Wiring board and wiring member

Abstract

To provide a wiring board and a wiring member capable of suppressing corrosion of a wiring layer and peeling of an insulating layer by making it difficult for a chemical solution to enter between the insulating layer and the wiring layer.SOLUTION: The wiring layer 102 includes a connection wiring portion 113 between the wiring portion 111 and the pad portion 112. The connection wiring portion 113 includes a plurality of connection wirings 121. Each of the connection wirings 121 is separated by the plurality of holes 122. In the wiring portion 102, a plurality of hole portions 122 are formed such that a conductor region including the plurality of connection wirings 121 has a mesh structure in the connection wiring portion 113. At least one connection wiring 121 and at least one hole portion 122 can be arranged on a linear band connecting the connection area arranged on the wiring portion 111 side and the connection area arranged on the pad portion 112 side.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a wiring board and a wiring member. [Background technology]

[0002] Known wiring substrates for mounting semiconductors include semiconductor package substrates and printed circuit boards. After forming a wiring circuit pattern on a substrate, the wiring circuit is insulated and protected with solder resist, and land portions for mounting the semiconductor are formed. The land portions are also called pad portions. A solder mask defined (SMD) structure is known as a land portion. For such wiring substrates, techniques have been proposed to suppress peeling between the insulating layer and the wiring layer due to deterioration over time. For example, Patent Document 1 discloses a rewiring layer in which an outer shell portion is formed around the land portion. In this structure, the sealing insulating layer and the interlayer insulating layer are joined in the gap between the land portion and the outer shell portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-34988 Summary of the Invention [Problem to be solved by the invention]

[0004] For the land portion of an SMD structure, a solder resist layer, which is an insulating layer, is formed on the land, and then an opening is formed in the solder resist layer to expose part of the land as copper wiring. The surface of the land exposed by the opening is etched, and a protective plating process is applied to the land. Examples of protective plating processes include electroless Ni plating / electroless nickel immersion gold (ENIG). Peeling between the wiring layer and the insulating layer occurs not only due to deterioration over time, but also during processing processes such as the protective plating formed on the land.

[0005] Specifically, as shown in the cross-section PA01 and plan view PB01 in FIG. 13, an opening 703A is formed in the insulating layer 703 to expose a portion of the wiring layer 702 constituting the copper wiring. Then, etching, performed as a pretreatment for the protective plating process, generates stresses, such as undercuts 711 in the wiring layer 702 constituting the copper wiring and immersion in various chemical solutions at the joint 712A, as shown in the cross-section PA02 and plan view PB02 in FIG. 13. This can cause peeling between the insulating layer and the wiring layer, leading to infiltration of various chemical solutions and contamination at the peeled portion, resulting in surface deterioration of the copper wiring. In worse cases, this can lead to defects due to peeling of the insulating layer, corrosion of the copper wiring, or breakage. As shown in the cross-section PA03 and plan view PB03 in FIG. 13, peeling and surface deterioration at the joint 712B can continue to worsen even after the Ni layer 721 and Au layer 722 are formed by the protective plating process.

[0006] The present disclosure has been made in consideration of the above-mentioned circumstances, and aims to provide a wiring board and wiring member that make it difficult for chemical solutions to penetrate between the insulating layer and the wiring layer, thereby suppressing corrosion of the wiring layer and peeling of the insulating layer. [Means for solving the problem]

[0007] The wiring board according to the first aspect of the present disclosure includes: A support substrate; a wiring layer formed on the support substrate and having main wiring and electrical contacts; an insulating layer having an opening formed in at least a part of the electrical contact and covering the wiring layer; a protective plating layer formed on the surface of the electrical contact corresponding to the opening, the wiring layer includes a connection region between the main wiring and the electrical contact; The linking region is a plurality of first connecting portions arranged on the side of the main wiring; a plurality of second connecting portions disposed on the side of the electrical contacts; At least one conductive region and at least one non-conductive region can be arranged on a linear band connecting one of the first connecting portions and one of the second connecting portions.

[0008] The wiring member according to the second aspect of the present disclosure includes: The main wiring and An electrical contact; a coupling region provided between the main wiring and the electrical contact; The linking region is a plurality of first connecting portions arranged on the side of the main wiring; a plurality of second connecting portions disposed on the side of the electrical contacts; At least one conductive region and at least one non-conductive region can be arranged on a linear band connecting one of the first connecting portions and one of the second connecting portions. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to provide a wiring board and a wiring member that make it difficult for a chemical solution to penetrate between an insulating layer and a wiring layer, thereby suppressing corrosion of the wiring layer and peeling of the insulating layer. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a plan view showing an example of the configuration of a main part of a wiring board according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line A1-A1 shown in FIG. [Figure 3] 1A is a plan view of a comparative example in which the wiring layer has a narrow wiring width, and FIG. 1B is a cross-sectional view taken along line B1-B1. [Figure 4] 1A is a plan view of another comparative example in which the wiring layer has a wide wiring width, and FIG. 1B is a cross-sectional view taken along line B2-B2. [Figure 5] FIG. 2 is an enlarged plan view of a connecting wiring portion. [Figure 6] FIG. 10 is an enlarged plan view of the connecting wiring portion from another perspective. [Figure 7]10A and 10B are diagrams illustrating an example of the configuration of a wiring portion having a land portion formed at an end portion thereof; [Figure 8] FIG. 10 is a plan view of a wiring board according to a second embodiment. [Figure 9] FIG. 10 is a plan view of a wiring board according to a third embodiment. [Figure 10] FIG. 10 is a plan view of a wiring board according to a fourth embodiment. [Figure 11] FIG. 10 is a plan view of a wiring board according to a fifth embodiment. [Figure 12] FIG. 10 is a plan view of a wiring board according to a sixth embodiment. [Figure 13] 1A and 1B are cross-sectional views and a plan view for explaining a problem to be solved; DETAILED DESCRIPTION OF THE INVENTION

[0011] [Embodiment 1] In this embodiment, a semiconductor package substrate on which a semiconductor element is mounted will be described as an example of the wiring substrate 100. Fig. 1 is a plan view showing an example of the configuration of a main part of the wiring substrate 100 according to one embodiment. Fig. 2 is a cross-sectional view taken along line A1-A1 in Fig. 1. In Figs. 1 and 2, positions P1 to P7 correspond one-to-one.

