Information processing device, recipe editing method, and semiconductor manufacturing device

Abstract

To provide a technique that enables an operator to more easily edit a recipe to be executed by a semiconductor manufacturing device.SOLUTION: An information processing device edits a recipe to be executed by a semiconductor manufacturing device includes a display block operation receiving unit that receives input of a time for continuing the category settings by an operator who arranges on a screen a plurality of display blocks that visually represent at least one of a plurality of category settings included in the recipe, a property setting input receiving unit that receives input of setting values for setting items included in the category settings from the operator for each display block arranged on the screen, and a recipe editing unit that edits a recipe in which steps are arranged in order, with the smallest unit being a step consisting of a combination of all setting items for which setting values have been set and the time for continuing the settings, on the basis of the input of the time for continuing the category settings and the setting values for the setting items.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to an information processing device, a recipe editing method, and a semiconductor manufacturing device. [Background technology]

[0002] Semiconductor manufacturing equipment performs processes by executing recipes that combine settings in various categories such as temperature, gas, pressure, plasma, and mechanics. For example, Patent Document 1 describes a technology that makes it easy to visually check the results of comparing multiple recipes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-169963 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that allows an operator to more easily edit recipes to be executed by semiconductor manufacturing equipment. [Means for solving the problem]

[0005] One aspect of the present disclosure is an information processing device that edits a recipe to be executed by a semiconductor manufacturing device, the information processing device comprising: a display block operation receiving unit that receives input of a time for continuing the setting of at least one of a plurality of category settings included in the recipe through operation by an operator who places multiple display blocks on a screen that visually represent the setting of the category; a property setting input receiving unit that receives input of setting values ​​for setting items included in the category settings from the operator for each of the display blocks placed on the screen; and a recipe editing unit that edits a recipe in which the steps are arranged in order, with the smallest unit being a step consisting of a combination of all setting items for which the setting values ​​have been set and the time for continuing the setting, based on the input of the time for continuing the setting of the category and the setting values ​​for the setting items. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to provide a technique that allows an operator to more easily edit a recipe to be executed by a semiconductor manufacturing device. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a configuration diagram of an example of a semiconductor manufacturing system according to an embodiment of the present invention. [Figure 2] FIG. 2 is a diagram illustrating a hardware configuration of an example of a computer. [Figure 3] FIG. 2 is a functional block diagram of an example of an equipment controller according to the present embodiment. [Figure 4] FIG. 2 is a diagram illustrating an example of a recipe executed by the semiconductor manufacturing apparatus. [Figure 5] FIG. 10 is a diagram illustrating an example of a configuration of setting items in the temperature category. [Figure 6] FIG. 10 is a diagram illustrating an example of a recipe in which the same setting values ​​are input. [Figure 7] FIG. 10 is a diagram illustrating an example of a recipe in which continuously changing setting values ​​are input. [Figure 8] FIG. 10 is a diagram illustrating an example of a recipe in which continuously changing setting values ​​are input. [Figure 9]FIG. 10 is a diagram illustrating an example of a recipe in which the set values ​​of other categories are changed at different step times while the temperature is being changed according to a continuously changing set value. [Figure 10] FIG. 10 is a diagram illustrating an example of a recipe in which step times are assigned to each category. [Figure 11] FIG. 10 is an image diagram of an example of a screen for editing a recipe according to the present embodiment. [Figure 12] FIG. 10 is a diagram illustrating a display block of "Temperature rise 500° C.", which is an example of a temperature block. [Figure 13] FIG. 10 is a diagram illustrating a display block of "Temperature drop to 400° C.", which is an example of a temperature block. [Figure 14] FIG. 10 is a diagram illustrating a display block of "Load 400° C.", which is an example of a temperature block. [Figure 15] FIG. 10 is a diagram illustrating a display block of "SVAC" as an example of a pressure block. [Figure 16] FIG. 10 is a diagram illustrating a display block of "MV Open" as an example of a pressure block. [Figure 17] FIG. 10 is a diagram illustrating a display block of "MV Close," which is an example of a pressure block. [Figure 18] FIG. 10 is a diagram illustrating a display block of "pressure control" as an example of a pressure block. [Figure 19] FIG. 10 is a diagram illustrating a display block of "ATM" as an example of a pressure block. [Figure 20] FIG. 10 is a diagram illustrating display blocks of "N2," "SiH4," and "NH3" as an example of a gas block. [Figure 21] This is a diagram explaining the "Rotate" display block of the Mecha Boat rotation block, the "Load" display block of the Mecha Boat ELV block, and the "Unload" display block of the Mecha Boat ELV block. [Figure 22] FIG. 10 is a diagram illustrating a block labeled "ALD," which is an example of a special film formation block. [Figure 23]FIG. 10 is a diagram illustrating a block labeled "TVS" as an example of a special film formation block. [Figure 24] FIG. 10 is an explanatory diagram showing an example of a recipe editing area in which display blocks are arranged. [Figure 25] FIG. 10 is an explanatory diagram showing an example of a recipe editing area in which display blocks are arranged. [Figure 26] FIG. 10 is an explanatory diagram showing an example of a recipe editing area in which display blocks are arranged. [Figure 27] FIG. 10 is a diagram illustrating the setting of a check visually displayed in the recipe editing area. [Figure 28] FIG. 10 is a diagram illustrating the setting of a check visually displayed in the recipe editing area. [Figure 29] FIG. 10 is an image diagram of an example of a process for editing a recipe of an existing recipe structure based on the arrangement of display blocks in the recipe editing area and property settings input in the property setting area. [Figure 30] 10 is a flowchart illustrating an example of a process for converting to an existing recipe structure. [Figure 31] FIG. 10 is an image diagram of an example of a process for editing a recipe of an existing recipe structure based on the arrangement of display blocks in the recipe editing area and property settings input in the property setting area. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, the present embodiment will be described with reference to the drawings.

