Headphone

Abstract

To provide a headphone that realizes a thin and lightweight.SOLUTION: A headphone includes: a headband; and two headphone units 10 respectively connected to both ends of the headband. Each of the two headphone units 10 includes: a headphone housing 20; a speaker housing 32; an ear pad 42; and a battery 50. At least one of the two headphone units 10 further includes a circuit board 60. An ear pad 42 is connected to the headphone housing 20. A surface of a speaker housing 32 and an inner wall surface of the headphone housing 20 are combined to surround the mounting cavity. A first attachment surface 3211 and a second attachment surface 3212 are formed on the surface of the speaker housing 32. The first attachment surface 3211 is connected to a battery 50, and the second attachment surface 3212 is connected to a circuit board 60.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to CN202420573274.9, filed March 22, 2024, which is incorporated by reference in its entirety.

[0002] The present application relates to the technical field of earphones, and more particularly to headphones. [Background technology]

[0003] In related technology, headphones are ,single One battery is installed in one headphone unit, and to ensure that the headphones have a relatively long operating range, the battery generally has a large volume in order to obtain sufficient battery capacity. As a result, a large battery takes up a lot of internal space in the headphone unit, and the battery and other electronic components inside the headphone unit must be laid out in a stacked form within the headphone unit housing. This configuration makes the overall structure of the headphone unit thick, which is disadvantageous when wearing and using the headphones. Summary of the Invention

[0004] The present application describes improved headphones that can be thin and lightweight. The present application provides headphones. The headphones include a headband and two headphone units connected to opposite ends of the headband. Each of the two headphone units includes a headphone housing, a speaker housing, ear pads, and a battery. At least one of the two headphone units further includes a circuit board. The ear pads are connected to the headphone housing of one of the two headphone units. A surface of the speaker housing of one of the two headphone units and an inner wall surface of the headphone housing combine to enclose a mounting cavity. A first mounting surface and a second mounting surface are formed on the surface of the speaker housing. The first mounting surface is connected to the battery of one of the two headphone units. The second mounting surface is connected to the circuit board. The first mounting surface and the second mounting surface are arranged in a direction perpendicular to the thickness direction of the headphone unit, and at least one of the first mounting surface and the second mounting surface is arranged so that the distance between the first mounting surface and the ear pad assembly decreases in a direction away from the other mounting surface.

[0005] In the headphones according to the embodiment of the present application, the headphone unit is provided with a headphone housing to protect various components therein and to prevent impurities such as dust and water stains from entering the inside of the headphone unit and causing damage to the components. Do and The opposite surface and the inner wall of the headphone housing combine to enclose a mounting cavity that accommodates components such as a battery, circuit board, etc. Do isThe headphone unit is connected to the headphone housing, comes into contact with the wearer's ear, and is covered on the outside of the user's ear, thereby reducing the pressure of the headphone unit on the wearer's auricle and improving comfort when the wearer wears the headphones.

[0006] In the present application, a battery is further provided in each of the two headphone units, and as can be understood, when the same driving range as that of conventional headphone designs is satisfied, the provision of two batteries inevitably reduces the volume and weight of each battery. Furthermore, the present application further provides that a first mounting surface and a second mounting surface are formed on the surface of the speaker housing, the first mounting surface and the second mounting surface are arranged in a direction perpendicular to the thickness direction of the headphone unit, and at least one of the first mounting surface and the second mounting surface is arranged so that the distance between them and the ear pad assembly is reduced in a direction away from the other, thereby providing a gradient on the rear surface of the speaker housing in the thickness direction of the headphone unit. As can be seen from the above, in the structural layout form of the present application, the battery is mounted offset and is arranged in parallel with the circuit board in the radial direction of the headphone unit, compared to the conventional design in which the battery and circuit board are simply stacked in the thickness direction of the headphone unit. Therefore, by making full use of the space within the mounting cavity, the thickness and overall volume of the headphone unit can be reduced, making the headphones lighter and thinner, and avoiding the product from becoming bulky, which is advantageous for wearing and using.

