Light source unit, manufacturing method for light source unit, and vehicular lighting fixture

Abstract

To provide a light source unit to which high current density can be applied while cost is reduced.SOLUTION: A light source unit 10 according to the present disclosure comprises a light emitting element 12, a power supply wiring part 13 in which wiring for supplying power to the light emitting element 12 is formed, and a metallic heat dissipation plate 11 supporting the light emitting element 12 and the power supply wiring part 13. In the light source unit 10, the wiring is metal formed by plastic working, and a surface supported by the heat dissipation plate 11 is supported via an insulation member 15.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a light source unit, a method for manufacturing a light source unit, and a vehicle lamp. [Background technology]

[0002] Patent Document 1 discloses a light source unit as a light source for a vehicle lamp, which includes a light emitting element, a conductive layer that constitutes a lighting circuit for the light emitting element, and a heat sink that supports the light emitting element and the conductive layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-940 Summary of the Invention [Problem to be solved by the invention]

[0004] The light source unit described in Prior Art Document 1 has a configuration in which an insulating oxide film is formed on the surface of a heat sink, and a conductive layer is formed on top of that by surface treatment. The conductive layer can be formed by, for example, inkjet coating using conductive ink or conductive paste, printing with a 3D printer, plating, or other surface treatments.

[0005] However, conductive layers made by coating or printing involve the application of minute conductive particles dispersed in a solvent, and because conductivity is achieved through contact between the conductive particles, there is a problem in that a current cannot be applied at a high current density. Furthermore, conductive layers made by plating are produced by a manufacturing method that forms a metal film through an electrochemical reaction, so thickening the metal film requires a long electrochemical reaction time, which increases costs. Therefore, in the light source unit of Prior Art Document 1, it is difficult to form thick circuit wiring while keeping costs down, and as a result, it may be difficult to apply a high current density to a light source unit having a conductive layer formed by coating or printing. Therefore, if the current density of the light source unit cannot be increased, the required amount of light may not be obtained.

[0006] Therefore, an object of the present disclosure is to provide a light source unit that can apply a high current density while suppressing costs. [Means for solving the problem]

[0007] The light source unit disclosed herein comprises a light emitting element, a power supply wiring section in which wiring for supplying power to the light emitting element is formed, and a metal heat sink that supports the light emitting element and the power supply wiring section, in which the wiring is made of metal formed by plastic processing, and the surface supported by the heat sink is supported via an insulating member.

[0008] According to the present disclosure, the thickness of the wiring in the power supply wiring section can be made thicker than that of conductive layers formed by inkjet coating using conductive ink or conductive paste, printing with a 3D printer, or surface treatment such as plating, allowing a higher current to be applied and providing a high-output light source unit.

[0009] In the light source unit of the present disclosure, the insulating member may be a thermally conductive adhesive. This allows the power supply wiring section to be fixed onto the heat sink while ensuring insulation between the power supply wiring section and the heat sink.

[0010] The light source unit disclosed herein may further include a light-emitting element having a first electrode and a second electrode of a different polarity from the first electrode, the first electrode being connected to a first wiring that forms part of the wiring by a first conductive member, and the second electrode being connected to a second wiring that forms part of the wiring and is different from the first wiring by a second conductive member, and an opening that penetrates the front and back of the heat sink and insulates the first wiring from the second wiring may be formed between the first wiring and the second wiring. This creates an opening near the light emitting element, allowing air to move between the front and back of the heat sink. This also promotes heat dissipation from the light-emitting element.

[0011] The light source unit disclosed herein may further comprise a light source unit including a light-emitting element, a power supply wiring section having wiring for supplying power to the light-emitting element, a support base for supporting the light-emitting element, and a metal heat sink for supporting the support base and the power supply wiring section, wherein the wiring and the support section are formed from the same metal material formed by plastic processing, the surface supported by the heat sink is supported via an insulating member, and the same metal material has higher thermal conductivity than the material forming the heat sink. This allows the light emitting element to dissipate more heat and apply a higher current than when the light emitting element is directly fixed to the heat sink.

