Three-dimensional measuring device, component mounting device, and three-dimensional measuring method

Abstract

To improve the performance of component recognition by a three-dimensional measuring device.SOLUTION: A three-dimensional measuring device comprises: a projection device for irradiating, with pattern light, a component having a body part and a plurality of protrusions protruding from the body part; an imaging device for imaging the component irradiated with pattern light; and a processing device including a processor for processing the image data of the component imaged by the imaging device. The processing device acquires component data indicating the outer shape and dimensions of the component, determines a noise processing parameter on the basis of the component data when removing noise from the three-dimensional point cloud data of the component generated from the image data, removes noise from the three-dimensional point cloud data on the basis of the noise processing parameter to extract the protrusions, converts the noise-removed three-dimensional point cloud data into grayscale image data indicating the shape of the component by shades, and calculates the reference position of the component on the basis of the respective coordinates of the plurality of protrusions in the grayscale image data.SELECTED DRAWING: Figure 16

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a three-dimensional measuring device, a component mounting device, and a three-dimensional measuring method. [Background technology]

[0002] In the technical field related to component mounting devices, there is known a component mounting device equipped with a three-dimensional measuring device, as disclosed in Patent Document 1. In Patent Document 1, the three-dimensional measuring device measures the three-dimensional shape of a component based on a phase shift method. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-054992 Summary of the Invention [Problem to be solved by the invention]

[0004] A component mounting device uses a 3D measurement device to recognize the reference position (e.g., the center position) of a component, and then mounts the component at the target position on the board based on the reference position of the component. Therefore, there is a demand for improving the component recognition performance of the 3D measurement device. [Means for solving the problem]

[0005] This specification discloses a 3D measuring device. The 3D measuring device includes a projection device that irradiates a patterned light onto a part having a body and multiple protrusions protruding from the body, an imaging device that captures an image of the part illuminated with the patterned light, and a processing device having a processor that processes image data of the part captured by the imaging device. The processing device acquires part data indicating the outer shape and dimensions of the part, determines noise processing parameters for removing noise from 3D point cloud data of the part generated from the image data based on the part data, removes noise from the 3D point cloud data based on the noise processing parameters, extracts the protrusions, converts the noise-removed 3D point cloud data into grayscale image data that represents the shape of the part using shades of gray, and calculates a reference position of the part based on the coordinates of each of the multiple protrusions in the grayscale image data. [Effects of the Invention]

[0006] The technology disclosed in this specification improves the part recognition performance of a three-dimensional measuring device. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a side view that schematically shows a component mounting apparatus according to an embodiment. [Figure 2] FIG. 2 is a plan view schematically showing the component mounting apparatus according to the embodiment. [Figure 3] FIG. 3 is a diagram illustrating a component according to an embodiment. [Figure 4] FIG. 4 is a diagram showing a component according to an embodiment. [Figure 5] FIG. 5 is a diagram showing a component according to an embodiment. [Figure 6] FIG. 6 is a side view schematically showing the three-dimensional measuring apparatus according to the embodiment. [Figure 7] FIG. 7 is a top view schematically showing the three-dimensional measuring apparatus according to the embodiment. [Figure 8] FIG. 8 is a hardware configuration diagram showing a processing device according to the embodiment. [Figure 9]FIG. 9 is a functional block diagram showing a processing device according to the embodiment. [Figure 10] FIG. 10 is a diagram illustrating part data according to the embodiment. [Figure 11] FIG. 11 is a diagram illustrating noise processing according to the embodiment. [Figure 12] FIG. 12 is a diagram illustrating noise processing according to the embodiment. [Figure 13] FIG. 13 is a diagram illustrating imaging parameters according to the embodiment. [Figure 14] FIG. 14 is a diagram illustrating a method for determining imaging parameters according to an embodiment. [Figure 15] FIG. 15 is a diagram showing pattern data according to the embodiment. [Figure 16] FIG. 16 is a diagram illustrating a part processing method according to an embodiment. [Figure 17] FIG. 17 is a diagram illustrating noise processing for a component according to the embodiment. [Figure 18] FIG. 18 is a diagram illustrating noise processing for a component according to the embodiment. [Figure 19] FIG. 19 is a diagram showing the second gradation image data of the part according to the embodiment. [Figure 20] FIG. 20 is a diagram illustrating noise processing for a component according to the embodiment. [Figure 21] FIG. 21 is a diagram showing the second gradation image data of the part according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, but the present disclosure is not limited to the embodiments. The components of the embodiments described below can be combined as appropriate. In addition, some components may not be used.

[0009] In the embodiment, a local coordinate system is set in the component mounting apparatus 1, and the positional relationship of each part will be described with reference to the local coordinate system. An XYZ Cartesian coordinate system is set as the local coordinate system. The direction parallel to the X axis within a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis perpendicular to the X axis within the predetermined plane is defined as the Y-axis direction. The direction parallel to the Z axis perpendicular to both the X axis and the Y axis is defined as the Z-axis direction. The direction of rotation or tilt around the X axis is defined as the θX direction. The direction of rotation or tilt around the Y axis is defined as the θY direction. The direction of rotation or tilt around the Z axis is defined as the θZ direction. The predetermined plane is the XY plane. The Z axis is perpendicular to the predetermined plane. In the embodiment, the predetermined plane is parallel to a horizontal plane. The Z-axis direction is the vertical direction. The +Z direction (+Z side) is upward (upper side), and the -Z direction (-Z side) is downward (lower side). Note that the predetermined plane may be inclined with respect to the horizontal plane.

[0010] [Component mounting equipment] Fig. 1 is a side view schematically showing a component mounting apparatus 1 according to an embodiment. Fig. 2 is a plan view schematically showing the component mounting apparatus 1 according to an embodiment. The component mounting apparatus 1 mounts a component C on a board W on which cream solder has been printed.

[0011] The component mounting apparatus 1 includes a base 11, a support 12, a component supply device 2, a substrate support device 3, a mounting head 5 having a nozzle 4, a nozzle moving device 6, a head moving device 7, a three-dimensional measuring device 8, and a control device 10.

[0012] The base 11 is installed on the floor of an industrial facility where the component mounting apparatus 1 is used. In the XY plane, the base 11 is long in the X-axis direction. The outer shape of the top surface of the base 11 is rectangular. The support columns 12 protrude upward from the top surface of the base 11. The support columns 12 are fixed to the base 11. In this embodiment, the support columns 12 are arranged at each of the four corners of the top surface of the base 11.

[0013] The component supply device 2 supplies components C. A supply position AP is set in the component mounting device 1. The component supply device 2 supplies the components C to the supply position AP. The component supply device 2 includes multiple tape feeders. The tape feeder has a reel on which a tape that holds the components C is wound, and a drive device that unwinds the tape wound on the reel. The drive device unwinds the tape so that the components C held on the tape move to the supply position AP. The component supply device 2 may also include a tray that supports the components C.

[0014] The substrate support device 3 supports the substrate W. A processing position BP is set in the component mounting device 1. The substrate support device 3 supports the substrate W at the processing position BP. The substrate support device 3 is supported on a base 11. The substrate support device 3 includes a substrate transport device that transports the substrate W to the processing position BP, and a substrate support member that supports the substrate W transported to the processing position BP. The substrate transport device includes a conveyor that transports the substrate W in the X-axis direction, and a guide member that guides the substrate W in the X-axis direction. The substrate support member supports the substrate W so that the surface of the substrate W is parallel to the XY plane.

[0015] The nozzle 4 detachably holds the component C. The nozzle 4 is a suction nozzle that suctions the top surface of the component C. An opening is provided at the tip of the nozzle 4. The opening of the nozzle 4 is connected to a vacuum system. With the tip of the nozzle 4 in contact with the top surface of the component C, the suction operation of the opening of the nozzle 4 is performed, thereby suctioning and holding the component C at the tip of the nozzle 4. When the suction operation of the opening of the nozzle 4 is released, the component C is released from the nozzle 4. The nozzle 4 may also be a gripper nozzle that grips the component C.

