Mounting device

Abstract

To perform position control of a cylinder rod holding a member to be bonded such as a chip or a substrate in a vertical direction and a rotational direction with high accuracy.SOLUTION: A bonding head 100 includes: a double-acting air bearing cylinder 10 that moves a cylinder rod 11 in a vertical direction by a first vertical movement amount; a first scale 22 that is disposed coaxially with the cylinder rod 11 and has a first encoder pattern 21; a first encoder sensor 23 that reads a position of a first encoder pattern 21; a second scale 25 that is disposed coaxially with the cylinder rod 11 and has a second encoder pattern 24; a second encoder sensor 26 that reads the position of the second encoder pattern 24; a shaft motor 30 that is disposed coaxially with the cylinder rod 11 and moves the cylinder rod 11 in the vertical direction by a second vertical movement amount based on the reading result of the first encoder sensor 23; and a piezo motor 40 that is disposed coaxially with the cylinder rod 11 and moves the cylinder rod 11 by a rotational movement amount in a rotational direction.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a mounting apparatus. [Background technology]

[0002] In order to achieve low power consumption and high drive speeds, semiconductor devices are becoming increasingly multi-layered, and the chip bonding process, which involves stacking semiconductor chips such as CoC (Chip on Chip) and CoW (Chip on Wafer) and assembling semiconductor packages, is changing from the conventional wire bonding method for connecting contacts to a more space-saving flip chip or through-silicon via (TSV) connection method.

[0003] In the case of wire bonding, a bonding accuracy of several tens of microns is sufficient. In contrast, in connection methods such as flip chips, as bumps become finer and denser and chip sizes become larger, sub-micron mounting accuracy is required to reduce the impact of bump misalignment due to angular error while also improving mounting load and productivity. Therefore, in addition to vertical position control, position control in the rotational direction of the bonding head is also important.

[0004] Furthermore, when flip-chip mounting wafers, semiconductor chips, interposers, and other bonded components, high-precision image processing for position control is also important. However, increasing the magnification to increase the pixel resolution of the image results in a shallow depth of field, so high-precision vertical position control is also required.

[0005] Patent Document 1 below discloses a pressure device that controls the pressure on a pressure target object with a pressure that corresponds to the pressure target object, such as a chip or a substrate. Also, Patent Document 2 below discloses a fluid pressure actuator that enables position control of a rod in the rotational direction in addition to the vertical direction. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-64127 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-113868 Summary of the Invention [Problem to be solved by the invention]

[0007] The device in Patent Document 1 controls the vertical position and load, but cannot control the rotational direction, so mounting accuracy cannot be ensured. Also, the device in Patent Document 2 controls rotation to adjust the bonding position, but the rotation axis and the rod axis are not coaxial but are arranged separately, making it difficult to control the rotational position with high accuracy.

[0008] The present invention has been made in consideration of the above-mentioned circumstances, and specifically, an object of the present invention is to provide a mounting device that can control the vertical and rotational position of a cylinder rod that holds a member to be joined, such as a chip or a substrate, with high precision. [Means for solving the problem]

[0009] The above object can be achieved by any one of the following means (1) to (7).

[0010] (1) A mounting device comprising a bonding head and a bonding stage, wherein the bonding head comprises a double-acting air bearing cylinder having a cylinder rod extending in a vertical direction and moving the cylinder rod in the vertical direction by a first vertical movement amount; a first scale arranged coaxially with the cylinder rod to allow for a range of motion in the rotational direction of the cylinder rod and having a first encoder pattern consisting of a pattern sequence by which the vertical position of the cylinder rod can be detected; a first encoder sensor arranged at a position opposite to the first scale and reading the position of the first encoder pattern; and a second encoder sensor arranged coaxially with the cylinder rod to allow for a range of motion in the vertical direction of the cylinder rod and having a first encoder pattern consisting of a pattern sequence by which the vertical position of the cylinder rod can be detected. a second scale having a second encoder pattern consisting of a pattern sequence whose position can be detected; a second encoder sensor disposed opposite the second scale and configured to read the position of the second encoder pattern; a shaft motor disposed coaxially with the cylinder rod and configured to move the vertical position of the cylinder rod by a second vertical movement amount during vertical position setting based on the reading result of the first encoder sensor so that the vertical position of the cylinder rod becomes a target vertical position; and a piezo motor disposed coaxially with the cylinder rod and configured to move the cylinder rod in a rotational direction by the rotational movement amount based on the reading result of the second encoder sensor so that the rotational position of the cylinder rod becomes a target rotational position.

[0011] (2) The mounting device according to (1)1 above, wherein the second scale is provided at the bottom of the cylinder rod of the double-acting air bearing cylinder.

[0012] (3) The mounting device according to (1) or (2) above, wherein the double-acting air bearing cylinder is disposed below the shaft motor.

[0013] (4) A mounting device according to any one of (1) to (3) above, comprising: a spline shaft, a spline nut, and an angular bearing including an outer raceway fixed to the housing of the bonding head and an inner raceway fixed to the spline nut; a ball spline disposed above the shaft motor to transmit the driving force of the piezoelectric motor; a flexible coupling connecting a lower part of the spline shaft and an upper part of the magnet rod of the shaft motor so as to be synchronously rotatable; a rigid coupling connecting a lower part of the magnet rod of the shaft motor and an upper part of the cylinder rod of the double-acting air bearing cylinder so as to be synchronously rotatable; and a rotor fixed to the spline nut, converting the driving force of the piezoelectric motor into rotational force and transmitting it to the spline nut.

