Sensor, electronic device, method of manufacturing sensor, and method of manufacturing electronic device

Abstract

To provide a sensor, such as a capacitive sensor, configured to reduce breaking risk caused when a tail part extending from the body of the sensor is bent.SOLUTION: A sensor 1 includes a base substrate 20 and a sensor sheet fixed to the base substrate 20, the sensor sheet including a sensor body 10a having a sensor electrode, and a tail part 10b having wiring electrically connected to the sensor electrode and protruding and extending toward the base substrate 20 and the sensor body 10a. The sensor sheet includes a tail support section which is not fixed to the base substrate 20 and located in a position overlapping the base substrate 20, provided at an end of the sensor body 10a, and connected to the tail part 10b to support the tail part 10b so as to be bent. The base substrate 20 includes a joint surface section fixed to the sensor body 10a, and a separation section which is provided in a position opposing the tail support section and not fixed to the tail support section. The separation section is provided between the base substrate 20 and the tail support section.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a sensor such as a capacitance sensor used for input operations of various electronic devices, and a manufacturing method thereof. [Background technology]

[0002] Various electronic devices use operating devices for performing input operations by touch. For example, a capacitance sensor is used as a sensor for detecting input operations. The capacitance sensor has, for example, a base substrate made of a hard resin or the like and a film sheet made of a resin film. The film sheet has a sensor main body held by the base substrate and a tail portion extending from the sensor main body.

[0003] The sensor main body is held by a base substrate. A plurality of sensor electrodes and wiring extending from each sensor electrode are formed on the sensor main body by printing with conductive ink or the like. The tail portion protrudes and extends from the sensor main body. That is, the tail portion is not held by the base substrate so that the wiring can be freely routed according to the layout of components inside the housing of the electronic device. Wiring extending from the plurality of sensor electrodes is formed on the tail portion, continuing from the sensor main body. Terminal portions are formed at the ends of each wiring. The terminal portions are connected to connectors on a circuit board disposed in the housing of the electronic device. Such a conventional capacitance sensor is described, for example, in JP 2013-247029 A (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-247029 Summary of the Invention [Problem to be solved by the invention]

[0005] In conventional capacitance sensors, the tail portion can bend. This can occur, for example, when the sensor is placed in the housing of an electronic device and the terminal portion is connected to a connector. Furthermore, the tail portion may need to be bent depending on the layout of the circuit board. When the tail portion is protruding from a rigid molded body, it is bent at the boundary with the molded body, which places a heavy load on the bent portion, causing the wiring in that area to curl up against the film sheet and potentially break.

[0006] The present invention was made against the background of the conventional technology described above, and has an object to reduce the risk of wire breakage when a tail portion extending from a sensor body, such as a capacitance sensor, is bent. [Means for solving the problem]

[0007] In order to achieve the above object, a sensor and a method for manufacturing the same according to one aspect of the present invention are configured as follows.

[0008] That is, one aspect of the present invention is a sensor comprising a base substrate and a sensor sheet, the sensor sheet having a sensor main body portion having a sensor electrode, and a tail portion having wiring conductive to the sensor electrode and extending and protruding from the base substrate, wherein the base substrate has a joint surface portion that is fixed to the sensor main body portion, and a separation portion that is provided at a position opposite to the tail support portion of the sensor main body portion to which the tail portion is connected, and is not fixed to the tail support portion.

[0009] In the sensor according to one aspect of the present invention, the sensor sheet is released from the constraint of the base material in the spaced portion that is not fixed to the tail support portion, making the tail portion provided at the end of the spaced portion more easily bendable, thereby reducing the risk of wire breakage.

[0010] The separating portion may be configured as a recess formed in the joining surface portion. According to one aspect of the present invention, a gap can be generated between the sensor sheet and the base substrate. If the separating portion is configured as a recess, the sensor sheet and the base substrate can be physically separated.

[0011] In one aspect of the present invention, the separation portion can be a heat-resistant resin member interposed between the tail support portion and the base substrate. According to one aspect of the present invention, the heat-resistant resin member interposed between the sensor sheet and the base substrate allows the two to be separated without creating a gap.

[0012] In one aspect of the present invention, the sensor sheet may have two notches along the outer edge of the tail portion at a location facing the separation portion. According to this aspect of the present invention, the area between the two notches is released from the constraint of the base substrate and becomes more easily deformable. This allows the tail portion of the sensor to be more easily deformed, reducing the risk of wiring breakage.

