Simulator device, substrate processing apparatus, semiconductor device manufacturing method, and program

Abstract

To provide a technique capable of reducing a time required for recipe editing by simulating the processing operation of a substrate according to an edited recipe without using a substrate processing apparatus.SOLUTION: A substrate processing apparatus includes a virtual apparatus memory unit that stores a recipe having a plurality of steps that define processing conditions and processing times for a substrate, and an apparatus control program that controls processing of the substrate in the substrate processing apparatus having the recipe, a startup unit that selects an execution speed of the apparatus control program and at least one of a normal transport operation and a transport skip operation as the operation of a transport unit for the substrate, and a virtual control unit that starts the apparatus control program on the basis of the execution speed and operation of the transport unit selected by the startup unit, and is capable of controlling virtual processing of the substrate on the basis of the recipe stored in the virtual apparatus memory unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a simulator apparatus, a substrate processing apparatus, a method for manufacturing a semiconductor device, and a program. [Background technology]

[0002] In a substrate processing apparatus, a recipe that allows processing conditions for processing a substrate to be set for each step or parameters for executing the recipe are edited, and the substrate is sometimes processed using the edited recipe and parameters (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-138158 Summary of the Invention [Problem to be solved by the invention]

[0004] When processing a substrate using an edited recipe and parameters, the substrate processing operation may be confirmed using the edited recipe in advance in the substrate processing apparatus. In this case, if the substrate processing results do not match the expected results, the recipe must be repeatedly modified and confirmed. This may result in time being spent monopolizing the substrate processing apparatus and editing the recipe.

[0005] The present disclosure provides a technique capable of simulating a substrate processing operation according to an edited recipe without using a substrate processing apparatus, thereby reducing the time required for recipe editing. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided a technology including: a virtual device memory unit that stores a recipe having a plurality of steps that define processing conditions and processing times for a substrate; and an device control program that controls processing of the substrate in a substrate processing apparatus having the recipe; a startup unit that selects an execution speed of the device control program and at least one of a normal transport operation and a transport skip operation as an operation of a transport unit for the substrate; and a virtual control unit that starts the device control program based on the execution speed and operation of the transport unit selected by the startup unit, and is capable of controlling virtual processing of the substrate based on the recipe stored in the virtual device memory unit. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to reduce the time required for recipe editing by simulating the substrate processing operation according to the edited recipe without using a substrate processing apparatus. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a block diagram showing an example of the configuration of a simulator according to the present embodiment. [Figure 2] FIG. 4 is a diagram showing an example of a schematic diagram of device information according to the embodiment. [Figure 3] 1 is a perspective view showing an example of a substrate processing apparatus according to an embodiment of the present invention; [Figure 4] 1 is a cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention, as viewed from the side. [Figure 5] FIG. 2 is a block diagram showing an example of a functional configuration of a control device included in the substrate processing apparatus according to the present embodiment. [Figure 6A] 10A to 10C are diagrams showing an example of screen transitions on a display operation unit accompanying startup processing of a simulator according to the present embodiment. [Figure 6B] 10A to 10C are diagrams showing an example of screen transitions on a display operation unit accompanying startup processing of a simulator according to the present embodiment. [Figure 6C] 10A to 10C are diagrams showing an example of screen transitions on a display operation unit accompanying startup processing of a simulator according to the present embodiment. [Figure 6D]10A to 10C are diagrams showing an example of screen transitions on a display operation unit accompanying startup processing of a simulator according to the present embodiment. [Figure 7] 10 is a flowchart illustrating an example of the flow of a startup process according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] <One aspect of the present disclosure> Hereinafter, one embodiment of the present disclosure will be described mainly with reference to FIGS. 1 to 7. Note that all drawings used in the following description are schematic, and the dimensional relationships between elements, the ratios of elements, etc. shown in the drawings do not necessarily match those in reality. Furthermore, the dimensional relationships between elements, the ratios of elements, etc. do not necessarily match between multiple drawings. Furthermore, the present disclosure is not limited to the following embodiments and can be implemented with appropriate modifications within the scope of the present disclosure.

[0010] In the following description, the term "worker" refers to a person who uses a simulator or a substrate processing apparatus, or a person who processes a substrate using the substrate processing apparatus. The substrate processing apparatus may also be referred to as "apparatus."

[0011] (Simulator) First, an overview of a simulator 300 as a simulator apparatus according to this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a block diagram showing an example of the configuration of the simulator 300 according to this embodiment. The simulator 300 can execute a simulation of substrate processing steps as virtual processing of a plurality of apparatuses including a substrate processing apparatus 1 (see Figures 3 to 5) described below. In Figure 1, blocks indicated by solid lines indicate hardware configurations, and blocks indicated by dashed lines indicate functional configurations.

[0012] (Simulator hardware configuration) As shown in FIG. 1, the simulator 300 includes a simulator control unit 301, a simulator memory unit 304 as a virtual device memory unit, an external communication unit 305, an external memory unit 306, and a display operation unit 307 as a virtual device display operation unit.

[0013] The simulator control unit 301 includes a CPU (Central Processing Unit) 302 and a RAM (Random Access Memory) 303 .

[0014] The CPU 302 is a central processing unit that executes various programs and controls each component. The RAM 303 temporarily stores programs or data as a working area. The simulator storage unit 304 stores various programs and data. That is, the CPU 302 of the simulator 300 according to this embodiment functions as the simulator 300 by writing a program stored in the simulator storage unit 304 to the RAM 303 and executing it.

[0015] For example, a hard disk drive (HDD), a solid state drive (SSD), a flash memory, etc. is used as the simulator storage unit 304. The simulator storage unit 304 of this embodiment stores a virtual processing program 304A, device information 304B, device data 304C, and selection information 304D.

[0016] The virtual processing program 304A is a program for executing the functions of the simulator 300, including the startup process described below. The virtual processing program 304A may be pre-installed in the simulator 300, for example. Alternatively, the virtual processing program 304A may be realized by being recorded on a non-volatile recording medium or distributed via a network and appropriately installed in the simulator 300. Examples of non-volatile recording media include a CD-ROM, a magneto-optical disk, a HDD, a DVD-ROM, a flash memory, a memory card, and a USB.

[0017] FIG. 2 is a diagram showing an example of the outline of the device information 304B according to this embodiment.

[0018] 2, the apparatus information 304B stores information about a plurality of apparatuses. The apparatus information 304B stores, for example, information about apparatus 1 to apparatus n. The apparatus 1 information, which is information about apparatus 1, stores an apparatus control program, apparatus parameters, recipes, and apparatus configuration information provided in apparatus 1. The apparatus 2 information, which is information about apparatus 2, stores an apparatus control program, apparatus parameters, recipes, and apparatus configuration information provided in apparatus 2 (the same applies to the apparatus n information below, where n is an integer equal to or greater than 3). It is sufficient that the apparatus information 304B stores information about at least one apparatus.

