Conductance adjustment device, substrate processing system, and method of producing article

Abstract

To provide a technique capable of adjusting exhaust conductance of a processing chamber in a substrate processing system provided with a plurality of processing chambers, without using a complicated control mechanism.SOLUTION: The conductance adjustment device comprises a cylindrical member attachable to / detachable from a connection part of a pipe constituting a flow path, and at least one flow path resistance member comprising a resistance part that functions as a flow path resistance and can be detachably fixed in the cylinder of the cylindrical member, in which the space in the cylinder of the cylindrical member communicates with the pipe to constitute a portion of the flow path, and the conductance of the flow path is adjusted by a combination of the number of the flow path resistance members fixed in the cylinder of the cylindrical member and the shape of the resistance part.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a conductance adjusting device that adjusts the conductance of a flow path, a substrate processing system, and a method for manufacturing an article. [Background technology]

[0002] When manufacturing various substrates, including display substrates, various processes, including drying, are often performed in a reduced-pressure atmosphere. For example, in the manufacture of organic electroluminescence (EL) display devices, which are an example of such products, when forming organic EL elements (OLEDs) on a substrate, a solution is applied to the substrate using an inkjet device or the like, and the substrate is then dried using a reduced-pressure drying device. To increase the throughput of the drying process, multiple reduced-pressure drying devices are often installed on substrate manufacturing lines.

[0003] In this case, even if the volumes of the processing chambers of the reduced-pressure drying apparatuses are the same, the depressurization speed and drying capacity of each processing chamber may differ depending on the individual differences in the exhaust capacity of the vacuum pumps used for depressurization, the length of the piping connecting the vacuum pumps to each processing chamber, etc. As a result, the condition of the dried substrates may vary from one reduced-pressure drying apparatus to another.

[0004] Patent Document 1 describes a substrate processing apparatus including multiple processing chambers, multiple exhaust paths connecting each processing chamber to a single pump, and a conductance adjuster provided in each exhaust path. The conductance adjuster includes a movable part and a drive mechanism, and the drive mechanism moves the movable part to automatically change the volume of the internal space of the conductance adjuster, thereby adjusting the conductance of the exhaust path. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2022-73539 Summary of the Invention [Problem to be solved by the invention]

[0006] In the substrate processing apparatus described in Patent Document 1, the volume of the internal space of the conductance adjuster provided in each exhaust path is controlled according to the processing state (stage of the processing process). In this case, if the state (e.g., pressure) of a certain exhaust path fluctuates due to the operation of a certain conductance adjuster, this fluctuation can propagate to other exhaust paths and affect the exhaust operation of those other exhaust paths. If a conductance adjuster provided in the other exhaust path is operated to reduce this fluctuation, the fluctuation can propagate to yet another exhaust path. Depending on the operating speed of the drive mechanism of the conductance adjuster and the response of the pumping speed to this fluctuation, problems such as unstable pressure control in each substrate processing chamber or a long time required for the pressure control to stabilize can occur.

[0007] Furthermore, if the conductance is automatically adjusted by controlling the moving parts and drive mechanisms according to the stage of the processing process, the drying processing system becomes complicated, the cost of the device increases, and it takes time to determine the automatic control procedure, which may lengthen the start-up period before the substrate processing device is operational.

[0008] Therefore, in a substrate processing system having multiple processing chambers, there has been a demand for a technique that allows adjustment of the exhaust conductance of the processing chambers without using a complex control mechanism. [Means for solving the problem]

[0009] One aspect of the present invention is a conductance adjustment device comprising a cylindrical member that can be attached and detached to a connection portion of a pipe that constitutes a flow path, and at least one flow path resistance member that has a resistance portion that provides flow path resistance and can be detachably fixed inside the cylindrical member, wherein the space inside the cylindrical member communicates with the pipe to form part of the flow path, and the conductance of the flow path is adjusted by combining the number of flow path resistance members fixed inside the cylindrical member and the shape of the resistance portion. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a technique that enables adjustment of the exhaust conductance of a processing chamber in a substrate processing system equipped with a plurality of processing chambers without using a complex control mechanism. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing a schematic configuration of a substrate processing system according to a first embodiment. [Figure 2] FIG. 2 is a schematic partial cross-sectional view illustrating the structure of a fixed conductance regulator. [Figure 3] (a) A cross-sectional view of the fixed conductance regulator taken along the exhaust flow path. (b) A cross-sectional view of the fixed conductance regulator taken along line AB in Figure 3(a). [Figure 4] 1A is a plan view of the cylindrical portion as viewed from the direction along the exhaust flow path, FIG. 1B is a diagram showing an example of the shape of the flow path resistance member, and FIG. 1C is a diagram showing another example of the shape of the flow path resistance member. [Figure 5] 10 is a flowchart illustrating a procedure for appropriately selecting a flow path resistance member, attaching it to a fixed conductance regulator, and connecting the fixed conductance regulator to an appropriate pipe. [Figure 6] 6 is a graph illustrating a comparison of pumping speeds when a fixed conductance adjuster is not installed in the first embodiment. [Figure 7] FIG. 10 is a schematic diagram showing a schematic configuration of a substrate processing system according to a second embodiment. [Figure 8] 10 is a graph illustrating a comparison of pumping speeds when a fixed conductance adjuster is not installed in the second embodiment. [Figure 9] FIG. 10 is a schematic diagram showing a schematic configuration of a substrate processing system according to a third embodiment. [Figure 10] 11 is a graph illustrating a comparison of pumping speeds when a fixed conductance adjuster is not installed in the third embodiment. [Figure 11] FIG. 10 is a schematic diagram showing a schematic configuration of a substrate processing system according to a fourth embodiment. [Figure 12] 10 is a graph illustrating a comparison of pumping speeds when a fixed conductance adjuster is not installed in the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] A conductance adjustment device, a substrate processing system, and the like according to embodiments of the present invention will be described with reference to the drawings. The embodiments shown below are merely examples, and those skilled in the art can appropriately modify and implement the detailed configurations within the scope of the present invention.

