Wafer handling robot with radial gas curtain and / or interior volume control

Abstract

To provide systems and techniques for reducing or eliminating particulate contamination from wafer handling robots configured for vertical translation.SOLUTION: In an EFEM 210, a collar 232 includes an aperture 252, through which a turret 224 of a wafer handling robot 214 may be extended or retracted, and further includes one or more radial gas passages 234. Gas directed at the turret from the radial passage(s) turns downward when it strikes the turret and prevents or discourages gas from within a base 230 of the wafer handling robot from escaping through the aperture. And, a bellows is affixed to a bottom of the turret and to a bottom of the base such that volume of the base occupied by the turret and the bellows 254 remains generally fixed regardless of a degree to which the turret is extended from the base.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] <Incorporated by Reference> A PCT application is being filed concurrently herewith as part of this application, and each application identified in that concurrently filed PCT application to which this application claims benefit or priority is incorporated herein by reference in its entirety for all purposes. [Background technology]

[0002] Semiconductor processing tools often utilize a Front End Equipment Module (EFEM), a large chamber or vestibule that is part of the semiconductor processing tool and typically has a load port on one side to accept front-opening unified pods (FOUPs) used to transport wafers in bulk, e.g., 25 at a time, between semiconductor processing tools. The EFEM may also typically have one or more load locks or other interfaces, usually on the opposite side of the load port, for introducing wafers into a transfer chamber or processing chamber. A wafer handling robot is typically located within the EFEM to transfer wafers between the load port and the load lock, as well as potentially between other stations within the EFEM, e.g., a wafer aligner.

[0003] Wafer handling robots used in EFEMs often include the ability to move wafers horizontally via articulated arms having arm links configured to each rotate relative to an attached arm link, and vertically via a linear motion mechanism that, for example, raises or lowers the entire robot arm assembly.

[0004] Presented herein is an improved wafer handling robot configuration that is particularly suited for use in certain types of EFEMs, such as those that may have a corrosive environment therein, e.g., an environment with elevated moisture levels or an environment in which one or more gases, such as chlorine, fluorine, or other corrosive substances, are present. Summary of the Invention

[0005] The details of one or more embodiments of the subject matter described herein are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages will become apparent from the description, drawings, and claims.

[0006] The present inventors have devised at least two different mechanisms that can be used alone or in tandem to provide an improved wafer handling robot, both of which reduce the potential for particulate contamination due to the vertical (z-axis) movement of the wafer handling robot.

[0007] Wafer-handling robots with z-axis capabilities typically include a base, which may be fixed relative to a chamber or structure (such as an EFEM; such a structure may be referred to simply as a chamber herein, which should be understood to include an EFEM), a turret mounted to the base so that the turret can move vertically relative to the base, and one or more robot arms supported by the turret and actuated by motors located within the turret. The turret is typically contained largely within the base when the wafer-handling robot is in its lowest vertical position and can rise from the base through an opening in the base when raised to a raised position. The inventors have determined that vertical movement of the turret relative to the base is a source of particulate contamination because air (or any atmosphere present in the chamber) is pushed out or drawn into the base with each lowering or raising of the turret. For example, a turret with an 8-inch diameter and 18-inch vertical travel can displace more than 0.5 cubic feet of volume as it travels.

[0008] Such displacement can cause gases within the base to be exhausted into the ambient environment surrounding the wafers in a chamber or similar structure when the wafer-handling robot is actuated to lower the robot arm, potentially expelling particulates from the equipment within the base into the chamber, where they may come into contact with and contaminate wafers that may be in the chamber. Such displacement can also cause air from within the chamber to be drawn into the base of the wafer-handling robot when the wafer-handling robot is actuated to raise the robot arm, potentially causing problems within the chamber where corrosive gases are present. Such corrosive gases can damage components within the base, such as bearings, motors, electrical cables, etc., and thus affect the performance or operability of the wafer-handling robot. Such corrosion, as recognized, can also result in the generation of additional particulates, increasing the likelihood that wafers will be subject to particulate contamination due to the movement of the wafer-handling robot.

[0009] The present inventors have devised two particulate mitigation techniques that can be used with wafer handling robots such as those described above to reduce or eliminate particulate contamination resulting from turret displacements of such wafer handling robots.

[0010] The first technique is a collar or other structure that provides a radial gas curtain that extends completely around the turret at a location near the top of the base. The radial gas curtain can deliver a thin radial flow of air (or other gas, such as nitrogen) across a relatively small gap toward the turret. After bridging the gap, this gas curtain strikes the side of the turret and rotates to flow in a generally vertical direction. Some of this air flows into the base of the wafer-handling robot, while the remaining air flows into the chamber. The portion of the air flowing into the base tends to push against or oppose any air flow attempting to flow out of the base at the location of the gas curtain, thereby causing any particulates that may be entrained in such air to become lodged within the base. The portion of the air flowing into the base can also tend to increase internal pressure within the base (if the base has an exhaust vent for escaping such gas that is small enough to create a positive pressure differential between the base and the ambient environment). The resulting positive pressure in the base relative to the chamber can prevent corrosive elements from entering the base at locations other than the location of the gas curtain. A portion of the air flowing into the chamber from the collar or other structure tends to push against or oppose the flow of any air attempting to flow into the base at the location of the gas curtain, thereby causing any corrosive elements that may be entrained in such air to remain within the chamber. While reference is often made herein to "air," it will be understood that other gases, such as nitrogen, can be used in place of air, as discussed above.

[0011] The second technique is a bellows unit that can be attached at one end to the bottom end of the turret and at the other end to the base. The bellows unit can therefore expand into the interior volume of the base when the turret rises and compress when the turret lowers. The bellows can act to keep the free volume within the base nearly constant, regardless of the vertical position of the turret relative to the base. As a result, there may be little or no overall displacement of air from the base due to vertical movement of the turret relative to the base. The bellows can also act to prevent potentially corrosive air from the chamber's ambient environment from being drawn into the base from the bottom.

[0012] While either technique by itself can reduce the likelihood or severity of particulate contamination, the use of both techniques provides a synergistic effect, reducing the particle generation rate of the wafer handling robot's vertical movement system within the chamber to virtually zero, e.g., less than 10 particles in a 72-minute window.

[0013] In some implementations, an apparatus can be provided that includes one or more robotic arms, a turret supporting the one or more robotic arms, a linear translation mechanism supporting the turret, and a base supporting the linear translation mechanism. In such an apparatus, the linear translation mechanism can be configured to move the turret and the one or more robotic arms along a first axis relative to the base, the base can include an opening sized to allow at least a first portion of the turret to pass therethrough as the turret moves along the first axis, the opening can have one or more radial gas passages extending around substantially all of the opening, the one or more radial gas passages can be fixed in size, a first gap can exist between an inner edge of the opening and the first portion of the turret, and the first gap can extend around an outer periphery of the first portion of the turret.

