Device and method for manufacturing device

Abstract

To provide a device for oscillation excitation and a method of manufacturing the same that allow reduced energy consumption, or a reduced number of piezoelectric elements, or a reduced control voltage.SOLUTION: A device comprises: an oscillating body (1) on which a piezoelectric element (2) is fixed by a solder joint (5). The oscillating body (1) has a T-shaped cross-section comprising a first region (3) having a first width and a second region (4) having a second width, where the second width is greater than the first width, and where the first region is arranged at the center of the second region. The piezoelectric element (2) is arranged on a side of the second region facing away from the first region.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a device for vibration excitation and to a method for manufacturing such a device, said device being particularly suitable for generating touch signals. [Background technology]

[0002] Devices that generate tactilely detectable signals by means of piezoelectric elements affixed to a vibrating body are known, for example, from U.S. Patent Application Publication No. 2014 / 0327839 and WO 2000 / 141264. In these devices, electrical excitation of one or more piezoelectric elements can induce mechanical resonance of the vibrating body. To sufficiently deflect a touchscreen using such devices, a large vibrating body with many attached piezoelectric elements is required, limiting the applicability of this technology in terms of space requirements, energy consumption, and cost.

[0003] U.S. Patent Application Publication No. 2014 / 0327839 and WO 2000 / 141264 describe fixing a piezoelectric element to a vibrating body using an organic adhesive such as an epoxy resin or an acrylic resin that partially contains an additive to increase electrical conductivity. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2014 / 0327839 [Patent Document 2] International Publication No. 2000 / 141264 Summary of the Invention

[0005] It is therefore an object of the present invention to provide an improved device which allows for reduced energy consumption, or a reduced number of piezoelectric elements, or a reduced control voltage.

[0006] According to the present invention, the solution to achieve the above object is a device as defined in claim 1. The second independent claim achieves the object of providing a method for manufacturing such an improved device.

[0007] The present invention proposes a device having a vibrating body to which a piezoelectric element is fixed by a solder joint.

[0008] The solder connection has higher rigidity than the adhesive. This allows the vibration generated in the piezoelectric element to be transmitted from the solder connection to the vibrating body more effectively. The solder connection does little or no suppression of vibration. The adhesive has viscoelastic properties that suppress the vibration generated in the piezoelectric element. The solder connection does not have viscoelastic properties, so the solder connection does not suppress vibration.

[0009] Furthermore, soldered connections improve the electrical connection between the piezoelectric element and the vibrating body, improving reliability compared to adhesives. When organic adhesives containing additives to increase conductivity are used as adhesives, the additives do not have adhesive properties, so compromises must be made in terms of adhesion. As a result, the adhesive's adhesive properties are reduced by the additives. Alternatively, if an extremely thin adhesive layer is used, electrical connection can be achieved without such additives, but the adhesive properties are still reduced due to the thin thickness.

[0010] When using a solder connection, the mechanical connection between the piezoelectric element and the vibrating body is better, so that the vibrating body can be excited to vibrate with more than twice the amplitude compared to adhesive, even with the same piezoelectric element excitation signal. As a result, even with the same piezoelectric element excitation signal, the solder connection can generate a stronger touch signal in the vibrating body. In this way, it is possible to design with fewer piezoelectric elements or to control the piezoelectric element vibrating body with a weaker excitation signal. Reducing the number of piezoelectric elements reduces the space required for the device, and this technology enables new applications. The use of a weaker excitation signal can reduce the energy consumption of the device.

[0011] The piezoelectric element may include a monolithic piezoelectric layer. The piezoelectric layer may be disposed between two electrodes on the outer surface of the piezoelectric element. The piezoelectric element may include a piezoelectric ceramic, such as a lead zirconate titanate ceramic (PZT ceramic). Alternatively, the piezoelectric element may include a piezoelectric polymer.

[0012] Alternatively, the piezoelectric element may comprise a multi-layer element having piezoelectric layers and inner electrodes stacked one on top of the other. The piezoelectric layers may comprise a piezoelectric ceramic, for example a PZT ceramic, or a piezoelectric polymer.

