Cutting device

Abstract

To provide a cutting device which can substantially reduce time for dressing to zero.SOLUTION: A cutting device includes a dressing mechanism 20A for dressing a cutting blade 83. The dressing mechanism 20A includes: dressing wire contact means 87 which places a tip of a dressing wire in contact with a cutting edge of a cutting blade 83; and dressing wire feeding means 24 which feeds the dressing wire to the dressing wire contact means 87.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cutting device including a chuck table for holding a workpiece, and cutting means having a rotatable cutting blade with cutting edges arranged on the outer periphery for cutting the workpiece held on the chuck table. [Background technology]

[0002] Wafers, on the surface of which multiple devices such as ICs and LSIs are formed along division lines, are separated into individual device chips by a cutting machine and used in electrical equipment such as mobile phones and personal computers.

[0003] The cutting device is configured to include a chuck table that holds the wafer, cutting means equipped with a rotatable cutting blade that cuts the wafer held on the chuck table, and feeding means that feeds the chuck table and the cutting means relative to each other for processing, and can divide the wafer into individual device chips with high precision (see, for example, Patent Document 1).

[0004] In conventional cutting devices, when the cutting ability of a cutting blade decreases, a dressing board is brought into the cutting device, placed on a chuck table and held by suction in order to sharpen or shape the cutting blade, and the cutting edge of the cutting blade is cut into the dressing board to perform dressing to sharpen or shape the cutting blade.After the dressing is completed, the dressing board is taken out of the chuck table and stored in a designated storage location, which is a time-consuming process.

[0005] Furthermore, if the dressing board is curved, it becomes difficult to properly hold it by suction on the chuck table, which poses the problem that quality control is required to prevent the dressing board from curving.

[0006] Furthermore, a cutting device has been proposed that includes a dedicated table for holding a dressing board, separate from a chuck table for holding a workpiece such as a wafer (see Patent Document 2). However, as with the above-mentioned conventional technology, if the dressing board is curved, it is difficult to hold it on the dedicated table, and there is also the problem that a used dressing board must be replaced with a new one, which is time-consuming. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-203429 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-216324 Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been made in consideration of the above facts, and its main technical object is to provide a cutting device that performs dressing when the cutting ability of a cutting blade has decreased, which solves the problems that, when performing dressing, it is necessary to transport a dressing board into the cutting device, place it on the chuck table and hold it by suction, and then, after dressing is performed, it is necessary to transport the dressing board from the chuck table and store it in a designated storage location, which is time-consuming; it is difficult to hold the dressing board on the chuck table if it is curved; and it is necessary to replace a used dressing board with a new one, which is time-consuming. [Means for solving the problem]

[0009] In order to solve the above-mentioned main technical problem, according to the present invention, there is provided a cutting device including a chuck table for holding a workpiece, and cutting means having a rotatable cutting blade with cutting edges arranged on the outer periphery for cutting the workpiece held on the chuck table, the cutting device also having a dressing mechanism for sharpening the cutting blade, the dressing mechanism having dressing wire contact means for bringing the tip of a dressing wire into contact with the cutting edge of the cutting blade, and dressing wire feeding means for feeding the dressing wire to the dressing wire contact means.

[0010] The dressing wire feeding means preferably includes a storage section for storing a dressing element in which dressing grains are kneaded with a fluid binder, and a tube for feeding the dressing element from the storage section to the dressing wire contacting means, and the dressing wire contacting means preferably includes a dressing wire generating section for cooling and solidifying the fed dressing element to generate a dressing wire. The dressing wire feeding means preferably also includes a reel around which a dressing wire formed into a wire shape by kneading dressing grains with a thermoplastic resin is wound, and a dressing wire feeding section for drawing out the dressing wire from the reel and feeding it to the dressing wire contacting means. The fluid binder preferably includes a thermoplastic resin or a gelling agent, and the dressing grains preferably include silicon carbide, alumina, or diamond. [Effects of the Invention]