[0012] The wiring substrate 100 includes a support substrate 101, a wiring layer 102, an insulating layer 103, and a protective plating layer 104. The support substrate 101 is made of, for example, a glass substrate, a SiN film, a SiO film, an organic film, or any other substrate material. The wiring layer 102 is made of, for example, Cu or any other conductor. The insulating layer 103 is made of, for example, polyimide or any other insulating material.

[0013] The wiring layer 102 is formed on a support substrate 101. The wiring layer 102 includes a wiring portion 111 as a main wiring. The wiring layer 102 includes a pad portion 112 as an electrical contact. A metal base layer (not shown) may be formed between the support substrate 101 and the wiring layer 102. The pad portion 112 is an SMD terminal, and the pad area is defined by an opening 103A formed in the insulating layer 103. The pad portion 112 may have a square shape with rounded corners or other rounded corners.

[0014] The width W1 of the wiring portion 111 is equal to or slightly narrower than the width W2 of the pad portion 112 at a position close to the pad portion 112. For example, the width W1 of the wiring portion 111 may be equal to or less than the width W2 of the pad portion 112. To prevent disconnection due to stress concentration, the wiring portion 111 may have a wide wiring, such as a teardrop shape, between the wiring portion 111 and the pad portion 112, in which the width W1 of the wiring portion 111 gradually widens toward the pad portion 112.

[0015] The insulating layer 103 covers the wiring layer 102, and has an opening 103A formed therein to expose at least a portion of the pad portion 112. The protective plating layer 104 is formed on the surface of the pad portion 112 corresponding to the opening 103A by, for example, an ENIG treatment or any other plating treatment. Note that in Figure 2, the undercut of the wiring layer 102 occurring near the edge of the opening 103A and the shape of the protective plating layer 104 in that area are not shown.

[0016] While the insulating layer 103 is closely fixed to the support substrate 101, its adhesion to the wiring layer 102 tends to weaken. In this case, the insulating layer 103 becomes more likely to peel off as the wiring width in the wiring layer 102 increases relative to the position where the support substrate 101 and the insulating layer 103 are closely fixed. The difference in the coefficient of thermal expansion (CTE) of a metal such as Cu that constitutes the wiring layer 102 and the coefficient of thermal expansion of a material such as resin that constitutes the insulating layer 103 has an effect that causes the contact surfaces of the wiring layer 102 and the insulating layer 103 to peel off when a temperature change occurs.

[0017] As a comparative example, FIG. 3A is a plan view of a wiring layer 102 having a narrow wiring width WW1 as the width W1 of the wiring portion 111. FIG. 3B is a cross-sectional view taken along line B1-B1 in FIG. 3A. In this case, the insulating layer 103 is tightly fixed to the support substrate 101 at positions GP1 and GP2 across the wiring layer 102. When the thermal expansion coefficient of Cu constituting the wiring layer 102 is 18 ppm and the thermal expansion coefficient of the material constituting the insulating layer 103 is 55 ppm, the thermal expansion amount E01 of the insulating layer 103 due to a temperature rise is greater than the thermal expansion amount E02 of the wiring layer 102. However, due to the narrow wiring width WW1, little strain occurs at the contact surface between the wiring layer 102 and the insulating layer 103, and the stress acting on the contact surface is small.

[0018] As another comparative example, FIG. 4A is a plan view of a wiring layer 102 in which the width W1 of the wiring portion 111 is a wiring width WW2 that is wider than the wiring width WW1. FIG. 4B is a cross-sectional view taken along line B2-B2 in FIG. 4A. In this case, the insulating layer 103 is tightly fixed to the support substrate 101 at positions GQ1 and GQ2 that straddle the wiring layer 102. When the thermal expansion coefficients are the same as those in FIGS. 3A and 3B, the thermal expansion amount E11 of the insulating layer 103 due to a temperature rise is significantly greater than the thermal expansion amount E12 of the wiring layer 102. This causes large stresses to act on the contact surfaces between the wiring layer 102 and the insulating layer 103, making it more likely that minute gaps will form due to peeling.

[0019] For example, in the ENIG process, the process temperature is about 90 degrees Celsius. As shown in Figures 4(A) and 4(B), when the wiring layer 102 has a wide wiring width WW2, the penetration of a chemical solution such as an etching solution into minute gaps generated at the contact surface between the wiring layer 102 and the insulating layer 103 is accelerated. In such a structure, the chemical solution easily penetrates along the surface of the wiring layer 102 from the pad portion 112 side toward the wiring portion 111 side.

[0020] In contrast, the wiring layer 102 in this embodiment includes a connecting wiring portion 113 as a connecting region between the wiring portion 111 and the pad portion 112. The width W3 of the connecting wiring portion 113 is equal to or less than the width W2 of the pad portion 112. Meanwhile, the width W3 of the connecting wiring portion 113 is close to the width W1 of the wiring portion 111 to prevent stress concentration. The connecting wiring portion 113 may be included in the teardrop shape of the wiring portion 111. For example, the width W3 of the connecting wiring portion 113 may be approximately 140 μm. The connecting wiring portion 113 includes a plurality of connecting wires 121. Each connecting wire 121 is a conductive region separated by a plurality of holes 122. Each hole 122 is an opening formed in the wiring layer 102 and is a non-conductive region filled with the material of the insulating layer 103. In this manner, the non-conductive region may include a plurality of holes 122. Each hole 122 may have a rectangular shape. The insulating layer 103 is bonded to the support substrate 101 at the bottom of each hole 122. The wiring layer 102 has a plurality of holes 122 formed therein so that the conductor region including the plurality of connecting wires 121 forms a mesh structure in the connecting wiring portion 113. Each connecting wire 121 has a wiring width that is sufficiently narrower than the width W3 of the connecting wiring portion 113.

[0021] 5 is an enlarged plan view of the connecting wiring portion 113. The connecting wiring portion 113 shown in FIG. 5 includes a plurality of connecting wirings 121A1-121A3, 121B1-121B4, 121C1-121C3, and 121D1-121D4. The connecting wirings 121A1 and 121A2 are separated by a hole 122A1. The connecting wirings 121A2 and 121A3 are separated by a hole 122A2. The connecting wirings 121B1 and 121B2 are separated by a hole 122B1. The connecting wirings 121B2 and 121B3 are separated by a hole 122B2. The connecting wirings 121B3 and 121B4 are separated by a hole 122B3. The connecting wires 121C1 and 121C2 are separated by a hole 122C1. The connecting wires 121C2 and 121C3 are separated by a hole 122C2. The connecting wires 121D1 and 121D2 are separated by a hole 122D1. The connecting wires 121D2 and 121D3 are separated by a hole 122D2. The connecting wires 121D3 and 121D4 are separated by a hole 122D3.