[0013] The piezoelectric element may be a piezoelectric actuator, which is designed to generate vibrations having frequencies in the ultrasonic range. It is capable of exciting vibrations at frequencies between 40 kHz and 120 kHz, and in particular at frequencies between 60 and 80 kHz.

[0014] In another mode of operation, a piezoelectric element may be used as a sensor, which may be designed to detect pressure applied to an input element connected to a vibrating mass.

[0015] The single piezoelectric element or multiple piezoelectric elements may each be fixed to the vibrating body by a single solder connection. The solder connections may be manufactured simultaneously in a single soldering process. The vibrating body may have a length of 50 mm to 300 mm.

[0016] The vibrating body may comprise or be made of a conductive material. For example, the vibrating body may comprise aluminum or stainless steel. Stainless steel has the advantage of being highly solderable, allowing for suitable connection by soldered joints. Aluminum has the advantage of being relatively light in weight and high in strength.

[0017] If the vibrating mass comprises a conductive material, it can be connected to the electrodes of the piezoelectric element by solder connections. A potential, for example a ground potential, can be applied from the vibrating mass to the electrodes.

[0018] Alternatively, the vibrating body may have or be made of a non-conductive material. For example, the vibrating body may have or be made of glass, ceramic, or glass-reinforced plastic. Wiring may also be added to the side of the vibrating body facing the piezoelectric element. For example, the wiring may be added by a coating process.

[0019] A coating may be applied to the vibrating body. The solder connection is disposed on the coating. The coating can improve the wettability of the vibrating body with the solder material. The coating may be sputtered. The coating may have a chromium-containing layer, a nickel-containing layer, and a silver-containing layer. Such a coating can significantly improve the wettability of the aluminum vibrating body.

[0020] The piezoelectric element may have a Curie temperature higher than the melting temperature of the material of the solder connection. The Curie temperature of the piezoelectric element may be, for example, higher than 300°C. This prevents depolarization of the piezoelectric element when the material of the solder connection is heated to a temperature higher than the melting temperature during the soldering process. For example, the soldering process may be performed at a temperature of 260°C to 280°C, e.g., 270°C. Alternatively, the piezoelectric element may be polarized only after the soldering process of fixing the piezoelectric element to the vibrating body is completed.

[0021] The vibrating body may have a T-shaped cross section. The cross section has a first region with a first width and a second region with a second width, the second width being larger than the first width, the first region being disposed in the center of the second region, and the piezoelectric element being disposed on the opposite side of the second region from the first region. A vibrating body shaped in this manner can transmit vibrations generated in the piezoelectric element to an output element, such as a touch screen, and in the process, can increase the amplitude of the vibrations. The piezoelectric element may be designed to excite the vibrating body to vibrate at a frequency in the ultrasonic range.

[0022] The solder connections may comprise a lead-free solder, for example, a SnAgCu solder material.

[0023] The piezoelectric element may have a first electrode and a second electrode. At least two wires may be disposed on the vibrating body. The first electrode may be connected to one of the at least two wires by a solder connection. The second electrode may be connected to the other of the at least two wires by a second solder connection. An excitation signal may be applied to the electrodes by the wires. For example, an AC voltage may be applied between the electrodes by the wires.

[0024] The first electrode may be disposed on a side of the piezoelectric element facing the vibration body. The second electrode may be disposed on a side of the piezoelectric element opposite the vibration body and extend through a sidewall of the piezoelectric element to the side of the piezoelectric element facing the vibration body. The two electrodes may each be in contact with the wiring via a solder connection. The two solder connections may have the same solder material and be manufactured using a single soldering process, for example, a single reflow soldering process.

[0025] In another embodiment, the piezoelectric element may also have a first electrode and a second electrode. The first electrode is disposed on a side of the piezoelectric element facing the vibrating body, and the second electrode is disposed on a side of the piezoelectric element opposite the vibrating body. In this embodiment, the first electrode may be connected to the vibrating body by a solder connection, and the second electrode may be connected to the connection element by a second solder connection. The connection element may be, for example, a wire connected to a flexible printed circuit. The solder connection and the second solder connection may have the same solder material and be manufactured in a single soldering process, for example, a single reflow soldering process.

