Resin composition, molded body, and compatibilizer

Abstract

To provide a resin composition in which a fluororesin and a super engineering plastic resin can be uniformly mixed, a molded body, and a compatibilizer.SOLUTION: A resin composition comprises a fluororesin, a super engineering plastic resin, and a compatibilizer, wherein the compatibilizer contains a graft polymer or a block polymer including a fluoropolymer segment and a non-fluoropolymer segment, and a functional compound, and the super engineering plastic resin and the non-fluoropolymer segment are composed of different types of monomers.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present disclosure relates to a resin composition, a molded article, and a compatibilizer. [Background technology]

[0002] There is a demand for the development of composite materials made of fluororesin and super engineering plastic resin in fields such as automobiles and semiconductors. However, because fluororesin has low compatibility with other resins, it has been difficult to uniformly mix fluororesin and super engineering plastic resin using common mixing methods and conditions.

[0003] As a method for uniformly mixing a fluororesin and a super engineering plastic resin, a method using a compatibilizer is known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2023-540107 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present disclosure is to provide a resin composition, a molded article, and a compatibilizer that can uniformly mix a fluororesin and a super engineering plastic resin. [Means for solving the problem]

[0006] The present disclosure (1) is a resin composition comprising a fluororesin, a super engineering plastic resin, and a compatibilizer, wherein the compatibilizer comprises a block polymer or graft polymer containing a fluoropolymer segment and a non-fluoropolymer segment, and a functional compound, and the super engineering plastic resin and the non-fluoropolymer segment are composed of different types of monomers.

[0007] The present disclosure (2) is the resin composition according to the present disclosure (1), wherein the fluororesin is a perfluororesin.

[0008] The present disclosure (3) is the resin composition according to the present disclosure (1) or (2), wherein the fluororesin is at least one selected from the group consisting of tetrafluoroethylene / perfluoro(alkyl vinyl ether) copolymer and tetrafluoroethylene / hexafluoropropylene copolymer.

[0009] The present disclosure (4) is a resin composition according to any one of the present disclosures (1) to (3), wherein the super engineering plastic resin is at least one selected from the group consisting of liquid crystal polymer, polyetherimide, polyphenylene sulfide, polyaryletherketone, polysulfone, and polyethersulfone.

[0010] The present disclosure (5) is the resin composition according to any one of the present disclosures (1) to (4), wherein the super engineering plastic resin is at least one selected from the group consisting of polyphenylene sulfide and polyether sulfone.

[0011] The present disclosure (6) is the resin composition according to any one of the present disclosures (1) to (5), wherein the content of the compatibilizer is 1 to 30 mass %.

[0012] The present disclosure (7) is the resin composition according to any one of the present disclosures (1) to (6), wherein the content of the compatibilizer is 5 to 20 mass %.

[0013] The present disclosure (8) is the resin composition according to any one of the present disclosures (1) to (7), wherein the mass ratio of the fluororesin and the super engineering plastic resin is fluororesin / super engineering plastic resin=99 / 1 to 50 / 50.

[0014] The present disclosure (9) is the resin composition according to any one of the present disclosures (1) to (8), wherein the mass ratio of the fluororesin and the super engineering plastic resin is fluororesin / super engineering plastic resin=90 / 10 to 70 / 30.

[0015] The present disclosure (10) is the resin composition according to any one of the present disclosures (1) to (9), wherein the melt flow rate of the fluoropolymer in the fluoropolymer segment is 60 g / 10 min or more.

[0016] The present disclosure (11) is the resin composition according to any one of the present disclosures (1) to (10), wherein the melt flow rate of the fluoropolymer in the fluoropolymer segment is 60 to 300 g / 10 min.

[0017] The present disclosure (12) is a fluoropolymer segment having a terminal functional group of 10 main chain carbon atoms. 6 The resin composition according to any one of the present disclosures (1) to (11) has 150 or more per particle.

[0018] The present disclosure (13) is a fluoropolymer segment having a terminal functional group of 10 main chain carbon atoms. 6 The resin composition according to any one of the present disclosures (1) to (12) has 150 to 2000 particles per particle.

[0019] The present disclosure (14) is the resin composition according to any one of the present disclosures (1) to (13), wherein the fluoropolymer in the fluoropolymer segment is a perfluororesin.

[0020] The present disclosure (15) is the resin composition according to any one of the present disclosures (1) to (14), wherein the fluoropolymer in the fluoropolymer segment is at least one selected from the group consisting of a tetrafluoroethylene / perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene / hexafluoropropylene copolymer.

[0021] The present disclosure (16) is the resin composition according to any one of the present disclosures (1) to (15), wherein the functional compound is a monomer capable of constituting an amorphous super engineering plastic resin.

[0022] The present disclosure (17) is the resin composition according to any one of the present disclosures (1) to (16), in which the functional compound is at least one selected from the group consisting of acid anhydrides and diamines.

[0023] The present disclosure (18) is the resin composition according to any one of the present disclosures (1) to (17), wherein the functional compound is at least one selected from the group consisting of 4,4'-(hexafluoroisopropylidene)diphthalic anhydride and 4,4'-oxydianiline.

[0024] The present disclosure (19) is the resin composition according to any one of the present disclosures (1) to (18), wherein the glass transition temperature of the non-fluoropolymer in the non-fluoropolymer segment is 180° C. or higher.

[0025] The present disclosure (20) is the resin composition according to any one of the present disclosures (1) to (19), wherein the non-fluoropolymer in the non-fluoropolymer segment is at least one selected from the group consisting of a liquid crystal polymer, a polyetherimide, a polyphenylene sulfide, a polyaryletherketone, a polysulfone, and a polyethersulfone.

[0026] The present disclosure (21) is a resin composition according to any one of the present disclosures (1) to (20), which contains an oxazoline group-containing compound.

[0027] The present disclosure (22) is the resin composition according to any one of the present disclosures (1) to (21), which is solid or liquid at 25°C.

[0028] The present disclosure (23) is a molded article using the resin composition according to any one of the present disclosures (1) to (22).

[0029] The present disclosure (24) is a block copolymer or graft polymer containing a fluoropolymer segment and a non-fluoropolymer segment, and a functional compound, wherein the melt flow rate of the fluoropolymer in the fluoropolymer segment is 60 g / 10 min or more, and the amount of terminal functional groups of the fluoropolymer in the fluoropolymer segment is 10 or more main chain carbon atoms. 6 It is a compatibilizer having 150 or more molecules per molecule.

[0030] The present disclosure (25) is a compatibilizer according to the present disclosure (24), which is used in a resin composition of a fluororesin and a super engineering plastic resin, and in which the super engineering plastic resin and the non-fluoropolymer segment are composed of different types of monomers.

[0031] The present disclosure (26) is the compatibilizer according to the present disclosure (24) or (25), wherein the melt flow rate of the fluoropolymer in the fluoropolymer segment is 60 to 300 g / 10 min.

