Polishing apparatus and polishing method

Abstract

To provide a polishing apparatus and a polishing method for improving an adjustment effect of a pad conditioner to a polishing pad.SOLUTION: The polishing apparatus comprises a polishing pad, a pad conditioner, a cleaning nozzle, a pressure detecting unit and a control unit. The pad conditioner can be moved onto a pressure detecting unit and contact with the pressure detecting unit, the pressure detecting unit is used for measuring pressure data of the pad conditioner, the cleaning nozzle cleans the pad conditioner, and the control unit is electrically connected with the pad conditioner and the pressure detecting unit to control a working state of the pad conditioner according to the pressure data.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] This application relates to the field of semiconductor technology, and more particularly to polishing apparatus and methods. [Background technology]

[0002] With the rapid development of semiconductor integrated circuit manufacturing technology, chemical mechanical polishing (CMP) technology is becoming more and more widely used. CMP technology can flatten the wafer surface, avoiding unevenness on the wafer surface and providing a flat interface for subsequent processes, making the polishing equipment used for CMP one of the important devices in semiconductor processing.

[0003] A polishing apparatus includes a polishing table, a polishing pad placed on the table, a polishing head placed above the polishing pad, and a pad conditioner (PC). The polishing head holds the wafer by suction, and the wafer's surface contacts the polishing surface of the polishing pad, moving relative to the polishing pad at a constant pressure and rotational speed to perform polishing. At the same time, a polishing solution is continuously dripped onto the polishing pad, achieving a polishing effect through the dual action of physical, mechanical, and chemical processes. The pad conditioner periodically polishes and conditions the surface of the polishing pad, adjusting its flatness to maintain the polishing performance of the polishing pad and control the morphology of the wafer's surface.

[0004] However, conventional pad conditioners have a low polishing pad conditioning effect and are prone to damaging the polishing pad, for example, causing the polishing pad to wear out and break, and rubbing or damaging the wafer. Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the above problems, embodiments of the present application provide a polishing apparatus and a polishing method that improve the conditioning effect of a pad conditioner on a polishing pad. [Means for solving the problem]

[0006] To achieve the above object, in a first aspect, an embodiment of the present application provides a polishing apparatus, the polishing apparatus comprising: a polishing pad, a movable pad conditioner, a cleaning nozzle, a pressure detection unit disposed at the cleaning nozzle, and a control unit; the pad conditioner is movable over the pressure detection unit and is capable of contacting the pressure detection unit, and the pad conditioner is for conditioning the polishing pad; the pressure detection unit is for measuring pressure data of the pad conditioner; the cleaning nozzle is for cleaning the pad conditioner, The control unit is electrically connected to both the pad conditioner and the pressure detection unit, and sets the operating state of the pad conditioner according to the pressure data, and the control unit is configured to acquire the pressure data of the pad conditioner when the cleaning nozzle cleans the pad conditioner.

[0007] In some possible embodiments, the pressure detection unit further comprises: a hollow base disposed on the cleaning nozzle; and A pressure sensing element is provided at one end of the hollow base remote from the cleaning nozzle for sensing the pressure data.

[0008] In some possible embodiments, the pressure sensitive element further comprises a pressure sensitive ring having the same shape as one end of the hollow base remote from the cleaning nozzle.

[0009] In some possible embodiments, the pressure-sensing ring further comprises a conductive material layer, a spacer layer and a pressure-sensitive material layer arranged in a stack, the spacer layer material comprising a polyester material.

[0010] In some possible embodiments, the pressure sensing element further comprises a plurality of support legs spaced apart and all disposed between the pressure sensing ring and the hollow base.

[0011] In some possible embodiments, the plurality of support legs and the pressure sensing ring are of one piece construction, and the material of the plurality of support legs comprises a flexible material.

[0012] In some possible embodiments, the pad conditioner further comprises a conditioning base and conditioning particles; the surface of the adjustment base has a central region and a peripheral region surrounding the central region, the shape of the peripheral region corresponding to the shape of the pressure-sensing ring; The conditioning particles are disposed in the central region.

[0013] In some possible embodiments, the hollow base further comprises a tubular structure, the cleaning nozzles are multiple, and the tubular structure is disposed outside at least one of the cleaning nozzles.

[0014] In some possible embodiments, the hollow base further comprises an outer edge, the outer edge being arranged on a radial side wall of one end of the tubular structure facing the pad conditioner, and the surface of the outer edge facing the pad conditioner being in the same plane as the surface of the tubular structure facing the pad conditioner.

[0015] In some possible embodiments, the control unit comprises: setting the pad conditioner to an idle state in response to the pressure data being outside the preset pressure range, and setting the pad conditioner to an abrasive state in response to the pressure data being within the preset pressure range; In response to the pad conditioner being in a polishing state, the pad conditioner is configured to condition the polishing pad at least once.

