Multilayer structured photosensitive dry film, pattern forming method, display device, and micro-led display

Abstract

To provide a material capable of collectively performing both a process of a quantum dot-containing photoresist and a process of a resist material that absorbs blue LED light, without separating them, as well as a pattern forming method and a display device using the material.SOLUTION: A multilayer structured photosensitive dry film comprises a support film, a photosensitive resin film layer (A) formed on the support film, and a photosensitive resin film layer (B) formed on the photosensitive resin film layer (A) and containing quantum dots, wherein the photosensitive resin film layer (A) has a thickness of 1-10 μm, a transmittance of 2% or less at least in part of a wavelength range of 450-470 nm, a transmittance of 80% or more at least in part of a wavelength range of 515-535 nm, and a transmittance of 80% or more at least in part of a wavelength range of 620-640 nm, and the photosensitive resin film layer (B) has a thickness of 1-100 μm.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a multilayer photosensitive dry film, a pattern forming method, a display device, and a micro LED display. [Background technology]

[0002] Various methods have been proposed to create displays with red, green, and blue subpixels. One method involves converting light from an LED array from shorter wavelength blue light to longer wavelength red and green light through a color conversion structure. Quantum dots are used to perform this color conversion.

[0003] In recent years, LED arrays have become micro-sized, and micro LED displays using these arrays have attracted attention. One method for forming color conversion structures on LED arrays is a lithography process using photosensitive materials (Patent Document 1). However, if the transmittance of the exposure wavelength during the lithography process is ensured to form a pattern, when blue LED light is irradiated from below onto the cured film, the blue light that is not color-converted by the quantum dots passes through and emerges, resulting in a lack of clarity in the display (because the absorbance of quantum dots is generally greater than the exposure wavelength during the lithography process). To solve this problem, it is necessary to selectively form blue light-absorbing layers using a lithography process only on subpixels where a quantum dot-containing photoresist cured film that emits red light is stacked on a blue LED and on subpixels where a quantum dot-containing photoresist cured film that emits green light is stacked on a blue LED. However, from the perspective of mass production, performing the quantum dot-containing photoresist process and the blue LED light-absorbing resist material process separately is inefficient, and improvements are needed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-089347 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in consideration of the above circumstances, and aims to provide a material that allows the processes of quantum dot-containing photoresist and resist material that absorbs blue LED light to be performed in one process without separating them, and a pattern forming method and a display device that use the same. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention provides: A support film; a photosensitive resin film layer (A) formed on the support film and having a thickness of 1 to 10 μm, the photosensitive resin film layer (A) having a transmittance of 2% or less at least in a wavelength range of 450 to 470 nm, a transmittance of 80% or more at least in a wavelength range of 515 to 535 nm, and a transmittance of 80% or more at least in a wavelength range of 620 to 640 nm; a photosensitive resin coating layer (B) containing quantum dots and having a thickness of 1 to 100 μm formed on the photosensitive resin coating layer (A); The present invention provides a multi-layered photosensitive dry film comprising:

[0007] This type of photosensitive dry film is a material that allows the quantum dot-containing photoresist process and the resist material process that absorbs blue LED light to be carried out in one process without having to be separated.

[0008] The photosensitive resin film layer (A) preferably contains 0.5 to 15% by mass of a dye having a maximum absorption wavelength in the range of 490 to 430 nm.

[0009] If the dye content is within the above range, fine patterns can be formed while maintaining good absorption characteristics of blue LED light.

[0010] It is also preferable that the photosensitive resin film layer (B) contains 15 to 45% by mass of the quantum dots.

[0011] If the content of quantum dot particles is within the above range, fine patterns can be formed while maintaining good light-emitting properties.

[0012] Furthermore, it is preferable that the quantum dots have a core-shell structure including a core and a shell covering the core, the core containing one or more compounds consisting of a combination of two or more of In, P, Zn, Ga, Cd, Se, S, Te, Pb, Ag, Hg, N, As, and O, and the shell containing one or more compounds consisting of a combination of two or more of In, P, Zn, Ga, Cd, Se, S, Te, Pb, Hg, N, As, O, Mn, and Sr.

[0013] In the present invention, such quantum dots can be suitably used.

[0014] It is also preferable that one or both of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) contain, as a resin component, an acrylic resin having a (meth)acryloyl group on the side chain.

[0015] This makes it possible to form a fine pattern with excellent perpendicularity.

[0016] It is also preferable that one or both of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) contain a resin having a silicone skeleton and a silphenylene skeleton as a resin component.

[0017] This makes it possible to form a fine pattern with excellent perpendicularity.

[0018] In addition, in the present invention, A pattern formation method, comprising: (i) a step of attaching the photosensitive resin coating layer (B) side of the multilayer structure photosensitive dry film onto a substrate to form a photosensitive resin coating on the substrate; (ii) exposing the photosensitive resin film to light; and (iii) A step of developing the exposed photosensitive resin film with a developer to dissolve and remove the unexposed areas to form a pattern. The present invention provides a pattern formation method comprising the steps of:

[0019] Using the photosensitive dry film of the present invention, it is possible to form a pattern of the desired shape by performing the quantum dot-containing photoresist process and the process of the resist material that absorbs blue LED light in one process without separating them.

[0020] The present invention also provides a display device having a pattern consisting of a cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the above-mentioned multilayer structure photosensitive dry film.

[0021] The multilayered photosensitive dry film of the present invention can be particularly suitably used for such applications.

[0022] The present invention also provides a display device that has a pattern consisting of the cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the above-mentioned multilayer structure photosensitive dry film above a blue LED, and extracts light color-converted by quantum dots from each subpixel.

[0023] The multilayered photosensitive dry film of the present invention can be particularly suitably used for such applications.

[0024] In the present invention, a pattern consisting of the cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure type photosensitive dry film is provided above a blue LED, and the size of the pattern consisting of the cured film is 0.01 mm 2The present invention provides a micro LED display that extracts light color-converted by quantum dots from each sub-pixel.

[0025] The multilayered photosensitive dry film of the present invention can be particularly suitably used for such applications. [Effects of the Invention]

[0026] The multilayered photosensitive dry film of the present invention can be processed in one step, without separating the quantum dot-containing photoresist process and the resist material process that absorbs blue LED light. Furthermore, the pattern formation method of the present invention makes it possible to easily form fine patterns with excellent verticality. Furthermore, the resulting cured film can effectively convert the hue of blue LED light, making it suitable for use in display devices such as micro LED displays. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a schematic diagram showing an example of a multilayer structure photosensitive dry film of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0028] As mentioned above, there was a need for a material that could be processed in one step, without separating the quantum dot-containing photoresist process and the process for the resist material that absorbs blue LED light, as well as the development of a pattern formation method and a display device that use this material.