[0014] In some embodiments of the device, the first gap between the first portion of the turret and the interior edge of the opening may be free of intervening structure around substantially all of the turret.

[0015] In some embodiments of the apparatus, the one or more radial gas passages may have a minimum width in a direction parallel to the first axis of less than 1 mm.

[0016] In some embodiments of the apparatus, the one or more radial gas passages may have a minimum width in a direction parallel to the first axis of less than 0.5 mm.

[0017] In some embodiments of the apparatus, the one or more radial gas passages may have a minimum width in a direction parallel to the first axis of 0.25 mm or less.

[0018] In some implementations of the apparatus, the one or more radial gas passages may be at least partially defined by one or more first surfaces and one or more second surfaces, and the one or more first surfaces may face toward the one or more second surfaces and may be separated from the one or more second surfaces by a second gap.

[0019] In some embodiments of the device, the one or more first surfaces and the one or more second surfaces may be perpendicular to the first axis.

[0020] In some embodiments of the device, each of the one or more first surfaces may define a first cross-sectional radial profile relative to a second axis parallel to the first axis and centered at the opening, and each of the one or more second surfaces may define a second cross-sectional radial profile relative to the second axis, the cross-sectional radial profiles may include one or more first cross-sectional radial profiles, and the one or more second cross-sectional radial profiles may each lie in a corresponding plane that is coincident with and parallel to the second axis, and each first cross-sectional radial profile may define an average first linear radial profile that is within ±30° of perpendicular to the second axis, and each second cross-sectional radial profile may define an average second linear radial profile that is within ±30° of perpendicular to the second axis.

[0021] In some implementations of the device, the device may further include one or more plenum volumes, one or more gas inlets, and one or more flow control components configured to regulate the flow of gas to the one or more gas inlets. In such implementations, each gas inlet may be fluidly connected to one of the one or more plenum volumes, each of the one or more plenum volumes may be fluidly connected to at least one of the one or more gas inlets, each of the one or more gas inlets may be fluidly interposed between one of the one or more plenum volumes and one of the one or more flow control components, and each of the one or more plenum volumes may be fluidly interposed between one of the one or more gas inlets and one or more radial gas passages.

[0022] In some embodiments of the device, the device may further include one or more gas sources, and the one or more flow control components may be fluidly connected to the one or more gas sources and configured to provide gas from the one or more gas sources to the one or more plenum volumes at a rate of 25 to 150 standard liters per minute. In such embodiments, the one or more radial gas passages may be sized such that gas from the one or more plenum volumes flows from the one or more radial gas passages at a velocity of at least 5 m / sec.

[0023] In some embodiments of the device, the first portion of the turret may have a first nominal circular cross-section and the opening may have a corresponding second nominal circular cross-section having a diameter larger than the diameter of the first nominal circular cross-section.

[0024] In some embodiments of the device, the one or more radial gas passages may include only a single gas passage in the form of a radial slit that extends around the entire opening without interruption in continuity.

[0025] In some embodiments of the apparatus, the first gap may be between 0.5 mm and 5 mm around the turret.

[0026] In some embodiments of the device, the device may further include a bellows, a first end of the bellows may be fixed to an end of the turret located within the base, a second end of the bellows opposite the first end may be fixed to a surface of the base opposite the opening, the bellows may expand in response to movement of the turret away from the surface of the base, and the bellows may contract in response to movement of the turret toward the surface of the base.

[0027] In some implementations of the device, the bellows may have a first average enclosed cross-sectional area when viewed along the first axis, one or more outermost surfaces of the first portion of the turret may define a second average cross-sectional area when viewed along the first axis, and the first average enclosed cross-sectional area may be substantially equal to the second average cross-sectional area.

[0028] In some implementations of the apparatus, the first portion of the turret may be nominally circular and may have a first nominal diameter, the bellows may have a plurality of pleats, each pleat may have an inner diameter and an outer diameter, and the average of the inner and outer diameters of the pleats may be substantially equal to the first nominal diameter.

[0029] In some implementations of the device, the base may have one or more vents in a surface of the base and within the area surrounded by the bellows when viewed along the first axis.

[0030] In some embodiments, an apparatus can be provided that includes one or more robotic arms, a turret supporting the one or more robotic arms, a linear translation mechanism supporting the turret, a bellows, and a base supporting the linear translation mechanism. In such embodiments, the linear translation mechanism can be configured to move the turret and the one or more robotic arms along a first axis relative to the base, the base can include an opening sized to allow at least a first portion of the turret to pass through as the turret moves along the first axis, a first end of the bellows can be fixed relative to a first end of the turret located within the base, a second end of the bellows opposite the first end of the bellows can be fixed relative to a first surface of the base opposite the opening, the bellows can expand in response to movement of the turret away from the surface of the base, and the bellows can contract in response to movement of the turret toward the surface of the base.

[0031] In some embodiments of the device, there may be no bellows connecting the turret to the second surface of the base opposite the first surface of the base.

[0032] In some implementations of the device, the bellows may have a first average enclosed cross-sectional area when viewed along the first axis, one or more outermost surfaces of the first portion of the turret may define a second average cross-sectional area when viewed along the first axis, and the first average enclosed cross-sectional area may be substantially equal to the second average cross-sectional area.

[0033] In some implementations of the apparatus, the first portion of the turret may be nominally circular and may have a first nominal diameter, the bellows may have a plurality of pleats, each pleat may have an inner diameter and an outer diameter, and the average of the inner and outer diameters of the pleats may be substantially equal to the first nominal diameter.

[0034] In some implementations of the device, the base may have one or more vents in a surface of the base and within the area surrounded by the bellows when viewed along the first axis.

[0035] In some implementations of the apparatus, the opening may have one or more radial gas passages extending around substantially all of the opening, the one or more radial gas passages may be fixed in size, a first gap may exist between an inner edge of the opening and the first portion of the turret, and the first gap may extend around the periphery of the first portion of the turret.

[0036] In some embodiments of the device, the first gap between the first portion of the turret and the interior edge of the opening may be free of intervening structure.

[0037] In some embodiments of the apparatus, the one or more radial gas passages may have a minimum width in a direction parallel to the first axis of less than 1 mm.

[0038] In some embodiments of the apparatus, the one or more radial gas passages may have a minimum width in a direction parallel to the first axis of less than 0.5 mm.

[0039] In some embodiments of the apparatus, the one or more radial gas passages may have a minimum width in a direction parallel to the first axis of 0.25 mm or less.

[0040] In some implementations of the apparatus, the one or more radial gas passages may be at least partially defined by one or more first surfaces and one or more second surfaces, and the one or more first surfaces may face toward the one or more second surfaces and may be separated from the one or more second surfaces by a second gap.