[0016] The mounting head 5 has a plurality of nozzles 4. The mounting head 5 has a shaft 5S to which the nozzles 4 are attached. The nozzles 4 are attached to the lower end of the shaft 5S. The mounting head 5 mounts the components C held by the nozzles 4 onto the board W. The mounting head 5 is movable between a supply position AP and a processing position BP. The supply position AP and the processing position BP are set at different positions within the XY plane. The mounting head 5 moves to the supply position AP and holds the component C supplied from the component supply device 2 with the nozzles 4. After holding the component C with the nozzles 4 at the supply position AP, the mounting head 5 moves to the processing position BP and mounts the component C on the board W supported by the board support device 3.

[0017] The nozzle moving device 6 moves the nozzle 4 in both the Z-axis direction and the θZ direction. The nozzle moving device 6 includes an actuator provided in the mounting head 5. A nozzle moving device 6 is provided for each of the multiple nozzles 4. The nozzle moving device 6 moves the shaft 5S in the Z-axis direction and the θZ direction, thereby moving the nozzle 4 in the Z-axis direction and the θZ direction.

[0018] The head moving device 7 moves the mounting head 5 in both the X-axis direction and the Y-axis direction. The head moving device 7 has an X-axis moving device 13 that moves the mounting head 5 in the X-axis direction, and a Y-axis moving device 14 that moves the mounting head 5 in the Y-axis direction.

[0019] The X-axis movement device 13 includes a guide member 13A extending in the X-axis direction, and an actuator 13B that generates power to move the mounting head 5 in the X-axis direction. The mounting head 5 is supported by the guide member 13A. The guide member 13A guides the mounting head 5 in the X-axis direction. At least a portion of the actuator 13B is disposed between the mounting head 5 and the guide member 13A. The mounting head 5 moves in the X-axis direction by the power generated by the actuator 13B while being guided by the guide member 13A.

[0020] The Y-axis movement device 14 includes a pair of guide members 14A and an actuator 14B that generates power to move the guide member 13A in the Y-axis direction. One guide member 14A is supported by two support columns 12 arranged at the +X side end of the base 11. The other guide member 14A is supported by two support columns 12 arranged at the -X side end of the base 11. The +X side end of the guide member 13A is supported by one guide member 14A. The -X side end of the guide member 13A is supported by the other guide member 14A. The guide member 14A guides the guide member 13A in the Y-axis direction. At least a portion of the actuator 14B is arranged between the guide members 13A and 14A. The guide member 13A moves in the Y-axis direction by the power generated by the actuator 14B while being guided by the guide member 14A. As the guide member 13A moves in the Y-axis direction, the mounting head 5 moves in the Y-axis direction.

[0021] The component mounting apparatus 1 is a gantry robot type mounting apparatus. A gantry robot is a robot that moves the mounting head 5 linearly in each of the X-axis direction and the Y-axis direction. The head moving device 7 includes a gantry robot. The nozzle 4 can be moved in four directions, the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction, by the nozzle moving device 6 and the head moving device 7. By moving the nozzle 4, the component C held by the nozzle 4 can also be moved in four directions, the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0022] The three-dimensional measuring device 8 measures the three-dimensional shape of the component C held by the nozzle 4. The three-dimensional measuring device 8 recognizes the reference position (e.g., the center position) of the component C. A measurement position CP is set in the component mounting device 1. The three-dimensional measuring device 8 measures the component C placed at the measurement position CP. The measurement position CP is set between the supply position AP and the processing position BP. The three-dimensional measuring device 8 measures the three-dimensional shape of the component C based on the phase shift method. The three-dimensional measuring device 8 measures the component C held by the nozzle 4 at the supply position AP before it is mounted on the substrate W. The three-dimensional measuring device 8 can recognize not only the three-dimensional shape of the component C, but also the holding state of the component C by the nozzle 4.

[0023] The control device 10 includes a computer. The control device 10 outputs an operation command to operate the mounting head 5. The control device 10 stores a production program that indicates the procedure for mounting components C on the substrate W. The control device 10 outputs an operation command to operate the mounting head 5 based on the production program.

[0024] [parts] Fig. 3 is a diagram showing a component Ca according to the embodiment. Fig. 4 is a diagram showing a component Cb according to the embodiment. Fig. 5 is a diagram showing a component Cc according to the embodiment. The component mounting apparatus 1 can mount multiple types of components C on the board W. The component C has a body portion B and multiple protrusions P protruding from the body portion B.

[0025] The component mounting apparatus 1 can mount a component Ca as shown in Fig. 3 as the component C on the board W. The component mounting apparatus 1 can mount a component Cb as shown in Fig. 4 as the component C on the board W. The component mounting apparatus 1 can mount a component Cc as shown in Fig. 5 as the component C on the board W.

[0026] FIG. 3(A) is a side view showing the component Ca, and FIG. 3(B) is a bottom view showing the component Ca. As shown in FIG. 3, the component Ca has a body portion Ba and multiple protrusions Pa protruding from the body portion Ba. The component Ca is a mounted component that is mounted on the surface of the substrate W. The component Ca is surface-mounted on the substrate W. The protrusions Pa include electrode portions Ea and boss portions Da. The component Ca has a body portion Ba, multiple electrode portions Ea, and multiple boss portions Da. The body portion Ba is long in a predetermined direction. Each of the electrode portions Ea and boss portions Da is supported by the body portion Ba.

[0027] The body part Ba is made of resin. The body part Ba has terminal parts C11 that support multiple electrode parts Ea and fixed parts C12 that are fixed to the substrate W. Two terminal parts C11 are provided. Three fixed parts C12 are provided. The fixed parts C12 are provided at one end of the body part Ba, at the center of the body part Ba, and at the other end of the body part Ba in the longitudinal direction of the body part Ba. One terminal part C11 is disposed between the fixed part C12 at one end of the body part Ba and the fixed part C12 at the center of the body part Ba. The other terminal part C11 is disposed between the fixed part C12 at the center of the body part Ba and the fixed part C12 at the other end of the body part Ba.

[0028] The electrode portions Ea are made of metal. A plurality of electrode portions Ea are provided on each of the two terminal portions C11. The electrode portions Ea protrude obliquely downward from the lower surface of the terminal portion C11 so as to extend in the width direction of the component Ca. The tip portions (lower ends) of the electrode portions Ea are substantially flat. The tip portions of the electrode portions Ea are connected to the wiring pattern provided on the surface of the substrate W.

[0029] The boss portion Da is made of resin. The boss portion Da may be integral with the body portion Ba. One boss portion Da is arranged on each of the three fixing portions C12. The boss portion Da protrudes downward from the lower surface of the fixing portion C12. The boss portion Da is inserted into a recess provided in the substrate W. A screw hole Fa is provided in the fixing portion C12. A screw is inserted into the screw hole Fa of the fixing portion C12 and a screw hole provided in the substrate W. The fixing portion C12 and the substrate W are fixed with the screw.

[0030] As shown in FIG. 4, component Cb has a body portion Bb and multiple protrusions Pb protruding from the body portion Bb. Component Cb is an insertion component in which at least a portion of component Cb is inserted into a through-hole provided in a board W. Component Cb is inserted and mounted on the board W. The protrusions Pb include electrode portions Eb and boss portions Db. Component Cb has a body portion Bb, multiple electrode portions Eb, and multiple boss portions Db. Each of the electrode portions Eb and boss portions Db is supported by the body portion Bb.

[0031] The body Bb is made of resin and has a substantially rectangular parallelepiped outer shape.

