Display panel, manufacturing method of display panel, and electronic apparatus

The display panel addresses water vapor intrusion by using an inorganic pixel defining layer and isolation structure to cover and protect the organic layer, enhancing manufacturing reliability.

JP2025155906APending Publication Date: 2025-10-14HEFEI VISIONOX TECH CO LTD +1
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Patent Information

Application Number
JP2025023434
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-29
Filing Date
2025-02-17
Publication Date
2025-10-14

AI Technical Summary

Technical Problem

Existing display panels are susceptible to water vapor intrusion through overlap holes, affecting the quality and yield of subsequent film layer manufacturing.

Method used

The display panel design includes a pixel defining layer made of inorganic material that covers the side of the organic layer facing the overlap hole, and an isolation structure that extends into the hole to contact the wiring, preventing direct exposure and reducing water vapor ingress.

Benefits of technology

This design effectively prevents water vapor from entering the organic layer, ensuring the integrity of subsequent film layers and improving manufacturing yield.

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Abstract

To provide a display panel with high-yield, a manufacturing method of the display panel, and an electronic device.SOLUTION: A display panel includes a base 111, a wiring layer 113, an organic layer 114, and a pixel definition layer 120. The wiring layer 113 includes a first wiring, the organic layer 114 includes an overlap hole 901 exposing at least a part of the first wiring. The pixel definition layer 120 extends into an overlap hole 901 and covers a side of the organic layer 114 facing the overlap hole 901. The portion of the pixel definition layer 120 located in the overlap hole 901 exposes at least a portion of the first wiring. The pixel defining layer 120 in the overlap hole 901 is disposed so as to cover the side surface of the organic layer 114 facing the overlap hole 901, thereby preventing the organic layer 114 from being exposed in the overlap hole 901 and reducing a risk of water vapor entering the organic layer 114 in the overlap hole 901.SELECTED DRAWING: Figure 4
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Description

[Technical Field]

[0001] The present application relates to display technology, and more particularly to a display panel, a method for manufacturing a display panel, and an electronic device. [Background technology]

[0002] With the continuous development of display technology, the application range of display panels becomes wider and wider, and people's requirements for display panels become higher and higher. Summary of the Invention [Problem to be solved by the invention]

[0003] However, the quality of existing display panels can be improved. [Means for solving the problem]

[0004] In order to overcome the above-mentioned drawbacks of the existing technology, the present application aims to provide a display panel, which comprises: With the base, a wiring layer located on the base side; an organic layer located on a side of the wiring layer away from the base; a pixel defining layer located on a side of the organic layer away from the base; the wiring layer includes a first wiring, the organic layer includes an overlap hole that exposes at least a portion of the first wiring; The pixel definition layer extends into the overlap hole and covers a side of the organic layer facing the overlap hole, and a portion of the pixel definition layer located in the overlap hole exposes at least a portion of the first wiring.

[0005] In some possible embodiments, the material of the pixel-defining layer comprises an inorganic material.

[0006] In some possible embodiments, the display panel further includes an isolation structure located on a side of the organic layer away from the base, the isolation structure extending into the overlap hole and contacting the first wiring.

[0007] In some possible embodiments, the display panel includes a display area, a pixel definition layer located in the display area includes a pixel aperture, the isolation structure is provided on a side of the pixel definition layer away from the base, the isolation structure located in the display area includes an isolation aperture, and an orthogonal projection of the pixel aperture at the base lies within an orthogonal projection of the isolation aperture at the base.

[0008] In some possible embodiments, the organic layer comprises a planarization layer; Preferably, the display area of ​​the display panel further comprises: a first electrode located on a side of the planarization layer away from the base and at least partially located within the pixel opening; a light-emitting unit at least partially located within the pixel opening and located on a side of the first electrode away from the base and in contact with the first electrode; a second electrode at least partially located within the pixel opening and located on a side of the light-emitting unit away from the base, the second electrode contacting the light-emitting unit.

[0009] In some possible embodiments, the second electrode contacts the isolation structure.

[0010] The present application further provides: With the base, a wiring layer located on the base side and including a first wiring; an organic layer located on a side of the wiring layer away from the base and including an overlap hole exposing at least a portion of the first wiring; a first material layer that covers a side of the organic layer facing the overlap hole and exposes the first wiring, the first material layer having a water absorption property lower than that of the organic layer; an auxiliary electrode located on a side of the first material layer away from the base and extending into the overlap hole to contact the first wiring, is provided.

[0011] In some possible embodiments, the display panel includes a display area and an overlap area located on the side of the display area, and the overlap hole is located in the overlap area.

[0012] In some possible embodiments, the material of the first material layer comprises an inorganic material.

[0013] In some possible embodiments, the device further comprises a pixel-defining layer located on a side of the organic layer away from the base, the first material layer being disposed in the same layer as the pixel-defining layer.