[0013] In the drawings referred to in the following description of the embodiments and examples, elements denoted by the same reference numerals have the same functions unless otherwise specified. When a plurality of identical elements are arranged in a drawing, the reference numerals and their descriptions may be omitted.

[0014] In addition, because the drawings may be represented schematically for the convenience of illustration and explanation, the shape, size, and arrangement of elements depicted in the drawings may not strictly correspond to the actual objects. Furthermore, the descriptions "XX or more and YY or less" and "XX to YY" that represent a numerical range mean a numerical range including the endpoints XX (lower limit) and YY (upper limit), unless otherwise specified. When a numerical range is described in stages, the upper and lower limits of each numerical range can be arbitrarily combined.

[0015] [Embodiment 1] FIG. 1 is a schematic diagram showing the overall configuration of a substrate processing system 1 according to a first embodiment. The substrate processing system 1 includes a processing chamber 4a and a processing chamber 4b, in which a drying process for a substrate is performed in a reduced-pressure atmosphere. The diagram illustrates a state in which a substrate 3a, which has been coated with a solution in a previous process, is accommodated in the processing chamber 4a, and a substrate 3b, which has been coated with a solution in a previous process, is accommodated in the processing chamber 4b. The substrates are carried into and out of the processing chambers by a transfer mechanism (e.g., a transfer robot), not shown. For example, the substrate 3a, which has been coated with a solution using an inkjet device or the like, is dried under reduced pressure in the processing chamber 4a or the processing chamber 4b, thereby producing an organic EL display device, which is an article.

[0016] The substrate processing system 1 includes an information processing unit 100. The information processing unit 100 includes a computer, and an input unit (mouse, keyboard, etc.) and an output unit (display, printer, etc.) as a user interface. As will be described later, the information processing unit 100 assists the user in selecting an appropriate flow path resistance member when setting the flow path resistance member in the fixed conductance regulator 2.

[0017] The processing chamber 4a is connected to an exhaust pump 5a (e.g., a vacuum pump) via a pipe 6a, and an on-off valve 7a that can open and close the pipe is disposed in the middle of the pipe 6a. The processing chamber 4b is connected to an exhaust pump 5b (e.g., a vacuum pump) via a pipe 6b, and an on-off valve 7b that can open and close the pipe is disposed in the middle of the pipe 6b. In the substrate processing system 1, an exhaust pump is individually connected to each of the multiple processing chambers, thereby improving the throughput of the reduced-pressure drying process.

[0018] Of the pipes 6a and 6b, the pipe with the larger conductance from the processing chamber to the exhaust pump is provided with a fixed conductance adjuster 2. In this example, the pipe diameters (cross-sectional area of ​​the flow path) of the pipes 6a and 6b are the same, and the pipe length L1 of the pipe 6a is larger than the pipe length L2 of the pipe 6b, so the conductance of the pipe 6b is larger than the conductance of the pipe 6a. Therefore, the fixed conductance adjuster 2 is disposed midway along the pipe 6b. The fixed conductance adjuster 2 is detachably attached to a pipe connection portion midway along the pipe 6b. It is desirable to dispose the fixed conductance adjuster 2 in the pipe 6b so that the distance from the fixed conductance adjuster 2 to the exhaust pump 5b is shorter than the distance from the fixed conductance adjuster 2 to the processing chamber 4b.

[0019] 2 is a schematic partial cross-sectional view illustrating the structure of fixed conductance regulator 2 attached to a pipe connection portion midway through pipe 6b. Pipe 6b is configured by connecting a plurality of pipe segments in series at connection portions. In this example, pipe 6b is configured by fastening flange portions 61 disposed on the ends of left and right pipes at the connection portion with fastening portions 21 (e.g., bolts and nuts). In this embodiment, flange portions 61 are fastened with fastening portions 21 with fixed conductance regulator 2 sandwiched between flange portions 61 of the left and right pipes.

[0020] The fixed conductance regulator 2 includes a cylindrical portion 8 as a cylindrical member and at least one flow path resistance member 9 detachably fixed inside the cylindrical portion 8. The cylindrical portion 8 is connected to left and right pipes, and the left and right pipes communicate with the internal space of the cylindrical portion 8 to form the piping 6b. It is desirable that the inner diameter of the cylindrical portion 8 is equal to the inner diameters of the left and right pipes.

[0021] By loosening fastening portion 21 and removing fixed conductance regulator 2 from pipe 6b, it is possible to remove flow path resistance member 9 fixed to cylindrical portion 8, replace it with another flow path resistance member 9, or fix a new flow path resistance member 9 to cylindrical portion 8. An appropriately selected flow path resistance member 9 for adjusting conductance is attached to the fixed conductance regulator, and the conductance is fixed to a predetermined value before being connected to the pipe. When fixed conductance regulator 2 is sandwiched between the left and right pipes to form part of pipe 6b, it acts as a part having an adjusted fixed value of conductance, and therefore can be called a fixed conductance regulator. Note that if fixed conductance regulator 2 is not attached to pipe 6b, pipe 6b can be connected by fastening flange portions 61 of the left and right pipes together with fastening portion 21.