[0014] (5) The mounting device described in any one of (1) to (4) above, wherein the second encoder sensor is arranged in multiple locations around the second scale and detects horizontal positional deviation of the rod tip of the double-acting air bearing cylinder.

[0015] (6) A mounting device described in any one of (1) to (5) above, wherein the double-acting air bearing cylinder is provided with a servo valve that adjusts the amount of air flowing in and out of the cylinder so that the cylinder rod moves by the first vertical movement amount.

[0016] (7) The mounting device according to any one of (1) to (6) above, comprising a control device including: a calculation unit that calculates an average thrust force of the shaft motor; an acquisition unit that acquires the driving state of the shaft motor; a judgment unit that compares the average thrust force calculated by the calculation unit with a preset threshold value to determine whether the average thrust force exceeds the threshold value; and a drive control unit that adjusts the opening of the servo valve of the double-acting air bearing cylinder based on the judgment result of the judgment unit so that the load on the shaft motor does not exceed an allowable value. [Effects of the Invention]

[0017] A mounting device according to one embodiment of the present invention can control the vertical and rotational positions of a shaft motor and a cylinder rod that holds a member to be joined, such as a chip or a substrate, with high precision. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a schematic configuration diagram of a mounting device according to an embodiment of the present invention; [Figure 2] FIG. 2 is a schematic diagram of a bonding head. [Figure 3A] FIG. 1 is a diagram illustrating the configuration of the first scale. [Figure 3B] FIG. 10 is a diagram illustrating the configuration of the second scale. [Figure 4A] 10 is a diagram showing an arrangement of a second encoder sensor relative to a second scale of a second position detection unit. FIG. [Figure 4B] 10A and 10B are diagrams illustrating other arrangements of the second encoder sensor relative to the second scale of the second position detection section. [Figure 5] FIG. 2 is a diagram showing an arrangement of piezo motors. [Figure 6] FIG. 2 is a functional block diagram of the mounting device. [Figure 7] 10 is a flowchart showing the flow of a bonding process of the mounting device. [Figure 8] 10 is a flowchart showing a flow of control of the position of the cylinder rod in the vertical direction. [Figure 9] 10 is a flowchart showing a flow of position control in the rotation direction of the cylinder rod. [Figure 10] 10 is a flowchart showing processing control of a servo valve. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following drawings, the same reference numerals refer to the same components, and the size of each component in the drawings may be exaggerated for clarity and convenience. Meanwhile, the embodiments described below are merely examples, and various modifications are possible from such embodiments.

[0020] Hereinafter, the terms "upper" and "above" may include not only what is directly above in contact with something, but also what is above without contact. Similarly, the terms "lower" and "below" may include not only what is directly below in contact with something, but also what is below without contact.

[0021] The singular expression includes the plural expression unless the context clearly dictates otherwise. Furthermore, when a part "includes," "comprises," or "has" a certain element, it does not mean that it excludes other elements, but that it may further include other elements, unless otherwise specified to the contrary.

[0022] Unless explicitly stated or stated to the contrary, steps constituting a method may be performed in any suitable order, and are not necessarily limited to the order of the steps described. The use of any examples or exemplary terms is merely for the purpose of illustrating the technical idea, and the scope of the invention is not limited by the examples or exemplary terms, except as limited by the scope of the claims.

[0023] In the following description, when ordinal numbers such as "first" and "second" are used, unless otherwise specified, they are used for convenience and do not stipulate any particular order.

[0024] A mounting apparatus 1 according to this embodiment will be described.

[0025] For ease of explanation, an XYZ Cartesian coordinate system is set for the mounting device 1. The direction parallel to the X axis within a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis, which is orthogonal to the X axis within the predetermined plane, is defined as the Y-axis direction. The direction parallel to the Z axis, which is orthogonal to both the X axis and the Y axis, is defined as the Z-axis direction. In this embodiment, the predetermined plane is the XY plane, which is parallel to the horizontal plane, and the Z axis is the vertical direction, which is orthogonal to the predetermined plane. The Z axis coincides with the direction along the central axis C shown in FIG. 2. Note that the up, down, left, and right directions in the following description and in the configurations illustrated in each figure are directions assuming that the mounting device is installed on a horizontal surface as a normal installation state, and the up, down, left, and right directions in each figure are defined as the up, down, left, and right directions as seen from the user.

[0026] 1, the mounting apparatus 1 includes a bonding head 100 that holds a first bonding member M1, a mounting table 200, a bonding stage 300, and an imaging device 400. The mounting apparatus 1 also includes a control device 500 that comprehensively controls the driving of each component constituting the apparatus and various processes. The mounting apparatus 1 can include other components in addition to the above-described components depending on the process to be executed.

[0027] The bonding head 100 suction-holds the first bonding member M1 with a head 120 provided at the lower tip of the cylinder rod 11. The first bonding member M1 held by the head 120 is a member to be mounted on a second bonding member M2 such as a chip, die, or interposer.

[0028] 1, the bonding head 100 is attached to a base 2 of the mounting apparatus 1 so as to be movable in the Y-axis direction (left and right direction in the figure) by a driving mechanism 110 such as a linear motor. This allows the bonding head 100 to move along the Y-axis direction between the mounting table 200 and the bonding stage 300.

[0029] The bonding head 100 picks up the first bonding member M1 placed on the mounting table 200 with the head 120 and moves it in the Y-axis direction to the bonding stage 300. Thereafter, the bonding head 100 bonds the first bonding member M1 to the second bonding member M2 on the bonding stage 300.

