Imprint device, imprint method, program and method of manufacturing article

Abstract

To provide an imprint device which is advantageous for overlap accuracy in imprint processing in a case where a portion of a pattern part of a mold is positioned outside of a substrate.SOLUTION: An imprint device for forming a pattern on a substrate using a mold comprises: a drive section which changes a relative tilt amount between opposed faces of the mold and the substrate; a mold deformation mechanism which deforms the mold in such a manner that a shape of the mold is projected toward the substrate; a substrate deformation mechanism which deforms the substrate in such a manner that a surface shape in at least a portion of the substrate is projected toward the mold; and a control section which determines a tilt amount by the drive section when starting contact between the mold and a non-cured imprint material on the substrate, a mold deformation correction amount for a predetermined mold deformation amount by the mold deformation mechanism and a substrate deformation amount by the substrate deformation mechanism in the order of the tilt amount, the mold deformation correction amount and the substrate deformation amount.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to an imprint apparatus, an imprint method, a program, and a method for manufacturing an article. [Background technology]

[0002] In the manufacture of semiconductor devices, MEMS, and the like, processing devices that discharge liquid material from multiple nozzles to perform microfabrication are used. One example of such processing devices is an imprinting device that discharges a liquid fluid, such as a relatively viscous uncured resin, from nozzles onto a substrate and presses a mold with a textured surface against the discharged resin to form a predetermined pattern. The imprinting device can form an article with a microstructure on the order of several nanometers on the substrate.

[0003] Patent Document 1 discloses a method for determining imprint conditions for deforming the pattern surface of a mold and the substrate when pressing the mold pattern against the substrate in order to prevent the mold from contacting the edge of the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-103399 [Patent Document 2] Special Publication No. 2008-509825 Summary of the Invention [Problem to be solved by the invention]

[0005] In an imprinting apparatus, to more efficiently fill the mold with resin, it is necessary to start contacting the resin on the substrate from a desired position on the mold. This is particularly important in partial shot areas where the shot area on the substrate (the area where the mold pattern is imprinted) is smaller than the pattern area where the mold pattern is formed, compared to full shot areas where the shot area is the same size as the pattern area where the mold pattern is formed.

[0006] The present invention has been made in view of the problems with the conventional technology, and aims to provide a method for determining imprint conditions that are advantageous for overlay accuracy in an imprint process when part of the pattern portion of the mold is outside the substrate. [Means for solving the problem]

[0007] The imprinting apparatus of the present invention is an imprinting apparatus that performs an imprinting process using a mold to form a pattern of imprinting material on a substrate, and is characterized by having: a drive unit that changes the relative amount of tilt between the opposing surfaces of the mold and the substrate; a mold deformation mechanism that deforms the mold so that the mold becomes convex toward the substrate; a substrate deformation mechanism that deforms the substrate so that the surface shape of at least a portion of the substrate becomes convex toward the mold; and a control unit that determines the amount of tilt by the drive unit when starting contact between the mold and the uncured imprinting material placed on the substrate, a mold deformation correction amount for a predetermined mold deformation amount by the mold deformation mechanism, and a substrate deformation amount by the substrate deformation mechanism in the order of the amount of tilt, the mold deformation correction amount, and the substrate deformation amount. [Effects of the Invention]

[0008] The present invention can provide a method for determining imprint conditions that are advantageous for overlay accuracy in imprint processing when a part of a pattern portion of a mold is outside a substrate. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic view showing a mechanism of an imprint apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a diagram illustrating an example of the configuration of a mold holding mechanism. [Figure 3] FIG. 2 is a diagram illustrating an example of the configuration of a substrate holding mechanism. [Figure 4] FIG. 2 is a diagram showing a part of the configuration of a mold according to an embodiment of the present invention. [Figure 5] 2A to 2C are diagrams for explaining an imprint process in the imprint apparatus shown in FIG. [Figure 6] 10A and 10B are diagrams for explaining an imprint process in which a part of a pattern portion of a mold is located outside a substrate. [Figure 7] 10A and 10B are diagrams showing deformation amounts and tilt amounts of a mold in an embodiment of the present invention. [Figure 8] FIG. 2 is a diagram showing a shot area on a substrate in an embodiment of the present invention. [Figure 9] 10A and 10B are diagrams showing the deformation amount of a substrate in an embodiment of the present invention. [Figure 10] 1A to 1C are diagrams illustrating a method for determining imprint conditions according to an embodiment of the present invention. [Figure 11] 10A and 10B are diagrams illustrating contact start target positions according to an embodiment of the present invention. [Figure 12] 1A to 1C are diagrams for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE INVENTION

[0010] An imprint apparatus according to an embodiment will be described in detail below with reference to the accompanying drawings. Note that the drawings shown below are drawn at a scale different from the actual scale in order to facilitate understanding of the embodiment. In this specification and the accompanying drawings, directions are indicated in an xyz coordinate system in which the xy plane is a plane parallel to the mounting surface on which the substrate 103 is placed on the substrate stage 104. The direction perpendicular to the mounting surface of the substrate stage 104 is the z-axis direction, and two directions perpendicular to each other in the plane parallel to the mounting surface of the substrate stage 104 are the x-axis direction and the y-axis direction, respectively.

