Substrate processing system

Abstract

To provide a technique for improving the efficiency of substrate transport.SOLUTION: A substrate processing system includes a load port arranged at a first height, a plurality of upper magnetic levitation vacuum transfer units arranged at a second height, a plurality of upper substrate processing modules, a plurality of lower magnetic levitation vacuum transfer units arranged at a third height lower than the second height, a plurality of lower magnetic levitation vacuum transfer units, and a load lock module configured so that its interior can be switched between an atmospheric environment and a vacuum environment.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] SUMMARY OF THE INVENTION An exemplary embodiment of the present disclosure relates to a substrate processing system. [Background technology]

[0002] Patent Document 1 discloses a magnetic levitation type transfer device that transfers a substrate between a vacuum transfer chamber and a processing chamber of a substrate processing system. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2023 / 85667 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides techniques for increasing the efficiency of substrate transport. [Means for solving the problem]

[0005] In one exemplary embodiment of the present disclosure, a load port is provided, the load port being arranged at a first height; a plurality of upper magnetic levitation vacuum transport units being arranged at a second height, the plurality of upper magnetic levitation vacuum transport units being connected horizontally along a first direction; a plurality of upper substrate processing modules, each upper substrate processing module being connected to one of the plurality of upper magnetic levitation vacuum transport units; a plurality of lower magnetic levitation vacuum transport units being arranged at a third height lower than the second height, the plurality of lower magnetic levitation vacuum transport units being connected horizontally along the first direction; and a plurality of lower substrate processing modules, each lower substrate processing module being connected to one of the plurality of upper magnetic levitation vacuum transport units. a load lock module whose interior can be switched between an atmospheric environment and a vacuum environment, the load lock module being configured to transport at least one substrate between the load lock module and a substrate container on the load port in the atmospheric environment, to transport at least one substrate in a vertical direction, to transport at least one substrate between the load lock module and any of the plurality of upper magnetic levitation vacuum transfer units in the vacuum environment, and to transport at least one substrate between the load lock module and any of the plurality of lower magnetic levitation vacuum transfer units in the vacuum environment. [Effects of the Invention]

[0006] According to one exemplary embodiment of the present disclosure, a technique for improving substrate transport efficiency can be provided. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a diagram illustrating an example of a substrate processing system 1. FIG. [Figure 2] 1 is a diagram illustrating an example of a substrate processing system 1. FIG. [Figure 3A]10 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. [Figure 3B] 10 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. [Figure 3C] 10 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. [Figure 3D] 10 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. [Figure 3E] 10 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. [Figure 3F] 10 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. [Figure 4] FIG. 2 is a diagram for explaining the layout of the devices in the substrate processing system 1. [Figure 5A] FIG. 10 is a diagram for explaining another example of the device layout of the substrate processing system 1. [Figure 5B] FIG. 10 is a diagram for explaining another example of the device layout of the substrate processing system 1. [Figure 6] 10A and 10B are diagrams for explaining other examples of the upper substrate processing module and the lower substrate processing module. [Figure 7] 10A and 10B are diagrams for explaining other examples of the upper vacuum transfer unit and the lower vacuum transfer unit. [Figure 8] 10A and 10B are diagrams for explaining other examples of the upper vacuum transfer unit and the lower vacuum transfer unit. [Figure 9] 10A and 10B are diagrams for explaining other examples of the upper vacuum transfer unit and the lower vacuum transfer unit. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, each embodiment of the present disclosure will be described.

[0009] In one exemplary embodiment, the load port includes a load port disposed at a first height, a plurality of upper magnetic levitation vacuum transport units disposed at a second height, the plurality of upper magnetic levitation vacuum transport units being connected horizontally along a first direction, a plurality of upper substrate processing modules, each upper substrate processing module being connected to one of the plurality of upper magnetic levitation vacuum transport units, a plurality of lower magnetic levitation vacuum transport units disposed at a third height lower than the second height, the plurality of lower magnetic levitation vacuum transport units being connected horizontally along the first direction, and a plurality of lower substrate processing modules, each lower substrate processing module being connected to a plurality of and a load lock module configured to have an interior switchable between an atmospheric environment and a vacuum environment, the load lock module being configured to transport at least one substrate between the load lock module and a substrate container on a load port in the atmospheric environment, to transport at least one substrate in a vertical direction, to transport at least one substrate between the load lock module and any of the plurality of upper magnetic levitation vacuum transfer units in the vacuum environment, and to transport at least one substrate between the load lock module and any of the plurality of lower magnetic levitation vacuum transfer units in the vacuum environment.

[0010] In one exemplary embodiment, the first height is greater than the second height.

[0011] In one exemplary embodiment, the load lock module is connected on a first side to one of a plurality of upper magnetic levitation vacuum transport units and is connected on a first side to one of a plurality of lower magnetic levitation vacuum transport units.

[0012] In one exemplary embodiment, the load lock module is connected at a first side to a load port.

[0013] In one exemplary embodiment, the system further includes a vertical transfer robot disposed within the load lock module, the vertical transfer robot configured to transfer a stack of substrates between the load lock module and a substrate container on the load port, and to transfer the stack of substrates vertically.

[0014] In one exemplary embodiment, the load lock module includes a vertical planar motor extending in a vertical direction, and the vertical transport robot is configured to move vertically while magnetically levitating on the vertical planar motor to vertically transport a stack of multiple substrates.

[0015] In one exemplary embodiment, each of the plurality of upper magnetically levitated vacuum transport units includes an upper horizontal planar motor extending horizontally, and the substrate processing system further includes an upper horizontal transport robot configured to move horizontally while magnetically levitating on the upper horizontal motor to transport at least one substrate between the load lock module and the plurality of upper substrate processing modules.

[0016] In one exemplary embodiment, each of the plurality of lower magnetically levitated vacuum transport units includes a lower horizontal planar motor extending horizontally, and the substrate processing system further includes a lower horizontal transport robot configured to move horizontally while magnetically levitated on the lower horizontal motor to transport at least one substrate between the load lock module and the plurality of lower substrate processing modules.

[0017] In one exemplary embodiment, each of the plurality of upper magnetic levitation vacuum transport units includes an upper horizontal planar motor extending horizontally, and the substrate processing system further includes a plurality of upper horizontal transport robots configured to move horizontally while magnetically levitating on the upper horizontal motors to simultaneously transport a plurality of substrates between the load lock module and the plurality of upper substrate processing modules.