[0013] In one aspect of the present invention, the sensor main body can be configured as a three-dimensional shape having a top surface and side surfaces. According to one aspect of the present invention, since the sensor main body has a three-dimensional shape having a top surface and side surfaces, the sensor itself can be provided with a three-dimensional shape to enhance design. As an example, the top surface of the sensor main body can be formed as a flat surface, a curved surface, or the like. The side surface of the sensor main body can be formed as a cylindrical or polygonal prism-like outer peripheral surface, or the like.

[0014] In one aspect of the present invention, the film sheet and the base substrate can be made of a light-transmitting material, and the sensor sheet can be illuminated by transmitting backlight. According to one aspect of the present invention, since the sensor sheet can be illuminated by transmitting backlight, the sensor main body can be illuminated, and the operation surface can be clearly identified even at night or in a dark place.

[0015] In the above aspect of the present invention, the plurality of sensor electrodes can be configured as electrodes for a capacitance sensor that detects a change in capacitance. According to this aspect of the present invention, the sensor of the above aspect of the present invention having the above characteristics can be realized as a capacitance sensor.

[0016] Another aspect of the present invention is a sensor comprising a base substrate and a sensor sheet, the sensor sheet having a sensor main body portion having a sensor electrode, and a tail portion having wiring conductive to the sensor electrode and extending and protruding from the base substrate, and a manufacturing method for a sensor in which the base substrate made of a resin material is integrally molded with the sensor sheet, the method comprising the steps of: providing a masking portion that does not adhere to the resin material at a tail support portion of the sensor main body portion to which the tail portion is connected; integrally molding the base substrate to cover the masking portion; and bending the tail support portion to bend the tail portion relative to the base substrate.

[0017] According to the method for manufacturing a sensor of one aspect of the present invention, a separation portion that is not fixed to the tail support portion can be provided at a position facing a joint surface portion of the base substrate that is fixed to the sensor main body and a tail support portion of the sensor main body that is connected to the tail portion. In this separation portion, the sensor sheet is released from the constraint of the base substrate, making it easier for the tail portion provided beyond the separation portion to bend, thereby providing a sensor that can reduce the risk of wiring breakage.

[0018] In one aspect of the present invention, the masking portion may be a heat-resistant tape. According to this aspect of the present invention, the heat-resistant tape does not adhere to the base substrate, and the separation portion can be formed. Also, according to this aspect of the present invention, the masking portion can be easily formed using the heat-resistant tape.

[0019] In one aspect of the present invention, the heat-resistant tape can be peeled off and removed after the base substrate is integrally molded. In the one aspect of the present invention, the heat-resistant tape is peeled off and removed after the base substrate is integrally molded, so that the portion from which the heat-resistant tape is removed becomes a gap, and this portion can be used as the separation portion.

[0020] In one aspect of the present invention, the masking portion may be a coating layer made of heat-resistant paint. In one aspect of the present invention, the masking portion is a coating layer made of heat-resistant paint, so the coating layer does not adhere to the base substrate and can form the separation portion. In another aspect of the present invention, the masking portion may be an adhesive polymer tape. In one aspect of the present invention, the masking portion is an adhesive polymer tape, so that when the molding time is short or the molding temperature is low, even a non-heat-resistant adhesive polymer tape will not adhere to the base substrate and can form the separation portion.

[0021] The sensor electrodes can be formed on the front or back surface of the film sheet. Alternatively, the sensor electrodes can be formed on both surfaces of the film sheet. According to one aspect of the present invention, the arrangement of the sensor electrodes can be diversified, thereby realizing a variety of sensors.

[0022] The sensor body and the base substrate can be configured as an integrated molded body. According to one aspect of the present invention, the base substrate and the sensor body are integrated. This allows the sensor body to be formed to match the design shape of the base substrate, enabling sensors with a variety of designs to be realized.

[0023] The sensor according to one aspect of the present invention can be configured to include a circuit board on which a connector is mounted, the circuit board being positioned opposite the bottom surface of the base material. This allows the connector and the circuit board to be disposed close to the bottom surface of the base material, thereby enabling the sensor, including the connector and the circuit board, to be miniaturized.

[0024] The base substrate of one aspect of the present invention has a top surface and a cylindrical side surface, and the tail portion of the sensor sheet can be configured to face inward of the side surface. In this way, the tail portion is positioned in the cylindrical space inside the base substrate, allowing the sensor to be miniaturized. [Effects of the Invention]

[0025] According to one aspect of the present invention, the risk of wiring breaking when the tail portion of the sensor sheet is bent can be reduced. [Brief explanation of the drawings]