[0041] In some embodiments of the device, the one or more first surfaces and the one or more second surfaces may be perpendicular to the first axis.

[0042] In some embodiments of the device, each of the one or more first surfaces may define a first cross-sectional radial profile relative to a second axis parallel to the first axis and centered at the opening, each of the one or more second surfaces may define a second cross-sectional radial profile relative to the second axis, the cross-sectional radial profiles, including the one or more first cross-sectional radial profiles and the one or more second cross-sectional radial profiles, may each lie in a corresponding plane that is coincident with and parallel to the second axis, each first cross-sectional radial profile may define an average first linear radial profile that is within ±30° of perpendicular to the second axis, and each second cross-sectional radial profile may define an average second linear radial profile that is within ±30° of perpendicular to the second axis.

[0043] In some implementations of the device, the device may further include one or more plenum volumes, one or more gas inlets, and one or more flow control components configured to regulate the flow of gas to the one or more gas inlets. In such implementations, each gas inlet may be fluidly connected to one of the one or more plenum volumes, each of the one or more plenum volumes may be fluidly connected to at least one of the one or more gas inlets, each of the one or more gas inlets may be fluidly interposed between one of the one or more plenum volumes and one of the one or more flow control components, and each of the one or more plenum volumes may be fluidly interposed between one of the one or more gas inlets and one or more radial gas passages.

[0044] In some embodiments of the device, the device may include one or more gas sources. In such embodiments, the one or more flow control components may be fluidly connected to the one or more gas sources and configured to provide gas from the one or more gas sources to the one or more plenum volumes at a rate of 25 to 150 standard liters per minute, and the one or more radial gas passages may be sized such that gas from the one or more plenum volumes flows from the one or more radial gas passages at a velocity of at least 5 m / sec.

[0045] In some embodiments of the device, the first portion of the turret may have a first nominal circular cross-section and the opening may have a corresponding second nominal circular cross-section having a diameter larger than the diameter of the first nominal circular cross-section.

[0046] In some embodiments of the device, the one or more radial gas passages may include only a single gas passage in the form of a radial slit that extends around the entire opening without interruption in continuity.

[0047] In some embodiments of the apparatus, the first gap may be between 0.5 mm and 5 mm around the turret. [Brief explanation of the drawings]

[0048] [Figure 1] FIG. 1 is a diagram of an exemplary semiconductor processing tool.

[0049] [Figure 2] FIG. 2 is a diagram of an exemplary EFEM with an exemplary wafer handling robot in a first configuration.

[0050] [Figure 3] FIG. 3 is a diagram of the example EFEM of FIG. 2 with the example wafer handling robot in a second configuration.

[0051] [Figure 4] FIG. 4 is a diagram of the example EFEM of FIG. 2 with an example wafer handling robot in a third configuration.

[0052] [Figure 5] FIG. 5 is a cross-sectional view of a portion of an exemplary gas curtain system.

[0053] [Figure 6] FIG. 6 is a cross-sectional view of a portion of another exemplary gas curtain system.

[0054] [Figure 7] FIG. 7 is a cross-sectional view of another exemplary gas curtain system.

[0055] [Figure 8] FIG. 8 is a cross-sectional top view of an exemplary gas curtain system.

[0056] [Figure 9] FIG. 9 is a top cross-sectional view of another exemplary gas curtain system.

[0057] [Figure 10]FIG. 10 is a top cross-sectional view of another exemplary gas curtain system. DETAILED DESCRIPTION OF THE INVENTION

[0058] As mentioned above, wafer handling robots used in EFEM or other types of semiconductor processing tool chambers may utilize systems such as those briefly described above to reduce particulate generation by the wafer handling robot, for example, to reduce the likelihood of exposure of the wafer handling robot's internal components to corrosive gases (if the wafer handling robot is used in such an environment).

[0059] FIG. 1 illustrates a diagram of an exemplary semiconductor processing tool. In FIG. 1, the semiconductor processing tool 100 is shown including an EFEM 110 with a wafer handling robot 114 located therein. The EFEM 110 can be connected to one or more load ports 106, which can allow wafers housed in a FOUP 108 to be transferred to the EFEM 110 by the wafer handling robot 114. The EFEM 110 can also be connected to a transfer chamber 102 (or other chambers, such as processing chambers) by one or more load locks 104. The EFEM 110 can also include a fan unit 112, which can push air within the EFEM into a vent system at the floor of the EFEM 110; in other embodiments, the vent system may simply be connected to an exhaust system having a negative pressure source, e.g., a blower unit, to draw air downward through the EFEM 110 (in still other embodiments, the EFEM may not have a vent system at all).

[0060] FIG. 2 is a diagram of an exemplary EFEM with an exemplary wafer-handling robot in a first configuration. In FIG. 2, the EFEM 210 is shown, and in this example, the EFEM 210 is not shown attached to other components, e.g., load ports, load locks, etc., to avoid undue clutter and allow the discussion to focus on the wafer-handling robot 214. The wafer-handling robot 214 may include, for example, a base 230 having a linear motion mechanism 242 therein configured to raise or lower a turret 224. The linear motion mechanism 242 in this example includes a ball screw 244 that can pass through a ball screw nut 246 attached to the turret 224 and is supported at one end by a bearing support 248 and at the other end by a motor 250. When the motor 250 is actuated to rotate the ball screw 244, the ball screw 244 raises and lowers the ball screw nut 246, thereby extending or retracting the turret 224 through an opening 252 along a direction parallel to the first axis 238. The base 230 may have a housing that generally surrounds and protects the hardware within the base 230, but the housing may have various openings or leak paths that may allow gas to flow between the interior and exterior of the housing (described below).

[0061] The turret 224 can support one or more robotic arms, which can include, for example, an upper link 218, a lower link 220, and an end effector 222, which can be actuated by various drive motors and other systems located within the turret (or elsewhere).

[0062] As previously described, the wafer handling robot may include either or both of two techniques described herein that may help mitigate particle generation by the wafer handling robot and / or protect the wafer handling robot from potentially harmful exposure to a corrosive ambient environment.

