Substrate processing device and substrate processing method

Abstract

To provide a substrate processing device capable of reliably performing desired substrate processing.SOLUTION: A substrate processing device includes a light source 91 held in a housing 52 and in a stationary state, a light source control unit 93 that controls the light source 91 to irradiate light toward the substrate W at least while the chemical solution is being supplied, a prism 65 that has a flat upper surface and mediates the entry of light into the substrate and the emission of light from within the substrate, a light detection unit 95 held in a stationary state in the housing 52 that detects light that has been repeatedly reflected and propagated within the substrate, and an analyzer 97 that grasps the condition of the substrate surface on the basis of the detection results of the light detection unit 95.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for performing a predetermined process on a substrate. [Background technology]

[0002] Non-Patent Document 1 describes a substrate inspection method that uses infrared light to detect the condition of a substrate surface. A prism attached to the underside of one end of the substrate is in close contact with the substrate and can guide infrared light generated from a light source outside the substrate to the substrate. The infrared light guided into the substrate travels toward the other end of the substrate while undergoing repeated total reflection. A prism attached to the underside of the other end of the substrate is in close contact with the substrate and can emit the infrared light guided into the substrate to the outside of the substrate. By analyzing the infrared light that has passed through the substrate in this way, information about the substrate surface can be obtained. Therefore, this inspection method makes it possible to determine whether substrate processing has been performed sufficiently. This inspection method is useful for improving the yield of substrate processing. [Prior art documents] [Non-patent literature]

[0003] [Non-Patent Document 1] Appl. Phys. Lett. Vol. 77 2249-2251, 2000 Summary of the Invention [Problem to be solved by the invention]

[0004] However, it is difficult to fully utilize the advantages of the above-described inspection method. Currently, substrate processing involves supplying a chemical solution to a substrate and subjecting the substrate to a predetermined treatment. Adding a new inspection step to a current chemical treatment process is not easy. Adding such a step may require, for example, changing the layout of the apparatus. Furthermore, adding an inspection step to a conventional substrate treatment process would impair the speed of the substrate treatment apparatus by the time required for the inspection step. Ultimately, it would be more practical to omit the infrared light inspection and instead extend the chemical treatment time sufficiently to ensure reliable substrate treatment. Thus, the prior art has not provided a specific method for fully utilizing the advantages of an analysis method using infrared light.

[0005] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus and a substrate processing method that can reliably perform the desired substrate processing by performing analysis using light. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention has the following configuration. That is, the substrate processing apparatus of the present invention comprises: Spin base and a rotation mechanism that rotates the spin base; openable and closable chuck pins disposed on the periphery of the spin base, the chuck pins holding the substrate in a horizontal position at a distance from the spin base when closed; a chemical solution supply unit that supplies a chemical solution to the surface of the substrate that rotates integrally with the spin base; a light source fixedly mounted apart from the spin base; a photodetector fixedly mounted apart from the spin base; a prism portion that rotates integrally with the spin base, has a flat upper surface that comes into close contact with the back surface of the substrate during chemical treatment of the substrate, and mediates the entry of light into the substrate and the emission of light from the inside of the substrate; an analyzer that receives the detection result of the photodetector, the light source irradiates light toward the prism portion while the substrate is being rotated by the spin base and subjected to chemical treatment; the prism portion guides the light emitted from the light source into the inside of the substrate; the prism portion emits light that is introduced into the substrate, is repeatedly reflected, and propagates through the substrate toward the photodetector; the photodetector detects light emitted from the prism portion, The analyzer determines the state of the substrate based on the detection result of the photodetector. It is characterized by the following.

[0007] [Actions and Effects] The substrate processing apparatus described above includes a stationary light source held in a housing, a light source control unit that controls the light source to irradiate light onto the substrate at least while the chemical solution is being supplied, a prism unit with a flat upper surface that mediates the entry of light into the substrate and the exit of light from the substrate, a stationary light detection unit held in the housing that detects light that has been repeatedly reflected and propagated inside the substrate, and an analyzer that determines the condition of the substrate surface based on the detection results of the light detection unit. The substrate processing apparatus of the present invention can determine the condition of the substrate surface while performing chemical solution processing, thereby ensuring the desired substrate processing through light-based analysis.

[0008] In the above-mentioned substrate processing apparatus, It is preferable to provide a chuck opening / closing mechanism that closes the chuck pins to bring the prism portion into close contact with the rear surface of the substrate.

[0009] [Operation and Effect] The above-mentioned configuration is provided with a chuck opening and closing mechanism that closes the chuck pins to bring the prism part into close contact with the back surface of the substrate. With this configuration, the prism part can be reliably brought into close contact with the back surface of the substrate.

[0010] In the above-mentioned substrate processing apparatus, the prism portion includes at least a pair of a first prism and a second prism, the first prism has a prismatic shape and allows light emitted from the light source to enter the interior of the substrate; It is preferable that the second prism has a prismatic shape and emits light that has propagated inside the substrate from the substrate to the light detection unit.

[0011] [Actions and Effects] According to the above-described configuration, the prism unit includes at least one pair of a first prism and a second prism, the first prism being prismatic and allowing light emitted from the light source to enter the interior of the substrate, and the second prism being prismatic and allowing light propagated within the substrate to exit from the substrate to the light detection unit. With this configuration, the prism unit that mediates the entry of light into the interior of the substrate can be configured with the first prism. Similarly, the prism unit that mediates the exit of light from the interior of the substrate can be configured with the second prism. According to the above-described configuration, the substrate processing apparatus of the present invention can be easily realized.

[0012] In the above-described substrate processing apparatus, The prism portion is preferably ring-shaped and includes at least a first portion that allows light emitted from the light source to enter the interior of the substrate, and a second portion that allows light that has propagated inside the substrate to exit the substrate.

[0013] [Operations and Effects] According to the above-described configuration, the prism portion is ring-shaped and includes at least a first portion that allows light emitted from the light source to enter the inside of the substrate, and a second portion that allows light that has propagated inside the substrate to exit the substrate. According to the above-described configuration, the substrate processing apparatus of the present invention can be easily realized.

[0014] In the above-described substrate processing apparatus, It is preferable to provide a liquid supply control unit that determines the timing to terminate the supply of the chemical liquid based on the analyzer.

[0015] [Operation and Effect] According to the above-mentioned configuration, a chemical liquid control unit is provided that determines the timing to stop the chemical liquid supply based on the analyzer. With this configuration, the timing to stop the chemical liquid supply can be determined based on the state of the substrate surface ascertained by the analyzer.