[0009] <System configuration> FIG. 1 is a configuration diagram of an example of a semiconductor manufacturing system 1 according to this embodiment. The semiconductor manufacturing system 1 of FIG. 1 includes semiconductor manufacturing equipment 10, an equipment controller 12, a server device 16, and an operator terminal 18. The semiconductor manufacturing equipment 10 and the equipment controller 12 are installed in a manufacturing factory 2. The server device 16 and the operator terminal 18 may be installed in the manufacturing factory 2 or may be installed outside the manufacturing factory 2. The operator terminal 18 is an information processing terminal such as a PC (Personal Computer) or a smartphone operated by an operator such as an equipment technician of the semiconductor manufacturing equipment 10 installed in the manufacturing factory 2.

[0010] The semiconductor manufacturing equipment 10, equipment controller 12, server device 16, and operator terminal 18 in FIG. 1 are communicably connected via networks 20 and 22 such as the Internet or a LAN (Local Area Network).

[0011] The semiconductor manufacturing apparatus 10 is an apparatus that performs processes such as film formation, etching, or ashing, and processes, for example, semiconductor wafers (hereinafter simply referred to as wafers). The semiconductor manufacturing apparatus 10 is, for example, a substrate processing apparatus, a heat treatment apparatus, or a film formation apparatus. The semiconductor manufacturing apparatus 10 receives, for example, a recipe from an apparatus controller 12 and executes the recipe to perform a process. The recipe is a control command that combines settings in various categories, such as temperature, gas, pressure, plasma, and mechanics.

[0012] The semiconductor manufacturing equipment 10 is equipped with a plurality of sensors, such as a temperature sensor for measuring temperature and a pressure sensor for measuring pressure, etc. The semiconductor manufacturing equipment 10 is also equipped with an actuator that performs mechanical operations by combining a power source and components.

[0013] The equipment controller 12 has a function of a man-machine interface that receives instructions for the semiconductor manufacturing equipment 10 from an operator and provides the operator with information related to the semiconductor manufacturing equipment 10. The equipment controller 12 receives sensor data output from a plurality of sensors installed in the semiconductor manufacturing equipment 10. The equipment controller 12 may perform anomaly detection or anomaly prediction for the semiconductor manufacturing equipment 10.

[0014] 1 is provided for each semiconductor manufacturing apparatus 10, it may be provided for each of a plurality of semiconductor manufacturing apparatuses 10. The equipment controller 12 may be provided inside the housing of the semiconductor manufacturing apparatus 10 or outside the housing.

[0015] The server device 16 may receive sensor data output from a plurality of sensors installed in the semiconductor manufacturing equipment 10 and store the data as a process log each time a process is performed (each Run).

[0016] The server device 16 may store, for example, information about multiple semiconductor manufacturing devices 10 in one or more manufacturing factories 2 (such as the recipe for the process performed by the semiconductor manufacturing device 10, sensor data and result data when the process is performed by executing that recipe) as a process log for each run.