[0022] Furthermore, connecting wire 121A1 is formed between hole 122A1 and notched portion 124A1 where wiring layer 102 has been removed. Connecting wire 121A3 is formed between hole 122A2 and notched portion 124A2 where wiring layer 102 has been removed. Connecting wire 121C1 is formed between hole 122C1 and notched portion 124C1 where wiring layer 102 has been removed. Connecting wire 121C3 is formed between hole 122C2 and notched portion 124C2 where wiring layer 102 has been removed. Each of notched portions 124A1, 124A2, 124C1, and 124C2 is a notch formed at an end of wiring layer 102 and is a non-conductive region filled with the material of insulating layer 103. In this manner, the non-conductive region may include a plurality of notched portions 124, such as notched portions 124A1, 124A2, 124C1, and 124C2. The insulating layer 103 is bonded to the support substrate 101 at the bottom surface of each of the notched portions 124A1, 124A2, 124C1, and 124C2.

[0023] The connecting wiring unit 113 includes a plurality of connecting areas 123A1-123A3 as a plurality of first connecting portions, which are arranged on the side of the wiring unit 111. In the connecting area 123A1, one end of the connecting wiring 121A1 is connected to the wiring unit 111. In the connecting area 123A2, one end of the connecting wiring 121A2 is connected to the wiring unit 111. In the connecting area 123A3, one end of the connecting wiring 121A3 is connected to the wiring unit 111. In this way, one ends of the connecting wirings 121A1-121A3 are directly connected to the wiring unit 111.

[0024] The other ends of the connecting wires 121A1 to 121A3 are connected to one ends of the connecting wires 121B1 to 121B4 via bent paths indicated by dashed lines 125A. The other ends of the connecting wires 121B1 to 121B4 are connected to one ends of the connecting wires 121C1 to 121C3 via bent paths indicated by dashed lines 125B. The other ends of the connecting wires 121C1 to 121C3 are connected to one ends of the connecting wires 121D1 to 121D4 via bent paths indicated by dashed lines 125C.

[0025] The other ends of the connecting wires 121D1 to 121D4 are directly connected to the pad unit 112. The connecting wire unit 113 includes a plurality of connecting areas 123B1 to 123B4 as a plurality of second connecting units arranged on the side of the pad unit 112. In the connecting area 123B1, the other end of the connecting wire 121D1 is connected to the pad unit 112. In the connecting area 123B2, the other end of the connecting wire 121D2 is connected to the pad unit 112. In the connecting area 123B3, the other end of the connecting wire 121D3 is connected to the pad unit 112. In the connecting area 123B4, the other end of the connecting wire 121D4 is connected to the pad unit 112.

[0026] The holes 122A1 and 122A2 are alternately arranged with the holes 122B1 to 122B3 across the bent path indicated by the dashed line 125A. The holes 122B1 to 122B3 are alternately arranged with the holes 122C1 and 122C2 across the bent path indicated by the dashed line 125B. The holes 122C1 and 122C2 are alternately arranged with the holes 122D1 to 122D3 across the bent path indicated by the dashed line 125C. Therefore, the connecting wiring portion 113 has a plurality of connecting wires 121 as conductive regions of a mesh structure and a plurality of holes 122 as non-conductive regions that form the mesh portion, which are formed in a staggered manner.

[0027] The multiple connecting wirings 121A1-121A3 are arranged so that their midpoints are aligned on the same line along the vertical direction or column direction DC, which is the first direction in Fig. 5. The multiple connecting wirings 121B1-121B4 are arranged so that their midpoints are aligned on the same line along the vertical direction or column direction DC, which is the first direction in Fig. 5. The multiple connecting wirings 121C1-121C3 are arranged so that their midpoints are aligned on the same line along the vertical direction or column direction DC, which is the first direction in Fig. 5. The multiple connecting wirings 121D1-121D4 are arranged so that their midpoints are aligned on the same line along the vertical direction or column direction DC, which is the first direction in Fig. 5.

[0028] Therefore, one of the connecting wirings 121A1-121A3 and another of the connecting wirings adjacent thereto are formed so that their midpoints are located on the same line in the first direction. One of the connecting wirings 121B1-121B4 and another of the connecting wirings adjacent thereto are formed so that their midpoints are located on the same line in the first direction. One of the connecting wirings 121C1-121C3 and another of the connecting wirings adjacent thereto are formed so that their midpoints are located on the same line in the first direction. One of the connecting wirings 121D1-121D4 and another of the connecting wirings adjacent thereto are formed so that their midpoints are located on the same line in the first direction.

[0029] The plurality of connecting wirings 121A1-121A3 are arranged such that their center lines are parallel to but different from the plurality of connecting wirings 121B1-121B4 adjacent to them via bent paths indicated by dashed lines 125A in the horizontal or row direction DR, which is the second direction in Fig. 5. For example, the center line of the connecting wiring 121A1 is parallel to and equidistant from the center lines of the connecting wirings 121B1 and 121B2. The plurality of connecting wirings 121B1-121B4 are arranged such that their center lines are parallel to but different from the plurality of connecting wirings 121C1-121C3 adjacent to them via bent paths indicated by dashed lines 125B in the horizontal or row direction DR, which is the second direction in Fig. 5. The plurality of connecting wires 121C1 to 121C3 are arranged such that their center lines are aligned on different lines parallel to the plurality of adjacent connecting wires 121D1 to 121D4 via bent paths indicated by dashed lines 125C in the horizontal or row direction DR, which is the second direction in Fig. 5. Therefore, in the connecting wiring portion 113 of the wiring layer 102, the plurality of connecting wires 121 as conductor regions with a mesh structure are formed aligned on the same line in the first direction, while the plurality of adjacent connecting wires 121 are formed alternately in the second direction.

[0030] FIG. 6 is an enlarged plan view of the connecting wiring portion 113 from another perspective. In FIG. 6, line segments L11 to L14 are shown connecting a point in the connecting area 123A1 included in the plurality of first connecting portions to a point in each of the connecting areas 123B1 to 123B4 included in the plurality of second connecting portions. One end point of the line segment L11 is included in the connecting area 123A1 and the other end point is included in the connecting area 123B1. One end point of the line segment L12 is included in the connecting area 123A1 and the other end point is included in the connecting area 123B2. One end point of the line segment L13 is included in the connecting area 123A1 and the other end point is included in the connecting area 123B3. One end point of the line segment L14 is included in the connecting area 123A1 and the other end point is included in the connecting area 123B4.