[0019] The device control program is a program installed in each device, and various screens displayed on the display unit of each device can be displayed on a display operation unit 307 (described later). The device control program is, for example, a program similar to the device control program 104A (see FIG. 5) (described later). Therefore, according to the simulator 300 of this embodiment, it is possible to edit recipes in the same way as for each device, and it is also possible to simulate substrate processing using the edited recipe. In addition, the simulator 300 has an external storage unit 306 (described later), and it is possible to deploy edited recipes to each device via the external storage unit 306, or copy recipes from each device and store them in the simulator storage unit 304. Therefore, according to the simulator 300 of this embodiment, by enabling recipe editing on the simulator 300, it is possible to immediately check the operation of the edited recipe, which also contributes to reducing the work of copying and using recipes edited externally.

[0020] The device parameters indicate the parameters of the equipment installed in each device. The device parameters are, for example, parameters similar to the device parameters 104C (see FIG. 5) described later. The device parameters are, for example, parameters that store the hardware configuration of each device (e.g., number, number of sheets, location, etc.) and processing conditions (e.g., numerical range). In addition, the device parameters are set with connection destination information as connection conditions for real or virtual measuring devices described later. Here, "real device" refers to real equipment, devices, etc. that actually operate, and "virtual" is used to refer to digital equipment, devices, etc. that operate in a simulation.

[0021] The recipe is information that defines the processing conditions and processing procedures used to process the substrate in each device. The recipe is, for example, the same as recipe 104B (see FIG. 5) described later.

[0022] The device configuration information indicates information for operating each device on the simulator 300. The device configuration information is information indicating, for example, the configuration of folders used by each device, and the data configuration of device control programs, recipes, etc. deployed in each folder.

[0023] Measurement data acquired from each measuring instrument is stored in the instrument data 304C in Fig. 1. Specifically, data acquired from a virtual measuring instrument control unit, which will be described later, is stored in the instrument data 304C.

[0024] The selection information 304D stores information related to the environment settings of the startup environment of the simulator 300. The selection information 304D stores, for example, information selected by the startup unit 401, which will be described later.

[0025] The external communication unit 305 communicates with the external communication device 500. The external communication unit 305 is connected to a network such as the Internet, a local area network (LAN), or a wide area network (WAN), and enables communication with external devices via the network. The simulator 300 is connected to, for example, a host computer that manages each device as the external communication device 500 via the external communication unit 305. Therefore, according to the simulator 300 of this embodiment, by including the external communication unit 305, it is possible to check communication operation with the external communication device 500 without waiting for the device to be assembled, etc., and it is possible to reduce the man-hours required for setting up the device.

[0026] The simulator 300 is also connected to an external storage unit 306 into which a USB (Universal Serial Bus) memory or the like, which is an example of a recording medium, can be inserted and removed.

[0027] The display operation unit 307 is configured to display various operation screens for operating the simulator 300. The display operation unit 307 is, for example, a touch panel. Note that the display operation unit 307 may also be configured, for example, with a liquid crystal display panel and input devices such as a keyboard and a mouse.

[0028] (Simulator functional configuration) The simulator 300 according to this embodiment functions as a virtual control unit 400, a startup unit 401, an operating environment setting unit 402, a time monitoring unit 403, a virtual I / O port 404, a virtual process control unit 405 connected to measuring instruments in the process system, and a virtual transfer control unit 406 connected to measuring instruments in the transfer system, when the CPU 302 executes the virtual processing program 304A. The virtual process control unit 405 and the virtual transfer control unit 406 are collectively referred to as a virtual measuring instrument control unit. The simulator 300 also functions as a virtual temperature measurement unit 405A, a virtual gas flow rate measurement unit 405B, a virtual pressure measurement unit 405C, and the like, which are measurement units in the process system connected to the virtual process control unit 405 in the simulation. The simulator 300 also functions as a virtual container transfer unit 406A, a virtual substrate transfer unit 406B, a virtual support tool transfer unit 406C, and the like, which are transfer units connected to the virtual transfer control unit 406 in the simulation. The virtual temperature measuring unit 405A, the virtual gas flow rate measuring unit 405B, the virtual pressure measuring unit 405C, the virtual container transport unit 406A, the virtual substrate transport unit 406B, and the virtual support tool transport unit 406C are also collectively referred to as virtual measuring instruments.

[0029] The virtual control unit 400 has a function of executing a simulation of a substrate processing step. The virtual control unit 400 configures a simulator based on, for example, an apparatus selected by a startup unit 401 (described later) and apparatus parameters and apparatus configuration information stored in apparatus information 304B. The virtual control unit 400 then controls the simulation of the substrate processing step based on the execution speed and transport operation mode selected by the startup unit 401 and the control device program and recipe stored in apparatus information 304B. The virtual control unit 400 has a function of simulating, for example, the function of a control device 100 (described later).

[0030] The startup unit 401 has a function of setting the startup environment of the simulator 300. Specifically, the startup unit 401 of this embodiment selects the device to be started, selects the execution speed, and selects the transfer operation mode for the transfer operation of the transfer unit. The device to be started is selected, for example, from multiple devices stored in the device information 304B. The execution speed is selected, for example, from multiple execution speeds: actual speed, double speed, or quadruple speed. Note that the execution speed may be a speed that slows the execution speed, such as half speed or one-third speed. The transfer operation mode is selected, for example, from normal transfer operation or transfer skip operation. The transfer skip operation is a mode in which a predetermined transfer process is skipped. For example, when the transfer skip operation is selected, the simulator 300 executes a simulation by skipping the transfer process of the virtual container transfer unit 406A (described later). The transfer skip operation may be performed by skipping at least one of the transfer steps of a virtual container transfer unit 406A, a virtual substrate transfer unit 406B, a virtual support tool transfer unit 406C, and the like, which will be described later.

[0031] That is, the simulator 300 of this embodiment can select and start multiple devices. Therefore, according to the simulator 300 of this embodiment, an operator can check the operation of various devices by selecting one device from multiple devices using one simulator.

[0032] Furthermore, the simulator 300 of this embodiment allows the execution speed to be selected from normal speed, double speed, and quadruple speed, and the simulator control unit 301 controls the device control program according to the selected execution speed. Therefore, according to the simulator 300 of this embodiment, simulation operations can be performed in a shorter time by changing the execution speed, which contributes to reducing the number of work steps.

[0033] Furthermore, the simulator 300 of this embodiment can be started by selecting a transport operation mode, and the simulator control unit 301 controls the device control program according to the selected transport operation mode. Therefore, according to the simulator 300 of this embodiment, when a transport skip operation is selected as the transport operation, it is possible to skip the operation of the transport system, and it is possible to check the substrate processing operation in a shorter time.