[0026] Another aspect of the present invention relates to a device having the above-described apparatus and an input element. The input element has an upper side and a lower side, and the vibrating body is fixed to the underside of the input element. The vibrating body may be fixed to the underside of the input element, particularly on the side opposite the piezoelectric element, for example in the first region. The input element may be a screen, preferably a touch screen.

[0027] The vibrating body may be connected to the input element such that, when excited by the piezoelectric element to vibrate, vibrations at frequencies in the ultrasonic range are applied to the input element. A standing wave may be formed above the input element. By using a solder connection between the piezoelectric element and the vibrating body, vibrations caused by the piezoelectric element, which are suppressed by the connection between the piezoelectric element and the vibrating body, are minimized, and a relatively strong signal is transmitted to the input element. In particular, this may produce a signal that is more tactilely perceptible than a signal produced by a comparable device in which the piezoelectric element is connected to the vibrating body by adhesive.

[0028] Standing waves can cause modulation of the upper friction, which represents a tactilely perceptible signal.

[0029] Another aspect of the present invention relates to a method for manufacturing a device having a vibrating body and a piezoelectric element, in which the piezoelectric element and the vibrating body are connected by a solder joint. The device may be the device described in the above aspect.

[0030] The solder connections may be made by a reflow soldering process, or a vapor phase soldering process, or by electrothermal soldering.

[0031] The piezoelectric element may be polarized before or after connecting the piezoelectric element and the vibrating body by a solder joint.

[0032] A single soldering process may form two electrical connections for applying an excitation voltage to the piezoelectric element. The electrical connections may be a solder connection and a second solder connection. The solder connection and the second solder connection may be formed simultaneously using the same soldering process and the same solder material.

[0033] The vibrating body may have at least two wirings. A first electrode of the piezoelectric element contacts one of the at least two wirings through a solder connection, and a second electrode of the piezoelectric element contacts the other of the at least two wirings through a second solder connection. The solder connection and the second solder connection are formed in a single soldering process. [Brief explanation of the drawings]

[0034] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0035] [Figure 1] FIG. 1 is a diagram showing a device having a vibrating body and a piezoelectric element fixed to the vibrating body. [Figure 2] 2 is a photomicrograph of a region of the device shown in FIG. 1. [Figure 3] FIG. 2 shows a device having the apparatus shown in FIG. 1. [Figure 4] FIG. 2 is a perspective view showing a first embodiment of the device. [Figure 5] FIG. 10 is a diagram showing the results of comparative measurements. [Figure 6] FIG. 10 is a diagram showing an apparatus according to a second embodiment. [Figure 7] FIG. 10 is a diagram illustrating a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0036] 1 is a diagram showing a device having a vibrating body 1 and a piezoelectric element 2 fixed to the vibrating body. The piezoelectric element 2 is a piezoelectric actuator designed to vibrate the vibrating body 1. A plurality of piezoelectric elements 2 are fixed to the vibrating body 1.

[0037] The vibrating body 1 has a T-shaped cross section. The vibrating body has a first region 3, which is formed as a vertical line of the T in the cross section of the vibrating body 1. The vibrating body has a second region 4, which is formed as a horizontal line of the T in the cross section of the vibrating body 1. The piezoelectric element 2 is fixed to the second region 4 on the opposite side to the first region 3.

[0038] The piezoelectric element 2 is fixed to the vibrating body 1 by a solder joint 5. The solder joint 5 has lead-free solder. The solder material may be, for example, a SnAgCu solder material. The solder joint 5 mechanically fixes the piezoelectric element 2 to the vibrating body 1 and also electrically connects the piezoelectric element 2 to the vibrating body 1.

[0039] The piezoelectric element 2 may be excited to vibrate at a frequency in the ultrasonic range. For this purpose, an AC voltage may be applied as an excitation signal to the piezoelectric element 2. The excitation signal may be applied to the piezoelectric element 2 via the vibrating body 1.

