Optical unit

Abstract

To provide an optical unit capable of securing translucency of base material by making a snow melting effect compatible with a defogging effect.SOLUTION: An optical unit 10 includes a housing 11, translucent base material 12 made of an ultraviolet-curable composition, optical devices 13 and 14 arranged in an internal space 10A defined by the housing 11 and the base material 12, and a transparent conductive film 15 which is provided in contact with the base material 12 and generates heat when power is supplied.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an optical unit. [Background technology]

[0002] Optical units are used in many fields, including automotive and motorcycle lighting fixtures, optical sensors, streetlights, and cameras. However, problems can arise when snow adheres to the lens of an optical unit, or when the surface temperature of the lens drops below the dew point, causing moisture in the air to condense into fine droplets, resulting in fogging and reducing the lens's light transmittance. To prevent these problems, a heater is installed inside the optical unit to ensure the lens's light transmittance.

[0003] For example, Patent Document 1 discloses a vehicle lamp that includes a lamp body, a lamp cover that has a light-transmitting portion and is attached to an opening of the lamp body to define a lamp chamber inside, and a transparent film heater that generates heat when power is supplied, with a protrusion formed on the surface of the lamp cover facing the lamp chamber, and the transparent film heater attached to the protrusion by thermal caulking. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2023-66837 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in such vehicle equipment in which the transparent film heater is spaced apart from the lamp cover, the snow-melting effect and anti-fogging effect are insufficient, and there is a risk that the light transmittance of the lens may not be ensured. An object of the present invention is to provide an optical unit that can ensure the light transmittance of the base material by achieving both the snow-melting effect and the anti-fogging effect. [Means for solving the problem]

[0006] The optical unit of the present invention comprises: Housing and a light-transmitting substrate made of an ultraviolet-curable composition; an optical instrument disposed in an interior space defined by the housing and the substrate; The device further comprises a transparent conductive film that is provided in contact with the substrate and generates heat when power is supplied thereto. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a conceptual diagram showing an optical unit of the present invention. [Figure 2A] 1 is a conceptual diagram illustrating an example of a transparent conductive film of the present invention. [Figure 2B] 1 is a conceptual diagram illustrating an example of a transparent conductive film of the present invention. [Figure 3] FIG. 10 is a conceptual diagram showing a modified example of the optical unit of the present invention. [Figure 4] 1 is a flowchart showing a manufacturing process of a substrate of the present invention. [Figure 5A] FIG. 2 is a cross-sectional view showing a manufacturing step S1 of the substrate of the present invention. [Figure 5B] FIG. 3 is a cross-sectional view showing a manufacturing step S2 of the substrate of the present invention. [Figure 5C] FIG. 3 is a cross-sectional view showing a manufacturing step S3 of the substrate of the present invention. [Figure 5D] FIG. 3 is a cross-sectional view showing a manufacturing step S4 of the substrate of the present invention. [Figure 6] 10 is a flowchart showing a modified example of the manufacturing process for a substrate of the present invention. [Figure 7A] FIG. 10 is a cross-sectional view showing a modified example S1 of the manufacturing process for the substrate of the present invention. [Figure 7B] FIG. 10 is a cross-sectional view showing a modified example S2 of the manufacturing process for the substrate of the present invention. [Figure 7C] FIG. 10 is a cross-sectional view showing a modified example S3 of the manufacturing process for the substrate of the present invention. [Figure 7D]FIG. 10 is a cross-sectional view showing a modified example S4 of the manufacturing process for the substrate of the present invention. [Figure 8] 1 is a table summarizing the compositions of examples and comparative examples of substrates (molded articles) of the present invention. [Figure 9] 1 is a table summarizing the results of comparison between examples of the substrate (molded article) of the present invention and comparative examples. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the following, preferred embodiments of the present invention will be described, but they may be modified and combined as appropriate. In the following description and accompanying drawings, substantially the same or equivalent parts are designated by the same reference numerals.

[0009] 1 is a conceptual diagram showing an optical unit 10 of the present invention, and is a cross-sectional view of the optical unit 10. In this embodiment, the optical unit 10 is a vehicle headlight unit having a light-emitting device. Note that the use of the optical unit 10 is not limited to vehicle headlight units, and it may also be used in lighting fixtures for vehicles other than headlights, such as automobiles and motorcycles, optical sensors, street lights, cameras, etc.

[0010] 1, the optical unit 10 includes a housing 11, a light-transmitting substrate 12, and a first optical device 13 and a second optical device 14 disposed in an internal space 10A defined by the housing 11 and the substrate 12. A transparent conductive film 15 is disposed in contact with the substrate 12.

[0011] The housing 11 is a housing that covers and supports parts of the optical devices 13 and 14. In detail, the housing 11 supports the optical devices 13 and 14 via fixing devices (not shown). The housing 11 has a bottom wall 11A that covers the rear sides of the optical devices 13 and 14, and a first side wall 11B that extends parallel to the light output direction of the optical devices 13 and 14 (leftward in FIG. 1), and is open at the front.

[0012] The housing 11 can be made of an elastic thermoplastic resin material such as ABS (acrylonitrile butadiene styrene) resin, PBT (polybutylene terephthalate) resin, or PP (polypropylene) resin.

[0013] The substrate 12 is fixed to the housing 11 so as to close the opening of the housing. The substrate 12 has an upper wall 12A that covers the front side of the optical devices 13, 14 and a second side wall 12B that extends parallel to the light emission direction of the optical devices 13, 14 (leftward in FIG. 1 ), and is open at the rear. In other words, light emitted from the optical devices 13, 14 passes through the substrate 12 and is emitted to the outside of the internal space 10A. The opening at the rear of the substrate 12 is closed by the housing 11.

[0014] The substrate 12 is a light-transmitting molded article made of an ultraviolet-curable composition. The light-transmitting property of the substrate 12 is preferably such that the transmittance of light in the wavelength band used in the optical devices 13 and 14 (for example, infrared light and / or visible light) is 80% or more.

[0015] According to the present invention, since the substrate 12 is a molded body made of an ultraviolet-curable composition that is cured by ultraviolet irradiation, even when the ultraviolet-curable composition is cured while the transparent conductive film 15 is in contact with the ultraviolet-curable composition, thermal deformation of the transparent conductive film 15 can be prevented, thereby improving the reliability of the transparent conductive film.

[0016] On the other hand, when the substrate is a molded body made of a thermoplastic resin material such as polycarbonate (PC) or acrylic (PMMA), and the thermoplastic resin material is heated and molded while being in contact with a transparent conductive film, the heat is transferred to the transparent conductive film, causing thermal deformation of the transparent conductive film. This problem also occurs when a thermosetting composition is used in combination with a thermoplastic resin material.

[0017] The ultraviolet-curable composition contains a polymer compound (acrylate). Specifically, examples of the polymer compound that can be used include isobornyl acrylate, phenoxydiethylene glycol acrylate, β-carboxyethyl acrylate, 1,6-hexanediol diacrylate, PEG400 diacrylate, tricyclodecane dimethanol diacrylate, trimethylolpropane triacrylate, trimethylolpropane ethoxy triacrylate, pentaerythritol (tri / tetra)acrylate, pentaerythritol alkoxytetraacrylate, and dipentaerythritol hexaacrylate. These polymer compounds may be used alone or in combination of two or more.