[0026] [Figure 1] FIG. 1 is a schematic plan view of a capacitance sensor according to a first embodiment. [Figure 2] FIG. 2 is a schematic front view of the capacitance sensor of FIG. 1. [Figure 3] 2 shows the capacitance sensor of FIG. 1, where sub-figure A is a cross-sectional view taken along line IIIA-IIIA in FIG. 1, and sub-figure B is a cross-sectional view taken along line IIIB-IIIB in FIG. [Figure 4] 2A to 2C are explanatory views showing an example of a method for manufacturing the capacitance sensor of FIG. 1. [Figure 5] 3B is a cross-sectional view corresponding to FIG. 3A in a state where the tail portion shown in FIG. 3A is bent downward. FIG. [Figure 6] 6 is a cross-sectional view corresponding to FIG. 3A, showing a state in which the tail portion shown in FIG. 5 is bent onto the rear surface of the base material. [Figure 7] FIG. 4 is an explanatory diagram of a capacitance sensor according to a first modified example of the first embodiment. [Figure 8] 10A and 10B are explanatory diagrams of a capacitance sensor according to a second modified example of the first embodiment. [Figure 9] FIG. 4 is a cross-sectional view of the capacitance sensor according to the second embodiment, corresponding to FIG. 3B. [Figure 10] 10A and 10B are explanatory diagrams illustrating a joint portion between a base material and a sensor sheet of a capacitance sensor according to another modified example. DETAILED DESCRIPTION OF THE INVENTION

[0027] The present invention will be described in further detail based on the following embodiments. In the following embodiments, a capacitance sensor will be described as a specific example of a sensor according to one aspect of the present invention. Note that components common to the embodiments will be assigned the same reference numerals and redundant explanations will be omitted. Furthermore, redundant explanations of materials, actions, effects, etc. common to the embodiments will be omitted.

[0028] First embodiment (Figs. 1 to 4)

[0029] The capacitance sensor 1 of this embodiment includes a sensor sheet 10 and a base substrate 20.

[0030] The sensor sheet 10 has a sensor body 10a and a tail portion 10b. The sensor body 10a is laminated and fixed to a top surface 20a and a side surface 20b of a base substrate 20. The sensor body 10a and the base substrate 20 constitute a detection portion 1A. The tail portion 10b extends from the detection portion 1A and constitutes a wiring connection portion 1B that is electrically connected to a connector 31 of a circuit board 30, which serves as a "connection object."

[0031] The sensor sheet 10 has a film sheet 11 made of a resin film. The film sheet 11 has a plurality of sensor electrodes 12, terminal portions 13, and a plurality of wirings 14 (14a to 14h) formed by lamination. A resist layer 15 is formed on the outermost surface of the sensor sheet 10 to protect the sensor electrodes 12 and wirings 14, except for the terminal portions 13. The sensor electrodes 12, terminal portions 13, wirings 14, and resist layer 15 are provided as printed layers formed on the film sheet 11. The sensor sheet 10 can also be formed with an ultraviolet-resistant layer, a sulfide-resistant layer, a decorative layer, a primer layer, etc.

[0032] As shown in FIG. 1, the multiple sensor electrodes 12 each form a diamond-shaped surface. The multiple sensor electrodes 12 form circuit patterns (first circuit pattern 12a, second circuit pattern 12b) of the capacitance sensor 1. In FIG. 1, the left-right direction is the X-axis direction and the up-down direction is the Y-axis direction. The first circuit pattern 12a is composed of multiple sensor electrodes 12 whose diagonal vertices are continuously connected in the left-right direction (X-axis direction) of FIG. 1. The first circuit pattern 12a can detect the Y coordinate of the sensor main body 10a because the circuit patterns extending in the X-axis direction are arranged side by side and cross the Y-axis. The second circuit pattern 12b is composed of multiple sensor electrodes 12 whose diagonal vertices are continuously connected in the up-down direction (Y-axis direction) of FIG. 1. The second circuit pattern 12b can detect the X coordinate of the sensor main body 10a because the circuit patterns extending in the Y-axis direction are arranged side by side and cross the X-axis direction. Therefore, by combining the changes in the capacitance of the first circuit pattern 12a and the second circuit pattern 12b, it is possible to detect the XY coordinates where a touch operation is performed.

[0033] As shown in the partially enlarged view of FIG. 3A , the first circuit pattern 12a is formed on the back surface 11b of the film sheet 11. The second circuit pattern 12b is formed on the front surface 11a of the film sheet 11. The first circuit pattern 12a and the second circuit pattern 12b are arranged at positions where the vertices of the diamonds of the sensor electrodes 12 forming the first circuit pattern 12a intersect with the vertices of the diamonds of the sensor electrodes 12 forming the second circuit pattern 12b in a plan view. On the other hand, the diamonds of the sensor electrodes 12 forming the first circuit pattern 12a and the diamonds of the sensor electrodes 12 forming the second circuit pattern 12b are arranged so as not to overlap with each other in the thickness direction of the film sheet 11. The sensor electrodes 12 forming the first circuit pattern 12a and the sensor electrodes 12 forming the second circuit pattern 12b arranged in this manner form an operation coordinate system for detecting the XY coordinates where a touch operation is performed.