[0014] In some possible embodiments, the first material layer and the pixel-defining layer are of a monolithic structure.

[0015] In some possible embodiments, the display panel further includes an isolation structure and a light-emitting unit, the isolation structure being located on a side of the first material layer away from the base and having an isolation opening, the light-emitting unit being located in the isolation opening, and the isolation structure also serving as the auxiliary electrode.

[0016] In some possible embodiments, the isolation structure includes a first layer, a second layer, and a third layer stacked in a direction away from the base, or the isolation structure includes a second layer and a third layer stacked in a direction away from the base.

[0017] In some possible embodiments, the material of the second layer comprises aluminum and the material of the third layer comprises titanium; Preferably, the material of the first layer comprises molybdenum.

[0018] The present application further provides a method for manufacturing a display panel, the method comprising: providing a base; providing a wiring layer including a first wiring on the base side; depositing an organic layer on a side of the wiring layer away from the base, and etching the organic layer to form an overlap hole exposing at least a portion of the first wiring; and disposing a pixel-defining layer on a side of the organic layer away from the base, the pixel-defining layer extending into the overlap hole and covering a side of the organic layer facing the overlap hole, the pixel-defining layer exposing at least a portion of the first wiring within the overlap hole.

[0019] In some possible embodiments, the wiring layer further includes a second wiring, and the step of forming the overlap hole in the organic layer includes: etching the organic layer to form an electrode connection hole exposing at least a portion of the second wiring and the overlap hole exposing at least a portion of the first wiring; Preferably, prior to the step of depositing a pixel-defining layer on a side of the organic layer remote from the base, the method further comprises: The method includes forming a first electrode on the side of the organic layer away from the base, the first electrode extending into the electrode connection hole and electrically connected to the second wiring.

[0020] In some possible embodiments, after the step of depositing a pixel-defining layer on a side of the organic layer remote from the base, the method further comprises: The method includes providing an isolation structure on a side of the organic layer away from the base, the isolation structure extending into the overlap hole and contacting the first wiring.

[0021] The present application further provides: providing a base; providing a wiring layer including a first wiring on the base side; depositing an organic layer on a side of the wiring layer away from the base, and etching the organic layer to form an overlap hole exposing at least a portion of the first wiring; providing a first material layer on a side of the organic layer away from the base, the first material layer covering a side of the organic layer facing the overlap hole and exposing the first wiring, the water absorption of the first material layer being lower than the water absorption of the organic layer; and providing an auxiliary electrode on the side of the first material layer away from the base, the auxiliary electrode extending into the overlap hole and contacting the first wiring.

[0022] In some possible embodiments, the step of providing an auxiliary electrode on the side of the first material layer away from the base comprises: The method also includes providing an isolation structure on the side of the first material layer away from the base, the isolation structure including an isolation opening and also serving as the auxiliary electrode.

[0023] Another object of the present invention is to provide an electronic device, which includes the display panel according to the present invention. [Effects of the Invention]

[0024] Compared to existing technologies, the present application has the following beneficial effects:

[0025] According to the display panel, the manufacturing method for the display panel, and the electronic device of the present application, in a display panel having an isolation structure, the pixel definition layer in the overlap hole is arranged to cover the side of the organic layer facing the overlap hole, thereby preventing the organic layer from being exposed at the overlap hole, thereby reducing the risk of water vapor entering the organic layer at the overlap hole and ensuring the yield of subsequent film layer manufacturing. [Brief explanation of the drawings]

[0026] In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that need to be used in the embodiments of the present application will be briefly described below, but the drawings described below are only some embodiments of the present application and do not limit the scope thereof. It is obvious that those skilled in the art can derive other related drawings based on these drawings without any creative efforts. [Figure 1] FIG. 1 is a first cross-sectional view schematically illustrating a display panel according to existing technology. [Figure 2] FIG. 10 is a second cross-sectional schematic diagram of a display panel according to existing technology. [Figure 3] 1 is a first cross-sectional schematic view of a display panel provided by this embodiment. [Figure 4] FIG. 2 is a second cross-sectional schematic view of the display panel provided by this embodiment. [Figure 5] 2 is a schematic diagram of an area of ​​a display panel provided by this embodiment. FIG. [Figure 6] FIG. 3 is a third cross-sectional schematic view of the display panel provided by this embodiment. [Figure 7] FIG. 1 is a first schematic diagram of an isolation structure provided by this embodiment. [Figure 8] FIG. 4 is a fourth cross-sectional schematic view of the display panel provided by this embodiment. [Figure 9] FIG. 5 is a fifth cross-sectional schematic diagram of the display panel provided by this embodiment. [Figure 10] FIG. 6 is a schematic cross-sectional view of the display panel provided by this embodiment. [Figure 11] FIG. 7 is a schematic cross-sectional view of the display panel provided by this embodiment. [Figure 12] FIG. 2 is a second schematic diagram of the isolation structure provided by this embodiment. [Figure 13] FIG. 8 is a schematic cross-sectional view of the display panel provided by this embodiment. [Figure 14] FIG. 9 is a ninth cross-sectional schematic diagram of the display panel provided by this embodiment. [Figure 15] 1 is a first example of a flowchart of steps of a method for manufacturing a display panel provided by the present embodiment. [Figure 16] 10 is a second example of a flowchart of steps of a method for manufacturing a display panel provided by the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0027] In order to clarify the objectives, technical solutions and advantages of the embodiments of the present application, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of the embodiments of the present application. Generally, the components of the embodiments of the present application described and shown in the drawings can be installed / designed in various different arrangements.