[0016] In the above-described substrate processing apparatus, Preferably, the light source emits infrared light.

[0017] [Operation and Effect] According to the above-mentioned configuration, the light source emits infrared light. According to the above-mentioned configuration, a light source that emits infrared light can be used in accordance with the configuration of the analyzer.

[0018] In the above-described substrate processing apparatus, The state of the substrate surface that is detected by the analyzer is preferably a change in composition on the substrate surface.

[0019] [Operation and Effect] According to the above-mentioned configuration, the state of the substrate surface that is detected by the analyzer is a change in composition on the substrate surface. With this configuration, the substrate processing apparatus of the present invention can be easily configured.

[0020] In the above-described substrate processing apparatus, It is preferable that the analyzer grasps the state of the oxide film on the substrate surface.

[0021] [Operation and Effect] According to the above-mentioned configuration, the analyzer grasps the state of the oxide film on the substrate surface. With this configuration, the substrate processing apparatus of the present invention can be easily configured.

[0022] This specification also describes an invention relating to the following substrate processing method: The method is a substrate processing method in a substrate processing apparatus including a spin base, a rotation mechanism for rotating the spin base, openable and closable chuck pins arranged on the periphery of the spin base, which in a closed state hold a substrate in a horizontal position at a distance from the spin base, a chemical solution supply unit for supplying a chemical solution to the front surface of the substrate rotating integrally with the spin base, a light source fixedly installed at a distance from the spin base, a photodetector fixedly installed at a distance from the spin base, a prism unit that rotates integrally with the spin base, has a flat upper surface that comes into close contact with the back surface of the substrate during chemical processing of the substrate, and mediates the entry of light into the interior of the substrate and the exit of light from the interior of the substrate, and an analyzer that is given the detection results of the photodetector, a holding step of holding the substrate on the spin base via the chuck pins in an open state; a fixing step of fixing the substrate in a horizontal position to the spin base while closing the chuck pins and bringing the back surface of the substrate into close contact with the upper surface of the prism portion; a rotation start step of rotating the substrate integrally with the spin base; a light emitting step of causing the light source to emit light while the chemical solution is being supplied to the surface of the substrate; a detection step of detecting light that has been repeatedly reflected and propagated inside the substrate; and an analysis step of determining the state of the substrate surface based on the detection result of the detection step.

[0023] [Actions and Effects] According to the above-mentioned configuration, the apparatus includes a holding step in which the substrate is held on the spin base via the open chuck pins, a fixing step in which the chuck pins are closed and the substrate is fixed in a horizontal position on the spin base while the back surface of the substrate is in close contact with the upper surface of the prism portion, a rotation start step in which the substrate is rotated integrally with the spin base, an emission step in which the light source is made to emit light while the chemical solution is supplied to the surface of the substrate, a detection step in which the light that has been repeatedly reflected and propagated inside the substrate is detected, and an analysis step in which the state of the substrate surface is grasped based on the detection result of the detection step. According to the present invention, by performing analysis using light, the desired substrate processing can be reliably performed. [Effects of the Invention]

[0024] According to the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method that can reliably perform desired substrate processing by performing analysis using light. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a plan view illustrating an overall configuration of a substrate processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a functional block diagram illustrating a chemical liquid processing chamber according to an embodiment. [Figure 3] FIG. 10 is a plan view illustrating the arrangement of chuck pins according to the embodiment. [Figure 4] FIG. 2 is a perspective view illustrating the configuration of a chuck pin according to the embodiment. [Figure 5] FIG. 2 is a side view illustrating the configuration of a chuck pin according to the embodiment. [Figure 6] FIG. 2 is a cross-sectional view illustrating the configuration of a chuck pin according to the embodiment. [Figure 7] FIG. 4 is a functional block diagram illustrating the operation of the chuck pin according to the embodiment. [Figure 8] 5A and 5B are schematic diagrams illustrating the operation of a light source and a detection unit according to the embodiment. [Figure 9] 5A and 5B are schematic diagrams illustrating the operation of a light source and a detection unit according to the embodiment. [Figure 10]10A and 10B are plan views illustrating the operation of a light source and a detection unit according to the embodiment. [Figure 11] 10A and 10B are plan views illustrating the operation of a light source and a detection unit according to the embodiment. [Figure 12] 10 is a flowchart illustrating an analysis operation according to an embodiment. [Figure 13] 1 is a flowchart illustrating a flow of substrate processing in the substrate processing apparatus according to the embodiment. [Figure 14] FIG. 10 is a perspective view illustrating a modified example of the present invention. [Figure 15] FIG. 10 is a perspective view illustrating a modified example of the present invention. [Figure 16] FIG. 10 is a plan view illustrating a modified example of the present invention. [Figure 17] FIG. 10 is a side view illustrating a modified example of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0026] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate processing apparatus according to an embodiment of the present invention is a substrate cleaning apparatus for removing a native oxide film grown on the surface of a substrate. [Example]

[0027] 1. Overall structure 1 is a plan view showing the overall configuration of a substrate processing apparatus according to this embodiment. The substrate processing apparatus 1 according to this embodiment has an indexer block 3 and a processing block 5. The substrate processing apparatus 1 has a block housing 1A that houses the blocks. The block housing 1A has a substantially rectangular shape in a plan view. A load port 11 is provided to protrude from a wall surface at one end of the block housing 1A.

[0028] For convenience, in this specification, the direction in which the indexer block 3 and the processing block 5 in the substrate processing apparatus 1 are arranged is referred to as the front-to-rear direction (X direction). The X direction extends horizontally. The direction from the processing block 5 to the indexer block 3 in the substrate processing apparatus 1 is referred to as the front. The direction opposite to the front is referred to as the rear. The horizontal direction perpendicular to the X direction is referred to as the left-to-right direction (Y direction). The Y direction is also the direction in which multiple load ports 11 are arranged. For convenience, one side of the Y direction is referred to as the right, and the direction opposite to the right is referred to as the left. The height direction (Z direction) is perpendicular to both the X direction and the Y direction and coincides with the vertical direction. In each figure, front, back, right, left, top, and bottom are indicated as appropriate for reference.

[0029] 2. Indexer Block 1, the indexer block 3 includes a load port 11, which is an entrance through which a carrier C, which stores multiple substrates W in a horizontal position at predetermined intervals in the Z direction, is introduced into the block. The carrier C can be placed on the load port 11.

[0030] A plurality of substrates W (for example, 25 substrates) are stored in a stack in one carrier C. The carrier C storing unprocessed substrates W to be carried into the substrate processing apparatus 1 is first placed on the load port 11.