[0022] Fig. 3(a) shows a cross-sectional view of the fixed conductance regulator 2 taken along the exhaust direction. Fig. 3(b) shows a cross-sectional view of the fixed conductance regulator 2 taken along line AB in Fig. 3(a), i.e., a cross-sectional view taken along a direction perpendicular to the exhaust flow path. Fig. 4(a) shows a plan view of the cylindrical portion 8 as seen from a direction along the exhaust flow path. Fig. 4(b) shows an example shape of the flow path resistance member 9, and Fig. 4(c) shows another example shape of the flow path resistance member 9.

[0023] 4(a), fitting grooves 81 for detachably fixing the flow path resistance member 9 are provided on the inner surface of the tube of the cylindrical portion 8. In the illustrated example, eight fitting grooves 81 are provided along the inner circumference of the cylindrical portion 8, but the number of fitting grooves 81 is not limited to eight. As shown in FIG. 4( b ) or FIG. 4( c ), the flow path resistance member 9 has a protrusion 91 that can be fitted into the fitting groove 81 of the cylindrical portion 8 .

[0024] The flow path resistance member 9 illustrated in FIG. 4(b) has a resistance portion 9a that protrudes into the flow path space when attached to the cylindrical portion 8, and the flow path resistance member 9 illustrated in FIG. 4(c) has a resistance portion 9b that protrudes into the flow path space when attached to the cylindrical portion 8. The resistance portions 9a and 9b have sector shapes with different circumferential angles θ of the flow path and / or different protruding distances R in the radial direction of the flow path, and they reduce the conductance of the exhaust flow path by different amounts. Here, two types of flow path resistance members 9 with different resistance portion shapes have been illustrated, but there may be more types of resistance portion shapes.

[0025] The fixed conductance regulator 2 according to this embodiment can detachably mount any number of flow path resistance members 9 of any shape. The shape of the flow path resistance members to be mounted is not limited to one type, and flow path resistance members of multiple types of shapes may be mounted in combination.

[0026] Next, a procedure will be described for appropriately selecting a flow path resistance member, attaching it to fixed conductance regulator 2, and connecting fixed conductance regulator 2 to an appropriate pipe (pipe 6b in this example). Figure 5 is a flowchart for explaining the procedure.

[0027] When the process starts, in step S1, the information processing unit 100 acquires data on the exhaust speed when the exhaust pump 5a exhausts the process chamber 4a to a predetermined pressure via the piping 6a that is not equipped with the fixed conductance regulator 2. The information processing unit 100 can read the data from a storage device that stores the exhaust speed data obtained in advance through an experiment, for example. In the experiment, the pressure in the process chamber is reduced from pressure P0 (e.g., atmospheric pressure) to a desired pressure P1 without a substrate placed in the process chamber, and the time required for the pressure inside the process chamber to be reduced to the desired pressure is measured.

[0028] Next, in step S2, the information processing unit 100 acquires data on the pumping speed when the exhaust pump 5b evacuates the processing chamber 4b to a predetermined pressure via the pipe 6b that is not equipped with the fixed conductance regulator 2. The information processing unit 100 can read the data from a storage device that stores the pumping speed data previously obtained through an experiment. In the experiment, the pressure in the processing chamber is reduced from P0 to a desired pressure P1 without a substrate being placed in the processing chamber, and the time required for the pressure inside the processing chamber to be reduced to the desired pressure is measured. Note that steps S1 and S2 may be executed in reverse order, or may be executed simultaneously in parallel.

[0029] Next, in step S3, the information processing unit 100 compares the pumping speed obtained in step S1 when exhausting through the pipe 6a with the pumping speed obtained in step S2 when exhausting through the pipe 6b to determine which is larger. FIG. 6 is a graph illustrating the comparison of pumping speeds, with the horizontal axis representing the time from the start of exhaust and the vertical axis representing the pressure in the processing chamber. The solid line represents data obtained when exhausting through the pipe 6a with a pipe length L1, and the dotted line represents data obtained when exhausting through the pipe 6b with a pipe length L2 (L1>L2). The time required for the pressure in the processing chamber to be reduced from pressure P0 to a predetermined pressure P1 is T2 for the pipe 6b, while it is T1 for the pipe 6a (T1>T2). That is, the pumping speed is faster for the processing chamber 4b, which is exhausted through the pipe 6b, and slower for the processing chamber 4a, which is exhausted through the pipe 6a. At this time, the graph shown in FIG. 6 is calculated using the general formula for calculating the pumping time, T=2.3×V / S×LOG 10 The graph shows a logarithmic function of (P0 / P1), where V is the volume of the processing chamber and S is the pumping speed of the vacuum pump.

[0030] Next, in step S4, the information processing unit 100 calculates the difference in conductance between the pipes from the difference in the exhaust speed between the pipes. For example, assume that there is no difference in the exhaust speed between the exhaust pumps 5a and 5b, and that the volumes V of the processing chambers 4a and 4b are the same. If the conductance of the pipe 6a is C1 and the conductance of the pipe 6b is C2, then the ratio of the arrival times T1 and T2, T1 / T2>1, becomes equal to the conductance ratio C2 / C1>1.