[0018] As the polymer compound, it is preferable to use a polymer compound having three or more and eight or less functional groups, such as trimethylolpropane triacrylate, trimethylolpropane ethoxy triacrylate, pentaerythritol (tri / tetra)acrylate, pentaerythritol alkoxytetraacrylate, and dipentaerythritol hexaacrylate. By using a polymer compound with three or more functional groups, sufficient strength can be ensured for the substrate 12. Specifically, a polymer compound having a Charpy impact strength of 80 KJ / m or more can be used. 2 The above strength can be ensured.

[0019] The UV-curable composition contains an initiator as an additive. The initiator is a radical generator that generates highly active radicals when irradiated with UV light. These radical species undergo decomposition and react with resin components such as monomers and / or oligomers. This reaction product then reacts with other resin components, causing a chain reaction to proceed. The crosslinking reaction then progresses, increasing the molecular weight and curing the polymer compound, forming the substrate 12 (molded body).

[0020] Examples of initiators that can be used include ketones such as benzophenone, benzoin methyl ether, benzoin propyl ether, diethoxyacetophenone, and 1-hydroxycyclohexyl phenyl ketone; azos such as 2,2'-azobisisobutylnitrile, azobis-2-methylbutyronitrile, and azobisdivaleronitrile; organic peroxides such as t-butylperoxyisobutyrate, t-butylperoxy-2-ethylhexanoate, t-amylperoxy-3,5,5-trimethylhexanoate, t-butylperoxyisopropyl carbonate, 2,2-bis(4,4-di-t-butylperoxycyclohexyl)propane, di-t-butyl peroxide, and di-t-amyl peroxide; and acylphosphine compounds such as 2,6-dimethylbenzoyldiphenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide. Among these, radical cleavage initiators such as 1-hydroxycyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, etc. are preferred. These initiators may be used alone or in combination of two or more.

[0021] The ultraviolet-curable composition contains a diluent as an additive. The viscosity of the ultraviolet-curable composition can be adjusted by adjusting the amount of the diluent added to the ultraviolet-curable composition.

[0022] The amount of diluent added is preferably adjusted so that the viscosity of the ultraviolet-curable composition is 10 to 2000 mPa·s / 25°C. Specifically, the diluent is preferably added in an amount of 15 to 50% of the total amount of the ultraviolet-curable composition. This ensures the smoothness of the surface of the substrate 12 when the ultraviolet-curable composition is cured, and also prevents air bubbles from remaining inside the ultraviolet-curable composition.

[0023] Examples of diluents that can be used include known compounds such as acrylates, epoxies, vinyl ethers, and polyene thiols. Specifically, examples of acrylates that can be used include monofunctional monomers such as cyclic trimethylolpropane formal acrylate, 3,3,5-trimethylcyclohexyl acrylate, 2-hydroxyethyl acrylate, 2-ethylhexyl acrylate, and tetrahydrofurfuryl acrylate, bifunctional monomers such as EO-modified bisphenol A diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, tricyclodecane dimethanol diacrylate, polyethylene glycol dimethacrylate, dicyclopentenyloxyethyl acrylate, 1,3-butanediol diacrylate, and 1,4-butanediol diacrylate, and trifunctional monomers such as trimethylpropane trimethacrylate and dipentaerythritol hexaacrylate.

[0024] The ultraviolet-curable composition preferably contains a thiol material as an additive. The thiol material is a compound containing a polyfunctional thiol group. In other words, it is a compound containing two or more functional thiol groups. By including a thiol material in the ultraviolet-curable composition, oxygen inhibition can be suppressed by a thiol-ene reaction.

[0025] By including a thiol material in the UV-curable composition, it is possible to suppress cure shrinkage. Cure shrinkage occurs when the double bonds of a polymer compound are polymerized by radical polymerization, converting them into a high-molecular-weight compound connected by single bonds, thereby shortening the molecular bond distance. However, by including a thiol material, it is possible to suppress the shortening of the molecular bond distance by forming a thioether crosslink with the double bonds of the polymer compound. Therefore, even when the UV-curable composition is cured while the transparent conductive film 15 is embedded in the UV-curable composition, it is possible to suppress the occurrence of warping or twisting of the transparent conductive film 15.

[0026] Furthermore, by including a thiol material in the UV-curable composition, oxygen inhibition can be suppressed through the thiol-ene reaction. The reaction mechanism of the thiol-ene reaction is shown below. First, UV light is irradiated, causing the initiator to cleave or undergo energy transfer (initiation reaction). Then, the initiator extracts an electron from the thiol material, generating a thiyl radical. The thiyl radical attacks the double bond of the monomer of the polymer compound, forming a polymer compound with a thioether crosslink and a radical. This further extracts hydrogen from the thiol material, generating a thiyl radical. The generated thiyl radical then attacks the double bond of the monomer of another polymer compound (propagation reaction). In this way, the reaction proceeds in a chain reaction, allowing the UV-curable composition to be efficiently cured.

[0027] [ka]

[0028] By including a thiol material in the UV-curable composition, curing can be promoted by a dark reaction even in the air (oxygen atmosphere). The reaction mechanism in an oxygen atmosphere is shown below. First, oxygen reacts with the monomer to generate a peroxy radical. Then, the peroxy radical abstracts hydrogen from the thiol to generate a thiyl radical. The thiyl radical then undergoes the above-mentioned propagation reaction. Therefore, the UV-curable composition can be cured even in an oxygen atmosphere.

[0029] [ka]

[0030] Furthermore, by including a thiol material in the ultraviolet-curable composition, a thioether crosslinked structure is formed, thereby increasing the flexibility of the substrate 12. This makes it possible to suppress the occurrence of cracks in low-temperature environments and further improve durability. Here, the flexibility of the substrate 12 can be increased because the sulfur atoms in the thioether crosslinked structure can move, such as rotate.

[0031] The content of the thiol material is preferably 3% by mass or more and 10% by mass or less relative to the total amount of the ultraviolet-curable composition, which makes it possible to sufficiently suppress cure shrinkage.

[0032] In addition to the thiol material, the ultraviolet-curable composition may contain various additives such as an antibacterial agent, an antifungal agent, an antifoaming agent, an antioxidant, an antistatic agent, and a polymerization inhibitor.

[0033] An LED light source is used as the first optical device 13, and a lidar is used as a sensor in an ADAS (Advanced Driving Assistant System) as the second optical device 14. Note that the first optical device 13 and the second optical device 14 may be lighting units such as fluorescent lamps, laser light sources, or incandescent light bulbs, optical sensor units that emit visible light, infrared light, ultraviolet light, millimeter waves, or the like, or optical sensor units that detect visible light, infrared light, ultraviolet light, millimeter waves, or the like. Also, a light source for an optical sensor and an optical sensor unit that detects reflected light of light emitted from the light source for the optical sensor may be used.

[0034] In this embodiment, the optical unit 10 has been described as having two optical devices, the first optical device 13 and the second optical device 14, but the optical unit 10 may have one optical device or three or more optical devices.

[0035] The transparent conductive film 15 generates heat when power is supplied, and functions as a so-called heater. As shown in Fig. 1, the transparent conductive film 15 is embedded in the substrate 12 in a region corresponding to the path of light emitted from the second optical device 14. In other words, the transparent conductive film 15 is disposed inside the substrate 12 and is in contact with the substrate 12.