[0016] A polishing apparatus provided by an embodiment of the present application includes a polishing pad, a pad conditioner, a cleaning nozzle, a pressure detection unit, and a control unit. The pad conditioner can move over and contact the pressure detection unit, which measures the pressure data of the pad conditioner. The cleaning nozzle is for cleaning the pad conditioner. The control unit is electrically connected to both the pad conditioner and the pressure detection unit and sets the operating state of the pad conditioner according to the pressure data. Using the pressure detection unit to monitor the pressure of the pad conditioner prevents excessive pad conditioner pressure from damaging the polishing pad or excessive pad conditioner pressure from making it difficult to remove by-products from the polishing pad, ensuring effective adjustment. Compared to manual measurement and calibration, this method ensures measurement accuracy, reduces human interference, reduces labor time, and reduces labor costs.

[0017] In a second aspect, an embodiment of the present application provides a polishing method to be applied to the polishing apparatus described above, the polishing method including steps a and b: In the step (a), a pad conditioner of the polishing apparatus is moved to a pressure detection unit and brought into contact with the pressure detection unit, the pressure detection unit is disposed in a cleaning nozzle of the polishing apparatus, and pressure data of the pad conditioner is acquired when the cleaning nozzle cleans the pad conditioner; In the step (b), an operating state of the pad conditioner is set in accordance with the pressure data and a preset pressure range; Steps a and b are repeated in sequence until the adjustment of the pad conditioner to the polishing pad of the polishing apparatus is complete or the pad conditioner is in an idle state.

[0018] In some possible embodiments, setting the operating state of the pad conditioner in response to the pressure data and a preset pressure range includes setting the pad conditioner to an idle state in response to the pressure data being outside the preset pressure range, and setting the pad conditioner to an abrasive state in response to the pressure data being within the preset pressure range; and In response to the pad conditioner being in a polishing state, the pad conditioner includes conditioning the polishing pad at least once.

[0019] In the polishing method according to an embodiment of the present application, the pad conditioner is moved to a pressure detection unit and controlled to contact the pressure detection unit to obtain pressure data for the pad conditioner, and the operating state of the pad conditioner is controlled according to the pressure data and a preset pressure range. The process of measuring the pressure data for the pad conditioner and controlling the operating state of the pad conditioner is repeated sequentially until the pad conditioner has adjusted the polishing pad or is in an idle state, ensuring that the pressure during adjustment of the pad conditioner is within a normal range, avoiding situations where the pad conditioner pressure is too high and damages the polishing pad, or where the pad conditioner pressure is too low and makes it difficult to remove by-products from the polishing pad, and ensuring the adjustment effect. Furthermore, by using the pressure detection unit to obtain the pressure data for the pad conditioner, a cleaning nozzle can simultaneously clean the pad conditioner, reducing the movement of the pad conditioner and reducing the complexity of operation.

[0020] In a third aspect, embodiments of the present application provide a wafer processing system, the wafer processing system comprising: a polishing pad, a movable pad conditioner, a cleaning nozzle, a pressure detection unit disposed at the cleaning nozzle, and a control unit; the polishing head is for polishing the wafer, the pad conditioner is movable over the pressure detection unit and is capable of contacting the pressure detection unit, and the pad conditioner is for conditioning the polishing pad; the pressure detection unit is for measuring pressure data of the pad conditioner; the cleaning nozzle is for cleaning the pad conditioner, The control unit is electrically connected to both the pad conditioner and the pressure detection unit, and sets the operating state of the pad conditioner according to the pressure data, and the control unit is configured to acquire the pressure data of the pad conditioner when the cleaning nozzle cleans the pad conditioner.

[0021] In some possible embodiments, the pressure detection unit further comprises: a hollow base disposed on the cleaning nozzle; and A pressure sensing element is provided at one end of the hollow base remote from the cleaning nozzle for sensing the pressure data.

[0022] In some possible embodiments, the pressure sensitive element further comprises a pressure sensitive ring having the same shape as one end of the hollow base remote from the cleaning nozzle.

[0023] In some possible embodiments, the pressure-sensing ring further comprises a conductive material layer, a spacer layer and a pressure-sensitive material layer arranged in a stack, the spacer layer material comprising a polyester material.

[0024] In some possible embodiments, the pressure sensing element further comprises a plurality of support legs spaced apart and all disposed between the pressure sensing ring and the hollow base.

[0025] In some possible embodiments, the plurality of support legs and the pressure sensing ring are of one piece construction, and the material of the plurality of support legs comprises a flexible material.