[0030] Next, the configuration of the bonding head 100 will be described. As shown in Fig. 2, the bonding head 100 includes a double-acting air bearing cylinder 10, a rigid coupling 20, a shaft motor 30, a flexible coupling 40, a ball spline 50, a rotor 60, a piezoelectric motor 70, and a position detection unit 80. In the bonding head 100, the double-acting air bearing cylinder 10, the rigid coupling 20, the shaft motor 30, the flexible coupling 40, the ball spline 50, the rotor 60, and the first scale 81a and the second scale 82a of the position detection unit 80 are arranged coaxially with the cylinder rod 11 of the double-acting air bearing cylinder 10 (on the central axis C in Fig. 2). The central axis C is the central axis of the mounting device 1 and is also the central axis of each component arranged coaxially with the cylinder rod 11.

[0031] The double-acting air bearing cylinder 10 comprises a cylinder rod 11, an air bearing 12, a pressure sensor 13, and a servo valve 14. Under the control of the control unit 510, the double-acting air bearing cylinder 10 can move the cylinder rod 11 up and down within a range of approximately 10 mm in the Z-axis direction based on a first vertical movement amount. Air at a predetermined pressure is drawn into the double-acting air bearing cylinder 10 from the cylinder air supply port 10b. The pressure inside the housing 10a can be obtained by the pressure sensor 13.

[0032] The cylinder rod 11 has a columnar shape extending in the Z-axis direction and is attached to the housing 10a via air bearings 12 at its lower, middle, and upper parts. The air bearings 12 support the cylinder rod 11 so that it can move up and down along the Z-axis direction and in a rotational direction around the Z-axis direction as its axis of rotation. Pressurized air at a predetermined pressure is supplied to the air bearing 12 from a supply unit (not shown) through an air bearing air supply port 12a.

[0033] The servo valve 14 has an air intake section 14a, an exhaust section 14b, and a regulator 14c, and adjusts the valve opening of the air intake section 14a and the exhaust section 14b with the regulator 14c to move the cylinder rod 11 up and down in the Z-axis direction by a first vertical movement amount. When lowering the cylinder rod 11, the servo valve 14 allows air to flow into the upper part of the cylinder rod 11, and when raising the cylinder rod 11, the servo valve 14 releases the air inside the housing 10a from the upper part of the cylinder rod 11 to the atmosphere to reduce the pressure.

[0034] The rigid coupling 20 connects and holds the upper part (near the upper end) of the cylinder rod 11 of the double-acting air bearing cylinder 10 and the lower part (near the lower end) of the magnet rod 31 of the shaft motor 30. As shown in FIG. 2, a first holding part 21 located on the lower side of the rigid coupling 20 holds the upper part of the cylinder rod 11, and a second holding part 22 located on the upper side holds the lower part of the magnet rod 31. Because the cylinder rod 11 and magnet rod 31 are connected via the rigid coupling 20, efficient power transmission is possible without backlash.

[0035] The shaft motor 30 is composed of a magnet rod 31, which is a cylindrical shaft with a magnet inserted therein, and a coil unit 32, which is arranged to surround the magnet rod 31. The shaft motor 30 is arranged above the double-acting air bearing cylinder 10 in the Z-axis direction, so that the magnet rod 31 and the cylinder rod 11 are coaxial. Under the control of the control unit 510, the shaft motor 30 performs minute position control in the Z-axis direction using a second vertical movement amount, which is an adjustment amount from the first vertical movement amount, during vertical position setting so that the lowered position of the cylinder rod 11 becomes the target vertical position.

[0036] Furthermore, the shaft motor 30 can adjust the position of the cylinder rod 11 by a small amount using the second vertical movement amount, which also allows for focus adjustment of the imaging device 400. Therefore, when the first imaging device 410 recognizes alignment marks and the like formed on the bonding surface of the first bonding member M1, it is possible to reduce recognition errors due to changes in the focal depth.

[0037] The shaft motor 30 is located above the double-acting air bearing cylinder 10 in the Z-axis direction, and the weight of the cylinder rod 11 is canceled out by pressure control within the double-acting air bearing cylinder 10, so there is no need for the shaft motor 30 to have load-bearing capacity. Therefore, even if the maximum load of the double-acting air bearing cylinder 10 is increased, the shaft motor 30 can be used without changing its specifications. Therefore, a compact shaft motor 30 can be used. A smaller shaft motor 30 can be realized compared to using a large voice coil motor (VCM) or linear motor as a drive motor. Furthermore, the miniaturization of the shaft motor 30 is extremely effective for the operation of the mounting device 1, as it allows for a smaller and lighter mechanism to be realized compared to when a large voice coil motor (VCM) or linear motor is used as a drive motor. Furthermore, it also suppresses the effects of temperature drift due to heat generation, etc., contributing to higher precision in position control.

[0038] When the mounting device 1 moves the cylinder rod 11 a long distance at high speed, such as by the first vertical movement amount, it reduces the position control response of the shaft motor 30 and moves the cylinder rod 11 up and down using only the servo valve 14. At this time, the shaft motor 30 does not impede the control of the servo valve 14 by delaying its responsiveness. Furthermore, the mounting device 1 increases the control response of the shaft motor 30 only when the position of the cylinder rod 11 enters the stabilization region, and performs adjustment control using only the shaft motor 30. This allows the mounting device 1 to position the cylinder rod 11 with high precision.