[0031] An indexer robot IR capable of transporting horizontally oriented substrates W one by one is disposed in the indexer block 3. The indexer robot IR can access any of the four load ports 11 and the path 34 provided at the boundary between the indexer block 3 and the processing block 5 shown in Fig. 1, and transfers substrates W between the path 34 and carriers C installed on the load ports 11. The transfer of substrates W by the indexer robot IR is achieved by a hand 36.

[0032] 3. Processing Block The processing block 5 is configured to mainly remove native oxide films grown on the surfaces of substrates W. The processing block 5 has a second column CL2 located at the rear of the path 34, a first column CL1 provided to the left of the second column CL2, and a third column CL3 provided to the right of the second column CL2. Therefore, the second column CL2 is sandwiched between the first column CL1 and the third column CL3 on the left and right.

[0033] In the first row CL1, chemical liquid processing chambers 51 each having a mechanical chuck 8 for rotatably supporting a substrate W and a nozzle 10 for supplying a chemical liquid to the substrate W are arranged in the X direction. Each chemical liquid processing chamber 51 is configured by housing the mechanical chuck 8 and the nozzle 10 in a rectangular parallelepiped housing 52. FIG. 1 illustrates how two chemical liquid processing chambers 51 are arranged in front of and behind each other in the first row CL1. The first row CL1 has a stack of chemical liquid processing chambers 51 stacked one on top of the other. The stack is configured by stacking two or more layers of chemical liquid processing chambers 51. The specific configuration of the chemical liquid processing chambers 51 will be described later.

[0034] The second row CL2 serves as a passage along which a center robot CR, which transports horizontally oriented substrates W, moves back and forth. The center robot CR can access the above-mentioned path 34 as well as the chemical liquid treatment chambers 51 in the first row CL1 and the chemical liquid treatment chambers 51 provided in the third row CL3, which will be described later.

[0035] The center robot CR is capable of moving back and forth in the X direction and moving up and down in the Z direction so as to transport the substrate W to each accessible position. The center robot CR can also face the hand 56 that holds the substrate W to any of the front, left, and right directions.

[0036] The third row CL3 has the same configuration as the first row CL1. Two chemical liquid treatment chambers 51 are arranged in the X direction in the third row CL3. The third row CL3 has a stack of chemical liquid treatment chambers 51 stacked one on top of another. The stack is formed by stacking two or more layers of chemical liquid treatment chambers 51. The specific configuration of the chemical liquid treatment chambers 51 will be described later.

[0037] 4. Chemical treatment chamber Fig. 2 illustrates the configuration of chemical liquid processing chamber 51 of the present invention. As shown in Fig. 2, chemical liquid processing chamber 51 of this example has housing 52 that forms the outer shape, and cylindrical guide 53 that extends in vertical direction Z and covers mechanical chuck 8 and nozzle 10 housed inside housing 52. Guide 53 can be moved up and down by guide lifting mechanism 54, and can be retracted from mechanical chuck 8 when substrates are transported by center robot CR.

[0038] The mechanical chuck 8 has a rotatable disk-shaped spin base 81, a rotation shaft 82 that rotates the spin base 81, and a motor 83 that drives the rotation shaft 82. The spin base 81 is configured to rotate together with the substrate W that is held in a horizontal position by the mechanical chuck 8. The rotation shaft 82 and the motor 83 correspond to the rotation mechanism of the present invention.

[0039] The chuck pins 84 are provided on the periphery of the spin base 81 and can cooperate to grip the substrate W. The chuck pins 84 are provided on the upper surface of the spin base 81, for example, six in number (see Figure 3), and are members that directly contact the substrate W held by the spin base 81. The chuck pins 84 can be opened and closed as described below. When the chuck pins 84 are in the closed state, the substrate W is locked by the chuck pins 84. When the chuck pins 84 are in the open state, the substrate W is unlocked. When the chuck pins 84 are in the closed state, they are configured to hold the substrate W in a horizontal position at a distance from the spin base 81.

[0040] The center robot CR can receive and transport the substrate W at the transfer position Pa shown in Fig. 2. Similarly, the center robot CR can place the substrate W at the transfer position Pa of the mechanical chuck 8 by transferring the substrate W to the chuck pins 84, all of which are in an extended state. Since the transfer position Pa is set above the spin base 81, the center robot CR can transfer the substrate W without colliding with the spin base 81. When the center robot CR transfers the substrate W to and from the mechanical chuck 8, the chuck opening / closing mechanism 67, which will be described later, needs to open the chuck pins 84.

[0041] When the spin base 81 rotates the substrate W, the chuck opening / closing mechanism 67 (described later) must keep the chuck pins 84 in a closed state.

[0042] As shown in FIG. 2 , the light source 91 is provided on the outer edge of the spin base 81. The light source holding member 92 is a member extending in the vertical direction Z and configured to fix the light source 91 to the housing 52. The light source 91 is fixedly installed away from the spin base 81 by the light source holding member 92. In this specification, the term "fixed installation of the light source 91" refers to the light source 91 being stationary during analysis of the surface of the substrate W. Therefore, for example, the light source 91 may be configured to move up and down together with the guide 53 when the center robot CR accesses the mechanical chuck 8. The light source control unit 93 controls the light emission state of the light source 91 by supplying or not supplying power to the light source 91. The light source control unit 93 controls the light source 91 to irradiate the substrate W with infrared light at least during the supply of the chemical solution. The light source 91 is configured to emit, for example, infrared light having a predetermined spectrum, but may instead be configured to emit a single wavelength. The light source 91 is held in the housing 52 via the light source holding member 92 and remains stationary at least during substrate processing.

[0043] The light detection unit 95 is also provided on the outer edge of the spin base 81, as shown in FIG. 2 . The detector holding member 96 is a member extending in the vertical direction Z and configured to fix the light detection unit 95 to the housing 52. The light detection unit 95 is fixedly installed away from the spin base 81 by the detector holding member 96. In this specification, the fixed installation of the light detector 95 means that it is stationary during analysis of the surface of the substrate W. Therefore, for example, the light detector 95 may be configured to move up and down together with the guide 53 when the center robot CR accesses the mechanical chuck 8. The light detection unit 95 is configured to detect infrared light that has repeatedly reflected and propagated inside the substrate. The light detection unit 95 is held in the housing 52 via the detector holding member 96 and remains stationary at least during substrate processing.