[0018] In one exemplary embodiment, each of the plurality of lower magnetically levitated vacuum transport units includes a lower horizontal planar motor extending horizontally, and the substrate processing system further includes a plurality of lower horizontal transport robots configured to move horizontally while magnetically levitating on the lower horizontal motors to simultaneously transport a plurality of substrates between the load lock module and the plurality of lower substrate processing modules.

[0019] In one exemplary embodiment, at least one of the plurality of upper substrate processing modules and the plurality of lower substrate processing modules comprises a chamber configured to process four substrates simultaneously.

[0020] In one exemplary embodiment, at least one of the plurality of upper substrate processing modules and the plurality of lower substrate processing modules comprises a chamber configured to process two substrates simultaneously.

[0021] In one exemplary embodiment, at least one chamber of the plurality of upper substrate processing modules and at least one chamber of the plurality of lower substrate processing modules are connected to the same gas supply.

[0022] In one exemplary embodiment, at least one chamber of the plurality of upper substrate processing modules and at least one chamber of the plurality of lower substrate processing modules are connected to the same exhaust system.

[0023] In one exemplary embodiment, at least one upper magnetic levitation vacuum transport unit and at least one lower magnetic levitation vacuum transport unit are arranged vertically one above the other and communicate with each other via an opening.

[0024] In one exemplary embodiment, the system further includes a lifting and lowering transport robot configured to lift and lower the at least one upper magnetic levitation vacuum transport unit and the at least one lower magnetic levitation vacuum transport unit through the opening to transport the at least one substrate.

[0025] In one exemplary embodiment, the lifting and transporting robot includes a mounting table on which at least one substrate is placed, and a top portion disposed vertically above the mounting table and having a shape corresponding to the opening, and the lifting and transporting robot is configured to move up and down vertically between an upper transport position where the mounting table is disposed vertically above the opening, a waiting position where the top portion is disposed at the opening, and a lower transport position where the top portion is disposed vertically below the opening.

[0026] In one exemplary embodiment, at least one upper magnetically levitated vacuum transport unit includes an upper horizontal planar motor extending horizontally, and the substrate processing system further includes an upper horizontal transport robot configured to move horizontally while magnetically levitating on the upper horizontal motor to transport at least one substrate between the platform of the lifting transport robot located in the upper transport position.

[0027] In one exemplary embodiment, the top of the lift transport robot is configured to function as part of the upper horizontal planar motor when the lift transport robot is in a standby position.

[0028] In one exemplary embodiment, at least one lower magnetically levitated vacuum transport unit includes a lower horizontal planar motor extending horizontally, and the substrate processing system further includes a lower horizontal transport robot configured to move horizontally while magnetically levitating on the lower horizontal motor to transport at least one substrate between the platform of the lifting transport robot located in the lower transport position.

[0029] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are designated by the same reference numerals, and redundant explanations will be omitted. Unless otherwise specified, the positional relationships, such as up, down, left, and right, will be described based on the positional relationships shown in the drawings. The dimensional ratios in the drawings do not represent actual ratios, and the actual ratios are not limited to the ratios shown in the drawings.

[0030] <Configuration example of substrate processing system> 1 and 2 are diagrams illustrating an example of a substrate processing system 1 according to an embodiment. Fig. 1 is a schematic perspective view of the substrate processing system 1. Fig. 2 is a schematic front view of the substrate processing system 1 (viewed in the direction of arrow A in Fig. 1). For convenience, Fig. 2 illustrates internal components of some of the devices in a transparent manner.

[0031] 1 and 2, the substrate processing system 1 includes a load port (LP) 10, a load lock module (LLM) 20, an upper vacuum transfer unit 30, an upper substrate processing module 40, a lower vacuum transfer unit 50, and a lower substrate processing module 60. The upper vacuum transfer unit 30 and the lower vacuum transfer unit 50 are also referred to as the upper vacuum transfer module (VTM) and the lower vacuum transfer module, respectively. The upper substrate processing module 40 and the lower substrate processing module 60 are also referred to as the upper process module (PM) and the lower process module, respectively.

[0032] The substrate processing system 1 is controlled by a control unit CU (see FIG. 2). The control unit CU has a memory, a processor, and an input / output interface. Data such as recipes, programs, etc. are stored in the memory. The memory is, for example, a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), or a solid state drive (SSD). The processor executes a program read from the memory to control each part of the substrate processing system 1 via the input / output interface based on data such as recipes stored in the memory. The processor is, for example, a central processing unit (CPU), a digital signal processor (DSP), etc.

[0033] The load port 10 has a mounting surface 10a. A container C is mounted on the mounting surface 10a. The container C may be configured to accommodate a stack ST of multiple (e.g., 25) substrates W. The container C may be, for example, a FOUP (Front-Opening Unified Pod). The container C is transported by a container transport mechanism such as an OHT (Overhead Hoist Transport) and mounted on the load port 10. The container C is an example of a "substrate storage container" in this disclosure. In one embodiment, multiple load ports 10 may be provided for one load lock module 20.

[0034] The load lock module 20 includes an internal pressure variable chamber 20a. The internal pressure variable chamber 20a is configured to be switchable between vacuum and atmospheric pressure. The internal pressure variable chamber 20a has, for example, a housing having a substantially rectangular parallelepiped shape. The internal pressure variable chamber 20a may include an exhaust device and a gas supply device. For example, the control unit CU controls the exhaust device to exhaust air from the internal pressure variable chamber 20a and switch the internal atmosphere from atmospheric to vacuum. Furthermore, for example, the control unit CU controls the gas supply device to supply, for example, clean air into the internal pressure variable chamber 20a and switch the internal atmosphere from vacuum to atmospheric.

[0035] The internal pressure variable chamber 20a is connected to the container C on the load port 10 via a gate valve GV1. The gate valve GV1 is provided on one of the side surfaces of the housing of the internal pressure variable chamber 20a. In the example shown in FIG. 2, the gate valve GV1 is provided on the side surface 20s1 of the housing of the internal pressure variable chamber 20a.