[0031] Next, in step S5, the information processing unit 100 determines the conditions for reducing the conductance C2 of the pipe 6b so that the conductance ratio becomes C2 / C1 = 1. For example, assume that there is no individual difference in the exhaust speed S of the exhaust pumps 5a and 5b, the volumes V of the processing chambers 4a and 4b are also the same, and the length L1 of the pipe 6a and the flow path cross-sectional area of ​​the pipe 6b are the same. In this case, the difference in exhaust conductance corresponds to the difference in conductance calculated from the length L1 of the pipe 6a and the length L2 of the pipe 6b. From the general formula for calculating conductance, C = 1349 × D / L × (P0 + P1) / 2, C2 / C1 = L1 / L2 can also be calculated. Here, D represents the flow path diameter of the pipes 6a and 6b. The ratio of the time required to depressurize each processing chamber from pressure P0 to the desired pressure P1, T1 / T2>1, is equal to the ratio C2 / C1, which is the ratio of the conductance C1 of pipe 6a to the conductance C2 of pipe 6b. Therefore, to make T1=T2, it is necessary to reduce the flow path cross-sectional area of ​​pipe 6b so that the conductance of pipe 6b becomes C1 / C2 times.

[0032] The information processing unit 100 selects and determines the shape and number of flow path resistance members 9 to be attached to the fixed conductance regulator 2 so that the effective conductance of the pipe 6b is increased by a factor of C1 / C2. The information processing unit 100 may store in advance a table of the relationship between the amount of conductance adjustment and the shape and number of flow path resistance members 9 to be attached, and read the information from the table.

[0033] The information processing unit 100 notifies the user of information about the shape and number of flow path resistance members 9 to be attached to the fixed conductance regulator 2, for example, by displaying it on a display unit. Based on the information displayed by the information processing unit 100, the user attaches an appropriate number of flow path resistance members of an appropriate shape to the fixed conductance regulator 2 that has been removed from the pipe 6b. Note that the method of notifying the user of the shape and number of flow path resistance members 9 to be attached is not limited to display using a display unit, and the information may be notified aloud using a voice synthesizer, or printed on a printer and notified via a medium such as paper. Alternatively, the information may be stored in a storage device accessible by the user. Based on the notified information, the user assembles flow path resistance members of an appropriate shape and number into the cylindrical portion 8.

[0034] Next, in step S6, the user attaches the fixed conductance regulator 2, to which the flow path resistance member is attached, to the pipe 6b.

[0035] In the substrate processing system 1 according to the embodiment, the shape and number of flow path resistance members 9 can be selected and attached to the fixed conductance adjuster 2 so as to reduce the conductance of the flow path formed by the pipe 6b in accordance with the conductance of the flow path formed by the pipe 6a. While the substrate processing system 1 is idle, the user can easily attach or replace the flow path resistance members by loosening the fastening portion 21 and removing the fixed conductance adjuster 2 from the pipe 6b. A substrate drying system is provided that can easily adjust the exhaust conductance of multiple substrate processing chambers and perform stable processing in each processing chamber without requiring a complex control mechanism as in the past.

[0036] [Embodiment 2] A substrate drying system according to embodiment 2 will be described. Descriptions of matters common to embodiment 1 will be simplified or omitted. Figure 7 is a schematic diagram showing the general configuration of a substrate processing system 101 according to this embodiment.

[0037] In this embodiment, the processing chamber 4a is connected to an exhaust pump 501a via a pipe 601a, and an on-off valve 7a that can open and close the pipe is disposed in the middle of the pipe 601a. ​​The processing chamber 4b is connected to an exhaust pump 501b via a pipe 601b, and an on-off valve 7b that can open and close the pipe is disposed in the middle of the pipe 601b. In the substrate processing system 101, an exhaust pump is individually connected to each of the multiple processing chambers, thereby improving the throughput of the reduced-pressure drying process.

[0038] In the substrate drying system according to embodiment 1, the lengths of the pipelines connecting the processing chamber and the exhaust pump are different, and the conductance of each pipeline differs. To equalize these differences, a fixed conductance adjuster 2 is placed in the pipeline with the larger conductance.

[0039] In contrast, in the substrate processing system 101 of this embodiment, the pipes 601a and 601b have the same flow path cross-sectional area and flow path length, and there is no substantial difference in the pipe conductance, but there is a difference between the pumping speed S1 of the exhaust pump 501a and the pumping speed S2 of the exhaust pump 501b. The difference in pumping speed can occur, for example, when the pumps are of different models or when there is individual variation in performance even among pumps of the same model. In this embodiment, a fixed conductance adjuster 2 is disposed between the pump with the higher pumping speed and the processing chamber.

[0040] The structure of fixed conductance adjuster 2 and the method of attaching it to the piping are as described in embodiment 1. In this example, since pumping speed S2 is greater than pumping speed S1, fixed conductance adjuster 2 is attached to piping 601b, which is connected to the pump with the faster pumping speed. However, if the relationship between the pumping speeds were reversed, fixed conductance adjuster 2 would be attached to piping 601a. ​​The attachment position is preferably such that the distance from fixed conductance adjuster 2 to the exhaust pump is shorter than the distance from fixed conductance adjuster 2 to the processing chamber.

[0041] The procedure from attaching an appropriate number of flow path resistance members of an appropriate shape to the fixed conductance regulator 2 to fixing the fixed conductance regulator 2 to the piping is the same as that of embodiment 1 described with reference to the flowchart of Figure 5. FIG. 8 is a graph of the exhaust speed data acquired in step S1 and step S2 in the substrate processing system 101 according to this embodiment.