[0017] The equipment controller 12 and the server device 16 may display information about the semiconductor manufacturing equipment 10 on the operator terminal 18, or may notify the operator of the operator terminal 18 by email or the like. At least one of the equipment controller 12, the server device 16, and the operator terminal 18 has a function to edit a recipe to be executed by the semiconductor manufacturing equipment 10. The equipment controller 12, the server device 16, and the operator terminal 18 in FIG. 1 are an example of an information processing device according to this embodiment.

[0018] It should be noted that the semiconductor manufacturing system 1 shown in Fig. 1 is merely an example, and it goes without saying that there are various system configurations depending on the application and purpose. The division of the equipment into the equipment controller 12 and the server device 16 in Fig. 1 is merely an example. For example, various configurations are possible, such as a configuration in which the equipment controller 12 and the server device 16 are integrated, or a configuration in which they are further separated.

[0019] <Hardware configuration> The equipment controller 12, server device 16, and operator terminal 18 shown in Fig. 1 may be realized by a computer having the hardware configuration shown in Fig. 2. Fig. 2 is a hardware configuration diagram of an example of a computer 500.

[0020] 2 includes an input device 501, an output device 502, an external I / F (interface) 503, a RAM (random access memory) 504, a ROM (read only memory) 505, a CPU (central processing unit) 506, a communication I / F 507, and an HDD (hard disk drive) 508, all of which are interconnected by a bus B. The input device 501 and the output device 502 may be connected and used when necessary.

[0021] The input device 501 is a keyboard, mouse, touch panel, etc., and is used by an operator to input operation signals. The output device 502 is a display, etc., and displays the results of processing by the computer 500. The communication I / F 507 is an interface that connects the computer 500 to the networks 20 and 22 shown in Figure 1. The HDD 508 is an example of a non-volatile storage device that stores programs and data.

[0022] The external I / F 503 is an interface with an external device. The computer 500 can read from a recording medium 503a such as an SD (Secure Digital) memory card via the external I / F 503. The external I / F 503 may also be able to write to the recording medium 503a such as an SD memory card via the external I / F 503.

[0023] The ROM 505 is an example of a non-volatile semiconductor memory (storage device) that stores programs and data. The RAM 504 is an example of a volatile semiconductor memory (storage device) that temporarily stores programs and data. The CPU 506 is an arithmetic unit that reads programs and data from a storage device such as the ROM 505 or HDD 508 onto the RAM 504 and executes processing to realize overall control and functions of the computer 500.

[0024] The equipment controller 12, server device 16, and operator terminal 18 of the semiconductor manufacturing system 1 shown in FIG. 1 execute programs on the computer 500 shown in FIG. 2 to realize various functions described below.

[0025] <Functional configuration> In the following, an example will be described in which the information processing device that edits the recipe to be executed by the semiconductor manufacturing equipment 10 is the equipment controller 12. Note that the information processing device that edits the recipe to be executed by the semiconductor manufacturing equipment 10 may be the server device 16 or the operator terminal 18.

[0026] The equipment controller 12 of the semiconductor manufacturing system 1 according to this embodiment is realized by, for example, the functional blocks shown in Fig. 3. Fig. 3 is a functional block diagram of an example of the equipment controller 12 according to this embodiment. Note that the functional block diagram of Fig. 3 omits illustration of components that are not necessary for explaining this embodiment.

[0027] The device controller 12 executes a program for the device controller 12 to implement a display block operation receiving unit 30, a property setting input receiving unit 32, a display control unit 34, a recipe editing unit 36, and a data storage unit 38. The data storage unit 38 has a display block storage unit 40, a property setting storage unit 42, an arrangement storage unit 44, and a recipe storage unit 46.

[0028] The display block operation receiving unit 30 receives an input of the duration for which the category settings are to continue, through the operation of an operator who arranges on the screen a plurality of display blocks that visually represent the settings of at least one of a plurality of categories included in a recipe. The function of the display block operation receiving unit 30 will be described in detail later.

[0029] The property setting input receiving unit 32 receives, from the operator, input of setting values ​​for setting items included in the category settings for each display block arranged on the screen. The input of setting values ​​for setting items included in the category settings is input of property settings. The function of the property setting input receiving unit 32 will be described in detail later.

[0030] The display control unit 34 displays a screen for the worker to edit the recipe on the output device 502 such as a display. The screen for the worker to edit the recipe will be described in detail later.