[0029] After extensive research, the inventors discovered that combining a quantum dot-containing photoresist and a resist material that absorbs blue LED light into a single dry film allows for simultaneous processing without the need for separate processes, leading to the completion of the present invention. This eliminates the need for repeated processing, and is expected to improve productivity.

[0030] That is, the present invention provides a multilayer photosensitive dry film comprising: a support film; a photosensitive resin coating layer (A) formed on the support film and having a thickness of 1 to 10 μm, the photosensitive resin coating layer (A) having a transmittance of 2% or less at least in a wavelength range of 450 to 470 nm, a transmittance of 80% or more at least in a wavelength range of 515 to 535 nm, and a transmittance of 80% or more at least in a wavelength range of 620 to 640 nm; and a photosensitive resin coating layer (B) having a thickness of 1 to 100 μm and containing quantum dots, formed on the photosensitive resin coating layer (A).

[0031] The present invention will be described in detail below, but the present invention is not limited thereto.

[0032] [Photosensitive resin film layer (A)] The photosensitive resin film layer (A) used in the present invention is not particularly limited as long as it is a photosensitive resin film layer with a thickness of 1 to 10 μm, a transmittance of 2% or less at least in a wavelength range of 450 to 470 nm, a transmittance of 80% or more at least in a wavelength range of 515 to 535 nm, and a transmittance of 80% or more at least in a wavelength range of 620 to 640 nm. By achieving such transmittance and film thickness, blue LED light can be selectively blocked and the layer has excellent process suitability.

[0033] The photosensitive resin film layer (A) can be, for example, a photosensitive resin film layer having a thickness of 1 to 10 μm and a transmittance of 2% or less at wavelengths of 450 to 470 nm, 80% or more at wavelengths of 515 to 535 nm, and 80% or more at wavelengths of 620 to 640 nm.

[0034] In the present invention, the photosensitive resin coating layer (A) preferably contains 0.5 to 15 mass %, more preferably 1 to 10 mass %, of a dye having an absorption maximum wavelength in the range of 490 to 430 nm in the (A) layer. If the dye content is within the above range, fine patterns can be formed while maintaining good absorption characteristics of blue LED light.

[0035] The maximum absorption wavelength is determined as follows. First, in UV-Vis (ultraviolet-visible) absorption measurement, a sample is irradiated with ultraviolet or visible light, and the amount of light absorbed by the sample (absorbance) is measured while the irradiated wavelength is continuously scanned. The measurement results are obtained as a graph (absorption spectrum) with wavelength on the horizontal axis and absorbance on the vertical axis, and the wavelength at the maximum value of the spectrum is defined as the maximum absorption wavelength.

[0036] Such dyes may be commercially available products, such as FDB-002 (maximum absorption wavelength: 431 nm), FDB-003 (maximum absorption wavelength: 438 nm), FDB-004 (maximum absorption wavelength: 445 nm), FDB-005 (maximum absorption wavelength: 452 nm), and FDB-006 (maximum absorption wavelength: 473 nm), all manufactured by Yamada Chemical Co., Ltd.; FS Yellow 1017 (maximum absorption wavelength: 443 nm), all manufactured by Arimoto Chemical Industry Co., Ltd.; and Dye 3 (maximum absorption wavelength: 464 nm) and Dye 4 (maximum absorption wavelength: 479 nm), all manufactured by Hayashibara Corporation.

[0037] In the present invention, the photosensitive resin film layer (A) preferably contains an acrylic resin having a (meth)acryloyl group in the side chain or a resin having a silicone skeleton and a silphenylene skeleton, which allows the formation of a fine pattern with excellent verticality.

[0038] Such resins may be used alone or in combination of two or more, and are preferably contained in the layer (A) in an amount of 40 to 99% by mass, more preferably 50 to 98% by mass.

[0039] The acrylic resin having a (meth)acryloyl group in the side chain preferably has a Mw of 5,000 to 500,000, and commercially available products can be used, such as "RA-4101" (Mw: 30,000, acid value: 90 mg KOH / g, double bond equivalent: 350 g / mol) manufactured by Negami Chemical Industrial Co., Ltd. and "8KQ-2001" (Mw: 20,000, acid value: 130 mg KOH / g, double bond equivalent: 540 g / mol) manufactured by Taisei Fine Chemical Co., Ltd.

[0040] In the present specification, the weight-average molecular weight Mw is a value determined as the weight-average molecular weight (weight-average degree of polymerization) in terms of polystyrene by GPC (gel permeation chromatography) analysis using toluene as the developing solvent.

[0041] As the resin having a silicone skeleton and a silphenylene skeleton, those with Mw = 3000 to 500000 are preferable, and examples thereof include resins containing repeating units represented by the following formulas (A1) to (A6).

[0042] [Chemical formula] [In the formula, R 1 ~R 4 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms which may contain a heteroatom. m is each independently an integer of 1 to 600. When m is an integer of 2 or more, each R 3 may be the same as or different from each other, and each R 4 may be the same as or different from each other. a, b, c, d, e and f are numbers satisfying 0 ≦ a ≦ 1, 0 ≦ b ≦ 1, 0 ≦ c ≦ 1, 0 ≦ d ≦ 1, 0 ≦ e ≦ 1, 0 ≦ f ≦ 1, 0 < c + d + e + f ≦ 1, and a + b + c + d + e + f = 1. X 1 is a divalent group represented by the following formula (X1). X 2 is a divalent group represented by the following formula (X2). X 3 is a divalent group represented by the following formula (X3).

[0043] [Chemical formula] (In the formula, R 11 ~R 14 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms which may contain a heteroatom. p is an integer of 1 to 600. When p is an integer of 2 or more, each R 13 may be the same as or different from each other, and each R 14 may be the same as or different from each other. R 15 and R16 are each independently a hydrogen atom or a methyl group. Each x is independently an integer of 0 to 7.

[0044] [ka] (In the formula, Y 1 R is a single bond, a methylene group, a propane-2,2-diyl group, a 1,1,1,3,3,3-hexafluoropropane-2,2-diyl group, or a fluorene-9,9-diyl group. 21 and R 22 are each independently an alkyl group or an alkoxy group having 1 to 4 carbon atoms, and g and h are each independently 0, 1, or 2. When g is 2, each R 21 may be the same or different, and when h is 2, each R 22 R may be the same or different. 23 and R 24 are each independently a hydrogen atom or a methyl group. Each y is independently an integer of 0 to 7.