[0044] The analyzer 97 is configured to acquire an output indicating the light detection result of the light detection unit 95 and analyze the state of the substrate surface. The analyzer 97 analyzes the state of the substrate surface based on the degree of light absorption by the substrate W detected by the light detection unit 95. The analyzer 97 grasps the state of the surface of the substrate W based on the detection result of the light detection unit 95.

[0045] The light-emitting portion of the light source 91 and the light-receiving portion of the light detection portion 95 are both located below the holding position Pb of the substrate W and above the spin base 81. The light-emitting portion of the light source and the light-receiving portion of the light detection portion 95 are located opposite each other across the rotation center of the spin base 81. The light-emitting portion of the light source 91 is configured to emit light obliquely with respect to the lower surface of the substrate W, and the light-receiving portion of the light detection portion 95 is configured to receive light emitted obliquely from the lower surface of the substrate W.

[0046] As shown in FIG. 2 , the nozzle 10 includes a tip 101 extending in the vertical direction Z, and an L-shaped liquid supply pipe 102 that supplies a chemical liquid to the tip 101 and rotates the tip 101 relative to the substrate W. The base of the liquid supply pipe 102 is supported by a rotation mechanism 103 that rotates the liquid supply pipe 102 relative to the housing 52. The liquid supply control unit 104 is configured to control the amount of chemical liquid supplied to the liquid supply pipe 102 and to control whether or not the chemical liquid is discharged from the tip 101. Examples of chemical liquids that can be controlled by the liquid supply control unit 104 include hydrofluoric acid (aqueous solution of hydrofluoric acid) and pure water for rinsing. The chemical liquid processing chamber 51 of this example may be configured to have a plurality of nozzles 10 that differ depending on the type of chemical liquid. The nozzle 10 corresponds to the chemical liquid supply unit of the present invention. The nozzle 10 is configured to supply a chemical solution to the surface (upper surface) of the substrate W which is rotating integrally with the spin base 81 and is in a horizontal position.

[0047] In this embodiment, the liquid supply control unit 104 can control the supply of the chemical liquid according to the state of the substrate surface. That is, the liquid supply control unit 104 can stop the chemical liquid treatment when the native oxide film on the substrate surface has been sufficiently removed. The liquid supply control unit 104 can know the state of the substrate surface via the analyzer 97.

[0048] 5.Chuck pin 3 shows six chuck pins 84 on the spin base 81. The chuck pins 84 are arranged on the spin base 81 at positions that divide the periphery of the substrate W into six parts.

[0049] FIG. 4 specifically illustrates the configuration of the chuck pin 84. The chuck pin 84 has a lift pin 84a extending in the vertical direction Z that forms a base, and various parts located at the tips of the lift pin 84a. The base 6 is a plate-like member extending horizontally and equipped with a rotatable arm. At the tip of the arm, a guide member 64 extending in the vertical direction Z that presses against the bevel portion of the substrate W, and a holding pin 63 attached to the guide member 64 that abuts against the lower part of the substrate W, are provided. The holding pin 63 extends in the vertical direction Z like the guide member 64, but is shorter than the guide member 64 because its tip abuts against the lower part of the substrate W. Because the guide member 64 must contact the bevel portion of the substrate W, it is always positioned outside the periphery of the substrate W relative to the center of rotation of the substrate W.

[0050] The base of the base 6 is provided with a rotation pin 62 that extends in the vertical direction Z and is located at the rotation center of the base 6. The tip of the rotation pin 62 is configured to come into contact with the underside of the substrate W. A disk-shaped holding member 61 that reinforces the rotation pin 62 is provided at the base of the rotation pin 62.

[0051] FIG. 4 also illustrates the prism 65 attached to the rotation pin 62. The prism 65 is integrated with the rotation pin 62 and rotates together with the rotation pin 62. The prism 65 is located outside the substrate W relative to the rotation pin 62 because it must be located outside the substrate W. Therefore, the direction from the rotation pin 62 toward the prism 65 coincides with the direction from the holding pin 63 toward the guide member 64. The prism 65 has a triangular prism shape with a right-angled triangular side, and one side forming a right angle extends in the vertical direction Z. The other side forming a right angle extends in the horizontal direction. The other side is positioned to abut against the lower surface of the substrate W to be held. Therefore, the prism 65 has a tapered structure in which the thickness increases from bottom to top.

[0052] The prism 65 corresponds to the prism unit of the present invention. The prism 65 rotates integrally with the spin base 81, has a flat upper surface that comes into close contact with the back surface of the substrate W during chemical processing of the substrate W, and mediates the entry of infrared light into the interior of the substrate. The prism 65 also mediates the exit of infrared light from the interior of the substrate. The prism 65 is made up of a pair of first and second prisms 65a and 65b (see FIG. 8). The first prism 65a is prismatic and allows light emitted from the light source 91 to enter the interior of the substrate. The second prism 65b is prismatic and allows infrared light that has propagated inside the substrate to exit from the substrate W to the light detection unit 95.

[0053] The prism 65 can be made of single crystal silicon, single crystal germanium, or diamond.

[0054] 5 shows a comparison between a reference position P1, which corresponds to the lower surface of the substrate W to be held, and the positions of each component of the chuck pins 84. The reference position P1 is a position in the vertical direction Z on the lower surface of the substrate W gripped by the mechanical chuck 8. Specifically, the reference position P1 is a unique position of the substrate W in the vertical direction Z that is determined by the shape of the guide member 64 when each chuck pin 84 provided on the spin base 81 is in a closed state. As shown in FIG. 5, the tip of the rotation pin 62, the tip surface of the prism 65 in the vertical direction Z, and the tip of the holding pin 63 all coincide with the reference position P1.

[0055] 6 illustrates the configuration of the guide member 64. The guide member 64 has a specially designed contact surface for the substrate W so that it can press the substrate W downward and bring it into close contact with the prism 65. That is, the contact surface of the guide member 64 for the substrate W is tapered at an angle of 90° or more. Therefore, the guide member 64 becomes thinner from top to bottom. When the substrate W is held by a plurality of chuck pins 84, the substrate W comes into contact with the contact surfaces of the plurality of guide members 64. Because the contact surfaces are tapered so as to press the substrate W downward, the substrate W is pressed against the prism 65 by the guide member 84. In this way, the mechanical chuck 8 in the closed state brings the back surface of the substrate W into close contact with the prism 65.