[0034] Furthermore, the startup unit 401 cannot specify a transfer skip operation when the destination connected to the virtual transfer control unit 406 (described later) is a real measuring device. The startup unit 401, for example, hides the transfer operation mode specification on the display screen or makes it unselectable. In other words, when the destination connected to the virtual transfer control unit 406 is a real device, only the normal transfer operation is checked in order to check the operation of the real device. According to the simulator 300 of this embodiment, it is possible to reduce the impact on the transfer operation when operating the real device.

[0035] The operating environment setting unit 402 expands the configuration of the device selected by the launching unit 401 and various information for operating the device. Specifically, the operating environment setting unit 402 acquires device configuration information for the selected device from the device information 304B, and generates folders from the device configuration information so that the selected device can operate and expands various information for operating the device. In other words, even if multiple devices have different configurations, the simulator 300 automatically expands the configuration of the selected device after device selection, allowing the operator to simulate the device without having to set a configuration tailored to the device. Therefore, the simulator 300 of this embodiment can contribute to shortening the setup time of the simulator 300.

[0036] Furthermore, the operating environment setting unit 402 acquires the device parameters of the selected device from the device information 304B and deploys them in the created folder. That is, the operating environment setting unit 402 deploys the device parameters that define the device configuration of the selected device, allowing the operator to build the operating environment of the simulator 300 without having to set the configuration of a real or virtual measuring device. Therefore, the simulator 300 of this embodiment can contribute to shortening the time required to set up the environment of the simulator 300.

[0037] The time monitoring unit 403 switches the time reporting interval in accordance with the execution speed selected by the startup unit 401. For example, the time monitoring unit 403 reports the time in 1-second increments at real speed, in 0.5-second increments at double speed, and in 0.25-second increments at quadruple speed. Therefore, according to the simulator 300 of this embodiment, the time monitoring unit 403 monitors the time of the simulator 300, thereby enabling centralized management of time monitoring of various configurations in accordance with the specified execution speed.

[0038] The virtual I / O port 404 has a function of simulating connections for transmitting and receiving each data, downloading and uploading each file, etc. That is, the simulator 300 connects to each of the virtual process control unit 405 and the virtual transport control unit 406 in the simulation via the virtual I / O port 404. The virtual I / O port 404 has a function of simulating the function of, for example, an I / O port 105 (see FIG. 5) described later.

[0039] Furthermore, the virtual I / O port 404 performs connection and control in accordance with each connection destination information defined in the device parameters. The connection destination information may, for example, specify an IP address. If a local IP address (e.g., 127.0.0.1) is specified as the IP address, it is determined that the target device is a virtual measuring device, and if a normal IP address (e.g., 192.168.0.3) is specified, it is determined that a real measuring device is connected. Therefore, the device control program and device parameters installed in the device can be used directly in the simulator 300.

[0040] Virtual process control unit 405 has the same functions as process control unit 205 (see FIG. 5), which will be described later. Virtual process control unit 405 also has a function of connecting, in a simulation, to virtual temperature measurement unit 405A, virtual gas flow rate measurement unit 405B, and virtual pressure measurement unit 405C, which serve as virtual measurement units. Virtual temperature measurement unit 405A, virtual gas flow rate measurement unit 405B, and virtual pressure measurement unit 405C each constitute measurement devices in the simulation, and are capable of transmitting and receiving measurement data to and from virtual process control unit 405.

[0041] A heating mechanism mainly composed of a heater and a temperature sensor is connected to the virtual temperature measurement unit 405A in the simulation. The virtual temperature measurement unit 405A is configured to measure, for example, the temperature of the heater in the processing furnace, the temperature inside the processing chamber, the temperature of the substrate, etc. The virtual temperature measurement unit 405A has a function to simulate, for example, the function of the temperature measurement unit 205A (see FIG. 5) described later.

[0042] A mass flow controller (MFC) serving as a gas flow rate controller is connected to the virtual gas flow rate measurement unit 405B in the simulation. The virtual gas flow rate measurement unit 405B is configured to measure, for example, the flow rate of gas supplied into the processing chamber in the simulation. The virtual gas flow rate measurement unit 405B has, for example, a function of simulating the function of a gas flow rate measurement unit 205B (see FIG. 5) described later.

[0043] A gas exhaust mechanism mainly composed of a pressure sensor and an APC (automatic pressure control) valve as a pressure valve is connected to the virtual pressure measurement unit 405C in the simulation. The virtual pressure measurement unit 405C is configured to measure the pressure inside the processing chamber in the simulation. The virtual pressure measurement unit 405C has a function to simulate the function of the pressure measurement unit 205C (see FIG. 5), which will be described later, for example.

[0044] Virtual process control unit 405 is also connected to temperature measurement unit 205A, gas flow rate measurement unit 205B, and pressure measurement unit 205C, which are measurement units of the process system described below. Temperature measurement unit 205A, gas flow rate measurement unit 205B, and pressure measurement unit 205C are also collectively referred to as actual measuring instruments.

[0045] The virtual transfer control unit 406 has the same functions as the transfer control unit 206 (see FIG. 5), which will be described later. The virtual transfer control unit 406 also has a function of connecting to a virtual container transfer unit 406A, a virtual substrate transfer unit 406B, and a virtual support tool transfer unit 406C as virtual transfer units in the simulation. The virtual container transfer unit 406A, the virtual substrate transfer unit 406B, and the virtual support tool transfer unit 406C each constitute a measuring device in the simulation, and are capable of sending and receiving measurement data to and from the virtual transfer control unit 406.

[0046] The virtual container transport unit 406A is configured with a simulated rotating pod shelf and pod transport mechanism for transporting FOUPs (Front Opening Unified Pods), etc. The virtual container transport unit 406A has a function to simulate the function of the container transport unit 206A (see FIG. 5), which will be described later, for example.

[0047] The virtual substrate transport unit 406B is configured with a simulated wafer transfer mechanism that loads and unloads wafers (substrates) onto and from a boat (substrate holder), a notch alignment device, etc. The virtual substrate transport unit 406B has a function to simulate the function of the substrate transport unit 206B (see FIG. 5), which will be described later, for example.

[0048] The virtual support tool transport unit 406C is configured with a simulated boat elevator that transports the boat, an arm connected to the lifting platform of the boat elevator, etc. The virtual support tool transport unit 406C has a function to simulate the function of the support tool transport unit 206C (see FIG. 5), which will be described later, for example.

[0049] The virtual transfer control unit 406 may be connected to a container transfer unit 206A, a substrate transfer unit 206B, and a support transfer unit 206C, which are transfer units described later. The container transfer unit 206A, the substrate transfer unit 206B, and the support transfer unit 206C are also collectively referred to as actual measuring devices.

[0050] In addition, the actual or virtual measuring device may include a manual controller (pendant) that can control the teaching process, which is one of the initial settings of the device, and an I / O reader for loading control programs, etc. from an external recording medium.