[0042] In this example, the time required for the process chamber 4a connected to the exhaust pump 501a with an exhaust speed of S1 to reach pressure P1 from P0 is T3, and the time required for the process chamber 4b connected to the exhaust pump 501b with an exhaust speed of S2 to reach pressure P1 is T4 (T3 / T4>1). In this case, if the diameters and lengths of the pipes 601a and 601b are the same and the volumes of the process chambers 4a and 4b are also the same, then T3 / T4, which is the ratio of the arrival time T3 to the arrival time T4, is equal to C4 / C3, which is the ratio of the effective exhaust conductances C3 and C4 (C4 / C3>1).

[0043] In step S5, the information processing unit 100 determines the conditions for reducing the conductance C4 of the pipe 601b so that the ratio of the effective conductances becomes C4 / C3 = 1. In order to make T3 = T4, it is necessary to reduce the cross-sectional area of ​​the flow path so that the effective conductance of the pipe 601b becomes C3 / C4 times.

[0044] The information processing unit 100 selects the shape and number of flow path resistance members 9 to be attached to the fixed conductance regulator 2 so that the effective conductance of the pipe 601b becomes C3 / C4 times. The information processing unit 100 may store in advance a table of the relationship between the conductance adjustment amount and the shape and number of flow path resistance members 9 to be attached, and read the information from the table. The information processing unit 100 notifies the user of the shape and number of flow path resistance members 9 to be attached to the fixed conductance regulator 2, for example, by displaying the information on the display unit.

[0045] In step S6, the user attaches the fixed conductance regulator 2, to which an appropriate flow path resistance member is attached, to the pipe 601b.

[0046] According to this embodiment, even if there is no substantial difference in conductance between the pipes 601a and 601b, but there is a difference between the pumping speed S1 of the exhaust pump 501a and the pumping speed S2 of the exhaust pump 501b, the difference in the effective pumping speed in the processing chamber can be reduced. While the substrate processing system 101 is idle, the user can easily install or replace the flow path resistance member by loosening the fastening portion 21 and removing the fixed conductance adjuster 2 from the pipe 601b. This provides a substrate drying system that can easily adjust the exhaust conductance of multiple substrate processing chambers and perform stable processing in each processing chamber without requiring a complex control mechanism as in the conventional technology.

[0047] [Embodiment 3] A substrate drying system according to embodiment 3 will be described. Descriptions of matters common to embodiment 1 or embodiment 2 will be simplified or omitted. Figure 9 is a schematic diagram showing the general configuration of a substrate processing system 102 according to this embodiment.

[0048] In this embodiment, the processing chamber 4a is connected to an exhaust pump 502a via a pipe 602a, and an on-off valve 7a that can open and close the pipe is disposed in the middle of the pipe 602a. The processing chamber 4b is connected to an exhaust pump 502b via a pipe 602b, and an on-off valve 7b that can open and close the pipe is disposed in the middle of the pipe 602b. In the substrate processing system 102, each of the multiple processing chambers is connected to an individual exhaust pump, thereby improving the throughput of the reduced-pressure drying process.

[0049] In the substrate drying system according to Embodiment 1, since the lengths of the pipelines connecting each processing chamber and the exhaust pump are different, there are differences in the conductance of each pipeline. In order to equalize this, the fixed conductance regulator 2 is arranged in the pipeline with a larger conductance. In the substrate drying system according to Embodiment 2, the conductance of the pipelines connecting each processing chamber and the exhaust pump was equal, but there were differences in the exhaust speed of the exhaust pumps. In order to equalize this, the fixed conductance regulator 2 is installed in the pipeline of the exhaust pump with a higher exhaust speed. It is desirable that the distance from the fixed conductance regulator 2 to the exhaust pump is smaller than the distance from the fixed conductance regulator 2 to the processing chamber.

[0050] In the substrate processing system 102 according to this embodiment shown in FIG. 9, the length L1 of the pipe 602a and the length L2 of the pipe 602b are different (L1 > L2), and the exhaust speed S1 of the exhaust pump 502a and the exhaust speed S2 of the exhaust pump 502b are different (S1 < S2). The exhaust conductance for each processing chamber can be evaluated as a combined conductance that reflects both the conductance of the pipe and the exhaust speed of the exhaust pump.

[0051] The procedure of attaching an appropriate number of flow path resistance members of an appropriate shape to the fixed conductance regulator 2 and then fixing the fixed conductance regulator 2 to the pipe is the same as that of Embodiment 1 described with reference to the flowchart of FIG. 5. FIG. 10 graphs the exhaust speed data obtained in the substrate processing system 102 according to this embodiment in steps S1 and S2.

[0052] An example is shown in which the time taken to reach from pressure P0 to pressure P1 in processing chamber 4a is T5, and the time taken to reach from pressure P0 to pressure P1 in processing chamber 4b is T6 (T5 / T6 > 1). At this time, assuming that the pipe diameters of pipes 602a and 602b are equal and the volumes of processing chambers 4a and 4b are also equal, T5 / T6, which is the ratio of the arrival times T5 and T6, is equal to C6 / C5, which is the ratio of the combined conductances C5 and C6 (C6 / C5 > 1).

[0053] Therefore, in step S5, the information processing unit 100 determines the conditions for reducing the conductance of the pipe 602b so that the ratio of the combined conductances of the processing chambers becomes C6 / C5 = 1. In order to make T5 = T6, it is necessary to reduce the flow path cross-sectional area of ​​the pipe 602b so that the effective conductance of the pipe 602b becomes C5 / C6 times.