[0011] Figure 1 is a schematic diagram showing the configuration of an imprinting apparatus 1 of the present invention. The imprinting apparatus 1 is a lithography apparatus used in a lithography process, which is a manufacturing process for devices such as semiconductor elements, liquid crystal display elements, and magnetic storage media, to form a pattern on a substrate. The imprinting apparatus 1 brings an uncured imprinting material placed (supplied) on the substrate into contact with a mold, and applies energy for curing to the imprinting material, thereby forming a pattern in the cured material in which the pattern of the mold is imprinted.

[0012] The imprint material is a material (curable composition) that hardens when curing energy is applied. The curing energy may be electromagnetic waves, heat, or the like. Electromagnetic waves include, for example, light having a wavelength selected from the range of 10 nm to 1 mm, specifically infrared rays, visible light, ultraviolet rays, and the like.

[0013] The curable composition is a composition that cures upon irradiation with light or heat. The photocurable composition that cures upon irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0014] The imprint material may be applied to the substrate in the form of a film using a spin coater or a slit coater. Alternatively, the imprint material may be applied to the substrate in the form of droplets, or in the form of islands or a film formed by connecting multiple droplets using a liquid jet head. The viscosity of the imprint material (at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0015] The substrate may be made of glass, ceramics, metal, semiconductor, resin, etc., and if necessary, a member made of a material different from the substrate may be formed on the surface of the substrate. Specifically, the substrate may be made of a silicon wafer, a compound semiconductor wafer, quartz glass, etc.

[0016] In this embodiment, the imprinting apparatus 1 employs a photo-curing method for curing the imprinting material by irradiating it with light such as ultraviolet light, but the imprinting apparatus 1 may also employ a thermal curing method for curing the imprinting material by applying heat.

[0017] The imprint apparatus 1 includes a mold holding mechanism 101, a substrate holding and deformation mechanism 108, a substrate height measurement mechanism 109, a mold height measurement mechanism 117, a resin application mechanism 106, a gas supply unit 125, a light source unit 105, an on-axis alignment scope 116, a memory unit STU, and a control unit CTU.

[0018] The substrate stage 104 supports a substrate holding and deformation mechanism 108 that holds the substrate 103. The substrate stage 104 includes a substrate driving unit (not shown) and is configured to be able to drive above (on the xy plane) a stage base 113. The substrate driving unit has the function of driving the substrate stage 104 (substrate 103) about six axes: the x-axis, y-axis, z-axis, and axes around these axes.

[0019] The off-axis alignment scope 107 observes the substrate 103 and positions the substrate 103. The substrate height measurement mechanism 109 is an optical distance measurement sensor that measures the height (position in the z direction) of the transferred surface of the substrate 103 relative to an imprinting reference surface 118. The imprinting reference surface 118 is an ideal imprinting surface where the substrate and mold fill together when imprinting is performed using an imprinting device, substrate, and mold according to design values. The mold height measurement mechanism 117 is an optical distance measurement sensor that measures, for example, the height of the mold pattern surface relative to the imprinting reference surface 118 (the position in the direction perpendicular to the mounting surface of the substrate stage 104 on which the substrate 103 is placed).

[0020] The resin applying mechanism 106 places the photocurable resin 126 in the shot area of ​​the substrate 103. However, the resin applying mechanism 106 may be configured as an external device of the imprint apparatus 1.

[0021] The gas supply unit 125 is a mechanism that supplies a gas (not shown) that promotes the filling and curing of the photocurable resin to the imprint space ISP between the mold 102 and the substrate 103. An example of a gas that promotes the filling and effect of the photocurable resin 126 is helium, but it is not limited to helium. As a result, when the mold 102 is pressed against the photocurable resin 126 on the substrate 103, the helium escapes from the imprint space ISP via the mold 102, thereby improving the filling of the photocurable resin 126 into the mold 102.

[0022] Furthermore, it is possible to suppress the occurrence of curing defects in the photocurable resin 126 due to oxygen inhibition when curing the photocurable resin 126 on the substrate 103. The amount of gas supplied from the gas supply unit 125 to the imprint space ISP is adjusted (optimized) according to the volume of the imprint space ISP (amount of gap between the mold 102 and the substrate 103) so that the number of curing defects (amount of defects) in the photocurable resin 126 falls within an allowable range.

[0023] The light source unit 105 includes, for example, a light source that emits light (such as ultraviolet light) containing a wavelength that can harden the photocurable resin 126, and an optical system for guiding the light emitted from the light source to the photocurable resin 126 on the substrate 103. The on-axis alignment scope (second sensor) 116 is used to measure the relative positions of the mold-side mark 206 and the mark formed on the substrate 103, and the mold-side mark 206 and the substrate stage-side mark 115, in a plane parallel to the mounting surface of the substrate stage 104. An optical position detection device is used to measure the relative positions, as disclosed in Patent Document 2. The filling camera 114 is used to observe the filling of the photocurable resin 126 through the mold 102 during imprinting.

[0024] The substrate 103 can be made of silicon, plastic, gallium arsenide, mercury telluride, or a composite material thereof. The upper surface of the substrate 103 may be spin-coated in advance with a conditioning mixture containing an additive to lower the surface energy.