[0028] Therefore, the detailed description of the embodiments of the present application provided in the drawings below is not intended to limit the scope of the application for which protection is sought, but merely illustrates selected embodiments of the present application. Based on the embodiments of the present application, any other embodiments that a person skilled in the art can obtain without paying creative efforts fall within the scope of protection of the present application.

[0029] It should be noted that in the following drawings, like symbols and letters represent like items, so that once an item is defined in one drawing, it does not require further definition and interpretation in subsequent drawings.

[0030] In the description of this application, the orientations or positional relationships indicated by terms such as "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer" are based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships in which the product of the present invention is normally placed when in use, and are merely for the purpose of facilitating and simplifying the description of this application. They do not indicate or imply that the devices or elements referred to must have a specific orientation or be configured or operated in a specific orientation, and should not be understood as limitations on this application. Furthermore, terms such as "first," "second," and "third" are used to distinguish between the descriptions, and are not to be understood as indicating or implying relative importance.

[0031] It should be noted that different features in the embodiments of the present application may be combined with each other unless they are inconsistent.

[0032] 1 , a conventional display panel employing several isolation structures 140 typically includes a base 111′, a plurality of array functional film layers 112′ located on the base 111′ side, a wiring layer 113′ located on the side of the array functional film layer 112′ away from the base 111′, a planarization layer 114′ located on the side of the wiring layer 113′ away from the base 111′, a pixel defining layer 120′ located on the side of the planarization layer 114′ away from the base 111′, and an isolation structure 140′ located on the side of the pixel defining layer 120′ away from the base 111′. The isolation structure 140′ needs to extend to be electrically connected to the wiring layer 113′ via overlapping holes that penetrate the pixel defining layer 120′ and the planarization layer 114′.

[0033] In this case, as shown in FIG. 2, during the manufacturing process of the display panel, some positions of the planarization layer 114' in the overlap hole are not covered by the pixel defining layer 120', and the planarization layer 114' made of an organic material is susceptible to the penetration of water vapor at these positions, and the water vapor released during the subsequent manufacturing process will affect the formation effect of other film layers.

[0034] In view of this, this embodiment provides a technical means for reducing the intrusion of water vapor during the manufacturing process of the display panel, and the technical means provided by this embodiment will be described in detail below.

[0035] As shown in Figure 3, which is a schematic diagram of a display panel provided by this embodiment, the display panel may include a base 111, a wiring layer 113, an organic layer 114, and a pixel definition layer 120.

[0036] In this embodiment, the first wiring layer 113 is located on the base 111 side, and one or more array functional film layers 112 may further be included between the first wiring layer 113 and the base 111, for example, a buffer layer, a semiconductor layer, one or more other wiring layers 113 and one or more insulating layers.

[0037] The wiring layer 113 includes a first wiring 1131. The wiring layer 113 may include wiring other than the first wiring 1131, but this will not be described redundantly in this embodiment.

[0038] The organic layer 114 is located on the side of the wiring layer 113 away from the base 111, and the organic layer 114 includes an overlapping hole that exposes at least a portion of the first wiring 1131. Optionally, in this embodiment, the organic layer 114 has a certain degree of fluidity during the manufacturing process.

[0039] The pixel defining layer 120 is located on the side of the organic layer 114 away from the base 111, the pixel defining layer 120 extends into the overlap hole and covers the side of the organic layer 114 facing the overlap hole, and the portion of the pixel defining layer 120 located in the overlap hole exposes at least a part of the first wiring 1131. That is, in the overlap hole, the pixel defining layer 120 can cover the exposed portion of the organic layer 114 while leaving the first wiring 1131 exposed.

[0040] According to the above design, in this embodiment, the pixel defining layer 120 at the overlap hole is disposed so as to cover the side of the organic layer 114 facing the overlap hole, thereby preventing the organic layer 114 from being exposed at the overlap hole, thereby reducing the risk of water vapor penetrating into the organic layer 114 at the overlap hole and ensuring the yield of subsequent film layer manufacturing.

