Method for manufacturing sensor device

Abstract

To provide a method for manufacturing a sensor device capable of appropriately detecting the state of a measurement target.SOLUTION: A method for manufacturing a condition monitoring sensor 1 includes a heat pressing step, a bubble removal step, and a cooling step. The condition monitoring sensor 1 comprises an elastic part 20 that generates or absorbs heat through elastic deformation, and a sensor part 10 that is capable of detecting a heat flow generated by deformation of the elastic part 20 and is sealed within the elastic part 20. In the heat pressing step, the sensor part 10 is molded at a temperature at which the elastic part 20 melts. In the bubble removal step, after the heat pressing step, vacuum evacuation and pressing are performed through cooling to the load deflection temperature of the elastic part 20. In the cooling step, the condition monitoring sensor 1 is cooled to a normal temperature.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a sensor device. [Background technology]

[0002] Conventionally, there are known position detection sensors that can detect a change in the position of a member relative to a reference. For example, in Patent Document 1, a change in the position of a detection object relative to a base is detected by detecting a change in heat flux due to heat generation or absorption by an elastic member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-7878 Summary of the Invention [Problem to be solved by the invention]

[0004] Resins with a large thermoelastic coefficient (such as ultra-high molecular weight polyethylene: UPE) are sometimes used as the elastic body of position detection sensors, but when they are used in locations where temperatures are high (such as 90°C or higher), the rigidity of the elastic body decreases as the deflection temperature under load is exceeded, causing a decrease in sensor sensitivity.On the other hand, when resins with a high deflection temperature under load are used, their fluidity during molding is low, and if the resin is heated to its boiling point to ensure reliable molding, air bubbles remain after cooling, reducing rigidity and sensor sensitivity.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a manufacturing method of a sensor device that can appropriately detect the state of a measurement target. [Means for solving the problem]

[0006] The present invention provides a method for manufacturing a sensor device (1) comprising an elastic part (20) that generates or absorbs heat through elastic deformation, and a sensor part (10) that is sealed in the elastic part and is capable of detecting a heat flow generated by the deformation of the elastic part, the method including a heat pressing process (S14, S26), a bubble removal process (S16, S28), and a cooling process (S18, 30).

[0007] In the heat pressing process, the sensor part is molded at a temperature at which the elastic part melts. In the bubble removal process, after the heat pressing process, the part is cooled to the deflection temperature under load, and then vacuuming and pressing are performed. In the cooling process, the sensor device is cooled to room temperature. This makes it possible to manufacture a sensor device that can appropriately detect the state of the measurement object. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a side view of the condition monitoring sensor according to the first embodiment. [Figure 2] 1A to 1C are explanatory diagrams illustrating an outline of a manufacturing process for the condition monitoring sensor. [Figure 3] 3 is a time chart illustrating the manufacturing process of FIG. 2. [Figure 4] FIG. 10 is an explanatory diagram illustrating a state in which air bubbles remain in the elastic portion. [Figure 5] FIG. 1 is a plan view showing a vacuum container according to a first embodiment. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] 5A to 5C are cross-sectional views illustrating the behavior of the vacuum container according to the first embodiment when pressed. [Figure 8] 5 is a flowchart illustrating a method for manufacturing the condition monitoring sensor according to the first embodiment. [Figure 9] 4 is a time chart illustrating a method for manufacturing the condition monitoring sensor according to the first embodiment. [Figure 10] 5A to 5C are explanatory views illustrating a method for manufacturing the condition monitoring sensor according to the first embodiment. [Figure 11] 10A and 10B are explanatory diagrams illustrating a case where local boiling occurs during the manufacture of the condition monitoring sensor. [Figure 12] 10 is a flowchart illustrating a method for manufacturing a condition monitoring sensor according to a second embodiment. [Figure 13] 10 is a time chart illustrating a method for manufacturing a condition monitoring sensor according to a second embodiment. [Figure 14] 10A to 10C are explanatory views illustrating a method for manufacturing the condition monitoring sensor according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] A method for manufacturing a sensor device according to the present invention will be described below with reference to the drawings. In the following, substantially identical components will be denoted by the same reference numerals in multiple embodiments, and their description will be omitted. As shown in FIG. 1, a condition monitoring sensor 1 as a sensor device includes a sensor section 10, a wiring section 13, and an elastic section 20.