[0063] A first technique, described in more detail below, is the inclusion of a radial gas curtain, which may be provided by a collar 232 defining an opening 252. The collar 232 may include one or more radial gas passages 234 fluidly connected to a plenum volume 236 within the collar 232. Gas may flow into the plenum volume 236 through one or more gas inlets (not shown) and then flow radially inward from the one or more radial gas passages 234 toward the turret 224 at a relatively high velocity, e.g., 5 m / s, 10 m / s, 15 m / s, 20 m / s, 25 m / s, or greater. The one or more radial gas passages 234 may be sized to be relatively thin, e.g., having a height of 1 mm, 0.75 mm, 0.5 mm, or 0.25 mm or less, thereby achieving a desired gas velocity at a reduced amount of gas volumetric flow rate, e.g., between 25 and 150 standard liters per minute (SLM), or between 50 and 100 SLM. A first gap 240 may exist between the turret 224 and the collar 232, allowing the first portion 226 of the turret 224 to move through the opening 252 without contacting the collar 232. This first gap 240 may be maintained at a value equal to or less than 5 mm, 4 mm, 3 mm, 2 mm, 1 mm, or 0.5 mm (or any value therebetween). In this example, the turret 224 is generally cylindrical and has a first nominal diameter 228, and the opening 252 is a circular opening having a nominal diameter equal to twice the first gap 240 plus the first nominal diameter 228. It will be understood that other embodiments may feature turrets 224 with different nominal cross-sectional shapes, e.g., square, hexagonal, etc., and the opening 252 in the collar 232 may be similarly shaped such that the first gap 240 remains generally constant, e.g., ±10% or ±20%, around the circumference of the first portion 226 of the turret 224.

[0064] As mentioned above and described in more detail below, gas, such as clean, dry air, nitrogen, or other gas compatible with the environment within the EFEM and / or the internal components of the wafer-handling robot, may flow through the plenum volume 236 and exit one or more radial gas passages 234 radially inward toward the outer surface of the turret 224, thereby allowing the gas flow to rotate both upward and downward along the outer surface of the turret 224. The portion of the gas flowing downward into the base 230 may act to push against any gas that may be attempting to flow out of the base through the first gap 240, thereby resisting the flow of gas from within the base 230 through the openings 252 and any particulates that may be entrained therein. The base 230 may also have one or more exhaust fans 265, which may be positioned along a surface of the base 230, e.g., a bottom surface 264 of the base 230, and which may be controlled to exhaust gas from within the base 230 to relieve pressure from within the base 230. The fan speed can be controlled so that the volumetric flow rate of gas passing through the fan is nominally equal to the volumetric flow rate of gas entering the base 230 through the openings 252, e.g., approximately half the volumetric flow rate of gas exiting the collar 232. This can allow the gas flow from the collar 232 to release any pressure built up within the base 230, thereby allowing the gas flow from the collar 232 to continue to oppose the flow of gas from within the base 230. Gases flowed out of the base 230 by the fan can be drawn downward by a downdraft within the EFEM, which in some embodiments includes a floor-located exhaust system. In other embodiments, the fan 265 can be omitted and replaced with one or more vents or exhaust ports, which can be provided to allow gases introduced into the base 230 by the collar 232 to exit the base 230 and exhaust into the ambient environment of the EFEM 210 or another chamber in which the base 230 is located.In such cases, the vent or exhaust port can be sized such that during normal operation (i.e., using the EFEM 210 or other chamber at nominal ambient pressure conditions used during wafer transfer operations, and using the collar 232 or other structure that provides a radial gas curtain at a nominal flow rate), an internal pressure of at least a few pascals higher than the ambient pressure within the EFEM 210 is maintained within the base 230, thereby preventing or reducing the possibility of corrosive gases in the ambient environment of the EFEM 210 entering the base 230.

[0065] A second technique that may be included in a wafer handling robot, alone or in combination with the radial gas curtain described above, is the use of a bellows 254 that spans between the bottom of the turret 224 and a bottom surface 264. The bellows 254, which may be made of a flexible material such as an elastomeric material, an elastomer-impregnated fabric, or a thin metal, may include a first end 260 that attaches to one or more bottom surfaces of the turret 224 and a second end 262 that attaches to the bottom surface 264 of the base 230. The bottom surface 264 of the base 230 may have a vent (or vents) 258 that allows gas within the bellows 254 to escape when the bellows 254 is compressed, for example, when the turret 224 moves from a raised position to a lowered position.

[0066] In some embodiments, bellows 254 may have a plurality of pleats 256, each having an inner diameter 266 and an outer diameter 268. The inner diameter 266 and the outer diameter 268 of pleats 256 of bellows 254 may be selected to provide an average diameter generally equal to first nominal diameter 228 of first portion 226 of turret 224, for example, within ±10% or ±20%. By selecting inner diameter 266 and outer diameter 268 in this manner, turret 224 and bellows 254 together can occupy a volume within base 230 whose size remains nominally constant, regardless of how far or how little turret 224 extends from base 230. As a result, when turret 224 moves into or out of base 230, the volume of gas displaced within base 230 (not including the volume of air within base 230 but "separated" from the interior volume of base 230 by bellows 254) is negligible. Thus, the use of bellows 254 as shown in FIG. 2 prevents gas from within the base from being forced out through opening 252 by the reciprocating motion of turret 2 (or at least significantly reduces the amount of such gas that can be expelled). FIG. 3 is a diagram of the exemplary EFEM of FIG. 2 with the exemplary wafer handling robot in a second configuration, e.g., partially extended, and FIG. 4 is a diagram of the exemplary EFEM of FIG. 2 with the exemplary wafer handling robot in a third configuration, e.g., fully retracted. As can be seen in each configuration, the interior volume 231 of base 230 remains approximately the same regardless of how far turret 224 is extended or retracted. 2-4, it may be possible to extend or retract the turret 224 of the wafer handling robot 214 with little displacement of the air (or gas) within the base 230. This can greatly reduce the likelihood that particulates entrained within such gas will be forced out of the base 230 by such reciprocating motion of the turret.

[0067] It will also be appreciated that the above-described bellows can be used in conjunction with turrets that are not nominally cylindrical in shape. In such embodiments, the inner and outer diameters of the bellows pleats can be selected to define an average cross-sectional area (e.g., based on the area within a circle having a diameter that is the average of the inner and outer diameters of the bellows pleats) that is generally equal to the cross-sectional area within the outermost surface of the first portion of the turret and within a plane perpendicular to first axis 238 (or, if a non-circular bellows is used, the average cross-sectional area of ​​the bellows, including the area within the bellows, can be generally equal to the cross-sectional area within the outermost surface of the first portion of the turret).

[0068] As explained above, the bellows described above can be used with or without the radial gas curtain feature described above (and vice versa). The radial gas curtain feature can be configured in many different ways, as will be explained in more detail below.

[0069] FIG. 5 is a cross-sectional view of a portion of an exemplary gas curtain system. As seen in FIG. 5, a collar 532 can have a plenum volume 536 supplied with air by one or more gas inlets 574. The plenum volume 536 can be configured to distribute gas from the one or more gas inlets 574 to one or more radial gas passages 534. The one or more radial gas passages 534 can direct gas, e.g., air, from the plenum volume 536 toward the turret 524, for example, radially inward toward the turret 524 across a first gap 540. In the embodiment shown in FIG. 5, the one or more radial gas passages 534 take the form of a single circumferential radial slit extending entirely around the turret 524. The radial gas passage 534 in this case is provided by a first surface 580 and a second surface 582, which face each other and can be separated by a second gap 584. First surface 580 may be defined by a first cross-sectional radial profile 586, which in this example is a line, and may be represented by an average first linear radial profile 590. Similarly, second surface 582 may be defined by a second cross-sectional radial profile 588, also a line in this example, and may be represented by an average second linear radial profile 592.