[0012] A manufacturing method of a light source unit according to the present disclosure includes a light emitting element, a power supply wiring section having wiring formed thereon for supplying power to the light emitting element, and a metal heat sink supporting the light emitting element and the power supply wiring section, and includes a wiring forming step of forming metal wiring on a surface of the metal heat sink, and a power supply path forming step of arranging the light emitting element on the heat sink and forming a power supply path for supplying power to the light emitting element on the metal wiring, and the wiring forming step may be characterized in that the metal wiring is formed by plastic processing, and the surface of the metal wiring that is supported by the heat sink is covered with an insulating member, and the metal wiring is supported by the heat sink via the insulating member. According to the manufacturing method disclosed herein, the power supply wiring portion can be formed thicker than in FPCs that require etching to form wiring, or conductive layers formed by surface treatment such as plating.

[0013] In the manufacturing method disclosed herein, the wiring formation step may further include a division step of forming an opening that penetrates a predetermined portion of the metal wiring, including the heat sink, to divide the metal wiring into a first wiring and a second wiring that are insulated from each other, and the power supply path formation step may further include a connection step of connecting the first wiring and a first electrode of the light-emitting element with a first conductive member, and connecting the second wiring and a second electrode of the light-emitting element with a second conductive member. This allows the power supply wiring to be divided into multiple insulated power supply wirings after the power supply circuit section is formed on the heat dissipation substrate, making the work more efficient than if the power supply wirings were formed individually on the heat dissipation substrate.

[0014] The lamp may be a vehicle lamp including a light source unit according to the present disclosure, a light-transmitting outer lens, and a lamp housing that forms a lamp chamber with the outer lens. As a result, the light source unit, which can apply a high current density, can generate a large amount of light, and therefore, a large amount of light can be distributed ahead of the vehicle, improving the driver's visibility. [Effects of the Invention]

[0015] According to the present disclosure, it is possible to provide a light source unit that can apply a high current density while suppressing costs. [Brief explanation of the drawings]

[0016] [Figure 1] 1 shows a vertical cross section of a vehicle lamp in which a light source unit of a first embodiment is used. [Figure 2] 1 shows a plan view of a light source unit according to a first embodiment. [Figure 3] Figure 3-1 shows a plan view of the light source unit of the second embodiment. Figure 3-2 shows an enlarged view of Figure 3-1. Figure 3-3 shows the cross section AA of Figure 3-2. [Figure 4] Figure 4-1 shows a plan view of the light source unit of the third embodiment, and Figure 4-2 shows an enlarged view of Figure 4-1. [Figure 5A] 5-1 to 5-3 show the first half of the method for manufacturing the light source unit of the second embodiment. [Figure 5B]5-4 and 5-5 show the second half of the method for manufacturing the light source unit of the second embodiment. [Figure 6A] 6-1 to 6-3 show the first half of the method for manufacturing the light source unit of the third embodiment. [Figure 6B] 6-4 and 6-5 show the second half of the manufacturing method for the light source unit of the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0018] 1 shows an automotive headlamp 1 suitable for use with light source units 10, 30, and 50 according to the first, second, and third embodiments. The automotive headlamp 1 includes an outer lens 2, a lamp housing 3, an optical component 4, and the light source units 10, 30, and 50. The light source units 10, 30, and 50 are fixed to the lamp housing 3 by optical axis adjustment screws 6, 7, and 8.

[0019] The outer lens 2 is a curved plate-like member made of a light-transmitting material. In this automobile headlamp 1, it is made of polycarbonate.

[0020] The lamp housing 3 is a bay-shaped component with an opening, and its periphery is joined by an outer lens 2 to form a lamp chamber. Optical components 4 and light source units 10, 30, and 50 are housed within the lamp chamber.

[0021] The optical component 4 distributes the light emitted by the light source units 10, 30, and 50 so that it is directed outside the lamp chamber. In this case, the optical component is an acrylic plano-convex projection lens, and is positioned so that the light emission positions of the light source units 10, 30, and 50 are at or near the rear focal points. The optical component 4 is fixed to the light source units 10, 30, and 50 by support members (not shown).

[0022] Light source units 10, 30, and 50 have a configuration in which a light-emitting element is mounted on a heat sink, and emits light when power is supplied to the light-emitting element. The peripheral edge of the heat sink is fixed to the lamp housing 3 by optical axis adjustment screws 6, 7, and 8. By manipulating the optical axis adjustment screws 6, 7, and 8, the position of the heat sink relative to the lamp housing 3 is changed, and the direction of the emitted light is changed.