[0026] In some possible embodiments, the pad conditioner further comprises a conditioning base and conditioning particles; the surface of the adjustment base has a central region and a peripheral region surrounding the central region, the shape of the peripheral region corresponding to the shape of the pressure-sensing ring; The conditioning particles are disposed in the central region.

[0027] In some possible embodiments, the control unit comprises: setting the pad conditioner to an idle state in response to the pressure data being outside the preset pressure range, and setting the pad conditioner to an abrasive state in response to the pressure data being within the preset pressure range; In response to the pad conditioner being in a polishing state, the pad conditioner is configured to condition the polishing pad at least once.

[0028] In addition to the technical problems solved by the embodiments of the present application described above, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features related to these technical solutions, other technical problems that can be solved by the polishing apparatus and polishing method provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be described in further detail in specific embodiments. [Brief explanation of the drawings]

[0029] In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly describe the drawings that need to be used in the description of the embodiments or the prior art. Of course, the drawings described below are for some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without any creative efforts. [Figure 1] 1 is a schematic diagram of a portion of the structure of a polishing apparatus according to an embodiment of the present application; [Figure 2] 1 is a cross-sectional view of a portion of the structure of a polishing apparatus according to an embodiment of the present application. [Figure 3] 1 is a schematic diagram of a conditioning base and conditioning particles according to an embodiment of the present application. [Figure 4]1 is a cross-sectional view of one structure of a pressure detection unit according to an embodiment of the present application. [Figure 5] FIG. 5 is a top view of FIG. [Figure 6] FIG. 10 is a cross-sectional view of another structure of the pressure detection unit according to the embodiment of the present application. [Figure 7] FIG. 10 is a cross-sectional view of another structure of the pressure detection unit according to the embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0030] Related technologies suffer from the problem of poor polishing pad conditioning effectiveness using pad conditioners. After extensive investigation, the inventors discovered the following underlying cause: When conditioning a polishing pad, a pad conditioner applies a constant pressure to the polishing pad, and the pressure data is provided by the factory's compressor dry air (CDA). The CDA supplies power gas and purge to the pneumatic equipment in the fabrication (FAB). The pressure data reflects the pressure from the compressed air to the pad conditioner, rather than the actual pressure of the pad conditioner. This makes it difficult to monitor the pad conditioner pressure in real time, resulting in poor conditioning effectiveness of the pad conditioner. Therefore, deviations in the pad conditioner pressure can cause abnormalities in the polishing pad, such as wear and tear, leading to abnormal wafer contours, damage, or scratches. In the worst case, the wafer may need to be discarded. Furthermore, pad conditioners require manual pressure measurement and calibration, which is time-consuming.

[0031] Therefore, an embodiment of the present application provides a polishing apparatus including a polishing pad, a pad conditioner, a cleaning nozzle, a pressure detection unit, and a control unit. The pad conditioner is movable to and contacts the pressure detection unit. The pressure detection unit measures pressure data of the pad conditioner. The cleaning nozzle is for cleaning the pad conditioner, and the control unit controls the operating state of the pad conditioner according to the pressure data. By using the pressure detection unit to monitor the pad conditioner, it is possible to avoid the pad conditioner's pressure being too high, which could damage the polishing pad, or the pad conditioner's pressure being too low, which could make it difficult to remove by-products on the polishing pad, thereby ensuring a regulating effect.

[0032] In order to make the above-mentioned objectives, features and advantages of the embodiments of the present application clearer, the technical solutions thereof will be clearly and completely described below with reference to the drawings relating to the embodiments of the present application, and it should be understood that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments thereof, and all other embodiments obtained by those skilled in the art without creative work based on the embodiments in the present application fall within the protection scope of the present application.

[0033] See Figures 1 to 7. An embodiment of the present application provides a polishing apparatus including a polishing pad, a pad conditioner, a cleaning nozzle 23, a pressure detection unit 30, and a control unit. The polishing pad polishes a wafer or the like, and the pad conditioner is movable, e.g., the pad conditioner moves to the polishing pad to polish and condition the polishing pad. The pressure detection unit 30 measures the pressure of the pad conditioner, and the cleaning nozzle 23 cleans the pad conditioner to remove by-products adhering to the pad conditioner. The control unit is electrically connected to the pad conditioner and the pressure detection unit 30 and controls the operating state of the pad conditioner in response to the pressure data.

[0034] In some further embodiments, the polishing pad is placed on a polishing disc, and the polishing pad is supported and fixed by the polishing disc. The polishing pad is configured so that its polishing surface faces the surface of the wafer. The polishing pad may be a circular pad, and the polishing surface of the polishing pad has a plurality of protrusions for friction with the wafer when the polishing pad rotates, and the protrusions may be made of polyurethane fiber or the like.