[0056] FIG. 7 illustrates the opening and closing operation of the chuck pin 84. The chuck pin 84 can pivot about the central axis of the rotation pin 62 extending in the vertical direction Z. That is, the chuck pin 84 can be displaced between the position indicated by the dashed line and the position indicated by the solid line by pivoting. The dashed line in FIG. 7 indicates the chuck pin 84 in the open state, and the solid line indicates the chuck pin 84 in the closed state. In the open state of the chuck pin 84, the holding pin 63 and the guide member 64 are positioned away from the substrate W held by the mechanical chuck 8. At this point, it is the rotation pin 62 that holds the substrate W. The rotation pin 62 supports the lower surface of the substrate W with its tip, so that the substrate W is placed on the chuck pin 84 in the open state.

[0057] The holding pins 63 and the guide members 64 in the closed state of the chuck pins 84 come into contact with the substrate W held by the mechanical chuck 8. At this point, the tips of the holding pins 63 come into contact with the lower surface of the substrate W, and the guide members 64 come into contact with the bevel portion of the substrate W.

[0058] The opening and closing operation of the chuck pins 84 is realized by the chuck opening and closing mechanism 67. The chuck opening and closing mechanism 67 simultaneously closes all of the chuck pins 84 that are in an open state. The chuck opening and closing mechanism 67 also simultaneously opens all of the chuck pins 84 that are in a closed state. For example, when the mechanical chuck 8 receives a substrate W, the substrate W is placed on each of the chuck pins 84 that are all in an open state, and the substrate W is supported by each of the rotation pins 62. When the chuck opening and closing mechanism 67 closes each of the chuck pins 84 from this state, the mechanical chuck 8 firmly grips the substrate W. The substrate W is rotated with the chuck pins 84 in a closed state. The chuck opening and closing mechanism 67 closes the chuck pins 84 that are in an open state, thereby fixing the substrate W to the spin base 81 while bringing the prism 65 into close contact with the back surface of the substrate W.

[0059] For example, when the mechanical chuck 8 sends out the substrate W, all of the chuck pins 84 that are in the closed state are opened. Then, the mechanical chuck 8 releases the grip of the substrate W. As a result, the substrate W is placed on each of the rotation pins 62 of the chuck pins 84.

[0060] 6. Light source and light detector Next, the light source 91 and the light detection unit 95 will be described in detail. The light source 91 irradiates the bottom surface of the rotating substrate W with infrared light. When the light source 91 is positioned on the optical path of the infrared light emitted by the first prism 65a, which has approached as the substrate W rotates, the light source 91 emits infrared light, as shown in Fig. 8. The infrared light emitted to the substrate W enters the inclined surface of the first prism 65a and proceeds into the inside of the substrate W, which is closely supported by the first prism 65a.

[0061] The infrared light that enters the inside of the substrate W undergoes repeated total reflection and travels inside the substrate W. The infrared light then travels to the inside of the second prism 65b, which is positioned opposite the photodetector 95, and exits from the inclined surface of the second prism 65b. This infrared light enters the photodetector 95 and is detected there.

[0062] 8, when there is no native oxide film on the surface of the substrate W, the infrared light emitted by the light source 91 undergoes ideal total reflection repeatedly inside the substrate W, and therefore proceeds to the light detection unit 95 without being absorbed by the substrate W. The light detection unit 95 can detect that the infrared light has not been absorbed by the substrate W.

[0063] 9, when a native oxide film 7 has grown on the surface of the substrate W, the infrared light emitted by the light source 91 is repeatedly reflected while being slightly scattered due to the influence of the native oxide film 7, and travels to the photodetector 95. The photodetector 95 can detect that the infrared light has been absorbed by the substrate W. Incidentally, evanescent light is generated from the substrate surface along the optical path of the infrared light.

[0064] According to this example, infrared light can be detected by the photodetector 95 when the first prism 65a and the second prism 65b are positioned on the optical path of the infrared light, as shown in Figures 8 and 9. Since the prisms 65 are provided at six locations around the periphery of the substrate W, the photodetector 95 of this example can detect infrared light six times while the substrate W makes one rotation.

[0065] Fig. 10 shows the substrate W during rotation. As shown in Fig. 10, the light source 91 is not facing the prism 65, and furthermore, the light detection unit 95 is not facing the prism 65, so there are no two prisms 65 on the optical path of the infrared light. At this time, the light source control unit 93 stops the emission of infrared light from the light source 91. Also, the analyzer 97 stops the analysis operation based on the detection result of the light detection unit 95.

[0066] FIG. 11 also shows a rotating substrate W. According to FIG. 11, a light source 91 faces a prism 65. Each prism 65 is provided with a separate pair of prisms 65 spaced apart by the diameter of the substrate W. Therefore, when the light source 91 faces a prism 65, the pair of prisms 65 faces a light detection unit 95. In other words, according to FIG. 11, the light source 91 faces the prism 65, and the light detection unit 95 also faces the prism 65, so that the two prisms 65 are located on the optical path of the infrared light. At this time, a light source control unit 93 causes the light source 91 to emit infrared light. Furthermore, an analyzer 97 performs an analysis operation based on the detection result of the light detection unit 95.

[0067] 7. Analyzer The analyzer 97 estimates the thickness of the native oxide film on the surface of the substrate W based on the detection result of the infrared light output by the light detection unit 95. That is, the analyzer 97 estimates that the higher the absorbance of the infrared light detected by the light detection unit 95, the thicker the native oxide film on the surface of the substrate W. This is because the absorbance of infrared light increases as the native oxide film becomes thicker. The state of the substrate surface grasped by the analyzer 97 refers to changes in the composition of the substrate surface, particularly the state of the oxide film on the substrate surface. Note that, although a native oxide film is an example of an oxide film on a substrate surface, this example is not limited to this.

[0068] 8. Fluid supply control unit The liquid supply control unit 104 controls the supply of the chemical liquid to the nozzle 10 in accordance with the analysis result of the analyzer 97. That is, when the analyzer 97 estimates that the natural oxide film has disappeared while the chemical liquid is being supplied to the nozzle 10, the liquid supply control unit 104 stops the supply of the chemical liquid to the nozzle 10. In this way, the chemical liquid processing of the substrate W can be stopped immediately after the natural oxide film has disappeared, thereby shortening the time required for substrate processing. The liquid supply control unit 104 determines the timing to stop the chemical liquid supply based on the analyzer 97.

[0069] 9. Other configurations As shown in Fig. 1, the substrate processing apparatus 1 includes a control unit 131 for controlling the apparatus. Although not shown in Fig. 1, the control unit 131 is also provided with a corresponding storage unit. The control unit 131 is configured, for example, by a CPU (Central Processing Unit). The specific configuration of the control unit is not limited, and for example, each control related to the substrate processing apparatus 1 may be configured by a single processor, or each control may be configured by an individual processor.