[0045] [ka] (In the formula, R 31 and R 32 are each independently a hydrogen atom or a methyl group. Each z is independently an integer of 0 to 7. R 33 is a monovalent hydrocarbon group having 1 to 8 carbon atoms which may contain an ester bond or an ether bond, or a monovalent group represented by the following formula (X3-1): [ka] (In the formula, R 34 is a divalent hydrocarbon group having 1 to 8 carbon atoms which may contain an ester bond or an ether bond.)

[0046] In the present invention, the photosensitive resin film layer (A) preferably contains a photopolymerization initiator for photocuring. It is particularly preferable that it contains a photoradical generator or a photoacid generator. The photopolymerization initiator is preferably present in the photosensitive resin film layer (A) in an amount of 0.1 to 10% by mass, more preferably 0.5 to 7% by mass. A good pattern can be formed if the content of the photopolymerization initiator is within the above range.

[0047] The photosensitive resin film layer (A) can be produced, for example, by the following method: First, the components of the photosensitive resin film layer (A) as described above are dissolved and dispersed in a solvent to prepare a photosensitive resin composition (A).

[0048] In this case, the solvent is preferably an organic solvent, for example, ketones such as cyclohexanone, cyclopentanone, methyl-2-n-pentyl ketone, etc.; alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, etc.; ethers such as propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether, etc.; esters such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, propylene glycol mono-tert-butyl ether acetate, γ-butyrolactone, etc. These may be used alone or in combination of two or more.

[0049] The content of the solvent is preferably 25 to 85 mass %, more preferably 35 to 75 mass %, based on the total amount, from the viewpoint of compatibility and viscosity of the components of the photosensitive resin coating layer (A) as described above.

[0050] The photosensitive resin composition (A) is applied to a support film and dried to form a photosensitive resin film layer (A). A film coater typically used for producing pressure-sensitive adhesive products can be used as the production device. Examples of the film coater include a comma coater, a comma reverse coater, a multi-coater, a die coater, a lip coater, a lip reverse coater, a direct gravure coater, an offset gravure coater, a three-bottom reverse coater, and a four-bottom reverse coater.

[0051] The support film is unwound from the unwinding shaft of the film coater and passed through the coater head of the film coater. The dissolved and dispersed solution (photosensitive resin composition (A)) is applied to the support film to a predetermined thickness. The film is then passed through a hot air circulating oven at a predetermined temperature and time, and dried on the support film to form a photosensitive resin film, thereby producing a photosensitive resin film layer (A). Optionally, the photosensitive resin film layer, together with a protective film unwound from another unwinding shaft of the film coater, is passed through a laminating roll at a predetermined pressure to bond the photosensitive resin film on the support film to the protective film. The protective film can then be wound up on the take-up shaft of the film coater to produce a photosensitive resin film layer (A) with a protective film. In this case, the temperature is preferably 50 to 120°C, the time is preferably 1 to 100 minutes, and the pressure is preferably 0.01 to 5 MPa.

[0052] The support film used in the photosensitive resin coating layer (A) may be a single-layer film made of a single film or a multilayer film made of multiple laminated films. Examples of materials for the film include synthetic resin films such as polyethylene, polypropylene, polycarbonate, and polyethylene terephthalate. Among these, polyethylene terephthalate is preferred, as it has moderate flexibility, mechanical strength, and heat resistance. These films may be subjected to various treatments such as corona treatment or release agent coating. Commercially available products may be used, such as Cerapeel WZ (RX) and Cerapeel BX8 (R) (manufactured by Toray Advanced Film Co., Ltd.), E7302 and E7304 (manufactured by Toyobo Co., Ltd.), Purex G31 and Purex G71T1 (manufactured by Teijin DuPont Films Co., Ltd.), PET38x1-A3, PET38x1-V8, and PET38x1-X08 (manufactured by Nippa Corporation).

[0053] The protective film may be the same as the support film described above, but polyethylene terephthalate and polyethylene, which have appropriate flexibility, are preferred. Commercially available products can be used for these, and examples of polyethylene terephthalate include those already exemplified, and examples of polyethylene include GF-8 (manufactured by Tamapoly Corporation) and PE Film 0 Type (manufactured by Nippa Corporation).

[0054] The thickness of each of the support film and the protective film is preferably 10 to 100 μm, more preferably 25 to 50 μm, from the viewpoints of stability in the production of the photosensitive dry film and prevention of curling around the core.

[0055] [Photosensitive resin film layer (B)] The photosensitive resin film layer (B) used in the present invention is not particularly limited as long as it is a photosensitive resin film layer containing quantum dots and having a thickness of 1 to 100 μm. By setting the film thickness to such a thickness, excellent process suitability is achieved.

[0056] In the present invention, the photosensitive resin coating layer (B) preferably contains 15 to 45 mass % of quantum dots in the layer (B), more preferably 20 to 40 mass %. If the content of quantum dot particles is within the above range, fine patterns can be formed while maintaining good light-emitting properties.

[0057] The quantum dots in the photosensitive resin coating layer (B) of the present invention preferably have a core-shell structure comprising a core and a shell covering the core. The core preferably contains one or more compounds consisting of a combination of two or more of In, P, Zn, Ga, Cd, Se, S, Te, Pb, Ag, Hg, N, As, and O. The shell preferably contains one or more compounds consisting of a combination of two or more of In, P, Zn, Ga, Cd, Se, S, Te, Pb, Hg, N, As, O, Mn, and Sr. Examples of such combinations include fine particles having a core of InP or AgGaSe and a shell of ZnS, ZnSe, or ZnSeS. Preferred core-shell combinations include core / shell = InP / ZnS, InP / ZnSe, InP / ZnSeS, and AgGaSe / ZnS.

[0058] It is preferable to use quantum dots with a particle size of 1 to 10 nm. The particle size of the quantum dots can be determined by dynamic light scattering using, for example, an ELSZ-2000ZS manufactured by Otsuka Electronics.

[0059] Such quantum dots can be commercially available, and examples thereof include S-BE030 (InP (core) / ZnS, ZnSe (shell): maximum fluorescence wavelength 635 nm) and S-BE029 (InP (core) / ZnS, ZnSe (shell): maximum fluorescence wavelength 535 nm) manufactured by Shoei Chemical Co., Ltd., 900514-1ML (CdSe (core) / CdS (shell): maximum fluorescence wavelength 620 nm) manufactured by Aldrich, and 900511-1ML (CdSe (core) / CdS (shell): maximum fluorescence wavelength 530 nm) manufactured by Aldrich.