[0023] As will be described later, a high current density can be applied to the light-emitting elements that are the light sources of light source units 10, 30, and 50, making it possible to generate a large amount of light.By using this light source unit in a vehicle headlamp, a large amount of light can be distributed ahead of the vehicle, improving visibility for the driver.

[0024] First Embodiment 2 shows a plan view of a light source unit 10 according to the first embodiment. In the light source unit 10, a total of four LEDs 121 to 124, which are light-emitting elements 12, are mounted on a metal heat sink 11. A power supply wiring section 13 (first wiring 131 to sixth wiring 136) that is wiring for supplying power to the LEDs 121 to 124 is formed on the heat sink 11. The power supply wiring section 13 is supported on the heat sink 11 via an insulating member 15 (not shown). The LEDs 121 to 124 are electrically connected to the power supply wiring section 13 by conductive members 14 (1411, 1412, 1421, 1422, 1431, 1432, 1441, 1442).

[0025] <Heat sink> The heat sink 11 is an aluminum plate with a thickness of 1 mm, but the material may be any metal such as copper or iron.

[0026] <led> LEDs 121-124 are top-electrode LEDs, with a first electrode (anode) adjacent to the light-emitting portion and a second electrode (cathode) opposite the first electrode. The LED chip and phosphor can be selected according to the application, and for vehicle headlights, a combination of a blue chip and a YAG phosphor is used to emit white light. The top-electrode type refers to a structure in which the light-emitting portion, first electrode, and second electrode are provided on the top surface, which is the surface opposite the surface mounted on heat sink 11.

[0027] <Power supply wiring section> The power supply wiring section 13 is composed of a total of six wirings, from a first wiring 131 to a sixth wiring 136. In the first embodiment, each wiring is a copper wiring formed by plastic processing, and is a wiring with a thickness of 0.5 mm formed by press processing. The plastic processing is not limited to press processing, and forging or bending may also be used. Furthermore, the wiring may be made of a material other than copper. Furthermore, the thickness may be greater than 0.5 mm. Generally, the cross-sectional area of ​​copper wiring is set according to the current density, but since the thickness of the copper wiring can be set to be thick, the width of the wiring can be shortened accordingly, and the wiring of the power supply wiring section can be formed densely. The width of the copper wiring may be shorter than the width of the LED.

[0028] <Insulating materials> The first wiring 131 to the sixth wiring 136 are supported on the heat sink 11 via an insulating member 15 (not shown). In the first embodiment, the insulating member 15 is an insulating adhesive made of resin with alumina powder dispersed therein, but is not limited to this and may be an insulating heat-conductive sheet. Furthermore, as long as the first wiring 131 to the sixth wiring 136 are insulated from the heat sink 11, a simple resin adhesive that does not contain alumina fine powder may be used.

[0029] <Conductive materials> The conductive member 14 electrically connects the first electrode and the second electrode to a predetermined wiring of the power supply wiring portion 13 by the first conductive member and the second conductive member. For example, regarding the LED 121, the first electrode is connected to the first wiring by the gold wire 1411 which is the first conductive member, and the second electrode is connected to the second wiring by the gold wire 1412 which is the second conductive member. Each of the LEDs 121 to 124 is connected to the wirings constituting the power supply wiring portion 13 by the first conductive member and the second conductive member. The conductive member 14 is not limited to a gold wire, and may be an aluminum ribbon or an aluminum wire.

[0030] <Electrical Connection of LED> The LEDs 121 to 123 are joined to the first wiring 131, the second wiring 132, the third wiring 133, and the fourth wiring 134 by the conductive members 1411, 1412, 1421, 1422, 1431, and 1432, and are connected in series. The LED 124 is connected to the fifth wiring 135 and the sixth wiring 136 via the conductive members 1441 and 1442.

[0031] <Unit Power Supply Section> The first wiring 131, the fifth wiring 135, the sixth wiring 136, and the fourth wiring 134 are arranged adjacent to each other in the lateral direction at the periphery of the heat sink 11 to form a unit power supply section C1. A power supply connector (not shown) is connected to the unit power supply section C1 to supply power to the first wiring 131, the fifth wiring 135, the sixth wiring 136, and the fourth wiring 134.