[0036] The internal pressure variable chamber 20a is connected to the upper vacuum transfer unit 30 via a gate valve GV2. The internal pressure variable chamber 20a is connected to the lower vacuum transfer unit 50 via a gate valve GV4. In the example shown in FIG. 2, the gate valves GV2 and GV4 are provided on the same side 20s1 as the gate valve GV1. The gate valve GV2 is provided vertically (z-direction) below the gate valve GV1. The gate valve GV4 is provided vertically (z-direction) below the gate valve GV2. In the example shown in FIG. 2, the load port 10, the upper vacuum transfer unit 30, and the lower vacuum transfer unit 50 are arranged on the same side (side 20s1) of the load lock module 20. In one embodiment, the upper vacuum transfer unit 30 and the lower vacuum transfer unit 50 are arranged on the same side (side 20s1) of the load lock module 20, and the load port 10 is arranged on the side 20s2 opposite the side 20s1.

[0037] The bottom surface of the load port 10 is disposed at a first height (h1) from the ground surface of the substrate processing system 1. The bottom surface of the upper vacuum transfer unit 30 is disposed at a second height (h2) from the ground surface of the substrate processing system 1. The bottom surface of the lower vacuum transfer unit 50 is disposed at a third height (h3) from the ground surface of the substrate processing system 1. The third height (h3) is lower than the second height (h2).

[0038] In one embodiment, the first height (h1) is different from the second height (h2) and the third height (h3). In the example shown in FIG. 2, the first height (h1) is higher than the second height (h2) and the third height (h3) (h1>h2>h3). In one embodiment, the first height (h1) is lower than the second height (h2) and higher than the third height (h3) (h2>h1>h3). In one embodiment, the first height (h1) is lower than the second height (h2) and the third height (h3) (h2>h3>h1). In one embodiment, the first height (h1) is the same as the second height (h2) and higher than the third height (h3) (h1=h2>h3). In one embodiment, the first height (h1) is lower than the second height (h2) and the third height (h3) (h2>h1=h3).

[0039] A vertical transfer robot 22 is disposed inside the internal pressure variable chamber 20a. The vertical transfer robot 22 includes an arm 22a. The arm 22a is configured to be able to rotate, extend, and move up and down freely. The arm 22a has a plurality of end effectors 22b. Each end effector 22b is configured to be able to place a respective substrate W in the stack ST thereon.

[0040] The vertical transfer robot 22 is configured to move up and down in the vertical direction while being magnetically levitated on the vertical planar motor 24. The vertical planar motor 24 is disposed extending in the vertical direction of the load lock module 20. The vertical planar motor 24 may be provided, for example, on the side surface 20s2 opposite to the side surface 20s1. The vertical planar motor 24 is configured by an array of multiple coils. Each coil generates a magnetic field when supplied with current. The control unit CU individually controls the value of the current passed through each coil, thereby controlling the up and down movement of the vertical transfer robot 22.

[0041] The vertical transfer robot 22 transfers the substrate W based on operation instructions output by the control unit CU. For example, the vertical transfer robot 22 transfers at least one substrate W between the load lock module 20 and a container C on the load port 10 in an atmospheric environment. Also, for example, the vertical transfer robot 22 holds at least one substrate W with an arm 22a and transfers the substrate W up and down in the vertical direction within the load lock module 20. In one embodiment, the vertical transfer robot 22 may collectively transfer a stack ST of multiple substrates W using multiple end effectors 22b of the arm 22a. In one embodiment, multiple vertical transfer robots 22 may be provided.

[0042] The upper vacuum transfer unit 30 includes a vacuum chamber 30a. The vacuum chamber 30a may have a housing having a substantially rectangular parallelepiped shape. The vacuum chamber 30a is connected to the load lock module 20 via the gate valve GV2 described above. The vacuum chamber 30a is also connected to the upper substrate processing module 40 via the gate valve GV3.

[0043] A magnetically levitated upper horizontal transfer robot 32 is disposed within the vacuum chamber 30a of the upper vacuum transfer unit 30. In one embodiment, the upper horizontal transfer robot 32 includes an arm 32a. The arm 32a is configured to be able to rotate, extend, and move up and down freely. The arm 32a includes one or more end effectors 32b. The end effector 32b is configured to be able to place one substrate W thereon.

[0044] The upper horizontal transfer robot 32 is configured to move in the horizontal direction (x and y directions) while being magnetically levitated on the upper horizontal planar motor 34. The upper horizontal planar motor 34 is disposed on the bottom surface of the upper vacuum transfer unit 30, extending in the horizontal direction. The upper horizontal planar motor 34 is configured with an array of multiple coils. Each coil generates a magnetic field when supplied with current. The control unit CU individually controls the value of the current passed through each coil, thereby controlling the horizontal movement of the upper horizontal transfer robot 32.

[0045] The upper horizontal transfer robot 32 transfers the substrate W based on an operation instruction output by the control unit CU. For example, the upper horizontal transfer robot 32 transfers at least one substrate W between the load lock module 20 and the upper vacuum transfer unit 30 in a vacuum environment. Also, for example, the upper horizontal transfer robot 32 transfers the substrate W between the upper vacuum transfer unit 30 and the upper substrate processing module 40 in a vacuum environment. In one embodiment, a plurality of upper horizontal transfer robots 32 may be provided. The upper vacuum transfer unit 30 is an example of an "upper magnetic levitation vacuum transfer unit" in the present disclosure.

[0046] The upper substrate processing module 40 includes a processing chamber 40a. The processing chamber 40a is configured to be depressurized to a predetermined vacuum atmosphere and to perform a desired process (etching process, film formation process, cleaning process, ashing process, etc.) on a substrate W therein. The processing chamber 40a is disposed adjacent to the upper vacuum transfer unit 30. The processing chamber 40a may include a stage 40b on which the substrate W is placed. The operation of each component for processing in the processing chamber 40a may be controlled by a control unit CU. For example, the control unit CU generates plasma from a processing gas introduced into the processing chamber 40a and performs an etching process on the substrate W on the stage 40b using the plasma. In one embodiment, the processing chamber 40a may include multiple stages 40b (e.g., two or four). That is, the upper substrate processing module 40 may be configured to simultaneously process multiple substrates W in the processing chamber 40a.

[0047] The lower vacuum transfer unit 50 includes a vacuum chamber 50a. The vacuum chamber 50a has, for example, a housing having a substantially rectangular parallelepiped shape. The vacuum chamber 50a is connected to the load lock module 20 via the gate valve GV4 described above. The vacuum chamber 50a is also connected to the lower substrate processing module 60 via the gate valve GV5.