[0039] The flexible coupling 40 connects and holds the upper part (near the upper end) of the magnet rod 31 of the shaft motor 30 and the lower part (near the lower end) of the spline shaft 51 of the ball spline 50. As shown in FIG. 2, a first holding part 41 located on the lower side of the flexible coupling 40 holds the upper part of the magnet rod 31, and a second holding part 42 located on the upper side holds the lower part of the spline shaft 51. Because the magnet rod 31 and the spline shaft 51 are connected via the flexible coupling 40, the effects of eccentricity and the like when transmitting rotation from the piezo motor 70 are absorbed and not transmitted to the double-acting air bearing cylinder 10. This allows the bonding head 100 to prevent damage to the double-acting air bearing cylinder 10.

[0040] The ball spline 50 includes a spline shaft 51, a spline nut 52, and an angular bearing 53. The upper part (near the upper end) of the spline nut 52 is fixed to the rotor 60. The outer peripheral surface of the spline nut 52, which serves as a bearing for the spline shaft 51, is fixed to an inner raceway of the angular bearing 53, and the outer raceway of the angular bearing 53 is fixed to the housing main body 130 of the bonding head 100.

[0041] The spline shaft 51 is movable up and down along the Z-axis direction (up and down) inside the cylindrical spline nut 52, and is rotatable around the long axis of the cylinder rod 11, which is along the Z-axis. As a result, the rotational force of the rotor 60, which is rotated by the piezoelectric motor 70, is transmitted from the spline shaft 51 to the cylinder rod 11 via the flexible coupling 40, the magnet rod 31, and the rigid coupling 20. In addition, because the ball spline 50 allows the spline shaft 51 to move in the Z-axis direction, it allows the cylinder rod 11 to be moved in the Z-axis direction by the double-acting air bearing cylinder 10 or the shaft motor 30.

[0042] The rotor 60 is fixed to the upper part of the spline nut 52, and converts the driving force of the piezoelectric motor 70 into rotational force and transmits it to the spline nut 52. The rotor 60 is rotated in a predetermined direction by the piezoelectric motor 70 around the longitudinal axis (central axis C) of the cylinder rod 11 as the rotation axis.

[0043] The piezo motor 70 is an actuator that rotates the rotor 60 in a predetermined direction by a predetermined angle (approximately ±5 degrees). If a contact-type piezo motor 70 is used to rotate the cylinder rod 11, hunting when the rotation direction stops can be reduced.

[0044] As shown in Figure 5, two piezo motors 70 can be installed in opposing positions across the rotor 60. This allows the piezo motors 70 to support the rotor 60 from two directions, increasing the holding force of the rotor 60 and reducing the load during rotation compared to a single motor. There is no limit to the number of piezo motors 70 that can be installed; it may be one, or three or more.

[0045] The position detection unit 80 has a first position detection unit 81 and a second position detection unit 82. The position detection unit 80 detects the current position of the cylinder rod 11 in the vertical direction and the rotational direction.

[0046] The first position detection unit 81 includes a first scale 81a and a first encoder sensor 81b. The first position detection unit 81 reads the first encoder pattern P1 of the first scale 81a with the first encoder sensor 81b, and detects the vertical position of the cylinder rod 11.

[0047] The first scale 81a has a first encoder pattern P1 formed thereon, which is a pattern sequence that enables detection of the vertical position of the cylinder rod 11. As shown in FIG. 3A, the first encoder pattern P1 is a predetermined pattern sequence formed on the outer surface of the cylindrical member. This pattern sequence can be formed by any combination of line patterns (grooves, ridges, printed lines, etc.), dot patterns, etc. The first encoder pattern P1 is formed at least within the detection range of the first encoder sensor 81b. The first encoder sensor 81b outputs the pattern information read from the first scale 81a to the control device 500 as current vertical position information (vertical position information) of the cylinder rod 11.

[0048] 3A, as long as the first encoder pattern P1 is a pattern that allows the first encoder sensor 81b to detect at least the vertical position of the cylinder rod 11. Furthermore, the number and location of the first encoder sensors 81b are not particularly limited as long as they can read the first encoder pattern P1 of the first scale 81a.

[0049] The first scale 81a is disposed integrally with the outer peripheral surface of the rigid coupling 20 so as to allow a range of motion in the rotational direction of the cylinder rod 11. As a result, the first scale 81a is disposed coaxially with the cylinder rod 11 and in the vicinity of the magnet rod 31 of the shaft motor 30, which has the effect of suppressing the occurrence of position control errors by the shaft motor 30.

[0050] The second position detection unit 82 is composed of a second scale 82a and a second encoder sensor 82b. The second position detection unit 82 reads the second encoder pattern P2 of the second scale 82a with the second encoder sensor 82b, and detects the position of the cylinder rod 11 in the rotational direction.

[0051] The second scale 82a has a second encoder pattern P2 formed thereon, which is a pattern array that can detect the position of the cylinder rod 11 in the rotational direction. The second scale 82a can be disposed so as to face the base of the second scale 82a. As shown in FIG. 3B, the second encoder pattern P2 has a pattern array formed by combining a plurality of patterns. This pattern array can be formed by any combination of line patterns (grooves, ridges, printed lines, etc.), dot patterns, etc. The second encoder pattern P2 is formed at least within the detection range of the second encoder sensor 82b. The second encoder sensor 82b outputs the pattern information read from the second scale 82a to the control device 500 as position information (rotational position information) of the current rotational direction of the cylinder rod 11.

[0052] The second scale 82a is tapped on the tip end surface corresponding to the lower part of the cylinder rod 11 and is fixed to the tip end surface with a screw. The second scale 82a moves in synchronization with the cylinder rod 11 while allowing for the vertical movement range of the cylinder rod 11. By providing the second scale 82a on the lower part of the cylinder rod 11, it is positioned near the head 120 that holds the first joining member M1, which reduces Abbe error and enables high mounting precision.