[0036] Because the transparent conductive film 15 is in contact with the substrate 12, the heat generated by the transparent conductive film 15 is easily transferred to the entire substrate 12, which can efficiently prevent fogging of the inner surface of the substrate 12. In addition, the heat generated by the transparent conductive film 15 is easily transferred to the entire substrate 12, which can efficiently melt snow adhering to the outer surface of the substrate 12.

[0037] 2A, the transparent conductive film 15 includes a light-transmitting thin film member 16, a plurality of metal wirings 17, a first contact 18, and a second contact 19. When a current is applied from the first contact 18 to the second contact 19, the metal wirings 17 generate heat.

[0038] The heat generated from the metal wiring 17 is transferred to the base material 12, thereby melting snow adhering to the base material 12. In addition, the heat generated from the metal wiring 17 is transferred to the base material 12, thereby preventing the base material 12 from fogging up.

[0039] In this embodiment, the transparent conductive film 15 is placed in an area corresponding to the path of the light emitted from the second optical device 14, but it may be placed outside the area corresponding to the path of the light emitted from the second optical device 14 as long as it can melt snow adhering to the substrate 12 and prevent fogging of the substrate 12.

[0040] In this embodiment, the transparent conductive film 15 is embedded in the substrate 12, but the transparent conductive film 15 only needs to be in contact with the substrate 12 so as to be able to melt snow adhering to the substrate 12 and prevent the substrate 12 from fogging up.

[0041] Alternatively, a portion of the transparent conductive film 15 may be embedded in the substrate 12. In particular, for example, the thin film member 16 may be embedded in the substrate 12, and the first contact 18 and the second contact 19 may be disposed outside the substrate 12. In other words, the transparent conductive film 15 may have an area embedded in the substrate 12 excluding the first contact 18 and the second contact 19 that serve as contact points with external wiring. This allows the above-described effects to be obtained while facilitating the connection of the first contact 18 and the second contact 19 with the external wiring.

[0042] The thin film member 16 is formed in the shape of a flat plate with a thickness of 20 μm. Polycarbonate resin (PC) is used as the material for the thin film member 16. Any material can be used for the thin film member 16 as long as it has translucency that allows transmission of at least one of the lights emitted from the optical devices 13 and 14, and hydrophobic synthetic resins such as polymethyl methacrylate resin (PMMA) and PET (polyethylene terephthalate), and hydrophobic materials such as glass may also be used.

[0043] The thin film member 16 preferably has a total light transmittance of 85% or more, and more preferably 90% or more. In order to prevent steps (irregularities) from being formed on the surface of the thin film member 16, the thin film member 16 is preferably formed to a thickness of 10 to 50 μm, and more preferably 10 to 30 μm.

[0044] It is preferable that the material of the thin film member 16 has the same dielectric constant as that of the substrate 12. By using materials with the same dielectric constant for the thin film member 16 and the substrate 12, the refractive indices of light for the thin film member 16 and the substrate 12 become similar or the same, and the boundary at the contact portion between the transparent conductive film 15 and the substrate 12 becomes inconspicuous.

[0045] The metal wiring 17 is formed of a copper wire with a wire diameter of 6 μm. As shown in FIG. 2A, the plurality of metal wirings 17 are formed in parallel at equal intervals of 1000 μm in the thin film member 16 from the first contact point 18 to the second contact point 19. By forming the plurality of metal wirings 17 in parallel, it is possible to improve the transmittance of millimeter waves.

[0046] 2. The optical unit according to claim 1, wherein the transmittance of light in a wavelength band used in the optical device is 80% or more.

[0047] In this embodiment, multiple metal wires 17 with a wire diameter of 6 μm are formed at equal intervals of 1000 μm, but the wire diameter of the metal wires 17 may be 4 to 80 μm, and the intervals between the multiple metal wires 17 may be 500 μm to 5.0 mm.

[0048] The metal wiring 17 preferably has a wire diameter of 4 to 6 μm, and the distance between the plurality of metal wirings 17 is preferably 1000 μm to 5.0 mm. By forming the metal wiring 17 in this configuration, the transparent conductive film 15 can ensure sufficient transmittance for visible light and infrared light.

[0049] In addition, in this embodiment, copper is used as the material for the metal wiring 17, but nickel, tungsten wire, gold, silver, polyethylenedioxythiophene, etc. may also be used.

[0050] 2B, the plurality of metal wirings 17 may be formed such that two metal wirings 17 intersect near the center of the thin film member 16. In other words, the plurality of metal wirings 17 may be formed in a mesh shape.

[0051] The transparent conductive film 15 may be any thin heat-generating member having light-transmitting properties, and may be a transparent conductive film such as an ITO film (indium tin oxide film).

[0052] [Variations] A modified example of the optical unit 10 of this embodiment will be described with reference to Fig. 3. Fig. 3 is a conceptual diagram showing a modified example of the optical unit 10 of this embodiment, and is a cross-sectional view of the modified example of the optical unit 10.

[0053] 3, in the modified example of the optical unit 10, an anti-fog coating 20 is formed on the inner surface of the substrate 12, and a hard coat 21 is formed on the outer surface of the substrate 12. In other words, the optical unit 10 of the modified example differs from the above-described embodiment in that it includes the anti-fog coating 20 and the hard coat 21.

[0054] Forming the anti-fogging coating 20 on the inner surface of the substrate 12 can further improve the anti-fogging effect. Furthermore, forming the hard coat 21 on the outer surface of the substrate 12 can improve the mechanical strength of the surface of the substrate 12. In other words, it is possible to prevent scratches or dirt from forming on the surface of the substrate 12, which can reduce light transmittance and cause poor visibility or malfunction of sensors, etc.

[0055] The anti-fog coating 20 is formed to a thickness of 30 μm on the entire inner surface of the substrate 12. In this embodiment, the anti-fog coating 20 is formed on the entire surface of the substrate 12, but it is sufficient that the anti-fog coating 20 is formed at least in an area corresponding to the path of light emitted from the optical devices 13 and 14.

[0056] In addition, in this embodiment, the thickness of the anti-fogging coating 20 is set to 30 μm, but the thickness of the anti-fogging coating 20 can be adjusted arbitrarily as long as the light emitted from the optical devices 13 and 14 can be transmitted through it.

[0057] The anti-fog coating 20 is a cured film obtained by curing an active energy-curable anti-fog composition. Because the anti-fog composition of the present invention is active energy-curable (e.g., ultraviolet-curable), it is possible to prevent thermal deformation of the transparent conductive film 15 even when the anti-fog composition is cured while the transparent conductive film 15 is in contact with the substrate 12. This improves the reliability of the transparent conductive film.

[0058] The anti-fogging composition is a solvent-free composition containing a radical-reactive material and an initiator. Here, "solvent-free" means that the anti-fogging composition does not contain a non-reactive volatile organic solvent or is substantially free of a non-reactive volatile organic solvent. "Substantially free of a non-reactive volatile organic solvent" means that when the anti-fogging composition is subjected to gas chromatography analysis at 200°C, the total amount of components detected that do not contain a vinyl group or an acryloyl group is less than 1% by mass.

[0059] Because the anti-fogging composition is solvent-free, when the anti-fogging composition is cured, most of the active ingredient becomes an anti-fogging coating, thereby reducing the total amount of anti-fogging composition required for application to the surface of the substrate 12.