[0040] The piezoelectric element 2 and the vibrating body 1 may be connected to transmit vibrations of the piezoelectric element 2 to the vibrating body 1, exciting the vibrating body 1 to vibrate at frequencies in the ultrasonic range. The solder connection 5 has high rigidity and does not dampen or barely dampen the vibrations when transmitted from the piezoelectric element 2 to the vibrating body 1.

[0041] The piezoelectric element 2 has metal electrodes. A first electrode 9 covers the surface of the piezoelectric element 2 facing the vibrating body 1. A second electrode 10 covers the surface of the piezoelectric element 2 opposite the vibrating body 1. The first electrode 9 is fixed to the vibrating body 1 by a solder joint 5.

[0042] The electrodes 9, 10 may be manufactured by thin film or thick film techniques, for example by metallizing the piezoelectric element 2 with silver paste in a thick film process.

[0043] The vibrating body 1 may include or be made of a conductive material. The vibrating body 1 may include, for example, aluminum or stainless steel, or may be made of aluminum or stainless steel. Aluminum has poor solderability. Therefore, a vibrating body 1 including aluminum may further include a coating that improves solderability. For example, the coating may be sputtered. The coating may be made of multiple sub-layers. The coating may include a chromium-containing layer, a nickel-containing layer, and a silver-containing layer.

[0044] Figure 2 is a photomicrograph showing one area of ​​the device shown in Figure 1. In Figure 2, the piezoelectric element 2, the solder connection 5 and the vibrating body 1 are shown.

[0045] 3 is a diagram showing a device having the apparatus shown in FIG. 1. The device further includes an input element 6. The input element 6 is a touch screen. The input element 6 has an upper side 7 that a user can touch with, for example, a finger or a pen, and a lower side 8 that is disposed opposite the upper side 7 and to which the vibrating body 1 is fixed. The first region 3 of the vibrating body 1 is fixed to the lower side 8 of the input element 6.

[0046] When the vibrating body 1 is excited by the piezoelectric element 2 and vibrates at a frequency in the ultrasonic range, it is designed to transmit the vibrations to the input element 6. The vibrations transmitted to the input element 6 form a surface standing wave on the upper side 7 of the input element 6. A user touching the upper side 7 of the input element 6 feels a friction modulation caused by the standing wave. This friction modulation represents a signal that can be tactilely sensed by the user. The standing wave can particularly form a micrometer-wide deformation on the upper side 7 of the input element 6, which forms an overpressure area on the upper side 7. The overpressure area reduces the coefficient of friction, which the user can feel tactilely.

[0047] FIG. 4 is a perspective view showing a part of the first embodiment of the device.

[0048] According to the first embodiment, the vibrating body 1 has a body made of aluminum and having a T-shaped cross section. The vibrating body 1 further has a Cr / Ni / Ag coating applied to the body by sputtering.

[0049] The vibrator according to the first embodiment has a length of 150 mm to 200 mm. The extension of the vibrator in a direction perpendicular to the cross section shown in Fig. 1 is called the length of the vibrator.

[0050] In a first embodiment, 16 piezoelectric elements 2 made of PZT ceramic are fixed to the vibrating body 1. Fig. 4 shows only a part of the device. In other embodiments, the vibrating body 1 has other numbers of piezoelectric elements 2.

[0051] In the first embodiment, the piezoelectric elements 2 are each connected to the vibrating body 1 by a solder connection 5, which has a SnAgCu solder material and is formed by reflow soldering.

[0052] FIG. 5 is a diagram showing the results of comparative measurements between the device according to the first embodiment and a reference object.

[0053] The same vibrator with 16 identical piezoelectric elements fixed to it with an acrylic resin adhesive was used as a reference.

[0054] An AC voltage was applied to the piezoelectric element 2 of the first embodiment and the reference piezoelectric element. In both cases, vibration of the corresponding vibrating body 1 was excited by this. The amplitude of the vibrating body 1 was measured using a laser Doppler vibrometer. During the measurement, the frequency of the voltage applied to the piezoelectric element 2 was changed, and the maximum amplitude of the vibrating body 1 was measured for each corresponding frequency. The results of this measurement are plotted in Figure 5. The frequency, expressed in arbitrary units, is taken as the abscissa, and the degree of deflection of the vibrating body 1 is taken as the ordinate.

