Method of manufacturing component built-in substrate

Abstract

To provide a method of manufacturing a component built-in substrate capable of reducing man-hour for manufacturing a component built-in substrate and suppressing cost of manufacture of the component built-in substrate low.SOLUTION: A method of manufacturing a component built-in substrate in which an electronic component is built in an opening of a substrate via a resin includes: forming a penetration hole 14 for a through hole in the substrate; forming a through hole conductor 15 on an inner peripheral surface of the penetration hole 14; forming an opening for the electronic component in the substrate; installing an adhesive tape 17 in a lower end of the substrate; temporarily fixing the electronic component on the adhesive tape 17 in the opening; filling the penetration hole 14 in which the through hole conductor 15 is formed and the opening in which the electronic component is temporarily fixed with a resin 19 and curing the resin 19; and removing the adhesive tape 17. As a preferable embodiment, a copper-clad laminate 13 is used.SELECTED DRAWING: Figure 2G

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a component-embedded substrate in which an electronic component is embedded in an opening of a substrate via a resin. [Background technology]

[0002] Conventionally, a method for manufacturing a component-embedded substrate in which an electronic component is embedded in an opening in a core substrate of a printed wiring board via a filling resin is known, for example, from Patent Document 1. Figures 3A to 3G are each a diagram for explaining one embodiment of a conventional method for manufacturing a component-embedded substrate.

[0003] In this conventional method for manufacturing a component-embedded substrate, first, as shown in FIG. 3A, a copper-clad substrate 51 is prepared. Next, as shown in FIG. 3B, a through-hole 52 is formed in the copper-clad substrate 51, and a through-hole conductor 53 is formed on the inner surface of the through-hole 52. Next, as shown in FIG. 3C, a resin 54 is filled into the through-hole conductor 53, and the filled resin 54 is cured. Thereafter, as shown in FIG. 3D, an opening 55 for mounting an electronic component is formed in the copper-clad substrate 51. Next, as shown in FIG. 3E, a releasable adhesive tape 56 is used to cover the bottom of the opening 55. Next, as shown in FIG. 3F, an electronic component 57 is inserted into the opening 55 from the top, and the adhesive tape 56 temporarily secures the electronic component 57 in the opening 55. Thereafter, as shown in FIG. 3G, a resin 58 is filled into the opening 55, and the resin 54 is cured, thereby fixing the electronic component 57 in the opening 55. The adhesive tape 56 is then removed, and the component-embedded substrate is obtained. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-114434 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in this conventional method for manufacturing a component-embedded substrate, filling resin 54 into through-hole conductor 53 and filling resin 58 into opening 55 for fixing electronic component 57 are carried out in separate processes, which increases the number of steps required to manufacture the core substrate and increases the manufacturing costs of the component-embedded substrate. [Means for solving the problem]

[0006] The method for manufacturing a component-embedded substrate of the present invention is a method for manufacturing a component-embedded substrate that embeds an electronic component in an opening in a substrate via a resin, and includes the steps of forming a penetrating hole for a through hole in the substrate, forming a through-hole conductor on the inner surface of the through hole, forming an opening for the electronic component in the substrate, placing an adhesive tape on the lower end of the substrate, temporarily fixing the electronic component on the adhesive tape in the opening, filling the through hole in which the through-hole conductor is formed and the opening in which the electronic component is temporarily fixed with resin and curing the resin, and removing the adhesive tape. [Brief explanation of the drawings]

[0007] [Figure 1] 1A to 1C are diagrams for explaining an embodiment of a component-embedded substrate that is a target of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2A] 1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2B] 1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2C] 1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2D] 1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2E] 1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2F] 1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2G]1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2H] 1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 2I] 1A to 1C are diagrams illustrating an embodiment of a method for manufacturing a component-embedded substrate according to the present invention. [Figure 3A] 10A to 10C are diagrams illustrating an embodiment of a conventional method for manufacturing a component-embedded substrate. [Figure 3B] 10A to 10C are diagrams illustrating an embodiment of a conventional method for manufacturing a component-embedded substrate. [Figure 3C] 10A to 10C are diagrams illustrating an embodiment of a conventional method for manufacturing a component-embedded substrate. [Figure 3D] 10A to 10C are diagrams illustrating an embodiment of a conventional method for manufacturing a component-embedded substrate. [Figure 3E] 10A to 10C are diagrams illustrating an embodiment of a conventional method for manufacturing a component-embedded substrate. [Figure 3F] 10A to 10C are diagrams illustrating an embodiment of a conventional method for manufacturing a component-embedded substrate. [Figure 3G] 10A to 10C are diagrams illustrating an embodiment of a conventional method for manufacturing a component-embedded substrate. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, one embodiment of a method for manufacturing a component-embedded substrate according to the present invention will be described with reference to the drawings. In the example shown in Figure 1 and Figures 2A to 2I, the dimensions of each member, particularly the height dimension, are shown as different from the actual dimensions in order to better understand the features of the present invention.