[0041] In some possible embodiments, the material of the pixel-defining layer 120 includes an inorganic material, so that the pixel-defining layer 120 has a better water vapor blocking effect and can better protect the organic layer 114 from the intrusion of water vapor.

[0042] 4, the display panel further includes an isolation structure 140 located on a side of the pixel defining layer 120 away from the base 111, the isolation structure 140 extending into the overlap hole and contacting the first wiring 1131. In this way, the isolation structure 140 may overlap and be electrically connected to the first wiring 1131 through the overlap hole.

[0043] The pixel defining layer 120 in the overlap hole is disposed so as to cover the side of the organic layer 114 facing the overlap hole, thereby preventing the organic layer 114 from directly contacting the isolation structure 140 extending into the overlap hole. This prevents water vapor absorbed by the organic layer 114 from affecting the formation of the isolation structure 140 during the plating film formation process of the isolation structure 140, and reduces the risk of film layer abnormalities in the isolation structure 140.

[0044] 5, the display panel includes a display area 10 and an overlap area 20 located on the side of the display area 10, and the overlap hole is located in the overlap area 20. The display panel further includes a banding area, and the overlap area 20 is located between the display area 10 and the banding area. The banding area is used for banding chips.

[0045] 6 , the pixel definition layer 120 located in the display area 10 includes a pixel aperture, the isolation structure 140 located in the display area 10 includes an isolation aperture, and the orthogonal projection of the pixel aperture at the base 111 is located within the orthogonal projection of the isolation aperture at the base 111. Related technical solutions of the isolation structure 140 located in the display area 10 are described in patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5, the contents of which are incorporated herein by reference.

[0046] Optionally, in some possible embodiments, in the display region 10, the isolation structure 140 may include a support portion and a blocking portion located on a side away from the base 111 of the support portion, and the orthogonal projection of the support portion on the base 111 is located within the orthogonal projection of the blocking portion on the base 111. That is, the isolation structure 140 located in the display region 10 has an undercut structure, which allows the organic film layer between adjacent pixel openings to be better cut when other organic film layers are formed later by vapor deposition.

[0047] 7 , the isolation structure 140 includes a first layer 141, a second layer 142, and a third layer 143 stacked in a direction away from the base 111. For example, the material of the first layer 141 includes molybdenum, the material of the second layer 142 includes aluminum, and the material of the third layer 143 includes titanium. The support portion may be formed by the first layer 141 and the second layer 142, and the blocking portion may be formed by the third layer 143. In other embodiments, the isolation structure 140 includes the second layer 142 and the third layer 143 stacked in a direction away from the base 111.

[0048] As shown in FIG. 8, when the isolation structure 140 is extended into the overlap hole, the first layer 141 and the first wiring 1131 come into contact with each other and are electrically connected.

[0049] In some possible embodiments, the display area 10 of the display panel further includes a first electrode 130, a light-emitting unit 150 and a second electrode 160, as shown again in FIG.

[0050] The first electrode 130 is located on a side of the organic layer 114 away from the base 111, and multiple first electrodes 130 can be distributed at intervals. At least a portion of the first electrode 130 is located within the pixel opening, for example, one pixel opening exposes at least a portion of one first electrode 130.

[0051] At least a portion of the light-emitting unit 150 is located within the pixel aperture and on the side of the first electrode 130 away from the base 111 , and the light-emitting unit 150 contacts the first electrode 130 .

[0052] At least a portion of the second electrode 160 is located within the pixel opening and on a side of the light-emitting unit 150 away from the base 111 , and the second electrode 160 contacts the light-emitting unit 150 .

[0053] When a potential difference exists between the first electrode 130 and the second electrode 160, the light-emitting unit 150 located between the first electrode 130 and the second electrode 160 is driven to emit light.

[0054] In some possible embodiments, as again shown in FIG. 6, at least a portion of the second electrode 160 extends from within the pixel opening to the side of the pixel defining layer 120 away from the base 111 to contact the isolation structure 140.

[0055] In this way, the second electrodes 160 corresponding to adjacent pixel openings may be electrically connected via the isolation structure 140 and connected to a common voltage (Vss) supply circuit, or the isolation structure 140 may connect each second electrode 160 relatively independently to the common voltage supply circuit.

[0056] In some possible embodiments, the display panel further includes a first packaging layer 170 located on the side of the second electrode 160 away from the base 111, as shown in FIG.

[0057] Optionally, the first packaging layer 170 may extend from within the pixel opening to a side of the isolation structure 140 away from the base 111. The first packaging layer 170 corresponding to an adjacent pixel opening may be cut to a side of the isolation structure 140 away from the base 111.

[0058] Furthermore, in some possible embodiments, the display panel further includes a second packaging layer 180 and a third packaging layer 190 stacked on the side of the first packaging layer 170 away from the base 111 .