[0060] In this modification, the anti-fogging composition is a solvent-free type, but an anti-fogging composition diluted with an organic solvent may also be used.

[0061] The radical-reactive material is a radical-reactive material made of a resin component such as a monomer or oligomer, and contains hydrophilic groups. When the anti-fogging composition is applied to the inner surface of the substrate 12, at least some of the hydrophilic groups are disposed in the surface layer of the anti-fogging composition. Then, by curing the anti-fogging composition through a radical reaction, an anti-fogging coating 20 can be formed on the surface of the substrate 12 as a cured film having hydrophilic groups.

[0062] Because hydrophilic groups are disposed on the surface of the anti-fog coating 20, the surface of the anti-fog coating 20 has a hydrophilic function. This reduces the contact angle between the surface of the anti-fog coating 20 and water. As a result, moisture diffuses onto the surface of the anti-fog coating 20 to form a water film, ensuring the anti-fog properties of the substrate 12.

[0063] The radical-reactive material is a radical-reactive material composed of a resin component such as a monomer or oligomer. The content of the radical-reactive material in the anti-fogging composition is preferably 70 to 95% of the total amount. By incorporating the radical-reactive material into the anti-fogging composition, the viscosity of the anti-fogging composition can be adjusted. Therefore, the anti-fogging composition can be adjusted to a viscosity suitable for spray coating without diluting it with an organic solvent. The viscosity suitable for spray coating is, for example, 3 to 60 mPa·s / 25°C. Therefore, a thermal drying step is not required in the step of curing the anti-fogging composition on the surface of the substrate 12, and thermal deformation of the transparent conductive film can be prevented.

[0064] Examples of radical reactive materials that can be used include polyethylene glycol diacrylate, triethylene glycol diacrylate, pentaerythritol triacrylate, 2-hydroxy-3-acryloyloxypropyl acrylate, polytetramethylene glycol diacrylate, etc. These radical reactive materials may be used alone or in combination of two or more.

[0065] An initiator is a radical generator that generates highly active radicals when irradiated with ultraviolet light. These radical species undergo decomposition and react with resin components such as monomers and / or oligomers. This reaction product then reacts with other resin components, causing a chain reaction to proceed. This crosslinking reaction then progresses, increasing the molecular weight and curing the radical-reactive material, forming a cured film.

[0066] Examples of initiators that can be used include ketones such as benzophenone, benzoin methyl ether, benzoin propyl ether, diethoxyacetophenone, and 1-hydroxycyclohexyl phenyl ketone; azos such as 2,2'-azobisisobutylnitrile, azobis-2-methylbutyronitrile, and azobisdivaleronitrile; organic peroxides such as t-butylperoxyisobutyrate, t-butylperoxy-2-ethylhexanoate, t-amylperoxy-3,5,5-trimethylhexanoate, t-butylperoxyisopropyl carbonate, 2,2-bis(4,4-di-t-butylperoxycyclohexyl)propane, di-t-butyl peroxide, and di-t-amyl peroxide; and acylphosphine compounds such as 2,6-dimethylbenzoyldiphenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide. Among these, radical cleavage initiators such as 1-hydroxycyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, etc. are preferred. These initiators may be used alone or in combination of two or more.

[0067] The anti-fogging composition may contain various additives such as thiol materials, antibacterial agents, antifungal agents, antifoaming agents, antioxidants, antistatic agents, and polymerization inhibitors.

[0068] The hard coat 21 is formed to a film thickness of 10 μm on the entire outer surface of the substrate 12. In this embodiment, the hard coat 21 is formed on the entire surface of the substrate 12, but it is sufficient that the hard coat 21 is formed at least in an area corresponding to the path of light emitted from the optical devices 13 and 14.

[0069] In addition, in this embodiment, the thickness of the hard coat 21 is set to 10 μm, but the thickness of the hard coat 21 can be adjusted arbitrarily as long as the light emitted from the optical devices 13 and 14 can be transmitted through it.

[0070] The hard coat 21 is a cured film obtained by curing an active energy curable composition. Because the hard coat 21 of the present invention is active energy curable (e.g., ultraviolet curable), it can prevent thermal deformation of the transparent conductive film 15 even when the hard coat is cured while the transparent conductive film 15 is in contact with the substrate 12.

[0071] The composition used for the hard coat 21 can be the same as the anti-fogging composition used for the anti-fogging coating 20. However, the composition used for the hard coat 21 may be a different composition from the anti-fogging composition used for the anti-fogging coating 20.

[0072] [Manufacturing method] Hereinafter, a method for manufacturing the substrate 12 in which the transparent conductive film 15 of this embodiment is embedded will be described in detail with reference to FIG. 4 and FIGS. 5A to 5D.

[0073] In this manufacturing method, a mold made of polycarbonate (PC) or quartz, which is transparent to ultraviolet light, was used as the light-transmitting mold 30 for molding the base material 12. The light-transmitting mold 30 also has an upper mold 30A and a lower mold 30B.

[0074] First, the ultraviolet-curable composition 12C was poured into the lower mold 30B (FIG. 4 / STEP 1, FIG. 5A). The surface of the ultraviolet-curable composition 12C that is in contact with the lower mold 30B becomes the outer surface of the substrate 12 on which the ultraviolet-curable composition 12C has been cured.

[0075] Next, a transparent conductive film 15 was placed on the ultraviolet-curable composition 12C (FIG. 4 / STEP 2, FIG. 5B).

[0076] Next, the ultraviolet-curable composition 12C was applied onto the transparent conductive film 15 (FIG. 4 / STEP 3, FIG. 5C). That is, the transparent conductive film 15 was buried in the ultraviolet-curable composition 12C.

[0077] Next, the upper mold 30A and the lower mold 30B were clamped together, and ultraviolet light was irradiated from the outside of the translucent mold 30 by a UV-LED lamp 31 toward the ultraviolet-curable composition 12C (FIG. 4 / STEP 4, FIG. 5D). The ultraviolet-curable composition 12C was cured by the ultraviolet light irradiation to form the substrate 12. As shown in FIG. 5D, four UV-LED lamps 31 were used to irradiate ultraviolet light from all four sides of the translucent mold 30. The ultraviolet light irradiation conditions were a wavelength of 220 to 400 nm and an intensity of 100 to 300 mW / cm. 2 , 1000~3000mJ / cm 2 It was decided.

[0078] Next, the substrate 12 with the transparent conductive film 15 embedded therein was released from the light-transmitting mold 30 (FIG. 4 / STEP 5). In this manner, the substrate 12 with the transparent conductive film 15 embedded therein can be manufactured.

[0079] As a method of irradiating ultraviolet light in this manufacturing method (FIG. 4 / STEP 4, FIG. 5D), two UV-LED lamps 31 may be used to irradiate ultraviolet light simultaneously from above and below the mold, or one UV-LED lamp 31 may be rotated around the light-transmitting mold 30 to irradiate ultraviolet light intermittently over the entire area of ​​the light-transmitting mold 30. Alternatively, one UV-LED lamp 31 may be used to irradiate ultraviolet light from either the top or bottom of the light-transmitting mold 30, while a reflective member that reflects the ultraviolet light emitted from the UV-LED lamp 31 is used to irradiate the other of the top or bottom of the light-transmitting mold 30, thereby irradiating ultraviolet light simultaneously over both the top and bottom of the light-transmitting mold 30. In addition to UV-LED lamps, a high-pressure mercury lamp may also be used as an ultraviolet light source.