[0032] The electrode portion Eb is made of metal. A plurality of electrode portions Eb are provided. The electrode portions Eb protrude downward from the lower surface of the body portion Bb. The electrode portions Eb are lead electrodes that are inserted into through holes provided in the substrate W. The lengths of the plurality of electrode portions Eb are equal to one another. In other words, the protrusion amounts of the plurality of electrode portions Eb from the body portion Bb are equal to one another.

[0033] The boss portion Db is made of resin. A plurality of boss portions Db are provided. The boss portion Db may be integral with the body portion Bb. The boss portion Db protrudes downward from the lower surface of the body portion Bb. The boss portion Db is inserted into a through hole provided in the substrate W. The lengths of the plurality of boss portions Db are equal to each other. In other words, the protrusion amounts of the plurality of boss portions Db from the body portion Bb are equal to each other.

[0034] The length of the electrode portion Eb is equal to the length of the boss portion Db, that is, the amount by which the electrode portion Eb protrudes from the body portion Bb is equal to the amount by which the boss portion Db protrudes from the body portion Bb.

[0035] As shown in Figure 5, the component Cc has a body portion Bc and multiple protrusions Pc protruding from the body portion Bc. The component Cc is an insertion component in which at least a portion of the component Cc is inserted into a through-hole provided in the board W. The component Cc is inserted and mounted on the board W. The protrusions Pc include electrode portions Ec. The component Cc has a body portion Bc and multiple electrode portions Ec. The electrode portions Ec are supported by the body portion Bc.

[0036] The body portion Bc is made of resin and has a substantially rectangular parallelepiped outer shape.

[0037] The electrode portion Ec is made of metal. A plurality of electrode portions Ec are provided. The electrode portion Ec protrudes downward from the lower surface of the body portion Bc. The electrode portion Ec is a lead electrode to be inserted into a through hole provided in the substrate W. The lengths of the plurality of electrode portions Ec are different from one another. That is, the protrusion amounts of the plurality of electrode portions Ec from the body portion Bc are different from one another. In the example shown in FIG. 5, the electrode portion Ec includes a first electrode portion Ec1, a second electrode portion Ec2, and a third electrode portion Ec3. The protrusion amount of the first electrode portion Ec1 from the body portion Bc, the protrusion amount of the second electrode portion Ec2 from the body portion Bc, and the protrusion amount of the third electrode portion Ec3 from the body portion Bc are different. The protrusion amount of the first electrode portion Ec1 is the largest, the protrusion amount of the second electrode portion Ec2 is next largest after the first electrode portion Ec1, and the protrusion amount of the third electrode portion Ec3 is the smallest. That is, the first electrode portion Ec1 is the longest, the second electrode portion Ec2 is the next longest, and the third electrode portion Ec3 is the shortest.

[0038] [3D measurement device] Fig. 6 is a side view that schematically shows the three-dimensional measuring device 8 according to the embodiment. Fig. 7 is a top view that schematically shows the three-dimensional measuring device 8 according to the embodiment.

[0039] The three-dimensional measuring device 8 measures the three-dimensional shape of the part C based on the phase shift method. The three-dimensional measuring device 8 acquires image data of the part C based on the phase shift method. The three-dimensional measuring device 8 measures the three-dimensional shape of at least a portion of the part C while the part C is held by the nozzle 4. The three-dimensional measuring device 8 is placed below the measurement position CP. The three-dimensional measuring device 8 measures the part C held by the nozzle 4 from below. Figures 6 and 7 show an example in which a part Ca is placed at the measurement position CP as the part C. Either a part Cb or a part Cc may be placed at the measurement position CP.

[0040] As shown in Figures 6 and 7, the three-dimensional measuring device 8 includes a projection device 30 that irradiates pattern light PL onto a component C placed at a measurement position CP, a reflecting member 81 that reflects the pattern light PL, an imaging device 40 that images the component C irradiated with the pattern light PL, and a processing device 50 that processes image data of the component C imaged by the imaging device 40.

[0041] The projection device 30 irradiates the component C with striped pattern light PL. The projection device 30 irradiates the component C with pattern light PL having different phases. The projection device 30 has a light source 31 that generates light, a light modulation element 32 that optically modulates the light generated from the light source 31 to generate the pattern light PL, and an emission optical system 33 that emits the pattern light PL generated by the light modulation element 32.

[0042] The light modulation element 32 includes a digital mirror device (DMD). The light modulation element 32 may include a transmissive liquid crystal panel or a reflective liquid crystal panel. The light modulation element 32 generates the patterned light PL based on the pattern data output from the processing device 50. The projection device 30 emits the patterned light PL that has been patterned based on the pattern data.

[0043] The reflecting member 81 reflects the pattern light PL emitted from the projection device 30 and irradiates it onto the component C. The reflecting surface of the reflecting member 81 is flat.

[0044] The imaging device 40 has an imaging optical system 41 that forms an image of the pattern light PL reflected by the component C, and an imaging element 42 that acquires image data of the component C via the imaging optical system 41. The imaging element 42 is a solid-state imaging element including a CMOS image sensor (Complementary Metal Oxide Semiconductor Image Sensor) or a CCD image sensor (Charge Coupled Device Image Sensor). In the embodiment, the optical axis AX and Z axis of the imaging optical system 41 are parallel to each other.

[0045] The processing device 50 includes a computer and controls the projection device 30 and the imaging device 40. The processing device 50 recognizes the part C based on image data captured by the imaging device 40. Recognizing the part C includes recognizing the three-dimensional shape of the part C and recognizing the position of the part C. Recognizing the position of the part C includes recognizing the reference position of the part C (e.g., the center position).

[0046] The three-dimensional measuring device 8 measures the three-dimensional shape of the component C placed at the measurement position CP by the nozzle 4 based on the phase shift method. The projection device 30 irradiates the component C with patterned light PL, for example, stripe pattern light with a sinusoidal brightness distribution, while shifting the phase of the light. The patterned light PL is irradiated onto the component C from multiple directions.

[0047] The imaging device 40 acquires image data of the component C illuminated with the patterned light PL. The imaging device 40 acquires image data of the component C illuminated with the first patterned light PL1 and image data of the component C illuminated with the second patterned light PL2. The incident direction of the first patterned light PL1 and the incident direction of the second patterned light PL2 incident on the component C are different.

[0048] 6, the first pattern light PL1 is pattern light PL that is emitted from the projection device 30 and directly irradiated onto the component C. The second pattern light PL2 is pattern light PL that is emitted from the projection device 30, reflected by the reflecting member 81, and irradiated onto the component C.

[0049] The processing device 50 controls the light modulation element 32 so as to change from one of a first irradiation state in which the first pattern light PL1 from the projection device 30 is irradiated onto the component C to the other of a second irradiation state in which the second pattern light PL2 from the reflecting member 81 is irradiated onto the component C.

[0050] When irradiating the component C with the first pattern light PL1, the processing device 50 controls the light modulation element 32 so that the pattern light PL is emitted from a first region 331 of the emission surface 33S of the emission optical system 33 and is not emitted from a second region 332 of the emission surface 33S. The pattern light PL emitted from the first region 331 is irradiated directly onto the component C as the first pattern light PL1 without passing through the reflecting member 81.

[0051] When irradiating the component C with the second pattern light PL2, the processing device 50 controls the light modulation element 32 so that the pattern light PL is emitted from the second region 332 of the emission surface 33S of the emission optical system 33 and is not emitted from the first region 331 of the emission surface 33S. The pattern light PL emitted from the second region 332 passes through the optical axis AX and is irradiated onto the reflecting member 81. The pattern light PL emitted from the second region 332 is irradiated onto the component C via the reflecting member 81 as the second pattern light PL2.