[0059] Optionally, the material of the first packaging layer 170 and the third packaging layer 190 includes an inorganic material, and the material of the second packaging layer 180 includes an organic material. For example, the first packaging layer 170 and the third packaging layer 190 may be formed using a chemical vapor deposition (CVD) method, and the second packaging layer 180 may be formed using an inkjet printing (IJP) method.

[0060] Optionally, there may be a gap between the portion of the first packaging layer 170 that is located away from the base 111 of the isolation structure 140 and the isolation structure 140. The second packaging layer 180 may fill the gap.

[0061] 10, which is a schematic diagram of a display panel provided by this embodiment, the display panel may include a base 211, a wiring layer 213, an organic layer 214, a first material layer 221, and an auxiliary electrode 310.

[0062] In this embodiment, the first wiring layer 213 is located on the base 211 side, and one or more array functional film layers 212 may further be included between the first wiring layer 213 and the base 211, for example, a buffer layer, a semiconductor layer, one or more other wiring layers 213 and one or more insulating layers.

[0063] The wiring layer 213 includes a first wiring 2131. The wiring layer 213 may include wiring other than the first wiring 2131, but this will not be described redundantly in this embodiment.

[0064] The organic layer 214 is located on the side of the wiring layer 213 away from the base 211, and the organic layer 214 includes an overlap hole that exposes at least a portion of the first wiring 2131.

[0065] The first material layer 221 is located on the side of the organic layer 214 away from the base 211 and exposes at least a portion of the first wiring 2131. That is, in the overlap hole, the first material layer 221 can cover the exposed portion of the organic layer 214 while leaving the first wiring 2131 exposed. The water absorption of the first material layer 221 is lower than the water absorption of the organic layer 214.

[0066] According to the above design, in this embodiment, the first material layer 221 at the overlap hole is arranged to cover the side of the organic layer 214 facing the overlap hole, thereby avoiding exposure of the organic layer 214 at the overlap hole, reducing the risk of water vapor intrusion into the organic layer 214 at the overlap hole, and ensuring the yield of subsequent film layer manufacturing.

[0067] In some possible embodiments, the material of the first material layer 221 includes an inorganic material, so that the first material layer 221 has a better blocking effect against water vapor and can better protect the organic layer 214 from the intrusion of water vapor.

[0068] The auxiliary electrode 310 is located on the side of the first material layer 221 away from the base 211, and the auxiliary electrode 310 extends into the overlap hole to contact the first wiring 2131. In this way, the auxiliary electrode 310 may overlap and be electrically connected to the first wiring 2131 through the overlap hole.

[0069] The first material layer 221 in the overlap hole is arranged to cover the side of the organic layer 214 facing the overlap hole, thereby preventing the organic layer 214 from coming into direct contact with the auxiliary electrode 310 extended into the overlap hole, thereby preventing water vapor absorbed by the organic layer 214 from affecting the formation of the auxiliary electrode 310 during the plating film formation process of the auxiliary electrode 310, and reducing the risk of abnormalities in the film layer of the auxiliary electrode 310.

[0070] In some possible embodiments, as shown again in FIG. 5, the display panel includes a display area 10 and an overlap area 20 located on the side of the display area 10, and the overlap hole is located in the overlap area 20.

[0071] 11 , the display panel provided by this embodiment further includes a pixel defining layer 220, which is located on the side of the organic layer 214 that is away from the base 211. The pixel defining layer 220 is disposed in the same layer as the first material layer 221. The pixel defining layer 220 and the first material layer 221 have an integral structure, that is, the pixel defining layer 220 and the first material layer 221 are integrally formed and contact each other.

[0072] In some possible embodiments, as shown in FIG. 11 again, the display panel provided by this embodiment further includes an isolation structure 240 and a light-emitting unit 250 .

[0073] The isolation structure 240 is located on the side of the first material layer 221 away from the base 211, and includes an isolation opening, within which the light-emitting unit 250 is located. The isolation structure 240 also serves as an auxiliary electrode 310.

[0074] Here, the relevant technical solutions of the isolation structure 240 in the display area 10 are described in patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, the contents of which are incorporated by reference into this application for reference purposes.

[0075] Optionally, in some possible embodiments, the isolation structure 240 may include a support portion and a blocking portion located on a side away from the base 211 of the support portion, and the orthogonal projection of the support portion on the base 211 is located within the orthogonal projection of the blocking portion on the base 211. That is, the isolation structure 240 located in the display region 10 has an undercut structure, which allows the organic film layer between adjacent pixel openings to be better cut when other organic film layers are formed later by vapor deposition.