[0053] 3B, as long as the second encoder pattern P2 is a pattern that allows at least the rotational position of the cylinder rod 11 to be detected by the second encoder sensor 82b. Furthermore, the number and location of the second encoder sensors 82b are not particularly limited as long as they can read the second encoder pattern P2 of the second scale 82a.

[0054] 4A and 4B show the arrangement of the scales and sensors of the second position detection unit 82. In FIG. 4A, two second encoder sensors 82b are arranged in the circumferential direction of the second scale 82a. The two second encoder sensors 82b in FIG. 4A are arranged in positions facing each other with the second scale 82a in between. In FIG. 4B, four second encoder sensors 82b are arranged in the circumferential direction of the second scale 82a. Each of the four second encoder sensors 82b in FIG. 4B is arranged in a position facing one of the other sensors with the second scale 82a in between.

[0055] 4A and 4B, by arranging a plurality of second encoder sensors 82b in pairs with respect to the second scale 82a, it becomes possible to detect horizontal movement of the cylinder rod 11. This allows the mounting apparatus 1 to correct the amount of horizontal deviation of the cylinder rod 11 on the bonding stage 300 side through alignment processing, thereby further improving component mounting accuracy. In FIGS. 4A and 4B, the second encoder pattern P2 (not shown) formed on the second scale 82a can be formed within the detection range of the second encoder sensor 82b.

[0056] The mounting table 200 is a table having a mounting portion 210 on which the first bonding members M1 are placed. The mounting table 200 may be configured to include a drive device that moves the mounting portion 210 in the X-axis direction and the Y-axis direction in order to pick up the multiple first bonding members M1 placed on the mounting portion 210.

[0057] The bonding stage 300 holds the second bonding member M2 that bonds the first bonding member M1. The second bonding member M2 is a member that mounts the first bonding member M1, such as a wafer, chip, die, or interposer. The bonding stage 300 has the second bonding member M2 placed on a stage 310. The stage 310 is configured to be movable by a driving unit 320 in the X-axis direction, the Y-axis direction, and a rotational direction around the Z-axis. The driving unit 320 can also correct the bonding position of the first bonding member M1 under drive control of the control device 500.

[0058] The imaging device 400 is composed of a CCD camera or the like, and includes a first imaging device 410 that captures an image of the bonding surface of the first bonding member M1 picked up from the mounting table 200, and a second imaging device 420 that captures an image of the bonding position for the second bonding member M2. The imaging device 400 captures images of the bonding surfaces of the first bonding member M1 and the second bonding member M2 under the control of the control unit 510.

[0059] The first imaging device 410 captures an image of the bonding surface of the first bonding member M1 (such as alignment marks on the surface) while the head 120 is holding the first bonding member M1. The first imaging device 410 is installed at a position (first imaging position) between the mounting table 200 and the bonding stage 300 where it can capture an image of the first bonding member M1. The first imaging device 410 outputs the captured image data (first image data) to the control device 500.

[0060] The second imaging device 420 is arranged next to the bonding head 100, and captures an image of the bonding surface of the second bonding member M2, which is the bonding position of the first bonding member M1, before bonding the first bonding member M1 to the second bonding member M2. The second imaging device 420 outputs the captured image data (second image data) to the control device 500.

[0061] 6, the control device 500 includes a control unit 510 and a storage unit 520. The control device 500 comprehensively performs various processes associated with driving the mounting device 1.

[0062] The control unit 510 includes a CPU, RAM, ROM, etc., and executes a control program etc. to control each unit of the mounting device 1 and to perform various calculation processes. The control unit 510 executes the control program etc. and functions as an acquisition unit 511, a calculation unit 512, a determination unit 513, and a drive control unit 514.

[0063] The acquisition unit 511 acquires the status of each part constituting the mounting device 1, such as the movement status of the cylinder rod 11 and the driving status of the shaft motor 30. The acquisition unit 511 also controls the position detection unit 80 to acquire current position information (vertical position information, rotational position information) of the cylinder rod 11.

[0064] The calculation unit 512 calculates information necessary for controlling each unit of the mounting apparatus 1. The calculation unit 512 calculates a first vertical movement amount corresponding to a preset target vertical position. The calculation unit 512 calculates a positional deviation error in the vertical direction (Z-axis direction) relative to the target vertical position based on the preset target vertical position and vertical position information detected after movement by the first vertical movement amount, and calculates a second vertical movement amount corresponding to this positional deviation error. The calculation unit 512 calculates a positional deviation error in the rotational direction relative to the target rotational position based on a preset target rotational position and rotational position information, and calculates a rotational movement amount corresponding to this positional deviation error. The calculation unit 512 calculates an average thrust value of the shaft motor 30. The calculation unit 512 calculates a position correction amount of the stage 310 relative to the bonding position of the first bonding member M1 based on the second image data.

[0065] 4A and 4B, when a plurality of second encoder sensors 82b are arranged as the configuration of the second position detection unit 82, the calculation unit 512 can calculate the horizontal positional deviation amount (horizontal positional deviation amount) of the cylinder rod 11. The calculation unit 512 calculates the correction drive amount of the drive unit 320 of the bonding stage 300 based on the calculated horizontal positional deviation amount. The horizontal positional deviation of the cylinder rod 11 can be compensated for by correcting the position of the stage 310 of the bonding stage 300 based on the calculated correction drive amount.