[0048] A magnetically levitated lower horizontal transfer robot 52 is disposed within the vacuum chamber 50a of the lower vacuum transfer unit 50. In one embodiment, the lower horizontal transfer robot 52 includes an arm 52a. The arm 52a is configured to be able to rotate, extend, and move up and down freely. The arm 52a includes one or more end effectors 52b. The end effector 52b is configured to be able to place one substrate W thereon.

[0049] The lower horizontal transfer robot 52 is configured to move horizontally (x and y directions) while being magnetically levitated on the lower horizontal planar motor 54. The lower horizontal planar motor 54 is disposed extending horizontally on the bottom surface of the lower vacuum transfer unit 50. The lower horizontal planar motor 54 is configured with an array of multiple coils. Each coil generates a magnetic field when supplied with current. The control unit CU individually controls the value of the current passed through each coil, thereby controlling the horizontal movement of the lower horizontal transfer robot 52.

[0050] The lower horizontal transfer robot 52 transfers the substrate W based on an operation instruction output by the control unit CU. For example, the lower horizontal transfer robot 52 transfers at least one substrate W between the load lock module 20 and the lower vacuum transfer unit 50 in a vacuum environment. Also, for example, the lower horizontal transfer robot 52 transfers the substrate W between the lower vacuum transfer unit 50 and the lower substrate processing module 60 in a vacuum environment. In one embodiment, a plurality of lower horizontal transfer robots 52 may be provided. The lower vacuum transfer unit 50 is an example of a "lower magnetic levitation vacuum transfer unit" in the present disclosure.

[0051] The lower substrate processing module 60 includes a processing chamber 60a. The processing chamber 60a is configured to be depressurized to a predetermined vacuum atmosphere and to perform a desired process (etching process, film formation process, cleaning process, ashing process, etc.) on a substrate W therein. The processing chamber 60a is disposed adjacent to the lower vacuum transfer unit 50. The processing chamber 60a may include a stage 60b on which the substrate W is placed. The operation of each component for processing in the processing chamber 60a may be controlled by a control unit CU. For example, the control unit CU generates plasma from a processing gas introduced into the processing chamber 60a and performs an etching process on the substrate W on the stage 60b using the plasma. In one embodiment, the processing chamber 60a may include multiple stages 60b (e.g., two or four). That is, the lower substrate processing module 60 may be configured to simultaneously process multiple substrates W in the processing chamber 60a.

[0052] <Example of Transfer Operation of Substrate Processing System 1> 3A to 3F are diagrams illustrating an example of a transfer operation of the substrate processing system 1. Here, as an example of the transfer operation, an operation will be described in which a substrate W accommodated in a container C on the load port 10 is transferred to the processing chamber 40a of the upper substrate processing module 40 via the upper vacuum transfer unit 30. This operation may be realized by the control unit CU controlling each part of the substrate processing system 1. At the start of the operation, the gate valves GV1 to GV5 are closed, and the internal pressure variable chamber 20a of the load lock module 20 is in an atmospheric atmosphere. The vacuum chamber 30a of the upper vacuum transfer unit 30 and the processing chamber 40a of the upper substrate processing module 40 are in a vacuum atmosphere. The vacuum chamber 50a of the lower vacuum transfer unit 50 and the processing chamber 60a of the lower substrate processing module 60 are in a vacuum atmosphere.

[0053] 3A, the vertical transfer robot 22 is raised to a first transfer height (h11) corresponding to the position of the load port 10. Then, the gate valve GV1 and the lid of the container C are opened, and the arm 22a of the vertical transfer robot 22 is inserted into the container C. Then, each substrate W in the stack ST in the container C is placed on each of the multiple end effectors 22b.

[0054] 3B, the arm 22a of the vertical transfer robot 22 holding the stack ST is returned to the internal pressure variable chamber 20a of the load lock module 20, and the gate valve GV1 is closed. As a result, all of the substrates W (stack ST) in the container C are transferred collectively into the internal pressure variable chamber 20a of the load lock module 20.

[0055] 3C, the vertical transfer robot 22, while holding the stack ST, is lowered vertically to a second transfer height (h21) corresponding to the position of the upper vacuum transfer unit 30. When the vertical transfer robot 22 is lowered, the air in the internal pressure variable chamber 20a may be discharged by an exhaust device, thereby switching the internal pressure variable chamber 20a from an atmospheric atmosphere to a vacuum atmosphere. The switch from an atmospheric atmosphere to a vacuum atmosphere may be performed before or after the vertical transfer robot 22 is lowered.

[0056] Next, as shown in Fig. 3D, the gate valve GV2 is opened. The upper horizontal transfer robot 32 moves horizontally to the vicinity of the gate valve GV2, and the end effector 32b is inserted into the internal pressure variable chamber 20a. Then, one substrate W in the stack ST is placed on the end effector 32b.

[0057] 3E, the end effector 32b of the upper horizontal transfer robot 32, while holding the substrate W, is returned to the vacuum chamber 30a of the upper vacuum transfer unit 30, and the gate valve GV2 is closed. As a result, one substrate W in the stack ST is transferred into the vacuum chamber 30a.

[0058] 3F, the gate valve GV3 is opened, and the upper horizontal transfer robot 32 moves horizontally to the vicinity of the gate valve GV3. Then, the end effector 32b holding the substrate W is inserted into the processing chamber 40a of the upper substrate processing module 40. As a result, the substrate W is placed on the stage 40b in the processing chamber 40a. The substrate W may be placed on, for example, a plurality of pins configured to be movable up and down in the vertical direction from the stage 40b.

[0059] In this manner, the substrate W accommodated in the container C placed on the load port 10 is transported to the processing chamber 40a of the upper substrate processing module 40. Note that the substrate W processed in the processing chamber 40a of the upper substrate processing module 40 may be transported to the container C on the load port 10 by reversing the above procedure.

[0060] The substrate W may be transferred between the container C on the load port 10 and the lower substrate processing module 60 in the same manner as described above. In this case, the vertical transfer robot 22, while holding the stack ST, is lowered vertically to a third transfer height corresponding to the position of the lower vacuum transfer unit 50. Note that a plurality of vertical transfer robots 22 may be provided. For example, one vertical transfer robot 22 may transfer the substrate W to the upper vacuum transfer unit 30, while another vertical transfer robot 22 may transfer the substrate W to the lower vacuum transfer unit 50.