[0007] Book prayer In order to more clearly explain the technical means in the prior art, the following is Original Vow The drawings necessary for the description of the present invention will be briefly described. Examples Those skilled in the art can derive other drawings based on the structures shown in these drawings without any creative effort. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram of a headphone unit according to an example of headphones of the present application. [Figure 2] 2 is an exploded view of a headphone unit in the headphones shown in FIG. 1. FIG. [Figure 3] FIG. 3 is a cross-sectional view of the headphone unit shown in FIG. [Figure 4] 3 is another cross-sectional view of the headphone unit shown in FIG. 2. [Figure 5] 3 is an exploded view of a speaker assembly of the headphone unit shown in FIG. 2. [Figure 6] 3 is a schematic diagram illustrating the configuration of an ear pad assembly of the headphone unit shown in FIG. 2. DETAILED DESCRIPTION OF THE INVENTION

[0009] The realization of the objectives, functional features and advantages of the present application will be described with reference to the drawings. For example, This will be further explained in combination with

[0010] In order to make the purpose, technical means and advantages of the present application clearer, the present application will be described below with reference to the drawings. Shape The state will be explained in more detail.

[0011] In the following description, when referring to the drawings, unless otherwise stated, the same numbers in different drawings refer to the same or similar elements. Examples The embodiments described herein are not intended to represent all embodiments consistent with the present application, but rather are merely examples of apparatus and methods consistent with certain aspects of the present application, as set forth in the appended claims.

[0012] It should be understood that in the description of this application, terms such as "first," "second," etc. are for descriptive purposes only and should not be understood as indicating or suggesting relative importance. Those skilled in the art can understand the specific meaning of the above terms in the description of this application according to the specific circumstances. In addition, in the description of this application, unless otherwise specified, "plurality" means two or more. "And / or" describes a relationship between related objects and indicates that three types of relationships can exist, for example, A and / or B indicates three cases: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally indicates that the related objects before and after it are in an "or" relationship.

[0013] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Examples The term "and / or" as used herein includes any and all combinations of one or more of the associated items.

[0014] Nowadays, earphones, as a commonly used electronic product, play an important role in people's lives. When distinguished by their sound-generating mechanism, earphones include air conduction earphones, bone conduction earphones, etc. When distinguished by wearing method, earphones include headphones, ear-hook earphones, etc. Headphones consist of a headband and two headphone units. (e.g. ear cups) When worn, the headband provides a certain clamping force to cover the two headphone units around the user's ears, providing high sound insulation during use, keeping the user warm even in winter, and having a very stylish design, making them popular with many users.

[0015] The traditional design of headphones involves placing one battery in one of the two headphone units. (e.g., installed)The two headphone units may be powered by the single battery and electrically connected by wiring in the headband. In order to ensure a long driving range, the battery generally has a large volume and a large capacity, so that the single battery occupies a large amount of internal space of the headphone unit, which results in the placement of other components inside the headphone unit being low, and other electronic components such as circuit boards always being placed in a stacked form with the battery, which increases the thickness of the headphone unit and makes it inconvenient to wear or carry.

[0016] In order to solve the above problems, as shown in FIGS. 1 to 3, the present application provides headphones 1, An example So, the headphones 1 are headbands. Do and The headphone unit 10 includes two headphone units 10 connected to both ends of the headband, respectively. During the wearing process, the headband crosses the user's head and provides a certain elastic clamping force to hold one headphone unit 10 to the user. ears For ease of explanation, the side of the headphone unit 10 that faces the user's ears will be referred to as the front side or front, and the side opposite the ears will be referred to as the rear side or rear.