[0080] In this manufacturing method, the transparent conductive film 15 is embedded in the substrate 12 by applying the ultraviolet-curable composition 12C onto the transparent conductive film 15 (Figure 4 / STEP 3, Figure 5C). However, by omitting this manufacturing step, it is possible to manufacture an optical unit 10 having a transparent conductive film 15 in which one surface of the thin film member 16 is in contact with the substrate 12 while a portion of the thin film member 16 is exposed from the substrate 12.

[0081] [Modification of manufacturing method] A modified example of the method for manufacturing the substrate 12 in which the transparent conductive film 15 of this embodiment is embedded will be described in detail below with reference to FIG. 6 and FIGS. 7A to 7D.

[0082] In this manufacturing method, a metal mold 40 made of metal is used as the mold for molding the substrate 12. In other words, the metal mold 40 is made of a material that does not transmit ultraviolet light.

[0083] The metal mold 40 is an open mold with one side open (the upward side as shown in FIG. 7A ). A first UV-LED lamp 41A is embedded in the metal mold 40 so that it can irradiate ultraviolet light toward the composition poured into the metal mold 40.

[0084] First, the ultraviolet-curable composition 12C was poured into the metal mold 40 (FIG. 6 / STEP 1, FIG. 7A). The surface of the ultraviolet-curable composition 12C in contact with the metal mold 40 becomes the outer surface of the substrate 12 on which the ultraviolet-curable composition 12C has been cured.

[0085] Next, a transparent conductive film 15 was placed on the ultraviolet-curable composition 12C (FIG. 6 / STEP 2, FIG. 7B).

[0086] Next, the ultraviolet-curable composition 12C was applied onto the transparent conductive film 15 (FIG. 6 / STEP 3, FIG. 7C). That is, the transparent conductive film 15 was embedded in the ultraviolet-curable composition 12C.

[0087] Next, ultraviolet light was irradiated onto the ultraviolet-curable composition 12C from a first UV-LED lamp 41A embedded in the metal mold 40 and a second UV-LED lamp 41B positioned opposite the first UV-LED lamp 41A (FIG. 6 / STEP 4, FIG. 7D). The ultraviolet-curable composition 12C was cured by the ultraviolet light irradiation to form the substrate 12. The ultraviolet irradiation conditions were a wavelength of 220 to 400 nm and a power of 100 to 300 mW / cm. 2 , 1000~3000mJ / cm 2 It was decided.

[0088] Next, the substrate 12 with the transparent conductive film 15 embedded therein was released from the metal mold 40 (FIG. 6 / STEP 5). In this manner, the substrate 12 with the transparent conductive film 15 embedded therein can be manufactured.

[0089] In the method of irradiating ultraviolet light in this manufacturing method (FIG. 6 / STEP 4, FIG. 7D), ultraviolet light may be irradiated using only either the first UV-LED lamp 41A or the second UV-LED lamp 41B. In addition to the UV-LED lamp, a high-pressure mercury lamp may also be used as an ultraviolet light source.

[0090] In this manufacturing method, the transparent conductive film 15 is embedded in the substrate 12 by applying the ultraviolet-curable composition 12C onto the transparent conductive film 15 (Figure 6 / STEP 3, Figure 7C). However, by omitting this manufacturing step, it is possible to manufacture an optical unit 10 having a transparent conductive film 15 in which one surface of the thin film member 16 is in contact with the substrate 12 while a portion of the thin film member 16 is exposed from the substrate 12. [Example]

[0091] The present invention will be described in more detail below with reference to examples and comparative examples. The compositions of the examples and comparative examples are summarized in Figure 8. However, the present invention is not limited to these examples.

[0092] Example 1 A 20 μm-thick polycarbonate resin (PC) film (50 mm x 100 mm) was used as the thin film member. Copper nanoparticles (Taiyo Nippon Sanso Corporation) were used as the material. Using an R&D inkjet device (Seiko Epson Corporation), multiple 10 μm-diameter metal wiring patterns were formed on the thin film member in parallel with 50 μm intervals (parallel wiring). A flexible printed circuit (FPC) from Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, a UV-curable composition was obtained by mixing 40 parts by weight of isobornyl acrylate (product name: IBOA-B, Daicel-Allnex Corporation) as a polymer compound, 45 parts by weight of EO-modified bisphenol A diacrylate (product name: EBECRYL 150, Daicel-Allnex Corporation) as a diluent, and 15 parts by weight of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, IGM Resins BV) as an initiator. Thereafter, a transparent conductive film is placed on the ultraviolet-curable composition, and the ultraviolet-curable composition is applied at 365 nm and 3,000 mJ / cm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 600° C. to obtain a molded body (substrate) of Example 1 having a thickness of 3 mm (70 mm×100 mm).

[0093] Example 2 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 20 μm were formed on the thin film member in parallel at 100 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 50 parts by mass of phenoxydiethylene glycol acrylate (product name: EBECRYL 110, manufactured by Daicel-Allnex Corporation) as a polymer compound, 20 parts by mass of tripropylene glycol diacrylate (product name: TPGDA, manufactured by Daicel-Allnex Corporation) and 20 parts by mass of EO-modified bisphenol A diacrylate (product name: EBECRYL 150, manufactured by Daicel-Allnex Corporation) as diluents, and 5 parts by mass of 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one (product name: Omnirad127, manufactured by IGM Resins BV) and 5 parts by mass of 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone (product name: Omnirad2959, manufactured by IGM Resins BV) as initiators were mixed to obtain a UV-curable composition. Thereafter, a transparent conductive film is placed on the ultraviolet-curable composition, and the ultraviolet-curable composition is applied at 365 nm and 3,000 mJ / cm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 600° C. to obtain a molded body (substrate) of Example 2 having a thickness of 3 mm (70 mm×100 mm).

[0094] Example 3 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 20 μm were formed on the thin film member in parallel at 100 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 30 parts by mass of β-carboxyethyl acrylate (product name: β-CEA, manufactured by Daicel-Allnex Co., Ltd.) as a polymer compound, 50 parts by mass of dipropylene glycol diacrylate (product name: DPGDA, manufactured by Daicel-Allnex Co., Ltd.) as a diluent, and 10 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (product name: Omnirad369, manufactured by IGM Resins BV) and 10 parts by mass of 1-hydroxycyclohexylphenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) as initiators were mixed to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated at 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 3 having a thickness of 3 mm (70 mm×100 mm).

[0095] Example 4 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 20 μm were formed on the thin film member in parallel at 100 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 47 parts by mass of 1,6-hexanediol diacrylate (product name: HDDA, manufactured by Daicel-Allnex Co., Ltd.) as a polymer compound, 50 parts by mass of tripropylene glycol diacrylate (product name: TPGDA, manufactured by Daicel-Allnex Co., Ltd.) as a diluent, and 3 parts by mass of 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone (product name: Omnirad2959, manufactured by IGM Resins BV) as an initiator were mixed to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated with 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 600° C. to obtain a molded body (substrate) of Example 4 having a thickness of 3 mm (70 mm×100 mm).