[0051] The measuring instrument connected to the simulator 300 of this embodiment can be selected as either a real instrument or a virtual instrument. For example, when a real instrument is connected, the operation of the real instrument can be checked. Therefore, when replacing a measuring instrument, the simulator 300 can check the operation of the measuring instrument before installing the new measuring instrument in the substrate processing apparatus, thereby contributing to reducing the time required to occupy the substrate processing apparatus and the time required to check the operation. Furthermore, the selection of whether the measuring instrument connected to the simulator 300 is real or virtual can be made by setting the connection destination information for the measuring instrument in the equipment parameters. Therefore, the simulator 300 of this embodiment allows the equipment parameters built into the substrate processing apparatus to be used as is, thereby reducing the time required to prepare parameters dedicated to the simulator. The measuring instruments connected to the simulator 300 of this embodiment can be a mixture of real and virtual measuring instruments.

[0052] Furthermore, the virtual measuring instruments connected to the simulator 300 of this embodiment notify the virtual measuring instrument control unit of measurement data at specific intervals, just like real instruments. In this case, the virtual measuring instruments notify at intervals according to their execution speeds. The virtual measuring instrument control unit notifies the simulator control unit 301 of the measurement data received from each measuring instrument, and the simulator control unit 301 stores the measurement data in the simulator storage unit 304 and further notifies the display operation unit 307. Therefore, according to the simulator 300 of this embodiment, by making the configuration of the simulator 300 (e.g., the virtual process control unit 405 and the virtual transport control unit 406) the same as the configuration of the equipment (e.g., the process control unit 205 and the transport control unit 206), it is possible to use the equipment control program and equipment parameters installed in the equipment as they are, and operation can be performed without preparing a control program and equipment parameters for the simulator 300.

[0053] Furthermore, the virtual measuring device control unit includes a virtual process control unit 405 and a virtual transfer control unit 406. The virtual process control unit 405 connects to measuring devices in the virtual or real substrate process system. The virtual transfer control unit 406 also connects to measuring devices in the virtual or real substrate transfer system. The virtual process control unit 405 and the virtual transfer control unit 406 acquire their respective connection destinations from the device parameters, connect to real or virtual measuring devices, and acquire measurement data from the connected measuring devices. Therefore, according to the simulator 300 of this embodiment, the virtual process control unit 405 and the virtual transfer control unit 406 can be used to connect to measuring devices defined by the device parameters and perform simulations, allowing the device control program and device parameters installed in the substrate processing apparatus to be used as is. Furthermore, the operator can perform simulations without being aware of whether the measuring devices are real or virtual.

[0054] (Substrate processing equipment) Next, an overview of the substrate processing apparatus 1 according to this embodiment will be described with reference to Figures 3 and 4. The substrate processing apparatus 1 according to this embodiment is an example of an apparatus that the simulator 300 simulates.

[0055] Fig. 3 is a perspective view showing an example of the substrate processing apparatus 1 according to this embodiment. Fig. 4 is a cross-sectional side view of the substrate processing apparatus 1 according to this embodiment. Figs. 3 and 4 show a vertical substrate processing apparatus 1 as an example of the substrate processing apparatus. The substrates processed in the substrate processing apparatus 1 are shown as semiconductor wafers made of silicon or the like, as an example.

[0056] As shown in Figures 3 and 4, the substrate processing apparatus 1 has a housing 2, and a front maintenance opening 4 is provided at the bottom of a front wall 3 of the housing 2 as an opening for maintenance, and the front maintenance opening 4 is opened and closed by a front maintenance door 5.

[0057] A pod loading / unloading opening 6 is opened in the front wall 3 of the housing 2 so as to communicate between the inside and outside of the housing 2, and the pod loading / unloading opening 6 is opened and closed by a front shutter (loading / unloading opening / closing mechanism) 7. A load port (substrate transport container delivery table) 8 is installed in front of the pod loading / unloading opening 6, and the load port 8 is configured to align a pod 9 placed thereon.

[0058] The pod 9 is a sealed substrate transport container, and is designed to be carried onto and removed from the load port 8 by an in-process transport device (not shown).

[0059] A rotary pod shelf (substrate transport container storage shelf) 11 is installed at the upper part of the housing 2, approximately in the center in the front-to-rear direction, and the rotary pod shelf 11 is configured to store a plurality of pods 9.

[0060] The rotary pod shelf 11 includes a support column 12 that is set up vertically and rotates intermittently, and multiple shelves (substrate transport container mounting shelves) 13 that are supported radially at upper, middle, and lower positions on the support column 12. The shelf column 13 is configured to store at least one pod 9 mounted thereon.

[0061] A pod opener (substrate transport container lid opening / closing mechanism) 14 is provided below the rotary pod shelf 11, and the pod opener 14 has a structure that allows the pod 9 to be placed thereon and the lid of the pod 9 to be opened and closed.

[0062] A pod transfer mechanism (container transfer mechanism) 15 is installed between the load port 8 and the rotary pod shelf 11 and pod opener 14, and the pod transfer mechanism 15 is capable of moving up and down while holding a pod 9, and moving back and forth horizontally. It is configured to transfer the pod 9 between the load port 8, the rotary pod shelf 11, and the pod opener 14.

[0063] A sub-housing 16 is provided extending to the rear end at the bottom of the housing 2, approximately in the center in the front-to-rear direction. A pair of wafer loading / unloading openings (substrate loading / unloading openings) 19 for loading / unloading wafers (substrates) 18 into / out of the sub-housing 16 are opened in a front wall 17 of the sub-housing 16, arranged vertically in two tiers, one above the other, and a pod opener 14 is provided for each of the upper and lower wafer loading / unloading openings 19.

[0064] The pod opener 14 includes a mounting table 21 on which the pod 9 is mounted, and an opening / closing mechanism 22 that opens and closes the lid of the pod 9. The pod opener 14 is configured to open and close the wafer entrance / exit of the pod 9 by opening and closing the lid of the pod 9 mounted on the mounting table 21 using the opening / closing mechanism 22.

[0065] The sub-housing 16 forms a transfer chamber 23 that is airtight from the space (pod transfer space) in which the pod transport mechanism 15 and the rotary pod shelf 11 are disposed. A wafer transfer mechanism (substrate transfer mechanism) 24 is installed in the front region of the transfer chamber 23. The wafer transfer mechanism 24 is equipped with wafer loading plates 25 for loading the required number of wafers 18 (for example, five in the figure), and the wafer loading plates 25 are movable in a horizontal direction, rotatable in a horizontal direction, and capable of being raised and lowered. The wafer transfer mechanism 24 is configured to load and unload wafers 18 onto a boat (substrate holder) 26.

[0066] A standby section 27 is configured in the rear region of the transfer chamber 23 to accommodate the boat 26 and allow it to wait, and a vertical processing furnace 28 is provided above the standby section 27. The processing furnace 28 has a processing chamber 29 formed therein, the lower end of which serves as a furnace opening, and the furnace opening is opened and closed by a furnace opening shutter (furnace opening opening / closing mechanism) 31. The processing chamber 29 is also called a processing vessel and is an example of a processing section.