[0017] The headband has a curved, arc-shaped structure that allows it to adapt to the contours of the user's head. profitThe headband may be designed to be stretchable and adjustable, and may include a frame and a cover that covers the frame. The frame may be made of plastic or metal, and the cover may be made of a flexible material such as leather or fabric, so that when the cover comes into contact with the user, the user's physical sensation becomes more comfortable. The frame may have a plurality of connecting units, and two connecting units may be connected in a sliding manner. In this way, the length of the headband can be adjusted by sliding between the two connecting units, to accommodate users with different head circumferences and improve convenience and comfort in use. Headphone units 10 are connected to both ends of the headband in the length direction, and each headphone unit 10 includes a headphone housing 20, a speaker assembly 30, an ear pad assembly 40, and a battery 50. can be seen .

[0018] The headphone housing 20 is connected to a headband and includes an ear pad assembly 40. (e.g. ear cushions) are connected to a headphone housing 20 that covers the outside of a user's ear. A speaker assembly 30 is located within the headphone housing 20 and is provided within the headphone housing 20 and includes a speaker body 31 and a speaker housing 32, the speaker housing 32 being connected to the headphone housing 20, and the speaker body 31 being connected to the speaker housing 32. for example, The surface of the speaker housing 32 opposite the ear pad assembly 40 and the inner wall surface of the headphone housing 20 are combined to enclose a mounting cavity 20a.

[0019] The headphone housing 20 includes a housing 21 and a headphone back cover 22 connected to the rear side of the housing 21. The headphone back cover 22 is connected to the housing 21 by adhesive, screws, or other methods. The speaker assembly 30 is disposed within the housing 21, such that the inner wall surfaces of the housing 21 and the headphone back cover 22 and the surface of the speaker housing 32 opposite the ear pad assembly 40 combine to enclose the mounting cavity 20a. As can be seen, the above structural form of the headphone housing 20 isolates the components inside the headphone unit 10 from the external environment, achieving dustproof and waterproof effects. Furthermore, when the headphone housing 20 includes the housing 21 and the headphone back cover 22, the headphone unit 10 has the advantage of being easy to attach, detach, and maintain. Also, or alternatively The housing 21 and the headphone back cover 22 of the headphone housing 20 may be integrally formed.

[0020] The headphone housing 20 may be made of a metal material (e.g., a metal such as aluminum), which can improve the overall rigidity of the headphone housing 20 and improve the impact resistance of the headphone housing 20. The metal material can also provide better protection for the internal components of the headphone housing 20. As can be understood, the headphone housing 20 may be made of other materials (e.g., plastic), which are easy to mold and have low costs. Furthermore, the housing 21 and the headphone back cover 22 of the headphone housing 20 may be made of the same material, for example, either a metal material or a plastic material, or both may be made of different materials, for example, the housing 21 is made of a metal material and the headphone back cover 22 is made of a plastic material.

[0021] 2, the speaker assembly 30 includes a speaker body 31 and a speaker housing 32. The speaker housing 32 is connected to the headphone housing 20. The speaker body 31 is connected to the speaker housing 32. The speaker housing 32 may be made of a high-strength material such as polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), or ABS resin to ensure its supporting strength. A first mounting surface 3211 and a second mounting surface 3212 are formed on the surface of the speaker housing 32. The first mounting surface 3211 and the second mounting surface 3212 are arranged in a direction perpendicular to the thickness direction of the headphone unit 10, and at least one of the first mounting surface 3211 and the second mounting surface 3212 is arranged so that the distance between them and the ear pad assembly 40 decreases in a direction away from the other.

[0022] As shown in FIG. 2, the first attachment surface 3211 is provided so that the distance between the first attachment surface 3211 and the ear pad assembly 40 decreases in a direction away from the second attachment surface 3212. No. The first mounting surface 3211 extends obliquely from the edge of the second mounting surface 3212 toward the ear pad assembly 40. Do. When the headphone unit 10 is considered to be substantially in the shape of a circular cake, the first mounting surface 3211 and the second mounting surface 3212 are arranged in the radial direction of the entire headphone unit 10, and as can be understood, the first mounting surface 3211 and the second mounting surface 3212 may be spaced apart in the radial direction of the headphone unit 10, or the second mounting surface 3212 may be provided such that the distance between it and the ear pad assembly 40 decreases in a direction away from the first mounting surface 3211. Naturally, when the first mounting surface 3211 extends at an angle from the edge of the second mounting surface 3212 towards the ear pad assembly 40, the headphone unit 10 has a more compact structure and a smaller volume.