[0031] Line segment L11 passes through connecting wiring 121A1 and connecting wiring 121D1, which are conductive regions, between a point on connecting area 123A1 and a point on connecting area 123B1. Line segment L11 also passes through hole 122B1 and notched portion 124C1, which are non-conductive regions. Therefore, connecting wiring 121A1 and connecting wiring 121D1, which are conductive regions, and hole 122B1 and notched portion 124C1, which are non-conductive regions, are located on line segment L11 between a point on connecting area 123A1 and a point on connecting area 123B1.

[0032] Line segment L12 passes through connecting wiring 121A1 and connecting wiring 121D2, which are conductive regions, between a point on connecting area 123A1 and a point on connecting area 123B2. Line segment L12 also passes through holes 122B1 and 122C1, which are non-conductive regions. Therefore, connecting wiring 121A1 and connecting wiring 121D2, which are conductive regions, and holes 122B1 and 122C1, which are non-conductive regions, are located on line segment L12 connecting a point on connecting area 123A1 and a point on connecting area 123B2.

[0033] Line segment L13 passes through connecting wiring 121A1, connecting wiring 121B2, connecting wiring 121C2, and connecting wiring 121D3, which are conductive regions, between a point on connecting area 123A1 and a point on connecting area 123B3. Line segment L13 also passes through holes 122A1 and 122D2, which are non-conductive regions. Therefore, connecting wiring 121A1, connecting wiring 121B2, connecting wiring 121C2, and connecting wiring 121D3, which are conductive regions, and holes 122A1 and 122D2, which are non-conductive regions, are located on line segment L13 connecting a point on connecting area 123A1 and a point on connecting area 123B3.

[0034] Line segment L14 passes through connecting wiring 121A1 and connecting wiring 121D4 as conductive regions between a point on connecting area 123A1 and a point on connecting area 123B4. Line segment L14 also passes through holes 122A1, 122B2, 122C2, and 122D3 as non-conductive regions. Therefore, connecting wiring 121A and connecting wiring 121D4 as conductive regions and holes 122A1, 122B2, 122C2, and 122D3 as non-conductive regions are located on line segment L14 connecting a point on connecting area 123A1 and a point on connecting area 123B4.

[0035] Similarly, for multiple line segments connecting a point on connecting area 123A2 included in the multiple first connecting portions to a point on each of connecting areas 123B1-123B4 included in the multiple second connecting portions, at least one conductive region and at least one non-conductive region are arranged on each line segment. Similarly, for multiple line segments connecting a point on connecting area 123A3 included in the multiple first connecting portions to a point on each of connecting areas 123B1-123B4 included in the multiple second connecting portions, at least one conductive region and at least one non-conductive region are arranged on each line segment. In this way, connecting wiring unit 113 can have at least one conductive region and at least one non-conductive region arranged on a line segment connecting a point on one first connecting portion to a point on one second connecting portion.

[0036] The connecting wiring portion 113 has a plurality of holes 122 formed therein so that the conductor region including the plurality of connecting wirings 121 has a mesh structure. The width W11 of each connecting wiring 121 is preferably 30 μm or less, such as 20 μm. Each hole 122 is preferably formed in a square shape. The length E11 of each side of each hole 122 is preferably 10 μm or more, such as 20 μm. However, the aspect ratio of the length E11 to the thickness of the insulating layer 103 is preferably 1 or less. For example, if the thickness of the insulating layer 103 is 10 μm, each hole 122 may be formed so that the length E11 is 10 μm or more. In the curved paths indicated by the dashed lines 125A to 125C, the width W12 is preferably 30 μm or less, such as 15 μm. The bent path may have a width narrower than or equal to the width of the connecting wiring 121. In the connecting wiring portion 113, the length LL1 between the wiring portion 111 and the pad portion 112 is preferably 100 μm or more so that peeling does not reach the wiring portion 111. The distance between positions P3 and P4 shown in FIGS. 1 and 2 is preferably the same as the width W12.

[0037] Because the multiple connecting wires 121 have width W11, the connecting areas 123A1-123A3 and the connecting areas 123B1-123B4 each have a predetermined width extending from a point at the top of the corresponding curly bracket shown in FIG. 6 to a point at the bottom. Multiple line segments connecting a point on each of the multiple connecting areas 123A1-123A3 located on the wiring portion 111 side to a point on each of the connecting areas 123B1-123B4 located on the pad portion 112 side may not pass through a non-conductive area, depending on the positions of their endpoints. For example, between the connecting area 123A1 and the connecting area 123B3 shown in FIG. 6, in addition to line segment L13, a line segment can be set that passes through the connecting wires 121A1, 121B2, 121C2, and 121D3 but does not pass through any non-conductive area. In this case, at least one conductive region and at least one non-conductive region may be arranged on straight line band Z13, shown in gray, connecting connecting area 123A1 and connecting area 123B3. Straight line band Z13 shown in Fig. 6 is formed between a line connecting the upper end points of connecting area 123A1 and connecting area 123B3 and a line connecting the lower end points of connecting area 123A1 and connecting area 123B3. Additionally, the line extending from the upper end point to the lower end point of connecting area 123A1 and the line extending from the upper end point to the lower end point of connecting area 123B3 form two sides at both ends of straight line band Z13. Thus, the multiple straight line bands connecting the multiple connection areas 123A1-123A3 arranged on the wiring portion 111 side as the multiple first connection portions and the multiple connection areas 123B1-123B4 arranged on the pad portion 112 side as the multiple second connection portions are all strip-shaped regions formed between a straight line connecting the upper end points and a straight line connecting the lower end points of one of the connection areas 123A1-123A3 arranged on the wiring portion 111 side and one of the connection areas 123B1-123B4 arranged on the pad portion 112 side. Each straight line band is a strip-shaped region whose two sides are formed by a straight line from the upper end point to the lower end point of one of the connection areas 123A1-123A3 arranged on the wiring portion 111 side and a straight line from the upper end point to the lower end point of one of the connection areas 123B1-123B4 arranged on the pad portion 112 side.