[0011] The cutting device of the present invention includes a chuck table for holding a workpiece, and cutting means having a rotatable cutting blade with a cutting edge disposed on the periphery for cutting the workpiece held on the chuck table, and a dressing mechanism for sharpening the cutting blade, the dressing mechanism including a dressing wire contact means for bringing the tip of a dressing wire into contact with the cutting edge of the cutting blade, and a dressing wire feed means for feeding the dressing wire to the dressing wire contact means. This eliminates the need to place a dressing board on the chuck table, hold it by suction, and then remove the dressing board after dressing, which is time-consuming, and also eliminates the problem of the dressing board being bent and unable to be properly held on the chuck table. Furthermore, there is no need to perform dressing separately from cutting, which essentially reduces the time required for dressing to zero, and there is no need to provide a dedicated table for holding the dressing board. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is an overall perspective view of a cutting device according to an embodiment of the present invention; [Figure 2] 2A and 2B are a perspective view and an exploded perspective view of a cutting means disposed in the cutting device shown in FIG. 1; [Figure 3] 3 is a conceptual diagram of a dressing mechanism disposed in the cutting means shown in FIG. 2. FIG. [Figure 4] 2 is a perspective view of a wafer 10 to be processed by the cutting device shown in FIG. [Figure 5] FIG. 1(a) is a perspective view showing a mode of performing cutting and dressing, and FIG. 1(b) is a side view of the cutting blade during dressing shown in FIG. 1(a) and a cross-sectional view of the dressing wire contact means. [Figure 6] FIG. 10 is a perspective view of another embodiment of a dressing mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0013] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a cutting device configured based on the present invention will be described in detail with reference to the accompanying drawings.

[0014] 1 shows an overall perspective view of a cutting device 1 of this embodiment. The illustrated cutting device 1 includes a chuck table 7 that holds a workpiece, and cutting means 8 that is rotatably equipped with a cutting blade 83 that has cutting edges arranged on its outer periphery for cutting the workpiece held on the chuck table 7, and is also equipped with a dressing mechanism (described in detail later) that dresses the cutting blade 83. The workpiece to be processed by the illustrated cutting device 1 is, for example, a semiconductor wafer 10, which is supported on an annular frame F by adhesive tape T.

[0015] In addition to the above-described configuration, as shown in FIG. 1, the cutting device 1 includes a housing 2 having an approximately rectangular parallelepiped shape, a cassette 4 placed on a cassette table 4a that can be raised and lowered, a transfer means 3 that transfers the wafer 10 held in a frame F from the cassette 4 to a temporary storage table 5, a transfer means 6 having a swivel arm that transfers the wafer 10 transferred to the temporary storage table 5 to the holding surface 7a of the chuck table 7, an alignment means 9 that images the wafer 10 held on the chuck table 7 and detects the processing position where it is cut by the cutting blade 83 of the cutting means 8, a cleaning device 11 (details omitted) that cleans the processed wafer 10 that is transferred from the transfer position where the chuck table 7 is positioned in FIG. 1, a cleaning and transfer means 12 that transfers the wafer 10 to the cleaning device 11, and a control means not shown.

[0016] The holding surface 7a of the chuck table 7 is a substantially horizontal XY plane defined by the X-axis direction and the Y-axis direction perpendicular to the X-axis direction. The holding surface 7a is made of a breathable material, and is connected to a suction means (not shown). Activating the suction means generates negative pressure on the holding surface 7a. A plurality of clamps 7b (four in the illustrated embodiment) are evenly spaced around the periphery of the chuck table 7 to grip a frame F that supports the wafer 10. Inside the housing 2, there are also provided an X-axis feed means for moving the chuck table 7 in the X-axis direction, a Y-axis feed means for moving the cutting means 8 in the Y-axis direction, a Z-axis feed means for moving the cutting means 8 in the Z-axis direction (up and down), a rotary drive means for rotating the chuck table 7, and other components (none of which are shown).

[0017] The control means is configured by a computer and includes a central processing unit (CPU) that performs calculations according to a control program, a read-only memory (ROM) that stores the control program, etc., a readable and writable random access memory (RAM) that temporarily stores detected values, calculation results, etc., an input interface, and an output interface (details are not shown in the drawings). Each operating unit of the cutting device 1 is connected to and controlled by the control means, and cutting processing and dressing, which will be described later, are performed.

[0018] 2, the cutting means 8 including a part of the dressing mechanism disposed in the cutting device 1 will be described in more detail. A perspective view of the cutting means 8 is shown in the lower part of Fig. 2, and an exploded view of the cutting means 8 is shown in the upper part.