[0052] 6, the first region 331 is half of the area of ​​the emission surface 33S on the +X side of the optical axis of the emission optical system 33, and the second region 332 is half of the area of ​​the emission surface 33S on the −X side of the optical axis of the emission optical system 33. The pattern light PL emitted from the first region 331 is irradiated onto the component C placed at the measurement position CP by the nozzle 4. The pattern light PL emitted from the second region 332 is irradiated onto the reflecting surface of the reflecting member 81, reflected by the reflecting surface of the reflecting member 81, and then irradiated onto the component C placed at the measurement position CP.

[0053] The projection device 30, the imaging device 40, and the reflecting member 81 are each supported by a housing 82. The relative positions of the projection device 30, the imaging device 40, and the reflecting member 81 are fixed by the housing 82. The imaging device 40 is disposed below the measurement position CP. The incident surface 41S of the imaging device 40 can face the component C disposed at the measurement position CP.

[0054] The reflecting member 81 is disposed at least partially around the optical axis AX of the imaging optical system 41 between the incident surface 41S and the component C disposed at the measurement position CP. The projection device 30 is disposed at least partially around the optical axis AX of the imaging optical system 41 between the incident surface 41S and the component C disposed at the measurement position CP. The reflecting member 81 is disposed at a position closer to the measurement position CP than the projection device 30.

[0055] 7, two projection devices 30 are arranged around the optical axis AX, and two reflecting members 81 are arranged around the optical axis AX.

[0056] The first reflecting member 81 is disposed on the -X side of the optical axis AX. The first projection device 30 is disposed on the +X side of the optical axis AX. The first projection device 30 can irradiate the first reflecting member 81 with the second pattern light PL2. The second pattern light PL2 reflected by the first reflecting member 81 is irradiated onto the component C disposed at the measurement position CP. The first projection device 30 can also irradiate the first pattern light PL1 directly onto the component C disposed at the measurement position CP.

[0057] The second reflecting member 81 is disposed on the +Y side of the optical axis AX. The second projection device 30 is disposed on the -Y side of the optical axis AX. The second projection device 30 is capable of irradiating the second reflecting member 81 with the second pattern light PL2. The second pattern light PL2 reflected by the second reflecting member 81 is irradiated onto the component C disposed at the measurement position CP. In addition, the second projection device 30 is capable of irradiating the first pattern light PL1 directly onto the component C disposed at the measurement position CP.

[0058] In this way, the three-dimensional measuring device 8 can irradiate the component C placed at the measurement position CP with the pattern light PL from four directions by using the first projection device 30, the second projection device 30, and the first reflecting member 81, the second reflecting member 81. The imaging device 40 acquires image data of the component C irradiated with the first pattern light PL1 from the first projection device 30, image data of the component C irradiated with the second pattern light PL2 from the first reflecting member 81, image data of the component C irradiated with the first pattern light PL1 from the second projection device 30, and image data of the component C irradiated with the second pattern light PL2 from the second reflecting member 81.

[0059] [Processing equipment] FIG. 8 is a hardware configuration diagram showing a processing device 50 according to an embodiment. The processing device 50 includes a computer. The processing device 50 has a processor 50A such as a CPU (Central Processing Unit), a main memory 50B including a nonvolatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 50C, and an interface 50D including an input / output circuit. The functions of the processing device 50 are stored in the storage 50C as a computer program. The processor 50A reads the computer program from the storage 50C, loads it into the main memory 50B, and executes processing in accordance with the computer program. The computer program may be distributed to the processing device 50 via a network.

[0060] Like the processing device 50, the control device 10 includes a computer. The control device 10 has a processor, a main memory, a storage, and an input / output interface.

[0061] 9 is a functional block diagram showing a processing device 50 according to an embodiment. The processing device 50 includes a component data acquisition unit 51, a noise processing parameter determination unit 52, an imaging parameter determination unit 53, a pattern generation unit 54, an image data acquisition unit 55, a phase value calculation unit 56, a first gradation image data generation unit 57, a three-dimensional point cloud data generation unit 58, a noise processing unit 59, a second gradation image data generation unit 60, a reference position calculation unit 61, and a storage unit 62.

[0062] The component data acquisition unit 51 acquires component data relating to the component C to be mounted on the board W. The component data includes specification data indicating the specifications of the component C.

[0063] FIG. 10 is a diagram illustrating part data according to an embodiment. The part data indicates the outer shape and dimensions of part C. As an example, the part data includes the outer dimensions of the body B, the number of protrusions P, the cross-sectional dimensions of the protrusions P, the cross-sectional shape of the protrusions P, the length of the protrusions P, the distance between a pair of adjacent protrusions P, and the material of the protrusions P. The part data includes, for example, specification data of part C provided by a part manufacturer. The part data may be input to the processing device 50 from the input device 9, or may be input to the processing device 50 via a network.

[0064] The noise processing parameter determination unit 52 determines noise processing parameters to be used when performing noise processing to remove noise from image data of the component C captured by the imaging device 40, based on the component data.

[0065] 11 and 12 are diagrams illustrating noise processing according to an embodiment. Noise processing is performed to remove noise from image data of the part C captured by the imaging device 40. As will be described later, three-dimensional point cloud data of the part C is generated from the image data of the part C. Noise processing is performed to remove noise from the three-dimensional point cloud data of the part C. The noise processing parameter determination unit 52 determines noise processing parameters to be used when removing noise from the three-dimensional point cloud data of the part C, based on the part data.

[0066] The noise processing is performed based on known noise processing algorithms, such as filtering, downsampling, upsampling, feature point, registration, and segmentation.

[0067] As shown in FIG. 11, an example of a noise processing algorithm is Radius Outlier Removal, which is a type of filtering. Radius outlier removal is an algorithm that removes noise based on the number of points (number of point clouds) existing inside a sphere centered on a point of interest and a threshold value. The threshold value is a threshold value for the number of point clouds existing inside the sphere. If the number of point clouds existing inside the sphere is equal to or less than the threshold value, the points existing inside the sphere are removed as noise.

[0068] Examples of noise processing parameters for radial outlier removal include the radius R of the sphere and a threshold for the number of point clouds present inside the sphere. When radial outlier removal is used as the noise processing algorithm, the noise processing parameter determination unit 52 determines the threshold for the radius R of the sphere and the number of point clouds based on the component data. The noise processing parameter determination unit 52 determines the threshold for the radius R of the sphere and the number of point clouds based on, for example, at least one of the number of protrusions P, the length of the protrusions P, and the distance between a pair of adjacent protrusions P. For example, the noise processing parameter determination unit 52 increases the radius R of the sphere and the threshold for the number of point clouds as the number of protrusions P increases. For example, the noise processing parameter determination unit 52 increases the radius R of the sphere and the threshold for the number of point clouds as the length of the protrusions P increases. For example, the noise processing parameter determination unit 52 increases the radius R of the sphere and the threshold for the number of point clouds as the distance between a pair of adjacent protrusions P increases.

[0069] As shown in Figure 12, Euclidean Cluster Segmentation, a type of segmentation, is an example of a noise processing algorithm. Euclidean segmentation is an algorithm that removes noise based on the Euclidean distance between two points in a point cloud and a threshold value. The threshold value is a threshold value for the Euclidean distance. If the Euclidean distance between two points is equal to or less than the threshold value, the two points are considered to be in the same cluster Cr. If the Euclidean distance between two points exceeds the threshold value, the two points are removed as noise.