[0070] Although FIG. 5 illustrates as an exemplary radial gas passage a linear radial slit, i.e., a slit in which the average first linear radial profile 590 and the average second linear radial profile 592 are parallel to each other and perpendicular to the first axis 538, other configurations of radial gas passages may be used as well, including, for example, radial gas passages having curved or angled first and second surfaces.

[0071] FIG. 6 is a cross-sectional view of a portion of another exemplary gas curtain system. The gas curtain system of FIG. 6 is similar to that of FIG. 5, and callouts in FIG. 6 with the same last two digits as those in FIG. 5 refer to similar structures; readers are referred to the previous discussion of FIG. 5 for a description of these structures. The gas curtain system of FIG. 6 differs from the gas curtain system of FIG. 5 in that the radial gas passages 634 have different cross-sectional profiles. For example, the radial gas passages 634 are defined by a first surface 680 and a second surface 682. The first surface 680 can have a curved first cross-sectional radial profile 686 that defines an average first linear radial profile 690 and a curved second cross-sectional radial profile 688 that defines an average second linear radial profile 692. In some such implementations, the average first linear radial profile 690 and the average second linear radial profile 692 can each be within ±10°, ±20°, or ±30° of an axis perpendicular to the first axis 638. In some further such embodiments, the average first linear profile 690 and the average second linear profile 292 can be angled asymmetrically with respect to an axis perpendicular to the first axis 638, for example. For example, the average first linear profile 690 and the average second linear profile 292 can both be angled slightly downward toward the base, such that the radial curtain gas flow is biased more toward the base 230 than into the EFEM 210 after impacting the turret 224. In another example, the average first linear profile 690 and the average second linear profile 292 can both be angled slightly upward away from the base, such that the radial curtain gas flow is biased more into the EFEM 210 than into the base 230 after impacting the turret 224. This may allow for adjustment of the amount of gas allocated to preventing air from within the base 230 from entering the EFEM 230 through the openings 252 versus preventing gas from within the EFEM 230 from entering the base 230 through the openings 252.

[0072] As previously explained, gas exiting one or more radial gas passages of one of the collars described herein may be directed toward the turret of a wafer-handling robot. FIG. 7 is a cross-sectional view of an exemplary gas curtain system illustrating such gas flow. As seen in FIG. 7, collar 732 is shown having a plenum volume 736 that receives gas from gas inlets 774 (indicated by the air flow arrows) and distributes the gas to radial gas passages 734. After the gas exits radial gas passages 734, it is directed radially inward across a first gap 740 to impinge on the side of turret 724. The gas flow then splits into two general directions: upward back toward the EFEM and downward toward the base.

[0073] It will be appreciated that the collars described above, and the radial gas passages they contain, can be provided in many forms. In some implementations, the collars may not be separate components, but may be integrated into the housing of the base or another component. Some implementations of the gas curtain systems described herein may feature radial gas passages of various shapes. Some of these various implementations are described below.

[0074] FIG. 8 is a top cross-sectional view of an exemplary gas curtain system. Shown in FIG. 8 is a collar 832 including a plenum volume 836 to which gas is provided through a gas inlet 874. A turret 824 extends through an opening in the collar 832 and is separated from the collar 832 by a first gap 840. Gas from the plenum volume 836 can flow across the first gap 840 through a radial gas passage 834, which is a single circumferential radial slit, similar to some of the previous collars described herein. Such a radial gas passage 834 can provide a uniformly distributed gas flow around the circumference of the turret 824.

[0075] Figure 9 is a top cross-sectional view of another exemplary gas curtain system. The gas curtain system of Figure 9 is similar to that of Figure 8, and callouts in Figure 9 with the same last two digits as Figure 8 refer to similar structures; readers are referred to the previous discussion of Figure 8 for a description of these structures. The gas curtain system of Figure 9, in contrast to the gas curtain system of Figure 8, features four radial gas passages 934, each spanning an approximately 90° arc and separated from adjacent radial gas passages 934 by small radial walls (not shown, but visible at the 12, 3, 6, and 9 o'clock positions). Such an arrangement can provide a substantially continuous radial gas curtain around the circumference of the turret 924, as the small radial walls provide minimal interruption to the gas flow. However, the small radial walls can provide a useful mechanism for helping to maintain a constant height for the radial gas passages 934.

[0076] Figure 10 is a top cross-sectional view of another exemplary gas curtain system. The gas curtain system of Figure 10 is similar to that of Figure 8, and callouts in Figure 10 with the same last two digits as Figure 8 refer to similar structures, and the reader is referred to the previous discussion of Figure 8 for a description of these structures. In Figure 10, there are a large number of radial gas passages 1034, e.g., 72, each of which is a radially extending hole or channel. Such individual radial gas passages are arranged such that they are arranged in a closely packed arrangement extending around the outer periphery of the turret 1024, thereby providing a generally continuous curtain of gas around the periphery of the turret 1024 via the individual holes or channels.

[0077] It will be appreciated that the radial gas curtain systems described above provide consistent and unchanging performance because the one or more radial gas passages used in such systems direct gas directly at the turret and are fixed in size, i.e., the secondary gaps of such radial gas passages cannot change over time (apart from potential thermal expansion effects). This contrasts with floating seal systems in which the seal surrounding the shaft "floats" in space and is buffered by a thin layer of gas flowing along its outer, upper, and lower surfaces. In such systems, the gaps through which gas flows can change in size due to the floating movement of the seal, potentially resulting in changes in the flow conductance of the gaps and fluctuations in the gas flow rate through such gaps. Additionally, the use of floating seals introduces an additional potential source of particulate generation, as the seal itself can potentially come into contact with other components, thereby generating particulate matter that can then be expelled from the seal area and potentially into the EFEM. Such radial gas curtain systems also offer numerous advantages over systems in which an annular plenum around the shaft is provided with pressurized gas through, for example, a small number of gas ports, e.g., two, four, or eight gas ports. In such systems, gas flowing along the shaft through smaller annular exit zones above and below the annular plenum may experience circumferential flow variations due to pressure differences within the annular plenum due to the reduced number of gas ports compared to the gas curtain systems described herein, which directs a generally continuous radial gas curtain radially inward, thereby creating a more uniform gas flow distribution.

[0078] A wafer handling robot having one or both of the above techniques may be part of a larger semiconductor processing tool that may be controlled by one or more controllers, as previously described.