[0034] The base substrate 20 is adhered and laminated to the surface 10c of the sensor body 10a of the sensor sheet 10, forming an operation surface for touch operation. Therefore, the sensor sheet 10 and the base substrate 20 are formed as a single unit. This integration allows the sensor body 10a to be formed in a shape that conforms to the base substrate 20. Therefore, although the film sheet 11 is a flat film, it can be formed to have a three-dimensional operation surface, such as a dome or arc shape, depending on the shape of the base substrate 20. Furthermore, the sensor sheet 10 conforms not only to the top surface 20a of the base substrate 20 but also to its cylindrical side surface 20b. This allows the sensor sheet 10 to be formed with rounded corners extending from the top surface 20a to the side surface 20b of the base substrate 20. A resist layer 15 may be further provided on the surface 10c of the sensor body 10a of the sensor sheet 10 and adhered to and laminated on the sensor sheet 10 and the base substrate 20. If the sensor sheet 10 and the base substrate 20 are made of a light-transmitting material, the backlight can pass through.

[0035] The top surface 20a and side surface 20b of the base substrate 20 have a joint surface 40, which serves as a "joint surface" where the base substrate 20 is joined to the film sheet 11 of the sensor sheet 10. As shown in the partial enlargement of FIG. 3A, the film sheet 11 protrudes from an edge 50 of the joint surface 40 to form a tail portion 10b. The boundary between this tail portion 10b and the base substrate 20 forms a separation portion 60, which serves as a "recess" where the base substrate 20 is recessed from an imaginary extension plane of the joint surface 40 formed on the edge 50 of the joint surface 40 formed on the side surface 20b of the base substrate 20. The separation portion 60 is a component of the base substrate 20. The portion of the sensor sheet 10 facing the separation portion 60 is a part of the sensor main body 10a. This portion is not fixed to the base substrate 20 and constitutes a tail support portion 10a1 that flexibly supports the tail portion 10b.

[0036] There are many methods for forming the separation portion 60, but one example will be described with reference to FIG. 4. One method involves interposing a masking material, such as heat-resistant tape 61 or a printed layer, on the surface 11a of the film sheet 11 corresponding to the portion where the separation portion 60 is to be formed. Here, a method for manufacturing the sensor sheet 10 using heat-resistant tape 61 will be described. First, the sensor electrodes 12, wiring 14, and resist layer 15 are formed on the flat film sheet 11 by printing or the like, and then the film sheet 11 is pre-drawn by vacuum forming or the like to form the shape shown in FIG. 4A. Next, as shown in FIG. 4B, heat-resistant tape 61 is attached to the portion of the film sheet 11 where the separation portion 60 will be formed. The heat-resistant tape 61 attached to the film sheet 11 constitutes a "masking portion." The film sheet 11 is then placed in an injection molding die, and molten resin that will become the base substrate 20 is injected and solidified to integrally form the film sheet 11 and base substrate 20 as shown in FIG. 4C. Next, by removing the heat-resistant tape 61, an integrally molded body is obtained, as shown in Fig. 4D, in which the separation portion 60 is formed as a "recess" that is a space approximately the same size as the thickness and area of ​​the heat-resistant tape 61. Thereafter, as shown in Fig. 4E, the tail support portion 10a1 is bent to fold the tail portion 10b.

[0037] The heat-resistant tape 61 is made of a material that does not melt or soften even at the molding temperature at which the sensor sheet 10 is integrated with the base substrate 20. Examples of materials that can be used include polyimide resin, fluororesin, silicone resin, glass cloth, and various metal foils such as aluminum or copper.

[0038] Alternatively, a layer of a heat-resistant polymer composition coated on the surface of a resin film such as polyethylene terephthalate (PET) resin can be used as the heat-resistant tape 61. Examples of heat-resistant polymer compositions include silicone-based, fluorosilicone-based, and fluorine-based polymer compositions.

[0039] The heat-resistant tape 61 preferably further comprises a heat-resistant adhesive on a substrate made of such a material. Examples of the adhesive that can be used include highly heat-resistant adhesives such as acrylic, silicone, and fluorine-based adhesives. When the heat-resistant tape 61 is a resin film having a layer of a heat-resistant polymer composition on the surface thereof, the adhesive is preferably provided on the surface of the resin film opposite the layer of the heat-resistant polymer composition. The surface of the heat-resistant tape 61 is preferably flat and smooth enough to prevent the molten resin that forms the base substrate 20 from sticking to or penetrating the surface.