[0070] Noise processing parameters for Euclidean segmentation include a threshold for Euclidean distance, a maximum number of point clouds in cluster Cr, a minimum number of point clouds in cluster Cr, and a cluster tolerance. When Euclidean segmentation is used as the noise processing algorithm, the noise processing parameter determination unit 52 determines the threshold for Euclidean distance, the maximum number of point clouds in cluster Cr, the minimum number of point clouds in cluster Cr, and the cluster tolerance based on the component data. The noise processing parameter determination unit 52 determines the threshold for Euclidean distance, the maximum number of point clouds in cluster Cr, the minimum number of point clouds in cluster Cr, and the cluster tolerance based on, for example, at least one of the number of protrusions P, the length of the protrusions P, and the distance between a pair of adjacent protrusions P. For example, the noise processing parameter determination unit 52 increases the threshold for Euclidean distance, the maximum number of point clouds in cluster Cr, the minimum number of point clouds in cluster Cr, and the cluster tolerance as the number of protrusions P increases. For example, the noise processing parameter determination unit 52 increases the threshold for Euclidean distance, increases the maximum number of point groups in cluster Cr, increases the minimum number of point groups in cluster Cr, and increases the cluster tolerance as the length of the protrusion P increases. For example, the noise processing parameter determination unit 52 increases the threshold for Euclidean distance, increases the maximum number of point groups in cluster Cr, increases the minimum number of point groups in cluster Cr, and increases the cluster tolerance as the distance between a pair of adjacent protrusions P increases.

[0071] The imaging parameter determination unit 53 determines, based on the component data, imaging parameters to be used when imaging the component C with the imaging device 40. The imaging parameters include imaging conditions to be used when imaging the component C with the imaging device 40. The imaging device 40 images the component C placed at the measurement position CP based on the imaging parameters determined by the imaging parameter determination unit 53.

[0072] 13 is a diagram illustrating imaging parameters according to an embodiment. As an example, the imaging parameters include the amount of pattern light irradiated onto the component C, exposure time, camera gain, noise cut threshold, and height range. The camera gain refers to the luminance value (pixel value) in the image data when a certain amount of light is incident on the imaging element 42. The higher the camera gain, the higher the luminance value (pixel value) in the image data when a certain amount of light is incident on the imaging element 42. The height range refers to the width in the height direction of the component C acquired as image data. The larger the height range, the larger the amount of image data.

[0073] The imaging parameter determination unit 53 determines at least one of the light intensity of the pattern light, the exposure time, and the camera gain based on, for example, the material of the protrusion P. The light reflectance of the protrusion P varies depending on the material of the protrusion P. If the protrusion P is made of metal and has high light reflectance, saturation (saturation of image brightness values) may occur due to excessive light reflection. If the protrusion P is made of resin and has low light reflectance, the imaging device 40 may have difficulty recognizing the protrusion P. For example, the imaging parameter determination unit 53 may reduce the light intensity of the pattern light, shorten the exposure time, or reduce the camera gain as the light reflectance of the protrusion P increases. In addition, the optimal imaging parameters for acquiring clear image data of the component C may vary depending on the outer dimensions of the body B, the number of protrusions P, the cross-sectional dimensions of the protrusions P, the cross-sectional shape of the protrusions P, the length of the protrusions P, and the distance between pairs of adjacent protrusions P.

[0074] FIG. 14 is a diagram illustrating a method for determining imaging parameters according to an embodiment. The imaging parameter determination unit 53 may determine the imaging parameters based on an artificial intelligence (AI) algorithm. The AI ​​algorithm determines the imaging parameters based on a learning model generated by learning feature amounts of component data. The learning model is a learning model that receives the feature amounts of the component data as input and outputs imaging parameters. The learning model is generated in advance and stored in the storage unit 62. The imaging parameter determination unit 53 inputs the component data into the learning model, thereby determining optimal imaging parameters for acquiring clear image data of the component C.

[0075] The pattern generation unit 54 generates pattern data. The pattern data generated by the pattern generation unit 54 is output to the light modulation element 32. The light modulation element 32 generates pattern light PL based on the pattern data generated by the pattern generation unit 54. The pattern data generated by the pattern generation unit 54 includes first pattern data for irradiating the component C with first pattern light PL1 from the projection device 30 without using the reflecting member 81, and second pattern data for irradiating the component C with second pattern light PL2 from the projection device 30 via the reflecting member 81.

[0076] 15A and 15B are diagrams illustrating pattern data according to an embodiment. As shown in Fig. 15A, when the component C is irradiated with the first pattern light PL1, the pattern generation unit 54 generates the first pattern data and controls the light modulation element 32 so that the pattern light PL is emitted from a first region 331 of the emission surface 33S of the emission optical system 33 and the pattern light PL is not emitted from a second region 332 of the emission surface 33S.

[0077] As shown in Figure 15(B), when irradiating the part C with the second pattern light PL2, the pattern generation unit 54 generates second pattern data and controls the light modulation element 32 so that the pattern light PL is emitted from the second region 332 of the emission surface 33S of the emission optical system 33 and the pattern light PL is not emitted from the first region 331 of the emission surface 33S.

[0078] The image data acquisition unit 55 acquires image data from the imaging element 42. The image data acquisition unit 55 acquires image data of the component C onto which the first pattern light PL1 is projected by the first projection device 30 and the second projection device 30, and image data of the component C onto which the second pattern light PL2 from the first reflection member 81 and the second reflection member 81 is projected.

[0079] The phase value calculation unit 56 calculates a phase value for each of the multiple pixels in the image data based on the luminance of the image data. The phase value calculation unit 56 calculates a phase value for a pixel in the image data corresponding to the same point based on the luminance of the same point in the multiple image data of the component C irradiated with each of the phase-shifted patterned lights PL. The phase value calculation unit 56 calculates a phase value for each of the multiple pixels in the image data based on the luminance of the respective points in the image data.

[0080] The first gradation image data generation unit 57 generates first gradation image data that indicates the shape of the part C with gradation from the image data of the part C captured by the imaging device 40. The first gradation image data calculates height data for each of the multiple points on the part C that correspond to each of the multiple pixels of the image data based on the phase values ​​of each of the multiple pixels in the image data of the part C. The first gradation image data generation unit 57 generates first gradation image data that indicates the three-dimensional shape of the part C with gradation based on the height data for each of the multiple points on the part C.

[0081] The three-dimensional point cloud data generating unit 58 converts the first gradation image data of the part C into three-dimensional point cloud data of the part C.

[0082] The noise processing unit 59 removes noise from the three-dimensional point cloud data of the part C and extracts the protrusion P. The noise processing unit 59 removes noise from the three-dimensional point cloud data of the part C and extracts the protrusion P based on the noise processing parameters determined by the noise processing parameter determination unit 52.

[0083] The second gradation image data generating unit 60 converts the three-dimensional point cloud data from which noise has been removed by the noise processing unit 59 into second gradation image data that indicates the shape of the part C with shading.

[0084] The reference position calculation unit 61 calculates the reference position of the part C based on the coordinates of each of the multiple protrusions P in the second gradation image data. The coordinates of the protrusions P are coordinates in the X-axis direction and coordinates in the Y-axis direction. The reference position of the part C includes the center position of the part C on the XY plane.

[0085] The control device 10 controls the mounting head 5 so that the component C is mounted at the target position on the board W based on the reference position of the component C calculated by the reference position calculation unit 61.

[0086] [Processing method for parts Ca] Fig. 16 is a diagram illustrating a method for processing a part Ca according to an embodiment. Each of the first gradation image data, the three-dimensional point cloud data, and the second gradation image data of the part Ca shown in Fig. 16 corresponds to a view of a part of the part Ca viewed from below.

[0087] As shown in FIG. 16, the first gradation image data generator 57 generates first gradation image data that indicates the shape of the part Ca using shading from image data of the part Ca captured by the imaging device 40. The first gradation image data expresses the height of each of the multiple parts of the part Ca using multiple gradations. The first gradation image data may express the height of each of the multiple parts of the part Ca using 256 gradations or 1024 gradations. In the first gradation image data, parts of the part Ca that are short are expressed in light colors, and parts of the part Ca that are tall are expressed in dark colors. When the part Ca is placed at the measurement position CP, the part of the part Ca that is shortest is the tip (lower end) of the electrode portion Ea. In the first gradation image data, the electrode portion Ea is expressed in the lightest color.