[0031] The recipe editing unit 36 ​​edits a recipe by arranging steps in order, with the minimum step being a combination of all the setting items for which setting values ​​have been set and the duration of the settings, based on the input of the duration of the category settings and the setting values ​​for the setting items. The details of the functions of the recipe editing unit 36 ​​will be described later.

[0032] The data storage unit 38 stores various data used by the display control unit 34 and the recipe editing unit 36. The display block storage unit 40 of the data storage unit 38 stores data on display blocks that can be used by the worker. The property setting storage unit 42 stores data on property settings input by the worker for each display block. The arrangement storage unit 44 stores data on the arrangement of display blocks displayed on the screen by the worker's operation. The recipe storage unit 46 stores data on recipes edited based on the arrangement of display blocks displayed on the screen by the worker's operation and the property settings input by the worker for each displayed display block.

[0033] The semiconductor manufacturing apparatus 10 according to this embodiment performs a process by executing a recipe stored in the recipe storage unit 46. The recipe executed by the semiconductor manufacturing apparatus 10 divides the process into sections called steps as the smallest units, and for each step, setting values ​​are set for setting items in various categories such as temperature, gas, pressure, plasma, and mechanism.

[0034] A step is made up of a combination of all setting items for which setting values ​​are set in various categories, such as temperature, gas, pressure, plasma, and mechanics, as well as the duration of the settings. The semiconductor manufacturing equipment 10 performs a process by executing a recipe, which is a sequence of steps.

[0035] <Outline of this embodiment> Recipe Fig. 4 is a diagram showing an example of a recipe executed by semiconductor manufacturing equipment 10. As shown in Fig. 4, the recipe is divided into steps. A step in Fig. 4 is made up of a combination 1000 of all setting items for which setting values ​​are set in various categories such as temperature, pressure, gas, and mechanics, and a time 1002 for which the setting is maintained.

[0036] In recent years, the number of actuators and sensors in semiconductor manufacturing equipment 10 has increased with the trend toward miniaturization. Therefore, the number of setting items in the recipe of Fig. 4 has increased, and editing of the recipe to be executed by semiconductor manufacturing equipment 10 has become more complicated. For example, the setting items in the recipe of Fig. 4 are simplified compared to the actual recipe.

[0037] For example, the setting items in the temperature category include set temperatures and ramp rates for multiple zones, a control mode, and a PID table, as shown in Fig. 5, and setting values ​​1004 are required for all steps. Fig. 5 is a configuration diagram of an example of setting items in the temperature category.

[0038] Furthermore, since a step is made up of a combination of setting values ​​for all setting items in various categories and the time for which those setting values ​​are maintained, if there is even one change in a setting value in another category, it is necessary to continue inputting the same setting value 1006 as shown in Fig. 6. Fig. 6 is a diagram illustrating an example of a recipe in which the same setting values ​​are input.

[0039] In this way, editing a recipe to be executed by semiconductor manufacturing equipment 10 increases the number of steps associated with an increase in the number of combinations of setting items, increasing the burden on the operator.

[0040] Furthermore, with the recent improvement in the performance of AI (artificial intelligence), AI can calculate (infer) optimal settings for setting items included in a recipe, even for continuously changing setting values. However, a recipe requires inputting setting values ​​and rates 1010 for setting items of various categories step by step, and is basically only capable of step responses.

[0041] For example, when incorporating continuously changing setting values ​​calculated by AI into a recipe, the recipe needs to be divided into steps with the smallest unit of time (for example, 1 second) as shown in Figure 7. Figure 7 is a diagram showing an example of a recipe into which continuously changing setting values ​​have been input. Therefore, setting values ​​1012 other than those for setting items whose setting values ​​change continuously need to be input continuously even though they are the same value.

[0042] Furthermore, when continuously changing setting values ​​are incorporated into a recipe, it is also possible to set the continuously changing setting values ​​in a separate table 1016 and refer to table 1016, as shown in Fig. 8. Fig. 8 is a diagram illustrating an example of a recipe in which continuously changing setting values ​​are input.

[0043] However, the step time is a common time for all setting items in that step, so it is necessary to match the step time with the time during which the setting values ​​set in table 1016 change continuously.

[0044] Furthermore, as shown in Fig. 9, when it is desired to change a set value of another category with a different step time while the temperature is changing with a continuously changing set value, the times may not be consistent. Fig. 9 is a diagram showing an example of a recipe in which a set value of another category is changed with a different step time while the temperature is changing with a continuously changing set value. For example, in Fig. 9, the time 1014 for the pressure and gas setting items is not consistent with the time 1018 set in table 1016. This is a problem with using a common time for each category.