[0032] <… <Operation of the First Embodiment> Since the power supply wiring portion 13 is a metal wiring formed by plastic working of a metal, a wiring pattern can be formed with a thick plate thickness. Further, since the power supply wiring portion 13 is supported by the metal heat sink 11 by the insulating material 15, the power supply wiring portion 13 is supported in an insulating state with respect to the heat sink 11. Thereby, a thick wiring pattern can be easily formed on the metal heat sink 11 as compared with pattern formation by surface treatment such as plating.

[0033] The LEDs 121 to 124 mounted on the heat sink 11 are electrically connected to the power supply wiring section 13 via the conductive member 14. Because the power supply wiring section 13 is thick, the possibility of the power supply wiring section 13 being melted can be reduced even when the current density applied to the LEDs 121 to 124 is increased. In other words, a light source unit capable of applying a higher current can be provided compared to a case where a pattern is formed by surface treatment such as plating.

[0034] Since the width of each wire (first wire 131 to sixth wire 136) of power supply wiring section 13 is shorter than the horizontal width of the LED, the wires can be arranged closely. Furthermore, since fifth wire 135 and sixth wire 136 arranged near LED 124 are arranged closely in the left-right direction of the page, the first electrode and second electrode of LED 124 and the fifth wire 135 and sixth wire 136 are arranged closely, and as a result, the lengths of gold wires 1441 and 1442 connected to the first electrode and second electrode can be shortened.

[0035] By further using a thermally conductive adhesive 15 as the insulating material 15, the power supply wiring section 13 is fixed to the heat sink 11 while maintaining an insulating state. Because the insulating material 15 has thermal conductivity, it can transfer heat generated in the power supply wiring section 13 to the heat sink 11.

[0036] Second Embodiment Fig. 3-1 is a plan view of a light source unit 30 according to a second embodiment. Fig. 3-2 is an enlarged view of Fig. 3-1. Fig. 3-3 is a cross-sectional view of the dashed line A-A in Fig. 3-2, viewed from the direction of the arrow.

[0037] 3-1 and 3-2 are plan views of a light source unit 30 according to a second embodiment. In the light source unit 30, a total of four upper-electrode LEDs 321 to 324, which are light-emitting elements 32, are mounted on a metal heat sink 31. A power supply wiring section 33 (first wiring 331 to sixth wiring 336) is formed on the heat sink 31 as wiring for supplying power to the LEDs 321 to 324. The LEDs 321 to 324 are electrically connected to the power supply wiring section 33 by conductive members 34 (3411, 3412, 3421, 3422, 3431, 3432, 3441, 3442). The power supply wiring section 33 is supported on the heat sink 31 via an insulating member 35.

[0038] The specifications of each component of the light source unit 30 of the second embodiment are basically the same as those of the light source unit 10, but differ in that it has first through holes 36 (361, 362, 363) that penetrate the heat sink 31. Specifically, the first through hole 361 is formed between the first wiring 331 and the second wiring 332, the first through hole 362 is formed between the second wiring 332 and the third wiring 333, and the first through hole 363 is formed between the third wiring 333 and the fourth wiring 334.

[0039] Figure 3-3 shows the cross section AA of Figure 3-2. The first wiring 331 and the second wiring 332 are discontinuous at the first through-hole 361 of the heat sink 31, and therefore the first wiring 331 and the second wiring 332 are insulated from each other. Similarly, the second wiring 332 and the third wiring 333 are discontinuous at the first through-hole 362, and therefore are insulated from each other. Similarly, the third wiring 333 and the fourth wiring 334 are discontinuous at the first through-hole 363, and therefore are insulated from each other.

[0040] <Operation of the Second Embodiment> In the light source unit 30, a first through hole 361 is formed between the first wiring 331 and the second wiring 332, a first through hole 362 is formed between the second wiring 332 and the third wiring 333, and a first through hole 363 is formed between the third wiring 333 and the fourth wiring 334. When the top electrode type LEDs 321 to 323 are connected to the respective wirings via a pair of conductive members 34, the first through holes 361 to 363 are located near the top electrode type LEDs 321 to 323. Because the first through holes penetrate the heat sink 31, the movement of air via the first through holes 361 to 363 is promoted, and the heat of the LEDs 321 to 323 is dissipated by the airflow. As a result, the heat dissipation performance of the LEDs 321 to 323 is improved.