[0032] The present disclosure (27) is directed to a method for manufacturing a fluoropolymer segment having a terminal functional group of fluoropolymer having 10 main chain carbon atoms. 6 The compatibilizer according to any one of the present disclosures (24) to (26) has 150 to 2000 particles per particle. [Effects of the Invention]

[0033] According to the present disclosure, it is possible to provide a resin composition, a molded body, and a compatibilizer that can uniformly mix a fluororesin and a super engineering plastic resin. [Brief explanation of the drawings]

[0034] [Figure 1] 1 is a micrograph showing the dispersion state of Example 1. [Figure 2] 1 is a micrograph showing the dispersion state of Example 2. [Figure 3] 1 is a micrograph showing the dispersion state of Example 3. [Figure 4] 1 is a micrograph showing the dispersion state of Example 4. [Figure 5] 1 is a micrograph showing the dispersion state of Example 5. [Figure 6] 1 is a micrograph showing the dispersion state of Comparative Example 1. [Figure 7] 1 is a micrograph showing the dispersion state of Example 6. [Figure 8] 1 is a micrograph showing the dispersion state of Comparative Example 2. DETAILED DESCRIPTION OF THE INVENTION

[0035] As used herein, "organic group" means a group containing one or more carbon atoms or a group formed by removing one hydrogen atom from an organic compound. Examples of the "organic group" are: an alkyl group optionally having one or more substituents; an alkenyl group optionally having one or more substituents; an alkynyl group optionally having one or more substituents; a cycloalkyl group optionally having one or more substituents; a cycloalkenyl group optionally having one or more substituents, a cycloalkadienyl group optionally having one or more substituents, an aryl group optionally having one or more substituents; an aralkyl group optionally having one or more substituents; a non-aromatic heterocyclic group optionally having one or more substituents, a heteroaryl group optionally having one or more substituents; cyano group, formyl group, RaO-, RaCO-, RaSO2-, RaCOO-, RaNRaCO-, RaCONRa-, RaOCO-, RaOSO2- and, RaNRbSO2- (In these formulas, Ra independently represents: an alkyl group optionally having one or more substituents; an alkenyl group optionally having one or more substituents; an alkynyl group optionally having one or more substituents; a cycloalkyl group optionally having one or more substituents; a cycloalkenyl group optionally having one or more substituents, a cycloalkadienyl group optionally having one or more substituents, an aryl group optionally having one or more substituents; an aralkyl group optionally having one or more substituents; a non-aromatic heterocyclic group optionally having one or more substituents, or a heteroaryl group optionally having one or more substituents; Rb is independently H or an alkyl group which may have one or more substituents. Includes. The organic group is preferably an alkyl group which may have one or more substituents.

[0036] The present disclosure will be specifically described below.

[0037] <Resin composition> The resin composition of the present disclosure comprises a fluororesin, a super engineering plastic resin, and a compatibilizer, the compatibilizer comprising a block polymer or graft polymer comprising a fluoropolymer segment and a non-fluoropolymer segment, and a functional compound, and the super engineering plastic resin and the non-fluoropolymer segment are composed of different types of monomers.

[0038] According to the resin composition of the present disclosure, the compatibility of the fluororesin is improved by the compatibilizer, and the fluororesin and super engineering plastic resin can be mixed uniformly.

[0039] Furthermore, it is common technical knowledge that a compatibilizer used in a composite material of a fluororesin and a super engineering plastic resin is usually composed of the same type of monomer as the super engineering plastic resin, and a compatibilizer composed of a different type of monomer from the super engineering plastic resin cannot fully exert its effect. In contrast, the compatibilizer used in the resin composition of the present disclosure, although composed of a different type of monomer from the super engineering plastic resin, fully exerts its effect as a compatibilizer and enables the fluororesin and the super engineering plastic resin to be mixed uniformly.

[0040] Examples of fluororesins include polytetrafluoroethylene [PTFE], tetrafluoroethylene [TFE] / perfluoro(alkyl vinyl ether) [PAVE] copolymer [PFA], TFE / hexafluoropropylene [HFP] copolymer [FEP], ethylene [Et] / TFE copolymer [ETFE], Et / TFE / HFP copolymer [EFEP], polychlorotrifluoroethylene [PCTFE], chlorotrifluoroethylene [CTFE] / TFE copolymer, CTFE / TFE / PAVE copolymer, and Et / CTFE copolymer.

[0041] The fluororesin is preferably a perfluororesin, and is preferably at least one selected from the group consisting of polytetrafluoroethylene [PTFE], tetrafluoroethylene [TFE] / perfluoro(alkyl vinyl ether) [PAVE] copolymer [PFA], and tetrafluoroethylene [TFE] / hexafluoropropylene [HFP] copolymer [FEP], more preferably at least one selected from the group consisting of PFA and FEP, and even more preferably PFA.

[0042] The PTFE may be a TFE homopolymer consisting of only tetrafluoroethylene (TFE) units, or may be a modified PTFE containing TFE units and modified monomer units based on a modified monomer copolymerizable with TFE.

[0043] The modifying monomer is not particularly limited as long as it is copolymerizable with TFE, and examples thereof include perfluoroolefins such as hexafluoropropylene [HFP], chlorofluoroolefins such as chlorotrifluoroethylene [CTFE], hydrogen-containing fluoroolefins such as trifluoroethylene and vinylidene fluoride [VdF], perfluorovinyl ethers, perfluoroalkyl allyl ethers, (perfluoroalkyl)ethylenes, ethylene, etc. The modifying monomer used may be one type or multiple types.

[0044] The perfluorovinyl ether is not particularly limited, and examples thereof include perfluorovinyl ethers represented by the following general formula (1): CF2=CF-ORf (1) (wherein Rf represents a perfluoroorganic group). In this specification, the "perfluoroorganic group" refers to an organic group in which all hydrogen atoms bonded to carbon atoms are substituted with fluorine atoms. The perfluoroorganic group may have an ether oxygen.

[0045] An example of the perfluorovinyl ether is perfluoro(alkyl vinyl ether) [PAVE], which is represented by the general formula (1) in which Rf represents a perfluoroalkyl group having 1 to 10 carbon atoms. The number of carbon atoms in the perfluoroalkyl group is preferably 1 to 5.

[0046] Examples of the perfluoroalkyl group in PAVE include perfluoromethyl group, perfluoroethyl group, perfluoropropyl group, perfluorobutyl group, perfluoropentyl group, and perfluorohexyl group, but perfluoro(propyl vinyl ether) [PPVE], in which the perfluoroalkyl group is a perfluoropropyl group, is preferred.

[0047] Further, the perfluorovinyl ether includes those represented by the general formula (1) in which Rf is a perfluoro(alkoxyalkyl) group having 4 to 9 carbon atoms, and those represented by the following formula:

[0048] [ka]

[0049] (wherein m represents 0 or an integer of 1 to 4), and Rf is a group represented by the following formula:

[0050] [ka]

[0051] (wherein n represents an integer of 1 to 4).

[0052] The (perfluoroalkyl)ethylene is not particularly limited, and examples thereof include (perfluorobutyl)ethylene [PFBE], (perfluorohexyl)ethylene [PFHE], and (perfluorooctyl)ethylene.

[0053] The modifying monomer in the modified PTFE is preferably at least one selected from the group consisting of HFP, CTFE, VdF, PPVE, PFBE, and ethylene, and more preferably at least one selected from the group consisting of HFP and CTFE.