[0067] A boat elevator (substrate holder lifting mechanism) 32 for lifting and lowering the boat 26 is installed between the right end of the housing 2 and the right end of the standby section 27 of the sub-housing 16. A seal cap 34 serving as a lid is attached horizontally to an arm 33 connected to the lifting platform of the boat elevator 32. The seal cap 34 supports the boat 26 vertically and can airtightly close the furnace throat when the boat 26 is loaded into the processing chamber 29.

[0068] The boat 26 is configured to hold multiple wafers 18 (for example, about 50 to 200) in a horizontal position with their centers aligned in multiple stages. Note that in this specification, a numerical range such as "50 to 200" means that the range includes both the lower and upper limits. Thus, for example, "50 to 200" means "50 or more and 200 or less." The same applies to other numerical ranges.

[0069] A clean unit 35 is disposed opposite the boat elevator 32, and is composed of a supply fan and a dust filter to supply clean air 36, which is a purified atmosphere or an inert gas. For example, a nitrogen (N)-containing gas can be used as the inert gas. For example, nitrogen (N2) gas can be used as the N-containing gas. One or more of these can be used as the N-containing gas. A notch alignment device (not shown) is installed between the wafer transfer mechanism 24 and the clean unit 35 as a substrate alignment device that aligns the circumferential position of the wafer 18.

[0070] The clean air 36 blown out from the clean unit 35 is circulated to a notch alignment device (not shown), a wafer transfer mechanism 24, and a boat 26, and then sucked in by a duct (not shown) and exhausted to the outside of the housing 2, or is blown out into the transfer chamber 23 by the clean unit 35.

[0071] Next, the operation of the substrate processing apparatus 1 will be described.

[0072] When the pod 9 is supplied to the load port 8, the pod loading / unloading opening 6 is opened by the front shutter 7. The pod 9 on the load port 8 is carried into the interior of the housing 2 through the pod loading / unloading opening 6 by the pod transport mechanism 15 and placed on a designated shelf 13 of the rotary pod shelf 11. After being temporarily stored on the rotary pod shelf 11, the pod 9 is transported by the pod transport mechanism 15 from the shelf 13 to one of the pod openers 14 and transferred to the placement table 21, or is transferred directly from the load port 8 to the placement table 21.

[0073] At this time, the wafer loading / unloading port 19 is closed by the opening / closing mechanism 22, and clean air 36 is circulated and filled in the transfer chamber 23. For example, by filling the transfer chamber 23 with N-containing gas as the clean air 36, the oxygen concentration is set to 20 ppm or less, which is lower than the oxygen concentration inside the housing 2 (air atmosphere).

[0074] The open end face of the pod 9 placed on the mounting table 21 is pressed against the edge of the opening of the wafer loading / unloading port 19 in the front wall 17 of the sub-housing 16, and the lid is removed by the opening / closing mechanism 22, opening the wafer entrance / exit.

[0075] When the pod 9 is opened by the pod opener 14, the wafers 18 are removed from the pod 9 by the wafer transfer mechanism 24 and transferred to a notch alignment device (not shown). After the wafers 18 are aligned by the notch alignment device, the wafer transfer mechanism 24 carries the wafers 18 into a waiting section 27 at the rear of the transfer chamber 23 and charges them into a boat 26.

[0076] After transferring the wafers 18 to the boat 26 , the wafer transfer mechanism 24 returns to the pod 9 and loads the next wafer 18 into the boat 26 .

[0077] While the wafer transfer mechanism 24 in one (upper or lower) pod opener 14 is loading wafers 18 into the boat 26, another pod 9 is transported from the rotary pod shelf 11 to the other (lower or upper) pod opener 14 by the pod transport mechanism 15 and transferred thereto, and the other pod opener 14 simultaneously begins opening the pod 9.

[0078] When a predetermined number of wafers 18 are loaded into the boat 26, the furnace opening of the processing furnace 28, which has been closed by the furnace opening shutter 31, is opened by the furnace opening shutter 31. Then, the boat 26 is raised by the boat elevator 32 and loaded into the processing chamber 29.

[0079] After loading, the furnace throat is airtightly closed by the seal cap 34. At this timing (after loading), the present embodiment includes a purging step (pre-purging step) in which the processing chamber 29 is purged with an inert gas.

[0080] The processing chamber 29 is evacuated to a desired pressure (vacuum level) by a gas exhaust mechanism (not shown), and is heated to a predetermined temperature by a heater driving unit (not shown) to achieve a desired temperature distribution.

[0081] A gas supply mechanism (not shown) supplies a process gas controlled at a predetermined flow rate, and as the process gas flows through the process chamber 29, it comes into contact with the surface of the wafer 18, and a predetermined process is performed on the surface of the wafer 18. Furthermore, the process gas after reaction is exhausted from the process chamber 29 by a gas exhaust mechanism. In this specification, the process gas means the gas supplied into the process chamber 29. This also applies to the following explanation.

[0082] After the preset processing time has elapsed, the gas supply mechanism supplies inert gas from an inert gas supply source (not shown), replacing the atmosphere in the processing chamber 29 with the inert gas, and the pressure in the processing chamber 29 is returned to normal pressure (after-purging process). Then, the boat elevator 32 lowers the boat 26 via the seal cap 34. The processing time in this specification refers to the time the processing continues. This also applies to the following explanations.

[0083] To remove the processed wafers 18, the above-described procedure is reversed, and the wafers 18 and the pod 9 are removed from the housing 2. Unprocessed wafers 18 are loaded into the boat 26, and the batch processing of the wafers 18 is repeated.

[0084] 3 and 4, the substrate processing apparatus 1 includes a control device 100, which controls the substrate processing apparatus 1. The control device 100 may be built into the substrate processing apparatus 1, or may be provided outside the substrate processing apparatus 1 so as to be accessible.

[0085] (Control device) Next, the configuration of a control system of the substrate processing apparatus 1 according to this embodiment will be described with reference to Fig. 5. Fig. 5 is a block diagram showing an example of the functional configuration of a control device 100 included in the substrate processing apparatus 1 according to this embodiment.

[0086] As shown in FIG. 5, the substrate processing apparatus 1 includes a control device (main controller) 100, an external communication unit 201, an external memory unit 202, an operation unit 203, a display unit 204, an input unit 207, a process control unit 205, and a transport control unit 206.

[0087] The control device 100 also includes a control unit 101, a storage unit 104, and an I / O port 105. The control unit 101 includes a CPU 102 and a RAM 103. Although the operation unit 203 is shown separately from the control unit 101, it may be realized as one function of the control unit 101.

[0088] The control device 100 is connected to an operation unit 203, and is also connected to a process control unit 205 and a transport control unit 206 via an I / O port 105. The control device 100 is electrically connected to each of the process control unit 205 and the transport control unit 206 via the I / O port 105, and is therefore configured to be able to send and receive each piece of data, download and upload each file, and so on.