[0079] The controller may be part of a system, including the examples described above, and may be operatively connected to various valves, mass flow controllers, pumps, etc. to receive information from and / or control such equipment. Such systems may include semiconductor processing equipment, including one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (such as a wafer pedestal, gas flow systems, etc.). These systems may be integrated with electronics for controlling operations before, during, and after processing of semiconductor wafers or substrates. Such electronics may be referred to as a "controller" and may control various components or subcomponents of one or more systems. The controller may be programmed to control any of the processes disclosed herein, depending on the processing requirements and / or type of system. Such processes may include the delivery of various gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, flow rate settings, fluid delivery settings, and position and operation settings.

[0080] Broadly, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors, i.e., microcontrollers, that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files) that define operational parameters for performing a particular process on or for a semiconductor wafer or for a system. The operational parameters, in some embodiments, may be part of a recipe defined by a process engineer to implement one or more processing steps in the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0081] In some embodiments, the controller may be part of, coupled to, or a combination of a computer integrated with, coupled to, or otherwise networked to the system. For example, the controller may be in the “cloud” or all or part of a fab host computer system. This allows for remote access of wafer processing. The computer may provide remote access to the system to monitor the current progress of a fabrication operation, review the history of past fabrication operations, review trends or performance criteria from multiple fabrication operations, modify parameters of a current process, configure processing steps following a current process, or initiate a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to the system over a network. Such a network may include a local network or the Internet. The remote computer may include a user interface that allows entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data. Such data identifies parameters for each processing step performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tool the controller is configured to interface with or control. Thus, as discussed above, the controller may be distributed, for example, by having one or more individual controllers networked together and working together toward a common purpose (such as the processes and controls described herein). An example of a distributed controller for such purposes would include one or more integrated circuits on the chamber in communication with one or more integrated circuits located remotely (e.g., at the platform level or as part of a remote computer) and coupled to control the process in the chamber.

[0082] Exemplary systems may include, but are not limited to, a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a tracking chamber or module, and any other semiconductor processing system that may be associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0083] As described above, depending on the process step or steps being performed by the tool, the controller may communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to and from tool locations and / or load ports in a semiconductor fabrication factory.

[0084] For purposes of this disclosure, the term "fluidically connected" is used in reference to volumes, plenums, holes, etc. that may be connected to one another to form a fluid connection, similar to the way the term "electrically connected" is used in reference to components that are connected to one another to form an electrical connection. The term "fluidically interposed," when used, may be used to refer to a component, volume, plenum, or hole that is fluidly connected to at least two other components, volumes, plenums, or holes, such that fluid flowing from one of those other components, volumes, plenums, or holes to the other or another of those components, volumes, plenums, or holes first flows through the "fluidically interposed" component before reaching the other or another of those components, volumes, plenums, or holes. For example, if a pump is fluidly interposed between a reservoir and an outlet, fluid flowing from the reservoir to the outlet first flows through the pump before reaching the outlet.

[0085] It should be understood that phrases such as "for each <item> of one or more <items>" or "for each <item> of one or more <items>," as used herein, should be understood to include both single and multiple items; i.e., the phrase "for each..." is used in the sense that it is used in programming languages ​​to refer to each item in a referenced population of items. For example, if the referenced population of items is a single item, then "each" refers only to that single item (despite the fact that dictionary definitions of "each" often define the term to refer to "one of two or more things") and does not imply that there must be at least two of those items. Similarly, the terms "set" or "subset" should not, in and of themselves, be considered as necessarily including multiple items; it will be understood that a set or subset can include only one member or multiple members (unless the context dictates otherwise).

[0086] The use of ordinal number markers, e.g., (a), (b), (c), ..., etc., in this disclosure and claims, when present, should be understood as not conveying a particular order or sequence (except to the extent such order or sequence is explicitly indicated). For example, where there are three steps labeled (i), (ii), and (iii), it should be understood that these steps may be performed in any order (or simultaneously, unless contraindicated) unless otherwise indicated. For example, if step (ii) involves handling an element formed in step (i), step (ii) can be considered to occur at some point after step (i). Similarly, if step (i) involves handling an element formed in step (ii), the opposite should be understood.

[0087] Terms such as "about," "approximately," "substantially," "nominal," and the like, when used in reference to a quantity or similar quantifiable property, unless otherwise indicated, should be understood to include values ​​within ±10% of the specified value or relationship (as well as including the actual value or relationship specified).

[0088] It is understood that all combinations of the foregoing concepts (provided that such concepts are not mutually inconsistent) are considered to be part of the inventive subject matter disclosed herein. In particular, all combinations of claimed subject matter appearing at the end of this disclosure are considered to be part of the inventive subject matter disclosed herein. It is also understood that terminology explicitly used herein, which may appear in any disclosure incorporated by reference, should be given a meaning that is most consistent with the specific concepts disclosed herein.

[0089] While the above disclosure has focused on several specific exemplary embodiments, it should be further understood that it is not limited to only the described examples, but may also apply to similar modifications and features, and such similar modifications and features are also considered to be within the scope of the present disclosure. It should be further understood that the above disclosure is intended to encompass at least the following numbered embodiments:

[0090] Embodiment 1: An apparatus comprising: one or more robot arms; a turret supporting the one or more robot arms; a linear motion mechanism supporting the turret; and a base supporting the linear motion mechanism, wherein the linear motion mechanism is configured to move the turret and the one or more robot arms along a first axis relative to the base; the base including an opening sized to allow at least a first portion of the turret to pass therethrough as the turret moves along the first axis, the opening having one or more radial gas passages extending around substantially all of the opening, the one or more radial gas passages being fixed in size; a first gap existing between an inner edge of the opening and the first portion of the turret, the first gap extending around the periphery of the first portion of the turret.

[0091] Embodiment 2: An apparatus as described in embodiment 1, wherein the first gap between the first portion of the turret and the inner edge of the opening is free of intervening structure around substantially all of the turret.

[0092] Embodiment 3: An apparatus as described in embodiment 1, wherein the one or more radial gas passages have a minimum width of less than 1 mm in a direction parallel to the first axis.

[0093] Embodiment 4: An apparatus as described in embodiment 1, wherein the one or more radial gas passages have a minimum width in a direction parallel to the first axis of less than 0.5 mm.

[0094] Embodiment 5: An apparatus as described in embodiment 1, wherein the one or more radial gas passages have a minimum width in a direction parallel to the first axis of 0.25 mm or less.

[0095] Embodiment 6: An apparatus as described in embodiment 1, wherein the one or more radial gas passages are at least partially defined by one or more first surfaces and one or more second surfaces, the one or more first surfaces facing toward the one or more second surfaces and separated from the one or more second surfaces by a second gap.

[0096] Embodiment 7: An apparatus as described in embodiment 6, wherein the one or more first surfaces and the one or more second surfaces are perpendicular to the first axis.