[0010] The sensor unit 10 is a heat flow sensor that converts heat flow into a voltage signal and outputs it. The sensor unit 10 has a heat flow sensor element and is formed in the shape of a roughly rectangular flat plate in a plan view. The sensor unit 10 is manufactured through a heat press processing process.

[0011] The wiring portion 13 has a signal line, one end of which is connected to the sensor portion 10 by solder or the like, and the other end of which extends to the outside of the elastic portion 20 and is connected to a detection device via an amplifier or the like (not shown). The wiring portion 13 also has a shielded line, which is connected to ground to cancel radio noise. The elastic portion 20 is formed in a generally rectangular shape in a plan view, and seals the entire sensor portion 10 and one end of the wiring portion 13.

[0012] In the condition monitoring sensor 1 of this embodiment, the sensor unit 10 is sealed in the elastic unit 20 by heat pressing, and the elastic unit 20 is placed in a gap between equipment or a jig while being slightly compressed in the thickness direction. When the structure of the equipment or jig on which the condition monitoring sensor 1 is placed is distorted, the elastic unit 20 compresses or expands, generating or absorbing heat due to the thermoelastic effect. The heat flow generated at this time is detected by the sensor unit 10, which is a heat flow sensor, and converted into a voltage signal. The condition monitoring sensor 1 outputs a voltage signal of several μV in response to a distortion of, for example, 0.1 μm or less. This makes it possible to detect the condition of operating equipment from slight structural deformation, making it possible to detect abnormalities in the equipment condition or long-term changes such as the end of machine life.

[0013] An overview of the manufacturing process of the condition monitoring sensor 1 will be explained based on the time charts of Fig. 2 and Fig. 3. In Fig. 2(a) to (c), the upper part is a schematic plan view, the lower part is a schematic cross-sectional view, Fig. 2(d) and (e) are cross-sectional views, and (f) is a side view corresponding to Fig. 1. In Fig. 3, the upper part shows the press load and the lower part shows the temperature. The same applies to Fig. 9 and Fig. 13.

[0014] As shown in FIG. 2(a), a lower press die 81 is placed in a molding frame 80. As shown in FIG. 2(b), a resin plate RP and a sensor unit 10 are placed on the lower press die 81. As shown in FIG. 2(c), a resin plate RP and an upper press die 82 are placed on the sensor unit 10. Hereinafter, the molding frame 80, the lower press die 81, and the upper press die 82 will be collectively referred to as a "press die 85" as appropriate. Furthermore, the resin plate RP, which will become the elastic unit 20, and the sensor unit 10 placed in the press die 85 will be referred to as a "workpiece W to be pressed."

[0015] As shown in FIG. 2(d), the workpiece W to be pressed is placed in a heat press device (not shown) maintained at a heat press temperature Tp (e.g., the melting point of the resin plate RP), where it is pressed at a predetermined pressure P (e.g., 100 kgf) and held for a predetermined time (e.g., 10 minutes). As shown in FIG. 2(e), when the press dies 81 and 82 are pressed all the way into the molding frame 80, the resin plate RP is integrated into the molding die 85 to form the elastic part 20 that seals the sensor part 10. The state in FIG. 2(e) corresponds to times x1 to x2 in the time chart of FIG. 3. After cooling to room temperature, the condition monitoring sensor 1 is removed from the press die 85 (FIG. 2(f)).

[0016] A resin with a large thermoelastic coefficient is preferably used for the elastic portion 20. For example, ultra-high molecular weight polyethylene (UPE) may be used for the elastic portion 20. Since UPE has a deflection temperature under load of 90°C, when the temperature of the application location of the condition monitoring sensor 1 exceeds 90°C, the rigidity of the elastic portion 20 decreases, and the sensor sensitivity decreases.

[0017] Here, for example, if polyacetal (deflection temperature under load: 124°C, melting point: 160°C) is used for the elastic portion 20 as a resin with a high deflection temperature under load, the fluidity is low when molding by hot pressing. Therefore, in order to ensure that the resin plates RP on both sides of the sensor portion 10 are tightly attached and molded, it is necessary to heat the resin to its melting point. As shown in the center of FIG. 4, if the resin is heated to its melting point during pressing, the resin boils. If the resin is cooled to room temperature in this state, air bubbles B remain inside the elastic portion 20 after cooling, as shown on the right side of FIG. 4. If air bubbles B remain inside the elastic portion 20, the rigidity of the elastic portion 20 will decrease due to the influence of the air bubbles B, and the sensor sensitivity will decrease.