[0096] Example 5 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 20 μm were formed on the thin film member in parallel at 100 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 20 parts by weight of 1,6-hexanediol diacrylate (product name: HDDA, manufactured by Daicel-Allnex Corporation) and 30 parts by weight of phenoxydiethylene glycol acrylate (product name: EBECRYL 110, manufactured by Daicel-Allnex Corporation) as polymer compounds were mixed with 40 parts by weight of dipropylene glycol diacrylate (product name: DPGDA, manufactured by Daicel-Allnex Corporation) as a diluent, and 10 parts by weight of 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one (product name: Omnirad127, manufactured by IGM Resins BV) as an initiator to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated at 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 5 having a thickness of 3 mm (70 mm×100 mm).

[0097] Example 6 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 10 μm were formed on the thin film member in parallel at 50 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 45 parts by mass of isobornyl acrylate (product name: IBOA-B, manufactured by Daicel-Allnex Co., Ltd.) as a polymer compound, 50 parts by mass of tripropylene glycol diacrylate (product name: TPGDA, manufactured by Daicel-Allnex Co., Ltd.) as a diluent, and 5 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (product name: Omnirad369, manufactured by IGM Resins BV) as an initiator were mixed to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated with 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 600° C. to obtain a molded body (substrate) of Example 6 having a thickness of 3 mm (70 mm×100 mm).

[0098] Example 7 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 20 μm were formed on the thin film member in parallel at 100 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 47 parts by weight of phenoxydiethylene glycol acrylate as a polymer compound (product name: EBECRYL 110, manufactured by Daicel-Allnex Corporation), 47 parts by weight of EO-modified bisphenol A diacrylate as a diluent (product name: EBECRYL 150, manufactured by Daicel-Allnex Corporation), 3 parts by weight of 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one as an initiator (product name: Omnirad127, manufactured by IGM Resins BV), and 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutyrate) as a thiol material (product name: KarenzMT® PE1, manufactured by Resonac Corporation) were mixed to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated at 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 7 having a thickness of 3 mm (70 mm×100 mm).

[0099] Example 8 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 10 μm were formed on the thin film member in parallel at 50 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 50 parts by weight of β-carboxyethyl acrylate as a polymer compound (product name: β-CEA, manufactured by Daicel-Allnex Co., Ltd.), 44 parts by weight of tripropylene glycol diacrylate as a diluent (product name: TPGDA, manufactured by Daicel-Allnex Co., Ltd.), 13 parts by weight of 1-hydroxycyclohexyl phenyl ketone as an initiator (product name: Omnirad184, manufactured by IGM Resins BV), and 5 parts by weight of pentaerythritol tetrakis(3-mercaptobutyrate) as a thiol material (product name: KarenzMT® PE1, manufactured by Resonac Co., Ltd.) were mixed to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated with 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 8 having a thickness of 3 mm (70 mm×100 mm).

[0100] Example 9 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 20 μm were formed on the thin film member in parallel at 100 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 50 parts by mass of PEG400 diacrylate (product name: PEG400DA, manufactured by Daicel-Allnex Corporation) as a polymer compound, 22 parts by mass of tripropylene glycol diacrylate (product name: TPGDA, manufactured by Daicel-Allnex Corporation) and 22 parts by mass of EO-modified bisphenol A diacrylate (product name: EBECRYL 150, manufactured by Daicel-Allnex Corporation) as diluents, 2 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (product name: Omnirad369, manufactured by IGM Resins BV) as an initiator, and 5 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (product name: KarenzMT® PE1, manufactured by Resonac Corporation) as a thiol material were mixed to obtain an ultraviolet-curable composition. Thereafter, a transparent conductive film is placed on the ultraviolet-curable composition, and the ultraviolet-curable composition is applied at 365 nm and 3,000 mJ / cm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 9 having a thickness of 3 mm (70 mm×100 mm).

[0101] Example 10 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 20 μm were formed on the thin film member in parallel at 100 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 40 parts by weight of tricyclodecane dimethanol diacrylate (product name: EBECRYL 130, manufactured by Daicel-Allnex Co., Ltd.) as a polymer compound, 50 parts by weight of EO-modified bisphenol A diacrylate (product name: EBECRYL 150, manufactured by Daicel-Allnex Co., Ltd.) as a diluent, 15 parts by weight of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) as an initiator, and 5 parts by weight of pentaerythritol tetrakis(3-mercaptobutyrate) as a thiol material (product name: KarenzMT® PE1, manufactured by Resonac Co., Ltd.) were mixed to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated at 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 600° C. to obtain a molded body (substrate) of Example 10 having a thickness of 3 mm (70 mm×100 mm).

[0102] Example 11 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 10 μm were formed on the thin film member in parallel at 50 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 25 parts by mass of 1,6-hexanediol diacrylate (product name: HDDA, manufactured by Daicel-Allnex Corporation) and 25 parts by mass of phenoxydiethylene glycol acrylate (product name: EBECRYL 110, manufactured by Daicel-Allnex Corporation) as polymer compounds, 42 parts by mass of dipropylene glycol diacrylate (product name: DPGDA, manufactured by Daicel-Allnex Corporation) as a diluent, 2 parts by mass of 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one (product name: Omnirad127, manufactured by IGM Resins BV) and 1 part by mass of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) as initiators, and 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (product name: Karenz MT(R)) as a thiol material. PE1 (manufactured by Resonac Corporation) to obtain an ultraviolet-curable composition. Then, a transparent conductive film was placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated with 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 11 having a thickness of 3 mm (70 mm×100 mm).

[0103] Example 12 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 20 μm were formed on the thin film member in parallel at 100 μm intervals (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 55 parts by mass of 1,6-hexanediol diacrylate (product name: HDDA, manufactured by Daicel-Allnex Corporation) as a polymer compound, 30 parts by mass of tripropylene glycol diacrylate (product name: TPGDA, manufactured by Daicel-Allnex Corporation) as a diluent, 3 parts by mass of 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one (product name: Omnirad127, manufactured by IGM Resins BV) and 2 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (product name: Omnirad369, manufactured by IGM Resins BV) as initiators, and 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (product name: KarenzMT® PE1, manufactured by Resonac Corporation) as a thiol material were mixed to obtain an ultraviolet-curable composition. Thereafter, a transparent conductive film is placed on the ultraviolet-curable composition, and the ultraviolet-curable composition is applied at 365 nm and 3,000 mJ / cm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 70° C. to obtain a molded body (substrate) of Example 12 having a thickness of 3 mm (70 mm×100 mm).

[0104] Example 13 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 5 μm were formed on the thin film member in parallel at intervals of 1000 μm (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 30 parts by mass of β-carboxyethyl acrylate (product name: β-CEA, manufactured by Daicel-Allnex Corporation) as a polymer compound, 50 parts by mass of dipropylene glycol diacrylate (product name: DPGDA, manufactured by Daicel-Allnex Corporation) as a diluent, 5 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (product name: Omnirad369, manufactured by IGM Resins BV) and 5 parts by mass of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) as initiators, and 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (product name: KarenzMT(R) PE1, manufactured by Resonac Corporation) as a thiol material were mixed to obtain an ultraviolet-curable composition. Thereafter, a transparent conductive film is placed on the ultraviolet-curable composition, and the ultraviolet-curable composition is applied at 365 nm and 3,000 mJ / cm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 13 having a thickness of 3 mm (70 mm×100 mm).