[0097] Embodiment 8: An apparatus as described in embodiment 6, wherein each of the one or more first surfaces defines a first cross-sectional radial profile relative to a second axis parallel to the first axis and centered on the opening, each of the one or more second surfaces defines a second cross-sectional radial profile relative to the second axis, the cross-sectional radial profiles including the one or more first cross-sectional radial profiles and the one or more second cross-sectional radial profiles each lie in corresponding planes that are coincident with and parallel to the second axis, each first cross-sectional radial profile defines an average first linear radial profile that is within ±30° of perpendicular to the second axis, and each second cross-sectional radial profile defines an average second linear radial profile that is within ±30° of perpendicular to the second axis.

[0098] Embodiment 9: The apparatus described in embodiment 1, further comprising one or more plenum volumes, one or more gas inlets, and one or more flow control components configured to regulate the flow of gas to the one or more gas inlets, wherein each gas inlet is fluidly connected to one of the one or more plenum volumes, each of the one or more plenum volumes is fluidly connected to at least one of the one or more gas inlets, each of the one or more gas inlets is fluidly interposed between one of the one or more plenum volumes and one of the one or more flow control components, and each of the one or more plenum volumes is fluidly interposed between one of the one or more gas inlets and the one or more radial gas passages.

[0099] Embodiment 10: An apparatus as described in embodiment 9, further comprising one or more gas sources, wherein the one or more flow control components are fluidly connected to the one or more gas sources and configured to provide gas from the one or more gas sources to the one or more plenum volumes at a rate of 25 to 150 standard liters per minute, and the one or more radial gas passages are sized such that the gas from the one or more plenum volumes flows from the one or more radial gas passages at a velocity of at least 5 m / s.

[0100] Embodiment 11: An apparatus as described in embodiment 1, wherein the first portion of the turret has a first nominal circular cross-section and the opening has a corresponding second nominal circular cross-section having a diameter larger than the diameter of the first nominal circular cross-section.

[0101] Embodiment 12: An apparatus as described in embodiment 1, wherein the one or more radial gas passages include only a single gas passage in the form of a radial slit extending around the entire opening without interruption in continuity.

[0102] Embodiment 13: An apparatus as described in embodiment 1, wherein the first gap is 0.5 mm to 5 mm around the turret.

[0103] Embodiment 14: An apparatus as described in embodiment 1, further comprising a bellows, wherein a first end of the bellows is fixed to an end of the turret located within the base, and a second end of the bellows opposite the first end is fixed to a surface of the base opposite the opening, the bellows expanding in response to movement of the turret away from the surface of the base, and the bellows contracting in response to movement of the turret toward the surface of the base.

[0104] Embodiment 15: An apparatus as described in embodiment 14, wherein the bellows has a first average enclosed cross-sectional area when viewed along the first axis, and one or more outermost surfaces of the first portion of the turret define a second average cross-sectional area when viewed along the first axis, and the first average enclosed cross-sectional area is substantially equal to the second average cross-sectional area.

[0105] Embodiment 16: An apparatus as described in embodiment 14, wherein the first portion of the turret is nominally circular and has a first nominal diameter, the bellows has a plurality of pleats, each pleat having an inner diameter and an outer diameter, and the average of the inner and outer diameters of the pleats is substantially equal to the first nominal diameter.

[0106] Embodiment 17: An apparatus as described in embodiment 14, wherein the base has one or more vents on the surface of the base and within the area surrounded by the bellows when viewed along the first axis.

[0107] Embodiment 18: An apparatus comprising: one or more robot arms; a turret supporting the one or more robot arms; a linear movement mechanism supporting the turret; a bellows; and a base supporting the linear movement mechanism, wherein the linear movement mechanism is configured to move the turret and the one or more robot arms along a first axis relative to the base; the base includes an opening sized to allow at least a first portion of the turret to pass through as the turret moves along the first axis; a first end of the bellows is fixed to a first end of the turret located within the base; a second end of the bellows opposite the first end of the bellows is fixed to a first surface of the base opposite the base from the opening; the bellows expands in response to movement of the turret away from the surface of the base; and the bellows contracts in response to movement of the turret toward the surface of the base.

[0108] Embodiment 19: An apparatus as described in embodiment 18, wherein there is no bellows connecting the turret to a second surface of the base opposite the first surface of the base.

[0109] Embodiment 20: An apparatus as described in embodiment 18, wherein the bellows has a first average enclosed cross-sectional area when viewed along the first axis, and one or more outermost surfaces of the first portion of the turret define a second average cross-sectional area when viewed along the first axis, and the first average enclosed cross-sectional area is substantially equal to the second average cross-sectional area.

[0110] Embodiment 21: An apparatus as described in embodiment 18, wherein the first portion of the turret is nominally circular and has a first nominal diameter, the bellows has a plurality of pleats, each pleat having an inner diameter and an outer diameter, and the average of the inner and outer diameters of the pleats is substantially equal to the first nominal diameter.

[0111] Embodiment 22: An apparatus as described in embodiment 18, wherein the base has one or more vents on the surface of the base and within the area surrounded by the bellows when viewed along the first axis.

[0112] Embodiment 23: An apparatus as described in embodiment 18, wherein the opening has one or more radial gas passages extending around substantially all of the opening, the one or more radial gas passages being fixed in size, a first gap existing between an inner edge of the opening and the first portion of the turret, and the first gap extending around the outer periphery of the first portion of the turret.

[0113] Embodiment 24: An apparatus as described in embodiment 23, wherein the first gap between the first portion of the turret and the inner edge of the opening is free of intervening structure.

[0114] Embodiment 25: An apparatus as described in embodiment 23, wherein the one or more radial gas passages have a minimum width of less than 1 mm in a direction parallel to the first axis.

[0115] Embodiment 26: An apparatus as described in embodiment 23, wherein the one or more radial gas passages have a minimum width in a direction parallel to the first axis of less than 0.5 mm.

[0116] Embodiment 27: An apparatus as described in embodiment 23, wherein the one or more radial gas passages have a minimum width of 0.25 mm or less in a direction parallel to the first axis.

[0117] Embodiment 28: An apparatus as described in embodiment 23, wherein the one or more radial gas passages are at least partially defined by one or more first surfaces and one or more second surfaces, the one or more first surfaces facing toward the one or more second surfaces and separated from the one or more second surfaces by a second gap.

[0118] Embodiment 29: An apparatus as described in embodiment 28, wherein the one or more first surfaces and the one or more second surfaces are perpendicular to the first axis.