[0045] To solve this problem, it is necessary to assign a step time to each category, as shown in Fig. 10. Fig. 10 is a diagram showing an example of a recipe in which a step time is assigned to each category. In the example of Fig. 10, for example, an operator needs to adjust and align the step times of each category in order to align the timing 1020 between each category.

[0046] Therefore, in the semiconductor manufacturing system 1 according to this embodiment, when an operator edits a recipe using, for example, a recipe editing CAD (Computer Aided Design), the timing at which the setting values ​​of the setting items in each category change is displayed graphically as described below. This makes it easier for the operator to match the timing at which the setting values ​​of the setting items in each category change, making it easier to edit recipes in the semiconductor manufacturing system 1 according to this embodiment.

[0047] <Recipe editing screen> The equipment controller 12 according to this embodiment displays a recipe editing screen 2000 such as that shown in Fig. 11, making it easy for the operator to edit the recipe. Fig. 11 is an image diagram of an example of the recipe editing screen 2000 according to this embodiment.

[0048] In the recipe editing screen 2000, a plurality of display blocks that visually represent the settings of at least one of a plurality of categories included in the recipe are prepared in a toolbox 2002. The display blocks may be displayed in a visually distinguishable manner, such as by color-coding the categories used, to make them easy for the operator to identify.

[0049] The worker moves and arranges the display blocks to be used in the recipe editing area 2004 by operations such as drag and drop. The width of the display blocks arranged in the recipe editing area 2004 represents time. The worker can move multiple display blocks from the toolbox 2002 to the recipe editing area 2004 and arrange them as shown in FIG. 11, for example.

[0050] For example, in the case of setting the temperature category shown in the recipe editing area 2004 in Fig. 11, the operator moves the display blocks of "Load," "Temperature increase," and "Temperature decrease" selected from the toolbox 2002 to the recipe editing area 2004 and arranges them horizontally. The duration for which the temperature category setting shown by the display block continues is linked to the width of the display block, making it easy for the operator to recognize.

[0051] The worker can also display a property setting area 2006 by selecting a display block in the recipe editing area 2004 by clicking or other operation. The property setting area 2006 accepts input of setting values ​​from the worker for setting items included in the settings of the category indicated by the display block.

[0052] For example, the property setting area 2006 in FIG. 11 accepts input of setting values ​​from the operator for the setting items "Set Temperature," "Ramp Rate," "PID Parameter," "Alarm Monitoring," and "AI-Generated Setting Value," which are included in the setting of the temperature category indicated by the display block for "Temperature Rise" in the recipe editing area 2004. Furthermore, for the setting item "AI-Generated Setting Value," a continuously changing setting value calculated by the AI ​​may be set in another table (for example, table 1016 shown in FIG. 8, etc.), and that table may be specified. Note that the display block for "Temperature Rise to 600°C" in the recipe editing area 2004 in FIG. 11 additionally displays the representative temperature "600°C" set in the setting item "Set Temperature" in the property setting area 2006.

[0053] In the recipe editing screen 2000 of FIG. 11, properties can be set for each display block, so even if settings in other categories change, they can be expressed with a single setting, and there is no need to keep inputting the same setting values.

[0054] 11, the width of the display block represents time, so the timing at which the setting values ​​of the setting items in each category change can be visually adjusted. This makes it easier for the operator to adjust the timing at which the setting values ​​of the setting items in each category change, making it easier to edit recipes.

[0055] 11, the recipe editing screen 2000 does not have the concept of steps, and allows settings for each category to be made independently. As a result, the recipe editing screen 2000 in FIG. 11 has the minimum necessary expression, making it easy for the operator to understand.

[0056] <Examples of display block types> Examples of types of display blocks include a temperature block that visually represents the temperature category settings, a pressure block that visually represents the pressure category settings, a gas block that visually represents the gas category settings, a mecha Boat rotation block and a mecha Boat ELV block that visually represent the mecha category settings, and a special film formation block that visually represents the special film formation settings.

[0057] FIG. 12 is a diagram illustrating a display block for "Temperature rise 500°C," an example of a temperature block. FIG. 12(A) shows an example of property settings for the display block for "Temperature rise" where the representative temperature is "500°C." FIG. 12(A) shows an example of an external table "Table 1" referenced by the setting item "PID parameters." FIG. 12(B) shows an example of "Table 1" in which the setting value for the setting item "PID parameters" is set. FIG. 12(C) shows an example of an operational image for the property settings shown in FIG. 12(A) and FIG. 12(B).