[0105] Example 14 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a diameter of 2 μm were formed on the thin film member in parallel at intervals of 1200 μm (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 45 parts by weight of 1,6-hexanediol diacrylate (product name: HDDA, manufactured by Daicel-Allnex Corporation) as a polymer compound, 42 parts by weight of tripropylene glycol diacrylate (product name: TPGDA, manufactured by Daicel-Allnex Corporation) as a diluent, 3 parts by weight of 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone (product name: Omnirad2959, manufactured by IGM Resins BV) as an initiator, and 10 parts by weight of pentaerythritol tetrakis(3-mercaptobutyrate) as a thiol material (product name: KarenzMT® PE1, manufactured by Resonac Corporation) were mixed to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated at 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 600° C. to obtain a molded body (substrate) of Example 14 having a thickness of 3 mm (70 mm×100 mm).

[0106] Example 15 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 2 μm were formed on the thin film member in parallel at intervals of 1500 μm (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 20 parts by mass of PEG400 diacrylate (product name: PEG400DA, manufactured by Daicel-Allnex Co., Ltd.) and 30 parts by mass of phenoxydiethylene glycol acrylate (product name: EBECRYL 110, manufactured by Daicel-Allnex Co., Ltd.) were used as polymer compounds, 35 parts by mass of dipropylene glycol diacrylate (product name: DPGDA, manufactured by Daicel-Allnex Co., Ltd.) was used as a diluent, 2 parts by mass of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) and 3 parts by mass of 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one (product name: Omnirad127, manufactured by IGM Resins BV) were used as initiators, and 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (product name: KarenzMT(R)) was used as a thiol material. PE1 (manufactured by Resonac Corporation) to obtain an ultraviolet-curable composition. Then, a transparent conductive film was placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated with 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 15 having a thickness of 3 mm (70 mm×100 mm).

[0107] Example 16 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 2 μm were formed on the thin film member in parallel at intervals of 1500 μm (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 45 parts by weight of trimethylolpropane triacrylate (product name: TMPTA, manufactured by Daicel-Allnex Corporation) with trifunctionality as a polymer compound, 50 parts by weight of dipropylene glycol diacrylate (product name: DPGDA, manufactured by Daicel-Allnex Corporation) as a diluent, 5 parts by weight of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) as an initiator, and 10 parts by weight of pentaerythritol tetrakis(3-mercaptobutyrate) as a thiol material (product name: KarenzMT® PE1, manufactured by Resonac Corporation) were mixed to obtain an ultraviolet-curable composition. A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was exposed to 3,000 mJ / cm at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 16 having a thickness of 3 mm (70 mm×100 mm).

[0108] Example 17 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 2 μm were formed on the thin film member in parallel at intervals of 1500 μm (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 50 parts by mass of trimethylolpropane ethoxy triacrylate (product name: EBECRYL 160S, manufactured by Daicel-Allnex Corporation) having three functional groups was mixed as a polymer compound, 20 parts by mass of EO-modified bisphenol A diacrylate (product name: EBECRYL 150, manufactured by Daicel-Allnex Corporation) and 15 parts by mass of tripropylene glycol diacrylate (product name: TPGDA, manufactured by Daicel-Allnex Corporation) were mixed as diluents, and 2 parts by mass of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) and 3 parts by mass of 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one (product name: Omnirad127, manufactured by IGM Resins BV) were mixed as initiators. An ultraviolet-curable composition was obtained by mixing 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) as a thiol material (product name: KarenzMT® PE1, manufactured by Resonac Corporation) with 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) as a thiol material (product name: KarenzMT® PE1, manufactured by Resonac Corporation). A transparent conductive film was then placed on the ultraviolet-curable composition, and the ultraviolet-curable composition was irradiated with 3,000 mJ / cm2 at 365 nm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 70° C. to obtain a molded body (substrate) of Example 17 having a thickness of 3 mm (70 mm×100 mm).

[0109] Example 18 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 2 μm were formed on the thin film member in parallel at intervals of 1500 μm (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 25 parts by mass of trifunctional pentaerythritol (tri / tetra)acrylate (product name: PETRA, manufactured by Daicel-Allnex Corporation) as a polymer compound and 25 parts by mass of tetrafunctional pentaerythritol alkoxytetraacrylate (product name: EBECRYL 40, manufactured by Daicel-Allnex Corporation) were mixed with 37 parts by mass of tripropylene glycol diacrylate (product name: TPGDA, manufactured by Daicel-Allnex Corporation) as a diluent, 3 parts by mass of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) as an initiator, and 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (product name: KarenzMT(R) PE1, manufactured by Resonac Corporation) as a thiol material to obtain an ultraviolet-curable composition. Thereafter, a transparent conductive film is placed on the ultraviolet-curable composition, and the ultraviolet-curable composition is applied at 365 nm and 3,000 mJ / cm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 18 having a thickness of 3 mm (70 mm×100 mm).

[0110] Example 19 A 20 μm thick polycarbonate resin (PC) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wiring lines with a wire diameter of 2 μm were formed on the thin film member in parallel at intervals of 1500 μm (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). A flexible printed circuit (FPC) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, 55 parts by mass of dipentaerythritol hexaacrylate (product name: DPHA, manufactured by Daicel-Allnex Corporation) having five or more functional groups as a polymer compound, 30 parts by mass of EO-modified bisphenol A diacrylate (product name: EBECRYL 150, manufactured by Daicel-Allnex Corporation) as a diluent, 3 parts by mass of 1-hydroxycyclohexyl phenyl ketone (product name: Omnirad184, manufactured by IGM Resins BV) and 2 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenone (product name: Omnirad369, manufactured by IGM Resins BV) as initiators, and 10 parts by mass of pentaerythritol tetrakis(3-mercaptobutyrate) (product name: KarenzMT® PE1, manufactured by Resonac Corporation) as a thiol material were mixed to obtain an ultraviolet-curable composition. Thereafter, a transparent conductive film is placed on the ultraviolet-curable composition, and the ultraviolet-curable composition is applied at 365 nm and 3,000 mJ / cm using a UV-LED lamp. 2 The mixture was cured with ultraviolet light at 60° C. to obtain a molded body (substrate) of Example 19 having a thickness of 3 mm (70 mm×100 mm).

[0111] Comparative Example 1 A 20 μm thick polyethylene terephthalate (PET) film (50 mm × 100 mm) was used as the thin film member. Copper nanoparticles (manufactured by Taiyo Nippon Sanso Co., Ltd.) were used as the material, and multiple metal wirings with a wire diameter of 10 μm were formed on the thin film member in parallel at intervals of 50 μm (parallel wiring) using an R&D inkjet device (manufactured by Seiko Epson Corporation). An FPC (Flexible Printed Circuits) manufactured by Nippon Mektron Co., Ltd. was attached to this to produce a transparent conductive film. Next, polycarbonate (product name: Iupilon) was used as the thermosetting composition. TM HL-3003 (manufactured by Mitsubishi Engineering-Plastics Corporation) was dried in a hot air dryer at 120°C for 4 to 8 hours, and then melted at an injection molding temperature of 260 to 290°C. Next, the thermosetting composition was poured into a mold set to 80 to 120°C with a transparent conductive film already placed inside, to obtain a molded body (substrate) of Comparative Example 1 having a thickness of 3 mm (70 mm x 100 mm).