[0054] The information processing unit 100 selects the shape and number of flow path resistance members 9 to be attached to the fixed conductance regulator 2 so that the effective conductance of the pipe 602b becomes C5 / C6 times. The information processing unit 100 may store in advance a table of the relationship between the conductance adjustment amount and the shape and number of flow path resistance members 9 to be attached, and read the information from the table. The information processing unit 100 notifies the user of the shape and number of flow path resistance members 9 to be attached to the fixed conductance regulator 2, for example, by displaying the information on the display unit.

[0055] In step S6, the user attaches the fixed conductance regulator 2, to which an appropriate flow path resistance member is attached, to the pipe 602b.

[0056] According to this embodiment, when there is a difference in both the conductance of the pipes connected to each processing chamber and the exhaust speed of the exhaust pump, the combined conductance can be adjusted to reduce the difference in the effective exhaust speed among the processing chambers. While the substrate processing system 102 is idle, the user can easily install or replace the flow path resistance member by loosening the fastening member 21 and removing the fixed conductance adjuster 2 from the pipe 602b. This provides a substrate drying system that can easily adjust the exhaust conductance of multiple substrate processing chambers and perform stable processing in each processing chamber without requiring a complex control mechanism as in the past.

[0057] [Embodiment 4] A substrate drying system according to embodiment 4 will be described. Descriptions of matters common to embodiment 1 will be simplified or omitted. Figure 11 is a schematic diagram showing the general configuration of a substrate processing system 103 according to this embodiment.

[0058] In this embodiment, a single exhaust pump 503 is used to evacuate both the processing chambers 4a and 4b. A common pipe 603c, which serves as a common pipe connected to the exhaust pump 503, branches into pipes 603a and 603b at a pipe branch point. The pipe 603a is connected to the processing chamber 4a, and the pipe 603b is connected to the processing chamber 4b. In this manner, the processing chamber 4a is connected to the exhaust pump 503 via the pipe 603a and the common pipe 603c. An on-off valve 7a capable of opening and closing the pipe line is disposed midway along the pipe 603a. The processing chamber 4b is connected to the exhaust pump 503 via the pipe 603b and the common pipe 603c. An on-off valve 7b capable of opening and closing the pipe line is disposed midway along the pipe 603b. In the substrate processing system 103, multiple processing chambers are evacuated using a single exhaust pump, thereby reducing the equipment costs of the reduced-pressure processing system.

[0059] In the substrate processing system 103 according to this embodiment, the length L1 of the pipe 603a from the processing chamber 4a to the branch point is different from the length L2 of the pipe 603b from the processing chamber 4b to the branch point, resulting in a difference in conductance between the pipes. Therefore, to equalize the conductance, a fixed conductance adjuster 2 is attached to the pipe with the larger conductance. The fixed conductance adjuster 2 is preferably attached at a position such that the distance from the fixed conductance adjuster 2 to the exhaust pump is shorter than the distance from the fixed conductance adjuster 2 to the processing chamber.

[0060] The procedure from attaching an appropriate number of flow path resistance members of an appropriate shape to the fixed conductance regulator 2 to fixing the fixed conductance regulator 2 to the piping is the same as that of embodiment 1 described with reference to the flowchart of Figure 5.

[0061] FIG. 12 is a graph of the exhaust speed data acquired in step S1 and step S2 in the substrate processing system 103 according to this embodiment.

[0062] In this example, the time required for the process chamber 4a to reach pressure P1 from P0 is T7, and the time required for the process chamber 4b to reach pressure P1 from P0 is T8 (T7 / T8>1). Assume that the diameters of the pipes 603a and 603b are equal, and the volumes of the process chambers 4a and 4b are also equal. In this case, the ratio of the time required for the process chambers to reach pressure T7 to T8, T7 / T8, is equal to the ratio of the conductance C7 of the pipe 603a to the conductance C8 of the pipe 603b, C8 / C7 (C8 / C7>1).

[0063] Therefore, we seek the conditions for reducing the conductance of the pipe 603b so that the ratio of the exhaust conductances for each processing chamber becomes C8 / C7 = 1. To make T7 = T8, it is necessary to reduce the cross-sectional area of ​​the flow path so that the effective conductance of the pipe 603b becomes C7 / C8 times.

[0064] The information processing unit 100 selects the shape and number of flow path resistance members 9 to be attached to the fixed conductance regulator 2 so that the effective conductance of the pipe 603b is C7 / C8 times. The information processing unit 100 may store in advance a table of the relationship between the conductance adjustment amount and the shape and number of flow path resistance members 9 to be attached, and read the information from the table. The information processing unit 100 notifies the user of the shape and number of flow path resistance members 9 to be attached to the fixed conductance regulator 2, for example, by displaying the information on the display unit.

[0065] In step S6, the user attaches the fixed conductance regulator 2, to which an appropriate flow path resistance member is attached, to the pipe 603b.

[0066] According to this embodiment, when there is a difference in the conductance of the pipes connected to each processing chamber, the conductance can be adjusted to reduce the difference in effective exhaust speed among the processing chambers. While the substrate processing system 103 is stopped, the user can easily install or replace the flow path resistance member by loosening the fastening portion 21 and removing the fixed conductance adjuster 2 from the pipe 603b. A substrate drying system is provided that can easily adjust the exhaust conductance of multiple substrate processing chambers and perform stable processing in each processing chamber without requiring a complex control mechanism as in the conventional case.