[0040] In the present embodiment, an example in which heat-resistant tape 61 is used as the "masking portion" is described, but other embodiments are also possible. For example, general-purpose non-heat-resistant adhesive polymer tapes such as cellophane tape, whose base material is a natural polymer, or OPP (Oriented Polypropylene) tape, whose base material is a synthetic polymer, can be used as one embodiment of the "masking portion" of the present invention if the effect of molding time or molding temperature is small. That is, even if these adhesive polymer tapes are non-heat-resistant, if the molding time is short or the molding temperature is low, they do not adhere to the molten resin that forms base substrate 20 and can be peeled off from film sheet 11, so they can be used as the "masking portion" when forming separation portion 60.

[0041] Returning to the explanation of the components of the capacitance sensor 1, the tail portion 10b is a portion that extends from the inner bottom edge 20d of the cylindrical side portion 20b of the base substrate 20 without being fixed to the base substrate 20. The tail portion 10b protrudes from the sensor main body 10a and is provided with a terminal portion 13 at its protruding tip. The wiring 14 extends from the sensor main body 10a of the sensor sheet 10 on the film sheet 11 to the terminal portion 13 through the side surface 11c of the film sheet 11 and the tail portion 10b.

[0042] Specifically, the first circuit pattern 12a of the sensor electrode 12 is formed on the back surface 11b of the film sheet 11. Therefore, the wiring 14 extending from the first circuit pattern 12a is formed on the back surface 11b of the film sheet 11 from the first circuit pattern 12a to the terminal portion 13 of the tail portion 10b.

[0043] In contrast, the second circuit pattern 12b is formed on the front surface 11a of the film sheet 11. Therefore, the wiring 14 extending from the second circuit pattern 12b to the through-hole 10b1 of the tail portion 10b is formed on the front surface 11a of the film sheet 11. The wiring 14 then passes through the through-hole 10b1 to reach the back surface 11b of the film sheet 11, and then extends to the terminal portion 13.

[0044] Therefore, the multiple wirings 14 are all formed on the back surface 11b of the film sheet 11 between the through-hole 10b1 and the terminal portion 13. In contrast, between the sensor main body 10a and the through-hole 10b1, some of the multiple wirings 14 are formed on the front surface 11a of the film sheet 11, and the remaining some are formed on the back surface 11b of the film sheet 11.

[0045] Next, the materials, functions, etc. of each part that forms the capacitance sensor 1 will be described.

[0046] The film sheet 11 is the substrate of the sensor sheet 10 and is a resin film made of a thermoplastic resin. This is because a thermoplastic resin can be easily molded into a shape corresponding to the shape of the base substrate 20 by heating. Examples of materials for such resin films include polyethylene terephthalate (PET) resin, polyethylene naphthalate (PEN) resin, polycarbonate (PC) resin, polymethyl methacrylate (PMMA) resin, polypropylene (PP) resin, polyurethane (PU) resin, polyamide (PA) resin, polyethersulfone (PES) resin, polyetheretherketone (PEEK) resin, triacetyl cellulose (TAC) resin, polyimide (PI) resin, and cycloolefin polymer (COP). When providing a display portion (not shown) displaying some kind of information such as symbols or numbers on the back surface 10d of the sensor sheet 10, it is preferable to use a transparent resin film.

[0047] The thickness of the film sheet 11 is preferably 10 to 500 μm because it needs to have a fixed shape for maintaining its shape, flexibility for bending, etc. The film sheet 11 may also be provided with a primer layer or a surface protection layer for improving adhesion with the conductive polymer that will be the material for the sensor electrode 12 described later, an overcoat layer for the purpose of preventing static electricity, or the like, or may be subjected to a surface treatment in advance.

[0048] The sensor electrode 12 is made of a conductive layer containing a conductive ink or a conductive polymer. If a conductive polymer is used, the sensor electrode 12 is less likely to break even if it is stretched during integral molding with the base substrate 20. Furthermore, it is preferable because it can be formed into a liquid coating and printed, and the sensor electrode 12 can be obtained more inexpensively than ITO, etc. On the other hand, if transparency is not required, the sensor electrode 12 can be formed using a conductive ink such as silver ink or carbon paste. Silver ink is preferable because it can form a sensor electrode 12 with low resistance and excellent sensitivity. On the other hand, carbon paste is preferable because the sensor electrode 12 can be obtained more inexpensively than a conductive polymer and has excellent weather resistance.