[0060] In the present invention, the photosensitive resin film layer (B) preferably contains an acrylic resin having a (meth)acryloyl group in its side chain or a resin having a silicone skeleton and a silphenylene skeleton. Thereby, a pattern that is fine and excellent in perpendicularity can be formed.

[0061] Such a resin may be used alone or in combination of two or more. Further, it is preferably in the range of 10 to 85% by mass in the (B) layer. More preferably, it is 20 to 80% by mass.

[0062] As the acrylic resin having a (meth)acryloyl group in its side chain, those having Mw = 5000 to 500000 are preferable, and commercially available products can be used. For example, the product name "RA-4101" (Mw: 30,000, acid value: 90 mgKOH / g, double bond equivalent: 350 g / mol) manufactured by Negami Kogyo Co., Ltd., the product name "8KQ-2001" (Mw: 20,000, acid value: 130 mgKOH / g, double bond equivalent: 540 g / mol) manufactured by Daisheng Fine Chemical Co., Ltd., etc. can be mentioned.

[0063] As the resin having a silicone skeleton and a silphenylene skeleton, those having Mw = 3000 to 500000 are preferable, and for example, resins containing repeating units represented by the following formulas (A1) to (A6) can be mentioned.

[0064]

Chemical formula

[0065] [ka] (In the formula, R 11 ~R 14 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms which may contain a heteroatom. p is an integer of 1 to 600. When p is an integer of 2 or greater, each R 13 may be the same or different, and each R 14 R may be the same or different. 15 and R 16 are each independently a hydrogen atom or a methyl group. Each x is independently an integer of 0 to 7.

[0066] [ka] (In the formula, Y 1 R is a single bond, a methylene group, a propane-2,2-diyl group, a 1,1,1,3,3,3-hexafluoropropane-2,2-diyl group, or a fluorene-9,9-diyl group. 21 and R 22 are each independently an alkyl group or an alkoxy group having 1 to 4 carbon atoms, and g and h are each independently 0, 1, or 2. When g is 2, each R 21 may be the same or different, and when h is 2, each R 22 R may be the same or different. 23 and R 24 are each independently a hydrogen atom or a methyl group. Each y is independently an integer of 0 to 7.

[0067] [ka] (In the formula, R 31 and R32 are each independently a hydrogen atom or a methyl group. Each z is independently an integer of 0 to 7. R 33 is a monovalent hydrocarbon group having 1 to 8 carbon atoms which may contain an ester bond or an ether bond, or a monovalent group represented by the following formula (X3-1): [ka] (In the formula, R 34 is a divalent hydrocarbon group having 1 to 8 carbon atoms which may contain an ester bond or an ether bond.)

[0068] In the present invention, the photosensitive resin film layer (B) preferably contains a photopolymerization initiator for photocuring. In particular, it preferably contains a photoradical generator or a photoacid generator. The photopolymerization initiator is preferably contained in the photosensitive resin film layer (B) in an amount of 0.1 to 10% by mass, more preferably 0.5 to 7% by mass. If the content of the photopolymerization initiator is within the above range, good pattern formation can be achieved.

[0069] The photosensitive resin film layer (B) can be produced, for example, by the following method: First, the components of the photosensitive resin film layer (B) described above are dissolved and dispersed in a solvent to prepare a photosensitive resin composition (B).

[0070] In this case, the solvent is preferably an organic solvent, for example, ketones such as cyclohexanone, cyclopentanone, methyl-2-n-pentyl ketone, etc.; alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, etc.; ethers such as propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether, etc.; esters such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, propylene glycol mono-tert-butyl ether acetate, γ-butyrolactone, etc. These may be used alone or in combination of two or more.

[0071] The content of the solvent is preferably 25 to 85 mass %, more preferably 35 to 75 mass %, based on the total amount, from the viewpoint of compatibility and viscosity of the components of the photosensitive resin coating layer (B) as described above.

[0072] The photosensitive resin composition (B) is applied to a support film and dried to form a photosensitive resin film layer (B). A film coater typically used for producing pressure-sensitive adhesive products can be used as the production device. Examples of the film coater include a comma coater, a comma reverse coater, a multi-coater, a die coater, a lip coater, a lip reverse coater, a direct gravure coater, an offset gravure coater, a three-bottom reverse coater, and a four-bottom reverse coater.

[0073] The support film is unwound from the unwinding shaft of the film coater and passed through the coater head of the film coater. The dissolved and dispersed solution (photosensitive resin film layer (B)) is applied to the support film to a predetermined thickness. The film is then passed through a hot air circulating oven at a predetermined temperature and time, and dried on the support film to form a photosensitive resin film, thereby producing the photosensitive resin film layer (B). Optionally, the photosensitive resin film layer is passed through a laminating roll at a predetermined pressure together with a protective film unwound from another unwinding shaft of the film coater to bond the photosensitive resin film on the support film to the protective film. The protective film-attached photosensitive resin film layer (B) can then be produced by winding the film onto the winding shaft of the film coater. In this case, the temperature is preferably 50 to 120°C, the time is preferably 1 to 100 minutes, and the pressure is preferably 0.01 to 5 MPa.

[0074] The support film used in the photosensitive resin coating layer (B) may be a single-layer film consisting of a single film, or a multilayer film consisting of multiple laminated films. Examples of materials for the film include synthetic resin films such as polyethylene, polypropylene, polycarbonate, and polyethylene terephthalate. Among these, polyethylene terephthalate is preferred, as it has moderate flexibility, mechanical strength, and heat resistance. These films may also be subjected to various treatments such as corona treatment or release agent coating. Commercially available products may be used, such as Cerapeel WZ (RX) and Cerapeel BX8 (R) (manufactured by Toray Advanced Film Co., Ltd.), E7302 and E7304 (manufactured by Toyobo Co., Ltd.), Purex G31 and Purex G71T1 (manufactured by Teijin DuPont Films Co., Ltd.), PET38x1-A3, PET38x1-V8, and PET38x1-X08 (manufactured by Nippa Corporation).

[0075] The protective film may be the same as the support film described above, but polyethylene terephthalate and polyethylene, which have appropriate flexibility, are preferred. Commercially available products can be used for these, and examples of polyethylene terephthalate include those already exemplified, and examples of polyethylene include GF-8 (manufactured by Tamapoly Corporation) and PE Film 0 Type (manufactured by Nippa Corporation).