[0038] Alternatively, the plurality of straight line bands connecting the plurality of connecting areas 123A1-123A3 arranged on the wiring portion 111 side as the plurality of first connecting portions and the plurality of connecting areas 123B1-123B4 arranged on the pad portion 112 side as the plurality of second connecting portions may include one or more straight line bands in which no non-conductor region is arranged. However, among the plurality of straight line bands connecting the plurality of connecting areas 123A1-123A3 and the plurality of connecting areas 123B1-123B4, at least one conductor region and at least one non-conductor region may be arranged on at least one straight line band in which the distance between the wiring portion 111 and the pad portion 112 is shortest, or on two or more straight line bands in which the distance between the wiring portion 111 and the pad portion 112 is relatively short. Therefore, at least one conductive region and at least one non-conductive region may be arranged on all or part of the multiple linear bands connecting the multiple connecting areas 123A1-123A3 included in the multiple first connecting portions and the multiple connecting areas 123B1-123B4 included in the multiple second connecting portions. In this case, the non-conductive region that can be arranged on the linear band may be the entirety of at least one continuous non-conductive region, or may be part of at least one continuous non-conductive region. For example, a portion of at least one continuous non-conductive region, such as one hole 122A1, may be arranged on the linear band, and another portion of this continuous non-conductive region may be arranged on wiring portion 111 or pad portion 112 together with connecting wiring portion 113 that is not on the linear band, or may be arranged only on connecting wiring portion 113.

[0039] In connecting wiring portion 113, non-conductor regions including multiple holes 122 can be arranged on a line segment connecting a point on each of connecting areas 123A1-123A3 on the wiring portion 111 side and a point on each of connecting areas 123B1-123B4 on the pad portion 112 side. Multiple connecting wires 121 can connect wiring portion 111 and pad portion 112 via bent paths indicated by dashed lines 125A-125C. This lengthens or narrows the path through which a chemical solution such as an etching solution permeates in connecting wiring portion 113, making it difficult for the chemical solution to penetrate wiring layer 102.

[0040] In the connecting wiring portion 113, the multiple connecting wires 121 included in the conductor region have a width W11 that is sufficiently smaller than the width W3 of the connecting wiring portion 113. The multiple holes 122 are filled with the material of the insulating layer 103, and the support substrate 101 and the insulating layer 103 are bonded at their bottom surfaces. This makes it difficult for the insulating layer 103 to peel off from the wiring layer 102 in the connecting wiring portion 113, and the wiring layer 102 to be penetrated by a chemical solution.

[0041] FIG. 7 shows the shape of a land portion 14 disclosed in Patent Document 1. The wiring portion 13 shown in FIG. 7 has a land portion 14 formed at its end. An outer shell 15 is formed away from the land portion 14 so as to surround the periphery of the land portion 14. Multiple insulating layers are joined in a gap 16 between the land portion 14 and the outer shell 15. In this way, in a structure in which the outer shell 15 is arranged around the land portion 14, the overall size S1 thereof becomes large. When multiple lands 14 corresponding to multiple wiring portions 13 are arranged on a substrate, the increase in the overall size S1 makes high-density arrangement difficult and leads to a decrease in integration degree.

[0042] In contrast, in the wiring layer 102 of this embodiment, the connecting wiring portion 113 is disposed between the wiring portion 111 and the pad portion 112, while there is no need to dispose a structure corresponding to the outer frame portion 15 around the pad portion 112. Because the width W3 of the connecting wiring portion 113 is smaller than the width W2 of the pad portion 112, the connecting wiring portion 113 does not affect the integration degree of the pad portion 112. Therefore, the wiring layer 102 including the connecting wiring portion 113 allows the pad portions 112 to be disposed at a high density, thereby improving the integration degree.

[0043] [Embodiment 2] A wiring board 200 according to the second embodiment will be described with reference to Fig. 8. Components common to the first embodiment will be described using the same reference numerals.

[0044] In the wiring substrate 200, the wiring layer 102 includes a connecting wiring portion 213 as a connecting region between the wiring portion 111 and the pad portion 112. The connecting wiring portion 213 includes a plurality of connecting wires 221. Each connecting wire 221 is a conductive region separated by a plurality of holes 222. Each hole 222 is an opening formed in the wiring layer 102 and is a non-conductive region filled with the material of the insulating layer 103. Each hole 222 may have a shape different from the hole 122 of the first embodiment, such as a round shape. The connecting wiring portion 213 may have the same width W3 as the connecting wiring portion 113 of the first embodiment.

[0045] The connecting wiring portion 213 includes a plurality of connecting areas 223A1-223A3 arranged on the wiring portion 111 side as a plurality of first connecting portions. The connecting wiring portion 213 also includes a plurality of connecting areas 223B1-223B4 arranged on the pad portion 112 side as a plurality of second connecting portions. In this case, at least one conductive region and at least one non-conductive region can be arranged on any line segment connecting a point in one of the connecting areas 223A1-223A3 included in the plurality of first connecting portions to a point in one of the connecting areas 223B1-223B4 included in the plurality of second connecting portions. In this way, in the connecting wiring portion 213, at least one conductive region and at least one non-conductive region can be arranged on a line segment connecting a point in one of the first connecting portions to a point in one of the second connecting portions. The connecting areas 223A1-223A3 and the connecting areas 223B1-223B4 have a predetermined width. The line segments connecting a point on each of the plurality of connection areas 223A1-223A3 arranged on the wiring portion 111 side to a point on each of the plurality of connection areas 223B1-223B4 arranged on the pad portion 112 side may not pass through a non-conductor area depending on the positions of their endpoints. In this case, at least one conductor area and at least one non-conductor area may be arranged on a straight line band connecting any one of the plurality of connection areas 223A1-223A3 and any one of the plurality of connection areas 223B1-223B4. Alternatively, the straight line bands connecting the plurality of connection areas 223A1-223A3 arranged on the wiring portion 111 side as the plurality of first connection portions and the plurality of connection areas 223B1-223B4 arranged on the pad portion 112 side as the plurality of second connection portions may include one or more straight line bands in which no non-conductor area is arranged. However, at least one conductive region and at least one non-conductive region may be arranged on at least one straight line band among the multiple straight line bands connecting the multiple connecting areas 223A1 to 223A3 and the multiple connecting areas 223B1 to 223B4, where the distance between the wiring portion 111 and the pad portion 112 is the shortest, or on two or more straight line bands where the distance between the wiring portion 111 and the pad portion 112 is relatively short.As a result, at least one conductive region and at least one non-conductive region may be arranged on all or part of the multiple straight line bands connecting the multiple connecting areas 223A1-223A3 included in the multiple first connecting units and the multiple connecting areas 223B1-223B4 included in the multiple second connecting units. In this case, the entire at least one continuous non-conductive region may be arranged on the straight line band, or a portion of the at least one continuous non-conductive region may be arranged on the straight line band, and another portion of this continuous non-conductive region may be arranged on wiring portion 111 or pad portion 112 together with connecting wiring portion 213 different from the straight line band, or may be arranged only on connecting wiring portion 213.