[0061] The substrate processing system 1 can transport the substrate W via the upper substrate processing module 40 and the lower substrate processing module 60 in parallel. This can improve the substrate transport efficiency. The substrate processing system 1 can also process the substrate W in the upper substrate processing module 40 and the lower substrate processing module 60 in parallel. Since the substrate processing system 1 can transport and process the substrate W in two stages, upper and lower, it can increase productivity while reducing the installation area of ​​the substrate processing system 1. In other words, productivity per unit area can be improved.

[0062] <Example of equipment layout of substrate processing system 1> FIG. 4 is a diagram for explaining the equipment layout of the substrate processing system 1. FIG. 4 shows the equipment layout when the substrate processing system 1 is viewed in a plane (xy plane). In FIG. 4, "LLM" indicates a "load lock module 20." "VTM" indicates an "upper vacuum transfer unit 30" and a "lower vacuum transfer unit 50" arranged vertically below it. "PM" indicates an "upper substrate processing module 40" and a "lower substrate processing module 60" arranged vertically below it.

[0063] In the example shown in Fig. 4, the LLM, upper VTM, and upper PM blocks are arranged side by side in the y direction. Also, the LLM, lower VTM, and lower PM blocks are arranged side by side in the y direction. Although not shown in Fig. 4, the blocks may be connected to each other via gate valves GV2 to GV5 (hereinafter collectively referred to as "gate valves") in an openable and closable manner, as shown in Fig. 2.

[0064] In one embodiment, the substrate processing system 1 may be configured such that one or more blocks of the LLM, upper VTM, and upper PM are connected in a first horizontal direction (x-y direction). The substrate processing system 1 may also be configured such that one or more blocks of the LLM, lower VTM, and lower PM are connected in a second horizontal direction (x-y direction). In one embodiment, the first direction and the second direction are the same. In another embodiment, the first direction and the second direction are different directions, for example, directions perpendicular to each other.

[0065] The positions of the gate valves in each block may be changed as appropriate to suit the equipment layout. When the substrate processing system 1 includes multiple VTMs, the VTMs may be connected to each other in the horizontal direction (x and y directions) via openings. In one embodiment, the upper horizontal transfer robot 32 may move horizontally across multiple upper VTMs via openings while being magnetically levitated on the upper horizontal planar motors 34 of the multiple upper VTMs. In one embodiment, the lower horizontal transfer robot 52 may move horizontally across multiple lower VTMs via openings while being magnetically levitated on the lower horizontal planar motors 54 of the multiple lower VTMs.

[0066] As described above, the layout of the LLM, VTM, and PM can be freely changed in the substrate processing system 1. Note that a plurality of vertical transfer robots 22, upper horizontal transfer robots 32, and / or lower horizontal transfer robots 52 may be provided depending on the layout of the equipment. This can prevent the rate of substrate transfer in the LLM or VTM from being limited, thereby preventing a decrease in transfer efficiency.

[0067] <Modification> 5A and 5B are diagrams illustrating another example of the device layout of the substrate processing system 1. In this example, the substrate processing system 1 has three VTM1A to VTM3A (each corresponding to an "upper vacuum transfer unit 30") connected to the upper stage of one LLM (corresponding to the load lock module 20). Furthermore, three VTM1B to VTM3B (each corresponding to a "lower vacuum transfer unit 50") connected to the lower stage of the LLM. In this example, the three upper VTM1A to VTM3A are connected along the x direction (first direction). Similarly, the lower VTM1B to VTM3B are connected along the x direction (first direction).

[0068] VTM1A is connected to PM1A (corresponding to "upper substrate processing module 40"; hereinafter the same applies to PM2A, etc.) at one side (first side) extending along the x direction, and is connected to the LLM at the other side (second side) opposite the one side. VTM2A is connected to PM2A at one side (first side) extending along the x direction, and is connected to PM3A at the other side (second side). VTM3A is connected to PM4A at one side (first side) extending along the x direction, and is connected to PM5A at the other side (second side).

[0069] VTM1B is connected to PM1B at one side (first side) extending along the x direction and connected to the LLM at the other side (second side) opposite the one side. VTM2B is connected to PM2B at one side (first side) extending along the x direction and connected to PM3B at the other side (second side). VTM3B is connected to PM4B at one side (first side) extending along the x direction and connected to PM5B at the other side (second side).

[0070] 6 is a diagram illustrating another example of the upper substrate processing module 40 and the lower substrate processing module 60. In one embodiment, the upper substrate processing module 40 and the lower substrate processing module 60 are connected to a common gas supply unit 70. The gas supply unit 70 may include at least one gas source 71 and at least one flow rate controller 72.

[0071] The gas supply unit 70 is configured to supply at least one process gas to the upper substrate processing module 40. The process gas supplied from the gas source 71 is introduced into the process chamber 40 of the upper substrate processing module 40 from the gas supply port 42 via the flow rate controller 72 and the upper supply path 73.

[0072] The gas supply unit 70 is configured to supply at least one process gas to the lower substrate processing module 60. The process gas supplied from the gas source 71 is introduced into the process chamber 60 of the upper substrate processing module 60 from the gas supply port 62 via the flow rate controller 72 and the upper supply path 73.

[0073] In one embodiment, the gas supply 70 may be connected to multiple upper substrate processing modules 40 and / or multiple lower substrate processing modules 60 .

[0074] In one embodiment, the upper substrate processing module 40 and the lower substrate processing module 60 are connected to a common exhaust system 80. The exhaust system 80 is connected to the gas exhaust port 44 of the upper substrate processing module 40 via an upper exhaust path 81. The gas exhaust port 44 may be provided, for example, at the bottom of the processing chamber 40a. The exhaust system 80 is connected to the gas exhaust port 64 of the lower substrate processing module 60 via a lower exhaust path 82. The gas exhaust port 64 may be provided, for example, at the bottom of the processing chamber 60a.

[0075] The exhaust system 80 may include a pressure regulating valve, which may regulate the pressure inside the process chamber 40a and the process chamber 60a. The exhaust system 80 may include a vacuum pump. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0076] In one embodiment, the exhaust system 80 may be connected to multiple upper substrate processing modules 40 and / or multiple lower substrate processing modules 60 .