[0025] The storage unit STU includes storage devices such as RAM, ROM, a hard disk, etc. The storage unit STU stores (contains) programs executed by the control unit CTU, various data, information, functions, etc.

[0026] The control unit CTU is configured, for example, by a computer (information processing device) including a CPU, memory, etc. The control unit CTU comprehensively controls each unit of the imprint apparatus 1 in accordance with a program stored in the storage unit STU, etc., to operate the imprint apparatus 1. For example, the control unit CTU performs an imprint process in which a pattern of an imprint material is formed on a substrate 103 using a mold 102.

[0027] 2 shows an embodiment of a mold holding mechanism 101 of the present invention. The mold holding mechanism (mold deformation mechanism) 101 holds a mold 102 by suction using a mold holding part 110. A mold backside pressure control part 111 can increase or decrease the air pressure in a mold backside space 127 surrounded by a seal glass 112 and the mold backside, thereby deforming the recessed part of the mold 102 into a convex shape on the side opposite to the mold holding part 110. The mold holding mechanism 101 imprints the pattern of the mold 102 onto a substrate 103 (not shown) and releases the mold 102 by driving it to move in the z-axis direction and rotate around the x-axis direction (tilt X) and rotate around the y-axis direction (tilt Y).

[0028] 3 shows an embodiment of the substrate holding and deformation mechanism 108 of the present invention. The substrate holding and deformation mechanism 108 is composed of substrate suction and deformation mechanisms 119-123 and a substrate holding chuck 124. The substrate suction and deformation mechanisms 119-123 suction the substrate 103 to the substrate holding chuck 124 by supplying a negative pressure to the substrate edge using the pressure control mechanism, and deform the substrate 103 toward the substrate upper surface by supplying a positive pressure to the substrate edge using the pressure control mechanism.

[0029] An embodiment of the mold 102 of the present invention is shown in Figure 4. The mold 102 may be made of, for example, fused silica, organic polymer, or metal, but is not limited to these materials. The mold 102 has a recessed portion 202 carved into the center. The appropriate thickness of the recessed portion 202 is about 1 mm. A pattern portion (pattern area) 201 in which a mold pattern is formed is formed on the surface opposite the recessed portion 202. The pattern portion 201 is formed in the center of the recessed portion 202.

[0030] The pattern portion 201 includes a base portion 205 and a pattern PTN consisting of recessed portions 203 and protruding portions 204 provided on the base portion 205. The base portion 205 has a thickness of about 30 μm. A minute pattern of, for example, several nm or a dozen nm may be formed as the pattern PTN, in which case the depth from the protruding portions 204 to the recessed portions 203 is about several tens of nm to several hundreds of nm. In addition, the pattern portion 201 is provided with a mold-side mark 206 for use with the on-axis alignment scope 116.

[0031] Next, the imprint process for forming a pattern on a substrate in the imprint apparatus 1 will be described with reference to FIGS. 5, the transfer process when the center of the mold 102 is within the substrate 103 will be described. When the center of the mold 102 is within the substrate 103, the mold 102 is not tilted, and the pattern PTN of the mold 102 is transferred to the photocurable resin 126 on the substrate 103 while the pattern portion 201 of the mold 102 is deformed without deforming the substrate 103.

[0032] 5 shows an example of imprint processing on a full-field shot area, in which the shot area on the substrate 103 (the area to which the pattern PTN of the mold 102 is transferred) is approximately the same size as the pattern portion 201 of the mold 102. Note that the full-field shot area is a shot area having the same area as the area of ​​the pattern portion 201 of the mold 102.

[0033] First, while gas is being supplied from the gas supply unit 125, the photocurable resin 126 is discharged from the resin application mechanism 106, and the photocurable resin 126 is placed (applied) in the shot region on the substrate 103.

[0034] As shown in Figure 5(a), the pattern portion 201 of the mold 102 is deformed into a convex shape toward the substrate 103 and brought close to the substrate 103, and the center of the pattern portion 201 of the mold 102 is brought into contact with the photocurable resin 126 applied onto the substrate 103, and imprinting begins.

[0035] Next, as shown in Figure 5(b), from a state in which the pattern portion 201 of the mold 102 and the photocurable resin 126 are in contact with each other, the mold back surface pressure control unit 111 controls the mold back surface pressure to atmospheric pressure, and the photocurable resin 126 is filled between the pattern portion 201 and the substrate 103.

[0036] Next, as shown in FIG. 5(c), while the photocurable resin 126 on the substrate 103 is in contact with the mold 102, light 302 is irradiated from the light source unit 105 to cure the photocurable resin 126 on the substrate 103. 5(d), the mold 102 is separated (released) from the photocurable resin 126 hardened on the substrate 103. As a result, the pattern PTN is transferred to the photocurable resin 126 on the substrate 103.

[0037] 6, the imprint process for a partial field shot area (partial shot area) when the center of the mold 102 is outside the substrate 103 will be described. Note that the partial field shot area is a shot area having an area smaller than the area of ​​the pattern portion 201 of the mold 102. When the center of the mold 102 is outside the substrate 103, the mold 102 (not shown) is tilted, and the pattern PTN of the mold 102 is transferred to the photocurable resin 126 on the substrate 103 while deforming the pattern portion 201 of the mold 102 and the substrate 103.