[0023] Furthermore, in the present application, one battery 50 is provided for each headphone unit 10. As can be understood, the capacity of the two batteries 50 is the same as that of the conventional With technologyThe capacity of one battery may be equivalent to 。1 One battery to two batteries 50 Replace Original range (e.g. battery life) Maintain 1 In contrast to the single battery design, the two battery 50 design of the present application results in a correspondingly smaller volume for each battery 50. In an ideal situation, each battery 50 of the present application would be approximately the same volume as the conventional battery. technology This is half the volume of the battery in this design.

[0024] figure 2, at least one headphone unit 10 further includes a circuit board 60. The circuit board 60 is electrically connected to the battery 50, and the circuit board 60 is connected to the second mounting surface 3212, and the battery 50 and the circuit board 60 are both provided in the mounting cavity 20a. There may be one or two circuit boards 60. When there is one circuit board 60, the circuit board 60 is a main control board. In this case, the circuit board 60 is provided in one of the headphone units 10 and is electrically connected to the battery 50 in that headphone unit 10, and the other headphone unit 10 and its built-in battery 50 are connected to the circuit board 60 by lead wires via wiring in the headband. When there is only one circuit board 60, the overall cost of the headphone unit 10 is low. Naturally, there may be two circuit boards 60, one of which is a main control board and the other is a connector board, and the two circuit boards 60 are provided in the two headphone units 10 respectively, and the two circuit boards 60 are also electrically connected by wiring in the headband, with the circuit board 60 acting as the main control board realizing signal control for the two headphone units 10. As can be seen, this type of layout makes the circuit design simpler and the weight of the two headphone units 10 more even.

[0025] In one example,The first mounting surface 3211 extends obliquely from one side of the second mounting surface 3212 toward the ear pad assembly 40, and the battery 50 is connected to the first mounting surface 3211 and the circuit board 60 is attached to the second mounting surface 3212. Therefore, the first mounting surface 3211 extends obliquely toward the ear pad assembly 40, and therefore a mounting space is formed on the rear surface of the speaker housing 32 that is obliquely provided in the thickness direction of the headphone unit 10. Since the battery 50 is already small in volume, it can be arranged in parallel with the circuit board 60 in the radial direction of the headphone unit 10. As can be seen from the above, the structural layout of the headphone unit 10 of the present application is different from that of the conventional technology In comparison with the configuration in which the battery and circuit board are simply stacked in the thickness direction of the headphone unit in the previous example, the battery 50 is mounted offset and is arranged in parallel with the circuit board 60 in the radial direction of the headphone unit 10. This makes full use of the space within the mounting cavity 20a, making the dimension of the headphone unit 10 in the thickness direction relatively smaller, reducing the thickness and overall volume of the headphone housing 20, making the headphones 1 lighter and thinner, and preventing the product from becoming bulky, which is advantageous for wearing and using in this manner.

[0026] After the battery 50 and the circuit board 60 are assembled, at least a portion of the circuit board 60 is located on the rear side of the battery 50 opposite the ear pad assembly 40. In this way, the space behind the battery 50 can be fully utilized during the installation process of the circuit board 60, and the circuit board 60 can also block the battery 50 from moving rearward, preventing the battery 50 from being removed rearward. As can be seen, since the first mounting surface 3211 is inclined relative to the second mounting surface 3212 and the circuit board 60 and the battery 50 are located on two different mounting surfaces, even if they overlap in the front-to-rear direction of the headphone unit 10, this does not increase the thickness of the headphone unit 10, unlike the solution in which the circuit board 60 and the battery 50 are stacked on the same plane in conventional designs. Possible .