[0077] 6, the upper substrate processing module 40 and the lower substrate processing module 60 are connected to the same gas supply unit 70 and the same exhaust system 80. The control unit CU can simultaneously control the flow rates of the processing gases supplied to the processing chambers 40a and 60a and the pressures within the chambers. This allows the upper substrate processing module 40 and the lower substrate processing module 60 to process substrates W in parallel under the same recipe (conditions).

[0078] 7 to 9 are diagrams for explaining other examples of the upper vacuum transfer unit 30 and the lower vacuum transfer unit 50. Fig. 7 is a diagram showing a state in which a lifting / lowering transfer robot 92, which will be described later, is in a standby position. Fig. 8 is a diagram showing a state in which the lifting / lowering transfer robot 92 is in an upper transfer position. Fig. 9 is a diagram showing a state in which the lifting / lowering transfer robot 92 is in a lower transfer position.

[0079] In one embodiment, the upper vacuum transfer unit 30 and the lower vacuum transfer unit 50 are connected to each other in the vertical direction. In the example shown in Figures 7 to 9, the upper vacuum transfer unit 30 and the lower vacuum transfer unit 50 may communicate with each other via an opening 36. The opening 36 is a through-hole that penetrates a part of the bottom surface of the vacuum chamber 30a of the upper vacuum transfer unit 30, a part of the upper horizontal plane motor 34 corresponding to the bottom surface, and the top surface of the vacuum chamber 50a of the lower vacuum transfer unit 50.

[0080] The opening 36 provides a passage for the lifting / lowering transfer robot 92. The lifting / lowering transfer robot 92 is configured to move up and down in the vertical direction through the opening 36 between the vacuum chamber 30a of the upper vacuum transfer unit 30 and the vacuum chamber 50a of the lower vacuum transfer unit 50. The lifting / lowering transfer robot 92 is configured to be able to move up and down in the vertical direction between a standby position (FIG. 7), an upper transfer position (FIG. 8), and a lower transfer position (FIG. 9).

[0081] In one embodiment, the lifting and transport robot 92 is configured to move up and down in the vertical direction while being magnetically levitated on a vertical planar motor 94. The vertical planar motor 94 is disposed, for example, on the same side of the upper vacuum transport unit 30 and the lower vacuum transport unit 50, extending in the vertical direction. The vertical planar motor 94 is configured with an array of multiple coils. Each coil generates a magnetic field when supplied with current. The control unit CU individually controls the value of the current passed through each coil, thereby controlling the vertical movement of the lifting and transport robot 92.

[0082] In one embodiment, the lifting and transport robot 92 includes a mounting table 92a and a ceiling part 92b. The mounting table 92a is configured to be able to mount at least one substrate W thereon. The ceiling part 92b is provided vertically above the mounting table 92a. The mounting table 92a and the ceiling part 92b may be connected via a connecting part 92c extending vertically.

[0083] The top portion 92b has a shape corresponding to the opening 36 in plan view (xy plane). The top portion 92b may have a shape similar to the opening 36 in plan view and a width and length (x direction and y direction) that are slightly smaller than those of the opening 36.

[0084] As shown in FIG. 7, the lifting transfer robot 92 is disposed and moved to a standby position when it is not transporting a substrate W (FIG. 7). At the standby position, the lifting transfer robot 92 is disposed in a position that does not interfere with the horizontal movements of the upper horizontal transfer robot 32 and the lower horizontal transfer robot 52. Specifically, a top portion 92b of the lifting transfer robot 92 is disposed in the opening 36. The top portion 92b covers the opening 36 and forms part of the bottom surface of the vacuum chamber 30a of the upper vacuum transfer unit 30. The mounting table 92a of the lifting transfer robot 92 is disposed at a height (h4) that is spaced apart from the bottom surface of the vacuum chamber 50a. This height (h4) can be set appropriately depending on the size and vertical operating range of the lower horizontal transfer robot 52.

[0085] The top section 92b may be configured to function as part of the upper horizontal planar motor 34 when placed in the opening 36. For example, the top section 92b may be configured to have a plurality of coils arranged therein and to generate a magnetic field on the top section 92b in response to a supplied current. The control unit CU may individually control the current values ​​applied to the upper horizontal planar motor 34 and each coil of the top section 92b, thereby controlling the horizontal movement of the upper horizontal transfer robot 32.

[0086] 8, when the lifting / lowering transfer robot 92 transfers a substrate W to / from the upper horizontal transfer robot 32, the lifting / lowering transfer robot 92 is placed and moved to the upper transfer position. At the upper transfer position, the mounting table 92a is placed vertically above the opening 36. For example, the control unit CU raises and lowers the lifting / lowering transfer robot 92 so that the mounting table 92a is at the same height as the substrate W on the end effector 32b of the upper horizontal transfer robot 32. The control unit CU may control the driving of the arm 32a and the end effector 32b of the upper horizontal transfer robot 32 to transport at least one substrate W to / from the mounting table 92a.

[0087] 9, when the lifting / lowering transfer robot 92 transfers a substrate W to / from the lower horizontal transfer robot 52, the lifting / lowering transfer robot 92 is disposed / moved to the lower transfer position. At the lower transfer position, the mounting table 92a and the ceiling part 92b are disposed vertically below the opening 36. For example, the control unit CU raises and lowers the lifting / lowering transfer robot 92 so that the mounting table 92a is at the same height as the substrate W on the end effector 52b of the lower horizontal transfer robot 52. The control unit CU may control the driving of the arm 52a and the end effector 52b of the lower horizontal transfer robot 52 to transfer at least one substrate W to / from the mounting table 92a.

[0088] 7 to 9, the substrate W can be transported between the upper vacuum transport unit 30 and the lower vacuum transport unit 50. This increases the number of transport paths for the substrate W, thereby improving the efficiency of substrate transport.

[0089] According to one embodiment, a technique for improving the efficiency of substrate transport can be provided.

[0090] Embodiments of the present disclosure further include the following aspects.