[0054] In the modified PTFE, the content of the modifying monomer unit is preferably in the range of 0.00001 to 1.0% by mass. The lower limit of the content of the modifying monomer unit is more preferably 0.0001% by mass, even more preferably 0.001% by mass, even more preferably 0.005% by mass, especially preferably 0.010% by mass, and particularly preferably 0.030% by mass. The upper limit of the content of the modifying monomer unit is preferably 0.90% by mass, more preferably 0.50% by mass, even more preferably 0.40% by mass, and even more preferably 0.30% by mass. In this specification, the modified monomer unit means a part of the molecular structure of the modified PTFE that is derived from the modified monomer.

[0055] The melting point of PTFE is preferably 324 to 360°C. The melting point of PTFE refers to the first melting point. The first melting point is the temperature corresponding to the maximum value on the heat of fusion curve when PTFE that has not been heated to a temperature of 300°C or higher is heated at a rate of 10°C / min using a differential scanning calorimeter (DSC).

[0056] The standard specific gravity (SSG) of PTFE is preferably 2.130 to 2.280. The standard specific gravity is more preferably 2.220 or less, and even more preferably 2.200 or less. It is also preferably 2.140 or more, and even more preferably 2.150 or more. The SSG is measured by the water displacement method in accordance with ASTM D-792 using a sample molded in accordance with ASTM D 4895-89.

[0057] The PTFE preferably has non-melt-fabricability, which means that the melt flow rate cannot be measured at a temperature higher than the crystallization melting point in accordance with ASTM D-1238 and D-2116.

[0058] Although the PFA is not particularly limited, a copolymer having a molar ratio of TFE units to PAVE units (TFE units / PAVE units) of 70 / 30 or more and less than 99 / 1 is preferred. A more preferred molar ratio is 70 / 30 or more and 98.9 / 1.1 or less, and an even more preferred molar ratio is 80 / 20 or more and 98.9 / 1.1 or less. The PFA preferably contains 0.1 to 10 mol % of monomer units derived from a monomer copolymerizable with TFE and PAVE (a copolymer having a total of 90 to 99.9 mol % of TFE units and PAVE units), more preferably 0.1 to 5 mol %, and particularly preferably 0.2 to 4 mol %.

[0059] Examples of the monomer copolymerizable with TFE and PAVE include HFP, a copolymer of the formula (I): CZ 1 Z 2 =CZ 3 (CF2) n Z 4 (In the formula, Z 1 , Z 2and Z 3 are the same or different and represent a hydrogen atom or a fluorine atom; Z 4 represents a hydrogen atom, a fluorine atom or a chlorine atom, and n represents an integer of 2 to 10.) and a vinyl monomer represented by formula (II): CF2=CF-OCH2-Rf 1 (In the formula, Rf 1 represents a perfluoroalkyl group having 1 to 5 carbon atoms, an alkyl perfluorovinyl ether derivative represented by the formula (X): CZ 5 Z 6 =CZ 7 -CZ 8 Z 9 -O-Rf 4 (in the formula, in the formula, Z 5 , Z 6 and Z 7 are the same or different and represent a hydrogen atom, a chlorine atom or a fluorine atom; Z 8 and Z 9 represents a hydrogen atom or a fluorine atom, and Rf 4 represents a perfluoroalkyl group having 1 to 5 carbon atoms. Examples of the allyl ether monomer include an allyl ether monomer represented by CH2=CFCF2-O-Rf 4 , CF2=CFCF2-O-Rf 4 (Perfluoroalkyl allyl ether), CF2=CFCH2-O-Rf 4 , CH2=CHCF2-O-Rf 4 (In the formula, Rf 4 is the same as the above formula (X). Further examples of monomers copolymerizable with TFE and PAVE include unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, and acid anhydrides of unsaturated dicarboxylic acids, such as itaconic acid, itaconic anhydride, citraconic anhydride, and 5-norbornene-2,3-dicarboxylic anhydride.

[0060] The melting point of PFA is preferably from 180 to less than 324°C, more preferably from 230 to 320°C, and even more preferably from 280 to 320°C. The melting point of PFA is the temperature corresponding to the maximum value on the heat of fusion curve when the temperature is increased at a rate of 10°C / min using a differential scanning calorimeter (DSC).

[0061] Although the FEP is not particularly limited, a copolymer having a molar ratio of TFE units to HFP units (TFE units / HFP units) of 70 / 30 or more and less than 99 / 1 is preferred. A more preferred molar ratio is 70 / 30 or more and 98.9 / 1.1 or less, and an even more preferred molar ratio is 80 / 20 or more and 98.9 / 1.1 or less. The FEP preferably contains 0.1 to 10 mol % of monomer units derived from a monomer copolymerizable with TFE and HFP (a copolymer having a total of 90 to 99.9 mol % of TFE units and HFP units), more preferably 0.1 to 5 mol %, and particularly preferably 0.2 to 4 mol %.

[0062] Examples of the monomer copolymerizable with TFE and HFP include PAVE, a monomer represented by formula (X), an alkyl perfluorovinyl ether derivative represented by formula (II), etc. Further examples of the monomer copolymerizable with TFE and HFP include unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, and acid anhydrides of unsaturated dicarboxylic acids, such as itaconic acid, itaconic anhydride, citraconic anhydride, and 5-norbornene-2,3-dicarboxylic anhydride.

[0063] The melting point of FEP is preferably from 150 to less than 324°C, more preferably from 200 to 320°C, and even more preferably from 240 to 320°C. The melting point of FEP is the temperature corresponding to the maximum value on the heat of fusion curve when the temperature is increased at a rate of 10°C / min using a differential scanning calorimeter (DSC).

[0064] The ETFE is preferably a copolymer having a molar ratio of TFE units to ethylene units (TFE units / ethylene units) of 20 / 80 or more and 90 / 10 or less. A more preferred molar ratio is 37 / 63 or more and 85 / 15 or less, and an even more preferred molar ratio is 38 / 62 or more and 80 / 20 or less. The ETFE may be a copolymer consisting of TFE, ethylene, and a monomer copolymerizable with TFE and ethylene. The ETFE preferably contains 0.1 to 10 mol % of monomer units derived from TFE and a monomer copolymerizable with ethylene (a copolymer having a total of 90 to 99.9 mol % of TFE units and ethylene units), more preferably 0.1 to 5 mol %, and particularly preferably 0.2 to 4 mol %.

[0065] The monomer copolymerizable with TFE and ethylene is represented by the following formula: CH2=CX 1 Rf 2 , CF2=CFRf 2 , CF2=CFORf 2 , CH2=C(Rf 2 )2(where, X 1 is a hydrogen atom or a fluorine atom, Rf 2 represents a fluoroalkyl group which may contain an ether bond.) and a monomer represented by formula (X), among which CF2=CFRf 2 , CF2=CFORf 2 and CH2=CX 1 Rf 2 and a monomer represented by formula (X), and HFP, CF2=CF-ORf 3 (In the formula, Rf 3 represents a perfluoroalkyl group having 1 to 5 carbon atoms.) 4 (In the formula, Rf 4 represents a perfluoroalkyl group having 1 to 5 carbon atoms. 2 is a fluoroalkyl group having 1 to 8 carbon atoms, CH2=CX 1 Rf 2Further preferred are fluorine-containing vinyl monomers represented by the following formula: Furthermore, examples of the monomer copolymerizable with TFE and ethylene also include unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, and acid anhydrides of unsaturated dicarboxylic acids, such as itaconic acid, itaconic anhydride, citraconic anhydride, and 5-norbornene-2,3-dicarboxylic anhydride.