[0019] As shown in the lower part of Figure 2, the cutting means 8 includes a spindle housing 81, a blade cover 82 attached to the tip of the spindle housing 81, a spindle 84 supported by the spindle housing 81 for rotation about the Y-axis and equipped with a cutting blade 83 with cutting edges arranged around its outer periphery, a pair of cutting water supply nozzles 85 (the opposite cutting water supply nozzle 85 is not visible) that supply cutting water from the front and back sides of the cutting blade 83 to the area where cutting is performed by the cutting blade 83, and a spindle motor (not shown) that rotates the spindle 84. The blade cover 82 is provided with a pair of cutting water inlets 86 that introduce cutting water into the pair of cutting water supply nozzles 85, and is also provided with a dressing wire contact means 87 that contacts the tip of a dressing wire (described later) with the cutting edge of the cutting blade 83. The dressing wire contact means 87 is a hollow pipe and can be made of, for example, stainless steel, which has excellent thermal conductivity and corrosion resistance.

[0020] 2, the blade cover 82 includes a fixed cover 82a fixed to the tip of the spindle housing 81, a detachable cover 82b attached to the tip of the fixed cover 82a via a screw 88a, and a blade detection block 82c attached to the top of the fixed cover 82a via a screw 88b for detecting the state of the cutting edge of the cutting blade 83. A recessed groove 82d is formed on the opposing surfaces of the fixed cover 82a and the detachable cover 82b to accommodate one end 87a of the dressing wire contact means 87. By accommodating the dressing wire contact means 87 in the recessed groove 82d and combining and assembling the fixed cover 82a and the detachable cover 82b, one end 87a of the dressing wire contact means 87 is positioned in proximity to the cutting edge of the cutting blade 83 and is held by the blade cover 82.

[0021] 3 shows a dressing mechanism 20A including a dressing wire contact means 87 disposed in the cutting means 8 and a dressing wire feed means 21 that feeds the dressing wire to the dressing wire contact means 87. The dressing feed means 21 includes a storage section 22 that stores dressing members 30 each having a fluid binder and dressing abrasive grains mixed therein, and a tube 23 that feeds the dressing members 30 from the storage section 22 in the direction indicated by arrow R1. The storage section 22 is provided with a heater (e.g., a Peltier element) 22a that heats the dressing members 30 stored in the storage section 22, and a vibration imparting means (e.g., a piezoelectric element) 22b that imparts vibration to the storage section 22 to agitate the dressing members 30 stored in the storage section 22, as needed, in order to maintain the fluidity of the stored dressing members 30.

[0022] As shown in Fig. 3, the dressing wire contact means 87 of this embodiment is provided with a dressing wire generating unit 25 that generates a dressing wire by cooling and solidifying the dressing member 30 delivered by the tube 23. The dressing wire generating unit 25 can be formed, for example, by a Peltier element, and is disposed so as to surround the other end 87b side of the dressing wire contact means 87. When the dressing member 30 passes through the dressing wire generating unit 25, the fluid dressing member 30 solidifies, generating a dressing wire 30' (see Fig. 5(b)) that is brought into contact with the cutting blade 83 by the dressing wire contact means 87. In addition, the tube 23 constituting the dressing feed means 21 of this embodiment is provided with a dressing wire feed means 24 including a pump 24a that pressure-feeds the dressing member 30 toward the dressing wire contact means 87 and an on-off valve 24b that switches the tube 23 between an open state and a closed state, and the dressing member 30 can be pressure-feed toward the dressing wire contact means 87 at any timing and at any flow rate.

[0023] The dressing member 30 stored in the storage section 22 is made by mixing dressing abrasive grains with a fluid binder, and the binder can be selected from, for example, a thermoplastic resin or a gelling agent, and the dressing abrasive grains are made up of abrasive grains selected from silicon carbide, alumina, and diamond.

[0024] As the thermoplastic resin, it is preferable to use any one of polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, polyurethane, ABS resin, AS resin, acrylic resin, polylactic acid, polyetherimide, polyamide nylon, polyacetal, polycarbonate, modified polyphenylene ether, polyethylene terephthalate, polybutylene terephthalate, cyclic polyolefin, polyphenylene sulfide, polytetrafluoroethylene, polysulfone, polyethersulfone, amorphous polyarylate, liquid crystal polymer, polyetheretherketone, thermoplastic polyimide, and polyamideimide.