[0088] The 3D point cloud data generation unit 58 converts the first gradation image data of the part Ca into 3D point cloud data of the part Ca. The 3D point cloud data generation unit 58 converts each gradation in the first gradation image data into one point. When the heights of each of the multiple portions of the part Ca are expressed in 256 gradations in the first gradation image data, the 3D point cloud data generation unit 58 generates 3D point cloud data consisting of points divided into 256 levels in the height direction. For example, the pixel with the lowest height, the first gradation, in the first gradation image data is converted into the point with the lowest height, the first level, in the 3D point cloud data. The pixel with the 100th gradation in the first gradation image data is converted into the point with the 100th level of height in the 3D point cloud data. The pixel with the highest height, the 256th gradation, in the first gradation image data is converted into the point with the highest height, the 256th level, in the 3D point cloud data.

[0089] The noise processing unit 59 removes noise from the 3D point cloud data of the part Ca. As shown in Fig. 16 , if noise Nz is present in the 3D point cloud data of the part Ca before noise processing, the noise processing unit 59 removes the noise Nz from the 3D point cloud data of the part Ca based on the well-known noise processing algorithm described above. When removing the noise Nz, the noise processing unit 59 removes the noise Nz from the 3D point cloud data of the part Ca based on the noise processing parameters determined by the noise processing parameter determination unit 52.

[0090] In the embodiment, removing noise from the 3D point cloud data of the part Ca includes removing a point cloud representing the body part Ba from the 3D point cloud data of the part Ca. That is, in the embodiment, the noise includes a point cloud representing the body part Ba. The noise processing unit 59 removes the point cloud representing the body part Ba as noise from the 3D point cloud data of the part Ca.

[0091] FIG. 17 is a diagram illustrating noise processing of a part Ca according to an embodiment. As shown in FIG. 17, the noise processing unit 59 removes noise from the three-dimensional point cloud data of the part Ca to extract the electrode portion Ea. The noise processing unit 59 leaves the point cloud in the height range Ze that includes the electrode portion Ea and removes the point cloud outside the height range Ze that includes the body portion Ba as noise. The height range Ze includes the tip end (lower end) of the electrode portion Ea. The height range Ze does not include the base end (upper end) of the electrode portion Ea. The point cloud of the body portion Ba and the point cloud of the base end of the electrode portion Ea are removed. The point cloud in the height range Ze that includes only the tip end of the electrode portion Ea is left, and the point cloud outside the height range Ze is removed, thereby extracting the point cloud of the tip end of the electrode portion Ea.

[0092] When imaging the component Ca placed at the measurement position CP, the imaging device 40 images the component Ca with the focal point of the imaging optical system 41 of the imaging device 40 aligned with the electrode portion Ea. That is, the imaging device 40 images the component C with the focus adjusted on the electrode portion Ea. The noise processing unit 59 can determine the height range Ze based on the focal position of the imaging device 40 when imaging the component Ca. The noise processing unit 59 can extract a point cloud of the tip of the electrode portion Ea from the 3D point cloud data of the component Ca based on the focal position of the imaging device 40 when imaging the component Ca. The height range Ze may be considered as one of the noise processing parameters.

[0093] As shown in Figure 16, by performing noise processing, the point cloud representing the tall body part Ba is removed from the 3D point cloud data of the part Ca, and the point cloud representing the short electrode part Ea remains.

[0094] The second gradation image data generator 60 converts the noise-removed 3D point cloud data of the part Ca into second gradation image data. As shown in Fig. 16, the second gradation image data does not include the body part Ba but includes the electrode part Ea.

[0095] The reference position calculation unit 61 calculates the reference position of the part Ca based on the coordinates of each of the multiple electrode portions Ea in the second gradation image data of the part Ca. The coordinates of the electrode portions Ea are coordinates in the X-axis direction and coordinates in the Y-axis direction. The reference position of the part Ca includes the center position of the part Ca on the XY plane.

[0096] The control device 10 controls the mounting head 5 so that the component Ca is mounted at the target position on the board W based on the reference position of the component Ca calculated by the reference position calculation unit 61.

[0097] [Processing method for part Cb] FIG. 18 is a diagram illustrating noise processing for a part Cb according to an embodiment. As with the part Ca, when recognizing the reference position of the part Cb, the part Cb placed at the measurement position CP is imaged by the imaging device 40. The part Cb has electrode portions Eb, which are metal protrusions Pb, and boss portions Db, which are resin protrusions Pb. When imaging the part Cb with the imaging device 40, the imaging parameter determination unit 53 determines optimal imaging parameters for imaging the part Cb based on the part data of the part Cb. The imaging device 40 can acquire clear image data of the part Cb by imaging the part Cb based on the imaging parameters.

[0098] As with part Ca, first gradation image data generation unit 57 generates first gradation image data for part Cb from image data for part Cb. 3D point cloud data generation unit 58 converts the first gradation image data for part Cb into 3D point cloud data for part Cb. Noise processing unit 59 removes noise from the 3D point cloud data for part Cb based on the noise processing parameters determined by noise processing parameter determination unit 52.

[0099] Removing noise from the 3D point cloud data of the part Cb includes removing at least the point cloud representing the body portion Bb from the 3D point cloud data of the part Cb and extracting the tip portions of the protrusions Pb (the tip portions of the electrodes Eb and the tip portions of the bosses Db). As shown in FIG. 18, the noise processing unit 59 leaves the point cloud in the height range Ze including the tip portions (lower ends) of the electrodes Eb and the tip portions (lower ends) of the bosses Db, and removes the point cloud outside the height range Ze including the body portion Bb as noise. The height range Ze does not include the base end (upper end) and middle portion of the electrodes Eb. The height range Ze does not include the base end (upper end) and middle portion of the bosses Db. The height range Ze does not include the body portion Bb. The point cloud of the body portion Bb, the point cloud of the base end and middle portion of the electrodes Eb, and the point cloud of the base end and middle portion of the bosses Db are removed. The point cloud of the height range Ze, which includes only the tip of the electrode portion Eb and the tip of the boss portion Db, is left, and the point cloud outside the height range Ze is removed, thereby extracting the point cloud of the tip of the electrode portion Eb and the tip of the boss portion Db.

[0100] When imaging a component Cb placed at measurement position CP, the imaging device 40 images the component Cb with the focal point of the imaging optical system 41 of the imaging device 40 aligned with the tips of the protrusions Pb (the tips of the electrodes Eb and the bosses Db). That is, the imaging device 40 images the component Cb with the focus adjusted on the tips of the protrusions Pb. The noise processing unit 59 can extract point clouds of the tips of the electrodes Eb and the bosses Db from the 3D point cloud data of the component Cb based on the focal position of the imaging device 40 when imaging the component Cb. The height range Ze may be considered as one of the noise processing parameters.

[0101] The second gradation image data generating unit 60 converts the noise-removed three-dimensional point cloud data of the part Cb into second gradation image data.

[0102] FIG. 19 is a diagram showing second gradation image data of a part Cb according to an embodiment. FIG. 19 corresponds to a view of the part Cb as seen from below. As shown in FIG. 19, the second gradation image data of the part Cb includes the tip portions of the electrode portions Eb and the tip portions of the boss portions Db. The second gradation image data of the part Cb does not include the base end portions and middle portions of the electrode portions Eb. The second gradation image data of the part Cb does not include the base end portions and middle portions of the boss portions Db. The second gradation image data of the part Cb does not include the body portion Bb.

[0103] The reference position calculation unit 61 calculates the reference position of the component Cb based on the coordinates of each of the tip ends of the multiple protrusions Pb (the tip ends of the electrode portions Eb and the tip ends of the boss portions Db) in the second gradation image data of the component Cb. The coordinates of the tip ends of the protrusions Pb are coordinates in the X-axis direction and coordinates in the Y-axis direction. The reference position of the component Cb includes the center position of the component Cb on the XY plane.