[0067] [Other embodiments] The present invention is not limited to the above-described embodiments, and many modifications are possible within the technical spirit of the present invention. For example, the above-described different embodiments may be combined in whole or in part.

[0068] For example, in the above embodiment, a fixed conductance adjuster is attached to one of the two pipes included in the substrate drying system, but the embodiment of the present invention is not limited to this. A fixed conductance adjuster may be attached to each of the two pipes, and the shape and number of flow path resistance members attached to each cylindrical portion may be different to reduce the difference in pumping speed between the processing chambers. Furthermore, the number of processing chambers and pipes included in the substrate drying system is not limited to two, and may be three or more. By attaching a fixed conductance adjuster to at least one of the pipes, the difference in pumping speed between the processing chambers can be reduced.

[0069] Although the above example shows a case where the flow path cross-sectional area of ​​each pipe is the same but the pipe length is different, the flow path cross-sectional area of ​​each pipe does not necessarily have to be the same, as long as the conductance adjustment device is arranged so as to reduce the difference in effective conductance. Furthermore, the positions and number of on-off valves arranged in each pipe are not limited to those in the above example.

[0070] Furthermore, the processing system to which the fixed conductance adjuster is applied is not limited to a processing system for drying a substrate, and the present invention can be suitably implemented in any processing system that has a plurality of processing chambers whose internal spaces are depressurized to perform some kind of processing and that requires adjustment of the pumping speed for evacuating each processing chamber.

[0071] The present invention can also be realized by supplying a program that realizes one or more functions of the embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program.The present invention can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0072] This specification discloses at least the following: [Matter 1] a cylindrical member that is detachable from a connection portion of a pipe that constitutes a flow path; At least one flow path resistance member is provided which has a resistance portion that becomes a flow path resistance and can be detachably fixed inside the cylindrical member, an internal space of the cylindrical member communicates with the piping and constitutes a part of the flow path; The conductance of the flow path is adjusted by a combination of the number of the flow path resistance members fixed inside the cylinder of the cylindrical member and the shape of the resistance portion. A conductance adjusting device characterized by: [Matter 2] The cylindrical member has at least one fitting groove along an inner circumference of the cylinder for detachably fixing the flow path resistance member. 2. The conductance adjusting device according to item 1. [Matter 3] Each of the flow path resistance members includes a protrusion that can be fitted into the fitting groove. 3. The conductance adjusting device according to item 2. [Matter 4] The resistor portion has a sector shape. 4. The conductance adjusting device according to any one of items 1 to 3, characterized in that: [Matter 5] The flow path resistance member includes at least two types of flow path resistance members having different resistance portion areas. 5. The conductance adjusting device according to any one of items 1 to 4, characterized in that: [Matter 6] a first processing chamber and a second processing chamber, each of which processes a substrate under reduced pressure; a first exhaust pump and a second exhaust pump; a first pipe connecting the first processing chamber and the first exhaust pump; a second pipe connecting the second processing chamber and the second exhaust pump; and a conductance adjusting device according to any one of items 1 to 5, The conductance adjusting device is attached to at least one of the first pipe and the second pipe. A substrate processing system comprising: [Matter 7] a first processing chamber and a second processing chamber, each of which processes a substrate under reduced pressure; An exhaust pump, a common piping section connecting the exhaust pump and a piping branch point; a first pipe connecting the first processing chamber and the pipe branch point; a second pipe connecting the second processing chamber and the pipe branch point; and a conductance adjusting device according to any one of items 1 to 5, The conductance adjusting device is attached to at least one of the first pipe and the second pipe. A substrate processing system comprising: [Matter 8] When the conductance adjusting device is not attached to either the first pipe or the second pipe, and the exhaust time required to reduce the pressure of the first processing chamber from a first pressure to a second pressure is longer than the exhaust time required to reduce the pressure of the second processing chamber from the first pressure to the second pressure, The conductance adjusting device is attached to the second pipe. 8. The substrate processing system according to item 6 or 7. [Matter 9] The conductance adjusting device is attached to a connection portion of a plurality of partial pipes that constitute the second pipe. 9. The substrate processing system according to item 8. [Matter 10] Each of the plurality of partial pipes has a flange portion at an end thereof, The flange portions are fastened together by fastening portions in a state in which the conductance adjustment device is sandwiched between the plurality of partial pipes. 10. The substrate processing system according to item 9. [Matter 11] The first pipe has a longer pipe length than the second pipe. 11. The substrate processing system according to any one of items 6 to 10. [Matter 12] The first exhaust pump has a lower exhaust speed than the second exhaust pump. 7. The substrate processing system according to item 6. [Matter 13] The first processing chamber and the second processing chamber are processing chambers in which the accommodated substrate is dried in a reduced pressure atmosphere. 13. The substrate processing system according to any one of items 6 to 12. [Matter 14] further comprising an information processing unit, the information processing unit acquires data on an exhaust time required to reduce the pressure of the first processing chamber from a first pressure to a second pressure and data on an exhaust time required to reduce the pressure of the second processing chamber from the first pressure to the second pressure in a state in which the conductance adjustment device is not attached to either the first pipe or the second pipe, and determines the length of the exhaust time; When the exhaust time required to reduce the pressure of the first processing chamber from a first pressure to a second pressure is longer than the exhaust time required to reduce the pressure of the second processing chamber from the first pressure to the second pressure, determining a combination of the number of flow path resistance members and the shape of the resistance portion to be fixed inside the cylindrical member of the conductance adjustment device attached to the second pipe in order to reduce the difference in exhaust time, and notifying a user of the determined information; 14. The substrate processing system according to any one of items 6 to 13. [Matter 15] 15. A method for manufacturing an article, comprising a step of processing a substrate using the substrate processing system according to any one of items 6 to 14. [Explanation of symbols]