[0038] First, while gas is being supplied from the gas supply unit 125, the photocurable resin 126 is discharged from the resin application mechanism 106, and the photocurable resin 126 is placed (applied) in the shot region on the substrate 103. 6(a), mold holding mechanism 101 is driven to tilt mold 102 relative to substrate 103, deforming pattern portion 201 into a convex shape toward substrate 103, and deforming substrate 103 into a convex shape on the side opposite substrate holding and deformation mechanism 108. In this state, pattern portion 201 of mold 102 is brought close to substrate 103, and pattern portion 201 of mold 102 is brought into contact with photocurable resin 126 applied to substrate 103, and imprinting begins.

[0039] In order to more efficiently fill the mold 102 with the photocurable resin 126, it is necessary to prevent the mold 102 from contacting the edge of the substrate 103 and to start contacting the photocurable resin 126 on the substrate 103 from a desired position on the mold 102. This is particularly important for processing in the partial shot region compared to the full shot region. In the imprinting process in the partial shot region of FIG. 6(a), the tilt amount of the mold 102, the deformation amount of the mold 102, and the deformation amount of the substrate 103 are calculated as correction amounts for the state in the imprinting process in the full shot region.

[0040] Next, from the state where the mold 102 and the photocurable resin 126 are in contact with each other, the pressure on the mold rear surface is returned to atmospheric pressure by the mold rear surface pressure control unit 111, the substrate suction / deformation mechanisms 119-123 are controlled to a negative pressure for the substrate suction pressure, and the mold holding mechanism 101 is driven to return the inclination of the mold 102 to the reference state while bringing the mold 102 closer to the substrate 103. As a result, the photocurable resin 126 is filled between the pattern portion 201 of the mold 102 and the substrate 103, as shown in FIG. 6(b).

[0041] Next, as shown in FIG. 6(c), the light source unit 105 irradiates light 302 to harden the photo-curable resin 126. 6(d), the mold 102 is pulled away (released) from the cured photocurable resin 126 on the substrate 103. As a result, part of the pattern PTN is imprinted into the photocurable resin 126 on the substrate 103.

[0042] In the case of imprint processing in which the center of the mold 102 is outside the substrate 103, it is necessary to start contact from a desired position on the pattern portion 201 of the mold 102 in order to more effectively progress the filling. On the other hand, in Figures 6(a) and 6(b), the substrate 103 is deformed, so distortion remains in the pattern on the surface of the substrate 103, and the overlay accuracy deteriorates. The present invention provides a method for determining imprint conditions that minimize the amount of deformation of the substrate 103, making it possible to avoid deterioration of overlay accuracy.

[0043] [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to FIGS. First, a method for calculating the tilt amount of the mold 102 required for imprinting will be described with reference to Fig. 7. The distance between the mold center 505 and the contact start position when the mold 102 is tilted is defined as d m [mm], and the radius of the mold rear space 127 enclosed by the seal glass 112 and the mold rear surface in the xy plane is R c [mm], deformation amount of mold center 505 c m [μm]. At this time, the tilt amount φ [rad] of the mold 102 is expressed by the following formula (1).

number

[0044] However, there is a limit to the amount of tilt of the mold 102. A method for calculating the maximum amount of tilt of the mold 102 when the substrate 103 and the mold 102 are in the positional relationship shown in Fig. 9 will be described. In Fig. 9, the coordinates of the shot center 603 in the substrate surface are (X, Y) [mm], and the distance between the substrate center and the shot center 603 is R [mm]. The dimensions of the mold 102 are as shown in Fig. 4. The width (length in the x direction) of the pattern portion 201 is W m , the depth (length in the y direction) of the pattern portion 201 is D m , the height (length in the z direction) of the pattern portion 201 is H m The width of the mold 102 is W M , the depth of the mold 102 is D M, the deformation amount at the mold center is c m At this time, the maximum tilt amount φ of the mold 102 that can be tilted without the mold 102 coming into contact with the substrate 103 is max [rad] is expressed by the following formula (2).

number

[0045] At this time, the width W m , depth D m and height H m can be calculated from the design dimensions of the mold 102 (not shown). m can be calculated from the results of measurement using a mold height measurement mechanism 117 (not shown). m , depth D m It is also possible to process the measurement results of the mold height measurement mechanism 117 (not shown) while moving the substrate stage 104 (not shown), and apply the results obtained by determining the change points of the height measurement values ​​as the ends of the pattern portion 201.

[0046] In addition, the width W of the pattern portion 201 m , depth D m can also be obtained based on the driving distance of the substrate stage 104 when the edge of the pattern portion 201 and the substrate stage 104 are simultaneously observed with the axial alignment scope 116. That is, the width W can be obtained by using an axial alignment scope that observes the relative position between the substrate 103 and the mold 102 in a plane parallel to the mounting surface of the substrate stage 104 and a driving mechanism (substrate stage 104) that changes the relative position between the substrate stage 104 and the mold 102 in the plane. m , depth D m may be obtained.