[0035] The pad conditioner polishes the polishing surface of the polishing pad to remove by-products (e.g., polishing products, polishing liquid crystals, etc.), activates the polishing surface of the polishing pad, and ensures a stable polishing rate. The pad conditioner includes a conditioning base 13 and conditioning particles 16 arranged on the surface of the conditioning base 13, and the conditioning base 13 and the conditioning particles 16 form a conditioning disk.

[0036] See Fig. 3. The conditioning particles 16 may be diamond particles, and the diamond particles are arranged on the surface (e.g., the lower surface) of the conditioning base 13 that faces the polishing pad, i.e., the diamond particles are arranged on one end of the conditioning base 13 that is closer to the polishing pad, and the rotation and reciprocating motion of the pad conditioner causes the conditioning disk to rub against the polishing pad, thereby conditioning the polishing surface of the polishing pad.

[0037] The surface of the conditioning base 13 has a central region 15 and a peripheral region 14 that encompasses the central region 15. The peripheral region 14 is the edge of the conditioning base 13, as shown by the black ring in Figure 3. Here, the surface of the conditioning base 13 refers to the surface of the conditioning base 13 that faces the polishing pad. Conditioning particles 16, shown as black dots in Figure 3, are arranged in the central region 15, while no conditioning particles 16 are arranged in the peripheral region 14. When detecting pressure data of the polishing conditioner, the peripheral region 14 comes into contact with the pressure detection unit 30.

[0038] For some possible embodiments, see Figures 1 and 2. The pad conditioner further includes a base 11 disposed near the abrasive disc, and an adjusting arm 12 rotatably connected at one end to the base 11 and at the other end to an adjusting base 13. The adjusting arm 12 swings back and forth around the base 11 within a preset angular range, thereby swinging the pad conditioner back and forth within the preset angular range. A drive unit can be disposed within the base 11, electrically connected to both the adjusting arm 12 and the control unit, to control the pressure of the adjusting arm 12 and the rotational speed of the adjusting base 13.

[0039] The pad conditioner has various operating states, including a polishing state and an idle state. When the pad conditioner is in the polishing state, the pad conditioner conditions the polishing pad at least once. When the pad conditioner is in the idle state, it is stationary and shuts down, and does not condition the polishing pad. At this time, the pad conditioner can still contact the polishing pad, or the pad conditioner can be spaced a certain distance from the polishing pad.

[0040] The operating state of the pad conditioner may further include a cleaning state, and when the pad conditioner is in the cleaning state, the pad conditioner performs cleaning, cleaning polishing products, polishing liquid crystals, etc. that have adhered to the pad conditioner.

[0041] Please continue to refer to FIG. 3. The pressure detection unit 30 measures the pressure data of the pad conditioner and prevents the pad conditioner from applying too much or too little pressure. If the pad conditioner applies too much pressure, the pad conditioner may damage the polishing pad when conditioning it, or in the worst case, cause wear and tear on the polishing pad. If the pad conditioner applies too little pressure, the pad conditioner may not be able to remove by-products from the polishing pad when conditioning it, resulting in poor conditioning effectiveness.

[0042] 4 and 5 for some possible embodiments. The pressure detection unit 30 includes a hollow base 31 and a pressure sensing element 35 disposed on the hollow base 31. The hollow base 31 is disposed on the cleaning nozzle 23, and the cleaning nozzle 23 can clean the pad conditioner through the hollow base 31. The pressure sensing element 35 is disposed on the hollow base 31 and is for sensing pressure data. When the pressure detection unit 30 measures the pressure data of the pad conditioner, the pressure sensing element 35 is abutted against the peripheral region 14 of the adjustment base 13.

[0043] 4 and 5, a pressure sensing element 35 is disposed at one end of the hollow base 31 remote from the cleaning nozzle 23, whereby the hollow base 31 supports the pressure sensing element 35, and the hollow base 31 and the pressure sensing element 35 are detachably connected, for example, by engagement or adhesion. The pressure sensing element 35 is disposed facing the pad conditioner, and is closer to the pad conditioner, making it easier to measure the pressure of the pad conditioner.

[0044] When pressure detection unit 30 measures pressure data of the pad conditioner, pressure sensing element 35 is abutted against the edge of conditioning base 13, for example, contacting edge region 14 of conditioning base 13. When positioned in this manner, pressure sensing element 35 does not come into contact with conditioning particles 16, thereby preventing conditioning particles 16 from being damaged or falling off due to friction.

[0045] In some possible embodiments, the pressure sensing element 35 comprises a pressure sensing ring 38 having the same shape as one end of the hollow base 31 remote from the cleaning nozzle 23. When the pressure detection unit 30 measures pressure data of the pad conditioner, the pressure sensing ring 38 is abutted against the peripheral region 14 of the conditioning base 13, and the conditioning particles 16 are located within the region surrounded by the pressure sensing ring 38.