[0066] The melting point of ETFE is preferably from 140 to less than 324°C, more preferably from 160 to 320°C, and even more preferably from 195 to 320°C. The melting point of ETFE is the temperature corresponding to the maximum value on the heat of fusion curve when the temperature is increased at a rate of 10°C / min using a differential scanning calorimeter (DSC).

[0067] The content of each monomer unit in the above-mentioned polymer can be calculated by appropriately combining NMR, FT-IR, elemental analysis, and X-ray fluorescence analysis depending on the type of monomer.

[0068] The melt flow rate (MFR) of the fluororesin is preferably 5 g / 10 min or more, more preferably 10 g / 10 min or more, even more preferably 20 g / 10 min or more, and is preferably 300 g / 10 min or less, more preferably 250 g / 10 min or less, even more preferably 200 g / 10 min or less. In this specification, MFR is a value measured in accordance with ASTM D-1238 using a die having a diameter of 2.1 mm and a length of 8 mm at 372° C. under a load of 5 kg.

[0069] Fluorine resin has a main chain of 10 carbon atoms. 6 Each of the polymers preferably has 150 or more terminal functional groups, more preferably 180 or more, more preferably 200 or more, and preferably 2000 or less, more preferably 1000 or less, and even more preferably 800 or less. Typical terminal functional groups are -COF, -COOH, and -COOCH3, and the above number is the total number of these.

[0070] The number of terminal functional groups (amount of terminal functional groups) can be measured by infrared spectroscopy. Specifically, a sample is first melt-extruded to produce a film with a thickness of 0.25 to 0.3 mm. This film is analyzed by Fourier transform infrared spectroscopy to obtain an infrared absorption spectrum of the sample, and a difference spectrum is obtained from the base spectrum, which is completely fluorinated and has no unstable terminal groups. From the absorption peaks of specific terminal groups that appear in this difference spectrum, the number of carbon atoms in the sample is calculated according to the following formula (A): 6 Calculate the number of terminal functional groups per unit, N. N=I×K / t (A) I: Absorbance K: Correction coefficient t: film thickness (mm)

[0071] The super engineering plastic resin may be crystalline or amorphous, but is preferably amorphous. The super engineering plastic resin is preferably a non-fluorine-containing resin.

[0072] The thermal decomposition temperature of the super engineering plastic resin is preferably 330°C or higher, more preferably 350°C or higher, even more preferably 370°C or higher, and is preferably 560°C or lower, more preferably 540°C or lower, even more preferably 520°C or lower. The thermal decomposition temperature of super engineering plastic resin was measured using a thermal analyzer, STA7200, manufactured by Hitachi High-Tech Science Corporation. Measurements were performed under a nitrogen purge atmosphere at 200 mL / min. 10 mg of sample was placed in an aluminum pan, held at 25°C for 10 minutes, and then heated to 600°C at a rate of 10°C / min. The temperature at which the mass decreased by 5% from the initial mass (Td5) was taken as the thermal decomposition temperature.

[0073] The continuous use temperature of the super engineering plastic resin is preferably 140° C. or higher, more preferably 160° C. or higher, and even more preferably 170° C. or higher. There is no particular upper limit, and the higher the temperature the better, but it may be, for example, 260° C. In this specification, the continuous use temperature is the temperature at which the physical property value deteriorates by 50% from the initial value when left in the atmosphere at a constant temperature for 40,000 hours, and is measured in accordance with UL746B.

[0074] The glass transition temperature of the super engineering plastic resin is preferably 180°C or higher, more preferably 200°C or higher, and even more preferably 220°C or higher, and is preferably 300°C or lower, more preferably 280°C or lower, and even more preferably 260°C or lower. In this specification, the glass transition temperature can be determined by obtaining a DSC curve using a differential scanning calorimeter (DSC822e, manufactured by Mettler-Toledo) by heating 10 mg of a sample at a rate of 10°C / min, and by determining the temperature at the midpoint between the two intersections of an extension of the baseline before and after the second-order transition of the DSC curve and a tangent to the inflection point of the DSC curve.

[0075] Examples of super engineering plastic resins that can be used include liquid crystal polymers, polyetherimides, polyphenylene sulfides, polyaryletherketones, polysulfones, and polyethersulfones.

[0076] The liquid crystal polymer is not particularly limited, but may be a polymer having a liquid crystallization temperature (i.e., melting point) of 180°C to 380°C, and is preferably a thermotropic liquid crystal polymer that changes to a liquid crystal state such as a nematic state upon heating, for example: Type I liquid crystal polymer (biphenol / benzoic acid / parahydroxybenzoic acid (POB) copolymer, etc.) Type II liquid crystal polymers (hydroxynaphthoic acid (HNA) / POB copolymers, etc.) Type III liquid crystal polymer (POB / ethylene terephthalate copolymer, etc.) Among these, from the viewpoints of the kneading temperature and the liquid crystal transition temperature, at least one selected from the group consisting of type I liquid crystal polymers and type II liquid crystal polymers is preferred, and type II liquid crystal polymers are more preferred.

[0077] The melting point of the liquid crystal polymer is preferably 280°C or higher, more preferably 310°C or higher, and is preferably 380°C or lower, more preferably 350°C or lower.

[0078] As the polyetherimide, for example, one having an imide bond and an ether bond in the molecule can be used, and one having a functional group such as an amino group at the end is also preferred.

[0079] The glass transition temperature of the polyetherimide is preferably 180°C or higher, more preferably 200°C or higher, and is preferably 300°C or lower, more preferably 280°C or lower.

[0080] As the polyphenylene sulfide, for example, a resin having a structural unit represented by the following formula can be used: The proportion of this structural unit is preferably 70 mol % or more. -(Ph-S)- In the formula, Ph is a phenylene group, and examples of the phenylene group include p-phenylene, m-phenylene, o-phenylene, alkyl-substituted phenylene, phenyl-substituted phenylene, halogen-substituted phenylene, amino-substituted phenylene, amido-substituted phenylene, p,p'-diphenylene sulfone, p,p'-biphenylene, p,p'-biphenylene ether, etc. Among these, p-phenylene is preferred.

[0081] The melting point of polyphenylene sulfide is preferably 240°C or higher, more preferably 270°C or higher, and is preferably 380°C or lower, more preferably 350°C or lower.

[0082] Examples of polyaryletherketone include polyetherketone (PEK), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), etc. Among these, PEEK is preferred.

[0083] The melting point of the polyaryletherketone is preferably 320°C or higher, more preferably 340°C or higher, and is preferably 400°C or lower, more preferably 380°C or lower.