[0041] <Third embodiment> FIG. 4 shows a plan view of a light source unit 50 according to the third embodiment.

[0042] The light source unit 50 has a total of four upper electrode type LEDs 521 to 524, which are light emitting elements 52, mounted on a metal heat sink 51. A power supply wiring section 53 (first wiring 531 to sixth wiring 536) that is wiring for supplying power to the LEDs 521 to 524 is formed on the heat sink 51. The LEDs 521 to 524 are electrically connected to the power supply wiring section 53 by conductive members 54 (5411, 5412, 5421, 5422, 5431, 5432, 5441, 5442). The power supply wiring section 53 is supported on the heat sink 51 via an insulating member 55 (not shown).

[0043] Each component of the light source unit 50 is basically the same as each component of the light source unit 30, but unlike the light source unit 30, the LEDs 521 to 523 are supported on the heat sink 51 via a support base 57, and further, a second through hole 58 (581, 582, 583, 584) that penetrates the heat sink 51 is formed between the power supply wiring section 53 and the support base 57.

[0044] Specifically, a second through hole 581 is formed between the first wiring 531 and the support base 57, a second through hole 582 is formed between the second wiring 532 and the support base 57, a second through hole 583 is formed between the third wiring 533 and the support base 57, and a second through hole 584 is formed between the fourth wiring 534 and the support base 57. The support base 57 is made of the same metal material as the heat sink 53. Specifically, it is a metal plate with a thickness of 0.5 mm formed by press working. The processing is not limited to press working, but forging or bending may also be used, and the material may be other than copper. The thickness may also be thicker than 0.5 mm.

[0045] <Operation of the Third Embodiment> Unlike the light source unit 30, the light source unit 50 has the LEDs 521 to 523 supported on the heat sink 51 via the support base 57, and furthermore, the power supply wiring part 53 and the support base 57 have higher thermal conductivity than the heat sink 51. Therefore, the heat generated from the LEDs 521 to 523 moves in the extending direction of the support base 57, and the heat sink 51 can receive heat over a wider area than in the case where the support base 57 is not provided. In other words, compared to when the LEDs 521 to 523 are directly fixed to a heat sink, the LEDs 521 to 523 can dissipate heat more efficiently and a higher current can be applied.

[0046] Furthermore, second through holes 58 (581, 582, 583, 584) that penetrate the heat sink 51 are formed between the power supply wiring portion 53 and the support base 57, so that the power supply wiring portion 53 and the support base 57 are electrically insulated from each other.

[0047] Furthermore, the movement of air is promoted via the second through holes 58 (581, 582, 583, 584), and the heat from the LEDs 521 to 523 is dissipated by the airflow. As a result, the heat dissipation performance of the LEDs 521 to 523 is improved.

[0048] <Manufacturing method of the second embodiment> 5-1 to 5-5 show the steps of the method for manufacturing the light source unit 30. FIG.

[0049] FIG. 5-1 shows a part of the wiring formation process, in which a copper plate (not shown), which is a metal plate having a thickness of 0.5 mm, is prepared and pressed with a mold to form a metal wiring base 1300 of a predetermined shape (metal wiring base formation process). The metal wiring base 1300 may be formed by plastic processing other than pressing, such as bending or forging.

[0050] 5-2 shows a part of the wiring formation process, in which insulating adhesive 35 is applied to a predetermined surface of the metal wiring base 1300 supported by the metal plate, and the predetermined surface is covered with insulating adhesive 35 (adhesive application process). The arrows in the figure indicate the transition from before application to after application.

[0051] 5-3 shows part of the wiring formation process, in which a metal wiring base 1300 with insulating adhesive 35 applied to a predetermined surface is bonded to a heat sink 31 formed into a predetermined shape (metal wiring base bonding process). The portion of the metal wiring base 1300 to be cut out to form the unit power supply part C2 is bonded in a state where it is shifted outward from the periphery of the heat sink 31 in advance. Depending on the type of adhesive, heat, ultraviolet light, or time may be applied to bond the parts together.