[0009] <Regarding the component-embedded substrate manufactured by the component-embedded substrate manufacturing method of the present invention> FIG. 1 is a diagram illustrating one embodiment of a component-embedded substrate that is the subject of a manufacturing method of a component-embedded substrate of the present invention. In the embodiment shown in FIG. 1, component-embedded substrate 1 is composed of substrate 2, seed layer 3 formed on the surface of substrate 2, through-hole conductors 5 formed on the surfaces of through holes 4 in substrate 2 and on the surface of seed layer 3, resin 6 filled inside through-hole conductors 5, openings 7 provided in substrate 2 for mounting electronic components, and electronic components 8 fixed in openings 7 by resin 6. Component-embedded substrate 1 is used as a core substrate, and a build-up layer (not shown) can be formed on the upper surface of the core substrate. Conventionally known materials can be used for substrate 2, seed layer 3, through-hole conductors 5, and resin 6.

[0010] <Method of manufacturing a component-embedded substrate of the present invention> 2A to 2I are diagrams illustrating one embodiment of a method for manufacturing a component-embedded substrate of the present invention. Hereinafter, one embodiment of a method for manufacturing a component-embedded substrate of the present invention will be described in order using FIGS. 2A to 2I.

[0011] First, as shown in FIG. 2A, a copper-clad laminate 13 is prepared, in which seed layers 12 made of copper foil are formed on both sides of a substrate 11. A commercially available copper-clad laminate 13 can be used as the copper-clad laminate 13. Next, as shown in FIG. 2B, through holes 14 for forming through holes are formed in the copper-clad laminate 13. Next, as shown in FIG. 2C, through-hole conductors 15 are formed on the inner surfaces of the through holes 14 and on the surface of the seed layer 12. Next, as shown in FIG. 2D, openings 16 for mounting electronic components are formed in the copper-clad laminate 13.

[0012] Next, as shown in FIG. 2E, adhesive tape 17 is placed on the underside of copper-clad laminate 13. Next, as shown in FIG. 2F, electronic component 18 is inserted into opening 16 from the top end thereof, and electronic component 18 is placed on adhesive tape 17 to temporarily fix electronic component 18 in opening 16. Next, as shown in FIG. 2G, resin 19 is placed on copper-clad laminate 13, and resin 19 is heated and pressurized to simultaneously fill through-holes 14 and openings 16 with resin 19 as shown in FIG. 2H. Resin 19 is then cured and its surface is polished. Next, as shown in FIG. 2I, adhesive tape 17 is removed to obtain component-embedded substrate 20.

[0013] Thereafter, if necessary, a build-up layer can be formed on the component-embedded substrate 20 using the component-embedded substrate 20 as a core substrate. In each step, the processing method and materials used can be conventionally known processing methods and materials.

[0014] According to the method for manufacturing a component-embedded substrate of the present invention described above, resin 19 is filled and cured simultaneously into through holes 14 and openings 16, as shown in Fig. 2H. Therefore, compared to the conventional method in which the filling of resin into through holes and the filling of resin into openings are carried out in separate steps, the number of steps required to manufacture a component-embedded substrate can be reduced, and the manufacturing cost of the component-embedded substrate can be kept low. [Explanation of symbols]

[0015] 1. Embedded component board 2 boards 3 Seed layer 4 through holes 5 through-hole conductors 6. Resin 7 aperture 8. Electronic Components 11 Circuit Board 12 Seed layer 13 Copper-clad laminate 14 Through holes 15 through-hole conductor 16 aperture 17 Adhesive Tape 18 Electronic Components 19 Resin 20. Substrate with embedded components

Claims

1. A method for manufacturing a component-embedded substrate in which an electronic component is embedded in an opening of a substrate via a resin, comprising: forming a through hole in the substrate; forming a through-hole conductor on an inner peripheral surface of the through hole; forming openings in the substrate for electronic components; placing an adhesive tape on the lower end of the substrate; temporarily fixing the electronic component on the adhesive tape in the opening; filling a resin into the through hole in which the through-hole conductor is formed and the opening in which the electronic component is temporarily fixed, and curing the resin; removing the adhesive tape; Includes:

2. The method for manufacturing a component-embedded substrate according to claim 1 , wherein a copper-clad laminate is used as the substrate.

Images