[0055] The measured values ​​for the first embodiment are shown by curve K1. The measured values ​​for the reference are shown by curve K2. The maximum value of curve K1 measured for the first embodiment was more than twice the maximum value of curve K2 measured for the reference. The comparative measurements showed that when the piezoelectric element 2 was fixed to the vibrating body 1 by a solder connection 5, the amplitude of the vibrating body 1 was larger, even for the same excitation signal, than when the piezoelectric element 2 was connected to the vibrating body 1 by adhesive. A 2.4-fold increase in amplitude was measured.

[0056] The reason for the increase in amplitude when using the solder connection 5 is that the solder connection 5 has higher rigidity than an adhesive, and, unlike an adhesive, the solder connection 5 does not have viscoelastic properties. Due to these two properties, the solder connection 5 is less able to suppress the vibrations generated in the piezoelectric element 2 than an adhesive. Another advantage of the solder connection 5 over an adhesive is that the solder connection 5 can improve the electrical connection between the piezoelectric element 2 and the vibrating body 1 compared to an adhesive.

[0057] Compared to adhesive, the vibration behavior of the vibrating body 1 with the solder connection 5 has a higher vibration quality. Therefore, the peak value of the curve K1 is higher than the peak value of the curve K2, and therefore the peak value of the curve K1 has a steeper edge.

[0058] FIG. 6 is a diagram showing an apparatus according to a second embodiment.

[0059] According to the second embodiment, the vibrating body 1 has a length of 50 mm to 150 mm, for example, 90 mm. According to the second embodiment, the vibrating body 1 comprises stainless steel. Since stainless steel has good solderability, an additional coating of the vibrating body 1 does not need to be provided.

[0060] According to the second embodiment, eight piezoelectric elements 2 having PZT ceramic are fixed to the vibrating body 1 by solder joints 5. In particular, the piezoelectric elements 2 and the vibrating body 1 are connected by the solder joints 5. The first electrode 9 is connected to a voltage source or grounded via the vibrating body 1.

[0061] A second electrode 10, which is arranged on the opposite side of the piezoelectric element 1 from the vibrating body 1, is connected to a connection element 13 via a second solder connection 11. The connection element 13 is designed to apply a potential to the second electrode 10. The connection element 13 may be a connection wire connected to a flexible printed circuit.

[0062] The solder connection 5 and the second solder connection 11 may be manufactured together in a single process step. The solder connection 5 and the second solder connection 11 may be formed in the same manner. The solder connection 5 and the second solder connection 11 each have a lead-free solder, for example, a SnAgCu solder material, and are manufactured by a reflow soldering process.

[0063] The second embodiment is compared with another reference object. The vibrating body of the other reference object is the same as the vibrating body 1 of the second embodiment. The vibrating body of the other reference object has eight piezoelectric elements fixed thereto, similar to the structure of the piezoelectric element 2 of the second embodiment. For the other reference object, the piezoelectric elements are bonded to the vibrating body with epoxy resin. Comparing the second embodiment with the other reference object also reveals that when the piezoelectric element 2 is fixed to the vibrating body 1, the amplitude of the vibrating body 1 is increased compared to the comparison object in which the piezoelectric elements are bonded to the vibrating body.

[0064] FIG. 7 is a diagram showing a third embodiment of the present invention.

[0065] According to a third embodiment, the vibrating mass 1 comprises a non-conductive material. The vibrating mass 1 may comprise glass, ceramic or glass-reinforced plastic or may consist of one of these materials.

[0066] Two or more wirings 12 are added to the vibrating body 1 by a coating process. The first electrode 9 and second electrode 10 of the piezoelectric element 2 can be soldered to the vibrating body 1 simultaneously with the wirings 12. The first electrode 9 faces the vibrating body 1 and contacts one of the wirings of the vibrating body 1 via a solder connection portion 5. The second electrode 10 extends from the side of the piezoelectric element 2 opposite the vibrating body 1, via the side wall of the piezoelectric element 2, to the side of the piezoelectric element 2 facing the vibrating body 1. On the side of the piezoelectric element 2 facing the vibrating body 1, the second electrode 10 contacts the other of the wirings 12 of the vibrating body 1. The second electrode 10 contacts the vibrating body 1 via a second solder connection portion 11'.