[0070] The control related to the control unit 131 includes, for example, control related to the indexer robot IR and the center robot CR, and control related to the motor 83, the chuck pin lifting mechanism 85, the guide lifting mechanism 54, and the chuck opening and closing mechanism 67. The control unit 131 also realizes the light source control unit 93, the analysis operation of the analyzer 97, the rotation mechanism 103, and the liquid supply control unit 104 in this example.

[0071] The storage unit stores programs and parameters related to the control. The storage unit may be configured as a single device, or may be configured as individual devices corresponding to each control. Furthermore, the substrate processing apparatus 1 of this example is not particularly limited in the configuration of the device that realizes the storage unit.

[0072] 10. Analysis behavior 12 is a flowchart illustrating the process when the analyzer 97 of this example analyzes the substrate W. Each process will be described below with reference to FIG.

[0073] Step S11: The substrate W is transferred to the mechanical chuck 8, whose chuck pins 84 are in an open state. The substrate W is held by the rotation pins 62 of the chuck pins 84. The substrate W has been transported to the chemical liquid processing chamber 51 by the center robot CR. Step S11 corresponds to the holding step of the present invention. In step S11, the substrate is held on the spin base via the open chuck pins.

[0074] Step S12: The chuck opening / closing mechanism 84 simultaneously closes all of the chuck pins 84 that are in the open state. This fixes the substrate W to the spin base 81. Step S12 corresponds to the fixing step of the present invention. In step S12, the chuck pins 84 are closed, and the substrate W in a horizontal position is fixed to the spin base 81 while the back surface of the substrate W is in close contact with the upper surface of the prism 65.

[0075] Step S13: The motor 83 starts rotating the spin base 81. Since the substrate W is fixed to the spin base 81, it starts rotating together with the spin base 81. Step S13 corresponds to the rotation start step of the present invention. In step S13, the substrate W is rotated integrally with the spin base 81.

[0076] Step S14: The light source control unit 93 causes the light source 91 to start emitting infrared light. The infrared light is emitted intermittently as described in FIGS. 10 and 11. Step S14 corresponds to the light emitting step of the present invention. Step S14 is executed while the chemical solution is being supplied to the substrate surface, as will be described later. The emission of infrared light may start before or after the supply of the chemical solution is started.

[0077] Step S15: The detection unit 95 detects the intensity of the infrared light that has passed through the substrate W and the prism 65 by making it incident thereon. Step S15 corresponds to the detection step of the present invention. In step S15, the infrared light that has been repeatedly reflected and propagated inside the substrate is detected.

[0078] Step S16: The analyzer 97 estimates the state of the substrate W, such as the thickness of the native oxide film, based on the detection result of the light detection unit 95. This completes the analysis operation in the chemical liquid processing chamber 51. Step S16 corresponds to the analysis step of the present invention. In step S16, the state of the substrate surface is determined based on the detection result of step S15.

[0079] 11. Substrate processing flow Fig. 13 is a flowchart illustrating the overall operation of the substrate processing apparatus. The flowchart in Fig. 13 includes the flowchart related to the start of analysis described in Fig. 12. That is, steps S11 to S16 in Fig. 12 correspond to step T13 in Fig. 13.

[0080] Step T11: The substrate W to be treated, which has been removed from the carrier C, is transported to the chemical liquid treatment chamber 51. During this transport, the substrate is transported from the carrier C to the path 34 by the indexer robot IR. Furthermore, the substrate is transported from the path 34 to the chemical liquid treatment chamber 51 by the center robot CR. In this step, the substrate W is placed in an unfixed state on the mechanical chuck 8, which is in the open state.

[0081] Step T13: After the processes of steps S11 to S16 described above, the surface of the substrate W held by the closed mechanical chuck 8 is analyzed. As a result, the native oxide film on the substrate surface is continuously monitored by the analyzer 97.

[0082] Step T15: A chemical solution for removing the native oxide film is supplied from the nozzle 10 to the surface of the rotating substrate W. This operation gradually removes the native oxide film from the surface of the substrate W. The analyzer 97 continues to monitor the native oxide film during this time.

[0083] Step T17: It is determined whether the analyzer 97 has detected a native oxide film with a predetermined thickness. If the determination is true, the process returns to before step T17, and the supply of the chemical solution to the surface of the substrate W continues. If the determination is false, the process proceeds to step T19.

[0084] Step T19: The analyzing operation of the analyzer 97 and the infrared light detecting operation of the light detecting section 95 are ended. Accordingly, the light source control section 93 causes the light source 91 to end the emission of infrared light.

[0085] Step T21: The liquid supply control unit 104 stops the supply of the chemical liquid to the surface of the substrate W. At this point, the natural oxide film on the substrate W has sufficiently disappeared, so there is no problem in stopping the supply of the chemical liquid.

[0086] Step T23: The liquid supply control unit 104 supplies a rinse liquid to the surface of the substrate W. As a result, the chemical liquid remaining on the surface of the substrate W is washed away by the rinse liquid.

[0087] Step T25: The supply of the rinse liquid is stopped and spin drying is performed, thereby removing the rinse liquid from the substrate surface and leaving the substrate W in a dry state.

[0088] Step T27: The rotation of the substrate W is completed.

[0089] Step T29: The processed substrate W held by the mechanical chuck 8 is returned to the carrier C. During this transport, the center robot CR transports the substrate from the chemical solution processing chamber 51 to the path 34. The indexer robot IR transports the substrate from the path 34 to the carrier C. This completes the substrate processing according to this example.

[0090] 12. Effects of the present invention As described above, the substrate processing apparatus 1 described above includes the light source 91 held in the housing 52 and in a stationary state, the light source control unit 93 that controls the light source 91 to irradiate the substrate W with infrared light at least while the chemical solution is being supplied, the prism 65 that has a flat upper surface and mediates the entry of the infrared light into the substrate and the emission of the infrared light from the inside of the substrate, the light detection unit 95 held in the housing 52 and in a stationary state that detects the infrared light that has propagated through the substrate after repeated reflections, and the analyzer 97 that determines the state of the substrate surface based on the detection result of the light detection unit 95. The substrate processing apparatus 1 of the present invention can determine the state of the substrate surface while performing chemical solution processing, and therefore can reliably perform the desired substrate processing by analysis using infrared light.