[0076] 12, the isolation structure 240 includes a first layer 241, a second layer 242, and a third layer 243 stacked in a direction away from the base 211. For example, the material of the first layer 241 includes molybdenum, the material of the second layer 242 includes aluminum, and the material of the third layer 243 includes titanium. The support portion may be formed by the first layer 241 and the second layer 242, and the blocking portion may be formed by the third layer 243. In this case, as shown in FIG. 13, the auxiliary electrode 310 may include the first layer 241, the second layer 242, and the third layer 243 stacked in a direction away from the base 211.

[0077] In some other possible embodiments, the isolation structure 240 includes a second layer 242 and a third layer 243 that are stacked in a direction away from the base 211. For example, the material of the second layer 242 includes aluminum, and the material of the third layer 243 includes titanium. The support portion may be formed by the second layer 242, and the blocking portion may be formed by the third layer 243. In this case, the auxiliary electrode 310 may include the second layer 242 and the third layer 243 that are stacked in a direction away from the base 211.

[0078] In some possible embodiments, the display panel further includes a first electrode 230 and a second electrode 260, as shown in FIG.

[0079] The first electrode 230 is located on a side of the organic layer 214 away from the base 211, and multiple first electrodes 230 may be distributed at intervals. At least a portion of the first electrode 230 is located within the pixel opening, for example, one pixel opening exposes at least a portion of one first electrode 230.

[0080] At least a portion of the light-emitting unit 250 is located within the pixel aperture and on the side of the first electrode 230 away from the base 211 , and the light-emitting unit 250 contacts the first electrode 230 .

[0081] At least a portion of the second electrode 260 is located within the pixel opening and on a side of the light-emitting unit 250 away from the base 211 , and the second electrode 260 contacts the light-emitting unit 250 .

[0082] When a potential difference exists between the first electrode 230 and the second electrode 260, the light-emitting unit 250 located between the first electrode 230 and the second electrode 260 is driven to emit light.

[0083] In some possible embodiments, as again shown in FIG. 11, at least a portion of the second electrode 260 extends from within the pixel opening to the side of the pixel defining layer 220 away from the base 211 to contact the isolation structure 240.

[0084] In this way, the second electrodes 260 corresponding to adjacent pixel openings may be electrically connected via the isolation structure 240 and connected to a common voltage (Vss) supply circuit, or the isolation structure 240 may connect each second electrode 260 relatively independently to the common voltage supply circuit.

[0085] In some possible embodiments, as shown in FIG. 14, the display panel further includes a first packaging layer 270 located on the side of the second electrode 260 away from the base 211 .

[0086] Optionally, the first packaging layer 270 may extend from within the pixel opening to a side of the isolation structure 240 away from the base 211. The first packaging layer 270 corresponding to an adjacent pixel opening may be cut to a side of the isolation structure 240 away from the base 211.

[0087] Furthermore, in some possible embodiments, the display panel further includes a second packaging layer 280 and a third packaging layer 290 stacked on the side of the first packaging layer 270 away from the base 211 .

[0088] Optionally, the first packaging layer 270 and the third packaging layer 290 may be made of an inorganic material, and the second packaging layer 280 may be made of an organic material. For example, the first packaging layer 270 and the third packaging layer 290 may be formed by chemical vapor deposition (CVD), and the second packaging layer 280 may be formed by inkjet printing (IJP).

[0089] Optionally, there may be a gap between the part of the first packaging layer 270 that is located away from the base 211 of the isolation structure 240 and the isolation structure 240. The second packaging layer 280 may fill the gap.

[0090] As shown in FIG. 15, this embodiment further provides a method for manufacturing a display panel, which may include the following steps:

[0091] Step S110: Provide a base 111.

[0092] Step S120: The wiring layer 113 including the first wiring 1131 is placed on the base 111 side.

[0093] Step S130: On the side of the wiring layer 113 away from the base 111, the organic layer 114 is provided, which includes an overlapping hole that exposes at least a part of the first wiring 1131.

[0094] Step S140: Dispose a pixel defining layer 120 on the side of the organic layer 114 away from the base 111, the pixel defining layer 120 extending into the overlap hole and covering the side of the organic layer 114 facing the overlap hole, and exposing at least a portion of the first wiring 1131 in the overlap hole.

[0095] In some possible embodiments, the wiring layer 113 further includes a second wiring 1132. The second wiring 1132 is used to supply a driving voltage to the first electrode .

[0096] In step S130, the organic layer 114 is etched to form an electrode connection hole that exposes at least a part of the second wiring 1132 and an overlap hole that exposes at least a part of the first wiring 1131. That is, the organic layer 114 is etched to form the electrode connection hole, and the overlap hole is also formed by etching.

[0097] Optionally, after step S130, a first electrode 130 can also be formed on the side of the organic layer 114 away from the base 111, and the first electrode 130 can be extended into the electrode connection hole and electrically connected to the second wiring 1132.