[0046] The plurality of holes 222 may have different sizes. In this case, it is desirable that the plurality of holes 222 separating the plurality of connecting wires 221 are formed so that the width W11 of at least some of the connecting wires 221 is 30 μm or less. In the connecting wire portion 213, the plurality of holes 222 may be randomly arranged in the conductor region including the plurality of connecting wires 221 so as to extend or narrow the path along which a chemical solution such as an etching solution permeates from the pad portion 112 side to the wiring portion 111 side. This makes it difficult for the chemical solution to penetrate the wiring layer 102.

[0047] In the connecting wiring portion 213, the plurality of connecting wires 221 included in the conductor region only need to have a width sufficiently narrower than the width W3 of the connecting wiring portion 213. The plurality of holes 222 are filled with the material of the insulating layer 103. The support substrate 101 and the insulating layer 103 are bonded to the bottom surface of each hole 222. This makes it difficult for the insulating layer 103 to peel off from the wiring layer 102 in the connecting wiring portion 213, and the wiring layer 102 to be penetrated by a chemical solution.

[0048] [Embodiment 3] A wiring board 300 according to the third embodiment will be described with reference to Fig. 9. Components common to the first embodiment will be described using the same reference numerals.

[0049] In the wiring substrate 300, the wiring layer 102 includes a connecting wiring portion 313 as a connecting region between the wiring portion 111 and the pad portion 112. The connecting wiring portion 313 includes a plurality of connecting wires 321. Each connecting wire 321 is a conductive region having a bent portion 321A and separated by a plurality of holes 322. Each hole 322 is an opening formed in the wiring layer 102 and is a non-conductive region filled with the material of the insulating layer 103. Each hole 322 has a shape different from the hole 122 of the first embodiment, such as a slit shape including a bent portion 322A. The connecting wiring portion 313 may have the same width W3 as the connecting wiring portion 113 of the first embodiment.

[0050] Connecting wiring unit 313 includes, as a plurality of first connecting portions, a plurality of connecting areas 323A1-323A3 arranged on the side of wiring unit 111. Connecting wiring unit 313 also includes, as a plurality of second connecting portions, a plurality of connecting areas 323B1-323B3 arranged on the side of pad unit 112. In this case, at least one conductive region and at least one non-conductive region can be arranged on any line segment connecting a point in one of connecting areas 323A1-323A3 included in the plurality of first connecting portions to a point in one of connecting areas 323B1-323B3 included in the plurality of second connecting portions. In this way, in connecting wiring unit 313, at least one conductive region and at least one non-conductive region can be arranged on a line segment connecting a point in one first connecting portion and a point in one second connecting portion. The line segments connecting a point on each of the plurality of connection areas 323A1-323A3 arranged on the wiring portion 111 side to a point on each of the plurality of connection areas 323B1-323B3 arranged on the pad portion 112 side may not pass through a non-conductive region depending on the positions of their endpoints. In this case, at least one conductive region and at least one non-conductive region may be arranged on a straight line band connecting any one of the plurality of connection areas 323A1-323A3 to any one of the plurality of connection areas 323B1-323B3. When each connection wiring 321 has a bent portion 321A, at least one conductive region and at least one non-conductive region can be arranged on each of the plurality of straight line bands connecting the plurality of connection areas 323A1-323A3 arranged on the wiring portion 111 side as the plurality of first connection portions and the plurality of connection areas 323B1-323B3 arranged on the pad portion 112 side as the plurality of second connection portions. Therefore, the multiple straight line bands connecting the multiple connection areas 323A1 to 323A3 included in the multiple first connection parts and the multiple connection areas 323B1 to 323B3 included in the multiple second connection parts may be such that at least one conductive region and at least one non-conductive region can be arranged on all of the straight line bands.In this case, a portion of at least one continuous non-conductive region is arranged on a straight line band, and another portion of this continuous non-conductive region may be arranged in the wiring section 111 or the pad section 112 together with a connecting wiring section 313 that is different from the straight line band, or may be arranged only in the connecting wiring section 313.

[0051] The plurality of holes 322 separating the plurality of connecting wires 321 are desirably formed so that the width W11 of each connecting wire 321 is 30 μm or less. The connecting wire portion 313 is formed so that each hole 322 has a bent portion 322A so that the path along which a chemical solution such as an etching solution permeates from the pad portion 112 side to the wiring portion 111 side is extended or narrowed in the conductor region including the plurality of connecting wires 321. This makes it difficult for the chemical solution to penetrate into the wiring layer 102.

[0052] In the connecting wiring portion 313, the plurality of connecting wires 321 included in the conductor region only need to have a width sufficiently narrower than the width W3 of the connecting wiring portion 313. The plurality of holes 322 are filled with the material of the insulating layer 103. The support substrate 101 and the insulating layer 103 are bonded to the bottom surface of each hole 322. This makes it difficult for the insulating layer 103 to peel off from the wiring layer 102 in the connecting wiring portion 313, and the wiring layer 102 to be penetrated by a chemical solution.

[0053] [Embodiment 4] A wiring board 400 according to the fourth embodiment will be described with reference to Fig. 10. Components common to the first embodiment will be described using the same reference numerals.

[0054] In the wiring substrate 400, the wiring layer 102 includes a pad portion 212 as an electrical contact. The pad portion 212 is a solder mask-defined terminal similar to the pad portion 112. Unlike the pad portion 112, the pad portion 212 may have a round shape. The wiring layer 102 includes a connecting wiring portion 413 as a connecting region between the wiring portion 111 and the pad portion 212. The connecting wiring portion 413 includes a plurality of connecting wires 421. Each connecting wire 421 is a conductive region separated by a plurality of holes 422. Each hole 422 is an opening formed in the wiring layer 102 and is a non-conductive region filled with the material of the insulating layer 103. Each hole 422 has a shape different from the hole 122 of the first embodiment, such as a diamond shape. The connecting wiring portion 413 may have the same width W3 as the connecting wiring portion 113 of the first embodiment. In the interconnect layer 102, a plurality of holes 422 are formed in the interconnecting wiring portion 413 so that the conductor region including the plurality of interconnecting wirings 421 has a mesh structure similar to the mesh structure of the first embodiment.