[0089] The control device 100 is connected to an external host computer (not shown) via an external communication unit 201. Therefore, even if the substrate processing apparatus 1 is installed in a clean room, the host computer can be located in an office or the like outside the clean room. In addition, an external storage unit 202 is connected to the control device 100 as an attachment unit into which a USB (Universal Serial Bus) memory or the like, which is an example of a recording medium, is inserted and removed. The substrate processing apparatus 1 of this embodiment can load, for example, a recipe whose operation has been confirmed by the simulator 300 into the substrate processing apparatus 1 via the external storage unit 202, and process substrates using the recipe loaded in the substrate processing apparatus 1. According to the substrate processing apparatus 1 of this embodiment, by using the recipe whose operation has been confirmed by the simulator 300 in the apparatus, losses (such as substrates and energy) due to erroneous recipe execution can be reduced.

[0090] The operation unit 203, which serves as an operation control unit, may integrally include a display unit 204 and an input unit 207, or may be connected to the display unit 204 via a video cable or the like and to the input unit 207 via a signal cable or the like. The display unit 204 is, for example, a liquid crystal display panel. The input unit 207 is, for example, an input device such as a keyboard or a mouse. The operation unit 203, display unit 204, and input unit 207 may also be integrally configured as a touch panel. The display unit 204 is configured to display various operation screens for operating the substrate processing apparatus 1. The operation screens include screens for checking the status of the substrate process system controlled by the process control unit 205 and the substrate transport system controlled by the transport control unit 206. The display unit 204 can also display various operation buttons and input fields as an input interface (input means) for inputting operation instructions to the substrate process system and the substrate transport system. Each operation button is selected or pressed via the operation unit 203 based on instructions input from the input unit 207. Numerical values ​​and the like are input into each input field via the operation unit 203 based on instructions input from the input unit 207. The operation unit 203 displays information generated within the substrate processing apparatus 1 on the display unit 204. The operation unit 203 also outputs, for example, information input from the input unit 207 or information displayed on the display unit 204 to a device such as a USB memory inserted into the external storage unit 202. The operation unit 203 accepts input data (input instructions) input by a user via an operation screen displayed on the display unit 204 and transmits the input data to the control device 100. The operation unit 203 also accepts instructions (control instructions) via the input unit 207 to execute an arbitrary substrate processing recipe (also referred to as a process recipe) from among the recipes expanded in the RAM 103 or the plurality of recipes stored in the storage unit 104, and transmits the instructions to the control device 100. Here, the operation unit 203 and the display unit 204 are provided separately from the control device 100, but may be configured to be included integrally in the control device 100.

[0091] In the processing chamber 29, the substrate is processed according to a recipe having at least one step that defines processing conditions for the substrate. That is, the recipe is made up of one or more steps.

[0092] The operation unit 203 accepts editing operations such as adding, deleting, changing the order of steps included in a recipe, and setting repeated execution from the user via the input unit 207. The operation unit 203 also accepts editing operations for at least one setting item included in the processing conditions of a selected step. In other words, the operation unit 203 accepts editing operations for steps included in a recipe and editing operations for at least one setting item included in the processing conditions of each step from the user via the operation screen.

[0093] The process control unit 205 includes a temperature measurement unit 205A, a gas flow rate measurement unit 205B, and a pressure measurement unit 205C. The temperature measurement unit 205A, the gas flow rate measurement unit 205B, and the pressure measurement unit 205C each constitute a sub-controller, and are electrically connected to the process control unit 205, enabling transmission and reception of each data, downloading and uploading of each file, etc. Although the process control unit 205 and each sub-controller (the temperature measurement unit 205A, the gas flow rate measurement unit 205B, and the pressure measurement unit 205C) are shown as separate units, they may also be configured as an integrated unit.

[0094] A heating mechanism mainly composed of a heater and a temperature sensor (not shown) is connected to the temperature measurement unit 205A. The temperature measurement unit 205A is configured to adjust the temperature inside the process furnace 28 by controlling the temperature of the heater of the process furnace 28. The temperature measurement unit 205A is configured to control the switching (on / off) of a thyristor to control the power supplied to the heater wire.

[0095] The gas flow rate measuring unit 205B is connected to an MFC (Mass Flow Controller) (not shown) as a gas flow rate controller that is provided on a gas pipe that supplies a predetermined gas into the processing chamber 29 and is configured to control the flow rate of the supplied gas. If an on-off valve (valve) other than the MFC is provided on the gas pipe, the gas flow rate measuring unit 205B may be configured to control the on-off valve together with the MFC. The gas flow rate measuring unit 205B is configured to control the valve opening of the MFC so that the flow rate of the gas supplied into the processing chamber 29 becomes a specified value. Alternatively, an MFC may be configured as the gas flow rate measuring unit 205B and directly connected to the process control unit 205.

[0096] A gas exhaust mechanism (not shown) mainly composed of a pressure sensor (not shown) and an APC (automatic pressure control) valve (not shown) serving as a pressure valve is connected to the pressure measurement unit 205C. A vacuum pump (not shown) may also be included in the gas exhaust mechanism. The pressure measurement unit 205C is configured to control the aperture of the APC valve and the switching (on / off) of the vacuum pump based on the pressure value detected by the pressure sensor so that the pressure inside the processing chamber 29 becomes the specified pressure at the specified timing.

[0097] The transfer control unit 206 includes a container transfer unit 206A that transfers containers capable of storing substrates in multiple tiers, a substrate transfer unit 206B that transfers substrates, and a support transfer unit 206C that transfers supports that support substrates. The container transfer unit 206A, the substrate transfer unit 206B, and the support transfer unit 206C are configured to control the drive system, the rotation system, and the lifting system of the substrate processing apparatus 1, respectively. The transfer control unit 206 is configured to control the transfer operations of, for example, the rotary pod shelf 11, the boat elevator 32, the pod transfer mechanism 15, the wafer transfer mechanism 24, the boat 26, and the rotation mechanism (not shown).

[0098] The container transport unit 206A is configured to transport the pod 9 by controlling the rotary pod shelf 11, the pod transport mechanism 15, etc. The substrate transport unit 206B is configured to load and unload wafers 18 into and from the boat 26 by controlling the wafer transfer mechanism 24, the notch alignment device, etc. The support tool transport unit 206C is configured to transport the boat 26 by controlling the boat elevator 32, the arm 33, etc.

[0099] The control device 100, process control unit 205, and transport control unit 206 according to this embodiment can be realized using a normal computer system, rather than a dedicated system. For example, each controller that executes a predetermined process can be configured by installing a program for executing the above-described processes from a recording medium (CD-ROM, USB, etc.) that stores the program into a general-purpose computer.

[0100] The means for supplying these programs is arbitrary. As described above, they can be supplied via a predetermined recording medium, or they can be supplied via a communication line, a communication network, a communication system, or the like.