[0066] The determination unit 513 performs determination processing associated with the control of each part of the mounting device 1, and causes each part to execute processing based on the determination result. The determination unit 513 determines whether the cylinder rod 11 has moved to the target vertical position based on a preset target vertical position and vertical position information. The determination unit 513 determines whether the cylinder rod 11 has moved to the target rotation position based on a preset target rotation position and rotation position information. The determination unit 513 determines whether the thrust average value has exceeded the thrust determination threshold value based on a preset thrust determination threshold value and thrust average value.

[0067] The drive control unit 514 controls the drive of each unit constituting the mounting apparatus 1. The drive control unit 514 controls the drive mechanism 110 to move the bonding head 100 to a predetermined position (such as the pick-up position of the first bonding member M1, the imaging position by the first imaging device 410, the imaging position by the second imaging device 420, or the bonding position of the bonding stage 300). The drive control unit 514 controls the drive of the first imaging device 410 to capture an image of the bonding surface of the first bonding member M1 picked up by the head 120. The drive control unit 514 controls the drive of the second imaging device 420 to capture an image of the bonding surface of the second bonding member M2, which will be the bonding position of the first bonding member M1. Based on image data captured by the imaging device 400, the drive control unit 514 controls the drive of the drive unit 320 of the bonding stage 300 to correct the bonding position of the first bonding member M1.

[0068] The drive control unit 514 appropriately controls the drive of the double-acting air bearing cylinder 10, the shaft motor 30, and the piezoelectric motor 70 to move the cylinder rod 11 in a predetermined direction (up and down movement, rotational movement) at the pickup position set for each first joining member M1, the imaging position of the first imaging device 410, and the bonding position for the second joining member M2.

[0069] The movement of the cylinder rod 11 can be controlled as follows. The drive control unit 514 controls the drive of the servo valve 14 based on a first vertical movement amount to move the cylinder rod 11 to a target vertical position. The drive control unit 514 controls the drive of the shaft motor 30 based on a second vertical movement amount to adjust the cylinder rod 11, after moving the first vertical movement amount, to the target vertical position. The drive control unit 514 controls the drive of the piezo motor 70 based on the rotational movement amount to move the cylinder rod 11 to a target rotational position. The drive control unit 514 controls the double-acting air bearing cylinder 10 to lift the cylinder rod 11 to a predetermined position after picking up the first bonding member M1, capturing an image with the first imaging device 410, and bonding the second bonding member M2.

[0070] In the downward control of the cylinder rod 11 by the drive control unit 514, if the position of the cylinder rod 11 moved by the first vertical movement amount coincides with the target vertical position, there is no need to control the movement amount adjustment of the cylinder rod 11 by the second vertical movement amount. Also, if the rotational position of the cylinder rod 11 coincides with the target rotational position, there is no need for the drive control unit 514 to control the movement of the cylinder rod 11 by the rotational movement amount.

[0071] Furthermore, when the thrust average value exceeds a predetermined thrust judgment threshold while the shaft motor 30 is not being driven, the drive control unit 514 adjusts and controls the opening of the servo valve 14 to prevent the load on the shaft motor 30 from exceeding the motor's allowable limit. To reduce the load on the shaft motor 30, the double-acting air bearing cylinder 10 cancels the weight of the cylinder rod 11. However, because the shaft motor 30 is small, fluctuations in the supply pressure of a few kPa can increase the load on the shaft motor 30 and exceed the allowable limit. In response to this, the mounting device 1 uses the drive control unit 514 to perform the above-described control, thereby reducing the increase in the load on the shaft motor 30. This process is typically performed as background processing during the downward control of the cylinder rod 11, but can also be applied during upward movement if precise positioning is required.

[0072] The storage unit 520 includes a ROM for storing various programs and data in advance, a RAM for temporarily storing programs and data as a working area, and a hard disk for storing various programs and data. The storage unit 520 stores a target vertical position and a target rotational position for each first joining member M1, a threshold value for thrust determination, and various other information required for controlling the mounting apparatus 1. The target vertical position and the target rotational position are set in advance so that the head 120 of the cylinder rod 11 is positioned appropriately when the cylinder rod 11 is lowered or rotated at the following times: when the first joining member M1 is picked up, when the first imaging device 410 captures an image, and when the first joining member M1 is bonded to the second joining member M2.

[0073] Next, a series of processing operations in the mounting apparatus 1 will be described.

[0074] Fig. 7 shows a series of processing flows of the mounting apparatus 1. Fig. 8 shows a processing flow relating to the movement (lowering) of the cylinder rod 11 in the processing steps of the mounting apparatus 1. Fig. 9 shows a processing flow relating to the movement (rotation) of the cylinder rod 11 in the processing steps of the mounting apparatus 1. Fig. 10 shows a processing flow for reducing the load on the shaft motor 30 in the processing steps of the mounting apparatus 1.

[0075] 7, the mounting apparatus 1 prepares a first bonding member M1 (S1). Next, the mounting apparatus 1 moves the bonding head 100 to a pickup position on the mounting table 200 (S2). Next, the mounting apparatus 1 moves the cylinder rod 11 to the pickup position and then controls its movement (S3), picks up the first bonding member M1 (S4), and then raises the head (S5).

[0076] Next, the mounting apparatus 1 moves the bonding head 100 to a first imaging position (S6) and controls the movement of the cylinder rod 11 (S7). After the bonding surface of the first bonding member M1 is imaged with the cylinder rod 11 lowered (S8), the head is raised (S9).