[0049] The conductive polymer material for the sensor electrode 12 is a conductive polymer capable of forming a transparent layer. Examples of such transparent conductive polymers include polyparaphenylene, polyacetylene, and PEDOT-PSS (poly-3,4-ethylenedioxythiophene-polystyrene sulfonic acid). The thickness of the sensor electrode 12 is preferably 0.04 to 1.0 μm, and more preferably 0.06 to 0.4 μm. If the thickness is less than 0.04 μm, the resistance of the sensor electrode 12 may be high, while if the thickness exceeds 1.0 μm, the transparency may be reduced. The thickness of the sensor electrode 12 can be measured using an atomic force microscope (AFM) after forming the sensor electrode 12 on the film sheet 11.

[0050] The wiring 14 electrically connects the sensor electrode 12 to the terminal portion 13. The wiring 14 is preferably made of a conductive paste or conductive ink containing a highly conductive metal such as copper, aluminum, silver, or an alloy containing these metals. Among these metals and alloys, silver wiring is preferred because it has high conductivity and is less susceptible to oxidation than copper.

[0051] The thickness of the wiring 14 is preferably 1.0 to 20 μm. If the thickness of the wiring 14 is less than 1.0 μm, the resistance value of the wiring 14 is likely to increase, which may cause noise. On the other hand, if the thickness of the wiring 14 exceeds 20 μm, the step becomes large, which increases the risk of air bubbles being trapped when the resist layer 15 is applied. If air bubbles are trapped, they may burst, creating holes, which may cause the highly conductive metal contained in the wiring 14 to corrode. Furthermore, the resistance value of the wiring 14 is preferably 300 Ω or less. If the resistance value of the wiring 14 exceeds 300 Ω, noise may increase and sensitivity may deteriorate.

[0052] The terminal portion 13 is a connection portion for conductively connecting the capacitance sensor 1 to the connector 31 of the circuit board 30. The terminal portion 13 can be formed by covering the tip of the wiring 14 with carbon ink, for example.

[0053] The resist layer 15 is an insulating protective film provided to prevent electrical conduction between adjacent sensor electrodes 12 and to protect the sensor electrodes 12 from ultraviolet rays, scratches, and the like. The resist layer 15 is transparent. The resist layer 15 also functions to prevent corrosion of the wiring 14 made of silver paste or metal. A hard resin is selected as the resin for the resist layer 15, and examples of resins that can be used include acrylic, urethane, epoxy, polyolefin, and other resins. The thickness of the resist layer 15 is usually 6 to 30 μm, and preferably 10 to 20 μm. This is because a thickness of the resist layer 15 exceeding 30 μm results in poor flexibility, and a thickness of less than 6 μm may result in insufficient protection of the sensor electrodes 12.

[0054] Next, the functions and effects of the capacitance sensor 1 of this embodiment will be described, excluding those already described.

[0055] Generally, in conventional molding methods such as integral molding or insert molding, the film sheet 11 and the base substrate 20 are bonded to each other across their entire lamination surfaces. Therefore, while it is easy to form the tail portion 10b having the wiring 14 in a state extending to the side of the base substrate 20 as shown in FIG. 3A, it is difficult to extend it in any direction at an angle of 90 degrees or more relative to the direction of extension of the film sheet 11, such as downward or inward. However, by providing a separation portion 60 in the film sheet 11 that forms the sensor sheet 10 that is not bonded to the base substrate 20, it is possible to obtain a tail portion 10b that can be easily bent in any direction. That is, as shown in FIG. 5, the tail portion 10b can be easily folded downward along the side surface portion 1A2, and then further folded so that the tail portion 10b is housed inside the base substrate 20 as shown in FIG. 6.

[0056] In the capacitance sensor 1, the tail portion 10b is separated from the bottom inner edge 20d of the base substrate 20 by the separation portion 60, which makes it easy to bend and arrange the tail portion 10b toward the bottom portion 20c of the base substrate 20 as described above. Therefore, the entire capacitance sensor 1, including the arrangement of the tail portion 10b, can be made smaller.

[0057] The base substrate 20 can be configured as a first divided housing of an electronic device. A second divided housing 32 can be combined with the opening 20e of the base substrate 20. An accommodation space is formed inside the housing formed by combining the first divided housing (base substrate 20) and the second divided housing 32. A circuit board 30 can be placed in the accommodation space. The terminal portion 13 of the tail portion 10b can be connected to a connector 31 inside the housing.

[0058] Because the detection unit 1A has a three-dimensional shape with a top surface 1A1 and side surfaces 1A2, the capacitance sensor 1 itself can be provided with three-dimensional shape innovations to enhance design. For example, the top surface 1A1 of the detection unit 1A, which serves as the operation surface, can be formed as a flat surface, a curved surface, or the like. The side surfaces 1A2 can be formed as a cylindrical or polygonal prism-like outer peripheral surface, or the like. Alternatively, the top surface 1A1 and side surfaces 1A2 can be smoothly connected to form a dome shape, or the like.