[0025] As the gelling agent, it is preferable to use, for example, any one of pectin, guar gum, xanthan gum, tamarind gum, carrageenan, propylene glycol, carboxymethyl cellulose, gelatin, and agar.

[0026] In the configuration of the above-described embodiment, the dressing wire feeding means 24 including the pump 24a and the on-off valve 24b is disposed on the tube 23, and the dressing member 30 stored in the storage section 22 is fed toward the dressing wire contacting means 87. However, the present invention is not limited to this, and other means may be used for feeding. For example, instead of disposing the pump 24a on the tube 23, the dressing wire feeding means may be configured by sealing the interior of the storage section 22 and disposing an air pump that introduces high-pressure air into the interior of the storage section 22. By pressurizing the interior of the storage section 22, the dressing member 30 stored in the storage section 22 may be fed toward the dressing wire contacting means 87 by the action of the high-pressure air.

[0027] The cutting device 1 of this embodiment has roughly the configuration as described above, and a specific description will be given of how the cutting edge of the cutting blade 83 of the cutting means 8 is dressed by the dressing mechanism 20A configured based on the present invention.

[0028] The wafer 10, which is the workpiece of the above-described cutting device 1, is a semiconductor wafer, for example, 200 μm thick and 300 mm in diameter, and as shown in Fig. 4, a plurality of devices D are formed on the surface 10a, partitioned by planned division lines L. The wafer 10 is housed with the surface 10a facing upward in the center of an opening Fa of an annular frame F that is capable of housing the wafer 10, and a tape T is attached to the backsides of the wafer 10 and frame F to integrate them.

[0029] When cutting the wafer 10, the wafer 10 supported by the frame F is carried out of the cassette 4 by the carry-in / out means 3 onto the temporary placement table 5 and aligned. Next, the frame F is sucked by the transport means 6, and is transported and placed on the holding surface 7a of the chuck table 7 positioned at the carry-in / out position shown in Fig. 1, and the suction means is operated to generate a negative pressure on the holding surface 7a of the chuck table 7 to suck the wafer 10, and the clamps 7b grip the frame F to hold the wafer 10.

[0030] Once the wafer 10 is held on the chuck table 7 as described above, the X-axis feed means is operated to position the wafer 10 directly below the alignment means 9, an image of the wafer 10 is taken, and the position of the planned dividing line L to be processed is detected.

[0031] 5(a), when dressing the cutting edge of the cutting blade 83 attached to the cutting means 8 while cutting the wafer 10 with the cutting means 8, the control means operates the dressing mechanism 20A, and the dressing member 30 sent out from the reservoir 22 flows in the tube 23 in the direction indicated by the arrow R1 and is sent out toward the dressing wire contacting means 87. The dressing wire contacting means 87 is provided with the dressing wire generating unit 25, which cools and solidifies the dressing member 30 to generate the dressing wire 30'.

[0032] With the dressing mechanism 20A operating as described above, the predetermined dividing line L detected by the alignment means 9 is aligned in the X-axis direction, and the spindle motor is operated to rotate the cutting blade 83 at high speed in the direction indicated by arrow R2. Next, the X-axis feed means is operated to move the chuck table 7 in the X-axis direction until it is positioned directly below the cutting means 8. Then, the Y-axis feed means is operated to adjust the position of the cutting means 8 in the Y-axis direction, and the cutting blade 83 is positioned on the dividing line L to be machined, as shown in FIG. 5(a).

[0033] Next, the Z-axis feed means is operated to cut into the planned dividing line L aligned in the X-axis direction to a predetermined depth slightly exceeding the thickness of the wafer 10 (200 μm), as shown in FIG. 5(a), and the X-axis feed means is operated to feed the wafer 10 in the X-axis direction to form a cutting groove 100 along the planned dividing line L.