[0047] Next, a method for calculating the deformation amount of the mold 102 required for imprinting will be described with reference to Figure 7. The relationship between the change amount and the contact start position when the deformation amount of the mold center 505 is changed while the mold 102 is tilted will be described. The tilt amount of the mold 102 is φ [rad], and the radius in the xy plane of the mold back surface space 127 surrounded by the seal glass 112 (not shown) and the mold back surface is R. c [mm], the distance between the mold center 505 and the contact start position is d m At this time, the deformation amount c of the mold center 505 is m [μm] is expressed by the following formula (3).

number

[0048] Finally, a method for calculating the amount of substrate deformation required during imprinting will be described with reference to Fig. 8. Reference numerals 119 to 123 in Fig. 8 correspond to the substrate suction and deformation mechanisms 119 to 123 shown in Fig. 3. Here, an example is taken in which substrate suction and deformation mechanism 122 is pressurized and substrate suction and deformation mechanisms 119, 120, 121, and 123 are suctioned with negative pressure.

[0049] The distance from the substrate center 705 to the center 703 of the substrate suction / deformation mechanism 122 is l4, and the distance from the center 703 of the substrate suction / deformation mechanism 122 to the boundary of the substrate suction / deformation mechanism 122 is W. W [mm], the deformation amount at the center 703 of the substrate suction deformation mechanism 122 is c w In this case, the distance r from the center 705 of the substrate w The substrate deformation amount g(r w ) as shown in Fig. 1. w For example, if the deformation is approximated by a quadratic function centered on the central portion 703 of the substrate suction / deformation mechanism 122, the amount of substrate deformation can be expressed by the following equation (4).

number

[0050] Substrate deformation g(r w ) is not limited to equation (4). The combination of the substrate suction / deformation mechanism that suctions with negative pressure and the substrate suction / deformation mechanism that applies pressure is selected so that the surface shape of the region of the substrate closer to the center than the initial contact point (at least a portion of the region) is deformed, and so that the shot region is convex toward the mold side. It is also necessary to select a combination of the substrate deformation mechanism and pressure that will hold the substrate 103 in place during mold release. The amount of substrate deformation may be controlled by the pressure supplied to the substrate suction and deformation mechanisms 119-122, or may be controlled by the amount of deformation using the substrate height measurement mechanism 109 (not shown).

[0051] 10, a method for determining the imprint conditions at the start of contact of the mold 102 with the photocurable resin 126 in the imprint process using the methods for calculating the mold inclination amount, mold deformation amount, and substrate deformation amount explained above will be described. Here, determining the imprint conditions in the imprint process (mold inclination amount, mold deformation correction amount, substrate deformation amount) can be said to be determining the respective correction amounts (adjustment amounts) for the reference mold inclination amount, reference mold deformation amount, and reference substrate deformation amount.

[0052] The standard mold tilt amount is basically a state in which the surface of the pattern portion 201 of the mold 102 and the surface of the substrate 103 are parallel to each other, but it may also be an amount of tilt adjusted based on the flatness of the substrate 103, the thickness distribution of the applied photocurable resin 126, etc.

[0053] The reference mold deformation amount is the mold deformation amount at the start of contact of the mold 102 with the photocurable resin 126 in imprint processing for a full-field shot area, for example, when the mold center is within the substrate.

[0054] The reference substrate deformation amount is an amount corresponding to a state in which the substrate 103 is held by suction on the substrate stage 104 by the substrate holding and deformation mechanism 108, and none of the substrate suction and deformation mechanisms 119 to 123 apply pressure.

[0055] In step S1, a target position for starting contact between the pattern portion 201 of the mold 102 and the substrate 103 in the shot region 910 is determined to be located within the substrate. As a method for determining this, for example, the center of gravity 901 of the shot region 910 may be selected as shown in Fig. 11(a). Alternatively, as shown in Fig. 11(b), a midpoint 902 within the shot region 910 on a line segment connecting the center of the substrate 103 and the center of the pattern portion 201 located to correspond to the shot region 910 may be selected as the target position for starting contact.

[0056] In step S2, the amount of mold tilt required to contact the mold from the initial contact point determined in step S1 is calculated using equation (1). m [μm] is the same deformation amount (reference mold deformation amount) as that during imprinting processing for a full-field shot area when the mold center is within the substrate.

[0057] In step S3, the mold tilt amount calculated in step S2 is compared with the maximum tilt amount φ in the shot region 910 calculated based on equation (2). max If it is smaller, the process proceeds to step S4, and the maximum tilt amount φ max In the above cases, the process proceeds to step S5. In step S4, the mold tilt amount is set to the value obtained in step S2, and the mold deformation amount is set to the same value as the mold deformation amount when the mold center is within the substrate (reference mold deformation amount), and then proceed to step S10.