[0027] To facilitate assembly of the battery 50, the speaker housing 32 is further connected to a rear surface thereof with a position limiting member 322 (see FIGS. 3 and 4). The position limiting member 322 is provided on the edge of the first mounting surface 3211 and surrounds the mounting groove 3221 together with the first mounting surface 3211. nothing. The battery 50 is fitted into the mounting groove 3221, and the battery 50 is stably fixed to the first mounting surface 3211. The position limiting member 322 has a bump structure. The position limiting member 322 may be a protruding metal or plastic piece, or a raised edge, plate, or bracket. The position limiting members 322 may be provided in plural so as to surround the outer periphery of the battery 50, and the position limiting members 322 are interference-fitted with the battery 50 to stably clamp the battery 50. Naturally, a snap fit or additional screw engagement may be used to fix the battery 50 to the first mounting surface 3211, and the present application does not limit the fixing form of the battery 50. To further ensure the connection reliability of the battery 50 mounted on the first mounting surface 3211 and prevent the battery 50 from loosening, an adhesive may be provided between the battery 50 and the first mounting surface 3211. Layer Further, profit The material of the adhesive layer may be double-sided tape, resin, or the like.

[0028] Specifically, as shown in FIGS. 3 to 5, the speaker housing 32 includes a speaker back cover 321 and a speaker frame 323 that are removably connected. nothing. The speaker frame 323 is connected to the headphone housing 20. do. The speaker back cover 321 covers the opposite side of the speaker frame 323 from the ear pad assembly 40. The speaker back cover 321 is The first mounting surface 3211 and the second mounting surface 3212 are provided. The speaker back cover 321 isThe speaker frame 323 and the receiving cavity 324 (see FIG. 3) are enclosed together, and the speaker body 31 is disposed within the receiving cavity 324. The speaker frame 323 enclosing the receiving cavity 324 isolates the speaker body 31 from other components within the headphone unit 10, thereby providing better protection for the speaker body 31. To facilitate positioning and assembly of the speaker body 31, a position limiting groove 3231 (see FIG. 5) is formed in the portion of the speaker frame 323 within the receiving cavity 324, and the speaker body 31 is fitted within the position limiting groove 3231. This arrangement prevents the speaker body 31 from being displaced or loosened due to vibrations generated when the speaker body 31 transmits audio, thereby ensuring smooth and stable sound quality output.

[0029] To further ensure the stability of the speaker body 31 attached to the speaker frame 323, the attachment method between the speaker body 31 and the speaker frame 323 may further include a screwing structure, a locking structure, etc., but this application is not limited thereto. Furthermore, the specific form of the speaker housing 32 may be an integrated structure except for the case where the speaker back cover 321 and the speaker frame 323 are two separate parts as exemplarily shown in the drawings, and in this way, the speaker body 31 and the speaker frame 323 may be fixed together by a method such as screwing or locking.

[0030] As shown in Figures 3 to 5 , an example In the figure, the speaker body 31 includes a sound emitting surface 311 facing the ear pad assembly 40. .vinegar The speaker body 31 is a sound-generating unit, and its basic configuration includes an auxiliary system, a vibration system, and a magnetic circuit system. The auxiliary system is mainly a housing structure, the vibration system includes a diaphragm, a voice coil, etc., and the magnetic circuit system includes structures such as a magnetic guide yoke and a spring gasket. In the auxiliary system, the front cover is pressed against the edge of the diaphragm of the vibration system. The sound-emitting surface 311 here is the surface of the front cover facing the ear pad assembly 40. can be (e.g., The sound emitting surface 311 is a plane P shown in FIG. ) When the first mounting surface 3211 is parallel to the sound emitting surface 311 and the first mounting surface 3211 of the speaker housing 32 is provided so as to extend toward the ear pad assembly 40, interference with the placement of the speaker housing 32 can be avoided during the installation of the speaker main body 31. (e.g., The speaker body 31 is mounted in an inclined position, which allows it to adapt to the layout of the battery 50.) .