[0058] FIG. 13 is a diagram illustrating a display block for "Temperature Drop 400°C," an example of a temperature block. FIG. 13(A) shows an example of property settings for the "Temperature Drop" display block, where the representative temperature is "400°C." In FIG. 13(A), an external table "Table 1" is set to reference the setting item "PID parameters." "Table 1," in which the setting values ​​for the setting item "PID parameters" are set, is omitted. FIG. 13(B) shows an example of an operation image for the property settings shown in FIG. 13(A). FIG. 13(B) shows an operation image in which high-speed cooling is performed using air blow to 430°C, and then stabilization is achieved at 400°C using cascade control.

[0059] Fig. 14 is a diagram illustrating the display block "Load 400°C" as an example of a temperature block. Fig. 14(A) shows an example of property settings for the display block "Load" where the representative temperature is "400°C". Fig. 14(B) shows an example of an operational image in the case of the property settings shown in Fig. 14(A).

[0060] FIG. 15 is a diagram illustrating the display block "SVAC," an example of a pressure block. FIG. 15(A) shows an example of property settings for a display block for creating a vacuum. FIG. 15(A) shows an example of an external table "Table 1" referenced in the setting item "PID parameters." FIG. 15(B) shows an example of "Table 1" in which the setting value for the setting item "PID parameters" is set. FIG. 15(C) shows an example of an operational image for the property settings shown in FIG. 15(A) and FIG. 15(B).

[0061] Figure 16 is a diagram illustrating the "MV Open" display block, an example of a pressure block. Figure 16(A) shows that there are no particular property settings for the "MV Open" display block. Figure 16(B) shows an example of the operation image for the "MV Open" display block.

[0062] Figure 17 is a diagram illustrating the "MV Close" display block, an example of a pressure block. Figure 17(A) shows that there are no particular property settings for the "MV Close" display block. Figure 17(B) shows an example of the operation image for the "MV Close" display block.

[0063] FIG. 18 is a diagram illustrating the display block of "Pressure Control," an example of a pressure block. FIG. 18(A) shows an example of property settings for the display block of "Pressure Control," where the pressure set value is "5 Torr." FIG. 18(A) shows the setting of an external table "Table 1" referenced in the setting item "PID Parameter." FIG. 18(B) shows an example of "Table 1" in which the setting value for the setting item "PID Parameter" is set. FIG. 18(C) shows an example of an operation image in the case of the property settings shown in FIG. 18(A) and FIG. 18(B). The display block of "Pressure Control" shown in FIG. 18 displays, for example, the setting value "5 Torr" set in the setting item "Pressure Set Value" of the property settings in FIG. 18(A).

[0064] Figure 19 is a diagram illustrating the "ATM" display block, which is an example of a pressure block. Figure 19(A) shows an example of property settings for the "ATM" display block for returning the pressure to normal by flowing gas. Figure 19(B) shows an example of an operational image for the property settings shown in Figure 19(A).

[0065] FIG. 20 is a diagram illustrating display blocks of "N2", "SiH4", and "NH3" as an example of a gas block.

[0066] Figure 20(A) shows an example of property settings for a display block where the gas is "N2". In Figure 20(A), the external table "Table1" referenced in the setting item "PID parameters" is set. "Table1" in which the setting value of the setting item "PID parameters" is set is omitted. Figure 20(B) shows an example of the operation image of the gas "N2" in the case of the property settings shown in Figure 20(A).

[0067] Figure 20(C) shows an example of property settings for a display block where the gas is "SiH4". In Figure 20(C), the external table "Table1" referenced in the setting item "PID parameters" is set. "Table1" in which the setting value of the setting item "PID parameters" is set is omitted. Figure 20(D) shows an example of the operation image of the gas "SiH4" in the case of the property settings shown in Figure 20(C).

[0068] Figure 20(E) shows an example of property settings for a display block where the gas is "NH3". In Figure 20(E), the external table "Table1" referenced in the setting item "PID parameters" is set. "Table1" in which the setting value of the setting item "PID parameters" is set is omitted. Figure 20(F) shows an example of the operation image of the gas "NH3" in the case of the property settings shown in Figure 20(E).

[0069] FIG. 21 is a diagram illustrating the "Rotate" display block of the Mecha Boat rotation block, the "Load" display block of the Mecha Boat ELV block, and the "Unload" display block of the Mecha Boat ELV block.