[0055] The connecting wiring portion 413 includes a plurality of connecting areas 423A1-423A4 arranged on the wiring portion 111 side as a plurality of first connecting portions. The connecting wiring portion 413 also includes a plurality of connecting areas 423B1-423B4 arranged on the pad portion 212 side as a plurality of second connecting portions. In this case, at least one conductive region and at least one non-conductive region can be arranged on any line segment connecting a point in one of the connecting areas 423A1-423A4 included in the plurality of first connecting portions to a point in one of the connecting areas 423B1-423B4 included in the plurality of second connecting portions. In this way, in the connecting wiring portion 413, at least one conductive region and at least one non-conductive region can be arranged on a line segment connecting a point in one of the first connecting portions to a point in one of the second connecting portions. The connecting areas 423A1-423A4 and the connecting areas 423B1-423B4 have a predetermined width. The line segments connecting a point on each of the plurality of connection areas 423A1-423A4 arranged on the wiring portion 111 side to a point on each of the plurality of connection areas 423B1-423B4 arranged on the pad portion 212 side may not pass through a non-conductor area depending on the positions of their endpoints. In this case, at least one conductor area and at least one non-conductor area may be arranged on a straight line band connecting any one of the plurality of connection areas 423A1-423A4 to any one of the plurality of connection areas 423B1-423B4. Alternatively, the straight line bands connecting the plurality of connection areas 423A1-423A4 arranged on the wiring portion 111 side as the plurality of first connection portions and the plurality of connection areas 423B1-423B4 arranged on the pad portion 212 side as the plurality of second connection portions may include one or more straight line bands in which no non-conductor area is arranged. However, at least one conductive region and at least one non-conductive region may be arranged on at least one straight line band among the multiple straight line bands connecting the multiple connecting areas 423A1 to 423A4 and the multiple connecting areas 423B1 to 423B4, where the distance between the wiring portion 111 and the pad portion 212 is the shortest, or on two or more straight line bands where the distance between the wiring portion 111 and the pad portion 212 is relatively short.As a result, at least one conductive region and at least one non-conductive region may be arranged on all or part of the multiple straight line bands connecting the multiple connecting areas 423A1-423A4 included in the multiple first connecting units and the multiple connecting areas 423B1-423B4 included in the multiple second connecting units. In this case, the entire at least one continuous non-conductive region may be arranged on the straight line band, or a portion of the at least one continuous non-conductive region may be arranged on the straight line band, and another portion of this continuous non-conductive region may be arranged on wiring unit 111 or pad unit 212 together with connecting wiring unit 413 different from the straight line band, or may be arranged only on connecting wiring unit 413.

[0056] The plurality of holes 422 separating the plurality of connecting wires 421 are preferably formed so that the width W11 of each connecting wire 421 is 30 μm or less. In the connecting wire portion 413 of the wiring layer 102, the plurality of holes 422 serving as non-conductive regions corresponding to voids are alternately formed with the plurality of connecting wires 421 serving as conductive regions of a mesh structure. This extends or narrows the path along which a chemical solution such as an etching solution permeates from the pad portion 212 side to the wiring portion 111 side in the conductive region including the plurality of connecting wires 421. In this structure, the wiring layer 102 is less susceptible to penetration of the chemical solution.

[0057] In the connecting wiring portion 413, the plurality of connecting wires 421 included in the conductor region only need to have a width sufficiently narrower than the width W3 of the connecting wiring portion 413. The plurality of holes 422 are filled with the material of the insulating layer 103. The support substrate 101 and the insulating layer 103 are bonded to the bottom surface of each hole 422. This makes it difficult for the insulating layer 103 to peel off from the wiring layer 102 in the connecting wiring portion 413, and the wiring layer 102 to be penetrated by a chemical solution.

[0058] 10, the wiring layer 102 may include the same connecting wiring portion 113 as in the first embodiment between the wiring portion 111 and the round pad portion 212. Alternatively, the wiring layer 102 may include the same connecting wiring portion 213 as in the second embodiment or a connecting wiring portion having any structure similar to the connecting wiring portion 213 between the wiring portion 111 and the round pad portion 212, instead of the connecting wiring portion 413 in FIG.

[0059] [Embodiment 5] A wiring board 500 according to the fifth embodiment will be described with reference to Fig. 11. Components common to the first embodiment will be described using the same reference numerals.

[0060] In the wiring substrate 500, the wiring layer 102 includes a pad portion 212 similar to that in the fourth embodiment. The wiring layer 102 includes a connecting wiring portion 313 similar to that in the third embodiment between the wiring portion 111 and the pad portion 212.

[0061] In the fifth embodiment, the connecting wiring portion 313 includes, as a plurality of first connecting portions, a plurality of connecting areas 523A1-523A3 arranged on the side of the wiring portion 111. Also, in the fifth embodiment, the connecting wiring portion 313 includes, as a plurality of second connecting portions, a plurality of connecting areas 523B1-523B3 arranged on the side of the pad portion 212. In this case, at least one conductive region and at least one non-conductive region can be arranged on any line segment connecting a point in one of the connecting areas 523A1-523A3 included in the plurality of first connecting portions and a point in one of the connecting areas 523B1-523B3 included in the plurality of second connecting portions. In this way, in the connecting wiring portion 313, at least one conductive region and at least one non-conductive region can be arranged on a line segment connecting a point in one of the first connecting portions and a point in one of the second connecting portions. Furthermore, at least one conductive region and at least one non-conductive region may be arranged on each of the plurality of linear bands connecting the plurality of connecting areas 523A1-523A3 included in the plurality of first connecting portions and the plurality of connecting areas 523B1-523B3 included in the plurality of second connecting portions. In this case, a portion of at least one continuous non-conductive region may be arranged on the linear band, and another portion of this continuous non-conductive region may be arranged on the wiring portion 111 or the pad portion 212 together with a connecting wiring portion 313 that is not on the linear band, or may be arranged only on the connecting wiring portion 313. In this structure, as in the third embodiment, the wiring layer 102 is less susceptible to penetration by a chemical solution.

[0062] [Embodiment 6] A wiring board 600 according to the sixth embodiment will be described with reference to Fig. 12. Components common to the other embodiments will be described using the same reference numerals.