[0119] Embodiment 30: An apparatus as described in embodiment 28, wherein each of the one or more first surfaces defines a first cross-sectional radial profile relative to a second axis parallel to the first axis and centered on the opening, each of the one or more second surfaces defines a second cross-sectional radial profile relative to the second axis, the cross-sectional radial profiles including the one or more first cross-sectional radial profiles and the one or more second cross-sectional radial profiles each lie in corresponding planes that are coincident with and parallel to the second axis, each first cross-sectional radial profile defines an average first linear radial profile that is within ±30° of perpendicular to the second axis, and each second cross-sectional radial profile defines an average second linear radial profile that is within ±30° of perpendicular to the second axis.

[0120] Embodiment 31: An apparatus as described in embodiment 23, further comprising one or more plenum volumes, one or more gas inlets, and one or more flow control components configured to regulate the flow of gas to the one or more gas inlets, wherein each gas inlet is fluidly connected to one of the one or more plenum volumes, each of the one or more plenum volumes is fluidly connected to at least one of the one or more gas inlets, each of the one or more gas inlets is fluidly interposed between one of the one or more plenum volumes and one of the one or more flow control components, and each of the one or more plenum volumes is fluidly interposed between one of the one or more gas inlets and the one or more radial gas passages.

[0121] Embodiment 32: An apparatus as described in embodiment 31, further comprising one or more gas sources, wherein the one or more flow control components are fluidly connected to the one or more gas sources and configured to provide gas from the one or more gas sources to the one or more plenum volumes at a rate of 25 to 150 standard liters per minute, and the one or more radial gas passages are sized such that the gas from the one or more plenum volumes flows from the one or more radial gas passages at a velocity of at least 5 m / s.

[0122] Embodiment 33: An apparatus as described in embodiment 23, wherein the first portion of the turret has a first nominal circular cross-section and the opening has a corresponding second nominal circular cross-section having a diameter larger than the diameter of the first nominal circular cross-section.

[0123] Embodiment 34: An apparatus as described in embodiment 23, wherein the one or more radial gas passages include only a single gas passage in the form of a radial slit extending around the entire opening without interruption in continuity.

[0124] Embodiment 35: An apparatus as described in embodiment 23, wherein the first gap is 0.5 mm to 5 mm around the turret.

Claims

1. 1. An apparatus comprising: one or more robotic arms; a turret supporting the one or more robotic arms; a linear movement mechanism supporting the turret; a base supporting the linear movement mechanism; Equipped with the linear translation mechanism is configured to translate the turret and the one or more robot arms along a first axis relative to the base; the base includes an opening sized to allow at least a first portion of the turret to pass therethrough as the turret moves along the first axis; the opening has one or more radial gas passages extending substantially all around the opening; the one or more radial gas passages are fixed in size; a first gap exists between an inner edge of the opening and the first portion of the turret; the first gap extends around the periphery of the first portion of the turret; Device.

2. 10. The apparatus of claim 1, the first gap between the first portion of the turret and the interior edge of the opening is free of intervening structure around substantially all of the turret.

3. 10. The apparatus of claim 1, The apparatus, wherein the one or more radial gas passages have a minimum width in a direction parallel to the first axis of less than 1 mm.

4. 10. The apparatus of claim 1, The apparatus, wherein the one or more radial gas passages have a minimum width in a direction parallel to the first axis of less than 0.5 mm.

5. 10. The apparatus of claim 1, The apparatus, wherein the one or more radial gas passages have a minimum width in a direction parallel to the first axis of 0.25 mm or less.

6. 10. The apparatus of claim 1, the one or more radial gas passages are at least partially defined by the one or more first surfaces and the one or more second surfaces; the one or more first surfaces face toward the one or more second surfaces and are separated from the one or more second surfaces by a second gap; Device.

7. 7. The apparatus of claim 6, The one or more first surfaces and the one or more second surfaces are perpendicular to the first axis.

8. 7. The apparatus of claim 6, each of the one or more first surfaces defines a first cross-sectional radial profile relative to a second axis parallel to the first axis and centered at the opening; each of the one or more second surfaces defines a second cross-sectional radial profile relative to the second axis; the cross-sectional radial profiles, including the one or more first cross-sectional radial profiles and the one or more second cross-sectional radial profiles, each lie in a corresponding plane that is coincident with and parallel to the second axis; each first cross-sectional radial profile defines an average first linear radial profile that is within ±30° of perpendicular to said second axis; each second cross-sectional radial profile defines an average second linear radial profile that is within ±30° of perpendicular to said second axis; Device.

9. 10. The apparatus of claim 1, one or more plenum volumes; one or more gas inlets; one or more flow control components configured to regulate the flow of gas to the one or more gas inlets; Furthermore, each gas inlet fluidly connected to one of the one or more plenum volumes; each of the one or more plenum volumes is fluidly connected to at least one of the one or more gas inlets; each of the one or more gas inlets is fluidly interposed between one of the one or more plenum volumes and one of the one or more flow control components; each of the one or more plenum volumes is fluidly interposed between one of the one or more gas inlets and the one or more radial gas passages; Device.

10. 10. The apparatus of claim 9, further comprising one or more gas sources; the one or more flow control components are fluidly connected to the one or more gas sources and configured to provide gas from the one or more gas sources to the one or more plenum volumes at a rate of 25 to 150 standard liters per minute, and the one or more radial gas passages are sized such that the gas from the one or more plenum volumes flows from the one or more radial gas passages at a velocity of at least 5 m / sec; Device.

11. 10. The apparatus of claim 1, The apparatus, wherein the first portion of the turret has a first nominal circular cross-section and the opening has a corresponding second nominal circular cross-section having a diameter greater than the diameter of the first nominal circular cross-section.

12. 10. The apparatus of claim 1, The apparatus wherein said one or more radial gas passages include only a single gas passage in the form of a radial slit extending around the entire opening without interruption in continuity.

13. 10. The apparatus of claim 1, The apparatus, wherein the first gap is between 0.5 mm and 5 mm around the turret.

14. 10. The apparatus of claim 1, Further equipped with bellows, a first end of the bellows fixed to an end of the turret located within the base; a second end of the bellows opposite the first end is secured to a surface of the base opposite the opening; the bellows expands in response to movement of the turret away from the surface of the base; the bellows contracts in response to movement of the turret toward the surface of the base. Device.

15. 15. The apparatus of claim 14, the bellows has a first average enclosed cross-sectional area when viewed along the first axis; one or more outermost surfaces of the first portion of the turret define a second average cross-sectional area when viewed along the first axis; the first average enclosed cross-sectional area is substantially equal to the second average cross-sectional area; Device.

16. 15. The apparatus of claim 14, the first portion of the turret is nominally circular and has a first nominal diameter; the bellows having a plurality of pleats; Each pleat has an inner diameter and an outer diameter; the average of the inner and outer diameters of the pleat is substantially equal to the first nominal diameter; Device.

17. 15. The apparatus of claim 14, The base has one or more vents in the surface of the base and within an area enclosed by the bellows when viewed along the first axis.

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