[0101] The control device 100 is configured as a computer including a CPU 102, RAM 103, a storage unit 104, and an I / O port 105. The storage unit 104 stores recipes 104B defining processing conditions and processing procedures, an apparatus control program 104A for executing each of these recipe files, apparatus parameters 104C (setting value files) for setting processing conditions and processing procedures, and apparatus data 104D as measurement data acquired from each measuring device. The control device 100 is connected to a network, such as the Internet, a local area network (LAN), or a wide area network (WAN), using an external communication unit 201, enabling communication with external devices via the network. The apparatus control program 104A may be pre-installed in the substrate processing apparatus 1, for example. Alternatively, the apparatus control program 104A may be recorded on a non-volatile recording medium or distributed via a network and installed appropriately in the substrate processing apparatus 1. Examples of non-volatile recording media include CD-ROMs, magneto-optical disks, HDDs, DVD-ROMs, flash memories, memory cards, and USBs.

[0102] The storage unit 104 may be, for example, a hard disk drive (HDD), a solid state drive (SSD), or a flash memory.

[0103] (Startup screen) Next, with reference to FIGS. 6A to 6D, an example of screen transition of the display operation unit 307 accompanying the startup process of the simulator 300 according to this embodiment will be described.

[0104] When a startup process, which will be described later, is executed in the simulator 300, the CPU 302 causes the display operation unit 307 to display a startup screen 600, as shown in FIG. 6A . The startup screen 600 is a screen for selecting environmental settings for the startup environment of the simulator 300. The startup screen 600 of this embodiment includes an apparatus list 601 from which an apparatus can be selected, an execution speed list 602 from which an execution speed can be selected, a transport condition list 603 from which transport conditions as transport operations can be selected, an execute button 604, and a cancel button 605. The display operation unit 307 of this embodiment is a touch panel, and is configured to allow touch operation by an operator. The startup screen 600 displayed on the display operation unit 307 may be displayed over the entire display area of ​​the display operation unit 307, or may be displayed in a portion of the display area (for example, a dialog window, etc.).

[0105] The device list 601 of this embodiment is configured to allow selection of device 1, device 2, and device 3. Therefore, when the worker presses the device list 601, the screen shown in Fig. 6B is displayed. As shown in Fig. 6B, the start-up screen 600 displays the options "Device 1," "Device 2," and "Device 3" in a pull-down list, allowing the worker to select the desired device.

[0106] Execution speed list 602 shown in Fig. 6A is configured to allow selection of actual speed, double speed, and quadruple speed. Therefore, when the operator presses execution speed list 602, the screen shown in Fig. 6C is displayed. As shown in Fig. 6C, start-up screen 600 displays options of "actual speed," "x2" indicating double speed, and "x4" indicating quadruple speed in a pull-down list, allowing the operator to select the desired execution speed.

[0107] The transport condition list 603 shown in Fig. 6A is configured to allow selection of a normal transport operation and a transport skip operation. Therefore, when the operator presses the transport condition list 603, the screen shown in Fig. 6D is displayed. As shown in Fig. 6D, the start-up screen 600 displays options of "Normal," which indicates a normal transport operation, and "Skip," which indicates a transport skip operation, in a pull-down list, allowing the operator to select the desired transport condition. Note that if the measuring device connected to the simulator 300 is an actual measuring device, the transport condition list 603 may be hidden or may not respond even when pressed.

[0108] 6A is a button for executing a simulation of the selected device at the selected execution speed and transport conditions, and a cancel button 605 is a button for canceling the execution of the simulation.

[0109] That is, the display operation unit 307 displays a selection screen for device selection, execution speed, and transport operation mode when the simulator 300 is started, prompting the operator to select each option. When the execute button 604 is pressed, the display operation unit 307 notifies the simulator control unit 301 of the selected information. The simulator control unit 301 instructs the operation environment setting unit 402 to develop the operating environment of the selected device, notifies the time monitoring unit 403 of the selected execution speed, and notifies the virtual transport control unit 406 of the selected transport conditions. The simulator control unit 301 then starts the device control program for the selected device and launches a simulation of the selected device. The simulator 300 of this embodiment operates in accordance with the device selection options, execution speed selection options, and transport condition selection options displayed on the screen of the display operation unit 307 at startup. The simulator 300 of this embodiment reduces the time required for the operator to make settings. Furthermore, the simulator control unit 301 starts the device control program using the startup conditions from the startup unit 401. Since the device control program is the same as the program stored in each device, the display / operation unit 307 of the simulator 300 can also simulate the operation of each device.

[0110] (flowchart) 7 is a flowchart showing an example of the flow of the startup process according to this embodiment, which is executed when the simulator 300 is started up, for example.

[0111] 7, the CPU 302 receives a selection of start conditions. Specifically, the CPU 302 displays a device list 601, an execution speed list 602, and a transport condition list 603 (see FIG. 6A), and receives a selection of a device, an execution speed, and a transport condition.

[0112] In step S101, the CPU 302 accepts the end of the selection of the start conditions. If the CPU 302 accepts the pressing of the execute button 604 (step S101: execute), the process proceeds to step S102. On the other hand, if the CPU 302 accepts the pressing of the cancel button 605 (step S101: cancel), the start process ends.

[0113] In step S102, the CPU 302 configures a simulator. Specifically, the CPU 302 sets the operating environment of the device selected in step S100 (reproduces the operating environment of the actual device). The CPU 302, for example, creates a folder structure and extracts various files.

[0114] In step S103, the CPU 302 executes the simulator. Specifically, the CPU 302 executes the device control program of the device selected in step S100 at the execution speed and transport conditions selected in step S100. Then, the CPU 302 ends the startup process.

[0115] The simulator 300 of this embodiment stores in the simulator storage unit 304 an apparatus control program installed in the substrate processing apparatus 1 and apparatus parameters defining setting information related to the apparatus configuration and substrate processing conditions. The simulator storage unit 304 also stores a recipe that sets substrate processing conditions. The recipe is composed of multiple steps for each substrate processing operation, and a processing time is defined for each of the multiple steps. When starting the apparatus control program, the simulator control unit 301 executes the apparatus control program according to the execution speed and transport operation mode selected by the startup unit 401. Therefore, the simulator 300 of this embodiment can achieve one or more of the following effects: It is possible to simulate substrate processing operations according to an edited recipe without using the substrate processing apparatus 1, thereby reducing the time required for recipe editing. Furthermore, by using the apparatus control program and apparatus parameters installed in the substrate processing apparatus 1, it is possible to perform the same operations as those performed by the substrate processing apparatus 1 on the simulator 300. By executing the apparatus control program according to the selected execution speed and transport operation mode, it is possible to adjust the confirmation time for the substrate processing operation, thereby enabling the operation of the executed recipe to be confirmed in a short time. Furthermore, assembling and installing the substrate processing apparatus 1 takes time, and when using an actual machine, operation can only be checked after installation of the substrate processing apparatus 1 is completed, but when using the simulator 300, operation can be checked without the substrate processing apparatus 1. Furthermore, when the transport skip operation is selected, it becomes possible to skip the operation of the transport system, and it becomes possible to check the substrate processing operation in a shorter time.