[0091] According to the above-described configuration, the prism 65 includes at least a pair of a first prism 65a and a second prism 65b, where the first prism 65a allows infrared light emitted from the light source 91 to enter the inside of the substrate, and the second prism 65b allows light that has propagated inside the substrate to exit from the substrate W to the light detection unit 95. With this configuration, the prism 65 that mediates the entry of light into the inside of the substrate can be composed of the first prism 65a. Similarly, the prism 65 that mediates the exit of infrared light from the inside of the substrate can be composed of the second prism 65b.

[0092] According to the above-described configuration, there is provided a liquid supply control unit 104 that determines the timing to end the chemical liquid supply based on the analyzer 97. With this configuration, the timing to end the chemical liquid supply can be determined based on the state of the substrate surface grasped by the analyzer 97.

[0093] According to the above-described configuration, the light source 91 emits infrared light. According to the above-described configuration, the light source 91 that emits infrared light can be used in accordance with the configuration of the analyzer 97.

[0094] According to the above-described configuration, the state of the substrate surface detected by the analyzer 97 is a change in composition on the substrate surface. With this configuration, the substrate processing apparatus 1 of the present invention can be easily configured.

[0095] According to the above-mentioned configuration, the analyzer 97 grasps the state of the oxide film on the substrate surface. With this configuration, the substrate processing apparatus 1 of the present invention can be easily configured.

[0096] 13. Variations The present invention is not limited to the above-described configuration, but can be modified as follows.

[0097] <Variation 1> In the configuration of the embodiment, as shown in FIG. 4, the direction from the rotation pin 62 to the prism 65 coincides with the direction from the holding pin 63 to the guide member 64. However, the present invention is not limited to this configuration. As shown in FIG. 14, the direction from the rotation pin 62 to the prism 65 may be the opposite direction to the direction from the holding pin 63 to the guide member 64. The prism 65 has a triangular prism shape with a right-angled triangular side. One side forming a right angle extends in the vertical direction Z. The other side forming a right angle extends horizontally. The prism 65 has a tapered structure that becomes thicker from bottom to top, but the right-angled corner of the prism 65 is located away from the rotation pin 62. Therefore, the rotation pin 62 is located in contact with the acute-angled corner of the prism 65. The prism 65 is fixed to the rotation pin 62 or the holding member 61. In this way, the present invention allows the position of the prism 65 to be changed according to design requirements.

[0098] <Variation 2> In the configuration of the embodiment, the prism 65 is provided on each of the chuck pins 84, but the present invention is not limited to this configuration. As shown in FIG. 15, the prism can also be made longer than the width of the chuck pin 84. In this way, the prism can be made to have an annular shape as shown in FIG. 16. Also, in this modification, the direction from the rotation pin 62 to the prism 65 is opposite to the direction from the holding pin 63 to the guide member 64, as in the first modification. In this respect, this modification can be said to be an example that further develops the first modification.

[0099] The configuration of the chuck pin 84 in this modified example will be described with reference to Fig. 15. The base body 6 has a first surface 6a that extends linearly from the rotation pin 62, and a second surface 6b that also extends linearly from the rotation pin 62. The first surface 6a and the second surface 6b have in common that their base point is the rotation pin 62, but they extend in different directions.

[0100] The first surface 6a extends from the rotation pin 62 toward the holding pin 63 and the guide member 64. On the other hand, the second surface 6b extends obliquely from the rotation pin 62 to the first surface 6a by the width of the holding member 61. The first surface 6a and the second surface 6b intersect at the rotation pin 62, forming a predetermined obtuse angle at the intersection.

[0101] The holding member 61 in this modification is a fan-shaped member that opens at the predetermined obtuse angle described above. That is, the holding member 61 has a first end face 61a conforming to the first surface 6a described above and a second end face 61b conforming to the second surface 6b described above.

[0102] Since the rotation pin 62 in this modification can rotate in the same manner as in the embodiment, the holding pin 63 and guide member 64 provided at the tip of the base 6 also turn in accordance with the rotation of the rotation pin 62. According to Fig. 15, the holding pin 63 and guide member 64 can be displaced between the position shown by the dashed line and the position shown by the solid line. When the chuck pin 84 is in the open state, the holding pin 63 and guide member 64 are in the position shown by the dashed line. When the chuck pin 84 is in the closed state, the holding pin 63 and guide member 64 are in the position shown by the solid line.

[0103] The annular prism 65c is ring-shaped and, as shown in FIG. 16, has a center point D at the rotation center of the spin base 81, with a ring-shaped horizontal surface 65h facing in a plan view. The annular prism 65c is tapered downward, with a vertical surface 65v that is perpendicular to the horizontal surface 65h facing the center point D. In other words, the vertical surface 65v is provided inside the annular prism 65c. FIG. 15 shows a cross section CS of the annular prism 65c, which can be used as a reference for understanding the configuration of the annular prism 65c.

[0104] The predetermined obtuse angle that defines the shapes of the base 6 and the holding member 61 is set to be sufficiently close to a right angle so that the base 6 and the holding member 61 do not come into contact with the annular prism 65c when the rotation pin 62 rotates. With this configuration, even when the chuck pin 84 is in the open state, the second surface 6b and the second end face 61b do not come into contact with the annular prism 65c.

[0105] FIG. 16 shows the light source 91 irradiating the annular prism 65c with infrared light. The light source 91 irradiates the infrared light onto a first portion R1 of the annular prism 65c facing the light source 91. The annular prism 65c receives the infrared light emitted by the light source 91 at the first portion R1 and allows it to enter the interior of the substrate W. The light that enters the substrate and propagates through the interior of the substrate W passes through the center point D and reaches the second portion R2 of the annular prism 65c. The annular prism 65c receives the infrared light that propagates through the interior of the substrate W at the second portion R2 and allows it to enter the photodetector 95 located opposite the second portion R2. In this way, the first portion R1 and the second portion R2 of the annular prism 65c are positioned apart from each other by the diameter of the annular prism 65c so that the infrared light can be guided from the light source 91 to the photodetector 95.

[0106] Because the annular prism 65c rotates together with the spin base 81, the first portion R1 and the second portion R2 do not maintain constant positions on the annular prism 65c while the chemical solution is being supplied to the substrate W. The positions where the infrared light enters and exits the annular prism 65c shift on the annular prism 65c as the annular prism 65c rotates. However, because the first portion R1 is determined by its positional relationship with the light source 91 in a stationary state, the positional relationship between the light source 91 and the first portion R1 does not change regardless of the rotation of the annular prism 65c. Similarly, because the second portion R2 is determined by its positional relationship with the light detector 95 in a stationary state, the positional relationship between the light detector 95 and the second portion R2 does not change regardless of the rotation of the annular prism 65c.