[0076] The thickness of each of the support film and the protective film is preferably 10 to 100 μm, more preferably 25 to 50 μm, from the viewpoints of stability in the production of the photosensitive dry film and prevention of curling around the core.

[0077] [Multi-layered photosensitive dry film] As shown in FIG. 1, the multilayer photosensitive dry film 10 of the present invention comprises a support film 1, a photosensitive resin coating layer (A) 2 having a thickness of 1 to 10 μm and formed on the support film 1, the photosensitive resin coating layer (A) 2 having a transmittance of 2% or less at least in a wavelength range of 450 to 470 nm, a transmittance of 80% or more at least in a wavelength range of 515 to 535 nm, and a transmittance of 80% or more at least in a wavelength range of 620 to 640 nm, and a photosensitive resin coating layer (B) 3 having a thickness of 1 to 100 μm and containing quantum dots and formed on the photosensitive resin coating layer (A) 2.

[0078] The multilayer structure photosensitive dry film (support film and photosensitive resin coating layers (A) and (B)) is solid, and the photosensitive resin coating layers (A) and (B) do not contain a solvent. Therefore, there is no risk of bubbles caused by the evaporation of the solvent remaining inside the photosensitive resin coating layers (A) and (B) or between the photosensitive resin coating layers (A) and (B) and the substrate having irregularities.

[0079] Furthermore, at high temperatures, the viscosity and fluidity of the photosensitive resin coating layers (A) and (B) are closely related, and the photosensitive resin coating layers (A) and (B) can exhibit appropriate fluidity within an appropriate viscosity range, allowing them to penetrate deep into narrow gaps and strengthen adhesion to the substrate by softening the resin. Therefore, from the viewpoint of the fluidity of the photosensitive resin coating layers (A) and (B), the viscosity of the photosensitive resin coating at high temperatures is preferably 10 to 5,000 Pa·s, more preferably 30 to 2,000 Pa·s, at 80°C. In the present invention, the viscosity is measured using a rotational viscometer.

[0080] When the multilayer photosensitive dry film of the present invention is adhered to an uneven substrate, the photosensitive resin coating layers (A) and (B) conform to the unevenness to achieve high flatness. In particular, the photosensitive resin coating layers (A) and (B) of the present invention have softening properties, which allows for even higher flatness. Furthermore, when the photosensitive resin coating is adhered to the substrate in a vacuum environment, the occurrence of gaps between them can be more effectively prevented.

[0081] A method for producing a multilayer photosensitive dry film includes, for example, peeling off the protective films from a resist film material having a photosensitive resin coating layer (A) and a protective film formed on a support film prepared as described above, and a resist film material having a photosensitive resin coating layer (B) and a protective film formed on a support film prepared as described above, and laminating the two materials using a roll-to-roll film laminator. The roll temperature is preferably 10 to 120°C, and the laminating roll pressure is preferably 0 to 5.0 MPa.

[0082] Another method for producing a multilayer photosensitive dry film is, for example, to apply the photosensitive resin composition (A) to a predetermined thickness on the support film when the support film is unwound from the unwinding shaft of a film coater and passed through the coater head of the film coater, pass the film through a hot air circulating oven at a predetermined temperature for a predetermined time, dry the film on the support film, and then apply the photosensitive resin composition (B) to a predetermined thickness, pass the film through a hot air circulating oven at a predetermined temperature for a predetermined time, and dry the film on the support film. The laminate, together with a protective film unwound from another unwinding shaft of the film coater, is passed through a laminating roll at a predetermined pressure to bond the resin layer on the support film, and then wound up on the winding shaft of the film coater. The order of application may be reversed.

[0083] [Pattern formation method using a multilayered photosensitive dry film] The pattern forming method using the multilayer structure photosensitive dry film of the present invention comprises the steps of: (i) a step of attaching the photosensitive resin coating layer (B) side of the multilayer structure photosensitive dry film to a substrate to form a photosensitive resin coating on the substrate; (ii) exposing the photosensitive resin film to light; and (iii) A step of developing the exposed photosensitive resin film with a developer to dissolve and remove the unexposed areas to form a pattern. The present invention is characterized by comprising:

[0084] First, (i) using a multilayer photosensitive dry film, the photosensitive resin film (B) side is attached to a substrate to form photosensitive resin films (A) and (B) on the substrate. If the multilayer photosensitive dry film has a protective film, the protective film is peeled off from the multilayer photosensitive dry film, and then the photosensitive resin film (B) side of the multilayer photosensitive dry film is attached to the substrate. The attachment can be performed, for example, using a film attachment device.

[0085] The film laminating device is preferably a vacuum laminator. For example, the protective film of the multilayer photosensitive dry film is peeled off, and the exposed photosensitive resin film (B) is adhered to the substrate on a table at a predetermined temperature using a laminating roll at a predetermined pressure in a vacuum chamber at a predetermined vacuum level. The temperature is preferably 60 to 120°C, the pressure is preferably 0 to 5.0 MPa, and the vacuum level is preferably 50 to 500 Pa.

[0086] In order to efficiently carry out the photocuring reaction of the photosensitive resin films (A) and (B) and to improve the adhesion between the photosensitive resin film (B) and the substrate, pre-baking may be carried out as necessary. Pre-baking can be carried out, for example, at 60 to 120°C for about 1 minute to 1 hour.

[0087] The photosensitive resin films (A) and (B) attached to the substrate can be patterned by (ii) exposing the photosensitive resin films to light, and (iii) developing the exposed photosensitive resin films with a developer to dissolve and remove the unexposed areas to form a pattern. Note that the support film of the multilayer structure photosensitive dry film is peeled off before the development step depending on the process.

[0088] In step (ii), the photosensitive resin films (A) and (B) are exposed to light. The exposure is preferably carried out with light having a wavelength of 10 to 600 nm, more preferably with light having a wavelength of 190 to 500 nm. Examples of light with such wavelengths include light of various wavelengths generated by a radiation generator, such as ultraviolet light such as g-line, h-line, and i-line, and far ultraviolet light (248 nm, 193 nm). Of these, light with a wavelength of 248 to 436 nm is particularly preferred. The exposure dose is 10 to 10,000 mJ / cm. 2 is preferred.

[0089] The exposure may be performed through a photomask. The photomask may be, for example, a photomask having a desired pattern cut out therein. The material of the photomask is not particularly limited, but is preferably one that blocks light of the wavelengths described above. For example, a photomask having a chromium light-shielding film is preferably used, but is not limited thereto.