[0046] 4 and 5, the pressure sensing ring 38 may be formed as an annular ring, such as a circular ring or an elliptical ring, and may have the same shape as the peripheral region 14 of the adjusting base 13 so that the pressure data of the pad conditioner can be easily measured by abutting against the peripheral region 14 of the adjusting base 13. Here, the peripheral region 14 may be larger than the pressure sensing ring 38 so that the central region 15 does not come into contact with the pressure sensing ring 38 during operation and affect the cleaning effect.

[0047] The pressure sensing ring 38 surrounds the first accommodating space 36 so that the adjusting particles 16 are accommodated and a certain distance is maintained between the adjusting particles 16 and the hollow base 31. This configuration avoids contact between the pressure sensing ring 38 and the adjusting particles 16, as well as between the hollow base 31 and the adjusting particles 16, thereby reducing damage to the adjusting particles 16.

[0048] Here, the pressure sensing ring 38 converts the pressure signal into an electrical signal for easy transmission. In some possible embodiments, the pressure sensing ring 38 comprises a conductive material layer, a spacer layer, and a pressure-sensitive material layer arranged in a laminated configuration, and the material of the spacer layer includes a polyester material to make the pressure sensing ring 38 flexible and avoid damaging the adjusting base 13. There is a gap in the spacer layer, and when the pressure sensing ring 38 is subjected to pressure, the conductive material layer and the pressure-sensitive material layer bond and become conductive, causing the resistance of the pressure sensing ring 38 to change. The pressure data of the polishing pad can be obtained according to the change in resistance of the pressure sensing ring 38.

[0049] To further avoid contact between the hollow base 31 and the conditioning particles 16, in some possible embodiments, see Fig. 6 , the pressure sensing element 35 further comprises a plurality of support legs 37 spaced apart and all disposed between the pressure sensing ring 38 and the hollow base 31. By disposing the plurality of support legs 37 between the pressure sensing ring 38 and the hollow base 31, the distance between the pressure sensing ring 38 and the hollow base 31 is increased, and as a result, the distance between the conditioning particles 16 and the hollow base 31 is increased, and contact between the hollow base 31 and the conditioning particles 16 is avoided.

[0050] Here, the multiple support legs 37 can be arranged at intervals along the circumferential direction of the pressure sensing ring 38. For example, the multiple support legs 37 can be arranged at equal intervals along the circumferential direction of the pressure sensing ring 38 so as to improve the uniformity of support of the multiple support legs 37. In some possible embodiments, the multiple support legs 37 can be connected to the hollow base 31 by screws and connected to the pressure sensing ring 38 by engagement, adhesive, or the like. In other possible embodiments, the multiple support legs 37 are integral with the pressure sensing ring 38, and the material of the multiple support legs 37 can be a flexible material.

[0051] 5 to 7, the hollow base 31 includes a tubular structure 33, which is formed to be enclosed as the second receiving space 32. This reduces the space occupied by the hollow base 31, facilitates the placement and assembly of the hollow base 31, avoids other structures, and improves the flexibility of installation of the hollow base 31. At the same time, the discharge of liquid from the cleaning nozzle 23 is not blocked, ensuring the cleaning ability of the cleaning nozzle 23 and the cleaning effect. Furthermore, the hollow base can prevent the cleaning liquid from splashing and causing contamination.

[0052] Based on the above-described embodiment, please refer to Fig. 7. To facilitate arranging the pressure sensing ring 38 on the hollow base 31, in some possible embodiments, the hollow base 31 further comprises an outer edge 34, which is arranged on a radial side wall of one end of the tubular structure 33 facing the pressure detection unit 30, and the surface of the outer edge 34 facing the pad conditioner is in the same plane as the surface of the tubular structure 33 facing the pad conditioner.

[0053] 7, the surface of outer edge 34 facing the pad conditioner becomes the upper surface of outer edge 34, and the surface of tubular structure 33 facing the pad conditioner becomes the upper surface of tubular structure 33, and these two upper surfaces are formed on the same plane to form the upper surface of hollow base 31, increasing the total area of ​​the upper surface of hollow base 31, facilitating support of pressure sensing element 35 and increasing the size of pressure sensing element 35, thereby enlarging first accommodating space 36 for pressure sensing element 35. The thickness of outer edge 34 is smaller than the thickness of tubular structure 33, and outer edge 34 and tubular structure 33 can be formed as an integral structure.