[0031] As shown in FIG. 6, the ear pad assembly 40 includes an ear pad frame 41 and an ear pad main body 42. The ear pad frame 41 is connected to the speaker housing 32. Specifically, the speaker frame 323 is connected to the ear pad frame 41. The connection method may be by locking or screwing. The ear pad frame 41 is annular, and the main body has a plate-like structure. The ear pad frame 41 has a connection surface 411 facing the speaker housing 32. (e.g., The connecting surface 411 is the plane S shown in FIG. The connection surface 411 is The circuit board 60 is arranged parallel to the second mounting surface 3212, i.e., the circuit board 60 attached to the second mounting surface 3212 is arranged parallel to the connection surface 411, and in this way, the relative distance between the circuit board 60 and the connection surface 411 in the front-to-back direction of the headphone unit 10 can be reduced, and further the thickness of the headphone housing 20 in the front-to-back direction of the headphone unit 10 can be reduced.

[0032] The ear pad main body 42 is located on the side of the ear pad frame 41 away from the connecting surface 411, and is connected to the ear pad frame 41. The connection method may be a fixed connection such as adhesive, which prevents the ear pad main body 42 from falling off. Naturally, the connection may be a detachable connection such as a sleeve connection or a latch, which allows the user to replace the ear pad assembly 40 according to their maintenance needs or sound quality needs, thereby meeting the usage needs of different users and providing a wide range of applications and high versatility. The ear pad main body 42 is annular and surrounds the edge of the ear pad frame 41. The ear pad assembly 40 is made of a flexible material such as memory sponge, which allows the ear pad main body 42 to fit closely to the wearer's auricle when the user wears the headphones 1, providing high noise resistance.

[0033] An exampleIn the figure, the connection surface 411 and the sound-emitting surface 311 are arranged so as to form an included angle; that is, the planes S and P are arranged so as to form the included angle α shown in FIG. 4 . In this way, when a user wears the headphones 1 of the present application, audio information transmitted from the headphones 1 comes into contact with the wearer's auricle via the ear pad assembly 40 and is output into the user's ear. At this time, the speaker housing 32 adaptively cooperates with the wearer's auricle to form a certain angle so as not to press on the wearer's auricle, thereby reducing the discomfort caused by pressing on the auricle when wearing the headphones, improving the wearer's comfort in use, and ensuring stable transmission of sound quality. The included angle α between the connecting surface 411 and the sound emitting surface 311 should not be too small to ensure that the speaker housing 32 does not press too hard against the wearer's auricle. Naturally, the included angle α should not be too large to avoid increasing the overall volume of the headphone unit 10 by increasing the mounting volume of the speaker assembly 30 inside the headphone housing 20. In addition, if the angle between the speaker body 31 and the user's auricle is too large, audio leakage may occur. profit , its sound emission effect Therefore, for example, The included angle α is greater than or equal to 5 degrees and less than or equal to 15 degrees. get (e.g., The included angle α may be 5 degrees, 6 degrees, 7 degrees, ... 13 degrees, 14 degrees, 15 degrees, or any value between 5 degrees and 15 degrees. good) .

[0034] To accommodate the shape of the speaker body 31, the speaker frame 323 has a circular plan view, and the speaker body 31 is fitted into a position limiting groove 3231 in the speaker frame 323. In order to accommodate the angle α between the connecting surface 411 of the ear pad frame 41 and the sound emitting surface 311 of the speaker body 31, the speaker frame 323 has a cap-like shape in a front view, as shown in Fig. 5, and the side of the speaker frame 323 adjacent to the speaker body 31 also forms the angle α with the sound emitting surface 311. The speaker frame 323 is further formed with a sound emitting hole 3232 that communicates with the accommodating cavity 324 and faces the sound emitting surface 311 of the speaker body, allowing audio from the speaker body 31 to propagate to the outside of the headphone unit 10 through the sound emitting hole 3232.