[0067] The solder connection 5 between the first electrode 9 and one of the wires 12 and the second solder connection 11' between the second electrode 10 and the other of the wires 12 are formed simultaneously in a single soldering process.

[0068] The present application discloses the following:

[0069] (1) The piezoelectric element (2) is fixed to a vibrating body (1) by a solder joint (5), The vibrating body (1) has a T-shaped cross section, the cross section having a first region (3) of a first width and a second region (4) of a second width, the second width being larger than the first width, and the first region being disposed at the center of the second region; The piezoelectric element (2) is disposed on the opposite side of the second region from the first region.

[0070] (2) The piezoelectric element (2) has a first electrode (9) and a second electrode (10), the first electrode (9) is disposed on a side of the piezoelectric element (2) facing the vibrating body (1), and is connected to a first wiring disposed on the vibrating body (1) via a solder connection part (5); The device described in (1) above, wherein the second electrode (10) is arranged on the opposite side of the piezoelectric element (2) from the vibrating body (1), extends through the side wall of the piezoelectric element (2) to the side of the piezoelectric element (2) facing the vibrating body (1), and is connected to a second wiring arranged on the vibrating body (1) via a second solder connection portion (11).

[0071] (3) The device according to (1) or (2) above, wherein the piezoelectric element (2) comprises a piezoelectric polymer.

[0072] (4) The piezoelectric element (2) is fixed to a vibrating body (1) by a solder joint (5), The piezoelectric element (2) has a first electrode (9) and a second electrode (10), At least two wirings (12) are arranged on the vibrating body (1), the first electrode (9) is connected to one of the at least two wirings (12) via the solder connection portion (5); The device, wherein the second electrode (10) is connected to the other of the at least two wirings (12) via a second solder connection (11').

[0073] (5) The piezoelectric element (2) is fixed to a vibrating body (1) by a solder joint (5), The piezoelectric element (2) has a first electrode (9) and a second electrode (10), the first electrode (9) is disposed on a side of the piezoelectric element (2) facing the vibrating body (1), and the second electrode (10) is disposed on a side of the piezoelectric element (2) opposite to the vibrating body (1); the first electrode (9) is connected to the vibrating body (1) via the solder connection portion (5); The second electrode (10) is connected to a connection element (13) via a second solder connection (11).

[0074] (6) A device comprising a vibrating body (1) to which a piezoelectric element (2) is fixed by a solder joint (5), the vibrating body (1) comprising a non-conductive material.

[0075] (7) The device according to (6) above, wherein the vibrating body (1) is made of the non-conductive material.

[0076] (8) The vibrating body (1) is made of aluminum or stainless steel, The vibrating body (1) comprises glass, ceramic, or glass-reinforced plastic; The device according to any one of (1) to (5) above.

[0077] (9) The device according to any one of (1) to (8) above, wherein a coating is applied to the vibrating body (1), and the solder connection portion (5) is disposed on the coating.

[0078] (10) The device according to any one of (1) to (9), wherein the piezoelectric element (2) has a Curie temperature higher than the melting temperature of the material of the solder connection (5).

[0079] (11) The piezoelectric element (2) is designed to excite the vibrating body (1) to vibrate at a frequency in the ultrasonic range. The device according to any one of (1) to (10) above.

[0080] (12) The device according to any one of (1) to (11) above, wherein the solder connection (5) comprises a lead-free solder.

[0081] (13) A device according to any one of (1) to (12) above and an input element, the input element has an upper side and a lower side; The vibrating body (1) is fixed to the underside of the input element.

[0082] (14) The input element (6) is a touch screen. The device according to (13) above.

[0083] (15) The device according to claim 13 or 14, wherein the vibrating body (1) is connected to the input element (6) so that when excited to vibrate by the piezoelectric element (2), vibrations of a frequency in the ultrasonic range are applied to the input element (6), and a standing wave is formed above the input element.