[0070] Figure 21(A) shows an example of the property settings for the "Rotate" display block of the mechanical boat rotation block. Figure 21(B) shows an example of the rotation operation of the boat in the case of the property settings shown in Figure 21(A).

[0071] Figure 21(C) shows an example of the property settings for the "Load" display block of the Mecha BoatELV block. Figure 21(D) shows an example of the operation image of raising (loading) the boat in the case of the property settings shown in Figure 21(C).

[0072] Figure 21(E) shows an example of the property settings for the "Unload" display block of the Mecha BoatELV block. Figure 21(F) shows an example of the operation image of lowering (unloading) the boat in the case of the property settings shown in Figure 21(E).

[0073] Figure 22 is a diagram illustrating the "ALD" display block, which is an example of a special deposition block. Figure 22(A) shows an example of property settings for the "ALD" display block, which can also accommodate continuous data combinations of multiple gases and pressures, such as ALD (Atomic Layer Deposition). Figure 22(B) shows an example of an operational image of the deposition gas flow rate, reaction gas flow rate, and purge gas flow rate for the property settings shown in Figure 22(A).

[0074] Figure 23 is a diagram illustrating the "TVS" display block, which is an example of a special film formation block. Figure 23(A) shows an example of property settings for the "TVS" display block, which can also handle temperature drops during film formation, such as TVS. Figure 23(B) shows, as an example of an operational image, temperature drops during film formation and temperature increases outside of film formation, in the case of the property settings shown in Figure 23(A).

[0075] <Recipe editing area display example> 24 to 26 are explanatory diagrams showing an example of the recipe editing area 2004 in which display blocks are arranged. In FIG. 24, an "ATM" display block is arranged, which visually represents the settings of the pressure category and the gas category. In FIG. 25, an "ALD" display block is arranged, which visually represents the settings of the pressure category and the gas category. In addition, in FIG. 26, a "TVS" display block is included, which visually represents the settings of the temperature category, the pressure category, and the gas category.

[0076] In the recipe editing area 2004 of Figures 24 to 26, dotted lines are arranged to visually represent the check settings shown in Figures 27 and 28. Figures 27 and 28 are diagrams for explaining the check settings visually represented in the recipe editing area 2004. Figures 27(A) to (D) and Figures 27(E) to (G) show examples of property settings for various types of checks.

[0077] As shown in Figures 24 to 26, the operator can place dotted lines in the recipe editing area 2004 that visually represent the check settings, taking into account the timing of the checks, and easily perform property settings as shown in Figures 27 and 28.

[0078] <Conversion to existing recipe structure> The recipe editing unit 36 ​​edits a recipe of an existing recipe structure that can be executed by the semiconductor manufacturing equipment 10 based on the arrangement of the display blocks in the recipe editing area 2004 and the property settings input in the property setting area 2006 .

[0079] FIG. 29 is an image diagram of an example of a process for editing a recipe 3000 of an existing recipe structure based on the arrangement of display blocks in the recipe editing area 2004 and the property settings input in the property setting area 2006.

[0080] Since there is no concept of steps in the recipe editing area 2004, the recipe editing unit 36 ​​converts the recipe into a recipe 3000 with an existing recipe structure, for example, in accordance with the procedure shown in the flowchart of Fig. 30. Fig. 30 is a flowchart of an example of a process for converting to an existing recipe structure.

[0081] In step S10, recipe editing unit 36 ​​acquires information about the layout of display blocks in recipe editing area 2004. The information about the layout of display blocks in recipe editing area 2004 indicates the time for which the setting value of a setting item is to be maintained.

[0082] In step S12, the recipe editing unit 36 ​​acquires information about the property settings entered in the property setting area 2006. The information about the property settings entered in the property setting area 2006 represents the setting values ​​entered for the setting items.

[0083] In step S14, the recipe editing unit 36 ​​outputs a step consisting of a combination of all setting items for which setting values ​​have been set and a minimum time. The steps output in step S14 are minimum-unit steps with a minimum time (for example, 1 second) that take into consideration that they will be combined in later processing. Therefore, the steps output in step S14 may include a series of steps in which all setting values ​​for the setting items are the same.

[0084] In step S16, the recipe editing unit 36 ​​repeats the process of combining steps having the same setting values ​​for all setting items until it is determined in step S18 that there are no steps that can be combined.