[0058] In step S5, the maximum tilt amount calculated by equation (2) is set as the mold tilt amount φ in the shot area 910, and the deformation amount c of the mold center required based on equation (3) is calculated. m Here, the deformation amount c of the mold center obtained based on equation (3) ism is a smaller deformation amount than the reference mold deformation amount when the mold center is inside the substrate, which was assumed when determining the required mold tilt amount in step S2. In other words, it may be obtained as an adjustment amount (mold deformation adjustment amount) for the deformation amount when the mold center is inside the substrate. This is because, in the mold tilt amount φ, the smaller the deformation amount at the mold center, the more the position of the pattern portion 201 that is parallel to (in contact with) the substrate 103 can be moved in a direction away from the center of the pattern portion 201 (toward the end portion). m It is possible to obtain a mold deformation adjustment amount relative to a reference mold deformation amount.

[0059] In step S6, the mold tilt amount φ and the deformation amount c of the mold center are calculated. m It is determined whether or not the conditions are such that a filling defect will occur when an imprint process is performed. If the conditions are such that a filling defect will not occur, the process proceeds to step S7, and if the conditions are such that a filling defect will occur, the process proceeds to step S8. Here, a filling defect is when air bubbles remain between the pattern portion 201 of the mold 102 and the photocurable resin 126 on the substrate 103 when they are in contact. A filling defect occurs when the mold deformation amount that deforms the pattern portion 201 into a convex shape toward the substrate 103 when the pattern portion 201 and the substrate 103 start to come into contact with each other is insufficient, and a contacting portion sandwiches an uncontacted portion in the xy plane until the pattern portion 201 and the shot area come into complete contact.

[0060] In step S6, the mold tilt amount φ and the deformation amount c of the mold center m The determination of whether or not a filling defect occurs due to the imprint process under the above conditions can be made based on, for example, data from past imprint processes. Alternatively, the mold tilt amount φ and the mold center deformation amount c m If there is no record of imprint processing corresponding to the above condition, the processing conditions may be interpolated or extrapolated to make a determination based on data from past imprint processing.

[0061] In addition, the determination in step S6 is made based on the deformation amount cm is the minimum mold deformation amount c mmin In the above cases, it is considered that there is no filling defect, and the process proceeds to step S7. mmin If the minimum mold deformation amount c is less than the minimum mold deformation amount c, it may be determined that there is a possibility of a filling failure, and the process may proceed to step S8. mmin can be set as a threshold value for the mold deformation amount based on the mold tilt amount φ, the deformation amount of the mold center, and the presence or absence of filling defects in past imprint processes. Furthermore, in order to more reliably prevent filling defects from occurring, the minimum mold deformation amount c mmin Alternatively, a mold deformation amount that is larger than the minimum mold deformation amount by a predetermined minute amount δ1 may be set as the minimum mold deformation amount.

[0062] In step S7, the maximum inclination amount φ of the mold calculated by equation (2) is max The deformation amount c of the mold center based on the formula (3) calculated in step S5 is set. m (Mold deformation adjustment amount based on) is set, and the process proceeds to step S10. Here, for the deformation amount of the mold center, the mold deformation amount based on the formula (3) calculated in step S5 is set as c m It is also possible to employ a mold deformation amount that is larger by a predetermined minute amount δ2 than the mold deformation amount, thereby more reliably preventing filling defects from occurring.

[0063] In step S8, the maximum tilt amount φ calculated by equation (2) is max is the mold tilt amount φ in the shot, and the minimum mold deformation amount c mmin The required substrate deformation amount is calculated based on the formula (4) using the mold deformation amount as the mold deformation amount, and the process proceeds to step S9.

[0064] In step S9, the maximum tilt amount φ calculated by equation (2) is max is the mold tilt amount φ, and the minimum mold deformation amount c mmin is set as the deformation amount of the mold center, and the required substrate deformation amount obtained based on equation (4) in step S8 is set as the substrate deformation amount, and the process proceeds to step S10.

[0065] In step S10, the imprint process is performed under the set conditions of mold tilt amount, mold deformation amount, and substrate deformation amount. Specifically, the mold holding mechanism 101 is driven to control the rotation angle around the x-axis and y-axis, and the relative angle between the mold 102 and the substrate 103 is changed (set) to the set mold tilt amount. The mold backside pressure control unit 111 controls the mold backside pressure to set the mold deformation amount. The substrate suction and deformation mechanisms 119 to 123 of the substrate holding and deformation mechanism 108 are controlled to set the desired position of the substrate 103 to the substrate deformation amount. After driving to set the set mold tilt amount, mold deformation amount, and substrate deformation amount (pre-contact driving step), contact between the mold 102 and the substrate 103 is initiated, and the imprint process is performed.

[0066] Following the above steps, the amount of mold tilt is determined, then the amount of mold deformation (mold deformation adjustment amount) is determined, and finally the amount of substrate deformation is determined, thereby realizing imprinting under conditions that minimize the amount of substrate deformation, which is advantageous for overlay accuracy.

[0067] The pattern of the cured product formed using the imprinting apparatus 1 (imprinting method) of this embodiment is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. Examples of articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0068] The pattern of the cured product may be used as it is as at least a part of a component of the above-mentioned article, or may be used temporarily as a resist mask, which is removed after etching or ion implantation is performed in a substrate processing step.