[0054] 1 and 2, the pressure detection unit 30 is configured with a hollow base 31, which is disposed outside the cleaning nozzle 23. This allows the hollow base 31 to be integrated with the outside of the cleaning nozzle 23, which is convenient for implementing embedded measurement, ensures timely measurement, and can track changes in the pressure of the pad conditioner over a long period of time. Meanwhile, because the hollow base 31 is disposed on the cleaning nozzle 23, the discharge of liquid from the cleaning nozzle 23 is not blocked, ensuring the cleaning ability of the cleaning nozzle 23 and ensuring the cleaning effect. Furthermore, the hollow base can prevent cleaning liquid from splashing and causing contamination.

[0055] To improve cleaning efficiency, in some possible embodiments, there are multiple cleaning nozzles 23, and the tubular structure 33 is arranged outside at least one of the cleaning nozzles 23. When arranged in this manner, the tubular structure 33 can be freely arranged according to the number, size, and spacing of the cleaning nozzles 23 and the size of the tubular structure 33, to avoid interference between the tubular structure 33 and the cleaning nozzle 23, and to ensure that the cleaning liquid sprayed from the cleaning nozzle 23 can reliably clean the pad conditioner.

[0056] The polishing apparatus further includes a cleaning base 21 and a conduit 22 disposed within the cleaning base 21, and a cleaning nozzle 23 disposed on the cleaning base 21 and communicating with the conduit 22. A cleaning liquid (e.g., water) enters the cleaning nozzle 23 via the conduit 22 and is sprayed onto the pad conditioner via the cleaning nozzle 23 to clean the pad conditioner. Illustratively, the cleaning liquid cleans the conditioning arm 12 and the conditioning disk of the pad conditioner.

[0057] In some possible embodiments, the control unit is electrically connected to both the pad conditioner and the pressure detection unit 30 and controls the operating state of the pad conditioner according to the pressure data. If the pressure data exceeds a preset pressure range, the control unit controls the pad conditioner to be in an idle state, and if the pressure data is within the preset pressure range, the control unit controls the pad conditioner to be in a polishing state, and the pad conditioner performs at least one conditioning of the polishing pad.

[0058] In some further embodiments, the preset pressure range may be a standard pressure value ±0.3 pounds-force (lbf), and if the absolute value of the difference between the pressure data and the standard pressure value is greater than 0.31 lbf, the control unit controls the pad conditioner to be in an idle state to avoid a decrease in the adjustment effect. Illustratively, if the pressure data exceeds the preset pressure range, the control unit controls the polishing apparatus to shut down and issues an alarm. Here, the preset pressure range is set in a user event of the polishing apparatus, the alarm is set to P1(2,3,4,...) Downforce Out Of Tolerance, PLS Check Tool, and the alarm action is set to shutdown.

[0059] If the pressure data is within a preset pressure range, for example, if the absolute value of the difference between the pressure data and the standard pressure value is 0.31 bf or less, the control unit controls the pad conditioner to be in a polishing state, and the pad conditioner performs at least one conditioning of the polishing pad. In some embodiments, the execution sequence of the polishing apparatus can be set so that the pressure detection unit 30 measures the pressure data once before the pad conditioner performs each conditioning process.

[0060] In some possible embodiments, the control unit includes an I / O signal board, and the pressure detection unit 30 is connected to the I / O signal board through a signal line, so that the pressure data measured by the pressure detection unit 30 is fed back in real time through the I / O signal board, and a real-time alarm can be issued after a user event is added. At the same time, the pressure data measured by the pressure detection unit 30 can be added to fault detection and classification (FDC) by using the I / O signal board for monitoring detection, ensuring the effectiveness of the measurement and enhancing the parameter management of the polishing machine.

[0061] As described above, the polishing apparatus according to the present embodiment includes a polishing pad, a pad conditioner, a cleaning nozzle 23, a pressure detection unit 30, and a control unit. The pad conditioner can move over the pressure detection unit 30 and make contact with it. The pressure detection unit 30 measures the pressure data of the pad conditioner. The cleaning nozzle 23 cleans the pad conditioner. The control unit is electrically connected to both the pad conditioner and the pressure detection unit 30 and controls the operation of the pad conditioner according to the pressure data. The pressure detection unit 30 is used to monitor the pressure data of the pad conditioner, preventing excessive pad conditioner pressure from damaging the polishing pad or excessive pad conditioner pressure from making it difficult to remove by-products from the polishing pad, thereby ensuring effective adjustment. Compared to manual measurement and calibration, this method ensures measurement accuracy, reduces human interference, reduces labor time, and reduces labor costs.

[0062] The present embodiment further provides a polishing method applicable to the above-mentioned polishing apparatus, and the polishing apparatus can be described in detail in the above description and in FIGS. 1 to 7, so that the description will not be repeated here. The polishing method includes the following steps: In step a, the pad conditioner of the polishing apparatus is moved over the pressure detection unit 30 to contact the pressure detection unit 30, and pressure data of the pad conditioner is acquired. The pressure detection unit 30 is disposed on the cleaning nozzle of the polishing apparatus, and the cleaning nozzle can simultaneously clean the pad conditioner. In step b, the operating state of the pad conditioner is controlled according to the pressure data and the preset pressure range; Steps a and b are repeated sequentially until the conditioning of the pad conditioner on the polishing pad is complete or the pad conditioner is in an idle state.