[0018] Therefore, in this embodiment, the workpiece W to be pressed is placed in the vacuum container 30, and the pressing temperature is changed stepwise while the vacuum is being drawn, so that no air bubbles B remain in the elastic part 20.

[0019] The manufacturing apparatus for the condition monitoring sensor 1 of this embodiment includes a pressing die 85, press devices 91 and 92 (see FIG. 10), and a vacuum vessel 30. The vacuum vessel 30 is shown in FIGS. 5 and 6. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5, and for the sake of explanation, the aspect ratio is not to scale.

[0020] 5 and 6, the vacuum vessel 30 has an upper vessel 31 and a lower vessel 41. The upper vessel 31 has an upper diaphragm plate 32, an upper vessel frame plate 33, an upper vessel pressing plate 34, etc. The lower vessel 41 has a lower diaphragm plate 42, a lower vessel frame plate 43, a lower vessel pressing plate 44, etc. The upper part of Fig. 6 shows the state before the upper vessel 31 and the lower vessel 41 are assembled, and the lower part shows the state after the upper vessel 31 and the lower vessel 41 are assembled.

[0021] The diaphragm plates 32 and 42 are formed, for example, from a 1 mm thick stainless steel thin plate. The upper diaphragm plate 32 has a workpiece holding portion 321, bent portions 322 and 323, and an outer edge portion 324. The lower diaphragm plate 42 has a workpiece holding portion 421, bent portions 422 and 423, and an outer edge portion 424.

[0022] The workpiece holding portions 321, 421 are formed approximately in the center and are capable of holding the top and bottom of the press die 85 of the workpiece W to be pressed. The bent portions 322, 323, 422, 423 are formed on the outside of the workpiece holding portions 321, 421 so as to be elastically deformable. In this embodiment, the bent portions 322, 323, 422, 423 are formed in an arc-shaped cross section, but may have a different shape as long as they are elastically deformable. The outer edge portions 324, 424 are formed in a flat shape along the outer edge of the diaphragm plates 32, 42.

[0023] The upper container frame plate 33 and the upper container pressing plate 34 are formed in a generally cylindrical shape, and are fixed together with bolts 35 while sandwiching the outer edge portion 324. An O-ring 36 is provided between the outer edge portion 324 and the upper container frame plate 33.

[0024] The lower container frame plate 43 and the lower container pressing plate 44 are formed in a roughly cylindrical shape, and are fixed together with bolts 45 while sandwiching the outer edge portion 424. An O-ring 46 is provided between the outer edge portion 424 and the lower container frame plate 43.

[0025] The upper container frame plate 33 has an insertion recess 331 formed on the side facing the lower container frame plate 43. The lower container frame plate 43 also has an insertion protrusion 431 formed on the side facing the upper container frame plate 33 that fits into the insertion recess 331. The upper container frame plate 33 and the lower container frame plate 43 are fixed together with bolts 48, with the insertion protrusion 431 inserted into the insertion recess 331. An O-ring 49 is provided on the contact surfaces of the upper container frame plate 33 and the lower container frame plate 43.

[0026] The lower container frame plate 43 is provided with a vacuum suction port 435 that connects the radially inner side to the radially outer side and that can be connected to a vacuum suction pipe (not shown). This makes it possible to evacuate the space between the diaphragm plates 32 and 42 via the vacuum suction port 435.

[0027] The behavior of the vacuum vessel 30 during pressing is shown in Figure 7. In Figure 7, the upper part shows the state before pressing, and the lower part shows the state during pressing. In this embodiment, the vacuum vessel 30 is constructed using thin diaphragm plates 32, 42, and the diaphragm plates 32, 42 are pressed while a vacuum is being drawn through the vacuum suction port 435. Figure 7 shows an example of pressing using a press device 91. The diaphragm plates 32, 42 hold the workpiece W to be pressed using the workpiece holding portions 321, 421, while the bending portions 322, 323, 422, 423 elastically deform in response to the press device 91. This allows the workpiece W to be pressed to be pressed while maintaining a vacuum drawn between the diaphragm plates 32, 42.