[0104] The control device 10 controls the mounting head 5 so that the component Ca is mounted at the target position on the board W based on the reference position of the component Cb calculated by the reference position calculation unit 61.

[0105] [Processing method for part Cc] FIG. 20 is a diagram illustrating noise processing for a part Cc according to an embodiment. As with parts Ca and Cb, when recognizing the reference position of part Cc, the imaging device 40 captures an image of part Cc placed at measurement position CP. Part Cc has a first electrode portion Ec1, a second electrode portion Ec2, and a third electrode portion Ec3, each of which has a different protrusion amount. When imaging part Cc using the imaging device 40, the imaging parameter determination unit 53 determines optimal imaging parameters for imaging part Cc based on the part data of part Cc. By capturing an image of part Cc based on the imaging parameters, the imaging device 40 can acquire clear image data of part Cc.

[0106] As with parts Ca and Cb, first gradation image data generation unit 57 generates first gradation image data for part Cc from the image data of part Cc. 3D point cloud data generation unit 58 converts the first gradation image data for part Cc into 3D point cloud data for part Cc. Noise processing unit 59 removes noise from the 3D point cloud data for part Cc based on the noise processing parameters determined by noise processing parameter determination unit 52.

[0107] Removing noise from the 3D point cloud data of the part Cc includes removing at least the point cloud representing the body portion Bc from the 3D point cloud data of the part Cc and extracting the tip portions of the protrusions Pc (the tip portions of the first electrode portion Ec1, the second electrode portion Ec2, and the third electrode portion Ec3). As shown in Fig. 20, the noise processing unit 59 leaves a point cloud in a height range Ze1 that includes the tip portion (lower end) of the first electrode portion Ec1, a point cloud in a height range Ze2 that includes the tip portion (lower end) of the second electrode portion Ec2, and a point cloud in a height range Ze3 that includes the tip portion (lower end) of the third electrode portion Ec3, and removes point clouds outside the height ranges Ze1, Ze2, and Ze3 as noise. The point cloud of the body portion Bc, the point cloud of the base end (upper end) and middle portion of the first electrode portion Ec1, the point cloud of the base end (upper end) and middle portion of the second electrode portion Ec2, and the point cloud of the base end (upper end) and middle portion of the third electrode portion Ec3 are removed. The point cloud of the height range Ze1 including only the tip portion of the first electrode portion Ec1, the point cloud of the height range Ze2 including only the tip portion of the second electrode portion Ec2, and the point cloud of the height range Ze3 including only the tip portion of the third electrode portion Ec3 are left, and the point clouds outside the height ranges Ze1, Ze2, and Ze3 are removed, thereby extracting the point cloud of the tip portion of the first electrode portion Ec1, the point cloud of the tip portion of the second electrode portion Ec2, and the point cloud of the tip portion of the third electrode portion Ec3.

[0108] In the embodiment, the noise processing unit 59 removes the base end and intermediate portion of the first electrode portion Ec1, the second electrode portion Ec2, the third electrode portion Ec3, and the body portion Bc as noise from the 3D point cloud data of the part Cc to generate first 3D point cloud data in which the tip portion of the first electrode portion Ec1 is extracted. Also, the noise processing unit 59 removes the base end and intermediate portion of the second electrode portion Ec2, the third electrode portion Ec3, the first electrode portion Ec1, and the body portion Bc as noise from the 3D point cloud data of the part Cc to generate second 3D point cloud data in which the tip portion of the second electrode portion Ec2 is extracted. In addition, the noise processing unit 59 removes the base end and middle portion of the third electrode portion Ec3, the first electrode portion Ec1, the second electrode portion Ec2, and the body portion Bc as noise from the 3D point cloud data of the part Cc, and generates third 3D point cloud data in which the tip portion of the third electrode portion Ec3 is extracted.

[0109] The second gradation image data generating unit 60 converts the noise-removed three-dimensional point cloud data of the part Cc into second gradation image data.

[0110] FIG. 21 is a diagram showing second gradation image data of a part Cc according to an embodiment. FIG. 21 corresponds to a view of the part Cc as seen from below. As shown in FIG. 21, the second gradation image data generation unit 60 converts the first three-dimensional point cloud data from which noise has been removed into first second gradation image data. The second gradation image data generation unit 60 converts the second three-dimensional point cloud data from which noise has been removed into second second gradation image data. The second gradation image data generation unit 60 converts the third three-dimensional point cloud data from which noise has been removed into third second gradation image data.

[0111] The first second-level gradation image data includes the tip of the first electrode portion Ec1 but does not include the second electrode portion Ec2 or the third electrode portion Ec3. The second second-level gradation image data includes the tip of the second electrode portion Ec2 but does not include the third electrode portion Ec3 or the first electrode portion Ec1. The third second-level gradation image data includes the tip of the third electrode portion Ec3 but does not include the first electrode portion Ec1 or the second electrode portion Ec2.

[0112] The reference position calculation unit 61 calculates the reference position OX of the component Cc based on the coordinates of the tip of the first electrode portion Ec1 in the first second-level image data, the coordinates of the tip of the second electrode portion Ec2 in the second second-level image data, and the coordinates of the tip of the third electrode portion Ec3 in the third second-level image data. The coordinates of the tip of the first electrode portion Ec1, the coordinates of the tip of the second electrode portion Ec2, and the coordinates of the tip of the third electrode portion Ec3 are coordinates in the X-axis direction and Y-axis direction. The reference position OX of the component Cc includes the center position of the component Cc in the XY plane.

[0113] The control device 10 controls the mounting head 5 so that the component Cc is mounted at the target position on the board W based on the reference position of the component Cc calculated by the reference position calculation unit 61.

[0114] [effect] As described above, the three-dimensional measuring device 8 includes a projection device 30 that irradiates pattern light PL onto a part Cb having a body part Bb and a plurality of protrusions Pb (electrode parts Eb and boss parts Db) protruding from the body part Bb, an imaging device 40 that images the part Cb irradiated with the pattern light PL, and a processing device 50 that has a processor 50A that processes image data of the part Cb imaged by the imaging device 40. The processing device 50 includes a component data acquisition unit 51 that acquires component data indicating the external shape and dimensions of the component Cb; a noise processing parameter determination unit 52 that determines noise processing parameters for removing noise from the three-dimensional point cloud data of the component Cb generated from the component Cb image data based on the component data of the component Cb; a noise processing unit 59 that removes noise from the three-dimensional point cloud data of the component Cb based on the noise processing parameters and extracts protrusions Pb; a second gradation image data generation unit 60 that converts the three-dimensional point cloud data of the component Cb from which noise has been removed into second gradation image data that indicates the shape of the component Cb in shades of gray; and a reference position calculation unit 61 that calculates a reference position of the component Cb based on the coordinates of each of the multiple protrusions Pb in the second gradation image data of the component Cb.

[0115] According to the embodiment, the recognition performance of the part Ca by the 3D measuring device 8 is improved. Noise processing parameters for removing noise from the 3D point cloud data of the part Cb are determined based on part data including unique data of the part Cb. The noise processing unit 59 can remove noise from the 3D point cloud data of the part Cb based on the noise processing parameters and extract the protrusions Pb (electrode portions Eb and boss portions Db). Even if the part Cb has electrode portions Eb and boss portions Db with different optical reflectances, noise is removed from the 3D point cloud data of the part Cb based on the optimal noise processing parameters, and second-level grayscale image data is generated in which the tips of the electrode portions Eb and boss portions Db are clearly visible. As a result, the reference position of the part Cb is properly recognized.