[0063] Here, before adjusting the pad conditioner relative to the polishing pad, the pressure data of the pad conditioner is first detected and acquired using pressure detection unit 30. In some possible embodiments, the control unit controls the pad conditioner to move over pressure detection unit 30 and come into contact with pressure detection unit 30, and acquires the pressure data.

[0064] The operating state of the pad conditioner includes a polishing state, an idle state, etc. When the pad conditioner is in the polishing state, the pad conditioner conditions the polishing pad at least once. When the pad conditioner is in the idle state, it is stationary and shuts down and does not condition the polishing pad. At this time, the pad conditioner can still contact the polishing pad or can be spaced a certain distance away from the polishing pad.

[0065] The operating state of the pad conditioner may further include a cleaning state. When the pad conditioner is in the cleaning state, the pad conditioner is cleaned to remove polishing products, polishing liquid crystals, and the like adhering to the pad conditioner.

[0066] The preset pressure range can be set or changed. For example, the preset pressure range is a standard pressure value ±0.3 lbf. If the pressure data is within the preset pressure range, the pressure data is equal to or greater than the standard pressure value -0.31 lbf and equal to or less than the standard pressure value +0.31 lbf. If the pressure data is outside the preset pressure range, the pressure data is less than the standard pressure value -0.31 lbf or greater than the standard pressure value +0.31 lbf.

[0067] In some possible embodiments, the control unit controls the operating state of the pad conditioner according to the pressure data and the preset pressure range. If the pressure data exceeds the preset pressure range, the control unit controls the pad conditioner to be in an idle state, and if the pressure data is within the preset pressure range, the control unit controls the pad conditioner to be in a polishing state. If the pad conditioner is in the polishing state, the pad conditioner performs at least one conditioning of the polishing pad.

[0068] By sequentially repeating the process of measuring the pressure data of the pad conditioner and controlling the operating state of the pad conditioner, pressure data before at least one adjustment of the pad conditioner can be obtained, and the adjustment effect can be maintained well.

[0069] The conditioning of the pad conditioner can include multiple conditionings, for example, the pad conditioner performs a reciprocating motion on the polishing pad, and one of the reciprocating motions can be defined as one conditioning. Completion of the conditioning of the pad conditioner on the polishing pad means that all of the conditioning of the pad conditioner on the polishing pad has been completed and the polishing surface of the polishing pad meets the preset requirements.

[0070] When the pad conditioner adjustment to the polishing pad is complete, there is no need to adjust the polishing pad. When the pad conditioner is idle, the pad conditioner pressure needs to be calibrated. In these two cases, the polishing method ends. After the pad conditioner pressure is calibrated, the polishing pad can be continued using the polishing method.

[0071] As described above, in the polishing method according to the present embodiment, the pad conditioner is moved over the pressure detection unit 30 and controlled to contact the pressure detection unit 30, pressure data of the pad conditioner is acquired, and the operating state of the pad conditioner is controlled according to the pressure data and a preset pressure range. The process of measuring the pad conditioner pressure data and controlling the pad conditioner operating state is repeated until the pad conditioner has fully adjusted the polishing pad or is in an idle state. This ensures that the pressure of the pad conditioner during adjustment is within a normal range, avoiding excessive pressure that could damage the polishing pad or excessive pressure that could make it difficult to remove by-products from the polishing pad, and ensuring the adjustment effect. Furthermore, the pressure detection unit 30 is used to acquire the pad conditioner pressure data, and the cleaning nozzle 23 can simultaneously clean the pad conditioner, reducing the movement of the pad conditioner and simplifying operation.

[0072] An embodiment of the present application provides a wafer processing system comprising: a polishing pad; a movable pad conditioner; a cleaning nozzle; a pressure detection unit disposed on the cleaning nozzle; and a control unit; the polishing head is for polishing the wafer; the pad conditioner is capable of moving over the pressure detection unit and contacting the pressure detection unit, and the pad conditioner is for conditioning the polishing pad; the pressure detection unit is for measuring pressure data of the pad conditioner; the cleaning nozzle is for cleaning the pad conditioner; the control unit is electrically connected to both the pad conditioner and the pressure detection unit and sets an operating state of the pad conditioner according to the pressure data; and the control unit is configured to acquire the pressure data of the pad conditioner when the cleaning nozzle cleans the pad conditioner. The specific arrangement of the polishing pad, pad conditioner, cleaning nozzle, pressure detection unit, and control unit in the wafer processing system has been described in detail in the above embodiment of the present application, so a description thereof will be omitted here.