[0091] [Appendix 1] a load port disposed at a first height; a plurality of upper magnetic levitation vacuum transport units arranged at a second height, the plurality of upper magnetic levitation vacuum transport units being connected horizontally along a first direction; a plurality of upper substrate processing modules, each of which is connected to one of the plurality of upper magnetic levitation vacuum transfer units; a plurality of lower magnetic levitation vacuum transport units arranged at a third height lower than the second height, the plurality of lower magnetic levitation vacuum transport units being connected horizontally along the first direction; a plurality of lower substrate processing modules, each of which is connected to one of the plurality of lower magnetic levitation vacuum transfer units; A load lock module configured to be able to switch its interior between an atmospheric environment and a vacuum environment, the load lock module comprising: transferring at least one substrate between the load lock module and a substrate container on the load port in an atmospheric environment; conveying at least one substrate vertically; Transferring at least one substrate between the load lock module and any one of the plurality of upper magnetic levitation vacuum transfer units in a vacuum environment; and a load lock module configured to transfer at least one substrate between the load lock module and any of the plurality of lower magnetic levitation vacuum transfer units under a vacuum environment; and A substrate processing system comprising:

[0092] [Appendix 2] 2. The substrate processing system of claim 1, wherein the first height is greater than the second height.

[0093] [Appendix 3] The load lock module includes: A first side surface is connected to one of the plurality of upper magnetic levitation vacuum transport units, and The first side is connected to one of the plurality of lower magnetic levitation vacuum transport units. 3. The substrate processing system according to claim 1 or 2.

[0094] [Appendix 4] 4. The substrate processing system of claim 3, wherein the load lock module is connected to the load port at the first side.

[0095] [Appendix 5] 5. The substrate processing system of claim 1, further comprising a vertical transfer robot disposed within the load lock module, the vertical transfer robot configured to transfer a stack of substrates between the load lock module and the substrate container on the load port, and to transfer the stack of substrates in a vertical direction.

[0096] [Appendix 6] the load lock module includes a vertical planar motor extending in a vertical direction; 6. The substrate processing system of claim 5, wherein the vertical transport robot is configured to move vertically while magnetically levitating on the vertical planar motor to transport the stack of substrates vertically.

[0097] [Appendix 7] each of the plurality of upper magnetic levitation vacuum transport units includes an upper horizontal planar motor extending in a horizontal direction; 7. The substrate processing system of claim 1, further comprising an upper horizontal transport robot configured to move horizontally while magnetically levitating on the upper horizontal motor to transport at least one substrate between the load lock module and the plurality of upper substrate processing modules.

[0098] [Appendix 8] each of the plurality of lower magnetic levitation vacuum transport units includes a lower horizontal planar motor extending in a horizontal direction; 8. The substrate processing system of claim 1, further comprising a lower horizontal transport robot configured to move horizontally while magnetically levitated on the lower horizontal motor to transport at least one substrate between the load lock module and the plurality of lower substrate processing modules.

[0099] [Appendix 9] each of the plurality of upper magnetic levitation vacuum transport units includes an upper horizontal planar motor extending in a horizontal direction; 9. The substrate processing system of claim 1, further comprising a plurality of upper horizontal transport robots configured to move horizontally while magnetically levitating on the upper horizontal motors to simultaneously transport a plurality of substrates between the load lock module and the plurality of upper substrate processing modules.

[0100] [Appendix 10] each of the plurality of lower magnetic levitation vacuum transport units includes a lower horizontal planar motor extending in a horizontal direction; 10. The substrate processing system of any one of Supplementary Note 1 to Supplementary Note 9, further comprising a plurality of lower horizontal transport robots configured to move horizontally while magnetically levitating on the lower horizontal motors to simultaneously transport a plurality of substrates between the load lock module and the plurality of lower substrate processing modules.

[0101] [Appendix 11] 11. The substrate processing system of any one of claims 1 to 10, wherein at least one of the plurality of upper substrate processing modules and the plurality of lower substrate processing modules comprises a chamber configured to process four substrates simultaneously.

[0102] [Appendix 12] 12. The substrate processing system of any one of claims 1 to 11, wherein at least one of the plurality of upper substrate processing modules and the plurality of lower substrate processing modules comprises a chamber configured to process two substrates simultaneously.

[0103] [Appendix 13] 13. The substrate processing system of claim 1, wherein at least one chamber of the upper substrate processing modules and at least one chamber of the lower substrate processing modules are connected to the same gas supply unit.

[0104] [Appendix 14] 14. The substrate processing system of any one of claims 1 to 13, wherein at least one chamber of the plurality of upper substrate processing modules and at least one chamber of the plurality of lower substrate processing modules are connected to a same exhaust system.

[0105] [Appendix 15] 15. A substrate processing system according to any one of claims 1 to 14, wherein at least one of the upper magnetic levitation vacuum transport units and at least one of the lower magnetic levitation vacuum transport units are arranged vertically one above the other and communicate with each other via an opening.

[0106] [Appendix 16] 16. The substrate processing system of claim 15, further comprising an elevating transport robot configured to elevate and transport at least one substrate between the at least one upper magnetic levitation vacuum transport unit and the at least one lower magnetic levitation vacuum transport unit through the opening.

[0107] [Appendix 17] the lifting and transport robot includes a mounting table on which at least one substrate is placed, and a ceiling portion that is disposed vertically above the mounting table and has a shape corresponding to the opening; The substrate processing system of claim 16, wherein the lifting and lowering transport robot is configured to move up and down vertically between an upper transport position where the mounting table is positioned vertically above the opening, a waiting position where the top part is positioned at the opening, and a lower transport position where the top part is positioned vertically below the opening.

[0108] [Appendix 18] the at least one upper magnetic levitation vacuum transport unit comprises an upper horizontal planar motor extending horizontally; 18. The substrate processing system of claim 17, further comprising an upper horizontal transport robot configured to move horizontally while being magnetically levitated on the upper horizontal motor to transport at least one substrate between the platform of the lifting transport robot located at the upper transport position.

[0109] [Appendix 19] 19. The substrate processing system of claim 17 or 18, wherein the top of the lifting transport robot is configured to function as part of the upper horizontal planar motor when the lifting transport robot is in the standby position.

[0110] [Appendix 20] the at least one lower magnetic levitation vacuum transport unit comprises a lower horizontal planar motor extending horizontally; 20. The substrate processing system of any one of Appendix 17 to Appendix 19, further comprising a lower horizontal transport robot configured to move horizontally while being magnetically levitated on the lower horizontal motor to transport at least one substrate between the platform of the lifting transport robot located at the lower transport position.