[0090] In step (iii), after exposure, the film is developed with a developer to form a pattern. Preferred examples of the developer include organic solvents such as alcohols such as IPA, ketones such as cyclohexanone, and glycols such as propylene glycol monomethyl ether. Examples of development methods include conventional methods, such as a dip method in which a patterned substrate is immersed in a developer, a paddle method in which the developer is dispensed with a paddle, and a spray method in which the developer is sprayed with a spray. By developing in this manner, the unexposed areas are dissolved and removed, forming a pattern. Thereafter, washing, rinsing, drying, etc. are performed as necessary to obtain a cured film having the desired pattern.

[0091] The pattern formation method using the multilayered photosensitive dry film of the present invention allows for easy formation of fine patterns. For example, the multilayered photosensitive dry film of the present invention can be applied to a substrate to cover numerous blue micro LEDs. Then, fine patterns can be formed by forming a cured film containing red or green quantum dots on the blue micro LEDs in individual areas. This allows for red and green light to be emitted. Furthermore, the cured film formed on top of the blue micro LEDs, which has a predetermined light transmittance, can absorb any blue LED light that has been transmitted. This allows for efficient fabrication of full-color display devices without separate processes for forming photosensitive resin film (A) and photosensitive resin film (B). This method is also compatible with mini LEDs.

[0092] [Display device] The present invention also provides a display device having a pattern formed from a cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure photosensitive dry film. The pattern formed from the cured film can be obtained by the pattern formation method described above.

[0093] Furthermore, the display device of the present invention can be configured to include a pattern consisting of the cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure photosensitive dry film above a blue LED, and to extract light color-converted by quantum dots from each subpixel.

[0094] [Micro LED display] In the present invention, a pattern consisting of the cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure type photosensitive dry film is provided above a blue LED, and the size of the pattern consisting of the cured film is 0.01 mm 2 The present invention provides a micro LED display that extracts light color-converted by quantum dots from each sub-pixel. [Example]

[0095] EXAMPLES The present invention will be specifically explained below using examples and comparative examples, but the present invention is not limited to these.

[0096] [1] Preparation of photosensitive resin compositions (A) and (B) [Preparation examples A1 to A8, A′1 to A′3, BR1 to BR8, BG1 to BG8] The components were blended according to the blending amounts shown in Tables 1 to 7, then stirred and mixed at room temperature and microfiltered through a 1.0 μm glass filter to obtain photosensitive resin compositions (PGMEA solutions) of Preparation Examples A1 to A8, A′1 to A′3, BR1 to BR8, and BG1 to BG8. In the tables, the total solid content (components other than the solvent) is shown to be 100.

[0097] [Table 1]

[0098] [Table 2]

[0099] [Table 3]

[0100] [Table 4]

[0101] [Table 5]

[0102] [Table 6]

[0103] [Table 7]

[0104] In Tables 1 to 7, A-1 is the product name "RA-4101" (Mw: 30,000, acid value: 90 mg KOH / g, double bond equivalent: 350 g / mol) manufactured by Negami Chemical Industries, Ltd., and A-2 is the product name "8KQ-2001" (Mw: 20,000, acid value: 130 mg KOH / g, double bond equivalent: 540 g / mol) manufactured by Taisei Fine Chemical Co., Ltd.

[0105] In Tables 1 to 7, B-1 is FDB-002 (maximum absorption wavelength: 431 nm) manufactured by Yamada Chemical Industry Co., Ltd., B-2 is FS Yellow 1017 (maximum absorption wavelength: 443 nm) manufactured by Arimoto Chemical Industry Co., Ltd., B-3 is FDB-005 (maximum absorption wavelength: 452 nm) manufactured by Yamada Chemical Industry Co., Ltd., B-4 is FDB-006 (maximum absorption wavelength: 473 nm) manufactured by Yamada Chemical Industry Co., Ltd., B'-1 is FDB-009 (maximum absorption wavelength: 402 nm) manufactured by Yamada Chemical Industry Co., Ltd., B'-2 is FDG-001 (maximum absorption wavelength: 503 nm) manufactured by Yamada Chemical Industry Co., Ltd., and B'-3 is FDR-001 (maximum absorption wavelength: 604 nm) manufactured by Yamada Chemical Industry Co., Ltd.

[0106] In Tables 1 to 7, BR-1 is S-BE030 (InP (core) / ZnS, ZnSe (shell): maximum fluorescence wavelength 635 nm) manufactured by Shoei Chemical Co., Ltd., BG-1 is S-BE029 (InP (core) / ZnS, ZnSe (shell): maximum fluorescence wavelength 535 nm) manufactured by Aldrich Corporation, BR-2 is 900514-1ML (CdSe (core) / CdS (shell): maximum fluorescence wavelength 620 nm) manufactured by Aldrich Corporation, and BG-2 is 900511-1ML (CdSe (core) / CdS (shell): maximum fluorescence wavelength 530 nm) manufactured by Aldrich Corporation. The particle diameters of the quantum dots are 5 to 10 nm for red and 3 to 5 nm for green.

[0107] In Tables 1 to 7, C-1 is the trade name "Irgacure OXE01" (oxime ester type) manufactured by BASF.

[0108] [ka]

[0109] In Tables 1 to 7, D-1 is the product name "KP341" (polyether type silicone surfactant) manufactured by Shin-Etsu Chemical Co., Ltd.

[0110] In Tables 1 to 7, A-3 was synthesized as follows. 265.0 g (1.00 mol) of the following compound (S-5) was added to a 3 L flask equipped with a stirrer, thermometer, nitrogen purge device, and reflux condenser, followed by the addition of 2,000 g of toluene and heating to 70°C. 1.0 g of a toluene solution of chloroplatinic acid (platinum concentration 0.5% by mass) was then added, followed by the addition of 164.9 g (0.85 mol) of the following compound (S-1) and the following compound (S-2) (y 1 453.0 g (0.15 mol) of methyl methyl silyl ether (H2O3) (manufactured by Shin-Etsu Chemical Co., Ltd.) was added dropwise over 1 hour (total hydrosilyl groups / total alkenyl groups = 1 / 1 (molar ratio)). After the addition was completed, the mixture was heated to 100°C and aged for 6 hours, after which toluene was distilled off under reduced pressure from the reaction solution to obtain Resin A-3 with an Mw of 65,000.