[0077] Next, the mounting apparatus 1 moves to above the stage 310 of the bonding stage 300 (S10), and uses the second imaging device 420 to capture an image of the bonding surface of the second bonding member M2 to recognize the bonding position (S11). After recognizing the bonding position, the mounting apparatus 1 moves the bonding head 100 to the bonding position and calculates a position correction amount for the stage 310 relative to the bonding position of the first bonding member M1 (S12). Then, the mounting apparatus 1 corrects the position of the stage 310 based on the calculated position correction amount (S13).

[0078] Next, the mounting apparatus 1 controls the movement of the cylinder rod 11 (S14), bonds the first bonding member M1 to the bonding position of the second bonding member M2 (S15), and raises the head (S16). With the above, the bonding process of the mounting apparatus 1 is completed.

[0079] Next, a description will be given of the movement control during the downward movement of the cylinder rod 11. The process shown in Fig. 8 is executed when the vertical position of the cylinder rod 11 is settled in S3, S7, and S14.

[0080] 8, the mounting device 1 moves the cylinder rod 11 by a first vertical movement amount (S21). After moving the cylinder rod 11 by the first vertical movement amount, the first encoder sensor 81b reads the first scale 81a to obtain current vertical position information of the cylinder rod 11 (S22).

[0081] Next, the mounting device 1 compares the read vertical position information with the target vertical position, and determines whether the cylinder rod 11 has moved to the target vertical position (S23).

[0082] In S23, if the cylinder rod 11 has moved to the target vertical position (S23-Yes), the process ends. On the other hand, if the cylinder rod 11 has not moved to the target vertical position (S23-No), the process calculates a positional deviation error from the target vertical position (S24), and calculates a second vertical movement amount corresponding to the positional deviation error (S25).

[0083] Then, the mounting device 1 drives the shaft motor 30 by the calculated second vertical movement amount (S26), adjusts and moves the cylinder rod 11 to the target vertical position (S27), and ends the process.

[0084] Next, a description will be given of movement control during rotation of the cylinder rod 11. The process shown in Fig. 9 is executed as appropriate when the rotational position of the cylinder rod 11 is settled in S3, S7, and S14.

[0085] 9, the mounting device 1 reads the second scale 82a with the second encoder sensor 82b to obtain current rotational position information of the cylinder rod 11 (S31). The mounting device 1 compares the read rotational position information with the target rotational position and determines whether the cylinder rod 11 is at the target rotational position (S32).

[0086] In S32, if the cylinder rod 11 is at the target rotation position (S32-Yes), the process ends. On the other hand, if the cylinder rod 11 is not at the target rotation position (S32-No), the positional deviation error from the target rotation position is calculated (S33), and the rotational movement amount corresponding to the positional deviation error is calculated (S34).

[0087] Then, the mounting apparatus 1 drives the piezo motor 70 by the calculated rotational movement amount (S35), moves the cylinder rod 11 to the target rotational position (S36), and ends the process.

[0088] In the processing of S3, S7, and S14, the order of execution of the movement control during vertical descent shown in FIG. 8 and the movement control during rotation shown in FIG. 9 is not particularly limited, and the downward movement may be followed by rotational movement, or the downward movement may be followed by rotational movement.

[0089] Next, we will explain the processing control for reducing the load on the shaft motor 30. The processing shown in Fig. 10 is executed as background processing during the control of lowering the cylinder rod 11 shown in Fig. 9, in order to prevent the load on the shaft motor 30 from exceeding the motor's allowable value.

[0090] 10, the mounting device 1 calculates the average thrust value of the shaft motor 30 (S41). Next, the mounting device 1 determines whether the cylinder rod 11 is being moved by the shaft motor 30 (S42).

[0091] In S42, if the cylinder rod 11 is being moved by the shaft motor 30 (S42-Yes), the process returns to S41. On the other hand, if the cylinder rod 11 is not being moved by the shaft motor 30 (S42-No), the thrust average value is compared with a preset thrust determination threshold value to determine whether the thrust average value has exceeded the thrust determination threshold value (S43).

[0092] In S43, if the thrust average value exceeds the thrust judgment threshold value (S43-Yes), the opening of the servo valve 14 is adjusted (S44) so ​​that the thrust average value does not exceed the thrust judgment threshold value, and the process returns to S41 again. On the other hand, if the thrust average value does not exceed the thrust judgment threshold value (S43-No), the process returns to S41 again. Note that the process flow shown in Fig. 10 is always executed while the mounting device 1 is operating, and the process ends when the mounting process is stopped for maintenance of the mounting device 1, etc.

[0093] As described above, the mounting apparatus 1 according to the present invention includes a bonding head 100 and a bonding stage 300. The bonding head 100 includes a double-acting air bearing cylinder 10 having a cylinder rod 11 extending in the vertical direction and moving the cylinder rod 11 by a first vertical movement amount in the vertical direction, a first scale 81a arranged coaxially with the cylinder rod 11 to allow for a range of motion in the rotational direction of the cylinder rod 11 and having a first encoder pattern P1 consisting of a pattern array capable of detecting the position of the cylinder rod 11 in the vertical direction, a first encoder sensor 81b arranged at a position opposite to the first scale 81a and reading the position of the first encoder pattern P1, and a first encoder sensor 81b arranged coaxially with the cylinder rod 11 to allow for a range of motion in the vertical direction of the cylinder rod 11 and having a pattern array capable of detecting the position of the cylinder rod 11 in the rotational direction. The actuator includes a second scale 82a having a second encoder pattern P2 consisting of a series of turns, a second encoder sensor 82b arranged opposite the second scale 82a and reading the position of the second encoder pattern P2, a shaft motor 30 that moves the vertical position of the cylinder rod 11 by a second vertical movement amount during vertical position setting based on the reading result of the first encoder sensor 81b so that the vertical position of the cylinder rod 11 becomes a target vertical position, and a piezoelectric motor 70 that is arranged coaxially with the cylinder rod 11 and moves the cylinder rod 11 by a rotational movement amount in the rotational direction based on the reading result of the second encoder sensor 82b so that the rotational position of the cylinder rod 11 becomes a target rotational position.