[0028] The manufacturing method of the condition monitoring sensor 1 of this embodiment will be described with reference to the flowchart of Fig. 8, the time chart of Fig. 9, and Fig. 10. In the flowchart, the "step" such as step S1 is omitted and simply indicated by the symbol "S." The temperature change in the time chart is the environmental temperature in which the workpiece is placed, and the temperature of the workpiece itself follows the environmental temperature change with a delay.

[0029] In S11, as shown in the upper left of Figure 10, the workpiece W to be pressed is placed in the vacuum container 30. In S12, evacuation of the vacuum container 30 begins. In S13, the vacuum container 30, with the workpiece W to be pressed placed therein and being evacuated, is transported to the first press device 91, which is kept at its melting point T1.

[0030] In S14, the workpiece W to be pressed is hot-pressed at melting point T1. The first press device 91 holds the workpiece W to be pressed for a melting point holding time H1 (for example, 10 minutes). The melting point holding time H1 is set according to the time required for the resin plate RP to become integrated and to come into close contact with the sensor section 10 as the elastic section 20. At this time, as shown in the upper right corner of the page in FIG. 10, the resin plate RP melts and comes into close contact, but at the same time, it boils. S14 corresponds to times x10 to x11 in the time chart of FIG. 9.

[0031] In S15, while maintaining the vacuum state, the vacuum container 30 is transferred from the first press 91 to the second press 92, which is kept at a deflection temperature under load T2. In the time chart of Fig. 9, the ambient temperature during transfer from time x11 to x12 is room temperature, but the temperature of the workpiece W to be pressed decreases naturally, and if the transfer time is short (for example, 1 minute), the temperature of the workpiece W to be pressed will not decrease to room temperature. The same applies to the embodiments described below.

[0032] In S16, the workpiece W to be pressed is cooled to its deflection temperature under load T2 in a vacuum press state. In the second press device 92, the same load as in S14 is applied, and the workpiece W is kept warm for a bubble removal time H2 (e.g., 10 minutes). The bubble removal time H2 is set depending on the time required to remove the bubbles in the elastic part 20.

[0033] 10, by cooling to the deflection temperature under load T2 in the vacuum press state, the boiling stops, but since the elastic portion 20 maintains its fluidity, it is possible to remove air bubbles in the elastic portion 20 by evacuating it. S16 corresponds to the period from time x12 to time x13 in the time chart of FIG.

[0034] In S17, the vacuum container 30 is removed from the second press device 92 and cooled to room temperature. Once cooling is complete, evacuation is stopped in S18, and the condition monitoring sensor 1 is removed from the vacuum container 30. No air bubbles remain in the elastic part 20 of the removed condition monitoring sensor 1. Therefore, even if a resin with a high deflection temperature under load is used for the elastic part 20, a condition monitoring sensor 1 with good sensitivity can be manufactured.

[0035] As described above, the condition monitoring sensor 1 of this embodiment includes the elastic portion 20 and the sensor portion 10. The elastic portion 20 is elastically deformable and generates or absorbs heat due to the elastic deformation. The sensor portion 10 is capable of detecting heat flow generated by the deformation of the elastic portion 20 and is sealed in the elastic portion 20.

[0036] The manufacturing method of the condition monitoring sensor 1 includes a heat pressing step, a bubble removal step, and a cooling step. The heat pressing step corresponds to S14 in the flowchart, and molds the sensor part 10 at a temperature at which the elastic part 20 (strictly speaking, the resin plate RP that becomes the elastic part 20) melts. Here, the "temperature at which the elastic part 20 melts" is, for example, the melting point T1 of the elastic part 20, but it may be any temperature at which the elastic part 20 melts to the extent that it can be adhered to the sensor part 10.

[0037] The bubble removal process corresponds to S16 in the flowchart, and after the heat pressing process, the elastic portion 20 is cooled to the deflection temperature under load T2, and then vacuuming and pressing are performed. Here, "cooling to the deflection temperature under load T2" does not necessarily have to be the deflection temperature under load of the material that makes up the elastic portion 20, but rather a temperature at which boiling stops and the material remains fluid. The cooling process corresponds to S17 in the flowchart, and involves cooling the condition monitoring sensor 1 to room temperature.