[0084] The polysulfone is not particularly limited, and a general polysulfone can be used.

[0085] The glass transition temperature of the polysulfone is preferably 180°C or higher, more preferably 200°C or higher, and even more preferably 220°C or higher, and is preferably 300°C or lower, more preferably 280°C or lower, and even more preferably 260°C or lower.

[0086] The polyethersulfone is not particularly limited, and a general polyethersulfone can be used.

[0087] The glass transition temperature of the polyethersulfone is preferably 180°C or higher, more preferably 200°C or higher, and even more preferably 220°C or higher, and is preferably 300°C or lower, more preferably 280°C or lower, and even more preferably 260°C or lower.

[0088] The melting points of liquid crystal polymers, polyetherimides, polyphenylene sulfides, and polyaryletherketones are the temperatures corresponding to the maximum values ​​on the heat of fusion curves when the temperature is increased at a rate of 10°C / min using a differential scanning calorimeter (DSC).

[0089] The super engineering plastic resin is preferably at least one selected from the group consisting of liquid crystal polymer, polyetherimide, polyphenylene sulfide, polyaryl ether ketone, polysulfone, and polyethersulfone, more preferably at least one selected from the group consisting of polyphenylene sulfide, polyaryl ether ketone, and polyethersulfone, even more preferably at least one selected from the group consisting of polyphenylene sulfide, polyether ether ketone, and polyethersulfone, and particularly preferably at least one selected from the group consisting of polyphenylene sulfide and polyethersulfone.

[0090] In the resin composition of the present disclosure, the mass ratio of the fluororesin and the super engineering plastic resin (fluororesin / super engineering plastic resin) is preferably 99 / 1 to 50 / 50, more preferably 90 / 10 to 60 / 40, even more preferably 85 / 15 to 65 / 35, and particularly preferably 80 / 20 to 70 / 30.

[0091] In the resin composition of the present disclosure, the content of the fluororesin is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, and preferably 90% by mass or less, more preferably 85% by mass or less, even more preferably 80% by mass or less.

[0092] In the resin composition of the present disclosure, the content of the super engineering plastic resin is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and is preferably 40% by mass or less, more preferably 30% by mass or less, even more preferably 25% by mass or less.

[0093] The compatibilizer includes a block polymer or a graft polymer containing a fluoropolymer segment and a non-fluoropolymer segment, and a functional compound.

[0094] In this specification, block polymers and graft polymers are polymers composed of two or more types of monomers, and have a structure in which polymer chains (segments) composed of the same types of monomers are bonded together. That is, the compatibilizer has a structure in which a polymer chain composed of a fluoropolymer and a polymer chain composed of a non-fluoropolymer are bonded together. A block polymer is a polymer without a branched structure, and a graft polymer is a polymer with a branched structure.

[0095] The compatibilizer may contain at least one of a block polymer and a graft polymer, and may contain both, but preferably contains at least a block polymer. The compatibilizer may also contain a fluoropolymer or non-fluoropolymer that does not constitute a block polymer or a graft polymer (that is, is not bonded to these polymers).

[0096] The fluoropolymer in the fluoropolymer segment may be any of those described above for the fluororesin, and preferred embodiments are also the same. The fluoropolymer constituting the fluoropolymer segment may be a fluororubber.

[0097] The melt flow rate (MFR) of the fluoropolymer in the fluoropolymer segment is preferably 60 g / 10 min or more, more preferably 80 g / 10 min or more, even more preferably 100 g / 10 min or more, and is preferably 300 g / 10 min or less, more preferably 250 g / 10 min or less, even more preferably 200 g / 10 min or less.

[0098] In view of the good performance as a compatibilizer, the fluoropolymer in the fluoropolymer segment is preferably the same type as the fluororesin added separately from the compatibilizer.

[0099] Examples of the non-fluoropolymer in the non-fluoropolymer segment include those described above for the super engineering plastic resin, and the preferred forms are also the same.

[0100] The functional compound is not particularly limited as long as it is a compound having a functional group, and may be a polymer, an oligomer, or a low molecular weight compound other than these (for example, a monomer). The functional compound is preferably a compound having two or more functional groups.

[0101] The functional compound may be, for example, a monomer capable of forming an amorphous super engineering plastic resin. The monomer is preferably at least one selected from the group consisting of carboxyl group-containing compounds, amines, anhydrides, hydroxyl group-containing compounds, epoxy group-containing compounds, sulfhydryl group-containing compounds, siloxanes, and oxazoline group-containing compounds, more preferably at least one selected from the group consisting of acid anhydrides and diamines, even more preferably at least one selected from the group consisting of 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 4,4'-oxydianiline (ODA), and particularly preferably a combination of 6FDA and ODA. The functional compound may also be a (co)polymer thereof.

[0102] In the compatibilizer, the functional compound may or may not be bonded to a block polymer or a graft polymer, but is preferably bonded. That is, the compatibilizer preferably contains a block polymer or a graft polymer in which a fluoropolymer segment, a non-fluoropolymer segment, and a functional compound are bonded. The compatibilizer may contain a functional compound bonded to the block polymer or graft polymer and a functional compound not bonded to the block polymer or graft polymer.

[0103] In the above compatibilizer, the content of the fluoropolymer segment is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 70% by mass or more, and is preferably 95% by mass or less, more preferably 90% by mass or less, even more preferably 85% by mass or less.

[0104] In the above compatibilizer, the content of the non-fluoropolymer segment is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 13% by mass or more, and is preferably 50% by mass or less, more preferably 40% by mass or less, even more preferably 30% by mass or less.

[0105] In the above compatibilizer, the content of the functional group compound is preferably 1% by mass or more, more preferably 3% by mass or more, even more preferably 4% by mass or more, and is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 10% by mass or less.

[0106] In the resin composition of the present disclosure, the content of the compatibilizer is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, and is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less.

[0107] The compatibilizer can be prepared by, for example, Step 1, in which the fluoropolymer is kneaded using a twin-screw extruder or the like to apply shear to adjust the amount of terminal functional groups and MFR of the fluoropolymer, and Step 2, in which the fluoropolymer obtained after Step 1 is kneaded with a non-fluoropolymer and a functional compound.

[0108] In order to be able to adjust the amount of terminal functional groups and MFR within a favorable range, the kneading in step 1 is preferably carried out at a kneading temperature of 200 to 400° C., for a kneading time of 1 to 120 minutes, and at a rotation speed of 100 to 3000 rpm.

[0109] In step 2, the functional compound may be added in portions. This prevents aggregation of the functional compound, resulting in a compatibilizer with excellent dispersion stability. For example, when using 6FDA and ODA in combination, 6FDA may be added first and kneaded, followed by the addition of ODA. Adding ODA later can prevent degradation of PEI and other components caused by ODA. From a similar viewpoint, when 6FDA and ODA are used in combination, they may be reacted in advance and the resulting polyamic acid may be added. From the viewpoint of reactivity, the polyamic acid is preferably a dimer or an oligomer.