[0069] Next, a specific method for manufacturing the article will be described. As shown in Figure 12(a), a substrate such as a silicon wafer is prepared, on the surface of which a workpiece such as an insulator is formed. Next, an imprinting material is applied to the surface of the workpiece by an inkjet method or the like. Here, the state in which multiple droplets of the imprinting material have been applied to the substrate is shown.

[0070] As shown in Figure 12(b), the imprinting mold is placed with the side on which the concave-convex pattern is formed facing the imprinting material on the substrate. As shown in Figure 12(c), the substrate on which the imprinting material has been applied is brought into contact with the mold, and pressure is applied. The imprinting material fills the gap between the mold and the workpiece. In this state, when light is irradiated through the mold as curing energy, the imprinting material hardens.

[0071] 12(d), when the mold and substrate are separated after the imprint material is cured, a pattern of the cured imprint material is formed on the substrate. In this cured material pattern, the recesses of the mold correspond to the protrusions of the cured material, and vice versa. In other words, the recesses and protrusions of the mold are imprinted onto the imprint material.

[0072] As shown in Figure 12(e), when etching is performed using the cured material pattern as an etching-resistant mask, the portions of the surface of the workpiece where no cured material or only a thin layer remains are removed, forming grooves. As shown in Figure 12(f), when the cured material pattern is removed, an article with grooves formed in the surface of the workpiece is obtained. Here, the cured material pattern is removed, but it may also be used as an interlayer insulating film included in semiconductor devices, i.e., a component of an article, without being removed after processing.

[0073] The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program. It can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0074] The disclosure of this specification includes the following methods, configurations, and programs. (Configuration 1) An imprinting apparatus that performs an imprinting process to form a pattern of an imprint material on a substrate using a mold, a driving unit that changes the relative tilt amount between the opposing surfaces of the mold and the substrate; a mold deformation mechanism that deforms the mold so that the mold has a convex shape toward the substrate; a substrate deformation mechanism that deforms the substrate so that a surface shape of at least a part of the substrate becomes a convex shape toward the mold; An imprinting apparatus characterized by having a control unit that determines the amount of tilt caused by the drive unit when initiating contact between the mold and the uncured imprint material placed on the substrate, the amount of mold deformation correction for a predetermined amount of mold deformation caused by the mold deformation mechanism, and the amount of substrate deformation caused by the substrate deformation mechanism in the order of the amount of tilt, the mold deformation correction amount, and the substrate deformation amount. (Configuration 2) The imprinting apparatus described in configuration 1 is characterized in that the control unit determines the tilt amount, the mold deformation correction amount, and the substrate deformation amount in that order based on the position of the initial contact point when the mold and the uncured imprinting material placed on the substrate are brought into contact. (Configuration 3) 3. The imprint apparatus according to configuration 2, wherein the initial contact point is set based on a shot area within the substrate. (Configuration 4) The imprint apparatus described in configuration 2 or 3, wherein the tilt amount is smaller than the maximum tilt amount based on the position of the initial contact point, the shot area in the substrate, the shape of the mold, and the shape of the pattern area in which a pattern is formed by the mold. (Configuration 5) The imprint apparatus according to configuration 4, wherein design dimensions are used for the shape of the pattern area. (Configuration 6) a measurement mechanism that measures the position of the mold in a direction perpendicular to a mounting surface of a substrate stage on which the substrate is mounted, 6. The imprint apparatus according to configuration 4 or 5, wherein the shape of the pattern area is based on a measurement value obtained by the measurement mechanism. (Configuration 7) an alignment scope for observing the relative position between the substrate and the mold in a plane parallel to a mounting surface on which the substrate is mounted; a drive mechanism for changing the relative position between a substrate stage on which the substrate is placed and the mold in a plane parallel to a placement surface of the substrate stage, 7. The imprint apparatus according to any one of configurations 4 to 6, wherein the shape of the pattern area is obtained using the alignment scope and the driving mechanism. (Configuration 8) 2. The imprint apparatus according to configuration 1, wherein an area of ​​a shot region of the substrate that comes into contact with a pattern region of the mold is smaller than an area of ​​the pattern region. (Configuration 9) 8. The imprint apparatus according to any one of configurations 2 to 7, wherein the initial contact point is the center of gravity of the shot area of ​​the substrate. (Configuration 10) The imprint apparatus of any one of configurations 2 to 7, characterized in that the initial contact point is a midpoint within the shot area on a line segment connecting the center of the pattern area in contact with the shot area and the center of the substrate. (Configuration 11) The mold deformation mechanism deforms the mold by pressure, and the control unit controls the pressure. and the amount of deformation of the mold is controlled based on the relationship between the amount of deformation of the mold and the amount of deformation of the mold. 11. The imprinting apparatus according to any one of configurations 1 to 10. (Method 1) An imprinting method for forming a pattern of an imprint material on a substrate using a mold, comprising: a determining step of determining a relative tilt amount between opposing surfaces of the mold and the substrate when contact between the mold and the uncured imprint material arranged on the substrate is initiated, a mold deformation correction amount for a predetermined mold deformation amount that causes the mold to have a convex shape toward the substrate, and a substrate deformation amount that causes at least a portion of the substrate to have a convex shape toward the mold, in the order of the tilt amount, the mold deformation correction amount, and the substrate deformation amount; a pre-contact driving step of driving the substrate to the tilt amount, the mold deformation correction amount, and the substrate deformation amount determined in the determining step; An imprinting method comprising, after the pre-contact driving step, a stamping step of initiating contact between the mold and the uncured imprint material disposed on the substrate. (Method 2) forming a pattern on a substrate using the imprint apparatus according to any one of configurations 1 to 11; processing the substrate on which the pattern has been formed in the process; and producing an article from the processed substrate. (Method 3) forming a pattern on a substrate using the imprinting method described in Method 1; processing the substrate on which the pattern has been formed in the process; manufacturing an article from the processed substrate; A method for manufacturing an article, comprising: (program) A program that, when executed by a processor, causes the processor to perform the imprint method according to Method 1. [Explanation of symbols]