[0038] In this embodiment, the sensor unit 10 and the elastic unit 20 are heated to the melting point T1 of the elastic unit 20 to bring them into close contact with each other, and then cooled to the deflection temperature under load T2 to stop boiling. Furthermore, because the fluidity of the elastic unit 20 is maintained at the deflection temperature under load T2, air bubbles in the elastic unit 20 can be removed by vacuuming.

[0039] This makes it possible to manufacture a condition monitoring sensor 1 that can appropriately detect the condition of the object to be measured. In particular, even if a material with a relatively high deflection temperature under load, such as polyacetal, is used, no air bubbles remain in the elastic part 20 and the rigidity does not decrease, so it is possible to manufacture a condition monitoring sensor 1 that is applicable to high-temperature environments and has good sensor sensitivity.

[0040] The condition monitoring sensor 1 is manufactured using a first press 91 capable of maintaining the temperature at the melting point T1 of the elastic portion 20, and a second press 92 capable of maintaining the temperature at the deflection temperature under load T2 of the elastic portion 20. The method for manufacturing the condition monitoring sensor 1 includes a transport step of transporting the condition monitoring sensor 1 from the first press 91 to the second press 92. In this embodiment, the transport step corresponds to S15 in the flowchart. This allows the manufacturing time to be shorter than when the temperature of the condition monitoring sensor 1 is changed within the same machine.

[0041] In this embodiment, a vacuum container 30 is used that can accommodate the condition monitoring sensor 1 and the press die 85. The vacuum container 30 can move between the first press device 91 and the second press device 92 while accommodating the condition monitoring sensor 1 and continuing to evacuate, and the first press device 91 and the second press device 92 can press the workpiece W to be pressed.

[0042] Specifically, the vacuum vessel 30 is elastically deformable and has diaphragm plates 32, 42 that sandwich the pressing die 85. In the first press device 91 and the second press device 92, a press load is applied from the outside of the diaphragm plates 32, 42. By using the vacuum vessel 30, it is possible to appropriately apply a press load to the workpiece W to be pressed while maintaining a vacuum state.

[0043] (Second embodiment) The second embodiment will be described with reference to Figures 11 to 14. In the first embodiment, polyacetal is used for the elastic portion 20. In this embodiment, polycarbonate (deflection temperature under load: 121°C, melting point: 170°C) is used for the elastic portion 20.

[0044] When a resin with a very high melting point, such as polycarbonate, is used for the elastic portion 20, heating and pressing causes the portion in contact with the pressing die 85 to boil locally, as shown in the upper center of Figure 11. When local boiling occurs, there is a risk that the side surfaces, which are still cool and hard, will be pushed by the bubbles B and destroyed, as shown on the right side of the page. If the side surfaces of the elastic portion 20 are destroyed, the rigidity will decrease.

[0045] Therefore, in this embodiment, the material is heated to the deflection temperature under load T2 and pressed, and when the upper pressing die 82 has completely sunk, it is further heated to the melting point T1 to prevent local boiling and suppress damage to the elastic part 20.

[0046] The manufacturing method of the condition monitoring sensor 1 of this embodiment will be described with reference to the flowchart of Fig. 12, the time chart of Fig. 13, and Fig. 14. The processes of S21 and S22 are the same as the processes of S11 and S12 in Fig. 8.

[0047] In S23, the vacuum container 30 with the workpiece W placed therein is transferred to the second press 92, which is kept at a deflection temperature under load T2. In S24, pressing is performed in the second press 92 at the deflection temperature under load T2. The second press 92 holds the workpiece W for a resin softening time H3 (e.g., 10 minutes). The resin softening time H3 is set according to the time required for the press dies 81 and 82 to completely sink.

[0048] 14, at deflection temperature under load T2, the resin plate RP deforms but does not melt, and is not in complete contact with the sensor unit 10. S24 corresponds to the time x21 to x22 in the time chart of FIG.

[0049] S25 corresponds to times x22 to x23 in the time chart, and while maintaining the vacuum state, the vacuum container 30 is transported from the second press device 92 to the first press device 91. S26 is similar to S14 in Fig. 8, and the vacuum container 30 with the workpiece W to be pressed placed therein is transported to the first press device 91, which is kept at the melting point T1, and hot pressing is performed in a vacuum state for the melting point holding time H1.