[0052] FIG. 5-4 shows a portion of the metal wiring base 1300 that is shifted outward from the heat sink 31, cut using a known method (showing part of the wiring formation process). Furthermore, through-holes 36 (361, 362, 363) are formed in the metal wiring base 1300 at three predetermined positions where the metal wirings are stacked (separation process). As a result, the first wiring 331 and the second wiring 332 adjacent to each other are insulated from each other by the through-hole 361. Similarly, the second wiring 332 and the third wiring 333 adjacent to each other are insulated from each other by the through-hole 362. Similarly, the third wiring 333 and the fourth wiring 334 adjacent to each other are insulated from each other by the through-hole 363. In other words, by forming the through-holes 36 (361, 362, 363), the metal wiring base 1300 is composed of six wirings 331 to 336 that are insulated from each other. The through holes 36 may be formed by press working or by other known means. The wirings 331 to 334 serve as power supply paths for supplying power to the LEDs 321 to 323, and the wirings 335 and 336 serve as power supply paths for supplying power to the LED 324.

[0053] 5-5, LEDs 321 to 324 are mounted at predetermined positions on the heat sink 31 and connected to the first wiring 331 to the sixth wiring 336 of the power supply wiring section 33 by eight gold wires 3411, 3412, 3421, 3422, 3431, 3432, 3441, and 3442, which are the conductive member 34 (power supply path forming process). The LEDs 321 to 323 are arranged near the through holes 361, 362, and 363. The LEDs 321 to 323 are connected to the wirings 331 to 334 by the gold wires so as to form a series connection.

[0054] <Function of the manufacturing method of the second embodiment> In the wiring formation process, the metal wiring is formed by plastic processing, so it is possible to prepare a metal plate of the desired thickness and form metal wiring of the desired thickness by plastic processing such as pressing. The metal wiring base 1300 is 0.5 mm thick, so it can be grasped and moved without plastic deformation. The metal wiring base 1300 is covered with an insulating member 35 and supported by the heat sink 31, so the metal wiring base 1300 and the heat sink 31 are supported while maintaining an insulated state. This makes it possible to manufacture light source units with thicker power supply wiring sections compared to flexible printed circuit boards (FPCs), which require etching to form wiring, or conductive layers formed by surface treatments such as plating. Furthermore, the power supply path forming process includes a division process for forming through holes 36 (361, 362, 363) that penetrate from the front to the back at three predetermined positions on the metal wiring base 1300 where the metal wiring is stacked, and therefore the work can be made more efficient than when the wiring 331 to 336 are individually formed on the heat sink 31 and then individually placed on the heat sink 31.

[0055] <Manufacturing method of the third embodiment> 6-1 to 6-5 show the steps of the method for manufacturing the light source unit 50. FIG.

[0056] 6-1 shows a wiring formation process in which a copper plate (not shown) having a thickness of 0.5 mm is prepared and pressed with a mold to form a predetermined shape of a metal wiring base 2300. Unlike the metal wiring base 1300 in FIG. 5-1, the metal wiring base 2300 further has an extension portion 2320 via narrow portions 2311-2314.

[0057] In FIG. 6B, an insulating adhesive 55 is applied to a predetermined surface of the metal wiring base 2300. The arrows in the figure indicate the transition from before application to after application.

[0058] 6-3 shows how a metal wiring base 2300, with insulating adhesive 55 applied to a predetermined surface, is bonded to a heat sink 51 formed in a predetermined shape. The portion of the metal wiring base 2300 to be cut out to form the unit power supply part C3 is bonded in a state where it is shifted outward from the peripheral edge of the heat sink 51 in advance.

[0059] 6-4, the metal wiring base 2300 is cut by a known means at a portion thereof that is shifted outward from the heat sink 51. Furthermore, first through holes 56 (561, 562, 563) that penetrate from the front to the back of the metal wiring base 2300 are formed by press working at three predetermined positions where the metal wirings are stacked. Furthermore, the narrow width portions 2311 to 2314 are also formed with second through holes 58 (581, 582, 583, 584) that penetrate from the front to the back by press working, so that the extension portion 2320 becomes the support base 57. As a result, the metal wiring base 2300 forms six metal wirings 531 to 536 and one extension portion 2320 (support base 57). These seven portions are electrically insulated.