[0110] In the above compatibilizer, the non-fluoropolymer segment is composed of a different type of monomer from that of the super engineering plastic resin. In this specification, when A and B are composed of different types of monomers, it is sufficient that at least a monomer not used in A (hereinafter also referred to as a different monomer) is used in B, and the different monomer may be used in B together with the monomer used in A. For example, when the super engineering plastic resin is a type I liquid crystal polymer biphenol / benzoic acid / parahydroxybenzoic acid (POB) copolymer, it is sufficient that the non-fluoropolymer segment uses at least a monomer (different monomer) different from biphenol, benzoic acid, and parahydroxybenzoic acid, and biphenol, benzoic acid, and parahydroxybenzoic acid may be used together with the different monomer.

[0111] In the non-fluoropolymer segment, the content of repeating units derived from different monomers is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more. There is no particular upper limit, and it may be 100% by mass.

[0112] The resin composition of the present disclosure preferably contains an oxazoline group-containing compound, which causes a crosslinking reaction via the oxazoline group-containing compound, thereby improving mechanical strength.

[0113] The oxazoline group-containing compound is not particularly limited as long as it has an oxazoline group, and may be a polymer, an oligomer, or any other low molecular weight compound. Specific examples of the oxazoline group-containing compound include low molecular weight oxazoline group-containing compounds such as 2-vinyl-2-oxazoline, 4-methyl-2-vinyl-2-oxazoline, 5-methyl-2-vinyl-2-oxazoline, 4-ethyl-2-vinyl-2-oxazoline, 5-ethyl-2-vinyl-2-oxazoline, 4,4-dimethyl-2-vinyl-2-oxazoline, 4,4-diethyl-2-vinyl-2-oxazoline, 4,5-dimethyl-2-vinyl-2-oxazoline, 4,5-diethyl-2-vinyl-2-oxazoline, 2-isopropenyl-2-oxazoline, 4-methyl-2-isopropenyl-2-oxazoline, 5-methyl-2-isopropenyl-2-oxazoline, 4-ethyl-2-isopropenyl-2-oxazoline, 5-ethyl-2-vinyl-2-oxazoline, Examples of the oxazoline group-containing polymer include 4,4-dimethyl-2-isopropenyl-2-oxazoline, 4,4-diethyl-2-isopropenyl-2-oxazoline, 4,5-dimethyl-2-isopropenyl-2-oxazoline, 4,5-diethyl-2-isopropenyl-2-oxazoline, 1,3-phenylbisoxazoline [1,3-PBO], and 1,4-phenylbisoxazoline [1,4-PBO]. Examples of the oxazoline group-containing polymer include homopolymers of the above-mentioned low molecular weight compounds containing oxazoline groups, such as poly-2-vinyl-2-oxazoline [Pvozo] and poly-2-isopropenyl-2-oxazoline [Pipovo], as well as copolymers of the above-mentioned low molecular weight compounds containing oxazoline groups with other monomers. These may be used alone or in combination of two or more. Among these, low molecular weight compounds are preferred, 1,3-PBO and 1,4-PBO are more preferred, and 1,3-PBO is even more preferred, because they have an excellent effect of improving mechanical strength.

[0114] In view of the excellent effect of improving mechanical strength, the oxazoline group-containing polymer preferably contains at least one selected from the group consisting of repeating units derived from 2-vinyl-2-oxazoline and repeating units derived from 2-isopropenyl-2-oxazoline, more preferably at least one selected from the group consisting of Pvozo and Pipovo, and even more preferably Pvozo. The oxazoline group-containing polymer is also preferably a copolymer of 2-vinyl-2-oxazoline or 2-isopropenyl-2-oxazoline with another monomer, more preferably a copolymer of 2-vinyl-2-oxazoline or 2-isopropenyl-2-oxazoline with an acrylic monomer, and even more preferably a copolymer of 2-isopropenyl-2-oxazoline with an acrylic monomer.

[0115] In the oxazoline group-containing polymer, the oxazoline group may be introduced at a terminal, at a side chain, or at both a terminal and a side chain, but it is preferable that the oxazoline group is introduced at least at a terminal.

[0116] The oxazoline group-containing polymer may have a branched structure. When the oxazoline group-containing polymer has a branched structure, the oxazoline group may be contained in the main chain, the branched chain, or both the main chain and the branched chain, but it is preferable that at least the main chain has the oxazoline group, and it is more preferable that the terminal of the main chain has the oxazoline group.

[0117] The molecular weight of the oxazoline group-containing polymer is preferably 2,000 or more, more preferably 5,000 or more, and even more preferably 10,000 or more, and is preferably 400,000 or less, more preferably 300,000 or less, and even more preferably 200,000 or less. The molecular weight of the oxazoline group-containing polymer is a number average molecular weight (Mn), which can be determined based on the PS-converted average molecular weight measured by GPC.

[0118] The oxazoline group-containing compound preferably has a plurality of oxazoline groups (2 or more), more preferably 10 or more, and even more preferably 100 or more. There is no particular upper limit, but it is usually 1000 or less.

[0119] In the resin composition of the present disclosure, the content of the oxazoline group-containing compound is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, and even more preferably 0.1 parts by mass or more, relative to 100 parts by mass of the total amount of components other than the oxazoline group-containing compound, and is preferably 20 parts by mass or less, more preferably 10 parts by mass or less, and even more preferably 5 parts by mass or less.

[0120] The resin composition of the present disclosure may further contain additives, such as fillers, crosslinking agents, antistatic agents, heat stabilizers, foaming agents, foam nucleating agents, antioxidants, surfactants, photopolymerization initiators, anti-wear agents, and surface modifiers, which are commonly used in resins.

[0121] The resin composition of the present disclosure is preferably a solid or liquid at 25°C, and more preferably a solid.

[0122] The method for producing the resin composition of the present disclosure is not particularly limited, and the resin composition can be produced by kneading the materials using a general kneading method such as melt kneading. The equipment used for kneading is also not particularly limited, and general equipment such as a twin-screw extruder or a batch kneader can be used.

[0123] <Molded body> The molded article of the present disclosure is obtained by molding the resin composition of the present disclosure. The molding method is not particularly limited, and conventional methods such as injection molding, blow molding, inflation molding, and vacuum / pressure molding can be used.

[0124] The molded article of the present disclosure can also be suitably used as a dielectric material, particularly as a low-dielectric substrate material (for example, an insulating material). In this specification, the term "low dielectric substrate material" refers to a material having a dielectric constant of 5.0 or less at 25°C and 10 GHz and a dielectric loss tangent of 0.003 or less at 25°C and 10 GHz, more preferably a material having a dielectric constant of 4.0 or less at 25°C and 10 GHz and a dielectric loss tangent of 0.002 or less at 25°C and 10 GHz, and even more preferably a material having a dielectric constant of 3.5 or less at 25°C and 10 GHz and a dielectric loss tangent of 0.0012 or less at 25°C and 10 GHz.