[0059] The resist layer 15 can reliably protect the sensor electrodes 12 and the wiring 14. Furthermore, the resist layer 15 can reliably insulate the sensor electrodes 12 from each other.

[0060] First Modification of First Embodiment (FIG. 7)

[0061] 7 shows a cross-sectional view of a capacitance sensor 2 according to a first modified example of the first embodiment. The capacitance sensor 2 is such that the heat-resistant tape 61 is left in place without being removed. By leaving the heat-resistant tape 61 in place without peeling it off, the heat-resistant tape 61 becomes a separation portion 60, making it easier to peel off the interface between the heat-resistant tape 61 and the base substrate 20. The rest of the configuration is the same as that of the capacitance sensor 1.

[0062] Second Modification of the First Embodiment (FIG. 8)

[0063] FIG. 8 shows a cross-sectional view of a capacitance sensor 3 according to a second modification of the first embodiment. As an alternative to the heat-resistant tape 61 used in the capacitance sensor 2 according to the first modification, a method of applying heat-resistant paint to the surface 11a of the film sheet 11 can be used. A coating layer 62 applied to the surface 11a of the film sheet 11 and cured forms a "masking portion." For example, a heat-resistant paint containing an inorganic filler in a fluorine-based or silicone-based base can be used as the heat-resistant paint. Alternatively, a heat-curing or ultraviolet-curing paint can be used. Leaving the coating layer 62 as is instead of removing it forms a separation portion 60, facilitating peeling at the interface between the coating layer 62 and the base substrate 20. The remaining configuration is the same as that of the capacitance sensor 2.

[0064] Second embodiment (Fig. 9)

[0065] The capacitance sensor 4 of the second embodiment is characterized by having a notch 10e in a portion of the sensor sheet 10 facing the separation portion 60. The rest of the configuration is similar to that of the capacitance sensor 1. FIG. 9 shows a cross-sectional view of the capacitance sensor 4 having the notch 10e. Compared to the capacitance sensor 1 of the first embodiment shown in FIG. 3B which does not have the notch 10e, the tail portion 10b is more likely to bend inward of the base material 20.

[0066] The incisions 10e must be wide enough to prevent the penetration of molten resin that forms the base substrate 20. A wider incision 10e is undesirable because the molten resin may penetrate and cause the sensor sheet 10 to bond to the incision. The masking portion and heat-resistant tape 61 are preferably provided to cover the incision 10e. This is to facilitate preventing molten resin from penetrating the incision 10e when the sensor sheet 10 and the base substrate 20 are integrally molded. The masking portion and heat-resistant tape 61 can also be peeled off and removed after integral molding, as in the capacitance sensor 2 according to the first modification of the first embodiment. The portions of the film sheet 11 sandwiched between the incisions 10e in the tail portion 10b protruding from the lower end of the side surface portion 1A2 and in the portion facing the side surface portion 1A2 can be separated from the base substrate 20 and bent and extended toward the inside of the base substrate 20 by the length of the incision 10e.

[0067] Other variations

[0068] In the above embodiment, the capacitive sensor 1 has been described in which the sensor main body 10a is formed into an upwardly convex shape by drawing, and the surface 10c of the sensor sheet 10 is covered with the base substrate 20, and the tail portion 10b protrudes outward from the sensor main body 10a, but the length of the tail portion 10b may be set to fit within the side surface 20b of the base substrate 20. However, it is necessary to electrically connect the tail portion 10b to the connector 31 away from the side surface 20b, so a notch 10e is provided so that the portion sandwiched between the notches 10e becomes the tail portion 10b.

[0069] The shape and orientation of the joint between the sensor sheet 10 and the base substrate 20 are not particularly limited, and may be such that a separation portion 60 is formed between the sensor sheet 10 provided at the lower end of the base substrate 20, as shown in Figure 10.

[0070] The above-described embodiment is merely an example of the present invention, and modifications of the embodiment or additions or combinations of known techniques may be made without departing from the spirit of the present invention, and such techniques are also included in the scope of the present invention. For example, the wiring 14 arranged on both ends of the tail portion 10b may be provided on either the front surface 11a or the back surface 11b of the film sheet 11.