[0060] 6-5, LEDs 621 to 624 are mounted on the extension portion 2320 and connected to the first wiring 531 to the sixth wiring 536 of the power supply wiring portion 53 by eight gold wires 5411, 5412, 5421, 5422, 5431, 5432, 5441, and 5442 which are the conductive member 54. In FIG. The LEDs 521 to 523 are connected in series with the first wirings 531 to 534.

[0061] <Function of the manufacturing method of the third embodiment> The metal wiring base 2300, in which the power supply wiring section 53 and the support base 57 are integrated, is fixed to the heat dissipation substrate 51 via the insulating member 55, and second through holes 58 (581, 582, 583, 584) that penetrate from the front to the back are formed by press processing at three predetermined positions on the metal wiring base 2300 where the metal wiring is stacked, so that the work can be made more efficient than when the power supply wiring section 53 and the support base 57 are individually placed on the heat dissipation plate 51.

[0062] The present disclosure is not limited to the above-described embodiment, and can be freely modified and improved as appropriate. Furthermore, the material, shape, dimensions, numerical values, form, number, location, etc. of each component in the above-described embodiment are not particularly limited as long as the present disclosure can be achieved. [Explanation of symbols]

[0063] 1 Automotive headlights 2 outer lens 3 Lamp housing 4. Projection lens (optical component) 6, 7, 8 Optical axis adjustment screws 10, 30, 50 light source units 11, 31, 51 Heat sink 12, 32, 52 LEDs (light-emitting elements) 13, 33, 53 Power supply wiring section 14, 34, 54 Conductive material 15, 35, 55 Insulating material 36, 56 First through hole 57 Support base 58 Second through hole< / led>

Claims

1. A light-emitting element; a power supply wiring section in which wiring for supplying power to the light emitting element is formed; a metal heat sink that supports the power supply wiring portion, The wiring is made of metal formed by plastic working, and the surface supported by the heat sink is made of an insulating material. A light source unit supported via the

2. The light source unit according to claim 1 , wherein the insulating member is a thermally conductive adhesive.

3. The light-emitting element has a first electrode and a second electrode having a polarity different from that of the first electrode, the first electrode is connected to a first wiring that forms a part of the wiring by a first conductive member; the second electrode is connected to a second wiring that forms a part of the wiring and is different from the first wiring by a second conductive member; The light source unit according to claim 1 or 2, wherein an opening is formed between the first wiring and the second wiring, penetrating the front and back of the heat sink and insulating the first wiring from the second wiring.

4. A light-emitting element; a power supply wiring section in which wiring for supplying power to the light emitting element is formed; a support base for supporting the light emitting element; a metal heat sink that supports the support base and the power supply wiring portion, the wiring and the support base are formed from the same metal material formed by plastic working; The surface supported by the heat sink is supported via an insulating member, The same metal material has higher thermal conductivity than the material forming the heat sink.

5. A method for manufacturing a light source unit including a light emitting element, a power supply wiring section in which wiring for supplying power to the light emitting element is formed, and a metal heat sink for supporting the light emitting element and the power supply wiring section, a wiring forming step of forming metal wiring on the surface of the metal heat sink; a power supply path forming step of disposing the light emitting element on the heat sink and forming a power supply path in the metal wiring to supply power to the light emitting element, In the wiring forming step, the metal wiring is formed by plastic working, A method for manufacturing a light source unit, wherein the surface of the metal wiring that is supported by the heat sink is covered with an insulating member, and the metal wiring is supported by the heat sink via the insulating member.

6. the wiring forming step further includes a dividing step of forming an opening that penetrates a predetermined portion of the metal wiring, including the heat sink, to divide the metal wiring into a first wiring and a second wiring that are insulated from each other; 6. The method for manufacturing a light source unit according to claim 5, wherein the power supply path forming process further includes a connection process of connecting the first wiring and the first electrode of the light-emitting element with a first conductive member, and connecting the second wiring and the second electrode of the light-emitting element with a second conductive member.

7. A translucent outer lens, a lamp housing that forms a lamp chamber with the outer lens; The light source unit according to claim 1, which is disposed in the lamp chamber; 1. A vehicle lighting fixture, comprising:

Images