[0034] Furthermore, the Y-axis feed means is operated to index and feed the cutting blade 83 of the cutting means 8 in the Y-axis direction according to the distance (e.g., 5 mm) between the dividing line L along which the cutting groove 100 has been formed and an uncut dividing line L adjacent in the Y-axis direction but on which no cutting groove 100 has been formed. The cutting blade 83 is positioned at the uncut dividing line L and fed for cutting, and cutting is performed in the same manner as above to form the cutting groove 100. By repeating this process, the cutting grooves 100 are formed along all dividing lines L along the X-axis direction. Next, the chuck table 7 holding the wafer 10 is rotated 90 degrees to align the direction perpendicular to the direction in which the cutting groove 100 was previously formed with the X-axis direction. The above-mentioned cutting process is then performed on all dividing lines L newly aligned in the X-axis direction to form cutting grooves 100 along all dividing lines L formed on the wafer 10, and the wafer 10 is divided into individual device chips.

[0035] 5(b) (for convenience of explanation, only one end 87a of the dressing wire contact means 87 and the area where the cutting blade 83 is disposed are shown, and other components are omitted), the tip of the cutting edge of the cutting blade 83, which is rotating at high speed in the direction indicated by arrow R2, is brought into contact with the dressing wire 30' that has been solidified by the dressing wire contact means 87 and is fed out from one end 87a, thereby dressing the cutting edge of the cutting blade 83. Note that, when this dressing is performed, part of the dressing wire 30' is scattered, but is washed away and collected by cutting water sprayed from the cutting water supply nozzle 85.

[0036] The above-described dressing can be instructed by the operator at any timing. For example, the operator can inspect the state of the cut groove 100 formed in the wafer 10 by the cutting blade 83, and based on the inspection results, determine that the time has come to perform dressing on the cutting blade 83, and instruct the control means to perform dressing. The control means can also notify the operator that the time has come to perform dressing on the cutting blade 83, and prompt the operator to perform dressing. The control means can determine that the time has come to perform dressing on the cutting blade 83, for example, by the number of wafers that have been cut reaching a predetermined number, the time for which cutting has been performed reaching a predetermined time, etc., and notify the operator.

[0037] As described above, once the wafer 10 has been divided into individual device chips by the cutting means 8, the wafer 10 is carried out from the chuck table 7 positioned at the carry-in / out position by the cleaning / carry-out means 12 and transported to the cleaning device 11 where it is cleaned and dried. Next, the wafer 10 is transported from the cleaning device 11 to the temporary placement table 5 by the transport means 6, and the carry-in / carry-out means 3 is operated to store the wafer 10 at a predetermined position in the cassette 4, thereby completing the cutting process on the wafer 10.

[0038] According to the above-described cutting device 1, while the cutting blade 83 is used to cut the predetermined dividing line L of the wafer 10 to form the cut groove 100, the cutting blade 83 can be brought into contact with the dressing wire 30′ fed out from one end 87a of the dressing wire contact means 87 to perform dressing. This eliminates the need to perform dressing using a dressing board separately from the cutting process, and the time required for dressing can be essentially reduced to zero. In other words, this eliminates the problem of the time-consuming process of placing the dressing board on the chuck table 7, holding it by suction, performing dressing, and then removing the dressing board after dressing. Furthermore, it also eliminates the problem of the dressing board bending and not being able to be properly held on the chuck table 7. Furthermore, it also eliminates the need to provide a dedicated table for holding the dressing board.

[0039] According to the cutting device 1 of this embodiment, it is not necessary to perform dressing of the cutting blade 83 simultaneously with cutting of the wafer 10. It is also possible to perform only dressing by operating the dressing mechanism 20A and rotating the cutting blade 83 at high speed while cutting is not being performed. Even in this case, there is no need to place the dressing board on the chuck table 7 and hold it by suction to perform dressing, and there is no need to remove the dressing board after dressing is performed. Furthermore, there is no problem that the dressing board is bent and cannot be properly held on the chuck table 7, making it impossible to perform dressing, and there is no need to provide a dedicated table to hold the dressing board.

[0040] Furthermore, in the cutting device 1 of this embodiment, when cutting processing is being performed on the wafer 10 without dressing being performed, dressing can be started and ended without interrupting the cutting processing, providing an extremely high degree of freedom in starting and ending dressing.

[0041] The dressing mechanism of the present invention is not limited to the above-described dressing mechanism 20 A. For example, instead of the dressing mechanism 20 A, another dressing mechanism 20 B shown in FIG.