[0098] In some possible embodiments, in step S140, a pixel-defining layer 120 is disposed on a side of the organic layer 114 away from the base 111, and the pixel-defining layer 120 is etched, so that the pixel-defining layer 120 in the overlap hole exposes at least a portion of the first wiring 1131.

[0099] Then, an isolation structure 140 is disposed on the side of the pixel defining layer 120 away from the base 111, and the isolation structure 140 extends into the overlap hole to contact the first wiring 1131. That is, the pixel defining layer is etched to expose the first wiring 1131, and then the isolation structure 140 is disposed.

[0100] In some possible embodiments, after the isolation structures 140 are deposited on the side of the pixel-defining layer 120 away from the base 111, the isolation layer may be etched to form the isolation openings.

[0101] Thereafter, the pixel definition layer 120 can be etched again to form pixel openings that communicate with the isolation openings. That is, the pixel definition layer 120 can be etched using the isolation structures 140 as a mask to form pixel openings.

[0102] As shown in FIG. 16, this embodiment further provides a method for manufacturing a display panel, which can include the following steps.

[0103] Step S210: Provide a base 211.

[0104] Step S220: The wiring layer 213 including the first wiring 2131 is placed on the base 211 side.

[0105] Step S230: The organic layer 214 is disposed on the side of the wiring layer 213 away from the base 211, and the organic layer 214 is etched to form an overlapping hole that exposes at least a part of the first wiring 2131.

[0106] Step S240: A first material layer 221 is disposed on the side of the organic layer 214 away from the base 211, so that the first material layer 221 covers the side of the organic layer 214 facing the overlap hole and exposes at least a part of the first wiring 2131. The water absorption of the first material layer 221 is lower than that of the organic layer 214.

[0107] Step S250: An auxiliary electrode 310 is disposed on the side of the first material layer 221 away from the base 211, and the auxiliary electrode 310 is extended into the overlap hole to contact the first wiring 2131.

[0108] In some possible embodiments, the wiring layer 213 further includes a second wiring 2132. The second wiring 2132 is used to supply a driving voltage to the first electrode 230.

[0109] In step S230, the organic layer 214 is etched to form an electrode connection hole that exposes at least a part of the second wiring 2132 and an overlap hole that exposes at least a part of the first wiring 2131. That is, the organic layer 214 is etched to form the electrode connection hole, and the overlap hole is also formed by etching.

[0110] In some possible embodiments, in step S240, a first material layer 221 is provided on the side of the organic layer 214 away from the base 211, and the first material layer 221 is etched, so that the first material layer 221 in the overlap hole exposes at least a portion of the first wiring 2131.

[0111] In some possible embodiments, in step S250, an isolation structure 240 may be provided on the side of the first material layer 221 away from the base 211, and at least a portion of the isolation structure 240 may extend into the overlap hole to double as an auxiliary electrode 310.

[0112] The present application further provides an electronic device, which includes a display panel according to the present application, and the electronic device may include devices with display functions such as mobile phones, tablets, smart wearable devices, televisions, laptops, and displays.

[0113] As described above, according to the display panel, the manufacturing method for a display panel, and the electronic device of the present application, in a display panel having an isolation structure, the pixel definition layer in the overlap hole is arranged to cover the side of the organic layer facing the overlap hole, thereby preventing the organic layer from being exposed at the overlap hole, thereby reducing the risk of water vapor entering the organic layer at the overlap hole and ensuring the yield of subsequent film layer manufacturing.

[0114] The technical features of the above embodiments can be combined in any way. For the sake of simplicity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it is deemed to be within the scope of the present invention.

[0115] The above examples merely illustrate some embodiments of the present invention, and although the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. Those skilled in the art can make some modifications and improvements without departing from the concept of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims. [Explanation of symbols]

[0116] 111, 211 base 112, 212 Array functional membrane layer 113, 213 wiring layer 1131, 2131 1st wiring 1132, 2132 2nd wiring 114, 214 organic layer 120, 220 pixel definition layers 221 1st material layer 130, 230 1st electrode 140, 240 Isolation structure 1400, 2400 isolation opening 150, 250 light units 160, 260 2nd electrode 170, 270 First packaging layer 180, 280 Second packaging layer 190, 290 Third packaging layer 141, 241 1st layer 142, 242 2nd layer 143, 243 3rd layer 310 Auxiliary electrode 10 Display area 20 overlapping areas 901, 902 overlap holes

Claims

1. With the base, a wiring layer located on the base side; an organic layer located on a side of the wiring layer away from the base; a pixel defining layer located on a side of the organic layer away from the base; the wiring layer includes a first wiring, the organic layer includes an overlap hole that exposes at least a portion of the first wiring; the pixel definition layer extends into the overlap hole and covers a side of the organic layer facing the overlap hole, and a portion of the pixel definition layer located in the overlap hole exposes at least a portion of the first wiring. Display panel.