[0116] <Other Aspects of the Disclosure> The simulator 300 and the substrate processing apparatus 1 according to the embodiment have been described above. The embodiment may be in the form of a program for causing a computer to execute the functions of the simulator 300 or the substrate processing apparatus 1. The embodiment may be in the form of a non-transitory recording medium that stores the program and is readable by a computer.

[0117] Furthermore, the configurations of the simulator 300 and the substrate processing apparatus 1 described in the above embodiment are merely examples, and may be changed depending on the situation without departing from the spirit of the invention.

[0118] Furthermore, the processing flow of the program described in the above embodiment is also an example, and unnecessary steps may be deleted, new steps may be added, or the processing order may be rearranged within the scope of the main idea.

[0119] In the above embodiment, the processing according to the embodiment is realized by a software configuration using a computer by executing a program, but the present invention is not limited to this. The embodiment may be realized by, for example, a hardware configuration or a combination of a hardware configuration and a software configuration.

[0120] In the above embodiment, an example of forming a film using a batch-type substrate processing apparatus that processes multiple substrates at a time has been described. The present disclosure is not limited to the above embodiment and can be suitably applied, for example, to a case where a film is formed using a single-wafer substrate processing apparatus that processes one or several substrates at a time. Furthermore, in the above embodiment, an example of forming a film using a substrate processing apparatus having a hot-wall type processing furnace has been described. The present disclosure is not limited to the above embodiment and can be suitably applied to a case where a film is formed using a substrate processing apparatus having a cold-wall type processing furnace.

[0121] When using these substrate processing apparatuses, each process can be performed under the same process procedures and conditions as in the above embodiment, and the same effects as in the above embodiment can be obtained. [Explanation of symbols]

[0122] 18 wafer (substrate), 300 simulator (simulator device), 304 simulator memory unit (virtual device memory unit), 400 virtual control unit, 401 startup unit

Claims

1. a virtual device storage unit that stores a recipe having a plurality of steps that define processing conditions and processing times for a substrate, and a device control program that controls processing of the substrate in a substrate processing apparatus having the recipe; a start-up unit that selects an execution speed of the device control program and at least one of a normal transport operation and a transport skip operation as an operation of the substrate transport unit; a virtual control unit that starts the apparatus control program based on the execution speed selected by the starting unit and the operation of the transport unit, and that is capable of controlling virtual processing of the substrate based on the recipe stored in the virtual apparatus storage unit; A simulator device comprising:

2. the transport unit is at least one of a container transport unit that transports a container capable of storing the substrates in multiple stages, a substrate transport unit that transports the substrates, and a support tool transport unit that transports the substrates to a processing container where the substrates are processed by a support tool that supports the substrates. The simulator device according to claim 1 .

3. a time monitoring unit that controls the execution speed of the device control program; the startup unit selects one execution speed from a plurality of execution speeds including a real speed and a double speed, the time monitoring unit monitors the time in accordance with the one execution speed selected by the starting unit; The simulator device according to claim 1 .

4. the virtual apparatus storage unit further stores the recipes for the plurality of substrate processing apparatuses and the apparatus control programs for the plurality of substrate processing apparatuses; the starting unit selects one of the substrate processing apparatuses from the plurality of substrate processing apparatuses. The simulator device according to claim 1 .

5. an operating environment setting unit that sets an operating environment of the selected substrate processing apparatus; the operating environment setting unit acquires apparatus configuration information corresponding to the selected substrate processing apparatus from the virtual apparatus storage unit, generates a folder based on the acquired apparatus configuration information, and sets the operating environment including at least one of the apparatus control program and the recipe of the selected substrate processing apparatus in the generated folder. The simulator device according to claim 4.

6. the virtual apparatus storage unit stores apparatus parameters defining a configuration of a measuring device including the transport unit connected to the substrate processing apparatus; the operating environment setting unit acquires the equipment parameters of the selected substrate processing apparatus from the virtual equipment storage unit and expands the equipment parameters into the generated folder; The simulator device according to claim 5 .

7. the apparatus parameters can set connection conditions of the measuring apparatus connected to the substrate processing apparatus; the virtual control unit connects to the measuring device set by the device parameters according to the device control program, executes the recipe, and controls virtual processing of the substrate. The simulator device according to claim 6.

8. The connection conditions of the measuring device in the device parameters are specified by setting connection destination information of the measuring device defined in the device parameters. The simulator device according to claim 7.

9. a virtual measuring device control unit that is connected to the measuring device defined in the device parameters and that can control communication with the measuring device; the virtual measuring device control unit notifies the virtual control unit of the measurement data reported by the measuring device; The simulator device according to claim 7.

10. the virtual measuring device control unit includes a virtual process control unit connected to a measurement unit of a process system in the measuring device, and a virtual transport control unit connected to the transport unit in the measuring device. The simulator device according to claim 9.

11. When connected to the measurement unit, if the measurement unit is set to virtual in the device parameters, the virtual process control unit acquires data reported from a virtual measurement unit that is a virtual measurement unit, and if the measurement unit is set to real equipment in the device parameters, the virtual process control unit acquires data reported from the measurement unit as a real equipment. The simulator device according to claim 10.

12. When connected to the transport unit, if the transport unit is set to virtual in the device parameters, the virtual transport control unit acquires data reported from the virtual transport unit, which is a virtual transport unit, and if the transport unit is set to real in the device parameters, acquires data reported from the transport unit as a real machine. The simulator device according to claim 10.

13. When the transport unit connected to the virtual transport control unit in the device parameters is set to a real machine, selection of the transport skip operation, which is the operation of the transport unit, is canceled. The simulator device according to claim 10.

14. a virtual device display / operation unit that displays selection information for each of the execution speed and the operation of the transport unit; the virtual device display operation unit displays a selection item for the execution speed and a selection item for the operation of the transport unit, The simulator device according to claim 1 .

15. the virtual device display / operation unit notifies the virtual control unit when the selection item of the execution speed and the selection item of the operation of the transport unit are confirmed; The simulator device according to claim 14.

16. The recipe can be edited, and the recipe is edited using the virtual device display and operation unit. The simulator device according to claim 14.

17. an external communication unit that is connected to an external communication device and is capable of communicating with the external communication device; It is possible to check the communication operation with the connected external communication device. The simulator device according to claim 1 .

18. a processing chamber for processing a substrate; The substrate is processed according to the recipe stored in the simulator apparatus according to claim 1. Substrate processing equipment.

19. A manufacturing method performed in the substrate processing apparatus of claim 18, comprising: transporting the substrate into the processing chamber; processing the substrate; A method for manufacturing a semiconductor device having the above structure.

20. A program executed in the substrate processing apparatus according to claim 18, transporting the substrate into the processing chamber; processing the substrate; A program for causing a computer to execute the above in the substrate processing apparatus.

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