[0042] The dressing mechanism 20B shown in FIG. 6 does not include the dressing wire feed means 24, but does include a dressing wire feed means 40. The illustrated dressing wire feed means 40 includes a reel 41 around which a dressing wire 31, formed into a wire by mixing dressing abrasive grains with a thermoplastic resin, is wound, and a dressing wire feed unit 42 that feeds the dressing wire 31 from the reel 41 toward the dressing wire contact means 87. When this dressing mechanism 20B is installed, the dressing wire generation unit 25 installed in the above-mentioned dressing mechanism 20A is not necessary because the dressing wire 31 is pre-solidified. The thermoplastic resin constituting the dressing wire 31 and the dressing abrasive grains mixed with the thermoplastic resin can be selected and used from the thermoplastic resins and dressing abrasive grains disclosed in the description of the above-mentioned dressing mechanism 20A.

[0043] The dressing wire feed unit 42 includes a drive motor 42a, a drive roller 42c disposed at the tip of a rotation shaft 42b of the drive motor 42a, and a guide roller 43 that contacts the drive roller 42c and is driven to rotate by the drive roller 42c. The drive motor 42a is controlled by the control means. The control means operates the drive motor 42a to rotate the drive roller 42c in the direction indicated by arrow R3, which causes the guide roller 43 to rotate in the direction indicated by arrow R4. The dressing wire 31 sandwiched between the drive roller 42c and the guide roller 43 is pulled out in the direction indicated by arrow R6. The reel 41 rotates in the direction indicated by arrow R5, and the dressing wire 31 is introduced from the other end 87b of the dressing wire contact means 87. The dressing wire 31 introduced from the other end 87b is sent out from one end 87a of the dressing wire contact means 87 toward the cutting edge of the cutting blade 83, similar to the dressing wire 30' described based on Figure 5(b), and can dress the cutting blade 83 in the same way as the above-mentioned dressing mechanism 20A, and can obtain the same effects as the above-mentioned dressing mechanism 20A. [Explanation of symbols]

[0044] 1:Cutting device 2: Housing 3: Carrying in / out means 4: Cassette 5: Temporary table 6: Means of transport 7: Chuck table 7a: Holding surface 7b: Clamp 8:Cutting means 81: Spindle housing 82: Blade cover 82a: Fixed cover 82b: Detachable cover 82c: Blade detection block 82d: Groove 83: Cutting blade 84: Spindle 85: Cutting water supply nozzle 86: Cutting water inlet 87: Dressing wire contact means 87a: One end 87b: Other end 9: Alignment means 10: Wafer 11: Cleaning equipment 12: Cleaning transport means 20A, 20B: Dressing mechanism 21: Dressing feeding means 22: Storage section 22a: Heater 22b: Vibration applying means 23: Tube 24: Dressing wire feeding means 24a: Pump 24b: On-off valve 25: Dressing wire generating means 30: Dressing material 30': Dressing wire 31: Dressing wire 40: Dressing wire feeding means 41: Reel 42: Dressing wire feed section 42a: Drive motor 42b: Rotation axis 42c: Drive roller 43: Guide roller 100: Cutting groove D:Device F: Frame L: Planned division line

Claims

1. A cutting device including a chuck table for holding a workpiece, and cutting means having a rotatable cutting blade with a cutting edge disposed on the outer periphery for cutting the workpiece held on the chuck table, Equipped with a dressing mechanism that sharpens the cutting blade, The dressing mechanism is a cutting device that includes a dressing wire contact means that brings the tip of the dressing wire into contact with the cutting edge of the cutting blade, and a dressing wire feeding means that feeds the dressing wire to the dressing wire contact means.

2. the dressing wire feeding means includes a storage section for storing a dressing member in which dressing abrasive grains are kneaded with a fluid binder, and a tube for feeding the dressing member from the storage section to the dressing wire contact means, 2. The cutting device according to claim 1, wherein the dressing wire contact means comprises a dressing wire generating section that cools and solidifies the delivered dressing member to generate the dressing wire.

3. The cutting device described in claim 1, wherein the dressing wire feeding means comprises a reel wound with a dressing wire formed into a wire shape by kneading dressing abrasive grains into a thermoplastic resin, and a dressing wire feeding unit that pulls out the dressing wire from the reel and feeds it to the dressing wire contact means.

4. 3. The cutting device according to claim 2, wherein the fluid binder contains either a thermoplastic resin or a gelling agent, and the dressing abrasive grains contain either silicon carbide, alumina, or diamond.

Images