[0073] Each example or embodiment in this specification is described in order, with each embodiment being described with an emphasis on the differences from other embodiments, and the same and similar parts of each embodiment may be cross-referenced.

[0074] In the description herein, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of the present application. Exemplary references to such terms in the present specification do not necessarily refer to the same embodiment or example. Furthermore, particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0075] Finally, it should be understood that the above embodiments are merely for illustrating the technical solutions of the present application, and are not intended to limit the same; the present application is described in detail with reference to the above embodiments, but those skilled in the art may still modify the technical solutions described in the above embodiments or make equivalent substitutions for some or all of the technical features thereof, and such modifications or substitutions shall not deviate from the essence of the corresponding technical solutions and the scope of the technical solutions of the embodiments of the present application. [Explanation of symbols]

[0076] 11. Bass 12. Adjustable arm 13. Adjustment base 14. Peripheral region 15, central area 16, adjustment particles 21. Cleaning base 22, conduit 23. Cleaning nozzle 30. Pressure detection unit 31. Hollow base 32. Second storage space 33, tubular structure 34. Outer edge 35. Pressure sensing element 36. First storage space 37, support leg 38. Pressure-sensing ring

Claims

1. A polishing apparatus comprising: a polishing pad; a movable pad conditioner; a cleaning nozzle; a pressure detection unit disposed in the cleaning nozzle; and a control unit; the pad conditioner is movable over the pressure detection unit and is capable of contacting the pressure detection unit, and the pad conditioner is for conditioning the polishing pad; the pressure detection unit is for measuring pressure data of the pad conditioner; the cleaning nozzle is for cleaning the pad conditioner, the control unit is electrically connected to both the pad conditioner and the pressure detection unit, and sets an operating state of the pad conditioner in response to the pressure data; The polishing apparatus, wherein the control unit is configured to acquire the pressure data of the pad conditioner when the cleaning nozzle cleans the pad conditioner.

2. Furthermore, the control unit setting the pad conditioner to an idle state in response to the pressure data being outside a preset pressure range, and setting the pad conditioner to an abrasive state in response to the pressure data being within the preset pressure range; 2. The polishing apparatus of claim 1, wherein the pad conditioner is configured to condition the polishing pad at least once in response to the pad conditioner being in a polishing state.

3. Furthermore, the pressure detection unit a hollow base disposed on the cleaning nozzle; and 2. The polishing apparatus according to claim 1, further comprising a pressure sensing element for sensing said pressure data, said pressure sensing element being disposed at one end of said hollow base remote from said cleaning nozzle.

4. 4. A polishing apparatus according to claim 3, wherein said pressure sensing element further comprises a pressure sensing ring having the same shape as one end of said hollow base remote from said cleaning nozzle.

5. 5. The polishing apparatus of claim 4, wherein the pressure-sensing ring further comprises a conductive material layer, a spacer layer, and a pressure-sensitive material layer arranged in a laminated state, the spacer layer being made of polyester material.

6. 5. The polishing apparatus of claim 4, wherein the pressure sensing element further comprises a plurality of support legs spaced apart and all disposed between the pressure sensing ring and the hollow base.

7. 7. The polishing apparatus according to claim 6, wherein the support legs and the pressure sensing ring are integrally formed, and the support legs are made of a flexible material.

8. The pad conditioner further comprises a conditioning base and conditioning particles; the surface of the adjustment base has a central region and a peripheral region surrounding the central region, the shape of the peripheral region corresponding to the shape of the pressure sensing ring; 8. The polishing apparatus according to claim 4, wherein the adjusting particles are arranged in the central region.

9. A polishing method comprising steps a and b, In the step (a), a pad conditioner of a polishing apparatus is moved to a pressure detection unit and brought into contact with the pressure detection unit, the pressure detection unit is disposed on a cleaning nozzle of the polishing apparatus, and pressure data of the pad conditioner is acquired when the cleaning nozzle cleans the pad conditioner; In the step (b), an operating state of the pad conditioner is set in accordance with the pressure data and a preset pressure range; A polishing method comprising sequentially repeating steps a and b until adjustment of the pad conditioner to the polishing pad of the polishing apparatus is completed or the pad conditioner is in an idle state.

10. The step of setting an operating state of the pad conditioner in accordance with the pressure data and a preset pressure range includes: setting the pad conditioner to an idle state in response to the pressure data being outside the preset pressure range, and setting the pad conditioner to an abrasive state in response to the pressure data being within the preset pressure range; and 10. The polishing method of claim 9, further comprising the step of: the pad conditioner conditioning the polishing pad at least once in response to the pad conditioner being in a polishing state.

Images