[0116] In the embodiment, the first gradation image data generation unit 57 generates first gradation image data that indicates the shape of the part Ca using shades of gray from the image data of the part Ca, the three-dimensional point cloud data generation unit 58 converts the first gradation image data of the part Ca into three-dimensional point cloud data of the part Ca, the noise processing unit 59 removes noise from the three-dimensional point cloud data of the part Ca to extract the electrode portions Ea, the second gradation image data generation unit 60 converts the three-dimensional point cloud data of the part Ca from which the noise has been removed into second gradation image data, and the reference position calculation unit 61 calculates the reference position of the part Ca based on the coordinates of each of the multiple electrode portions Ea in the second gradation image data of the part Ca.

[0117] According to the embodiment, the recognition performance of the part Ca by the three-dimensional measuring device 8 is improved. When removing noise from measurement data of the part Ca measured by the three-dimensional measuring device 8, it is easier to remove noise from three-dimensional point cloud data than from first gradation image data. Furthermore, there are many known noise processing algorithms for removing noise from three-dimensional point cloud data, and noise processing techniques are established. Furthermore, when setting a height range Ze for extracting the electrode portion Ea, it is easier to set the height range Ze for three-dimensional point cloud data than for gradation image data. That is, after the first gradation image data of the part Ca is converted into three-dimensional point cloud data, noise processing is performed to remove noise from the three-dimensional point cloud data, thereby properly removing noise. By converting the three-dimensional point cloud data from which noise has been properly removed into second gradation image data, the coordinates of the electrode portion Ea can be properly recognized in the second gradation image data. When recognizing the coordinates of the electrode portion Ea, it is easier to recognize the coordinates of the electrode portion Ea in the second gradation image data than in the three-dimensional point cloud data. Since the coordinates of the electrode portion Ea are correctly recognized in the second gradation image data, the reference position of the component Ca is correctly recognized.

[0118] According to the embodiment, first gradation image data is generated from the image data of the part Ca, and then the first gradation image data is converted into three-dimensional point cloud data. If three-dimensional point cloud data were generated directly from the image data of the part Ca, the amount of data in the three-dimensional point cloud data could be large. After the first gradation image data is generated from the image data of the part Ca, the first gradation image data is converted into three-dimensional point cloud data, thereby reducing the amount of data in the three-dimensional point cloud data. Noise processing is performed on the three-dimensional point cloud data with a small amount of data. The three-dimensional point cloud data with a small amount of data after noise processing is converted into second gradation image data. The reference position of the part Ca is recognized based on the coordinates of the electrode portion Ea in the second gradation image data with a small amount of data. This reduces the computational load on the processing device 50 that recognizes the reference position of the part Ca.

[0119] In this embodiment, when recognizing the reference position OX of the part Cc, the noise processing unit 59 removes noise from the 3D point cloud data of the part Cc to extract the tip of the first electrode portion Ec1, the tip of the second electrode portion Ec2, and the tip of the third electrode portion Ec3. The second gradation image data generation unit 60 converts the 3D point cloud data of the part Cc from which noise has been removed into second gradation image data. The reference position calculation unit 61 calculates the reference position OX of the part Cc based on the coordinates of the tip of the first electrode portion Ec1, the coordinates of the tip of the second electrode portion Ec2, and the coordinates of the tip of the third electrode portion Ec3 in the second gradation image data of the part Cc. Even if a component Cc is provided with a first electrode portion Ec1, a second electrode portion Ec2, and a third electrode portion Ec3 that have different amounts of protrusion (tip heights) from the body portion Bc, the second grayscale image data of the component Cc will have clear images of the tips of the first electrode portion Ec1, the second electrode portion Ec2, and the third electrode portion Ec3. Since the imaging device 40 does not need to capture images of the component Cc multiple times (three times) to match the heights of the tips of the first electrode portion Ec1, the second electrode portion Ec2, and the third electrode portion Ec3, respectively, the takt time, which is the time required to recognize the reference position OX of the component Cc, is improved. [Explanation of symbols]

[0120] 1...component mounting device, 2...component supply device, 3...substrate support device, 4...nozzle, 5...mounting head, 5S...shaft, 6...nozzle moving device, 7...head moving device, 8...3D measuring device, 9...input device, 10...control device, 11...base, 12...support, 13...X-axis moving device, 13A...guide member, 13B...actuator, 14...Y-axis moving device, 14A...guide member, 14B...actuator, 30...projection device, 31...light source, 32...light modulation element, 33 ...Exit optical system, 33S...exit surface, 40...imaging device, 41...imaging optical system, 41S...incident surface, 42...imaging element, 50...processing device, 50A...processor, 50B...main memory, 50C...storage, 50D...interface, 51...component data acquisition unit, 52...noise processing parameter determination unit, 53...imaging parameter determination unit, 54...pattern generation unit, 55...image data acquisition unit, 56...phase value calculation unit, 57...first gradation image data generation unit, 58... 3D point cloud data generation unit, 59... noise processing unit, 60... second gradation image data generation unit, 61... reference position calculation unit, 62... storage unit, 81... reflective member, 82... housing, 331... first region, 332... second region, AP... supply position, AX... optical axis, B... body part, Ba... body part, Bb... body part, Bc... body part, BP... processing position, C... component, Ca... component, Cb... component, Cc... component, Cr... cluster, C11... terminal part, C12... fixed part, CP... total Measurement position, Da...boss part, Db...boss part, Ea...electrode part, Eb...electrode part, Ec...electrode part, Ec1...first electrode part, Ec2...second electrode part, Ec3...third electrode part, Fa...screw hole, Nz...noise, OX...reference position, P...protrusion, Pa...protrusion, Pb...protrusion, Pc...protrusion, PL...pattern light, PL1...first pattern light, PL2...second pattern light, R...radius, W...substrate, Ze...height range, Ze1...height range, Ze2...height range, Ze3...height range.

Claims

1. a projection device that irradiates a pattern light onto a component having a body portion and a plurality of protrusions protruding from the body portion; an imaging device that captures an image of the component irradiated with the pattern light; a processing device having a processor that processes image data of the component captured by the imaging device, The processing device includes: acquiring part data indicating the outer shape and dimensions of the part; determining, based on the part data, noise processing parameters for removing noise from the three-dimensional point cloud data of the part generated from the image data; removing noise from the three-dimensional point cloud data based on the noise processing parameters and extracting the protruding portion; converting the noise-removed three-dimensional point cloud data into grayscale image data that indicates the shape of the part using shades of gray; calculating a reference position of the component based on the coordinates of each of the plurality of protrusions in the gradation image data; 3D measuring device.

2. the component data includes the number of the protrusions, the cross-sectional dimensions of the protrusions, the cross-sectional shapes of the protrusions, the lengths of the protrusions, the distance between a pair of the protrusions adjacent to each other, and the material of the protrusions; The three-dimensional measurement device according to claim 1 .

3. the processing device determines, based on the component data, imaging parameters for imaging the component by the imaging device; The imaging device images the component based on the imaging parameters. The three-dimensional measurement device according to claim 1 .

4. The three-dimensional measurement device according to claim 1 ; a mounting head having a nozzle for holding the component, the three-dimensional measuring device measures the part held by the nozzle; the mounting head mounts the component at a target position on a board based on the reference position of the component calculated by the three-dimensional measurement device. Component mounting equipment.

5. acquiring image data of a component having a body portion and a plurality of protrusions protruding from the body portion based on a phase shift method; acquiring part data indicating the outer shape and dimensions of the part; determining, based on the part data, noise processing parameters for removing noise from the three-dimensional point cloud data of the part generated from the image data; removing noise from the three-dimensional point cloud data based on the noise processing parameters and extracting the protruding portion; converting the noise-removed three-dimensional point cloud data into grayscale image data that indicates the shape of the part using shades of gray; calculating a reference position of the component based on the coordinates of each of the plurality of protrusions in the gradation image data; Three-dimensional measurement method.

Images