[0084] (16) A method for manufacturing a device having a vibrating body (1) and a piezoelectric element (2), comprising: a step of connecting the piezoelectric element (2) and the vibrating body (1) by a solder joint (5), The vibrating body (1) has a T-shaped cross section, the cross section having a first region (3) of a first width and a second region (4) of a second width, the second width being larger than the first width, and the first region being disposed at the center of the second region; The piezoelectric element (2) is disposed on the opposite side of the second region from the first region.

[0085] (17) A method for manufacturing a device having a vibrating body (1) and a piezoelectric element (2), comprising: a step of connecting the piezoelectric element (2) and the vibrating body (1) by a solder joint (5), The piezoelectric element (2) has a first electrode (9) and a second electrode (10), At least two wirings (12) are arranged on the vibrating body (1), the first electrode (9) is connected to one of the at least two wirings (12) via the solder connection portion (5); The second electrode (10) is connected to the other of the at least two wirings (12) via a second solder connection (11').

[0086] (18) A method for manufacturing a device having a vibrating body (1) and a piezoelectric element (2), comprising: a step of connecting the piezoelectric element (2) and the vibrating body (1) by a solder joint (5), The piezoelectric element (2) has a first electrode (9) and a second electrode (10), the first electrode (9) is disposed on a side of the piezoelectric element (2) facing the vibrating body (1), and the second electrode (10) is disposed on a side of the piezoelectric element (2) opposite to the vibrating body (1); the first electrode (9) is connected to the vibrating body (1) via the solder connection portion (5); The second electrode (10) is connected to a connection element (13) via a second solder connection (11).

[0087] (19) A method for manufacturing a device having a vibrating body (1) and a piezoelectric element (2), comprising: The method for manufacturing a device includes a step of connecting the piezoelectric element (2) and the vibrating body (1) with a solder joint (5), wherein the vibrating body (1) comprises a non-conductive material.

[0088] (20) the solder connection (5) is produced by a reflow soldering process, or a vapor phase soldering process, or by electrothermal soldering; A method for manufacturing the device according to any one of (16) to (19) above.

[0089] (21) Before connecting the piezoelectric element (2) and the vibrating body (1) by the solder connection portion (5), the piezoelectric element (2) is polarized; Or, After connecting the piezoelectric element (2) and the vibrating body (1) by the solder joint (5), the piezoelectric element (2) is polarized. A method for manufacturing the device according to any one of (16) to (20) above.

[0090] (22) The solder connection (5) and the second solder connection (11, 11') are formed in a single soldering process, and the solder connection (5) and the second solder connection (11, 11') are designed to apply an excitation voltage to the piezoelectric element (2). A method for manufacturing the device according to any one of (16) to (21) above.

[0091] (23) The vibrating body (1) has at least two wirings, and a first electrode (9) of the piezoelectric element (2) is in contact with one of the at least two wirings via the solder connection portion (5); a second electrode (10) of the piezoelectric element (2) contacting the other of the at least two wirings via a second solder connection portion (11′); forming the solder connection (5) and the second solder connection (11') in a single soldering process; A method for manufacturing a device according to any one of (16) to (21) above. [Explanation of symbols]

[0092] 1 vibrating body 2 Piezoelectric element 3. First region of the vibrating body 4. Second region of the vibrating body 5 Solder joints 6 input elements 7 Upper side of input element 8 Bottom of input element 9. First electrode of piezoelectric element 10 Second electrode of piezoelectric element 11 Second solder joint 11' Second solder joint 12 Wiring 13 Connecting elements K1: A curve showing the measured values ​​measured for the first embodiment K2 Curve showing measurements taken against a reference

Claims

[Claim 1] The piezoelectric element (2) is fixed to a vibrating body (1) by a solder joint (5), The vibrating body (1) has a T-shaped cross section, the cross section having a first region (3) of a first width and a second region (4) of a second width, the second width being larger than the first width, and the first region being disposed at the center of the second region; The piezoelectric element (2) is disposed on the opposite side of the second region from the first region.

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