[0073] 1···Substrate processing system / 2···Fixed conductance adjuster / 3a··Substrate / 3b··Substrate / 4a··Processing chamber / 4b··Processing chamber / 5a··Exhaust pump / 5b···Exhaust pump / 6a···Piping / 6b···Piping / 7a··Open / close valve / 7b···Open / close valve / 8···Cylindrical part / 9···Flow path resistance member / 9a···Resistance part / 9b···Resistance part / 21···Fastening part / 61···Flange part / 81···Fitting groove / 91··· Convex portion / 100 Information processing unit / 101 Substrate processing system / 102 Substrate processing system / 103 Substrate processing system / 501a Exhaust pump / 501b Exhaust pump / 502a Exhaust pump / 502b Exhaust pump / 503 Exhaust pump / 601a Piping / 601b Piping / 602a Piping / 602b Piping / 603a Piping / 603b Piping / 603c Common piping

Claims

1. a cylindrical member that is detachable from a connection portion of a pipe that constitutes a flow path; At least one flow path resistance member is provided which has a resistance portion that becomes a flow path resistance and can be detachably fixed inside the cylindrical member, an internal space of the cylindrical member communicates with the piping and constitutes a part of the flow path; The conductance of the flow path is adjusted by a combination of the number of the flow path resistance members fixed inside the cylinder of the cylindrical member and the shape of the resistance portion. A conductance adjusting device characterized by:

2. The cylindrical member has at least one fitting groove along an inner periphery of the cylinder for detachably fixing the flow path resistance member.

2. The conductance adjusting device according to claim 1, wherein:

3. Each of the flow path resistance members includes a protrusion that can be fitted into the fitting groove.

3. The conductance adjusting device according to claim 2, wherein the conductance adjusting device is a conducting electrode.

4. The resistor portion has a sector shape.

2. The conductance adjusting device according to claim 1, wherein:

5. The flow path resistance member includes at least two types of flow path resistance members each having a different resistance portion area.

2. The conductance adjusting device according to claim 1, wherein:

6. a first processing chamber and a second processing chamber, each of which processes a substrate under reduced pressure; a first exhaust pump and a second exhaust pump; a first pipe connecting the first processing chamber and the first exhaust pump; a second pipe connecting the second processing chamber and the second exhaust pump; The conductance adjusting device according to claim 1, The conductance adjusting device is attached to at least one of the first pipe and the second pipe. A substrate processing system comprising:

7. a first processing chamber and a second processing chamber, each of which processes a substrate under reduced pressure; An exhaust pump, a common piping section connecting the exhaust pump and a piping branch point; a first pipe connecting the first processing chamber and the pipe branch point; a second pipe connecting the second processing chamber and the pipe branch point; The conductance adjusting device according to claim 1, The conductance adjusting device is attached to at least one of the first pipe and the second pipe. A substrate processing system comprising:

8. When the conductance adjustment device is not attached to either the first pipe or the second pipe, an exhaust time required to reduce the pressure of the first processing chamber from a first pressure to a second pressure is longer than an exhaust time required to reduce the pressure of the second processing chamber from the first pressure to the second pressure, The conductance adjusting device is attached to the second pipe.

8. The substrate processing system according to claim 6, wherein the substrate processing system comprises: a substrate processing unit;

9. the conductance adjusting device is attached to a connection portion of a plurality of partial pipes that constitute the second pipe; The substrate processing system according to claim 8 .

10. Each of the plurality of partial pipes has a flange portion at an end thereof, The flange portions are fastened together by fastening portions in a state in which the conductance adjustment device is sandwiched between the plurality of partial pipes. The substrate processing system according to claim 9 .

11. The first pipe has a longer pipe length than the second pipe.

8. The substrate processing system according to claim 6, wherein the substrate processing system comprises: a substrate processing unit;

12. The first exhaust pump has a lower exhaust speed than the second exhaust pump.

7. The substrate processing system according to claim 6.

13. the first processing chamber and the second processing chamber are processing chambers in which the accommodated substrate is dried in a reduced pressure atmosphere; 8. The substrate processing system according to claim 6, wherein the substrate processing system comprises: a substrate processing unit;

14. further comprising an information processing unit; the information processing unit acquires data on an exhaust time required to reduce the pressure of the first processing chamber from a first pressure to a second pressure and data on an exhaust time required to reduce the pressure of the second processing chamber from the first pressure to the second pressure in a state in which the conductance adjustment device is not attached to either the first pipe or the second pipe, and determines the length of the exhaust time; When the exhaust time required to reduce the pressure of the first processing chamber from a first pressure to a second pressure is longer than the exhaust time required to reduce the pressure of the second processing chamber from the first pressure to the second pressure, determining a combination of the number of flow path resistance members and the shape of the resistance portion to be fixed inside the cylindrical member of the conductance adjustment device attached to the second pipe in order to reduce the difference in exhaust time, and notifying a user of the determined information; 8. The substrate processing system according to claim 6, wherein the substrate processing system comprises: a substrate processing unit;

15. A method for manufacturing an article, comprising a step of processing a substrate using the substrate processing system according to claim 6 or 7.

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