2. the material of the pixel defining layer comprises an inorganic material; The display panel according to claim 1 .

3. the display panel further includes an isolation structure located on a side of the organic layer away from the base, the isolation structure extending into the overlap hole and contacting the first wiring; The display panel according to claim 1 .

4. the display panel includes a display area, a pixel definition layer located in the display area includes a pixel aperture, the isolation structure is provided on a side of the pixel definition layer away from the base, the isolation structure located in the display area includes an isolation aperture, and an orthogonal projection of the pixel aperture on the base is located within an orthogonal projection of the isolation aperture on the base. The display panel according to claim 3 .

5. the organic layer includes a planarization layer; The display area of ​​the display panel further comprises: a first electrode located on the planarization layer away from the base and at least partially located within the pixel opening; a light-emitting unit at least partially located within the pixel opening and located on a side of the first electrode away from the base, the light-emitting unit contacting the first electrode; a second electrode at least partially located within the pixel opening and located on a side of the light-emitting unit away from the base, the second electrode contacting the light-emitting unit; The display panel according to claim 4 .

6. the second electrode contacts the isolation structure; The display panel according to claim 5 .

7. With the base, a wiring layer located on the base side and including a first wiring; an organic layer located on a side of the wiring layer away from the base and including an overlap hole exposing at least a portion of the first wiring; a first material layer covering a side of the organic layer facing the overlap hole and exposing the first wiring, the first material layer having a water absorption property lower than that of the organic layer; an auxiliary electrode located on a side of the first material layer away from the base, extending into the overlap hole, and contacting the first wiring; Display panel.

8. the display panel includes a display area and an overlap area located on the display area side, and the overlap hole is located in the overlap area; the display panel further includes a banding area, and the overlap area is located between the display area and the banding area. The display panel according to claim 7 .

9. the material of the first material layer includes an inorganic material; the display panel further includes a pixel-defining layer located on a side of the organic layer away from the base, the first material layer being co-layered with the pixel-defining layer; the first material layer and the pixel defining layer are monolithic structures; The display panel according to claim 7 .

10. The display panel further includes an isolation structure and a light-emitting unit, the isolation structure being located on a side of the first material layer away from the base and having an isolation opening, the light-emitting unit being located in the isolation opening, and the isolation structure also serving as the auxiliary electrode. The display panel according to claim 7 .

11. the isolation structure includes a first layer, a second layer, and a third layer stacked in a direction away from the base, or the isolation structure includes a second layer and a third layer stacked in a direction away from the base; The display panel according to claim 10.

12. the material of the second layer includes aluminum, and the material of the third layer includes titanium; the material of the first layer comprises molybdenum; The display panel according to claim 11 .

13. providing a base; providing a wiring layer including a first wiring on the base side; depositing an organic layer on a side of the wiring layer away from the base, and etching the organic layer to form an overlap hole exposing at least a portion of the first wiring; disposing a pixel-defining layer on a side of the organic layer away from the base, the pixel-defining layer extending into the overlap hole and covering a side of the organic layer facing the overlap hole, the pixel-defining layer exposing at least a portion of the first wiring within the overlap hole; A method for manufacturing a display panel.

14. The wiring layer further includes a second wiring, and the step of forming the overlap hole in the organic layer includes: etching the organic layer to form an electrode connection hole exposing at least a portion of the second wiring and the overlap hole exposing at least a portion of the first wiring; The method of claim 13.

15. Prior to the step of depositing a pixel-defining layer on a side of the organic layer away from the base, the method may further comprise: forming a first electrode on a side of the organic layer away from the base, the first electrode extending into the electrode connection hole and electrically connected to the second wiring, 15. The method of claim 14.

16. After the step of disposing a pixel-defining layer on a side of the organic layer away from the base, the method further comprises: providing an isolation structure on a side of the organic layer away from the base, the isolation structure extending into the overlap hole and contacting the first wiring; The method of claim 13.

17. providing a base; providing a wiring layer including a first wiring on the base side; depositing an organic layer on a side of the wiring layer away from the base, and etching the organic layer to form an overlap hole exposing at least a portion of the first wiring; providing a first material layer on a side of the organic layer away from the base, the first material layer covering a side of the organic layer facing the overlap hole and exposing the first wiring, the water absorption of the first material layer being lower than the water absorption of the organic layer; and providing an auxiliary electrode on the side of the first material layer away from the base, the auxiliary electrode extending into the overlap hole and contacting the first wiring. A method for manufacturing a display panel.

18. The step of providing an auxiliary electrode on the side of the first material layer away from the base comprises: forming an isolation structure on the side of the first material layer away from the base, the isolation structure including an isolation opening and also serving as the auxiliary electrode; 18. The method of claim 17.

19. A display panel comprising the display panel according to any one of claims 1 to 16. electronic equipment.

Citation Information

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