[0063] In the wiring substrate 600, the wiring layer 102 includes a planar conductor portion 211 such as a ground electrode instead of the wiring portion 111. In FIG. 12 , the wiring layer 102 includes a connecting wiring portion 313 similar to that of the third embodiment between the planar conductor portion 211 and the pad portion 112. The wiring layer 102 may include a pad portion 212 similar to that of the fourth embodiment instead of the pad portion 112. The wiring layer 102 may include a connecting wiring portion 113 similar to that of the first embodiment instead of the connecting wiring portion 313. Alternatively, the wiring layer 102 may include a connecting wiring portion 213 similar to that of the second embodiment instead of the connecting wiring portion 313. In these structures, as in the other embodiments, it is sufficient that the wiring layer 102 is resistant to penetration of chemical solutions.

[0064] [Variations] Although the embodiments have been described above, various modifications can be made to the present disclosure without departing from the spirit and scope of the present disclosure.

[0065] In embodiment 1 corresponding to Fig. 1 or embodiment 4 corresponding to Fig. 10, the conductor region having a network structure or mesh structure may be replaced with a conductor region having a honeycomb structure. In embodiment 3 corresponding to Fig. 9, embodiment 5 corresponding to Fig. 11, or embodiment 6 corresponding to Fig. 12, the conductor region having a bent portion of the connecting wiring portion may be replaced with a conductor region having a zigzag structure or meander structure. Alternatively, the wiring layer 102 may have a plurality of holes formed in the connecting wiring portion so that the conductor region including the plurality of connecting wires has any structure that extends or narrows the penetration path of the chemical solution.

[0066] 1, in the case of wiring board 100 shown in FIG. 8, in the case of wiring board 200 shown in FIG. 10, and in the case of wiring board 400 shown in FIG. 10, connecting wiring portion 113 is drawn from pad portion 112 along the horizontal direction or row direction DR as the second direction, and is connected to wiring portion 111. However, when wiring portion 111 is not disposed in the second direction or the first direction with respect to the position where pad portion 112 is disposed, connecting wiring portion 113 may be drawn in an oblique direction from pad portion 112. Furthermore, in a structure in which connecting wiring portion 113 is drawn in an oblique direction from square-shaped pad portion 112, connecting wiring portion 113 may be drawn from a corner of pad portion 112.

[0067] The wiring layer 102 is not limited to being formed on the support substrate 101. For example, the wiring layer 102 in a multilayer wiring substrate may be formed between a first insulating layer and a second insulating layer that are different from the support substrate 101. The first insulating layer may be an interlayer insulating layer in a multilayer structure. The second insulating layer may be a protective insulating layer that covers the wiring layer 102. Alternatively, both the first insulating layer and the second insulating layer may be interlayer insulating layers, and may be any layer that has a greater adhesive strength than the insulating layer 103 and the wiring layer 102.

[0068] The conductive regions in the wiring layer 102 may have any technical characteristics, such as length, width, thickness, size including all or part of these, shape, structure, architecture, arrangement, combination, and other characteristics, determined based on any constraints, including wiring strength, electrical resistance, insulation spacing, circuit layout, integration density, and wiring processing technology, all or part of which are included, without departing from the spirit and scope of the present disclosure. The number of rows, columns, and other totals, size including both or either length and width, shape, and other characteristics, may be determined for multiple holes and other non-conductive regions, without departing from the spirit and scope of the present disclosure. The technical characteristics of the wiring layer 102 can be applied to other technologies by being abstracted as the configuration of wiring members.

[0069] The present disclosure allows various embodiments and modifications without departing from the broad spirit and scope of the present disclosure. Furthermore, the above-described embodiments and examples are intended to illustrate the present disclosure and do not limit the scope of the present disclosure. That is, the scope of the present disclosure is defined by the claims, not the embodiments and examples. Various modifications made within the scope of the claims and within the meaning of the disclosure equivalent thereto are considered to be within the scope of the present disclosure. [Explanation of symbols]

[0070] 100,200,300,400,500,600 Wiring board 101 Support substrate 102,702 wiring layer 103,703 Insulating layer 103A,703A opening 104 Protective plating layer 111 Wiring section 112,212 Pad section 113,213,313,413 Connection wiring section 121, 121A1 to 121A3, 121B1 to 121B4, 121C1 to 121C3, 121D1 to 121D4, 221, 321, 421 connecting wiring 122,122A1,122A2, 122B1~122B3,122C1,122C2,122D1~122D3,222,322,422 Hole 123A1~123A3, 123B1~123B4, 223A1~223A3, 223B1~223B4, 323A1~323A3, 323B1~323B3, 423A1~423A4, 423B1~423B4, 523A1~523A3, 523B1~523B3 Connected area 124A1,124A2,124C1,124C2 End part 211 Planar conductor part 321A,322A Bend part 711 Undercut 712A,712B joint 721 Ni layer 722 Au layer

Claims

1. A support substrate; a wiring layer formed on the support substrate and having main wiring and electrical contacts; an insulating layer having an opening formed in at least a part of the electrical contact and covering the wiring layer; a protective plating layer formed on the surface of the electrical contact corresponding to the opening, the wiring layer includes a connection region between the main wiring and the electrical contact; The linking region is a plurality of first connecting portions arranged on the side of the main wiring; a plurality of second connecting portions disposed on the side of the electrical contacts; At least one conductive region and at least one non-conductive region can be arranged on a linear band connecting one of the first connecting portions and one of the second connecting portions. Wiring board.

2. In the connecting region, a plurality of the non-conductive regions are formed so that the conductive region has a mesh structure. The wiring board according to claim 1.

3. The connecting region is formed by alternately forming a plurality of the non-conductive regions corresponding to mesh portions. The wiring board according to claim 2.

4. The connection region includes a plurality of connection lines formed in parallel along a first direction and alternately formed along a second direction. The wiring board according to claim 1.

5. The connecting region is formed with a plurality of the non-conductive regions each having a rectangular shape. The wiring board according to claim 1.

6. The connecting region is formed with a plurality of the non-conductive regions each having a round shape. The wiring board according to claim 1.

7. The connecting region is formed with a plurality of the non-conductive regions each having a slit shape including a bent portion. The wiring board according to claim 1.

8. the connecting region includes a plurality of connecting wires; Each of the connecting wires has a width of 30 μm or less. The wiring board according to claim 1.

9. The connecting region has a length of 100 μm or more between the main wiring and the electrical contact. The wiring board according to claim 1.

10. The main wiring and An electrical contact; a coupling region provided between the main wiring and the electrical contact; The linking region is a plurality of first connecting portions arranged on the side of the main wiring; a plurality of second connecting portions disposed on the side of the electrical contacts; At least one conductive region and at least one non-conductive region can be arranged on a linear band connecting one of the first connecting portions and one of the second connecting portions. Wiring components.

Images