[0071] The capacitance sensors 1, 2, and 3 of the above-described embodiments may be provided with a decorative layer including coloring and display portions of letters, numbers, symbols, etc. The resist layer 15 may be configured as the decorative layer, and in this case, a protective layer may be provided to protect the decorative layer. [Explanation of symbols]

[0072] 1 Capacitive sensor (sensor, first embodiment) 1A Detection unit 1A1 Top section 1A2 Side part 1B Wiring connection 2 Capacitive sensor (sensor, first modified example of the first embodiment) 3. Capacitive sensor (sensor, second modified example of the first embodiment) 4 Capacitive sensor (sensor, second embodiment) 10 Sensor sheet 10a Sensor body 10a1 Tail support 10b Tail section 10b1 through hole 10c surface 10d back 10e notch 11 film sheets 11a surface 11b Back side 11c side 12 Sensor electrode 12a First circuit pattern 12b Second circuit pattern 13 Terminal section 14 Wiring 15 Resist layer 16 Bend 16a Outer curved surface 16b Inner curved surface 20 Base Material 20a Top section 20b Side part 20c Bottom part 20d bottom inner edge 20e opening 30 Circuit Board 31 Connector 32 Second division housing 40 Joint surface 50 Edge of joint surface 60 Separation part 61 Heat-resistant tape (masking part, heat-resistant resin part) 62 Paint layer (masking part, heat-resistant resin part)

Claims

1. A base substrate and a sensor sheet fixed to the base substrate, The sensor sheet has a sensor body having a sensor electrode, and a tail portion having wiring electrically connected to the sensor electrode, the tail portion protruding and extending beyond the base substrate and the sensor body, the sensor sheet is not fixed to the base substrate, but is positioned so as to overlap the base substrate, and has a tail support portion that is provided at an end of the sensor body, is connected to the tail portion, and supports the tail portion in a bendable manner; The base substrate is a joint surface portion that is fixed to the sensor main body portion; a separation portion provided at a position facing the tail support portion and not fixed to the tail support portion, The separation portion is provided between the base material and the tail support portion. Sensor.

2. A base substrate and a sensor sheet are provided, The sensor sheet has a sensor body having a sensor electrode, and a tail portion having wiring electrically connected to the sensor electrode and projecting and extending from the sensor body, the sensor sheet has a tail support portion connected to the tail portion and supporting the tail portion in a bendable manner, The base substrate is a joint surface portion that is fixed to the sensor main body portion; a separation portion provided at a position opposite to the tail support portion and consisting of a gap that is not fixed to the tail support portion; Sensor.

3. The base substrate has a three-dimensional shape having a top surface and a side surface, and the surface is a touch-operated surface. Form an operation surface for The sensor according to claim 1 or 2.

4. The separation portion is located at the lower end of the side surface portion opposite the top surface portion. The sensor of claim 3.

5. The base substrate has a dome-shaped or arc-shaped three-dimensional operation surface. The sensor according to claim 1 or 2.

6. The sensor sheet has a notch that is released from the constraint of the base substrate and facilitates deformation of the tail support portion. The sensor according to any one of claims 1 to 5.

7. An electronic device comprising the sensor according to any one of claims 1 to 6, The tail portion is configured to be folded toward the inside of the base substrate and to be incorporated into the electronic device. electronic equipment.

8. The base material is a housing of the electronic device.

8. The electronic device according to claim 7.

9. A base substrate and a sensor sheet fixed to the base substrate, the sensor sheet has a sensor body having a sensor electrode, and a tail portion having wiring electrically connected to the sensor electrode, the tail portion protruding and extending beyond the base substrate and the sensor body, In the method for manufacturing a sensor, the base substrate made of a resin material is integrally molded with the sensor sheet, the sensor sheet is not fixed to the base substrate, but is positioned so as to overlap the base substrate, and has a tail support portion that is provided at an end of the sensor body, is connected to the tail portion, and supports the tail portion in a bendable manner; a masking portion that does not adhere to the resin material is provided on the tail support portion; The base material is integrally molded to cover the masking portion. How sensors are manufactured.

10. A base substrate and a sensor sheet are provided, the sensor sheet has a sensor body having a sensor electrode, and a tail portion having wiring electrically connected to the sensor electrode and projecting and extending from the sensor body, In the method for manufacturing a sensor, the base substrate made of a resin material is integrally molded with the sensor sheet, the sensor sheet has a tail support portion connected to the tail portion and supporting the tail portion in a bendable manner, a masking portion that does not adhere to the resin material is provided on the tail support portion; The base material is integrally molded so as to cover the masking portion, By removing the masking portion, a separation portion consisting of a gap that is not fixed to the tail support portion is formed at a position of the base material facing the tail support portion. How sensors are manufactured.

11. A method for manufacturing an electronic device including the sensor according to claim 9 or 10, comprising: The tail portion is folded toward the inside of the base material and is incorporated into the electronic device. Manufacturing methods for electronic devices.

12. The base material is a housing of the electronic device. The method for manufacturing an electronic device according to claim 11.

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