[0125] When the molded article of the present disclosure is used as a dielectric material, its applications are not particularly limited. For example, electrical and electronic components such as connectors, sockets, relay parts, coil bobbins, optical pickups, oscillators, printed wiring boards, and computer-related parts; semiconductor manufacturing process-related parts such as IC trays and wafer carriers; household electrical appliance parts such as VTRs, televisions, irons, air conditioners, stereos, vacuum cleaners, refrigerators, rice cookers, and lighting fixtures; lighting fixture parts such as lamp reflectors and lamp holders; audio product parts such as compact discs and speakers; ferrules for optical cables, telephone parts, facsimile parts, and communication equipment parts such as modems; copier-related parts such as separation claws and heater holders; impellers. It can be used in a wide range of applications, including mechanical parts such as fans, cogwheels, bearings, motor parts and cases, automotive mechanical parts, engine parts, engine room parts, electrical parts, interior parts and other automotive parts, cooking utensils such as microwave cooking pots and heat-resistant tableware, heat insulation and soundproofing materials such as flooring and wall materials, support materials such as beams and pillars, building materials such as roofing materials or civil engineering and construction materials, aircraft, spacecraft, space equipment parts, radiation facility components such as nuclear reactors, marine facility components, cleaning jigs, optical equipment parts, valves, pipes, nozzles, filters, membranes, medical equipment parts and materials, sensor parts, sanitary fixtures, etc.

[0126] The molded article of the present disclosure may be laminated with a metal foil to form a laminate, which is suitable for use as a circuit board, particularly a printed circuit board, a laminated circuit board (multilayer board), or a high-frequency circuit board.

[0127] A high-frequency circuit board is a circuit board that can operate in a high-frequency band. The high-frequency band may be a band of 1 GHz or higher, preferably a band of 3 GHz or higher, and more preferably a band of 5 GHz or higher. There is no particular upper limit, but it may be a band of 100 GHz or lower.

[0128] Examples of metals for the metal foil include aluminum, iron, silver, gold, and ruthenium. Alloys of these metals can also be used. Of these, copper is preferred. Examples of copper that can be used include rolled copper and electrolytic copper.

[0129] The thickness of the laminate is preferably 10 μm to 1000 μm. In the laminate, the molded article of the present disclosure preferably has a thickness of 1 μm to 100 μm. It is preferable that the laminate and the molded body are in the form of a sheet with a substantially uniform thickness, but if there are portions with different thicknesses, the thicknesses are measured at 10 equally spaced points in the longitudinal direction and the average is calculated.

[0130] <Compatibilizer> The compatibilizer of the present disclosure comprises a block copolymer or graft polymer containing a fluoropolymer segment and a non-fluoropolymer segment, and a functional compound, wherein the melt flow rate of the fluoropolymer in the fluoropolymer segment is 60 g / 10 min or more, and the amount of terminal functional groups of the fluoropolymer in the fluoropolymer segment is 10 or more main chain carbon atoms. 6 There are more than 150 pieces per piece.

[0131] The compatibilizer of the present disclosure can improve the compatibility of fluororesins, thereby enabling, for example, the fluororesin and super engineering plastic resin to be mixed uniformly. Furthermore, the compatibilizer of the present disclosure, although composed of a different type of monomer from the super engineering plastic resin, fully exhibits its effect as a compatibilizer, making it possible to uniformly mix the fluororesin and the super engineering plastic resin. That is, the compatibilizer of the present disclosure can be used in a resin composition of a fluororesin and a super engineering plastic resin, and can be applied when the super engineering plastic resin and the non-fluoropolymer segment are composed of different types of monomers.

[0132] Examples of the fluoropolymer in the fluoropolymer segment include those described above as the compatibilizer in the resin composition of the present disclosure, and the same applies to preferred embodiments.

[0133] Examples of the non-fluoropolymer in the non-fluoropolymer segment include those described above as the compatibilizer in the resin composition of the present disclosure, and the same applies to preferred embodiments.

[0134] Although the embodiments have been described above, it will be understood that various changes in form and details can be made without departing from the spirit and scope of the claims. [Example]

[0135] The present disclosure will now be described in more detail with reference to examples, but the present disclosure is not limited to these examples.

[0136] The materials used in the examples are as follows: (Compatibilizer material) PFA-00 (TFE unit / PPVE unit (molar ratio) = 97.9 / 2.1, melting point: 300°C, MFR: 25g / 10min, main chain carbon number: 10 6 Terminal functional group amount per unit: 66 PFA-01 (TFE unit / PPVE unit (molar ratio) = 97.9 / 2.1, melting point: 300°C, MFR: 110g / 10min, main chain carbon number: 10 6 Terminal functional group amount per unit: 383 PEI: (Polyetherimide with amino groups at the ends, thermal decomposition temperature: 529°C, continuous use temperature: 170°C, Tg: 201°C) 6FDA: (4,4'-(hexafluoroisopropylidene)diphthalic anhydride) ODA: (4,4'-oxydianiline) (Fluorine resin) PFA-1 (TFE unit / PPVE unit (molar ratio) = 97.2 / 2.8, melting point: 301°C, MFR: 66g / 10min, main chain carbon number: 10 6 Terminal functional group amount per unit: 247 PFA-2 (TFE unit / PPVE unit (molar ratio) = 97.9 / 2.1, melting point: 300°C, MFR: 25g / 10min, main chain carbon number: 10 6 Terminal functional group amount per unit: 66 (Super engineering plastic resin) PES (Polyethersulfone, amorphous resin, thermal decomposition temperature: 518°C, continuous use temperature: 180°C, Tg: 225°C) PPS (Polyphenylene sulfide, crystalline resin, thermal decomposition temperature: 492°C, continuous use temperature: 220°C, Tg: 90°C) (Oxazoline group-containing compounds) 1,3-PBO (1,3-phenylbisoxazoline, manufactured by Tokyo Chemical Industry Co., Ltd.)

[0137] (Production Example 1) 21.5 g of fluororesin (PFA-00) was placed in a small circulation mixer (DSM's Xplore) and mixed at 390°C, 500 rpm, and 5 minutes to adjust the amount of terminal functional groups and MFR. The prepared fluororesin (PFA-01), polyetherimide (PEI) with amino groups at the ends, and 6FDA were placed in a small circulation mixer and mixed at 370°C, 500 rpm, and for 2 minutes. ODA was then added and the mixture was mixed for a further 3 minutes to obtain a compatibilizer.

[0138] The compatibilizer obtained in Production Example 1 was a block polymer in which a segment (segment A) composed of PFA, a fluoropolymer, a segment (segment B) composed of PEI, a non-fluoropolymer, and a segment (segment C) composed of functional compounds 6FDA and ODA were bonded. The contents of segments A, B, and C were 81.8 mass%, 13.6 mass%, and 4.6 mass%, respectively. The fluoropolymer constituting segment A had an MFR of 110 g / 10 min and a main chain carbon number of 10. 6 The number of terminal functional groups per segment was 383. The non-fluoropolymer constituting segment B had a thermal decomposition temperature of 529°C, a continuous use temperature of 170°C, and a Tg of 201°C.

[0139] Examples 1 to 6, Comparative Examples 1 to 2 The materials were dry blended in the ratios (parts by mass) shown in Tables 1 and 2, then charged into a small circulation extruder and kneaded at 370°C, 500 rpm, and 5 minutes to obtain a resin composition.