[0085] If it is determined in step S18 that there are no remaining steps that can be combined, then in step S20, the recipe editing unit 36 ​​edits a recipe 3000 of an existing recipe structure that can be executed by the semiconductor manufacturing equipment 10, in which the combined steps are arranged in order.

[0086] The recipe 3000 edited by the recipe editing unit 36 ​​may refer to another table 3002 in which continuously changing setting values ​​are set, as shown in FIG.

[0087] The semiconductor manufacturing system 1 according to this embodiment can provide a technique that allows an operator to more easily edit recipes to be executed by the semiconductor manufacturing equipment 10.

[0088] Although the preferred examples of this embodiment have been described in detail above, this embodiment is not limited to the above-described examples, and various modifications and substitutions can be made to the above-described examples without departing from the scope of this embodiment.

[0089] The semiconductor manufacturing apparatus 10 of the present disclosure can be applied to any type of apparatus, such as an atomic layer deposition (ALD) apparatus, a capacitively coupled plasma (CCP) apparatus, an inductively coupled plasma (ICP) apparatus, a radial line slot antenna (RLSA) apparatus, an electron cyclotron resonance plasma (ECR) apparatus, or a helicon wave plasma (HWP) apparatus. The semiconductor manufacturing apparatus 10 of the present disclosure can also be applied to a chemical vapor deposition (CVD) apparatus and an oxidation / annealing apparatus.

[0090] The semiconductor manufacturing system 1 of the present disclosure is not limited to the configuration shown in Fig. 1, and there are, of course, various system configuration examples depending on the application and purpose. The semiconductor manufacturing apparatus 10 of the present disclosure can be applied to any of a single-wafer apparatus that processes substrates one by one, a batch apparatus that processes multiple substrates at once, and a semi-batch apparatus. Processes performed by the semiconductor manufacturing apparatus 10 of the present disclosure include, for example, film formation processing and etching processing. [Explanation of symbols]

[0091] 1. Semiconductor manufacturing systems 10. Semiconductor manufacturing equipment 12 Equipment Controller 16 Server equipment 18 Worker terminal 30 Display block operation reception section 32 Property setting input reception section 34 Display control unit 36 Recipe Editorial Department 38 Data storage unit

Claims

1. In an information processing device that edits a recipe to be executed by a semiconductor manufacturing device, a display block operation receiving unit that receives an input of a duration for setting the category by an operator's operation of arranging a plurality of display blocks on a screen, the display blocks visually representing at least one of the settings of the plurality of categories included in the recipe; and a property setting input receiving unit that receives, from an operator, input of setting values ​​for setting items included in the setting of the category for each of the display blocks arranged on the screen; a recipe editing unit that edits a recipe in which a step consisting of a combination of all setting items for which the setting values ​​are set and a duration of the setting is set, as a minimum unit, based on the duration of the setting of the category and the input of the setting values ​​for the setting items, and arranges the steps in order; An information processing device having the above.

2. The display block operation receiving unit receives an operation by a worker to connect and arrange the display blocks, each representing a duration of the setting of the category by a width.

2. The information processing device according to claim 1.

3. The property setting input receiving unit receives input of the setting value from the operator according to the setting of the reference table.

2. The information processing device according to claim 1.

4. The recipe editing unit outputs a step consisting of a combination of all setting items for which the setting values ​​are set and a time shorter than the duration of the setting as a minimum unit, and edits a recipe in which the steps having the same setting values ​​are combined and then the steps are arranged in order.

2. The information processing device according to claim 1.

5. The display block visually represents at least one of a temperature category setting, a pressure category setting, a gas category setting, a mechanical category setting, and a special film formation setting included in the recipe. The information processing device according to claim 1 .

6. A recipe editing method performed by an information processing device that edits a recipe to be executed by a semiconductor manufacturing device, comprising: receiving an input of a duration for which the setting of at least one category is to continue by an operator's operation of arranging a plurality of display blocks on a screen, the display blocks visually representing the setting of at least one category among the settings of a plurality of categories included in the recipe; receiving, from an operator, input of setting values ​​for setting items included in the setting of the category for each of the display blocks arranged on the screen; editing a recipe in which a step consisting of a combination of all setting items for which the setting values ​​are set and a time for continuing the setting is taken as the smallest unit based on the time for continuing the setting of the category and the input of the setting values ​​for the setting items, and arranging the steps in order; A recipe editing method comprising:

7. A semiconductor manufacturing device comprising the information processing device according to any one of claims 1 to 4.

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