[0035] figure It should be understood that the same or similar symbols in the drawings correspond to the same or similar components, and that in the description of this application, the orientations or positional relationships indicated by the terms "upper," "lower," "left," "right," etc. are orientations or positional relationships based on the drawings, are merely for the purpose of explaining and simplifying the description of this application, and do not indicate or suggest that the referred-to devices or elements must have a specific orientation, be configured in a specific orientation, and operate in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are merely used for illustrative purposes and should not be understood to limit the present application, and those skilled in the art can understand the specific meanings of the terms according to specific circumstances.

[0036] The above is the some The present invention is merely an example and does not limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should fall within the scope of protection of the present invention. [Explanation of symbols]

[0037] 1 headphones 10 headphone units 20 Headphone housing 20a Mounting Cavity 21 Housing 22 Headphone back cover 30 Speaker Assembly 31 Speaker body 311 Sound emission surface 32 Speaker housing 321 Speaker back cover 3211 First mounting surface 3212 Second mounting surface 322 Position limiting member 3221 Mounting groove 323 Speaker Frame 3231 Position limiting groove 3232 Sound emission hole 324 Containment Cavity 40 Ear pad assembly 41 Ear pad frame 411 Connection Surface 42 Ear pad body 50 batteries 60 Circuit Board

Claims

1. A headband and two headphone units respectively connected to opposite ends of the headband, each including a headphone housing, a speaker assembly, an ear pad assembly, and a battery, at least one of the headphone units further including a circuit board; Including, the headphone housing is connected to the headband; the ear pad assembly is connected to the headphone housing and covers the outside of the user's ear; the speaker assembly is provided in the headphone housing and includes a speaker body and a speaker housing, the speaker housing is connected to the headphone housing, and the speaker body is connected to the speaker housing; a surface of the speaker housing opposite to the ear pad assembly and an inner wall surface of the headphone housing are combined to enclose a mounting cavity, the surface of the speaker housing is formed with a first mounting surface and a second mounting surface, the first mounting surface is connected to the battery, and the second mounting surface is connected to the circuit board; the first mounting surface and the second mounting surface are arranged in a direction perpendicular to a thickness direction of the headphone unit, and at least one of the first mounting surface and the second mounting surface is arranged so that the distance between the first mounting surface and the ear pad assembly decreases in a direction away from the other mounting surface.

2. a position limiting member further connected to the first mounting surface, the position limiting member cooperating with the first mounting surface to surround the mounting groove; 2. The headphones according to claim 1, wherein the battery is fitted into the mounting groove.

3. The headphones according to claim 1 , further comprising an adhesive layer between the battery and the first mounting surface.

4. The headphones according to claim 1 , wherein at least a portion of the circuit board is located on an opposite side of the battery from the ear pad assembly.

5. the speaker body includes a sound emitting surface facing the ear pad assembly; The headphones according to any one of claims 1 to 4, characterized in that the first mounting surface is arranged so that the distance between the first mounting surface and the ear pad assembly decreases in a direction away from the second mounting surface, and the first mounting surface is parallel to the sound emitting surface.

6. 6. The headphones according to claim 5, wherein the ear pad assembly includes an ear pad frame connected to the speaker housing, the ear pad frame having a connection surface facing the speaker housing, the connection surface and the sound emitting surface being arranged to form an included angle.

7. 7. The headphones according to claim 6, wherein an included angle between the connection surface and the sound emitting surface is equal to or greater than 5 degrees and equal to or less than 15 degrees.

8. the speaker housing includes a speaker back cover and a speaker frame that are detachably connected, the speaker frame being connected to the headphone housing, the speaker back cover covering the speaker frame on the side opposite to the ear pad assembly, and enclosing an accommodating cavity together with the speaker frame; The headphone according to claim 6 , wherein the speaker body is disposed in the receiving cavity, and the speaker back cover has the first mounting surface and the second mounting surface.

9. The headphone according to claim 8, wherein a position limiting groove is formed in a portion of the speaker frame within the receiving cavity, and the speaker body is fitted into the position limiting groove.

10. The headphones according to claim 6, wherein the connection surface is provided parallel to the second attachment surface.

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