[0140] The resulting resin compositions were evaluated by the following methods, and the results are shown in Tables 1 and 2 and Figures 1 to 8.

[0141] (dispersed state) The resin composition was cut perpendicular to the longitudinal direction to obtain a test piece, and the cross section was observed with a confocal laser microscope.

[0142] (dispersibility) The laser microscope image obtained above was analyzed using image analysis software (Image J) to determine the equivalent circle diameter of the dispersed phase. The equivalent circle diameters of 20 dispersed phase particles were then calculated, and the average was taken as the dispersed particle diameter. Dispersed particle diameters of less than 2.5 μm were rated as ◯, and those of 2.5 μm or more were rated as ×.

[0143] (Surface appearance) The appearance of the resin composition was visually inspected, and those with a glossy and smooth surface were marked with a "good" mark, and those with a rough surface were marked with a "bad" mark.

[0144] [Table 1]

[0145] [Table 2]

[0146] Examples 7 to 8, Comparative Example 3 Resin compositions were produced in the proportions (parts by mass) shown in Table 3 in the same manner as in Example 1. The resulting resin composition was molded in a vacuum press under the following conditions to obtain a molded article. Equipment: Manual hydraulic vacuum heating press IMC-46E2-3 (manufactured by Imoto Manufacturing Co., Ltd.) Drying conditions: None Molding temperature: 330℃ (under vacuum) Molding pressure: After putting into the device, apply contact pressure for 1 minute, then increase the pressure to 10 MPa over 2 minutes. Cooling: Water-cooled press at 10 MPa for approximately 17 minutes Dimensions: 100mm x 100mm x t0.3mm Number of pieces produced: 1 each Note: The mirror plate and mold (spacer) were coated with a release agent, sandwiched between stainless steel cloth (cushioning material) and stainless steel plate (5 mm pressure), and heated in a vacuum press at 330°C before use.

[0147] The obtained molded articles were evaluated by the following methods. The resin compositions were also evaluated by the same methods as in Example 1. The results are shown in Table 3.

[0148] (tensile modulus, breaking stress, breaking elongation) Using a tensile testing machine (Tensilon), the test was carried out at a tensile speed of 10 mm / min, and the tensile modulus, breaking stress, and breaking elongation were measured.

[0149] [Table 3]

Claims

1. Contains fluororesin, super engineering plastic resin, and a compatibilizer, the compatibilizer comprises a block polymer or a graft polymer comprising a fluoropolymer segment and a non-fluoropolymer segment, and a functional compound; The resin composition is such that the super engineering plastic resin and the non-fluoropolymer segment are composed of different types of monomers.

2. 2. The resin composition according to claim 1, wherein the fluororesin is a perfluororesin.

3. 3. The resin composition according to claim 1, wherein the fluororesin is at least one selected from the group consisting of tetrafluoroethylene / perfluoro(alkyl vinyl ether) copolymers and tetrafluoroethylene / hexafluoropropylene copolymers.

4. 3. The resin composition according to claim 1, wherein the super engineering plastic resin is at least one selected from the group consisting of liquid crystal polymer, polyetherimide, polyphenylene sulfide, polyaryletherketone, polysulfone, and polyethersulfone.

5. 3. The resin composition according to claim 1, wherein the super engineering plastic resin is at least one selected from the group consisting of polyphenylene sulfide and polyether sulfone.

6. 3. The resin composition according to claim 1, wherein the content of the compatibilizer is 1 to 30% by mass.

7. 3. The resin composition according to claim 1, wherein the content of the compatibilizer is 5 to 20% by mass.

8. 3. The resin composition according to claim 1, wherein the mass ratio of said fluororesin to said super engineering plastic resin is fluororesin / super engineering plastic resin=99 / 1 to 50 / 50.

9. 3. The resin composition according to claim 1, wherein the mass ratio of said fluororesin to said super engineering plastic resin is fluororesin / super engineering plastic resin=90 / 10 to 70 / 30.

10. 3. The resin composition according to claim 1, wherein the fluoropolymer in the fluoropolymer segment has a melt flow rate of 60 g / 10 min or more.

11. 3. The resin composition according to claim 1, wherein the melt flow rate of the fluoropolymer in the fluoropolymer segment is 60 to 300 g / 10 min.

12. The number of terminal functional groups of the fluoropolymer in the fluoropolymer segment is 10 main chain carbon atoms. ６ 3. The resin composition according to claim 1, wherein the number of particles per molecule is 150 or more.

13. The number of terminal functional groups of the fluoropolymer in the fluoropolymer segment is 10 main chain carbon atoms. ６ The resin composition according to claim 1 or 2, wherein the number of particles per particle is 150 to 2000.

14. 3. The resin composition according to claim 1, wherein the fluoropolymer in the fluoropolymer segment is a perfluororesin.

15. 3. The resin composition according to claim 1, wherein the fluoropolymer in the fluoropolymer segment is at least one selected from the group consisting of tetrafluoroethylene / perfluoro(alkyl vinyl ether) copolymer and tetrafluoroethylene / hexafluoropropylene copolymer.

16. 3. The resin composition according to claim 1, wherein the functional compound is a monomer capable of constituting an amorphous super engineering plastic resin.

17. 3. The resin composition according to claim 1, wherein the functional compound is at least one selected from the group consisting of acid anhydrides and diamines.

18. 3. The resin composition according to claim 1, wherein the functional compound is at least one selected from the group consisting of 4,4'-(hexafluoroisopropylidene)diphthalic anhydride and 4,4'-oxydianiline.

19. 3. The resin composition according to claim 1, wherein the glass transition temperature of the non-fluoropolymer in the non-fluoropolymer segment is 180° C. or higher.

20. The resin composition according to claim 1 or 2, wherein the non-fluoropolymer in the non-fluoropolymer segment is at least one selected from the group consisting of liquid crystal polymers, polyetherimides, polyphenylene sulfides, polyaryletherketones, polysulfones and polyethersulfones.

21. The resin composition according to claim 1 or 2, which contains an oxazoline group-containing compound.

22. 3. The resin composition according to claim 1, which is a solid or liquid at 25°C.

23. A molded article made using the resin composition according to claim 1 or 2.

24. a block copolymer or graft polymer comprising a fluoropolymer segment and a non-fluoropolymer segment, and a functional compound; The melt flow rate of the fluoropolymer in the fluoropolymer segment is 60 g / 10 min or more, The number of terminal functional groups of the fluoropolymer in the fluoropolymer segment is 10 main chain carbon atoms. ６ A compatibilizer having 150 or more molecules per molecule.

25. Used in resin compositions of fluororesins and super engineering plastics, The compatibilizer according to claim 24, wherein the super engineering plastic resin and the non-fluoropolymer segment are composed of different types of monomers.

26. The compatibilizer according to claim 24 or 25, wherein the melt flow rate of the fluoropolymer in the fluoropolymer segment is 60 to 300 g / 10 min.

27. The number of terminal functional groups of the fluoropolymer in the fluoropolymer segment is 10 main chain carbon atoms. ６ The compatibilizer according to claim 24 or 25, wherein the number of particles per particle is 150 to 2000.

Images