[0111] [ka]

[0112] In Tables 1 to 7, the photoacid generator F-1 used was "CPI-210S" manufactured by San-Apro Co., Ltd.

[0113] [ka]

[0114] In Tables 1 to 7, the epoxy crosslinking agent G-1 is as follows: [ka]

[0115] [2] Preparation of photosensitive resin film layer (A) and transmittance at each wavelength Using a die coater as the film coater and a polyethylene terephthalate film (38 μm thick) as the support film, each of the photosensitive resin compositions (A) (A1 to A8, A′1 to A′3) listed in Tables 1 to 7 was applied onto the support film. The film was then dried by passing it through a hot air circulating oven (4 m long) set at 80°C for 5 minutes, forming a photosensitive resin film on the support film to a thickness of 3 μm, thereby obtaining a photosensitive resin film layer (A). A polyethylene film (50 μm thick) was laminated onto the photosensitive resin film as a protective film using a laminating roll at a pressure of 1 MPa to produce a photosensitive dry film with a protective film. The protective film was peeled off, and the photosensitive dry film with the protective film was then attached to a glass wafer using a vacuum laminator TEAM-100RF (manufactured by Takatori Corporation) with the vacuum level set to 80 Pa in the vacuum chamber. The temperature condition was 100°C. After returning to normal pressure, the substrate was removed from the vacuum laminator and the support film was peeled off. Next, the transmittance of the cured film was measured at 450 to 470 nm, 515 to 535 nm, and 620 to 640 nm using a spectrophotometer U-3900H (manufactured by Hitachi High-Tech Science Corporation). If the transmittance at at least a portion of the wavelength range of 450 to 470 nm was 2% or less, if the transmittance at at least a portion of the wavelength range of 515 to 535 nm was 80% or more, and if the transmittance at at least a portion of the wavelength range of 620 to 640 nm was 80% or more, then the rating was ◯; if the rating was not 80%, then the rating was ×. The results are shown in Table 8.

[0116] In the transmittance measurement, A1 to A8 had a transmittance of 2% or less in the range of 450 to 470 nm, a transmittance of 80% or more in the range of 515 to 535 nm, and a transmittance of 80% or more in the range of 620 to 640 nm.

[0117] [Table 8]

[0118] [3] Preparation of photosensitive resin film layer (B) Using a die coater as the film coater and a polyethylene terephthalate film (38 μm thick) as the support film, each of the photosensitive resin compositions (B) listed in Tables 3 to 6 was applied onto the support film. The film was then dried by passing it through a hot air circulating oven (4 m long) set at 80°C for 5 minutes, forming a photosensitive resin film on the support film to a thickness of 20 μm, thereby obtaining a photosensitive resin film layer (B). A polyethylene film (50 μm thick) was attached as a protective film to the photosensitive resin film using a laminating roll at a pressure of 1 MPa, producing a photosensitive dry film with a protective film.

[0119] [Examples 1 to 16 and Comparative Examples 1 to 22] The protective films were peeled off from the film including the photosensitive resin coating layer (A) and the film including the photosensitive resin coating layer (B), and the photosensitive resin coating layer (A) and the photosensitive resin coating layer (B) were laminated together using a roll-to-roll film laminator to produce multilayer photosensitive dry films with the combinations shown in Tables 9-1 to 11. When the protective film on the photosensitive resin coating layer (B) side of the produced multilayer photosensitive dry films was peeled off, the films were visually observed, and films with even one area where the photosensitive resin coating layer (B) had stuck to the protective film side were marked with an "X," and films with no problems were marked with an "O." The results are shown in Tables 9-1 to 11.

[0120] [4] Pattern formation and its evaluation The protective film was peeled off from the multilayer photosensitive dry film with a protective film. Using a vacuum laminator TEAM-100RF (manufactured by Takatori Corporation), the vacuum level in the vacuum chamber was set to 80 Pa, and the photosensitive resin coating layer (B) on the support film was adhered to a glass wafer. The temperature condition was 100°C. After returning to normal pressure, the substrate was removed from the vacuum laminator, and the support film was peeled off. Next, to improve adhesion to the substrate, the substrate was prebaked on a hot plate at 100°C for 2 minutes. The resulting photosensitive resin coating layers (A) and (B) were exposed to light via a mask using an i-line stepper NSR-2205i11D (manufactured by Nikon Corporation) to form a square island pattern with a 1:1 pitch between adjacent patterns. After irradiation, spray development was performed with PGMEA for 20 seconds to form a pattern. The resulting island patterns, each measuring 50 μm, 30 μm, 20 μm, and 10 μm on a side, were then observed using a scanning electron microscope (SEM), and the minimum pattern size that was not connected to adjacent island patterns (with a 1:1 pitch) was determined as the limiting resolution. The results are shown in Tables 9-1 to 11.

[0121] [5] Chromaticity measurement An island pattern measuring 4 cm on a side was formed on a glass wafer using the same method as described above. Then, while irradiating the backside of the substrate with blue LED light, chromaticity was measured from the front side using a spectroradiometer MK350S PREMIUM (manufactured by UPRtek). When x≧0.5 (red region), the result was red; when y≧0.5 (green region), the result was green; and otherwise, the result was ×. The results are shown in Tables 9-1 to 11.

[0122] [Table 9-1]

[0123] [Table 9-2]

[0124] [Table 10-1]

[0125] [Table 10-2]

[0126] [Table 11]

[0127] As shown in Tables 9-1 and 9-2, the multilayer photosensitive dry films of Examples 1 to 16 of the present invention comprise a photosensitive resin film layer (A) having a predetermined light transmittance and a quantum dot-containing photosensitive resin film layer (B) bonded together, allowing for simultaneous processing. Furthermore, the cover film peelability, limiting resolution, and chromaticity measurements were all excellent. On the other hand, as shown in Tables 10-1 and 10-2, the photosensitive dry films of Comparative Examples 1 to 16 do not have a photosensitive resin film layer (A) but only a photosensitive resin film layer (B), making it impossible to perform simultaneous processing. Furthermore, as shown in Tables 11 and 8, the transmittance of the photosensitive resin film layer (A) for each wavelength in Comparative Examples 17 to 22 was outside the range of the present invention, meaning that blue light could not be accurately blocked, resulting in poor chromaticity measurements.

[0128] The above results demonstrate that the multilayer photosensitive dry film of the present invention has no problems with the peelability of the protective film, is efficient because the quantum dot-containing photoresist process and the resist material process that absorbs blue LED light can be performed simultaneously without separating them, and can easily form fine patterns. Furthermore, the resulting cured film can effectively convert the hue of blue LED light, making it suitable for use in display devices such as micro LED displays.