[0111] The above embodiments are described for the purpose of explanation and are not intended to limit the scope of the present disclosure. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment can be added to other embodiments. Also, some components in one embodiment can be replaced with corresponding components in other embodiments. [Explanation of symbols]

[0112] 10...load port, 20...load lock module, 22...vertical transfer robot, 24...vertical planar motor, 30...upper vacuum transfer unit, 32...upper horizontal transfer robot, 34...upper horizontal planar motor, 40...upper substrate processing module, 50...lower vacuum transfer unit, 52...lower horizontal transfer robot, 54...lower horizontal planar motor, 60...lower substrate processing module, C...container, CU...control unit

Claims

1. a load port disposed at a first height; a plurality of upper magnetic levitation vacuum transport units arranged at a second height, the plurality of upper magnetic levitation vacuum transport units being connected horizontally along a first direction; a plurality of upper substrate processing modules, each of which is connected to one of the plurality of upper magnetic levitation vacuum transfer units; a plurality of lower magnetic levitation vacuum transport units arranged at a third height lower than the second height, the plurality of lower magnetic levitation vacuum transport units being connected in a horizontal direction along the first direction; a plurality of lower substrate processing modules, each of which is connected to one of the plurality of lower magnetic levitation vacuum transfer units; A load lock module configured to be able to switch its interior between an atmospheric environment and a vacuum environment, the load lock module comprising: transferring at least one substrate between the load lock module and a substrate container on the load port in an atmospheric environment; conveying at least one substrate vertically; Transferring at least one substrate between the load lock module and any one of the plurality of upper magnetic levitation vacuum transfer units in a vacuum environment; and a load lock module configured to transfer at least one substrate between the load lock module and any of the plurality of lower magnetic levitation vacuum transfer units under a vacuum environment; and A substrate processing system comprising:

2. The substrate processing system of claim 1 , wherein the first height is greater than the second height.

3. The load lock module includes: A first side surface is connected to one of the plurality of upper magnetic levitation vacuum transport units, and The first side is connected to any one of the plurality of lower magnetic levitation vacuum transport units. The substrate processing system of claim 2 .

4. The substrate processing system of claim 3 , wherein the load lock module is connected to the load port at the first side.

5. 5. The substrate processing system of claim 4, further comprising a vertical transfer robot disposed within the load lock module, the vertical transfer robot configured to transfer a stack of substrates between the load lock module and the substrate container on the load port, and to transfer the stack of substrates in a vertical direction.

6. the load lock module includes a vertical planar motor extending in a vertical direction; The substrate processing system of claim 5 , wherein the vertical transfer robot is configured to move vertically while being magnetically levitated on the vertical planar motor to vertically transfer the stack of substrates.

7. each of the plurality of upper magnetic levitation vacuum transport units includes an upper horizontal planar motor extending in a horizontal direction; 6. The substrate processing system of claim 5, further comprising an upper horizontal transport robot configured to move horizontally while magnetically levitating on the upper horizontal motor to transport at least one substrate between the load lock module and the plurality of upper substrate processing modules.

8. each of the plurality of lower magnetic levitation vacuum transport units includes a lower horizontal planar motor extending in a horizontal direction; 8. The substrate processing system of claim 7, further comprising a lower horizontal transport robot configured to move horizontally while magnetically levitated on the lower horizontal motor to transport at least one substrate between the load lock module and the plurality of lower substrate processing modules.

9. each of the plurality of upper magnetic levitation vacuum transport units includes an upper horizontal planar motor extending in a horizontal direction; 6. The substrate processing system of claim 5, further comprising a plurality of upper horizontal transport robots configured to move horizontally while being magnetically levitated on the upper horizontal motors to simultaneously transport a plurality of substrates between the load lock module and the plurality of upper substrate processing modules.

10. each of the plurality of lower magnetic levitation vacuum transport units includes a lower horizontal planar motor extending in a horizontal direction; 8. The substrate processing system of claim 7, further comprising a plurality of lower horizontal transport robots configured to move horizontally while being magnetically levitated on the lower horizontal motors to simultaneously transport a plurality of substrates between the load lock module and the plurality of lower substrate processing modules.

11. 10. The substrate processing system of claim 1, wherein at least one of the plurality of upper substrate processing modules and the plurality of lower substrate processing modules comprises a chamber configured to process four substrates simultaneously.

12. 10. The substrate processing system of claim 1, wherein at least one of the plurality of upper substrate processing modules and the plurality of lower substrate processing modules comprises a chamber configured to process two substrates simultaneously.

13. 10. The substrate processing system of claim 1, wherein at least one chamber of the plurality of upper substrate processing modules and at least one chamber of the plurality of lower substrate processing modules are connected to the same gas supply.

14. 14. The substrate processing system of claim 13, wherein at least one chamber of the plurality of upper substrate processing modules and at least one chamber of the plurality of lower substrate processing modules are connected to a same exhaust system.

15. 2. The substrate processing system of claim 1, wherein the at least one upper magnetic levitation vacuum transport unit and the at least one lower magnetic levitation vacuum transport unit are arranged vertically one above the other and communicate with each other through an opening.

16. 16. The substrate processing system of claim 15, further comprising a lifting and lowering transfer robot configured to lift and lower at least one substrate between the at least one upper magnetic levitation vacuum transfer unit and the at least one lower magnetic levitation vacuum transfer unit through the opening.

17. the lifting and transporting robot includes a mounting table on which at least one substrate is placed, and a ceiling portion that is disposed vertically above the mounting table and has a shape corresponding to the opening; 17. The substrate processing system of claim 16, wherein the lifting and lowering transport robot is configured to move up and down vertically between an upper transport position where the mounting table is positioned vertically above the opening, a standby position where the ceiling is positioned at the opening, and a lower transport position where the ceiling is positioned vertically below the opening.

18. the at least one upper magnetic levitation vacuum transport unit comprises an upper horizontal planar motor extending horizontally; 18. The substrate processing system of claim 17, further comprising an upper horizontal transport robot configured to move horizontally while being magnetically levitated on the upper horizontal motor to transport at least one substrate between the stage of the lifting transport robot located at the upper transport position.

19. 20. The substrate processing system of claim 18, wherein the top portion of the lift transport robot is configured to function as part of the upper horizontal planar motor when the lift transport robot is in the standby position.

20. the at least one lower magnetic levitation vacuum transport unit comprises a lower horizontal planar motor extending horizontally; 20. The substrate processing system of claim 19, further comprising a lower horizontal transport robot configured to move horizontally while being magnetically levitated on the lower horizontal motor to transport at least one substrate between the platform of the lifting transport robot located at the lower transport position.

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