[0112] (Evaluation of cure shrinkage) The dimensional change rate in the height direction of each of the molded articles of Examples 1 to 19 and Comparative Example 1 was measured, and the cure shrinkage (warpage) of the molded articles was evaluated on a five-point scale of A to E. The evaluation was based on the following criteria: A: no dimensional change (0% or more but less than ±3%); B: ±3% or more but less than ±5%; C: ±5% or more but less than ±10%; D: ±10% or more but less than ±15%; and E: ±15% or more. Fig. 9 shows the evaluation results of cure shrinkage for Examples 1 to 19 and Comparative Example 1.

[0113] (Evaluation of visible light transmittance) The average transmittance (%) of each of the molded articles of Examples 1 to 19 and Comparative Example 1 in the wavelength range of 360 nm to 830 nm was measured, and the visible light transmittance (%) was evaluated on a five-level scale of A to E. A spectrophotometer (device name: UV-1900i, manufactured by Shimadzu Corporation) was used to measure the transmittance (%). The evaluation was performed as follows: A: visible light transmittance of 95% or more; B: visible light transmittance of 90% or more but less than 95%; C: visible light transmittance of 80% or more but less than 90%; D: visible light transmittance of 70% or more but less than 80%; and E: visible light transmittance of less than 70%. FIG. 9 shows the evaluation results of visible light transmittance for Examples 1 to 19 and Comparative Example 1.

[0114] (Evaluation of infrared transmittance) The average transmittance (%) in the wavelength range of 780 nm to 1 mm was measured for each of the molded articles of Examples 1 to 19 and Comparative Example 1, and the infrared transmittance (%) was evaluated on a five-level scale of A to E. A spectrophotometer (device name: UV-1900i, manufactured by Shimadzu Corporation) was used to measure the transmittance (%). The evaluation was performed as follows: A indicates an infrared transmittance of 95% or more; B indicates an infrared transmittance of 90% or more but less than 95%; C indicates an infrared transmittance of 80% or more but less than 90%; D indicates an infrared transmittance of 70% or more but less than 80%; and E indicates an infrared transmittance of less than 70%. FIG. 9 shows the evaluation results of infrared transmittance for Examples 1 to 19 and Comparative Example 1.

[0115] (Strength evaluation) The Charpy impact strength (KJ / m 2 ) was measured and the strength was evaluated on a scale of A to E. 2 The Charpy impact strength was measured using a fully automatic Charpy impact tester (device name: No. 625, manufactured by Toyo Seiki Seisakusho Co., Ltd.) in accordance with ISO 179, with a notch. The evaluation was carried out at a Charpy impact strength of 45 KJ / m 2 If the Charpy impact strength is 35KJ / m or more, it is rated as A. 2 More than 45KJ / m 2If the Charpy impact strength is less than 20KJ / m, it is classified as B. 2 More than 35KJ / m 2 If the Charpy impact strength is less than 5KJ / m, it is classified as C. 2 More than 20KJ / m 2 If the Charpy impact strength is less than 5KJ / m, it is classified as D. 2 If the strength was less than 1 / 2, it was rated as E. FIG. 9 shows the evaluation results of strength for Examples 1 to 19 and Comparative Example 1.

[0116] As is clear from FIG. 9, the molded articles of Examples 1 to 19 are formed from an ultraviolet-curable composition, and therefore exhibit reduced cure shrinkage compared to the molded article of Comparative Example 1, which is made from a thermosetting composition, and are transparent to visible light and infrared light. In other words, a visible-light monocular camera and an infrared LiDAR (sensor) can be installed inside the substrate. Furthermore, snow can be actively melted on the outer surface of the molded article by applying a voltage to the metal wiring. Furthermore, active anti-fogging can be achieved on the inner surface of the molded article. In other words, the reliability of ADAS sensors and the like can be improved.

[0117] As is clear from FIG. 9, the molded articles of Examples 7 to 19, in which the ultraviolet-curable composition contains a thiol material, have evaluation results of C or higher for cure shrinkage, which indicates that the cure shrinkage of the molded articles is suppressed.

[0118] 9, the molded articles according to Examples 8 to 19, in which the ultraviolet-curable composition contains 5% or more of a thiol material, have a curing shrinkage that is further suppressed, as indicated by the evaluation results of B or higher for the curing shrinkage of the molded articles. Therefore, the content of the thiol material in the ultraviolet-curable composition is preferably 5% or more.

[0119] 9, the molded articles according to Examples 11 to 19, in which the ultraviolet-curable composition contains 10% or more of a thiol material, have further suppressed cure shrinkage, as indicated by the evaluation result of cure shrinkage being A. Therefore, it is more preferable that the content of the thiol material in the ultraviolet-curable composition is 10% or more.

[0120] 9, the molded articles according to Examples 13 to 19, in which the metal wiring of the transparent conductive film was formed with a wire diameter of 5 μm or less and spaced at intervals of 1000 μm or more, had improved visible light transmittance and infrared transmittance, as indicated by the evaluation results of B or higher for the visible light transmittance and infrared transmittance. Therefore, it is preferable that the metal wiring of the transparent conductive film be formed with a wire diameter of 5 μm or less and spaced at intervals of 1000 μm or more.

[0121] 9, the molded articles according to Examples 15 to 19, in which the metal wiring of the transparent conductive film was formed with a wire diameter of 2 μm or less and spaced at intervals of 1500 μm or more, had improved visible light transmittance and infrared transmittance, as indicated by the evaluation results of visible light transmittance and infrared transmittance being A. Therefore, it is more preferable that the metal wiring of the transparent conductive film be formed with a wire diameter of 2 μm or less and spaced at intervals of 1500 μm or more.

[0122] 9, the molded articles according to Examples 16 to 19, in which a polymer compound having a functionality of three or more was used as the polymer compound of the ultraviolet-curable composition, had improved strength, as indicated by the strength evaluation results of B or higher. Therefore, it is preferable to use a polymer compound having a functionality of three or more as the polymer compound of the ultraviolet-curable composition.

[0123] As described above, the optical unit of the present invention can ensure the translucency of the base material by achieving both the snow-melting effect and the anti-fogging effect. [Explanation of symbols]

[0124] 10 Optical unit 11. Housing 12 Base material 13 1st optical equipment 14 Second optical equipment 15 Transparent conductive film 16 Thin film materials 17 Metal wiring 18 First Contact 19 Second Contact 20 Anti-fog coating 21 Hard Court 30 Translucent mold 31 UV-LED lamps 40 Metal molds 41A 1st UV-LED lamp 41B 2nd UV-LED lamp

Claims

1. Housing and a light-transmitting substrate made of an ultraviolet-curable composition; an optical instrument disposed in an interior space defined by the housing and the substrate; an optical unit comprising: a transparent conductive film that is provided in contact with the base material and generates heat when power is supplied thereto;

2. 2. The optical unit according to claim 1, wherein the polymer compound contained in the ultraviolet-curable composition has three or more functional groups.

3. The optical unit according to claim 1 , wherein the ultraviolet-curable composition contains a thiol material containing a polyfunctional thiol group.

4. 2. The optical unit according to claim 1, wherein the transmittance of light in a wavelength range used in the optical device is 80% or more.

5. The Charpy impact strength of the substrate is 80 KJ / m 2 The optical unit according to claim 1, wherein the optical unit is as described above.

6. 2. The optical unit according to claim 1, wherein the optical unit is a headlight unit for a vehicle having a light emitting device as the optical device.

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