[0050] As shown in the lower left of FIG. 14, when the workpiece W to be pressed is transferred to the first press device 91, the workpiece W has already been heated to its deflection temperature under load T2, and the elastic portion 20 has been softened. Therefore, the elastic portion 20 is heated relatively uniformly, and no resin damage due to bubbles B occurs. S26 corresponds to time x23 to time x24 in the time chart of FIG. 13. The processing from S27 onwards is the same as the processing from S15 onwards in FIG. 8. As a result, even when a material with a high melting point is used for the elastic portion 20, a condition monitoring sensor 1 can be manufactured in which no bubbles remain and the elastic portion 20 is not damaged.

[0051] The manufacturing method of the condition monitoring sensor 1 of this embodiment further includes a preheating step of pressing the elastic portion 20 at the deflection temperature under load T2 before the heat pressing step. In this embodiment, the preheating step corresponds to S24 in the flowchart, and the heat pressing step corresponds to S26 in the flowchart. This prevents the rigidity of the elastic portion 20 from decreasing even when a material with a very high melting point, such as polycarbonate, is used, so that a condition monitoring sensor 1 that is applicable in high-temperature environments and has good sensor sensitivity can be manufactured. This also provides the same effects as the above embodiment.

[0052] In the embodiment, the condition monitoring sensor 1 corresponds to the "sensor device," and the upper diaphragm plate 32 and the lower diaphragm plate 42 correspond to the "diaphragm plates." Furthermore, S14 and S26 correspond to the "heat pressing step," S16 and S28 correspond to the "bubble removal step," S17 and S19 correspond to the "cooling step," S24 corresponds to the "preheating step," and S15, S25, and S27 correspond to the "transport step."

[0053] (Other embodiments) In the above embodiment, a first press device that performs pressing at the melting point T1 and a second press device 92 that performs pressing at the deflection temperature under load T2 are provided separately. In another embodiment, the temperature of the sensor device may be changed within the same device. Also, in the second embodiment, the same second press device 92 is used in the preheating step and the bubble removal step. In another embodiment, separate devices may be used for the preheating step and the bubble removal step.

[0054] In the above embodiment, the sensor device is a heat flow sensor. In other embodiments, the sensor device may be something other than a heat flow sensor. As described above, the present invention is not limited to the above embodiment, and various forms can be implemented within the scope of the invention. [Explanation of symbols]

[0055] 1. Condition monitoring sensor (sensor device) 10. Sensor section 20 Elastic part 30...Vacuum container 31...Upper container 41...Lower container 32···Upper diaphragm plate (diaphragm plate) 42 Lower diaphragm plate (diaphragm plate) 85···Press mold 91 First press device 92 Second press device

Claims

1. A method for manufacturing a sensor device (1) including an elastic part (20) that generates or absorbs heat due to elastic deformation, and a sensor part (10) that is sealed in the elastic part and is capable of detecting a heat flow generated by the deformation of the elastic part, a heat pressing step (S14, S26) of molding the sensor unit at a temperature at which the elastic unit melts; After the heat pressing step, a bubble removal step (S16, S28) is performed in which the elastic portion is cooled to a deflection temperature under load, and then vacuuming and pressing are performed. a cooling step (S17, S29) of cooling to room temperature; A method for manufacturing a sensor device comprising:

2. The method for manufacturing a sensor device according to claim 1 , further comprising a preheating step (S24) of pressing the elastic portion at a deflection temperature under load before the heat pressing step.

3. A first press device (91) capable of maintaining a temperature at a temperature at which the elastic portion melts, and a second press device (92) capable of maintaining a temperature at a deflection temperature under load of the elastic portion are used, The method for manufacturing a sensor device according to claim 1 or 2, further comprising a transport step (S15, S25, S27) of transporting the sensor device from one of the first press machine and the second press machine to the other.

4. A vacuum container (30) capable of accommodating the sensor device and the stamping die (85) therein is used, 4. The method for manufacturing a sensor device according to claim 3, wherein the vacuum container is movable between the first press device and the second press device and can be pressed by the first press device and the second press device while the vacuum container houses the sensor device and continues to be evacuated.

5. The vacuum vessel has elastically deformable diaphragm plates (32, 42) that sandwich the pressing die, 5. The method for manufacturing a sensor device according to claim 4, wherein the first press and the second press apply a press load from outside the diaphragm plate.

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