[0129] This specification includes the following inventions.

[0130] [1]: A multilayer photosensitive dry film comprising: a support film; a photosensitive resin coating layer (A) formed on the support film and having a thickness of 1 to 10 μm, the photosensitive resin coating layer (A) having a transmittance of 2% or less at least in a wavelength range of 450 to 470 nm, a transmittance of 80% or more at least in a wavelength range of 515 to 535 nm, and a transmittance of 80% or more at least in a wavelength range of 620 to 640 nm; and a photosensitive resin coating layer (B) having a thickness of 1 to 100 μm and containing quantum dots, formed on the photosensitive resin coating layer (A).

[0131] [2]: The multilayer structure photosensitive dry film according to the above [1], characterized in that the photosensitive resin coating layer (A) contains 0.5 to 15 mass % of a dye having an absorption maximum wavelength in any of wavelengths from 490 to 430 nm.

[0132] [3]: The multilayer structure photosensitive dry film according to the above [1] or [2], characterized in that the quantum dots are contained in the photosensitive resin coating layer (B) in an amount of 15 to 45% by mass.

[0133] [4]: The quantum dots have a core-shell structure including a core and a shell covering the core, the core contains one or more compounds consisting of a combination of two or more of In, P, Zn, Ga, Cd, Se, S, Te, Pb, Ag, Hg, N, As and O, and the shell contains one or more compounds consisting of a combination of two or more of In, P, Zn, Ga, Cd, Se, S, Te, Pb, Hg, N, As, O, Mn and Sr. A multilayer structure photosensitive dry film according to any one of [1] to [3] above.

[0134] [5]: The multilayer structure photosensitive dry film according to any one of [1] to [4] above, characterized in that one or both of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) contain, as a resin component, an acrylic resin having a (meth)acryloyl group in a side chain.

[0135] [6]: The multilayer structure photosensitive dry film according to any one of [1] to [4] above, characterized in that one or both of the photosensitive resin coating layer (A) and the photosensitive resin coating layer (B) contain, as a resin component, a resin having a silicone skeleton and a silphenylene skeleton.

[0136] [7]: A pattern formation method, comprising: (i) a step of attaching the photosensitive resin film layer (B) side of the multilayer structure photosensitive dry film according to any one of [1] to [6] above onto a substrate to form a photosensitive resin film on the substrate; (ii) a step of exposing the photosensitive resin film; and (iii) a step of developing the exposed photosensitive resin film with a developer to dissolve and remove unexposed areas to form a pattern.

[0137] [8]: A display device characterized by having a pattern consisting of a cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure photosensitive dry film according to any one of [1] to [6] above.

[0138] [9]: A display device characterized in that a pattern consisting of a cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure photosensitive dry film described in any one of [1] to [6] above is provided above a blue LED, and light color-converted by quantum dots is extracted from each subpixel.

[0139]

[10] : A pattern made of a cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure photosensitive dry film according to any one of [1] to [6] above a blue LED is provided, and the size of the pattern made of the cured film is 0.01 mm 2 A micro LED display characterized by extracting light color-converted by quantum dots from each subpixel.

[0140] The present invention is not limited to the above-described embodiments. The above-described embodiments are merely examples, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits similar effects is included within the technical scope of the present invention. [Explanation of symbols]

[0141] 1... Support film, 2... Photosensitive resin film layer (A), 3... Photosensitive resin film layer (B), 10...Multi-layered photosensitive dry film.

Claims

1. A support film; a photosensitive resin film layer (A) formed on the support film and having a thickness of 1 to 10 μm, the photosensitive resin film layer (A) having a transmittance of 2% or less at at least a part of a wavelength range of 450 to 470 nm, a transmittance of 80% or more at at least a part of a wavelength range of 515 to 535 nm, and a transmittance of 80% or more at at least a part of a wavelength range of 620 to 640 nm; a photosensitive resin coating layer (B) containing quantum dots and having a thickness of 1 to 100 μm formed on the photosensitive resin coating layer (A); A multilayer structure photosensitive dry film comprising:

2. The multilayer structure photosensitive dry film according to claim 1, characterized in that the photosensitive resin coating layer (A) contains 0.5 to 15 mass % of a dye having an absorption maximum wavelength in any one of wavelengths 490 to 430 nm.

3. The multilayer structure photosensitive dry film according to claim 1, characterized in that the quantum dots are contained in the photosensitive resin coating layer (B) in an amount of 15 to 45% by mass.

4. The quantum dots have a core-shell structure including a core and a shell covering the core, the core includes one or more compounds consisting of a combination of two or more of In, P, Zn, Ga, Cd, Se, S, Te, Pb, Ag, Hg, N, As, and O, and the shell includes one or more compounds consisting of a combination of two or more of In, P, Zn, Ga, Cd, Se, S, Te, Pb, Hg, N, As, O, Mn, and Sr. The multilayer structure photosensitive dry film according to claim 1,

5. The multilayer structure photosensitive dry film according to claim 1, characterized in that one or both of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) contain, as a resin component, an acrylic resin having a (meth)acryloyl group in a side chain.

6. 2. The multilayer structure photosensitive dry film according to claim 1, wherein one or both of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) contain a resin having a silicone skeleton and a silphenylene skeleton as a resin component.

7. A pattern formation method, comprising: (i) a step of attaching the photosensitive resin coating layer (B) side of the multilayer structure photosensitive dry film according to any one of claims 1 to 6 onto a substrate to form a photosensitive resin coating on the substrate; (ii) exposing the photosensitive resin film to light; and (iii) A step of developing the exposed photosensitive resin film with a developer to dissolve and remove the unexposed areas to form a pattern. A pattern forming method comprising the steps of:

8. A display device characterized by having a pattern consisting of a cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure photosensitive dry film described in any one of claims 1 to 6.

9. 7. A display device characterized in that a pattern consisting of a cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure photosensitive dry film according to any one of claims 1 to 6 is provided above a blue LED, and light color-converted by quantum dots is extracted from each subpixel.

10. A pattern made of a cured film of the photosensitive resin film layer (A) and the photosensitive resin film layer (B) of the multilayer structure photosensitive dry film according to any one of claims 1 to 6 is provided above a blue LED, and the size of the pattern made of the cured film is 0.01 mm ２ A micro LED display characterized in that light color-converted by quantum dots is extracted from each subpixel.

Images