[0107] According to the above-described configuration, the annular prism 65c includes at least a first portion R1 that allows infrared light emitted from the light source 91 to enter the inside of the substrate, and a second portion R2 that allows infrared light that has propagated inside the substrate to exit the substrate W. According to the above-described configuration, it is possible to continuously detect absorption of infrared light in the substrate W. Unlike the embodiment, according to this modification, even if the substrate W rotates, the first portion R1 of the annular prism 65c always faces the light source 91, and the second portion R2 of the annular prism 65c always faces the light detection unit 95.

[0108] As shown in FIG. 17 , the annular prism 65c is supported by a ring holder 69 provided on the spin base 81. Therefore, the annular prism 65c is configured to rotate integrally with the spin base 81. The ring holder 69 is integrated with the annular prism 65c through a vertical surface 65v. Therefore, the ring holder 69 is located closer to the center point D of the annular prism 65c than the vertical surface 65v. The multiple ring holders 69 are provided on an imaginary circle based on the center point D. The radius of the imaginary circle is smaller than the radius of the annular prism 65c. Because the ring holders 69 are provided avoiding the inclined surface of the annular prism 65c, which corresponds to the optical path, they do not interfere with the incidence of infrared light on the annular prism 65c or the emission of infrared light from the annular prism 65c.

[0109] <Variation 3> In the present invention, the light source 91 emits infrared light that is partially scattered by a native oxide film on the surface of the substrate W, but the present invention is not limited to this configuration. The wavelength of the light emitted by the light source 91 and the wavelength of the light detected by the light detection unit 95 can be changed as appropriate depending on the purpose. [Explanation of symbols]

[0110] 1. Substrate processing equipment 1A Block Housing 3 Indexer Blocks 5 Processing Blocks 6 Base 6a 1st page 6b 2nd side 7. Native oxide film 8 Mechanical chuck 10 nozzles 11 Loading Port 34 Pass 36 hands 51 Chemical treatment chamber 52 Case 53 Guide 54 Guide lifting mechanism 56 hands 61 Retaining member 61a 1st end face 61b 2nd end face 62 Rotating Pin 63 Retaining pin 64 Guide member 65 Prism 65a First Prism 65b Second Prism 65c Annular Prism 65h horizontal plane 65v vertical surface 67 Zipper opening and closing mechanism 69 Ring retaining member 81 Spinbase 82 Rotation axis 83 Motor 84 Zipper Pin 84a Lifting pin 85 Chuck pin lifting mechanism 91 Light source 92 Light source holding member 93 Light source control unit 95 Light detection unit 96 Detector holding member 97 Analyzer 101 Tip 102 Liquid supply pipe 103 Rotating mechanism 104 Liquid supply control unit 131 Control Unit C Carrier CL1 1st row CL2 2nd row CL3 3rd row CR Center Robot CS cross section D center point IR Indexer Robot P1 reference position R1 1st part R2 2nd part W substrate

Claims

1. Spin base and a rotation mechanism that rotates the spin base; openable and closable chuck pins disposed on the periphery of the spin base, the chuck pins holding the substrate in a horizontal position at a distance from the spin base when closed; a chemical solution supply unit that supplies a chemical solution to the surface of the substrate that rotates integrally with the spin base; a light source fixedly mounted apart from the spin base; a photodetector fixedly mounted apart from the spin base; a prism portion that rotates integrally with the spin base, has a flat upper surface that comes into close contact with the back surface of the substrate during chemical treatment of the substrate, and mediates the entry of light into the substrate and the emission of light from the substrate; an analyzer that receives the detection result of the photodetector, the light source irradiates light toward the prism portion while the substrate is being rotated by the spin base and subjected to chemical treatment; the prism portion guides the light emitted from the light source into the inside of the substrate; the prism portion emits light that is introduced into the substrate, is repeatedly reflected, and propagates through the substrate toward the photodetector; the photodetector detects light emitted from the prism portion, The analyzer determines the state of the substrate based on the detection result of the photodetector. A substrate processing apparatus characterized by:

2. 2. The substrate processing apparatus according to claim 1, A chuck opening / closing mechanism is provided to close the chuck pins and thereby bring the prism part into close contact with the rear surface of the substrate. A substrate processing apparatus characterized by:

3. 2. The substrate processing apparatus according to claim 1, the prism portion includes at least a pair of a first prism and a second prism, the first prism has a prismatic shape and allows light emitted from the light source to enter the interior of the substrate; The second prism has a prismatic shape and emits light that has propagated inside the substrate from the substrate to the light detection unit. A substrate processing apparatus characterized by:

4. 2. The substrate processing apparatus according to claim 1, The prism portion is ring-shaped and includes at least a first portion that allows light emitted from the light source to enter the inside of the substrate, and a second portion that allows light that has propagated inside the substrate to exit the substrate. A substrate processing apparatus characterized by:

5. 2. The substrate processing apparatus according to claim 1, A liquid supply control unit is provided that determines the timing to stop supplying the chemical liquid based on the analyzer. A substrate processing apparatus characterized by:

6. 2. The substrate processing apparatus according to claim 1, The light source emits infrared light. A substrate processing apparatus characterized by:

7. 2. The substrate processing apparatus according to claim 1, The state of the substrate surface that is detected by the analyzer is a change in the composition of the substrate surface. A substrate processing apparatus characterized by:

8. 7. The substrate processing apparatus according to claim 6, The analyzer determines the state of the oxide film on the substrate surface. A substrate processing apparatus characterized by:

9. a light source fixed and installed apart from the spin base; a photodetector fixed and installed apart from the spin base; a prism unit that rotates integrally with the spin base, has a flat upper surface that comes into close contact with a back surface of the substrate during chemical solution processing of the substrate, and mediates the entry of light into the interior of the substrate and the exit of light from the interior of the substrate; and an analyzer that is given the detection results of the photodetector, a holding step of holding the substrate on the spin base via the chuck pins in an open state; a fixing step of fixing the substrate in a horizontal position to the spin base while closing the chuck pins and bringing the back surface of the substrate into close contact with the upper surface of the prism portion; a rotation start step of rotating the substrate integrally with the spin base; a light emitting step of causing the light source to emit light while the chemical solution is being supplied to the surface of the substrate; a detection step of detecting light that has been repeatedly reflected and propagated inside the substrate; an analysis step of determining the state of the substrate surface based on the detection result of the detection step; A substrate processing method comprising:

Images