mechanism 24 is operated to move the support unit 22, and the circular resin sheet 3a is brought into contact with the ring frame 13 from one end to the other while being pressed by the pressure roller 20. At this time, the circular resin sheet 3a also comes into contact with the substrate 11.

[0068] At the same time, in the integration step S30, the circular resin sheet 3a (resin sheet 3) is heated by the heating unit described above. For example, by heating the circular resin sheet 3a to a temperature near the melting point of the circular resin sheet 3a (resin sheet 3) while pressing it against the substrate 11, etc., the circular resin sheet 3a can be integrated with the substrate 11 and the ring frame 13 by thermocompression bonding.

[0069] For example, when the pressure roller 20 is equipped with a heat source, the pressure roller 20 is heated to a predetermined temperature, and the circular resin sheet 3a is pressed while being heated by the pressure roller 20. This allows the circular resin sheet 3a to be thermocompression bonded to the substrate 11 and the ring frame 13. However, the thermocompression bonding method is not limited to this, and the pressing member and heating unit used are also not limited to this.

[0070] In the sheet disposition method described above, the protective sheet 5 that protects the resin sheet 3 is a metallocene catalyst-based polyolefin sheet. Therefore, low molecular weight components derived from the protective sheet 5 are less likely to adhere to the resin sheet 3, and are less likely to be transferred to the substrate 11 and the ring frame 13. Therefore, the substrate 11 is less likely to be contaminated, and the quality of the chips manufactured by dividing the substrate 11 is improved.

[0071] In the above embodiment, the case where the substrate 11 on which the resin sheet 3 protected by the protective sheet 5 (metallocene catalyst-based polyolefin sheet) is disposed is described as being divided, but one aspect of the present invention is not limited to this. That is, the substrate 11 on which the resin sheet 3 is disposed does not have to be divided. Even in this case, when the resin sheet 3 is finally peeled off from the substrate 11, it is possible to prevent low-molecular-weight components derived from the protective sheet 5 from remaining on the substrate 11, and to prevent deterioration in the quality of the substrate 11.

[0072] In addition, the structures, methods, etc. according to the above-described embodiments and modifications can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0073] 1 tape body 3 Resin sheet 3a Circular resin sheet 5 Protective sheet 11 Circuit Board 11a surface 11b Back side 13 Ring Frame 13a surface 13b Back side 13c opening 2. Sheet placement device 4 Feed roller 6,16,26,28 Conveyor rollers 8. Cutting unit 10 Cutting blade roller 12 Support Roller 14 Pressurizing unit 18 Peeling unit 20 Pressure roller 22 Support unit 22a 1st support surface 22b Second support surface 24 Moving mechanism 30 Winding roller

Claims

1. A protective sheet for protecting a surface of a resin sheet disposed on one surface of a substrate, A protective sheet comprising a metallocene catalyst-based polyolefin sheet.

2. 2. The protective sheet according to claim 1, wherein the resin sheet is a polyolefin sheet or a polyethylene sheet.

3. A sheet disposing method for disposing and integrating a resin sheet on a ring frame having an opening in the center and a plate-shaped substrate placed in the opening of the ring frame, comprising: a placing step of placing the ring frame and the substrate on a support unit while placing the substrate in the opening of the ring frame; a peeling step of peeling the metallocene catalyst-based polyolefin sheet from the resin sheet whose surface is protected by the metallocene catalyst-based polyolefin sheet; an integration step of integrating the ring frame and the substrate via the resin sheet after the placing step and the peeling step, by arranging the resin sheet on the ring frame and the substrate supported by the support unit; A sheet disposing method comprising:

4. 4. The sheet disposing method according to claim 3, wherein the resin sheet is a polyolefin sheet or a polyethylene sheet.

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