[0075] 1 Imprinting device 101 Mold holding mechanism (drive unit, mold deformation mechanism) 102 Mold 103 Substrate 108 Substrate holding and deformation mechanism (substrate deformation mechanism) 111 Mold backside pressure control unit (mold deformation mechanism) 119~123 Substrate suction deformation mechanism (substrate deformation mechanism) 126 Photocurable resin (imprint material)

Claims

1. An imprinting apparatus that performs an imprinting process to form a pattern of an imprint material on a substrate using a mold, a driving unit that changes the relative tilt amount between the opposing surfaces of the mold and the substrate; a mold deformation mechanism that deforms the mold so that the mold has a convex shape toward the substrate; a substrate deformation mechanism that deforms the substrate so that a surface shape of at least a part of the substrate becomes a convex shape toward the mold; An imprinting apparatus characterized by having a control unit that determines the amount of tilt caused by the drive unit when initiating contact between the mold and the uncured imprint material placed on the substrate, the amount of mold deformation correction for a predetermined amount of mold deformation caused by the mold deformation mechanism, and the amount of substrate deformation caused by the substrate deformation mechanism in the order of the amount of tilt, the mold deformation correction amount, and the substrate deformation amount.

2. The imprinting apparatus according to claim 1, characterized in that the control unit determines the tilt amount, the mold deformation correction amount, and the substrate deformation amount in that order based on the position of the initial contact point when the mold and the uncured imprinting material placed on the substrate are brought into contact.

3. The imprint apparatus according to claim 2 , wherein the initial contact point is set based on a shot area within the substrate.

4. 3. The imprint apparatus according to claim 2, wherein the tilt amount is smaller than a maximum tilt amount based on the position of the initial contact point, the shot area in the substrate, the shape of the mold, and the shape of a pattern area in which a pattern is formed by the mold.

5. The imprint apparatus according to claim 4 , wherein the shape of the pattern area is determined based on a design dimension.

6. a measurement mechanism that measures the position of the mold in a direction perpendicular to a mounting surface of a substrate stage on which the substrate is mounted, 5. The imprint apparatus according to claim 4, wherein the shape of the pattern area is based on a measurement value obtained by the measurement mechanism.

7. an alignment scope for observing the relative position between the substrate and the mold in a plane parallel to a mounting surface on which the substrate is mounted; a drive mechanism for changing the relative position between a substrate stage on which the substrate is placed and the mold in a plane parallel to a placement surface of the substrate stage, The imprint apparatus according to claim 4 , wherein the shape of the pattern area is obtained using the alignment scope and the driving mechanism.

8. 2. The imprint apparatus according to claim 1, wherein an area of ​​the shot area of ​​the substrate that comes into contact with the pattern area of ​​the mold is smaller than an area of ​​the pattern area.

9. The imprint apparatus according to claim 2 , wherein the initial contact point is the center of gravity of the shot area of ​​the substrate.

10. The imprint apparatus according to claim 2 , wherein the initial contact point is a midpoint within the shot area on a line segment connecting a center of the pattern area in contact with the shot area and a center of the substrate.

11. The mold deformation mechanism deforms the mold by pressure, and the control unit controls the pressure. and the deformation amount of the mold is controlled based on the relationship between the The imprinting apparatus according to claim 1 .

12. An imprinting method for forming a pattern of an imprint material on a substrate using a mold, comprising: a determining step of determining a relative tilt amount between opposing surfaces of the mold and the substrate when contact between the mold and the uncured imprint material arranged on the substrate is initiated, a mold deformation correction amount for a predetermined mold deformation amount that causes the mold to have a convex shape toward the substrate, and a substrate deformation amount that causes at least a portion of the substrate to have a convex shape toward the mold, in the order of the tilt amount, the mold deformation correction amount, and the substrate deformation amount; a pre-contact driving step of driving the substrate to the tilt amount, the mold deformation correction amount, and the substrate deformation amount determined in the determining step; An imprinting method comprising, after the pre-contact driving step, an imprinting step of initiating contact between the mold and the uncured imprint material disposed on the substrate.

13. A program that, when executed by a processor, causes the processor to perform the imprint method according to claim 12.

14. forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 11; processing the substrate on which the pattern has been formed in the process; and producing an article from the processed substrate.

15. forming a pattern on a substrate using the imprint method of claim 12; processing the substrate on which the pattern has been formed in the process; and producing an article from the processed substrate.

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