[0094] With this configuration, the mounting apparatus 1 can move the cylinder rod 11 by a first vertical movement amount using the double-acting air bearing cylinder 10, and then drive the shaft motor 30 to adjust the movement by a second vertical movement amount during vertical positioning so that the target vertical position is reached. This improves the position control performance of the cylinder rod 11, enabling highly accurate bonding. It also reduces recognition errors due to changes in focal depth when the first imaging device 410 recognizes alignment marks and the like on the bonding surface of the first bonding member M1 from below the head 120. Additionally, the mounting apparatus 1 has a first scale 81a that allows for a rotational movement range and a second scale 82a that allows for a vertical movement range, both of which are coaxially arranged with the cylinder rod 11, enabling highly accurate position control of the cylinder rod 11 in the vertical and rotational directions. [Explanation of symbols]

[0095] 1 mounting device, 10 double-acting air bearing cylinders, 11 cylinder rod, 12 air bearings, 13 pressure sensor, 14 servo valves, 20 Rigid coupling, 30 shaft motor, 31 magnet rod, 40 flexible coupling, 50 ball spline, 51 spline shaft, 52 spline nut, 53 angular bearing, 60 rotors, 70 Piezo motor, 80 position detection unit, 81 first position detection unit (81a first scale, 81b first encoder sensor), 82 second position detection unit (82a second scale, 82b second encoder sensor), 100 bonding heads, 110 drive mechanism, 120 heads, 200 mounting table, 300 bonding stages, 400 imaging device, 410 first imaging device, 420 second imaging device, 500 control device, 511 Acquisition Department; 512 calculation unit, 513 Judgment Department, 514 drive control unit, 520 storage section, C center axis, M1 first joining member, M2 second joining member, P1 First encoder pattern, P2 Second encoder pattern.

Claims

1. A mounting apparatus comprising a bonding head and a bonding stage, The bonding head includes: a double-acting air bearing cylinder having a vertically extending cylinder rod for vertically moving the cylinder rod a first vertical travel; a first scale arranged coaxially with the cylinder rod to allow a range of motion of the cylinder rod in a rotational direction, the first scale having a first encoder pattern consisting of a pattern sequence that can detect the vertical position of the cylinder rod; a first encoder sensor disposed at a position facing the first scale and configured to read the position of the first encoder pattern; a second scale arranged coaxially with the cylinder rod to allow a vertical movement range of the cylinder rod, the second scale having a second encoder pattern consisting of a pattern sequence that can detect the position of the cylinder rod in the rotational direction; a second encoder sensor disposed at a position facing the second scale and configured to read the position of the second encoder pattern; a shaft motor that is arranged coaxially with the cylinder rod and that moves the vertical position of the cylinder rod by a second vertical movement amount during vertical position setting based on the reading result of the first encoder sensor so that the vertical position of the cylinder rod becomes a target vertical position; a piezo motor arranged coaxially with the cylinder rod, which moves the cylinder rod in a rotational direction by a rotational movement amount based on a reading result of the second encoder sensor so that the rotational position of the cylinder rod becomes a target rotational position; A mounting device comprising:

2. The mounting device according to claim 1 , wherein the second scale is provided on a lower part of the cylinder rod of the double-acting air bearing cylinder.

3. The mounting device of claim 1 , wherein the double-acting air bearing cylinder is positioned below the shaft motor.

4. a ball spline including a spline shaft, a spline nut, and an angular bearing having an outer raceway fixed to a housing of the bonding head and an inner raceway fixed to the spline nut, the ball spline being disposed above the shaft motor and transmitting the driving force of the piezoelectric motor; a flexible coupling that connects a lower portion of the spline shaft and an upper portion of the magnet rod of the shaft motor so as to be synchronously rotatable; a rigid coupling that connects a lower portion of the magnet rod of the shaft motor and an upper portion of the cylinder rod of the double-acting air bearing cylinder so as to be synchronously rotatable; a rotor fixed to the spline nut, which converts the driving force of the piezoelectric motor into rotational force and transmits the rotational force to the spline nut; The mounting device according to claim 1 , comprising:

5. 2. The mounting device according to claim 1, wherein the second encoder sensor comprises a plurality of second encoder sensors arranged around the second scale, and detects horizontal positional deviation of the tip of the rod of the double-acting air bearing cylinder.

6. 2. The mounting device according to claim 1, wherein the double-acting air bearing cylinder includes a servo valve that adjusts the amount of air flowing into and out of the cylinder so that the cylinder rod moves by the first vertical movement amount.

7. a calculation unit that calculates an average thrust force of the shaft motor; an acquisition unit that acquires a driving state of the shaft motor; a determination unit that compares the thrust average value calculated by the calculation unit with a preset threshold value and determines whether the thrust average value exceeds the threshold value; a drive control unit that adjusts the opening of the servo valve of the double-acting air bearing cylinder based on the judgment result of the judgment unit so that the load on the shaft motor does not exceed an allowable value; The mounting device according to any one of claims 1 to 6, comprising a control device including:

Images